1206SFS350F_32

1206SFS350F_32
Surface-mount Fuses – Fundamentals
Surface-mount Fuses
Fundamentals
Overview
TE Circuit Protection offers the widest selection of surface-mount
fuses available for addressing a broad range of overcurrent
protection applications. Helping to prevent costly damage and
promote a safe environment for electronic and electrical
equipment, our single-use chip fuses provide performance stability
to support applications with current ratings from .5A up to 20A.
TE Circuit Protection also offers the telecom FT600 fuse for
telecommunications applications. This telecom fuse helps comply
with North American overcurrent protection requirements,
including Telcordia, GR-1089, TIA-968-A (formerly FCC Part 68),
and UL60950 3rd edition.
Multi-layer Design for Chip Fuses
The multi-layer design has the benefit of exposing more fuse
element surface area to the glass-ceramic absorption material.
When the fuse elements open, there is more material for the
vaporizing fuse metals to absorb into, resulting in a very efficient
and effective quenching of the fuse arc.
Figure 1 compared the multi-layer design of our SFF fuses with
standard glass coated designs. The glass coated designs rely on
the coating on only one side of the fuse element to absorb the
vaporizing fuse material when it opens. Therefore, there is much
less absorption material available to absorb the fuse metals. The
result can be prolonged arcing and possible coating breach.
Figure 2 shows how the absorption characteristics of the two
designs differ. The multi-layer design indicates a clean separation
with the fuse element evenly diffusing into the surrounding
ceramic substrate. In the glass coated design, the element
diffusion takes place in a small portion of the device and is only
absorbed by the glass material directly above the area of failure.
Figure 1
Glass/Ceramic
Substrate
Multiple Fuse
Elements
Multi-layer Design
Substrate
Material
Single Fuse Glass
Element Coating
Single-layer Glass Coated Design
Figure 2
Fault Zones
11
Multi-layer Design
Single-layer Glass Coated Design
Wire-In-Air Design for 2410SFV Fuses
The 2410(6125) is a Wire-In-Air SMD Fuse which is very suitable
for secondary level over current protection applications.
Figure 3 compared our straight wire element design 2410SFV
fuses with normal corrugating wire design fuse. The straight wire
element in air performs consistent fusing and cutting
characteristics together with excellent inrush current
withstanding capability.
Introduced PCB assembly technology into 2410SFV fuses design
and manufacture, we achieved on lead free completely and no
end cap falling off risk comparing with traditional ceramic body
with end cap fuse.
Figure 3
Glass fiber enforced
epoxy body
Straight wire element
Copper terminal
plated with Ni and Tin
Ceramic body
Corrugate wire element
End cap plated with Tin
75
Temperature Derating
A fuse is a temperature sensitive device. Therefore, operating temperature will have an effect on fuse performance and lifetime.
Operating temperature should be taken into consideration when selecting the fuse current rating. The Thermal Derating Curve for
surface mount fuses is presented in Figure 4. Use it to determine the derating percentage based on operating temperature and
apply it to the derated system current.
Figure 4
105
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-55
2410 Series
Temperature Effect On Current Rating
110
105
100
95
% De-rating
% De-rating
1206/0603/0402 Series
Temperature Effect on Current Rating
90
85
80
75
70
65
60
55
-35
-15
5
25
45
65
85
105
125
145
50
-55
-35
Maximum Operating Temperature (°C)
-15
5
25
45
65
85
105
125
Maximum Operating Temperature (°C)
Pulse Cycle Derating
Figure 5
Surface-mount Fuse Pulse Derating Curve
100%
% of Minimum I2t
Once the I2t value for the application waveform has been
determined, it must be derated based on the number of cycles
expected over the system lifetime. Since the stress induced by the
current pulse is mechanical in nature, the number of times the
stress is applied has significant bearing on how much derating
must be applied to the fuse rating. Figure 5 presents the current
pulse derating curve for our surface-mount chip fuses up to
100,000 cycles.
10%
100
1000
10000
100000
Number of Pulses
Selecting Surface-mount Fuses
11
Fuse selection seems straightforward, in that, you pick one which has a current rating just a bit higher than your worstcase system
operating current. Unfortunately, it’s not that simple. There are derating considerations for operating current and application
temperature. Turn-on and other system operations (like processor speed changes or motor start up) cause current surges or
spikes that also require consideration when selecting a fuse. So selecting the right fuse for your application is not as simple as
knowing the nominal current drawn by the system.
Fuse Selection Flowchart
However, the basic considerations for fuse selection are shown in the flowchart presented in Figure 6. Following this flow chart
will help you select a fuse best suited for your application conditions.
Figure 6
Step 1 –
Determine Steady State
Fuse Current Rating
Step 2 –
Determine Pulse
Waveform by
Calculating I2t
Apply Standard Steady
State Derating (75%)
[Ifuse ≥ Isys/0.75]
Step 3 –
Apply Pulse
Cycle Derating
Step 7 – Select Fuse Current Rating
(use higher value between Step 1 and Step 6)
76
Step 4 –
Apply Pulse
Temperature
Derating
Apply
Temperature Derating
[Ifuse ≥ Isys/0.75/Ktemp]
Step 5 –
Apply Derating
for Variance in
the Circuit
Steady State
Fuse Current
Rating
Step 6 –
Select Fuse Current
Rating for Pulse
Environment
Step 8 – Check Voltage Rating
Surface-mount Fuses – Pulse Tolerant Chip Fuses
Surface-mount Fuses
Pulse Tolerant Chip Fuses
NEW
Pulse Tolerant chip fuses has high inrush current
withstand capability and provide overcurrent protection
on DC power systems. Silver fusing element, monolithic
and multilayer design provides strong arc suppression
characteristics.
These RoHS-compliant surface-mount devices facilitate
the development of more reliable, high performance
consumer electronics such as laptops, multimedia
devices, cell phones, and other portable electronics.
Benefits
Features
• High inrush current withstanding capability
• Lead free materials and RoHS compliant
• Ceramic Monolithic structure
• Halogen free
(refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm)
• Silver fusing element and silver termination with
nickel and tin plating
• Monolithic, multilayer design
• Excellent temperature stability
• High-temperature performance
• Strong arc suppression characteristics
• -55°C to +125°C operating temperature range
11
Applications
• Laptops
• Printers
• Game systems
• Digital cameras
• DVD players
• LCD monitors
• Cell phones
• Portable electronics
• Scanners
77
Table FP1 Clear Time Characteristics for Pulse Tolerant Chip Fuses
% of rated current
100%
200%
1000%
Clear time at 25°C
4 hours (min.)
1 seconds (min.)
0.0002 second (min.)
60 seconds (max.)
0.02 seconds (max.)
Table FP2 Typical Electrical Characteristics and Dimensions for Pulse Tolerant Chip Fuses
0603 (1608 mm) Pulse Tolerant Chip Fuses
Typical
Electrical Characteristics
D
A
Part Number
Shape and Dimensions
mm (Inch)
B
C
A
mm
in
B
C
D
Min
Max
Min
Max
Min
Max
Min
Max
1.45
1.75
0.65
0.95
0.21
0.51
0.65
0.95
(0.057) (0.069)
(0.026) (0.037)
(0.008) (0.020)
(0.026) (0.037)
Rated
Current
(A)
Nominal Nominal
I2t
Cold DCR
(A2sec)†
(Ω)*
Max.
Interrupt Ratings
Voltage
(VDC)
Current
(A)
0603SFP100F/32-2
1.0
0.210
0.080
32
50
0603SFP150F/32-2
1.5
0.101
0.11
32
50
0603SFP200F/32-2
2.0
0.057
0.24
32
50
0603SFP250F/32-2
2.5
0.042
0.56
32
50
0603SFP300F/32-2
3.0
0.030
0.72
32
50
0603SFP350F/32-2
3.5
0.022
1.10
32
50
0603SFP400F/32-2
4.0
0.018
2.08
32
50
0603SFP450F/32-2
4.5
0.014
2.63
32
50
0603SFP500F/32-2
5.0
0.013
3.25
32
50
1206 (3216 mm) Pulse Tolerant Chip Fuses
Typical
Electrical Characteristics
Max.
Interrupt Ratings
D
A
11
Part Number
Shape and Dimensions
mm (Inch)
B
C
A
mm
in
B
C
D
Min
Max
Min
Max
Min
Max
Min
Max
3.00
3.40
0.77
1.17
0.26
0.76
1.40
1.80
(0.118) (0.134)
(0.030) (0.046)
(0.010) (0.030)
(0.055) (0.071)
Rated
Current
(A)
Nominal Nominal
I2t
Cold DCR
(A2sec)†
(Ω)*
Voltage
(VDC)
Current
(A)
1206SFP100F/63-2
1.0
0.340
0.11
63
50
1206SFP150F/63-2
1.5
0.150
0.33
63
50
1206SFP200F/63-2
2.0
0.090
0.80
63
50
1206SFP250F/32-2
2.5
0.070
1.19
32
50
1206SFP300F/32-2
3.0
0.035
1.35
32
50
1206SFP350F/32-2
3.5
0.029
1.84
32
50
1206SFP400F/32-2
4.0
0.023
2.74
32
50
1206SFP450F/32-2
4.5
0.021
3.20
32
50
1206SFP500F/32-2
5.0
0.017
5.50
32
50
* Measured at ⱕ10% of rated current and 25°C ambient temperature.
† Melting I2t at 0.001 sec clear time.
78
RoHS Compliant, ELV Compliant
HF Halogen Free
Surface-mount Fuses – Pulse Tolerant Chip Fuses
Figure FP1-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses
Figure FP1
4.5
A
5.0
A
A
A
A
3.0
4.0
A
2. 5
3.5
A
2. 0
1.5
A
1.0
A
0603SFP Average Time Current Curves
100
10
Clear Time (s)
1
0.1
0.01
0.001
0.0001
1
10
100
Current (A)
Figure FP2
0603SFP I2T vs. t Curves
10,000
5.0A
4.5A
4.0A
3.5A
3.0A
2.5A
2.0A
1000
11
1.5A
1.0A
I2t (A2s)
100
10
1
0.1
0.01
0.0001
0.001
0.01
0.1
1
10
100
Time (s)
Note: Curves are nominal
RoHS Compliant, ELV Compliant
HF Halogen Free
79
Figure FP1-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses
Cont’d
Figure FP3
A
2. 5
3.0
A
3.5
A
4.0
A
4.5
A
5.0
A
A
2. 0
1.0
A
1.5
A
1206SFP Average Time Current Curves
10,000
Clear Time (s)
100
1
0.01
0.001
1
10
100
Current (A)
Figure FP4
1206SFP I2T vs. t Curves
5.0A
4.5A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
1.0A
10,000
11
I2t (A2s)
100
1
0.01
0.0001
0.01
1
Time (s)
Note: Curves are nominal
Please go to page 97 for more information for Pulse Tolerant Chip Fuses.
80
RoHS Compliant, ELV Compliant
HF Halogen Free
100
10,000
Surface-mount Fuses – 0603 Very Fast-Acting Chip Fuses
Surface-mount Fuses
0603 Very Fast-Acting Chip Fuses
NEW
Very Fast-acting chip fuses help provide overcurrent
protection on systems using DC power sources up to
32VDC. The fuse’s monolithic, multilayer design provides
the highest hold current in the smallest footprint,
reduces diffusion-related aging, improves product
reliability and resilience, and enhances high-temperature
performance in a wide range of circuit designs.
These RoHS-compliant surface-mount devices offer
strong arc suppression characteristics and facilitate the
development of more reliable, high performance
consumer electronics such as laptops, multimedia
devices, cell phones, and other portable electronics.
Benefits
Features
• Very fast acting at 200% and 300% overloads
• Lead free materials and RoHS compliant
• Excellent inrush current withstanding capability at
high overloads
• Halogen free
• Thin body for space limiting applications
• Monolithic, multilayer design
• Glass ceramic monolithic structure
• High-temperature performance
• Silver fusing element and silver termination with
nickel and tin plating
• -55°C to +125°C operating temperature range
(refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm)
11
• RoHS compliant and lead-free materials
• Symmetrical design with marking on both sides
(optional)
Applications
• Laptops
• Printers
• Game systems
• Digital cameras
• DVD players
• LCD monitors
• Cell phones
• Portable electronics
• Scanners
81
Table FV1 Clear Time Characteristics for Very Fast-Acting Chip Fuses
% of rated current
100%
200%
300%
Clear time at 25°C
4 hours (min.)
0.01 second (min.)
0.001 second (min.)
5 seconds (max.)
0.2 seconds (max.)
Table FV2 Typical Electrical Characteristics and Dimensions for Very Fast-Acting Chip Fuses
0603 (1608 mm) Very Fast-Acting Chip Fuses
Typical Electrical Characteristics
D
Nominal
Cold DCR
(Ω)*
Nominal
I2t
(A2sec)
Voltage
(VDC)
Current
(A)
0603SFV050F/32-2
0.5
0.860
0.0093
32
50
0603SFV075F/32-2
0.8
0.450
0.0191
32
50
0603SFV100F/32-2
1.0
0.280
0.0360
32
50
0603SFV125F/32-2
1.3
0.205
0.0630
32
35
0603SFV150F/32-2
1.5
0.143
0.0950
32
35
Max
0603SFV175F/32-2
1.8
0.095
0.1400
32
35
0.95
0603SFV200F/32-2
2.0
0.073
0.2100
32
35
0603SFV250F/32-2
2.5
0.046
0.3000
32
35
0603SFV300F/32-2
3.0
0.039
0.4600
32
35
0603SFV350F/32-2
3.5
0.028
0.7300
32
35
0603SFV400F/32-2
4.0
0.023
1.1500
32
35
0603SFV450F/32-2
4.5
0.019
1.6800
32
35
0603SFV500F/32-2
5.0
0.015
2.6200
32
35
A
Part Number
Shape and Dimensions
mm (Inch)
B
C
A
Min
mm
in
B
Max
1.45
1.75
Min
0.22
C
Max
0.48
Min
0.21
D
Max
0.51
Min
0.65
Max. Interrupt Ratings
Rated
Current
(A)
(0.057) (0.069) (0.009) (0.019) (0.008) (0.020) (0.025) (0.037)
* Measured at 10% of rated current and 25°C
Figure FV1-FV2 Family Performance Curves for Very Fast-Acting Chip Fuses
Figure FV1
Figure FV2
0603SFV Average Time Current Curves
0603SFV I²t vs. t Curves
0.0
5A
0.7
5
1.0 A
0
1. 2 A
5
1.5 A
1.7 0A
2.05 A
2. 5 0 A
3.0 0A
3.5 0A
4.0 0A
4.5 0A
5.0 0A
0A
11
100
1000
5.00A
4.50A
4.00A
3.50A
3.00A
2.50A
2.00A
1.75A
1.50A
1.25A
1.00A
0.75A
0.05A
100
10
10
1
I²t (A²s)
Clear Time (s)
1
0.1
0.1
0.01
0.01
0.001
0.001
0.0001
1
10
Current (A)
100
0.0001
0.0001
Note: Curves are nominal
Please go to page 97 for more information for Very Fast-Acting Chip Fuses.
82
RoHS Compliant, ELV Compliant
HF Halogen Free
0.001
0.01
0.1
Time (s)
1
10
Surface-mount Fuses – Fast-Acting Chip Fuses
Surface-mount Fuses
Fast-Acting Chip Fuses
Fast-acting chip fuses help provide overcurrent protection
on systems using DC power sources up to 63VDC. The
fuse’s monolithic, multilayer design provides the highest
hold current in the smallest footprint, reduces diffusionrelated aging, improves product reliability and resilience,
and enhances high-temperature performance in a wide
range of circuit designs.
These RoHS-compliant surface-mount devices offer
strong arc suppression characteristics and facilitate the
development of more reliable, high performance
consumer electronics such as laptops, multimedia
devices, cell phones, and other portable electronics.
Benefits
Features
• Small size with high-current ratings
• Lead free materials and RoHS compliant
• Excellent temperature stability
• Halogen free
• High reliability and resilience
• Strong arc suppression characteristics
(refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm)
• Monolithic, multilayer design
11
• High-temperature performance
• -55°C to +125°C operating temperature range
Applications
• Laptops
• Printers
• Game systems
• Digital cameras
• DVD players
• LCD monitors
• Cell phones
• Portable electronics
• Scanners
83
Table FF1 Clear Time Characteristics for Fast-Acting Chip Fuses
% of rated current
100%
250%
400%
Table FF2
Clear time at 25°C
4 hours min.
5 seconds max.
0.05 seconds max.
Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for
Fast-Acting Chip Fuses
0402 (1005mm) Fast-Acting Chip Fuses
Shape and
Dimensions
Inch (mm)
0.020±0.004
(0.51±0.10)
Typical Electrical Characteristics
0.039±0.004
(1.00±0.10)
0.010±0.004
(0.25±0.10)
0.063
(1.60)
Recommended
Pad Layout
Inch (mm)
0.016
(0.40)
Nominal
Cold DCR
(Ω)*
Nominal
I2t
(A2sec)†
Voltage
(VDC)
Current
(A)
0402SFF050F/24
0.50
0.380
0.0043
24
35
0402SFF075F/24
0.75
0.210
0.0076
24
35
0402SFF100F/24
1.00
0.120
0.0170
24
35
0402SFF150F/24
1.50
0.056
0.0490
24
35
0402SFF200F/24
2.00
0.035
0.0700
24
35
0402SFF300F/24
3.00
0.021
0.1250
24
35
0402SFF400F/24
4.00
0.014
0.2250
24
35
Part Number
0.020±0.004
(0.51±0.10)
0
0.028
(0.70)
Max. Interrupt Ratings
Rated
Current
(A)
0.024
(0.60)
0603 (1608mm) Fast-Acting Chip Fuses
Typical Electrical Characteristics
Shape and
Dimensions
Inch (mm)
0.031±0.006
(0.80±0.15)
Nominal
Cold DCR
(Ω)*
Nominal
I2t
(A2sec)†
Voltage
(VDC)
Current
(A)
0603SFF050F/32
0.50
0.485
0.0029
32
50
0603SFF075F/32
0.75
0.254
0.0064
32
50
0603SFF100F/32
1.00
0.131
0.0160
32
50
0603SFF150F/32
1.50
0.059
0.0300
32
35
0603SFF200F/32
2.00
0.044
0.0600
32
35
0603SFF250F/32
2.50
0.032
0.1150
32
35
0603SFF300F/32
3.00
0.025
0.1900
32
35
0603SFF350F/32
3.50
0.024
0.2950
32
35
0603SFF400F/32
4.00
0.018
0.4000
32
35
0603SFF500F/32
5.00
0.013
0.7000
32
35
0603SFF600F/24
6.00
0.010
1.1250
24
35
Part Number
1206SFF050F/63
Rated
Current
(A)
0.50
Nominal
Cold DCR
(Ω)*
0.730
Nominal
I2t
(A2sec)†
0.0021
Voltage
(VDC)
63
Current
(A)
50
1206SFF075F/63
0.75
0.513
0.0052
63
50
1206SFF100F/63
1.00
0.220
0.0120
63
50
1206SFF150F/63
1.50
0.120
0.0250
63
50
1206SFF175F/63
1.75
0.100
0.0450
63
50
1206SFF200F/63
2.00
0.050
0.0700
63
50
1206SFF250F/32
2.50
0.035
0.1400
32
50
1206SFF300F/32
3.00
0.031
0.2200
32
50
1206SFF400F/32
4.00
0.022
0.3800
32
45
1206SFF500F/32
5.00
0.015
0.6000
32
45
1206SFF600F/32
6.00
0.013
1.0000
32
50
1206SFF700F/32
7.00
0.011
1.7500
32
50
1206SFF800F/32
8.00
0.008
2.5000
32
50
1206SFF600F/24
6.00
0.013
1.0000
24
45
1206SFF700F/24
7.00
0.011
1.7500
24
45
1206SFF800F/24
8.00
0.008
2.5000
24
45
Part Number
0.031±0.006
(0.80±0.15)
0.014±0.006
(0.36±0.15)
0.110
(2.80)
Recommended
Pad Layout
Inch (mm)
0.024
0
(0.60)
11
0.039
(1.00)
0.043
(1.09)
Max. Interrupt Ratings
Rated
Current
(A)
0.063±0.006
(1.60±0.15)
1206 (3216mm) Fast-Acting Chip Fuses
Typical Electrical Characteristics
Shape and
Dimensions
S (mm)
Inch
0
0.063±0.008
(1.60±0.20)
0.126±0.008
(3.20±0.20)
0.043±0.008
(1.10±0.20)
0.020±0.010
(0.51±0.25)
0
0.173
(4.40)
Recommended
Pad Layout
Inch (mm)
0.059
(1.50)
0.071
(1.80)
0.057
(1.45)
* Measured at ⱕ10% of rated current and 25°C ambient temperature.
† Melting I2t at 0.001 sec clear time.
84
RoHS Compliant, ELV Compliant
HF Halogen Free
Max. Interrupt Ratings
Surface-mount Fuses – Fast-Acting Chip Fuses
Figure FF1-FF6 Family Performance Curves for Fast-Acting Chip Fuses
Figure FF1
Figure FF2
0402SFF I²t vs. t Curves
2. 0
A
3.0
4.0 A
A
0.5
A
0.7
5
1.0 A
1.5A
A
0402SFF Average Time Current Curves
1000
10
4.0A
3.0A
2.0A
1.5A
100
1.0A
0.75A
1
0.5A
I²t (A²s)
Clear-Time (s)
10
0.1
1
0.1
0.01
0.01
0.001
0.1
1
10
0.001
0.001
100
0.01
Current (A)
0.1
1
10
Time (s)
Note: Curves are nominal
Figure FF3
Figure FF4
0.5
A
0.7
5
1.0 A
A
1.5
2 . 0A
2. 5 A
3.0A
3.5A
4. A
5.00A
6 .0A
A
0603SFF Average Time Current Curves
0603SFF I²t vs. t Curves
10
10000
11
6.0A
5.0A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
1.0A
0.75A
1000
1
10
0.5A
I²t (A²s)
Clear-Time (s)
100
0.1
1
0.1
0.01
0.01
0.001
0.1
1
10
Current (A)
RoHS Compliant, ELV Compliant
HF Halogen Free
100
0.001
0.001
Note: Curves are nominal
0.01
0.1
1
10
Time (s)
85
Figure FF1-FF6 Family Performance Curves for Fast-Acting Chip Fuses
Figure FF5
Cont’d
Figure FF6
1206SFF Average Time Current Curves
0.5
A
0.7
5
1.0 A
A
1.5
1.7 A
2.05 A
2. 5 A
3.0A
4. A
5.00A
6 .0A
7.0 A
8 .0A
A
1206SFF I²t vs. t Curves
10000
10
8.0A
7.0A
6.0A
5.0A
4.0A
3.0A
2.5A
2.0A
1.75A
1.5A
1.0A
1000
1
100
0.5A
I²t (A²s)
Clear-Time (s)
0.75A
10
0.1
1
0.1
0.01
0.01
0.001
0.1
1
10
0.001
0.001
100
Note: Curves are nominal
Please go to page 97 for more information for Fast-Acting Chip Fuses.
11
86
RoHS Compliant, ELV Compliant
HF Halogen Free
0.01
0.1
Time (s)
Current (A)
1
10
High-Current Rated Chip Fuses
Surface-mount Fuses
High-Current-Rated Chip Fuses
The monolithic multilayer design of the TE Circuit
Protection high-current-rated chip fuses helps to
provide some of the highest current ratings available in
the
1206
size
and
enhances
high-temperature
performance in a wide range of circuit protection
designs. The devices’ small size, high reliability and
strong arc suppression characteristics make them
suitable for overcurrent protection of power supplies,
servers, communications equipment, voltage regulator
modules, and other high-current, small size applications.
Benefits
• Glass ceramic monolithic structure provides stability
in application cycling
Features
• Lead free materials and RoHS compliant
• Halogen free
• High-current rating in a small package allows more
efficient use in system space
• Monolithic multilayer design
• Strong arc suppression in overcurrent conditions
• High-temperature performance
(refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm)
11
• -55°C to +125°C operating temperature range
Applications
• Communications equipment
• Voltage regulator modules
• Power supplies
• Servers
87
Table FH1 Clear Time Characteristics for High-Current-Rated Chip Fuses
1206SFH Series
% of rated current
100%
250%
Table FH2
Clear time at 25°C
4 hours (min.)
5 seconds (max.)
Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for
High-Current-Rated Chip Fuses
1206 (3216mm) High-Current-Rated Chip Fuses
Shape and
Dimensions
Inch (mm)
0.063±0.008
(1.60±0.20)
Typical Electrical
Characteristics
Rated
Nominal
Nominal
Current
Cold DCR
I2t
(A)
(Ω)*
(A2sec)†
0.126±0.008
(3.20±0.20)
Part Number
0.038±0.008
(0.97±0.20)
0.020±0.010
(0.51±0.25)
Recommended
Pad Layout
Inch (mm)
Max.
Interrupt Ratings
Voltage
(VDC)
Current
(A)
1206SFH100F/24
10
0.010
9
24
100
1206SFH120F/24
12
0.008
14
24
100
1206SFH150F/24
15
0.005
26
24
100
1206SFH200F/24
20
0.003
56
24
100
* Measured at ⱕ10% of rated current and 25°C ambient temperature.
† Melting I2t at 0.001 sec clear time.
0.173
(4.40)
0.059
(1.50)
0.071
(1.80)
0.057
(1.45)
Figure FH1-FH2 Family Performance Curves for High-Current-Rated Chip Fuses
Figure FH1
Figure FH2
1206SFH Average Time Current Curves
A
1206SFH I²t vs. t Curves
20
10
A
12
A
15
A
11
10
10000
20A
15A
12A
10A
1000
I²t (A²s)
Clear Time (s)
1
0.1
0.01
100
10
0.001
10
100
Current (A)
1000
1
0.001
Note: Curves are nominal
Please go to page 97 for more information for High-Current-Rated Chip Fuses.
88
RoHS Compliant, ELV Compliant
HF Halogen Free
0.01
0.1
Time (s)
1
10
Surface-mount Fuses – Slow-Blow Chip Fuses
Surface-mount Fuses
Slow-Blow Chip Fuses
Available in industry standard 1206 and 0603 chip sizes,
TE Circuit Protection’s slow-blow chip fuses help
provide
overcurrent
protection
on
systems
that
experience large and frequent current surges as part of
their normal operation.
The slow-blow chip fuse’s monolithic, multilayer design
helps provide some of the highest current ratings
available in the 1206 and 0603 footprints and enhances
high-temperature performance in a wide range of circuit
protection designs. The devices’ small size, high
reliability and strong arc suppression characteristics
make them suitable for overcurrent protection of power
supplies, capacitor filter banks, LCD (Liquid Crystal
Display) backlight inverters, electric motors and
portable electronics.
Benefits
Features
• Time-delayed design prevents nuisance openings
in pulsed and high inrush current applications
• Lead free materials and RoHS compliant
• Halogen free
(refers to: Brⱕ900ppm, Clⱕ900ppm, Br+Clⱕ1500ppm)
• Small size with high-current ratings
• Strong arc suppression characteristics
• Monolithic multilayer design
11
• High-temperature performance
• -55°C to +125°C operating temperature range
Applications
• Small motors systems
• Power over Ethernet (POE)
• Computer drives
• Portable electronics
• Test equipment
• Displays
• Input power ports
• POL converter protection
• Printers
89
0
Table FS1 Clear Time Characteristics for Slow-Blow Chip Fuses
0603SFS Series
% of rated current
100%
200%
300%
800%(1.0A-1.5A)
800%(2.0A-5.0A)
Table FS2
1206SFS Series
Clear time at 25°C
4 hours (min.)
1 second (min.) 120 seconds (max.)
0.1 second (min.)
3 seconds (max.)
0.0005 second
(min.) 0.05 seconds (max.)
0
0.001 second (min.) 0.05 seconds (max.)
% of rated current
100%
200%
300%
800%(1.0A-1.5A)
800%(2.0A-8.0A)
Clear time at 25°C
4 hours (min.)
1 second (min.) 120 seconds (max.)
0.1 second (min.)
3 seconds (max.)
0.0016 second (min.) 0.05 seconds (max.)
0.002 second (min.) 0.05 seconds (max.)
Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for
Slow-Blow Chip Fuses
0603 (1608mm) Slow-Blow Chip Fuses
Shape and
Dimensions
Inch (mm)
0.031±0.006
(0.80±0.15)
0.063±0.006
(1.60±0.15)
Part Number
0.031±0.006
(0.80±0.15)
Max.
Interrupt Ratings
Voltage
(VDC)
Current
(A)
0603SFS100F/32
1.0
0.200
0.093
32
50
0603SFS150F/32
1.5
0.100
0.18
32
50
0603SFS200F/32
2.0
0.052
0.32
32
50
0603SFS250F/32
2.5
0.041
0.63
32
50
0.110
(2.80)
0603SFS300F/32
3.0
0.031
0.87
32
50
0.024
(0.60)
0603SFS350F/32
3.5
0.021
1.20
32
50
0603SFS400F/32
4.0
0.017
2.30
32
50
0603SFS450F/32
4.5
0.015
2.70
32
50
0603SFS500F/32
5.0
0.013
3.20
32
50
0.014±0.006
(0.36±0.15)
Recommended
Pad Layout
Inch (mm)
Typical Electrical
Characteristics
Rated
Nominal
Nominal
Current
Cold DCR
I2t
(A)
(Ω)*
(A2sec)†
0.039
(1.00)
0.043
(1.09)
1206 (3216mm) Slow-Blow Chip Fuses
11
Shape and
Dimensions
Inch (mm)
0.063±0.008
(1.60±0.20)
0.126±0.008
(3.20±0.20)
Part Number
Current
(A)
1.0
0.360
0.11
63
50
1.25
0.200
0.22
63
50
1206SFS150F/63
1.5
0.150
0.23
63
50
1206SFS200F/63
2.0
0.088
0.63
63
50
1206SFS250F/32
2.5
0.065
0.90
32
50
1206SFS300F/32
3.0
0.034
1.20
32
50
1206SFS350F/32
3.5
0.028
1.60
32
50
0.173
(4.40)
1206SFS400F/32
4.0
0.024
2.20
32
50
0.059
(1.50)
1206SFS450F/32
4.5
0.020
3.60
32
50
1206SFS500F/32
5.0
0.016
5.30
32
50
1206SFS550F/24
5.5
0.014
6.40
24
50
1206SFS600F/24
6.0
0.011
8.50
24
60
1206SFS700F/24
7.0
0.010
10.00
24
60
1206SFS800F/24
8.0
0.009
16.90
24
60
0.071
(1.80)
0.057
(1.45)
* Measured at ⱕ10% of rated current and 25°C ambient temperature.
† Melting I2t at 0.001 sec clear time.
RoHS Compliant, ELV Compliant
Voltage
(VDC)
1206SFS125F/63
0.020±0.010
(0.51±0.25)
90
Max.
Interrupt Ratings
1206SFS100F/63
0.038±0.008
(0.97±0.20)
Recommended
Pad Layout
Inch (mm)
Typical Electrical
Characteristics
Rated
Nominal
Nominal
Current
Cold DCR
I2t
(A)
(Ω)*
(A2sec)†
HF Halogen Free
Surface-mount Fuses – Slow-Blow Chip Fuses
Figure FS1-FS4 Family Performance Curves for Slow-Blow Chip Fuses
Figure FS1
A
2. 5
3.0A
A
3.5
A
4.0
A
4.5
A
5.0
A
2. 0
1.5
A
1.0
A
0603SFS Average Time Current Curves
100
Clear Time (s)
10
1
0.1
0.01
0.001
1
10
100
Current (A)
Figure FS2
0603SFS I²t vs. t Curves
10,000
5.0A
4.5A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
1000
11
1.0A
I2t (A2s)
100
10
1
0.1
0.01
0.001
0.01
0.1
1
10
100
Time (s)
Note: Curves are nominal
RoHS Compliant, ELV Compliant
HF Halogen Free
91
Figure FS1-FS4 Family Performance Curves for Slow-Blow Chip Fuses
Cont’d
Figure FS3
A
A
3.0
3.5A
4.0 A
4.5A
5.0 A
5.5A
6 .0 A
7.0 A
A
8 .0
A
2. 5
2. 0
1. 2
5A
1.5
A
1.0
A
1206SFS Average Time Current Curves
100
10
Clear Time (s)
1
0.1
0.01
0.001
1
10
1000
100
Current (A)
Figure FS4
1206SFS I²t vs. t Curves
100000
8.0A
7.0A
6.0A
5.5A
5.0A
4.5A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
1.25A
1.0A
10000
11
1000
I2t (A2s)
100
10
1
0.1
0.01
0.001
0.01
0.1
1
Time (s)
Note: Curves are nominal
Please go to page 97 for more information for Slow-Blow Chip Fuses.
92
RoHS Compliant, ELV Compliant
HF Halogen Free
10
100
Surface-mount Fuses – 2410 Very Fast-Acting Fuses
Surface-mount Fuses
2410 Very Fast-Acting Fuses
NEW
The 2410(6125) is Wire-in Air SMD Fuse which is very
suitable for secondary level overcurrent protection
applications.
These lead-free surface mount devices offer more
reliability and have no end cap falling off risk. Straight
wire element in air performs consistent fusing and
cutting characteristics.
Benefits
Features
• Very fast acting at 200% overload current level
• Halogen free, RoHS compliant and 100% lead-free
• Excellent inrush current withstanding capability
• Copper or copper alloy composite fuse link
• High reliability and resilience
• Fiberglass enforced epoxy fuse body
• Strong arc suppression characteristics
• Wide range of current rating
• Copper terminal with nickel and tin plated
• -55°C to +125°C operating temperature range
(with de-rating)
11
Applications
• Industrial equipment
• Power supplier
• Game systems
• LCD/PDP TV
• Telecom system
• White goods
• Backlight inverter
• Networking
• Automotive
93
Table SFV1 Clear Time Characteristics for 2410 Very Fast-Acting Fuses
% of rated current
100%
200% (0.5A-10.0A)
200% (12.0A-20.0A)
Table SFV2
Clear time at 25°C
4 hours (min.)
0.01 second (min.)
0.01 second (min.)
5 seconds (max.)
20 seconds (max.)
Typical Electrical Characteristics, Dimensions and Recommended Pad Layout for
2410 Very Fast-Acting Fuses
2410 (6125 mm) Very Fast-Acting Fuse
Shape and Dimensions
mm (Inch)
A
D
B
C
Recommended Pad Layout
mm (Inch)
D
Min
Max
Min
Max
Min
Max
Min
Max
6.86
(0.270)
5.95
6.25
1.96
2.36
0.97
1.73
2.34
2.64
2.95
(0.116)
A
C
B
mm
in
(0.234) (0.246)
(0.077) (0.093)
(0.038) (0.068)
(0.092) (0.104)
3.15
(0.124)
1.96
(0.077)
Typical Electrical Characteristics
Marking
Code
Rated
Current
(A)
Nominal
Cold DCR
(Ω)*
Nominal
I2t
(A2sec)
(VAC)
(VDC)
C
0.5
0.2310
0.10
250
125
2410SFV0.63FM/125-2
S
0.6
0.1740
0.16
250
125
2410SFV0.75FM/125-2
D
0.8
0.1480
0.23
250
125
2410SFV1.00FM/125-2
E
1.0
0.0930
0.59
250
125
2410SFV1.25FM/125-2
F
1.3
0.0700
0.96
250
125
Part Number
2410SFV0.50FM/125-2
11
Voltage
2410SFV1.50FM/125-2
G
1.5
0.0620
1.19
125
125
2410SFV2.00FM/125-2
I
2.0
0.0420
2.75
125
125
2410SFV2.50FM/125-2
J
2.5
0.0310
1.21
125
125
2410SFV3.00FM/125-2
K
3.0
0.0249
1.73
125
125
2410SFV3.15FM/125-2
V
3.2
0.0232
2.20
125
125
2410SFV3.50FM/125-2
L
3.5
0.0220
2.50
125
125
2410SFV4.00FM/125-2
M
4.0
0.0172
4.10
125
125
2410SFV5.00FM/125-2
N
5.0
0.0143
5.90
125
125
2410SFV6.30FM/125-2
O
6.3
0.0100
12.50
125
125
2410SFV7.00FM/125-2
P
7.0
0.0094
14.20
125
125
2410SFV8.00FM/125-2
R
8.0
0.0086
20.30
125
125
2410SFV10.0FM/125-2
Q
10.0
0.0066
29.20
125
125
2410SFV12.0FM/065-2
X
12.0
0.0053
49.20
65
65
2410SFV15.0FM/065-2
Y
15.0
0.0038
102.50
65
65
2410SFV20.0FM/065-2
Z
20.0
0.0034
126.20
65
65
* Measured at ⱕ10% of rated current and 25°C ambient temperature.
94
Max. Interrupt Ratings
RoHS Compliant, ELV Compliant
HF Halogen Free
Current
(A)
50A @ 250VAC
50A @ 125VDC
300A @ 32VDC
50A @ 125VAC
50A @ 125VDC
300A @ 32VDC
35A @ 125VAC
50A @ 125VDC
300A @ 32VDC
50A @ 65VAC
50A @ 65VDC
300A @ 32VDC
50A @ 65VAC
50A @ 65VDC
300A @ 32VDC
Surface-mount Fuses – 2410 Very Fast-Acting Fuses
Figure SFV1-SFV2 Family Performance Curves for 2410 Very Fast-Acting Fuses
Figure SFV1
1.0
0A
1. 2
1.55 A
0A
2. 0
2. 5 0 A
0
3.0 A
3.1 0A
3.55 A
4.0 0A
5.0 0A
0A
6.3
7.0 0A
0
8 .0 A
10 0A
.
12 0A
.
15 0A
.0A
20
.0A
3A
5A
0.7
0.6
0.5
0A
2410SFV Average Time Current Curves
100
10
Clear Time (s)
1
0.1
0.01
0.001
0.1
1
10
100
1000
Current (A)
Figure SFV2
2410SFV I2T vs. t Curves
20.0A
15.0A
12.0A
10.0A
8.00A
7.00A
6.30A
5.00A
4.00A
3.50A
3.15A
3.00A
2.50A
2.00A
1.50A
1.25A
1.00A
0.75A
0.63A
0.50A
100,000
10,000
1000
I2t (A2s)
100
11
10
1
0.1
0.01
0.001
0.01
0.1
1
10
100
Time (s)
Note: Curves are nominal
Please go to page 97 for more information for 2410 Fast-Acting Fuses.
RoHS Compliant, ELV Compliant
HF Halogen Free
95
11
96
Surface-mount Fuses - Specifications for All Fuses
Specifications, Packaging Information, Agency Approvals and
Part Numbering Systems for All Fuses
Table F1 Environmental Specifications for All Fuses
Operating temperature
-55°C to +125°C
Mechanical vibration
Withstands 5-3000 Hz at 30 Gs when evaluated per Method 204 of MIL-STD-202
Mechanical shock
Withstands 1500 Gs, 0.5 millisecond half-sine pulses when evaluated per Method 213 of MIL-STD-202
Thermal shock
Withstands 100 cycles from -65°C to +125°C when evaluated per Method 107 of MIL-STD-202
Resistance to soldering heat
Withstands 60 seconds at +260°C when evaluated per Method 210 of MIL-STD-202
Solderability
Meets 95% minimum coverage requirement when evaluated per Method 208 of MIL-STD-202
Moisture resistance
Withstands 10 cycles when evaluated per Method 106 of MIL-STD-202
Salt spray
Storage temperature
Storage humidity
Withstands 48-hour exposure when evaluated per Method 101 of MIL-STD-202
ⱕ30°C/ 85% RH
Per MIL-STD-202F, Method 106F
Table F2 Material Specifications for All Fuses
Construction body material
Termination material
Fuse element
Ceramic (1206/0603/0402); Fiberglass/Epoxy (2410)
Silver, Nickel, Tin
Silver(1206/0603/0402); Copper/Copper Alloy (2410)
Figure F1 Thermal Derating Current for All Fuses
105
100
95
90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-55
2410 Series
Temperature Effect on Current Rating
110
105
11
100
95
90
% De-rating
% De-rating
1206/0603/0402 Series
Temperature Effect on Current Rating
85
80
75
70
65
60
55
-35
-15
5
25
45
65
85
105
125
145
50
-55
-35
Maximum Operating Temperature (˚C)
-15
5
25
45
65
85
105
125
Maximum Operating Temperature (˚C)
Table F3 Electrical Specifications for All Fuses
Insulation resistance after opening
20,000Ω minimum @ rated voltage. Fuse clearing under low voltage conditions may result in lower post-clearing insulation values. Under normal fault conditions TE Circuit Protection fuses provide
sufficient insulation resistance for circuit protection.
Current carrying capacity
RoHS Compliant, ELV Compliant
Withstands 100% rated current at +25°C ambient for 4 hours when evaluated per MIL-PRF-23419.
HF Halogen Free
97
Table F4 Packaging Information for All Fuses
Size
Reel Quantity
(pcs)
Reel Diameter
Reel Width
Carrier
Tape Size
Tape Type
Reels per Outside
Shipment Box
Outside Shipment
Boxes per Overpack
0402(1005)
10,000
178mm white plastic
9.0 ± 0.5mm
8.00 ± 0.10mm
Paper
5
1 to 10
0603(1608)
4,000
178mm white plastic
9.0 ± 0.5mm
8.00 ± 0.10mm
Paper
5
1 to 10
0603SFV(1608)
6,000
178mm white plastic
9.0 ± 0.5mm
8.00 ± 0.10mm
Paper
5
1 to 10
1206(3216)
3,000
178mm white plastic
9.0 ± 0.5mm
8.00 ± 0.10mm
Plastic
5
1 to 10
2410(6125)
2,000
178mm white plastic
13.4 ± 0.5mm
12.00 ± 0.10mm
Plastic
4
1 to 10
Figure F2 Recommended Soldering Temperature Profile for All Fuses
tp
Critical Zone
TL to Tp
Tp
Ramp up
Temperature
TL
tL
TsMAX
TsMIN
ts
Preheat
25
Reflow Profile
Ramp down
t 25˚C to Peak
Time
Classification Reflow Profiles
Profile Feature
Average ramp up rate (TsMAX to Tp)
Preheat
• Temperature min. (TsMIN)
• Temperature max. (TsMAX)
• Time (tsMIN to tsMAX)
Time maintained above:
• Temperature (TL)
• Time (tL)
Peak/Classification temperature (Tp)
Time within 5°C of actual peak temperature
Time (tp)
From 25°C to preheating (150°C)
Ramp down rate
11
1206/0603/0402
3°C/second max.
2410
3°C/second max.
150°C
200°C
60-180 seconds
150°C
200°C
40-100 seconds
217°C
60-150 seconds
260°C max.
200°C
30-90 seconds
250°C max.
20-40 seconds
8 minutes max.
4°C/second max.
30-40 seconds
40-100 seconds
Natural cooling
Recommended conditions for hand soldering:
1. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended,
do not directly contact the chip termination with the tip of soldering iron.
2. Preheating: 150°C, 60s (min).
Appropriate temperature (max) of soldering iron tip/soldering time (max): 280°C /10s or 350°C / 3s.
98
RoHS Compliant, ELV Compliant
HF Halogen Free
Surface-mount Fuses - Specifications for All Fuses
Table F5 Tape and Reel Specifications for All Fuses
Dimension in inches (mm)
Mark
0402 (1005)
0603 (1608)
1206 (3216)
0603SFV (1608)
2410 (6125)
E1
0.069 ± 0.004
0.069 ± 0.004
0.069 ± 0.004
0.069 ± 0.004
0.069 ± 0.004
(1.75 ± 0.10)
(1.75 ± 0.10)
(1.75 ± 0.10)
(1.75 ± 0.10)
(1.75 ± 0.10)
F
0.138 ± 0.002
0.138 ± 0.002
0.138 ± 0.002
0.138 ± 0.002
0.217 ± 0.004
(3.50 ± 0.05)
(3.50 ± 0.05)
(3.50 ± 0.05)
(3.50 ± 0.05)
(5.50 ± 0.10)
W
0.315 ± 0.004
0.315 ± 0.004
0.315 ± 0.004
0.315 ± 0.004
0.472 ± 0.004
(8.00 ± 0.10)
(8.00 ± 0.10)
(8.00 ± 0.10)
(8.00 ± 0.10)
(12.00 ± 0.10)
P1
0.079 ± 0.004
0.157 ± 0.004
0.157 ± 0.004
0.157 ± 0.004
0.157 ± 0.004
(2.00 ± 0.10)
(4.00 ± 0.10)
(4.00 ± 0.10)
(4.00 ± 0.10)
(4.00 ± 0.10)
P0
0.157 ± 0.004
0.157 ± 0.004
0.157 ± 0.004
0.157 ± 0.004
0.157 ± 0.004
(4.00 ± 0.10)
(4.00 ± 0.10)
(4.00 ± 0.10)
(4.00 ± 0.10)
(4.00 ± 0.10)
P2
0.079 ± 0.002
0.079 ± 0.002
0.079 ± 0.002
0.079 ± 0.002
0.079 ± 0.004
(2.00 ± 0.05)
(2.00 ± 0.05)
(2.00 ± 0.05)
(2.00 ± 0.05)
(2.00 ± 0.10)
D0
0.059 ± 0.004
0.059 ± 0.004
0.059 ± 0.004
0.059 ± 0.004
0.059 ± 0.004
(1.50+0.10/-0.00)
(1.50+0.10/-0.00)
(1.50+0.10/-0.00)
(1.50+0.10/-0.00)
(1.50+0.10/-0.00)
—
—
0.039 max
—
0.61 ± 0.004
—
0.010 ± 0.002
0.039 ± 0.004
0.112 ± 0.004
D1
(1.00 max)
t
(1.55 ± 0.10)
—
—
0.009 ± 0.001
A0
0.026 ± 0.004
0.039 ± 0.004
0.071 ± 0.004
(0.67 ± 0.10)
(0.98 ± 0.10)
(1.80 ± 0.10)
(0.98 ± 0.10)
(2.85 ± 0.10)
B0
0.046 ± 0.004
0.071 ± 0.004
0.138 ± 0.004
0.071 ± 0.004
0.252 ± 0.004
(1.17 ± 0.10)
(1.80 ± 0.10)
(3.50 ± 0.10)
(1.80 ± 0.10)
(6.40 ± 0.10)
K0
0.025 ± 0.004
0.037 ± 0.003
0.050 ± 0.004
0.024 ± 0.003
0.093 ± 0.004
(0.63 ± 0.10)
(0.95 ± 0.08)
(1.27 ± 0.10)
(0.60 ± 0.08)
(2.35 ± 0.10)
(0.23 ± 0.02)
(0.25 ± 0.05)
Figure F3 Component Tape Dimensions for All Fuses
Paper Carrier Tape Specifications
P0
D0
11
P2
E1
F
W
B0
P1
D1
A0
K0
Plastic Carrier Tape Specifications
D0
P0
t
P2
E1
F
W
B0
D1
RoHS Compliant, ELV Compliant
HF Halogen Free
P1
A0
K0
99
Figure F4 Reel Dimensions for All Fuses
Dimension
Description
Hub outer diameter
Dimension (mm)
Mark
1206/0603/0402
2410
B
60
60.2
Reel inside width
W1
9
13.4
Reel outside width
W2
11.4
16
Tape width
W2
B
8
W1
Agency Approvals for All Fuses
UL
File # E197536
Part Numbering System for Fast-Acting, Slow-Blow And 0603 Very Fast-Acting Chip Fuses
1206 SF F 400 F / 24 -2
Packaging
-2 = Tape and Reel
Voltage Rating
24 = 24VDC
Special Code
F = RoHS Compliant
FM = RoHS Compliant + Marked Part
Rated Current
050 = 0.50 Amps
400 = 4 Amps
Fuse Blow Type
F = Fast Acting
S = Slow Blow
11
SF = Surface Mount Fuse
Size (1206, 0603, 0402)
Part Numbering System for High-Current-Rated Chip Fuses
1206 SF H 100 F / 24 -2
Packaging
-2 = Tape and Reel
Voltage Rating
24 = 24VDC
Special Code
F = RoHS Compliant
FM = RoHS Compliant + Marked Part
Rated Current
100 = 10 Amps
Fuse Blow Type
H = High Current
SF = Surface Mount Fuse
Size (1206)
100
RoHS Compliant, ELV Compliant
HF Halogen Free
Surface-mount Fuses - Specifications for All Fuses
Part Numbering System for 2410 Very Fast-Acting Fuses
2410 SF V 6.30 FM / 125 -2
Packaging
-2 = Tape and Reel
Voltage Rating
125 = 125VDC
Special Code
F = RoHS Compliant
M = Marked Part
Rated Current
6.30= 6.30 Amps
Fuse Blow Type
V = Very Fast Acting
SF = Surface Mount Fuse
Size (0.24*0.10 inch)
11
Warning :
All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and
test each product selected for their application. Tyco Electronics Corporation and/or its Affiliates in the TE Connectivity Ltd. family of companies
(“TE”) makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use.TE’s only obligations
are those in the TE Standard Terms and Conditions of Sale for this product, and in no case will TE be liable for any incidental, indirect, or
consequential damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In
addition, TE reserves the right to make changes to materials or processing that do not affect compliance with any applicable specification without
notification to Buyer.
RoHS Compliant, ELV Compliant
HF Halogen Free
101
11
102
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