650 kHz/1.3 MHz, 4 A, Step-Up, PWM, DC-to-DC Switching Converter ADP1614 Data Sheet

650 kHz/1.3 MHz, 4 A, Step-Up, PWM, DC-to-DC Switching Converter ADP1614 Data Sheet

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter Rating

VIN, EN, FB, FREQ to GND

CLRES to GND

COMP to GND

SS to GND

−0.3 V to +6 V

−0.3 V to VIN

1.0 V to 1.6 V

−0.3 V to +1.3 V

SW to GND 21 V

Operating Junction Temperature Range −40°C to +125°C

Storage Temperature Range

Soldering Conditions

−65°C to +150°C

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.

Absolute maximum ratings apply individually only, not in combination.

ADP1614

THERMAL RESISTANCE

The junction-to-ambient thermal resistance (θ

JA

) of the package is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. The θ

JA

is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, attention to thermal board design is required. The value of θ

JA

may vary, depending on the printed circuit board (PCB) material, layout, and environmental conditions.

The boundary conditions for the thermal resistance of the

ADP1614 are modeled under natural convection cooling at

25°C ambient temperature, JESD 51-9, and 1 W power input on a

4-layer board.

Table 3. Thermal Resistance 1

Package Type

10-Lead LFCSP

θ

JA

47

1 Thermal numbers per JEDEC standard JESD 51-9.

ESD CAUTION

θ

JC

7.22

Unit

°C/W

Rev. B | Page 5 of 18

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