LG KU380 mobile phone Service Manual

Below you will find brief information for mobile phone KU380. The KU380 mobile phone offers a range of features, including support for UMTS-2100, GSM-900, DCS-1800, and PCS-1900 networks, allowing you to stay connected while on the go. It also boasts a 1.3 MP camera for capturing memories and a VGA camera for video calls. The KU380's compact size and stylish design make it a perfect companion for your daily activities.

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Date: December, 2007 / Issue 1.0

Service Manual

KU380

Internal Use Only

1. INTRODUCTION.................................. 5

1.1 Purpose ...................................................... 5

1.2 Regulatory Information ............................... 5

2. PERFORMANCE ..................................7

2.1 System Overview.........................................7

2.2 Usable environment.....................................8

2.3 Radio Performance......................................8

2.4 Current Consumption.................................14

2.5 RSSI BAR ..................................................14

2.6 Battery BAR ...............................................15

2.7 Sound Pressure Level ...............................16

2.8 Charging ....................................................16

4.15 Main LCD Troubleshooting ....................106

4.16 Receiver Path ........................................107

4.17 Headset path .........................................109

4.18 Speaker phone path ..............................111

4.19 Main microphone ...................................113

4.20 Headset microphone..............................115

4.21 Vibrator ..................................................117

3. TECHNICAL BRIEF............................17

3.1 General Description ...................................17

3.2 GSM Mode.................................................19

3.3 UMTS Mode...............................................23

3.4 LO generation and distribution circuits ......25

3.5 Off-chip RF Components ...........................25

3.6 Digital Baseband(DBB/MSM6245) ............34

3.7 Subsystem(MSM6245) ..............................37

3.8 Power Block...............................................45

3.9 External memory interface.........................50

3.10 H/W Sub System .....................................52

3.11 Main Features..........................................68

7. CIRCUIT DIAGRAM..........................143

8. BGA IC PIN MAP..............................149

9. PCB LAYOUT ...................................153

4. TROUBLE SHOOTING.......................73

4.1 RF Component ..........................................73

4.2 SIGNAL PATH_UMTS RF .........................75

4.3 SIGNAL PATH_GSM RF ...........................76

4.4 Checking VC-TCXO Block.........................77

4.5 Checking Front-End Module Block ............79

4.6 Checking UMTS Block...............................81

4.7 Checking GSM Block.................................86

4.8 Checking Bluetooth Block..........................92

4.9 Power ON Troubleshooting .......................94

4.10 Charger Troubleshooting .........................96

4.11 USB Troubleshooting...............................99

4.12 SIM Detect Troubleshooting ..................100

4.13 Camera Troubleshooting .......................102

4.14 Keypad Backlight Troubleshooting ........105

5. DOWNLOAD .....................................118

5.1 Introduction ..............................................118

5.2 Downloading Procedure ..........................118

5.3 Troubleshooting Download Errors ..........131

5.4 Caution ....................................................136

6. BLOCK DIAGRAM ...........................137

6.1 GSM & UMTS RF Block ..........................137

6.2 Interface Diagram ....................................139

10. Calibration & RF Auto Test

Program (Hot Kimchi) ...................159

10.1 Configuration of HOT KIMCHI ...............159

10.2 How to use HOT KIMCHI.......................162

11. Factory Test Mode .........................164

11.1 Factory Test Mode.................................164

11.2 WCDMA Test Mode...............................164

11.3 GSM Test Mode.....................................165

12. EXPLODED VIEW & REPLACEMENT

PART LIST ..................................... 167

12.1 EXPLODED VIEW ................................ 167

12.2 Replacement Parts

<Mechanic component> ....................... 169

<Main component> ............................... 172

12.3 Accessory ............................................. 188

Only for training and service purposes

- 3 -

LGE Internal Use Only

- 4 -

Only for training and service purposes

1. INTRODUCTION

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system.

There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

Only for training and service purposes

- 5 -

LGE Internal Use Only

1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.

Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

LGE Internal Use Only

- 6 -

Only for training and service purposes

2. PERFORMANCE

2. PERFORMANCE

2.1 System Overview

Item

Shape

Size

Weight

Power

Talk Time with 1000mAh)

Standby Time

(with 1000mAh)

Specification

GSM900/1800/1900/EDGE and WCDMA2100 - Slide type Handset

96 X 45 X 17.9 mm

Under 97 g (with 900mAh Battery)

3.7 V normal, 900 mAh Li-Ion

Over 160 min (WCDMA, Tx=12 dBm, Voice)

Over 160 min (GSM, Max Tx Power, Voice)

Over 200 Hrs (WCDMA, DRX=1.28)

Over 270 Hrs (GSM, Paging period=9)

LCD

LCD Backlight

Camera

Vibrator

Main 1.76” TFT, QCIF, 262K

White LED Back Light

1.3 Mega pixel + VGA Video Call Camera

Yes ( Coin Type)

LED Indicator No

MIC Yes

Receiver Yes

Earphone Jack Yes (18 pin)

External Memory

I/O Connect

Yes(Micro SD)

18 Pin

Only for training and service purposes

- 7 -

LGE Internal Use Only

2. PERFORMANCE

2.2 Usable environment

1) Environment

Item

Voltage

Operation Temp

Storage Temp

Humidity

Specification

3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V]

-20 ~ +60

°C

-20 ~ +70

°C

85 % (Max)

2) Environment (Accessory)

Reference

TA Power

* CLA : 12 ~ 24 V(DC)

Spec.

Available power

Min

100

Typ.

220

Max

240

Unit

Vac

2.3 Radio Performance

1) Transmitter - GSM Mode

No Item

MS allocated

Channel

100k~1GHz

1G~12.75GHz

Conducted

Spurious

Emission

Idle Mode

100k~880MHz

880M~915MHz

915M~1GHz

1G~[A]MHz

[A]M~[B]MHz

[B]M~12.5GHz

* In case of DCS : [A] -> 1710, [B] -> 1785

LGE Internal Use Only

- 8 -

GSM DCS & PCS

9k ~ 1GHz -39dBm

-39dBm

1G~[A]MHz

[A]M~[B]MHz

-33dBm

[B]M~12.75GHz

-60dBm 100k~880MHz

-33dBm

-39dBm

-33dBm

-60dBm

-62dBm 880M~915MHz

-60dBm 915M~1GHz

-62dBm

-60dBm

-50dBm 1G~[A]MHz

-56dBm [A]M~[B]MHz

-50dBm

-56dBm

-50dBm [B]M~12.5GHz

-50dBm

* In case of PCS : [A] -> 1850, [B] -> 1910

Only for training and service purposes

2. PERFORMANCE

Radiated

Spurious

Emission

Item

MS allocated

Channel

Idle Mode

Frequency Error

Phase Error

Frequency Error

Under Multipath and

Interference Condition

30M ~ 1GHz

1G ~ 4GHz

915M~1GHz

1G~[A]MHz

[A]M~[B]MHz

[B]M~4GHz

±0.1ppm

±5(RMS)

±20(PEAK)

GSM

30M ~ 880MHz

880M ~ 915MHz

DCS & PCS

30M~1GHz -36dBm

-36dBm

1G~[A]MHz

[A]M~[B]MHz

-30dBm

[B]M~4GHz

-57dBm 30M~880MHz

-30dBm

-36dBm

-30dBm

-57dBm

-59dBm 880M~915MHz

-57dBm

-47dBm 1G~[A]MHz

-53dBm

915M~1GHz

[A]M~[B]MHz

-47dBm [B]M~4GHz

±0.1ppm

±5(RMS)

±20(PEAK)

-59dBm

-57dBm

-47dBm

-53dBm

-47dBm

3dB below reference sensitivity 3dB below reference sensitivity

RA250 : ±200Hz

HT100 : ±100Hz

RA250: ±250Hz

HT100: ±250Hz

TU50 : ±100Hz

TU3 : ±150Hz

0 ~ 100kHz

200kHz

+0.5dB

-30dB

TU50: ±150Hz

TU1.5: ±200Hz

0 ~ 100kHz

200kHz

Output RF

Spectrum

Due to

250kHz

400kHz modulation 600 ~ 1800kHz

Due to

Switching transient

** In case of DCS : [A] -> 1710, [B] -> 1785

-33dB

-60dB

250kHz

400kHz

1800 ~ 3000kHz

3000 ~ 6000kHz

≥6000kHz

400kHz

600kHz

1200kHz

-66dB 600 ~ 1800kHz

-69dB 1800 ~ 6000kHz

-71dB ≥6000kHz

-77dB

-19dB 400kHz

-21dB 600kHz

-21dB 1200kHz

1800kHz -24dB 1800kHz

* In case of PCS : [A] -> 1850, [B] -> 1910

+0.5dB

-30dB

-33dB

-60dB

-65dB

-73dB

-22dB

-24dB

-27dB

Only for training and service purposes

- 9 -

LGE Internal Use Only

2. PERFORMANCE

Item

Intermodulation attenuation

Transmitter Output Power

Burst timing

GSM

–

DCS & PCS

Frequency offset 800kHz

Intermodulation product should be Less than 55dB below the level of Wanted signal

Power control Power Tolerance Power control Power Tolerance

Level

(dBm)

(dB)

±3

Level

(dBm)

(dB)

±3

Mask IN

±3

±5

Mask IN

±4

±5

±4

LGE Internal Use Only

- 10 -

Only for training and service purposes

2. PERFORMANCE

2) Transmitter - WCDMA Mode

Item

Maximum Output Power

Frequency Error

Open Loop Power control in uplink

Specification

Class 3 : +24dBm(+1/-3dB)

±0.1ppm

±9dB@normal, ±12dB@extreme

Adjust output(TPC command) cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4.5

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

4 Inner Loop Power control in uplink

-1 -0.5/-1.5 -1/-3 -1.5/-4.5

Group (10 equel command group)

+1 +8/+12 +16/+24

-50dBm(3.84MHz) 5 Minimum Output Power

Qin/Qout : PCCH quality levels

6 Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB

Transmit OFF Power

Transmit ON/OFF Time Mask

Change of TFC

Ton@DPCCH/Ior : -24 -> -18dB

-56dBm(3.84MHz)

±25us

PRACH,CPCH,uplinlk compressed mode

±25us

Power varies according to the data rate

DTX : DPCH off

(minimize interference between UE)

10 Power setting in uplink compressed

11 Occupied Bandwidth(OBW)

12 Spectrum emission Mask

±3dB(after 14slots transmission gap)

5MHz(99%)

-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k

-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M

-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M

-49dBc@∆f=8.5~12.5MHz,1M

Only for training and service purposes

- 11 -

LGE Internal Use Only

2. PERFORMANCE

No Item

13 Adjacent Channel Leakage Ratio(ACLR)

Spurious Emissions

(*: additional requirement)

15 Transmit Intermodulation

16 Error Vector Magnitude (EVM)

17 Transmit OFF Power

Specification

33dB@5MHz, ACP>-50dBm

43dB@10MHz, ACP>-50dBm

-36dBm@f=9~150KHz, 1K BW

-36dBm@f=50KHz~30MHz, 10K BW

-36dBm@f=30MHz~1000MHz, 100K BW

-30dBm@f=1~12.5GHz, 1M BW

(*)-41dBm@f=1893.5~1919.6MHz, 300K

(*)-67dBm@f=925~935MHz, 100K BW

(*)-79dBm@f=935~960MHz, 100K BW

(*)-71dBm@f=1805~1880MHz, 100K BW

-31dBc@5MHz,Interferer -40dBc

-41dBc@10MHz, Interferer -40dBc

17.5%(>-20dBm)

(@12.2K, 1DPDCH+1DPCCH)

-15dB@SF=4.768Kbps, Multi-code transmission

3)Receiver - GSM Mode

Item

Sensitivity (TCH/FS Class II)

Co-Channel Rejection

(TCH/FS Class II, RBER, TU high/FH)

3 Adjacent Channel

Rejection

200kHz

400kHz

Intermodulation Rejection

Blocking Response

(TCH/FS Class II, RBER)

GSM

-105dBm

C/Ic=7dB

DCS & PCS

-105dBm

Storage -30 ~ +85

C/Ia1=-12dB

C/Ia2=-44dB

Wanted Signal :-98dBm 1st interferer:-44dBm 2nd

C/Ia1=-12dB

C/Ia2=-44dB

Wanted Signal :-96dBm 1st interferer:-44dBm 2nd interferer:-45dBm

Wanted Signal :-101dBm interferer:-44dBm

Wanted Signal :-101dBm

Unwanted : Depend on Frequency Unwanted : Depend on Frequency

LGE Internal Use Only

- 12 -

Only for training and service purposes

2. PERFORMANCE

5) Receiver - WCDMA Mode

No Item

1 Reference Sensitivity Level

2 Maximum Input Level

Adjacent Channel Selectivity (ACS)

In-band Blocking

Out-band Blocking

Spurious Response

Intermodulation Characteristic

Spurious Emissions

Only for training and service purposes

- 13 -

Specification

-106.7 dBm(3.84 MHz)

-25dBm(3.84MHz)

-44dBm/3.84MHz(DPCH_Ec)

UE@+20dBm output power(Class3)

33dB

UE@+20dBm output power(Class3)

-56dBm/3.84MHz@10MHz

UE@+20dBm output power(Class3)

-44dBm/3.84MHz@15MHz

UE@+20dBm output power(Class3)

-44dBm/3.84MHz@f=2050~2095 and

2185~2230MHz

UE@+20dBm output power(Class3)

-30dBm/3.84MHz@f=2025~2050 and

2230~2255MHz

UE@+20dBm output power(Class3)

-15dBm/3.84MHz@f=1~2025 and

2255~12500MHz

UE@+20dBm output power(Class3)

-44dBm CW

UE@+20dBm output power(Class3)

-46dBm CW@10MHz

-46dBm/3.84MHz@20MHz

UE@+20dBm output power(Class3)

-57dBm@f=9KHz~1GHz, 100K BW

-47dBm@f=1~12.5GHz, 1M BW

-60dBm@f=1920MHz~1980MHz, 3.84M BW

-60dBm@f=2110MHz~2170MHz, 3.84M BW

LGE Internal Use Only

2. PERFORMANCE

2.4 Current Consumption

1) KU380 Current Consumption

WCDMA

Stand by

Under 4.5 mA

(DRX=1.28)

Under 3.3 mA

Paging=9 period

Voice Call

Under 350 mA

(Tx=12dBm)

Under 350 mA

(Max Tx Power)

Under 410mA

(Tx=12dBm)

GSM

(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test

Condition : Speaker off, LCD backlight On)

2.5 RSSI BAR

Level Change

BAR 4

→ 3

BAR 3

→ 2

BAR 2

→ 1

BAR 1

→ 0

WCDMA

-85

± 2 dBm

-95

± 2 dBm

-106

± 2 dBm

-111

± 2 dBm

GSM

-91

± 2 dBm

-96

± 2 dBm

-101

± 2 dBm

-106

± 2 dBm

LGE Internal Use Only

- 14 -

Only for training and service purposes

2. PERFORMANCE

2.6 Battery BAR

Indication

Bar 4

→ 3

Bar 3

→ 2

Bar 2

→ 1

Bar 1

→ Empty

Low Voltage,

Warning message+ Blinking

Power Off

Standby

Over 3.83

± 0.05V

3.82

± 0.05V

3.73

± 0.05V

3.68

± 0.05V

3.58

± 0.05V

3.58

± 0.05V (Stand-by) / 3.58 ± 0.05V (Talk)

[Interval : 3min(Stand-by) / 1min(Talk)]

3.20

± 0.05V

Only for training and service purposes

- 15 -

LGE Internal Use Only

2. PERFORMANCE

2.7 Sound Pressure Level

Test Item

Sending Loudness Rating (SLR)

Receiving Loudness Rating (RLR)

Side Tone Masking Rating (STMR)

Echo Loss (EL)

Idle Noise-Sending (INS)

Idle Noise-Receiving (INR)

Sending Loudness Rating (SLR)

Receiving Loudness Rating (RLR)

Side Tone Masking Rating (STMR)

Echo Loss (EL)

Idle Noise-Sending (INS)

Idle Noise-Receiving (INR)

TDMA Noise

-. GSM : Power Level : 5

DCS/PCS : Power Level : 0

(Cell Power : -90 ~ -105 dBm)

MS and

Headset

Max

-. Acoustic (Max Vol.)

MS/Headset SLR : 8 ± 3dB

MS/Headset RLR : -15 ± 3dB/-12dB

(SLR/RLR : Mid-value setting)

2.8 Charging

• Charging Method : CC & CV (Constant Current and Constant Voltage)

• Maximum Charging Voltage : 4.2 V

• Maximum Charging Current : 600 mA

• Normal Battery Capacity : 900 mAh

• Charging Time : Max 3.5 hours (except for trickle charging time)

• Full charging indication current (charging icon stop current) : 100 mA

• Cut-off voltage : 3.20 V

Headset

Nor

Max

Min

Max

Nor

Max

Nor

Max

Min

Max

Nor

Max

Specification

8 ±3 dB

-4 ± 3 dB

-15 ± 3 dB

17 dB

40 dB

-64 dBm0p

Under -47 dBPA

Under -36 dBPA

8±3dB

-1 ±3 dB

-12 ±3 dB

25 dB

40 dB

-55 dBm0p

Under -45 dBPA

Under -40 dBPA

Under -62 dBm

LGE Internal Use Only

- 16 -

Only for training and service purposes

3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.1 General Description

The KU380 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/UMTS.

All receivers and the UMTS transmitter use the radioOne 1 Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSKmodulated signal to RF.

USB

Bluetooth

RF Module

GSM Block

VCTCXO

PM6650

-2M

GSM

PAM

GSM

TX SAW

GSM900 Tx

GSM1800/1900 Tx

GSM900 Rx

GSM1800 Rx

GSM1900 Rx

GSM

VCO

Front

End

Module

WCDMA Block

COUPLER

WCDMA

PAM

WCDMA

TX SAW

RTR6275

WCDMA2100 Tx

Duplexer

WCDMA2100 Rx

HDET

WCDMA

VCO

WCDMA

RX SAW

AntSW Logic

SPK/RCV

MIC

MAIN LCD

MSM6245

1.3M CAM

VGA CAM

U-SIM

NAND, SDRAM

FLASH

KEYPAD

[Fig 1.1] Block diagram of RF part

1 QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.

Only for training and service purposes

- 17 -

LGE Internal Use Only

3. TECHNICAL BRIEF

A generic, high-level functional block diagram of KU380 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module).

The UMTS receive path each include a LNA, a RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF technique. The RFIC Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same inputs to the MSM IC.

For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The

RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PA. The high- and low-band UMTS RF transmit signals emerge from the RTR6275 transceiver.

In the GSM receive paths, the received RF signals are applied through their band-pass filters and down-converted directly to baseband in the RTR6275 transceiver IC. These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for further signal processing.

The GSM transmit paths employ one stage of up-conversion and, in order to improve efficiency.

1. The on-chip quadrature up-converter translates the GMSK-modulated signal to a constant envelope phase signal at RF;

2. The amplitude-modulated (AM) component is applied to the ramping control pin of power amplifier from a DAC within the MSM

KU380 power supply voltages are managed and regulated by the PM6650 Power Management IC.

This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.

LGE Internal Use Only

- 18 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.2 GSM Mode

3.2.1 GSM Receiver

The Dual-mode KU380’s receiver functions are split among the three RFIC’s as follows:

• GSM-900, DCS-1800, and PCS-1900 UMTS-2100 modes use the RTR6275 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SBI2-controlled parameters.

RF Front end consists of antenna, antenna switch module(D5011) which includes three RX saw filters(GSM900, DCS and PCS). The antenna switch module allows multiple operating bands and modes to share the same antenna. In KU380, a common antenna connects to one of six paths: 1)

UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800 Tx, PCS-

1900 Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. The GSM900, DCS, and PCS operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required.

[Table 1.1] Antenna Switch Module Control logic

2 The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application

Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS

Software documentation for details.

Only for training and service purposes

- 19 -

LGE Internal Use Only

3. TECHNICAL BRIEF

The GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiver front-end circuits(filters and antenna switch module). The GSM900, DCS, and PCS receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins

Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers this is accomplished in the switch module.

The GSM900, DCS, and PCS receive signals are routed to the RTR6275 through band selection filters and matching networks that transform single-ended 50-Ω. sources to differential impedances optimized for gain and noise figure. The RTR input uses a differential configuration to improve second-order intermodulation and common mode rejection performance. The RTR6275 input stages include MSMcontrolled gain adjustments that maximize receiver dynamic range.

The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM6245 IC for further processing (an interface shared with the RFR6275 UMTS receiver outputs).

LGE Internal Use Only

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Only for training and service purposes

3. TECHNICAL BRIEF

[Fig 1.2] RTR6275 RX feature

Only for training and service purposes

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.2.2 GSM Transmitter

The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matching inductors. The 50ohm output impedance is achieved by adding a series capacitor at the output pins.

The capacitor value may be optimized for specific applications and PCB characteristics based on passband symmetry about the band center frequency, the suggested starting value is shown in Figure1.2.

6pF 51Ω

91Ω

12p 39Ω

91Ω

100Ω 100Ω

[Fig 1.3] GSM Transmitter matching

The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This design guideline shows a tri-band GSM application.

Both high-band and low band outputs are followed by resistive pads to ensure that the load presented to the outputs remains close to 50ohm. The low-band GSM Tx path also includes a Tx-band SAW filter to remove noise-spurious components and noise that would be amplified by the PA and appear in the

GSM Rx band

LGE Internal Use Only

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Only for training and service purposes

3. TECHNICAL BRIEF

3.3 UMTS Mode

3.3.1 Receiver

The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter. This second stage input is configured differentially to optimize second-order intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RFtobaseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with

GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 is downconverting GSM signals and on when the UMTS is operating.

3.3.2 Transmitter

The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device.

These analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The up-converter output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that simplifies the external matching network to a single series capacitor to achieve the desired 50-Ω interface.

The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the antenna through the switch module.

The transceiver LO synthesizer is contained within the RTR6275 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for multimode applications.

The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital logic generator.

UMTS Tx using PLL1, the LO generation and distribution circuits create the necessary LO signals for different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal directly from baseband to RF. This requires F

LO to equal F

, and the RTR6275 IC design achieves this without allowing F

VCO to equal F

The RTR6275 IC is able to support UMTS 2100/1900 and UMTS 850 mode transmitting. This design guideline shows only UMTS 2100 applications.

Only for training and service purposes

- 23 -

LGE Internal Use Only

3. TECHNICAL BRIEF

WCDMA_2100_TX

WCDMA_2100_RX

[Figure 1.4] RTR6275 IC functional block diagram

LGE Internal Use Only

- 24 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.4 LO generation and distribution circuits

The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM and UMTS band upconverters and downconverters; with the help of these LO generation and distribution circuits, zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from

RF to baseband and from baseband to RF.

Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the

RTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS

2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM 850,

GSM 900, GSM 1800, and GSM 1900. The second synthesizer (PLL2) provides the LO for the UMTS

2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6275 IC integrates most of PLL loop filter components on-chip except two off-chip loop filter series capacitors, and significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6275 has the advantages of more flexible loop bandwidth control, fast lock time, and low-integrated phase error

3.5 Off-chip RF Components

3.5.1 WCDMA PAM (U104: AWT6277R)

The UMTS PA output power is monitored by l power detector circuits(U101 : RTR6275) .

This detector voltage can be used for transmitter calibration and monitor to meet RF system

WCDMA

L126

12nH

L123

1.8nH

FL102

PGND

ANT

ACMD-7602

3.9p

C154

+VPWR

NEAR TO PAM

C149

4.7u

C151

20dB

U103

CP0402A1950DNTR

R123

130

R122

7dB

R124

130

PWR_DET

C157

C155

10p

L127

15nH

NEAR TO PAM

C152

+VPWR

AWT6277R

GND5

VCC2

GND4

RFOUT

GND3

GND2

U104

VCC1

RFIN

GND1

VMODE

VREF

NEAR TO PAM

C158

100p

PA_R0

TR100

KRX102U

L122

C148

8.2p

L121

5.6nH

FL101

EFCH1950TDF1

3 2

PA_ON

C162

100p

VREG_TCXO_2.85V

L131

2 2nH

[Figure 1.5] WCDMA PAM, Duplexer, Coupler

Only for training and service purposes

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.5.2 VCTCXO (X100 : DSA321SCE-19.2M)

The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the

MSM6245 IC. The oscillator frequency is controlled by the MSM6245 IC.

TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control

TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line.

The PM6650 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the MSM TCXO_EN line . The PM6650 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is enabled before most other regulated outputs.

Any GSM mode power control circuits within the MSM6245 IC require a reference voltage for proper operation and sufficient accuracy. Connecting the PM6650 IC REF_OUT directly to the MSM6245 IC

GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 µF low frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both sides, plus ground above and below if routed on internal layers.

3.5.3 Front-End Module (U100 : D5011)

This equipment uses a single antenna to support all handset operating modes, with an antenna switch module select the operating frequency and band. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. The active connection is MSM-selected by three control lines (GPIO[9], GPIO[10]).

Two GPIO are programmed to be ANT_SEL0_N, ANT_SEL1_N) respectively.

LGE Internal Use Only

[Table 1.2] Front End Module control logic

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Only for training and service purposes

3. TECHNICAL BRIEF

3.5.4 PMIC Functional Block Diagram (U300 : PM6650-2M)

• Input power management

- Valid external supply attachment and removal detection

- Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources

- Supports lithium-ion main batteries

- Trickle, constant current, constant voltage, and pulsed charging of the main battery

- Supports coin cell backup battery (including charging)

- Battery voltage detectors with programmable thresholds

- VDD collapse protection

- Charger current regulation and real-time monitoring for over-current protection

- Charger transistor protection by power limit control

- Control drivers for two external pass transistors and one external battery MOSFET MOSFET is optional

- Voltage, current, and power control loops

- Automated recovery from sudden momentary power loss

• Output voltage regulation

- One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting USBOTG

- Three buck (step-down) switched-mode power supplies that efficiently generate MSMC, MSME, and PA

(or second MSMC) supply voltages

- Supports dynamic voltage scaling (DVS) for MSMC and PA

- Eleven low dropout regulator circuits with programmable output voltages, implemented using three different current ratings: 300 mA (two), 150 mA (six), and 50 mA (three). These can be used to power

MSMA, MSMP, RFRX1, RFRX2, RFTX, SYNT, TCXO, WLAN, MMC, USB, and RUIM circuits.

- All regulators can be individually enabled/disabled for power savings

- Low power mode available on MSMA and MSMP regulators

- All regulated outputs are derived from a common bandgap reference - close tracking

• Integrated handset-level housekeeping functions reduces external parts count, size, cost

- Analog multiplexer selects from 8 internal and up to 18 external inputs

- Multiplexer output’s offset and gain are adjusted, increasing the effective ADC resolution

- Adjusted multiplexer output is buffered and routed to an MSM device ADC

- Dual oscillators - 32.768 kHz off-chip crystal and on-chip RC assures MSM device sleep clock

- Crystal oscillator detector and automated switch-over upon lost oscillation

- Real time clock for tracking time and generating associated alarms

- On-chip adjustments minimize crystal oscillator frequency errors

- Circuits control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal

- TCXO buffer control for optimal QPH/catnap timing

- Three-stage over-temperature protection (smart thermal control)

• Integrated handset-level user interfaces

- Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash, and general-purpose drivers

- Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments

- Speaker driver with programmable gain, turn-on time, and muting; differential operation (drives external

|8 Ω speakers with volume controlled 500 mW)

Only for training and service purposes

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LGE Internal Use Only

3. TECHNICAL BRIEF

• IC-level interfaces

- MSM device-compatible 3-line SBI for efficient initialization, status, and control

- Supports the MSM device’s interrupt processing with an internal interrupt manager

- Many functions monitored and reported through real-time and interrupt status signals

- Dedicated circuits for controlled power-on sequencing, including the MSM device’s reset signal

- Several events continuously monitored for triggering power-on/power-off sequences

- Supports and orchestrates soft resets

- USB-OTG transceiver for full-speed (12 Mb/s) and low speed (1.5 Mb/s) interfacing of the MSM device to computers as a USB peripheral, or connecting the MSM device to other peripherals

- RUIM level translators enable MSM device interfacing with external modules

• Twelve multi-purpose pins that can be configured as digital or analog I/Os, bi-directional I/Os, or current sinks. Default functions support the RUIM level translators, power-on circuits, analog multiplexer inputs, an

LED driver, and a reference voltage buffer.

• Highly integrated functionality in a small package - 84-pin BCCS with a large center slug for electrical ground, mechanical stability, and thermal relief.

LGE Internal Use Only

[Figure 1.6] MSM6245 Interface

- 28 -

Only for training and service purposes

3. TECHNICAL BRIEF

[Figure1.7] PM6650 Block Diagram

Only for training and service purposes

- 29 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.5.5 GSM PAM (U102 : SKY77329)

The SKY77329 Power Amplifier Module (PAM) is designed in a compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, PCS1900, and supports Class 12 General

Packet Radio Service (GPRS) multi-slot operation.

The module consists of a GSM850/900 PA block and a DCS1800/PCS1900 PA block, impedance matching circuitry for 50 Ω input and output impedances, and a Power Amplifier Control (PAC) block.

A custom CMOS integrated circuit provides the internal PAC function and interface circuitry.

Two separate Heterojunction Bipolar Transistor (HBT) PA blocks are fabricated onto InGaP/GaAs die; one supports the GSM850/900 bands, the other supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to distribute current. The GaAs die, the silicon die, and the passive components are mounted on a multi-layer laminate substrate and the entire assembly is encapsulated with plastic overmold.

L115

18nH

C133

L116

8.2nH

C122

8.2p

L117

1.5nH

C134

DCS_PCS_OUT

GSM_OUT

U102

SKY77329

R110

C131

68p

2.2K

NEAR TO PAM

GSM_PA_RAMP

+VPWR

C136

33p

C132

33u

DCS_PCS_IN

GSM_IN

TX_EN

C143

15p

R118 100ohm

R119 100ohm

C144

15p

FL100

GSM_PA_EN

GSM_PA_BAND

EFCH897MTDB1

10dB

R111

GSM_PA_BAND

LOW

HIGH

MODE

GSM

DCS/PCS

6dB

R115

DCS_PCS_TX

GSM_TX

[Figure 1. 8] GSM PAM Schematic

LGE Internal Use Only

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Only for training and service purposes

3. TECHNICAL BRIEF

3.5.6 UMTS Duplexer(FL102:ACMD-7602)

A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include;

• Insertion loss . this component is also in the receive and transmit paths ;

In the KU380 typical losses : UMTS2100_ Tx = 1.2 dB, UMTS2100_ Rx = 1.4 dB

• Out-of-band rejection or attenuation. the duplexer provides input selectivity for the receiver, output filtering for the transmitter, and isolation between the two. Rejection levels for both paths are specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver performance:

• Rx-band isolation. the transmitter is specified for out-of-band noise falling into the Rx band. This noise leaks from the transmit path into the receive path, and must be limited to avoid degrading receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and

Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 51 dB.

• Tx-band isolation the transmit channel power also leaks into the receiver. In this case, the leakage is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum duplexer Tx-band isolation value is about 58dB.

• Passband ripple the loss of this fairly narrowband device is not flat across its passband. Passband ripple increases the receive or transmit insertion loss at specific frequencies, creating performance variations across the band.s channels, and should be controlled.

• Return loss . minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).

• Power handling high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be used between the UMTS PA and duplexer to assure proper performance.

Only for training and service purposes

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.5.7 UMTS Rx RF filter (FL103 : EFCH2140TDE1)

■ Frequency range : 2110 ~ 2170MHz

An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include:

■ Out-of-band rejection or attenuation levels, usually specified to meet these conditions:

❏ Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency.

❏ Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage.

❏ Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.

LGE Internal Use Only

Table 1.3 WCDMA Rx SAW Filter Specification

- 32 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.5.8 Bluetooth (M100 : LBRQ-2B43A)

The MSM6280 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure1.5.12-1 shows the bluetooth system architecture in the KU380.

MSM6245

Bluetooth baseband

[Figure1.9] Bluetooth system architecture

Only for training and service purposes

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LGE Internal Use Only

3. TECHNICAL BRIEF

3. BB Technical Description

3.6 Digital Baseband(DBB/MSM6245)

3.6.1 General Description

A. Features(MSM6245)

■ Support for multimode operation - tri-band WCDMA (UMTS), quad-band GSM/GPRS/EDGE

■ Support for WCDMA (UMTS) uplink data rate up to 384 kbps

■ High-performance ARM926EJ-S running at up to 225 MHz

■ ARM Jazelle Java hardware acceleration for faster Java-based games and other applets

■ QDSP4000 high-performance DSP cores

■ Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals

■ Qcamera¢‚ with 30 fps QCIF viewfinder resolution, and support for 2 MP camera sensors

■ Direct interface to digital camera module with video front end (VFE) image processing

■ True 3D graphics for advanced wireless gaming

■ SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and

IMEI integrity. Support for Q-fuse. Only trusted boot is supported

■ Audio that is on par with portable music players

■ Vocoder support (AMR, FR, EFR, HR)

■ Advanced 14 x 14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology

■ SD/SDIO hardware support

LGE Internal Use Only

- 34 -

Only for training and service purposes

3. TECHNICAL BRIEF

USB

Bluetooth

RF Module

GSM Block

VCTCXO

PM6650

-2M

GSM

PAM

GSM

TX SAW

GSM900 Tx

GSM1800/1900 Tx

GSM900 Rx

GSM1800 Rx

GSM1900 Rx

GSM

VCO

Front

End

Module

WCDMA Block

COUPLER

WCDMA

PAM

WCDMA

TX SAW

RTR6275

WCDMA2100 Tx

Duplexer

WCDMA2100 Rx

HDET

WCDMA

VCO

WCDMA

RX SAW

AntSW Logic

SPK/RCV

MIC

MAIN LCD

MSM6245

1.3M CAM

VGA CAM

U-SIM

NAND, SDRAM

FLASH

KEYPAD

Figure. Simplified Block Diagram

Only for training and service purposes

- 35 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.6.2 Block Diagram(MSM6245)

SDRAM

512Mbit

NAND Flash

512Mbit

LCD

(1.76inch)

Camera 1.3M

VGA camera

CAMERA

PROCESSING

(Default 8bit

Interface)

GRAPHICS

Open GL ES

3D, 2D

VIDEO

MPEG-4

H.263, H.264

AUDIO

MP3, AAC,

EVRC, QCELP

AMR, CMX, MIDI

EBI 1 EBI 2

DUAL MEMORY BUS

MSM6245

Modem QDSP 4000

PLL

QDSP 4000

ARM 926ejs

With Jazelle

CONNECTIVITY

GSM/GPRS/EDGE processor

UMTS, WCDMA

BT 1.2

processor

GPIO

RF SBI

Rx ADC

Tx DAC

USIM

PM6650

USB

Figure. Simplified Block Diagram of MSM6245

LGE Internal Use Only

- 36 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.7 Subsystem(MSM6245)

3.7.1. ARM Microprocessor Subsystem

The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a Generic single-wire serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the

RTR6275, RFR6275 and PM6650 devices.

3.7.2 WCDMA R99 features

The MSM6245 device supports release 99 June 2004 of the W-CDMA FDD standard, including the following features:

■ All modes and data rates for W-CDMA frequency division duplex (FDD), with the following restrictions:

❏ The downlink supports the following specifications:

- Up to four physical channels, including the broadcast channel (BCH), if present

- Up to three dedicated physical channels (DPCHs)

- Spreading factor (SF) range support from 4 to 256

- The following transmit diversity modes are supported:

❏ Space time transmit diversity (STTD)

❏ Time-switched transmit diversity (TSTD)

❏ Closed-loop feedback transmit diversity (CLTD)

■ The uplink supports the following specifications:

❏ The uplink provides the following UE support:

- One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary

- A maximum data rate of 384 kbps

❏ Full SF range support from 4 to 256

■ SMS (CS and PS)

■ PS data rate - 384 kbps DL / 384 kbps UL

■ CS data rate - 64 kbps DL / 64 kbps UL

■ AMR (all rates)

Only for training and service purposes

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LGE Internal Use Only

3. TECHNICAL BRIEF

3.7.3 GSM features

The following GSM modes and data rates are supported by the MSM6245 device hardware. Support modes conform to release '99 specifications of the sub-feature.

■ Voice features

❏ FR

❏ EFR

❏ AMR

❏ HR

❏ A5/1, A5/2, and A5/3 ciphering

■ Circuit-switched data features

❏ 9.6k

❏ 14.4k

❏ Fax

❏ Transparent and non-transparent modes for CS data and fax

❏ No sub-rates are supported.

3.7.4 GPRS features

■ Packet switched data (GPRS)

❏ DTM (Simple Class A) operation

❏ Multi-slot class 12 data services

❏ CS schemes: CS1, CS2, CS3, and CS4

❏ GEA1, GEA2, and GEA3 ciphering

■ Maximum of four Rx timeslots per frame

3.7.5 EDGE features

■ EDGE E2 power class for 8 PSK

■ DTM (simple Class A), multi-slot class 12

■ Downlink coding schemes - CS 1-4, MCS 1-9

■ Uplink coding schemes - CS 1-4, MCS 1-9

■ BEP reporting

■ SRB loopback and test mode B

■ 8-bit, 11-bit RACH

■ PBCCH support

■ 1 phase/2 phase access procedures

■ Link adaptation and IR

■ NACC, extended UL TBF.

LGE Internal Use Only

- 38 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.7.6 MSM6245 device audio processing features

■ Integrated wideband stereo CODEC

❏ 16-bit DAC with typical 88 dB dynamic range

❏ Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path

■ VR- Voice mail + voice memo

■ Acoustic echo cancellation

■ Audio AGC

■ Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8

(G2)

■ Internal vocoder supporting AMR, FR, EFR, and HR

3.7.7 MSM6245 microprocessor subsystem

■ Industry standard ARM926EJ-S embedded microprocessor subsystem

❏ 16 kB instruction and 16 kB data cache

❏ Instruction set compatible with ARM7TDMI®

❏ ARM version 5TEJ instructions

❏ Higher performance 5 stage pipeline, Harvard cached architecture

❏ Higher internal CPU clock rate with on-chip cache

■ Java hardware acceleration

■ Enhanced memory support

❏ 75 MHz and 90 MHz bus clock for SDRAM

❏ 32-bit SDRAM

❏ Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed peripherals (EBI2) such as LCD panels

❏ 1.8 memory interface support for EBI1 and 1.8 V or 2.6 V memory interface support EBI2

❏ NAND FLASH memory interface

- 8/16-bit data I/O width NAND flash support

- 1- or 4-bit ECC

- 512-byte/2KB page-size support

- 2 chip selects supported for NAND Flash

❏ Boot from NAND

❏ Low-power SDRAM (LP-SDRAM) interface

■ Internal watchdog and sleep timers

Only for training and service purposes

- 39 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.7.8 Supported interface features

■ USB On-the-Go core supports both slave and host functionality

■ Three universal asynchronous receiver transmitter (UART) serial ports

■ USIM controller (via UART)

■ Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards

■ Parallel LCD interface

■ General-purpose I/O pins

■ External keypad interface

3.7.9 Supported multimedia features

■ Provide additional general purpose MIPS by using:

❏ Two QDSP4000s

❏ Dedicated hardware accelerators and compression engines

■ Improve Java, BREW, and game performance

❏ Integrated Java and 2D/3D graphics accelerator with Sprite engine

■ Enable various accessories via USB host connectivity.

❏ Integrated USB host controller functionality

■ Enable compelling visual and audio applications.

Qcamera TM

■ High-quality digital camera processing, supporting CCD or CMOS image sensors up to 2MP

■ 30 fps QCIF viewfinder

Qtv TM

■ Audio and video decoder that supports VOD, MOD and Broadcast multimedia services.

■ Audio codecs supported: AMR-NB, AMR-WB, AMR-WB+, AAC, AAC Plus, Enhanced AAC Plus,

Windows® Media Audio v9, RealAudio® v8

■ Integrated stereo wideband codec for music/digital clips

■ CMX

■ Video codecs supported: MPEG-4, H.263, H.264, Windows Media® v9 and RealNetworks® v10

Video telephony services: Qvideophone TM

■ A two-way mobile video conferencing solution that delivers 15 fps @ QCIF, 64kbps

■ Video codecs supported: MPEG-4 and H.263

■ Audio codecs supported: AMR-NB.

LGE Internal Use Only

- 40 -

Only for training and service purposes

Qcamcorder TM

■ Real time mobile video encoder

■ Video codecs supported: MPEG-4, H.263.H.264

■ Audio codecs supported: AMR-NB

■ Recording performance: 15 fps @ QCIF, 192 kbps

CMX TM (MIDI and still image, animation, text, LED/vibrate support)

■ 72 simultaneous polyphonic tones

■ 44 kHz sampling rate

■ 512 kB wave table

■ Support of universal file formats

❏ Standard MIDI Format (SMF)

❏ SP-MIDI

❏ SMAF Audio playback (MA-2, MA-3, MA-5)

❏ XMF/OLS

❏ MFi (requires Docomo license)

■ PNG decoder

■ Pitch bend range support

■ LED/vibrate support

■ Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2)

■ MLZ decoder

■ Integrated PNG/SAF A.T.

3. TECHNICAL BRIEF

Only for training and service purposes

- 41 -

LGE Internal Use Only

3. TECHNICAL BRIEF

LGE Internal Use Only

- 42 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.7.10 Stereo Wideband CODEC

The MSM6245 device integrates a wideband voice/audio CODEC into the mobile station modem

(MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface.

The CODEC integrates the microphone and earphone amplifiers into the MSM6245 device, reducing the external component count to just a few passive components.

The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set externally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems.

3.7.11 Vocoder Subsystem

The MSM6245 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to support DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), ear seal echo canceller (ESEC),

Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR,

Tx/Rx compensation filters. The MSM6245 device’s integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.

3.7.12 ARM Microprocessor subsystem

The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM device, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a generic single serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the RFR6275, RTR6275, and PM6650 devices.

3.7.13 Mode Select and JTAG Interfaces

The mode pins to the MSM6245 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation,

ETM mode, which enables the built-in trace mode, and test mode for factory testing.

The MSM6245 device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture.

Only for training and service purposes

- 43 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.7.14 General-Purpose Input/Output Interface

The MSM62450 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional

RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.

3.7.15 UART

The MSM6245 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share multiplexed pins.

3.7.16 USB

The MSM6245 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral communicating with the USB host. MSM6245 supports the 3-wire functionality.

LGE Internal Use Only

- 44 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.8 Power Block

3.8.1 General

MSM6245, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of

MSM6245, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are :

3.8.2 PM6650

The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference.

A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (undervoltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions.

MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.

Only for training and service purposes

- 45 -

LGE Internal Use Only

3. TECHNICAL BRIEF

Figure 1-1. PM6650 Functional Block Diagram

LGE Internal Use Only

- 46 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.8.3 Charging control

A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and

ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.

4.2V~3.83V

100~70 (%)

3.82V~3.73V

69~45 (%)

3.72V~3.68V

44~20 (%)

3.67V~3.58V

19~3 (%)

KU380 Battery Bar Display(Stand By Condition)

3.57V~3.20V

2~0 (%)

Only for training and service purposes

- 47 -

LGE Internal Use Only

3. TECHNICAL BRIEF

Trickle Charging

Trickle Charging of the main battery, enabled through SBI control and powered from V

, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from V

DD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its performance specified below (3.2V). The charging current is set to 80mA.

Parameter

Trickle Current

Min

Typ

Max

100

Unit

LGE Internal Use Only

- 48 -

Only for training and service purposes

3. TECHNICAL BRIEF

Constant Current Charging

The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.

Constant Voltage Charging

Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.

The end of constant voltage charging is commonly detected 10% of the full charging current.

• Charging Method : CC & CV (Constant Current & Constant Voltage)

• Maximum Charging Voltage : 4.2V

• Maximum Charging Current : 600mA

• Nominal Battery Capacity : 900mAh

• Charger Voltage : 5.1V

• Charging time : Max 3.5h (Except time trickle charging)

• Full charge indication current (icon stop current) : 100mA

• Low battery POP UP : Idle - 3.58V, Dedicated(GSM/WCDMA) - 3.58V

• Low battery alarm interval : Idle - 3 min, Dedicated - 1min

• Cut-off voltage : 3.20V

Only for training and service purposes

- 49 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.9 External memory interface

The MSM6245 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SDRAM, etc.

• EBI1 Features

- 16 bit static and dynamic memory interface

- 32 bit dynamic memory interface

- 24 bits of address for static memory devices which can support up to 32MBytes on each chip select

- Synchronous burst memories supported (burst NOR, burst PSRAM)

- Synchronous DRAM memories supported

- Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses

- Pseudo SRAM (PSRAM) memory support

• EBI2 Features

- Support for asynchronous FLASH and SRAM(16bit & 8bit).

- Interface support for byte addressable 16bit devices (UB_N & LB_N signals).

- Support for 8 bit/16bit wide NAND flash.

- Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit).

• 2Gb NAND(16bit, Large Block ) flash memory + 1Gb SDRAM (32bit)

• 1Gb NAND(8bit) flash memory + 512Mb SDRAM (32bit)

Device

FLASH

SDRAM

Part Name

TY9000A800JOGG

Interface Spec

Maker

TOSHIBA

Read Access Time

50 ns

8 ns

Table#1. External memory interface

Write Access Time

30 ns

8 ns

LGE Internal Use Only

- 50 -

Only for training and service purposes

3. TECHNICAL BRIEF

SDRAM

512Mb

EBI1

ADDRESS[12:0]

DATA[31:0]

WE*

CS*

CAS*

RAS*

CLK_EN

CLK

DQM[3:0]

EBI2

MSM6245

NAND_CS*

NAND_RE*

NAND_WE*

NAND_CLE

NAND_WP*

NAND_ALE

NAND_READY

DATA[15:0]

NAND

1Gb

(126MB)

Figure. Simplified Block Diagram of Memory Interface

Only for training and service purposes

- 51 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.10 H/W Sub System

3.10.1 RF Interface

A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)

MSM6245 controls RF part(RTR6275) using these signals.

• SBST : SSBI I/F signals for control Sub-chipset

• PA_ON1 : Power AMP on RF part

• RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF

• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier

• DAC_REF : Reference input to the MSM Tx data DACs

XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77

UART3_RFR_N_GPIO87

UART2_DP_RX_DATA_GPIO89

SYNTH0_GP_PDM0_GPIO92

SBST1_GPIO93

L25

F18

H18

TX_AGC_ADJ

TRK_LO_ADJ

TCXO_EN_GPIO94

PA_ON0

H13

L13

F19

F17

Q_OUT_N

Q_OUT

I_OUT_N

I_OUT

DAC_REF

A12

B12

A13

B13

F12

Q_IM_CH1

Q_IP_CH1

I_IM_CH1

I_IP_CH1

Q_IM_CH0

Q_IP_CH0

I_IM_CH0

I_IP_CH0

W23

V23

V25

W25

AA25

Y25

AB25

AC25

GP_PDM2_PA_RAN_GE1

GP_PDM1_PA_RAN_GE0

D17

H17

TRST_N

TCK

TMS

TDI

TDO

RTCK

H15

D16

F15

D15

A17

H16

AUX_PCM_CLK_GRFC14_GPIO80

AUX_PCM_DIN_GRFC13_GPIO14

AUX_PCM_DOUT_GRFC12_GPIO103

AUX_PCM_SYNC_GRFC11_GPIO102

TX_ON_GRFC10

K19

N21

H12

GRFC8_GPIO11

GRFC7_GPIO10

GRFX6_GPIO9

GRFC5_AUX_SBST_GPIO8

GRFC4_AUX_SBCK_GPIO7

GRFC3_GPIO6

GRFC2_GPIO5

GRFC1_AUX_SBDT_GPIO4

GRFC0_GPIO3

T23

T19

D11

H10

F10

BT_CLK_GPIO25

BT_SBST_GPIO24

BT_SBCK_GPIO23

BT_SBDT_GPIO22

BT_TX_RX_N_GPIO21

BT_DATA_GPIO20

G23

F23

E26

E25

H21

R19

PA_R0

JTAG_TRST_N

JTAG_TCK

JTAG_TMS

JTAG_TDI

JTAG_TDO

JTAG_RTCK

SPK_AMP_EN

TX_ON

ANT_SEL1

ANT_SEL0

GSM_PA_BAND

GSM_PA_EN

BT_CLK

BT_SBST

BT_SBCK

BT_SBDT

BT_TX_RX_N

BT_DATA

KEY_BL_EN

RCV_EN_N

SLIDE_DETECT

LCD_IF_MODE_1

GPIOs

0 R211

2K R212

TCXO_EN

PA_ON

TX_QM

TX_QP

TX_IM

TX_IP

DAC_REF

Close to MSM

TX_AGC_ADJ

TRK_LO_ADJ

RX_QM

RX_QP

RX_IM

RX_IP

JTAG

Figure. Schematic of RF Interface of MSM6245

LGE Internal Use Only

- 52 -

Only for training and service purposes

3. TECHNICAL BRIEF

B. the others

• TRK_LO_ADJ : TCXO(19.2M) Control

• PA_ON : WCDMA(2100) TX Power Amp Enable

• ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)

• GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp

• GSM_PA_RAMP : Power Amp Gain Control of APC_IC

• GSM_PA_EN : Power Amp Gain Control Enable of APC_IC

Only for training and service purposes

- 53 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.10.2 MSM Sub System

3.10.2.1. USIM Interface

SIM interface scheme is shown in Figure.

And, there control signals are followed

• USIM_CLK : USIM Clock

• USIM_Reset : USIM Reset

• USIM_Data : USIM Data T/Rx

MSM6245

USIM CLK

USIM Reset

USIM Data

PM6650

VREG_UIM 2.85V

USIM CLK

USIM Reset

USIM Data

USIM

Figure. SIM Interface

3.10.2.2 UART Interface

UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.

GPIO_Map

GPIO_96

GPIO_95

Name

UART_RXD

UART_TXD

Note

Data_Rx

Data_Tx

Table. UART Interface

LGE Internal Use Only

- 54 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.10.2.3 USB

The MSM6245 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the

MSM6245 was designed to comply with the definition of a peripheral as specified in USB Specification,

Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB

Specification, Revision 2.0.

The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the MSM6245.

Name

USB_DAT

USB_SE0

USB_OE_N

USB_VBUS

USB_D+

USB_D-

Note

Data to/from MSM

Out-Put Enable of Transceiver

USB_Power From Host(PC)

USB Data+ to Host

USB Data- to Host

Table. USB Signal Interface

USB_OE_N

USB_CTL_N

USB_DAT

USB_SE0

USB_ID

VREG_5V

USB_OE_N

VSW_5V

USB_CTL_N

USB_VBUS

USB_DAT

USB_D_P

USB_SE0

USB_D_M

GP1_DRV_N(MPP7)

R309 2.2K

C331

1608

4.7u

PMIC USB MicroSD

Figure. Schematic of USB block(MSM6245 Side & PM6650 Side)

Only for training and service purposes

- 55 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.10.3 HKADC(House Keeping ADC)

The MSM6245 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6245 device has six analog input pins which are multiplexed to the input of the internal HKADC.

Figure. MSM6245 HKADC Block diagram

Channel

HKADC0

HKADC1

HKADC2

HKADC3

HKADC4

HKADC5

Signal

AMUX_OUT

VBATT_SENSE

REF_ADC

TTY_ADC_DET

PCB_Rev_ADC

Battery_THERM

Note

RF PAM Temperature Check

Battery voltage level

ADC Reference voltage

Ear jack Detection for TTY

PCB Version Check

Battery Temperature Check

Table. HKADC channel table

LGE Internal Use Only

- 56 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.10.4 Key Pad

There are 23 main key buttons in Figure.

Shows the Keypad circuit. ‘END’ Key is connected to PMIC(PM6650).

ROW(0)

ROW(1)

ROW(2)

ROW(3)

ROW(4)

COL(0)

COL(1)

COL(2)

* 0 #

Table. Key Matrix Mapping Table

COL(3)

CLR

LEFT

SND

COL(4)

RIGHT

BACK

VREG_MSMP_2.7V

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

HOT4

KEY_ROW(4)

KEY_COL(0)

KEY_COL(1)

KEY_COL(2)

KEY MAP

400

403

406

HOT400

407

409

HOT3

401

404

402

405

408

HOT401

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_ROW(4)

KEY_COL(3)

KEY_COL(4)

CLR

LEFT

RIGHT

SND

BACK

Figure. Main/Sub Keypad Circuit

Only for training and service purposes

- 57 -

LGE Internal Use Only

3. TECHNICAL BRIEF

END

PM_ON_SW_N

EVL14K02200

Figure. END Keypad Circuit

LGE Internal Use Only

- 58 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.10.5 Camera Interface

KU380 Installed a 1.3M Pixel and 0.3Mega Camera.

Below figure shows the camera socket type connector and camera I/F signal.

CAMERA

MEGA CAMERA CONNECTOR

CAM_DATA_OUT(0)

CAM_DATA_OUT(1)

CAM_DATA_OUT(2)

CAM_DATA_OUT(3)

CAM_DATA_OUT(4)

CAM_DATA_OUT(5)

CAM_DATA_OUT(6)

CAM_DATA_OUT(7)

CN403

PCLK

VSYNC

HSYNC

STANDBY

SCK

SDA

RESETB

MCLK

R412 47

CAM_PCLK

CAM_VSYNC_OUT

CAM_HSYNC_OUT

MEGA_CAM_PWR_DOWN

I2C_SCL

I2C_SDA

MEGA_CAM_RESET_N

CAM_MCLK

VREG_CAM_AVDD_2.8V

VREG_CAM_DVDD_1.8V

CAM_DATA_OUT(6)

CAM_DATA_OUT(7)

CAM_VSYNC_OUT

CAM_HSYNC_OUT

I2C_SDA

I2C_SCL

VGA_CAM_RESET_N

VREG_CAM_DVDD_1.8V

VREG_CAM_AVDD_2.8V

CAM_DATA(0)

CAM_DATA(1)

CAM_DATA(2)

EVRC18S05Q030050R

INOUT_A1

INOUT_A3

INOUT_A2

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

FL406

CAM_DATA_OUT(0)

CAM_DATA_OUT(1)

CAM_DATA_OUT(2)

CAM_DATA(6)

CAM_DATA(7)

CAM_VSYNC

CAM_HSYNC

CAM_DATA(3)

CAM_DATA(4)

CAM_DATA(5)

EVRC18S05Q030050R

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

FL408

EVRC18S05Q030050R

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

FL407

CAM_DATA_OUT(6)

CAM_DATA_OUT(7)

CAM_VSYNC_OUT

CAM_HSYNC_OUT

CAM_DATA_OUT(3)

CAM_DATA_OUT(4)

CAM_DATA_OUT(5)

CN101

CAM_DATA_OUT(5)

CAM_DATA_OUT(4)

CAM_DATA_OUT(3)

CAM_DATA_OUT(2)

CAM_DATA_OUT(1)

CAM_DATA_OUT(0)

CAM_PCLK

CAM_MCLK

VGA_CAM_EN

FPCB to VGA Camera Connector

Figure. Camera Socket Type Connector

Only for training and service purposes

- 59 -

LGE Internal Use Only

3. TECHNICAL BRIEF

The MEGA Camera module is connected to socket type connector with 24 pin (F95M08). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from

MSM6245.

Name

CAM_DATA_OUT(3)

CAM_DATA_OUT(4)

CAM_DATA_OUT(5)

CAM_DATA_OUT(6)

CAM_DATA_OUT(7)

GND

MCLK

GND

MEGA_CAM_RESET_N

I2C_SDA

I2C_SCL

MEGA_CAM_PWR_DN

VREG_CAM_DVDD_1.8V

VREG_CAM_AVDD_2.8V

GND

VREG_CAM_AVDD_2.8V

GND

CAM_HSYNC_OUT

CAM_VSYNC_OUT

CAM_PCLK

GND

CAM_DATA_OUT(0)

CAM_DATA_OUT(1)

CAM_DATA_OUT(2)

GND

Port

GND

Note

Data

GND

Master Clock(24.576M)

GND

Camera reset signal

I2C Data

I2C Clock

Camera power down

DVDD

VDDIO

GND

AVDD

GND

Horizontal Sync

Vertical Sync

Pixel Clock (49.152M)

GND

Data

Table. Interface between MEGA Camera Module and MAIN PCB (in camera module)

LGE Internal Use Only

- 60 -

Only for training and service purposes

3. TECHNICAL BRIEF

The VGA Camera module is connected to socket type connector with 20 pin (CLE9120-2761E). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 12.288MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6245.

Name

VGA_CAM_EN

CAM_MCLK

GND

VGA_CAM_PCLK

CAM_DATA(0)

CAM_DATA(1)

CAM_DATA(2)

CAM_DATA(3)

CAM_DATA(4)

CAM_DATA(5)

CAM_DATA(6)

CAM_DATA(7)

CAM_VSYNC_OUT

CAM_HSYNC_OUT

GND

I2C_SDA

I2C_SCL

VGA_CAM_RESET_N

VREG_CAM_DVDD_1.8V

VREG_AVDD_2.8V

Port

GND

Note

DVDD

Master Clock(24.576M)

GND

Clock for Camera Data Out(12M)

Data

Vertical Sync

Horizontal Sync

GND

I2C Data

I2C Clock

Camera reset signal

Camera I/O Power

Table. Interface between VGA Camera Module and MAIN PCB (in camera module)

Only for training and service purposes

- 61 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.10.6 Keypad Light

There are 1 white LED in Main key backlight circuit, which are driven by KYDB_BACKLIGHT line from

PM6650.

+VPWR

LD400

SSC-SWTS1007

1 2

A C

R411

100ohm

KYBD_BACKLIGHT

Figure. Schematic of KEY back light circuit ( KEY side )

3.10.7 LCD Module (IM176CBA2N)

- The IM176CBA2N model is a Color TFT Main supplied by LGIT. This LCD Module has a 1.76 inch diagonally measured active display area with 176(RGB)X220 resolution. each pixel is divided into Red,

Green and Blue sub-pixels and dots which are arranged in vertical stripes.

* Features

- Display mode(Main LCD) : Normally White, Transmissive TN mode 265K colors.

- LCD Driver IC: HX8340 (Himax).

- 16 bit CPU interface Parallel

LGE Internal Use Only

- 62 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.10.8 Display & LCD FPC Interface

LCD module is connected to LCD KEY FPCB with 35 pin (XF2B-3545-31A / OMROM) The LCD module is controlled by 16-bit EBI2 in MSM6245.

CN101

LCD_RESET_N

LCD_IF_MODE_0

LCD_IF_MODE_1

LCD_VSYNC

LCD_CS_N

LCD_ADS

EBI2_WE_N

EBI2_OE_N

EBI2_DATA(0)

EBI2_DATA(1)

EBI2_DATA(2)

EBI2_DATA(3)

EBI2_DATA(4)

EBI2_DATA(5)

EBI2_DATA(6)

EBI2_DATA(7)

EBI2_DATA(8)

EBI2_DATA(9)

EBI2_DATA(10)

EBI2_DATA(11)

EBI2_DATA(12)

EBI2_DATA(13)

EBI2_DATA(14)

EBI2_DATA(15)

LCD_MAKER_ID

VREG_LCD_2.8V

WLED_1

WLED_2

WLED_3

WLED_PWR

LCD CONNECTOR

Figure. Interface between LCD Module and MAIN PCB.

Only for training and service purposes

- 63 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.10.8.1 Audio Signal Processing & Interface

Audio signal processing is divided uplink path and downlink path.

The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (MSM6245).

This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset.

The downlink path amplifies the signal from DBB chip (MSM6245) and outputs it to receiver (or speaker). The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_P, LINE_N) are differential outputs. Earphone2 (HPH_L, HPH_R) is a single-ended output stage designed to drive a headset speaker. The microphone interface consists of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.

LGE Internal Use Only

Figure. Audio Interface Detailed Diagram(MSM6245)

- 64 -

Only for training and service purposes

3. TECHNICAL BRIEF

MSM6245 CODEC pins

C200 47p

C201 47p

AUDIO

Near to MSM

C204

10p

C212

0.1u

10%

Place near

MSM pin W18

(CODEC VSS)

SDCC_DAT1_GPIO99

SDCC_DAT2_GPIO100

F25

M25

Figure . Audio part schematics

VREG_MSMP_2.7V

R401

5.1K

C400

0.1u

HOOK_KEY_N

OUT

VCC

U400

NCS2200SQ2T2G

GND

VIN-

VIN+

10K

R404

MIC2N

MIC2P

HPH_L

HPH_R

USB_D+

USB_D-

EAR_SENSE_N

R400

2.2K

MICBIAS

VREG_MSMP_2.7V

R403

51K

I/O CONNECTOR

C402

C401

33u

R407

R406 100ohm

100ohm

Figure . Audio part schematics

CN400

HSEJ-18S04-25R

Only for training and service purposes

- 65 -

LGE Internal Use Only

3. TECHNICAL BRIEF

AUDIO

+VPWR

C415

0.01u

SPK-

SPK_RCV-

RCV-

SELECT_SPK&RCV

R414 39

U401

NLAS5223BMNR2G

VCC NO2

NO1 COM2

COM1

IN1

NC1

IN2

NC2

GND

39 R413

SPK+

SPK_RCV+

RCV_EN_N

RCV+

REV_B

MIC

REV_B : SUMY0010301 --> SUMY0003802

SP0204LE5-PB

PWR

OUT

MIC400

C421

10u

C422

47p

MICBIAS

C423

C424

22n

MIC1N

MIC1P

REV_B : EDTY0008606 --> EDTY0008601

SPK_AMP_EN

LINE_N

LINE_P

R418

R420

C427

C428

0.1u

R419

R421

5.6K

R417

20K

R422

20K

Audio AMP

NCP2890DMR2

_SD OUTB

BYPASS

U402

INP

INM OUTA

C429

10u

C432

SPK-

+VPWR

SPK+

Figure . Audio part schematics

LGE Internal Use Only

- 66 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.10.8.2 Audio Mode

There are three audio modes (Voice call, speaker phone, MIDI/MP3).

MODE

Voice Call

Speaker phone

MIDI

MP3

Device

Receiver Mode

Loud Mode

Headset

Loud Mode

Headset

Loud Mode

Headset

Description

Receiver Voice Call

Speaker Phone

Headset Voice Call

Speaker Phone

Speaker MIDI Bell

Headset MIDI Bell

Speaker MP3

Headset MP3

Audio & Sound Main Component

There are 6 main components in KU380.

Table. Audio Mode

Component

MSM6245

Audio amp

Analog Switch

Speaker/Receiver

MIC

Ear jack

Design No.

U201

Maker Part No.

MSM6245

U402

U401

MIC400

NCP2890DMR2

NLAS5223BMNR2G

EMS1810TFR1P

SP0204LE5-PB

RMBLGG080STSB

Note

Base-Band Modem

1W Audio Amp

Dual Analog Switch

Speaker/Receiver

SMD microphone

Ear jack

Table. Audio main component list

Only for training and service purposes

- 67 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.11 Main Features

1. LG-KU380 Main features

- Slide Type

- WCDMA(2100) + GSM Tri-Band (900/1800/1900)/EDGE

- Color LCD (Main:262K TFT, 1.76”)

- Dual Camera (1.3Mega + VGA(0.3M))

- 1810 speaker/receiver

- Stereo Headset

- Speaker phone (in GSM and WCDMA)

- MP3/AAC decoder and play

- MPEG4 encoder/decoder and play/save

- JPEG en/decoder

- Supports Bluetooth, USB

- 900 mAh (Li-Ion)

LGE Internal Use Only

- 68 -

Only for training and service purposes

2. KU380 Main Component

RF

3. TECHNICAL BRIEF

Power

Logic

Main board (Top)

Bluetooth

Main board (Bottom)

Only for training and service purposes

- 69 -

LGE Internal Use Only

3. TECHNICAL BRIEF

U100

X100

U101

FL101

Reference

SW100

U500

U101

FL100

U100

Description

Ant. Switch module

Front End module

GSM PAM

GSM SAW

RTR6275

Reference

FL104

U103

X100

M100

Description

W2100 Duplex

WCDMA PAM

VCTCXO

BT module

SW100

U100

FL104

U103

LGE Internal Use Only

- 70 -

Only for training and service purposes

3. TECHNICAL BRIEF

Logic / Audio

BAT300

U302

CN401

U402

Reference

BAT300

U302

U402

Description

Backup Battery

1.3M Cam. LDO

Audio AMP

Reference

CN401

Description

MMI connector

(18pin)

Only for training and service purposes

- 71 -

LGE Internal Use Only

3. TECHNICAL BRIEF

Logic

CN400

U300

U201

U301

J300

S300

Reference

U201

U301

CN400

Description

MSM6245_A

Memory MCP

Main To LCD

Connector

Reference

U300

J300

S300

Description

PMIC

U-SIM socket

T-FLASH socket

LGE Internal Use Only

- 72 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.1 RF Component

BOTTOM SIDE

4. TROUBLE SHOOTING

Only for training and service purposes

- 73 -

LGE Internal Use Only

4. TROUBLE SHOOTING

LGE Internal Use Only

- 74 -

Only for training and service purposes

4.2 SIGNAL PATH_UMTS RF

4. TROUBLE SHOOTING

Only for training and service purposes

- 75 -

Common Tx/Rx

UMTX 2100 Tx/Rx

UMTX 2100 Tx

UMTX 2100 Rx

Tx I/Q

RX I/Q

LGE Internal Use Only

4. TROUBLE SHOOTING

4.3 SIGNAL PATH_GSM RF

LGE Internal Use Only

Common Tx/Rx

GSM900 Tx

DCS/PCS Tx

EGSM900 RX

PCS Rx

DCS RX

Tx I/Q

RX I/Q

- 76 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.4 Checking VC-TCXO Block

The reference frequency (19.2MHz) from X100 (VC-TCXO) is used in UMTS TX part, GSM part and

BB part.

Schematic of the VC-TCXO Block

TCXO

TP1

VREG_TCXO_2.85V

DSA321SCE-19.2M

VCC

X100

VCONT

OUTPUT GND

NC4

NC3

NC1

NC2

100ohm R126

TRK_LO_ADJ

TP2

TCXO_PM

RTR6275_TCXO

C175 100p

C177 1000p

TP3

R127 100K

C178 0.01u

VCC

U105

TC7SH04FU

GND

C176

1000p

TCXO_BT

TP1

TP3

TP2

Test Point of the VC-TCXO Block

Only for training and service purposes

- 77 -

LGE Internal Use Only

4. TROUBLE SHOOTING

T

Check C312 of PMIC (U300)

Check R 212 of MSM (U200)

T

LGE Internal Use Only

- 78 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.5 Checking Front-End Module Block

TP1

VREG_RF_SMPS

L106

7.5nH

C110

10p

VDD

GND1

GND2

GND3

GND4

GND5

GND6

GND7

GND8

GND9

GND10

D5011

GSM900_RX1

GSM900_RX2

GSM1800_RX1

GSM1800_RX2

GSM1900_RX1

GSM1900_RX2

WCDMA2100

CTRL1

CTRL2

GSM900_TX

GSM18001900_TX

Schematic of the Front-End Module Block

C116

33p

C117

33p

R102

R103

ANT_SEL0

ANT_SEL1

ANT_SEL0

TP1

Test Point of the Front-End

Module Block

ANT_SEL1

Only for training and service purposes

- 79 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Logic Table of the FEM

TP1 VREG_RF_SMPS

LGE Internal Use Only

- 80 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.6 Checking UMTS Block

4.6.1 Checking Tx level

TP1

TP2

TP3

TP4

C101

1.5p

L126

12nH

L123

1.8nH

WCDMA

TP2

FL102

PGND

ANT

ACMD-7602

3.9p

C154

L101

3.3nH

L102

15nH

ANT

SW100

KMS-507

C100

56p

TP1

L103

100nH

U100

+VPWR

NEAR TO PAM

C149

4.7u

C151

20dB

U103

CP0402A1950DNTR

R123

130

R122

7dB

R124

130

PWR_DET

C157

C155

10p

L127

15nH

TP3

TP4

NEAR TO PAM

C152

+VPWR

AWT6277R

GND5

VCC2

GND4

RFOUT

GND3

GND2

U104

VCC1

RFIN

GND1

VMODE

VREF

NEAR TO PAM

C158

100p

PA_R0

TR100

KRX102U

L122

C148

8.2p

L121

5.6nH

PA_ON

C162

100p

VREG_TCXO_2.85V

Only for training and service purposes

- 81 -

LGE Internal Use Only

4. TROUBLE SHOOTING

U103

FL102

U100

LGE Internal Use Only

- 82 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.6.2 Checking UMTS PAM Control Block

• PAM control signal

1. PWR_DET : UMTS Tx Power Detected value (Check R120)

2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control

3. VREG_TCXO_2.85V : UMTS PAM enable (C170) (about 2.85V)

4. +VPWR : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V)

5. PA_ON : Turns the PA on and off

6. PA_R0 : Control signals that step the active PA mode and bias

+VPWR

PWR_DET

PA_R 0

PA_ON

VREG_TCXO_2.85

Only for training and service purposes

- 83 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.6.3 Checking RF Rx Level

TP1

TP2

TP4

TP3

C100

56p

TP1

C101

1.5p

L101

3.3nH

L102

15nH

ANT

SW100

KMS-507

L103

100nH

U100

WCDMA

L126

12nH

L123

1.8nH

FL102

PGND

ANT

ACMD-7602

TP2

3.9p

C154

+VPWR

NEAR TO PAM

C149

4.7u

C151

20dB

U103

CP0402A1950DNTR

R123

130

R122

7dB

R124

130

PWR_DET

C157

C155

10p

L127

15nH

NEAR TO PAM

C152

+VPWR

AWT6277R

GND5

VCC2

GND4

RFOUT

GND3

GND2

U104

VCC1

RFIN

GND1

VMODE

VREF

NEAR TO PAM

C158

100p

PA_R0

TR100

KRX102U

L122

C148

8.2p

L121

5.6nH

4 5

O1 G3

G2 G1

FL101

EFCH1950TDF1

3 2

C162

100p

PA_ON

VREG_TCXO_2.85V

TP3

L131

2.2nH

L132

2.7nH

C166

10p

TP4

VDD_RX

C150

100p

L120

1nH

C153

2.2p

L124

4.7nH

C156

2.2p

L130

10nH

5 4

O2 FL103

EFCH2140TDE1

2 3

L129

4.7nH

L125

4.7nH

C160

2.2p

LGE Internal Use Only

- 84 -

Only for training and service purposes

4. TROUBLE SHOOTING

Only for training and service purposes

- 85 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.7 Checking GSM Block

LGE Internal Use Only

- 86 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.7.1 Checking RF Tx level

TP1

TP2

TP3

3.7.2 Schematic of RF Tx level

TP1

L102

15nH

ANT

SW100

KMS-507

C100

56p

L103

100nH

VDD

U100

GND1

GND2

GND3

GND4

GND5

GND6

GND7

GND8

GND9

GND10

D5011

GSM900_RX1

GSM900_RX2

GSM1800_RX1

GSM1800_RX2

GSM1900_RX1

GSM1900_RX2

WCDMA2100

CTRL1

CTRL2

GSM900_TX

GSM18001900_TX

GSM 850/ GSM 900 RX

GSM 850/GSM 900 TX/ WCDMA

GSM 1800/GSM 1900 TX

HIGH

LOW

HIGH

LOW

HIGH

C116

33p

C117

33p

R102

R103

ANT_SEL0

ANT_SEL1

TP3

L115

18nH

C133

C122

8.2p

L117

1.5nH

C134

L116

8.2nH

DCS_PCS_OUT

GSM_OUT

U102

SKY77329

DCS_PCS_IN

GSM_IN

TX_EN

TP3

Only for training and service purposes

- 87 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.7.3 Checking RF Tx level

LGE Internal Use Only

- 88 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.7.4 Checking PAM Block

TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.6V

TP2. GSM_PA_EN : Power Amp Enable

(Power ON : higher than 1.25V , Power OFF : lower than 0.4V)

TP3. GSM_PA_BAND : Power Amp Band Selection Control

(GSM Mode : -0.2V < VBS < 0.4V , DCS/PCS Mode : 1.25V < VBS < 3.0V)

TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.0V

TP3

TP2

TP1

TP4

C134

L116

8.2nH

DCS_PCS_OUT

GSM_OUT

U102

SKY77329

R110

2.2K

C131

68p

NEAR TO PAM

TP4

GSM_PA_RAMP

+VPWR

C136

33p

C132

33u

TP1

TP3

DCS_PCS_IN

GSM_IN

TX_EN

C143

15p

R118 100ohm

R119 100ohm

C144

15p

TP2

GSM_PA_EN

GSM_PA_BAND

LOW

HIGH

Schematic of GSM PAM Block

Only for training and service purposes

- 89 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.7.5 Checking RF Rx Block

TP3

TP2

TP1

TP1. DCS RX INPUT

TP2. PCS RX INPUT

TP3. GSM RX INPUT

L103

100nH

VDD

U100

GND1

GND2

GND3

GND4

GND5

GND6

GND7

GND8

GND9

GND10

D5011

GSM900_RX1

GSM900_RX2

GSM1800_RX1

GSM1800_RX2

GSM1900_RX1

GSM1900_RX2

WCDMA2100

CTRL1

CTRL2

GSM900_TX

GSM18001900_TX

C116

33p

C117

33p

TP1

R102

R103

ANT_SEL0

ANT_SEL1

TP2

TP3

Schematic of GSM900/DCS/PCS Rx Block

DCS

PCS

EGSM

L104

C106

2.2nH

L107

2.2nH

L108

2.2nH

C115

0.5p

L110

2.2nH

L111

C120

12nH

L105

2.2nH

L109

3.9nH

L112

12nH

L113 12nH

LGE Internal Use Only

- 90 -

Only for training and service purposes

4. TROUBLE SHOOTING

Only for training and service purposes

- 91 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.8 Checking Bluetooth Block

TP1. VREG_BT_2.85V

TP2. VREG_MSMP_2.7V

TP3. TCXO_BT

TP4. BT ANT Output

TP4

TP1

TP2

TP3

Test Point of the Bluetooth Block

TP1

TP2

BT_CLK

VREG_MSMP_2.7V

VREG_BT_2.85V

TP4

BLUETOOTH

R125

C163 1000p

C164

C165

2.2u

L128

M100

LBRQ-2B43A

CLK_REF

VCC_OUT

VDD_INT

VDD_MSM

VDD_BAT

SBST

SBCK

SBDT

SYNC_DET_TX_EN

RX_BB_TX_BB

XTAL_IN

C159

100p

1000p C167

AMAA802012LG09

FEED

GND1

GND2

ANT104

TP3

BT_SBST

BT_SBCK

BT_SBDT

BT_TX_RX_N

BT_DATA

TCXO_BT

Schematic of the Bluetooth Block

LGE Internal Use Only

- 92 -

Only for training and service purposes

4. TROUBLE SHOOTING

Start

TP1,TP2

Signals exits?

YES

TP3

Is clock ok? 19.2M

Change the Main board

Cha nge the X100

YES

TP4

Signals exits?

YES

Change the Main board

Change the M100

Only for training and service purposes

- 93 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.9 Power ON Troubleshooting

Power On sequence of KU380 is :

PWR key press

→ PM_ON_SW_N go to low, PM6650 KPDPWR_N (pin24) → PM6650 Power Up →

VREG_MSMC_1.2V, VREG_MSME_1.8V, VREG_MSMP_2.7V, VREG_MSMA_2.6V,

VREG_TCXO_2.85V power up and system reset assert to MSM6245

→ Phone booting and

PS_HOLD assert to PMIC

Start

Battery voltage. higher than 3.20V?

YES

Change or charging the

Battery

Key press?

Check the Key Dome

YES

VREG_MSMC_1.2V,VREG_MSMP_2.7V,

VREG_MSME_1.8V, VREG_TCXO_2.85V,

VREG_MSMA_2.6V power up?

Change the Main board

YES

Is clock ok?

R306 : 19.2M

X300 : 32.768Khz

YES

Change the Main board

Check the TXCO

LGE Internal Use Only

- 94 -

Only for training and service purposes

X300 : 32.768Khz

4. TROUBLE SHOOTING

VREG_MSME_18V VREG_MSMC_125V VREG_RF_SMPS

VREG_MSMA_2.6A

[ KU380 Main PCB BOTTOM ]

R306 : 19.2Mhz

Only for training and service purposes

- 95 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.10 Charger Troubleshooting

VBATT

+5V_PWR

USB_VBUS

ICHARGE

U304

P_DRAIN P_COLLECTOR

EMITTER1

EMITTER2

COLLECTOR

SOURCE

BASE1

BASE2

GATE

DRAIN

NUS3116MTR2G

ICHARGEOUT

+VPWR

Charging Procedure

- Connect TA or USB Cable

- Control the charging current by PM6650 IC

- Charging current flows into the battery

Troubleshooting Setup

- Connect TA and battery to the phone

Check Point

- Connection of TA or USB Cable

- Charging current path

- Battery

Troubleshooting Procedure

- Check the charger (TA or USB Cable) connector

- Check the charging current Path

- Check the battery

CHG_CTL_N

USB_CTL_N

BATT_FET_N

VBATT

LGE Internal Use Only

- 96 -

Only for training and service purposes

4. TROUBLE SHOOTING

Start

Check the pin and battery

Connect terminals of I/O connector

Connection OK?

Change I/O connector

Yes

Is the TA (or USB Cable) voltage 5.1V (or 5.0V)?

Yes

Change TA

(or USB Cable)

Yes

Is it charging properly

After turning on U304?

END

Change the board

[ Charger Troubleshooting Flow ]

Only for training and service purposes

- 97 -

LGE Internal Use Only

4. TROUBLE SHOOTING

[ Charging part ( Main PCB) ]

U304

LGE Internal Use Only

- 98 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.11 USB Troubleshooting

USB Initial sequence of KU380 is :

USB connected to KU380 power on

→ USB_VBUS(U304, pin #2) go to 5V → USB_D+ go to 3.3V →

USB_DAT is triggered

→ USB work.

Start

Power is on?

YES

Cable is inserted?

YES

U304, pin #2 is 5V?

YES

USB_D+ is 3.3V?

YES

Change the Main board

Go to power on trouble shooting

Insert cable

Check U304 (pin #2)

Check VA302

Only for training and service purposes

- 99 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.12 SIM Detect Troubleshooting

USIM Initial sequence of KU380 is :

USIM_CLK,USIM_RST,USIM_DATA triggered

→ VREG_UIM_2.85V go to 2.8V → USIM IF work

Start

Re-insert the SIM card

Work well?

VREG_UIM_2.85V is 2.85V?

USIM_P_CLK is run?

YES

Change SIM card

Yes

Work well?

Change the Main board

Yes

End

Check J300

End

LGE Internal Use Only

- 100 -

Only for training and service purposes

4. TROUBLE SHOOTING

VREG_USIM_2.85V

USIM_P_RST_N

USIM_P_CLK

USIM_P_DATA

USIM_P_DATA

L303

56nH

USIM

R317

15K

J300 HSSC-8P-18

GND1 VCC

VPP RST

IO CLK

RSV2 RSV1

GND2 GND5

GND3 GND4

Figure. USIM part schematics

VREG_USIM_2.85V

USIM_P_RST_N

USIM_P_CLK

Only for training and service purposes

- 101 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.13 Camera Troubleshooting

Camera control signals are generated by MSM6245.

4.13.1 MEGA CAMERA

Start

Check the camera connector and reconnect the camera

Yes

Camera is OK?

VREG_CAM_AVDD_2.8V

VREG_CAM_DVDD_1.8V is

2.8V?

Yes

Check the CAM_MCLK

Yes

Change the camera

Yes

Camera is OK

Change the Main board

END

Change the Main board

END

LGE Internal Use Only

- 102 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.13.2 VGA CAMERA

Start

Check the camera connector and reconnect the camera

Yes

Camera is OK?

VREG_AVDD_2.8V

VREG_DVDD_1.5V is 2.8V?

Yes

Check the CAM_MCLK

Yes

Change the camera

Yes

Camera is OK

Change the Main board

END

Change the Main board

END

Only for training and service purposes

- 103 -

LGE Internal Use Only

4. TROUBLE SHOOTING

U302

C346

C345

C344

+VPWR

CAM_LDO_EN

C344

CAMERA LDO

U302

VIN

EN1

EN2

NC1

RT9011-MGPQW

VOUT1

VOUT2

NC2

GND C345

C346

VREG_CAM_AVDD_2.8V

VREG_CAM_DVDD_1.8V

LGE Internal Use Only

- 104 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.14 Keypad Backlight Troubleshooting

Key Pad Back Light is on as below :

Key pressing

→ KYBD_BACKLIGHT go to 0V → MAIN Key Backlight LED On

Start

Key press

+VPWR is above 3.2V?

Yes

KYBD_BACKLIGHT is 0V ?

Yes

Backlight LED ON?

Change the Main boa rd

YES

Check b attery

Yes

Change the Main boa rd

END

+VPWR

+VPWR

LD400

SSC-SWTS1007

1 2

A C

R411

100ohm

KYBD_BACKLIGHT

Figure.Keypad backlight LED part

Only for training and service purposes

- 105 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.15 Main LCD Troubleshooting

Main LCD control signals are generated by MSM6245. The signal path is :

MSM6245

→ CN402 → LCD Module

Start

Press END key

Key LED is on?

Yes

Disconnect and reconnect

The LCD connector

GO to power on trouble shooting

LCD display OK?

Yes

Change the LCD module

END

LCD display OK?

Yes

Change the Main boa rd

END

LGE Internal Use Only

- 106 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.16 Receiver Path

MSM6245 EAR1ON/EAR1OP

→ R413, R414 → Analog Switch(U401) Receiver

Start

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

YES

Can you hear the tone?

The sine wave appears at

L101, L102?

The sine wave appears at

R413, R414?

Change the Main board

YES

END

Change receiver

Check the analog switch

Only for training and service purposes

- 107 -

LGE Internal Use Only

4. TROUBLE SHOOTING

R414

U401

R413

AUDIO

+VPWR

C415

0.01u

SPK-

SPK_RCV-

RCV-

SELECT_SPK&RCV

R414 39

U401

NLAS5223BMNR2G

VCC NO2

NO1

COM1

IN1

NC1

COM2

IN2

NC2

GND

39 R413

SPK+

SPK_RCV+

RCV_EN_N

RCV+

REV_B

LGE Internal Use Only

- 108 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.17 Headset path

MSM6245 HPH_R, HPH_L

→ C402/C401 → R407/R406 → CN400 (MMI Connector)

Start

Connect the phone to network equipment and setup call.

Setup 1KHz tone out and insert headset.

YES

Can you hear the tone?

Sine wave appears at

R407/R406?

Change the Main board

YES

END

Change the Headset

Only for training and service purposes

- 109 -

LGE Internal Use Only

4. TROUBLE SHOOTING

CN400

R406

C401

R407

C402

R403

51K

LGE Internal Use Only

C402

C401

33u

R407

R406 100ohm

100ohm

FL405

OUT IN

REV_B

G2 G1

NTS104B

- 110 -

CN400

HSEJ-18S04-25R

Only for training and service purposes

4. TROUBLE SHOOTING

4.18 Speaker phone path

MSM6245 LINE_P,LINE_N

→ R418/R420, C427/C428, R419/R421 → Audio AMP(U402)

→ Analog Switch(U401) → Speaker

Start

Connect the phone to network equipment and setup call

Setup 1KHz tone out

YES

Can you hear the tone?

Sine wave appears at

R418/R420 and C427/C428

And R419/R421 ?

YES

SPK_AMP_EN is 2.6V?

YES

The sine wave appears at

SPK+, SPK- ?

YES

The sine wave appears at

SPK_RCV-,SPK_RCV+?

Change the Main board

YES

END

Change the Main board

Change the Audio Amp

Change speaker

Only for training and service purposes

- 111 -

LGE Internal Use Only

4. TROUBLE SHOOTING

R421

C428

R420

R418

SPK_AMP_EN

Analog Switch Audio Amp

R419

C427

+VPWR

C415

0.01u

SPK-

SPK_RCV-

SELECT_SPK&RCV

R414 39

U401

NLAS5223BMNR2G

VCC NO2

NO1

COM1

IN1

NC1

COM2

IN2

NC2

GND

39 R413

RCV-

SPK+

SPK_RCV+

RCV_EN_N

RCV+

REV_B

SPK_RCV-

SPK_RCV+

Speaker

VIBRATOR PAD

L101

L102

56nH

RCVN

RCVP

SPK_AMP_EN : 2.6V

SPK_AMP_EN

LINE_N

LINE_P

R418

R420

C427

C428

0.1u

R419

R421

5.6K

R417

20K

R422

20K

Audio AMP

NCP2890DMR2

_SD OUTB

BYPASS

U402

INP

INM OUTA

C429

10u

C432

SPK-

+VPWR

SPK+

LGE Internal Use Only

- 112 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.19 Main microphone

MIC400

→ MIC1P, MIC1N (MSM6245)

Start

Make a call

MIC_BIAS(C421) is 1.8V

YES

Make sound to MIC

Sine wave appears at

C423/C424?

YES

Change the Main board

Change main board

Change the MIC

Work well?

YES

END

Only for training and service purposes

- 113 -

LGE Internal Use Only

4. TROUBLE SHOOTING

C423

C424

MIC400

LGE Internal Use Only

- 114 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.20 Headset microphone

Headset

→ C210/C211 → MIC2P, MIC2N (MSM6245)

Start

Make a call

Change the headset and retry

HOOK_KEY is detected?

Yes

MICBIAS is biased by 1.8V?

Yes

Sine wave appears at

C210/C211 ?

Yes

Change the Main board

END

YES

Change the MAIN board

Change MAIN board

Change the headset or

Main board and retry.

Only for training and service purposes

- 115 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Ear_Sense_N

C211

C210

LGE Internal Use Only

- 116 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.21 Vibrator

The Vibrator is connected between +VPWR and VIB_DRV_N (PM6650 25 pin).

The Vibrator motor driver is an SBI-programmable voltage out that is reference to +VPWR.

Start

Operate the Vibrator

Work well?

Change vibrator or PM6650

TP100

TP101

Yes

End

L100

D100

RB521S-30

56nH

+VPWR

MOTOR_PWR-

+VPWR

MOTOR_PWR-

Only for training and service purposes

- 117 -

LGE Internal Use Only

5. DOWNLOAD

5. DOWNLOAD

5.1 Introduction

LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed.

Additionally, LGMDP allows multi downloading up to 9 handsets at the same time.

5.2 Downloading Procedure

• Connect the phone to your desktop PC using the USB cable and run the LGMDP application. Before getting started, set up LGMDP preferences from the Preferences of the file menu the way you want.

Click on the File menu and select Preferences.

➢ Play a success sound

It will be played a .wav file when the download has been completed. To enable this simply check the box.

➢ Always on Top

Check if LGMDP always appears at the top of the window so that user can monitor it all the time.

➢ Automatically run Select Port When LGMDP starts

When LGMDP starts, it will automatically select Select Port button to download new image file.

LGE Internal Use Only

- 118 -

Only for training and service purposes

5. DOWNLOAD

5.2.1 Connecting to PC

• Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button.

(The port number(COM7) shall be different from that of the port number in the snapshot.)

Only for training and service purposes

- 119 -

LGE Internal Use Only

5. DOWNLOAD

• The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed.

LGE Internal Use Only

- 120 -

Only for training and service purposes

5. DOWNLOAD

1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse… button. The edit box shows the file path where images are located.

Please note that all images should be located in a selected folder.

2) Click on the Browse… button to select image files to be downloaded on the handset.

3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option.

Backup the NV data and restore the backed up NV data automatically.

Only for training and service purposes

- 121 -

LGE Internal Use Only

5. DOWNLOAD

4) Reset database & Contents:

User related data including the setting data on the EFS is reset in the handset. The user contents in the handset will be erased. If you want to reset all the user data back to the way they were before you started downloading new images, check the option.

Erase_EFS:

The calibration data, user contents, media, and module are erased. Only calibration data is kept when NV backup/restore is checked. The user contents and file system physically are wiped out.

Keep All Contents

Maintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading a new S/W images. User data stated above are maintained if this option is selected.

5) Additional Options:

Display Information is defaultly not selected and user cannot choose.

Override partition table is also also defaultly not selected and user cannot choose.

6) Clear: Clearing all directory paths of images in the dialog.

7) Start: Starting downloading the selected individual image.

LGE Internal Use Only

- 122 -

Only for training and service purposes

5. DOWNLOAD

5.2.2 Choosing image files

• Select the image folder, where all the image files are located, by clicking on the Browse….

(The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.)

Only for training and service purposes

- 123 -

LGE Internal Use Only

5. DOWNLOAD

Select the path on the Image Folder by clicking on the Browse…, then the LGMDP will automatically load images accordingly. Also you can select images by manually. For instance, select the path of

AMSS Modem Image file by clicking on the Browse… button.

The selected AMSS image will be downloaded to the handset from the path directory in the PC.

Make sure that you have chosen correct file. In case of wrong AMSS Modem file is selected, the phone may not work. (The file name shall be different from that of the file name in the snapshot.)

LGE Internal Use Only

- 124 -

Only for training and service purposes

5. DOWNLOAD

• If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the

NV file from the LGMDP installation directory by clicking on the Browse… button.

Only for training and service purposes

- 125 -

LGE Internal Use Only

5. DOWNLOAD

Click on the START button to start downloading. A summary of the selected images and option information window will be displayed. Click on the No button if this is notthe setting you are downloading for. Otherwise click on the Yes button to continue downloading selected image file with options.

Yes

LGE Internal Use Only

- 126 -

Only for training and service purposes

5.2.3 Downloading

5. DOWNLOAD

• This message box informs that a new file for

NV backup will be created in the displayed file name in the LGMDP installation directory.

• Backing up NV data and backed up NV data will be stored in the LGMDP installation directory.

• Erasing the existing directories and files before the Module image is downloaded.

• Downloading the AMSS modem image

Only for training and service purposes

- 127 -

LGE Internal Use Only

5. DOWNLOAD

• Rebooting the handset and re-establishing the connection

• Restoring NV data which backed up in the

Backing up process. User can also restore

NV data using NV Default image selection.

• Rebooting the handset and re-establishing the connection

• Erasing the existing directories and files before downloading the selected Media image

LGE Internal Use Only

- 128 -

Only for training and service purposes

5. DOWNLOAD

• Downloading Media image in progress

• Downloading Module image in progress

• Downloading process has completed successfully

Only for training and service purposes

- 129 -

LGE Internal Use Only

5. DOWNLOAD

5.2.4 Tools

• Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device

Manager from the Tools of the file menu.

LGE Internal Use Only

- 130 -

Only for training and service purposes

5. DOWNLOAD

5.3 Troubleshooting Download Errors

5.3.1 When the phone does not work

• Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and then try to download all the images up to AMSS. In the emergency mode, you can not download media or module image.

• The phone supports a special mode called emergency mode. In this mode, minimum units for downloading is running so that users can download the images again in case of emergency situation. (AMSS modem, Media, and Module images can not be running in this mode.)

• The below dialog shows parameters of Select Port when phone is booted in Emergency mode.

Click on the Connect button to continue.

Only for training and service purposes

- 131 -

LGE Internal Use Only

5. DOWNLOAD

• Choose Image file after clicking on the Browse… button. Make sure that you have chosen the right image file. After choosing valid images, then click on the Start button to start downloading selected images. The selected image will be downloaded to the handset from the path directory in the PC.

After downloading images successfully, it will boot to normal mode.

LGE Internal Use Only

- 132 -

Only for training and service purposes

5. DOWNLOAD

5.3.2 NV Restore Error

• Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt.

Only for training and service purposes

- 133 -

LGE Internal Use Only

5. DOWNLOAD

• Connect the handset and Press the Connect button in the Select Port window.

(Enable state in the window indicates that the Phone has been detected and is ready to download.)

LGE Internal Use Only

- 134 -

Only for training and service purposes

5. DOWNLOAD

• Click on Browse… . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) will be shown. These nv files were saved every time NV Backup option was selected, and the name of the nv file is determined based on the time when NV Backup was done. Choose the desired NV file to be downloaded on the handset, and click on Start.

Only for training and service purposes

- 135 -

LGE Internal Use Only

5. DOWNLOAD

5.4 Caution

1) Multi-downloading using the USB hub is not recommendable.

2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image

(media and module) download.

3) The NV data saved at LGMDP folder as following format.

D:\LGMDP\004400-01-429926\_COM14_

LGMDP folder name

IMEI number

Port number

4) Recommended that the Module and Media Image have to be downloaded at the\ same time.

5) Erase EFS option will erase everything (media, module, nv items, and user data) in the EFS area.

LGE Internal Use Only

- 136 -

Only for training and service purposes

6. BLOCK DIAGRAM

6. BLOCK DIAGRAM

6.1 GSM & UMTS RF Block

[Fig 2.1] KU380 RF Functional Block Diagram

Only for training and service purposes

- 137 -

LGE Internal Use Only

6. BLOCK DIAGRAM

Ref. Name

U102

Part Name

SKY77329

Function

GSM TX Dual PAM

Comment

M100

U100

FL100

FL101

FL103

LBRQ-2B43A

D5011

EFCH897MTDB1

EFCH1950TDF1

EFCH2140TDE1

Bluetooth RF Transceiver Bluetooth TRX

FEM (Front end Module)

GSM900 TX SAW Filter

UMTS2100 RX SAW flter

[Table 2.1] RF Block Component

FEM

UMTS2100 TX SAW filter TX

LGE Internal Use Only

- 138 -

Only for training and service purposes

6. BLOCK DIAGRAM

6.2 Interface Diagram

6.2.1 RTR6275 & MSM6245 Interface Diagram

[Fig 2.2] RTR6275 & MSM6245 Interface Diagram

Only for training and service purposes

- 139 -

LGE Internal Use Only

6. BLOCK DIAGRAM

6.2.2 Memory Interface

[Fig 2.3] Memory Interface Diagram

LGE Internal Use Only

- 140 -

Only for training and service purposes

6.2.3 USB,UART,SIM,JTAG Interface

6. BLOCK DIAGRAM

[Fig 2.4] USB, UART, SIM, JTAG Interface

Only for training and service purposes

- 141 -

LGE Internal Use Only

6. BLOCK DIAGRAM

Main RF signal

GSM 900 TX

DCS TX

PCS TX

UMTS2100 TX

GSM 900 RX

DCS RX

PCS RX

UMTS2100 RX

TX_I/Q

RX_I/Q

Description

GSM 900 TX RF Signal

DCS TX RF Signal

PCS TX RF Signal

UMTS2100 TX RF Signal

GSM 900 RX RF Signal

DCS RX RF Signal

PCS RX RF Signal

UMTS2100 RX RF Signal

I/Q for Tx of RF

I/Q for Rx of RF

Control signal

UMTS PA_CTL signal

Description

PA_R0 UMTS Tx High/Low Power Control

GSM PA_CTL signal

GSM_PA_BAND DCS or PCS /GSM Mode Selection

GSM_PA_EN Power Amp Gain Control Enable

ANT_SEL 0,1 Ant Switch Module Mode Selection

Comment

UMTS,

GSM900Tx/Rx,

DCS Tx/Rx,

PCS Tx/Rx

LGE Internal Use Only

- 142 -

Only for training and service purposes

7. CIRCUIT DIAGRAM

ANT100 ANT101 ANT102 ANT103

2 3 4 5

VREG_RF_SMPS

GSM/EDGE

WCDMA

C101

1.5p

L106

7.5nH

C110

10p

L101

3.3nH

L102

15nH

ANT

SW100

KMS-507

C100

56p

L103

100nH

VDD

U100

GND1

GND2

GND3

GND4

GND5

GND6

GND7

GND8

GND9

GND10

D5011

GSM900_RX1

GSM900_RX2

GSM1800_RX1

GSM1800_RX2

GSM1900_RX1

GSM1900_RX2

WCDMA2100

CTRL1

CTRL2

GSM900_TX

GSM18001900_TX

GSM 1800/GSM 1900 RX

GSM 850/ GSM 900 RX

GSM 850/GSM 900 TX/ WCDMA

GSM 1800/GSM 1900 TX

ANT_SEL0 ANT_SEL1

LOW

HIGH

LOW

HIGH

LOW

HIGH

C116

33p

C117

33p

R102

R103

ANT_SEL0

ANT_SEL1

L115

18nH

C133

C122

8.2p

L117

1.5nH

C134

L116

8.2nH

DCS_PCS_OUT

GSM_OUT

U102

SKY77329

DCS

PCS

EGSM

C106

L104

2.2nH

L107

2.2nH

C115

0.5p

L108

2.2nH

L110

2.2nH

C120

L111 12nH

L112

12nH

L105

2.2nH

L109

3.9nH

L113 12nH

R110

2.2K

C131

68p

NEAR TO PAM

GSM_PA_RAMP

+VPWR

C136

33p

C132

33u

FL100

G2 G1

3 2

DCS_PCS_IN

GSM_IN

TX_EN

C143

15p

R118

R119

100ohm

C144

15p

GSM_PA_EN

GSM_PA_BAND

EFCH897MTDB1

10dB

R111

GSM_PA_BAND

LOW

HIGH

MODE

GSM

DCS/PCS

6dB

R115

L126

12nH

L123

1.8nH

FL102

PGND

ANT

ACMD-7602

3.9p

C154

+VPWR

NEAR TO PAM

C149

4.7u

C151

20dB

U103

CP0402A1950DNTR

R123

130

R122

7dB

R124

130

PWR_DET

C157

C155

10p

L127

15nH

DCS_PCS_TX

GSM_TX

NEAR TO PAM

C152

+VPWR

AWT6277R

GND5

VCC2

GND4

RFOUT

GND3

GND2

U104

VCC1

RFIN

GND1

VMODE

VREF

NEAR TO PAM

C158

100p

PA_R0

TR100

KRX102U

L122

C148

8.2p

L121

5.6nH

FL101

EFCH1950TDF1

3 2

C162

100p

PA_ON

VREG_TCXO_2.85V

L131

2.2nH

L132

2.7nH

C166

10p

VREG_TCXO_2.85V

TCXO

DSA321SCE-19.2M

VCC

X100

VCONT

OUTPUT GND

NC4

NC3

NC1

NC2

100ohm R126

TRK_LO_ADJ

TCXO_PM

RTR6275_TCXO

C175 100p

C177 1000p

R127 100K

C178 0.01u

U105

TC7SH04FU

VCC

GND

C176

1000p

TCXO_BT

DCS_PCS_TX

GSM_TX

TX_ON

TX_AGC_ADJ

DAC_REF

C118

12p

SSBDT_RTR

TX_IP

C104

C107

C108

C111

8.2p

12p

R104 12K

(1%)

R105

C119

680 (1%)

22p

C105

LB_RF_OUT1

LB_RF_OUT2

RF_ON

VCONTROL

DAC_REF

SBDT

R_BIAS1

R_BIAS2

ENV_OUT

HB_RF_OUT1

HB_RF_OUT2

GCELL_INP

GCELL_INN

EGSM_INP

EGSM_INN

DCS_INP

DCS_INN

GPCS_INP

GPCS_INN

CAL_INP

CAL_INN

WLNA_IN

ENV_LNP

ENV_LNN

TX_IP

TX_IN

TX_QP

TX_QN

TCXO

VTUNE1

VTUNE2

RX_IP

RX_IN

U101

RTR6275

RX_QP

RX_QN

PWD_DET_IN

TEST

VDDA1

VDDA2

VDDA3

VDDA4

VDDA5

VDDA6

VDDA7

VDDA8

VDDA9

VDDA10

VDDA11

VDDA12

VDDA13

VDDA14

C114

C113

1000p

3300p

VTUNE-Connected directly to GND

R106 5.1

C102

180p

C103

180p

C109

180p

C112

180p

R107

R108

R109

2.7

5.1

L114 47nH

C130

22p

TX_IM

TX_QP

TX_QM

RTR6275_TCXO

RX_IP

RX_IM

RX_QP

RX_QM

PWR_DET

L118

47nH

C121

22u

VREG_RF_SMPS

VREG_SYNTH_2.6V

VDD_RX

R114 10

L119

47nH

VREG_RF_SMPS

C145

1000p

C146

22p

C147

0.01u

R120

100ohm

VREG_MSMP_2.7V

VDD_RX

14 15 16

C150

100p

L120

1nH

C153

2.2p

L130

10nH

L124

4.7nH

C156

2.2p

5 4

FL103

EFCH2140TDE1

2 3

L129

4.7nH

L125

4.7nH

C160

2.2p

BLUETOOTH

BT_CLK

VREG_MSMP_2.7V

VREG_BT_2.85V

R125

C163 1000p

C164

C165

2.2u

L128

M100

LBRQ-2B43A

CLK_REF

VCC_OUT

VDD_INT

VDD_MSM

VDD_BAT

SBST

SBCK

SBDT

SYNC_DET_TX_EN

RX_BB_TX_BB

XTAL_IN

C159

100p

1000p C167

AMAA802012LG09

FEED

GND1

GND2

ANT104

BT_SBST

BT_SBCK

BT_SBDT

BT_TX_RX_N

BT_DATA

TCXO_BT

LG(42)-A-5505-10:01

1 2 4 5 6 7 8 9

LG Electronics Inc.

Only for training and service purposes

- 143 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

1 2

SDRAM_ADDR(0:14)

SDRAM_DATA(0:31)

REV_B

Change 32 bit

SDRAM

EBI2_DATA(0:15)

NAND & LCD

(ADS signal for LCD)

SDRAM_DATA(31)

SDRAM_DATA(30)

SDRAM_DATA(29)

SDRAM_DATA(28)

SDRAM_DATA(27)

SDRAM_DATA(26)

SDRAM_DATA(25)

SDRAM_DATA(24)

SDRAM_DATA(23)

SDRAM_DATA(22)

SDRAM_DATA(21)

SDRAM_DATA(20)

SDRAM_DATA(19)

SDRAM_DATA(18)

SDRAM_DATA(17)

SDRAM_DATA(16)

SDRAM_DATA(15)

SDRAM_DATA(14)

SDRAM_DATA(13)

SDRAM_DATA(12)

SDRAM_DATA(11)

SDRAM_DATA(10)

SDRAM_DATA(9)

SDRAM_DATA(8)

SDRAM_DATA(7)

SDRAM_DATA(6)

SDRAM_DATA(5)

SDRAM_DATA(4)

SDRAM_DATA(3)

SDRAM_DATA(2)

SDRAM_DATA(1)

SDRAM_DATA(0)

LCD_CS_N

NAND_CLE

NAND_CS_N

EBI2_OE_N

EBI2_WE_N

NAND_ALE

NAND_READY

EBI2_DATA(15)

EBI2_DATA(14)

EBI2_DATA(13)

EBI2_DATA(12)

EBI2_DATA(11)

EBI2_DATA(10)

EBI2_DATA(9)

EBI2_DATA(8)

EBI2_DATA(7)

EBI2_DATA(6)

EBI2_DATA(5)

EBI2_DATA(4)

EBI2_DATA(3)

EBI2_DATA(2)

EBI2_DATA(1)

EBI2_DATA(0)

LCD_ADS

AC15

AF14

XMEM2_CS_N1

LCD_CS_N_GPIO38

AF10

W14

AF7

AF4

AE10

T14

UB2_N

XMEM2_CS_N0

OE2_N

WE2_N

LB2_N_A2_0

NAND2_FLASH_READY_GPIO33

AA10

AC9

W10

AA9

AE7

D2_15

D2_14

D2_13

D2_12

D2_11

AC8

AA8

AC7

AE5

AC6

D2_10

D2_9

D2_8

D2_7

AF5

AA7

D2_6

D2_5

D2_4

D2_3

AE4

AF3

AC5

D2_2

D2_1

D2_0

AF13

AA14

T13

AC14

AE14

W13

AC13

T12

AC11

AA11

AC10

W11

AF9

AE9

AA13

AF12

AE12

AC12

AA12

W12

A2_10

A2_9

A2_8

A2_7

A2_6

A2_5

A2_4

A2_3

A2_2

A2_1

A2_20_GPIO34

A2_19

A2_18

A2_17

A2_16

A2_15

A2_14

A2_13

A2_12

A2_11

4 5

SDRAM

REV_B

CLOCK

RESET

VREG_MSME_1.8V

HKADC

300K

R202

U200-1

MSM6245_A

C200 47p

C201 47p

C204

10p

AUDIO

Near to MSM

9 10 11 12 13

MODE

MODE2 MODE1 MODE0

0 0 0

( Default Pull-Down)

Native, ARM JTAG

BOOT_MODE3 BOOT_MODE2 BOOT_MODE1

0 0 1

0 1 1

1 0 1

1 1 1

8-bit, NAND, Normal

16-bit, NAND, Normal

8-bit, NAND, Trusted

16-bit, NAND, Trusted

1005 0.1uF 16V +80/-20%

2012 10uF 6.3V +80/-20% Ceramic

VREG_MSMC_1.25V

VREG_MSME_1.8V

VREG_MSMP_2.7V

ADC

HKADC[0] - AMUX_OUT

HKADC[1] - VBATT_SENSE

HKADC[2] - HDET1

HKADC[3] - TTY_ADC_DET

HKADC[4] - PCB_Rev_ADC

HKADC[5] - VBATT_TEMP

PMIC_AUXIN[1]

PMIC_AUXIN[2] - PA_THERM

C205

4.7u

C207

0.01u

HKADC(4):PCB_Rev_ADC

150K : 10K : 0.016V

150K : 47K : 0.62V

150K : 68K : 0.81V

150K : 100K : 1.04V

150K : 150K : 1.30V

150K : 300K : 1.73V

150K : 470K : 1.97V

150K : 680K : 2.13V

150K : 750K : 2.17V

VREG_MSMA_2.6V

(CAD : 10uF=>Input MSMA_2.6V)

C206

10u

C208

0.1uF

C209

0.1uF

C212

0.1u

10%

Place near

MSM pin W18

(CODEC VSS)

C213

0.01u

C214

0.01u

C215

0.01u

C216

0.1uF

C217

0.01u

C218

0.01u

C219

0.1uF

C220

0.1uF

C221

0.1uF

SDCC_DAT1_GPIO99

SDCC_DAT2_GPIO100

SDCC_DAT3_GPIO101

MDP_VSYNC_SECONDA_GPIO104

MDP_VSYNC_PRIMARY_GPIO105

F25

M25

M26

AE3

AD2

WDOG_STB_SBCK1_GPIO0

SBDT1_GPIO1

PA_ON1_GPIO2

GRFC9_GPIO12

CAMCLK_PO_GP_MN_GPIO13

GPIO28

USB_RX_DATA_GPIO29

XMEM2_CS_N2_GPIO35

XMEM2_CS_N3_GPIO36

LCD_EN_GPIO37

GPIO43

SYNTH2_GPIO65

GPIO66

XMEM1_CS_N1_GPIO76

XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77

UART3_RFR_N_GPIO87

UART2_DP_RX_DATA_GPIO89

SYNTH0_GP_PDM0_GPIO92

SBST1_GPIO93

H25

F26

W15

AA15

AE13

F18

H18

AA1

L25

H11

J21

N19

TX_AGC_ADJ

TRK_LO_ADJ

TCXO_EN_GPIO94

PA_ON0

H13

L13

F19

F17

Q_OUT_N

Q_OUT

I_OUT_N

I_OUT

DAC_REF

A12

B12

A13

B13

F12

Q_IM_CH1

Q_IP_CH1

I_IM_CH1

I_IP_CH1

Q_IM_CH0

Q_IP_CH0

I_IM_CH0

I_IP_CH0

W23

V23

V25

W25

AA25

Y25

AB25

AC25

GP_PDM2_PA_RAN_GE1

GP_PDM1_PA_RAN_GE0

D17

H17

TRST_N

TCK

TMS

TDI

TDO

RTCK

H15

D16

F15

D15

A17

H16

AUX_PCM_CLK_GRFC14_GPIO80

AUX_PCM_DIN_GRFC13_GPIO14

AUX_PCM_DOUT_GRFC12_GPIO103

AUX_PCM_SYNC_GRFC11_GPIO102

TX_ON_GRFC10

K19

N21

H12

GRFC8_GPIO11

GRFC7_GPIO10

GRFX6_GPIO9

GRFC5_AUX_SBST_GPIO8

GRFC4_AUX_SBCK_GPIO7

GRFC3_GPIO6

GRFC2_GPIO5

GRFC1_AUX_SBDT_GPIO4

GRFC0_GPIO3

T23

T19

D11

H10

F10

BT_CLK_GPIO25

BT_SBST_GPIO24

BT_SBCK_GPIO23

BT_SBDT_GPIO22

BT_TX_RX_N_GPIO21

BT_DATA_GPIO20

G23

F23

E26

E25

H21

R19

MDDIC_DATP

MDDIC_DATN

MDDIC_STBP

MDDIC_STBN

A22

A23

B22

B23

LCD_MAKER_ID

LCD_VSYNC

TP200

WDOG monitoring

C222

1000p

C223

1000p

C224

1000p

C225

0.01u

C226

0.01u

C227

0.01u

C228

0.1uF

C229

0.01u

C230

0.1uF

LCD_IF_MODE_0

VGA_CAM_RESET_N

VGA_CAM_EN

LCD_LDO_EN

LCD_RESET_N

HOOK_KEY_N

R209 47

CAM_MCLK

C234

1000p

C235

1000p

C236

1000p

C237

1000p

KEY_BL_EN

RCV_EN_N

SLIDE_DETECT

LCD_IF_MODE_1

GPIOs

TCXO_EN

PA_ON

R211

R212

TX_QM

TX_QP

TX_IM

TX_IP

DAC_REF

Close to MSM

TX_AGC_ADJ

TRK_LO_ADJ

RX_QM

RX_QP

RX_IM

RX_IP

PA_R0

JTAG_TRST_N

JTAG_TCK

JTAG_TMS

JTAG_TDI

JTAG_TDO

JTAG_RTCK

SPK_AMP_EN

JTAG

VSS_PAD1_0

VSS_PAD1_1

VSS_PAD1_2

VSS_PAD1_3

VSS_PAD1_4

AF6

AF11

AF15

VSS_PAD2_0

VSS_PAD2_1

VSS_PAD2_2

R26

B17

A15

VSS_PAD3_0

VSS_PAD3_1

VSS_PAD3_2

VSS_PAD3_3

A18

A21

D13

D19

P26

W16

W18

VSSA1

VSSA2

VSSA3

VSSA4

VSSA5

U19

V26

VSSA6

VSSA7

VSSA8

VSSA9

W26

AB26

AC16

AC26

AD25

AF23

AF24

VSSA10

VSSA11

VSSA12

VSSA13

VSSA14

VSSA15

VSSA16 TX_ON

ANT_SEL1

ANT_SEL0

C238

0.01u

C239

1000p

C240

1000p

C241

1000p

U200-2

MSM6245_B w18 (Analog VSS guard ring for CODEC)

C242

0.1uF

C243

0.1uF

C244

0.1uF

GSM_PA_BAND

GSM_PA_EN

BT_CLK

BT_SBST

BT_SBCK

BT_SBDT

BT_TX_RX_N

BT_DATA

RESERVED

C26

(PLLOUT_TEST)

VSS_DIG_0

VSS_DIG_1

VSS_DIG_2

VSS_DIG_3

VSS_DIG_4

VSS_DIG_5

VSS_DIG_6

VSS_DIG_7

VSS_DIG_8

VSS_DIG_9

VSS_DIG_10

VSS_DIG_11

VSS_DIG_12

VSS_DIG

AC1

AF8

AF16

T26

G26

D26

A24

A14

A11

AC23

AA21

VSS39

VSS41

VSS43

VSS44

VSS45

VSS46

VSS47

VSS48

VSS49

VSS50

AA6

AC4

AE1

AE2

AE25

AE26

AF1

AF2

AF25

AF26

2200p cap => place between

D12(VDDA1) and F12(DAC_REF)

DAC_REF

Near to B18 (VDD_PLL)

VREG_MSMA_2.6V

R210

C245

0.1u

10%

C246

0.01u

LG(42)-A-5505-10:01

1 2 3

KEYPAD

C249

0.1u

10%

Place near

MSM pin AD26

UART

USIM PMIC USB MicroSD

R213

R214

2.2K

VREG_CAM_AVDD_2.8V

(Check CAM_DATA PINOUT !!!!)

CAMERA

4 5 6 7 8 9

USB_D+

USB_D-

USB_VBUS

VBATT

REMOTE_PWR_ON

+5V_PWR

UART_TXD

UART_RXD

TP211

TP212

TP213

TP214

TP215

CTS

RTS

DSR

NC4

NC3

NC2

UTXD

URXD

PWR

VBAT

VBAT

ON_SW

ON_SW

NC1

GND

UFLS

GND

2.5G

UART

LG Electronics Inc.

LGE Internal Use Only

- 144 -

Only for training and service purposes

7. CIRCUIT DIAGRAM

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

SDRAM_DATA(0:31)

EBI2_DATA(0:15)

SDRAM_DATA(0)

SDRAM_DATA(1)

SDRAM_DATA(2)

SDRAM_DATA(3)

SDRAM_DATA(4)

SDRAM_DATA(5)

SDRAM_DATA(6)

SDRAM_DATA(7)

SDRAM_DATA(8)

SDRAM_DATA(9)

SDRAM_DATA(10)

SDRAM_DATA(11)

SDRAM_DATA(12)

TP300

SDRAM_DATA(13)

SDRAM_DATA(14)

SDRAM_DATA(15)

SDRAM_DATA(16)

SDRAM_DATA(17)

SDRAM_DATA(18)

SDRAM_DATA(19)

SDRAM_DATA(20)

SDRAM_DATA(21)

SDRAM_DATA(22)

T10

V10

T11

U11

V11

T12

U12

SDRAM_DATA(23)

SDRAM_DATA(24)

SDRAM_DATA(25)

SDRAM_DATA(26)

SDRAM_DATA(27)

SDRAM_DATA(28)

SDRAM_DATA(29)

SDRAM_DATA(30)

SDRAM_DATA(31)

P10

R10

P11

R11

P12

R12

R13

DQ14

DQ15

DQ16

DQ17

DQ18

DQ19

DQ20

DQ21

DQ22

DQ23

DQ24

DQ25

DQ26

DQ27

DQ28

DQ29

DQ30

DQ31

DQ0

DQ1

DQ2

DQ3

DQ4

DQ5

DQ6

DQ7

DQ8

DQ9

DQ10

DQ11

DQ12

DQ13

SDRAM_DQM(0)

SDRAM_DQM(1)

SDRAM_DQM(2)

SDRAM_DQM(3)

TP310

EBI2_DATA(0)

EBI2_DATA(1)

EBI2_DATA(2)

EBI2_DATA(3)

EBI2_DATA(4)

EBI2_DATA(5)

EBI2_DATA(6)

EBI2_DATA(7)

EBI2_DATA(8)

EBI2_DATA(9)

EBI2_DATA(10)

EBI2_DATA(11)

EBI2_DATA(12)

EBI2_DATA(13)

EBI2_DATA(14)

EBI2_DATA(15)

DQM0

DQM1

DQM2

DQM3

M12

L11

H13

H11

G11

M11

M13

L10

L12

H12

H10

G12

IO7

IO8

IO9

IO10

IO11

IO12

IO13

IO14

IO15

IO16

IO1

IO2

IO3

IO4

IO5

IO6

A14

B11

B12

B13

B14

C13

C14

A11

A12

A13

NC9

NC10

NC11

NC12

NC13

NC14

NC15

NC16

NC17

NC18

NC19

NC20

NC21

NC1

NC2

NC3

NC4

NC5

NC6

NC7

NC8

MMC_CD

MMC_CMD

T-FLASH

J301

DAT2 DAT1

DAT3

CMD

VDD

DAT0

VSS

GND1

GND2

CLK

GND3

GND4

U301

TY9000A800KOGG40

C347

0.1u

R314

VREG_MMC_3.0V

MMC_DATA

MMC_CLK

USIM_P_DATA

SDRAM_ADDR(0:12)

VSS1

VSS2

VSS3

VSS4

VSS5

VSS6

VSS7

VSS8

VSS9

VSS10

VSS11

VSS12

P13

U10

U13

G13

L13

J11

J13

J12

K10

K11

K13

K14

L14

NC71

NC72

NC73

NC74

NC75

NC76

NC77

NC78

NC79

NC80

NC81

NC82

NC83

NC62

NC63

NC64

NC65

NC66

NC67

NC68

NC69

NC70

A10

A11

A12

_WP

_WEN

_RAS

_WED

_CAS

CLK

_CS

ALE

CLE

_CE

_RE

RY__BY

CKE

BA0

BA1

M10

D12

C12

D11

C11

D10

C10

TP301

SDRAM_ADDR(0)

SDRAM_ADDR(1)

SDRAM_ADDR(2)

SDRAM_ADDR(3)

SDRAM_ADDR(4)

SDRAM_ADDR(5)

SDRAM_ADDR(6)

SDRAM_ADDR(7)

SDRAM_ADDR(8)

SDRAM_ADDR(9)

SDRAM_ADDR(10)

SDRAM_ADDR(11)

SDRAM_ADDR(12)

R300 100K

TP302

TP303

TP304

TP305

TP306

TP307

TP308

TP309

RESOUT_N

EBI2_WE_N

SDRAM_RAS_N

SDRAM_WE_N

SDRAM_CAS_N

SDRAM_CLK

SDRAM_CS_N(0)

NAND_ALE

NAND_CLE

EBI2_OE_N

SDRAM_CLK_EN

SDRAM_ADDR(13)

SDRAM_ADDR(14)

VCCD1

VCCD2

VCCD3

VCCD4

VCCD5

VCCD6

D13

V12

VCCQD1

VCCQD2

VCCN2

K12

VREG_MSMP_2.7V

VREG_MSME_1.8V

VREG_MSMP_2.7V

NAND_CS_N

NAND_READY

MCP(1Gb NAND +512Mb 1 piece SDRAM)

MEMORY

+5V_PWR

USB_VBUS

USB_D+

USB_D-

+VPWR

CAM_LDO_EN

C327

ICHARGE

CHG_CTL_N

ICHARGEOUT

VBATT

BATT_FET_N

RESIN_N

USB_OE_N

USB_CTL_N

USB_DAT

USB_SE0

R309 2.2K

C331

1608

4.7u

KYBD_BACKLIGHT

PM_ON_SW_N

MOTOR_PWR-

USIM_P_DATA

ADC_BYP

VCHG

ISNS_P

CHG_CTL_N

ISNS_M

VBAT

BAT_FET_N

FLSH_DRV_N

PON_RESET_N

VREG_USB

USB_ID

VREG_5V

USB_OE_N

VSW_5V

USB_CTL_N

USB_VBUS

USB_DAT

USB_D_P

USB_SE0

USB_D_M

GP1_DRV_N(MPP7)

U300

PM6650-2M

1608

REMOTE_PWR_ON

Check if it is LOW enable.

VA300

EVLC18S02003

REF_BYP

REF_GND

REF_ISET

VCOIN

MSM_INT_N

TCXO_IN

PS_HOLD

VREG_MSMA

TCXO_EN

VDD_ANA

TCXO_OUT

VDD_MSM

SBST

VREG_MSMP

SBCK

VBACKUP

SBDT

XTAL_OUT

SLEEP_CLK

XTAL_IN

RUIM_RST(MPP6)

51K

0.1u

R303

R306

R307

R308

TP311

C314

121K

PM_INT_N

TCXO_PM

TCXO_EN

+VPWR

BAT300

TCXO_MSM

VREG_MSMP_2.7V

SSBDT_PM

SLEEP_CLK

USIM_P_RST_N

NBL414R-F9J

C315

470K

R304

C320

4.7u

X300

MC-146_7pF

32.768KHz

D300 RB521S-30

+VPWR

USIM_RST_N

USIM_P_CLK

USIM_CLK

USIM_DATA

VREG_USIM_2.85V

VREG_MMC_3.0V

+VPWR

C334

2.2u

C335

2.2u

VREG_RF_SMPS

R311

C336

22u

C339

10u

C340

0.1u

C341

1000p

Power Line --> Route carefully!!!!!

Draw the Artwork_line thickly !!!!!

--->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-

JTAG_PS_HOLD

PS_HOLD

VREG_MSMA_2.6V

VREG_MSMP_2.7V

Artwork --> Place resistor and capacitor close to PM6650 !!

C344

CAMERA LDO

U302

VIN

EN1

EN2

NC1

RT9011-MGPQW

VOUT1

VOUT2

NC2

GND C345

C346

VREG_CAM_AVDD_2.8V

VREG_CAM_DVDD_1.8V

PMIC VPWR BYPASS

VDD_MSMC : 4.7uF

VDD_MSME : 4.7uF

VDD_PA : 4.7uF

VDD_MSM : 0.1uF

VDD_ANA : 0.1uF

VDD_RUIM : 0.1uF

VDD_RF : 0.1uF

VDD_WLAN : 0.1uF

VDD_MAIN : 0.1uF

VDD_SPKR : 0.1uF

C300

33u

+VPWR

CHARGER

USIM

R317

15K

J300 HSSC-8P-18

GND1 VCC

VPP

RST

CLK

RSV2 RSV1

GND2 GND5

GND3 GND4

VREG_USIM_2.85V

USIM_P_RST_N

USIM_P_CLK

VREG_MSMP_2.7V

SLIDE_DETECT

C348

0.1u

HALL IC

U303

A3212EELLT-T

VDD

OUT G2

C349

10p

VBATT

+5V_PWR

USB_VBUS

ICHARGE

ICHARGEOUT

+VPWR

U304

P_DRAIN P_COLLECTOR

EMITTER1

EMITTER2

COLLECTOR

SOURCE

BASE1

BASE2

GATE

DRAIN

NUS3116MTR2G

CHG_CTL_N

USB_CTL_N

BATT_FET_N

VBATT

L303

56nH

Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT

OJ300 OJ301 OJ302 OJ303

LG(42)-A-5505-10:01

1 2 3 4 5 6 7 8 9

LG Electronics Inc.

Only for training and service purposes

- 145 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

EBI2_DATA(7)

EBI2_DATA(6)

EBI2_DATA(5)

EBI2_DATA(4)

EBI2_DATA(3)

EBI2_DATA(2)

EBI2_DATA(1)

EBI2_DATA(0)

EBI2_OE_N

EBI2_WE_N

LCD_ADS

LCD_CS_N

LCD_VSYNC

LCD_IF_MODE_1

LCD_IF_MODE_0

LCD_RESET_N

CAM_PCLK

CAM_MCLK

VGA_CAM_EN

VREG_CAM_AVDD_2.8V

VREG_CAM_DVDD_1.8V

VGA_CAM_RESET_N

I2C_SCL

I2C_SDA

CAM_HSYNC_OUT

CAM_VSYNC_OUT

CAM_DATA_OUT(7)

CAM_DATA_OUT(6)

CAM_DATA_OUT(5)

CAM_DATA_OUT(4)

2 3

LCD CONNECTOR

EVRC18S05Q030050R

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

FL401

EVRC18S05Q030050R

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

FL403

EVRC18S05Q030050R

INOUT_B1 INOUT_A1

INOUT_B2 INOUT_A2

INOUT_B3 INOUT_A3

INOUT_B4 INOUT_A4

FL404

4 5

CN402

G1 G2

G3 G4

6 7 8

EVRC18S05Q030050R

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

FL400

EVRC18S05Q030050R

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

FL402

CAMERA

CAM_DATA_OUT(0)

CAM_DATA_OUT(1)

CAM_DATA_OUT(2)

CAM_DATA_OUT(3)

CAM_DATA_OUT(4)

CAM_DATA_OUT(5)

CAM_DATA_OUT(6)

CAM_DATA_OUT(7)

MEGA CAMERA CONNECTOR

CN403

PCLK

VSYNC

HSYNC

STANDBY

SCK

SDA

RESETB

MCLK

R412 47

CAM_PCLK

CAM_VSYNC_OUT

CAM_HSYNC_OUT

MEGA_CAM_PWR_DOWN

I2C_SCL

I2C_SDA

MEGA_CAM_RESET_N

CAM_MCLK

AUDIO

+VPWR

C415

0.01u

SPK-

SPK_RCV-

RCV-

SELECT_SPK&RCV

R414 39

U401

NLAS5223BMNR2G

VCC NO2

NO1

COM1

IN1

NC1

COM2

IN2

NC2

GND

39 R413

VREG_CAM_AVDD_2.8V

VREG_CAM_DVDD_1.8V

MIC

REV_B : SUMY0010301 --> SUMY0003802

SP0204LE5-PB

PWR

OUT

MIC400

C421

10u

C422

47p

MICBIAS

C423

C424

22n

MIC1N

MIC1P

CAM_DATA(0)

CAM_DATA(1)

CAM_DATA(2)

EVRC18S05Q030050R

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

FL406

CAM_DATA_OUT(0)

CAM_DATA_OUT(1)

CAM_DATA_OUT(2)

CAM_DATA(6)

CAM_DATA(7)

CAM_VSYNC

CAM_HSYNC

CAM_DATA(3)

CAM_DATA(4)

CAM_DATA(5)

EVRC18S05Q030050R

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

FL408

EVRC18S05Q030050R

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

FL407

CAM_DATA_OUT(6)

CAM_DATA_OUT(7)

CAM_VSYNC_OUT

CAM_HSYNC_OUT

CAM_DATA_OUT(3)

CAM_DATA_OUT(4)

CAM_DATA_OUT(5)

REV_B : EDTY0008606 --> EDTY0008601

SPK_AMP_EN

LINE_N

LINE_P

R418

R420

C427

C428

0.1u

R419

R421

5.6K

R417

20K

R422

20K

Audio AMP

NCP2890DMR2

_SD

BYPASS

INP

INM

OUTB

U402

OUTA

C429

10u

C432

SPK+

SPK_RCV+

RCV_EN_N

RCV+

REV_B

SPK-

+VPWR

SPK+

10 11 12 13 14

I/O CONNECTOR

EBI2_DATA(8)

EBI2_DATA(9)

EBI2_DATA(10)

EBI2_DATA(11)

EBI2_DATA(12)

EBI2_DATA(13)

EBI2_DATA(14)

EBI2_DATA(15)

LCD_MAKER_ID

LCD_LDO_EN

LCD_BL_CTRL

KEY_COL(4)

KEY_COL(3)

KEY_ROW(4)

KEY_BL_EN

+VPWR

PM_ON_SW_N

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

MOTOR_PWR-

SPK_RCV+

SPK_RCV-

CAM_DATA_OUT(0)

CAM_DATA_OUT(1)

CAM_DATA_OUT(2)

CAM_DATA_OUT(3)

VREG_MSMP_2.7V

R400

2.2K

MICBIAS

R401

5.1K

C400

0.1u

VREG_MSMP_2.7V

VCC

HOOK_KEY_N

OUT

U400

NCS2200SQ2T2G

GND

VIN-

VIN+

VBAT_SENSE

10K

R404

R408

470K

MIC2N

MIC2P

HPH_L

HPH_R

USB_D+

USB_D-

EAR_SENSE_N

VBATT

REMOTE_PWR_ON

+5V_PWR

VBAT_TEMP

VREG_MSMP_2.7V

R410

80.6K

USB_VBUS

UART_TXD

UART_RXD

CN401

VBAT

C405

33u

PSD05-LF

INSTPAR

D400

R403

51K

VBAT_GND

C402

C401

33u

R407

R406 100ohm

100ohm

FL405

OUT IN

REV_B

G2 G1

NTS104B

KEY_BACK_LIGHT LED(14EA)

+VPWR

LD400

SSC-SWTS1007

1 2

A C

R411

100ohm

KYBD_BACKLIGHT

NEAR TO CN401

VREG_MSMP_2.7V

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

HOT4

KEY_ROW(4)

KEY_COL(0)

KEY_COL(1)

KEY_COL(2)

KEY MAP

400

403

406

HOT400

HOT3

401

404

402

405

407

409

408

HOT401

CN400

HSEJ-18S04-25R

3 4 5 6 7 8 9 2

LG(42)-A-5505-10:01

LGE Internal Use Only

- 146 -

LG Electronics Inc.

Only for training and service purposes

7. CIRCUIT DIAGRAM

CN101

PM_ON_SW_N

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

MOTOR_PWR-

SPK_RCV+

SPK_RCV-

LCD_RESET_N

LCD_IF_MODE_0

LCD_IF_MODE_1

LCD_VSYNC

LCD_CS_N

LCD_ADS

EBI2_WE_N

EBI2_OE_N

EBI2_DATA(0)

EBI2_DATA(1)

EBI2_DATA(2)

EBI2_DATA(3)

CN100

52 51

54 53

+VPWR

KEY_BL_EN

KEY_ROW(4)

KEY_COL(3)

KEY_COL(4)

LCD_BL_CTRL

LCD_LDO_EN

LCD_MAKER_ID

EBI2_DATA(15)

EBI2_DATA(14)

EBI2_DATA(13)

EBI2_DATA(12)

EBI2_DATA(11)

EBI2_DATA(10)

EBI2_DATA(9)

EBI2_DATA(8)

EBI2_DATA(7)

EBI2_DATA(6)

EBI2_DATA(5)

EBI2_DATA(4)

FPCB CONNECTOR

LCD_RESET_N

LCD_IF_MODE_0

LCD_IF_MODE_1

LCD_VSYNC

LCD_CS_N

LCD_ADS

EBI2_WE_N

EBI2_OE_N

EBI2_DATA(0)

EBI2_DATA(1)

EBI2_DATA(2)

EBI2_DATA(3)

EBI2_DATA(4)

EBI2_DATA(5)

EBI2_DATA(6)

EBI2_DATA(7)

EBI2_DATA(8)

EBI2_DATA(9)

EBI2_DATA(10)

EBI2_DATA(11)

EBI2_DATA(12)

EBI2_DATA(13)

EBI2_DATA(14)

EBI2_DATA(15)

LCD_MAKER_ID

VREG_LCD_2.8V

WLED_1

WLED_2

WLED_3

WLED_PWR

LCD CONNECTOR

+VPWR

LCD_LDO_EN

C101

U100 R1114D281D-TR-F

VDD VOUT

GND1

GND2

C100

VREG_LCD_2.8V

LCD LDO

+VPWR

WLED_PWR

LCD_BL_CTRL

C105

C103

EN_SET

U101

GND

AAT3157ITP-T1

C1+

C102

C1-

C2+

C104

C2-

WLED_1

WLED_2

WLED_3

LCD BACKLIGHT

END

PM_ON_SW_N

EVL14K02200

+VPWR

KEY ON

LD100

LD101

LD102

LD103

LD104

LD105

LD106

LD107

R101

100ohm

R102

100ohm

R103

100ohm

R104

R130

100ohm

100ohm

R131

100ohm

R132

100ohm

R133

100ohm

KEY_BL_EN

R105

4.7K

KEY LED

Only for training and service purposes

- 147 -

TP100

TP101

+VPWR

MOTOR_PWR-

L100

D100

RB521S-30

56nH

SPK_RCV-

SPK_RCV+

VIBRATOR PAD

L101

L102

56nH

RCVN

RCVP

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_ROW(4)

KEY_COL(3)

KEY_COL(4)

SPEAKER PAD

CLR MENU

LEFT

RIGHT

SND

BACK

LGE Internal Use Only

7. CIRCUIT DIAGRAM

LGE Internal Use Only

EBI2_DATA(7)

EBI2_DATA(6)

EBI2_DATA(5)

EBI2_DATA(4)

EBI2_DATA(3)

EBI2_DATA(2)

EBI2_DATA(1)

EBI2_DATA(0)

EBI2_OE_N

EBI2_WE_N

LCD_ADS

LCD_CS_N

LCD_VSYNC

LCD_IF_MODE_1

LCD_IF_MODE_0

LCD_RESET_N

CAM_PCLK

CAM_MCLK

VGA_CAM_EN

VREG_CAM_AVDD_2.8V

VREG_CAM_DVDD_1.8V

VGA_CAM_RESET_N

I2C_SCL

I2C_SDA

CAM_HSYNC_OUT

CAM_VSYNC_OUT

CAM_DATA_OUT(7)

CAM_DATA_OUT(6)

CAM_DATA_OUT(5)

CAM_DATA_OUT(4)

CN102

G1 G2

G3 G4

SLIDE to FPCB Connector

EBI2_DATA(8)

EBI2_DATA(9)

EBI2_DATA(10)

EBI2_DATA(11)

EBI2_DATA(12)

EBI2_DATA(13)

EBI2_DATA(14)

EBI2_DATA(15)

LCD_MAKER_ID

LCD_LDO_EN

LCD_BL_CTRL

KEY_COL(4)

KEY_COL(3)

KEY_ROW(4)

KEY_BL_EN

+VPWR

PM_ON_SW_N

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

MOTOR_PWR-

SPK_RCV+

SPK_RCV-

CAM_DATA_OUT(0)

CAM_DATA_OUT(1)

CAM_DATA_OUT(2)

CAM_DATA_OUT(3)

PM_ON_SW_N

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

MOTOR_PWR-

SPK_RCV+

SPK_RCV-

LCD_RESET_N

LCD_IF_MODE_0

LCD_IF_MODE_1

LCD_VSYNC

LCD_CS_N

LCD_ADS

EBI2_WE_N

EBI2_OE_N

EBI2_DATA(0)

EBI2_DATA(1)

EBI2_DATA(2)

EBI2_DATA(3)

CN100

52 51

54 53

FPCB to SUB Connector

+VPWR

KEY_BL_EN

KEY_ROW(4)

KEY_COL(3)

KEY_COL(4)

LCD_BL_CTRL

LCD_LDO_EN

LCD_MAKER_ID

EBI2_DATA(15)

EBI2_DATA(14)

EBI2_DATA(13)

EBI2_DATA(12)

EBI2_DATA(11)

EBI2_DATA(10)

EBI2_DATA(9)

EBI2_DATA(8)

EBI2_DATA(7)

EBI2_DATA(6)

EBI2_DATA(5)

EBI2_DATA(4)

CAM_DATA_OUT(6)

CAM_DATA_OUT(7)

CAM_VSYNC_OUT

CAM_HSYNC_OUT

I2C_SDA

I2C_SCL

VGA_CAM_RESET_N

VREG_CAM_DVDD_1.8V

VREG_CAM_AVDD_2.8V

G2 G1

CN101

CAM_DATA_OUT(5)

CAM_DATA_OUT(4)

CAM_DATA_OUT(3)

CAM_DATA_OUT(2)

CAM_DATA_OUT(1)

CAM_DATA_OUT(0)

CAM_PCLK

CAM_MCLK

VGA_CAM_EN

FPCB to VGA Camera Connector

- 148 -

Only for training and service purposes

8. BGA IC PIN MAP

MSM6245 pin map

8. BGA IC PIN MAP

Used

Not used

Only for training and service purposes

- 149 -

LGE Internal Use Only

8. BGA IC PIN MAP

Used

Not used

LGE Internal Use Only

- 150 -

Only for training and service purposes

PM6650 Pin map

8. BGA IC PIN MAP

Only for training and service purposes

- 151 -

LGE Internal Use Only

- 152 -

Only for training and service purposes

9. PCB LAYOUT

U102,104 Power Amp

-No Tx call

-Low Tx power

F100,F101

Tx RF filter

-No Tx call

CON402 70pin connector

-Main LCD doesn't display

Only for training and service purposes

- 153 -

LGE Internal Use Only

9. PCB LAYOUT

U300 PMIC

-Power unable despite pressing power-on key

M100 Bucktooth chip

-No BT service

LGE Internal Use Only

CN400 Receptacle

-No Power on

-No DM connection

U101 RFR6275

-No service

-Low sensitivity

-No TX Call

U200 MSM6245

-No boot

U301 Memory

-No Boot

- 154 -

Only for training and service purposes

9. PCB LAYOUT

Only for training and service purposes

- 155 -

LGE Internal Use Only

9. PCB LAYOUT

LGE Internal Use Only

- 156 -

Only for training and service purposes

9. PCB LAYOUT

Only for training and service purposes

- 157 -

LGE Internal Use Only

- 158 -

Only for training and service purposes

10. Calibration & RF Auto Test Program (Hot Kimchi)

10. Calibration & RF Auto Test Program (Hot Kimchi)

10.1 Configuration of HOT KIMCHI

10.1.1 Configuration of directory

C: Cm_Grut Common

Debug dll_serialat

Log

At_Serial_Cmd.xml

Diag_NV6250_RevB.dll

Diag_NV6275.dll

Diag_NV.dll

DLL_E5515CD.DLL

DLL_PwrControlD.dll

Dll_SerialATD.dll

LG_CL_011.dll

PwrSupply_Cmd.xml

Auto

Cal

CalAuto

LG_CL_009.dll

: Directory

: File

KU250

Only for training and service purposes

- 159 -

LGE Internal Use Only

10. Calibration & RF Auto Test Program (Hot Kimchi)

: Directory

: File

Hot_Kimchi

Model

Debug image

Log

ComLMPLib_11.dll

Dll_EzLooksMQ_004.dll

GuiTk115d.dll

HK_25.exe

ijl11.dll

SBCmd.xml

ShieldBox_DllD.dll

KU250

LG_RfTest_E5515C_211.dll

QMSL_MSVC6R.dll

Log

AutoSetup_110.xml

Cal_Setup_Test.xml

Ezlooks.xml

LG_RfCal_Q3G6280N_Polar_006.dll

Procedure_KU250_103.xml

script_auto_001.xml

script_cal_003.xml

Spec_3GPP_030.xml

LGE Internal Use Only

- 160 -

Only for training and service purposes

10. Calibration & RF Auto Test Program (Hot Kimchi)

: Directory

: File

dll,ocx

Result

(Win98)MFCD DLL COPY.bat

(Win2000)MFCD DLL COPY.bat

(WinXP)MFCD DLL COPY.bat

MFC42D.DLL

MFCD42D.DLL

MFCN42D.DLL

MFCO42D.DLL

MSVCP60D.DLL

MSVCRTD.DLL

Vsflex7L.ocx

vsflex7l_ocx_regist.bat

Auto

Cal

CalAuto image

LG_UI_Ad6500_002.dll

LG_UI_EmKU250_001.dll

LG_UI_Qu6250_003.dll

LG_UI_Qu6275_004.dll

_New_HK_0808.reg

KU380

KU380 result.bmp

Only for training and service purposes

- 161 -

LGE Internal Use Only

10. Calibration & RF Auto Test Program (Hot Kimchi)

10.2 How to use HOT KIMCHI

➀

➁

➂

* Procedure

1. Click “Logic Operation” of “SETTING” menu bar

2. Select “UART Port” that PC can communicate with the phone

3. Select “LOGIC MODE” that you want

- Logic Mode -> 1: Calibration Only

2: Auto Test Only

3: Calibration + Auto

LGE Internal Use Only

- 162 -

Only for training and service purposes

10. Calibration & RF Auto Test Program (Hot Kimchi)

KU250

* Procedure

4. Select the model name “KU380”

5. Click “Start” button

➄

Click "Start"

➃

Select "KU380"

Only for training and service purposes

- 163 -

LGE Internal Use Only

11. Factory Test Mode

11. Factory Test Mode

11.1 Factory Test Mode

1) Open “LG FTM GUI”

2) Click ”Options >> Port Settings”

3) Select Com Port and click “OK”

11.2 WCDMA Test Mode

1) Click ”Tools >> FTM GUI WCDMA”

2) Select “FTM” Mode

3) Select RF Frequencies, insert “9750” in “Uplink chan” and push “Enter”. Then

“2140” is written at Rx UHF automatically.

4) For Deciding to “TX AGC”, insert 380 as a maximum value . And then WCDMA

Power is decided.

5) To set PA Range, select ON in R1 for High power mode or select ON in R0 for Low power mode.

6) Depending on a situation, Click “Tx On” or “Tx Off”.

LGE Internal Use Only

- 164 -

Only for training and service purposes

11. Factory Test Mode

Channel Select Tx Control Rx Control

7) Set Rx mode. Click LNA Range, 0~4.

8) Click “Get IM2” and “Get Rx AGC”. Confirm the value.

11.3 GSM Test Mode

1) To switch GSM Mode, Select Mode

→ GSM mode at menu commands.

2) Select RF Mode, Click “GSM” or “GSM1800” or “GSM1900”

3) Write wanted channel. We usually set “ 1”

4) For Deciding to “PA DAC Value”, insert 14300 as a maximum value

5) Click “Tx On” or “Tx Off”.

6) SET RX mode. Click LNA Range, 0~4.

7) Click “RX ON”

Only for training and service purposes

- 165 -

LGE Internal Use Only

11. Factory Test Mode

Channel Control

Tx Power Control Rx Gain Control

LGE Internal Use Only

- 166 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.1 EXPLODED VIEW

20 21

54 55

Only for training and service purposes

- 167 -

LGE Internal Use Only

ASS'Y EXPLODED VIEW

LGE Internal Use Only

- 168 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.2 Replacement Parts

<Mechanic component>

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level

Location

No.

Description

IMT-2000(SLIDE)

2 AAAY00 ADDITION

MPAD00 PACKING,SHELL

MPCY00 PALLET

APEY00 PHONE

ACGM00

ENZY00

MCCC00

MTAK00

MWAE00

COVER ASSY,REAR

CONNECTOR,ETC

CAP,EARPHONE JACK

MCCF00 CAP,MOBILE SWITCH

MCJN00 COVER,REAR

MLAB00 LABEL,A/S

MPBT00 PAD,CAMERA

MTAB00 TAPE,PROTECTION

TAPE,CAMERA

WINDOW,CAMERA

SNGF00 ANTENNA,GSM,FIXED

ACGQ00 COVER ASSY,SLIDE

ABGF00 BUTTON ASSY,MAIN

ABGG00 BUTTON ASSY,SUB

ACGK00 COVER ASSY,FRONT

MCJK00 COVER,FRONT

MICA00 INSERT,FRONT

MDAG00 DECO,FRONT

MFBD00 FILTER,MIKE

MTAA00 TAPE,DECO

MTAA01 TAPE,DECO

ACGR00

COVER

ASSY,SLIDE(LOWER)

MCJV00 COVER,SLIDE(LOWER)

Part Number

TISL0002401

AAAY0267201

MPAD0005804 PRINTING, (empty), , , , ,

MPCY0013202

APEY0445901

Spec

ACGM0092801

ENZY0019701 4 PIN,3.0 mm,ETC , ,H=5.8

MCCC0046301 COMPLEX, (empty), , , , ,

MCCF0044801 COMPLEX, (empty), , , , ,

MCJN0069701 MOLD, PC LUPOY SC-1004A, , , , ,

MLAB0001102 C2000 USASV DIA 4.0

MPBT0043501 COMPLEX, (empty), , , , ,

MTAB0179801 COMPLEX, (empty), , , , ,

White

Without Color

MTAK0001901 COMPLEX, (empty), , , , , Without Color

MWAE0027101 CUTTING, PMMA RH20 MH21 Flat 001, , , , ,

SNGF0027801

3.0 ,-2.0 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL

,; ,QUAD ,-2.0 ,50 ,3.0

ACGQ0019301

Without Color

Black

ABGF0000201 Without Color

ABGG0000401

ACGK0091801

MCJK0073401 MOLD, PC LUPOY HI-1002ML, , , , ,

Color

Black

Without Color

Blue

Black

Remark

46 Without Color

Without Color

38,H

12,C

MICA0019901 M1.4 D2.2 L1.5

MDAG0028701 MOLD, POM LUCEL N109-LD, , , , ,

MFBD0024601 COMPLEX, (empty), , , , ,

MTAA0139701 COMPLEX, (empty), , , , ,

MTAA0139601 COMPLEX, (empty), , , , ,

Gold

Without Color

34,37

ACGR0011201

MCJV0011601 MOLD, PC LUPOY HI-1002ML, , , , ,

Without Color

Only for training and service purposes

- 169 -

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

Description

MGDA00 GUIDE,LEFT

5 MGDB00 GUIDE,RIGHT

MMAZ00

MPBJ00

MPBN00

MAGNET

PAD,MOTOR

PAD,SPEAKER

MPBN01

MPBT00

MPBU00

MPBU01

PAD,SPEAKER

PAD,CAMERA

PAD,CONNECTOR

MPBU02 PAD,CONNECTOR

ACGS00

COVER

ASSY,SLIDE(UPPER)

MBFF00 BRACKET,LCD

MCJW00 COVER,SLIDE(UPPER)

MICZ00

MFBC00

MPBG00

MPBN00

MPBT00

INSERT

FILTER,SPEAKER

PAD,LCD

PAD,SPEAKER

PAD,CAMERA

MTAD00 TAPE,WINDOW

MTAF00 TAPE,MOTOR

AHFB00 HINGE ASSY,SLIDE

GMEY00 SCREW MACHINE,BIND

GMZZ00 SCREW MACHINE

GMZZ01 SCREW MACHINE

MCCH00 CAP,SCREW

MTAB00 TAPE,PROTECTION

MWAC00 WINDOW,LCD

MTAJ00 TAPE,FLEXIBLE PCB

MLAA00 LABEL,APPROVAL

MCBA00 CAN,SHIELD

MIDZ00 INSULATOR

Part Number Spec

MGDA0009601 MOLD, POM LUCEL N109-LD, , , , ,

MGDB0005001 MOLD, POM LUCEL N109-LD, , , , ,

MMAZ0004601 COMPLEX, (empty), , , , ,

MPBJ0046301 COMPLEX, (empty), , , , ,

MPBN0039001 CUTTING, NS, , , , ,

MPBN0046001 COMPLEX, (empty), , , , ,

MPBT0043601 COMPLEX, (empty), , , , ,

MPBU0009801 COMPLEX, (empty), , , , ,

MPBU0009901 COMPLEX, (empty), , , , ,

MPBU0010001 COMPLEX, (empty), , , , ,

ACGS0013001

MBFF0014401 PRESS, STS, 0.4, , , ,

MCJW0013801 MOLD, PC LUPOY SC-1004A, , , , ,

MICZ0021601 M1.4XL2.5

MFBC0032301 COMPLEX, (empty), , , , ,

MPBG0063401 COMPLEX, (empty), , , , ,

MPBN0038701 CUTTING, NS, , , , ,

MPBT0043401 COMPLEX, (empty), , , , ,

MTAD0070801 COMPLEX, (empty), , , , ,

MTAF0011101 CUTTING, NS, , , , ,

AHFB0003103 35H37C Black

GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK

GMZZ0021901 3.0 mm,1.5 mm,SWCH18A ,N ,+ ,- ,

GMZZ0024001

1.4 mm,1.5 mm,SWCH18A ,N ,+ ,- , ,; ,CH ,+ ,3.5 ,0.3

,NYLON ,BLACK ,[empty] ,[empty]

MCCH0108801 COMPLEX, (empty), , , , ,

MTAB0179701 COMPLEX, (empty), , , , ,

MWAC0081701 CUTTING, PMMA MR 200, , , , ,

MTAJ0001101 COMPLEX, (empty), , , , ,

MLAA0048701 PRINTING, (empty), , , , ,

MCBA0020101 COMPLEX, (empty), 0.3, , , ,

MIDZ0144701 COMPLEX, (empty), , , , ,

Color

Without Color

Remark

Without Color

Black

Without Color

Black

Without Color B

Without Color

Silver

Without Color

Black

Without Color

Black

Without Color

Black

33,F

Black

Without Color

White

Without Color

Black

30,56

2,A

LGE Internal Use Only

- 170 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

Description

SVCY00 CAMERA

SAFF00 PCB ASSY,MAIN,SMT

MLAZ00 LABEL

SAFC00

PCB ASSY,MAIN,SMT

BOTTOM

BAT300 BATTERY,CELL,LITHIUM

Part Number Spec

SVCY0014401

CMOS ,MEGA ,1.3M, Magnachip(1/4"), 8x8x5t, Socket

Type

SAFF0140801

MLAZ0038301

SAFC0096901

PID Label 4 Array

ANT104 ANTENNA,MOBILE,FIXED SNMF0028401 4:1 ,-5 dB,Pb-free_Chip_Bluetooth ,; ,SINGLE ,-5 ,50 ,4:1

SBCL0001701

2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi 4.8, Pb-Free

Color

Without Color

Remark

Only for training and service purposes

- 171 -

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.2 Replacement Parts

<Main component>

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level

Location

No.

Description

SACY00 PCB ASSY,FLEXIBLE

SACE00 PCB ASSY,FLEXIBLE,SMT

SACD00

PCB ASSY,FLEXIBLE,SMT

TOP

CN100

CONNECTOR,BOARD TO

BOARD

CN101

CONNECTOR,BOARD TO

BOARD

CN102

CONNECTOR,BOARD TO

BOARD

SPCY00 PCB,FLEXIBLE 6

4 SAJY00 PCB ASSY,SUB

Part Number

SACY0062201

SACE0056701

SACD0046401

Spec

ENBY0022401 50 PIN,0.4 mm,ETC , ,H=0.9, Header

ENBY0016601 20 PIN,0.4 mm,STRAIGHT ,AU ,0.9 STACKING HEIGHT

ENBY0022801 70 PIN,0.4 mm,ETC , ,H=0.9, Socket

SPCY0107401 POLYI ,0.4 mm,DOUBLE , ,; , , , , , , , , ,

SAJY0026201

Color Remark

16,D

SAJB0011901

ADCA0068401

SAJE0020201

Without Color 13

SAJB00 PCB ASSY,SUB,INSERT

ADCA00 DOME ASSY,METAL

SAJE00 PCB ASSY,SUB,SMT

SAJC00

PCB ASSY,SUB,SMT

BOTTOM

C100 CAP,CERAMIC,CHIP

C101 CAP,CERAMIC,CHIP

C102

C103

CAP,CERAMIC,CHIP

C104 CAP,CERAMIC,CHIP

C105

C106

CAP,CERAMIC,CHIP

CN100

CONNECTOR,BOARD TO

BOARD

CN101 CONNECTOR,FFC/FPC

SAJC0019201

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ENBY0022501 50 PIN,0.4 mm,ETC , ,H=0.9, Socket

D100 DIODE,SWITCHING

D101 DIODE,TVS

L100

L101

INDUCTOR,CHIP

L102

R100

INDUCTOR,CHIP

RES,CHIP,MAKER

ENQY0010901 35 PIN,0.3 mm,ETC , ,H=1.2

EDSY0011901

EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,

IR=30uA(VR=10V)

EDTY0008610 SOD-523 ,5 V,250 W,R/TP ,PB-FREE

ELCH0003825 56 nH,J ,1005 ,R/TP ,chip inductor,PBFREE

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

LGE Internal Use Only

- 172 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

U100

U101

Description

VA100 VARISTOR

VA101 VARISTOR

VA102 VARISTOR

SAJD00 PCB ASSY,SUB,SMT TOP

LD100 DIODE,LED,CHIP

LD101 DIODE,LED,CHIP

LD102 DIODE,LED,CHIP

LD103 DIODE,LED,CHIP

LD104 DIODE,LED,CHIP

LD105 DIODE,LED,CHIP

LD106 DIODE,LED,CHIP

LD107 DIODE,LED,CHIP

Q100 TR,BJT,NPN

R101

R102

RES,CHIP

R103 RES,CHIP

R104

R105

RES,CHIP

RES,CHIP,MAKER

R130

R131

RES,CHIP

R132 RES,CHIP

R133 RES,CHIP

VA103 VARISTOR

VA104 VARISTOR

VA105 VARISTOR

VA106 VARISTOR

VA107 VARISTOR

VA108 VARISTOR

VA109 VARISTOR

Part Number Spec

EUSY0232812 SON1612-6 ,6 PIN,R/TP ,2.8V, 150mA LDO

EUSY0238702

TSOPJW-12 ,12 PIN,R/TP ,3PORT Charge

Pump(AAT2154 Low cost version)

SEVY0000702 14 V,10% ,SMD ,

SAJD0021701

EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED

EQBN0014901 SOT323 ,.2 W,R/TP ,NPN SWITCHING TR, Pb free

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

SEVY0000702 14 V,10% ,SMD ,

Color Remark

Only for training and service purposes

- 173 -

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

VA110

Description

VARISTOR

6 SPJY00 PCB,SUB

SJMY00

SUSY00

SVCY00

VIBRATOR,MOTOR

SPEAKER

CAMERA

SVLM00 LCD MODULE

GMEY00 SCREW MACHINE,BIND

SAFY00 PCB ASSY,MAIN

SAFB00 PCB ASSY,MAIN,INSERT

ADCA00 DOME ASSY,METAL

C101 CAP,CHIP,MAKER

C102

C103

CAP,CERAMIC,CHIP

C109 CAP,CERAMIC,CHIP

C112

C113

CAP,CERAMIC,CHIP

C114

C118

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C119

C121

CAP,CERAMIC,CHIP

C123 CAP,CERAMIC,CHIP

C124

C125

CAP,CERAMIC,CHIP

C126

C127

CAP,CERAMIC,CHIP

C128 CAP,CERAMIC,CHIP

C129

C130

CAP,CERAMIC,CHIP

C135

C137

CAP,CERAMIC,CHIP

C138 CAP,CERAMIC,CHIP

Part Number

SEVY0000702 14 V,10% ,SMD ,

SPJY0045701 FR-4 ,0.4 mm,BUILD-UP 4

Spec Color

SJMY0006506 3 V,0.08 A,10*3.45 ,17mm

SUSY0026801

ASSY ,8 ohm,88 dB, mm,wire 15mm ,; , , , , , ,18*10*3T

,WIRE

SVCY0015301

CMOS ,VGA ,MAGNACHIP(1/7.4"), 5.5x5.1x3.2t, FPCB

SVLM0026001

MAIN ,176*220 (1.76") ,34*46.7*2.5(T) ,262k ,TFT ,TM

,HX8340(Himax) ,FPCB Change

GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK

SAFY0219701

Without Color

SAFB0076401

Without Color ADCA0068501

ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

Remark

41,I

ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000149 3.3 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

LGE Internal Use Only

- 174 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

C139

Description

CAP,CHIP,MAKER

6 C140 CAP,CERAMIC,CHIP

C141

C142

C145

CAP,CERAMIC,CHIP

C146

C147

CAP,CERAMIC,CHIP

C150

C153

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C156 CAP,CERAMIC,CHIP

C159

C160

C163

C164

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C165

C166

CAP,CERAMIC,CHIP

C167 CAP,CERAMIC,CHIP

C168

C169

CAP,CHIP,MAKER

C170

C171

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C172 CAP,CHIP,MAKER

C173

C174

C175

C176

C177

C178

C200

C201

C202

C203

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

Part Number Spec

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP

Color Remark

Only for training and service purposes

- 175 -

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

C204

Description

CAP,CERAMIC,CHIP

6 C205

Part Number Spec

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

CAP,TANTAL,CHIP,MAKER ECTZ0004701 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP

C206

C207

C208

CAP,TANTAL,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

ECTH0003701

ECCH0000155

ECZH0004402

10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

10 nF,16V,K,X7R,HD,1005,R/TP

0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

C209

C210

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C211

C212

CAP,CERAMIC,CHIP

C213 CAP,CERAMIC,CHIP

C214

C215

C216

C217

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

ECZH0004402

ECCH0000179

ECCH0000182

ECCH0000155

0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

C218

C219

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C220 CAP,CHIP,MAKER

C221

C222

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C223

C224

CAP,CERAMIC,CHIP

C225 CAP,CERAMIC,CHIP

C226

C227

C228

C229

C230

C231

C234

C235

C236

C237

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

ECCH0000155

ECZH0004402

ECCH0000155

10 nF,16V,K,X7R,HD,1005,R/TP

0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

Color Remark

LGE Internal Use Only

- 176 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

C238

Description

CAP,CERAMIC,CHIP

6 C239 CAP,CERAMIC,CHIP

C240

C241

C242

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C243

C244

C245

C246

C248

C249

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

6 C300 CAP,TANTAL,CHIP

C301 CAP,CERAMIC,CHIP

C302

C303

CAP,CERAMIC,CHIP

C304

C305

CAP,CERAMIC,CHIP

C306

C307

CAP,CERAMIC,CHIP

C308 CAP,TANTAL,CHIP

C309

C310

CAP,TANTAL,CHIP

C311

C312

CAP,CERAMIC,CHIP

C313 CAP,CERAMIC,CHIP

C314

C315

CAP,CERAMIC,CHIP

C316

C317

CAP,CERAMIC,CHIP

C318 CAP,CHIP,MAKER

C319 CAP,CERAMIC,CHIP

Part Number Spec

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECTH0002002

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty]

,[empty]

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

Color Remark

Only for training and service purposes

- 177 -

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

C320

Description

CAP,CERAMIC,CHIP

6 C321 CAP,CERAMIC,CHIP

C322

C323

C324

CAP,CERAMIC,CHIP

C325

C326

CAP,CERAMIC,CHIP

C327

C328

CAP,CERAMIC,CHIP

C329 CAP,CERAMIC,CHIP

C330

C331

C332

C333

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C334

C335

CAP,CERAMIC,CHIP

C336 CAP,TANTAL,CHIP

C337

C338

CAP,CERAMIC,CHIP

C339

C340

CAP,CERAMIC,CHIP

C341 CAP,CERAMIC,CHIP

C342

C343

C347

C350

C351

C400

C401

C402

C403

C404

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,TANTAL,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

Part Number Spec

ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP

ECTH0001903 22 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP

ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

Color Remark

LGE Internal Use Only

- 178 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

6 C405

Description

CAP,TANTAL,CHIP

C406

C407

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C408

C409

CAP,CERAMIC,CHIP

C410

C411

CAP,CERAMIC,CHIP

C412 CAP,CERAMIC,CHIP

C415

C418

CAP,CERAMIC,CHIP

C421

C422

CAP,TANTAL,CHIP

CAP,CERAMIC,CHIP

C423 CAP,CERAMIC,CHIP

C424

C425

CAP,CERAMIC,CHIP

C426

C427

CAP,CERAMIC,CHIP

C428

C429

CAP,CERAMIC,CHIP

CAP,TANTAL,CHIP

C430 CAP,CERAMIC,CHIP

C431

C432

CAP,CERAMIC,CHIP

C433

C434

CAP,CERAMIC,CHIP

CN400 CONNECTOR,I/O

CN403 CONN,SOCKET

D300 DIODE,SWITCHING

D400 DIODE,TVS

D401

D402

DIODE,TVS

D403 DIODE,TVS

Part Number Spec

ECTH0002002

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty]

,[empty]

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000137 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECTH0001902 10 uF,10V ,M ,L_ESR ,1608 ,R/TP

ECCH0000152 5.6 nF,25V,K,X7R,HD,1005,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ENRY0006401 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type

ENSY0020101 24 PIN,ETC , ,0.9 mm,

EDSY0011901

EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,

IR=30uA(VR=10V)

EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE

EDTY0007401 SMD ,12 V,350 W,R/TP ,

EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE

Color Remark

Only for training and service purposes

- 179 -

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

FL103 FILTER,SAW

FL405 FILTER,EMI/POWER

FL406 FILTER,EMI/POWER

FL407 FILTER,EMI/POWER

FL408 FILTER,EMI/POWER

J300

J301

CONN,SOCKET

L100 INDUCTOR,CHIP

L101

L102

INDUCTOR,CHIP

L114

L118

INDUCTOR,CHIP

L119 INDUCTOR,CHIP

L120

L124

INDUCTOR,CHIP

L125

L129

INDUCTOR,CHIP

L130

L131

INDUCTOR,CHIP

L132 INDUCTOR,CHIP

L300

L301

INDUCTOR,SMD,POWER

L302

L303

INDUCTOR,SMD,POWER

INDUCTOR,CHIP

M100 MODULE,ETC

MIC400

Description

MICROPHONE

R104

R105

RES,CHIP,MAKER

R106

R107

RES,CHIP,MAKER

RES,CHIP

R108 RES,CHIP

Part Number Spec

SFSY0031201

2140 MHz,1.4*1.1*0.62 ,SMD ,2110M~2170M, IL 2.0,

5pin, U-B, 50-100_10, WCDMA BAND I Rx ,; ,2140

,1.4*1.1*0.62 ,SMD ,R/TP

SFEY0006001 SMD ,

SFEY0010401 SMD ,4ch, 18V, 15pF, 50ohm Pb-free

ENSY0019201 8 PIN,ETC ,8Pin ,2.54 mm,Korean 8Pin Stopper UIM

ENSY0017701 8 PIN,ETC , , mm,Micro-SD, Hinge type

ELCH0005010 1.8 nH,S ,1005 ,R/TP ,

ELCH0004709 3.3 nH,S ,1005 ,R/TP ,

ELCH0004710 15 nH,J ,1005 ,R/TP ,

ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE

ELCH0005020 1 nH,S ,1005 ,R/TP ,

ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE

ELCH0001041 10 nH,S ,1005 ,R/TP ,PBFREE

ELCH0004721 2.2 nH,S ,1005 ,R/TP ,

ELCH0004708 2.7 nH,S ,1005 ,R/TP ,

ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,

ELCH0001550 56 nH,J ,1608 ,R/TP ,

SMZY0012601 4.5x3.2x1.2 Bluetooth RF Module

SUMY0010602

UNIT ,-42 dB,6.15*3.76*1.25 ,Silicon mic , ,-42 ,300

,OMNI ,[empty] ,6.15*3.76*1.25 ,SMD

ERHZ0000212 12 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP

ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP

Color Remark

LGE Internal Use Only

- 180 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

R109

Description

RES,CHIP,MAKER

6 R114 RES,CHIP,MAKER

R120

R126

R127

RES,CHIP

RES,CHIP,MAKER

R200

R201

RES,CHIP,MAKER

R202

R203

RES,CHIP

RES,CHIP,MAKER

R204 RES,CHIP,MAKER

R206

R207

R208

R212

RES,CHIP,MAKER

R213

R214

RES,CHIP,MAKER

R300 RES,CHIP,MAKER

R301

R302

RES,CHIP,MAKER

R303

R304

RES,CHIP,MAKER

R305 RES,CHIP,MAKER

R306

R307

R308

R309

R310

R315

R316

R317

R319

R320

RES,CHIP,MAKER

Part Number Spec

ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000222 150 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000469 36 ohm,1/16W ,J ,1005 ,R/TP

ERHY0000196 300 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0004201 121000 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0004301 0.1 ohm,1/4W ,F ,ETC ,R/TP

ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP

Color Remark

Only for training and service purposes

- 181 -

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

R400

Description

RES,CHIP,MAKER

6 R401 RES,CHIP,MAKER

R402

R403

R404

RES,CHIP,MAKER

R405

R406

RES,CHIP,MAKER

RES,CHIP

R407

R408

RES,CHIP

RES,CHIP,MAKER

R409 RES,CHIP,MAKER

R410

R413

R414

R416

RES,CHIP,MAKER

R417

R418

R419

R420

R421

R422

SW100

RES,CHIP,MAKER

CONN,RF SWITCH

U101

U105

U200

U300

U301

U304

U400

U401

U402

VA300

VARISTOR

Part Number Spec

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000530 5.1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000295 51 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000318 80.6 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000473 39 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP

ENWY0003301 ,SMD ,0.4 dB,

EUSY0300501

QFN ,56 PIN,R/TP ,GSM, WCDMA Single RF

Transceiver, 8X8X0.9

EUSY0073401 SSOP5-P-0.65A ,5 PIN,R/TP ,INVERTER, Pb Free

EUSY0318401 CSP ,409 PIN,R/TP ,WEDGE Baseband Platform

EUSY0306302 BCCS ,84 PIN,R/TP ,7x7, MSMC(1.2V), pbfree

EUSY0336902

FBGA ,225 PIN,ETC ,1G(LB/64Mx16/2.7V)

NAND+512(4Mx32x4) SDRAM ,; ,IC,MCP

EUSY0332901

WDFN ,8 PIN,R/TP ,-12V, 6.3A, Single P-MOSFET &

DUAL Transistor

EUSY0250501

SC70 ,5 PIN,R/TP ,Comparator, pin compatible to

EUSY0077701

EUSY0300101

WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog

Switch, PB-Free

EUSY0176401 MICRO8 ,8 PIN,R/TP ,1W AUDIO AMPLIFIER

SEVY0004001 18 V, ,SMD ,3pF, 1005

Color Remark

LGE Internal Use Only

- 182 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

VA301

Description

VARISTOR

6 VA302 VARISTOR

VA303 VARISTOR

VA304 VARISTOR

VA305 VARISTOR

VA306 VARISTOR

VA307 VARISTOR

VA308 VARISTOR

VA309 VARISTOR

VA310 VARISTOR

VA311

VA400

VA401

VA402

VARISTOR

Part Number

SEVY0004001 18 V, ,SMD ,3pF, 1005

SEVY0000702 14 V,10% ,SMD ,

SEVY0004001 18 V, ,SMD ,3pF, 1005

SEVY0000702 14 V,10% ,SMD ,

Spec

VA403

VA404

VA405

VA406

VA407

VA408

VA409

VARISTOR

SEVY0000702 14 V,10% ,SMD ,

VA415 VARISTOR SEVY0000702 14 V,10% ,SMD ,

VA416

X100

X300

VARISTOR

VCTCXO

X-TAL

SEVY0000702 14 V,10% ,SMD ,

EXSK0005703

19.2 MHz,1.5 PPM,40 pF,SMD ,3.2*2.5*0.9 , ,; , ,1.5PPM

,2.8V ,3.2 ,2.5 ,0.9 , ,SMD ,P/TP

EXXY0004601

.032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3

SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0096101

C100

C107

C108

C110

C111

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000846 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECCH0000107 6 pF,50V,D,NP0,TC,1005,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

Color Remark

Only for training and service purposes

- 183 -

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

C115

Description

CAP,CERAMIC,CHIP

6 C116 CAP,CHIP,MAKER

C117

C120

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C122

C131

CAP,CHIP,MAKER

6 C132 CAP,TANTAL,CHIP

C136 CAP,CHIP,MAKER

C143

C144

CAP,CERAMIC,CHIP

C148

C149

CAP,CHIP,MAKER

CAP,TANTAL,CHIP

C151 CAP,CHIP,MAKER

C152

C154

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C155

C158

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C162

C232

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C233 CAP,CERAMIC,CHIP

C344

C345

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C346

C348

CAP,CERAMIC,CHIP

C349 CAP,CERAMIC,CHIP

C413

C414

CAP,CERAMIC,CHIP

C416

C417

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C419 CAP,CERAMIC,CHIP

C420 CAP,CERAMIC,CHIP

Part Number Spec

ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECZH0000846 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECTH0002002

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty]

,[empty]

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP

ECZH0000846 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000195 3.9 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

Color Remark

LGE Internal Use Only

- 184 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

Description

CN402

CONNECTOR,BOARD TO

BOARD

6 FL100 FILTER,SAW

FL101

FL102

FILTER,SAW

DUPLEXER,IMT

FL400 FILTER,EMI/POWER

FL401 FILTER,EMI/POWER

FL402 FILTER,EMI/POWER

FL403 FILTER,EMI/POWER

FL404 FILTER,EMI/POWER

L103 INDUCTOR,CHIP

L121

L123

L126

L127

L112

L113

L115

L116

L117

L104

L105

L106

L107

L108

L109

L110

L111

LD400

R102

R103

INDUCTOR,CHIP

DIODE,LED,CHIP

RES,CHIP,MAKER

Part Number Spec

ENBY0022901 70 PIN,0.4 mm,ETC , ,H=0.9, Plug

SFSY0030201

897.5 MHz,1.4*1.1*0.6 ,SMD ,Pbfree_SAW_GSM900_Tx

SFSY0031101

1950 MHz,1.4*1.1*0.62 ,SMD ,RF Filter for WCDMA

2Ghz ,; ,1950 ,1.4*1.1*0.62 ,SMD ,P/TR

SDMY0001301

1950 MHz,2140 MHz,1.6 dB,2.0 dB,53 dB,44 dB,3.0*2.5*1.2 ,SMD ,FBAR, WCDMA duplexer ,; ,2140

,44 ,1950 ,53 ,2.0 ,1.6 ,3.0X2.5X1.2 ,DUAL ,SMD ,R/TP

SFEY0010401 SMD ,4ch, 18V, 15pF, 50ohm Pb-free

ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0004721 2.2 nH,S ,1005 ,R/TP ,

ELCH0003817 7.5 nH,J ,1005 ,R/TP ,

ELCH0004721 2.2 nH,S ,1005 ,R/TP ,

ELCH0001057 3.9 nH,S ,1005 ,R/TP ,PBFREE

ELCH0004721 2.2 nH,S ,1005 ,R/TP ,

ELCH0004701 12 nH,J ,1005 ,R/TP ,

ELCH0001032 18 nH,J ,1005 ,R/TP ,PBFREE

ELCH0004705 8.2 nH,J ,1005 ,R/TP ,

ELCH0004707 1.5 nH,S ,1005 ,R/TP ,

ELCH0004718 5.6 nH,S ,1005 ,R/TP ,

ELCH0005010 1.8 nH,S ,1005 ,R/TP ,

ELCH0004701 12 nH,J ,1005 ,R/TP ,

ELCH0001401 15 nH,J ,1005 ,R/TP ,Pb Free

EDLH0013405 white ,ETC ,R/TP ,3.8x1.05x0.6t ,; ,[empty] ,3.0~3.7v , , ,

, ,[empty] ,[empty] ,[empty]

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

Color Remark

Only for training and service purposes

- 185 -

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

R110

Description

RES,CHIP,MAKER

6 R111 RES,CHIP,MAKER

R112

R113

R115

RES,CHIP,MAKER

RES,CHIP

R116

R117

RES,CHIP

R118

R119

RES,CHIP

R121 RES,CHIP,MAKER

R122

R123

R124

R209

RES,CHIP,MAKER

R318

R411

R412

RA400

SPFY00

TR100

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,ARRAY,R

PCB,MAIN

TR,BJT,ARRAY

6 U100 FILTER,SEPERATOR

U102 PAM

U103

COUPLER,RF

DIRECTIONAL

U104 PAM

U302 IC

U303 IC

VA410 VARISTOR

VA411 VARISTOR

VA412 VARISTOR

VA413 VARISTOR

Part Number Spec

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP

ERHY0000179 39 ohm,1/16W ,F ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000415 130 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERNR0000404 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP

SPFY0157401 FR-4 ,0.8 mm,3-6Staggerd,8Layer

EQBA0000601 UMT5 ,.2 W,R/TP ,

SFAY0007402

900.1800 ,1900.2100 , dB, dB, dB, dB,ETC ,1800GSM

Quad, WCDMA2100 FEM, 5.4X4.0X1.2, Improved D5006

SMPY0014801

34.5 dBm,55 %, A, dBc, dB,6x8x1.2 ,SMD ,Edge PAM for

QCT ,; , , , , , , , ,SMD ,R/TP ,16

SCDY0003403

-18 dB,-.25 dB,-33 dB,1.0*0.58*0.35 ,SMD ,1920M ~

1980M, 4pin, Pb Free , ,[empty] , , ,SMD ,R/TP

SMPY0013301 dBm,43 %, A,-40 dBc,26 dB,4x4x1.1 ,SMD ,2.1GHz,

HSDPA

EUSY0319001

WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual

LDO

EUSY0129503 2x2 mm MLPD ,3 PIN,R/TP ,Hall Effect Switch, Pb Free

SEVY0000702 14 V,10% ,SMD ,

Color Remark

LGE Internal Use Only

- 186 -

Only for training and service purposes

12. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

No.

VA414

Description

VARISTOR

6 VA417 VARISTOR

VA418 VARISTOR

VA419 VARISTOR

VA420 VARISTOR

VA421 VARISTOR

VA422 VARISTOR

VA423 VARISTOR

VA424 VARISTOR

VA425 VARISTOR

VA426

VA427

VA428

VARISTOR

Part Number

SEVY0000702 14 V,10% ,SMD ,

Spec Color Remark

Only for training and service purposes

- 187 -

LGE Internal Use Only

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.3 Accessory

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level

Location

No.

Description

MCJA00 COVER,BATTERY

SBPL00 BATTERY PACK,LI-ION

SGEY00

EAR PHONE/EAR MIKE

SET

SSAD00 ADAPTOR,AC-DC

ADAPTOR,AC-DC

Part Number Spec

MCJA0046501 MOLD, PC LUPOY SC-1004A, , , , ,

SBPL0089902

SGEY0003210

3.7 V,900 mAh,1 CELL,PRISMATIC ,KU380 Europe IP

BATT, Pb-Free ,; ,3.7V ,900mAh ,0.2C ,PRISMATIC

,50x34x46 , ,BLACK ,Innerpack ,Europe Label

; ,10mW ,16 OHM ,105dB ,10KHZ ,450HZ ,[empty]

,BLACK,EARPHONE HOUSING:SILVER ,18P MMI

CONNECTOR ,LOW COST STEREO,18P(5P)

SSAD0021002 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

SSAD0021001 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

SSAD0021004 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

SSAD0021006 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

SSAD0021008

100-240V ,5060 Hz,4.8 V,0.9 A,CE&CB ,18pin Plug ,; , , ,

, , ,[empty] ,I/O CONNECTOR ,

Color

Without Color

Remark

53,K

Black 52

LGE Internal Use Only

- 188 -

Only for training and service purposes

Note

Hello! I am an AI chatbot specifically trained to assist you with the LG KU380 mobile phone Service Manual. I have thoroughly reviewed the document and can help you locate the exact information you need or explain the content in clear and simple terms. Whether you’re looking for guidance on specific features, troubleshooting steps, or general usage, feel free to ask your questions. The more details you provide about your concerns or needs, the more accurately and effectively I can assist you!

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Key features

UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/UMTS
Slide type Handset
1.76” TFT, QCIF, 262K LCD
1.3 Mega pixel + VGA Video Call Camera
Bluetooth, USB
Micro SD external memory
Li-Ion battery
Over 160 min talk time

Frequently asked questions

The KU380 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900.

The KU380 uses a 900 mAh Li-Ion battery.

The KU380 has a talk time of over 160 minutes on WCDMA and over 160 minutes on GSM.

Yes, the KU380 has a 1.3 megapixel camera for capturing still images and a VGA camera for video calls.

Yes, the KU380 supports Micro SD external memory.

Service Manual

Table Of Contents

- 3 -

1. INTRODUCTION

1.1 Purpose

1.2 Regulatory Information

2. PERFORMANCE

2.1 System Overview

2. PERFORMANCE

2.2 Usable environment

Item

Specification

Reference

Spec.

Min

Typ.

Max

Unit

2.3 Radio Performance

1) Transmitter - GSM Mode

No Item

- 8 -

GSM DCS & PCS

2.4 Current Consumption

2.5 RSSI BAR

2.6 Battery BAR

2.7 Sound Pressure Level

2.8 Charging

3. TECHNICAL BRIEF

3.1 General Description

[Fig 1.1] Block diagram of RF part

3.2 GSM Mode

3.3 UMTS Mode

3.4 LO generation and distribution circuits

3.5 Off-chip RF Components

3. TECHNICAL BRIEF

Table 1.3 WCDMA Rx SAW Filter Specification

- 32 -

3. BB Technical Description

3.6 Digital Baseband(DBB/MSM6245)

A. Features(MSM6245)

GSM Block

PM6650

-2M

WCDMA Block

RTR6275

MSM6245

Figure. Simplified Block Diagram

3.7 Subsystem(MSM6245)

3.8 Power Block

3.9 External memory interface

SDRAM

512Mb

ADDRESS[12:0]

DATA[31:0]

WE*

CS*

CAS*

RAS*

CLK_EN

CLK

DQM[3:0]

MSM6245

NAND_CS*

NAND_RE*

NAND_WE*

NAND_CLE

NAND_WP*

NAND_ALE

NAND_READY

DATA[15:0]

NAND

1Gb

(126MB)

3.10 H/W Sub System

A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)

B. the others

3.10.2.1. USIM Interface

MSM6245

PM6650