anyCAP 100 mA Low Dropout Linear Regulator ADP3309

anyCAP 100 mA Low Dropout Linear Regulator ADP3309
anyCAP® 100 mA
Low Dropout Linear Regulator
ADP3309
FEATURES
FUNCTIONAL BLOCK DIAGRAM
ADP3309
Q1
IN
THERMAL
PROTECTION
ERR/NC
R1
CC
Q2
OUT
gm
DRIVER
R2
SD
BANDGAP
REF
00141-001
±1.2% accuracy over line and load regulations @ 25°C
Ultralow dropout voltage: 120 mV typical @ 100 mA
Requires only COUT = 0.47 μF for stability
anyCAP LDOs are stable with all types of capacitors
(including MLCC)
Current and thermal limiting
Low noise
Low shutdown current: 1 μA
2.8 V to 12 V supply range
−20°C to +85°C ambient temperature range
Several fixed voltage options
Ultrasmall 5-lead SOT-23 package
Excellent line and load regulations
GND
Figure 1.
APPLICATIONS
Cellular telephones
Notebook, palmtop computers
Battery-powered systems
PCMCIA regulator
Bar code scanners
Camcorders, cameras
GENERAL DESCRIPTION
The ADP3309 operates with a wide input voltage range from
2.8 V to 12 V and delivers a load current in excess of 100 mA.
The ADP3309 anyCAP LDO offers a wide range of output
voltages.
ERR/NC 4
ADP3309-3.3
VIN
C1 +
0.47µF –
1
VOUT = 3.3V
OUT 5
IN
2
3
+
–
C2
0.47µF
ON
OFF
SD
GND
00141-002
The ADP3309 is a member of the ADP330x family of precision
low dropout anyCAP voltage regulators. It is pin-for-pin and
functionally compatible with National’s LP2981, but offers
performance advantages. The ADP3309 stands out from
conventional LDOs with a novel architecture and an enhanced
process. Its patented design requires only a 0.47 μF output
capacitor for stability. This device is stable with any type of
capacitor regardless of its equivalent series resistance (ESR)
value, including ceramic types for space restricted applications.
The ADP3309 achieves ±1.2% accuracy at room temperature
and ±2.2% overall accuracy over temperature, line, and load
regulations. The dropout voltage of the ADP3309 is only
120 mV (typical) at 100 mA. This device also includes a current
limit and a shutdown feature. In shutdown mode, the ground
current is reduced to ~1 μA.
Figure 2. Typical Application Circuit
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2006 Analog Devices, Inc. All rights reserved.
ADP3309
TABLE OF CONTENTS
Features .............................................................................................. 1
Capacitor Selection: anyCAP.................................................... 10
Applications....................................................................................... 1
Thermal Overload Protection .................................................. 10
Functional Block Diagram .............................................................. 1
Calculating Junction Temperature........................................... 10
General Description ......................................................................... 1
Printed Circuit Board Layout Consideration ......................... 10
Revision History ............................................................................... 2
Shutdown Mode ......................................................................... 10
Specifications..................................................................................... 3
Error Flag Dropout Detector .................................................... 10
Absolute Maximum Ratings............................................................ 4
Application Circuits ....................................................................... 11
ESD Caution.................................................................................. 4
Crossover Switch ........................................................................ 11
Pin Configuration and Function Descriptions............................. 5
Higher Output Current ............................................................. 11
Typical Performance Characteristics ............................................. 6
Constant Dropout Post Regulator............................................ 11
Theory of Operation ........................................................................ 9
Outline Dimensions ....................................................................... 12
Application Information................................................................ 10
Ordering Guide .......................................................................... 12
REVISION HISTORY
12/06—Rev. B to Rev. C
Change to Table 1 ............................................................................. 3
Updated Outline Dimensions ....................................................... 12
Changes to the Ordering Guide.................................................... 12
7/04—Rev. A to Rev. B.
Changes to the Ordering Guide...................................................... 3
Updated Outline Dimensions ......................................................... 8
12/00—Rev. 0 to Rev. A
9/98—Revision 0: Initial Version
Rev. C | Page 2 of 12
ADP3309
SPECIFICATIONS
@ TA = −20°C to +85°C, VIN = 7 V, CIN = 0.47 μF, COUT = 0.47 μF, unless otherwise noted. 1 The following specifications apply to all voltage
options.
Table 1.
Parameter
Output Voltage Accuracy
Line Regulation
Symbol
VOUT
ΔVOUT
ΔVIN
Load Regulation
ΔVOUT
Ground Current
IGND
Ground Current in Dropout
Dropout Voltage
IGND
VDROP
Conditions
VIN = VOUTNOM + 0.3 V to 12 V,
IL = 0.1 mA to 100 mA, TA = 25°C
VIN = VOUTNOM + 0.3 V to 12 V,
IL = 0.1 mA to 100 mA
VIN = VOUTNOM + 0.3 V to 12 V,
TA = 25°C
Min
−1.2
Typ
−2.2
Max
+1.2
Unit
%
+2.2
%
0.02
mV/V
IL = 0.1 mA to 100 mA, TA = 25°C
0.06
mV/mA
0.8
0.19
0.9
2.0
0.3
1.7
mA
mA
mA
0.12
0.025
0.004
0.25
0.07
0.015
V
V
V
V
V
μA
ΔIL
Shutdown Threshold
VTHSD
Shutdown Pin Input Current
ISDIN
IL = 100 mA
IL = 0.1 mA
VIN = 2.4 V, IL = 0.1 mA
VOUT = 98% of VOUTNOM
IL = 100 mA
IL = 10 mA
IL = 1 mA
On
Off
0 < VSD ≤ 5 V
9
μA
Ground Current in Shutdown Mode
IQ
VSD = 0 V, VIN = 12 V, TA = 25°C
0.005
1
μA
VSD = 0 V, VIN = 12 V, TA = 85°C
0.01
3
μA
Output Current in Shutdown Mode
IOSD
Error Pin Output Leakage
Error Pin Output Low Voltage
Peak Load Current
Output Noise @ 5 V Input
IEL
VEOL
ILDPK
VNOISE
TA = 25°C @ VIN = 12 V
TA = 85°C @ VIN = 12 V
VEO = 5 V
ISINK = 400 μA
VIN = VOUTNOM + 1 V, TA = 25°C
f = 10 Hz to 100 kHz
2
4
13
0.3
μA
μA
μA
V
mA
μV rms
2.0
0.3
1
5 < VSD ≤ 12 V @ VIN = 12 V
1
Ambient temperature of 85°C corresponds to a junction temperature of 125°C under typical full load test conditions.
Rev. C | Page 3 of 12
0.12
150
100
ADP3309
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Input Supply Voltage
Shutdown Input Voltage
Power Dissipation
Operating Ambient Temperature Range
Operating Junction Temperature Range
θJA
θJC
Storage Temperature Range
Lead Temperature (Soldering 10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
Rating
−0.3 V to +16 V
−0.3 V to +16 V
Internally Limited
−55°C to +125°C
−55°C to +125°C
190°C/W
92°C/W
−65°C to +150°C
300°C
215°C
220°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. C | Page 4 of 12
ADP3309
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
GND 2
SD 3
ADP3309
5
OUT
3
ERR/NC
TOP VIEW
(Not to Scale)
NC = NO CONNECT
00141-003
IN 1
Figure 3. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
1
2
3
Mnemonic
IN
GND
SD
4
ERR/NC
5
OUT
Description
Regulator Input.
Ground Pin.
Active Low Shutdown Pin. Connect to ground to disable the regulator output. When shutdown is not used, this
pin should be connected to the input pin.
Open Collector. Output that goes low to indicate the output is about to go out of regulation. This pin can be left
open. (NC = No Connect).
Output of the Regulator. Fixed 2.5 V, 2.7 V, 2.85 V, 2.9 V, 3.0 V, 3.3 V, or 3.6 V output voltage. Bypass to ground with
a 0.47 μF or larger capacitor.
Rev. C | Page 5 of 12
ADP3309
TYPICAL PERFORMANCE CHARACTERISTICS
3.302
900
VOUT = 3.3V
IL = 0mA
IL = 0 TO 100mA
3.301
3.300
GROUND CURRENT (µA)
OUTPUT VOLTAGE (V)
750
IL = 10mA
3.299
IL = 50mA
3.298
3.297
600
450
300
3.296
7
8
9
10
INPUT VOLTAGE (V)
11
12
13
14
150
0
Figure 4. Line Regulation: Output Voltage vs. Supply Voltage
75
OUTPUT VOLTAGE (%)
3.299
3.298
3.297
0
135
IL = 0mA
–0.1
IL = 100mA
–0.2
–0.3
3.296
10
20
30
40
50
60
70
OUTPUT LOAD (mA)
80
90
100
–0.4
–45
00141-005
0
–25
–5
15
35
55
75
TEMPERATURE (°C)
95
115
Figure 8. Output Voltage Variation % vs. Temperature
Figure 5. Output Voltage vs. Load Current
1150
1250
VOUT = 3.3V
IL = 0mA
VIN = 7V
900
GROUND CURRENT (µA)
1000
650
400
IL = 100mA
750
500
IL = 0mA
250
150
0
1.2
2.4
3.6
4.8
6.0
7.2
8.4
INPUT VOLTAGE (V)
9.6
10.8
12.0
0
–25
00141-006
GROUND CURRENT (µA)
135
IL = 50mA
0.1
3.300
0
100
0.2
VOUT = 3.3V
VIN = 7V
3.301
OUTPUT VOLTAGE (V)
50
OUTPUT LOAD (mA)
Figure 7. Quiescent Current vs. Load Current
3.302
3.295
25
00141-007
6
00141-008
5
00141-004
4
00141-009
IL = 100mA
3.295
3.3
Figure 6. Quiescent Current vs. Supply Voltage
–5
15
35
55
75
TEMPERATURE (°C)
95
115
Figure 9. Quiescent Current vs. Temperature
Rev. C | Page 6 of 12
ADP3309
120
3.32
VOUT = 3.3V
96
3.30
3.29
72
VOLTS
INPUT/OUTPUT VOLTAGE (mV)
3.31
RL = 33Ω
CL = 0.47µF
3.28
48
VIN
7.50
24
50
OUTPUT LOAD (mA)
75
100
0
40
Figure 10. Dropout Voltage vs. Output Current
120
160
200 240
TIME (µs)
280
320
360
400
180
200
500
Figure 13. Line Transient Response
5
3.32
VOUT = 3.3V
RL = 33Ω
VOUT = 3.3V
3.31
4
3.30
3.29
3
VOLTS
INPUT/OUTPUT VOLTAGE (V)
80
00141-013
25
00141-014
0
00141-015
0
00141-010
7.00
2
RL = 3.3kΩ
CL = 0.47µF
3.28
VIN
7.50
1
0
0
1
2
3
4
3
INPUT VOLTAGE (V)
2
1
0
00141-011
7.00
0
Figure 11. Power-Up/Power-Down
40
60
80
100 120
TIME (µs)
140
160
Figure 14. Line Transient Response
8
3.32
VSD = VIN
CL = 0.47µF
RL = 33Ω
VOUT = 3.3V
6
VIN
VOUT = 3.3V
CL = 0.47µF
3.31
VOLTS
7
5
3.30
3.29
4
VOUT
3.28
3
mA
10
1
0
IOUT
100
2
0
20
40
60
80
100 120
TIME (µs)
140
160
180
200
00141-012
INPUT/OUTPUT VOLTAGE (V)
20
0
Figure 12. Power-Up Overshoot
100
200
300
TIME (µs)
Figure 15. Load Transient
Rev. C | Page 7 of 12
400
ADP3309
3.32
4
VOUT = 3.3V
CL = 4.7µF
3.3V
VOUT = 3.3V
RL = 33Ω
CL = 0.47µF
3
3.30
2
3.29
1
VOLTS
VOLTS
3.31
3.28
0
IOUT
10
0
200
300
TIME (µs)
400
500
0
10
20
30
40
Figure 16. Load Transient
Figure 19. Turn-Off
0
300
IOUT
RIPPLE REJECTION (dB)
0
VOLTS
4
VOUT = 3.3V
2
–40
d
–50
–60
a
b
–70
VOUT
c
0.5
1.0
1.5
2.0
2.5
3.0
TIME (Seconds)
3.5
4.0
4.5
5.0
00141-017
–90
0
–100
a
10
VOLTAGE NOISE SPECTRAL DENSITY (µV/√Hz)
4
VOUT
3
CL = 0.47µF
3.3V
2
CL = 4.7µF
VOUT = 3.3V
RL = 33Ω
1
0
3
VSD
0
3V
40
60
TIME (µs)
80
100
100
1k
10k
100k
FREQUENCY (Hz)
1M
10M
10
VOUT = 3.3V, CL = 0.47µF
IL = 1mA
1
0.1
0.01
100
00141-018
20
c
Figure 20. Power Supply Ripple Rejection
Figure 17. Short-Circuit Current
VOLTS
d
–80
0
0
b
–30
00141-020
mA
–20
100
VOUT = 3.3V
a. 0.47µF, RL = 33kΩ
b. 0.47µF, RL = 33Ω
c. 10µF, RL = 33kΩ
d. 10µF, RL = 33Ω
–10
200
50
TIME (µs)
1k
10k
FREQUENCY (Hz)
Figure 21. Output Noise Density
Figure 18. Turn-On
Rev. C | Page 8 of 12
100k
00141-021
100
00141-016
0
VSD
00141-019
3
mA
100
ADP3309
THEORY OF OPERATION
The ADP3309 anyCAP LDO uses a single control loop for
regulation and reference functions. The output voltage is sensed
by a resistive voltage divider consisting of R1 and R2, which is
varied to provide the available output voltage option. Feedback
is taken from this network by way of a series diode (D1) and a
second resistor divider (R3 and R4) to the input of an amplifier.
INPUT
OUTPUT
Q1
COMPENSATION
CAPACITOR
NONINVERTING
WIDEBAND
DRIVER
gm
ATTENUATION
(VBANDGAP /VOUT)
R3
PTAT
VOS
R4
D1
PTAT
CURRENT
R1
(a)
R2
RLOAD
CLOAD
00141-022
ADP3309
GND
Figure 22. Functional Block Diagram
A very high gain error amplifier is used to control this loop. The
amplifier is constructed in such a way that at equilibrium, it
produces a large, temperature proportional input offset voltage
that is repeatable and very well controlled. The temperature
proportional offset voltage is combined with the complementary
diode voltage to form a virtual band gap voltage, implicit in the
network, although it never appears explicitly in the circuit.
Ultimately, this patented design makes it possible to control the
loop with only one amplifier. This technique also improves the
noise characteristics of the amplifier by providing more
flexibility on the trade-off of noise sources that leads to a low
noise design.
The R1, R2 divider is chosen in the same ratio as the band gap
voltage to the output voltage. Although the R1, R2 resistor
divider is loaded by the diode (D1), and a second divider
consisting of R3 and R4, the values can be chosen to produce a
temperature stable output.
The patented amplifier controls a new and unique noninverting
driver that drives the pass transistor (Q1). The use of this
special noninverting driver enables the frequency compensation
to include the load capacitor in a pole splitting arrangement to
achieve reduced sensitivity to the value, type, and ESR of the
load capacitance.
Most LDOs place very strict requirements on the range of ESR
values for the output capacitor because they are difficult to
stabilize due to the uncertainty of load capacitance and
resistance. Moreover, the ESR value, required to keep
conventional LDOs stable, changes depending on load and
temperature. These ESR limitations make designing with LDOs
more difficult because of their unclear specifications and
extreme variations over temperature.
This is no longer true with the ADP3309 anyCAP LDO. It can
be used with virtually any capacitor, with no constraint on the
minimum ESR. This innovative design allows the circuit to be
stable with just a small 0.47 μF capacitor on the output.
Additional advantages of the design scheme include superior
line noise rejection and very high regulator gain, which leads to
excellent line, and load regulation. An impressive ±2.2%
accuracy is guaranteed over line, load, and temperature.
Additional features of the circuit include current limit and
thermal shutdown. Compared to the standard solutions that
give warning after the output has lost regulation, the ADP3309
provides improved system performance by enabling the ERR
pin to give warning before the device loses regulation.
As the chip’s temperature rises above 165°C, the circuit activates
a soft thermal shutdown, indicated by a signal low on the ERR
pin, to reduce the current to a safe level.
Rev. C | Page 9 of 12
ADP3309
APPLICATION INFORMATION
CAPACITOR SELECTION: anyCAP
Output Capacitors: As with any micropower device, output
transient response is a function of the output capacitance. The
ADP3309 is stable with a wide range of capacitor values, types,
and ESR (anyCAP). A capacitor as low as 0.47 μF is all that is
needed for stability. However, larger capacitors can be used if
high output current surges are anticipated. The ADP3309 is
stable with extremely low ESR capacitors (ESR ≈ 0), such as
multilayer ceramic capacitors (MLCC) or OSCON.
Input Bypass Capacitor: An input bypass capacitor is not
required. However, for applications where the input source is
high impedance or far from the input pin, a bypass capacitor is
recommended. Connecting a 0.47 μF capacitor from the input
pin (Pin 1) to ground reduces the circuit’s sensitivity to PC
board layout. If a bigger output capacitor is used, the input
capacitor must be 1 μF minimum.
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATION
Surface-mount components rely on the conductive traces or
pads to transfer heat away from the device. Appropriate PC
board layout techniques should be used to remove heat from
the immediate vicinity of the package.
The following general guidelines will be helpful when designing
a board layout:
1.
PC board traces with larger cross section areas remove
more heat. For optimum results, use PC boards with
thicker copper and/or wider traces.
2.
Increase the surface area exposed to open air so heat can be
removed by convection or forced air flow.
3.
Do not use solder mask or silk screen on the heat
dissipating traces because it increases the junction to
ambient thermal resistance of the package.
THERMAL OVERLOAD PROTECTION
The ADP3309 is protected against damage due to excessive
power dissipation by its thermal overload protection circuit,
which limits the die temperature to a maximum of 165°C.
Under extreme conditions (that is, high ambient temperature
and power dissipation) where die temperature starts to rise
above 165°C, the output current is reduced until the die
temperature has dropped to a safe level. The output current is
restored when the die temperature is reduced.
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For normal
operation, device power dissipation should be externally limited
so that junction temperatures do not exceed 125°C.
CALCULATING JUNCTION TEMPERATURE
Device power dissipation is calculated as follows:
SHUTDOWN MODE
Applying a TTL high signal to the shutdown pin or tying it to
the input pin turns the output on. Pulling the shutdown pin
down to a TTL low signal or tying it to ground turns the output
off. In shutdown mode, quiescent current is reduced to less
than 1 μA.
ERROR FLAG DROPOUT DETECTOR
The ADP3309 maintains its output voltage over a wide range of
load, input voltage, and temperature conditions. If the output is
about to lose regulation, for example, by reducing the supply
voltage below the combined regulated output and dropout
voltages, the ERR pin will be activated. The ERR output is an
open collector that will be driven low.
Once set, the ERR or flag’s hysteresis keeps the output low until
a small margin of operating range is restored either by raising
the supply voltage or reducing the load.
PD = (VIN – VOUT) ILOAD + (VIN) IGND
where:
ILOAD is the load current.
IGND is the ground current.
VIN is the input voltage.
VOUT is the output voltage.
Assuming ILOAD = 100 mA, IGND = 2 mA, VIN = 5.0 V, and
VOUT = 3.3 V, device power dissipation is
PD = (5.0 − 3.3) 100 mA + 5.0 × 2 mA = 180 mW
ΔT = TJ – TA = PD × θJA = 0.18 × 190 = 34.2°C
With a maximum junction temperature of 125°C, this yields a
maximum ambient temperature of ~90°C.
Rev. C | Page 10 of 12
ADP3309
APPLICATION CIRCUITS
VIN = 4V TO 8V
The circuit in Figure 23 shows that two ADP3309s can be used
to form a mixed supply voltage system. The output switches
between two different levels selected by an external digital
input. Output voltages can be any combination of voltages from
the Ordering Guide of the data sheet.
VIN = 4V TO 12V
IN
OUTPUT SELECT
4V
0V
MJE253*
IN
SD
ADP3309-2.7
SD
OUT
ADP3309-3.3
VOUT = 2.7V/3.3V
OUT
VOUT = 3.3V @ 1A
R1
50Ω
C1
47µF
GND
+
C2
10µF
ERR
00141-024
CROSSOVER SWITCH
*AAVID531002 HEAT SINK IS USED
Figure 24. Higher Output Current Linear Regulator
GND
CONSTANT DROPOUT POST REGULATOR
+
IN
OUT
+
ADP3309-3.3
SD
The circuit in Figure 25 provides high precision with low
dropout for any regulated output voltage. It significantly
reduces the ripple from a switching regulator while providing a
constant dropout voltage, which limits the power dissipation of
the LDO to 30 mW. The ADP3000 used in this circuit is a
switching regulator in the step-up configuration.
C2
0.47µF
GND
00141-023
C1
1µF
Figure 23. Crossover Switch
HIGHER OUTPUT CURRENT
The ADP3309 can source up to 100 mA without any heat sink
or pass transistor. If higher current is needed, an appropriate
pass transistor can be used, as in Figure 24, to increase the
output current to 1 A.
VIN = 2.5V TO 3.5V
C1
100µF
10V
D1
1N5817
ADP3309-3.3
IN
R1
120Ω
ILIM
C2
100µF
10V
VIN
SW1
ADP3000-ADJ
GND
SW2
FB
R2
30.1kΩ
1%
SD
VOUT = 3.3V @ 100mA
OUT
GND
+
C3
2.2µF
Q2
2N3906
Q1
2N3906
R3
124kΩ
1%
Figure 25. Constant Dropout Post Regulator
Rev. C | Page 11 of 12
R4
274kΩ
00141-025
L1
6.8µF
ADP3309
OUTLINE DIMENSIONS
2.90 BSC
5
4
2.80 BSC
1.60 BSC
1
2
3
PIN 1
0.95 BSC
1.90
BSC
1.30
1.15
0.90
1.45 MAX
0.15 MAX
0.50
0.30
0.22
0.08
SEATING
PLANE
10°
5°
0°
0.60
0.45
0.30
COMPLIANT TO JEDEC STANDARDS MO-178-AA
Figure 26. 5-Lead Small Outline Transistor Package [SOT-23]
(RJ-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADP3309ART-2.5-RL
ADP3309ART-2.5-RL7
ADP3309ARTZ-2.5RL7 1
ADP3309ART-2.7-RL
ADP3309ART-2.7-RL7
ADP3309ARTZ-2.7-R71
ADP3309ART-2.85-R7
ADP3309ART-2.85-RL
ADP3309ARTZ-2.85R71
ADP3309ART-2.9-RL
ADP3309ART-2.9-RL7
ADP3309ARTZ-2.9-R71
ADP3309ART-3-REEL
ADP3309ART-3-REEL7
ADP3309ARTZ-3REEL71
ADP3309ART-3.3-RL
ADP3309ART-3.3-RL7
ADP3309ARTZ-3.3-R71
ADP3309ART-3.6-RL
ADP3309ART-3.6-RL7
ADP3309ARTZ-3.6-R71
1
Temperature Range
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
−20°C to +85°C
Voltage Output
2.5 V
2.5 V
2.5 V
2.7 V
2.7 V
2.7 V
2.85 V
2.85 V
2.85 V
2.9 V
2.9 V
2.9 V
3.0 V
3.0 V
3.0 V
3.3 V
3.3 V
3.3 V
3.6 V
3.6 V
3.6 V
Z = Pb-free part, # denotes lead-free product may be top or bottom marked.
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C00141-0-12/06(C)
Rev. C | Page 12 of 12
Package Description
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
Package Option
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
Branding
LDE
LDE
LDE#
DNC
DNC
L1P
DVC
DVC
L1R
DWC
DWC
L1S
DPC
DPC
DPC#
DRC
DRC
L1Q
DTC
DTC
L1T
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