MAX14626

MAX14626
 MAX14626
RELIABILITY REPORT
FOR
MAX14626ETT+T
PLASTIC ENCAPSULATED DEVICES
June 7, 2013
MAXIM INTEGRATED
160 RIO ROBLES
SAN JOSE, CA 95134
Approved by
Maxim Integrated. All rights reserved.
Richard Aburano
Quality Assurance
Manager, Reliability Engineering
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MAX14626
Conclusion
The MAX14626ETT+T successfully meets the quality and reliability standards required of all Maxim Integrated products. In addition,
Maxim Integrated's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim Integrated's quality
and reliability standards.
Table of Contents
I. ........Device Description
IV. .......Die Information
II. ........Manufacturing Information
V. ........Quality Assurance Information
III. .......Packaging Information
VI. .......Reliability Evaluation
.....Attachments
I. Device Description
A. General
The MAX14626 current loop protector features a current-limit switch to prevent damage to the analog input module from sensor failure. The currentlimit switch features a 25Ω (typ) on-resistance and operates from a +2.3V to +36V input voltage range. The accurate current limit is set to 30mA,
making the part ideal for protecting the sensor reading devices. The MAX14626 handles an overcurrent event in a continuous current-limit mode.
Additional safety features include thermal shutdown to prevent overheating and reverse-input blocking to protect from being reverse connected into
the sensor. The device is available in a tiny 6-pin (3mm x 3mm), TDFN exposed pad package and is specified over the -40°C to +85°C extended
temperature range.
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MAX14626
II. Manufacturing Information
A. Description/Function:
High-Voltage Reverse-Input-Capable 4â€"20mA Current Loop Protector
B. Process:
S18
C. Number of Device Transistors:
3272
D. Fabrication Location:
USA
E. Assembly Location:
Taiwan and Thailand
F. Date of Initial Production:
March 30, 2012
III. Packaging Information
A. Package Type:
6-pin TDFN 3x3
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive
E. Bondwire:
Au (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-4868
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
55°C/W
K. Single Layer Theta Jc:
9°C/W
L. Multi Layer Theta Ja:
42°C/W
M. Multi Layer Theta Jc:
9°C/W
IV. Die Information
A. Dimensions:
25.5905X37.7953 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
0.23 microns (as drawn)
F. Minimum Metal Spacing:
0.23 microns (as drawn)
G. Bondpad Dimensions:
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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Page 3
MAX14626
V. Quality Assurance Information
A. Quality Assurance Contacts:
Richard Aburano (Manager, Reliability Engineering)
Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Vice President of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
= = 22.9 x 10
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 48 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim Integrated's reliability monitor program. Maxim Integrated
performs quarterly life test monitors on its processes. This data is published in the Reliability Report found at
http://www.maximintegrated.com/qa/reliability/monitor. Cumulative monitor data for the S18 Process results in a FIT Rate of 0.05 @
25C and 0.93 @ 55C (0.8 eV, 60% UCL)
B. E.S.D. and Latch-Up Testing (lot SACV9Q001C, D/C 1152)
The AL43-0 die type has been found to have all pins able to withstand a HBM transient pulse of +/- 2500V per
JEDEC JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/- 100mA and overvoltage
per JEDEC JESD78.
Maxim Integrated. All rights reserved.
Page 4
MAX14626
Table 1
Reliability Evaluation Test Results
MAX14626ETT+T
TEST ITEM
TEST CONDITION
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
COMMENTS
DC Parameters
& functionality
48
0
SACV9Q001C, D/C 1152
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Note 1: Life Test Data may represent plastic DIP qualification lots.
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