Access line, 16 MHz STM8S 8-bit MCU, up to 8 Kbytes Flash, data

STM8S103x Package characteristics

The maximum chip junction temperature (T

Jmax

) must never exceed the values given in

Table 19: General operating conditions on page 49

.

The maximum chip-junction temperature, T

Jmax

, in degrees Celsius, may be calculated using the following equation:

T

Jmax

= T

Amax

+ (P

Dmax

x

Θ

JA

)

Where:

●

●

T

Amax

is the maximum ambient temperature in

° C

Θ

JA

is the package junction-to-ambient thermal resistance in

° C/W

●

●

P

Dmax

is the sum of P

INTmax

and P

I/Omax

(PDmax = P

INTmax

+ P

I/Omax

)

P

INTmax

is the product of I

DD and V

DD

, expressed in Watts. This is the maximum chip internal power.

●

P

I/Omax

represents the maximum power dissipation on output pins

Where:

P

I/Omax

=

Σ (V

OL

*I

OL

) +

Σ((V

DD

-V

OH)

*I

OH

), taking into account the actual V

OL

/I

OL and

V

OH

/I

OH the application.

of the I/Os at low and high level in

Table 56.

Thermal characteristics

(1)

Symbol Parameter Value

Θ

Θ

JA

JA3

Θ

Θ

JA

JA

Thermal resistance junction-ambient

LQFP32 - 7 x 7 mm

Thermal resistance junction-ambient

VFQFPN32 - 5 x 5 mm

Thermal resistance junction-ambient

TSSOP20 - 4.4 mm

Thermal resistance junction-ambient

UFQFPN20 - 3 x 3 mm

60

22

84

90

1.

Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection environment.

Unit

°C/W

°C/W

°C/W

°C/W

JESD51-2 integrated circuits thermal test method environment conditions - natural convection (still air). Available from www.jedec.org.

15441 Rev 3 89/95