MAX13448E

MAX13448E
MAX13448EESD+
RELIABILITY REPORT
FOR
MAX13448EESD+
PLASTIC ENCAPSULATED DEVICES
February 16, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX13448EESD+
Conclusion
The MAX13448EESD+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX13448E full-duplex RS-485 transceiver features inputs and outputs fault protected up to ±80V (with respect to ground). The device operates
from a +3.0V to +5.5V supply and features true fail-safe circuitry, guaranteeing a logic-high receiver output when the receiver inputs are open or
shorted. This enables all receiver outputs on a terminated bus to output logic-high when all transmitters are disabled. The MAX13448E features a
slew-rate limited driver that minimizes EMI and reduces reflections caused by improperly terminated cables, allowing error-free data transmission at
data rates up to 500kbps with a +5V supply, and 250kbps with a +3.3V supply. The MAX13448E includes a hot-swap capability to eliminate false
transitions on the bus during power-up or hot insertion. The driver and receiver feature active-high and active-low enables, respectively, that can be
connected together externally to serve as a direction control. The MAX13448E features an 1/8-unit load receiver input impedance, allowing up to 256
transceivers on the bus. All driver outputs are protected to ±8kV ESD using the Human Body Model. The MAX13448E is available in a 14-pin SO
package and operates over the extended -40°C to +85°C temperature range.
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MAX13448EESD+
II. Manufacturing Information
A. Description/Function:
±80V Fault-Protected, Full-Duplex RS-485 Transceiver
B. Process:
BCD8
C. Number of Device Transistors:
D. Fabrication Location:
Oregon
E. Assembly Location:
ATP Philippines, UTL Thailand
F. Date of Initial Production:
April 26, 2008
III. Packaging Information
A. Package Type:
14-pin SOIC (N)
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive Epoxy
E. Bondwire:
Gold (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-2823
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
120°C/W
K. Single Layer Theta Jc:
37°C/W
IV. Die Information
A. Dimensions:
80 X 240 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
3.0 microns (as drawn)
F. Minimum Metal Spacing:
3.0 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX13448EESD+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
follows:
=
1
MTTF
=
1.83
192 x 4340 x 48 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.4 x 10
= 22.4 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000
hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/.
Current monitor data for the BCD8 Process results in a FIT Rate of 2.3 @ 25C and 39.6 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The RU29 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500 mA per JEDEC
JESD22-A114-D. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
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MAX13448EESD+
Table 1
Reliability Evaluation Test Results
MAX13448EESD+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
48
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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