advertisement
SERVICE MANUAL
MDS-NT1
AEP Model
UK Model
E Model
US and foreign patents licensed from Dolby
Laboratories Licensing Corporation.
• OpenMG, “MagicGate”, “MagicGate Memory
Stick”, “Memory Stick”, VAIO, MusicClip, Net MD, and their logos are trademarks of Sony Corporation.
• “WALKMAN ” is a trademark of Sony Corporation.
• Microsoft, Windows, Windows NT and Windows Media are trademarks or registered trademarks of
Microsoft Corporation in the United States and/or other countries.
• IBM and PC/AT are registered trademarks of International Business Machines Corporation.
• Macintosh is a trademark of Apple Computer,Inc.in
the United States and/or other countries.
• MMX and Pentium are trademarks or registered trademarks of Intel Corporation.
• All other trademarks are trademarks of their respective owners.
TM and ® marks are omitted in this manual.
Model Name Using Similar Mechanism NEW
MD Mechanism Type MDM-7S2B
Optical Pick-up Name KMS-262E
SPECIFICATIONS
System
Disc
Laser
Revolutions (CLV)
Error correction
Sampling frequency
Coding
Modulation system
Number of channels
Frequency response
Signal-to-noise ratio
Wow and flutter
MiniDisc digital audio system
MiniDisc
Semiconductor laser (
λ
= 780 nm)
Emission duration: continuous
800 rpm to 1800 rpm
Advanced Cross Interleave Reed
Solomon Code (ACIRC)
44.1 kHz
Adaptive Transform Acoustic
Coding (ATRAC)/ATRAC 3
EFM (Eight-to-Fourteen
Modulation)
2 stereo channels
5 to 20,000 Hz
±
0.8 dB
Over 96 dB during playback
Below measurable limit
Outputs
LINE (ANALOG) OUT Jack type: stereo-mini
Rated output: 1 Vrms (at
50 kilohms)
PHONES
Load impedance: Over 10 kilohms
Jack type: stereo-mini
Rated output: 5 mW
Load impedance: 32 ohms
General
USB port series B, self powerd, full speed
Where purchased Power requirements *
Europe and other countries 220 – 230 V AC, 50/60 Hz
* Using an AC power adaptor (supplied)
Power consumption
Dimensions (approx.)
Mass (approx.)
6 W
152
×
52
×
249 mm (w/h/d) incl.
projecting parts and controls
1.0 kg
Supplied accessories
•
•
•
•
•
AC power adaptor (1)
USB cable (1)
Audio connecting cord
(stereo mini-plug
×
1 y stereo mini-plug
×
1)
(1)
OpenMG Jukebox CD-ROM (1)
Operating instructions for OpenMG Jukebox
(1)
•
Do not connect the supplied AC power adaptor to a switched AC outlet (e.g., on an amplifier).
•
Use only the supplied AC power adaptor. Do not use any other AC power adaptor.
Polarity of the plug
Design and specifications are subject to change without notice.
MINIDISC DECK
9-873-614-01
2002B0500-1
C 2002.02
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
MDS-NT1
SELF-DIAGNOSIS FUNCTION
The self-diagnosis function consists of error codes for customers which are displayed automatically when errors occur, and error codes which show the error history in the test mode during servicing. For details on how to view error codes for the customer, refer to the following box in the instruction manual. For details on how to check error codes during servicing, refer to the following “Procedure for using the Self-Diagnosis Function (Error History Display Mode)”.
The deck’s self-diagnosis function automatically checks the condition of the MD deck when an error occurs, then indicates the nature of the error through the two indicators. If the indicators light up or flash, find them in the following table and perform the indicated countermeasure. Should the problem persist, consult your nearest Sony dealer.
Playback
Indicator
(green)
Recording
Indicator
(red)
Flashes
Cause/Remedy
Flashes
Lights up
Flashes
Flashes
Lights up
Lights up
Flashes
Both indicators flash alternately
The recording was not made properly. (C13/Rec Error)
, Set the deck in a stable surface, and repeat the recording procedure.
The inserted MD is dirty (with smudges, fingerprints, etc.), scratched, or substandard in quality. (C13/Rec Error)
, Replace the disc and repeat the recording procedure.
The deck could not read the TOC on the MD properly. (C13/Read Error)
, Take out the MD and insert it again.
The deck could not read the TOC on the MD properly. (C14/Toc Error)
, Insert another disc.
, If possible, erase all the tracks on the MD.
There is an error in the internal data that the deck needs in order to operate.
(E0001/MEMORY NG)
, Consult your nearest Sony dealer.
There is a problem with the optical pickup. (E0101/LASER NG)
, Consult your nearest Sony dealer.
An MD loading problem has occurred. (E0201/LOADING NG)
, Consult your nearest Sony dealer.
PROCEDURE FOR USING THE SELF-DIAGNOSIS FUNCTION (ERROR HISTORY DISPLAY MODE)
Note 1: The test mode and recording of this set are controlled by a personal computer, thus requiring the set to be connected to the PC.
Prepare the personal computer in which necessary software is already installed.
• Attached software “OpenMG Jukebox” (necessary for recording (check in, check out)) (Part No. : 4-237-880-01)
• Software for test mode “TestMode_S.exe” (“TestMode_S.exe” and essential files “data_files.csv”, “Net MDUSB.dil” are distributed together with the Service Manual. For the test mode, copy these three files in the same folder beforehand)
Note 2: In the operation in the test mode, the operational description requiring “click [xxx] ” means that you have to click the button on the screen.
(“xxx” indicates the button name)
Note 3: Perform the self-diagnosis function in the “error history display mode” in the test mode. The following describes the least required procedure.
Be careful not to enter other modes by mistake. If you set other modes accidentally, click the [MENU/NO] to exit the mode.
1. Press the [ ] button and [ ] button until the NetMD indicator turns off (for more than 3 seconds). (During this step, the USB cable must be disconnected)
2. Connect the set to the PC with the attached USB cable.
3. Start up the software for test mode.
4. Click the [TEST MODE] .
5. Click the [JOG UP] or [JOG DOWN] and when “[Service]” is displayed, click the [ENTER/YES] .
6. Click the
[JOG UP]
or
[JOG DOWN]
to display “Err Display”.
7. Click the [ENTER/YES] to sets the error history mode and displays “op rec tm”.
8. Select the contents to be displayed or executed using the [JOG UP] or [JOG DOWN] .
9. Click the [PUSH] to display or execute the contents selected.
10. Click the [PUSH] another time returns to step 8.
11. Click the
[MENU/NO]
to display “Err Display” and release the error history mode.
12. To release the test mode, quit the software for test mode after the [REPEAT] clicked.
Note: When retrying this operation, start from step1.
2
MDS-NT1
ITEMS OF ERROR HISTORY MODE ITEMS AND CONTENTS
Selecting the Test Mode
Display op rec tm op play tm spdl rp tm retry err total err err history retry adrs er refresh tm refresh op change spdl change
Details of History
Cumulative recording time is displayed.
When cumulative recording time is over 1 minute, the hour and minute are displayed as they are.
When it is under 1 minute, “Under 1 min” is displayed.
The displayed time shows how long the laser is in high power state.
It is about one fourth the actual recording time.
Cumulative playing time is displayed.
When cumulative playing time is over 1 minute, the hour and minute are displayed as they are.
When it is under 1 minute, “Under 1 min” is displayed.
Cumulative spindle motor running time is displayed.
When cumulative spindle motor run time is over 1 minute, the hour and minute are displayed as they are.
When it is under 1 minute, “Under 1 min” is displayed.
Displays the total number of retries during recording and number of retry errors during play.
Displayed as “rss pss”.
“r” indicates the retries during recording while “p” indicates the retry errors during play.
The number of retries and retry errors are displayed in hexadecimal digits from 00 to FF.
Displays the total number of errors.
Displayed as “total ss”.
The number of errors is displayed in hexadecimal digits from 00 to FF.
Displays the 10 latest errors.
Displayed as “0s ErrCd@@”.
s indicates the history number. The smaller the number, the more recent is the error. (00 is the latest).
@@ indicates the error code.
Refer to the following table for the details. The error history can be switched by clicking the [JOG UP] or
[JOG DOWN] .
Displays the past five retry addresses.
Displays “ss ADRS ssss”, ss is the history number, ssss is the cluster with the retry error.
Select the error history number using the [JOG UP] or [JOG DOWN] .
Mode to clear the error history and retry address history.
[Operating method]
1) Click the [JOG UP] or [JOG DOWN] when “er refresh” is displayed.
2) The display will change to “er refresh?”, and then click the
[ENTER/YES]
.
The operation is over if “Complete!” is displayed.
After this mode was executed, check the following:
• The data have been cleared.
• Perform the recording and playing to check that the mechanism operates normally.
Mode to clear the “op rec tm” and “op play tm” histories.
These histories serve as approximate indications of when to replace the optical pick-up. If the optical pick-up has been replaced, perform this operation and clear the history.
[Operating method]
1) Click the [JOG UP] or [JOG DOWN] when “tm refresh” is displayed.
2) The display will change to “tm refresh?”, and then click the [ENTER/YES] .
The operation is over if “Complete!” is displayed.
After this mode was executed, check the following:
• The data have been cleared.
• Perform the recording and playing to check that the mechanism operates normally.
Mode to clear cumulative time of “op rec tm” and “op play tm”.
These historical data are used to determine the timing when the optical pick-up is to be replaced. When the optical pick-up was replaced, perform this operation to clear historical data.
[Operating method]
1) Click the [JOG UP] or [JOG DOWN] when “op change” is displayed.
2) The display will change to “op chang?”, and then click the [ENTER/YES] .
The operation is over if “Complete!” is displayed.
Mode to clear cumulative time of “spdl rp tm”.
This historical data is used to determine the timing when the spindle motor is to be replaced. When the spindle motor was replaced, perform this operation to clear historical data.
[Operating method]
1) Click the [JOG UP] or [JOG DOWN] when “spdl change” is displayed.
2) The display will change to “spdl chang?”, and then click the [ENTER/YES] .
The operation is over if “Complete!” is displayed.
3
MDS-NT1
Table of Error Codes
24
30
31
40
41
42
43
50
Error Code
10
12
20
21
22
23
51
60
Details of Error
Loading failed
Loading switch combination is illegal
Head of PTOC could not be read within the specified time
Head of PTOC could be read but its content is erroneous
Access to UTOC could not be made within the specified time
UTOC could be not read within the specified
3time
Content of UTOC is erroneous
Playing could not start
Content of sector is erroneous
Cause of retry occurred during normal recording
D-RAM overflowed and retry was executed
Retry was executed during the writing to TOC
S.F editing was interrupted by retry
Address could not be read except in access processing
Focusing failed and it is out of control
Unlock retry
4
TABLE OF CONTENTS
SELF-DIAGNOSIS FUNCTION
...........................
2
1.
SERVICING NOTES
...............................................
7
2.
GENERAL
................................................................... 12
3.
DISASSEMBLY
3-1. Disassembly Flow ........................................................... 13
3-2. Case (Upper) ................................................................... 14
3-3. Main Board ...................................................................... 15
3-4. MD Mechanism Deck (MDM-7S2B) ............................. 15
3-5. Front Panel Section ......................................................... 16
3-6. BD Board, Over Write Head (HR901) ........................... 16
3-7. Holder Assy ..................................................................... 17
3-8. Loading Motor Assy (M103) .......................................... 17
3-9. Sled Motor Assy (M102) ................................................ 18
3-10. Optical Pick-Up (KMS-262E) ........................................ 18
3-11. Spindle Motor Assy (M101) ........................................... 19
4.
TEST MODE
.............................................................. 20
5.
ELECTRICAL ADJUSTMENTS
........................ 24
6.
DIAGRAMS
6-1. Block Diagram – SERVO Section – ............................... 36
6-2. Block Diagram – MAIN Section – ................................. 37
6-3. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 38
6-4. Printed Wiring Board – BD Board – .............................. 39
6-5. Schematic Diagram – BD Board (1/2) – ........................ 40
6-6. Schematic Diagram – BD Board (2/2) – ........................ 41
6-7. Printed Wiring Board
– MAIN Board (Component Side) – .............................. 42
6-8. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................ 43
6-9. Schematic Diagram – MAIN Board (1/2) – ................... 44
6-10. Schematic Diagram – MAIN Board (2/2) – ................... 45
6-11. Printed Wiring Board – Panel Board – ........................... 46
6-12. Schematic Diagram – Panel Board – .............................. 47
6-13. IC Pin Function Description ........................................... 51
7.
EXPLODED VIEWS
7-1. Case Section .................................................................... 59
7-2. Front Panel Section ......................................................... 60
7-3. Case (B) Section .............................................................. 61
7-4. MD Mechanism Deck Section-1 (MDX-7S2B) ............. 62
7-5. MD Mechanism Deck Section-2 (MDX-7S2B) ............. 63
8.
ELECTRICAL PARTS LIST
............................... 64
MDS-NT1
5
MDS-NT1
The laser component in this product is capable of emitting radiation exceeding the limit for Class 1.
This appliance is classified as a CLASS 1
LASER product. The CLASS 1 LASER
PRODUCT MARKING is located on the bottom exterior.
CAUTION
Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C during repairing.
• Do not touch the soldering iron on the same conductor of the circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL
OR IN SUPPLEMENTS PUBLISHED BY SONY.
6
MDS-NT1
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts.
The flexible board is easily damaged and should be handled with care.
NOTES ON REPLACING BD BOARD OR MD MECHANISM
DECK
In replacing the BD board or MD mechanism deck, perform the work through the steps provided below:
1. Remove the IC195 from the BD board to be replaced.
2. Remove the IC195 from new BD board.
3. Mount the IC195 on new BD board, which was removed from the BD board to be replaced.
4. Install new BD board in the set.
Note: The IC195 cannot be replaced with a new part. If IC195 is faulty, replace the entire BD board.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when checking it for adjustment. It is feared that you will lose your sight.
– BD BOARD (Conductor Side) –
CLEANING OBJECTIVE LENS OF OPTICAL PICK-UP
• In cleaning the objective lens of optical pick-up, be sure the following below.
1. In cleaning the lens, do not apply an excessive force.
As the optical pick-up is vulnerable, application of excessive force could damage the lens holder.
2. In cleaning, do not use a cleaner other than exclusive cleaning liquid (KK-91 or isopropyl alcohol).
3. Wipe the objective lens spirally from center toward outside.
(See Figure A)
IC195
(Figure A)
4. Eject the disc, if loaded.
5. Disconnect the power cord from the socket to shut off the power supply.
OPERATION CHECK IN NORMAL MODE
The set alone is capable of performing the play function only. In checking the recording and other functions, connect the set to the
PC with a USB cable and perform the operation on the application software “OpenMG Jukebox” attached.
7
MDS-NT1
JIG FOR CHECKING BD BOARD WAVEFORM
The special jig (J-2501-149-A) is useful for checking the waveform of the BD board. The names of terminals and the checking items to be performed are shown as follows.
GND : Ground
I+3V : For measuring Iop (Check the deterioration of the optical pick-up laser)
Iop : For measuring Iop (Check the deterioration of the optical pick-up laser)
TE : Tracking error signal (Traverse adjustment)
VC : Reference level for checking the signal
RF : RF signal (Check jitter)
FE : Focus error signal
CN105
8
I+3V
GND
FE
RF
Iop
TE
VC
I+3V
Iop
GND
TE
FE
VC
RF
1
I+3V
Iop
GND
TE
FE
VC
RF
7 for
MDM-7S2B
MDS-NT1
Note 1: The test mode and recording of this set are controlled by a personal computer, thus requiring the set to be connected to the PC.
Prepare the personal computer in which necessary software is already installed.
• Attached software “OpenMG Jukebox” (necessary for recording (check in, check out)) (Part No. : 4-237-880-01)
• Software for test mode “TestMode_S.exe” (“TestMode_S.exe” and essential files “data_files.csv”, “Net MDUSB.dil” are distributed together with the Service Manual. For the test mode, copy these three files in the same folder beforehand)
Note 2: In the operation in the test mode, the operational description requiring “click [xxx] ” means that you have to click the button on the screen.
(“xxx” indicates the button name)
Iop DATA RECORDING AND DISPLAY WHEN OPTICAL PICK-UP AND NON-VOLATILE MEMORY (IC195 OF
BD BOARD) ARE REPLACED
The Iop value labeled on the optical pick-up can be recorded in the non-volatile memory. By recording the value, it will eliminate the need to look at the value on the optical pick-up label. When replacing the optical pick-up or non-volatile memory (IC195 of BD board), record the Iop value on the optical pick-up according to the following procedure.
Record Procedure:
1. Press the [ ] button and [ ] button until the NetMD indicator turns off (for more than 3 seconds). (During this step, the USB cable must be disconnected)
2. Connect the set to the PC with the attached USB cable.
3. Start up the software for test mode.
4. Click the [TEST MODE] .
5. Click the [JOG UP] or [JOG DOWN] to display “[Service]”, and click the [ENTER/YES] .
6. Click the [JOG UP] or [JOG DOWN] to display “Iop Write” (C05), and click the [ENTER/YES] .
7. The display becomes “Ref=@@@.@” (@ is an arbitrary number) and the numbers which can be changed will blink.
8. Input the Iop value written on the optical pick-up label.
To select the number : Click the [JOG UP] or [JOG DOWN] .
To select the digit : Click the [PUSH] .
9. When the [ENTER/YES] is clicked, the display becomes “Measu=@@@.@” (@ is an arbitrary number).
10. As the adjustment results are recorded for the 6 value. Leave it as it is and click the [PUSH] .
11. “Complete!” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop
Write (C05)”.
12. Quit the software for test mode after the [REPEAT] clicked.
Note: When retrying this operation start from step1.
Display Procedure:
1. Press the [ ] button and [ ] button until the NetMD indicator turns off (for more than 3 seconds). (During this step, the USB cable must be disconnected)
2. Connect the set to the PC with the attached USB cable.
3. Start up the software for test mode.
4. Click the [TEST MODE] .
5. Click the [JOG UP] or [JOG DOWN] to display “[Service]”, and click the [ENTER/YES] .
6. Click the [JOG UP] or [JOG DOWN] to display “Iop Read” (C26), and click the [ENTER/YES] .
7. “@@.@/##.#” is displayed and the recorded contents are displayed.
@@.@ : indicates the Iop value on the optical pick-up label.
##.# : indicates the Iop value after adjustment
8. To end, click the [PUSH] and [MENU/NO] to display “Iop Read” (C26).
9. Quit the software for test mode after the [REPEAT] clicked.
Note: When retrying this operation start from step1.
9
MDS-NT1
CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS IN MD
Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent.
Details of the procedures are described in “5. Electrical Adjustments”.
Note: This set uses optical pick-up KMS-262E in the production, but for the repair, only the KMS-262A is supplied. As a result, two types of optical pick-ups are used for this set, and the specified values for the check and adjustment of the laser power vary depending on the type.Details of the identify of KMS-262A/KMS-262E are described in “5-4. How to Identify Optical Pick-up KMS-262A/KMS-262E”. (See Page 26)
Laser power check
(5-7-2 : See page 28)
Auto check
(5-7-4 : See page 29)
Temperature compensation offset check
(5-7-1 : See page 28)
Criteria for Determination
(Unsatisfactory if specified value is not satisfied)
• 0.90 mW power
Specified value : 0.84 to 0.92 mW (KMS-262A)
0.90 to 0.96 mW (KMS-262E)
• 8.40 mW power
Specified value : 8.1 to 8.7 mW (KMS-262A)
8.4 to 8.9 mW (KMS-262E)
• Iop (at 8.4mW)
Labeled on the optical pick-up
Iop value
±
10mA
• Unsatisfactory if displayed as “NG: XXXX”
NG
(XXXX is arbitrary number)
• Unsatisfactory if displayed as “T=@@ (##) [NG”
NG
(@@, ## are both arbitrary numbers)
Measure if unsatisfactory:
• Clean the optical pick-up
• Adjust again
• Replace the optical pick-up
• Replace the optical pick-up
• Replace the optical pick-up
• Check for disconnection of the circuits around
D101 (BD board)
• Check the signals around IC101, IC201, CN102,
CN103 (BD board)
Note:
The criteria for determination above is intended merely to determine if satisfactory or not, and does not serve as the specified value for adjustments.
When performing adjustments, use the specified values for adjustments.
10
MDS-NT1
SERVICE MODE
Microcomputer Version Display
Procedure:
1. Press the [ ] button and [ ] button until the NetMD indicator turns off (for more than 3 seconds). (During this step, the USB cable must be disconnected)
2. Connect the set to the PC with the attached USB cable.
3. Start up the software for test mode.
4. Click the [TEST MODE] .
5. Enter the test mode, then click the [JOG UP] or [JOG DOWN] to display “<INFORMATION> ”, and click the [ENTER/YES] .
6. “NT1-V **.****” is displayed. In the event of different display, click the [ENTER/YES] until it is displayed.
“ **.****” indicates the microcomputer version.
Software Reset
Procedure:
1. Press the [ ] button and [ ] button until the NetMD indicator turns off (for more than 3 seconds). (During this step, the USB cable must be disconnected)
2. Connect the set to the PC with the attached USB cable.
3. Start up the software for test mode.
4. Click the [TEST MODE] .
5. Quit the software for test mode after the [REPEAT] clicked.
Note: When retrying this operation, start from step 1.
System Requirements
• IBM PC/AT or Compatible (The software does not run on Macintosh.)
– CPU: MMX˛ Pentium® 233 MHz or higher (Pentium® II 400 MHz or higher is recommended)
– Hard disk drive space: 60 MB or more (The amount of necessary space depends on the version of the Windows OS or the size of your audio files.)
– RAM: 64 MB or more
– CD-ROM drive (capable of software installation and playback of an audio CD)
– Sound Board
– USB port (supports USB 2.0 Full Speed. (previously USB 1.1))
• Operating System: Windows® 98/Windows® 98 Second Edition/Windows® 2000 Professional/Windows® Me/Windows® XP Home
Edition/Windows® XP Professional (manufacturer installed)
The following environments are not supported.
– Windows® 95, Windows® NT, or other versions of Windows® NT (such as Server)
– An environment that is an upgrade of the original manufacturer-installed operating system, as in the following examples:
Windows® 3.1/Windows® 95 t Windows® 98 (or Windows® 98 Second Edition/Windows® Me)
Windows® Me/Windows® 2000 Professional t Windows® XP
– Multi-boot environment with Windows® 2000 (or Windows® XP) and Windows® 98 (or Windows® 98 Second Edition/Windows® Me)
• Display: High (16 bit) Color or more (800
×
480 dot or more)
• Internet access: for Web registration and EMD services
• Windows Media Player (Version 6.4 or higher) installed for playing MP3 files.
• Windows Media Player (Version 7.0 or higher) installed for playing WMA files.
• We do not assure the operation of MusicClip on the computer other than VAIO series computer.
Notes
• We do not assure trouble-free operation for all computers satisfying the system requirements.
• Trouble-free operation is not guaranteed following the self-conducted upgrade of home-built PCs oroperating systems.
11
MDS-NT1
SECTION 2
GENERAL
• LOCATION OF CONTROLS
– Front View –
This chapter tells you about the location and function of the various buttons, controls on the MD deck.
– Rear View –
1 2 3
This section is extracted from instruction manual.
1
6 5 4
1 N / > button
Press while the unit is stopped to start playback.
Press while the unit is playing to locate the beginning of the next track.
2 MD insertion slot
Insert the MD as illustrated below.
With the labeled side up
With the arrow pointing towards the deck
3 x / Z button
Press while the unit is playing to stop playback.
Press while the unit is stopped to eject the MD.
4 Recording indicator
Lights up in the following cases:
While an audio file is being transferred from the connected computer to the MD deck (check-out).
While an audio file is being transferred from the
MD deck to the connected computer (check-in).
When TOC information (such as track information) has not been recorded to the MD.
Flashes when overwriting of the MD’s TOC by the MD deck is started by pressing x/Z .
5 Net MD lamp
Indicates the USB connection status between the unit and the computer.
Lights dimly when the unit is connected only to a wall outlet with the supplied AC adaptor.
Lights brightly when the unit is connected to a computer with its operating system running.
6 Playback indicator
Lights during playback.
Flashes while the MD's TOC is being loaded by the MD deck.
Notes
•
Except for operation of the x/Z button for ejecting the MD, all other operations on the MD deck are disabled while the Net MD is connected through the supplied USB cable to a computer with its operating system running.
Under these conditions, the Net MD lamp flashes
(the other indicators remain off) whenever you attempt to do an operation that is disabled.
•
The flashing of the Net MD lamp and flashing or lighting up of the other indicators are indications that the MD deck’s self-diagnosis function is active.
For details, see page 12.
4 3
1 DC IN 9V jack
Connect this jack to a wall outlet via the supplied
AC power adaptor to power the MD deck.
2 USB port
Connect this port to a USB port on your computer with the supplied USB cable.
3 Headphones jack and PHONE LEVEL control
Connect a headphones plug to this jack.
Turn the PHONE LEVEL control to adjust the volume of the connected headphones.
4 ANALOG OUT jack
Connect active speakers, etc. to this jack with the supplied audio connecting cord (stereo mini-plug
×
1 y stereo mini-plug
×
1) or optional audio connecting cord (stereo mini-plug
×
1 y phono plug
×
2).
or
2
12
SECTION 3
DISASSEMBLY
• This set can be disassembled in the order shown below.
3-1.
DISASSEMBLY FLOW
Note: The process described in can be performed in any order.
Note: Without completing the process described in , the next process can not be performed.
SET
3-2. CASE (UPPER)
(Page 14)
3-4. MD MECHANISM DECK
(MDM-7S2B)
(Page 15)
3-6. BD (MD) BOARD
(Page 16)
3-6. OVER WRITE HEAD
(HR901)
(Page 16)
3-7. HOLDER ASSY
(Page 17)
3-10. OPTICAL PICK-UP
(KMS-262E)
(Page 18)
3-11. SPINDLE MOTOR ASSY
(M101)
(Page 19)
3-3. MAIN BOARD
(Page 15)
3-6. BD (MD) BOARD
(Page 16)
3-7. HOLDER ASSY
(Page 17)
3-8. LOADING MOTOR ASSY
(M103)
(Page 17)
3-5. FRONT PANEL SECTION
(Page 16)
3-9. SLED MOTOR ASSY
(M102)
(Page 18)
MDS-NT1
13
MDS-NT1
Note: Follow the disassembly procedure in the numerical order given.
3-2.
CASE (UPPER)
Note 1: Fold down the flat type wire (7 core) in the direction of the arrow at the first setout, then install the upper case.
wire (flat type) (7 core)
2 case (upper) wire (flat type) (7core)
14
1 three screws
(BVTP3
×
10) lead wire
Note 2: Check that the lead wire is connected vertically to the chassis before installing the upper case.
If the lead wire is not connected vertically, it may be caught between the upper case.
chassis chassis lead wire lead wire
1 three screws
(BVTP3
×
10)
OK NG
3-3.
MAIN BOARD
1 wire (flat type) (7 core)
(CN104)
3 screw
(BVTP3
×
8)
1 wire (flat type) (23 core)
(CN102)
1 wire (flat type) (27 core)
(CN101)
3 screw
(BVTP3
×
8)
4 MAIN board
2 screw
(BVTT3
×
8)
MDS-NT1
3-4.
MD MECHANISM DECK
(MDM-7S2B)
2 four screws
(BVTTWH M3)
1 wire (flat type) (23 core)
(CN102)
1 wire (flat type) (27 core)
(CN101)
3 MD mechanism deck
(MDM-7S2B)
15
MDS-NT1
3-5.
FRONT PANEL SECTION
5 front panel section wire (flat type) (7 core)
4 two screws
(BVTT3
×
5)
1 wire (flat type) (7 core)
(CN104)
Note: Set the wire (flat type) as illustrated, then install the front panel section.
3 two screws
(K3
×
8)
3-6.
BD BOARD, OVER WRITE HEAD (HR901)
Note: By means of removing 1 connector (CN104),
BD board can be removed without removing the over write head (HR901).
2 screw (P1.7
× 6)
3 over write head (HR901)
Note: The over write head (HR901) should be handled with care as it is damaged easily.
2 lead wire
4 Remove four solders.
BD board
(side B)
4 Remove five solders.
6
8 BD board
1 connector
(CN104)
5 two screws (PWH1.7
× 3.5)
7 flexible board (CN101)
16
3-7.
HOLDER ASSY
5
6 holder assy
1 tension spring (holder)
4 boss
4 boss
3
2 claw
MDS-NT1
3-8.
LOADING MOTOR ASSY (M103)
2 two screws
(PWH1.7
× 2.5)
1 belt (loading)
3 loading motor assy
(M103)
17
MDS-NT1
3-9.
SLED MOTOR ASSY (M102)
4 slider (EJ)
6 slider
1 two screws
(B2 × 6)
2 guide (L)
7 lever (CHG)
3
5 With holding the claw, slide the slider fully in the direction of arrow A .
A
8 lever (head)
9 two screws
(PWH1.7
× 2.5)
0 sled motor assy
(M102)
3-10. OPTICAL PICK-UP (KMS-262E)
qa optical pick-up (KMS-262E)
7 Pull out the main shaft.
1 flexible board
0 SL base
9 screw
(P1.7
× 6)
8
6 two screws
(KTP2 × 6)
4 screw (B2 × 6)
5 base (BU-A)
3 gear (SD)
2 screw (M1.7)
18
3-11. SPINDLE MOTOR ASSY (M101)
2 spindle motor assy
(M101)
1 three screws (M1.7)
MDS-NT1
19
MDS-NT1
SECTION 4
TEST MODE
Note 1: The test mode and recording of this set are controlled by a personal computer, thus requiring the set to be connected to the PC.
Prepare the personal computer in which necessary software is already installed.
• Attached software “OpenMG Jukebox” (necessary for recording (check in, check out)) (Part No. : 4-237-880-01)
• Software for test mode “TestMode_S.exe” (“TestMode_S.exe” and essential files “data_files.csv”, “Net MDUSB.dil” are distributed together with the Service Manual. For the test mode, copy these three files in the same folder beforehand)
Note 2: In the operation in the test mode, the operational description requiring “click [xxx] ” means that you have to click the button on the screen.
(“xxx” indicates the button name)
Note 3: MD always plays double speed.
4-1.
PRECAUTIONS FOR USE OF TEST MODE
• The software for test mode is used.
Be sure to start the software for test mode after quitting the application software.
• As loading related operations will be performed regardless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it.
Even if the [EJECT] is clicked while the disc is rotating during continuous playback, continuous recording, etc., the disc will not stop rotating.
Therefore, it will be ejected while rotating.
Be sure to click the [EJECT] button after clicking the [MENU/NO] and the rotation of disc is stopped.
4-1-1. Recording laser emission mode
• Continuous recording mode (CREC MODE)
• Laser power check mode (LDPWR CHECK)
• Laser power adjustment mode (LDPWR ADJUST)
• Iop check (Iop compare)
• Iop value non-volatile writing (Iop NV save)
• Traverse (MO) check (EF MO CHECK)
• Traverse (MO) adjustment (EF MO ADJUST)
4-2.
SETTING THE TEST MODE
1. Press the [ ] button and [ ] button until the NetMD indicator turns off (for more than 3 seconds). (During this step, the USB cable must be disconnected)
2. Connect the set to the PC with the attached USB cable.
3. Start up the software for test mode.
4. Click the [TEST MODE] .
5. When the test mode is set, “[Check]” will be displayed. Click the [JOG UP] or [JOG UP] switches between the following three groups; ···Tt [Check] Tt [Service] Tt [Develop] Tt ···.
Note: Do not use the test mode in the [Develop] group.
If used, the unit may not operate normally.
If the [Develop] group is set accidentally, click the [MENU/NO] immediately to exit the [Develop] group.
4-3.
RELEASING THE TEST MODE
Quit the software for test mode after [REPEAT] is clicked.
Note: When retrying test mode setting, perform the setting method from the start once again.
4-4.
BASIC OPERATIONS OF THE TEST MODE
All operations are performed clicking the
[JOG UP]
,
[JOG DOWN]
,
[PUSH]
,
[ENTER/YES]
, and
[MENU/NO]
.
The functions of these buttons are as follows.
Function name
[JOG UP] , [JOG DOWN]
[PUSH]
[ENTER/YES]
[MENU/NO]
Function
Select
Set Sub menu
Proceeds onto the next step. Finalizes input
Returns to previous step. Stops operations
20
MDS-NT1
4-5.
SELECTING THE TEST MODE
There are 26 types of test modes as shown below. The groups can be switched by clicking the [JOG UP] or [JOG DOWN] . After selecting the group to be used, click the [ENTER/YES] . After setting a certain group, click the [JOG UP] or [JOG DOWN] switches between these modes.
Refer to “Group” in the table for details can be selected.
All items used for servicing can be treated using group [Service]. So be carefully not to enter other groups by mistake.
Note: Do not use the test mode in the [Develop] group.
If used, the unit may not operate normally.
If the [Develop] group is set accidentally, click the
[MENU/NO]
immediately to exit the [Develop] group.
Display No.
Details Mark
Check
Group
Service
C13
C14
C15
C16
C09
C10
C11
C12
C05
C06
C07
C08
C01
C02
C03
C04
C26
C27
C28
C31
C17
C18
C19
C25
C36
C37
AUTO CHECK
Err Display
TEMP ADJUST
LDPWR ADJUST
Iop Write
Iop NV Save
EF MO ADJUST
EF CD ADJUST
FBIAS ADJUST
AG Set (MO)
AG Set (CD)
TEMP CHECK
LDPWR CHECK
EF MO CHECK
EF CD CHECK
FBIAS CHECK
ScurveCHECK
VERIFYMODE
DETRK CHECK
0920 CHECK
Iop Read
Iop Compare
ADJ CLEAR
INFORMATION
CPLAY2MODE
CREC 2MODE
Automatic self-diagnosis
Error history display, clear
Temperature compensation offset adjustment
Laser power adjustment
Iop data writing
Writes current Iop value in read nonvolatile memory using microprocessor
Traverse (MO) adjustment
Traverse (CD) adjustment
Focus bias adjustment
Auto gain output level adjustment (MO)
Auto gain output level adjustment (CD)
Temperature compensation offset check
Laser power check
Traverse (MO) check
Traverse (CD) check
Focus bias check
S-curve check
Nonvolatile memory check
Detrack check
Most circumference check
Iop data display
Comparison with initial Iop value written in nonvolatile memory
Initialization of nonvolatile memory for adjustment values
Display of microprocessor version, etc.
Continuous playback mode
Continuous recording mode
• For details of each adjustment mode, refer to “SECTION 5. Electrical Adjustments”.
For details of “Err Display”, refer to “Self-Diagnosis Function” on page 2.
• If a different mode has been selected by mistake, click the
[MENU/NO]
to release that mode.
• Modes with (
×
) in the Mark column are not used for servicing and therefore are not described in detail. If these modes are set accidentally, click the [MENU/NO] to release the mode immediately.
21
MDS-NT1
4-5-1. Operating the Continuous Playback Mode
1. Entering the continuous playback mode
(1) Set the disc in the unit. (Whichever recordable discs or discs for playback only are available)
(2) Click the [JOG UP] or [JOG DOWN] and display “CPLAY2MODE” (C36).
(3) Click the [ENTER/YES] to change the display to “CPLAY2MID”.
(4) When access completes, the display changes to “C = AD = ”.
Note: The numbers “ ” displayed show you error rates and ADER.
2. Changing the parts to be played back
(1) Click the [ENTER/YES] during continuous playback to change the display as below.
“CREC 2MID” t “CREC 2OUT” t “CREC 2IN”
When clicked another time, the parts to be played back can be moved.
(2) When access completes, the display changes to “C = AD = ”.
Note: The numbers “ ” displayed show you error rates and ADER.
3. Ending the continuous playback mode
(1) Click the [MENU/NO] . The display will change to “CPLAY2MODE” (C36).
(2) Click the [EJECT] and take out the disc.
Note: The playback start addresses for IN, MID, and OUT are as follows.
IN 40h cluster
MID 300h cluster
OUT 700h cluster
4-5-2. Operating the Continuous Recording Mode (Use only when performing self-recording/palyback check)
1. Entering the continuous recording mode
(1) Set a recordable disc in the unit.
(2) Click the [JOG UP] or [JOG DOWN] and display “CREC 2MODE” (C37).
(3) Click the
[ENTER/YES]
to change the display to “CREC 2MID”.
(4) When access completes, the display changes to “CREC 2 ( ”.
Note: The numbers “ ” displayed shows you the recording position addresses.
2. Changing the parts to be recorded
(1) When the [ENTER/YES] is clicked during continuous recording, the display changes as below.
“CREC 2MID” t “CREC 2OUT” t “CREC 2IN”
When clicked another time, the parts to be recorded can be changed.
(2) When access completes, the display changes to “CREC 2 ( ”.
Note: The numbers “ ” displayed shows you the recording position addresses.
3. Ending the continuous recording mode
(1) Click the [MENU/NO] . The display changes to “CREC 2MODE” (C37).
(2) Click the [EJECT] and take out the disc.
Note 1: The recording start addresses for IN, MID, and OUT are as follows.
IN 40h cluster
MID 300h cluster
OUT 700h cluster
Note 2: The [MENU/NO] can be used to stop recording anytime.
Note 3: Do not perform continuous recording for long periods of time above 5 minutes.
Note 4: During continuous recording, be careful not to apply vibration.
22
MDS-NT1
4-6.
AUTOMATIC SELF-DIAGNOSIS FUNCTION
This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up.
To perform this test mode, the laser power must first be checked.
Perform AUTO CHECK after the laser power check and Iop check.
Procedure:
1. Click the [ENTER/YES] . If “LDPWR ” is displayed, it means that the laser power check has not been performed. In this case, perform the laser power check and Iop compare, and then repeat from step 1.
2. If a disc is in the mechanical deck, it will be ejected forcibly.
“DISC IN” will be displayed in this case. Load a test disc (MDW-74/GA-1) which can be recorded.
3. If a disk is loaded at step 2, the check will start automatically.
4. When “XX CHECK” is displayed, the item corresponding to XX will be performed.
When “06 CHECK” completes, the disc loaded at step 2 will be ejected. “DISC IN” will be displayed. Load the check disc (MD) TDYS-1.
5. When the disc is loaded in step 4, the check will automatically be resumed from “07 CHECK”.
6. After completing to test item 12, check OK or NG will be displayed. If all items are OK, “CHECK ALL OK” will be displayed. If any item is NG, it will be displayed as “NG:xxxx”.
When “CHECK ALL OK” is displayed, it means that the optical pick-up is normal. Check the operations of the other spindle motor, thread motor, etc.
When displayed as “NG:xxxx”, it means that the optical pick-up is faulty. In this case, replace the optical pick-up.
4-7.
INFORMATION
Display the software version.
Procedure:
1. If displayed as “INFORMATION”, click the [ENTER/YES] .
2. The software version will be displayed.
3. Click the [MENU/NO] to end this mode.
23
MDS-NT1
SECTION 5
ELECTRICAL ADJUSTMENTS
Note 1: The test mode and recording of this set are controlled by a personal computer, thus requiring the set to be connected to the PC.
Prepare the personal computer in which necessary software is already installed.
• Attached software “OpenMG Jukebox” (necessary for recording (check in, check out)) (Part No. : 4-237-880-01)
• Software for test mode “TestMode_S.exe” (“TestMode_S.exe” and essential files “data_files.csv”, “Net MDUSB.dil” are distributed together with the Service Manual. For the test mode, copy these three files in the same folder beforehand)
Note 2: In the operation in the test mode, the operational description requiring “click [xxx] ” means that you have to click the button on the screen.
(“xxx” indicates the button name)
Note 3: MD always plays double speed.
5-1.
PARTS REPLACEMENT AND ADJUSTMENT
If malfunctions caused by Optical pick-up such as sound skipping are suspected, follow the following check.
Check before replacement
Start
5-7-2.
Laser Power Check
(See page 28)
OK
5-7-3.
Iop Compare
(See page 28)
OK
NG
NG
5-7-4.
Auto Check
(See page 29)
OK
Other faults are suspected.
Check the mechanism
(sled motor, etc).
NG
Replace optical pick-up or MDM-7S2B
24
Adjustment flow
Start
YES
Replace OP or IC195 *
NO
Replace IC101, IC195 * , or D101
NO
YES
YES
Replace OP, IC933, or IC195 *
NO
YES
Replace OP, IC701, IC933, or IC195 *
NO
YES
Replace OP, IC101, IC201, or IC195 *
NO
YES
Replace OP
NO
YES
Replace the spindle motor
NO
5-7-4. Auto Check
(See page 29)
End adjustments
• Abbreviation
OP: optical pick-up
5-8. INITIAL SETTING OF ADJUSTMENT VALUE
(See page 31)
5-10. TEMPERATURE COMPENSATION OFFSET
ADJUSTMENT (See page 31)
5-11. LASER POWER ADJUSTMENT (See page 31)
5-12. Iop NV SAVE (See page 32)
5-13. TRAVERSE ADJUSTMENT (See page 32)
5-14. FOCUS BIAS ADJUSTMENT (See page 33)
5-17. AUTO GAIN CONTROL OUTPUT LEVEL
ADJUSTMENT (See page 34)
OP change in Err Display mode
Iop write
Spindle change in Err Display mode
* The IC195 cannot be replaced with a new part.
For derail refer to “Notes on Replacing BD Board or MD Mechanism Deck” (See page 7).
MDS-NT1
25
MDS-NT1
5-2. PRECAUTIONS FOR CHECKING LASER DIODE
EMISSION
To check the emission of the laser diode during adjustments, never view directly from the top as this may lose your eye-sight.
5-3. PRECAUTIONS FOR USE OF OPTICAL PICK-
UP (KMS-262A/262E)
As the laser diode in the optical pick-up is easily damaged by static electricity, solder the laser tap of the flexible board when using it.
Before disconnecting the connector, desolder first. Before connecting the connector, be careful not to remove the solder. Also take adequate measures to prevent damage by static electricity.
Handle the flexible board with care as it breaks easily.
pick-up flexible board
5-4. HOW TO IDENTIFY OPTICAL PICK-UP KMS-
262A/KMS-262E
This set uses optical pick-up KMS-262E in the production, but for the repair, only the KMS-262A is supplied. As a result, two types of optical pick-ups are used for this set, and the specified values for the check and adjustment of the laser power vary depending on the type. Therefore, in performing the check and adjustment of the laser power, first make sure the type of optical pick-up. The type of optical pick-up can be identified as follows.
– KMS-262A –
[Top view] [Side view]
– KMS-262E –
[Top view] [Side view] laser tap
Optical pick-up flexible board
TYPE2 VR (small) TYPE3 VR (large)
26
MDS-NT1
5-5. PRECAUTIONS FOR ADJUSTMENTS
1. When replacing the following parts, perform the adjustments and checks with in the order shown in the following table.
2. Set the test mode when performing adjustments.
After completing the adjustments, exit the test mode.
Perform the adjustments and checks in “group Service” of the test mode.
3. Perform the adjustments to be needed in the order shown.
4. Use the following tools and measuring devices.
• Check Disc (MD) TDYS-1 (Part No. : 4-963-646-01)
• Test Disk (MDW-74/GA-1) (Part No. : 4-229-747-01)
• Laser power meter LPM-8001 (Part No. : J-2501-046-A) or
MD Laser power meter 8010S (Part No. : J-2501-145-A)* 1
• Oscilloscope (Measure after performing CAL of prove)
• Digital voltmeter
• Thermometer
• Jig for checking BD board waveform
(Part No. : J-2501-149-A)
• Attached software “OpenMG Jukebox”
(Part No. : 4-237-880-01)
• Software for test mode
(Distributed together with the Service Manual)
• Attached USB cable (Part No. : 1-757-471-11)
• Personal computer (Refer to Servicing Notes)
5. When observing several signals on the oscilloscope, etc., make sure that VC and ground do not connect inside the oscilloscope.
(VC and ground will become short-circuited)
6. Using the above jig enables the waveform to be checked without the need to solder.
(Refer to Servicing Note on page 8)
7. As the disc used will affect the adjustment results, make sure that no dusts nor fingerprints are attached to it.
8. In normal operation check after the completion of adjustment, be sure to perform the recording check (check in, check out) using the software “OpenMG Jukebox” attached.
* 1 Laser power meter
When performing laser power checks and adjustment (electrical adjustment), use of the new MD laser power meter 8010S (Part
No. : J-2501-145-A) instead of the conventional laser power meter is convenient.
It sharply reduces the time and trouble to set the laser power meter sensor onto the objective lens of optical pick-up.
Parts to be replaced
Adjustment Optical
Pick-up
IC101 IC701
7.
Initial setting of adjustment value
8.
Recording of Iop information
9.
Temperature compensation offset adjustment
10. Laser power adjustment
11. Iop NV Save
12. Traverse adjustment
13. Focus bias adjustment
16. Auto gain adjustment
6-4. AUTO CHECK
* The IC195 cannot be replaced with a new part.
For detail refer to “Notes on Replacing BD Board or MD Mechanism Deck” (See page 7).
IC201 IC933 IC195 * D101
27
MDS-NT1
5-6. USING THE CONTINUOUSLY RECORDED DISC
* This disc is used in focus bias adjustment and error rate check.
The following describes how to create a continuous recording disc.
1. Insert a disc (blank disc) commercially available.
2. Check the [JOG UP] or [JOG DOWN] and display
“CREC 2MODE” (C37).
3. Click the [ENTER/YES] again to display “CREC 2MID”.
Display “CREC 2 (0300)” and start to recording.
4. Complete recording within 5 minutes.
5. Click the [MENU/NO] and stop recording .
6. Click the [EJECT] and remove the disc.
The above has been how to create a continuous recorded data for the focus bias adjustment and error rate check.
Note: Be careful not to apply vibration during continuous recording.
5-7. CHECKS PRIOR TO REPAIRS
These checks are performed before replacing parts according to
“approximate specifications” to determine the faulty locations. For details, refer to “Checks Prior to Parts Replacement and Adjustments” (see page 10).
5-7-1. Temperature Compensation Offset Check
When performing adjustments, set the internal temperature and room temperature to 22 to 28ºC.
Checking Procedure:
1. Click the [JOG UP] or [JOG DOWN] to display “TEMP
CHECK” (C12).
2. Click the [ENTER/YES] .
3. “T=@@(##) [OK” should be displayed. If “T=@@ (##) [NG” is displayed, it means that the results are bad.
(@@ indicates the current value set, and ## indicates the value written in the non-volatile memory)
5-7-2. Laser Power Check
Before checking, check the Iop value of the optical pick-up.
(Refer to 5-9. Recording and Displaying the Iop Information (see page 31)
Connection: laser power meter
Optical pick-up objective lens
BD board
CN105 pin 1 (I +3 V)
CN105 pin 2 (Iop) digital voltmeter
+
–
Checking Procedure:
1. Set the laser power meter on the objective lens of the optical pick-up.
Connect the digital volt meter to CN105 pin 1 (I+3V) and
CN105 pin 2 (Iop).
2. Then, click the [JOG UP] or [JOG DOWN] and display
“LDPWR CHECK” (C13).
3. Click the [ENTER/YES] once and display “L 0.90 mW $ ”.
Check that the reading of the laser power meter become specified value.
Specified Value:
Laser power meter reading : 0.84 to 0.92 mW (KMS-262A)
0.90 to 0.96 mW (KMS-262E)
4. Click the [ENTER/YES] once more and display “L 8.40 mW $
” (KMS-262A) or “L 8.65 mW $ ” (KMS-262E). Check that the reading the laser power meter and digital volt meter satisfy the specified value.
Specified Value:
Laser power meter reading : 8.4
±
0.3 mW (KMS-262A)
8.65
±
0.25 mW (KMS-262E)
Digital voltmeter reading : Optical pick-up displayed value
±
10%
(Optical pick-up label)
KMS 262A
20101
B0825
(For details of the method for checking this value, refer to “6-9.
Recording and Displaying the Iop
Information”)
Iop = 82.5 mA in this case
Iop (mA) = Digital voltmeter reading (mV)/1 (
Ω
)
5. Click the [MENU/NO] and display “LDPWR CHECK” (C13) and stop the laser emission.
(The [MENU/NO] is effective at all times to stop the laser emission)
Note: After step 4, each time the [ENTER/YES] is clicked, the display will be switched between “L 0.70 mW $ ” and “L 7.50 mW $
”, Nothing needs to be performed here.
Checking Location: BD board (see page 35)
5-7-3. Iop Compare
The current Iop value at laser power 8.4 mW output and reference
Iop value (set at shipment) written in the nonvolatile memory are compared, and the rate of increase/decrease will be displayed in percentage.
Note: Perform this function with the optical pick-up set at room temperature.
Procedure:
1. Click the [JOG UP] or [JOGDOWN] to display “Iop Compare”
(C27).
2. Click the [ENTER/YES] and start measurements.
3. When measurements complete, the display changes to
“
± xx%yy”.
xx is the percentage of increase/decrease, and OK or NG is displayed at yy to indicate whether the percentage of increase/ decrease is within the allowable range.
4. Click the [MENU/NO] to end this mode.
28
MDS-NT1
5-7-4. Auto Check
This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up. To perform this test mode, the laser power must first be checked.
Perform Auto Check after the laser power check and Iop compare.
Procedure:
1. Click the [ENTER/YES] . If “LDPWR ” is displayed, it means that the laser power check has not been performed. In this case, perform the laser power check and Iop compare, and then repeat from step 1.
2. If a disc is in the mechanical deck, it will be ejected forcibly.
“DISC IN” will be displayed in this case. Load a test disc (MDW-
74/GA-1) which can be recorded.
3. If a disk is loaded at step 2, the check will start automatically.
4. When “XX CHECK” is displayed, the item corresponding to
XX will be performed.
When “06 CHECK” completes, the disc loaded at step 2 will be ejected. “DISC IN” will be displayed. Load the check disc (MD)
TDYS-1.
5. When the disc is loaded, the check will automatically be resumed from “07 CHECK”.
6. After completing to test item “12 check”, check OK or NG will be displayed. If all items are OK, “CHECK ALL OK” will be displayed. If any item is NG, it will be displayed as “NG:xxxx”.
When “CHECK ALL OK” is displayed, it means that the optical pick-up is normal. Check the operations of the other spindle motor, sled motor, etc.
When displayed as “NG:xxxx”, it means that the optical pick-up is faulty. In this case, replace the optical pick-up.
5-7-5. Other Checks
All the following checks are performed by the Auto Check mode.
They therefore need not be performed in normal operation.
5-7-6. Traverse Check
5-7-7. Focus Bias Check
5-7-8. C PLAY Check
5-7-9. Self-Recording/Playback Check
5-7-6. Traverse Check
Note 1: Data will be erased during MO reading if a recorded disc is used in this adjustment.
Note 2: If the traverse waveform is not clear, connect the oscilloscope as shown in the following figure so that it can be seen more clearly.
oscilloscope
(DC range)
BD board
CN105 pin 4 (TE)
CN105 pin 6 (VC)
330 k
Ω
10 pF
+
–
Connection: oscilloscope
(DC range)
BD board
CN105 pin 4 (TE)
CN105 pin 6 (VC)
+
–
V: 0.1 V/div
H: 10 ms/div
Checking Procedure:
1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105 pin 6 (VC) on the BD (MD) board.
2. Load a disc (any available on the market). (Refer to Note 1)
3. Click the [FF] to move the optical pick-up outside the pit and click the [STOP] to stop.
4. Click the [JOG UP] or [JOG DOWN] to display “EF MO
CHECK”(C14).
5. Click the [ENTER/YES] to display “EFB = MO-R”.
(Laser power READ power/Focus servo ON/tracking servo
OFF/spindle (S) servo ON)
6. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not click the [JOG UP] or
[JOG DOWN] .
(Read power traverse checking)
Traverse Waveform
VC
A
B
Specified value : Below 10% offset value
Offset value (%) = X 100
2 (A + B)
7. Click the [ENTER/YES] to display “EFB = MO-W”.
8. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not click the [JOG UP] or
[JOG DOWN] .
(Write power traverse checking)
Traverse Waveform
VC
Specified value : Below 10% offset value
Offset value (%) = X 100
2 (A + B)
A
B
29
MDS-NT1
9. Click the [ENTER/YES] to display “EFB = MO-P”.
Then, the optical pick-up moves to the pit area automatically and servo is imposed.
10. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not click the [JOG UP] or
[JOG DOWN] .
Traverse Waveform
A
VC
B
Specified value : Below 10% offset value
Offset value (%) = X 100
2 (A + B)
11. Click the [ENTER/YES] to display “EF MO CHECK (C14)”.
The disc stops rotating automatically.
12. Click the [EJECT] button and take out the disc.
13. Load the check disc (MD) TDYS-1.
14. Click the [JOG UP] or [JOG DOWN] and display “EF CD
CHECK” (C15).
15. Click the [ENTER/YES] to display “EFB = CD”. Servo is imposed automatically.
16. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not click the [JOG UP] or
[JOG DOWN] .
Traverse Waveform
A
VC
B
Specified value : Below 10% offset value
Offset value (%) = X 100
2 (A + B)
17. Click the [ENTER/YES] to display “EF CD CHECK” (C15).
18. Click the [EJECT] and take out the check disc (MD) TDYS-1.
Check Location: BD board (see page 35)
5-7-7. Focus Bias Check
Change the focus bias and check the focus tolerance amount.
Checking Procedure:
1. Load the test disk (MDW-74/GA-1).
2. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
3. Click the [ENTER/YES] to display “CPLAY2MID”.
4. Click the [MENU/NO] when “C = AD = ” is displayed.
5. Click the [JOG UP] or [JOG DOWN] to display “FBIAS
CHECK” (C16).
6. Click the [ENTER/YES] to display “ / c = ”.
The first four digits indicate the C1 error rate, the two digits after [/] indicate ADER, and the 2 digits after [c =] indicate the focus bias value.
Check that the C1 error is below 20 and ADER is below 2.
7. Click the [ENTER/YES] to display “ / b = ”.
Check that the C1 error is about 100 and ADER is below 2.
8. Click the [ENTER/YES] to display “ / a = ”.
Check that the C1 error is about 100 and ADER is below 2.
9. Click the [MENU/NO] , then click the [EJECT] and take out the test disc.
5-7-8. C PLAY Check
MO Error Rate Check
Checking Procedure:
1. Load the test disk (MDW-74/GA-1).
2. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
3. Click the [ENTER/YES] to display “CPLAY2MID”.
4. The display changes to “C = AD = ”.
5. If the C1 error rate is below 20, check that ADER is 00.
6. Click the [MENU/NO] to stop playback, then Click the
[EJECT]
and take out the test disc.
CD Error Rate Check
Checking Procedure:
1. Load the check disc (MD) TDYS-1.
2. Click the
[JOG UP]
or
[JOG DOWN]
to display “CPLAY2
MODE” (C36).
3. Click the [ENTER/YES] to display “CPLAY2MID”.
4. The display changes to “C = AD = ”.
5. Check that the C1 error rate is below 20.
6. Click the
[MENU/NO]
to stop playback, then click the
[EJECT] and take out the check disc.
5-7-9. Self-Recording/playback Check
Prepare a continuous recording disc using the unit to be repaired and check the error rate.
Checking Procedure:
1. Load a recordable disc (blank disc).
2. Click the [JOG UP] or [JOG DOWN] to display
“CREC 2MODE” (C37).
3. Click the [ENTER/YES] to display “CREC 2MID”.
4. When recording starts and display “CREC 2 @@@@” (@@@@ is the address).
5. About 1 minute later, click the [MENU/NO] to stop continuous recording.
6. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
7. Click the [ENTER/YES] to display “CPLAY2MID”.
8. “C = AD = ” will be displayed.
9. Check that the C1 error becomes below 20 and the AD error below 2.
10. Click the [MENU/NO] to stop playback, then click the
[EJECT] and take out the disc.
30
MDS-NT1
5-8. INITIAL SETTING OF ADJUSTMENT VALUE
Note:
Mode which sets the adjustment results recorded in the non-volatile memory to the initial setting value. However the results of the temperature compensation offset adjustment will not change to the initial setting value.
If initial setting is performed, perform all adjustments again excluding the temperature compensation offset adjustment.
For details of the initial setting, refer to “5-5. Precautions for Adjustments” and execute the initial setting before the adjustment as required.
Setting Procedure:
1. Click the [JOG UP] or [JOG DOWN] to display “ADJ
CLEAR” (C28).
2. Click the [ENTER/YES] . “Complete!” will be displayed momentarily and initial setting will be executed, after which “ADJ
CLEAR” (C28) will be displayed.
5-9. RECORDING AND DISPLAYING THE Iop
INFORMATION
The Iop data can be recorded in the non-volatile memory. The Iop value on the optical pick-up label and the Iop value after the adjustment will be recorded. Recording these data eliminates the need to read the label on the optical pick-up.
Recording Procedure:
1. Click the [JOG UP] or [JOG DOWN] to display “Iop Write”
(C05), and click the [ENTER/YES] .
2. The display becomes “Ref=@@@.@” (@ is an arbitrary number) and the numbers which can be changed will blink.
3. Input the Iop value on the optical pick-up label.
To select the number : Click the [JOG UP] or [JOG DOWN] .
To select the digit : Click the [PUSH] .
4. When the [ENTER/YES] is clicked, the display becomes
“Measu=@@@.@” (@ is an arbitrary number).
5. As the adjustment results are recorded for the 4 value. Leave it as it is and click the
[ENTER/YES]
.
6. “Complete!!” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop Write” (C05).
Display Procedure:
1. Click the [JOG UP] or [JOG DOWN] to display “Iop Read”
(C26), and click the [ENTER/YES] .
2. “@@.@/##.#” is displayed and the recorded contents are displayed.
@@.@ indicates the Iop value on the optical pick-up label.
##.# indicates the Iop value after adjustment
3. To end, click the [PUSH] or [MENU/NO] to display “Iop Read”
(C26).
5-10.TEMPERATURE COMPENSATION OFFSET
ADJUSTMENT
Save the temperature data at that time in the non-volatile memory as 25 ˚C reference data.
Note:
1. Usually, do not perform this adjustment.
2. Perform this adjustment in an ambient temperature of 22 ˚C to 28 ˚C.
Perform it immediately after the power is turned on when the internal temperature of the unit is the same as the ambient temperature of 22 ˚C to 28 ˚C.
3. When D101 has been replaced, perform this adjustment after the temperature of this part has become the ambient temperature.
Adjusting Procedure:
1. Click the [JOG UP] or [JOG DOWN] to display “TEMP AD-
JUST” (C03).
2. Click the [ENTER/YES] to select the “TEMP ADJUST” mode.
3. “TEMP = [OK” and the current temperature data will be displayed.
4. To save the data, click the [ENTER/YES] .
When not saving the data, click the [MENU/NO] .
5. When the [ENTER/YES] is clicked, “TEMP = SAVE” will be displayed and turned back to “TEMP ADJUST” (C03) display then. When the [MENU/NO] is clicked, “TEMP ADJUST”
(C03) will be displayed immediately.
Specified Value:
The “TEMP = ” should be within “E0 - EF”, “F0 - FF”, “00 -
0F”, “10 - 1F” and “20 - 2F”.
5-11. LASER POWER ADJUSTMENT
Check the Iop value of the optical pick-up before adjustments.
(Refer to 5-9. Recording and Displaying Iop Information)
Connection: laser power meter
Optical pick-up objective lens digital voltmeter
BD board
CN105 pin 1 (I +3 V)
CN105 pin 2 (Iop)
+
–
Adjusting Procedure:
1. Set the laser power meter on the objective lens of the optical pick-up. (When it cannot be set properly, click the [FF] or
[FR] to move the optical pick-up)
Connect the digital voltmeter to CN105 pin 1 (I+3V) and
CN105 pin 2 (Iop) on the BD (MD) board.
2. Click the
[JOG UP]
or
[JOG DOWN]
to display “LDPWR
ADJUST” (C04).
(Laser power : For adjustment)
3. Click the [ENTER/YES] once to display “L 0.90 mW $ ”.
4. Click the [JOG UP] or [JOG DOWN] so that the reading of the laser power meter becomes specified value. Click the
[ENTER/YES] after setting the range knob of the laser power meter, and save the adjustment results. (“LD SAVE $ ” will be displayed for a moment)
Specified Value:
Laser power meter reading: 0.85 to 0.91 mW (KMS-262A)
0.90 to 0.95 mW (KMS-262E)
5. Then “L 8.40 mW $ ” (KMS-262A) or “L 8.65 mW $ ”
(KMS-262E) will be displayed.
31
MDS-NT1
6. Click the [JOG UP] or [JOG DOWN] so that the reading of the laser power meter becomes specified value, click the
[ENTER/YES] to save it.
Specified Value:
Laser power meter reading: 8.2 to 8.6 mW (KMS-262A)
8.5 to 8.8 mW (KMS-262E)
Note: Do not perform the emission with 8.4 mW more than 15 seconds continuously.
7. Then, click the [JOG UP] or [JOG DOWN] to display
“LDPWR CHECK” (C13).
8. Click the [ENTER/YES] once to display “L 0.90 mW $ ”.
Check that the reading of the laser power meter become specified value.
Specified Value:
Laser power meter reading: 0.84 to 0.92 mW (KMS-262A)
0.90 to 0.96 mW (KMS-262E)
9. Click the [ENTER/YES] button once more to display “L 8.40
mW $ ” (KMS-262A) or “L 8.65 mW $ ” (KMS-262E).
Check that the reading the laser power meter and digital voltmeter satisfy the specified value.
Note down the digital voltmeter reading value.
Specified Value:
Laser power meter reading : 8.4
±
0.3 mW (KMS-262A)
8.65
±
0.25 mW (KMS-262E)
Digital voltmeter reading : Value on the optical pick-up label
±
10%
(Optical pick-up label)
KMS 262A
20101
B0825
(For details of the method for checking this value, refer to “8.
Recording and Displaying the Iop
Information”.)
Iop = 82.5 mA in this case
Iop (mA) = Digital voltmeter reading (mV)/1 (
Ω
)
10. Click the [MENU/NO] to display “LDPWR CHECK” (C13) and stop the laser emission.
(The [MENU/NO] is effective at all times to stop the laser emission.)
11. Click the [JOG UP] or [JOG DOWN] to display “Iop Write”
(C05).
12. Click the
[ENTER/YES]
. When the display becomes
Ref=@@@.@ (@ is an arbitrary number), click the [ENTER/YES] to display “Measu=@@@.@” (@ is an arbitrary number).
13. The numbers which can be changed will blink. Input the Iop value noted down at step 9.
To select the number : Click the
[JOG UP]
or
[JOG DOWN]
.
To select the digit : Click the [PUSH] .
14. When the [ENTER/YES] is clicked, “Complete!” will be displayed momentarily. The value will be recorded in the nonvolatile memory and the display will become “Iop Write”
(C05).
Note: After step 4, each time the
[ENTER/YES]
is clicked, the display will be switched “L 0.70 mW $ ” and “LD 7.50 mW $ ”.
Nothing needs to be performed here.
Adjustment Location: BD board (see page 35)
5-12. Iop NV SAVE
Write the reference values in the nonvolatile memory to perform
“Iop compare”. As this involves rewriting the reference values, do not perform this procedure except when adjusting the laser power during replacement of the optical pick-up and when replacing the
IC102. Otherwise the optical pick-up check may deteriorate.
Note: Perform this function with the optical pick-up set at room temperature.
Procedure:
1. Click the [JOG UP] or [JOG DOWN] to display “Iop NV Save”
(C06).
2. Click the [ENTER/YES] and display “Iop [stop]”.
3. After the display changes to “Iop =xxsave?”, click the [ENTER/YES] .
4. After “Complete!” is displayed momentarily, the display changes to “Iop 8.4 mW”.
5. After the display changes to “Iop=yysave?”, click the [ENTER/YES] .
6. When “Complete!” is displayed, it means that Iop NV saving has been completed.
5-13. TRAVERSE ADJUSTMENT
Note 1: Data will be erased during MO reading if a recorded disc is used in this adjustment.
Note 2: If the traverse waveform is not clear, connect the oscilloscope as shown in the following figure so that it can be seen more clearly.
oscilloscope
(DC range)
BD board
CN105 pin 4 (TE)
CN105 pin 6 (VC)
330 k
Ω
10 pF
+
–
Connection: oscilloscope
(DC range)
BD board
CN105 pin 4 (TE)
CN105 pin 6 (VC)
+
–
V: 0.1 V/div
H: 10 ms/div
Adjusting Procedure:
1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105 pin 6 (VC) on the BD board.
2. Load a disc (any available on the market). (Refer to Note 1)
3. Click the
[STOP]
after the
[FF]
clicked to move the optical pick-up outside the pit.
4. Click the [JOG UP] or [JOG DOWN] to display “EF MO
ADJUST” (C07).
5. Click the [ENTER/YES] to display “EFB = MO-R”.
(Laser power READ power/Focus servo ON/tracking servo
OFF/spindle (S) servo ON)
6. Click the [JOG UP] or [JOG DOWN] so that the waveform of the oscilloscope becomes the specified value.
(When the [JOG UP] or [JOG DOWN] is clicked, the of
“EFB= ” changes and the waveform changes.) In this adjustment, waveform varies at intervals of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible.
(Read power traverse adjustment)
Traverse Waveform
VC
A
B
Specification A = B
32
MDS-NT1
7. Click the [ENTER/YES] and save the result of adjustment to the non-volatile memory (“EFB = SAVE” will be displayed for a moment. Then “EFB = MO-W” will be displayed).
8. Click the [JOG UP] or [JOG DOWN] so that the waveform of the oscilloscope becomes the specified value.
(When the [JOG UP] or [JOG DOWN] is clicked, the of
“EFB= ” changes and the waveform changes.) In this adjustment, waveform varies at intervals of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible.
(Write power traverse adjustment)
Traverse Waveform
VC
A
B
Specification A = B
9. Click the [ENTER/YES] , and save the adjustment results in the non-volatile memory. (“EFB = SAVE” will be displayed for a moment)
10. “EFB = MO-P” will be displayed.
The optical pick-up moves to the pit area automatically and servo is imposed.
11. Click the [JOG UP] or [JOG DOWN] until the waveform of the oscilloscope moves closer to the specified value.
In this adjustment, waveform varies at intervals of approx. 2%.
Adjust the waveform so that the specified value is satisfied as much as possible.
Traverse Waveform
VC
Specification A = B
A
B
18. Click the [ENTER/YES] , display “EFB = SAVE” for a moment and save the adjustment results in the non-volatile memory.
Next “EF CD ADJUST” (C08) will be displayed.
19. Click the [EJECT] button and take out the disc (MD) TDYS-
1.
Adjustment Location: BD board (see page 35)
5-14. FOCUS BIAS ADJUSTMENT
Adjusting Procedure:
1. Load the continuously-recorded disc. (Refer to “5. USING
THE CONTINUOUSLY RECORDED DISC”)
2. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
3. Click the [ENTER/YES] to display “CPLAY2MID”.
4. Click the [MENU/NO] when “C = AD = ” is displayed.
5. Click the [JOG UP] or [JOG DOWN] to display “FBIAS
ADJUST” (C09).
6. Click the [ENTER/YES] to display “ / a = ”.
The first four digits indicate the C1 error rate, the two digits after “/ ” indicate ADER, and the 2 digits after “a =” indicate the focus bias value.
7. Click the [JOG UP] and find the focus bias value at which the
C1 error rate becomes about 200 (refer to Note 2).
8. Click the [ENTER/YES] to display “ / b = ”.
9. Click the [JOG DOWN] and find the focus bias value at which the C1 error rate becomes about 200.
10. Click the [ENTER/YES] to display “ / c = ”.
11. Check that the C1 error rate is below 20 and ADER is 00.
Then click the [ENTER/YES] .
12. If the “( )” in “ - - ( )” is above 20, click the
[ENTER/YES] button.
If below 20, click the
[MENU/NO]
and repeat the adjustment from step 2.
13. Click the [EJECT] button and take out the disc.
Note 1: The relation between the C1 error and focus bias is as shown in the following figure. Find points A and B in the following figure using the above adjustment. The focal point position C is automatically calculated from points A and B.
Note 2: As the C1 error rate changes, perform the adjustment using the average vale.
12. Click the [ENTER/YES] , and save the adjustment results in the non-volatile memory. (“EFB = SAVE” will be displayed for a moment.)
Next “EF MO ADJUST” (C07) is displayed. The disc stops rotating automatically.
13. Click the [EJECT] and take out the disc.
14. Load the check disc (MD) TDYS-1.
15. Click the [JOG UP] or [JOG DOWN] to display “EF CD
ADJUST” (C08).
16. Click the [ENTER/YES] to display “EFB = CD”. Servo is imposed automatically.
17. Click the [JOG UP] or [JOG DOWN] so that the waveform of the oscilloscope moves closer to the specified value.
In this adjustment, waveform varies at intervals of approx. 2%.
Adjust the waveform so that the specified value is satisfied as much as possible.
Traverse Waveform
A
VC
B
Specification A = B
C1 error about
200
B C A
Focus bias value
33
MDS-NT1
5-15. ERROR RATE CHECK
5-15-1. CD Error Rate Check
Checking Procedure:
1. Load the check disc (MD) TDYS-1.
2. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
3. Click the
[ENTER/YES]
twice and display “CPLAY2MID”.
4. The display changes to “C = AD = ”.
5. Check that the C1 error rate is below 20.
6. Click the [MENU/NO] to stop playback, then click the [EJECT] and take out the check disc.
5-15-2. MO Error Rate Check
Checking Procedure:
1. Load the continuously-recorded disc. (Refer to “5-6. USING
THE CONTINUOUSLY RECORDED DISC”)
2. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
3. Click the
[ENTER/YES]
to display “CPLAY2MID”.
4. The display changes to “C = AD = ”.
5. If the C1 error rate is below 20, check that ADER is 00.
6. Click the [MENU/NO] to stop playback, then click the
[EJECT] and take out the test disc.
5-16. FOCUS BIAS CHECK
Change the focus bias and check the focus tolerance amount.
Checking Procedure:
1. Load the continuously-recorded disc. (Refer to “5-6. USING
THE CONTINUOUSLY RECORDED DISC”)
2. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
3. Click the [ENTER/YES] twice to display “CPLAY2MID”.
4. Click the [MENU/NO] when “C = AD = ” is displayed.
5. Click the
[JOG UP]
or
[JOG DOWN]
to display “FBIAS
CHECK” (C16).
6. Click the [ENTER/YES] to display “ / c = ”.
The first four digits indicate the C1 error rate, the two digits after “/ ” indicate ADER, and the 2 digits after “c =” indicate the focus bias value.
Check that the C1 error is below 20 and ADER is below 2.
7. Click the [ENTER/YES] and display “ / b = ”.
Check that the C1 error is about 100 and ADER is below 2.
8. Click the [ENTER/YES] and display “ / a = ”.
Check that the C1 error is about 100 and ADER is below 2
9. Click the [MENU/NO] , then click the [EJECT] and take out the disc.
Note: If the C1 error and ADER are above other than the specified value at points a (step 8. in the above) or b (step 7. in the above), the focus bias adjustment may not have been carried out properly. Adjust perform the beginning again.
5-17. AUTO GAIN CONTROL OUTPUT LEVEL
ADJUSTMENT
Be sure to perform this adjustment when the optical pick-up is replaced.
If the adjustment results becomes “Adjust NG!”, the optical pickup may be faulty or the servo system circuits may be abnormal.
5-17-1. CD Auto Gain Control Output Level Adjustment
Adjusting Procedure:
1. Load the check disc (MD) TDYS-1.
2. Click the [JOG UP] or [JOG DOWN] to display “AG Set (CD)”
(C11).
3. When the [ENTER/YES] is clicked, the adjustment will be performed automatically.
“Complete!!” will then be displayed momentarily when the value is recorded in the non-volatile memory, after which the display changes to “AG Set (CD)” (C11).
4. Click the [EJECT] and take out the check disc.
5-17-2. MO Auto Gain Control Output Level Adjustment
Adjusting Procedure:
1. Load the test disc (MDW-74/GA-1).
2. Click the [JOG UP] or [JOG DOWN] to display “AG Set
(MO)” (C10).
3. When the [ENTER/YES] is clicked, the adjustment will be performed automatically.
“Complete!!” will then be displayed momentarily when the value is recorded in the non-volatile memory, after which the display changes to “AG Set (MO)” (C10).
4. Click the [EJECT] and take out the test disc.
34
Adjustment and Checking Loacation:
– BD BOARD (Component Side) –
D101
CN101
– BD BOARD (Conductor Side) –
IC101
IC201
CN105
1
7
1. I+3V
2. Iop
3. GND
4. TE
5. FE
6. VC
7. RF
IC933
Note: It is useful to use the jig for checking the waveform. (Refer to Servicing Notes on page 8)
35 35
MDS-NT1
MDS-NT1
6-1.
BLOCK DIAGRAM – SERVO Section –
SECTION 6
DIAGRAMS
HR901
OVER WRITE HEAD
SCTX
DIGITAL SIGNAL PROCESSOR,
EFM/ACIRC ENCODER/DECODER,
SHOCK PROOF MEMORY CONTROLLER,
ATRAC ENCODER/DECODER
IC201 (1/2)
OPTICAL PICK-UP BLOCK
(KMS-262E)
I
J
I
F
B
C B
D A
J
A
E
DETECTOR
C
D
E
F
ILCC
PD LD
LASER DIODE
PD
RF AMP,
FOCUS/TRACKING ERROR AMP
IC101
AUTOMATIC
POWER CONTROL
Q202, 203
LASER ON
SWITCH
Q201
12 16 17 18
110 109
FOCUS/TRACKING COIL DRIVE,
SPINDLE/SLED MOTOR DRIVE
IC401
M101
(SPINDLE)
SPFD
SPRD
14 13 16 12 11 10 6 7 8 1 2 3 4
SWDT
SCLK
65 64
2-AXIS
DEVICE
FCS+
FCS–
TRK+
TRK–
HF MODULE
MOD
M102
(SLED)
M
XLAT
SCLK
SWDT
HF MODULE
SWITCH
Q701 – 704
LOADING
MOTOR DRIVE
IC440
+5V
7 2
M
M103
(LOADING)
REFERENCE
VOLTAGE SWITCH
Q401, 440
DADTI
XBCKI
LRCKI
DIN1
DADT
BCK
LRCK
FS256
X801
90.3168MHz
D-RAM
IC152
DADTI, XBCKI,
DADT, BCK,
SWDT, SCLK
•
SIGNAL PATH
: PLAY
: REC
–1
S102
–2
S101
(LIMIT IN)
S105
(REC)
S103
(OUT)
S104
(PLAY)
S102-1
(REFELECT RATE DETECT)
S102-2
(PROTECT DETECT)
36 36
6-2.
BLOCK DIAGRAM – MAIN Section –
DADTI, XBCKI,
LRCKI, DIN1
DADT, BCK,
LRCK, FS256
SWDT, SCLK
FS256
DADT
BCK
LRCK
SWDT
SCLK
DADTI
XBCKI
LRCKI
DIN1
D/A CONVERTER
IC505
5
52 53 51 56 57 3 58 47 46
X550
12MHz
MUTING
Q170, 270
RV301
PHONE
LEVEL
D901
D732
Net MD
D751
(PLAY)
D731
(REC)
MUTING
CONTROL SWITCH
Q100
D301
HEADPHONE AMP
IC503
2
HEADPHONE
MUTING
Q451
• SIGNAL PATH
: PLAY
: REC
X301
10MHz
LED DRIVE
Q732
LED DRIVE
Q751
LED DRIVE
Q731
S726
B />
S702 x /Z
SYS+3.3V
BAK+3.3V
+5V
D422 D421
BT420
LITHIUM
BATTERY
BD+3.3V
D+2.6V
A–5V
SWITCHING
Q400
A+5V
+9V
THP400
2
3
CN4
USB
USB+
USB–
1
VBUS
CN200
ANALOG OUT
J180
PHONES
J400
–
DC IN 9V
+
37 37
MDS-NT1
MDS-NT1
6-3.
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Schematic Diagram:
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F
50 WV or less are not indicated except for electrolytics and tantalums.
• All resistors are in
Ω
and 1 /
4
W or less unless otherwise specified.
• f : internal component.
• C : panel designation.
Note: The components identified by mark 0 or dotted line with mark 0 are critical for safety.
Replace only with part number specified.
• A : B+ Line.
• B : B– Line.
• Power voltage is dc 9V and fed with regulated dc power supply from external power voltage jack.
• Voltages and waveforms are dc with respect to ground under no-signal conditions.
no mark : PLAYBACK
( ) : STOP
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E : PLAY l : REC
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• f
: internal component.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Waveforms
– BD Board –
1 IC101 ek (RF) (PLAY mode)
1.4 Vp-p
5 IC201 ef (LRCK) (PLAY mode) qd IC505 4 (LRCK) (PLAY mode)
4.5 Vp-p 4 Vp-p
2 IC101 ef (FE) (PLAY mode) approx
460 mVp-p
22.7 ns
6 IC201 eg (XBCK) (PLAY mode)
22.7 ns qf IC505 2 (BICK) (PLAY mode)
4.6 Vp-p
3.6 Vp-p
3 IC101 wh (TE) (PLAY mode) approx
620 mVp-p
354 ns
– MAIN Board – qa IC301 qa (XOUT)
3 Vp-p
354 ns qg IC505 1 (MCLK)
4.2 Vp-p
4 IC201 w; (OSCO)
100 ns qs IC901 5 (DSPCLK)
88 ns qh IC400 7 (EXT)
2.6 Vp-p
4.2 Vp-p
9.1 Vp-p
11 ns 88 ns 15.8
µ s
38 38
6-4.
PRINTED WIRING BOARD – BD Board –
1 2 3 4
A
BD BOARD (COMPONENT SIDE)
B
C
D
E
F
G
H
(OUT)
(REC)
(PLAY)
8 5
1 4
(LIMIT IN)
5 6 7
HR901
OVER WRITE
HEAD
8 9 10 11 12
13 14
15
BD BOARD (CONDUCTOR SIDE)
2C
1C
2B
B
E
E 1B
C
C
C
E
B
E
B
B
E
C
OPTICAL PICK-UP
BLOCK
(KMS-262E)
1-683-807-
FLEXIBLE BOARD
12
(12)
–
1
1
(SLED)
M
D
D
S
G
S
G
+
7
8
1
14
IC181
26
26 31
30
IC152
13
I+3V
IOP
GND
TE
FE
VC
RF
7
1
E C
B
C
14
C
E
B
4
3 2 1
5
IC701
60
61
1
48 37
36
12
13
24
25
1
90
91
M101
(SPINDLE)
M
3
2
–
IC195
4
1
1
16
(LOADING)
M
+
3
2
1
32
17
3
2
1
S102
-1
-2
1-683-807-
S102-1
REFLECT
RATE
DETECT
S102-2
PROTECT
DETECT
12
(12)
I
• Semiconductor Location
Ref. No.
Location
D101
D501
D502
I-6
C-9
C-9
IC101
IC152
IC181
IC195
IC201
IC401
IC701
IC926
H-10
D-9
B-10
C-12
D-11
G-13
F-10
E-13
Ref. No.
Location
IC933 C-14
Q181
Q182
Q201
Q202
Q203
Q701
Q702
Q703
Q704
C-9
C-9
F-7
G-9
E-10
E-7
F-6
F-7
F-6
39 39
MDS-NT1
MDS-NT1
6-5.
SCHEMATIC DIAGRAM – BD Board (1/2) – •
See page 38 for Waveforms.
•
See page 48 for IC Block Diagrams.
FLEXIBLE
BOARD
TEST PIN
(FOR ADJUSTMENT)
M102
(SLED)
M101
(SPINDLE)
HR901
OVER WRITE
HEAD
FE
VC
RF
I+3V
IOP
GND
TE
CN105
7P
PD
K
FCS+
FCS-
TRK+
TRK-
F
I
VC
A
B
J
VEE
E
D
C
VCC
LD-GND
ILCC
MOD
VR
CN101
21P
CN104
2P
(1/2)
TP701
C103
0.01
R707
4.7k
Q704
2SA1576A-T
TP616
TP615
TP614
TP613
TP612
TP611
TP609
TP608
TP607
TP606
L601
L602
L603
A
B
J
C101 4.7
TP605
C
F
E
D
I
C701
0.1
R103
4.7k
TP604
TP603
TP602
TP601
AA1
AA2
AA3
AA4
C105
10
6.3V
Q702
FMW1-T-148
-1
R701
1k
-2
Q701-704
HF MODULE
SWITCH
Q701
UN5214-TX
L201
C106
10
6.3V
D
E
F
A
B
C
I
J
R702
1k
Q703
UN5214-TX
Q201
UN5113
-TX
LASER ON
SWITCH
R104
470k
R105
3.3M
TP204
C107 0.022
R110
470k
TP203
R108
2.2k
C116
4.7
C117
0.01
C704 0.047
R703
1k
R705
10k
R704
47k
C702
4.7
R706
2.2k
C703
0.1
R709
2.2k
R708
4.7k
R710
47k
L701
R713
10k
TP11
C110
0.001
C109
0.047
TP207 C111
0.01
C114
2200p
C112
0.022
IC701
TLV2361CDBV
TP212
R112
100k
C113
0.0068
TP215
R111
10k
D101
1SS355TE-1
TP214
R712 100
COMPARATOR
R711
10k
R114
4.7k
R116
3.3k
C115
0.1
R113
10k
R115
10k
R120
33k
R119
22k
TP163
TP219
BB3
BB4
BB5
BB6 TP218
TP217 BB9
C119 1
C118
0.0047
TP216 BB7
C120 0.068
BB8
L203
R117
100k
R118
2.2k
R102
1
R101
2.2
R106
100k
R107
680
C104
0.1
Q203
UN5113
-TX
C108
0.1
BB8
BB5
BB1
Q202
2SB798
-T1D
R109
4.7k
Q202,203
AUTOMATIC
POWER CONTROL
TP404
DD1
DD2
OVER WRITE
HEAD DRIVE
IC181
MC74ACT08D
TR2
TP403
TP402
TP401
DD3
DD4
TP504 TP503
BG1
TP502 TP501
Q181,182
OVER WRITE
HEAD DRIVE
Q181
2SJ518ATZR
D501
F1J6TP
R501
0
C550
22
10V
D502
F1J6TP
C501
470p
630V
Q182
2SK2788VYTR
R551
47k
R552
47k
C504
10
C502
0.1
TP143
L202
L550
C299
0.1
FOCUS/TRACKING
COIL DRIVE,
SPINDLE/SLED
MOTOR DRIVE
IC401
BH6519FS
C409
0.1
R405
0
C122
0.033
C505
100
6.3V
C121
0.01
C406
0.01
C405
0.1
C490
0.1
L502 L501
40 40
C410
100
6.3V
C407
0.1
C411
4.7
L401
L402
A8
A9
A10
A11
A1
A2
A3
A4
A5
A6
A7
A17
A18
A19
A14
A15
A16
A12
A13
MDS-NT1
6-6.
SCHEMATIC DIAGRAM – BD Board (2/2) – •
See page 38 for Waveforms.
A12
A13
A14
A15
A16
A8
A9
A10
A11
A1
A2
A3
A4
A5
A6
A7
(2/2)
BB9
C235 0.1
C230 0.1
XLRF
CKRF
DTRF
R122 10k TP162
C251 0.1
TP144
TP161
TP160
TP165
TRDR
R121
2.2k
TFDR
FFDR
FRDR
TP158
SRDR
SFDR
SPRD
SPFD
TP110
C231 0.1
C234
0.1
C250
0.1
TP190
C241
0.1
TP10
L122
TP1002
C206
100
6.3V
BB7
TP125
R202
680
TP145
TP101
R203
100
TP164
C240
0.1
TP1001
C215 0.033
R207 150
R212
330k
C220
0.47
C219
100p
C216 R211
2.2
1M
C242
0.1
DIGITAL SERVO SIGNAL PROCESSOR,
SHOCK PROOF MEMORY CONTROLLER,
TP148 TP149
L899
0
C809
4.7
C807
0.1
R808
0
1
X801
90MHz
4
2 3
L801
C209
100p
C211 C212
100p 100p
R205
10k
R206
10k
TP8
C214
0.01
R299
0
C254
0.01
A03
A04
C253
0.1
A02
A05
A01
A06
A00
A07
A10
A08
A09
XRAS
XCAS
D1
D2
D0
D3
C233
0.1
XOE
XWE
R227 100
R226 100
R225 100
R224 100
R228 100
XBCK
LRCK
DADT
ADDT
C909
22
10V
C255
0.1
D3
D0
XWE
XRAS
A10
A00
A01
A02
A03
C175
0.1
D-RAM
IC152
MSM51V17400F-
50TS-K
IC195
BR24C16F-E2
(NOT SUPPLIED)
R303 R302 R301
10k 10k 10k
C302
0.1
EEPROM
L10
IC926
NJM2391DL1-26
C905
100
6.3V
+2.6V REGULATOR C998
0.1
L8
C1102
0.1
C908
10
C903
100
6.3V
C902
0.1
+3.3V REGULATOR
IC933
BA033FP-E2
TP169
GND C999
0.1
D2
D1
XCAS
XOE
A09
A08
A07
A06
A05
A04
S105
(REC)
S104
(PLAY)
S103
(OUT)
S101
(LIMIT IN)
TP935 CC2
TP931 CC3
TP927 CC4
CC5
CC6
CC1
TP920
TP919
S102
-1
-2
S102-1
REFLECT RATE
DETECT
S102-2
PROTECT
DETECT
CC1
XINT
DQSY
CC2
SQSY
SENS
CC3
SRDT
XLAT
SCLK
CC4
SWDT
MNT2
MNT1
CC5
CC6
C301
0.1
XBCK
R178
0
ADDT
LRCK
DADT
XBCKI TP987
LRCKI TP899
DADTI
DOUT
TP999
TP910
TP909
TP917
TP916
TP986
TP911
TP914
TP913
TP912
C901
100
6.3V
TP908
TP907
C194
0.1
TP930
TP929
TP928
TP926
TP925
TP924
TP923
TP922
TP921
TP942
TP941
TP940
TP939
TP938
TP937
TP936
TP934
TP933
TP932
CN102
27P
MOD
IOP
LDON
LIMIT-IN
XINT
WRPWR
DQSY
REC-SW
SQSY
DIG-RST
SENS
PLAY-SW
SRDT
XLATCH
SCLK
OUT-SW
SWDT
MNT2(XBUSY)
MNT1(SHCK)
EEP-WP
SDA
SCL
REFRECT SW
PROTECT SW
D-GND
LD-OUT
LD-IN
DIN0
MGND
DIN1
MGND
M+5V
M+5V
ADDT
LRCK
DADT
GND
BCK
MCKGND
MCLK
D-GND
XBCKI
GND
LRCKI
GND
DADTI
+5V
DOUT
H+5V
HGND
CN103
23P
M103
(LOADING)
C907
0.01
A17
A18
A19
41 41
MDS-NT1
6-7.
PRINTED WIRING BOARD – MAIN Board (Component Side) –
1 2 3 4 5
A
MAIN BOARD (COMPONENT SIDE)
B
IC400
C
3
1 2
D
• Semiconductor
Location
Ref. No.
Location
D301
D400
D402
D421
D422
D470
D901
D-3
C-2
C-7
D-6
D-6
D-3
F-5
Q100
Q170
Q270
Q400
Q401
Q440
Q451
IC301
IC400
IC401
IC402
IC420
IC451
IC501
IC503
IC505
IC550
IC901
F-7
B-5
D-3
C-7
E-6
I-9
E-10
D-9
F-10
G-10
G-4
D-3
C-11
C-10
B-6
H-5
H-5
E-9
I
E
1
2
NC
F
G
H
13
14
1
2
7
6
6
IC420
7
1
3
IC402
2
1
2
NC
7
8
42 42
8 9
IC503
IC451
1 6
3 4
10 11 12
B
E
C C
E
B
IC505
IC550
8
5
1-682-708-
12
(12)
MDS-NT1
G
H
D
E
6-8.
PRINTED WIRING BOARD – MAIN Board (Conductor Side) –
1 2 3 4 5
A MAIN BOARD (CONDUCTOR SIDE)
CN200
ANALOG
OUT
J180
PHONES
B
–1
RV301
PHONE
LEVEL
–2
C
F
IC450
6
SHORT
SOCKET
7 8 9
CN4
(FRONT VIEW)
10
CN4
USB
2
3
4
1
J400
– +
DC IN 9V
11
2 1
1
8
IC440
I
1-682-708-
12
(12)
(CHASSIS)
43 43
• Semiconductor
Location
Ref. No.
Location
IC440
IC450
G-7
H-4
MDS-NT1
6-9.
SCHEMATIC DIAGRAM – MAIN Board (1/2) – •
See page 38 for Waveforms.
•
See page 48 for IC Block Diagrams.
(1/2)
NC
NC
CN105
8P
GND
RESET
CNVSS
RXD1
CLK1
+3.5V
RTS1
TXD1
RESET
CNVSS
RXD1
CLK1
RTS1
TXD1
5V
RMC
KEY2
FLCS
KEY1
FLDT
KEY0
FLCK
LED
CN103
14P
SYS+3.3V
DISP.GND
JOG1
JOG0
DIG-RST
CN104
7P
SYS+3.3V
PANEL.GND
LED1
LED2
LED3
KEY1
KEY0
CN101
27P
MOD
IOP
LDON
LIMIT-IN
XINT
WRPWR
DQSY
REC-SW
SQSY
DIG-RST
SENS
PLAY-SW
SRDT
XLATCH
SCLK
OUT-SW
SWDT
XBUSY
SHCK
EEP-WP
SDA
SCL
REFRECT SW
PROTECT SW
D-GND
LD-OUT
LD-IN
MOD
IOP
LDON
LIMIT-IN
XINIT
WRPWR
DQSY
REC-P
SQSY
DIG-RST
SENS
PLAY-P
SRDT
XLATCH
SCLK
OUT-SW
SWDT
XBUSY
SHCK
EEP-WP
SDA
SCL
REFLECT
PROTECT
LED1
LED2
LED3
KEY1
KEY0
JOG1
JOG0
DIG-RST
RMC
KEY2
FLCS
KEY1
FLDT
KEY0
FLCK
LED4
RB300
10k
X4
RB301
10k
X4
C318
0.1
LOAD-LOW
LOAD-OUT
LOAD-IN
XLATCH
SCL
OUT-SW
XBUSY
SHCK
EEP-WP
SDA
REFLECT
PROTECT
R306
0
TP300
TP301
TP302
TP303
UINT
UCS
URESET
LOADING
MOTOR DRIVER
C441
0.1
Q401
2SA1576-T106-QR
C442
0.1
R441
22k
R442
15k
R443
47k
LOAD-OUT
LOAD-IN
Q440
UN5211-TX
LOAD-LOW
Q401,440
REFERENCE
VOLTAGE SWITCH
C304
100p
C1
0.1
TP1
R10
0
FB1
0
AA2
AA1
TP2
TP3
TP4
LF1
AA3
FB2
0
FB3
0
FB4 0
R314
10k
R304
0
R303
0
TP350
TP351
C306 220p
R350
10k
C307
220p
R351
10k
C420
0.33
XINIT
SQSY
DQSY
X301
10MHz
RESET
C309 0.1
C321
CNVSS
R332 10k
UCLK
USI
USO
RMC
RESET SIGNAL
GENERATOR
RESET
IC420
M62016FP-E1
TP1642
R308
10k
C308
1000p
C316
0.1
R307
10k
R301
100k
C301
10
16V
C421
0.1
UVBUS3.3
UCLK
USI
USO
C903
0.1
C904
0.1
UCS
R901
0
UINT
URESET
R902
0
C905
0.1
R915
10k
C906
0.1
UPLLSW
C920
0
C918
22p
C917
0.1
R907
1.5k
R906
27
C916
0.1
C915
0.1
C900
22p
X550
12MHz
R905
27
C922
0.1
C913
0.1
R913
10k
R904
22k
R903
47k
D901
1SS355TE-17
C907
0.1
L451
0
C453
0.1
L452
0
R908
10k
R951
0
R950
0
R952
0
C910
0.1
CN4
4P
USB
DADTI
LRCKI
XBCKI
BCK
DADT
LRCK
R552
220 L552
DIN1
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
DOUT
REG +5V
DADTI
REG GND
LRCKI
REG GND
XBCKI
D-GND
MCLK
MCKGND
BCK
REG GND
DADT
LRCK
ADDT
M+5V
M+5V
MGND
CN102
23P
DIN1
MGND
DIN0
HGND
H+5V
44 44
MDS-NT1
6-10. SCHEMATIC DIAGRAM – MAIN Board (2/2) – •
See page 38 for Waveforms.
•
See page 48 for IC Block Diagrams.
(CHASSIS)
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
(2/2)
EP550
C556
0.1
C856
0.1
R551
R581
220
L551
0.1
R550
1M
C519
1000p
BCK
DADT
LRCK
ADA.RESET
LATCH
SCLK
SWDT
IC550
TC7WHU04FU
BUFFER
C554
0
R501 220
R503 220
R500 220
R506 100
R505 100
R504 100
C517
100p
C516
100p
C515
100p
C551
0.1
C550
100
10V
L550
R420
0
C555
0.1
C432
0.1
D422
RB495D-T146 R421
220
C416
220
10V
C415
0.1
+3.3V REGULATOR
IC402
BA033FP-E2
D/A CONVERTER
IC505
CXD9627
L504
0
C461
0.1
C523
100
10V
C524
0.1
+5V REGULATOR
IC450
BA05T
L400
L22 µ H
L503
C462
0.1
C854
0
C507
0.1
C450
220
10V
Q400
R162
10k
R164
10k
C166
100p
C161
220p
C852
0
R161
10k
R163
10k
C165
100p
C851
0
R165
10k
MIX AMP
C265
100p
R261
10k
R263
10k
C261
220p
R265
10k IC501(1/2)
NJM2115V(TE2)
3
2
4
R262
10k
R264
10k
R266
10k
C266
100p
IC501(2/2)
NJM2115V(TE2)
6
5
8
R240
0
R242
0
R166
10k
R140
0
R142
0
C451
0.1
C452
0.1
C456
220
10V
R176
680
C176
22
25V
R170
10k
Q170
2SD1938(F)
-T(TX)
Q170,270
MUTING
L178
L278
R178
330
C177
220p
R278
330
C277
220p
R456
4.7k
R270
10k
Q270
2SD1938(F)
-T(TX)
-1
-2
R455
10k
R450
100k
C459
1
R276
680
C276
22
25V
C280
1
50V
C281
220 10V L280
R280
2.2
RV301
20k/20k
PHONE
LEVEL
-5V REGULATOR
IC451
XC6351A120MR C101
1
C100
1
Q100
UN5111-TX
MUTING
CONTROL
SWITCH
Q451
UN5211-TX
HEADPHONE
MUTING
HEADPHONE AMP
IC503
BH3541F-E2
C282
220p
R281
1k
R181
1k
C182
220p
C181
220
10V
L180
R180
2.2
C180
1 50V
C460
47
10V
C458
220
10V
D301
DAP202UT106
HAT1020R-E
SWITCHING
R401
0.047
D470
MA8033-L-TX
MAX1626ESA
IC400
R471
2.2k
R470
2.2k
C408
0.1
C409
0.1
C410
15
16V
VOLTAGE
DETECT
IC401
XC61FN3012MR
THP400
T400
R403
4.7k
C401
0.1
CN200
ANALOG
(CHASSIS)
OUT
J180
PHONES
J400
DC IN 9V
C402
0.1
(CHASSIS)
C404
0.1
CN420
2P
(CHASSIS)
SHORT
SOCKET
S
C414
0.1
C413
1000
10V
C412
47
6.3V
D402
SFPB-52V
SWITCHING
REGULATOR
C407
6800
16V
R404
10k
C406
0.1
BT420
LITHIUM
BATTERY
45 45
MDS-NT1
6-11. PRINTED WIRING BOARD – PANEL Board –
A
1 2
PANEL BOARD
(COMPONENT SIDE)
K
(PLAY)
A
B
3
A
D731, 751
K
PANEL BOARD
(CONDUCTOR SIDE)
C
N />
D
Net MD
• Semiconductor
Location
Ref. No.
Location
D731
D732
D751
A-6
C-4
A-1
Q731
Q732
Q751
B-5
B-3
B-1
46 46
4 5 6
K
(REC)
A
1-682-709-
12
(12) x /Z
1-682-709-
12
(12)
(CHASSIS)
MDS-NT1
6-12. SCHEMATIC DIAGRAM – PANEL Board –
(CHASSIS)
D732
SEL5820A-TP15
Net MD
R732
150
D751
SML-010MT-T87
(PLAY)
R751
150
R726
4.7k
TP701
Q732
UN5211-TX
LED DRIVE
C748
0.1
R731
150
D731
SML-010VT-T87
(REC)
Q751
UN5211-TX
LED DRIVE
S726
S702
Q731
UN5211-TX
LED DRIVE
R702
2.2k
SYS+3.5V
PANEL.GND
LED1
LED2
LED3
KEY1
KEY0
CN704
7P
47
MDS-NT1
• IC Block Diagrams
– BD Board –
IC101 CXA2523AR
J
VC
I 1
2
3
A 4
IVR
B 5
IVR
C 6
IVR
D 7
IVR
E 8
IVR
F 9
IVR
PD
APC
APCREF
10
11
12
CVB
GSW
+ –
+
–
RFA1
48 47 46 45
–
+
USROP
44
–
–
–
–
1
2
RFA2
OFST
–
–
–
1
2
HLPT
GRV
GRVA
–1
RFA3
–2
PTGR
–2
–1
PBSW
43 42 41 40 39 38
+
–
BPF3T
USRC
RF AGC
DET
3T
PEAK3T
P-P
3T
PEAK
BOTTOM
WBL
PBH
WBL
TEMP
EQ
EQ
AUX
SW
37
+
–
AA
–
–
ABCDA
BPFC
36 BOTM
35 ABCD
34 FE
33 AUX
+
–
BB
32 ADFG
31 ADAGC
–
–
+
+
FEA
30 ADIN
+
– CC
DET
+
– DD
–
–
+
+ ATA
BPF22
WBL
ADIP
AGC
29 ADFM
WBL
+
– EE
+
–
EBAL
EE'
EFB
ESW
–
+
TESW
PTGR
–1
–2
SEA
TG
28 SE
–1
–2
TEA
27 CSLED
TG
26 TE
+
–
IV
FF
+
–
FBAL
FF'
WBL
3T
EQ
VI CONV 25 WBLADJ
AUXSW
COMMAND
BGR
+ – VREF
SCRI - PARA
DECODE
13 14 15 16 17 18 19 20 21 22 23 24
48
IC401 BH6519FS-E2
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
AMP AMP
CHARGE
PUMP.
OSC
INTERFACE AMP
PREDRIVE
PREDRIVE
INTERFACE AMP AMP AMP
AMP INTERFACE V DD
PREDRIVE
AMP
PREDRIVE
INTERFACE PSB
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
– MAIN Board –
IC400 MAX1626ESA-TE2
8 GND
7 EXT
OUT 1
R2
R3
3/5 2
SHDN 3
REF 4
R1
1.5V
ERROR
COMPARATOR
–
+
MINIMUM ON-TIME
ONE-SHOT
TRIG Q
TRIG Q
MINIMUM OFF-TIME
ONE-SHOT
+
REF Q
R S
CURRENT-SENSE
COMPARATOR
–
+
– +
6
5
CS
V+
IC420 M62016FP-E1
R3
R2
R4
R1
3 4 5 6
+
–
COM
INTERRUPT
SIGNAL
GENERATOR
8 INT
+
–
COM
7
RESET
SIGNAL
GENERATOR
1 RESET
2
MDS-NT1
49
MDS-NT1
IC440 M54641L
INPUT
AMP
INPUT
AMP
CONTROL
REG.
POWER
AMP
POWER
AMP
1 2 3 4 5 6 7 8
IC451 XC6351A120MR
GND 1
CCE/ 2
CHIP
ENABLE
C1+ 3
OSCILLATOR
P1 N2
N3
BUFFER
6 C1–
5 VIN
N4
4 VOUT
IC503 BH3541F-E2
8 7
0dB
0dB
6
BIAS
5
180k
+
180k
+
1
MUTE
2 3 4
IC505 CXD9627A-E2
CDTI
CLK
CSN
8
7
6
PDN 5
LRCK
SDTI
BICK
4
3
2
µ
P
INTERFACE
AUDIO
DATA
INTERFACE
MCLK 1
DE-EMPHASIS
CONTROL
8X
INTERPOLATOR
8X
INTERPOLATOR
CLOCK
DIVIDER
∆∑
MODULATOR
∆∑
MODULATOR
SCF
SCF
9
10
AOUTR–
AOUTR+
11
12
AOUTL–
AOUTL+
13
14
15
16
VSS
VDD
DZFR
DZFL
50
MDS-NT1
42
43
44
45
39
40
41
46
47
48
36
37
38
33
34
35
30
31
32
27
28
29
24
25
26
21
22
23
Pin No.
1
2
3
4 to 9
10
11
12
13
14
15
16
17
18
19
AUX
FE
ABCD
BOTM
PEAK
RF
RFAGC
AGCI
COMPO
COMPP
ADDC
OPO
OPN
RFO
MORFI
MORFO
VREF
EQADJ
3TADJ
VCC
WBLADJ
TE
CSLED
SE
ADFM
ADIN
ADAGC
ADFG
6-13.
IC PIN FUNCTION DESCRIPTION
•
BD BOARD IC101 CXA2523AR (RF AMP, FOCUS/TRACKING ERROR AMP)
20
Pin Name
I
J
VC
A to F
PD
APC
APCREF
GND
TEMPI
TEMPR
SWDT
SCLK
XLAT
XSTBY
F0CNT
I/O
I
I
Description
I-V converted RF signal I input from the optical pick-up block detector
I-V converted RF signal J input from the optical pick-up block detector
O Middle point voltage (+1.65V) generation output terminal
I Signal input from the optical pick-up detector
I Light amount monitor input from the optical pick-up block laser diode
O Laser amplifier output to the automatic power control circuit
I Reference voltage input for setting laser power
— Ground terminal
I Connected to the temperature sensor
I
I
O Output terminal for a temperature sensor reference voltage
I Writing serial data input from the CXD2664R
I Serial data transfer clock signal input from the CXD2664R
Serial data latch pulse signal input from the CXD2664R
Standby signal input terminal “L”: standby (fixed at “H” in this set)
I
Center frequency control voltage input terminal of internal circuit (BPF22, BPF3T, EQ) input terminal
O Reference voltage output terminal Not used
I Center frequency setting terminal for the internal circuit (EQ)
I Center frequency setting terminal for the internal circuit (BPF3T)
— Power supply terminal (+3.3V)
I Center frequency setting terminal for the internal circuit (BPF22)
O Tracking error signal output terminal
I Connected to the external capacitor for low-pass filter of the sled error signal
O Sled error signal output terminal
O FM signal output terminal of the ADIP
I Receives a ADIP FM signal in AC coupling
I Connected to the external capacitor for ADIP AGC
O ADIP duplex signal (22.05 kHz
±
1 kHz) output to the CXD2664R
O Auxiliary signal (I
3
signal/temperature signal) output to the CXD2664R
O Focus error signal output terminal
O Light amount signal (ABCD) output terminal
O Light amount signal (RF/ABCD) bottom hold output terminal
O Light amount signal (RF/ABCD) peak hold output terminal
O Playback EFM RF signal output terminal
I Connected to the external capacitor for RF auto gain control circuit
I Receives a RF signal in AC coupling
O User comparator output terminal Not used
I User comparator input terminal Not used
I Connected to the external capacitor for cutting the low band of the ADIP amplifier
O User operational amplifier output terminal Not used
I User operational amplifier inversion input terminal Not used
O RF signal output terminal
I Receives a MO RF signal in AC coupling
O MO RF signal output terminal
51
MDS-NT1
•
BD BOARD IC201 CXD2664R
(DIGITAL SIGNAL PROCESSOR, DIGITAL SERVO SIGNAL PROCESSOR, EFM/ACIRC ENCODER/DECODER,
SHOCK PROOF MEMORY CONTROLLER, ATRAC ENCODER/DECODER)
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
Pin Name I/O Description
MNT0 (FOK)
MNT1 (SHCK) O Track jump detection signal output to the system controller
MNT2 (XBUSY) O Busy monitor signal output to the system controller
MNT3 (SLOC)
VDC0
SWDT
O Focus OK signal output terminal “H” is output when focus is on (“L”: NG) Not used
O Spindle servo lock status monitor signal output terminal Not used
—
I
Power supply terminal (+2.5V) (for core)
Writing serial data signal input from the system controller
SCLK
XLAT
VSC0
SRDT
SENS
XRST
I
I
Serial data transfer clock signal input from the system controller
Serial data latch pulse signal input from the system controller
— Ground terminal (for core)
O Reading serial data signal output to the system controller
O Internal status (SENSE) output to the system controller
I Reset signal input from the system controller “L”: reset
13 SQSY O
Subcode Q sync (SCOR) output to the system controller
“L” is output every 13.3 msec Almost all, “H” is output
14 DQSY O
Digital In U-bit CD format subcode Q sync (SCOR) output to the system controller
“L” is output every 13.3 msec Almost all, “H” is output
15
21
22
23
32
33
34
29
30
31
35
36
37
38
39
40
24
25
26
27
28
16
17
18
19
20
RPWR
XINT
TX
VDIO0
OSCI
OSCO
OSCN
VSIO0
XTSL
DIN0
DIN1
DOUT
DATAI
LRCKI
XBCKI
VDC1
VSC1
ADDT
DADT
LRCK
XBCK
FS256
XWE
XOE
DRVDD0
DRVSS0
I
O Interrupt status output to the system controller
O Magnetic head on/off signal output to the over write head drive
— Power supply terminal (+3.3V) (for I/O)
I System clock signal input terminal Not used
I
I
Laser power selection signal input from the system controller
“L”: playback mode, “H”: recording mode
System clock signal (2048Fs=90.3168 MHz) input terminal
Control terminal for inverter and feedback resistor of internal oscillator circuit
“L”: OSCO (pin w;) is output terminal, “H”: OSCO (pin w;) is input terminal
(fixed at “H” in this set)
— Ground terminal (for I/O)
I
Input terminal for the system clock frequency setting
“L”: 180.6336 MHz, “H”: 90.3168 MHz (fixed at “H” in this set)
I
I
I
I
I
Digital audio signal input terminal when recording mode Not used
Digital audio signal input terminal when recording mode
O Digital audio signal output terminal when playback mode Not used
Recording data input from the USB interface
L/R sampling clock signal (44.1 kHz) input from the USB interface
Bit clock signal (2.8224 MHz) input from the USB interface
— Power supply terminal (+2.5V) (for core)
— Ground terminal (for core)
I Recording data input terminal Not used
O Playback data output to the D/A converter
O L/R sampling clock signal (44.1 kHz) output to the D/A converter
O Bit clock signal (2.8224 MHz) output to the D/A converter
O Clock signal (11.2896 MHz) output to the D/A converter
O Write enable signal output to the D-RAM “L” active
O Output enable signal output to the D-RAM “L” active
— Power supply terminal (+3.3V) (for D-RAM interface)
— Ground terminal (for D-RAM interface)
52
MDS-NT1
94
95
96
89
90
91
92
93
97
98
99
83
84
85
80
81
82
86
87
88
76
77
78
79
73
74
75
70
71
72
67
68
69
Pin No.
41
42 to 45
46
47
48 to 56
57
58
59, 60
61
Pin Name
A11
D0 to D3
XCAS
XRAS
A00 to A02,
A05 to A10
VDC2
VSC2
A03, A04
DRVDD1
62 DRVSS1
63, 64 TEST0, TEST1
65 TEST2
66 AVD1
ASYO
ASYI
BIAS
RFI
AVS1
PCO
DCHG
APC
ADFG
VDIO1
VSIO1
F0CN
VDC3
VSC3
XLRF
CKRF
DTRF
FILI
FILO
CLTV
PEAK
BOTM
ABCD
FE
AUX1
VC
ADIO
ADRT
ADRB
SE
TE
AVD2
AVS2
I/O Description
O Address signal output to the external D-RAM Not used
I/O Two-way data bus with the D-RAM
O Column address strobe signal output to the D-RAM “L” active
O Row address strobe signal output to the D-RAM “L” active
O Address signal output to the D-RAM
— Power supply terminal (+2.5V) (for core)
— Ground terminal (for core)
O Address signal output to the D-RAM
— Power supply terminal (+3.3V) (for D-RAM interface)
— Ground terminal (for D-RAM interface)
I Not used
O Not used
— Power supply terminal (+3.3V) (analog system)
O Playback EFM full-swing output
I Playback EFM comparator slice voltage input
I Playback EFM comparator bias current input
I Playback EFM RF signal input from the RF amplifier
— Ground terminal (analog system)
O Phase comparison output for master clock of the recording/playback EFM master PLL
I Filter input for master clock of the recording/playback EFM master PLL
O Filter output for master clock of the recording/playback EFM master PLL
I Internal VCO control voltage input of the recording/playback EFM master PLL
I
I
I
I
Light amount signal (RF/ABCD) peak hold input from the RF amplifier
Light amount signal (RF/ABCD) bottom hold input from the RF amplifier
Light amount signal (ABCD) input from the RF amplifier
Focus error signal input from the RF amplifier
I
I
Auxiliary signal (I
3
signal/temperature signal) input from the RF amplifier
Middle point voltage (+1.65V) input from the RF amplifier
O Output terminal for the test
I
I
I
A/D converter operational range upper limit voltage input terminal (fixed at “H” in this set)
A/D converter operational range lower limit voltage input terminal (fixed at “L” in this set)
Sled error signal input from the RF amplifier
I Tracking error signal input from the RF amplifier
— Power supply terminal (+3.3V) (analog system)
— Ground terminal (analog system)
I Connected to the +3.3V power supply
I
I
Error signal input terminal for laser digital automatic power control Not used
ADIP duplex FM signal (22.05 kHz
±
1 kHz) input from the RF amplifier
— Power supply terminal (+3.3V) (for I/O)
— Ground terminal (for I/O)
O Filter f0 control signal output to the RF amplifier
— Power supply terminal (+2.5V) (for core)
— Ground terminal (for core)
O Serial data latch pulse signal output to the RF amplifier
O Serial data transfer clock signal output to the RF amplifier
O Writing serial data output to the RF amplifier
53
MDS-NT1
Pin No.
100
101
102
103
104
105
106
107
108
109
Pin Name
APC
LDDR
TRDR
TFDR
FFDR
FRDR
FS4
SRDR
SFDR
SPRD
110
111
SPFD
FGIN
112 to 114 TST1 to TST3
115
116
EFMO
VDIO1
117
118
119
VSIO1
VDC4
VSC4
120 MDDT1
I/O Description
O Reference PWM signal output to the RF amplifier for the laser automatic power control
O PWM signal output terminal for laser digital automatic power control Not used
O Tracking servo drive PWM signal (–) output
O Tracking servo drive PWM signal (+) output
O Focus servo drive PWM signal (+) output
O Focus servo drive PWM signal (–) output
O Clock signal (176.4 kHz) output terminal (X’tal system) Not used
O Sled servo drive PWM signal (–) output
O Sled servo drive PWM signal (+) output
O Spindle servo drive PWM signal (–) output
O Spindle servo drive PWM signal (+) output
I FG input terminal for spindle servo Not used
I Input terminal for the test
O EFM signal output terminal when recording mode “L” is output when playback mode
— Power supply terminal (+3.3V) (for I/O)
— Ground terminal (for I/O)
— Power supply terminal (+2.5V) (for core)
— Ground terminal (for core)
I
MD data mode selection signal input terminal
“L”: normal mode, “H”: MD data mode (fixed at “L” in this set)
54
MDS-NT1
19 to 22
23
24 to 26
27
28
29
30
31
32
33 to 35
36
37
38
39
40, 41
•
MAIN BOARD IC301 M30835FJGP-01 (SYSTEM CONTROLLER)
Pin No.
1
2
3
4
5
6
7
8, 9
10
11
12
13
14
15
16
17
20
42
43
44
45
46
47
48
49
Pin Name
NC
RMC
NETMD_SO
NETMD_SI
NETMD_CLK
BYTE
CNVSS
NC
S.RESET
XOUT
VSS
XIN
VCC
NMI
DQSY
P.DOWN
SQSY
NC
XINT
NC
I2C_CLK
I2C_DATA
SWDT
SRDT
SCLK
RTSI
NC
MUTE
ADA_RESET
ADA_LATCH
EPM
NC
MOD
LDON
CE
LIMIT-IN
WRPWR
REC-SW
ADA_RESET
SENSE
I/O
—
I
Not used
O Serial data output to the USB interface IC
I
I
Serial data input from the USB interface IC
— Not used
Description
Remote control signal input terminal Not used
O Serial data transfer clock output to the USB interface IC
External data bus line byte selection signal input “L”: 16 bit, “H”: 8 bit (fixed at “L”)
— Not used
I
I
System reset signal input terminal “L”: reset
For several hundreds msec. after the power supply rises, “L” is input, then it change to “H”
System clock input terminal (10 MHz)
— Ground terminal
O System clock output terminal (10 MHz)
— Power supply terminal (+3.3V)
I
I
I
Non-maskable interrupt input terminal Not used
Digital In U-bit CD format subcode Q sync (SCOR) input terminal
“L” is input every 13.3 msec Almost all, “H” is input
Power down detection signal input terminal
I
Subcode Q sync (SCOR) input terminal
“L” is input every 13.3 msec Almost all, “H” is input
— Not used
I Interrupt status input from the mechanism deck section
— Not used
I/O Communication data reading clock signal output terminal Not used
I/O Communication data bus input/output terminal Not used
O Writing data output to the mechanism deck section and the D/A converter
I Reading data input from the mechanism deck section
O Serial data transfer clock signal output to the mechanism deck section and the D/A converter
— Not used
— Not used
O Audio line muting control signal output terminal “L”: line muting on
O Reset signal output to the D/A converter “L”: reset
O Serial data latch signal output to the D/A converter “L”: reset
— Not used
— Not used
O
Laser modulation select signal output terminal Stop: “L” Playback power: “H”
Recoding power: “H” pulse is inputted in a cycle of 2 seconds
O
Laser diode on/off control signal output to the automatic power control circuit
“H”: laser diode on
I
I
Command chip enable signal output to the D-RAM
Detection input from the sled limit-in detect switch (S101)
The optical pick-up is inner position when “L”
O Laser power select signal output terminal “L”: playback mode, “H”: recording mode
I Detection input from the recording position detect switch “L”: active
O Reset signal output to the mechanism deck section “L”: reset
I Internal status (SENSE) signal input to the mechanism deck section
55
MDS-NT1
Pin No.
50
51
52
53
54
55
56
57
58
Pin Name
PLAY-SW
XLATCH
SCL
OUT-SW
XBUSY
SHOCK
EEP-WP
SDA
REFLECT
I/O
I
Description
Detection input from the playback position detect switch “L”: active
O Serial data latch pulse signal output to the mechanism deck section
O Serial clock signal output to the EEPROM
I
I
Detection signal input from the loading-out detect switch (S103)
“L” at a load-out position, others: “H”
I Busy monitor signal input from the mechanism deck section
I Track jump detection signal input from the mechanism deck section
O Writing protect signal output to the EEPROM
I/O Two-way data bus with the EEPROM
Detection input from the disc reflection rate detect switch
“L”: high reflection rate disc, “H”: low reflection rate disc
59 PROTECT SW I
REC-proof claw detection signal input from the protect detect switch
“H”: write protect
60
61
62
63
64
65
66 to 69
70 to 72
73
74
75
76
77
78, 79
80
81, 82
83
84
85
86
87
88
89
90, 91
92
93
94
95
96
97
98
99
100
VCC
EEPNET-WP
VSS
LD-LOW
LOAD OUT
LOAD OUT
SEL1
SEL0
NC
KEY2
— Power supply terminal (+3.3V)
— Not used
— Ground terminal
O Loading motor drive voltage control signal output terminal “H” active
O Loading motor control signal (load-in direction) output terminal “H” at a load-in
O Loading motor control signal (eject direction) output terminal “H” at a eject
I Test input terminal Not used TEST
NC
NETMD_INT
NETMD_XCS
JOG0
JOG1
IOP
— Not used
I Interrupt status input from the USB interface IC
O Chip select signal output to the USB interface IC
NETMD_RESET O Reset signal output to the USB interface IC “L”: reset
NETMD_PLLSW O PLL function on/off control signal output to the USB interface IC “L”: PLL on
NETMD_VBUS I USB connect detection signal input terminal “H”: USB on
NC
LED4
LED3, 2
— Not used
O LED drive signal output terminal Not used
O LED drive signal output terminal
FLCS
LED1
—
O
I
I
Not used
LED drive signal output terminal
Jog dial pulse input terminal Not used
Jog dial pulse input terminal Not used
— Not used
I Destination setting terminal
I Model setting terminal
KEY1
AVSS
KEY0
— Not used
I key input terminal Not used
I B/> key input terminal
— Ground terminal
I x/Z key input terminal
I Reference voltage (+3.3V) input terminal VREF
AVCC
NC
FLDT
FLCK
—
—
— Not used
—
Power supply terminal (+3.3V)
Not used
Not used
56
MDS-NT1
35
36
37
38
32
33
34
29
30
31
26
27
28
42
43
44
39
40
41
45
23
24
25
20
21
22
17
18
19
13
14
15
16
10
11
12
7
8
9
Pin No.
1
2
3
4
5
6
DNKSO
DNKSI
DNKST
VDC3
VSC2
DNKRS
TEST1
VDEA4
PLLTHRU
USBEN
VDC4
VSC3
USBVSS
DP
DM
USBVDD
USBSW
PLLVDD
PLLVSS
OSCVDD
VSC0
EXTIF0
EXTIF1
VDEA2
VSEA1
EXTIF0
EXTIF1
VDC2
VSC1
DNKCK
DNKCS
VDEA3
VSEA2
Pin Name
VDEA0
VSEA0
PLLSW
TEST0
DSPCLK
VDC0
DSPIF0
DSPIF1
VDEA1
DSPIF2
DSPIF3
VDC1
•
MAIN BOARD IC301 CXD1873R (NET MD SECURITY, DIGITAL SIGNAL PROCESSOR, USB INTERFACE)
I/O
— Power supply terminal (+3.3V) (for DSP)
Description
— Ground terminal (for DSP)
I PLL function on/off control signal input from the system controller “L”: PLL on
I Test input terminal Normally fixed at “L”
I DSP transfer clock signal input terminal (256Fs: 11.2896MHz)
— Power supply terminal (+3.3V)
O Digital audio signal output terminal when recording mode
O L/R sampling clock signal (44.1 kHz) output terminal
— Power supply terminal (+3.3V) (for DSP)
O Bit clock signal (2.8224 MHz) output terminal
O Recording data output terminal
— Power supply terminal (+3.3V)
— Ground terminal
I/O Not used
I/O Not used
— Power supply terminal (+3.3V) (for DSP)
— Ground terminal (for DSP)
I/O Not used
I/O Not used
— Power supply terminal (+3.3V)
— Ground terminal
O Serial ROM clock signal output terminal Not used
O Serial ROM chip select signal output terminal Not used
— Power supply terminal (+3.3V) (for DSP)
— Ground terminal (for DSP)
O Serial ROM data output terminal Not used
I Serial ROM data input terminal Not used
I Serial ROM status input terminal Not used
— Power supply terminal (+3.3V)
— Ground terminal
I Serial ROM reset signal input terminal Not used
I Test input terminal Normally fixed at “L”
— Power supply terminal (+3.3V) (for DSP)
I Not used
I USB enable signal input terminal
— Power supply terminal (+3.3V)
— Ground terminal
— Ground terminal (for USB)
I/O USB communication input/output
I/O USB communication input/output
— Power supply terminal (+3.3V) (for USB)
O USB communication on/off control signal output “H”: USB communication on
— Power supply terminal (+3.3V) (for USB)
— Ground terminal (for USB)
— Power supply terminal (+3.3V) (for OSC)
57
MDS-NT1
55
56
57
52
53
54
Pin No.
46
47
48
49
50
51
61
62
63
58
59
60
64
Pin Name
EXTAL
XTAL
PLLVSS
VDEC0
VSEC0
CPUCK
CPUSO
CPUSI
VDEC1
VSEC1
CPUXCS
CPUINT
RESET
VDEC2
VSEC2
VDC5
VSC4
TEST2
TEST3
I/O
I
O
System clock input terminal (12 MHz)
System clock output terminal (12 MHz)
— Ground terminal (for OSC)
— Power supply terminal (+3.3V) (for CPU)
Description
— Ground terminal (for CPU)
I Serial data transfer clock input from the system controller
O
I
Serial data output to the system controller
Serial data input from the system controller
— Power supply terminal (+3.3V) (for CPU)
— Ground terminal (for CPU)
I Chip select signal input from the system controller
O
I
Interrupt status output to the system controller
Reset signal input from the system controller “L”: reset
— Power supply terminal (+3.3V) (for CPU)
— Ground terminal (for CPU)
— Power supply terminal (+3.3V)
— Ground terminal
O Test input terminal Not used
I Test input terminal Normally fixed at “L”
58
NOTE:
• -XX and -X mean standardized parts, so they may have some difference from the original one.
• Color Indication of Appearance Parts
Example:
KNOB, BALANCE (WHITE) . . . (RED)
↑ ↑
Parts Color Cabinet's Color
7-1. CASE SECTION
3
MDS-NT1
SECTION 7
EXPLODED VIEWS
• Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.
• The mechanical parts with no reference number in the exploded views are not supplied.
• Hardware (# mark) list and accessories and packing materials are given in the last of the electrical parts list.
• Abbreviation
SP : Singapore model
4
5
MDM-7S2B
4
5
not supplied
5
7
6
8
5
2
#1 case (B) section
#2 not supplied
#3
#2 front panel section
Ref. No.
Part No.
4
5
2
3
6
Description
4-951-620-01 SCREW (2.6X8), +BVTP
4-237-133-02 CASE (UPPER)
4-228-643-21 SCREW (+BVTTWH M3), STEP
4-228-689-01 INSULATOR
1-823-648-11 WIRE (FLAT TYPE) (7 CORE)
Remark Ref. No.
Part No.
7
8
#1
#2
#3
Description
1-792-811-21 WIRE (FLAT TYPE) (23 CORE)
1-792-812-21 WIRE (FLAT TYPE) (27 CORE)
7-685-870-01 SCREW +BVTT 3X5 (S)
7-685-647-79 SCREW +BVTP 3X10 TYPE2 IT-3
7-682-248-04 SCREW +K 3X8
Remark
59
MDS-NT1
7-2. FRONT PANEL SECTION
52
54
53
51
not supplied
56
56
55
Ref. No.
Part No.
51
52
53
54
Description
X-4954-600-3 PANEL ASSY, FRONT
4-236-730-01 BUTTON (A)
4-228-630-01 SPRING (LID), TENSION COIL
4-230-848-21 LID (MD)
Remark Ref. No.
Part No.
55
55
56
Description
A-4727-709-A PANEL BOARD, COMPLETE (SP)
A-4727-707-A PANEL BOARD, COMPLETE (AEP, UK)
4-951-620-01 SCREW (2.6X8), +BVTP
Remark
60
7-3. CASE (B) SECTION
105
101
#4
#4
#4
102
not supplied
104
#5
#4
103
105
MDS-NT1
Ref. No.
Part No.
101
101
* 102
103
Description
A-4727-708-A MAIN BOARD, COMPLETE (SP)
A-4727-706-A MAIN BOARD, COMPLETE (AEP, UK)
1-569-972-21 SOCKET, SHORT 2P
4-236-736-11 PANEL, BACK
Remark Ref. No.
Part No.
104
105
#4
#5
Description
4-230-473-11 CASE (B)
4-977-358-01 CUSHION
7-685-646-79 SCREW +BVTP 3X8 TYPE2 IT-3
7-685-872-09 SCREW +BVTT 3X8 (S)
Remark
61
MDS-NT1
7-4. MD MECHANISM DECK SECTION-1
(MDM-7S2B)
319
311
310
302
304
308
not supplied
306
not supplied
305
313
314
315
317
303
not supplied
318
316
307
320
302
301
MD mechanism deck section-2
Ref. No.
Part No.
* 301
302
303
304
305
Description
4-996-267-01 BASE (BU-D)
4-231-319-01 SCREW (2X6) CZN, +B (P) TRI
4-227-007-01 GEAR (SB)
4-227-025-01 BELT (LOADING)
A-4680-638-B RETAINER COMPLETE ASSY
306
307
308
310
4-227-002-01 GEAR, PULLEY
4-226-999-01 LEVER (HEAD)
X-4952-665-1 SPRING (SHT) ASSY, LEAF
4-229-533-02 SPRING (STOPPER), TORSION
Remark Ref. No.
Part No.
311
313
314
315
316
Description
4-227-012-01 SPRING (HOLDER), TENSION
4-227-013-01 SPRING (EJ), TENSION
4-226-995-01 SLIDER (EJ)
4-226-996-01 LIMITTER (EJ)
4-226-997-04 SLIDER
317
318
319
320
4-226-998-01 LEVER (CHG)
4-227-006-01 GEAR (SA)
A-4735-075-B HOLDER ASSY
4-226-994-01 GUIDE (L)
Remark
62
MDS-NT1
7-5. MD MECHANISM DECK SECTION-2
(MDM-7S2B)
359
HR901
357
358
354
355
352
S102
A
360
359
356
A
362
364
#11
365
366
M101
361
#11
362
368
367
353
not supplied
M102
352
363
353
M103 not supplied
353
353
351
The components identified by mark 0 or dotted line with mark 0 are critical for safety.
Replace only with part number specified.
356
357
0 358
359
360
361
362
363
Ref. No.
Part No.
351
352
353
354
355
Description
A-4727-982-A BD BOARD, COMPLETE
4-231-319-01 SCREW (2X6) CZN, +B (P) TRI
3-372-761-01 SCREW (M1.7), TAPPING
4-226-993-01 RACK
4-227-014-01 SPRING (RACK), COMPRESSION
4-226-992-01 BASE, SL
1-678-514-11 FLEXIBLE BOARD
A-4672-976-A OPTICAL PICK-UP KMS-262
4-988-560-01 SCREW (+P 1.7X6)
4-996-265-01 SHAFT, MAIN
4-226-989-01 CHASSIS
4-211-036-01 SCREW (1.7X2.5), +PWH
4-226-990-04 BASE (BU-A)
Remark Ref. No.
Part No.
364
365
366
367
368
Description
4-230-716-01 SPRING (SPDL), TORSION
4-227-004-01 GEAR (LC)
4-227-005-01 GEAR (LD)
4-227-008-01 GEAR (SC)
4-227-009-01 GEAR (SD)
Remark
HR901 1-500-670-22 HEAD, OVER WRITE
M101 A-4735-757-A MOTOR ASSY, SPINDLE
M102 A-4672-900-A MOTOR ASSY, SLED
M103 A-4672-975-A MOTOR ASSY, LOADING
S102 1-771-957-11 SWITCH, PUSH (2 KEY)
(REFLECT RATE DETECT, PROTECT DETECT)
#11 7-685-204-19 SCREW +KTP 2X6 TYPE2 NON-SLIT
63
MDS-NT1
BD
NOTE:
• Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.
• -XX and -X mean standardized parts, so they may have some difference from the original one.
• RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
• Abbreviation
SP: Singapore
SECTION 8
ELECTRICAL PARTS LIST
• Items marked “*” are not stocked since they are seldom required for routine service.
Some delay should be anticipated when ordering these items.
• SEMICONDUCTORS
In each case, u:
µ
, for example: uA. .
:
µ
A. .
uPB. . :
µ
PB. .
uPD. . :
µ
PD. .
uPA. . : uPC. . :
µ
µ
PA. .
PC. .
• CAPACITORS uF:
µ
F
• COILS uH:
µ
H
The components identified by mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number specified.
When indicating parts by reference number, please include the board.
Ref. No.
Part No.
Description
A-4727-982-A BD BOARD, COMPLETE
*******************
Remark
< CAPACITOR >
C101 1-117-720-11 CERAMIC CHIP 4.7uF
10V
C103 1-162-970-11 CERAMIC CHIP 0.01uF
10% 25V
C104 1-164-156-11 CERAMIC CHIP 0.1uF
C105 1-135-259-11 TANTALUM CHIP 10uF
C106 1-135-259-11 TANTALUM CHIP 10uF
20%
20%
25V
6.3V
6.3V
Ref. No.
C241
C242
C250
C251
C252
Part No.
Description
1-164-156-11 CERAMIC CHIP
1-164-156-11 CERAMIC CHIP
1-164-156-11 CERAMIC CHIP
1-164-156-11 CERAMIC CHIP
1-164-156-11 CERAMIC CHIP
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
Remark
25V
25V
25V
25V
25V
C253 1-164-156-11 CERAMIC CHIP 0.1uF
25V
C254 1-162-970-11 CERAMIC CHIP 0.01uF
10% 25V
C255 1-164-156-11 CERAMIC CHIP 0.1uF
C299 1-164-156-11 CERAMIC CHIP 0.1uF
C301 1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
25V C107 1-164-227-11 CERAMIC CHIP 0.022uF
10% 25V
C108 1-164-156-11 CERAMIC CHIP 0.1uF
25V
C109 1-165-176-11 CERAMIC CHIP 0.047uF
10% 16V
C110 1-115-416-11 CERAMIC CHIP 0.001uF
5% 25V
C111 1-162-970-11 CERAMIC CHIP 0.01uF
10% 25V
C112 1-164-227-11 CERAMIC CHIP 0.022uF
10% 25V
C113 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V
C114 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C115 1-164-156-11 CERAMIC CHIP 0.1uF
25V
C116 1-117-720-11 CERAMIC CHIP 4.7uF
10V
C302 1-164-156-11 CERAMIC CHIP 0.1uF
C405 1-164-156-11 CERAMIC CHIP 0.1uF
C406 1-162-970-11 CERAMIC CHIP 0.01uF
10% 25V
C407 1-164-156-11 CERAMIC CHIP 0.1uF
25V
C409 1-164-156-11 CERAMIC CHIP 0.1uF
C410 1-126-206-11 ELECT CHIP 100uF
C411 1-117-720-11 CERAMIC CHIP 4.7uF
C490 1-164-156-11 CERAMIC CHIP 0.1uF
C501 1-128-795-91 ELECT CHIP 470PF
C502 1-164-156-11 CERAMIC CHIP 0.1uF
20%
10%
25V
25V
25V
6.3V
10V
25V
630V
25V C117 1-162-970-11 CERAMIC CHIP 0.01uF
10% 25V
C118 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50V
C119 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C120 1-110-563-11 CERAMIC CHIP 0.068uF
10% 16V
C121 1-162-970-11 CERAMIC CHIP 0.01uF
10% 25V
C122 1-164-677-11 CERAMIC CHIP 0.033uF
10% 16V
C175 1-164-156-11 CERAMIC CHIP 0.1uF
25V
C194 1-164-156-11 CERAMIC CHIP 0.1uF
25V
C205 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C206 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C503 1-164-156-11 CERAMIC CHIP 0.1uF
C504 1-117-370-11 CERAMIC CHIP 10uF
C505 1-126-206-11 ELECT CHIP
C550 1-117-970-11 ELECT CHIP
100uF
22uF
C701 1-164-156-11 CERAMIC CHIP 0.1uF
C702 1-117-720-11 CERAMIC CHIP 4.7uF
C703 1-164-156-11 CERAMIC CHIP 0.1uF
25V
10V
20% 6.3V
20% 10V
25V
10V
25V
C704 1-165-176-11 CERAMIC CHIP 0.047uF
10% 16V
C807 1-164-156-11 CERAMIC CHIP 0.1uF
25V
C809 1-117-720-11 CERAMIC CHIP 4.7uF
10V C209 1-162-927-11 CERAMIC CHIP 100PF
C211 1-162-927-11 CERAMIC CHIP 100PF
5%
5%
50V
50V
C212 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C214 1-162-970-11 CERAMIC CHIP 0.01uF
10% 25V
C215 1-164-677-11 CERAMIC CHIP 0.033uF
10% 16V
C216 1-125-889-11 CERAMIC CHIP 2.2uF
C219 1-162-927-11 CERAMIC CHIP 100PF
10% 10V
5% 50V
C220 1-125-891-11 CERAMIC CHIP 0.47uF
10% 10V
C221 1-162-970-11 CERAMIC CHIP 0.01uF
10% 25V
C230 1-164-156-11 CERAMIC CHIP 0.1uF
25V
C231
C233
C234
C235
1-164-156-11 CERAMIC CHIP
1-164-156-11 CERAMIC CHIP
1-164-156-11 CERAMIC CHIP
1-164-156-11 CERAMIC CHIP
0.1uF
0.1uF
0.1uF
0.1uF
C240 1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
25V
25V
25V
C901 1-126-206-11 ELECT CHIP
C903 1-126-206-11 ELECT CHIP
C905 1-126-206-11 ELECT CHIP
100uF
C902 1-164-156-11 CERAMIC CHIP 0.1uF
100uF
C904 1-164-156-11 CERAMIC CHIP 0.1uF
100uF
C907 1-162-970-11 CERAMIC CHIP 0.01uF
10% 25V
C908 1-117-370-11 CERAMIC CHIP 10uF
C909 1-104-852-11 TANTALUM CHIP 22uF
C909 1-117-370-11 CERAMIC CHIP 10uF
C998 1-164-156-11 CERAMIC CHIP 0.1uF
C999 1-164-156-11 CERAMIC CHIP 0.1uF
C1102 1-164-156-11 CERAMIC CHIP 0.1uF
20% 6.3V
20%
20%
25V
20% 6.3V
25V
6.3V
10V
10V
10V
25V
25V
25V
64
Ref. No.
Part No.
Description
< CONNECTOR >
CN101 1-766-833-21 CONNECTOR, FFC/FPC (ZIF) 21P
CN102 1-784-835-21 CONNECTOR, FFC (LIF (NON-ZIF)) 27P
CN103 1-784-834-21 CONNECTOR, FFC (LIF (NON-ZIF)) 23P
* CN104 1-580-055-21 PIN, CONNECTOR (SMD) 2P
CN105 1-784-859-21 CONNECTOR, FFC (LIF (NON-ZIF)) 7P
Remark
L8
L10
L122
L201
L202
L203
L401
L402
L501
L502
< DIODE >
D101 8-719-988-61 DIODE 1SS355TE-17
D501 8-719-046-86 DIODE F1J6TP
D502 8-719-046-86 DIODE F1J6TP
< IC >
IC101 8-752-080-95 IC CXA2523AR
IC152 6-700-052-01 IC MSM51V17400F-50TS-K
IC181 8-759-481-17 IC MC74ACT08DTR2
IC195 (not supplied) IC BR24C16F-E2
IC201 8-752-414-89 IC CXD2664R
IC401 8-759-836-79 IC BH6519FS-E2
IC701 8-759-473-51 IC TLV2361CDBV
IC926 8-759-835-63 IC NJM2391DL1-26 (TE1)
IC933 8-759-460-72 IC BA033FP-E2
< FERRITE BEAD/RESISTOR >
1-414-760-21 FERRITE
1-469-981-21 FERRITE
1-414-760-21 FERRITE
1-414-760-21 FERRITE
1-469-981-21 FERRITE
1-414-760-21 FERRITE
1-400-050-11 FERRITE
1-400-050-11 FERRITE
1-400-050-11 FERRITE
1-400-050-11 FERRITE
0uH
0uH
0uH
0uH
0uH
0uH
0uH
0uH
0uH
0uH
L550
L601
L602
L603
L701
L801
L899
1-414-760-21 FERRITE
1-469-981-21 FERRITE
1-469-981-21 FERRITE
1-414-760-21 FERRITE
1-414-760-21 FERRITE
1-414-760-21 FERRITE
1-216-864-11 METAL CHIP
0uH
0uH
0uH
0uH
0uH
0uH
0
R101 1-216-298-00 METAL CHIP
R102 1-219-724-11 METAL CHIP
R103 1-216-829-11 METAL CHIP
R104 1-216-853-11 METAL CHIP
2.2
1
4.7K
470K
5%
< TRANSISTOR >
Q181 8-729-048-87 FET
Q182 8-729-048-88 FET
Q201 8-729-403-35 TRANSISTOR
Q202 8-729-101-07 TRANSISTOR
Q203 8-729-403-35 TRANSISTOR
2SJ518AZTR
2SK2788VYTR
UN5113-TX
2SB798-T1DK
UN5113-TX
Q701 8-729-402-93 TRANSISTOR
Q702 8-729-903-10 TRANSISTOR
Q703 8-729-402-93 TRANSISTOR
Q704 8-729-026-53 TRANSISTOR
< RESISTOR >
UN5214-TX
FMW1-T-148
UN5214-TX
2SA1576A-T106-QR
5%
1%
5%
5%
1/10W
1/10W
1/4W
1/10W
1/10W
Ref. No.
Part No.
Description
R105 1-216-863-11 RES-CHIP
R106 1-216-845-11 METAL CHIP
R107 1-216-819-11 METAL CHIP
R108 1-216-825-11 METAL CHIP
R109 1-216-829-11 METAL CHIP
R110 1-216-853-11 METAL CHIP
R111 1-216-833-11 METAL CHIP
R112 1-216-845-11 METAL CHIP
R113 1-216-833-11 METAL CHIP
R114 1-216-829-11 METAL CHIP
R115 1-216-833-11 METAL CHIP
R116 1-216-827-11 METAL CHIP
R117 1-216-845-11 METAL CHIP
R118 1-216-825-11 METAL CHIP
R119 1-216-837-11 METAL CHIP
R120 1-216-839-11 METAL CHIP
R121 1-216-825-11 METAL CHIP
R122 1-216-833-11 METAL CHIP
R178 1-216-864-11 METAL CHIP
R201 1-216-815-11 METAL CHIP
R202 1-216-819-11 METAL CHIP
R203 1-216-809-11 METAL CHIP
R205 1-216-833-11 METAL CHIP
R206 1-216-833-11 METAL CHIP
R207 1-216-811-11 METAL CHIP
R208 1-216-821-11 METAL CHIP
R209 1-216-815-11 METAL CHIP
R210 1-216-839-11 METAL CHIP
R211 1-216-857-11 METAL CHIP
R212 1-216-851-11 METAL CHIP
R214 1-216-845-11 METAL CHIP
R216 1-216-864-11 METAL CHIP
R217 1-216-833-11 METAL CHIP
R218 1-216-864-11 METAL CHIP
R219 1-216-809-11 METAL CHIP
R224 1-216-809-11 METAL CHIP
R225 1-216-809-11 METAL CHIP
R226 1-216-809-11 METAL CHIP
R227 1-216-809-11 METAL CHIP
R228 1-216-809-11 METAL CHIP
R281 1-216-821-11 METAL CHIP
R298 1-216-864-11 METAL CHIP
R299 1-216-864-11 METAL CHIP
R301 1-216-833-11 METAL CHIP
R302 1-216-833-11 METAL CHIP
R303 1-216-833-11 METAL CHIP
R405 1-216-864-11 METAL CHIP
R501 1-216-295-00 SHORT
R551 1-216-841-11 METAL CHIP
R552 1-216-841-11 METAL CHIP
R553 1-216-841-11 METAL CHIP
R701 1-216-821-11 METAL CHIP
R702 1-216-821-11 METAL CHIP
R703 1-216-821-11 METAL CHIP
R704 1-216-841-11 METAL CHIP
R705 1-216-833-11 METAL CHIP
R706 1-218-855-11 METAL CHIP
0
10K
0
100
100
330
33K
1M
330K
100K
100
10K
10K
150
1K
2.2K
10K
0
330
680
10K
100K
10K
4.7K
10K
3.3K
100K
2.2K
22K
33K
3.3M
100K
680
2.2K
4.7K
470K
1K
1K
1K
47K
10K
0
0
47K
47K
47K
2.2K
0
0
10K
10K
10K
100
100
100
100
1K
MDS-NT1
BD
Remark
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
0.5% 1/10W
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
65
MDS-NT1
BD MAIN
Ref. No.
Part No.
Description
R707 1-218-863-11 METAL CHIP
R708 1-218-863-11 METAL CHIP
R709 1-218-855-11 METAL CHIP
R710 1-218-887-11 METAL CHIP
R711
R712
R713
R808
1-216-833-11 METAL CHIP
1-216-809-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-864-11 METAL CHIP
< SWITCH >
< VIBRATOR >
4.7K
4.7K
2.2K
47K
10K
100
10K
0
5%
5%
5%
5%
Remark Ref. No.
Part No.
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
C321
Description
1-801-862-11 VARISTOR, CHIP
C401 1-164-156-11 CERAMIC CHIP 0.1uF
C402 1-164-156-11 CERAMIC CHIP 0.1uF
C404 1-164-156-11 CERAMIC CHIP 0.1uF
C406 1-164-156-11 CERAMIC CHIP 0.1uF
1/10W
1/10W
1/10W
1/10W
C407 1-128-547-11 ELECT
C410 1-119-879-11 ELECT
C412 1-119-765-11 ELECT
6800uF
C408 1-164-156-11 CERAMIC CHIP 0.1uF
C409 1-164-156-11 CERAMIC CHIP 0.1uF
15uF
47uF
20%
Remark
25V
25V
25V
25V
16V
25V
25V
16V
20% 6.3V
S101 1-762-596-21 SWITCH, PUSH (1 KEY) (LIMIT IN)
S103 1-771-956-21 SWITCH, PUSH (1 KEY) (OUT)
S104 1-771-955-21 SWITCH, PUSH (1 KEY) (PLAY)
S105 1-771-955-21 SWITCH, PUSH (1 KEY) (REC)
C413 1-126-926-11 ELECT 1000uF
C414 1-164-156-11 CERAMIC CHIP 0.1uF
C415 1-164-156-11 CERAMIC CHIP 0.1uF
C416 1-126-934-11 ELECT 220uF
C420 1-165-112-11 CERAMIC CHIP 0.33uF
20% 10V
25V
25V
20% 10V
16V
X801 1-781-569-21 OSCILLATOR, CRYSTAL (90MHz)
************************************************************
A-4727-706-A MAIN BOARD, COMPLETE (AEP, UK)
A-4727-708-A MAIN BOARD, COMPLETE (SP)
**********************
< CAPACITOR/VARISTOR/RESISTOR >
C1 1-164-156-11 CERAMIC CHIP 0.1uF
C100 1-115-156-11 CERAMIC CHIP 1uF
C101 1-115-156-11 CERAMIC CHIP 1uF
C161 1-164-230-11 CERAMIC CHIP 220PF
C165 1-162-927-11 CERAMIC CHIP 100PF
5%
5%
25V
10V
10V
50V
50V
C421
C432 1-164-156-11 CERAMIC CHIP 0.1uF
C441 1-164-156-11 CERAMIC CHIP 0.1uF
C442
C450
1-164-156-11 CERAMIC CHIP
1-164-156-11 CERAMIC CHIP
1-126-934-11 ELECT
0.1uF
0.1uF
220uF
C451 1-164-156-11 CERAMIC CHIP 0.1uF
C452 1-164-156-11 CERAMIC CHIP 0.1uF
C453 1-164-156-11 CERAMIC CHIP 0.1uF
C456 1-126-934-11 ELECT
C458 1-126-934-11 ELECT
220uF
220uF
20%
20%
20%
25V
25V
25V
25V
10V
25V
25V
25V
10V
10V
C166
C176 1-128-551-11 ELECT
C177 1-164-230-11 CERAMIC CHIP 220PF
C180
C181
C182
1-162-927-11 CERAMIC CHIP
1-126-960-11 ELECT
1-126-934-11 ELECT
1-164-230-11 CERAMIC CHIP
100PF
22uF
1uF
220uF
220PF
C261 1-164-230-11 CERAMIC CHIP 220PF
C265 1-162-927-11 CERAMIC CHIP 100PF
C266 1-162-927-11 CERAMIC CHIP 100PF
C276 1-128-551-11 ELECT 22uF
5%
5%
5%
5%
50V
20% 25V
5% 50V
20% 50V
20% 10V
50V
50V
50V
5% 50V
20% 25V
C459 1-115-156-11 CERAMIC CHIP 1uF
C460 1-126-947-11 ELECT 47uF
C461 1-164-156-11 CERAMIC CHIP 0.1uF
C462 1-164-156-11 CERAMIC CHIP 0.1uF
C507 1-164-156-11 CERAMIC CHIP 0.1uF
10V
20% 10V
25V
25V
25V
C515 1-162-927-11 CERAMIC CHIP 100PF
C516 1-162-927-11 CERAMIC CHIP 100PF
C517 1-162-927-11 CERAMIC CHIP 100PF
5%
5%
5%
50V
50V
50V
C519 1-162-964-11 CERAMIC CHIP 0.001uF
10% 50V
C523 1-104-665-11 ELECT 100uF 20% 10V
C277 1-164-230-11 CERAMIC CHIP 220PF
C280 1-126-960-11 ELECT
C281 1-126-934-11 ELECT
C282 1-164-230-11 CERAMIC CHIP 220PF
C301 1-126-791-11 ELECT
1uF
220uF
10uF
C304 1-162-927-11 CERAMIC CHIP 100PF
C306 1-164-230-11 CERAMIC CHIP 220PF
C307 1-164-230-11 CERAMIC CHIP 220PF
5% 50V
20% 50V
20% 10V
5% 50V
20% 16V
5%
5%
5%
50V
50V
50V
C308 1-162-964-11 CERAMIC CHIP 0.001uF
10% 50V
C309 1-164-156-11 CERAMIC CHIP 0.1uF
25V
C524 1-164-156-11 CERAMIC CHIP 0.1uF
C550 1-104-665-11 ELECT 100uF
C551 1-164-156-11 CERAMIC CHIP 0.1uF
C554 1-216-864-11 METAL CHIP 0
C555 1-164-156-11 CERAMIC CHIP 0.1uF
C556 1-164-156-11 CERAMIC CHIP 0.1uF
C851 1-216-864-11 METAL CHIP
C852 1-216-864-11 METAL CHIP
0
0
C854 1-216-864-11 METAL CHIP 0
C856 1-164-156-11 CERAMIC CHIP 0.1uF
25V
20% 10V
25V
5% 1/10W
25V
5%
5%
5%
25V
1/10W
1/10W
1/10W
25V
5%
C310
C313
C314
C315
1-162-964-11 CERAMIC CHIP
1-162-964-11 CERAMIC CHIP
1-162-964-11 CERAMIC CHIP
1-162-964-11 CERAMIC CHIP
0.001uF
C311 1-162-964-11 CERAMIC CHIP 0.001uF
10% 50V
C312 1-162-964-11 CERAMIC CHIP 0.001uF
10% 50V
0.001uF
0.001uF
0.001uF
C316 1-164-156-11 CERAMIC CHIP 0.1uF
C318 1-164-156-11 CERAMIC CHIP 0.1uF
C319 1-164-156-11 CERAMIC CHIP 0.1uF
C320 1-164-156-11 CERAMIC CHIP 0.1uF
10%
10%
10%
10%
50V
50V
50V
50V
25V
25V
25V
25V
C900 1-162-919-11 CERAMIC CHIP 22PF
C903 1-164-156-11 CERAMIC CHIP 0.1uF
C904 1-164-156-11 CERAMIC CHIP 0.1uF
C905 1-164-156-11 CERAMIC CHIP 0.1uF
C906 1-164-156-11 CERAMIC CHIP 0.1uF
C907 1-164-156-11 CERAMIC CHIP 0.1uF
C910 1-164-156-11 CERAMIC CHIP 0.1uF
C911 1-164-156-11 CERAMIC CHIP 0.1uF
C912 1-164-156-11 CERAMIC CHIP 0.1uF
C913 1-164-156-11 CERAMIC CHIP 0.1uF
C915 1-164-156-11 CERAMIC CHIP 0.1uF
C916 1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
25V
25V
25V
50V
25V
25V
25V
25V
25V
25V
66
MDS-NT1
Ref. No.
Part No.
Description
C917 1-164-156-11 CERAMIC CHIP 0.1uF
C918 1-162-919-11 CERAMIC CHIP 22PF
C920 1-216-864-11 METAL CHIP 0
C922 1-164-156-11 CERAMIC CHIP 0.1uF
< CONNECTOR/JACK >
5%
5%
Remark
25V
50V
1/10W
25V
CN4 1-815-194-11 CONNECTOR, USB (B) (USB)
CN101 1-784-384-11 CONNECTOR, FFC/FPC 27P
CN102 1-793-991-11 CONNECTOR, FFC/FPC 23P
CN103 1-784-373-21 CONNECTOR, FFC/FPC 14P
CN104 1-784-366-21 CONNECTOR, FFC/FPC 7P
CN105 1-784-367-11 CONNECTOR, FFC/FPC 8P
CN200 1-573-798-11 JACK, MINIATURE (DIA. 3.5) (ANALOG OUT)
* CN420 1-565-513-11 PIN, CONNECTOR 2P
< DIODE >
D301 8-719-941-09 DIODE DAP202UT106
D400 8-719-313-73 DIODE SFPB-52V
D402 8-719-313-73 DIODE SFPB-52V
D421 8-719-988-61 DIODE 1SS355TE-17
D422 8-719-074-34 DIODE RB495D-T146
D470 8-719-421-18 DIODE MA8033-L-TX
D901 8-719-988-61 DIODE 1SS355TE-17
< GROUND TERMINAL >
EP550 1-537-771-21 TERMINAL BOARD, GROUND
< RESISTOR >
FB1
FB2
FB3
FB4
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
0
0
0
0
< IC >
IC301 6-801-147-01 IC M30833FJGP-01
IC400 8-759-485-63 IC MAX1626ESA-TE2
IC401 8-759-712-90 IC XC61FN3012MR
IC402 8-759-460-72 IC BA033FP-E2
IC420 8-759-565-74 IC M62016FP-E1
IC451 8-759-712-91 IC XC6351A120MR
IC501 8-759-358-47 IC NJM2115V (TE2)
IC503 8-759-713-72 IC BH3541F-E2
IC505 6-701-565-01 IC CXD9627A-E2
IC550 8-759-591-61 IC TC7WHU04FU (TE12R)
IC901 8-752-415-60 IC CXD1873R
5%
5%
5%
5%
J180
J400
L178
L180
L278
1/10W
1/10W
1/10W
1/10W
< JACK >
1-507-678-51 JACK (PHONES)
1-691-452-11 JACK, DC (POLARITY UNIFIET TYPE)
(DC IN 9V)
< COIL/RESISTOR/CAPACITOR >
1-414-760-21 FERRITE
1-414-760-21 FERRITE
1-414-760-21 FERRITE
0uH
0uH
0uH
MAIN
Remark Ref. No.
Part No.
L280
L400
L451
Description
1-414-760-21 FERRITE
1-424-674-11 INDUCTOR
1-216-864-11 METAL CHIP
L452 1-216-864-11 METAL CHIP
L503 1-414-760-21 FERRITE
L504 1-216-864-11 METAL CHIP
L550 1-414-760-21 FERRITE
0uH
22uH
0
0
0uH
0
0uH
L551 1-164-156-11 CERAMIC CHIP 0.1uF
L552 1-414-760-21 FERRITE 0uH
< COIL >
5%
5%
5%
1/10W
1/10W
1/10W
25V
LF1 1-419-100-21 INDUCTOR 0uH
< TRANSISTOR >
Q100 8-729-015-74 TRANSISTOR
Q170 8-729-046-97 TRANSISTOR
Q270 8-729-046-97 TRANSISTOR
Q400 8-729-036-99 TRANSISTOR
Q401 8-729-026-53 TRANSISTOR
UN5111-TX
2SD1938 (F) -T (TX).SO
2SD1938 (F) -T (TX).SO
HAT1020R-EL
2SA1576A-T106-QR
Q440 8-729-015-76 TRANSISTOR
Q451 8-729-015-76 TRANSISTOR
UN5211-TX
UN5211-TX
< RESISTOR/FERRITE BEAD >
R10 1-216-864-11 METAL CHIP
R140 1-216-864-11 METAL CHIP
R142 1-216-864-11 METAL CHIP
R161 1-216-833-11 METAL CHIP
R162 1-216-833-11 METAL CHIP
R163 1-216-833-11 METAL CHIP
R164 1-216-833-11 METAL CHIP
R165 1-218-716-11 METAL CHIP
R166 1-218-716-11 METAL CHIP
R170 1-216-833-11 METAL CHIP
R176 1-216-819-11 METAL CHIP
R178 1-216-815-11 METAL CHIP
R180 1-216-789-11 METAL CHIP
R181 1-216-821-11 METAL CHIP
R240 1-216-864-11 METAL CHIP
R242 1-216-864-11 METAL CHIP
R261 1-216-833-11 METAL CHIP
R262 1-216-833-11 METAL CHIP
R263 1-216-833-11 METAL CHIP
R264 1-216-833-11 METAL CHIP
R265 1-218-716-11 METAL CHIP
R266 1-218-716-11 METAL CHIP
R270 1-216-833-11 METAL CHIP
R276 1-216-819-11 METAL CHIP
R278 1-216-815-11 METAL CHIP
R280 1-216-789-11 METAL CHIP
R281 1-216-821-11 METAL CHIP
R301 1-216-845-11 METAL CHIP
R302 1-216-864-11 METAL CHIP
R303 1-216-864-11 METAL CHIP
R304 1-216-864-11 METAL CHIP
R306 1-216-864-11 METAL CHIP
R307 1-216-833-11 METAL CHIP
R308 1-216-833-11 METAL CHIP
0
10K
10K
10K
10K
680
330
2.2
1K
0
10K
10K
10K
10K
10K
0
0
0
10K
10K
10K
10K
10K
680
330
2.2
1K
100K
0
0
0
0
10K
10K
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
5%
5%
1/10W
1/10W
0.5% 1/10W
0.5% 1/10W
5% 1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
5%
5%
5%
5%
5%
5%
5%
5%
5%
0.5% 1/10W
0.5% 1/10W
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
67
MDS-NT1
MAIN PANEL
Ref. No.
Part No.
Description
R314 1-216-833-11 METAL CHIP
R320
R321
R323
R330
R332
R403
R404
R442
R443
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
R324 1-216-833-11 METAL CHIP
R325 1-216-833-11 METAL CHIP
R329 1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
R350 1-216-833-11 METAL CHIP
R351 1-216-833-11 METAL CHIP
R401 1-240-037-11 METAL
1-218-708-11 METAL CHIP
1-218-716-11 METAL CHIP
R420 1-216-864-11 METAL CHIP
R421 1-216-813-11 METAL CHIP
R441 1-216-837-11 METAL CHIP
1-216-835-11 METAL CHIP
1-216-841-11 METAL CHIP
R450 1-216-845-11 METAL CHIP
R455 1-216-833-11 METAL CHIP
10K
10K
10K
10K
10K
10K
10K
10K
10K
10K
10K
0.05
4.7K
10K
0
220
R456 1-216-829-11 METAL CHIP
R470 1-216-825-11 METAL CHIP
R471 1-216-825-11 METAL CHIP
R500 1-216-813-11 METAL CHIP
R501 1-216-813-11 METAL CHIP
R503 1-216-813-11 METAL CHIP
R504 1-216-809-11 METAL CHIP
R505 1-216-809-11 METAL CHIP
R506 1-216-809-11 METAL CHIP
R550 1-216-857-11 METAL CHIP
R551 1-414-760-21 FERRITE
R552 1-216-813-11 METAL CHIP
R581 1-216-813-11 METAL CHIP
R901 1-216-864-11 METAL CHIP
R902 1-216-864-11 METAL CHIP
R903 1-216-841-11 METAL CHIP
R904 1-216-837-11 METAL CHIP
R905 1-216-802-11 RES-CHIP
R906 1-216-802-11 RES-CHIP
R907 1-216-823-11 METAL CHIP
R908 1-216-833-11 METAL CHIP
R911 1-216-833-11 METAL CHIP
R913 1-216-833-11 METAL CHIP
R915 1-216-833-11 METAL CHIP
R950 1-216-864-11 METAL CHIP
R951 1-216-864-11 METAL CHIP
R952 1-216-864-11 METAL CHIP
47K
22K
27
27
1.5K
10K
10K
10K
10K
0
0
0
< COMPOSITION CIRCUIT BLOCK >
RB300 1-236-908-11 NETWORK RESISTOR (CHIP) 10K
RB301 1-236-908-11 NETWORK RESISTOR (CHIP) 10K
< VARIABLE RESISTOR >
RV301 1-227-450-11 RES, VAR 10K/10K (PHONE LEVEL)
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
0uH
220
220
0
0
220
100
100
100
1M
22K
15K
47K
100K
10K
4.7K
2.2K
2.2K
220
220
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
5%
Remark Ref. No.
Part No.
1/10W
5%
5%
5%
5%
5%
1% 1/4W
0.5% 1/10W
0.5% 1/10W
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
T400
Description
< FILTER >
1-411-312-11 FILTER, COMMON MODE
< THERMISTOR (POSITIVE) >
THP400 1-771-075-21 THERMISTOR, POSITIVE
< VIBRATOR >
X301 1-795-004-21 VIBRATOR, CERAMIC (10MHz)
X550 1-567-865-21 VIBRATOR, CRYSTAL (12MHz)
Remark
**************************************************************
A-4727-707-A PANEL BOARD, COMPLETE (AEP, UK)
A-4727-709-A PANEL BOARD, COMPLETE (SP)
**********************
< CAPACITOR >
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
C748 1-164-156-11 CERAMIC CHIP 0.1uF
< CONNECTOR >
CN704 1-784-859-21 CONNECTOR, FFC (LIF (NON-ZIF)) 7P
25V
< LED >
D731 8-719-051-89 LED SML-010VT-T87 (REC)
D732 8-719-032-98 LED SEL5820A-TP15 (NetMD)
D751 8-719-984-33 LED SML-010MT-T87 (PLAY)
< TRANSISTOR >
Q731 8-729-015-76 TRANSISTOR
Q732 8-729-015-76 TRANSISTOR
Q751 8-729-015-76 TRANSISTOR
UN5211-TX
UN5211-TX
UN5211-TX
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
1/10W
R702
R726 1-216-829-11 METAL CHIP
R731 1-216-811-11 METAL CHIP
R732
R751
< RESISTOR >
1-216-825-11 METAL CHIP
1-216-811-11 METAL CHIP
1-216-811-11 METAL CHIP
2.2K
4.7K
150
150
150
< SWITCH >
S702 1-762-875-21 SWITCH, KEYBOARD (x/Z)
S726 1-762-875-21 SWITCH, KEYBOARD (N/>)
< LEAD >
1/10W
1/10W
1/10W
1/10W
TP701 1-690-880-11 LEAD (WITH CONNECTOR)
************************************************************
MISCELLANEOUS
**************
6
7
8
* 102
357
1-823-648-11 WIRE (FLAT TYPE) (7 CORE)
1-792-811-21 WIRE (FLAT TYPE) (23 CORE)
1-792-812-21 WIRE (FLAT TYPE) (27 CORE)
1-569-972-21 SOCKET, SHORT 2P
1-678-514-11 FLEXIBLE BOARD
0 358 A-4672-976-A OPTICAL PICK-UP KMS-262
HR901 1-500-670-22 HEAD, OVER WRITE
M101 A-4735-757-A MOTOR ASSY, SPINDLE
M102 A-4672-900-A MOTOR ASSY, SLED
5%
5%
5%
5%
5%
1/10W
68
The components identified by mark 0 or dotted line with mark 0 are critical for safety.
Replace only with part number specified.
Ref. No.
Part No.
Description
M103 A-4672-975-A MOTOR ASSY, LOADING
Remark
S102 1-771-957-11 SWITCH, PUSH (2 KEY)
(REFLECT RATE DETECT, PROTECT DETECT)
************************************************************
ACCESSORIES
************
0
0
1-469-089-11 FILTER, CLAMP (FERRITE CORE)
(for USB CABLE)
1-476-352-12 ADAPTOR, AC (AC-96NP) (AEP, SP)
1-476-353-12 ADAPTOR, AC (AC-96NP) (UK)
1-543-793-11 FILTER, CLAMP (FERRITE CORE)
(for AC ADAPTOR)
1-757-409-11 CORD, CONNECTION
(AUDIO CONNECTING CORD)
1-757-471-11 CABLE, CONNECTION (USB)
4-237-878-11 MANUAL, INSTRUCTION
(ENGLISH, FRENCH) (UK)
4-237-878-21 MANUAL, INSTRUCTION
(ENGLISH, FRENCH, GERMAN, SPANISH,
DUTCH, ITALIAN, SWEDISH, POLISH,
TRADITIONAL CHINESE) (AEP, SP)
4-237-878-31 MANUAL, INSTRUCTION (DANISH, FINNISH)
(AEP)
4-237-880-11 CD-ROM (Open MG Jukebox)
4-237-881-11 MANUAL, INSTRUCTION (ENGLISH) (AEP)
4-237-881-21 MANUAL, INSTRUCTION
(CZECK, HUNGALIAN) (AEP)
4-237-881-31 MANUAL, INSTRUCTION (TRUKISH) (AEP)
4-237-881-41 MANUAL, INSTRUCTION (SLOVAKIAN) (AEP)
Ref. No.
Part No.
Description
The components identified by mark 0 or dotted line with mark 0 are critical for safety.
Replace only with part number specified.
MDS-NT1
Remark
69
MDS-NT1
REVISION HISTORY
Clicking the version allows you to jump to the revised page.
Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page.
Ver.
Date
2002.02
New
Description of Revision
advertisement
* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project
Questions & Answers
K K C
How do I fix error 12?
Related manuals
advertisement
Table of contents
- 1 COVER
- 2 SELF-DIAGNOSIS FUNCTION
- 5 TABLE OF CONTENTS
- 7 SERVICING NOTES
- 12 GENERAL
- 13 DISASSEMBLY
- 13 DISASSEMBLY FLOW
- 14 CASE (UPPER)
- 15 MAIN BOARD
- 15 MD MECHANISM DECK (MDM-7S2B)
- 16 FRONT PANEL SECTION
- 16 BD BOARD, OVER WRITE HEAD (HR901)
- 17 HOLDER ASSY
- 17 LOADING MOTOR ASSY (M103)
- 18 SLED MOTOR ASSY (M102)
- 18 OPTICAL PICK-UP (KMS-262E)
- 19 SPINDLE MOTOR ASSY (M101)
- 20 TEST MODE
- 24 ELECTRICAL ADJUSTMENTS
- 36 DIAGRAMS
- 36 BLOCK DIAGRAM – SERVO Section –
- 37 BLOCK DIAGRAM – MAIN Section –
- 38 NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
- 38 Waveforms
- 39 PRINTED WIRING BOARD – BD Board –
- 40 SCHEMATIC DIAGRAM – BD Board (1/2) –
- 41 SCHEMATIC DIAGRAM – BD Board (2/2) –
- 42 PRINTED WIRING BOARD – MAIN Board (Component Side) –
- 43 PRINTED WIRING BOARD – MAIN Board (Conductor Side) –
- 44 SCHEMATIC DIAGRAM – MAIN Board (1/2) –
- 45 SCHEMATIC DIAGRAM – MAIN Board (2/2) –
- 46 PRINTED WIRING BOARD – PANEL Board –
- 47 SCHEMATIC DIAGRAM – PANEL Board –
- 48 IC Block Diagrams
- 51 IC PIN FUNCTION DESCRIPTION
- 59 EXPLODED VIEWS
- 59 CASE SECTION
- 60 FRONT PANEL SECTION
- 61 CASE (B) SECTION
- 62 MD MECHANISM DECK SECTION-1 (MDM-7S2B)
- 63 MD MECHANISM DECK SECTION-2 (MDM-7S2B)
- 64 ELECTRICAL PARTS LIST
- 64 BD
- 66 MAIN
- 68 PANEL
- 70 REVISION HISTORY