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STR-X6757
Off-Line Quasi-Resonant Switching Regulators
Features and Benefits
Quasi-resonant topology IC
Low EMI noise and soft switching
Bottom-skip mode
Improved system efficiency over the entire output load by avoiding increase of switching frequency
Auto-Standby mode
Lowers input power at very light output load condition
Avalanche-guaranteed MOSFET
Improves system-level reliability and does not require V
DSS
derating
650 V
DSS
/ 0.62 R
DS(on)
Various protections
Improved system-level reliability
Pulse-by-pulse drain overcurrent limiting
Overvoltage Protection (bias winding voltage sensing), with latch
Overload Protection with latch
Maximum on-time limit
Package: 7-Pin TO-3P
Description
The STR-X6757 is a quasi-resonant topology IC designed for
SMPS applications. It shows lower EMI noise characteristics than conventional PWM solutions, especially at greater than
2 MHz. It also provides a soft-switching mode to turn on the internal MOSFET at close to zero voltage (V
DS
bottom point) by use of the resonant characteristic of primary inductance and a resonant capacitor.
The package is a fully molded TO-3P, which contains the controller chip (MIC) and MOSFET, enabling output power up to 320 W at 230 VAC and 165 W at universal input. The bottom-skip mode skips the first bottom of V
DS
and turns on the
MOSFET at the second bottom point, to minimize an increase of operating frequency at light output load, improving systemlevel efficiency over the entire load range.
There are two standby modes available to reduce the input power under very light load conditions. The first is Auto-Standby mode, which is internally triggered by periodic sensing, and the other is a manual standby mode, which is executed by clamping the secondary output. In general applications, the manual standby mode reduces the input power further compared to Auto-Standby mode.
Continued on the next page…
Not to scale
Typical Application
STRX6757DS
SANKEN ELECTRIC CO., LTD.
http://www.sanken-ele.co.jp/en/
STR-X6757 Off-Line Quasi-Resonant Switching Regulators
Description (continued)
The soft-start mode minimizes surge voltage and reduces power stress to the MOSFET and to the secondary rectifying diodes during the start-up sequence. Various protections such as overvoltage, overload, overcurrent, maximum on-time protections and avalanche-energyguaranteed MOSFET secure good system-level reliability.
Applications include the following:
Set Top Box
LCD PC monitor, LCD TV
Printer, Scanner
SMPS power supplies
Selection Guide
Part Number
STR-X6757
Package
TO-3P
Absolute Maximum Ratings at T
A
= 25°C
Drain Current 1
Parameter
Maximum Switching Current
OCP/BD Terminal Voltage
MOSFET Power Dissipation
2
Single Pulse Avalanche Energy 3
Input Voltage for Controller (MIC)
SS/OLP Terminal Voltage
FB Terminal Inflow Current
FB Terminal Voltage
4
Symbol Conditions
I
D peak Single pulse
I
Dmax
T
A
= –20°C to 125°C
E
AS
V
CC
Single pulse, V
DD
= 30 V, L = 50 mH, I
Lpeak
= 3.53 A
V
SSOLP
I
FB
V
FB
V
OCPBD
I
FB
within the limits of I
FB
With infinite heatsink
P
D1
Without heatsink
Controller (MIC) Power Dissipation
Operating Internal Leadframe Temperature
Operating Ambient Temperature
Storage Temperature
P
D2
T
F
T
OP
T stg
V
CC
× I
CC
Recommended operation temperature, see cautions
Channel Temperature T ch
1 Refer to MOSFET ASO curve
2 I
DMAX
is the drain current determined by the drive voltage of the IC and the threshold voltage, V th
, of the MOSFET
3 Refer to Avalanche Energy Derating curve
4 Refer to MOSFET Ta-PD1 curve
Rating
18
18
326
35
–0.5 to 6.0
10
–0.5 to 9.0
–1.5 to 5.0
44
2.8
0.8
–20 to 125
–20 to 125
–40 to 125
150
°C
°C
°C
°C
V
W
W
W
Unit
A
A mJ
V
V mA
V
All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature, T
A
, of 25°C, unless oth er wise stated.
STRX6757DS
SANKEN ELECTRIC CO., LTD.
2
STR-X6757
Functional
Block Diagram
Off-Line Quasi-Resonant Switching Regulators
Terminal List Table
Number Name
1
2
3
4
5
6
7
D
S
GND
VCC
SS/OLP
FB
OCP/BD
Description
Drain
Source
Ground terminal
MOSFET drain
MOSFET source
Ground
Functions
Power supply terminal
Soft Start/Overload Protection terminal
Input of power supply for control circuit
Input to set delay for Overload Protection and Soft Start operation
Feedback terminal
Input for Constant Voltage Control and Burst (intermittent) Mode oscillation control signals
Overcurrent Protection/Bottom Detection Input for Overcurrent Detection and Bottom Detection signals
STRX6757DS
SANKEN ELECTRIC CO., LTD.
3
STR-X6757 Off-Line Quasi-Resonant Switching Regulators
80
60
40
STR-X6757
A.S.O. tempera ture dera ting coefficient curve
100
20
0
0 20 40 60 80 100 120
T
F
[ ]
Interna l fra me tempera ture
10
1
STR-X6757
MOSFET A.S.O. Curve
100
Determined by On-Resistance
1ms
100 s
STR-X6757
Ava la nche energy dera ting curve
100
80
60
40
20
0
25 50 75 100 125
Tch [ ]
Cha nnel tempera ture
150
0.1
Apply A.S.O temperature coefficient from the left graph to this curve for evaluating actual operations' safety
0.01
1 10 100
V
DS
[V]
Drain-to-Source Voltage
1000
4
STRX6757DS
SANKEN ELECTRIC CO., LTD.
STR-X6757 Off-Line Quasi-Resonant Switching Regulators
STRX6757DS
35
30
25
STR-X6757
MOSFET Ta -P
D1
Curve
50
45
40
P D1 =44[W]
With infinite heatsink
20
15
10
5
Without heatsink
P D1 =2.8[W]
0
0 20 40 60 80 100 120 140
Ta [ ]
Ambient tempera ture
1
STR-X6757
MIC T
F
-P
D2
Curve
0.8
0.6
0.4
0.2
0
0 20 40 60 80 100 120 140
T
F
Internal frame temperature
STR-X6757
Transient thermal resistance curve
1
0.1
0.01
0.001
1.0E-06 1.0E-05 1.0E-04 t [sec] time
1.0E-03 1.0E-02 1.0E-01
SANKEN ELECTRIC CO., LTD.
5
STR-X6757 Off-Line Quasi-Resonant Switching Regulators
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Test Conditions Min.
Typ.
ELECTRICAL CHARACTERISTICS for Controller (MIC) 1 , valid at T
A
= 25°C, V
CC
= 20 V, unless otherwise specified
Power Supply Start-up Operation
Operation Start Voltage
Operation Stop Voltage
Circuit Current In Operation
Circuit Current In Non-Operation
Oscillation Frequency
Soft Start Operation Stop Voltage
Soft Start Operation Charging Current
V
V
CC(ON)
CC(OFF)
I
CC(ON)
I
CC(OFF) f osc
V
SSOLP(SS)
I
SSOLP(SS)
V
CC
= 0 20 V
V
CC
= 20 8.8 V
V
V
V
CC
= 15 V
SS/OLP
SS/OLP
increasing
= 0 V
16.3
8.8
–
–
19
1.1
–710
18.2
9.7
–
–
22
1.2
–550
Normal Operation
Bottom-Skip Operation Threshold Voltage 1
Bottom-Skip Operation Threshold Voltage 2
Overcurrent Detection Threshold Voltage
OCP/BD Terminal Outflow Current
Quasi-Resonant Operation Threshold Voltage 1
Quasi-Resonant Operation Threshold Voltage 2
FB Terminal Threshold Voltage
FB Terminal Inflow Current (Normal Operation)
V
OCPBD(BS1)
V
OCPBD(BS2)
V
OCPBD(LIM)
I
OCPBD
V
OCPBD(TH1)
V
OCP/BD
falling
V
OCP/BD
= –0.95 V
V
OCP/BD
falling
V
OCPBD(TH2)
V
FB(OFF)
I
FB(ON)
V
OCP/BD
rising
V
FB
rising
V
FB
= 1.6 V
–0.720
–0.485
–0.995
–250
0.28
0.67
1.32
600
–0.665
–0.435
–0.940
–100
0.40
0.80
1.45
1000
Max.
19.9
10.6
6
100
25
1.4
–390
–0.605
–0.385
–0.895
–40
0.52
0.93
1.58
1400
Units
V
V
V
V
V
μA
V
V
V
μA mA
μA kHz
V
μA
Standby Operation
Standby Operation Start Voltage
Standby Operation Start Voltage Interval
Standby Non-Operation Circuit Current
FB Terminal Inflow Current, Standby Operation
FB Terminal Threshold Voltage, Standby Operation
Minimum On Time t
V
CC(S)
V
I
CC(SK)
CC(S)
I
FB(S)
V
FB(S)
ON(MIN)
V
CC
V
CC
V
CC
V
CC
= 0 15 V, V
FB
V
CC(SK)
= V
CC(S)
– V
= 10.2 V, V
FB
= 10.2 V, V
FB
= 15 V, V
FB
= 1.6 V
CC(OFF)
= 1.6 V
= 1.6 V
rising
10.3
1.10
–
–
0.55
0.65
11.2
1.35
20
4
1.10
1.00
12.1
1.65
56
14
1.50
1.35
V
Protection Operation
Maximum On Time
Overload Protection Operation Threshold Voltage
Overload Protection Operation Charging Current
Overvoltage Protection Operation Voltage
Latch Circuit Holding Current
Latch Circuit Release Voltage
2
2 t
ON(MAX)
V
SSOLP(OLP)
I
SSOLP(OLP)
V
CC(OVP)
I
CC(H)
V
CC(La.OFF)
V
SS/OLP
= 2.5 V
V
CC
= 0 30 V
V
CC(OFF)
– 0.3 V
V
CC
= 30 6 V, OVP operating
27.5
4.0
–16
25.5
–
6.0
32.5
4.9
–11
27.7
45
7.2
39.0
5.8
–6
29.9
140
8.5
ELECTRICAL CHARACTERISTICS for MOSFET , valid at T
A
= 25°C, unless otherwise specified
Drain-to-Source Breakdown Voltage
Drain Leakage Current
On Resistance R
V
I
DSS
DSS
DS(on)
I
DSS
= 300
μA
V
DSSS
= 650 V
I
DS
= 3.4 A
650
–
–
–
–
–
–
300
0.62
Switching Time
Thermal Resistance t f
R ch-F
Channel to internal frame
–
–
–
–
500
1.09
°C/W
1 Current polarity with respect to the IC: positive current indicates current sink at the terminal named, negative current indicates source at the terminal named.
2 The latch circuit means a circuit operated OVP and OLP.
V
μA
Ω ns
μs
V
μA
V
μA
V
V
μA
μA
V
μs
6
STRX6757DS
SANKEN ELECTRIC CO., LTD.
STR-X6757 Off-Line Quasi-Resonant Switching Regulators
Gate Burr
15.6 ±0.2
6
Package Outline Drawing, TO-3P
5.5±0.2
3.45±0.2
Branding
Area
XXXXXXXX
XXXXXXXX
XXXXXXXX
3.35±0.1
0.55
+0.2
–0.1
View A
2X 2.54±0.1
4X 1.27±0.1
Terminal dimension at lead tip
1
2 3
4
5 7
6
4.3 ±0.5
3.6 ±0.5
Terminal dimension at lead tip
1.33
+0.2
–0.1
2X 0.83
+0.2
–0.1
1.89
+0.2
–0.1
Enlargement View A
5X 0.75
+0.2
–0.1
5X 0.65
+0.2
–0.1
0.5
0.5
Front View (Plan View)
Gate burr: 0.3 mm (max.)
Terminal core material: Cu
Drawing for reference only
Branding codes (exact appearance at manufacturer discretion):
Terminal treatment: Ni plating and Pb-free solder dip
Leadform: 1905
Approximate weight: 6 g
Dimensions in millimeters
1st line, type: STR
2nd line, subtype: X6757
3rd line, lot: YM DD
Where: Y is the last digit of the year of manufacture
M is the month ( 1 to 9, O, N, D )
DD is the 2-digit date
Leadframe plating Pb-free. Device composition includes high-temperature solder (Pb >85%), which is exempted from the RoHS directive.
STRX6757DS
SANKEN ELECTRIC CO., LTD.
7
STR-X6757 Off-Line Quasi-Resonant Switching Regulators
Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions.
Cautions for Storage
• Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40% to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
• Avoid locations where dust or harmful gases are present and avoid direct sunlight.
• Reinspect for rust on leads and solderability of the products that have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are within the ratings specified by Sanken for the products.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce excess stress.
• Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. Silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsink.
Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below:
Type
G746
YG6260
SC102
Suppliers
Shin-Etsu Chemical Co., Ltd.
Momentive Performance Materials Inc.
Dow Corning Toray Co., Ltd.
Cautions for Mounting to a Heatsink
• When the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has an extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque. For mounting the products, the mounting surface flatness should be 0.05 mm or less.
• Please select suitable screws for the product shape. Do not use a flat-head machine screw because of the stress to the products. Self-tapping screws are not recommended. When using self-tapping screws, the screw may enter the hole diagonally, not vertically, depending on the conditions of hole before threading or the work situation. That may stress the products and may cause failures.
• Recommended screw torque: 0.588 to 0.785 N m (6 to 8 kgf cm).
• For tightening screws, if a tightening tool (such as a driver) hits the products, the package may crack, and internal stress fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure.
Tightening with an air driver makes a substantial impact.
In addition, a screw torque higher than the set torque can be applied and the package may be damaged. Therefore, an electric driver is recommended.
When the package is tightened at two or more places, first pre-tighten with a lower torque at all places, then tighten with the specified torque. When using a power driver, torque control is mandatory.
Soldering
• When soldering the products, please be sure to minimize the working time, within the following limits:
260±5°C 10±1 s (Flow, 2 times)
380±10°C 3.5±0.5 s (Soldering iron, 1 time)
• Soldering should be at a distance of at least 2.0 mm from the body of the products.
Electrostatic Discharge
• When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1 M
Ω of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator.
• Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats.
• When using measuring equipment such as a curve tracer, the equipment should be grounded.
• When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products.
• The products should always be stored and transported in
Sanken shipping containers or conductive containers, or be wrapped in aluminum foil.
8
STRX6757DS
SANKEN ELECTRIC CO., LTD.
STR-X6757 Off-Line Quasi-Resonant Switching Regulators
• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use.
• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use.
• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction.
• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly.
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribution network.
• The contents in this document must not be transcribed or copied without Sanken's written consent.
9
STRX6757DS
SANKEN ELECTRIC CO., LTD.
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