Samsung HT-DB760 Specifications

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Samsung HT-DB760 Specifications | Manualzz

DVD RECEIVER AMP

BASIC MODEL :

HT-Q9

SERVICE Manual

DVD RECEIVER AMP SYSTEM Features

* Multi-Disc Playback & FM Tuner

* Dolby Pro Logic II

* DTS (Digital Theater Systems)

* TV Screen Saver Function

* Power Saving Function

* Customized TV Screen Display

MODEL : HT-Q9

- Confidential -

ELECTRONICS

© Samsung Electronics Co.,Ltd. AUG. 2006

Printed in Korea

Code no. AH68-01893Q

INDEX

Ch1 Precautions Ch8 Electrical Parts List

1-1. Safety Precautions 1-1

1-2. Servicing Precautions 1-2

1-3. Precautions for Electrostatically

Sensitive Device (ESDs) 1-3

1-4. Special Precations and Waring

Lables for Laser Products 1-4

1-5. Special Precautions for HDD 1-5

Electrical Parts List 8-1

Ch9 Block Diagram

1. MAIN BLOCK DIAGRAM 9-1

Ch10 Wiring Diagram

No Reference

Ch2 Product Descriptions

1. Product Feature 2-1

2. Specifications 2-2

3. Accessories 2-3

Ch11 PCB Diagram

1. PCB Layout 11-1

Ch3 Product Functions

1. Connecting the Speakers 3-1

2. Basic Functions 3-3

3. New Functions 3-10

Ch4 Adjustments

No Reference

Ch12 Schematic Diagram

1. MAIN-1 12-1

2. MAIN-2

3. AMP

4. FUNCTION

5. RF

6. SMSP

12-2

12-3

12-4

12-5

12-6

Ch5 How to disassemble

How to disassemble 5-1

Ch13 Circuit Description

1. Description 13-1

2. Function Description 13-3

Ch6 Troubleshooting

1. Main (Power) 6-1

2. Output Failure (for 2Ch Analog Input) 6-2

Ch7 Exploded View & Parts List

1. Total Exploded View 7-1

2. Parts List 7-2

Ch14 HTS Reference

1. HTS (Home Thater Sytsem) 14-1

2. About “Sound” 14-2

3. 5.1 Channel Sound 14-3

4. HTS Sonud Format 14-4

5. HTS Devices 14-5

1. Precautions

Follow these safety, servicing and ESD precautions to prevent damage and protect against potential hazards such as electrical shock and X-rays.

1-1 Safety Precautions

1. Be sure that all of the built-in protective devices are replaced.

2. When reinstalling the chassis and its assemblies, be sure to restore all protective devices, including control knobs and compartment covers.

3. Make sure that there are no cabinet openings through which people-particularly children--might insert fingers and contact dangerous voltages. Such openings include the spacing between the picture tube and the cabinet mask, excessively wide cabinet ventilation slots, and improperly fitted back covers.

4. Design Alteration Warning:

Never alter or add to the mechanical or electrical design of the unit. Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any design changes or additions will void the manufacturer's warranty.

5. Leakage Current Hot Check (Figure 1-1):

Warning: Do not use an isolation transformer during this test. Use a leakagecurrent tester or a metering system that complies with American National Standards

Institute (ANSI C101.1, Leakage Current for

Appliances), and Underwriters Laboratories

(UL Publication UL1410, 59.7).

With the unit completely reassembled, plug the AC line cord directly into a 120V AC outlet. With the unit's AC switch first in the ON position and then OFF, measure the current between a known earth ground

(metal water pipe, etc.) and all exposed metal parts. Examples: Handle brackets, metal cabinets, screwheads and control shafts. The current measured should not exceed 0.5 milliamp. Reverse the powerplug prongs in the AC outlet and repeat.

Fig. 1-1 AC Leakage Test

6. Insulation Resistance Cold Check:

(1) With the unit's AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs. (2) Set the power switch to ON. (3) Measure the resistance between the shorted AC plug and any exposed metallic parts. Example:

Screwheads, antenna, control shafts or handle brackets.

If any of the exposed metallic parts has a return path to the chassis, the measured resistance should be between 1 and 5.2

megohms. If there is no return path, the measured resistance should be "infinite." If the resistance is outside these limits, a shock hazard might exist. See Figure 1-2

Fig. 1-2 Insulation Resistance Test

Samsung Electronics 1-1

Precautions

1-1 Safety Precautions (Continued)

7. Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with parts that meet the original specifications.

Always determine the cause of damage or overheating, and correct any potential hazards

8. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the

AC and high voltage power supplies.

Always inspect for pinched, out-of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage. Make sure that no wires or components touch thermally hot parts.

9. Product Safety Notice:

Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual inspection. These safety features and the protection they give might be lost if the replacement component differs from the original--even if the replacement is rated for higher voltage, wattage, etc.

10 Components that are critical for safety are indicated in the circuit diagram by shading, or . Use replacement components that have the same ratings, especially for flame resistance and dielectric strength specifications. A replacement part that does not have the same safety characteristics as the original might create shock, fire or other hazards.

1-2 Servicing Precautions

Warning1: First read the "Safety Precautions" section of this manual. If some unforeseen circumstance creates a conflict between the servicing and safety precautions, always follow the safety precautions.

1. Servicing precautions are printed on the cabinet. Follow them.

2. Always unplug the unit's AC power cord from the AC power source before attempting to: (a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in parallel with an electrolytic capacitor.

3. Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used.

The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elements to their original position.

4. After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that the portion around the serviced part has not been damaged.

5. Check the insulation between the blades of the AC plug and accessible conductive parts

(examples: metal panels, input terminals and earphone jacks).

6. Insulation Checking Procedure: Disconnect the power cord from the AC source and turn the power switch ON. Connect an insulation resistance meter (500V) to the blades of the AC plug.

The insulation resistance between each blade of the AC plug and accessible conductive parts (see above) should be greater than 1 megohm.

7. Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all solid-state heat sinks are correctly installed.

8. Always connect a test instrument's ground lead to the instrument chassis ground

before connecting the positive lead; always remove the instrument's ground lead last.

1-2 Samsung Electronics

Precautions

1-3 Precautions for Electrostatically Sensitive Devices (ESDs)

1. Some semiconductor ("solid state") devices are easily damaged by static electricity.

Such components are called Electrostatically

Sensitive Devices (ESDs). Examples include integrated circuits and some field-effect transistors. The following techniques will reduce the occurrence of component damage caused by static electricity.

5. Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

6. Use only an anti-static solder removal device. Many solder removal devices are not rated as "anti-static" (these can accumulate sufficient electrical charge to damage ESDs).

2. Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your body by touching a known earth ground.

Alternatively, wear a discharging wrist-strap device. (Be sure to remove it prior to applying power--this is an electric shock precaution.)

3. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent accumulation of electrostatic charge.

7. Do not remove a replacement ESD from its protective package until you are ready to install it. Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum foil or other conductive materials.

8. Immediately before removing the protective material from the leads of a replacement

ESD, touch the protective material to the chassis or circuit assembly into which the device will be installed.

4. Do not use freon-propelled chemicals.

These can generate electrical charges that damage ESDs.

9. Minimize body motions when handing unpackaged replacement ESDs. Motions such as brushing clothes together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

1-4 Special Precautions and Warning Labels for Laser Products

(UL)

This Product Complies with

DHHS Rules 21CFR, Sub chapter J.At date of Manufacture

(CSA)

CERTIFIED ONLY TO CANADIAN

ELECTRICAL CODE.

CERTIFIE EN VERTU DU CODE

CANADIAN DE LELETRICITE

SEULEMENT

(UL,CSA,EU)

CLASS 1

LASER PRODUCT

Fig. 1-3 Warning Labels (Location: Enclosure Block)

(UL,CSA,SCAN)

CAUTION :

INVISIBLE LASER RADIATION WHEN OPEN

AND INTERLOCKS DEFEATEO AVOIDEXPOSURE TO BEAM

ADVARSEL:

USYNLIG LASERSTRÅLING VED ABNING

NÅR SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION

UNDGA UDSAETTELSE FOR STRALING

VARO:

AVATTAESSA JA SUOJALUKITUS OHITETTAESSA

OLET ALTTINA NAKYMATTÖMALLE LASERSATEILYLLE ALA

KATSO SATEESEEN!

VARNING:

OSYNLIG LASERSTRÅLNING NAR DENNA DEL

AR OPPNAD OCH SPARREN AR URKOPPLAD BETRAKTA

EJSTRÅLEN!

(EU)

UL : Manufactured for U.S.A. Market.

CSA : Manufactured for Canadian Market.

EU : Manufactured for European Market.

SCAN : Manufactured for Scandinavian

Market.

Fig. 1-4 Warning Labels (Location: Disc Clamper, Inner Side of Unit Door or Nearby Unit Chassis )

Samsung Electronics 1-3

Precautions

1-4 Special Precautions and Warning Labels for Laser Products (Continued)

1-4-1 Warnings

1. When servicing, do not approach the LASER exit with the eye too closely. In case it is necessary to confirm LASER beam emission, be sure to observe from a distance of more than 30 cm from the surface of the objective lens on the optical pick-up block.

2. Do not attempt to handle the objective lens when the DISC is not on the tray.

1-4-3 Handling the Optical Pick-up

1. Static electricity from clothing or the body may cause electrostatic breakdown of the laser diode in the Optical Pickup. Follow this procedure:

2. Place a conductive sheet on the work bench

(i.e., the black sheet used for wrapping repair parts.) Note: The surface of the work bench should be covered by a copper ground plane, which is grounded.

1-4-2 Laser Diode Specifications

Material: GaAs+ GaAlAs

Wavelength: 760-800 nm

Emission Duration: Continuous

3. The repair technician must wear a wrist strap which is grounded to the copper sheet.

Laser Output: 0.2 mw (measured at a

1.6 mm distance from the objective lens surface on the optical pick-up block.)

4. To remove the Optical Pickup block:

Place the set on the conductive sheet, and momentarily touch the conductive sheet with both hands. (While working, do not allow any electrostatic sources--such as clothes--to touch the unit.)

5. Ground the "Short Terminal" (located on the

PCB, inside the Pickup Assembly) before replacing the Pickup. This terminal should be shorted whenever the Pickup Assembly is lifted or moved.

6. After replacing the Pickup, reopen the Short

Terminal. See diagrams below:

1-5 Special Precautions for HDD

* HDD Data Maintenance Step

1. Since the data on the HDD is weak to mechanical shock, place the HDD in a safe location that is free from mechanical shock once it is removed from the main unit.

2. In order to safe keep the data on the HDD, back up the data before the repair or make sure not to place the HDD near any electrical appliance that generates a strong magnetic field.

1-4 Samsung Electronics

2. Product Descriptions

1. Product Feature

Multi-Disc Playback &

FM Tuner

Dolby Pro Logic II

DTS

(Digital Theater Systems)

TV Screen Saver

Function

Power Saving Function

Customized TV Screen

Display

Product Feature

The HT-Q9 combines the convenience of multi-disc playback capability, including DVD-VIDEO, VCD, CD, MP3-CD, WMA-CD, DivX, CD-R/RW, and DVD-R/RW, with a sophisticated FM tuner, all in a single player.

Dolby Pro Logic II is a new form of multi-channel audio signal decoding technology that improves upon existing Dolby Pro Logic.

DTS is an audio compression format developed by Digital Theater

Systems Inc. It delivers full-frequency 5.1 channel sound.

The HT-Q9 automatically brightens and darkens your TV screen after 3 minutes in the stop mode. The HT-Q9 automatically switches itself into the power saving mode after 20 minutes in the screen saver mode.

The HT-Q9 automatically shuts itself off after 20 minutes in stop mode.

The HT-Q9 allows you to select your favorite image during JPEG,

DVD or VCD playback and set it as your background wallpaper.

2-1 Samsung Electronics

2. Specifications

K

E

R

E

A

S

P

V

I

D

E

O

I

E

I

F

R

A

M

P

L

O

U

T

P

U

T

F

M

R

A

L

G

E

N

E

T

U

N

E

R

Power Consumption

Weight

Dimensions (W x H x D)

Operating Temperature Range

Operating Humidity Range

Usable Sensitivity

S/N Ratio

Distortion

Composite Video

Component Video

Front speaker output

Center speaker output

Rear speaker output

Subwoofer speaker output

Frequency range

S/N Ratio

Channel separation

Input sensitivity

Speaker system

Impedance

Frequency range

Output sound pressure level

Rated input

Maximum input

Dimensions (W x H x D)

Weights

20W

2.6Kg

430 x 65.5 x 256.5 mm

+5°C~+35°C

10% ~ 75%

10dB

60dB

0.5%

1.0Vp-p(75

Ω load)

Y:1.0Vp-p(75

Ω load)

Pr:0.70Vp-p(75

Ω load)

Pb:0.70Vp-p(75

Ω load)

30W x 2(4

)

30W(4

)

30W x 2(4

)

30W(8

)

20Hz~20KHz

75dB

60dB

(AUX)500mV

Front/Center/Rear speaker

4

140Hz~20KHz

5.1ch speaker system

Subwoofer speaker

8

35Hz~140Hz

85dB/W/M

30W

60W

85dB/W/M

30W

60W

Front/Rear

92 x 102x 96.5 mm

Center

Front/Rear

Center

0.5 Kg/0.5 Kg

0.5 Kg

130 x 320 x 314 mm

3.3 kg

Samsung Electronics 2-2

3. Accessories

Accessories Name

Remote control

Audio Cable

FM antenna

Code No.

AH59-01657A

AH39-40001Y

AH42-00021A

2-3 Samsung Electronics

6. Troubleshooting

1. Main (Power)

Samsung Electronics 6-1

2. Output Failure (for 2Ch Analog Input)

6-2 Samsung Electronics

7.Exploded View & Parts List

1. Total Exploded View

AC080

AC025

AD510

7-1

AK250

AB030

AC010

AD502

AR011

AL180

AK290

AS260

AR011

AD370

AK420

AK170

Samsung Electronics

2. Parts List

LOC.

AS260

AK420

AD370

AK170

AC025

AD510

-

-

AK250

AD502

AR011

AB030

AC010

AL180

AK290

-

-

AC080

PART NAME

KNOB-MIC

DOOR-DVD

RUBBER-FOOT

BADGE-BRAND

CABINET-FRONT

LENS-STAND BY

KNOB-POWER

SPRING-DOOR

KNOB-VOL

DECO-VOL

KNOB-FUNCTION

CABINET-BOTTOM

DOOR-TRAY

HOLDER-MECHA

HOLDER-VFD

HOLDER-IC

H-SINK AMP

CABINET-TOP

A

B

C

D

TAPTITE SCREW

TAPTITE SCREW

TAPTITE SCREW

TAPTITE SCREW

PART CODE MATERAIL SPEC Q'TY REMARK

AH64-03687B

AH64-04017A

AH73-00005A

AH64-03746A

AH64-04014A

AH67-00438A

AH64-04016A

AH61-02122B

AH64-04030A

AH64-03789A

AH64-04015A

AH64-04012A

AH64-02320B

AH61-02182A

AH61-02181A

AH61-02183A

AH62-00146B

AH64-04013A

ABS

ABS

RUBBER

AL

HIPS

PMMA

ABS

SUS304

ABS

PC

ABS

SECC 0.6T

ABS

ABS

ABS

ABS+GF30%

AL

SECC 0.5T

1

1

1

1

2

1

1

1

1

1

1

1

1

1

1

2

1

2

SNA

SNA

SNA

SNA

SNA

SNA

SNA

6003-001499

6003-001561

6003-000280

6003-000275

BWH 3*10 SILVER

BH 3 *6 YEL

BH 3*25 YEL

BH 3*10 BLACK

4

3

3

2

Samsung Electronics 7-2

DR29

DR30

DR31

DR55

DR57

DDA1

DIC2

DR27

DR28

DR281

CP20

DC18

DC30

DD1

DD2

CN1

CNP1

CNP1-

CP11

CP18

DR64

EJACK

ER1

ER2

FL1

FS01

FUSEC

HC20

HC23

CK21

CK23

CK26

CK7

CK9

CK1

CK11

CK14

CK16

CK19

C2RR

C37

C3A

C3S

C4P

CD000

CD300

CD340

CD380

CD520

AR34

AR8

C1P

C1S

C2P

AR1

AR11

AR15

AR3

AR33

AC2

AC23

AC7

ACR24

AD510

ADIC3

AIC2

AIC3

AIC4

AIC5

8. Electrical Parts List

Location no.

Code no.

Description & Specification Remarks

*** HT-Q9 Parts List ***

3711-000483

3711-000471

AH39-00754A

2401-001102

2402-001198

2401-001364

2203-005148

2203-000189

0407-000116

0403-001062

0404-000156

1201-001842

2007-000124

2007-000109

2007-000075

2007-000120

2007-000090

2007-000458

2007-000134

2007-000082

2007-000483

3722-000363

2007-000682

2007-000931

AH07-00190A

3404-000165

3602-000147

2203-001640

2203-000315

2203-000783

2401-001508

2401-000414

2203-000260

2203-001537

AH61-01741A

AH66-00217A

AH66-00262A

AH66-00215A

3409-001138

2402-000008

2203-000716

2401-001952

2401-000480

2401-000918

2401-001887

2402-000130

2203-000595

2203-005550

2203-001058

2401-000651

2203-002398

2203-000626

2007-000081

AH64-02320A

1002-001392

1201-002342

1204-002548

0801-002455

0801-001055

2007-000130

2007-000309

2007-000072

2007-000086

2007-000102

2007-000121

2007-000091

2203-000257

2305-000412

2401-000847

C-AL;2.2uF,20%,50V,GP,TP,4x7,5

C-CER,CHIP;22nF,10%,50V,X7R,1608

C-CER,CHIP;0.022nF,5%,50V,C0G,1608

R-CHIP;2.7Kohm,5%,1/10W,TP,1608

DOOR-TRAY;HT-DB300,ABS,-,-,-,-,NTR,-

IC-A/D CONVERTER;WM8775EDS,24BIT,SSOP,28

IC-AUDIO AMP;S1S4001,SSOPH,56P,18.4x7.5m

IC-MODULATOR;S5M0061,TQFP,64P,10x10mm,PL

IC-CMOS LOGIC;74LV74,DUAL D F/F,TSSOP,14

IC-CMOS LOGIC;74VHC08,AND GATE,SOP,14,15

R-CHIP;39Kohm,5%,1/10W,TP,1608

R-CHIP;10ohm,5%,1/10W,TP,1608

R-CHIP;47ohm,5%,1/10W,TP,1608

R-CHIP;5.6Kohm,5%,1/10W,TP,1608

R-CHIP;100Kohm,5%,1/10W,TP,1608

R-CHIP;820ohm,5%,1/10W,TP,1608

R-CHIP;12Kohm,5%,1/10W,TP,1608

C-CER,CHIP;10nF,10%,50V,X7R,1608

C-FILM,LEAD-PEF;470nF,5%,63V,TP,-,5mm

C-AL;220uF,20%,35V,GP,TP,10x12mm,5m

C-CER,CHIP;0.33nF,5%,50V,C0G,1608

C-AL;47uF,20%,16V,GP,TP,6.3x5,5

C-AL;10uF,20%,16V,GP,TP,4x7,5

C-CER,CHIP;10nF,10%,50V,X7R,2012

C-CER,CHIP;1nF,10%,50V,X7R,TP,2012

BASE-MAIN;K100,ABS,-,-,-,-,-

GEAR-TRAY;CMS-SD100,POM,-,-,-,BLACK,-,-,

LEVER-LIFT;-,ABS,-,-,-,-,BLK,-

PULLEY MOTOR;CMS-SD100,POM,-,WHITE,-,-,-

SWITCH-DETECTOR;5V DC,1A,DPST,30GF,-

C-AL,SMD;47uF,20%,16V,GP,TP,6.6x6.6x5.4

C-CER,CHIP;3.3nF,10%,50V,X7R,2012

C-AL;4.7uF,20%,50V,GP,TP,5x7mm,5mm

C-AL;10uF,20%,50V,GP,TP,5x11,5

C-AL;22uF,20%,16V,GP,-,6.3x7,5

C-AL;0.1uF,20%,50V,-,TP,4x7mm,5

C-AL,SMD;2.2uF,20%,50V,GP,TP,4.3x4.3x5.

C-CER,CHIP;0.22nF,5%,50V,C0G,2012

C-CER,CHIP;82nF,10%,50V,X7R,TP,2012,-

C-CER,CHIP;0.56NF,5%,50V,C0G,TP,2012

HEADER-BOARD TO CABLE;BOX,5P,1R,2mm,STRA

HEADER-BOARD TO CABLE;3WALL,4P,1R,2mm,ST

LEAD CONNECTOR;HT-P50,4P,2mm,70mm,1007#2

C-AL;330uF,20%,16V,GP,TP,8x11.5mm,5

C-AL,SMD;330UF,20%,6.3V,GP,TP,6.6X6.6X7

C-AL;470uF,20%,16V,GP,TP,10x12.5,5

C-CER,CHIP;100nF,10%,16V,X7R,1608

C-CER,CHIP;100nF,+80-20%,25V,Y5V,1608

DIODE-ARRAY;DAP202K,80V,100mA,CK2-3,SOT-

DIODE-ZENER;UDZ4.7B,4.55-4.75V,200MW,SOD

DIODE-SCHOTTKY;RB441Q,40V,350MA,DO-34,TP

IC-OP AMP;TL3472CD,SO,TP,8P,-,DUAL,-,PAL

R-CHIP;2.2Kohm,5%,1/10W,TP,1608

R-CHIP;1Mohm,5%,1/10W,TP,1608

R-CHIP;220ohm,5%,1/10W,TP,1608

R-CHIP;680ohm,5%,1/10W,TP,1608

R-CHIP;10Kohm,5%,1/10W,TP,1608

R-CHIP;18Kohm,5%,1/10W,TP,1608

R-CHIP;33Kohm,5%,1/10W,TP,1608

R-CHIP;3.3Kohm,5%,1/10W,TP,1608

R-CHIP;1OHM,5%,1/8W,TP,2012

JACK-PHONE;9P,AU,BLK,ANGLE

R-CHIP;3.3Kohm,1%,1/8W,TP,2012

R-CHIP;470ohm,5%,1/8W,TP,2012

VF DISPLAY;HNV-08SS71,HT-Q9,75x18.5x6.8,

SWITCH-TACT;12V,50mA,160gf,6x6mm,SPST

FUSE-CLIP;250V,7.5A,30mohm

C-CER,CHIP;0.39nF,10%,50V,X7R,1608

C-CER,CHIP;0.12nF,5%,50V,C0G,1608

Location no.

Code no.

HC26 2203-001052

MR66

MR93

MREG1

MREG2

MV1

PB7

PC2

PC24

PS300

PS300

MJ4

MQ1_1

MQ2

MR29

MR30

MR32

MR35

MR54

MR63

MR65

Q4

Q5

R1P

R24

R2P

R2RR

R39

R3RR

R5SS

R7FL

RAC1

MIC2

MIC3

MIC4

MIC6

MIC8

MD3

MDIC1

MDIC2

MIC1

MIC1_

MC31

MC40

MC43

MC45

MC5

MC50

MC52

MC53

MC6

MCON8

KR5

KR6

L1SS

L2P

L5P

LD1

MC10

MC16

MC18

MC29

KIC2

KR1

KR2

KR3

KR4

HEATS

HEATS

HEATS

HL23

IC HO

3708-002023

0504-000156

0504-000128

2007-000100

2007-000093

2007-000087

2007-000962

2007-000694

2011-000651

2007-000643

2007-000077

2007-000118

1203-002425

1203-002935

2101-001068

3301-001495

2402-001042

2401-001975

AH59-01687C

AH59-01731C

0501-000303

0501-000369

2007-000502

2007-000116

2007-001806

2007-000462

2007-000094

2007-000518

2007-000253

2007-000695

2003-000587

2203-001656

2203-001103

2203-000646

2203-000440

2203-005221

2402-001049

2203-005065

2401-000042

2203-006170

AH40-00129A

0403-000509

1003-001450

1003-001508

0801-002683

1002-001448

1204-002233

1107-001505

1204-002224

1103-001334

1105-001535

AH62-00062G

AH62-00146B

AH62-30061F

2703-001254

AH61-02183A

1201-001572

2007-001198

2007-000468

2007-000221

2007-000241

2007-000267

2007-000493

2702-001028

3301-000297

3301-000314

0601-001238

2203-000815

2203-000972

2203-000998

2402-001009

Description & Specification Remarks

C-CER,CHIP;0.56nF,10%,50V,X7R,TP,1608

HEAT SINK-TR;HT-DS400,AL EXTR,-,-,-,-,-,

HEAT SINK-AMP;COMMON,AL,.,38,62,-,-,-,36

HEAT SINK-TR;-,AL,-,15,40,-,-,-,-

INDUCTOR-SMD;1.8uH,10%,2012

HOLDER-IC;HT-Q9,ABS+GF30%,-,-,-,-,-

IC-PREAMP;2011,SIP,8P,19.2x6.5mm,SINGLE,

R-CHIP;820ohm,1%,1/8W,TP,2012

R-CHIP;1Kohm,5%,1/8W,TP,2012

R-CHIP;1.2Kohm,5%,1/8W,TP,2012

R-CHIP;1.5Kohm,5%,1/8W,TP,2012

R-CHIP;1.8Kohm,5%,1/8W,TP,2012

R-CHIP;2.2Kohm,5%,1/8W,TP,2012

INDUCTOR-RADIAL;22UH,10%,10.3X18MM

BEAD-AXIAL;25ohm,3.6x1.2x5.7mm,-,TP,-,-,

BEAD-SMD;120ohm,1.6x0.8x0.8mm,150mA,,,,

LED;LTL-1CHESS-UA,ROUND,RED,3.1mm,697nm

C-CER,CHIP;0.033nF,5%,50V,C0G,1608

C-CER,CHIP;47nF,10%,16V,X7R,1608

C-CER,CHIP;0.047nF,5%,50V,C0G,1608

C-AL,SMD;100uF,20%,6.3V,GP,TP,5.3x5.3x5

C-CER,CHIP;0.47nF,5%,50V,NP0,1608

C-CER,CHIP;6.8nF,10%,50V,X7R,1608

C-CER,CHIP;0.024NF,5%,50V,C0G,TP,1608

C-CER,CHIP;1nF,10%,50V,X7R,1608

C-CER,CHIP;15nF,10%,50V,X7R,1608

C-AL,SMD;10uF,20%,16V,GP,TP,3.3x3.3x5.4

C-CER,CHIP;1000nF,+80-20%,10V,Y5V,1608

C-AL;100uF,20%,16V,GP,TP,6.3x7,5

C-CER,CHIP;220nF,10%,16V,X7R,1608

TUNER;KST-MW004FV1-E50LKOR,HT-Q40,FM

DIODE-ZENER;MTZJ5.6B,5.4-5.7V,500MW,DO-3

IC-MOTOR DRIVER;BA5954FM,SOP,28P,300MIL,

IC-MOTOR DRIVER;FAN8082DTF,SOP,8P,200MIL

IC-CMOS LOGIC;74HCT245,TRANSCEIVER,TSSOP

IC-A/D CONVERTER;AK5358ET,24,TSSOP,16P,5

IC-VOLUME/TONE CONT.;PT2399S,SO,16P,300M

IC-FLASH MEMORY;49BV162AT,16Mbit,1Mx16/2

IC-PAL/NTSC DECODER;ES6698FD,PQFP,208P,2

IC-EEPROM;K524A60X81,1KX8BIT,SOP,8P,5X4M

IC-DRAM;M12L128168A-7T,-,128MBIT,4X2MX

CONNECTOR-FPC/FFC/PIC;6P,1MM,SMD-S,TIN,N

TR-DIGITAL;KSR2103,PNP,200MW,22K/22K,SOT

TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-23,TP

R-CHIP;68Kohm,5%,1/10W,TP,1608

R-CHIP;20Kohm,5%,1/10W,TP,1608

R-CHIP;6.8Kohm,5%,1/10W,TP,1608

R-CHIP;5.1Kohm,1%,1/10W,TP,1608

R-CHIP;3.3ohm,5%,1/8W,TP,2012

R-NET;10ohm,5%,1/16W,L,CHIP,8P,TP,32

R-CHIP;270ohm,5%,1/10W,TP,1608

R-CHIP;470ohm,5%,1/10W,TP,1608

R-CHIP;390ohm,5%,1/10W,TP,1608

IC-POSI.FIXED REG.;AP1117,SOT-223,3P,138

IC-POSI.ADJUST REG.;AIC1117ACE,TO-252,3P

VR-ROTARY;10KB,-,1/20W,SIDE

BEAD-SMD;120ohm,2012,2500mA,TP,115ohm/1

C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.6x5.

C-AL;47uF,20%,16V,GP,TP,5x11mm,5mm

SPEAKER SYSTEM;PS-Q9,XSH,FRONT,REAR,CENT

SPEAKER SYSTEM;PS-Q9,XSH,SUB W/F SPEAKER

TR-SMALL SIGNAL;KSA733,PNP,250mW,TO-92,T

TR-SMALL SIGNAL;KSC2331-Y,NPN,1000mW,TO-

R-CHIP;2.2ohm,5%,1/8W,TP,2012

R-CHIP;120ohm,5%,1/10W,TP,1608

R-CHIP;1.5ohm,5%,1/10W,BK,1608

R-CHIP;18ohm,5%,1/8W,TP,2012

R-CHIP;22Kohm,5%,1/10W,TP,1608

R-CHIP;2.7Kohm,5%,1/8W,TP,2012

R-CHIP;1.5ohm,5%,1/4W,TP,3216

R-CHIP;3.3ohm,5%,1/10W,TP,1608

R-METAL OXIDE(S);22ohm,5%,1W,AA,TP,3.3x9

Samsung Electronics 8-1

Location no.

Code no.

SMLF0

SMPC0

SMPN0

SMQ01

SMR01

SMR04

SMR05

SMR08

SMR43

SMR44

SMR46

SMD43

SMD50

SMFU0

SMIC0

SMIC0

SMIC4

SMIC4

SMIC4

SMIC4

SMIC4

SMC48

SMC49

SMC50

SMC60

SMC61

SMC64

SMCM0

SMD02

SMD04

SMD41

SMC08

SMC09

SMC10

SMC11

SMC16

SMC18

SMC41

SMC43

SMC44

SMC46

RQ5

RR17

RR34

RR6

RR9

SMBC0

SMBD0

SMC01

SMC03

SMC04

RK17

RK20

RK21

RK23

RK37

RK5

RK8

RL2

RP16

RPW6

RG3

RIC1

RK1

RK12

RK14

RC5

RCN1

REM1

REN1

RFG1

RAU2

RC1

RC10

RC15

RC2

RC25

RC27

RC31

RC40

0402-000268

0401-000005

3601-000301

1203-003336

1203-004084

1203-000294

1203-001586

1203-001589

1203-000165

AC14-12006D

AH29-00013A

0604-000117

3711-000190

0501-000630

2001-000242

2001-000302

2001-000786

2003-000738

2007-000830

2007-001043

2007-000030

2301-000474

2301-000449

2401-002300

2301-000375

2305-001016

2201-000551

2401-003139

2401-003378

2401-001020

2401-000357

2401-000804

2401-001355

2401-000118

2201-000129

2401-000740

2401-000598

2301-001220

0402-001148

0402-000012

0402-001377

2007-000766

2007-000477

2007-000123

2007-000822

2007-000872

2007-001177

2007-000409

3301-001069

2007-000824

2007-000113

0501-000632

2007-000097

2007-000071

2007-000308

2007-000122

AC27-92001M

0402-000003

2201-000987

2201-002213

2401-003472

2007-000119

2203-000681

2203-000491

2203-001222

2203-000888

2203-000357

2203-000575

2203-000975

2203-001634

2402-000167

3708-001765

0609-001198

3406-001109

2007-000033

2007-000300

1201-002059

2007-001071

2007-000029

2007-000981

Description & Specification Remarks

C-FILM,LEAD-PEF;8.2nF,10%,50V,TP,6.5x12x

C-FILM,LEAD-PEF;47nF,10%,50V,TP,9.5x12.5

C-AL;47uF,20%,50V,GP,TP,6.3x11,5

C-FILM,LEAD-PEF;100nF,5%,50V,TP,11x12.5x

C-FILM,LEAD-PEF;10nF,10%,630V,TP,12.5x6.

C-CERAMIC,DISC;0.47NF,10%,1KV,Y5P,TP,6.3

C-AL;1000uF,20%,25V,WT,TP,10*20,5mm

C-AL;1000uF,20%,10V,WT,-,10x12.5,5

C-AL;3.3UF,20%,50V,GP,TP,4X7,5

C-AL;100uF,20%,50V,GP,-,8x11.5,3.5m

C-AL;220uF,20%,16V,GP,TP,8x9mm,5

C-AL;470uF,20%,10V,GP,TP,8x11.5mm,5

C-AL;1000uF,20%,10V,GP,TP,10x12.5,5

C-CERAMIC,DISC;0.1nF,10%,1000V,Y5P,-,7x4

C-AL;2200uF,20%,50V,LZ,TP,18x40,7.5

C-AL;1uF,20%,50V,GP,TP,4x7,5

C-FILM,LEAD-PPF;100nF,10%,275V,BK,18x6x1

DIODE-RECTIFIER;1N4936,400V,1.0A,DO-41,T

DIODE-RECTIFIER;UF4007,1KV,1A,DO-41,TP

DIODE-RECTIFIER;UG4D,200V,4A,TO-220F,TP

DIODE-RECTIFIER;SB360,60V,3A,DO-201AD,TP

DIODE-SWITCHING;1N4148,75V,150mA,DO-35,T

FUSE-CARTRIDGE;250V,6.3A,TIME-LAG,GLASS,

IC-PWM CONTROLLER;KA5M0365,TO-220F-4L,4P

IC-PWM CONTROLLER;FSDM0365RNB,DIP,8P,9.8

IC-POSI.FIXED REG.;7808,TO-220,3P,-,PLAS

IC-POSI.FIXED REG.;278R33,TO-220F,4P,-,P

IC-POSI.FIXED REG.;278R05,TO-220F,4P,-,P

IC-POSI.ADJUST REG.;78R12,TO-220,4P,-,PL

IC;KA431Z,TO-92,TAPING

FILTER LINE;HT-Q9,SQE-2424(SM100S,HM5A,-

PHOTO-COUPLER;TR,130-260%,200mW,DIP-4,ST

HEADER-BOARD TO CABLE;1WALL,2P,1R,7.92MM

TR-SMALL SIGNAL;KTA1268,PNP,300MW,TO-92,

R-CARBON;1.5MOHM,5%,1/4W,AA,TP,2.4X6.4M

R-CARBON;10OHM,5%,1/8W,AA,TP,1.8X3.2MM

R-CARBON;47KOHM,5%,1/8W,AA,TP,1.8X3.2MM

R-METAL OXIDE(S);56Kohm,5%,2W,AA,TP,4x12

R-CHIP;39Kohm,5%,1/8W,TP,2012

R-CHIP;56ohm,5%,1/8W,TP,2012

R-CHIP;560ohm,5%,1/8W,TP,2012

R-CHIP;560ohm,5%,1/10W,TP,1608

C-CER,CHIP;0.027nF,5%,50V,C0G,1608

C-CER,CHIP;2.2nF,10%,50V,X7R,1608

C-CER,CHIP;0.82nF,10%,50V,X7R,1608

C-CER,CHIP;4.7nF,10%,50V,X7R,1608

C-CER,CHIP;0.15nF,5%,50V,C0G,1608

C-CER,CHIP;220nF,10%,25V,X7R,2012

C-CER,CHIP;47nF,10%,25V,X7R,TP,1608,-

C-CER,CHIP;33nF,10%,50V,X7R,1608

C-AL,SMD;100uF,20%,10V,-,-,6.6x6.6x5.7m

CONNECTOR-FPC/FFC/PIC;24P,0.5mm,SMD-S,SN

MODULE REMOCON;VERTICAL,19MM,TR

SWITCH-ROTARY;5V,0.5mA,SPDT,12mm

R-CHIP;0ohm,5%,1/4W,TP,3216

R-CHIP;10Kohm,5%,1/8W,TP,2012

IC-RF AMP;ES6603SF,LQFP,64P,10X10MM,SING

R-CHIP;6.8Kohm,5%,1/8W,TP,2012

R-CHIP;0ohm,5%,1/8W,TP,2012

R-CHIP;5.6Kohm,5%,1/8W,TP,2012

R-CHIP;330ohm,5%,1/8W,TP,2012

R-CHIP;1Mohm,5%,1/8W,TP,2012

R-CHIP;1.5Kohm,5%,1/10W,TP,1608

R-CHIP;390ohm,5%,1/8W,TP,2012

R-CHIP;4.7Kohm,5%,1/8W,TP,2012

R-CHIP;8.2Kohm,5%,1/8W,TP,2012

R-CHIP;15Kohm,5%,1/8W,TP,2012

BEAD-SMD;120ohm,1.6x0.8x0.8mm,200mA,TP,

R-CHIP;390ohm,5%,1/4W,TP,3216

R-CHIP;33ohm,5%,1/10W,TP,1608

TR-SMALL SIGNAL;2SB1197K,PNP,200mW,SOT-2

R-CHIP;47Kohm,5%,1/10W,TP,1608

R-CHIP;22ohm,5%,1/10W,TP,1608

R-CHIP;10ohm,5%,1/8W,TP,2012

R-CHIP;1.2Kohm,5%,1/10W,TP,1608

COIL-INDUCTOR;RH3.5X6.5RS,BEAD(RADIAL),-

DIODE-BRIDGE;DF06M,600V,1A,DIP-4,ST

C-CERAMIC,DISC;2.2NF,20%,400V,Y5U,BK,12.

C-CERAMIC,DISC;0.47nF,10%,400V,Y,-,9.5X7

C-AL;100UF,20%,250V,GP,BK,16X31.5MM

8-2

Location no.

Code no.

VJ5

VL29

VQ3

VR17

VR51

UX1

VC2

VC38

VC49

VFD H

UR24

UR46

UR51

UR6

UR9

UQ1

UR11

UR12

UR17

UR19

VR56

VR7

WC5

WC9

X2

XD9

ZD5

UC2

UC6

UC8

UD10

UIC1

SMZD0

SPK1

UC12

UC16

UC18

SMR49

SMR51

SMR62

SMR64

SMR68

SMT01

SMT02

SMTH0

SMVR0

2007-001167

2007-000115

2401-002042

2203-000727

2801-004284

0401-001099

0403-000355

3101-001300

AH59-01592A

3301-001760

3809-001627

3809-001630

AH39-00884A

AH61-01742A

AH61-01743A

AH63-00695A

AH63-00905A

AH66-00261A

AH73-00058A

AH61-02182A

3301-000132

6902-000360

AH39-00257J

AH39-40001V

AH42-00021A

AH59-01615E

AH59-01657A

AH92-02518C

0501-000341

2007-000065

2007-000402

2007-000084

2007-000052

2007-000074

2007-000106

2007-000449

2007-000070

2007-000078

2802-000188

2401-000303

2401-001092

2203-000280

AH61-02181A

3722-002027

2703-000272

0501-000002

2007-000076

2007-001134

2007-000781

2001-000440

2007-000457

2007-000290

2007-000586

AH26-00338A

AH26-00337A

2006-001004

1405-000001

0403-001170

3716-001243

2401-000240

2203-000206

2203-000236

2401-000759

2409-000123

2203-005249

0401-001090

AH09-00111A

Description & Specification Remarks

R-CHIP;33ohm,5%,1/8W,TP,2012

R-CARBON;1OHM,5%,1/8W,AA,TP,1.8X3.2MM

R-CHIP;18Kohm,5%,1/8W,TP,2012

R-CHIP;100ohm,5%,1/8W,TP,2012

R-CHIP;22Kohm,5%,1/8W,TP,2012

TRANS POWER;-,HT-Q9,1.2mH,15,-,VARIABLE,

TRANS POWER;EER2828(PL-5,PM5),HT-Q9,620,

R-CEMENT;2.7OHM,5%,2W,CB,BK,11X20.5X7.5

VARISTOR;470V,1250A,14x7.5mm,TP

DIODE-ZENER;MTZJ9.1C,8.89-9.29V,500MW,DO

TERMINAL-BLOCK;-,12P,14mm,-,-

C-AL;100uF,20%,10V,GP,TP,5x11,5

C-CER,CHIP;100nF,10%,50V,X7R,2012

C-CER,CHIP;0.1nF,5%,50V,C0G,1608

C-AL;220nF,20%,50V,GP,TP,5x11mm,5mm

C-EDL;47000uF,4uA,5.5V,-,BK,-,5mm

C-CER,CHIP;100nF,10%,50V,X7R,1608

DIODE-SWITCHING;1SS355,80V,100MA,SOD-323

IC MICOM;GMS87C2020,HT-Q9,64PIN,2.7V~5.

TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-

R-CHIP;2.2Mohm,5%,1/10W,TP,1608

R-CHIP;150ohm,5%,1/10W,TP,1608

R-CHIP;4.7Kohm,5%,1/10W,TP,1608

R-CHIP;10Kohm,1%,1/10W,TP,1608

R-CHIP;100ohm,5%,1/10W,TP,1608

R-CHIP;220Kohm,5%,1/10W,TP,1608

R-CHIP;180ohm,5%,1/8W,TP,2012

R-CHIP;0ohm,5%,1/10W,TP,1608

R-CHIP;1Kohm,5%,1/10W,TP,1608

RESONATOR-CERAMIC;8MHz,0.5%,TP,10.0x5.0x

C-AL;100uF,20%,25V,GP,TP,6.3x11,5

C-AL;330uF,20%,10V,GP,-,8x11.5,2.5m

C-CER,CHIP;0.01nF,0.5pF,50V,C0G,1608

HOLDER-VFD;HT-Q9,ABS,-,-,-,-,-

JACK-PIN;6P/6C,SN,YEL/GN/WH/BL/RD,ANGLE

INDUCTOR-SMD;1.2uH,10%,2012

TR-SMALL SIGNAL;KSA812,PNP,150MW,SOT-23,

R-CHIP;330ohm,5%,1/10W,TP,1608

R-CHIP;68ohm,5%,1/10W,TP,1608

R-CHIP;75ohm,5%,1/10W,TP,1608

R-CHIP;82ohm,5%,1/10W,TP,1608

C-AL;220uF,20%,10V,GP,TP,6.3x11,5

C-CER,CHIP;3.9nF,10%,50V,X7R,2012

CRYSTAL-SMD;27MHZ,10PPM,28-AAN,20PF,30OH

DIODE-SWITCHING;1N4148WS,75V,150mA,SOD-3

DIODE-ZENER;UZ5.1BSB,5-5.2V,500MW,DO-35,

MOTOR-DC;2670RPM,9G.CM,3.9V,160MA

DECK-CD;-,CMS-S75RB,MAGNET,23.2mm,3V,S

CORE-FERRITE;-,33x12x8mm,-,-

CABLE-FLAT;30V,80C,90mm,6P,1mm,UL20696

CABLE-FLAT;30V,80C,175mm,24P,0.5mm,UL206

LEAD CONNECTOR-ASSY;SDM-D12,-,-,5P,150mm

BODY CLAMPER-UPPER;-,POM,0.8,-,-,-,WHT,-

BODY CLAMPER-LOWER;-,POM,0.8,-,-,-,WHT,-

TRAY-DISK;SDM-D11,ABS,-,-,-,-,GRAY,-

FELT-DECK;SDM-D12,FELT,0.8,10,18,-,DOUBL

CAM-SLIDE;K100,POM,-,-,WHT,-,-,-,-

SILICON/RUBBER-DECK;CMS-SD100,SILICON,D1

HOLDER-MEHCA;HT-Q9,ABS,-,-,-,-,-

CORE-FERRITE;AC,28.8x19.3x7.5mm,1400,290

BAG PE;HDPE,T0.03,L360,W250,TRP,8,1,P

CBF-POWER CORD;DVC90,-,CP2(5.0),250V,2.5

CABLE-AUDIO CABLE;-,-,1P-1P,3000MM,-,-,-

ANT FM T;T18011F-1,75 ohm,1800mm

DECK-1DVD MECHA;AH59-01615E,HT-Q20,T TYP

REMOCON-ASSY;HT-Q9,SAMSUNG,50,200,-,60,-

ASSY PCB-MAIN3;HT-Q9/XEU,MAIN,ENGLAND

Samsung Electronics

9. BLOCK DIAGRAM

9-1. MAIN BLOCK DIAGRAM

1-1. MAIN

Samsung Electronics

- This Document can be used without Samsung’s authorization -

9-1

10. Wiring Diagram

1-1. MAIN

Samsung Electronics

- This Document can be used without Samsung’s authorization -

10-1

11. PCB Diagram

11-1. PCB Layout

1-1. MAIN

Samsung Electronics

- This Document can be used without Samsung’s authorization -

11-1

12. Schematic Diagram

1. MAIN-1

1-1. MAIN

Samsung Electronics

- This Document can be used without Samsung’s authorization -

12-1

2. MAIN-2 - This Document can be used without Samsung’s authorization -

12-2 Samsung Electronics

3. AMP

- This Document can be used without Samsung’s authorization -

Samsung Electronics 12-3

4. FUNCTION - This Document can be used without Samsung’s authorization -

12-4 Samsung Electronics

5. RF

- This Document can be used without Samsung’s authorization -

Samsung Electronics 12-5

6. SMSP - This Document can be used without Samsung’s authorization -

12-6 Samsung Electronics

13. Circuit Description

1. Description (HT-Q9)

DECK

MPEG

Samsung Electronics

MAIN

TUNER

AMP

FRONT

SMPS

13-1

2. Function Description

13-2 Samsung Electronics

1. Definition of Home Theater

What is Home Theater?

Home theater system is the proper combination of audio and video system at home which enable you to enjoy more dynamic sound and vivid image in a wide screen of movie theater.

This effect can be implemented with wide screen, high quality projector, Dolby digital and DTS sound effects.

Now you can enjoy surround sound field wieh realistic presence and Dolby digital at your home as if you are in a movie theater.

As time goes by, home theater system has become recognized as a system that helps listen sound closer to the original sound rather than video. In this 21st century, most movie and animation films will be produced for home theater and reproduce sound closer to original sound.

14-1 Samsung Electronics

2. Concept of Sound

What is Sound Range?

People can listen to the sounds with frequency between 200Hz~20.000Hz

As time goes by, home theater system has become recognized as a system that helps listen sound closer to the original sound rather than video. In this 21st century, most movie and animation films will be produced for home theater and reproduce sound closer to original sound.

What is Sound Pressure?

* A measure of how well speaker converts electric signal it receives to sound

* Unit of sound pressure is decibel and mainly measures the size of sound at 1 m away after sending 1 W power from speaker.

❋ High sound pressure doesn't necessary mean good performance

What is Timbre?

* How well the unique sound of musical instrument is expressed

* Better if violin and cello sound are accurately distinguished. Good timbre means high quality.

Samsung Electronics 14-2

2. Concept of Sound

By reproducing standard channels used during soundtrack recording of movie, it outputs 3 sounds of movie (words / music / sound effects) from 6 different speakers and provides surround dynamic sound effects so that you can even feel the direction of sound.

5 channel

A

B

Center Speaker : Voice ( over 95%)

Front Speaker (L/R) : Music Sound

C Rear Speaker (L/R) : Sound Effect

0.1 channel

D Subwoofer : Low Sound Effect

* Power amp is embedded in active sub woofer

* Require separate amp since there is no amp in passive sub woofer

❋ No difference in performance of active sub woofer and passive sub woofer

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4. Home Theater Sound Format

Overview

* As home theater has recently penetrated deep into consumer's market in Korea, Dolby digital and

DTS, the sound format for 5.1 channel home theater, are the mainstream in the market.

* Expanded type of 6.1 channel or 7.1 channel are recently released in the market, but there are not much DVD title that can support expanded type.

1958 1Ch Mono/ 2Ch Stereo

1982 Matrix 3Ch Dolby Surround

1987 Matrix 4Ch Dolby Pro Logic

1995 5.1Ch Dolby Digital

1997 DTS (Digital Theater System)

1999 Matrix 6.1Ch Dolby Digital Sourround EX

Home theater format...

Samsung Electronics

Stereo

Is used in general audio and analog TV and and consists of 2 channels, at front left/right

Dolby Surround

In this sound format, 4 audio channels (Front left / right / center / surround) are entered in 2 channel and reproduce in 4 channels through device with Dolby decoder.

Center channel is not completely separated so that it forms virtual center channel with help of front left / right channel.

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Dolby Prologic

– Provide 4 channels (Front Left/Right/Center/Surround)

– Reinforced from Dolby Surround

① Center channel is completely separated

➁ Separation between channels gets higher

Dolby Digital

– Provide completely separate 5.1 channel

(Front Left/Right, Center, Rear Left/Right, Sub Woofer)

– Main sound format of home theater

– Reinforced from Dolby Prologic

– Rear surround left/right channels give different sound

– Support sub woofer reinforcing Bass

❋ Dolby Digital is also called AC-301

AC-3(Audo-Coding-3) : 3rd digital audio coding Dolby Research Center has developed.

DTS(Digital Theater System)

– Technology of providing 5.1 channel sound, higher quality than

Dolby Digital

– Home appliance produced to apply system installed at 1,800 theaters throughout the world.

✪ Comparison of DTS and Dolby Digital(DD)

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Dolby Prologic

– Latest technology reproducing music CD recorded in 2 channel, cassette tape and video tape made in Dolby Prologic into 5.1 channel.

– Surround speaker that makes you feel more natural, deeper and wider than existing Dolby Prologic.

(Ex-Profound sound adds more realistic presence from 5 speakers and sub woofer when you watch soccer match.)

DTS (Digital Theater System)

THX (Abbreviation of Tomlison Holman's Experiment)

– THX is not a sound format like a Dolby or DTS, but is a standard of sound. Like standard KS mark in Korea, THX means good certification in sound effects.

– THX issues certificate when a movie, theater or home theater system satisfy proper standards.

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5. Home Theater Components

Amp / Receiver

Amp: Device of raising output after tuning signal of CD player or DVD into unique sound timbre

Various Types and Usages of Amplifier

- For Listening to Music ¡æ For Music+ Movie

- ① AV Receiver (Dedicated Lamp for Home Theater) : Preferred by Home Theater mania.

➁ DVD Receiver (DVD Player+ Amp+ Radio Tuner) : Suitable for beginner of Home Theater

- Many A/V companies adopt DVD receiver type for expansion of easy and economic Home Theater system.

Popular Korean Products

- Popular for those who pursue relatively good sound quality at low price

- Product priced between 400,000 won~600,000 won are popular.

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Popular Foreign Products

– Popular for those who prefer profound sound volume/output(Hi-fi mania, Home Theater mania)

– Products in the range of middle and low price such as Denon, Yamaha, Onkyo (900,000~1.1 million won) are popular.

– There is very expensive product over 10 million won among foreign audio markers such as

Merdian, Mcintosh, Krell.

Type of Amp/Receiver

* Pre Amp

A device that receives, adjusts and sends signal from source devices (tape deck, CD player, radio tuner, etc.) to power amplifier.

* Power Amp

A device that amplifies the signal from Pre Amp into big sound so that speaker can vibrate.

* Integrated Amp

A device that combines pre-amp and power amp into one.

* Receiver

A device that contains tuner for radio broadcasting and integrated amp.

A/V Receiver

General Amplifier

– Support 2 channels (Left, Right Speaker)

– Mainly reproduce music

– No decoder : cannot cope with various sound formats

A/V Receiver

– Support multi-channel (support 5.1 channel)

Launch products supporting 6.1 channel and 7.1 channel recently.

– Reproduce music and movie sound realistically

– Has decoder

Can cope with various sound formats such as Dolby Digital.

DTS

– Rich input/output

– Use digital signal type and has no sound

A/V Receiver

A device of implementing home theater more conveniently with radio and A/V receiver embeded in DVD player.

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How to Select Amp/Receiver

- Select the products that can support both Dolby Digital and DTS since they require both for vivid sound

- Performance of amp gets better in output(W) but high output is a burden in narrow house.

- Important to match output(W) and capacity(§Ù) of amp and speaker.

- It is advantageous for beginners to purchase DVD receiver type that has amp and radio tuner in

DVD player

- If the budget is tight, it is recommended to continue to upgrade after purchasing a low-priced system.

* Computer will be of no use when it is outdated.

* But, home theater system can be utilized in various ways due to feature of A/V device.

Speaker

Speaker system consists of speaker unit and enclosure.

The type and price range are diverse from expensive big speaker to miniature thin speaker.

Difference between famous speaker and big A/V speaker

- Speaker units are similar(there are a few several speaker unit makers in the world)

- Design, finishing, assembling and tuning process of enclosure are different.

(Prestige speakers are made manually in whole processes of manufacturing)

Famous speaker brands: B&W, JBL, BOSE, Definitve, B&O, etc.

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Speaker Structure

Speaker Unit

Enclosure

- Divided into for high tone, middle tone and low tong

- Tweeter : for high pitch

Smallest unit suitable for feature of high tone reproduction

- Mid-Range : for middle tone

Mid sound reproduction ability is the most critical standard of speaker evaluation

- Woofer : for low tone

Much bigger size than other speaker unit

- Case of speaker unit

- Enclosure sways sound quality of reproduction

- Low tone is almost acattered without enclosure, and only high sound tone is heard.

Type of Speaker System

Full Range Speaker

A speaker system producing sound with one speaker unit.

2 Way Type

A speaker system designed using units of 2 woofers for bass and tweeter for high tone.

3 Way Type

Difference between foreign prestige speaker and big A/V maker's speaker.

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