X3 SiGe HBT 0.35 m BiCMOS (MB3)

X3 SiGe HBT 0.35 m BiCMOS (MB3)
4/16/2014
RELIABILITY MONITOR REPORT
FOR
X3 MBiC3 SiGe HBT 0.35µm (MB3)
MAXIM INTEGRATED
160 RIO ROBLES
SAN JOSE, CA 95134
This Report was prepared by
MAXIM INTEGRATED Reliability Engineering
Summary:
The data in the tables that follow was generated as the result of an on-going Process Reliability
Monitor. The specific products in this process monitor are:
MAX2832ETM+
MAX3521ETP+
The calculated failure rate for devices using this process is:
FAILURE RATE:
MTTF (YRS): 6251
QUANTITY: 180
FAILS: 0
FITS: 18.3
The parameters used to calculate this failure rate are as follows:
Cf: 60%
Ea: 0.7
Tu: 25
°C
The reliability data follows and in this section is the detailed reliability data by stress. The reliability
data section includes the latest data available. This report covers data between 4/1/2013
and 3/31/2014 .
Process Information:
Process Description:
X3 MBiC3 SiGe HBT 0.35µm (MB3)
OPERATING LIFE
DESCRIPTION
DATE TEST
CODE VEHICLE
CONDITION
READPOINT QUANTITY
HIGH TEMP OP LIFE
1303
135°C
192
HRS
70
0
MAX2832ETM+
FAILS
LOT
NO.
STB3NA291DQ
HIGH TEMP OP LIFE
1316
MAX3521ETP+
135°C
192
HRS
80
0
SAML3Q002BQ
HIGH TEMP OP LIFE
1316
MAX3521ETP+
135°C
192
HRS
30
0
SAML3Q002CQ
Total:
FAILURE RATE:
MTTF (YRS): 6251
QUANTITY: 180
FAILS: 0
0
FITS: 18.3
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