MP34DT01 MEMS audio sensor omnidirectional digital microphone Description

MP34DT01  MEMS audio sensor omnidirectional digital microphone Description

MP34DT01

MEMS audio sensor omnidirectional digital microphone

Datasheet - production data

Features

Single supply voltage

Low power consumption

120 dBSPL acoustic overload point

63 dB signal-to-noise ratio

Omnidirectional sensitivity

–26 dBFS sensitivity

PDM output

HCLGA package

Top-port design

SMD-compliant

EMI-shielded

ECOPACK

®

, RoHS, and “Green” compliant

Applications

Mobile terminals

Laptop and notebook computers

Portable media players

VoIP

Speech recognition

A/V eLearning devices

Gaming and virtual reality input devices

Digital still and video cameras

Antitheft systems

Description

The MP34DT01 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface.

The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors.

The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.

The MP34DT01 has an acoustic overload point of

120 dBSPL with a 63 dB signal-to-noise ratio and

–26 dBFS sensitivity.

The MP34DT01 is available in a top-port, SMDcompliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

Order codes

Table 1: Device summary

Temp. range [°C]

Package Packing

MP34DT01 -40 to +85

MP34DT01TR -40 to +85

HCLGA

(3x4 x1 mm)

4LD

HCLGA

(3x4x1 mm)

4LD

Tray

Tape and reel

February 2015 DocID022331 Rev 12

This is information on a product in full production.

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www.st.com

Contents

Contents

MP34DT01

1 Pin description ................................................................................ 5

2 Acoustic and electrical specifications ........................................... 6

2.1

2.2

2.3

Acoustic and electrical characteristics ............................................... 6

Timing characteristics ....................................................................... 7

Frequency response ......................................................................... 8

3 Carrier tape mechanical specifications ......................................... 9

4 Process recommendations ........................................................... 10

5 Sensing element ............................................................................ 12

6 Absolute maximum ratings ........................................................... 13

7 Functionality .................................................................................. 14

7.1

L/R channel selection ...................................................................... 14

8 Package information ..................................................................... 15

8.1

Soldering information ...................................................................... 15

8.2

HCLGA package information........................................................... 16

9 Revision history ............................................................................ 19

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MP34DT01

List of tables

List of tables

Table 1: Device summary ........................................................................................................................... 1

Table 2: Pin description .............................................................................................................................. 5

Table 3: Acoustic and electrical characteristics .......................................................................................... 6

Table 4: Distortion specifications ................................................................................................................ 6

Table 5: Timing characteristics ................................................................................................................... 7

Table 6: Frequency response mask for digital microphones ...................................................................... 8

Table 7: Absolute maximum ratings ......................................................................................................... 13

Table 8: L/R channel selection ................................................................................................................. 14

Table 9: Recommended soldering profile limits ........................................................................................ 15

Table 10: HCLGA (3 x 4 x 1 mm) 4-lead package dimensions ................................................................ 17

Table 11: Document revision history ........................................................................................................ 19

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List of figures

List of figures

MP34DT01

Figure 1: Pin connections ........................................................................................................................... 5

Figure 2: Timing waveforms ....................................................................................................................... 7

Figure 3: Frequency response and mask ................................................................................................... 8

Figure 4: Carrier tape without microphone (top view) ................................................................................. 9

Figure 5: Carrier tape with microphone (top view) ...................................................................................... 9

Figure 6: Recommended picking area ...................................................................................................... 10

Figure 7: Recommended picker design .................................................................................................... 11

Figure 8: Recommended soldering profile limits ...................................................................................... 15

Figure 9: HCLGA (3 x 4 x 1 mm) 4-lead package outline ......................................................................... 16

Figure 10: Land pattern............................................................................................................................. 18

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MP34DT01

1 Pin description

Figure 1: Pin connections

Pin description

Pin #

1

2

3

4

5 (ground ring)

Pin name

Vdd

LR

CLK

DOUT

GND

Table 2: Pin description

Function

Power supply

Left/Right channel selection

Synchronization input clock

Left/Right PDM data output

0 V supply

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Acoustic and electrical specifications

MP34DT01

2 Acoustic and electrical specifications

2.1

Symbol

Vdd

Idd

IddPdn

Scc

AOP

So

SNR

PSR

Clock

Ton

Top

V

IOL

V

IOH

Acoustic and electrical characteristics

The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25

°C, unless otherwise noted.

Parameter

Table 3: Acoustic and electrical characteristics

Test condition Min.

Typ.

(1)

Max. Unit

Supply voltage

Current consumption in normal mode

Current consumption in power-

down mode

(2)

Short-circuit current

Acoustic overload point

Sensitivity

Signal-to-noise ratio

Power supply rejection

Input clock frequency

(3)

Turn-on time

(4)

Operating temperature range

Low-level logic input/output voltage

High-level logic input/output voltage

Mean value

A-weighted at 1 kHz,

1 Pa

Guaranteed by design

Guaranteed by design

I out

= 1 mA

I out

= 1 mA

1.64

1

-29

1

-40

-0.3

0.65xVdd

1.8

0.6

20

120

-26

63

-70

2.4

3.6

10

-23

3.25

10

+85

0.35xVdd

Vdd+0.3

V mA

µA mA dBSPL dBFS dB dBFS

MHz ms

°C

V

V

Notes:

(1)

Typical specifications are not guaranteed.

(2)

Input clock in static mode.

(3)

Duty cycle: min = 40% max = 60%.

(4)

Time from the first clock edge to valid output data.

Parameter

Distortion

Distortion

Table 4: Distortion specifications

Test condition

100 dBSPL (50 Hz - 4 kHz)

115 dBSPL (1 kHz)

Value

< 1% THD + N

< 5% THD + N

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MP34DT01

2.2

Acoustic and electrical specifications

Timing characteristics

Parameter

Table 5: Timing characteristics

Description Min.

f

CLK f

PD

T

CLK

T

R,EN

T

R,DIS

T

L,EN

T

L,DIS

Clock frequency for normal mode

Clock frequency for power-down mode

Clock period for normal mode

Data enabled on DATA line, L/R pin = 1

Data disabled on DATA line, L/R pin = 1

Data enabled on DATA line, L/R pin = 0

Data disabled on DATA line, L/R pin = 0

1

308

18

(1)

18

(1)

Notes:

(1)

From design simulations

Figure 2: Timing waveforms

Max.

3.25

0.23

1000

16

(1)

16

(1)

Unit

MHz

MHz ns ns ns ns ns

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Acoustic and electrical specifications

2.3 Frequency response

Figure 3: Frequency response and mask

MP34DT01

Table 6: Frequency response mask for digital microphones

Frequency / Hz

(1)

Lower limit Upper limit

100...4000

4000...10000

-2

-2

+2

+4

Notes:

(1)

At T = 20 °C and acoustic stimulus = 1 Pa (94 dB SPL)

Unit

dBr 1 kHz dBr 1 kHz

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3

Carrier tape mechanical specifications

Carrier tape mechanical specifications

Figure 4: Carrier tape without microphone (top view)

Figure 5: Carrier tape with microphone (top view)

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Process recommendations

4 Process recommendations

MP34DT01

To ensure a consistent manufacturing process it is strongly advised to comply with the following recommendations:

The recommended pick-up area for the MP34DT01 package must be defined using the worst case (ie. no device alignment during the picking process). This area has been defined considering all the tolerances of the components involved (reel, package, sound inlet). The picker tolerance shall be considered as well.

To prevent damage to the MEMS membrane or incorrect pick-up and placement, do not pick up the component on the inlet area

For the package outline please refer to

Figure 5: "Carrier tape with microphone (top view)"

. Nozzle shape, size, and placement accuracy are the other key factors to

consider when deciding on the coordinates for picking.

Device alignment before picking is highly recommended.

A vacuum force greater than 7 psi must be avoided

1 kPa = 0.145 psi (lb/in2) = 0.0102 kgf/cm² = 0.0098 atm

All recommended dimensions (device safe-picking area) do not include the pick-andplace equipment tolerances

Figure 6: Recommended picking area

10/20

To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle.

The following picker ensures that the holes for the vacuum and the air stream are ALWAYS away from the porthole of the device (4 vacuum ports located at each corner of the device).

The recommended nozzle also has a recess, in the form of a cross, which guarantees that the porthole is always left at atmospheric pressure. By using the recommended nozzle, the membrane will not suffer any sudden air disturbances during the picking or placing of the devices in the tape and reel.

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MP34DT01

Process recommendations

Figure 7: Recommended picker design

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Sensing element

5 Sensing element

MP34DT01

The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity between those two plates.

Omron Corporation supplies this element for STMicroelectronics.

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MP34DT01

6

Absolute maximum ratings

Absolute maximum ratings

Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Symbol

Table 7: Absolute maximum ratings

Ratings Maximum value Unit

Vdd

Vin

T

STG

ESD

Supply voltage

Input voltage on any control pin

Storage temperature range

Electrostatic discharge protection

-0.3 to 6

-0.3 to Vdd +0.3

-40 to +125

2 (HBM)

V

V

°C kV

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Functionality

7

7.1

MP34DT01

Functionality

L/R channel selection

The L/R digital pad lets the user select the DOUT signal pattern as shown in

Table 8: "L/R channel selection"

. The L/R pin must be connected to Vdd or GND.

L/R

Table 8: L/R channel selection

CLK low CLK high

GND

Vdd

Data valid

High impedance

High impedance

Data valid

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8

8.1

Package information

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK

®

packages, depending on their level of environmental compliance. ECOPACK

® specifications, grade definitions and product status are available at: www.st.com.

ECOPACK

®

is an ST trademark.

Soldering information

The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.

Land pattern and soldering recommendations are available at www.st.com.

Figure 8: Recommended soldering profile limits

Table 9: Recommended soldering profile limits

Description Parameter

T

L

to T

P

Average ramp rate

Preheat

Minimum temperature

Maximum temperature

Time (T

SMIN

to T

SMAX

)

Ramp-up rate

Time maintained above liquids temperature

Liquids temperature

Peak temperature

Time within 5 °C of actual peak temperature

Ramp-down rate

Time 25 °C (t25 °C) to peak temperature

T

SMIN

T

SMAX t

S

T

SMAX

to T

L t

L

T

L

T

P

Pb free

3 °C/sec max

150 °C

200 °C

60 sec to 120 sec

60 sec to 150 sec

217 °C

260 °C max

20 sec to 40 sec

6 °C/sec max

8 minutes max

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Package information

8.2 HCLGA package information

Figure 9: HCLGA (3 x 4 x 1 mm) 4-lead package outline

MP34DT01

16/20

Note: The MEMS microphone plastic cap can exhibit some level of variation in color when the device is subjected to thermal processes.

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MP34DT01

Symbol

Package information

Table 10: HCLGA (3 x 4 x 1 mm) 4-lead package dimensions mm

Min. Typ. Max.

e2 h

L

L1

E1

E2

E3 e1

D1

D2

D3

E

A

A1 b

D

N

R1

R2 aaa ccc eee

2.05

2.75

-0.20

1.30

0.80

0.25

0.90

-

0.90

0.00

0.35

3.90

3.05

3.75

0.30

2.90

0.30

-

2.10

2.80

0.00

1.35

0.85

0.30

0.95

0.10

1.00

-

0.45

4.00

3.10

3.80

0.50

3.00

4

0.40

0.40

0.15

0.10

0.08

2.15

2.85

0.20

1.40

0.90

0.35

1.00

-

1.10

0.05

0.50

4.10

3.15

3.85

0.70

3.10

0.50

-

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Package information

0.85

Figure 10: Land pattern

1.30

GND

0.40

MP34DT01

0.35

GND

Pad + solder paste

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MP34DT01

Revision history

9

Date

06-Oct-2011

18-Nov-2011

29-Nov-2011

04-Jan-2012

23-Mar-2012

06-Apr-2012

07-May-2012

18-May-2012

05-Jul-2012

21-Feb-2013

07-Jun-2013

27-Feb-2015

Revision history

Revision

Table 11: Document revision history

Changes

1

2

3

4

5

6

7

8

9

10

11

12

Initial release

Removed “stereo” from title,

Section "Features"

, and

Section "Description"

Updated

Section "Features"

and

Section "Description"

Updated

Added So limits to

Table 3: "Acoustic and electrical characteristics"

Minor textual updates

Updated

Figure 9: "HCLGA (3 x 4 x 1 mm) 4-lead package outline"

Pin 1 indicator removed from top view of package on page 1 and

Figure 1: "Pin connections"

Updated

Table 10: "HCLGA (3 x 4 x 1 mm) 4-lead package dimensions"

Updated maximum supply voltage in

Table 3: "Acoustic and electrical characteristics"

Added V

IOL

, V

IOH

to

Table 3: "Acoustic and electrical characteristics"

Updated

Table 5: "Timing characteristics"

Added

Section 5: "Sensing element"

Added

Figure 10: "Land pattern"

Updated temperature range to -40 to +85 °C throughout datasheet

Updated dimension T2 in

Table 10: "HCLGA (3 x 4 x 1 mm) 4-lead package dimensions"

Updated

-

Figure 3: "Frequency response and mask"

-

Table 6: "Frequency response mask for digital microphones"

- HCLGA mechanical data

Figure 9: "HCLGA (3 x 4 x 1 mm) 4-lead package outline"

and

Table 10: "HCLGA (3 x 4 x 1 mm) 4-lead package dimensions"

Added

-

Section 3: "Carrier tape mechanical specifications"

-

Section 4: "Process recommendations"

Minor textual updates

Added note below

Figure 9: "HCLGA (3 x 4 x 1 mm) 4-lead package outline"

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MP34DT01

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© 2015 STMicroelectronics – All rights reserved

20/20 DocID022331 Rev 12

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