- No category
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D a t a S h e e t
( A d v a n c e I n f o r m a t i o n )
1.
Ordering Information
The ordering part number is formed by a valid combination of the following:
S29VS 256 R xx BH W 00 0
Packing Type
0
= Tray (standard; see note ( Note 1 ))
3 = 13-inch Tape and Reel
Model Number
00 = Top
01 = Bottom
Temperature Range
W = Wireless (–25°C to +85°C)
Package Type and Material
BH = Very Thin Fine-Pitch BGA, Low Halogen Lead (Pb)-Free Package
Speed Option (Burst Frequency)
0S = 83 MHz
AA = 104 MHz
AB = 108 MHz
Process Technology
R = 65 nm MirrorBit
®
Technology
Flash Density
256 = 256 Mb
128 = 128 Mb
Device Family
S29VS256R =1.8 Volt-only Simultaneous Read/Write, Burst-Mode Address and Data
Multiplexed Flash Memory
S29XS256R =1.8 Volt-only Simultaneous Read/Write, Burst-Mode Address Low,
Address High and Data Multiplexed Flash Memory
1.1
Valid Combinations
Valid Combination list configurations are planned to be supported in volume for this device. Consult your local sales office to confirm availability of specific valid combinations and to check on newly released combinations.
Base Ordering
Part Number
S29VS256R
S29VS128R
S29XS256R
S29XS128R
S29VS-R Valid Combinations (1) (2)
Speed Option
0S, AA, AB
Package Type, Material, and Temperature Range
Packing
Type
0, 3
Model
Numbers
00, 01
Package Type
6.2 mm x 7.7 mm, 44-ball
Notes:
1. Type 0 is standard. Specify other options as required.
2. BGA package marking omits leading S29 and packing type designator from ordering part number.
3. Industrial Temperature Range is also available. For device specification differences, please refer to the Specification Supplement with
Publication Number S29VS_XS-R_SP.
July 30, 2012 S29VS_XS-R_00_08 S29VS/XS-R MirrorBit
®
Flash Family 7
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Table of contents
- 3 Features
- 3 General Description
- 3 Performance Characteristics
- 7 Ordering Information
- 7 Valid Combinations
- 8 Input/Output Descriptions & Logic Symbol
- 9 Block Diagrams
- 10 Physical Dimensions/Connection Diagrams
- 10 Related Documents
- 10 Special Handling Instructions for FBGA Package
- 12 Product Overview
- 13 Address Space Maps
- 14 Data Address & Quantity Nomenclature
- 15 Flash Memory Array
- 17 Address/Data Interface
- 18 Bus Operations
- 19 Device ID and CFI (ID-CFI)
- 21 Device Operations
- 22 Asynchronous Read
- 22 Synchronous (Burst) Read Mode and Configuration Register
- 28 Status Register
- 31 Blank Check
- 31 Simultaneous Read/Write
- 32 Writing Commands/Command Sequences
- 32 Program/Erase Operations
- 38 Handshaking
- 39 Hardware Reset
- 39 Software Reset
- 39 Sector Protection/Unprotection
- 39 Sector Lock/Unlock Command
- 40 Sector Lock Range Command
- 40 Hardware Data Protection Methods
- 41 SSR Lock
- 41 Secure Silicon Region
- 43 Power Conservation Modes
- 43 Standby Mode
- 43 Automatic Sleep Mode
- 43 Output Disable (OE#)
- 44 Electrical Specifications
- 44 Absolute Maximum Ratings
- 44 Operating Ranges
- 45 DC Characteristics
- 46 Capacitance
- 46 AC Test Conditions
- 46 Key to Switching Waveforms
- 47 Power Up
- 47 CLK Characterization
- 48 AC Characteristics
- 56 Appendix
- 56 Command Definitions
- 58 Device ID and Common Flash Memory Interface Address Map
- 70 Revision History
- 48 S29VS_XS-R_00_08 July
- 31 Simultaneous Operation Circuit
- 32 44-Ball Very Thin Fine-Pitch Ball Grid Array, Top View, Balls Facing Down
- 33 VDJ044—44-Ball Very Thin Fine-Pitch Ball Grid Array
- 48 Synchronous Read
- 66 Maximum Negative Overshoot Waveform
- 66 Maximum Positive Overshoot Waveform
- 68 Input Pulse and Test Point
- 68 Output Load
- 69 Power-up Diagram
- 69 CLK Characterization
- 70 Synchronous Read Mode - ADM Interface
- 71 Asynchronous Mode Read - ADM Interface
- 72 Asynchronous Program Operation Timings - ADM Interface