SPA™ Silicon Protection Array Products SP050xBA Lead-Free/Green Series HF

SPA™ Silicon Protection Array Products SP050xBA Lead-Free/Green Series HF
SPA™ Silicon Protection Array Products
Surface Mount TVS Avalanche Diode Array
HF
Pb GREEN
RoHS
SP050xBA Lead-Free/Green Series
Description
The surface mount family of arrays are designed to
suppress ESD and other transient overvoltage events.
These arrays are used to meet the International
Electrotechnical Compatibility (IEC transient immunity
standards IEC 61000-4-2 for Electrostatic Discharge
Requirements). The series are used to help protect
sensitive digital or analog input circuits on data, signal, or
control lines with voltage levels up to 5VDC.
The monolithic silicon arrays are comprised of specially
designed structures for transient voltage suppression(TVS).
The size and shape of these structures have be tailored
for transient protection. The low capacitance and clamp
voltage are ideal for high speed signal line protection.
Pinout
SP0502BAHTG
SP0502BAJTG
SP0503BAHTG
1
4
1
3
SP0504BAHTG
SP0504BAJTG
1
Features
5
t "O"SSBZPGPS574"WBMBODIF%JPEFTJOBVMUSB
small SC70, SOT-23, SOT-143, MSOP or TSSOP packages
t &4%$BQBCJMJUZ4UBOEBSET
2
- IEC 61000-4-2, Direct Discharge ........ 20kV (Level 4)
- IEC 61000-4-2, Air Discharge .............. 30kV (Level 4)
2
2
3
4
3
- MIL STD 883 3015.7 ..........................................30kV
t *OQVU1SPUFDUJPOGPS"QQMJDBUJPOT6QUP7%$
SP0505BAHTG
SP0505BAJTG
1
6
2
5
3
4
SP0504BAATG
8
7
6
5
t 'BTU3FTQPOTF5JNF ..................................................<1ns
SP0506BAATG
8
7
6
5
t -PX*OQVU$BQBDJUBODF...................................30pF Typical
t 0QFSBUJOH5FNQFSBUVSF3BOHF..................... -40ºC to 85ºC
Applications
t .PCJMFQIPOFIBOETFUT
1
2
3
4
1
2
3
t 1FSTPOBM%JHJUBM
Assistants (PDA)
4
t %JHJUBMTUJMMDBNFSBT
t 1PSUBCMFIBOEIFME
equipment (Laptop,
Palmtop computers)
SP050xBA Lead-Free/Green Series
72
t $PNQVUFSQPSULFZCPBSE
(USB1.1)
t %JHJUBMWJEFPDBNFSBT
t .1QMBZFST
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Surface Mount TVS Avalanche Diode Array
Absolute Maximum Ratings
Parameter
Storage Temperature Range
Package Power Dissipation
SC70
SOT23-3, SOT23-5, SOT23-6, SOT143
TSSOP, MSOP
Electrical Characteristics
Rating
-65 to + 150
Units
ºC
0.2
0.225
0.5
W
W
W
TA = +25ºC, Unless Otherwise Specified
Parameter
Reverse Standoff Voltage
Reverse Standoff Leakage Current
Test Conditions
Min
Typ
Max
Units
IR < = 1μA
-
-
5.5
V
1
100
nA
V = 5.0V
Signal Clamp Voltage
Positive
I = 10mA
5.6
6.8
8
V
Negative
I = 10mA
-1.2
-0.8
-0.4
V
Clamp Voltage during ESD
MIL-STD-883 Method 3015 (HBM) test
+ 8kV
12
V
- 8kV
-8
V
IEC-61000-2, Contact discharge
20
kV
MIL-STD-883 Method 3015 (HBM)
30
kV
Capacitance
2.5V @ 1Mhz
Turn on/off Time
30
pF
<1
ns
Temperature Range
Operating
-40
85
ºC
Storage
-65
150
ºC
Diode Dynamic Resistance
Forward Conduction
1.0
Ω
Reverse Conduction
1.4
Ω
Note:
(1) ESD voltage applied between channel pins and ground, one pin at a time; all other channel pins are open; all ground pins are grounded.
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
73
SP050xBA Lead-Free/Green Series
Lead-Free/Green SP050xBA
ESD Test Level (1)
SPA™ Silicon Protection Array Products
Surface Mount TVS Avalanche Diode Array
Typical Input VI Characteristics
Typical Diode Capacitance vs. Reverse Voltage
(Pulse-mode measurements, pulse width = 0.7 mS nominal)
60
1.6
1.4
1.2
Diode Capacitance (pF)
1.0
Input Current (A)
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
40
20
-0.8
-1.0
-1.2
-1.4
-1.6
0
-3
-2
-1
0
1
2
3
4
5
6
7
8
9
0
Input Voltage (V)
1
2
3
4
5
Diode Reverse Voltage (V)
Soldering Parameters - Wave Soldering
Reflow Condition
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
Pb – Free assembly
5°C/second max
5°C/second max
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
250+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
5°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
SP050xBA Lead-Free/Green Series
74
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Surface Mount TVS Avalanche Diode Array
Package Dimensions - SC70
B
Package
Pins
JEDEC
3
502
1
SP0502BAJTG - SC70-3
HE
E
2
e
A
A1
A2
B
c
D
E
e
HE
L
e
D
A2 A
A1
C
SC70-3
3
MO-203 Issue A
Millimeters
Inches
Min
Max
Min
Max
0.80
1.10
0.031
0.043
0.00
0.10
0.00
0.004
0.70
1.00
0.028
0.039
0.15
0.30
0.006
0.012
0.08
0.25
0.003
0.010
1.85
2.25
0.073
0.089
1.15
1.35
0.045
0.053
0.66 BSC
0.026 BSC
2.00
2.40
0.079
0.094
0.26
0.46
0.010
0.018
5
4
SP0504BAJTG - SC70-5
504
1
Package
Pins
JEDEC
e
e
E HE
A
A1
A2
B
c
D
E
e
HE
L
3
2
B
D
A2 A
A1
c
SC70-5
5
MO-203 Issue A
Millimeters
Inches
Min
Max
Min
Max
0.80
1.10
0.031
0.043
0.00
0.10
0.00
0.004
0.70
1.00
0.028
0.039
0.15
0.30
0.006
0.012
0.08
0.25
0.003
0.010
1.85
2.25
0.073
0.089
1.15
1.35
0.045
0.053
0.65 BSC
0.026 BSC
2.00
2.40
0.079
0.094
0.26
0.46
0.010
0.018
L
6
Package
Pins
JEDEC
e
e
5
SP0505BAJTG - SC70-6
4
505
E
Recommended Pad Layout
HE
A
A1
A2
B
c
D
E
e
HE
L
M
N
O
P
R
S
T
O (REF)
1
2
3
R
B
+
+
+
D
T
A2 A
+
P
S (REF)
A1
c
+
+
M (REF)
+
N (REF)
L
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
75
SC70-6
6
MO-203 Issue A
Millimeters
Inches
Min
Max
Min
Max
0.80
1.10
0.031
0.043
0.00
0.10
0.00
0.004
0.70
1.00
0.028
0.039
0.15
0.30
0.006
0.012
0.08
0.25
0.003
0.010
1.85
2.25
0.073
0.089
1.15
1.35
0.045
0.053
0.65 BSC
0.026 BSC
2.00
2.40
0.079
0.094
0.26
0.46
0.010
0.018
1.60
0.063
1.30
0.051
0.65
0.026
0.70
0.028
0.35
0.014
0.90
0.035
2.50
0.098
SP050xBA Lead-Free/Green Series
Lead-Free/Green SP050xBA
L
SPA™ Silicon Protection Array Products
Surface Mount TVS Avalanche Diode Array
Package Dimensions - SOT23
Package
Pins
JEDEC
b
3
SP0502BAHT - SOT23-3
502B
1
E1
E
Recommended Pad Layout
A
A1
b
c
D
E
E1
e
e1
L1
M
N
O
P
2
e
e1
M
D
P
A
A1
N
0
C
L1
e1
5
4
504B
1
Recommended Pad Layout
E1 E
A
A1
b
c
D
E
E1
e
e1
L1
M
N
O
P
3
2
B
M
D
A
P
A1
N
c
O
L1
e
5
505B
1
2
SP0505BAHTG - SOT23-6
4
E1
E
Recommended Pad Layout
A
A1
b
c
D
E
E1
e
e1
L1
M
N
O
P
3
b
M
D
A
P
A1
N
O
c
L1
SP050xBA Lead-Free/Green Series
76
Inches
Min
Max
0.035
0.044
0.0004
0.004
0.012
0.020
0.003
0.008
0.110
0.120
0.083
0.104
0.047
0.055
0.038 BSC
0.075 BSC
0.021 REF
.090
0.038
.030TYP
.030TYP
SOT23-5
5
MO-178
Millimeters
Min
Max
1.45
0
0.15
0.3
0.5
0.08
0.22
2.75
3.05
2.6
3.0
1.45
1.75
0.95 BSC
1.90 BSC
0.60 REF
2.59
0.95
0.69
0.99
Package
Pins
JEDEC
e1
6
Millimeters
Min
Max
0.89
1.12
0.01
0.1
0.3
0.5
0.08
0.2
2.8
3.04
2.1
2.64
1.2
1.4
0.95 BSC
1.90 BSC
0.54 REF
2.29
0.95
0.78
0.78
Package
Pins
JEDEC
SP0504BAHTG - SOT23-5
e
SOT23-3
3
TO-236
Inches
Min
Max
0.057
0
0.006
0.012
0.020
0.003
0.009
0.108
0.120
0.102
0.118
0.057
0.069
0.038 BSC
0.075 BSC
0.024 REF
.102
.038
.027TYP
.039TYP
SOT23-6
6
MO-178
Millimeters
Min
Max
1.45
0
0.15
0.3
0.5
0.08
0.22
2.75
3.05
2.6
3.0
1.45
1.75
0.95 BSC
1.90 BSC
0.60 REF
2.59
0.95
0.69
0.99
Inches
Min
Max
0.057
0
0.006
0.012
0.020
0.003
0.009
0.108
0.120
0.102
0.118
0.057
0.069
0.038 BSC
0.075 BSC
0.024 REF
.102
0.038
.027TYP
.039TYP
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
SPA™ Silicon Protection Array Products
Surface Mount TVS Avalanche Diode Array
Package Dimensions - SOT143
e
Package
Pins
JEDEC
SP0503BAHTG - SOT143-4
3
4
Recommended Pad Layout
503B
E1
E
A
A1
b
b2
c
D
E
E1
e
e1
L
L1
0.80 (.032")
1.00 (.040")
2
1
e1
1.40 (.055")
MAX
2.20
3.40 (.134")
(.087")
3.60 (.140")
REF
D
1.90
(.075")
1.70
(.067")
A
BSC
b2
A1
b
1.00 (.040")
1.20 (.048")
c
0.80 (.032")
1.00 (.040")
L
SOT143-4
4
TO-253
Millimeters
Min
Max
0.08
1.22
0.05
0.15
0.30
0.50
0.76
0.89
0.08
0.20
2.80
3.04
2.10
2.64
1.20
1.40
1.92 BSC
0.20 BSC
0.4
0.6
0.550 REF
Inches
Min
Max
0.003
0.048
0.002
0.006
0.012
0.020
0.030
0.035
0.003
0.008
0.110
0.120
0.082
0.104
0.047
0.055
0.076 BSC
0.008 BSC
0.016
0.024
0.022 REF
L1
Package Dimensions - TSSOP
SP0504BAATG - TSSOP-8
LF
504 BA
E
D
E
E1
A
A1
B
C
L1
L2
E1
A
A1
C
TSSOP-8
8
Millimeters
Min
Max
2.90
3.10
6.40 REF
4.29
4.50
1.194 REF
0.051
0.152
0.30
0.66
0.51
0.76
0.102
0.203
Inches
Min
Max
0.114
.122
.252 REF
.17
.18
.047 REF
.002
0.006
0.012TYP
TYP
.020
.030
.004
.008
B
L2
L1
Package Dimensions - MSOP
Package
Pins
D
SP0506BAATG - MSOP-8
LF
E
506 B
Recommended Pad Layout
E1
H
G
F1
F
A
A1
D
E
E1
A
A1
B
C
L1
L2
F
F1
G
H
I
I
B
L1
C
L2
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
77
MSOP-8
8
Millimeters
Min
Max
2.90
3.10
4.78
4.98
2.90
3.10
0.87
1.17
0.05
0.25
0.30TYP
0.65TYP
0.52
0.54
0.18TYP
5.28
4.24
0.65
0.38
1.04
Inches
Min
0.114
.188
.114
.034
.002
0.020
-
Max
.122
.196
.122
.046
0.010
0.012TYP
0.026TYP
0.021
.007TYP
.208
.167
0.026
.015
.041
SP050xBA Lead-Free/Green Series
Lead-Free/Green SP050xBA
Package
Pins
D
SPA™ Silicon Protection Array Products
Surface Mount TVS Avalanche Diode Array
Part Numbering System
Product Characteristics
SP0502 BAHT G
Blank = NOT Green/RoHS/Lead Free*
G= Green/RoHS/Lead Free Product
Silicon
Protection
Array
Series
T= Tape & Reel
Package
BAA = MSOP-8 or TSSOP-8, 2500 qty
BAH = SOT23-3, -5, -6 or
SOT143-4, 3000 qty
BAJ = SC70-3, -5 or -6, 3000 qty
Number of Channels
02 = 2 channel (SC70-3, SOT23 packages)
03 = 3 channel (SOT143 package)
04 = 4 channel (SC70-5, SOT23-5, TSSOP-8 packages)
05 = 5 channel (SC70-6, SOT23-6 packages)
06 = 6 channel (MSOP-8 package)
Lead Plating
“G” Green version - Matte Tin (Sn);
*Non-Green version - Tin Lead
Lead Material
Copper Alloy
Lead Coplanarity
0.004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
Notes:
1. All dimensions are in millimeters.
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-203 ISSUE A.
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Ordering Information
*NOTE: To order NON-Green/RoHS/Lead Free version of product, remove “G” at the end of part number.
Part Number
CH
Package Type
Quantity Per Reel
SP0502BAHTG
2
SOT23-3
3000
SP0503BAHTG
3
SOT143-4
3000
SP0504BAHTG
4
SOT23-5
3000
SP0505BAHTG
5
SOT23-6
3000
SP0504BAATG
4
TSSOP-8
3000
SP0506BAATG
6
MSOP-8
4000
SP0502BAJTG
2
SC70-3
3000
SP0504BAJTG
4
SC70-5
3000
SP0505BAJTG
5
SC70-6
3000
SP050xBA Lead-Free/Green Series
78
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
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