ASML PAS 5500 User Manual
ASML PAS 5500 is a powerful stepper that offers high-precision lithography for semiconductor manufacturing. With a resolution of 350nm and a variable numerical aperture of 0.48-0.60, it enables the creation of intricate patterns on silicon wafers. Its overlay accuracy of better than 50nm ensures precise alignment of multiple layers, resulting in high-quality integrated circuits.
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R·I·T Title: ASML Stepper
Semiconductor & Microsystems
Fabrication Laboratory Revision: B Rev Date: 12/21/2010
Approved by:
/ / / /
Process Engineer Equipment Engineer
RIT SMFL Page 1 of 11
1 SCOPE
The purpose of this document is to detail the use of the ASML PAS 5500 Stepper. All users are expected
to have read and understood this document. It is not a substitute for in-person training on the system and
is not sufficient to qualify a user on the system. Failure to follow guidelines in this document may result
in loss of privileges.
2 REFERENCE DOCUMENTS
Batch Control PAS 5500 Training Module
Reticle Design Manual
PAS 5500 User Guide
PAS 5500 Job Definition
PAS Global Alignment Strategies
PAS 5500 Steppers up to and including /300 Stepper Introduction
3 DEFINITIONS
n/a
4 TOOLS AND MATERIALS
4.1 General Description - The ASML PAS 5500/200 is a 5x reduction, i-line stepper set up for
exposure of 6 inch wafers using 6 inch reticles. The system has 350nm resolution with a
0.48-0.60 variable numerical aperture. The maximum field size on the wafer is 22x22mm.
Overlay capability is better than 50nm. All lithography levels for a particular design are
included in a single stepper job.
Semiconductor & Microsystems
Fabrication Laboratory Revision: B Rev Date: 12/21/2010
Approved by:
/ / / /
Process Engineer Equipment Engineer
RIT SMFL Page 1 of 11
1 SCOPE
The purpose of this document is to detail the use of the ASML PAS 5500 Stepper. All users are expected
to have read and understood this document. It is not a substitute for in-person training on the system and
is not sufficient to qualify a user on the system. Failure to follow guidelines in this document may result
in loss of privileges.
2 REFERENCE DOCUMENTS
Batch Control PAS 5500 Training Module
Reticle Design Manual
PAS 5500 User Guide
PAS 5500 Job Definition
PAS Global Alignment Strategies
PAS 5500 Steppers up to and including /300 Stepper Introduction
3 DEFINITIONS
n/a
4 TOOLS AND MATERIALS
4.1 General Description - The ASML PAS 5500/200 is a 5x reduction, i-line stepper set up for
exposure of 6 inch wafers using 6 inch reticles. The system has 350nm resolution with a
0.48-0.60 variable numerical aperture. The maximum field size on the wafer is 22x22mm.
Overlay capability is better than 50nm. All lithography levels for a particular design are
included in a single stepper job.
R·I·T Title: ASML Stepper
Semiconductor & Microsystems
Fabrication Laboratory Revision: B Rev Date: 12/21/2010
RIT SMFL Page 2 of 11
← Reticle Pre-Alignment Marks
← Reticle Barcode
← Reticle Alignment Marks
4.2 Reticle Bar Code – The reticle barcode is read as the reticle is removed from the reticle
carrier. Reticle bar code information is specified in the stepper job.
4.3 Reticle Pre-Alignment Marks – Two Pre-alignment Marks are located 135.5mm apart near
the corners of the reticle. They are used to pre-align the reticle to the reticle table.
4.4 Reticle Alignment Marks - Two Reticle Alignment Marks, M1 and M2, are located 139mm
apart near the left and right edges of the reticle. After the reticle is pre-aligned on the reticle
table, the Reticle Alignment Marks are aligned to the permanent fiducial marks F1 and F2,
located on the fiducial plate on the wafer table.
4.5 Wafer Zero Level – The ASML Stepper utilizes zero level marks that are patterned and
etched into the wafer before any other steps. An etch depth of 1200A +/- 10% allows the
stepper to recognize the marks. It is possible to pattern the zero level at the same time as the
first level, but overlay accuracy will be reduced since the first level is not aligned to the zero
level. This is because the zero level is defined by a separate reticle.
4.6 Wafer Global Alignment - The wafer alignment marks W1, W2, etc, are exposed on the
zero layer and etched into the wafer. Two of these marks are sufficient but up to 25 may be
used on a single wafer. If more than two marks are used, the stepper will find a best
alignment and expose all die using the same settings. The stepper uses through the lens
alignment of the wafer and the reticle.
* * |||||||||||||||
RIT RIT
Semiconductor & Microsystems
Fabrication Laboratory Revision: B Rev Date: 12/21/2010
RIT SMFL Page 2 of 11
← Reticle Pre-Alignment Marks
← Reticle Barcode
← Reticle Alignment Marks
4.2 Reticle Bar Code – The reticle barcode is read as the reticle is removed from the reticle
carrier. Reticle bar code information is specified in the stepper job.
4.3 Reticle Pre-Alignment Marks – Two Pre-alignment Marks are located 135.5mm apart near
the corners of the reticle. They are used to pre-align the reticle to the reticle table.
4.4 Reticle Alignment Marks - Two Reticle Alignment Marks, M1 and M2, are located 139mm
apart near the left and right edges of the reticle. After the reticle is pre-aligned on the reticle
table, the Reticle Alignment Marks are aligned to the permanent fiducial marks F1 and F2,
located on the fiducial plate on the wafer table.
4.5 Wafer Zero Level – The ASML Stepper utilizes zero level marks that are patterned and
etched into the wafer before any other steps. An etch depth of 1200A +/- 10% allows the
stepper to recognize the marks. It is possible to pattern the zero level at the same time as the
first level, but overlay accuracy will be reduced since the first level is not aligned to the zero
level. This is because the zero level is defined by a separate reticle.
4.6 Wafer Global Alignment - The wafer alignment marks W1, W2, etc, are exposed on the
zero layer and etched into the wafer. Two of these marks are sufficient but up to 25 may be
used on a single wafer. If more than two marks are used, the stepper will find a best
alignment and expose all die using the same settings. The stepper uses through the lens
alignment of the wafer and the reticle.
* * |||||||||||||||
RIT RIT
R·I·T Title: ASML Stepper
Semiconductor & Microsystems
Fabrication Laboratory Revision: B Rev Date: 12/21/2010
RIT SMFL Page 3 of 11
4.7 Wafer Field by Field Alignment – This method uses marks that are part of the CAD data
for each mask layer; they are not exposed individually. These marks may be placed in the
scribe lanes. Field by field alignment takes longer than global alignment because each die is
aligned.
4.8 Standard Jobs – Several standard jobs are available for use with the Standard Reticle
Templates. This allows a user to process wafers without having to develop a new stepper
job. These jobs should not be changed but may be copied and saved as new jobs.
5 SAFETY PRECAUTIONS
5.1 Hazards to the Operator
5.1.1 The ASML uses ultraviolet light as well as lasers, and should only be operated with
all of the covers closed. Safety glasses should be worn at all times.
5.1.2 The ASML stepper had mechanical hazards. Do not operate with open covers and
do not open any covers during operation.
5.2 Hazards to the Tool
5.2.1 Never open or service the wafer stage since serious damage to the tool can occur.
5.2.2 Never manually remove stuck wafers from the system. Please contact the tool
technician.
5.2.3 Reticle changing should only be done by a certified user. Use care not to touch the
surface of the reticle. If alignment marks become obscured, the stepper will not be
able to find them.
5.2.4 Do not remove the Combi reticle from the SMIF pod. It is fragile and expensive to
replace.
5.2.5 Wafers must have clean backs. This will keep the stage clean and prevent errors.
5.2.6 Do not remove a carrier that is not fully raised.
Semiconductor & Microsystems
Fabrication Laboratory Revision: B Rev Date: 12/21/2010
RIT SMFL Page 3 of 11
4.7 Wafer Field by Field Alignment – This method uses marks that are part of the CAD data
for each mask layer; they are not exposed individually. These marks may be placed in the
scribe lanes. Field by field alignment takes longer than global alignment because each die is
aligned.
4.8 Standard Jobs – Several standard jobs are available for use with the Standard Reticle
Templates. This allows a user to process wafers without having to develop a new stepper
job. These jobs should not be changed but may be copied and saved as new jobs.
5 SAFETY PRECAUTIONS
5.1 Hazards to the Operator
5.1.1 The ASML uses ultraviolet light as well as lasers, and should only be operated with
all of the covers closed. Safety glasses should be worn at all times.
5.1.2 The ASML stepper had mechanical hazards. Do not operate with open covers and
do not open any covers during operation.
5.2 Hazards to the Tool
5.2.1 Never open or service the wafer stage since serious damage to the tool can occur.
5.2.2 Never manually remove stuck wafers from the system. Please contact the tool
technician.
5.2.3 Reticle changing should only be done by a certified user. Use care not to touch the
surface of the reticle. If alignment marks become obscured, the stepper will not be
able to find them.
5.2.4 Do not remove the Combi reticle from the SMIF pod. It is fragile and expensive to
replace.
5.2.5 Wafers must have clean backs. This will keep the stage clean and prevent errors.
5.2.6 Do not remove a carrier that is not fully raised.
R·I·T Title: ASML Stepper
Semiconductor & Microsystems
Fabrication Laboratory Revision: B Rev Date: 12/21/2010
RIT SMFL Page 4 of 11
6 INSTRUCTIONS
6.1 Starting the System
6.1.1 Swipe the tool in on the Card Swipe System.
6.1.2 Verify that the computer is on.
6.1.3 Make sure that the computer is on the Main Menu, if not select 0 Exit. Do not exit
from the Main Menu.
Unload Load
Reticle Changer
Semiconductor & Microsystems
Fabrication Laboratory Revision: B Rev Date: 12/21/2010
RIT SMFL Page 4 of 11
6 INSTRUCTIONS
6.1 Starting the System
6.1.1 Swipe the tool in on the Card Swipe System.
6.1.2 Verify that the computer is on.
6.1.3 Make sure that the computer is on the Main Menu, if not select 0 Exit. Do not exit
from the Main Menu.
Unload Load
Reticle Changer
5
6
7
8
9
10
11
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Key Features
- 5x reduction
- i-line stepper
- 350nm resolution
- 0.48-0.60 variable numerical aperture
- 22x22mm maximum field size
- Overlay capability better than 50nm
- Single stepper job for all lithography levels
Questions & Answers
2024-09-21
V V L
How to load a reticle box?
Instructions for loading a reticle box are available in the manual. Please specify the type of reticle box or the specific step you need help with.
What are the safety precautions for using the ASML PAS 5500 stepper?
Refer to the ASML PAS 5500 stepper manual for detailed safety precautions. Please specify your safety concern, such as laser safety or electrical hazards.
What is the maximum field size on a wafer?
The maximum field size depends on the wafer specifications. Please provide details about the wafer size you are using.
Related manuals
Frequently Answers and Questions
What is the maximum field size on the wafer?
22x22mm
What is the overlay capability?
Better than 50nm
How many lithography levels can be included in a single stepper job?
All lithography levels for a particular design
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