Samsung HT-DB760 Specifications
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Samsung HT-DB760 is a stylish and feature-packed home entertainment system that delivers an immersive audio experience, making it ideal for movie nights, music sessions, and gaming. With its sleek design and powerful performance, this system transforms your living room into a cinematic haven.
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DVD RECEIVER AMP
BASIC MODEL :
HT-Q9
SERVICE Manual
DVD RECEIVER AMP SYSTEM Features
* Multi-Disc Playback & FM Tuner
* Dolby Pro Logic II
* DTS (Digital Theater Systems)
* TV Screen Saver Function
* Power Saving Function
* Customized TV Screen Display
MODEL : HT-Q9
- Confidential -
ELECTRONICS
© Samsung Electronics Co.,Ltd. AUG. 2006
Printed in Korea
Code no. AH68-01893Q
INDEX
Ch1 Precautions Ch8 Electrical Parts List
1-1. Safety Precautions 1-1
1-2. Servicing Precautions 1-2
1-3. Precautions for Electrostatically
Sensitive Device (ESDs) 1-3
1-4. Special Precations and Waring
Lables for Laser Products 1-4
1-5. Special Precautions for HDD 1-5
Electrical Parts List 8-1
Ch9 Block Diagram
1. MAIN BLOCK DIAGRAM 9-1
Ch10 Wiring Diagram
No Reference
Ch2 Product Descriptions
1. Product Feature 2-1
2. Specifications 2-2
3. Accessories 2-3
Ch11 PCB Diagram
1. PCB Layout 11-1
Ch3 Product Functions
1. Connecting the Speakers 3-1
2. Basic Functions 3-3
3. New Functions 3-10
Ch4 Adjustments
No Reference
Ch12 Schematic Diagram
1. MAIN-1 12-1
2. MAIN-2
3. AMP
4. FUNCTION
5. RF
6. SMSP
12-2
12-3
12-4
12-5
12-6
Ch5 How to disassemble
How to disassemble 5-1
Ch13 Circuit Description
1. Description 13-1
2. Function Description 13-3
Ch6 Troubleshooting
1. Main (Power) 6-1
2. Output Failure (for 2Ch Analog Input) 6-2
Ch7 Exploded View & Parts List
1. Total Exploded View 7-1
2. Parts List 7-2
Ch14 HTS Reference
1. HTS (Home Thater Sytsem) 14-1
2. About “Sound” 14-2
3. 5.1 Channel Sound 14-3
4. HTS Sonud Format 14-4
5. HTS Devices 14-5
1. Precautions
Follow these safety, servicing and ESD precautions to prevent damage and protect against potential hazards such as electrical shock and X-rays.
1-1 Safety Precautions
1. Be sure that all of the built-in protective devices are replaced.
2. When reinstalling the chassis and its assemblies, be sure to restore all protective devices, including control knobs and compartment covers.
3. Make sure that there are no cabinet openings through which people-particularly children--might insert fingers and contact dangerous voltages. Such openings include the spacing between the picture tube and the cabinet mask, excessively wide cabinet ventilation slots, and improperly fitted back covers.
4. Design Alteration Warning:
Never alter or add to the mechanical or electrical design of the unit. Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any design changes or additions will void the manufacturer's warranty.
5. Leakage Current Hot Check (Figure 1-1):
Warning: Do not use an isolation transformer during this test. Use a leakagecurrent tester or a metering system that complies with American National Standards
Institute (ANSI C101.1, Leakage Current for
Appliances), and Underwriters Laboratories
(UL Publication UL1410, 59.7).
With the unit completely reassembled, plug the AC line cord directly into a 120V AC outlet. With the unit's AC switch first in the ON position and then OFF, measure the current between a known earth ground
(metal water pipe, etc.) and all exposed metal parts. Examples: Handle brackets, metal cabinets, screwheads and control shafts. The current measured should not exceed 0.5 milliamp. Reverse the powerplug prongs in the AC outlet and repeat.
Fig. 1-1 AC Leakage Test
6. Insulation Resistance Cold Check:
(1) With the unit's AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs. (2) Set the power switch to ON. (3) Measure the resistance between the shorted AC plug and any exposed metallic parts. Example:
Screwheads, antenna, control shafts or handle brackets.
If any of the exposed metallic parts has a return path to the chassis, the measured resistance should be between 1 and 5.2
megohms. If there is no return path, the measured resistance should be "infinite." If the resistance is outside these limits, a shock hazard might exist. See Figure 1-2
Fig. 1-2 Insulation Resistance Test
Samsung Electronics 1-1
Precautions
1-1 Safety Precautions (Continued)
7. Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with parts that meet the original specifications.
Always determine the cause of damage or overheating, and correct any potential hazards
8. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the
AC and high voltage power supplies.
Always inspect for pinched, out-of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage. Make sure that no wires or components touch thermally hot parts.
9. Product Safety Notice:
Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual inspection. These safety features and the protection they give might be lost if the replacement component differs from the original--even if the replacement is rated for higher voltage, wattage, etc.
10 Components that are critical for safety are indicated in the circuit diagram by shading, or . Use replacement components that have the same ratings, especially for flame resistance and dielectric strength specifications. A replacement part that does not have the same safety characteristics as the original might create shock, fire or other hazards.
1-2 Servicing Precautions
Warning1: First read the "Safety Precautions" section of this manual. If some unforeseen circumstance creates a conflict between the servicing and safety precautions, always follow the safety precautions.
1. Servicing precautions are printed on the cabinet. Follow them.
2. Always unplug the unit's AC power cord from the AC power source before attempting to: (a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in parallel with an electrolytic capacitor.
3. Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used.
The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elements to their original position.
4. After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that the portion around the serviced part has not been damaged.
5. Check the insulation between the blades of the AC plug and accessible conductive parts
(examples: metal panels, input terminals and earphone jacks).
6. Insulation Checking Procedure: Disconnect the power cord from the AC source and turn the power switch ON. Connect an insulation resistance meter (500V) to the blades of the AC plug.
The insulation resistance between each blade of the AC plug and accessible conductive parts (see above) should be greater than 1 megohm.
7. Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all solid-state heat sinks are correctly installed.
8. Always connect a test instrument's ground lead to the instrument chassis ground
before connecting the positive lead; always remove the instrument's ground lead last.
1-2 Samsung Electronics
Precautions
1-3 Precautions for Electrostatically Sensitive Devices (ESDs)
1. Some semiconductor ("solid state") devices are easily damaged by static electricity.
Such components are called Electrostatically
Sensitive Devices (ESDs). Examples include integrated circuits and some field-effect transistors. The following techniques will reduce the occurrence of component damage caused by static electricity.
5. Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.
6. Use only an anti-static solder removal device. Many solder removal devices are not rated as "anti-static" (these can accumulate sufficient electrical charge to damage ESDs).
2. Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your body by touching a known earth ground.
Alternatively, wear a discharging wrist-strap device. (Be sure to remove it prior to applying power--this is an electric shock precaution.)
3. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent accumulation of electrostatic charge.
7. Do not remove a replacement ESD from its protective package until you are ready to install it. Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum foil or other conductive materials.
8. Immediately before removing the protective material from the leads of a replacement
ESD, touch the protective material to the chassis or circuit assembly into which the device will be installed.
4. Do not use freon-propelled chemicals.
These can generate electrical charges that damage ESDs.
9. Minimize body motions when handing unpackaged replacement ESDs. Motions such as brushing clothes together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.
1-4 Special Precautions and Warning Labels for Laser Products
(UL)
This Product Complies with
DHHS Rules 21CFR, Sub chapter J.At date of Manufacture
(CSA)
CERTIFIED ONLY TO CANADIAN
ELECTRICAL CODE.
CERTIFIE EN VERTU DU CODE
CANADIAN DE LELETRICITE
SEULEMENT
(UL,CSA,EU)
CLASS 1
LASER PRODUCT
Fig. 1-3 Warning Labels (Location: Enclosure Block)
(UL,CSA,SCAN)
CAUTION :
INVISIBLE LASER RADIATION WHEN OPEN
AND INTERLOCKS DEFEATEO AVOIDEXPOSURE TO BEAM
ADVARSEL:
USYNLIG LASERSTRÅLING VED ABNING
NÅR SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION
UNDGA UDSAETTELSE FOR STRALING
VARO:
AVATTAESSA JA SUOJALUKITUS OHITETTAESSA
OLET ALTTINA NAKYMATTÖMALLE LASERSATEILYLLE ALA
KATSO SATEESEEN!
VARNING:
OSYNLIG LASERSTRÅLNING NAR DENNA DEL
AR OPPNAD OCH SPARREN AR URKOPPLAD BETRAKTA
EJSTRÅLEN!
(EU)
UL : Manufactured for U.S.A. Market.
CSA : Manufactured for Canadian Market.
EU : Manufactured for European Market.
SCAN : Manufactured for Scandinavian
Market.
Fig. 1-4 Warning Labels (Location: Disc Clamper, Inner Side of Unit Door or Nearby Unit Chassis )
Samsung Electronics 1-3
Precautions
1-4 Special Precautions and Warning Labels for Laser Products (Continued)
1-4-1 Warnings
1. When servicing, do not approach the LASER exit with the eye too closely. In case it is necessary to confirm LASER beam emission, be sure to observe from a distance of more than 30 cm from the surface of the objective lens on the optical pick-up block.
2. Do not attempt to handle the objective lens when the DISC is not on the tray.
1-4-3 Handling the Optical Pick-up
1. Static electricity from clothing or the body may cause electrostatic breakdown of the laser diode in the Optical Pickup. Follow this procedure:
2. Place a conductive sheet on the work bench
(i.e., the black sheet used for wrapping repair parts.) Note: The surface of the work bench should be covered by a copper ground plane, which is grounded.
1-4-2 Laser Diode Specifications
Material: GaAs+ GaAlAs
Wavelength: 760-800 nm
Emission Duration: Continuous
3. The repair technician must wear a wrist strap which is grounded to the copper sheet.
Laser Output: 0.2 mw (measured at a
1.6 mm distance from the objective lens surface on the optical pick-up block.)
4. To remove the Optical Pickup block:
Place the set on the conductive sheet, and momentarily touch the conductive sheet with both hands. (While working, do not allow any electrostatic sources--such as clothes--to touch the unit.)
5. Ground the "Short Terminal" (located on the
PCB, inside the Pickup Assembly) before replacing the Pickup. This terminal should be shorted whenever the Pickup Assembly is lifted or moved.
6. After replacing the Pickup, reopen the Short
Terminal. See diagrams below:
1-5 Special Precautions for HDD
* HDD Data Maintenance Step
1. Since the data on the HDD is weak to mechanical shock, place the HDD in a safe location that is free from mechanical shock once it is removed from the main unit.
2. In order to safe keep the data on the HDD, back up the data before the repair or make sure not to place the HDD near any electrical appliance that generates a strong magnetic field.
1-4 Samsung Electronics
2. Product Descriptions
1. Product Feature
Multi-Disc Playback &
FM Tuner
Dolby Pro Logic II
DTS
(Digital Theater Systems)
TV Screen Saver
Function
Power Saving Function
Customized TV Screen
Display
Product Feature
■
The HT-Q9 combines the convenience of multi-disc playback capability, including DVD-VIDEO, VCD, CD, MP3-CD, WMA-CD, DivX, CD-R/RW, and DVD-R/RW, with a sophisticated FM tuner, all in a single player.
■
Dolby Pro Logic II is a new form of multi-channel audio signal decoding technology that improves upon existing Dolby Pro Logic.
■
DTS is an audio compression format developed by Digital Theater
Systems Inc. It delivers full-frequency 5.1 channel sound.
■
The HT-Q9 automatically brightens and darkens your TV screen after 3 minutes in the stop mode. The HT-Q9 automatically switches itself into the power saving mode after 20 minutes in the screen saver mode.
■
The HT-Q9 automatically shuts itself off after 20 minutes in stop mode.
■
The HT-Q9 allows you to select your favorite image during JPEG,
DVD or VCD playback and set it as your background wallpaper.
2-1 Samsung Electronics
2. Specifications
K
E
R
E
A
S
P
V
I
D
E
O
I
E
I
F
R
A
M
P
L
O
U
T
P
U
T
F
M
R
A
L
G
E
N
E
T
U
N
E
R
Power Consumption
Weight
Dimensions (W x H x D)
Operating Temperature Range
Operating Humidity Range
Usable Sensitivity
S/N Ratio
Distortion
Composite Video
Component Video
Front speaker output
Center speaker output
Rear speaker output
Subwoofer speaker output
Frequency range
S/N Ratio
Channel separation
Input sensitivity
Speaker system
Impedance
Frequency range
Output sound pressure level
Rated input
Maximum input
Dimensions (W x H x D)
Weights
20W
2.6Kg
430 x 65.5 x 256.5 mm
+5°C~+35°C
10% ~ 75%
10dB
60dB
0.5%
1.0Vp-p(75
Ω load)
Y:1.0Vp-p(75
Ω load)
Pr:0.70Vp-p(75
Ω load)
Pb:0.70Vp-p(75
Ω load)
30W x 2(4
Ω
)
30W(4
Ω
)
30W x 2(4
Ω
)
30W(8
Ω
)
20Hz~20KHz
75dB
60dB
(AUX)500mV
Front/Center/Rear speaker
4
Ω
140Hz~20KHz
5.1ch speaker system
Subwoofer speaker
8
Ω
35Hz~140Hz
85dB/W/M
30W
60W
85dB/W/M
30W
60W
Front/Rear
92 x 102x 96.5 mm
Center
Front/Rear
Center
0.5 Kg/0.5 Kg
0.5 Kg
130 x 320 x 314 mm
3.3 kg
Samsung Electronics 2-2
3. Accessories
Accessories Name
Remote control
Audio Cable
FM antenna
Code No.
AH59-01657A
AH39-40001Y
AH42-00021A
2-3 Samsung Electronics
6. Troubleshooting
1. Main (Power)
Samsung Electronics 6-1
2. Output Failure (for 2Ch Analog Input)
6-2 Samsung Electronics
7.Exploded View & Parts List
1. Total Exploded View
AC080
AC025
AD510
7-1
AK250
AB030
AC010
AD502
AR011
AL180
AK290
AS260
AR011
AD370
AK420
AK170
Samsung Electronics
2. Parts List
LOC.
AS260
AK420
AD370
AK170
AC025
AD510
-
-
AK250
AD502
AR011
AB030
AC010
AL180
AK290
-
-
AC080
PART NAME
KNOB-MIC
DOOR-DVD
RUBBER-FOOT
BADGE-BRAND
CABINET-FRONT
LENS-STAND BY
KNOB-POWER
SPRING-DOOR
KNOB-VOL
DECO-VOL
KNOB-FUNCTION
CABINET-BOTTOM
DOOR-TRAY
HOLDER-MECHA
HOLDER-VFD
HOLDER-IC
H-SINK AMP
CABINET-TOP
A
B
C
D
TAPTITE SCREW
TAPTITE SCREW
TAPTITE SCREW
TAPTITE SCREW
PART CODE MATERAIL SPEC Q'TY REMARK
AH64-03687B
AH64-04017A
AH73-00005A
AH64-03746A
AH64-04014A
AH67-00438A
AH64-04016A
AH61-02122B
AH64-04030A
AH64-03789A
AH64-04015A
AH64-04012A
AH64-02320B
AH61-02182A
AH61-02181A
AH61-02183A
AH62-00146B
AH64-04013A
ABS
ABS
RUBBER
AL
HIPS
PMMA
ABS
SUS304
ABS
PC
ABS
SECC 0.6T
ABS
ABS
ABS
ABS+GF30%
AL
SECC 0.5T
1
1
1
1
2
1
1
1
1
1
1
1
1
1
1
2
1
2
SNA
SNA
SNA
SNA
SNA
SNA
SNA
6003-001499
6003-001561
6003-000280
6003-000275
BWH 3*10 SILVER
BH 3 *6 YEL
BH 3*25 YEL
BH 3*10 BLACK
4
3
3
2
Samsung Electronics 7-2
DR29
DR30
DR31
DR55
DR57
DDA1
DIC2
DR27
DR28
DR281
CP20
DC18
DC30
DD1
DD2
CN1
CNP1
CNP1-
CP11
CP18
DR64
EJACK
ER1
ER2
FL1
FS01
FUSEC
HC20
HC23
CK21
CK23
CK26
CK7
CK9
CK1
CK11
CK14
CK16
CK19
C2RR
C37
C3A
C3S
C4P
CD000
CD300
CD340
CD380
CD520
AR34
AR8
C1P
C1S
C2P
AR1
AR11
AR15
AR3
AR33
AC2
AC23
AC7
ACR24
AD510
ADIC3
AIC2
AIC3
AIC4
AIC5
8. Electrical Parts List
Location no.
Code no.
Description & Specification Remarks
*** HT-Q9 Parts List ***
3711-000483
3711-000471
AH39-00754A
2401-001102
2402-001198
2401-001364
2203-005148
2203-000189
0407-000116
0403-001062
0404-000156
1201-001842
2007-000124
2007-000109
2007-000075
2007-000120
2007-000090
2007-000458
2007-000134
2007-000082
2007-000483
3722-000363
2007-000682
2007-000931
AH07-00190A
3404-000165
3602-000147
2203-001640
2203-000315
2203-000783
2401-001508
2401-000414
2203-000260
2203-001537
AH61-01741A
AH66-00217A
AH66-00262A
AH66-00215A
3409-001138
2402-000008
2203-000716
2401-001952
2401-000480
2401-000918
2401-001887
2402-000130
2203-000595
2203-005550
2203-001058
2401-000651
2203-002398
2203-000626
2007-000081
AH64-02320A
1002-001392
1201-002342
1204-002548
0801-002455
0801-001055
2007-000130
2007-000309
2007-000072
2007-000086
2007-000102
2007-000121
2007-000091
2203-000257
2305-000412
2401-000847
C-AL;2.2uF,20%,50V,GP,TP,4x7,5
C-CER,CHIP;22nF,10%,50V,X7R,1608
C-CER,CHIP;0.022nF,5%,50V,C0G,1608
R-CHIP;2.7Kohm,5%,1/10W,TP,1608
DOOR-TRAY;HT-DB300,ABS,-,-,-,-,NTR,-
IC-A/D CONVERTER;WM8775EDS,24BIT,SSOP,28
IC-AUDIO AMP;S1S4001,SSOPH,56P,18.4x7.5m
IC-MODULATOR;S5M0061,TQFP,64P,10x10mm,PL
IC-CMOS LOGIC;74LV74,DUAL D F/F,TSSOP,14
IC-CMOS LOGIC;74VHC08,AND GATE,SOP,14,15
R-CHIP;39Kohm,5%,1/10W,TP,1608
R-CHIP;10ohm,5%,1/10W,TP,1608
R-CHIP;47ohm,5%,1/10W,TP,1608
R-CHIP;5.6Kohm,5%,1/10W,TP,1608
R-CHIP;100Kohm,5%,1/10W,TP,1608
R-CHIP;820ohm,5%,1/10W,TP,1608
R-CHIP;12Kohm,5%,1/10W,TP,1608
C-CER,CHIP;10nF,10%,50V,X7R,1608
C-FILM,LEAD-PEF;470nF,5%,63V,TP,-,5mm
C-AL;220uF,20%,35V,GP,TP,10x12mm,5m
C-CER,CHIP;0.33nF,5%,50V,C0G,1608
C-AL;47uF,20%,16V,GP,TP,6.3x5,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-CER,CHIP;10nF,10%,50V,X7R,2012
C-CER,CHIP;1nF,10%,50V,X7R,TP,2012
BASE-MAIN;K100,ABS,-,-,-,-,-
GEAR-TRAY;CMS-SD100,POM,-,-,-,BLACK,-,-,
LEVER-LIFT;-,ABS,-,-,-,-,BLK,-
PULLEY MOTOR;CMS-SD100,POM,-,WHITE,-,-,-
SWITCH-DETECTOR;5V DC,1A,DPST,30GF,-
C-AL,SMD;47uF,20%,16V,GP,TP,6.6x6.6x5.4
C-CER,CHIP;3.3nF,10%,50V,X7R,2012
C-AL;4.7uF,20%,50V,GP,TP,5x7mm,5mm
C-AL;10uF,20%,50V,GP,TP,5x11,5
C-AL;22uF,20%,16V,GP,-,6.3x7,5
C-AL;0.1uF,20%,50V,-,TP,4x7mm,5
C-AL,SMD;2.2uF,20%,50V,GP,TP,4.3x4.3x5.
C-CER,CHIP;0.22nF,5%,50V,C0G,2012
C-CER,CHIP;82nF,10%,50V,X7R,TP,2012,-
C-CER,CHIP;0.56NF,5%,50V,C0G,TP,2012
HEADER-BOARD TO CABLE;BOX,5P,1R,2mm,STRA
HEADER-BOARD TO CABLE;3WALL,4P,1R,2mm,ST
LEAD CONNECTOR;HT-P50,4P,2mm,70mm,1007#2
C-AL;330uF,20%,16V,GP,TP,8x11.5mm,5
C-AL,SMD;330UF,20%,6.3V,GP,TP,6.6X6.6X7
C-AL;470uF,20%,16V,GP,TP,10x12.5,5
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,+80-20%,25V,Y5V,1608
DIODE-ARRAY;DAP202K,80V,100mA,CK2-3,SOT-
DIODE-ZENER;UDZ4.7B,4.55-4.75V,200MW,SOD
DIODE-SCHOTTKY;RB441Q,40V,350MA,DO-34,TP
IC-OP AMP;TL3472CD,SO,TP,8P,-,DUAL,-,PAL
R-CHIP;2.2Kohm,5%,1/10W,TP,1608
R-CHIP;1Mohm,5%,1/10W,TP,1608
R-CHIP;220ohm,5%,1/10W,TP,1608
R-CHIP;680ohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;18Kohm,5%,1/10W,TP,1608
R-CHIP;33Kohm,5%,1/10W,TP,1608
R-CHIP;3.3Kohm,5%,1/10W,TP,1608
R-CHIP;1OHM,5%,1/8W,TP,2012
JACK-PHONE;9P,AU,BLK,ANGLE
R-CHIP;3.3Kohm,1%,1/8W,TP,2012
R-CHIP;470ohm,5%,1/8W,TP,2012
VF DISPLAY;HNV-08SS71,HT-Q9,75x18.5x6.8,
SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST
FUSE-CLIP;250V,7.5A,30mohm
C-CER,CHIP;0.39nF,10%,50V,X7R,1608
C-CER,CHIP;0.12nF,5%,50V,C0G,1608
Location no.
Code no.
HC26 2203-001052
MR66
MR93
MREG1
MREG2
MV1
PB7
PC2
PC24
PS300
PS300
MJ4
MQ1_1
MQ2
MR29
MR30
MR32
MR35
MR54
MR63
MR65
Q4
Q5
R1P
R24
R2P
R2RR
R39
R3RR
R5SS
R7FL
RAC1
MIC2
MIC3
MIC4
MIC6
MIC8
MD3
MDIC1
MDIC2
MIC1
MIC1_
MC31
MC40
MC43
MC45
MC5
MC50
MC52
MC53
MC6
MCON8
KR5
KR6
L1SS
L2P
L5P
LD1
MC10
MC16
MC18
MC29
KIC2
KR1
KR2
KR3
KR4
HEATS
HEATS
HEATS
HL23
IC HO
3708-002023
0504-000156
0504-000128
2007-000100
2007-000093
2007-000087
2007-000962
2007-000694
2011-000651
2007-000643
2007-000077
2007-000118
1203-002425
1203-002935
2101-001068
3301-001495
2402-001042
2401-001975
AH59-01687C
AH59-01731C
0501-000303
0501-000369
2007-000502
2007-000116
2007-001806
2007-000462
2007-000094
2007-000518
2007-000253
2007-000695
2003-000587
2203-001656
2203-001103
2203-000646
2203-000440
2203-005221
2402-001049
2203-005065
2401-000042
2203-006170
AH40-00129A
0403-000509
1003-001450
1003-001508
0801-002683
1002-001448
1204-002233
1107-001505
1204-002224
1103-001334
1105-001535
AH62-00062G
AH62-00146B
AH62-30061F
2703-001254
AH61-02183A
1201-001572
2007-001198
2007-000468
2007-000221
2007-000241
2007-000267
2007-000493
2702-001028
3301-000297
3301-000314
0601-001238
2203-000815
2203-000972
2203-000998
2402-001009
Description & Specification Remarks
C-CER,CHIP;0.56nF,10%,50V,X7R,TP,1608
HEAT SINK-TR;HT-DS400,AL EXTR,-,-,-,-,-,
HEAT SINK-AMP;COMMON,AL,.,38,62,-,-,-,36
HEAT SINK-TR;-,AL,-,15,40,-,-,-,-
INDUCTOR-SMD;1.8uH,10%,2012
HOLDER-IC;HT-Q9,ABS+GF30%,-,-,-,-,-
IC-PREAMP;2011,SIP,8P,19.2x6.5mm,SINGLE,
R-CHIP;820ohm,1%,1/8W,TP,2012
R-CHIP;1Kohm,5%,1/8W,TP,2012
R-CHIP;1.2Kohm,5%,1/8W,TP,2012
R-CHIP;1.5Kohm,5%,1/8W,TP,2012
R-CHIP;1.8Kohm,5%,1/8W,TP,2012
R-CHIP;2.2Kohm,5%,1/8W,TP,2012
INDUCTOR-RADIAL;22UH,10%,10.3X18MM
BEAD-AXIAL;25ohm,3.6x1.2x5.7mm,-,TP,-,-,
BEAD-SMD;120ohm,1.6x0.8x0.8mm,150mA,,,,
LED;LTL-1CHESS-UA,ROUND,RED,3.1mm,697nm
C-CER,CHIP;0.033nF,5%,50V,C0G,1608
C-CER,CHIP;47nF,10%,16V,X7R,1608
C-CER,CHIP;0.047nF,5%,50V,C0G,1608
C-AL,SMD;100uF,20%,6.3V,GP,TP,5.3x5.3x5
C-CER,CHIP;0.47nF,5%,50V,NP0,1608
C-CER,CHIP;6.8nF,10%,50V,X7R,1608
C-CER,CHIP;0.024NF,5%,50V,C0G,TP,1608
C-CER,CHIP;1nF,10%,50V,X7R,1608
C-CER,CHIP;15nF,10%,50V,X7R,1608
C-AL,SMD;10uF,20%,16V,GP,TP,3.3x3.3x5.4
C-CER,CHIP;1000nF,+80-20%,10V,Y5V,1608
C-AL;100uF,20%,16V,GP,TP,6.3x7,5
C-CER,CHIP;220nF,10%,16V,X7R,1608
TUNER;KST-MW004FV1-E50LKOR,HT-Q40,FM
DIODE-ZENER;MTZJ5.6B,5.4-5.7V,500MW,DO-3
IC-MOTOR DRIVER;BA5954FM,SOP,28P,300MIL,
IC-MOTOR DRIVER;FAN8082DTF,SOP,8P,200MIL
IC-CMOS LOGIC;74HCT245,TRANSCEIVER,TSSOP
IC-A/D CONVERTER;AK5358ET,24,TSSOP,16P,5
IC-VOLUME/TONE CONT.;PT2399S,SO,16P,300M
IC-FLASH MEMORY;49BV162AT,16Mbit,1Mx16/2
IC-PAL/NTSC DECODER;ES6698FD,PQFP,208P,2
IC-EEPROM;K524A60X81,1KX8BIT,SOP,8P,5X4M
IC-DRAM;M12L128168A-7T,-,128MBIT,4X2MX
CONNECTOR-FPC/FFC/PIC;6P,1MM,SMD-S,TIN,N
TR-DIGITAL;KSR2103,PNP,200MW,22K/22K,SOT
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP
R-CHIP;68Kohm,5%,1/10W,TP,1608
R-CHIP;20Kohm,5%,1/10W,TP,1608
R-CHIP;6.8Kohm,5%,1/10W,TP,1608
R-CHIP;5.1Kohm,1%,1/10W,TP,1608
R-CHIP;3.3ohm,5%,1/8W,TP,2012
R-NET;10ohm,5%,1/16W,L,CHIP,8P,TP,32
R-CHIP;270ohm,5%,1/10W,TP,1608
R-CHIP;470ohm,5%,1/10W,TP,1608
R-CHIP;390ohm,5%,1/10W,TP,1608
IC-POSI.FIXED REG.;AP1117,SOT-223,3P,138
IC-POSI.ADJUST REG.;AIC1117ACE,TO-252,3P
VR-ROTARY;10KB,-,1/20W,SIDE
BEAD-SMD;120ohm,2012,2500mA,TP,115ohm/1
C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.6x5.
C-AL;47uF,20%,16V,GP,TP,5x11mm,5mm
SPEAKER SYSTEM;PS-Q9,XSH,FRONT,REAR,CENT
SPEAKER SYSTEM;PS-Q9,XSH,SUB W/F SPEAKER
TR-SMALL SIGNAL;KSA733,PNP,250mW,TO-92,T
TR-SMALL SIGNAL;KSC2331-Y,NPN,1000mW,TO-
R-CHIP;2.2ohm,5%,1/8W,TP,2012
R-CHIP;120ohm,5%,1/10W,TP,1608
R-CHIP;1.5ohm,5%,1/10W,BK,1608
R-CHIP;18ohm,5%,1/8W,TP,2012
R-CHIP;22Kohm,5%,1/10W,TP,1608
R-CHIP;2.7Kohm,5%,1/8W,TP,2012
R-CHIP;1.5ohm,5%,1/4W,TP,3216
R-CHIP;3.3ohm,5%,1/10W,TP,1608
R-METAL OXIDE(S);22ohm,5%,1W,AA,TP,3.3x9
Samsung Electronics 8-1
Location no.
Code no.
SMLF0
SMPC0
SMPN0
SMQ01
SMR01
SMR04
SMR05
SMR08
SMR43
SMR44
SMR46
SMD43
SMD50
SMFU0
SMIC0
SMIC0
SMIC4
SMIC4
SMIC4
SMIC4
SMIC4
SMC48
SMC49
SMC50
SMC60
SMC61
SMC64
SMCM0
SMD02
SMD04
SMD41
SMC08
SMC09
SMC10
SMC11
SMC16
SMC18
SMC41
SMC43
SMC44
SMC46
RQ5
RR17
RR34
RR6
RR9
SMBC0
SMBD0
SMC01
SMC03
SMC04
RK17
RK20
RK21
RK23
RK37
RK5
RK8
RL2
RP16
RPW6
RG3
RIC1
RK1
RK12
RK14
RC5
RCN1
REM1
REN1
RFG1
RAU2
RC1
RC10
RC15
RC2
RC25
RC27
RC31
RC40
0402-000268
0401-000005
3601-000301
1203-003336
1203-004084
1203-000294
1203-001586
1203-001589
1203-000165
AC14-12006D
AH29-00013A
0604-000117
3711-000190
0501-000630
2001-000242
2001-000302
2001-000786
2003-000738
2007-000830
2007-001043
2007-000030
2301-000474
2301-000449
2401-002300
2301-000375
2305-001016
2201-000551
2401-003139
2401-003378
2401-001020
2401-000357
2401-000804
2401-001355
2401-000118
2201-000129
2401-000740
2401-000598
2301-001220
0402-001148
0402-000012
0402-001377
2007-000766
2007-000477
2007-000123
2007-000822
2007-000872
2007-001177
2007-000409
3301-001069
2007-000824
2007-000113
0501-000632
2007-000097
2007-000071
2007-000308
2007-000122
AC27-92001M
0402-000003
2201-000987
2201-002213
2401-003472
2007-000119
2203-000681
2203-000491
2203-001222
2203-000888
2203-000357
2203-000575
2203-000975
2203-001634
2402-000167
3708-001765
0609-001198
3406-001109
2007-000033
2007-000300
1201-002059
2007-001071
2007-000029
2007-000981
Description & Specification Remarks
C-FILM,LEAD-PEF;8.2nF,10%,50V,TP,6.5x12x
C-FILM,LEAD-PEF;47nF,10%,50V,TP,9.5x12.5
C-AL;47uF,20%,50V,GP,TP,6.3x11,5
C-FILM,LEAD-PEF;100nF,5%,50V,TP,11x12.5x
C-FILM,LEAD-PEF;10nF,10%,630V,TP,12.5x6.
C-CERAMIC,DISC;0.47NF,10%,1KV,Y5P,TP,6.3
C-AL;1000uF,20%,25V,WT,TP,10*20,5mm
C-AL;1000uF,20%,10V,WT,-,10x12.5,5
C-AL;3.3UF,20%,50V,GP,TP,4X7,5
C-AL;100uF,20%,50V,GP,-,8x11.5,3.5m
C-AL;220uF,20%,16V,GP,TP,8x9mm,5
C-AL;470uF,20%,10V,GP,TP,8x11.5mm,5
C-AL;1000uF,20%,10V,GP,TP,10x12.5,5
C-CERAMIC,DISC;0.1nF,10%,1000V,Y5P,-,7x4
C-AL;2200uF,20%,50V,LZ,TP,18x40,7.5
C-AL;1uF,20%,50V,GP,TP,4x7,5
C-FILM,LEAD-PPF;100nF,10%,275V,BK,18x6x1
DIODE-RECTIFIER;1N4936,400V,1.0A,DO-41,T
DIODE-RECTIFIER;UF4007,1KV,1A,DO-41,TP
DIODE-RECTIFIER;UG4D,200V,4A,TO-220F,TP
DIODE-RECTIFIER;SB360,60V,3A,DO-201AD,TP
DIODE-SWITCHING;1N4148,75V,150mA,DO-35,T
FUSE-CARTRIDGE;250V,6.3A,TIME-LAG,GLASS,
IC-PWM CONTROLLER;KA5M0365,TO-220F-4L,4P
IC-PWM CONTROLLER;FSDM0365RNB,DIP,8P,9.8
IC-POSI.FIXED REG.;7808,TO-220,3P,-,PLAS
IC-POSI.FIXED REG.;278R33,TO-220F,4P,-,P
IC-POSI.FIXED REG.;278R05,TO-220F,4P,-,P
IC-POSI.ADJUST REG.;78R12,TO-220,4P,-,PL
IC;KA431Z,TO-92,TAPING
FILTER LINE;HT-Q9,SQE-2424(SM100S,HM5A,-
PHOTO-COUPLER;TR,130-260%,200mW,DIP-4,ST
HEADER-BOARD TO CABLE;1WALL,2P,1R,7.92MM
TR-SMALL SIGNAL;KTA1268,PNP,300MW,TO-92,
R-CARBON;1.5MOHM,5%,1/4W,AA,TP,2.4X6.4M
R-CARBON;10OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CARBON;47KOHM,5%,1/8W,AA,TP,1.8X3.2MM
R-METAL OXIDE(S);56Kohm,5%,2W,AA,TP,4x12
R-CHIP;39Kohm,5%,1/8W,TP,2012
R-CHIP;56ohm,5%,1/8W,TP,2012
R-CHIP;560ohm,5%,1/8W,TP,2012
R-CHIP;560ohm,5%,1/10W,TP,1608
C-CER,CHIP;0.027nF,5%,50V,C0G,1608
C-CER,CHIP;2.2nF,10%,50V,X7R,1608
C-CER,CHIP;0.82nF,10%,50V,X7R,1608
C-CER,CHIP;4.7nF,10%,50V,X7R,1608
C-CER,CHIP;0.15nF,5%,50V,C0G,1608
C-CER,CHIP;220nF,10%,25V,X7R,2012
C-CER,CHIP;47nF,10%,25V,X7R,TP,1608,-
C-CER,CHIP;33nF,10%,50V,X7R,1608
C-AL,SMD;100uF,20%,10V,-,-,6.6x6.6x5.7m
CONNECTOR-FPC/FFC/PIC;24P,0.5mm,SMD-S,SN
MODULE REMOCON;VERTICAL,19MM,TR
SWITCH-ROTARY;5V,0.5mA,SPDT,12mm
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;10Kohm,5%,1/8W,TP,2012
IC-RF AMP;ES6603SF,LQFP,64P,10X10MM,SING
R-CHIP;6.8Kohm,5%,1/8W,TP,2012
R-CHIP;0ohm,5%,1/8W,TP,2012
R-CHIP;5.6Kohm,5%,1/8W,TP,2012
R-CHIP;330ohm,5%,1/8W,TP,2012
R-CHIP;1Mohm,5%,1/8W,TP,2012
R-CHIP;1.5Kohm,5%,1/10W,TP,1608
R-CHIP;390ohm,5%,1/8W,TP,2012
R-CHIP;4.7Kohm,5%,1/8W,TP,2012
R-CHIP;8.2Kohm,5%,1/8W,TP,2012
R-CHIP;15Kohm,5%,1/8W,TP,2012
BEAD-SMD;120ohm,1.6x0.8x0.8mm,200mA,TP,
R-CHIP;390ohm,5%,1/4W,TP,3216
R-CHIP;33ohm,5%,1/10W,TP,1608
TR-SMALL SIGNAL;2SB1197K,PNP,200mW,SOT-2
R-CHIP;47Kohm,5%,1/10W,TP,1608
R-CHIP;22ohm,5%,1/10W,TP,1608
R-CHIP;10ohm,5%,1/8W,TP,2012
R-CHIP;1.2Kohm,5%,1/10W,TP,1608
COIL-INDUCTOR;RH3.5X6.5RS,BEAD(RADIAL),-
DIODE-BRIDGE;DF06M,600V,1A,DIP-4,ST
C-CERAMIC,DISC;2.2NF,20%,400V,Y5U,BK,12.
C-CERAMIC,DISC;0.47nF,10%,400V,Y,-,9.5X7
C-AL;100UF,20%,250V,GP,BK,16X31.5MM
8-2
Location no.
Code no.
VJ5
VL29
VQ3
VR17
VR51
UX1
VC2
VC38
VC49
VFD H
UR24
UR46
UR51
UR6
UR9
UQ1
UR11
UR12
UR17
UR19
VR56
VR7
WC5
WC9
X2
XD9
ZD5
UC2
UC6
UC8
UD10
UIC1
SMZD0
SPK1
UC12
UC16
UC18
SMR49
SMR51
SMR62
SMR64
SMR68
SMT01
SMT02
SMTH0
SMVR0
2007-001167
2007-000115
2401-002042
2203-000727
2801-004284
0401-001099
0403-000355
3101-001300
AH59-01592A
3301-001760
3809-001627
3809-001630
AH39-00884A
AH61-01742A
AH61-01743A
AH63-00695A
AH63-00905A
AH66-00261A
AH73-00058A
AH61-02182A
3301-000132
6902-000360
AH39-00257J
AH39-40001V
AH42-00021A
AH59-01615E
AH59-01657A
AH92-02518C
0501-000341
2007-000065
2007-000402
2007-000084
2007-000052
2007-000074
2007-000106
2007-000449
2007-000070
2007-000078
2802-000188
2401-000303
2401-001092
2203-000280
AH61-02181A
3722-002027
2703-000272
0501-000002
2007-000076
2007-001134
2007-000781
2001-000440
2007-000457
2007-000290
2007-000586
AH26-00338A
AH26-00337A
2006-001004
1405-000001
0403-001170
3716-001243
2401-000240
2203-000206
2203-000236
2401-000759
2409-000123
2203-005249
0401-001090
AH09-00111A
Description & Specification Remarks
R-CHIP;33ohm,5%,1/8W,TP,2012
R-CARBON;1OHM,5%,1/8W,AA,TP,1.8X3.2MM
R-CHIP;18Kohm,5%,1/8W,TP,2012
R-CHIP;100ohm,5%,1/8W,TP,2012
R-CHIP;22Kohm,5%,1/8W,TP,2012
TRANS POWER;-,HT-Q9,1.2mH,15,-,VARIABLE,
TRANS POWER;EER2828(PL-5,PM5),HT-Q9,620,
R-CEMENT;2.7OHM,5%,2W,CB,BK,11X20.5X7.5
VARISTOR;470V,1250A,14x7.5mm,TP
DIODE-ZENER;MTZJ9.1C,8.89-9.29V,500MW,DO
TERMINAL-BLOCK;-,12P,14mm,-,-
C-AL;100uF,20%,10V,GP,TP,5x11,5
C-CER,CHIP;100nF,10%,50V,X7R,2012
C-CER,CHIP;0.1nF,5%,50V,C0G,1608
C-AL;220nF,20%,50V,GP,TP,5x11mm,5mm
C-EDL;47000uF,4uA,5.5V,-,BK,-,5mm
C-CER,CHIP;100nF,10%,50V,X7R,1608
DIODE-SWITCHING;1SS355,80V,100MA,SOD-323
IC MICOM;GMS87C2020,HT-Q9,64PIN,2.7V~5.
TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-
R-CHIP;2.2Mohm,5%,1/10W,TP,1608
R-CHIP;150ohm,5%,1/10W,TP,1608
R-CHIP;4.7Kohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,1%,1/10W,TP,1608
R-CHIP;100ohm,5%,1/10W,TP,1608
R-CHIP;220Kohm,5%,1/10W,TP,1608
R-CHIP;180ohm,5%,1/8W,TP,2012
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
RESONATOR-CERAMIC;8MHz,0.5%,TP,10.0x5.0x
C-AL;100uF,20%,25V,GP,TP,6.3x11,5
C-AL;330uF,20%,10V,GP,-,8x11.5,2.5m
C-CER,CHIP;0.01nF,0.5pF,50V,C0G,1608
HOLDER-VFD;HT-Q9,ABS,-,-,-,-,-
JACK-PIN;6P/6C,SN,YEL/GN/WH/BL/RD,ANGLE
INDUCTOR-SMD;1.2uH,10%,2012
TR-SMALL SIGNAL;KSA812,PNP,150MW,SOT-23,
R-CHIP;330ohm,5%,1/10W,TP,1608
R-CHIP;68ohm,5%,1/10W,TP,1608
R-CHIP;75ohm,5%,1/10W,TP,1608
R-CHIP;82ohm,5%,1/10W,TP,1608
C-AL;220uF,20%,10V,GP,TP,6.3x11,5
C-CER,CHIP;3.9nF,10%,50V,X7R,2012
CRYSTAL-SMD;27MHZ,10PPM,28-AAN,20PF,30OH
DIODE-SWITCHING;1N4148WS,75V,150mA,SOD-3
DIODE-ZENER;UZ5.1BSB,5-5.2V,500MW,DO-35,
MOTOR-DC;2670RPM,9G.CM,3.9V,160MA
DECK-CD;-,CMS-S75RB,MAGNET,23.2mm,3V,S
CORE-FERRITE;-,33x12x8mm,-,-
CABLE-FLAT;30V,80C,90mm,6P,1mm,UL20696
CABLE-FLAT;30V,80C,175mm,24P,0.5mm,UL206
LEAD CONNECTOR-ASSY;SDM-D12,-,-,5P,150mm
BODY CLAMPER-UPPER;-,POM,0.8,-,-,-,WHT,-
BODY CLAMPER-LOWER;-,POM,0.8,-,-,-,WHT,-
TRAY-DISK;SDM-D11,ABS,-,-,-,-,GRAY,-
FELT-DECK;SDM-D12,FELT,0.8,10,18,-,DOUBL
CAM-SLIDE;K100,POM,-,-,WHT,-,-,-,-
SILICON/RUBBER-DECK;CMS-SD100,SILICON,D1
HOLDER-MEHCA;HT-Q9,ABS,-,-,-,-,-
CORE-FERRITE;AC,28.8x19.3x7.5mm,1400,290
BAG PE;HDPE,T0.03,L360,W250,TRP,8,1,P
CBF-POWER CORD;DVC90,-,CP2(5.0),250V,2.5
CABLE-AUDIO CABLE;-,-,1P-1P,3000MM,-,-,-
ANT FM T;T18011F-1,75 ohm,1800mm
DECK-1DVD MECHA;AH59-01615E,HT-Q20,T TYP
REMOCON-ASSY;HT-Q9,SAMSUNG,50,200,-,60,-
ASSY PCB-MAIN3;HT-Q9/XEU,MAIN,ENGLAND
Samsung Electronics
9. BLOCK DIAGRAM
9-1. MAIN BLOCK DIAGRAM
1-1. MAIN
Samsung Electronics
- This Document can be used without Samsung’s authorization -
9-1
10. Wiring Diagram
1-1. MAIN
Samsung Electronics
- This Document can be used without Samsung’s authorization -
10-1
11. PCB Diagram
11-1. PCB Layout
1-1. MAIN
Samsung Electronics
- This Document can be used without Samsung’s authorization -
11-1
12. Schematic Diagram
1. MAIN-1
1-1. MAIN
Samsung Electronics
- This Document can be used without Samsung’s authorization -
12-1
2. MAIN-2 - This Document can be used without Samsung’s authorization -
12-2 Samsung Electronics
3. AMP
- This Document can be used without Samsung’s authorization -
Samsung Electronics 12-3
4. FUNCTION - This Document can be used without Samsung’s authorization -
12-4 Samsung Electronics
5. RF
- This Document can be used without Samsung’s authorization -
Samsung Electronics 12-5
6. SMSP - This Document can be used without Samsung’s authorization -
12-6 Samsung Electronics
13. Circuit Description
1. Description (HT-Q9)
DECK
MPEG
Samsung Electronics
MAIN
TUNER
AMP
FRONT
SMPS
13-1
2. Function Description
13-2 Samsung Electronics
1. Definition of Home Theater
What is Home Theater?
Home theater system is the proper combination of audio and video system at home which enable you to enjoy more dynamic sound and vivid image in a wide screen of movie theater.
This effect can be implemented with wide screen, high quality projector, Dolby digital and DTS sound effects.
Now you can enjoy surround sound field wieh realistic presence and Dolby digital at your home as if you are in a movie theater.
As time goes by, home theater system has become recognized as a system that helps listen sound closer to the original sound rather than video. In this 21st century, most movie and animation films will be produced for home theater and reproduce sound closer to original sound.
14-1 Samsung Electronics
2. Concept of Sound
What is Sound Range?
People can listen to the sounds with frequency between 200Hz~20.000Hz
As time goes by, home theater system has become recognized as a system that helps listen sound closer to the original sound rather than video. In this 21st century, most movie and animation films will be produced for home theater and reproduce sound closer to original sound.
What is Sound Pressure?
* A measure of how well speaker converts electric signal it receives to sound
* Unit of sound pressure is decibel and mainly measures the size of sound at 1 m away after sending 1 W power from speaker.
❋ High sound pressure doesn't necessary mean good performance
What is Timbre?
* How well the unique sound of musical instrument is expressed
* Better if violin and cello sound are accurately distinguished. Good timbre means high quality.
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2. Concept of Sound
By reproducing standard channels used during soundtrack recording of movie, it outputs 3 sounds of movie (words / music / sound effects) from 6 different speakers and provides surround dynamic sound effects so that you can even feel the direction of sound.
5 channel
A
B
Center Speaker : Voice ( over 95%)
Front Speaker (L/R) : Music Sound
C Rear Speaker (L/R) : Sound Effect
0.1 channel
D Subwoofer : Low Sound Effect
* Power amp is embedded in active sub woofer
* Require separate amp since there is no amp in passive sub woofer
❋ No difference in performance of active sub woofer and passive sub woofer
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4. Home Theater Sound Format
Overview
* As home theater has recently penetrated deep into consumer's market in Korea, Dolby digital and
DTS, the sound format for 5.1 channel home theater, are the mainstream in the market.
* Expanded type of 6.1 channel or 7.1 channel are recently released in the market, but there are not much DVD title that can support expanded type.
1958 1Ch Mono/ 2Ch Stereo
1982 Matrix 3Ch Dolby Surround
1987 Matrix 4Ch Dolby Pro Logic
1995 5.1Ch Dolby Digital
1997 DTS (Digital Theater System)
1999 Matrix 6.1Ch Dolby Digital Sourround EX
Home theater format...
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Stereo
Is used in general audio and analog TV and and consists of 2 channels, at front left/right
Dolby Surround
In this sound format, 4 audio channels (Front left / right / center / surround) are entered in 2 channel and reproduce in 4 channels through device with Dolby decoder.
Center channel is not completely separated so that it forms virtual center channel with help of front left / right channel.
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Dolby Prologic
– Provide 4 channels (Front Left/Right/Center/Surround)
– Reinforced from Dolby Surround
① Center channel is completely separated
➁ Separation between channels gets higher
Dolby Digital
– Provide completely separate 5.1 channel
(Front Left/Right, Center, Rear Left/Right, Sub Woofer)
– Main sound format of home theater
– Reinforced from Dolby Prologic
– Rear surround left/right channels give different sound
– Support sub woofer reinforcing Bass
❋ Dolby Digital is also called AC-301
AC-3(Audo-Coding-3) : 3rd digital audio coding Dolby Research Center has developed.
DTS(Digital Theater System)
– Technology of providing 5.1 channel sound, higher quality than
Dolby Digital
– Home appliance produced to apply system installed at 1,800 theaters throughout the world.
✪ Comparison of DTS and Dolby Digital(DD)
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Dolby Prologic
– Latest technology reproducing music CD recorded in 2 channel, cassette tape and video tape made in Dolby Prologic into 5.1 channel.
– Surround speaker that makes you feel more natural, deeper and wider than existing Dolby Prologic.
(Ex-Profound sound adds more realistic presence from 5 speakers and sub woofer when you watch soccer match.)
DTS (Digital Theater System)
THX (Abbreviation of Tomlison Holman's Experiment)
– THX is not a sound format like a Dolby or DTS, but is a standard of sound. Like standard KS mark in Korea, THX means good certification in sound effects.
– THX issues certificate when a movie, theater or home theater system satisfy proper standards.
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5. Home Theater Components
Amp / Receiver
Amp: Device of raising output after tuning signal of CD player or DVD into unique sound timbre
Various Types and Usages of Amplifier
- For Listening to Music ¡æ For Music+ Movie
- ① AV Receiver (Dedicated Lamp for Home Theater) : Preferred by Home Theater mania.
➁ DVD Receiver (DVD Player+ Amp+ Radio Tuner) : Suitable for beginner of Home Theater
- Many A/V companies adopt DVD receiver type for expansion of easy and economic Home Theater system.
Popular Korean Products
- Popular for those who pursue relatively good sound quality at low price
- Product priced between 400,000 won~600,000 won are popular.
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Popular Foreign Products
– Popular for those who prefer profound sound volume/output(Hi-fi mania, Home Theater mania)
– Products in the range of middle and low price such as Denon, Yamaha, Onkyo (900,000~1.1 million won) are popular.
– There is very expensive product over 10 million won among foreign audio markers such as
Merdian, Mcintosh, Krell.
Type of Amp/Receiver
* Pre Amp
A device that receives, adjusts and sends signal from source devices (tape deck, CD player, radio tuner, etc.) to power amplifier.
* Power Amp
A device that amplifies the signal from Pre Amp into big sound so that speaker can vibrate.
* Integrated Amp
A device that combines pre-amp and power amp into one.
* Receiver
A device that contains tuner for radio broadcasting and integrated amp.
A/V Receiver
General Amplifier
– Support 2 channels (Left, Right Speaker)
– Mainly reproduce music
– No decoder : cannot cope with various sound formats
A/V Receiver
– Support multi-channel (support 5.1 channel)
Launch products supporting 6.1 channel and 7.1 channel recently.
– Reproduce music and movie sound realistically
– Has decoder
Can cope with various sound formats such as Dolby Digital.
DTS
– Rich input/output
– Use digital signal type and has no sound
A/V Receiver
A device of implementing home theater more conveniently with radio and A/V receiver embeded in DVD player.
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How to Select Amp/Receiver
- Select the products that can support both Dolby Digital and DTS since they require both for vivid sound
- Performance of amp gets better in output(W) but high output is a burden in narrow house.
- Important to match output(W) and capacity(§Ù) of amp and speaker.
- It is advantageous for beginners to purchase DVD receiver type that has amp and radio tuner in
DVD player
- If the budget is tight, it is recommended to continue to upgrade after purchasing a low-priced system.
* Computer will be of no use when it is outdated.
* But, home theater system can be utilized in various ways due to feature of A/V device.
Speaker
Speaker system consists of speaker unit and enclosure.
The type and price range are diverse from expensive big speaker to miniature thin speaker.
Difference between famous speaker and big A/V speaker
- Speaker units are similar(there are a few several speaker unit makers in the world)
- Design, finishing, assembling and tuning process of enclosure are different.
(Prestige speakers are made manually in whole processes of manufacturing)
Famous speaker brands: B&W, JBL, BOSE, Definitve, B&O, etc.
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Speaker Structure
Speaker Unit
Enclosure
- Divided into for high tone, middle tone and low tong
- Tweeter : for high pitch
Smallest unit suitable for feature of high tone reproduction
- Mid-Range : for middle tone
Mid sound reproduction ability is the most critical standard of speaker evaluation
- Woofer : for low tone
Much bigger size than other speaker unit
- Case of speaker unit
- Enclosure sways sound quality of reproduction
- Low tone is almost acattered without enclosure, and only high sound tone is heard.
Type of Speaker System
Full Range Speaker
A speaker system producing sound with one speaker unit.
2 Way Type
A speaker system designed using units of 2 woofers for bass and tweeter for high tone.
3 Way Type
Difference between foreign prestige speaker and big A/V maker's speaker.
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