SM712 Series 600W Asymmetrical TVS Diode Array TVS Diode Arrays (SPA

SM712 Series 600W Asymmetrical TVS Diode Array TVS Diode Arrays (SPA
TVS Diode Arrays (SPA® Diodes)
Diodes)
General Purpose ESD Protection - SM712
SM712 Series 600W Asymmetrical TVS Diode Array
RoHS
Pb GREEN
Description
The SM712 TVS Diode Array is designed to protect RS-485
applications with asymmetrical working voltages (-7V to
12V) from damage due to electrostatic discharge (ESD),
electrical fast transients (EFT), and lightning induced surges.
The SM712 can absorb repetitive ESD strikes above the
maximum level specified in the IEC61000-4-2 international
standard without performance degradation and safely
dissipate up to 19A of 8/20us induced surge current (IEC61000-4-5) with very low clamping voltages.
Pinout and Functional Block Diagram
2
Features
1
12V
12V
7V
7V
• ESD, IEC61000-4-2,
±30kV contact, ±30kV air
• Working Voltages: -7V to
12V
• EFT, IEC61000-4-4, 50A
(5/50ns)
• Low clamping voltage
• Lightning, IEC61000-4-5,
19A (tP=8/20μs)
• AEC-Q101 Qualified
• Low leakage current
Applications
3
• RS-485
• Security Systems
• Fieldbus
• Modbus
• Automated Teller Machines
(ATMs)
Life Support Note:
• Profibus
• Automation Equipments
Not Intended for Use in Life Support or Life Saving Applications
• DMX512
• Communication
Equipments
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RS-485 Application Example
RS-485 Port
Receiver
A
B
IC
SM712
GND
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/09/14
TVS Diode Arrays (SPA®®Diodes)
Diodes)
General Purpose ESD Protection - SM712
Absolute Maximum Ratings
Value
Units
PPk
Symbol
Peak Pulse Power (tp=8/20μs)
Parameter
600
W
IPP
Peak Pulse Current (tp=8/20μs)
19
A
TOP
Operating Temperature
-40 to 125
°C
TSTOR
Storage Temperature
-55 to 150
°C
Notes:
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated
in the operational sections of this specification is not implied.
Thermal Information
Parameter
Rating
Units
-55 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 20-40s)
260
°C
Storage Temperature Range
SM712 Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Reverse Standoff Voltage
Test Conditions
VRWM
Reverse Breakdown
Voltage
IR=1mA, Pin3 to Pin1 or Pin2
7.5
IR=1mA, Pin1 or Pin2 to Pin3
13.3
VC
Dynamic Resistance
RDYN
ESD Withstand Voltage1
VESD
1
Units
7.0
V
12.0
V
V
V
20
μA
μA
VR=12V
1
IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3
19
V
IPP=1A, tp=8/20µs, Pin 3 to Pin 1 or Pin 2
11
V
IPP=19A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3
31
V
IPP=19A, tp=8/20µs, Pin 3 to Pin 1 or Pin 2
19
V
(VC2 - VC1) / (IPP2 - IPP1)
0.5
Ω
IEC61000-4-2 (Contact Discharge)
±30
kV
IEC61000-4-2 (Air Discharge)
±30
kV
Reverse Bias=0V, f=1MHz;
Pin 1 or Pin2 to Pin 3
CI/O-GND
Diode Capacitance1
Max
VR=7V
ILEAK
Clamp Voltage1
Typ
IR≤1μA, Pin1 or Pin2 to Pin3
VR
Leakage Current
Min
IR≤1μA, Pin3 to Pin1 or Pin2
75
pF
Notes : 1. Parameter is guaranteed by design and/or device characterization.
Clamping Voltage vs. IPP
80
35
70
30
Clamp Voltage (VC )
Capacitance (pF)
Capacitance vs. Reverse Bias
60
50
40
30
20
Pin 1 or Pin 2 to Pin 3
20
15
Pin 3 to Pin 1 or Pin 2
10
10
0
25
5
0
2
4
6
Bias Voltage (V)
8
10
12
0
0
2
4
6
8
10
12
14
16
18
20
Peak Pulse Current-IPP (A)
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/09/14
TVS Diode Arrays (SPA® Diodes)
Diodes)
General Purpose ESD Protection - SM712
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
10
90
% of Rated Power I PP
Peak Pulse Power - P
pk (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
1000
Pulse Duration - t p (µs)
Pulse Waveform
0
25
50
75
100
125
150
Ambient Temperature - T A (oC)
Product Characteristics
110%
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substrate material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
100%
90%
Percent of IPP
80%
70%
60%
50%
40%
30%
20%
10%
0%
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Time (μs)
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL)
to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/09/14
tP
TP
Temperature
Reflow Condition
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
tS
time to peak temperature
Time
TVS Diode Arrays (SPA®®Diodes)
Diodes)
General Purpose ESD Protection - SM712
Part Marking System
Part Numbering System
SM 712 – 02 H T G
TVS Diode Arrays
(SPA® Diodes)
Series
Working
Voltage
712
G= Green
T= Tape & Reel
Package
H: SOT23-3
Number of
Channels
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SM712-02HTG
SOT23-3
712
3000
Package Dimensions — SOT23-3
Package
Pins
JEDEC
b
3
502B
1
E1
E
Recommended Pad Layout
2
e
P
e1
D
A
M
P
A1
C
N
L1
0
0
A
A1
b
c
D
E
E1
e
e1
L1
M
N
O
P
M
N
SOT23-3
3
TO-236
Millimeters
Min
Max
0.89
1.12
0.01
0.1
0.3
0.5
0.08
0.2
2.8
3.04
2.1
2.64
1.2
1.4
0.95 BSC
1.90 BSC
0.54 REF
2.29
0.95
0.78
0.78
Inches
Min
Max
0.035
0.044
0.0004
0.004
0.012
0.020
0.003
0.008
0.110
0.120
0.083
0.104
0.047
0.055
0.038 BSC
0.075 BSC
0.021 REF
.090
0.038
.030TYP
.030TYP
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/09/14
TVS Diode Arrays (SPA® Diodes)
Diodes)
General Purpose ESD Protection - SM712
Embossed Carrier Tape & Reel Specification — SOT23-3
Symbol
8mm TAPE AND REEL
GENERAL INFORMATION
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
ACCESS HOLE
14.4mm
SOT23-3 (8mm POCKET PITCH)
13mm
180mm
60mm
USER DIRECTION OF FEED
PIN 1
8.4mm
COVER TAPE
© 2014 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/09/14
Millimetres
Inches
Min
Max
Min
Max
E
1.65
1.85
0.065
0.073
F
3.40
3.60
0.134
0.142
P2
1.90
2.10
0.075
0.083
D
1.40
1.60
0.055
0.063
P0
3.90
4.10
0.154
0.161
W
7.70
8.30
0.303
0.327
P
3.90
4.10
0.154
0.161
A0
3.05
3.25
0.120
0.128
B0
2.67
2.87
0.105
0.113
K0
1.12
1.32
0.044
0.052
t
0.22
0.24
0.009
0.009
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