MAX8725

MAX8725
MAX8725ETI
RELIABILITY REPORT
FOR
MAX8725ETI
(MAX1909/MAX8725)
PLASTIC ENCAPSULATED DEVICES
February 2, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX8725ETI
Conclusion
The MAX8725ETI successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX1909/MAX8725 highly integrated control ICs simplify construction of accurate and efficient multichemistry battery chargers. The
MAX1909/MAX8725 use analog inputs to control charge current and voltage, and can be programmed by a host microcontroller (µC) or hardwired.
High efficiency is achieved through use of buck topology with synchronous rectification. The maximum current drawn from the AC adapter is
programmable to avoid overloading the AC adapter when supplying the load and the battery charger simultaneously. The MAX1909/MAX8725 provide
a digital output that indicates the presence of an AC adapter, and an analog output that monitors the current drawn from the AC adapter. Based on the
presence or absence of the AC adapter, the MAX1909/MAX8725 automatically select the appropriate source for supplying power to the system by
controlling two external p-channel MOSFETs. Under system control, the MAX1909/MAX8725 allow the battery to undergo a relearning or conditioning
cycle in which the battery is completely discharged through the system load and then recharged. The MAX1909 includes a conditioning charge
feature while the MAX8725 does not. The MAX1909/MAX8725 are available in space-saving 28-pin, 5mm x 5mm thin QFN packages and operate
over the extended -40°C to +85°C temperature range. The MAX1909/MAX8725 are now available in lead-free packages.
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MAX8725ETI
II. Manufacturing Information
A. Description/Function:
Multichemistry Battery Chargers with Automatic System Power Selector
B. Process:
B12
C. Number of Device Transistors:
D. Fabrication Location:
Oregon
E. Assembly Location:
ASAT China, UTL Thailand, Unisem Malalysia
F. Date of Initial Production:
April 22, 2004
III. Packaging Information
A. Package Type:
28-pin TQFN 5x5
B. Lead Frame:
Copper
C. Lead Finish:
85Sn/15Pb plate D.
Die Attach:
Conductive Epoxy
E. Bondwire:
Gold (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-0069
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
47°C/W
K. Single Layer Theta Jc:
2.1°C/W
L. Multi Layer Theta Ja:
29°C/W
M. Multi Layer Theta Jc:
2.1°C/W
IV. Die Information
A. Dimensions:
114 X 117 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
1.2 microns (as drawn)
F. Minimum Metal Spacing:
1.2 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX8725ETI
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1 Using these results, the Failure Rate ( ) is calculated as
follows:
=
1
MTTF
=
1.83
192 x 4340 x 144 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 7.5 x 10
= 7.5 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000
hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/.
Current monitor data for the B12 Process results in a FIT Rate of 3.13 @ 25C and 54.16 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The PD16-1 die type has been found to have all pins able to withstand a HBM transient pulse of +/-500 V per JEDEC
JESD22-A114-D. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
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MAX8725ETI
Table 1
Reliability Evaluation Test Results
MAX8725ETI
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
144
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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