DG403

DG403
DG403
RELIABILITY REPORT
FOR
DG403DJ+
PLASTIC ENCAPSULATED DEVICES
December 22, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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DG403
Conclusion
The DG403DJ+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s continuous
reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
Maxim's redesigned DG401/DG403/DG405 analog switches now feature guaranteed low on-resistance matching between switches (2 max) and
guaranteed on-resistance flatness over the signal range (3 max). These low on-resistance switches (20 typ) conduct equally well in either direction
and are guaranteed to have low charge injection (15pC max). The new design offers lower off leakage current over temperature (less than 5nA at
+85°C). The DG401/DG403/DG405 are dual, high-speed switches. The single-pole/single-throw DG401 and double-pole/single-throw DG405 are
normally open dual switches. The dual, single-pole/double-throw DG403 has two normally open and two normally closed switches. Switching times are
150ns max for tON and 100ns max for tOFF, with a maximum power consumption of 35µW. These devices operate from a single +10V to +30V
supply, or bipolar supplies of ±4.5V to ±20V. Maxim's improved DG401/DG403/DG405 are fabricated with a 44V silicon-gate process.
Maxim Integrated Products. All rights reserved.
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DG403
II. Manufacturing Information
A. Description/Function:
Improved, Dual, High-Speed Analog Switches
B. Process:
S5
C. Number of Device Transistors:
0
D. Fabrication Location:
Oregon
E. Assembly Location:
Malaysia, Philippines, Thailand
F. Date of Initial Production:
Pre 1997
III. Packaging Information
A. Package Type:
16-pin PDIP
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive
E. Bondwire:
Au (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-0301-0538
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
95°C/W
K. Single Layer Theta Jc:
35°C/W
IV. Die Information
A. Dimensions:
70 X 102 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
5.0 microns (as drawn)
F. Minimum Metal Spacing:
5.0 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
Maxim Integrated Products. All rights reserved.
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DG403
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 410 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 2.62 x 10
= 2.62 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the S5 Process results in a FIT Rate of 0.09 @ 25C and 1.55 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The AG58-1 die type has been found to have all pins able to withstand a HBM transient pulse of +/-800 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
Maxim Integrated Products. All rights reserved.
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DG403
Table 1
Reliability Evaluation Test Results
DG403DJ+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing (Note 2)
HAST
Ta = 130°C
RH = 85%
Biased
Time = 96hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
410
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
Maxim Integrated Products. All rights reserved.
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