cert RoHS 03

cert RoHS 03
No. T08-E-70603
March 26, 2008
To: BYD COMPANY LIMITED.
TOREX No.
T08-E-70603
2008/3/26
TOREX Semiconductor Device HK Ltd.
TOREX Semiconductor Ltd.
Composition Table
Product(Pb-free):
Typical Mass:
Part name
IC chip
XC6219BxxxMR
15
mg
Weight(mg)
Material name
0.666 Silicon
- Arsenic
Leadframe
5.503
0.022
0.021
0.024
0.325
Die attach adhesive
CAS number
7440-21-3
7440-38-2
366800
1500
1400
1600
21700
7440-50-8
7440-31-5
7440-66-6
7440-47-3
7440-22-4
0.009 Epoxy
0.049 Silver
600
3200
7440-22-4
Bonding wire
0.050 Gold
3300
7440-57-5
Molding compound
6.062
0.973
0.507
0.118
0.285
0.047
404100
64900
33800
7900
19000
3200
60676-86-0
1309-64-4
-
Plating (1)
0.007 Bismuth
0.333 Tin
0.340 Tin
500
22200
22700
7440-69-9
7440-31-5
7440-31-5
Plating (2)
Plating (3)
Copper
Tin
Zinc
Chromium
Silver
Ratio(ppm)
44400
2
Silica
Epoxy resin
Phenol resin
Antimony trioxide
Brominated resin
Organic phosphorus
0.012 Silver
800
7440-22-4
0.328 Tin
21900
7440-31-5
*The mass of the IC and its fractions could be different due to the manufacturing
conditions of materials.
*Any indication "-" in CAS number means "confidential."
*If more than one termination plating types are listed, the composition is either (1), (2), or (3).
No. T08-E-70603
No. T08-E-70603
No. T08-E-70603
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