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APPENDIX B DEVELOPMENT TOOLS
B.7 Conversion Socket (EV-9200GF-100) Package Drawing and Recommended Footprint
Figure B-2. EV-9200GF-100 Package Drawing (for Reference Purposes only)
E
A
B
M
N O
F
No.1 pin index
1
EV-9200GF-100
P
G
H
I
I
J
G
H
K
L
M
ITEM
A
B
E
F
C
D
P
Q
N
O
R
S
User’s Manual U11302EJ5V0UD
12.0
22.6
25.3
6.0
16.6
19.3
8.2
MILLIMETERS
24.6
21
15
18.6
4-C 2
0.8
8.0
2.5
2.0
0.35
EV-9200GF-100-G0
INCHES
0.969
0.827
0.591
0.732
4-C 0.079
0.031
0.472
0.89
0.996
0.236
0.654
076
0.323
0.315
0.098
0.079
0.014
445
446
APPENDIX B DEVELOPMENT TOOLS
Figure B-3. Recommended Footprint for EV-9200GF-100 (for Reference Purposes only)
G
J
K
L
C
B
A
ITEM
A
B
C
D
E
MILLIMETERS
26.3
EV-9200GF-100-P1
INCHES
1.035
21.6
0.65
±0.02 × 29=18.85±0.05
0.65
±0.02 × 19=12.35±0.05
15.6
0.85
0.026
+0.001
—0.002
× 1.142=0.742
_
0.002
0.026
+0.001
—0.002
× 0.748=0.486
_
0.002
0.614
F
G
H
I
J
20.3
12
±0.05
6
±0.05
0.35
±0.02
2.36
±0.03
0.799
0.472
_
0.002
0.236
_
0.002
0.014
_
0.001
_
0.002
K
L 1.57
±0.03
_
0.002
Caution The dimensions of the mount pad for EV-9200 and that for
target device (QFP) may be different in some parts. For
the recommended mount pad dimensions for QFP, refer to the “Semiconductor Device Mount Manual” website
(http://www.necel.com/pkg/en/mount/index.html).
User’s Manual U11302EJ5V0UD
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