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Date: April, 2009 / Issue 1.0
Service Manual
GM210
Internal Use Only
Table Of Contents
1. INTRODUCTION ............................................... 5
1.1 Purpose ......................................................................5
1.2 Regulatory Information .................................................5
1.3 Abbreviations ..............................................................7
2. SYSTEM SPECIFICATION................................. 9
2.1 H/W Features ..............................................................9
2.2 Technical Specifi cation ...............................................11
3. TECHNICAL BRIEF ......................................... 16
3.1 Main Processor(Digital Part : AD6725, U102) ..............16
3.2 Main Processor (Analog Part : AD6725, U102) ............19
3.3 RF Transceiver (AD6546) ...........................................26
3.4 Power Amplifi er Module (SKY77523) ..........................39
3.5 BT Module with integrated FM tuner ...........................30
3.6 MEMORY(PF38F5060M0Y0BE, U100 ) .......................32
3.7 Multi-Media Processor (AIT817, U602) .......................35
3.8 SIM Card Interface .....................................................38
3.9 Micro-SD Card Interface ............................................39
3.10 LCD Interface ..........................................................40
3.11 Battery Charger Interface .........................................43
3.12 Keypad Interface .....................................................44
3.13 Audio Interface ........................................................46
3.14 Camera Interface(2M Fixed Focus Camera) ...............53
3.15 KEY BACLKLIGHT LED Interface ................................55
3.16 Vibrator Interface .....................................................57
4. TROUBLE SHOOTING ..................................... 58
4.1 RF Component ..........................................................58
4.2 RX Trouble ................................................................59
4.3 TX Trouble .................................................................64
4.4 Power On Trouble ......................................................68
4.5 Charging Trouble .......................................................71
4.6 Vibrator Trouble .........................................................73
4.7 LCD Trouble ..............................................................75
4.8 Camera Trouble .........................................................79
4.9 Speaker Trouble ........................................................83
4.10 Earphone Trouble .....................................................85
4.11 Receiver Trouble ......................................................89
4.12 Microphone Trouble .................................................91
4.13 SIM Card Interface Trouble .......................................93
4.14 KEY backlight Trouble ..............................................95
4.15 RTC Trouble ............................................................97
4.16 Folder on/off Trouble ................................................99
4.17 Micro SD Trouble ...................................................101
4.18 FM radio Trouble ...................................................103
5. DOWNLOAD ................................................. 105
5.1 Download................................................................105
6. BLOCK DIAGRAM ........................................ 111
7. CIRCUIT DIAGRAM ...................................... 113
8. BGA Pin Map .............................................. 121
9. PCB LAYOUT ............................................... 125
10. Confi guration of HOT KIMCHI ................. 131
10.1 BB Test [MENU 1] ..................................................132
10.2 RF Test [MENU 2] ..................................................134
10.3 MF mode [MENU 3] ...............................................134
10.4 Trace option [MENU 4] ...........................................135
10.5 Call timer [MENU 5] ...............................................135
10.6 Fact. Reset [MENU 6] .............................................135
10.7 S/W version ..........................................................135
11. STAND ALONE TEST.................................. 136
11.1 Introduction ...........................................................136
11.2 Setting Method ......................................................136
11.3 Means of Test ........................................................137
12. RF Calibration .......................................... 139
12.1 Overview ...............................................................139
12.2 Procedure .............................................................139
12.3 AGC ......................................................................140
12.4 APC ......................................................................140
12.5 ADC ......................................................................140
13. EXPLODED VIEW & REPLACEMENT
PART LIST ................................................ 141
13.1 EXPLODED VIEW ...................................................141
13.2 Replacement Parts ................................................143
13.3 Accessory .............................................................166
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1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
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1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.
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1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
IF
LCD
LDO
LED
OPLL
APC
BB
BER
CC-CV
DAC
DCS
FPCB
GMSK
GPIB
GSM dBm
DSP
EEPROM
ESD
IPUI
Automatic Power Control
Baseband
Bit Error Ratio
Constant Current – Constant Voltage
Digital to Analog Converter
Digital Communication System dB relative to 1 milli watt
Digital Signal Processing
Electrical Erasable Programmable Read-Only Memory
Electrostatic Discharge
Flexible Printed Circuit Board
Gaussian Minimum Shift Keying
General Purpose Interface Bus
Global System for Mobile Communications
International Portable User Identity
Intermediate Frequency
Liquid Crystal Display
Low Drop Output
Light Emitting Diode
Offset Phase Locked Loop
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1. INTRODUCTION
PSTN
RF
RLR
RMS
RTC
SAW
SIM
SLR
PAM
PCB
PGA
PLL
SRAM
PSRAM
STMR
TA
TDD
TDMA
UART
VCO
VCTCXO
WAP
Power Amplifier Module
Printed Circuit Board
Programmable Gain Amplifier
Phase Locked Loop
Public Switched Telephone Network
Radio Frequency
Receiving Loudness Rating
Root Mean Square
Real Time Clock
Surface Acoustic Wave
Subscriber Identity Module
Sending Loudness Rating
Static Random Access Memory
Pseudo SRAM
Side Tone Masking Rating
Travel Adapter
Time Division Duplex
Time Division Multiple Access
Universal Asynchronous Receiver/Transmitter
Voltage Controlled Oscillator
Voltage Control Temperature Compensated Crystal Oscillator
Wireless Application Protocol
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2. SYSTEM SPECIFICATION
2. SYSTEM SPECIFICATION
2.1 H/W Features
Item
Standard Battery
Feature
Li-ion Polymer, 3.7V 800mAh
Comment
Stand by TIME
Talk time
Stand by time
Charging time
RX Sensitivity
TX output power
GPRS compatibility
EDGE compatibility
SIM card type
Display
KEYPAD
ANT
EAR Phone Jack
PC Synchronization
Speech coding
Data and Fax
Vibrator
Loud Speaker
Voice Recoding
Microphone
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Up to 200 hrs : Paging Period 5, RSSI 85dBm
Up to 200min : GSM Tx Level 7
Up to 200 hours (Paging Period: 5, RSSI: -85 dBm)
Approx. 3 hours
GSM, EGSM: -109dBm, DCS: -109dBm
GSM, EGSM: 32.3dBm(Level 5),
DCS , PCS: 29.5dBm(Level 0)
Class 12
Class 12
3V/1.8V Small
TFT 240 × 320 pixel 65K Color
0 ~ 9, #, *, Up/Down/Left/Right Navigation Key
Music Key, Clear Key, OK Key, PWR Key
Send Key, Soft Key(Left/Right)
Volume Key(Up/Down), Camera Key, Hold Key
Internal(GSM, Bluetooth)
Yes
Yes
Yes
Yes
Yes
EFR/FR/HR/AMR
Yes
Yes
3.5
Ø only
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2. SYSTEM SPECIFICATION
Item
Speaker/Receiver
Travel Adapter
MIDI
Camera
Bluetooth / FM Radio
Feature
Oval Type(1812), Speaker & Receiver Dual Mode
Yes
SW MIDI (Mono SPK)
2M
Bluetooth version 2.1 / 76~108MHz supported
Comment
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2. SYSTEM SPECIFICATION
2.2 Technical Specification
Item Description Specification
GSM850
TX: 824 + n ´ 0.2 MHz (n=1 ~ 124)
RX: TX + 45 MHz
2
3
1 Frequency Band
GSM900
TX: 890 + n ´ 0.2 MHz (n=1 ~ 124)
890 + (n-1024) ´ 0.2 MHz (n=975 ~ 1023)
RX: TX + 45 MHz
DCS1800
TX: 1710 + ( n-511 ) ´ 0.2 MHz (n = 512 ~ 885)
RX: TX + 95 MHz
4
Phase Error
Frequency Error
Power Level
PCS1900
TX: 1850 + ( n-511 ) ´ 0.2 MHz
RX: 1930 + ( n-511 ) ´ 0.2 MHz (n = 512 ~ 810)
RMS < 5 degrees
Peak < 20 degrees
< 0.1ppm
GSM850/GSM900
Level
5
6
9
10
7
8
11
Power Toler.
33 dBm ±2dB
31 dBm ±3dB
29 dBm ±3dB
27 dBm ±3dB
25 dBm ±3dB
23 dBm ±3dB
21 dBm ±3dB
12 19 dBm ±3dB
DCS1800/PCS1900
Level
13
14
15
16
17
18
19
Level
0
1
4
5
2
3
6
7
Power Toler.
30 dBm ±2dB
28 dBm ±3dB
26 dBm ±3dB
24 dBm ±3dB
22 dBm ±3dB
20 dBm ±3dB
18 dBm ±3dB
16 dBm ±3dB
Level
8
9
10
11
12
13
14
15
Power Toler.
17 dBm ±3dB
15 dBm ±3dB
13 dBm ±3dB
11 dBm ±5dB
9 dBm ±5dB
7 dBm ±5dB
5 dBm ±5dB
Power Toler.
14 dBm ±3dB
12 dBm ±4dB
10 dBm ±4dB
8 dBm ±4dB
6 dBm ±4dB
4 dBm ±4dB
2 dBm ±5dB
0 dBm ±5dB
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2. SYSTEM SPECIFICATION
Item
6
Output RF Spectrum
(due to switching transient)
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Description
5
Output RF Spectrum
(due to modulation)
Specification
GSM, EGSM
Offset from Carrier (kHz).
100
200
250
400
600~ <1,200
1,200~ <1,800
1,800~ <3,000
3,000~ <6,000
6,000
DCS/PCS
Offset from Carrier (kHz).
100
200
250
400
600~ <1,200
1,200~ <1,800
1,800~ <3,000
3,000~ <6,000
6,000
GSM, EGSM
Max. dBc
+0.5
-30
-33
-60
-60
-60
-63
-65
-71
Max. dBc
+0.5
-30
-33
-60
-60
-60
-65
-65
-73
Offset from Carrier (kHz).
400
600
1,200
1,800
Max. dBm
-19
-21
-21
-24
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2. SYSTEM SPECIFICATION
Item
6
Output RF Spectrum
(due to switching transient)
7 Spurious Emissions
8 Bit Error Ratio
12 RLR
Description
9
10
RX Level Report Accuracy
SLR
11 Sending Response
Specification
DCS/PCS
Offset from Carrier (kHz).
400
600
1,200
1,800
Conduction, Emission Status
Max. dBm
-22
-24
-24
-27
GSM, EGSM
BER (Class II) < 2.439% @-104 dBm
DCS, PCS
BER (Class II) < 2.439% @-104 dBm
± 3 dB
8 ± 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100
200
300
1,000
-12
0
0
0
-
-
-12
-6
2,000 4 -6
3,000
3,400
4,000
4
4
0
-6
-9
-
2 ± 3 dB
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2. SYSTEM SPECIFICATION
Item Description
13 Receiving Response
14
15
STMR
Stability Margin
16 Distortion
17
18
19
Side Tone Distortion
System frequency
(13 MHz) tolerance
32.768KHz tolerance
20 Ringer Volume
LGE Internal Use Only
Specification
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300
500
2
*
-7
-5
1,000 0 -5
3,000
3,400
4,000
2
2
2
-5
-10
* Mean that Adopt a straight line in between 300 Hz and 1,000 Hz to be Max. level in the range.
13 ± 5 dB
> 6 dB dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30
-20
22.5
30.7
-10 33.3
0 33.7
7
10
31.7
25.5
Three stage distortion < 10%
≤ 2.5 ppm
≤ 30 ppm
At least 65 dBspl under below conditions:
1. Ringer set as ringer.
2. Test distance set as 50 cm
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2. SYSTEM SPECIFICATION
Item
21
22
23
24
25
26
27
28
LGE Internal Use Only
Description
Charge Current
Antenna Display
Battery Indicator
Low Voltage Warning
( Blinking Bar)
Forced shut down
Voltage
Sustain RTC without battery
Battery Type
Travel Charger
Specification
Fast Charge : Typ. 390 mA
Slow Charge : Typ. 80mA
Total Charging Time : < 3 hours
Bar Number Power
7
7 -> 5
5 -> 4
4 -> 2
2 -> 1
-93 ~
-93 ± 2
-98 ± 2
-101 ± 2
-104 ± 2
-106 ± 2 1 -> 0
0 -> OFF
~ -106
Battery Bar Number Voltage
3
≥ 3.75
± 0.05 V
3 -> 2 3.75 ± 0.05 V
2 -> 1 3.64 ± 0.05 V
1 -> 0 3.54 ± 0.05 V
≤ 3.54 ± 0.05V (Call), 1/1-minute(Receiver)
≤ 3.4 ± 0.05V (Standby), 1/3-minute(Speaker)
3.33 ± 0.05V
Over 50 hours
Li-Polymer Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 800mAh
Switching-mode charger
Input: 100 ~ 350V, 50/60 Hz
Output: 5.6 V, 400 mA
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 Main Processor(Digital Part : AD6725, U102)
Figure. 3-1-1 AD6725 FUNCTIONAL BLOCK DIAGRAM
The AD6725 is a tightly integrated single-package baseband processing solution offered by Analog Devices as part of the AD20msp520 SoftFone® chipset family. The AD6725 incorporates all digital, analog, and power management functions required in GSM, GPRS, EGPRS handsets with advanced multimedia and system power management capabilities.
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3. TECHNICAL BRIEF
3.1.1 Features of AD6725
Complete Single-Chip Programmable Baseband Processor divided into several subsystems
MCU Control Processor Subsystem:
▪ 32-bit ARM926EJ-S® MCU Control Processor
▪ 208 MHz operation at 1.2V
▪ 2 dedicated caches, 16kB each, for instructions and data
▪ 4kB Instruction Tightly Coupled Memory (TCM)
▪ 2-Mbit On-chip System SRAM
▪ Ciphering coprocessor for GPRS supporting GEA1 and GEA2 encryption algorithms
▪ Kasumi cipher coprocessor for GEA3 encryption
▪ Dedicated multichannel DMA controller
DSP Subsystem:
▪ 16-bit fixed-point Blackfin® DSP Processor
▪ 208 MHz operation at 1.
▪ Memory:
→ L1 program space: 64 kB SRAM and 16 kB configurable as instruction cache or SRAM
→ L1 data space: Two banks of 16K bytes, each with 8K bytes of dedicated SRAM and an additional 8K bytes that can be configured as either cache or SRAM
→ L2 space: 64KB SRAM
▪ Ciphering coprocessor (GEA1 and GEA2)
▪ Kasumi cipher coprocessor for GEA3 encryption
▪ Dedicated multichannel DMA controller
Peripherals Subsystem:
▪ Shared on-chip peripherals and off-chip interfaces:
▪ Support for Burst-mode, Page-mode, and NAND Flash memory
▪ Support for SRAM, SDRAM, and PSRAM (cellular RAM)
▪ Full-Speed USB 2.0 Dual-Role Interface with OTG (On-The-Go) Host Mode or traditional Peripheral-only mode
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3. TECHNICAL BRIEF
▪ Serial Display Interface
▪ 8x8 Keypad Interface
▪ Thumbwheel Interface
▪ 4 Independent Programmable Backlights plus a Service Light
▪ 1.8V and 3.0V, 64 kbps SIM Interface
▪ Universal System Connector Interface
▪ Multimedia Card (MMC) Interface
▪ Secure Data (SD) Card Interface and SD I/O
▪ IrDA transceiver interfaces, including Fast IrDA (4 Mbps baud)
▪ 2 Configurable Generic Serial Ports (GSPs)
▪ 7 Configurable Enhanced Generic Serial Ports (eGSPs)
Applications Subsystem for Enhanced Multimedia:
▪ Dedicated 8/16/18-bit interface for parallel displays
▪ 8/10-bit Parallel Peripheral Interface (PPI) for camera sensor
▪ Image Signal Processing (ISP) module supporting resolutions up to 3.14 mega pixels.
▪ Flexible 2-D DMA controller
▪ Camera Flash synchronization strobe
▪ Hardware image scaling
▪ YCbCr/RGB color conversion
▪ JPEG decoder hardware Hardware
▪ JPEG compression
OTHER FEATURES
▪ Real-Time Clock (RTC) with Alarm
▪ Four General-Purpose Timers
▪ Compatible with Othello® radio subsystem
▪ Configurable interrupt controller architecture
▪ Programmable bus arbitration to optimize system performance
▪ Programmable Power Management and Clock Management
Slow Clocking Scheme for Low Idle Mode Current
Power Down modes
Dynamic Core Voltage Scaling
Active Leakage Current Management
▪ Independent I/O Voltage Domains
▪ On-chip support for EGPRS Data Services up to Class 12
▪ JTAG Interface for Test and In-Circuit Emulation of both the MCU and DSP
▪ Embedded Trace Macrocell for MCU Debug
▪ Advanced features for security Real-Time Clock (RTC) with Alarm
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3.2 Main Processor (Analog Part : AD6725, U102)
3. TECHNICAL BRIEF
AUDIO Subsystem
Radio Interface
Figure. 3-2-1 AD6725 FUNCTIONAL BLOCK DIAGRAM
The AD6725 is a complete mixed-signal baseband processor that combines all of the data converters and power supply regulators required for a GSM 900 / GSM 850 / DCS 1800 / PCS 1900 mobile on a single device, including HSCSD, GPRS and EGPRS.
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3. TECHNICAL BRIEF
3.2.1 General Description
The AD6725 baseband transmit section supports the following mobile station GMSK modulation power classes:
• GSM 900/850 power classes 4 and 5,
• DCS 1800 power classes 1 and 2, and
• PCS 1900 power classes 1 and 2.
The AD6725 baseband transmit section supports the following mobile station 8-PSK modulation power classes:
• GSM 900/850 power classes E2 and E3,
• DCS 1800 power classes E2 and E3, and
• PCS 1900 power classes E2 and E3.
The AD6725 baseband receive section supports GMSK and 8-PSK applications.
The AD6725 auxiliary section provides a voltage reference, an automatic frequency control DAC, an auxiliary
ADC, and light controllers. The auxiliary ADC provides two channels for measuring temperature using discrete external devices placed in critical locations. The AD6725 audio section provides 8 kHz and 16 kHz sampling rates for voiceband data input and output and provides nine standard sample rates ranging from 8kHz to 48 kHz for personal audio output on two PCM Audio serial ports. The two Audio serial ports allow support for concurrency. The AD6725 power management section provides voltage regulators for digital and analog components, a battery charger, battery protection circuitry, and power supply activation logic. The AD6725 digital processor interface provides serial ports for control data, baseband transmit and receive data, and two for audio data.
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3. TECHNICAL BRIEF
3.2.2 Power Block
CSPORT interface, power management control interface and the circuit that generates power up RESET pulses(RESET1P8) for use by the DBB chip.
All regulators except the USB interface regulator are powered from the main battery.
The USB regulator is powered from USB VBUS.
And the user presses KEYON which puts the AD6725 power management system into ACTIVATION state
(see definitions below) and signals DBB software that it’s time to wake up and operate using the KEYOUT signal.
Figure. 3-2-2 AD6725 POWER BLOCK DIAGRAM
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3. TECHNICAL BRIEF
Figure. 3-2-3 AD6725 KEYON/KEYOUT BLOCK DIAGRAM
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Figure. 3-2-4 AD6725 RESET GENERATION BLOCK DIAGRAM
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3. TECHNICAL BRIEF
Power On Reset Generator
The power-on reset signals (RESET1P8 and RESET2P8) are asserted based on the VCORE (if VAPPCFG = 0),
VMEM, VEXT, and VPLL regulators. RESET1P8 and RESET2P8 are low when reset is enabled and high when reset is disabled.
When the outputs of all four regulators reach their corresponding threshold voltages, reset will be disabled after a nominal reset period of 130ms.
The outputs of all four regulators must remain at or above their corresponding threshold voltages for the duration of the reset period for reset to be disabled (pulled high).
The nominal 130ms reset period is restarted whenever all four regulators reach their threshold voltages.
The nominal reset period of 130ms can be extended by connecting an external capacitor to CRST. This capacitor is charged using a small current when reset is enabled. Once the capacitor reaches the threshold, reset is disabled.
Reset will be enabled immediately if any one of the four regulators falls below their corresponding threshold voltages. In addition, reset will be enabled if VBAT falls below VRTC. The PWREN signal is the logical AND of all the state controls that enable or disable many of the regulators on the chip. If the regulators enabled by PWREN are disabled by PMT state controls described below then PWREN must go low.
When PWREN goes low reset will be immediately enabled causing RESET1P8 and RESET2P8 to be pulled low.
When reset is enabled, both RESET1P8 and RESET2P8 are actively pulled low.
CRST is also actively pulled low when reset is enabled.
VABB Regulator Enable/Disable Logic Operation
The VABB regulator powers many on-chip analog circuits on the ABB. The VCXOEN signal, the VABBEn bit in the LDOControl1 Bit Positions ( Addr 0x35) register, and the AFCDACMode and AFCDACOn bits in the
AuxControl1 Bit Positions ( Addr 0x13) register all particpate in controlling the VABB enable/disable.
When the ABB power management system transitions from Off state, DDLO state, UVLO state, or Thermal
Shutdown State to Power Key Activation, Charger Activation, USB Charger Activation, or Active State VABB will be enabled. During these state transitions ABBEn = 0 and AFCDACMode = 0, VRF is enabled.
Once the ABB power management system is in Power Key Activation, Charger Activation, USB Charger
Activation, Active-Standby or Active State the VABB regulator enable/disable is controlled by the information written to the VABBEn and AFCDACMode register bits by system software.
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3. TECHNICAL BRIEF
Digital Baseband Core (VCORE)
The Digital Baseband Core regulator supplies the digital baseband processor (DBB) core.
The voltage on VCORE is selectable using the VCOREControl register.
The VCOREActive code selects the voltage on VCORE in high power mode and the VCOREStandby code selects the voltage on VCORE in low-power mode.
DBB Interface (VINT)
The DBB interface regulator supplies the DBB/ABB digital interfaces. The output voltage of the VINT regulator is nominal 1.8V.
Memory (VMEM)
The VMEM regulator supplies the external memory(s) and the interface to the external memory on the digital baseband processor. The output voltage of the Memory Interface regulator can be selected as 1.8V nominal or 2.8V nominal using the VMEMSEL terminal.
External Interface (VEXT)
The External Interface regulator supplies the Radio digital interface and the high voltage (>1.8V) interface between the digital baseband processor and various peripherals, such as the LED indicators and the LCD display.
SIM Interface (VSIM)
AD6725 is designed to support 3.0 V and 1.8 V SIMs exclusively (i.e. no 5 V SIMs).
The SIM Interface regulator supplies the SIM interface circuitry on the digital processor and the SIM card. By default the SIM Interface regulator output is 2.85 V, which can be decreased to 1.8 V if a 1.8 V SIM is detected.
Real-Time Clock (VRTC)
The Real-Time Clock regulator supplies the Real-Time Clock module. The Real-Time Clock regulator is optimized for low ground current.
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3. TECHNICAL BRIEF
Baseband Analog (VABB)
The Baseband Analog regulator supplies the analog portions of the AD6725. Operation of the VABB regulator is controlled by the VABBEn bit in the LDOControl1 register.
If VABBEn = 0, the VABB regultor will be disabled unless the AFCDAC is enabled or VCXOEN = 1. If VABBEn
= 1 (the default state) VABB is enabled along with VCORE, VMEM, and VEXT. The Baseband Analog regulator is optimized for high ripple rejection and low noise. The output of the Baseband Analog regulator should not be used as a supply for any external components.
Microphone (VMIC)
The Microphone regulator supplies the microphone interface circuitry. The Microphone regulator is optimized for extremely high ripple rejection up to 217 Hz and low noise.
VRF (VRF)
The VCXO regulator supplies the voltage controlled crystal oscillator (VCXO). The VCXO regulator is optimized for high ripple rejection and low noise.
USB Interface (VUSB)
The VUSB regulator supplies the USB transceiver located in the DBB. Digital Baseband PLL (VPLL) The
VPLL regulator supplies the phase locked loop on the digital baseband (DBB).
General Purpose Regulator (VGP)
The General Purpose regulator is intended primarily to serve as a supply rail for camera modules. Its voltage is programmable by setting VGPSel[3:0] in theLDOControl2 Register. VGP is enabled by setting the VGPEn bit in LDOControl1 to 1.
Applications Regulator (VAPP)
The VAPP regulator is an adjustable regulator that uses an off chip pass device. It has two modes of operation selected by the state of the VAPPCFG terminal. If VAPPCFG is pulled low the VAPP regulator functions as a programmable voltage applications supply.
In this mode, VAPP is enabled or disabled using the VAPPEn bit of LDOControl1.
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3.3 RF Transceiver (AD6546)
3.3.1 Internal Block Diagram
Figure 3-3-1 AD6546 FUNCTIONAL BLOCK DIAGRAM
3.3.2 General Description
The AD6546 is a fully integrated Quad band GSM Transceiver with an advanced modulator design that fully supports 8-PSK EDGE modulation format.
The AD6546 contains a translation loop modulator for directly modulating baseband signals onto an integrated Tx VCO. The translation loop modulator and Tx VCO are extremely low noise removing the need for external TX filtering.
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3. TECHNICAL BRIEF
3.3.2.1 Receiver
Figure 3-3-2 AD6546 RECEIVER
Low Noise Amplifiers
The LNAs have differential inputs which help minimize the effect of unwanted interferers. The voltage gain of the LNAs is typically 24 dB. Each LNA can be switch to a low gain mode when receiving large input signals as part of the AGC system.
Down-Converting Mixers
Two quadrature mixers are used to mix down the signals from the LNAs, one for the high bands (1800 and 1900 MHz) and one for the low bands (850 and 900 MHz). The outputs of the mixers are connected to the baseband section through an integrated single pole filter with nominal cut-off frequency of 800kHz.
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3.3.2.2 Transmitter
Figure 3-3-3 AD6546 TRANSMITTER
Transmitter Overview
The highly integrated transmit section of the AD6546 radio has been designed to fully support 8 PSK modulation for EDGE applications, and GMSK modulation for GSM. A translational loop is used for phase modulation, and for 8 PSK additional envelope (AM) circuits are enabled to implement a Polar modulator.
Quadrature Modulator
The Quadrature modulator takes the baseband I/Q signals and converts this onto a complex modulated signal (containing both amplitude and phase information) at the TX IF frequency. After bandpass filtering the TX IF signal is used as the reference input to the Phase Frequency Detector (PFD) for the transmit PLL, and in EDGE mode also provides the input to the Reference Path Log Detector circuit for AM restoration.
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3.4 Power Amplifier Module (SKY77523)
3.4.1 Internal Block Diagram
3. TECHNICAL BRIEF
Figure 3-4-1 SKY77523 FUNCTIONAL BLOCK DIAGRAM
3.4.2 General Description
The SKY77523 provides a complete transmit Voltage-Controlled Oscillator (VCO)-to-antenna and antenna-to-receive Surface Acoustic Wave (SAW) filter solution.
The module consists of a single GSM850/EGSM900 and DCS1800/PCS1900 PA block, a PA Control (PAC) block, impedance-matching circuitry for 50 Ω inputs and outputs, transmit harmonic filtering, an integrated coupler, high-linearity and low insertion-loss PHEMT RF switches, and a diplexer. A custom
CMOS integrated circuit provides the internal PAC function, interface circuitry, and decoder circuitry to control the RF switches.
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3.5 BT Module with integrated FM tuner
3.5.1 General Description
The BlueCore 5-FM BGA is a single-chip radio and baseband IC for Bluetooth 2.4GHz systems including enhanced data rates (EDR) to 3Mbits/s.
It includes anintegrated FM receiver with stereo audio output stage and an RDS demodulator. With the on-chip CSR Bluetooth software stack, it provides a fully compliant Bluetooth system to v2.1 +EDR of the specification for data and voice communications.
3.5.2 Total internal Block Diagram
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Figure 3-5-1 Total Internal Block Diagram
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3.5.3 BT radio internal Block Diagram
Figure 3-5-2 BT radio internal Block Diagram
3.5.4 FM radio internal Block Diagram
3. TECHNICAL BRIEF
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Figure 3-5-3 FM Radio internal Block Diagram
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3.6 MEMORY(PF38F5060M0Y0BE, U100 )
Figure 3-6-1 MEMORY BLOCK DIAGRAM
The 512Mbit Ballaire Wireless Flash memory with LPSDRAM stacked device family offers multiple high-performance solutions. The Ballaire flash die is manufactured on 65 nm ETOX™IX Pr ocess Technology. It delivers 108 MHz synchronous burst and page- mode read rates with supports mult i-partitioning with Read-While-Write (RWW) or Read-While-Erase (RWE) dual operations. The LPSDRAM i s a high-performance volatile memory operating at speeds up to 133 MHz with configurable burst lengths.
The Ballaire stacked device features programmable driver strength and low-power opera- tion. This Stac ked Chip Scale Package (SCSP) device is packaged in a standard Intel® x16D footprint and signal ballout.
This model uses 512Mbits Flash memory and 128Mbits LPSDRAM memory with stacked.
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3. TECHNICAL BRIEF
The DBB External Bus Interface provides a memory-mapped interface to external devices such as NOR Flash
, NAND Flash, SRAM, SDRAM, PSRAM, and other custom devices.
The External Memory Interface contains three distinct memory controllers: a NAND Flash Controller (NFC), an SDRAM Controller (SDC), and the External Bus Controller (EBC).
These three controllers share the external pins. They also share an arbiter through which the DMA controlle rs (via DDBUS, ADBUS, and DMABUS) and the processor cores (via DSPBUS and MCUEBUS) access external devices. The following figure shows the external memory interface block diagram.
Figure 3-6-2 DBB EBU SUBSYSTEM BLOCK DIAGRAM
The following table shows the pin list for the external memory interface which supported by Main Base
Band chipset(AD6725).
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Signal Name
DATA[15:0]
ADDR[25:1] nWE nRD nADV nA0CS nSDCS nHWR / nUBS/ SDQM[1] / CLE nLWR / nLBS / SDQM[0] / ALE
BURSTCLK nWAIT nSDRAS nSDCAS nSDWE
SDCKE
SDCLKOUT
Function
Data
Address
Write Enable
Read Enable
Valid Address
NOR Memory Chip Select
SDRAM Chip Select
High Write / Byte Strobe / Data Mask/ Command Latch Enable
Low Write / Byte Strobe / Data Mask / Address Latch Enable
Burst Memory Clock
External Device Wait Input
SDC Row Address Strobe
SDC Column Address Strobe
SDC Write Enable
SDC Clock Enable
SDC Clock Output
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3.7 Multi-Media Processor (AIT817, U602)
3. TECHNICAL BRIEF
Figure 3-7-1 AIT817 FUNCTIONAL BLOCK DIAGRAM
The AIT817 is a highly integrated multi-media processor for mobile phone. The most significant advantage of AIT817 is small package, low power consumption, and high-end multimedia features.
The AIT817 includes an embedded 32-bit ARM9 processor, JPEG, MPEG4, H263, MP3, WMA, AMR, AAC,
EAAC+, MIDI, SBC, hardware 2D-graphic Engine, SD/MMC/MS interface, USB and LCD Display interface,
The MPEG4 and H263 CODEC is fully compliant with the 3GPP standard for MMS(Multimedia Message
Service), with performs real-time compression and decompression at the rate of 30 frames per second with
QVGA resolution.
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Audio functions such as MP3, WMA, AAC, EAAC+, MIDI, SBC and AMR are also supported for feature such as music streaming and playback, voice recording, audio/vedio synchronization, etc. All audios can be played with 3D surround sound.
The 2D graphic hardware acceleration enhances the GUI performance.
The LCD Display Interface of AIT817 Support a wide range of resolutions of LCD panels up to WQVGA.
The AIT817 powered by Alpha Imaging Technology, will provide complete developmint environment for customer.
3.7.1 Features of AIT817
CPU
▪ ARM926EJ-S Up to 300Mhz
▪ 32KB I-Cache + 32KB D-Cache
Memory
▪ 128KB internal frame buffer
▪ Stack LPSDRAM 16~128Mb
DSC
▪ Support up to 3Mp (YUV)
▪ Support Face Detection, Anti-Shaking
Display
▪ Up to WQVGA, 16M colors LCD
Software
▪ Mass storage, PC CAM
▪ Picture Bridge, MS MTP, Virtual COM
▪ MS MS-DRM, Play4Sure 2.2v log
▪ Loudness Maxmizer for Audio
▪ RTOS for Multi Tasking
▪ Single Software Package Download
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Audio
▪ AMR, MP3, WMA, WMA-pro, AAC, EAAC, Real Audio,EAAC+, OGG, SBC encode, 64-poly MIDI, Karaoke, 3D surround, 10-bands EQ
▪ MP3 Long-Time Play (under 20mA w/DAC, HP_Amp)
▪ MP3/AAC encode for FM record (Stereo 32KHz, 192Kbps)
Video
▪ Hardware MPEG4 / H.263 support
QVGA@ 30fps encode w/ AMR &AAC
QVGA@ 30fps decode w/ AMR &AAC
Peripheral
▪ USB 2.0 High Speed
▪ NAND / SD / MMC storage (SDHC)
▪ I 2S / I2C / UART / PWM / GPIO
▪ Integrated audio 16-bit stereo A/D & D/A (95dB SNR)
Others
▪ Process Technology: 90nm
▪ 8*8mm TFBGA 144-pin package(pin compatible w/ AIT820)
▪ Core voltage 1.2V
▪ Separated IO voltage 1.8~3.3V
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3.8 SIM Card Interface
2V85_VSIM 2V85_VSIM
SIM_DATA
R306
15K
C315
DNI
J300
6
10
9
4
5
C5
C6
C7
GND4
GND3
C1
C2
C3
GND1
GND2
3
7
8
1
2
R308 24
SIM_RST
SIM_CLK
C314
220n
C316
22p
C317
1000p
Figure 3-8-1 SIM CARD Interface
The SIM interface supports the functionality of the GSM Phase 1 specification and also supports the functionality of the GSM Phase 2+ specification for FAST 64 kbps SIM (intended for use with a SIM application Toolkit). All SIM interrupts are routed through the IRQ controller to the MCU, DSP or DMA.
The DMA supports autobuffering of the communication between the processor and the SIM interface.
Both 1.8V and 3.0V SIMs are supported..
Signal
SIM_RST
SIM_CLK
SIM_DATA
Description
This signal makes SIM card to HW default status.
This signal is transferred to SIM card.
This signal is interface datum.
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3. TECHNICAL BRIEF
3.9 Micro-SD Card Interface
T-FLASH
3V3_MM
S
SI1305-E3
Q600
D
G
TF_PWR_EN
TF_DATA1
TF_DATA0
TF_CLK
TF_CMD
TF_DATA3
TF_DATA2
TF_DET
R623
30
2V93_VEXT
Figure 3-8-1. Micro-SD Interface
C662
2.2u
S600 AXA463062C02
GND
DAT1_2
DUMMY1
DAT0
VSS
CLK
VDD
CMD
CD_DAT3
DUMMY2
DAT2
DETECT_A
DETECT_B
DUMMY3
Support SD-Card/T-Flash
Figure 3-9-1 Micro-SD Card Interface
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3.10 LCD Interface
2V8_LCD
MLCD_RESET
MLCD_VSYNC
MLCD_RD
MLCD_WR
MLCD_RS
MLCD_CS
EVLC18S02015
MLED
LED_CA1
LED_CA2
LED_CA3
LED_CA4
VA1
LCD_ID
R102 100ohm
2
3
4
5
6
7
8
9
11
10
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
18p 1u
Figure 3-10-1 LCD Interface
MLCD_DATA(15)
MLCD_DATA(14)
MLCD_DATA(13)
MLCD_DATA(12)
MLCD_DATA(11)
MLCD_DATA(10)
MLCD_DATA(9)
MLCD_DATA(8)
MLCD_DATA(7)
MLCD_DATA(6)
MLCD_DATA(5)
MLCD_DATA(4)
MLCD_DATA(3)
MLCD_DATA(2)
MLCD_DATA(1)
MLCD_DATA(0)
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3. TECHNICAL BRIEF
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VBAT
LCD_BL_CTRL
R115
100K
1V5_CAM
2V8_LCD
FB101
15
14
13
12
11
LDO1
LDO2
BYP
NC3
SWIF
U100
SC624ULTRT
C2-
PGND
NC1
BL1
BL2
3
4
5
1
2
C108
22n
C103
2.2u
C109
2.2u
FB100
C105
2.2u
MLED
LED_CA1
LED_CA3
LED_CA2
LED_CA4
Figure 3-10-2 SC624 CIRCUIT DIAGRAM
The SC624 is a high efficiency charge pump LED driver using Semtech’s proprietary mAhXLifeTM technology.
Performance is optimized for use in single-cell Li-ion battery applications.
The charge pump provides backlight current in conjunction with four matched current sinks. The load and supply conditions determine whether the charge pump operates in 1x, 1.5x, or 2x mode. An optional fading feature that gradually adjusts the backlight current is provided to simplify control software. The SC624 also provides two low-dropout, low-noise linear regulators for powering a camera module or other peripheral circuits.
The SC624 uses the proprietary SemWire single wire interface. The interface controls all functions of the device, including backlight current and two LDO voltage outputs. The single wire implementation minimizes microcontroller and interface pin counts.
In sleep mode, the device reduces quiescent current to 100 μ A while continuing to monitor the serial interface. The two LDOs can be enabled when the device is in sleep mode. Total current reduces to 0.1
μ A in shutdown.
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3. TECHNICAL BRIEF
3.11 Battery Charger Interface
From From External Source
(Wall (Wall Adaptor or Computer)
External Charger
2V93_VEXT
VUSBIN
VCHARGE
CHG_PPR
CHG_IND
CHG_EN
U202
1
VDC
2
VUSB
3
_PPR
4
_CHG
5
_EN
6
IMIN
ISL9221
PGND
13
VDC_BYP
12
BAT
11
USB_BYP
10
IVDC
9
GND
8
IUSB
7
C220
1u
C221
1u
VBAT CHG_ABB VBUS_USB
R216
10K
R217
15K
USB_DET
C222
1u
C223
1u
C224
1u
Figure 3-11-1 BATTERY CHARGER BLOCK
The ISL9221 Lithium Ion charging IC is designed to meet the charging requirements of most of today’s handheld devices. The IC provides two inputs for either USB connection where the current is limited by the
USB standard or for powering/charging from a power adapter.
If the voltage at either VUSB or VDC pin is within the safe allowable range, the PPR pin is pulled low indicating to the system processor that external power is available.
Charging can be enabled/disabled by controlling the state of the EN pin. While charging, the CHG pin is pulled low indicating the battery is being charged.
The battery is charged to 4.2V with only a 1% error across the temperature range. USB charge current,
Adapter charge current and charge termination currents can be programmed via external resistors.
The ISL9221 adds an additional feature in providing a limited amount of current to system architecture while protecting the system from destructively high voltage.
The device contains Thermal regulation and protection to provide additional safety features of this device.
When the temperature exceeds +125 ° C, the current will fold back to reduce and control the die temperature.
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3. TECHNICAL BRIEF
3.12 Keypad Interface
CN304
1
2
3
4
VOLUME
EVLC5S02100
VA301
EVLC5S02100 EVLC5S02100
VA302 VA303
KEY_ROW0
R304 680
SW300 SW301 SW302
KEY_ROW1
R307 680
KEY_ROW2
R311 680
KEY_ROW3
R312 680
KEY_ROW4
R313 680
D300
PRSB6.8C
D301
PRSB6.8C
D302
PRSB6.8C
D303
PRSB6.8C
KEY_ROW5
KEY_COL0
KEY_COL1
KEY_COL2
R314
R315
R316
R317
680
680
680
680
SW303
SW306
SW309
SW311
PRSB6.8C
D304
PRSB6.8C
PRSB6.8C
D305 D306
SW304
SW307
SW310
PRSB6.8C
D307
SW305
SW308
3
2
1
CN301
HOLD
3
2
1
CN303
CAMERA
Figure 3-12-1 KEY STRUCTURE
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The keypad interface supports a row/column decoding of a keyboard matrix of up to 8 rows and 8 columns. The interface generates an interrupt when any key is pressed, and the interrupt is routed through the system interrupt controller to the MCU. Software must scan the columns to determine which key was pressed. Debouncing must also be implemented in software. The keypad interface consists of eight tristateable KEYPADCOL outputs and eight KEYPADROW inputs. Pressing a key pulls the corresponding
KEYPADROW input low. When all KEYPADCOL outputs are driven low, pulling any KEYPADROW input low generates an interrupt.
In the interrupt service routine, the keypad must be scanned by setting only one column output low at a time and reading the row inputs. A zero is read anywhere a key is pressed on that column. The scan should be repeated at regular intervals until no key is being pressed. To implement debouncing, the software must require the same scan result for several scans. The keypad interrupt should not be cleared until no key has been pressed for several scans.
The 8 by 8 matrix of rows and columns provides the possibility of up to 64 keys (with an additional 8 if a ghost column is used). Full flexibility in enabling and disabling individual rows and columns is provided.
Any rows or columns not used should be disabled in the Keypad Control Register. The following figure shows the keypad interface and interrupt generation logic.
Figure 3-12-2 keypad interface and interrupt generation logic
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3.13 Audio Interface
Figure 3-13-1 ABB Internal Audio Block Diagram
The AD6725 Audio Section supports communications and personal audio applications. The Audio Section provides an audio codec with two digital-to-analog converters and an analog-to-digital converter, a microphone interface, and analog input and output channels.
Audio and Music Serial Ports
The AD6725 Audio Serial Port is described in detail in the Audio Serial Port (ASPORT) section below.
AD6725 Music serial port (MSPORT) is described in detail in the Music Serial Port (MSPORT) section below.
Audio Codec
The AD6725 audio codec supports communications applications with digital sample rates of 8 kHz or
16kHz. DAC 1 is used for receiving speech. An ADC is used for sending speech. The AD6725 audio codec supports personal audio applications with digital sample rates of 8 kHz, 11.025kHz, 12 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz. DAC 1 and DAC 2 are used for monophonic audio. The channels are common in the digital section. DAC 1 and DAC 2 are used together for stereo audio, with DAC 1 decoding the left-channel digital input and DAC 2 decoding the right-channel digital input.
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Audio codec operating modes can be controlled by writing 5 bit codes in the AudMode field of the
AudControl1 register and in the AudMode_M field of the AudControl4 register. AudControl1 programs the sampling rate and stereo or monophonic operating mode for PCM audio samples input via the
ASPORT.
AudControl4 programs the sampling rate and stereo or monophonic operating mode for PCM audio samples input via the MSPORT.
The AudControl1 and AudControl4 contain control bits that allow system software to turn on three audio loudness enhancement techniques meant for use when driving 8 ohm loudspeakers. These are high pass filter, dynamic range compressor, and x4 gain boost. These loudness enhancement techniques can be used with any AudMode or AudMode_M setting. And are programmed seperately and independently for the ASPORT and MS- PORT PCM audio decoder data streams.
Analog Audio Output & Input Configurations
Output configurations are set by AudOS[4:0] bits in the AudControl2 register. Input configurations are set by AudIS[3:0] bits in the AudControl2 register.
AudIn3LMute bit high in the AudMuteControl register (0x27 ). For configurations using “DAC2+AIN3R”, the AIN3R input may be muted by setting AudIn3RMute bit high in the AudMuteControl register. For configurations using “AIN3(L)”, the AIN3L and AIN3R inputs may be used as a differential input or the
AIN3L input may be used as a single-ended input.
Single ended configuration is chosen by setting AudIn3Cfg bit high in the AudControl3 register (0x32 ).
Audio DACs and Analog Filters
The Audio DACs are over-sampled switched-capacitor DACs. The analog filters are switched-capacitor filters followed by active-RC filters.
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3. TECHNICAL BRIEF
Analog Audio Output Drivers
Audio Output 1
PGA gain for Audio Output 1 can be set by using bits AudOut1Gain[4:0] in the AudOut12Control (0x21 ) register. Output 1 is used for 32 Ω interface with differential output but can be used by single ended interface.
And this model only uses passive filters between output port and Receiver.
Figure 3-13-2 ABB Audio OUTPUT1
Audio Output 2
PGA gain for Audio Output 2 can be set by using bits AudOut2Gain[4:0] in the AudOut12Control
(0x21) register. Output 2 is used for 8 Ω . This port supports only a differential interface. And this model only uses passive filters and Class D audio amplifier between output port and speaker. Audio amplifier Gain is set by hardware component and gain is 6 times.
LGE Internal Use Only
LGE Internal Use Only
Figure 3-13-3 ABB Audio OUTPUT2
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 48 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
Audio Output 3
PGA gain for Audio Output 3 Stereo Configuration can be set by using bits AudOutL-Gain[4:0] and
AudOutRGain[4:0] in the AudOutLRControl (0x22 ) register. When Audio Output 3 configured as monophonic differential output PGA gain can be set by using bits AudOut3Gain[4:0] in the
AudOut3Control register (0x23 ).
This port is used for headset speaker in stereo. This port must use DC-coupling capacitor as output DC.
It uses two 100uF capacitor each other in left and right output.
Figure 3-13-3 ABB Audio OUTPUT3
Analog Audio Input
The AD6725 provides two analog input channels, AIN1 and AIN2, that may be used for both microphone and line inputs. The AIN1 and AIN2 channels are identical. One of the two channels is typically used with microphone built into a handset. The other channel is typically used with an external microphone or external line input.
LGE Internal Use Only
Figure 3-13-4 Audio Input Block Diagram
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 49 LGE Internal Use Only
3. TECHNICAL BRIEF
Analog Input AIN1, AIN2 and VMIC configurations can be chosen by setting bits AudIS[3:0] in the
AudControl2 register (0x1E ). Additional gain of 9dB can be inserted into Analog Audio Input signal chain by setting AudPreampGainSel bit high in the AudControl3 register (0x32 ).
Microphone Interface
The microphone pre-amplifier and associated integrated resistors support electret microphones. An internal (Configuration 11) or external (Configuration 01 or 10) load resistor converts the current input of the microphone to a voltage signal which is amplified using a low-noise pre-amplifier. The Microphone signal path also includes an additional programmable gain of +9 dB gain directly after the pre-amplifier.
Different microphones require different DC bias currents for optimum sensitivity.
Audio ADC and PGA
The Audio ADC is a high-order single-bit sigma-delta ADC that includes a switched- capacitor PGA at the input.
Digital Filters
The AD6725 Audio Section provides two digital filters. The voiceband filter is used for applications with a 8 kHz digital sample rate. The high-quality audio filter is used for applications with higher digital sample rates.
LGE Internal Use Only
LGE Internal Use Only
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Only for training and service purposes
- 50 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
Audio Accessory Detection
The AD6725 provides for detection of audio headset accessory insertion, extraction, and hookswitch events. The detector circuit is designed to operate with minimum power in standby mode. There are two pins dedicated to the accessory detector. AccDet is intended to interface to the external microphone and monitor its bias voltage. The ACCDET terminal is used to sense hookswitch events while a headset accessory is inserted. The JackSense terminal is interfaced to the switch pin of the Jack socket or a Jack Sense terminal on a handset system connector.
Use of the AccDet Terminal for Hookswitch Event Detection
The AccDet terminal may be connected directly to the Ain2P pin in the case of a DC coupling of the accessory microphone. If the accessory microphone is connected via a capacitor then the AccDet pin may be connected to the microphone side of the coupling capacitor. The AccDet terminal is used to detect hookswitch events. Hookswitch events cause the system to answer an incoming phone call or hang up on an active phone call.
The detector circuit is in operation only if an accessory is inserted. It monitors the voltage at the AccDet terminal using a comparator as shown Figure below.
Associated logic then provides the AudAccInt interrupt and updates the contents of the Detector
Control register as follows on each comparator transition
Figure 3-13-5 Audio Accessory Detection Block Diagram
LGE Internal Use Only
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Only for training and service purposes
- 51 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
Use of the JackSense Terminal for Accessory Insertion and Removal Detection
Accessory insertion and removal is detected using the JackSense terminal. The JackSense terminal is connected to a signal produced by a mechanical connection that indicates the presence or absence of the headset accessory. The insertion/removal sense circuit fed by JackSense is flexible as far as the characteristics of the mechanical connection are concerned. The mechanical connection will often times be pulled down in one state and floating in the other. In such cases a 1uA on chip current source is used to pull JsckSense to VBAT when the mechanical connection is floating.
To avoid false interrupts the Accessory detect logic has a hardware polling loop which will prevent
Interrupt generation from comparator transitions with a duration of no less than 10 mSec.
Figure 3-13-6 Accessory Insertion/Removal Detector Block Diagram
LGE Internal Use Only
LGE Internal Use Only
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- 52 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.14 Camera Interface(2M Fixed Focus Camera)
3.14.1 AIT817 Camera Interface
Support 2M pixel sensor with YUV interface.
High performance scaling engine to support real-time image scale-up interpolation
Support advanced image effort such as face detection, anti-shaking, panorama, and smile detection
JPEG Codec
• Real-time high performance JPEG engine does 15-frame per second @ 2M resolution.
• Compliant with JPEG baseline standard (ISO/IEC 10918) with JFIF.
• Support Motion JPEG.
Video Codec
• MPEG4 / H.263 encode/decode at QVGA@30fps
• MPEG4 Simple Profile Level 3
• H.263 Baseline Profile Level 0
LGE Internal Use Only
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- 53 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
CAM_RESET
CAM_1V8_EN
CAM_2V8_EN
C1
PMCLK
E11
D12
C11
C12
B12
PI2S_SCK
PI2S_WS
PI2S_SDO
PI2S_SDI
PI2S_MCLK
1V8_CAM
CAM_I2C_SDA
CAM_I2C_SCL
1V5_CAM
1V8_CAM 2V8_CAM
C301
56p
C302
0.1u
C303
56p
C304
0.1u
C305
0.1u
C306
56p
CAM_D(7)
CAM_D(6)
CAM_D(5)
CAM_D(4)
CAM_D(3)
CAM_D(2)
CAM_D(1)
CAM_D(0)
5
4
3
2
1
24
23
22
D7
D6
D5
D4
D3
D2
D1
D0
S300
MCLK
RESETB
SDA
SCK
STANDBY
HSYNC
VSYNC
PCLK
7
9
10
11
12
18
19
20
VA300
EVLC5S02100
CAM_MCLK
CAM_RESET
CAM_I2C_SDA
CAM_I2C_SCL
CIF_PD
CAM_HS
CAM_VS
CAM_PCLK
LGE Internal Use Only
LGE Internal Use Only
Figure 3-14-1 CAMERA Circuit Diagram
- 54 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.15 KEY BACLKLIGHT LED Interface
The AD6725 Auxiliary Section provides three independent PWM light controllers.
The PWM output controllers regulate the average current through active lights.
3. TECHNICAL BRIEF
Figure 3-15-1 ABB Light Controller Block Diagram
The output frequencies of the LIGHTx PWM output controllers are set by the Light12Period (0x2F ) and
Light3Period (0x31 ) control registers.
With fMCLK = 13 MHz, frequencies ranging from 50.781 kHz to 49.591 Hz may be specified.
fLIGHT1 = ( fMCLK / 256 ) / ( Light12Period[9:0] + 1 ) fLIGHT2 = ( fMCLK / 256 ) / ( Light12Period[9:0] + 1 ) fLIGHT3 = ( fMCLK / 256 ) / ( Light3Period[9:0] + 1 ) he output duty cycles of the PWM output controllers are set by the LightxDutyCycle[7:0] control registers –
Light1DutyCycle (0x2D ), Light2DutyCycle (0x2E) and Light3DutyCycle (0x30 ).
This model use only Light3 port and 2 high luminance white LED with light guard film.
LGE Internal Use Only
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- 55 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
POWERKEY
KEY_ROW4
(USE GHOST FUNC. OF ROW4 ON POWER-UP)
SLIDE_KEY_BL_EN
KEY_BACKLIGHT3
K22
L20
KEYON
KEYOUT
F18
G17
G18
LIGHT1
LIGHT2
LIGHT3
VBAT
R309
100ohm
LD300
SWAF07
VBAT
R310
100ohm
LD301
SWAF07
KEY_BACKLIGHT3
LGE Internal Use Only
SLIDE_KEY_BL_EN
Figure 3-15-2 KEY BACKLIGHT LED Circuit Diagram
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only - 56 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.16 Vibrator Interface
Vibrator is drived by Dual BJT with bias resistor.
MOTOR is connected with + terminal of vibrator and – terminal is connected with Ground. It is controlled by
VIBRATOR signal of DBB with only ON/OFF function.
MOTOR
VIBRATOR
VIBRATOR
R305
2.2
Q300
3
Q2_C
2
Q1_B
1
Q1_E
Q2_E
4
Q2_B
5
Q1_C
6
VBAT
Figure 3-16-1 Vibrator Driver Block Diagram
LGE Internal Use Only
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Only for training and service purposes
- 57 -
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Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Component
X501
U500
U501
FL500
FL501
Figure 4.1
LGE Internal Use Only
U501
U500
X501
FL500, FL501
Power Amp Module (SKY77523)
RF Main Chip (Transceiver)
Crystal, 26MHz Clock
SAW Filter
Table 4.1
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LGE Internal Use Only - 58 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.2 RX Trouble
CHECKING FLOW
START
HP8960 : Test mode
190 CH, 7 level setting (TCH)
190CH, -60dBm setting (BCCH)
Spectrum analyzer setting
Oscilloscope setting
(1) Check
Crystal Circuit
(X501)
(2) Check
Mobile SW &SKY77517
(U501)
(3) Check
RX I/Q Signal
(U500)
Re-download SW or
Do calibration again
LGE Internal Use Only
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- 59 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
(1) Checking Crystal Circuit
TEST POINT
X501
CHECKING FLOW
26MHz is ok?(TP1)
No
Change X501
Yes Crystal Circuit is OK
TP1
Figure 4.2
CIRCUIT
1
2
3
4
9
10
7
8
5
6
I
IB
VSUP_BBI
REF_SEL
SEL_26M
VLDO3_DRV
TXOP_LO
TXOP_HI
VLDO3_VCO
VBAT1
U500
AD6546
QB
SCLK
Q
SDATA
SEN
VDD
REF_OP
REFIN
REFINB
VSUP_REF
30
29
28
27
26
25
24
23
22
21
0.1u
2V93_VEXT
C507
39p
QP
QN
S_CLK
S_DATA
S_EN
(GPIO_074)
(GPIO_073)
(GPIO_072)
4
1
X501
3
2 DSX321G-26M
26MHz
C509 1000p
WAVEFORM
TP1
LGE Internal Use Only
LGE Internal Use Only
Graph 4.1
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Only for training and service purposes
- 60 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
(2) Checking Mobile switch, SKY7723
TEST POINT
TP3
TP2
TP4
TP5
TP1
U501
U500
CIRCUIT
GRS300-2S-H36-E3000 SW500
SW50
0
Figure 4.3
LGE Internal Use Only
C510
22p
U501
SKY77523
GND17
VPC
VBATT
VSUP
BS0
BS1
PAC_EN
TR_EN
SAT_DET
COUP
GND16
31
30
29
28
27
26
25
24
23
22
21
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 61 -
TP5
TP4
TP3
TP2
ANT_SW2
ANT_SW1
PA_EN
PA_BAND
(GPIO_060)
(GPIO_070)
R508
18
R509
220
R510
220
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
CHECKING FLOW
Check SW500 Pin ANT,RF with RF Cable connected.
Check SW500 Pin ANT,RF with No RF Cable Connected
Check C510(TP1)
Check whether Ant SW
Set as RX mode i
Refer to Table 4.2
Open
Yes
Short
Yes
Check TP2, TP3,
TP4, TP5
Yes
No
No
No
Changing SW500
Changing SW500
Changing the Board.
PA Module & Mobile SW is OK
See next Page to check
Rx I/Q Signal
LGE Internal Use Only
LGE Internal Use Only
Table 4.2
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- 62 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TP2
(3) Checking RX I/Q
TEST POINT
U500
CIRCUIT
6M
IP
TP1
TP1
C505
39p
IN
100p
3
4
5
1
2
I
IB
VSUP_BBI
REF_SEL
SEL 26M U500
Q
QB
SCLK
SDATA
SEN
30
29
28
27
26
TP1
Figure 4.4
TP2
0.1u
TP2
QP
C507
39p
QN
S_CLK
S_DATA
S EN
(GP
(GP
(GP
WAVEFORM
TP1
TP2
CHECKING FLOW
Graph 4.2
Check C505(TP1), C507(TP2).
Check if there is any
Major difference
Refer to graph 4.2
Similar?
Yes
Redownload software and calibration again
LGE Internal Use Only
Replace U500
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 63 LGE Internal Use Only
4. TROUBLE SHOOTING
4.3 TX Trouble
CHECKING FLOW
START
HP8960 : Test mode
190 CH, 7 level setting (TCH)
190CH, -60dBm setting (BCCH)
Spectrum analyzer setting
Oscilloscope setting
(1)Check
Crystal Circuit
(2)Check
Mobile SW &
SKY77523
(4)Check
TX I/Q Signal
Redownload SW or
Do calibration again
LGE Internal Use Only
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 64 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
(1) Checking Crystal Circuit
TEST POINT
X501
CHECKING FLOW
26MHz is ok?(TP1)
No
Change X501
Yes Crystal Circuit is OK
Figure 4.5
CIRCUIT
100p
7
8
9
10
1
2
3
4
5
6
I
IB
VSUP_BBI
REF_SEL
SEL_26M
VLDO3_DRV
TXOP_LO
TXOP_HI
VLDO3_VCO
VBAT1
U500
AD6546
Q
QB
SCLK
SDATA
SEN
VDD
REF_OP
REFIN
REFINB
VSUP_REF
24
23
22
21
30
29
28
27
26
25
TP1
0.1u
2V93_VEXT
C507
39p
QP
QN
S_CLK
S_DATA
S_EN
(GPIO_074)
(GPIO_073)
(GPIO_072)
4
1
X501
3
2
DSX321G-26M
26MHz
C509 1000p
WAVEFORM
TP1
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 65 -
Graph 4.3
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
(2) Checking Mobile SW, SKY77523
CHECKING FLOW
Check SW500 Pin ANT,RF with RF Cable connected.
Check SW500 Pin ANT,RF with No RF Cable Connected
Check C510(TP1)
Check whether Ant SW
Set as RX mode i
Refer to Table 4.2
Open
Yes
Short
Yes
Check TP2, TP3,
TP4, TP5
Yes
No
No
No
Changing SW500
Changing SW500
Changing the Board.
PA Module & Mobile SW is OK
See next Page to check
Rx I/Q Signal
LGE Internal Use Only
LGE Internal Use Only
Table 4.3
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- 66 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TP2
(3) Checking TX I/Q
TEST POINT
U500
6M
IP
TP1
TP1
C505
39p
IN
CIRCUIT
100p
3
4
1
2
5
I
IB
VSUP_BBI
REF_SEL
SEL 26M U500
Q
QB
SCLK
SDATA
SEN
30
29
28
27
26
TP1
TP2
0.1u
TP2
QP
C507
39p
QN
S_CLK
S_DATA
S EN
(GP
(GP
(GP
Figure 4.6
WAVEFORM
TP1
TP2
CHECKING FLOW
Graph 4.4
Check C505(TP1), C507(TP2).
Check if there is any
Major difference
Refer to graph 4.2
Similar?
Yes
Redownload software and calibration again
LGE Internal Use Only
Replace U500
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 67 LGE Internal Use Only
4. TROUBLE SHOOTING
4.4 Power On Trouble
CHECKING FLOW
START
Check Battery Voltage
> 3.5V
YES
Push power-on key
And check the level change into low of POWERKEY
NO
NO
Charge or Change Battery
Check the contact of power key
Or dome-switch
YES
Check the voltage of
The LDO outputs at U102
NO
Replace U102
YES
VCORE=1.2V~1.5V 2V75_VCXO=2.75V
1V88_VMEM=1.88V 2V85_VSIM= 2.85V
2V93_VEXT=2.93V
1V5_VPLL=1.5V
2V5_VMIC=2.5V 2V5_VABB=2.5V
Logic level at RPWRON(DBBON) of D101
= HIGH(above 1.2V)?
YES
NO
Re-download software
NO
Is the phone power on?
Replace U102 and Re-download software
LGE Internal Use Only
YES
The phone will
Properly operating.
LGE Internal Use Only
Does it work properly?
NO
Replace the main board
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 68 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
TEST POINT
Figure 4.4
TP1
TP8
TP2
TP3
TP4
TP5
TP7
TP6
CIRCUIT
LGE Internal Use Only
PWRON
RPWRON
TP8
1
2
D101
KDR331V
3
DBBON
R117
47K
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 69 LGE Internal Use Only
4. TROUBLE SHOOTING
ADD01
ADD02
ADD03
ADD04
CIRCUIT
C126
22p
C127
0.1u
K4
J5
J4
J3
H4
ADD0
ADD1
ADD2
ADD3
ADD4
TP3
1V88_VMEM 1V88_VMEM 1V88_VMEM
VCORE
C102
1u
C115 C116
C103
0.1u
22p
10u
C117
10u
TP1
TP 6
2V93_VEXT 2V5_VABB HSMICBIAS
C128
22p
C129
0.1u
C113
1u
C130
1u
2.2u
C114
DATA0
DATA1
DATA2
DATA3
E2
E3
D2
D3
DATA00
DATA01
DATA02
DATA03
TP4
2V93_VEXT TP2
1V82_VINT
2V5_VMIC TP5
1V8_VRTC
TP7
4.7K
R100
VBACKUP
2V93_VEXT 1V5_VPLL VBUS_USB 2V75_VCXO
C107
1u
1u
C108
C109
1u
C110
1u
C111
1u
C112
1u
LGE Internal Use Only
LGE Internal Use Only
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- 70 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.5 Charging Trouble
CHECKING FLOW
START
Change the battery
Battery is charged?
NO
Is I/O Connector(CN200) well-soldered ?
YES
Check the voltage at
C227 = 5.1V ?
YES
Is the voltage at pin2 of U202 = 5.1V?
YES
Is Voltage across R220 about 1.2V?
YES
Battery is charged?
YES
Charging is properly operating
YES
NO
NO
NO
NO
NO
Replace the main board
Charging is properly operating
Resolder the CN200
(Pin 12,13 : VCHARGE)
The TA is out of order
Change the TA
Replace the
U202
Replace the
U202
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
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- 71 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TEST POINT
Figure 4.5
TP1
TP2
CIRCUIT
U202
1
VDC
2
VUSB
3
_PPR
4
_CHG
5
_EN
6
IMIN
ISL9221
PGND
13
VDC_BYP
12
BAT
11
USB_BYP
10
IVDC
9
GND
8
IUSB
7
TP1
LGE Internal Use Only
LGE Internal Use Only
TP2
C222
1u
C223
1u
C224
1u
R216
10K
R217
15K
USB_DET
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 72 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.6 Vibrator Trouble
CHECKING FLOW
SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu
START
Is the voltage at pin 2 of Q300 high?
YES
Is the voltage at pin 4 of Q300 high (VBAT) ?
YES
Check the soldering of vibrator ?
YES
Replace vibrator
YES
Vibrator
Working well !
NO
NO
NO
Check the soldering
Q300
Check the soldering of Q300
Resolder or Replace vibrator
LGE Internal Use Only
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Only for training and service purposes
- 73 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TEST POINT
Figure 4.6
TP2
TP1
TP3
MOTOR
VIBRATOR
TP1
CIRCUIT
R305
2.2
Q300
3
Q2_C
2
Q1_B
1
Q1_E
Q2_E
4
Q2_B
5
Q1_C
6
VBAT
MOTOR
TP2
Vibrator PAD
L100
100nH
C101
2.2u
TP3
VA102
VB100
1
2
MVMF-A300M2
SJMY0007104
EVLC18S02015
LGE Internal Use Only
LGE Internal Use Only
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- 74 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.7 LCD Trouble
CHECKING FLOW
START
Is the connection of
CN102 with LCD connector ok ?
YES
Is the connection of
CN102 with LCD connector ok ?
YES
Is the connection of
CN300 with CN103 connector ok ?
YES
Check the Voltage Level of
C105 is about Battery voltage ?
(LCD_BL_CTRT signal is high Level)
YES
Check the Waveform of
EMI filter ?
YES
Check the Waveform of
Data pins on CN103 ?
YES
Does LCD work properly ?
YES
LCD working well !
LGE Internal Use Only
NO
NO
NO
NO
NO
NO
NO
Reassemble FPCB with LCD connector
Reassemble FPCB with Key connector
Reassemble FPCB with Main connector
Resoldering or Replace U100
Resoldering EMI filter.
(FL300, FL301. FL302, FL303, FL304)
Replace Main FPCB
Replace LCD module
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 75 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TEST POINT
Figure 4.7
TP1
Key PCB
TP2
TP3
Main PCB
Key PCB
U100
TP5
LGE Internal Use Only
TP6 / TP7 / TP8 / TP9 / TP10
TP4
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only - 76 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
CIRCUIT
L_DATAOUT00
L_DATAOUT01
L_DATAOUT02
L_DATAOUT03
L_DATAOUT04
L_DATAOUT05
L_DATAOUT06
L_DATAOUT07
L_DATAOUT08
L_DATAOUT09
L_DATAOUT10
L_DATAOUT11
L_DATAOUT12
L_DATAOUT13
L_DATAOUT14
L_DATAOUT15
L_MAIN_LCD_CS_OUT
LCD_RESET_OUT
LCD_RS_OUT
LCD_WR_OUT
LCD_RD
LCD_ID
FPCB CONNECTOR
VBAT 1V5_CAM
18
19
20
21
14
15
16
17
9
10
11
12
13
1
2
3
4
5
6
7
8
26
27
28
29
30
22
23
24
25
CN300
56
55
54
53
60
59
58
57
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
C312
1u
C313
1u
C310
47p
C311
47p
SPK_RCV_N
27p
C300
SPK_RCV_P
MOTOR
LCD_BL_CTRL
LCD_VSYNC
VBACKUP
SLIDE_KEY_BL_EN
KEY_COL3
KEY_COL4
POWERKEY
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_ROW4
KEY_ROW5
LCD_BL_CTRL
TP5
R115
100K
FB101
15
14
13
12
11
LDO1
LDO2
BYP
NC3
SWIF
U100
SC624ULTRT
C2-
PGND
NC1
BL1
BL2
1
2
3
4
5
C108
22n
LCD_CS
TP10
LCD_WR
FL300
1
2
3
4
INOUT_A1
INOUT_A2
INOUT_A3
INOUT_A4
ICVE10184E050R101FR
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
9
8
7
6
L_MAIN_LCD_CS_OUT
LCD_RESET_OUT
LCD_RS_OUT
LCD_WR_OUT
LCD_DATA00
TP 6
LCD_DATA03
FL301
3
4
1
2
INOUT_A1
INOUT_A2
INOUT_A3
INOUT_A4
ICVE10184E050R101FR
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
7
6
9
8
L_DATAOUT00
L_DATAOUT01
L_DATAOUT02
L_DATAOUT03
LCD_DATA04
LCD_DATA05
LCD_DATA07
LCD_DATA08
LCD_DATA09
LCD_DATA11
FL302
3
4
1
2
INOUT_A1
INOUT_A2
INOUT_A3
INOUT_A4
ICVE10184E050R101FR
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
7
6
9
8
L_DATAOUT04
L_DATAOUT05
L_DATAOUT06
L_DATAOUT07
FL303
3
4
1
2
INOUT_A1
INOUT_A2
INOUT_A3
INOUT_A4
ICVE10184E050R101FR
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
9
8
7
6
L_DATAOUT08
L_DATAOUT09
L_DATAOUT10
L_DATAOUT11
LCD_DATA12
TP
LCD_DATA15
9
FL304
3
4
1
2
INOUT_A1
INOUT_A2
INOUT_A3
INOUT_A4
ICVE10184E050R101FR
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
7
6
9
8
L_DATAOUT12
L_DATAOUT13
L_DATAOUT14
L_DATAOUT15
TP4
FB100
C105
2.2u
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 77 LGE Internal Use Only
4. TROUBLE SHOOTING
Waveform
LCD_BL_CTRT
Graph 4.7.1. LCD Backlight Control Signal Waveform
LCD_RS
LCD_CS
LCD_WR
Graph 4.7.2. LCD Data Waveform
LGE Internal Use Only
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 78 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.8 Camera Trouble
CHECKING FLOW
START
Is the connection of
S300 with Camera Module ok ?
YES
NO
Check the each voltage level of
C308(1.8V), C309(2.8V), C106(1.5V) is right ?
(CAM_1V8_EN / CAM_2V8_EN signal is high Level)
NO
Push the camera.module
Resoldering or Replace U300 / U100 (Key PCB)
YES
Check the Waveform of
CAM_I2C_SCL, CAM_I2C_SDA ?
YES
Check the Waveform of
CAM_MCLK(13MHz) ?
YES
Check the Waveform of
Data pins on S300 ?
YES
Check the Waveform of
Varistor (VA300) ?
YES
Does Camera work properly ?
YES
Camera working well !
NO
NO
NO
NO
NO
Resoldering R501, R502
Replace U602
Replace Camera Module.
Resoldering VA300
Replace U602
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 79 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TEST POINT
Figure 4.8
Main PCB
Key PCB
Camera
Module
TP3
TP2
TP1
TP4
LGE Internal Use Only
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 80 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
CIRCUIT
1V5_CAM
1V8_CAM 2V8_CAM
C301
56p
C302
0.1u
C303
56p
C304
0.1u
C305
0.1u
C30
56p
1V5_CAM
2V8_LCD
2
1
24
23
22
5
4
3
D3
D2
D1
D0
D7
D6
D5
D4
S300
MCLK
RESETB
SDA
SCK
STANDBY
HSYNC
VSYNC
PCLK
7
9
10
11
12
18
19
20
VA300
EVLC5S021
FB101
TP1
TP4
15
14
13
12
11
LDO1
LDO2
BYP
NC3
SWIF
U100
SC624ULTRT
PG
CAM_2V8_EN
CAM_1V8_EN
CAMERA PART POWER
VBAT
C307
1u
1
2
3
4
U300
VIN
EN1
EN2
NC1
RT9011-MGPQW
VOUT1
VOUT2
NC2
GND
8
7
6
5
1V8_CAM 2V8_CAM
C308
1u
C309
1u
TP3
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 81 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
Waveform
CAM_RESET
I2C_DATA
Graph 4.8.1. I2C Data Waveform
CAM_VSYNC
CAM_MCLK
13MHz
Graph 4.8.2. MCLK Waveform
CAM_HSYNC
CAM_HSYNC
CAM_PCLK
20.8MHz
Graph 4.8.3.CAM_VSYNC vs.
CAM_HSYNC Waveform
Graph 4.8.4.CAM_HSYNC vs.
CAM_PCLK Waveform
LGE Internal Use Only
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 82 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.9 Speaker Trouble
CHECKING FLOW
START
(Play the mp3 file)
Check the state of contact of speaker
Yes
Check the Audio Input signal
TP1, TP2
Yes
No
No
No
Check the TP5
(AMP Input Power)
Yes
OK
Change speaker
Check AIT817(U602)
Check LP3907(U600)
TEST POINT
TP1
TP2
TP5
U603
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Figure 4.9
- 83 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
CIRCUIT
TP1
SPK_P
RCV_P
RCV_N
SPK_N
MM_R
FM_R
FM_L
MM_L
C649 1u
C650
C651
1u
1u
C652 1u
I2C_SDA
I2C_SCL
TP2
AUDIO AMP
EUSY0360201
2V93_VEXT
C643
C646
C647
1u
1u
1u
C648 1u
EXT_SPK_R
EXT_SPK_L
C653
0.1u
C654
2.2u
E1
MONO_IN+
D1
MONO_IN-
C2
RIN
C1
LIN
C3
BYPASS
A1
B2
B3
I2CVDD
SDA
SCL
U603
LM49150TLX
VBAT
C655
2.2u
C656
2.2u
TP5
C644
1u
C645
0.1u
MONO+
A4
MONO-
A3
ROUT
E2
LOUT
E3
VO_LDO
D2
C657
0.1u
C658
2.2u
C659
27p
C660
27p
TP3
Audio Filter & PAD
SPK_RCV_P
C100
100p
SPK_RCV_N
C103
47p
C104
47p
VA100 VA101
TP4
CN102
1
2
EMS1812TVC1P
SUSY0027501
SPK_RCV_P
SPK_RCV_N
HP_ROUT
HP_LOUT
LGE Internal Use Only
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 84 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.10 Earphone Trouble
CHECKING FLOW
START
Resolder J200
NO
Is JACK_DETECT_3.5
High ?
Resolder TP3
YES
Check the TP8 and TP9
(Amp Input Power and Chargepump Power)
NO
YES
NO
Check the TP4
Check the U603(LM49150)
Check the U600(LP3907)
YES
Set the audio part of the test equipment to PRBS or
Continuous wave mode
Check TP5(Low)
NO
Check U102(AD6725)
YES
Can you hear the sound from the earphone?
YES
Set the audio part of the test
Equipment to echo mode
NO
Change the earphone and try again
Can you hear the sound from the earphone?
YES
NO
Resolder the TP1, TP2, TP6 and TP7
Can you hear your voice from the earphone?
NO
Change the earphone and try again
Earphone will work properly
LGE Internal Use Only
Can you hear your voice from the earphone?
NO
Check the level of HPMIC_DET_3.5
and the path of Ear-Mic
YES
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 85 LGE Internal Use Only
4. TROUBLE SHOOTING
TEST POINT
TP2
TP1
TP4
TP5
TP3
LGE Internal Use Only
LGE Internal Use Only
TP8
TP9
U603
TP6
TP7
Figure 4.10
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 86 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
CIRCUIT
MM_R
FM_R
FM_L
MM_L
TP 6
C649 1u
C650
C651
1u
1u
C652 1u
VBAT
SPK_P
RCV_P
RCV_N
SPK_N
AUDIO AMP
EUSY0360201
2V93_VEXT
C643
C646
C647
1u
1u
1u
C648 1u
I2C_SDA
I2C_SCL
EXT_SPK_R
EXT_SPK_L
E1
MONO_IN+
D1
MONO_IN-
C2
RIN
C1
LIN
C3
BYPASS
A1
B2
B3
I2CVDD
SDA
SCL
U603
LM49150TLX
TP7
C653
0.1u
C654
2.2u
C644
1u
C645
0.1u
MONO+
A4
MONO-
A3
ROUT
E2
LOUT
E3
VO_LDO
D2
TP8
C655
2.2u
C656
2.2u
C657
0.1u
TP
C658
2.2u
C659
27p
C660
27p
9
TP4
1V8_MM_AUDIO
SPK_RCV_P
SPK_RCV_N
HP_ROUT
HP_LOUT
LGE Internal Use Only
TP5
MM_HP_R
HSO_3.5_R
EAR_PATH_SEL
HP_ROUT
C640
0.1u
1
U601
DG2735DN-T1-E3
10
V+ NO2
2
NO1
3
COM1
4
IN1
5
NC1
COM2
9
IN2
8
NC2
7
GND
6
C641
27p
C642
27p
MM_HP_L
HSO_3.5_L
EAR_PATH_SEL
HP_LOUT
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 87 LGE Internal Use Only
4. TROUBLE SHOOTING
TP1
TP2
HP_MIC_3.5
TP3
JACK_DET_3.5
HSO_3.5_L
HSO_3.5_R
L200
L201
L202
100nH
120
120
C204
47p
C205
47p
VA201
0.068u
GRM36X7R683K16PT
VA202 VA203
C208
24p
20
R200
HPMIC_DET_3.5
VA200 EVLC5S02100
J200
7620-3_5G-DB1-A
3.5phi
FM_ANT
LGE Internal Use Only - 88 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.11 Receiver Trouble
CHECKING FLOW
SETTING : After initialize Agilent 8960, Test GSM850, PCS mode
Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max.
START
Check the state of contact of Receiver
Yes
Check the Audio Input signal
TP1, TP2
Yes
No
No
No
Check the TP5
(AMP Input Power)
Yes
OK
Change receiver
Check AD6725(U102)
Check LP3907(U600)
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 89 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TEST POINT
TP5 U603
TP1
TP2
Figure 4.11
CIRCUIT
TP5
SPK_P
RCV_P
RCV_N
SPK_N
TP1
AUDIO AMP
EUSY0360201
2V93_VEXT
C643
C646
C647
C648
1u
1u
1u
1u
EXT_SPK_R
E1
MONO_IN+
D1
MONO_IN-
C2
RIN
C1
LIN
VBAT
U603
LM49150TLX
C644
1u
C645
0.1u
MONO+
A4
MONO-
A3
ROUT
E2
TP2
TP3
Audio Filter & PAD
SPK_RCV_P
C100
100p
SPK_RCV_N
C103
47p
C104
47p
VA100
TP4
LGE Internal Use Only
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 90 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.12 Microphone Trouble
CHECKING FLOW
SETTING : After initialize Agilent 8960, Test GSM850, PCS mode
START
Check microphone sound hole
Make a phone call, then check TP1 mic bias signal comes from U102 ?
NO
1. Check mic Bias signal line
2. Change the U102
YES
Check the signal
Level at TP3 of MIC200.
Is it a few tens mV AC?
NO
Resolder TP2 and TP3
NO
Replace the MIC200
YES
Microphone will work properly.
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 91 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TEST POINT
TP2 TP3 TP1
U604
TP4
Figure 4.12
CIRCUIT
MIC_N
MIC_P
TP2
2V5_VMIC
R202
1K
C202
DNI
MIC
C201
10u
R206
2.2K
VMIC_GND
L203
100nH
TP1
C206
47p
C207
1u
VA204
VA205
EVLC5S0250
ICVS0505500FR
27p
C209
C212
27p
TP3
V
LGE Internal Use Only
TP4
2V5_VMIC
MM_MIC_P
MIC_P
MIC_SEL
BB_MIC_P
TP5
C661
0.1u
1
U604
DG2735DN-T1-E3
10
V+ NO2
2
NO1
3
COM1
4
IN1
9
COM2
IN2
8
NC2
7
5
NC1 GND
6
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only - 92 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.13 SIM Card Interface Trouble
CHECKING FLOW
START
Does the SIM card support 3V or 1.8V ?
YES
NO
Is Voltage at the pin1 of J300 2.85V or 1.8V?
NO
Change the SIM Card.
This phone supports 3V or 1.8V SIM card.
NO
YES
Voltage output of VSIM LDO
Is 2.85V?
YES
Resolder J300
Change the U102
Change the SIM Card
And try again.
Does it work
Properly?
YES
SIM card is properly working
NO Redownload SW.
Does it work
Properly?
YES
SIM card is properly working.
NO
Change the main board
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 93 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TEST POINT
Figure 4.13
1
번
3
번
TP2
SIM CONNECTOR
TP1
CIRCUIT
4
번
6
번
SIM CONNECTOR
2V85_VSIM 2V85_VSIM
R306
15K
SIM_DATA
C315
DNI
LGE Internal Use Only
J300
4
10
9
5
6
C5
C6
C7
GND4
GND3
C1
C2
C3
GND1
GND2
1
2
3
7
8
2V
TP2 2V85_VSIM
1V82
TP1
C106
1u
R308 24
SIM_RST
SIM_CLK
C314
220n
C316
22p
C317
1000p
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only - 94 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.14 KEY backlight Trouble
CHECKING FLOW
START
Are all LEDs
Working?
YES
Backlight will work properly.
NO
Check the soldering each R and LED
NO
Replace or resolder component
4. TROUBLE SHOOTING
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 95 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TEST POINT
Figure 4.14
Main PCB (Top)
TP1 TP2
Key PCB (Top)
LD1
LD300
LD2
LD301
Key PCB (Bottom)
TP3
TP4
CIRCUIT
VBAT
TP1 TP2
R309
100ohm
R310
100ohm
LD300
SWAF07
LGE Internal Use Only
LD301
SWAF07
KEY_BACKLIGHT3
VBAT
TP4 TP3
Only for training and service purposes
LGE Internal Use Only - 96 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.15 RTC Trouble
CHECKING FLOW
START
Is frequency at R109 about 32.768KHz?
YES
Is voltage at R109 about 400mV ?
YES
Is RTC properly working?
YES
RTC will work properly
NO
NO
NO
Resolder the X100 or change the X100
Resolder the X100 or change the X100
Re-download software and try again
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 97 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TEST POINT
Figure 4.15
TP2
TP1
CIRCUIT
TP1
X100
FC-135
32.768KHz
TP2
C140
22p
R109
10M
C147
22p
JTAGEN
HPMIC_DET_3.5
VBAT
CHG_ABB
BATT TEMP
C141
C142
1u
1u
(1%) R110 68K
Y1
F2
JTAGEN
TESTMODE
B18
A18
D16
B17
A21
C17
TEMP1
TEMP2
AUXADC1
AUXADC2
REF
REFOUT
A7
A8
OSCIN
OSCOUT
A15
C15
B16
A17
D19
B15
VCHG
GATEDRIVE
ISENSE
VBATSENSE
REFCHG
VATTYPE
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only - 98 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.16 Folder on/off Trouble
CHECKING FLOW
START
Is there the magnet in the Folder?
YES
Check the soldering of C145
YES
Voltage at pin 1 of U101 = 2.93V?
YES
NO
NO
NO
Open Folder.
Voltage at pin 1 of U101
=2.93V
YES
Close folder.
Voltage at pin 1 of U101
= 0V
YES
Folder on/off will work properly
NO
NO
Place the magnet properly.
Resolder C145
Voltage of VEXT at U102
= 2.93V?
YES
Resolder U101
Resolder U101
Replace U101
NO
Replace U102
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 99 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TEST POINT
Figure 4.16
TP1
TP2
CIRCUIT
LGE Internal Use Only
LGE Internal Use Only
FLIP SWITCH
2V93_VEXT
U101
EM-1681-FT
C144
1u
C145
1u
TP1
FOLDER_DET
TP2
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 100 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.17 Micro SD Trouble
CHECKING FLOW
START
Micro SD Detect
OK?
YES
NO
Check the
C662=3.3V?
YES
NO
NO
Change U102
TF_DET(R617)
Is High?
YES
Re-attach or
Replace S600
Check out MC_CLK & Data
Timing OK?
YES
Replace Micro SD Card
YES
Micro SD Card will work properly
LGE Internal Use Only
NO
Re-download SW
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 101 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TEST POINT
Figure 4.17
S600
TP1
TP2
CIRCUIT
TP2
2V93_VEXT
TP1
C662
2.2u
S600 AXA463062C02
GND
DAT1_2
DUMMY1
DAT0
VSS
CLK
VDD
CMD
CD_DAT3
DUMMY2
DAT2
DETECT_A
DETECT_B
DUMMY3
LGE Internal Use Only
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 102 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. TROUBLE SHOOTING
4.18 FM radio Trouble
CHECKING FLOW
START
Check of ear_jack condition
A condition is good?
Yes
Check Bias Voltage
2V93_VEXT at TP1
Yes
Check BT _32K at TP2
FM_Radio work is good?
FM_radio will Work properly
Replace J200
Replace U102
Replace U102
Replace M400 or
Re-download S/W
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 103 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
TEST POINT
J200
M400
TP1
CIRCUIT
TP2
2V93_VEXT 1V5_BT_LDO
BLUETOOTH
TP1
C400
0.01u
C401
15p
C402
0.1u
C403
2.2u
ANT400 GND400
C404 0.068u
C406 15p
C407 47n
FM_R
FM_L
BT_32K
26M_BT
FM_ANT
LGE Internal Use Only
TP2
C416
C409
15p
C410
15p
C413
820p
0
L402
LFB212G45BA1A220
FL400
39nH
C412
C418
15p
C411
220n
C414
R402 560
0.01u
L403
C417
47n
470nH
820p
B3
C9
K3
J2
K2
A3
A4
A5
AU_REF
SPKR_R
SPKR_L
FILT_EXT
CLK_32K
LO_REF
XTAL_OUT
XTAL_IN
B1
A1
B5
D1
FM_P
FM_N
BLUECORE5-FM
M400
Copyright © 2008 LG Electronics. Inc. All right reserved.
AUX_DAC
Only for training and service purposes
RX P
LGE Internal Use Only - 104 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. DOWNLOAD
5.1 Download
A. Download Setup
Figure 5-1 describes Download setup
5. DOWNLOAD
LGE Internal Use Only
Figure 5-1. Download Setup
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 105 LGE Internal Use Only
5. DOWNLOAD
B. Multi Download Procedure
1. Run GSM Multi Download program and select Setting
LGE Internal Use Only
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 106 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. Select Configuration from the menu and you may see this window
5. DOWNLOAD
3. Press key to select DLL file and press Open
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 107 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
4. Press key to select the mot files
5. Select AlchemyData.mot and press open
6. Repeat step 4-5 to select CodeData.mot
LGE Internal Use Only
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 108 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. Check if the ADI option is set to Hermes
8. Press OK to end Configuration
5. DOWNLOAD
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 109 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
9. Press START to execute download
10. Once downloading is started, press STOP button to keep from re-downloading after downloading is completed.
LGE Internal Use Only
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 110 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
Camera
SPK/R
CV
MIC MMI FM radio T-FLASH
KEYPAD
KEY_ROW(1:5)/COL(0
:2)
KEY_BACKLIG
HT3 KEY LED
SIDE KEY 3 ea
SIM/T-Flash
32.768KHz
KEY_ROW0/5,
KEY_COL1/2
SIM_DATA/RST/CLK,
TF_DET
BT_PCM_TX/RX/SYNC
/CLK,
BT_UART_RTS/CTS/TX
/RX,
BT_32K/INT/RESET
BT_DBB_CL
KON
VCXOE
N
CLK
ON
26M
_BT 26MHz
RF Block
PA_EN/BAND, ANT_SW1/2,
S_EN/DATA/CLK, AFC, IP/N,
QP/N, TX_RAMP, REF_SEL_26M
CHG_PPR, CHG_IND, CHG_DET,
CHG_ABB, CHG_EN, VBAT, BATT_TEMP,
VBUS_USB, USB_DET, 2V93_VEXT,
VCORE, 2V85_VSIM, 1V82_VINT, VUSB,
1V8_VRTC, 2V5_VABB, 1V88_VMEM,
1V5_VPLL, 2V75_VCXO
Power Block
ABB_INT, KEY_ROW4, nRESET
CLKOUT, CLKOUT_GATE,
EAR_PATH_SEL
Audio block
JACK_DETECT, HOOK_DETECT, I2C_SDA/SCL,
JACK_DET_3.5, MIC_SEL, HP_MIC_P/N, BB_MIC_P/N,
RCV_P/N, SPK_P/N, 2V5_VMIC, HSMICBIAS, VMIC_GND,
JACK_TYPE
AD6725
DBB,
ATLAS3HLITE
FOLDER_D
ET
GPIO_98 (USB_DET) : 0 – UART D/L, 1
– USB D/L
GPIO_99 : 0 – 13M, 1 – 26M
GPIO_113 : 0 – NOR, 1 – NAND
Hall Effect SW
VIBRATOR
VIBRATOR
MOTOR
TR
BACKUP
BATTERY
VBACKUP, LCD_BL_CTRL/ID,
SLIDE_KEY_BL_EN,
POWERKEY,
KEY_ROW(1:5)/COL3-4
Slide FPCB
MAIN LCD
LCD_
Data[0:15]/CS/RS/WR/
RESET/RD/VSYNC,
1V8_MM
MM_TF_DET,
MM_CS/WAIT,
EBUS2_RD/WR/DATA(0:1
5),
MM_RESET/CMD/LCD_BY
PASS/INT
EN_T,
I2C_S
CL/SD
A
LDO
L3907
1V2/3
V3_M
M
AIT817
TF_DATA[0:3]/CL
K/CMD,
TF_PWR_EN
CAM_D[0:7]/MCLK/
PCLK/HS/VS/RESET,
CIF_PD,
CAM_I2C_SDA/SCL
CAM_1V8/2V
8_EN LDO
MM_L/R, MM_HP_L/R,
FM_L/R, HP_MIC_P/N,
MM_MIC_P/N
Slide Key
T-FLASH
Camera
Audio block
USB_DP/DM,
GENIE_TX/RX,
USB_DET,
MM_USB_EN
SW
MM_USB_DP/D
M
IO_P6/7
DSR_DET, USC1/2, JACK_DETECT,
JACK_TYPE
DBBO
N
PWRO
N
RPWR
ON
ADD(25:0), SD_CKE, BURSTCLK, NOR_CS,
SD_CS/CLK/WE/RAS/CAS, nADV, nWAIT, nWE, nRD, nRESET, DQM0/1, DATA(00:15)
MMI
MEMORY (INTEL,)
512Mb NOR
+128Mb SDRAM
LGE Internal Use Only
JTAG USC Interface cf) USC1/2/4/5 :
UART_RX/TX/CTS/RTS
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 111 LGE Internal Use Only
LGE Internal Use Only - 112 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A A
B
C
C126
22p
1V88_VMEM 1V88_VMEM 1V88_VMEM
VCORE
C100
0.1u
C127
0.1u
C102
1u
C115 C116
C103
0.1u
22p 10u
C117
10u
VBAT
VBAT 2V93_VEXT 2V85_VSIM
2V93_VEXT
1V82_VINT
(2012)
C104
C118
10u
10u
(2012)
C119
10u
C120
10u
C121
22p
C122
22p
C123
0.1u
C105
1u
C106
1u
C107
1u
1u
C108
2V5_VMIC
REF_SEL_26M
1V8_VRTC
4.7K
R100
VBACKUP
2V93_VEXT 1V5_VPLL VBUS_USB
R101
100K
2V75_VCXO
C109
1u
C110
1u
C111
1u
C112
1u
VUSB
2V93_VEXT
2V5_VABB HSMICBIAS
C101
1u
C128
22p
C129
0.1u
C113
1u
C130
1u
2.2u
C114
D
E
F
G
H
I
X100
FC-135
32.768KHz
I2C_SDA
I2C_SCL
C140
22p
R109
10M
C147
22p
TCK
HPMIC_DET_3.5
VBAT
C149
0.1u
CHG_ABB
BATT_TEMP
ADD01
ADD02
ADD03
ADD04
ADD05
ADD06
ADD07
ADD08
ADD09
ADD10
ADD11
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21
ADD22
ADD23
KEY_COL0
KEY_COL1
KEY_COL2
KEY_COL3
KEY_COL4
2V93_VEXT
26M
KEY_ROW0
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_ROW4
SIM_DATA
SIM_CLK
BT_UART_TX
BT_UART_RX
BT_UART_CTS
BT_UART_RTS
R107
MM_TF_DET
CHG_PPR
FOLDER_DET
CHG_IND
VIBRATOR
CHG_DET
BT_PCM_CLK
BT_PCM_RX
BT_PCM_SYNC
BT_PCM_TX
TMS
TDI
TDO
47K ADD25
ADD24
LCD_BL_CTRL
TF_DET
KEY_ROW5
MM_INT
USB_DET
1V88_VMEM
LCD_ID
(MUXOUT_2) BT_32K
BT_INT
DSR_DET
CHG_EN
PA_EN
2V93_VEXT
PA_BAND
S_EN
S_DATA
S_CLK
NORMAL : DNI
JTAG ENABLE : 100 K ABB_INT
JTAGEN
VBUS_USB
CHG_ABB
ANT_SW2
ANT_SW1
C141
C142
(1%)
R110
R628
DNI
W10
AB13
AA11
KEYPADROW0
KEYPADROW1
KEYPADROW2
Y9
AB12
KEYPADROW3
KEYPADROW4
N14
SIMDATAIO
T21
SIMCLK
A5
CLKIN
N1
GPIO_0
P2
GPIO_1
P6
GPIO_2
R4
R5 GPIO_3
GPIO_4
R2
GPIO_5
T2
GPIO_6
R3
GPIO_7
T1
GPIO_8
T3
GPIO_9
U1
GPIO_10
U2
T4 GPIO_11
GPIO_12
T5
GPIO_13
V1
GPIO_14
V2
GPIO_15
U3
GPIO_16
W2
GPIO_17
V3
U4
AA1
GPIO_18
GPIO_19
GPIO_20
V4
GPIO_21
W3
GPIO_22
E9
GPIO_24
C7
GPIO_32
U5
GPIO_33
Y3
U6
Y4
GPIO_34
GPIO_35
GPIO_36
AA2
GPIO_37
W4
GPIO_38
K5
GPIO_49
L4
GPIO_50
K2
GPIO_51
L5
K1
N3
GPIO_52
GPIO_53
GPIO_54
V6
GPIO_55
AA3
GPIO_56
W5
GPIO_59
V7
GPIO_60
Y6
GPIO_61
L12
AA4
AA5
GPIO_63
GPIO_64
GPIO_65
W6
GPIO_66
AA6
AB5
GPIO_67
GPIO_68
U7
W7
GPIO_69
GPIO_70
Y7
U8 GPIO_71
GPIO_72
Y8
AB6
GPIO_73
GPIO_74
K12
GPIO_76
AA7
GPIO_78
K4
J5
J4
H4
H5
ADD2
J3
ADD3
ADD4
ADD5
H6
ADD1
ADD6
G5
ADD0
ADD7
G4
ADD8
K9
ADD9
E4
ADD10
F4
ADD11
D4
J11 ADD12
ADD13
E5
ADD14
J9
ADD15
E7
ADD16
G6
ADD17
F7
ADD18
G7
ADD19
E8
F8 ADD20
ADD21
D7
K10
ADD22
ADD23
V12
KEYPADCOL0
AB14
KEYPADCOL1
W12
KEYPADCOL2
AA12
W11 KEYPADCOL3
KEYPADCOL4
1u
1u
68K
Y1
JTAGEN
F2
TESTMODE
B18
TEMP1
A18
TEMP2
D16
AUXADC1
B17
AUXADC2
A21
REF
C17
REFOUT
A7
A8
OSCIN
OSCOUT
A15
VCHG
C15
GATEDRIVE
B16
ISENSE
A17
D19
B15
VBATSENSE
REFCHG
VATTYPE
C20
TRKCHG1
B21
TRKCHG2
A16
VUSBCHG
C16
CHGDET
G20
CHGLED
U102
AD6725-ATLAS3HLITE
NADV
NA0CS
H2
K3
NA1CS
NA2CS
NA3CS
J2
J1
L3
U21
PPI_DATA0
U20
PPI_DATA1
V20
PPI_DATA2
V21
PPI_DATA3
Y20
PPI_DATA4
Y21
PPI_DATA5
PPI_DATA6
PPI_DATA7
PPI_DATA8
Y18
Y19
PPI_DATA9
AA22
AA21
GPIO_85
AB3
Y5
GPIO_86
V5
GPIO_87
GPIO_98 V8
AB8
GPIO_99
R20
GPIO_100
AB7
GPIO_113
P12
GPIO_123
P13
GPIO_124
AA13
GPIO_141
AB15
GPIO_142
GPIO_143 AA14
AB16
GPIO_144
AA15
GPIO_145
Y13
GPIO_146
AA16
GPIO_147
Y14
GPIO_148
AB19
GPIO_149
Y16
GPIO_150
GPIO_151 AB20
Y22
GPIO_152
W20
GPIO_153
W19
GPIO_154
W21
GPIO_155
W22
GPIO_156
V13
GPIO_172
W13
GPIO_173
GPIO_174 V14
Y12
GPIO_175
Y2
GPIO_177
PPI_CLK
PPI_VSYNC
PPI_HSYNC
AA18
AA19
AA20
EB2_ADDR0
EB2_ADDR1
EB2_ADDR2
EB2_ADDR3
EB2_ADDR4
EB2_ADDR5
EB2_ADDR6
EB2_ADDR7
EB2_ADDR8
EB2_ADDR9
EB2_ADDR10
EB2_ADDR11
EB2_ADDR12
U15
U16
V17
U14
U17
V15
U19
R17
T17
U18
V16
W16
W15
EB2_NWE
EB2_NWAIT
EB2_NRD
P14
W14
V19
MC_DAT0
MC_DAT1
MC_DAT2
MC_DAT3
MC_CMD
MC_CLK
M12
P19
P17
N12
N13
R21
DATA0
DATA1
DATA2
DATA3
DATA4
DATA5
DATA6
DATA7
DATA8
DATA9
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
C3
B2
C4
B3
B4
C5
D6
A3
C6
D8
E2
E3
D2
D3
B1
C2
NLWR
NHWR
NRD
NNDWP
NWE
NWAIT
B19
PA
QN
QP
A19
IP
IN
A20
C18
C19
E1
G3
D1
P5
H3
G2
NSDCAS
NSDCS
NSDWE
NSDRAS
SCLKOUT
SDA10
NNDBUSY
NNDCS
L2
M2
M4
M5
M1
N2
N4
N5
REFBB
RESET1P8
RESET2P8
D17
J19
C9
NRESET
M3
C148 1u
DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
TX_RAMP
IP
IN
QN
QP
DQM0
DQM1 nRD nWE nWAIT
SD_CAS
SD_CS
SD_WE
SD_RAS
SD_CLK nADV
NOR_CS
JACK_TYPE
MM_USB_EN
MM_LCD_BYPASS
MIC_SEL
MM_CMD
MM_RESET
LCD_RESET
BT_RESET
EAR_PATH_SEL
2V93_VEXT nRESET nRESET
R106
USB_DET
SIM_RST
GENIE_RX
GENIE_TX
EBUS2_DATA15
EBUS2_DATA14
EBUS2_DATA13
EBUS2_DATA12
EBUS2_DATA11
EBUS2_DATA10
EBUS2_DATA09
EBUS2_DATA08
EBUS2_DATA07
EBUS2_DATA06
EBUS2_DATA05
EBUS2_DATA04
EBUS2_DATA03
EBUS2_DATA02
EBUS2_DATA01
EBUS2_DATA00
JACK_DETECT
EN_T
MM_CS
HOOK_DETECT_GPIO
RTCK
10K
EBUS2_WR
MM_WAIT
EBUS2_RD
R111 3300
J
VMIC_GND
VBAT
C154
1u
2V93_VEXT
2V5_VMIC
VCXOEN
VCXOEN
USC3
C157
39p
C158
39p
SPK_N
SPK_P
RCV_P
RCV_N
PWRON
RPWRON
1
2
D101
KDR331V
3
R117
47K
DBBON
K
HP_MIC_N
HP_MIC_P
BB_MIC_N
BB_MIC_P
C159
39p
C160
39p
C161 C162
39p 39p
BOOT CONTROL
PIN
GPIO_098
GPIO_099
GPIO_113
0
1
0
1
0
1
DOWNLOAD UART
DOWNLOAD USB
13MHz
26MHz
NOR BOOT
NAND BOOT
1V88_VMEM
ADD09
ADD10
ADD11
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD21
ADD22
ADD23
ADD24
ADD25
ADD01
ADD02
ADD03
ADD04
ADD05
ADD06
ADD07
ADD08
C137
0.1u
MEMORY
(INTEL, 512Mbit NOR + 128Mbit SDRAM)
C131
0.1u
C132
0.1u
C135
0.1u
C136
0.1u
C138
0.1u
C133
0.1u
C139
0.1u
PF38F5060M0Y0BF
D5
_ADV
F1__CE
F2__CE
F3__CE
F4__CE_A27
_WE
D__WE
K5
F_CLK
D_CLK
D__CLK
_OE
H7
G7
F__RST
H5
J9
F_WAIT
J5
E2
H6
E1
F__WP1
H3
E6
F1
F__WP2
G2
B6
F_DPD
G3
E5
N_CLE
D8
N_ALE
M2
DQ0
L1
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
L4
L5
DQ7
M4
L3
M5
DQ8
L2
L6
DQ9
K1
M6
DQ10
L7
DQ11
DQ12
DQ13
L8
K9
L9
DQ14
M8
DQ15
N_RY__BY
H1
N__RE_S__CS1
N__WE_S_CS2
G6
D_CKE
D_BA0
D_BA1
D_DM1_S__UB
D_UDQS
D_LDQS
G4
H4
D__RAS
D__CAS
F4
F3
D1__CS
F2
D2__CS
D_DM0_S__LB
E3
H9
H8
M7
M3
F6
H2
A1
DU1
A9
DU2
M1
DU3
M9
DU4
RFU
G1
J1
F_VPP
D4
F1_VCC1
D6
F2_VCC2
J4
F1_VCC3
J6
F2_VCC4
C5
D_VCC1
D3
D7 D_VCC2
D_VCC3
D2
S_VCC
J2
VCCQ1
J3
VCCQ2
J7
VCCQ3
J8
VCCQ4
C2
VSS1
C3
VSS2
C4
VSS3
C6
VSS4
C7
VSS5
C8
VSS6
K2
K3 VSS7
VSS8
K4
VSS9
K6
VSS10
K7
VSS11
K8
VSS12
U100
D1
A0
C1
A1
B1
A2
B2
F9
E9
A3
A2
B3 A4
A5
A3
A6
A4
G8
A8
F8
A7
A9
E8
A10
G9
A11
A12
A13
D9
A14
C9
A15
B9
A16
B4
A17
B5
A18
A5
A19
F7
E7 A20
A21
B7
A22
A6
A23
A7
A24
A8
A25
B8
A26
FLIP SWITCH
2V93_VEXT
U101
EM-1681-FT
C144
1u
C145
1u
FOLDER_DET
ON BOARD JTAG INTERFACE
2V93_VEXT
TCK
TDO
TDI
TMS nRESET
RTCK
JT100
VCC
GND
TCK
TDO
TDI
TMS
TX
RX
VUSBIN
URT100
3G 2.5G
GND
RX
TX
VCHAR
ON_SW
VBAT
PWR
URXD
UTXD
TX
NC1
1
GND
RX
2
3
4
5
ON_SW
6
VBAT
7
NC2
8
NC3
9
NC4
10
DSR
RTS
CTS
11
12
VBAT VCHARGE
TP100
TP101
TP102
TP103
USC1
USC2
RPWRON
USB_DM
USB_DP
DSR_DET
OJ100 OJ101
DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15 nADV
NOR_CS
BURSTCLK
SD_CLK
1V88_VMEM nRD nRESET nWAIT nWE
SD_WE
1V88_VMEM
R102
100K R103
100K
SD_CKE
ADD18
ADD19
SD_RAS
SD_CAS
SD_CS
DQM0
DQM1
ON BOARD USC INTERFACE
USC6
USC5
USC4
USC3
USC2
USC1
USC0
JT101
VCC
GND
TCK
TDO
TDI
TMS
TX
RX
L
B
C
D
E
F
G
H
J
K
L
I
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 113 LGE Internal Use Only
7. CIRCUIT DIAGRAM
LGE Internal Use Only
E
C
D
1 2 3
A
MIC_N
B
MIC_P
27p
C209
C212
27p
C206
47p
2V5_VMIC
R202
1K
C202
DNI
MIC
C201
10u
R206
2.2K
VMIC_GND
L203
100nH
C207
1u
VA204
VA205
EVLC5S0250
ICVS0505500FR
VMIC_GND
USB_DP
BB_IO_P6
MIC200
1
2
3
4
P
G1
G2
O
SPU0410HR5H-PB
USB_DET
GENIE_TX
C200
0.1u
VBAT
1
U201
DG2735DN-T1-E3
10
V+ NO2
2
NO1 COM2
9
3
COM1
4
IN1
5
NC1
IN2
8
NC2
7
GND
6
CHG_PPR
CHG_IND
CHG_EN
2V93_VEXT
VUSBIN
VCHARGE
External Charger VBAT CHG_ABB VBUS_USB
U202
1
VDC
2
VUSB
3
_PPR
4
_CHG
5
_EN
6
IMIN
ISL9221
13
PGND
12
VDC_BYP
BAT
11
USB_BYP
10
IVDC
9
8
GND
IUSB
7
C220
1u
C221
1u
C222
1u
C223
1u
C224
1u
R216
10K
R217
15K
4
USB_DET
5 6 7 8 9
3.5phi HEADSET
HP_MIC_3.5
20
R200
HPMIC_DET_3.5
VBAT
A
A
USB_DM
BB_IO_P7
USB_DET
GENIE_RX
IO_P6
IO_P7
MM_USB_DM
MM_USB_DP
1
U200
NLAS7222C
D+ S
10
2
D-
3
GND
9
VCC
_OE
8
4
HSD2HSD1+
7
5
HSD2+ HSD1-
6
HSMICBIAS
MM_USB_EN
BB_IO_P6
BB_IO_P7
JACK_DET_3.5
HSO_3.5_L
HSO_3.5_R
L200
L201
L202
100nH
120
120
C204
47p
C205
47p
VA201
0.068u
VA202 VA203
GRM36X7R683K16PT
HEADSET MIC
HP_MIC_N
R210
2.2K
C213
10u
C214
39p
2V93_VEXT
HP_MIC_3.5
HP_MIC_P
C216
39p
C217
39p
R211
20
HOOK_DETECT_GPIO
C666
0.1u
U605
5
VCC
4
VIN-
1
OUT 3 VIN+
GND
2
LMV7291MGX-NOPB
2V93_VEXT
(UART_TxD)
(UART_RxD)
USC2
USC1
2V93_VEXT
R221
100K
R223
R224
47
47
JACK_TYPE
EXT_SPK_L
EXT_SPK_R
IO_P6
IO_P7
JACK_DETECT
RPWRON
DSR_DET
R214
100K
R227
100K
R215
100K
47
R622
VBAT
VCHARGE
FB401
FB402
FB200
FB403
FB404
C208
24p
PIF-UNION
JIG PORT
UART
(18pin 16, 17)
MON PORT
DEBUG_TX/RX
(18pin 6, 7)
UART PORT
USAGE
S/W Download
/ Calibration
S/W DEBUG???
VA200 EVLC5S02100
J200
7620-3_5G-DB1-A
L210
100nH
3.5phi
FM_ANT
C215
24p
5
6
7
2
3
4
21
19
1
13
14
15
16
8
9
10
11
12
17
18
20
22
FM_ANT
ENRY0006401
HSEJ-18S04-25R
CN200
VUSBIN
C226
1u
(Reverse Type)
B
B
C
D
BATTERY
CONNNECTOR
BATT_TEMP
C229
1u
VBAT
C228
22u
C230
1u
C231
39p
1
CN201
2
3
4
CHG_ABB
R225
30K
CHG_DET
R226
30K
1 2 3 4 5
- 114 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
4 5 6 7 8 9 10
A
L_DATAOUT00
L_DATAOUT01
L_DATAOUT02
L_DATAOUT03
L_DATAOUT04
L_DATAOUT05
L_DATAOUT06
L_DATAOUT07
B
L_DATAOUT08
L_DATAOUT09
L_DATAOUT10
L_DATAOUT11
L_DATAOUT12
L_DATAOUT13
L_DATAOUT14
L_DATAOUT15
L_MAIN_LCD_CS_OUT
LCD_RESET_OUT
LCD_RS_OUT
LCD_WR_OUT
LCD_RD
LCD_ID
FPCB CONNECTOR
VBAT 1V5_CAM
22
23
24
25
17
18
19
20
21
26
27
28
29
30
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
10
CN300
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
54
53
52
51
50
49
48
47
46
60
59
58
57
56
55
27p
C300
SPK_RCV_N
SPK_RCV_P
MOTOR
LCD_BL_CTRL
LCD_VSYNC
VBACKUP
SLIDE_KEY_BL_EN
KEY_COL3
KEY_COL4
POWERKEY
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_ROW4
KEY_ROW5
C312
1u
C313
1u
C310 C311
47p 47p
LCD_CS
LCD_RESET
LCD_RS
LCD_WR
FL300
1
2
3
4
INOUT_A1
INOUT_A2
INOUT_A3
INOUT_A4
ICVE10184E050R101FR
9
INOUT_B1
INOUT_B2
INOUT_B3
6
INOUT_B4
8
7
L_MAIN_LCD_CS_OUT
LCD_RESET_OUT
LCD_RS_OUT
LCD_WR_OUT
LCD_DATA00
LCD_DATA01
LCD_DATA02
LCD_DATA03
FL301
3
4
1
INOUT_A1
2
INOUT_A2
INOUT_A3
INOUT_A4
ICVE10184E050R101FR
9
INOUT_B1 L_DATAOUT00
8
INOUT_B2 L_DATAOUT01
INOUT_B3
7
6
L_DATAOUT02
INOUT_B4 L_DATAOUT03
LCD_DATA04
LCD_DATA05
LCD_DATA06
LCD_DATA07
FL302
1
2
3
INOUT_A1
INOUT_A2
4
INOUT_A3
INOUT_A4
ICVE10184E050R101FR
9
INOUT_B1
INOUT_B2
8
7
L_DATAOUT04
L_DATAOUT05
INOUT_B3
INOUT_B4
6
L_DATAOUT06
L_DATAOUT07
LCD_DATA08
LCD_DATA09
LCD_DATA10
LCD_DATA11
FL303
3
4
1
INOUT_A1
2
INOUT_A2
INOUT_A3
INOUT_A4
ICVE10184E050R101FR
9
INOUT_B1 L_DATAOUT08
8
INOUT_B2 L_DATAOUT09
INOUT_B3
7
6
INOUT_B4
L_DATAOUT10
L_DATAOUT11
LCD_DATA12
LCD_DATA13
LCD_DATA14
LCD_DATA15
FL304
1
2
INOUT_A1
INOUT_A2
3
INOUT_A3
4
INOUT_A4
ICVE10184E050R101FR
INOUT_B1
INOUT_B2
INOUT_B3
7
6
INOUT_B4
9
8
L_DATAOUT12
L_DATAOUT13
L_DATAOUT14
L_DATAOUT15
2M F/F CAMERA CONNECTOR
CAM_D(7)
CAM_D(6)
CAM_D(5)
CAM_D(4)
CAM_D(3)
CAM_D(2)
CAM_D(1)
CAM_D(0)
5
4
D7
D6
D5
3
2
24
23
1
D2
D1
D0
22
D4
D3
1V5_CAM
C301
56p
C302
0.1u
1V8_CAM
C303
56p
C304
0.1u
S300
MCLK
RESETB
SDA
SCK
STANDBY
HSYNC
VSYNC
PCLK
7
9
10
11
12
18
19
20
2V8_CAM
C305
0.1u
C306
56p
VA300
EVLC5S02100
CAM_MCLK
CAM_RESET
CAM_I2C_SDA
CAM_I2C_SCL
CIF_PD
CAM_HS
CAM_VS
CAM_PCLK
CAM_2V8_EN
CAM_1V8_EN
CAMERA PART POWER
VBAT
C307
1u
U300
1
2
EN1
3
VIN
EN2
4
NC1
RT9011-MGPQW
8
VOUT1
VOUT2
7
6
NC2
5
GND
Discharge R
1V8_CAM 2V8_CAM
C308
1u
C309
1u
C
CN304
1
2
3
4
VOLUME
EVLC5S02100 EVLC5S02100 EVLC5S02100
VA301
VA302 VA303
KEY_ROW0
R304 680
SW300 SW301 SW302
D
KEY_ROW1
R307 680
KEY_ROW2
R311 680
KEY_ROW3
R312 680
D300
PRSB6.8C
D301
PRSB6.8C
D302
PRSB6.8C
KEY_ROW4
R313 680
D303
PRSB6.8C
E
KEY_ROW5
KEY_COL0
KEY_COL1
KEY_COL2
R314
R315
R316
R317
680
680
680
680
SW303
SW306
SW309
SW311
PRSB6.8C
D304 D305 D306
SW304
SW307
SW310
PRSB6.8C
D307
SW305
SW308
3
2
1
CN301
HOLD
3
2
1
CN303
CAMERA
R309
100ohm
LD300
SWAF07
KEY BACKLIGHT
VBAT
R310
100ohm
LD301
SWAF07
KEY_BACKLIGHT3
SIM CONNECTOR
2V85_VSIM 2V85_VSIM
SIM_DATA
R306
15K
C315
DNI
4
5
C5
C6
6
C7
10
GND4
9
GND3
J300
C1
C2
1
2
C3
GND1
GND2
3
7
8
R308 24
SIM_RST
SIM_CLK
C314
220n
C316
22p
C317
1000p
MOTOR
VIBRATOR
VIBRATOR
R305
2.2
Q300
3
Q2_C Q2_E
4
Q2_B
5
2
Q1_B
1
Q1_E Q1_C
6
VBAT
A
A
C
D
1 2 3 4 5 6 7
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 115 LGE Internal Use Only
7. CIRCUIT DIAGRAM
1
A
B
C
D
2 3 7 8 4 5 6
BLUETOOTH
2V93_VEXT 1V5_BT_LDO
L401
NA
L400
0
C400
0.01u
C401
15p
C402
0.1u
C403
2.2u
ANT400 GND400
C404 0.068u
C406 15p
C407 47n
1V5_BT_LDO
FM_R
FM_L
BT_32K
26M_BT
FM_ANT
L404
22nH
C416
C409
15p
C410
15p
C413
820p
L402 39nH
LFB212G45BA1A220
FL400
3
2
1
UB
NC_DC
NC
0
B1
G2
B2
7
5
6
C412 220n
C418
15p
C411 47n
A3
A4
A5
AU_REF
SPKR_R
SPKR_L
R402 560
C414 0.01u
B3
C9
K3
J2
K2
FILT_EXT
CLK_32K
LO_REF
XTAL_OUT
XTAL_IN
L403 470nH
C417 820p
B1
A1
FM_P
FM_N
B5
D1
E1
F1
G1
AUX_DAC
RX_N
RX_P
RF_P
RF_N
C419
1.5p
BT_INT
BT_DBB_CLKON
BT_RESET
R406
DNI
R405
47K
2V93_VEXT
BLUECORE5-FM
M400
I2C_DATA
I2C_CLK
C8
C7
USB_DN
USB_DP
UART_CTS
UART_RTS
UART_RX
UART_TX
K6
J7
H6
H5
K7
J8
PCM2_CLK
PCM2_SYNC
PCM2_IN
PCM2_OUT
D9
D10
E10
D8
PCM_CLK
PCM_SYNC
PCM_IN
PCM_OUT
H9
J10
K8
H7
R404
2.2
C420
2.2u
2V93_VEXT
FB400
C421
2.2u
BT_UART_RTS
BT_UART_CTS
BT_UART_TX
BT_UART_RX
BT_PCM_CLK
BT_PCM_SYNC
BT_PCM_TX
BT_PCM_RX
9 10
A
B
C
D
E
LGE Internal Use Only
1 2 3 4 5
- 116 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
GND500 ANT500
C500
1.5p
C502
0.5p
L509
1nH
L510
10nH
GRS300-2S-H36-E3000 SW500
C510
22p
L500
100nH
10
11
7
8
9
3
4
5
6
1
2
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
ANT
GND10
U501
SKY77523
VPC
VBATT
VSUP
BS0
BS1
PAC_EN
TR_EN
SAT_DET
COUP
GND16
GND17
28
27
26
25
24
23
22
21
31
30
29
VBAT
R502
R503
68
68
R508
18
R509
220
R510
220
C518
DNI
C519
39p
C520
22u
DCS
PCS
L505
L506
2.7nH
1.2nH
GSM850 L507
EGSM L508
1.5nH
3.3nH
ANT_SW2
ANT_SW1
PA_EN
PA_BAND
(GPIO_060)
(GPIO_070)
REF_SEL_26M
IP
IN
C505
39p
C511
0.1u
C501
39p
C512
0.1u
3
4
5
6
1
2
9
10
7
8
I
IB
VSUP_BBI
REF_SEL
SEL_26M
VLDO3_DRV
TXOP_LO
TXOP_HI
VLDO3_VCO
VBAT1
U500
AD6546
Q
QB
SCLK
SDATA
SEN
VDD
REF_OP
REFIN
REFINB
VSUP_REF
30
29
28
27
26
25
24
23
22
21
C503
100p
2V75_VCXO
C504
0.1u
2V93_VEXT
C507
39p
QP
QN
S_CLK
S_DATA
S_EN
(GPIO_074)
(GPIO_073)
(GPIO_072)
4
X501
3
1 2 DSX321G-26M
26MHz
TX_RAMP
C522
220p
VBAT C521
1u
C517
0.1u
C523
0.1u
C524
1u
PCS DCS
C533
DNI
R511 1K
AFC
EGSM
C509 1000p
GSM850
2V93_VEXT
Q2_E
4
5
Q2_B
6
Q1_C
Q500
Q2_C
3
Q1_B
2
Q1_E
1
2
X500
GND VCC
4
1
NC OUT
3
26MHz
TG-5010LH-87N
C506
1u
BT_DBB_CLKON
C508
33p
26M_BT
26M
2
3
4
1
FL500
IN_1842_5
SAWEN1G84CN0F00
OUT_1842_5_1
7
OUT_1842_5_2
OUT_1960_1
6
9
IN_1960 OUT_1960_2
8
GND1
GND2
GND3
GND4
5
10
2
3
4
FL501 SAWEN881MCN0F00
IN_881_5 OUT_881_5_1
OUT_881_5_2
1
IN_942_5
OUT_942_5_1
OUT_942_5_2
7
6
9
8
GND1
GND2
GND3
GND4
5
10
GSM850 RX
EGSM900 RX
DCS1800 RX
PCS1900 RX
GSM/EGSM TX
DCS/PCS TX
ANT_SW1
L
L
H
H
L
H
ANT_SW2
L
H
L
H
H
H
PA_EN
L
L
L
H
L
H
PA_BAND
H
H
H
H
H
H
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 117 LGE Internal Use Only
7. CIRCUIT DIAGRAM
LGE Internal Use Only
MM_CS
EBUS2_RD
EBUS2_WR
MM_RESET
EBUS2_DATA00
EBUS2_DATA01
EBUS2_DATA02
EBUS2_DATA03
EBUS2_DATA04
EBUS2_DATA05
EBUS2_DATA06
EBUS2_DATA07
EBUS2_DATA08
EBUS2_DATA09
EBUS2_DATA10
EBUS2_DATA11
EBUS2_DATA12
EBUS2_DATA13
EBUS2_DATA14
EBUS2_DATA15
C630 33p
MM_INT
MM_LCD_BYPASS
MM_CMD
MM_WAIT
CAM_RESET
CAM_1V8_EN
CAM_2V8_EN
CAM_I2C_SDA
CAM_I2C_SCL
1V8_CAM
D2
D1
D4
C3
_PHCS
_PHRD
_PHWE
_PRST
F6
H1
F7
G5
H2
H3
J1
H4
G1
F4
G2
F5
F1
F2
E5
E3
E2
E1
PHD0
PHD1
PHD2
PHD3
PHD4
PHD5
PHD6
PHD7
PHD8
PHD9
PHD10
PHD11
PHD12
PDH13
PHD14
PHD15
PHLCD16
PHLCD17
G6
J2
J3
H5
J4
PHLCD_BY
PHLCD_A0
_PHLCD2_CS
PHINT
_PHWAIT
C1
PMCLK
E11
D12
C11
PI2S_SCK
PI2S_WS
C12
B12
PI2S_SDO
PI2S_SDI
PI2S_MCLK
CAMCORDING MIC SWITCH
2V5_VMIC
MM_MIC_P
MIC_P
MIC_SEL
BB_MIC_P
C661
0.1u
1
U604
DG2735DN-T1-E3
10
V+ NO2
2
NO1
3
COM1
COM2
9
4
IN1
IN2
8
7
NC2
5
NC1 GND
6
MM_MIC_N
MIC_N
MIC_SEL
BB_MIC_N
1V2_MM
MULTIMEDIA IC
2V93_VEXT
2V93_VEXT 1V8_MM
1V8_MM_AUDIO
1V8_MM 1V2_MM
1V8_MM 3V3_MM 3V3_MM 2V93_VEXT
C600 C601 C602
0.1u
0.1u
0.1u
C603
0.1u
C604
0.1u
C605 C606
0.1u
1u 1u 1u 1u 1u 1u 1u 1u 1u 1u 1u
U602
AIT817
SUB PMIC
VBAT VBAT VBAT VBAT VBAT VBAT VBAT
TF_DATA1
TF_DATA0
TF_CLK
TF_CMD
TF_DATA3
TF_DATA2
TF_DET
PAU_LIN
PAU_LIP
PAU_RIN
PAU_RIP
PAUXL
PAUXR
PVREF
PAU_LOUT2
PAU_LOUT
PAU_ROUT
PAU_ROUT2
NC1
NC2
NC3
H11
H12
G9
H10
G11
G10
G12
F10
F11
F12
E12
C634
C628
C629
C624
C625
C626
1u
1u
C627
FM_L
FM_R
220u
C635
1u
1u
1u
1u
220u
G8
F8
H9
XSCI
XSCO
PUSBDP
PUSBDN
RREF
A4
A3
A2
A1
B2 R604 12K
MM_MIC_N
MM_MIC_P
HP_MIC_N
HP_MIC_P
R629
C637
C631
MM_L
15p
470K
10u
MM_R
C636 15p
X600
12MHz
DSX321G(12MHz,8PF)
MM_USB_DP
MM_USB_DM
PLCD10
PLCD11
PLCD12
PLCD13
PLCD14
PLCD15
PLCD16
PLCD17
PLCD0
PLCD1
PLCD2
PLCD3
PLCD4
PLCD5
PLCD6
PLCD7
PLCD8
PLCD9
_PLCD_WE
PLCD_A0
_PLCD_RD
_PLCD1_CS
_PLCD2_CS
K11
K12
M12
L11
L12
L9
K9
K10
M9
L10
M10
J10
J11
M11
J7
L7
M7
M8
L8
L6
J6
H6
M6
R607
10K
LCD_WR
LCD_RS
LCD_RD
LCD_CS
LCD_DATA00
LCD_DATA01
LCD_DATA02
LCD_DATA03
LCD_DATA04
LCD_DATA05
LCD_DATA06
LCD_DATA07
LCD_DATA08
LCD_DATA09
LCD_DATA10
LCD_DATA11
LCD_DATA12
LCD_DATA13
LCD_DATA14
LCD_DATA15
T-FLASH
3V3_MM
S
SI1305-E3
Q600
D
G
C664
51
C665
51
MM_HP_L
MM_HP_R
EARPHONE PATH SWITCH
TF_PWR_EN
MM_HP_R
HSO_3.5_R
EAR_PATH_SEL
HP_ROUT
1V8_MM_AUDIO
C640
0.1u
1
U601
DG2735DN-T1-E3
10
V+ NO2
2
NO1 COM2
9
3
COM1
4
IN1
5
NC1
IN2
NC2
GND
8
7
6
C641
27p
C642
27p
MM_HP_L
HSO_3.5_L
EAR_PATH_SEL
HP_LOUT
EN_T
I2C_SCL
I2C_SDA
C619 C620 C621
1u 1u 1u
B3
EN_LDO1
A3
EN_LDO2
D4
EN_SW1
D2
EN_SW2
C4
EN_T
B2
C2
SCL
SDA
U600
LP3907TLX
C617
10u
C618
10u
C622
1u
C623
1u
SW1
FB1
D5
E4
SW2
FB2
D1
E2
LDO1
A2
LDO2
A4
NPOR
C3
L600 2.2uH
L601 2.2uH
10u
C632
10u
C633
C638
470n
C639
470n
MM_R
FM_R
FM_L
MM_L
C649 1u
C650
C651
1u
1u
C652 1u
VBAT
SPK_P
RCV_P
RCV_N
SPK_N
AUDIO AMP
EUSY0360201
2V93_VEXT
C643 1u
C646 1u
C647 1u
C648 1u
I2C_SDA
I2C_SCL
EXT_SPK_R
EXT_SPK_L
E1
MONO_IN+
D1
MONO_IN-
C2
RIN
C1
LIN
C3
BYPASS
A1
B2
B3
I2CVDD
SDA
SCL
U603
LM49150TLX
C644
1u
C645
0.1u
MONO+
A4
MONO-
A3
ROUT
E2
LOUT
E3
VO_LDO
D2
C653
0.1u
C654
2.2u
C655
2.2u
C656
2.2u
C657
0.1u
C658
2.2u
C659
27p
C660
27p
1V2_MM
1V8_MM_AUDIO
1V8_MM
3V3_MM
SPK_RCV_P
SPK_RCV_N
HP_ROUT
HP_LOUT
R623
30
2V93_VEXT
C662
2.2u
S600 AXA463062C02
GND
DAT1_2
DUMMY1
DAT0
VSS
CLK
VDD
CMD
CD_DAT3
DUMMY2
DAT2
DETECT_A
DETECT_B
DUMMY3
- 118 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM
E
D
4 1 2 3
ZIP CONN (0.85t)
2V8_LCD
A
B
MLCD_RESET
MLCD_VSYNC
MLCD_RD
MLCD_WR
MLCD_RS
MLCD_CS
EVLC18S02015
VA1
MLED
LED_CA1
LED_CA2
LED_CA3
LED_CA4
LCD_ID
R102 100ohm
CN102
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
C100
18p
C101
1u
C
MLCD_DATA(15)
MLCD_DATA(14)
MLCD_DATA(13)
MLCD_DATA(12)
MLCD_DATA(11)
MLCD_DATA(10)
MLCD_DATA(9)
MLCD_DATA(8)
MLCD_DATA(7)
MLCD_DATA(6)
MLCD_DATA(5)
MLCD_DATA(4)
MLCD_DATA(3)
MLCD_DATA(2)
MLCD_DATA(1)
MLCD_DATA(0)
CHARGE PUMP
VBAT
MLCD_DATA(0)
MLCD_DATA(1)
MLCD_DATA(2)
MLCD_DATA(3)
MLCD_DATA(4)
MLCD_DATA(5)
MLCD_DATA(6)
MLCD_DATA(7)
MLCD_DATA(8)
MLCD_DATA(9)
MLCD_DATA(10)
MLCD_DATA(11)
MLCD_DATA(12)
MLCD_DATA(13)
MLCD_DATA(14)
MLCD_DATA(15)
MLCD_CS
MLCD_RESET
MLCD_RS
MLCD_WR
MLCD_RD
LCD_ID
LCD_BL_CTRL
R115
100K
1V5_CAM
2V8_LCD
FB101
15
14
13
12
11
LDO1
LDO2
BYP
NC3
SWIF
U100
PGND
SC624ULTRT
C2-
NC1
BL1
BL2
1
2
3
4
5
C108
22n
C103
2.2u
C109
2.2u
FB100
C105
2.2u
MLED
LED_CA1
LED_CA3
LED_CA2
LED_CA4
5 6 7 8 9 10
30
31
32
33
34
26
27
28
29
38
39
40
41
35
36
37
47
48
49
50
42
43
44
45
46
13
12
11
10
9
8
7
16
15
14
4
3
2
6
5
1
CN103
21
20
19
18
17
25
24
23
22
VBAT
1V5_CAM VBAT
D1
MSMF05C-P
D2 MSMF05C-P
BACK-UP BATTERY
VBACKUP
BAT100
SLIDE_KEY_BL_EN
LCD_BL_CTRL
MLCD_VSYNC
VBACKUP
SLIDE_KEY_BL_EN
KBC(3)
KBC(4)
POWERKEY
KBR(1)
KBR(2)
KBR(3)
KBR(4)
KBR(5)
END KEY
POWERKEY
R106 680
SLIDE KEY
END
SEND S_RIGHT
KBR(1)
R103 680
MUSIC CLEAR
KBR(2)
R104 680
S_OK S_LEFT
KBR(3)
R105
680
KBR(4)
R111 680
S_UP S_DOWN
S_MENU_LEFT S_MENU_RIGHT
D
C
B
KBR(5)
KBC(3)
KBC(4)
R112 680
R113 680
R114 680
A
3 4 5 1
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2
- 119 LGE Internal Use Only
7. CIRCUIT DIAGRAM
B
D
1
MLCD_DATA(0)
MLCD_DATA(1)
MLCD_DATA(2)
MLCD_DATA(3)
MLCD_DATA(4)
MLCD_DATA(5)
MLCD_DATA(6)
MLCD_DATA(7)
MLCD_DATA(8)
MLCD_DATA(9)
MLCD_DATA(10)
MLCD_DATA(11)
MLCD_DATA(12)
MLCD_DATA(13)
MLCD_DATA(14)
MLCD_DATA(15)
MLCD_CS
MLCD_RESET
MLCD_RS
MLCD_WR
MLCD_RD
LCD_ID
2 3
FPCB CONNECTOR
4 5 6
19
20
21
22
15
16
17
18
23
24
25
26
27
28
29
30
4
5
6
7
8
9
10
11
12
13
14
1
2
3
CN103
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
36
35
34
33
32
31
42
41
40
39
38
37
VBAT 1V5_CAM
SPK_RCV_N
SPK_RCV_P
MOTOR
LCD_BL_CTRL
MLCD_VSYNC
VBACKUP
SLIDE_KEY_BL_EN
KBC(3)
KBC(4)
POWERKEY
KBR(1)
KBR(2)
KBR(3)
KBR(4)
KBR(5)
TP1 TP2
TP3 TP4
SPK_RCV_P
SPK_RCV_N
Audio Filter & PAD
C100
100p
C103
47p
C104
47p
VA100 VA101
CN102
1
2
EMS1812TVC1P
SUSY0027501
7 8 9
MLCD_DATA(0)
MLCD_DATA(1)
MLCD_DATA(2)
MLCD_DATA(3)
MLCD_DATA(4)
MLCD_DATA(5)
MLCD_DATA(6)
MLCD_DATA(7)
MLCD_DATA(8)
MLCD_DATA(9)
MLCD_DATA(10)
MLCD_DATA(11)
MLCD_DATA(12)
MLCD_DATA(13)
MLCD_DATA(14)
MLCD_DATA(15)
MLCD_CS
MLCD_RESET
MLCD_RS
MLCD_WR
MLCD_RD
LCD_ID
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
6
5
4
3
9
8
7
2
1
CN105
37
38
39
40
41
32
33
34
35
36
45
46
47
48
42
43
44
49
50
26
27
28
29
30
31
1V5_CAM VBAT
LCD_BL_CTRL
MLCD_VSYNC
VBACKUP
SLIDE_KEY_BL_EN
KBC(3)
KBC(4)
POWERKEY
KBR(1)
KBR(2)
KBR(3)
KBR(4)
KBR(5)
MOTOR
Vibrator PAD
L100
100nH
C101
2.2u
VA102
VB100
1
MVMF-A300M2
2
SJMY0007104
EVLC18S02015
10
LGE Internal Use Only
1 2 3 4 5
- 120 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA Pin Map
8. BGA Pin Map
T
U
P
R
K
L
M
N
V
W
Y
AA
AB
G
H
J
E
F
C
D
A
B
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
U102
BB CHIP (AD6725)
USED
NOT USED
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 121 LGE Internal Use Only
8. BGA Pin Map
E
D
G
F
C
B
A
K
J
M
L
H
1 2 3 4 5 6 7 8 9 10 11 12
U602
MULTIMEDIA CHIP
USED
NOT USED
LGE Internal Use Only - 122 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
8. BGA Pin Map
K
L
M
H
J
F
G
C
D
E
A
B
1 2 3 4 5 6 7 8 9
U100
MEMORY
USED
NOT USED
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 123 LGE Internal Use Only
8. BGA Pin Map
M400
BT+FM RAIO CHIP
USED
NOT USED
LGE Internal Use Only - 124 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT
CN304
SIDEKEY-VOL
-No Volume up/down
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LD300, LD301
KEY LED
-No LED On
- 125 -
U101
FLIP SWITCH
-No SLIDE UP/DOWN
Recognition
CN301
SIDEKEY-HOLD
-No HOLD
CN303
SIDEKEY-CAMERA
-No CAMERA MODE
LGE Internal Use Only
9. PCB LAYOUT
LGE Internal Use Only
CN200
18pin CON.
-No CHARGING
M400
BT+FM Radio CHIP
-No BT, FM Radio On
U602
Multimedia Chip
-No Camera On,
-Cant’ playing a MP3
U100
MEMORY
-No Power On
U102
BB CHIP
-No Power On
X500
26MHz X-TAL
-No BT, FM Radio On
X501
26MHz X-TAL
-No Power On
U501
TX Power Amp Module
-No TX Power
-No Service
FL500, FL501
SAW FILTER
-Can’t make a call
-No Service
CN300
Board To Board CON.
- No LCD On
- 126 -
J200
3.5pi EARMIC CON.
- No EARMIC MODE
S300
CAMERA SOCKET
- No CAMERA On
J300
SIM SOCKET
- No SIM Recognition
S600
T-FALASH SOCKET
-Can’t read or write a T-FLASH Memory
U500
TRANSCEIVER
-Can’t make a call
-No Service
CN201
BATTERY CON.
-No Power On
MIC200
MIC
-No Sending
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT
LD1, LD2
KEY LED
-No LED On
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 127 LGE Internal Use Only
9. PCB LAYOUT
LGE Internal Use Only
CN102
LCD CON.
-No LCD On
BAT100
BACKUUP Battery
-RTC Is not working well.
U100
CHARGE PUMP
-No LCD On
- 128 -
CN103
Board to Board CON.
- No LCD ON
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
9. PCB LAYOUT
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 129 LGE Internal Use Only
9. PCB LAYOUT
LGE Internal Use Only - 130 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. ENGINEERING MODE
10. ENGINEERING MODE
A. About Engineering Mode
Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset.
B. Access Codes
The key sequence for switching the engineering mode on is 277634#*#. Pressing END will switch back to non-engineering mode operation.
C. Key Operation
Use Up and Down key to select a menu and press ‘select’ key to progress the test. Pressing ‘back’ key will switch back to the original test menu.
D. Engineering Mode Menu Tree
Engineering
Mode
①
BB Test
②
RF Test
③
MF Mode
④
Trace option
⑤
Call Timer
⑥
Fact.
Reset
① CAMERA
② LCD
③
Backlight
④ Buzzer
⑤ Vibrator
⑥ ADC
⑦ Battery
⑧ Audio
⑨ DAI
⑩ Bluetooth
① SAR Test
① All Auto Test
② Backlight
③ Buzzer
④
Vibrator
⑤ LCD
⑥ Key PAD
⑦ MicSpkTest
⑧ Camera
⑨ Video Camera
① UART On
② UART Off
③ Bluetooth on
④ Bluetooth off
① All Calls
② Reset
⑦
S/W
Version
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 131 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
10. ENGINEERING MODE
10.1 BB Test [MENU 1]
10.1.1 CAMERA
This menu is to test the Camera.
1) Main LCD preview : It shows the picture on Main LCD.
10.1.2 LCD
1)
2)
COLOUR : WHITE, RED, GREEN, BLUE, BLACK
Contrast Value
10.1.3 Backlight
This menu is to test the LCD Backlight and Keypad EL Backlight.
1) Backlight on : LCD Backlight and Keypad EL Backlight light on at the same time.
2) Backlight off : LCD Backlight and Keypad EL Backlight light off at the same time.
3) Backlight value : This controls brightness of Backlight. When entering into the menu, the present backlight-value in the phone is displayed. Use Left/Right key to adjust the level of brightness. The value of the brightness set at last will be saved in the NVRAM.
10.1.4 Buzzer
This menu is to test the melody sound.
1) Melody on : Melody sound is played through the speaker.
2) Melody off : Melody sound is off.
10.1.5 Vibrator
This menu is to test the vibration mode.
1) Vibrator on : Vibration mode is on.
2) Vibrator off : Vibration mode is off.
LGE Internal Use Only
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 132 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. ENGINEERING MODE
10.1.6 ADC (Analog to Digital Converter)
This displays the value of each ADC.
1) MVBAT ADC : Main Voltage Battery ADC
2) AUX ADC : Auxiliary ADC
3) TEMPER ADC : Temperature ADC
10.1.7 BATTERY
1) Bat Cal : This displays the value of Battery Calibration. The following menus are displayed in order : BAT_LEV_4V, BAT_LEV_3_LIMIT, BAT_LEV_2_LIMIT,
BAT_LEV_1_LIMIT, BAT_IDLE_LI MIT, BAT_INCALL_LIMIT,
SHUT_DOWN_VOLTAGE, BAT_RECHARGE_LMT
2) TEMP Cal : This displays the value of Temperature Calibration. The following menus are displayed in order : TEMP_HIGH_LIMIT, TEMP_HIGH_RECHARGE_LMT,
TEMP_LOW_RECHARGE_LMT, TEMP_LOW_LIMIT
10.1.8 Audio
This is a menu for setting the control register of Voiceband Baseband Codec chip.
Although the actual value can be written over, it returns to default value after switching off and on the phone.
1) VbControl1 : VbControl1 bit Register Value Setting
2) VbControl2 : VbControl2 bit Register Value Setting
3) VbControl3 : VbControl3 bit Register Value Setting
4) VbControl4 : VbControl4 bit Register Value Setting
5) VbControl5 : VbControl5 bit Register Value Setting
6) VbControl6 : VbControl6 bit Register Value Setting
10.1.9 DAI (Digital Audio Interface)
This menu is to set the Digital Audio Interface Mode for Speech Transcoder and
Acoustic testing.
1) DAI AUDIO : DAI audio mode
2) DAI UPLINK : Speech encoder test
3) DAI DOWNLINK : Speech decoder test
4) DAI OFF : DAI mode off
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 133 LGE Internal Use Only
10. ENGINEERING MODE
10.2 RF Test [MENU 2]
10.2.1 SAR test
This menu is to test the Specific Absorption Rate.
1) SAR test on : Phone continuously process TX only. Call-setup equipment is not required.
2) SAR test off : TX process off
10.3 MF mode [MENU 3]
This manufacturing mode is designed to do the baseband test automatically. Selecting this menu will process the test automatically, and phone displays the previous menu after completing the test.
10.3.1 All auto test
LCD, Backlight, Vibrator, Buzzer, Key Pad, Mic&Speaker,
10.3.2 Backlight
LCD Backlight is on for about 1.5 seconds at the same time, then off.
10.3.3 Buzzer
This menu is to test the volume of Melody. It rings in the following sequence. Volume 1,
Volume 2, Volume 3, Volume 0 (mute), Volume 4, Volume 5.
10.3.4 Vibrator
Vibrator is on for about 1.5 seconds.
10.3.5 LCD
1)LCD
Main LCD screen resolution tests horizontally and vertically one by one and fills the screen.
10.3.6 Key pad
When a pop-up message shows ‘Press Any Key’, you may press any keys including side keys, but not [Soft2 Key]. If the key is working properly, name of the key is displayed on the screen. Test will be completed in 15 seconds automatically.
LGE Internal Use Only
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 134 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
10. ENGINEERING MODE
10.3.7 MicSpk Test
The sound from MIC is recorded for about 3 seconds, then it is replayed on the speaker automatically.
10.3.8 Camera Test
This menu is to test camera(preview and capture automatically.)
10.3.9 Video Camera Test
This menu is to test video camera(record and play automatically.)
10.4 Trace option [MENU 4]
This is NOT a necessary menu to be used by neither engineers nor users.
10.5 Call timer [MENU 5]
This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing.
1) All calls : This displays total conversation time. User cannot reset this value.
2) Reset settings : This resets total conversation time to this, [00:00:00].
10.6 Fact. Reset [MENU 6]
This Factory Reset menu is to format data block in the flash memory and this procedure set up the default value in data block.
Attention
① Fact. Reset (i.e.Factory Reset) should be only used during the Manufacturing process.
② Servicemen should NOT progress this menu, otherwise some of valuable data such as
Setting value, RF Calibration data, etc. cannot be restored again.
10.7 S/W version
This displays software version stored in the phone.
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 135 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. STAND ALONE TEST
11. STAND ALONE TEST
11.1 Introduction
This manual explains how to examine the status of RX and TX of the model.
A. Tx Test
TX test - this is to see if the transmitter of the phones is activating normally.
B. Rx Test
RX test - this is to see if the receiver of the phones is activating normally.
11.2 Setting Method
A. COM port
a. Move your mouse on the “Connect” button, then click the right button of the mouse and select “Com setting”.
b. In the “Dialog Menu”, select the values as explained below.
- Port : select a correct COM port
- Baud rate : 38400
- Leave the rest as default values
B. Tx
1. Selecting Channel
- Select one of GSM or DCS Band and input appropriate channel.
2. Selecting APC a. Select either Power level or Scaling Factor.
b. Power level
- Input appropriate value GSM (between 5~19) or DCS (between 0~15) c. Scaling Factor
- A ‘Ramp Factor’ appears on the screen.
- You may adjust the shape of the Ramp or directly input the values.
C. Rx
1. Selecting Channel
- Select one of GSM or DCS Band and input appropriate channel.
2. Gain Control Index (0~ 26) and RSSI level
- See if the value of RSSI is close to -16dBm when setting the value between 0 ~ 26 in Gain
Control Index.
- Normal phone should indicate the value of RSSI close to -16dBm.
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only - 136 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
11.3 Means of Test
a. Select a Open COM port b. Set the Test band and channel c. Set the Burst Mode d. Set the Burst Type e. Press the Send Setup to Target
11. STAND ALONE TEST
Figure 11-1. HW test program
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 137 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
11. STAND ALONE TEST
Figure 11-2. HW test setting
LGE Internal Use Only
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 138 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
12. RF Calibration
12. RF Calibration
12.1 Overview
RF Calibration is the PC side Calibration tool that perform Tx, Rx and Battery Calibration with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable Power supply).
Auto-cal generates calibration data by communicating with phone and measuring equipment then write it into calibration data block of flash memory in GSM phone.
4. 0
0
0
V0. 00 A
00
12.2 Procedure
1. Copy the file to C:\Cm_Gsm_Multi
2. Copy the files of((Windows XXX)MFCD DLL, vsflex7l_ocx_regist to C:\Cm_Gsm_Multi\dll,ocx
3. Select MFCD DLL of your computer OS
4. Click on “vsflex7l_ocx_regist”
5. Click on “Multi_HK reg”
6. Connect as Fig 12-2 (RS232 serial cable is connected between COM port of PC, in general.)
7. Run HK_30exe to start calibration.
8. Click “Logic Operation” of “SETTING” menu bar
9. Set PORT (using RS232 cable) that
PC can communicate with the phone
10. Select “LOGIC MODE” that you want Logic mode:
1-> Calibration only
2-> Auto test only
3-> Cal & Auto
LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 139 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
12. RF Calibration
11. Select the model name “GM210”
12. Click “Start” button
Model Name Start button
12.3 AGC
This procedure is for Rx calibration.
In this procedure, We can get RSSI correction value.
Set band EGSM and press Start button the result window will show correction values per every power level and gain code and the same measure is performed per every frequency.
12.4 APC
This procedure is for Tx calibration.
In this procedure you can get proper scale factor value and measured power level.
12.5 ADC
This procedure is for battery calibration.
You can get main Battery Config Table and temperature Config Table will be reset.
LGE Internal Use Only
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 140 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
13.1 EXPLODED VIEW
55
23
37
1
2
3
6
7
8
9
38
56
57
12 13
15
58
16
59
18
4
5
27
28
29 34
63
10
19
20
22
11
39
21
60
62
14
40
41 42
61
17
43
44
45
33
52
47
46
48
51
53
54
24
49
50
30
31
32
35
36
26
25
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 141 LGE Internal Use Only
ASS’Y EXPLODED VIEW
LGE Internal Use Only
A
B
C
D
E
F
G
H
I
J
D
C
F
E
B
A
K
J
I
H
G
K
- 142 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
13.2 Replacement Parts
<Mechanic component>
Level
Location
No.
2 APEY00 PHONE
Description Part Number
APEY0729601
3
4
4
4
4
4
5
5
5
5
5
5
4
4
3
4
4
4
5
5
ACGM00 COVER ASSY,REAR
MCCE00 CAP,RECEPTACLE
MCCF00 CAP,MOBILE SWITCH
MCCG00 CAP,MULTIMEDIA CARD
MCJN00 COVER,REAR
MDAD00 DECO,CAMERA
MDAD00 DECO,CAMERA
MPBT00 PAD,CAMERA
MTAA00 TAPE,DECO
MTAA01 TAPE,DECO
MTAK00 TAPE,CAMERA
MWAE00 WINDOW,CAMERA
MHGF00 HOLDER,MIKE
MPBF01 PAD,FLEXIBLE PCB
ACGQ00 COVER ASSY,SLIDE
ABGF00 BUTTON ASSY,MAIN
ABGG00 BUTTON ASSY,SUB
ACGK00 COVER ASSY,FRONT
MBJL00 BUTTON,SIDE
MBJL01 BUTTON,SIDE
Note : This Chapter is used for reference, Part order is ordered
by SBOM standard on GCSC
ACGM0124801
MCCE0049601 COMPLEX, (empty), , , , ,
MCCF0062401 COMPLEX, (empty), , , , ,
MCCG0017301 COMPLEX, (empty), , , , ,
MPBF0037601 COMPLEX, (empty), , , , ,
ACGQ0038001
ABGF0010401
ABGG0008501
ACGK0126301
MBJL0072601 COMPLEX, (empty), , , , ,
MBJL0072901 COMPLEX, (empty), , , , ,
Spec
MCJN0094501 MOLD, PC LUPOY SC-1004A, , , , ,
MDAD0042201 COMPLEX, (empty), , , , ,
MDAD0042301 COMPLEX, (empty), , , , ,
MPBT0067901 COMPLEX, (empty), , , , ,
MTAA0174501 COMPLEX, (empty), , , , ,
MTAA0191101 COMPLEX, (empty), , , , ,
MTAK0019801 COMPLEX, (empty), , , , ,
MWAE0042201 CUTTING, PMMA MR 200, 0.8, , , ,
MHGF0006101 MOLD, Silicone Rubber K-770, , , , ,
Color
COLOR
UNFIXED
BLACK
Without
Color
BLACK
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
Without
Color
Without
Color
Without
Color
Without
Color
WITHOUT
COLOR
Without
Color
Without
Color
WITHOUT
COLOR
YELLOW
BLACK
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
Remark
J
52
51
42
41
43
33
44
45
49
46
G, 25
B, 10
H
31
30
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 143 LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
5
Description
MBJL02 BUTTON,SIDE
5
5
5
5
MGDA00 GUIDE,LEFT
MGDB00 GUIDE,RIGHT
MIDZ00 INSULATOR
MMAA MAGNET,SWITCH
5 MPBJ00 PAD,MOTOR
Part Number
MBJL0072801 COMPLEX, (empty), , , , ,
Spec
5
5
5
4
5
6
5
MCJK00 COVER,FRONT
MICA00 INSERT,FRONT
MDAG00 DECO,FRONT
MIDZ00 INSULATOR
MIDZ01 INSULATOR
ACGR00
COVER
ASSY,SLIDE(LOWER)
MCJV00 COVER,SLIDE(LOWER)
MCJK0097501 MOLD, PC LUPOY SC-1004A, , , , ,
MICA0021701 CUTTING, Bs, , , , ,
MDAG0043001 MOLD, POM LUCEL N109-LD, , , , ,
MIDZ0199601 COMPLEX, (empty), , , , ,
MIDZ0199501 COMPLEX, (empty), , , , ,
ACGR0018301
MCJV0018201 MOLD, PC LUPOY SC-1004A, , , , ,
MGDA0015801 MOLD, POM LUCEL N109-LD, , , , ,
MGDB0010301 MOLD, POM LUCEL N109-LD, , , , ,
MIDZ0216201 COMPLEX, (empty), , , , ,
MMAA0010401 COMPLEX, (empty), , , , ,
MPBJ0059901 COMPLEX, (empty), , , , ,
MPBU0049701 COMPLEX, (empty), , , , , 5 MPBU00 PAD,CONNECTOR
5
5
4
5
6
5
MSGB00 STOPPER,HINGE
MTAA00 TAPE,DECO
ACGS00
COVER
ASSY,SLIDE(UPPER)
MCJW00 COVER,SLIDE(UPPER)
MICA00 INSERT,FRONT
MDAP00 DECO,SLIDE(UPPER)
MSGB0030601
MTAA0182801
ACGS0025501
MOLD, Urethane Rubber S190A, , , , ,
COMPLEX, (empty), , , , ,
MCJW0023401 MOLD, PC LUPOY SC-1004A, , , , ,
MICA0021701 CUTTING, Bs, , , , ,
MDAP0005001 CUTTING, PMMA HI835M, , , , ,
5
5
5
5
MPBG00
MPBG01
MPBN00
MTAA00
PAD,LCD
PAD,LCD
PAD,SPEAKER
TAPE,DECO
MPBG0086201 COMPLEX, (empty), , , , ,
MPBG0094201 COMPLEX, (empty), , , , ,
MPBN0065601 COMPLEX, (empty), , , , ,
MTAA0174401 COMPLEX, (empty), , , , ,
LGE Internal Use Only
SILVER
Without
Color
Without
Color
Without
Color
WITHOUT
COLOR
YELLOW
WITHOUT
COLOR
WITHOUT
COLOR
Silver
WITHOUT
COLOR
Without
Color
WITHOUT
COLOR
Without
Color
Without
Color
GREEN
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
Color
Without
Color
WITHOUT
COLOR
Silver
WITHOUT
COLOR
GREEN
Remark
28
29
26
E
18
20
19
61
16
15
17
22
21
C
6
4
7
63
9
5
- 144 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
5
Description
MTAA01 TAPE,DECO
5 MTAD00 TAPE,WINDOW
5 MTAF00 TAPE,MOTOR
Part Number
MTAA0182601 COMPLEX, (empty), , , , ,
Spec
MTAD0097601 COMPLEX, (empty), , , , ,
MTAF0026001 COMPLEX, (empty), , , , ,
5
4
5
5
MWAC00
APGZ00
MBFF00
MIDZ00
WINDOW,LCD
PLATE ASSY
BRACKET,LCD
INSULATOR
MWAC0111101 CUTTING, PMMA HI835M, , , , ,
APGZ0002901 STS
MBFF0027301 PRESS, STS, , , , ,
MIDZ0211001 COMPLEX, (empty), , , , ,
MTAA0192301 CUTTING, Al, , , , ,
MTAA0192401 COMPLEX, (empty), , , , ,
5 MTAA00 TAPE,DECO
5 MTAA01 TAPE,DECO
5 MTAA02 TAPE,DECO MTAA0192501 COMPLEX, (empty), , , , ,
4
4
4
4
ARDY00 RAIL ASSY,SLIDE
GMEY00 SCREW MACHINE,BIND
GMZZ00 SCREW MACHINE
MCCH01 CAP,SCREW
ARDY0010201
GMEY0010601 1.4 mm,2.5 mm,MSWR3(BK) ,N ,+ ,NYLOK
GMZZ0019001 3.5 mm,1.5 mm,MSWR3 ,N ,+ ,- ,NYLOK Coating
MCCH0142001 COMPLEX, (empty), , , , ,
4 MTAB00 TAPE,PROTECTION
4 MTAB02 TAPE,PROTECTION
MTAB0295501 COMPLEX, (empty), , , , ,
MTAB0304101 COMPLEX, (empty), , , , ,
4 MTAC00 TAPE,SHIELD MTAC0085401 COMPLEX, (empty), , , , ,
4 MTAZ00 TAPE MTAZ0230401 COMPLEX, (empty), , , , ,
6 MGAD00 GASKET,SHIELD FORM MGAD0180001 COMPLEX, (empty), , , , ,
6 MTAJ00 TAPE,FLEXIBLE PCB
6
3
3
ADCA00 DOME ASSY,METAL
GMZZ00 SCREW MACHINE
MLAK00 LABEL,MODEL
MTAJ0021601 COMPLEX, (empty), , , , ,
ADCA0092501
GMZZ0017701 1.4 mm,3.0 mm,MSWR3 ,N ,+ ,- ,
MLAK0010806 PRINTING, (empty), , , , ,
Color
WITHOUT
COLOR
WITHOUT
COLOR
Black
Silver
Without
Color
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
Without
Color
WITHOUT
COLOR
Without
Color
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
Silver
WITHOUT
COLOR
Remark
3
2
8
A, 1
57
F, 23
24
25
55
37
58
14, 59
13
11
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 145 LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
5
Description
ADCA00 DOME ASSY,METAL
5 ACKA00 CAN ASSY,SHIELD
6 MCBA00 CAN,SHIELD
6 MIDZ00 INSULATOR
6 MIDZ00 INSULATOR
6 MIDZ00 INSULATOR
6
6
5
MIDZ00 INSULATOR
MLAB00 LABEL,A/S
ADCA00 DOME ASSY,METAL
Part Number
ADCA0092501
ACKA0011701
MCBA0041401 PRESS, STS, 0.3, , , ,
Spec
MIDZ0210901 COMPLEX, (empty), , , , ,
MIDZ0217201 COMPLEX, (empty), , , , ,
MIDZ0217301 COMPLEX, (empty), , , , ,
MIDZ0217501 COMPLEX, (empty), , , , ,
MLAB0001102 C2000 USASV DIA 4.0
ADCA0092601 MAIN
Color
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
WITHOUT
COLOR
WHITE
WITHOUT
COLOR
Remark
40
36
LGE Internal Use Only - 146 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
13.2 Replacement Parts
<Main component>
Note : This Chapter is used for reference, Part order is ordered
by SBOM standard on GCSC
7
7
7
7
7
7
7
7
Level
Location
No.
1
6
6
4
5
5
6
6
7
7
6
4
5
5
6
7
BFAA00
BFAA00
Description
IMT-2000(SLIDE)
FILM,INMOLD
FILM,INMOLD
Part Number
TISL0007001
BFAA0106101
BFAA0106001
; ,[empty] , , ,
; ,BLACK , , ,
Spec
SACY00 PCB ASSY,FLEXIBLE
SACB00
PCB
ASSY,FLEXIBLE,INSERT
SACY0093001
SACB0053301
SACE00 PCB ASSY,FLEXIBLE,SMT SACE0084701
SACC00
PCB ASSY,FLEXIBLE,SMT
BOTTOM
SACC0060101
C100
C101
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
C103
C104
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
L100 INDUCTOR,CHIP
VA100 VARISTOR
VA101 VARISTOR
SAEY00 PCB ASSY,KEYPAD
SAEB00
PCB
ASSY,KEYPAD,INSERT
SAEE00 PCB ASSY,KEYPAD,SMT
SAEC00
PCB ASSY,KEYPAD,SMT
BOTTOM
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
ELCH0005009 100 nH,J ,1005 ,R/TP ,
SEVY0003801 18 V, ,SMD ,
SEVY0003801 18 V, ,SMD ,
VA102 VARISTOR
SACD00
PCB ASSY,FLEXIBLE,SMT
TOP
SEVY0003801
SACD0073401
18 V, ,SMD ,
CN103
CONNECTOR,BOARD TO
BOARD
CN105
CONNECTOR,BOARD TO
BOARD
SPCY00 PCB,FLEXIBLE
ENBY0036701
ENBY0040401
SPCY0157101
60 PIN,0.4 mm,ETC , ,H=1.0, Plug
50 PIN,0.4 mm,ETC , ,H=1.0, Plug
POLYI ,0.15 mm,DOUBLE , ,; , , , , , , , , ,
SAEY0067801
SAEB0029501
SAEE0034601
SAEC0033601
BAT100 BATTERY,CELL,LITHIUM SBCL0001701
2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi
4.8, Pb-Free
Color
COLOR
UNFIXED
WITHOUT
COLOR
WITHOUT
COLOR
Remark
60
62
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 147 LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Level
7
Location
No.
C100
Description
CAP,CERAMIC,CHIP
7
7
7
7
7
7
7
7
7
7
7
C101
C102
C103
C104
C105
C106
C107
C108
C109
CN102
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CONNECTOR,FFC/FPC
Part Number Spec
ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
ENQY0014901
35 ,0.3 mm,ETC , , ,; , ,0.30MM ,FPC ,STRAIGHT ,BOTH
,SMD ,R/TP ,[empty] ,
CN103
CONNECTOR,BOARD TO
BOARD
D1
D2
DIODE,TVS
DIODE,TVS
FB100 FILTER,BEAD,CHIP
FB101 FILTER,BEAD,CHIP
FB103 FILTER,BEAD,CHIP
R100
R101
R102
R103
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP
RES,CHIP,MAKER
R104
R105
R106
R111
R112
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
R113
R114
R115
R116
R117
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
ENBY0040501 50 PIN,0.4 mm,ETC , ,H=1.0, Socket
EDTY0008604 SOT-563 ,6 V,100 W,R/TP ,PB-FREE
EDTY0008604 SOT-563 ,6 V,100 W,R/TP ,PB-FREE
SFBH0000903 600 ohm,1005 ,
SFBH0000903 600 ohm,1005 ,
SFBH0000903 600 ohm,1005 ,
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP
Color Remark
LGE Internal Use Only - 148 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
Level
7
7
7
6
7
7
6
4
4
4
3
4
4
5
6
6
6
Location
No.
R118
U100 IC
Description
RES,CHIP
Part Number Spec
ERHY0001302 1 ohm,1/8W,J,2012,R/TP
EUSY0263105
QFN ,20 PIN,R/TP ,SUB-PMIC4Ch+2LDO ,; ,IC,Charge
Pump
SEVY0003801 18 V, ,SMD , VA1 VARISTOR
SAED00
PCB ASSY,KEYPAD,SMT
TOP
SAED0033101
LD1
LD2
SPEY00
SJMY00
SUSY00
SVLM00
DIODE,LED,CHIP
DIODE,LED,CHIP
PCB,KEYPAD
VIBRATOR,MOTOR
SPEAKER
LCD MODULE
EDLH0013401
WHITE ,ETC ,R/TP ,SIDEVIEW LED ,; ,[empty] , , , , ,
,[empty] ,[empty] ,2P
EDLH0013401
WHITE ,ETC ,R/TP ,SIDEVIEW LED ,; ,[empty] , , , , ,
,[empty] ,[empty] ,2P
SPEY0059701 FR-4 ,0.5 mm,BUILD-UP 4 , ,; , , , , , , , , ,
SJMY0007106 3 V,.08 A,10*3.0T ,17mm ,; ,3V , , ,12000 rpm , , , ,
SUSY0027204 ASSY ,8 ohm,90 dB,1812 mm,15mm ,; , , , , , , ,WIRE
SVLM0027001
Main ,2.0" ,240*320 ,37.2*52.1*1.5 ,16.7M ,TFT ,TM
,HM15CP200 ,
SAEY0066301 SAEY00 PCB ASSY,KEYPAD
SAEB00
PCB
ASSY,KEYPAD,INSERT
SAEE00 PCB ASSY,KEYPAD,SMT
SAEC00
PCB ASSY,KEYPAD,SMT
BOTTOM
SAEB0028001
SAEE0033401
SAEC0032301
BAT100
C100
C101
C102
C103
C104
C105
C106
C107
C108
C109
CN102
BATTERY,CELL,LITHIUM
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CONNECTOR,FFC/FPC
CN103
CONNECTOR,BOARD TO
BOARD
SBCL0001701
2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi
4.8, Pb-Free
ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP
ENQY0014901
35 ,0.3 mm,ETC , , ,; , ,0.30MM ,FPC ,STRAIGHT ,BOTH
,SMD ,R/TP ,[empty] ,
ENBY0041901
50 PIN,0.4 mm,STRAIGHT , ,H=1.0,SOCKET ,; ,
,0.40MM ,STRAIGHT ,FEMALE ,SMD ,P/TR , ,
Color Remark
38
56
12
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 149 LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
D1
Description
DIODE,TVS
6
6
6
D2
FB100
FB101
DIODE,TVS
FILTER,BEAD,CHIP
FILTER,BEAD,CHIP
FB103 FILTER,BEAD,CHIP
R100
R101
R102
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP
R103
R104
R105
R106
R111
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
R112
R113
R114
R115
R116
R117
R118
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP
RES,CHIP
RES,CHIP
6
6
5
U100 IC
Part Number Spec
EDTY0008604 SOT-563 ,6 V,100 W,R/TP ,PB-FREE
EDTY0008604 SOT-563 ,6 V,100 W,R/TP ,PB-FREE
SFBH0000903 600 ohm,1005 ,
SFBH0000903 600 ohm,1005 ,
SFBH0000903 600 ohm,1005 ,
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
ERHY0001302 1 ohm,1/8W,J,2012,R/TP
EUSY0263105
QFN ,20 PIN,R/TP ,SUB-PMIC4Ch+2LDO ,; ,IC,Charge
Pump
SEVY0003801 18 V, ,SMD , VA1 VARISTOR
SAED00
PCB ASSY,KEYPAD,SMT
TOP
SAED0031701
6
6
3
4
4
5
6
LD1
LD2
SAFY00
SAFB00
DIODE,LED,CHIP
DIODE,LED,CHIP
PCB ASSY,MAIN
PCB ASSY,MAIN,INSERT
SAFF00 PCB ASSY,MAIN,SMT
SAFC00
PCB ASSY,MAIN,SMT
BOTTOM
C100 CAP,CERAMIC,CHIP
EDLH0013401
WHITE ,ETC ,R/TP ,SIDEVIEW LED ,; ,[empty] , , , , ,
,[empty] ,[empty] ,2P
EDLH0013401
WHITE ,ETC ,R/TP ,SIDEVIEW LED ,; ,[empty] , , , , ,
,[empty] ,[empty] ,2P
SAFY0308801
SAFB0094001
SAFF0221601
SAFC0123201
ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
Color Remark
D, I, 39
LGE Internal Use Only - 150 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C101
Description
CAP,CHIP,MAKER
6 C102 CAP,CERAMIC,CHIP
6 C103 CAP,CERAMIC,CHIP
C104
C113
C114
C115
C116
C117
CAP,CERAMIC,CHIP
C105
C106
C107
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C108
C109
C110
C111
C112
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C118
C119
C120
C121
C122
C123
C124
C125
C126
C127
C128
C129
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
Part Number Spec
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0005604
10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty]
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
ECCH0003002
10000000 pF,10V ,Z ,Y5V ,HD ,2012 ,R/TP , , ,[empty]
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,1.25 mm
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0005604
10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty]
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
ECCH0003002
10000000 pF,10V ,Z ,Y5V ,HD ,2012 ,R/TP , , ,[empty]
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,1.25 mm
ECCH0003002
10000000 pF,10V ,Z ,Y5V ,HD ,2012 ,R/TP , , ,[empty]
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,1.25 mm
ECCH0003002
10000000 pF,10V ,Z ,Y5V ,HD ,2012 ,R/TP , , ,[empty]
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,1.25 mm
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
Color Remark
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 151 LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C130
Description
CAP,CERAMIC,CHIP
6
6
6
C131
C132
C133
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
C134
C135
C136
C137
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
C138
C139
C140
C141
C142
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C147
C148
C149
C150
C151
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C152
C153
C154
C155
C156
C157
C158
C159
C160
C161
C162
C200
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
6 C201 CAP,TANTAL,CHIP
Part Number Spec
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECTH0004807
10 uF,10V ,M ,STD ,1608 ,R/TP ,; , ,[empty] ,[empty] , ,-
55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]
Color Remark
LGE Internal Use Only - 152 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C202
Description
CAP,CERAMIC,CHIP
6
6
6
C203
C204
C205
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C206
C207
C208
C209
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C210
C211
C212
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C213 CAP,CERAMIC,CHIP
C214
C216
C217
C218
C219
C220
C221
C222
C223
C224
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
C225
C226
C227
C228
C229
C230
C231
C300
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,TANTAL,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
Part Number Spec
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0000901 24 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECZH0000901 24 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0005604
10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty]
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP
ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001703
2200000 pF,25V ,Z ,Y5V ,HD ,2012 ,R/TP , ,1.25 T
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]
ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP
ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP
ECTH0001704
22 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,
,[empty] , ,2.2X1.25X1.2MM ,[empty] ,[empty] ,[empty]
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
Color Remark
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 153 LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C301
Description
CAP,CHIP,MAKER
6
6
6
C302
C303
C304
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
C305
C306
C307
C308
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C309
C310
C311
C312
C313
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C314
C316
C317
C400
C401
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C402
C403
C404
C406
C407
C409
C410
C411
C412
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
6 C413
C414
PCB ASSY,MAIN,PAD
SHORT
CAP,CERAMIC,CHIP
C416
C417
CAP,CHIP,MAKER
CAP,CHIP,MAKER
Part Number Spec
ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
ECZH0003124 68 nF,16V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000163 47 nF,10V,K,X5R,HD,1005,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP
ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
SAFP0000501
ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP
ECZH0001126 820 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0001126 820 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
LGE Internal Use Only - 154 -
Color Remark
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C418
Description
CAP,CERAMIC,CHIP
6
6
6
C419
C420
C421
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C500
C501
C502
C503
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
C504
C505
C506
C507
C508
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
C509
C510
C511
C512
C513
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C514
C515
C516
C517
C519
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C520
C521
C522
C523
C524
C525
C526
C527
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
Part Number Spec
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000393
22000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP , , ,[empty]
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,1.25 mm
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000133 220 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
Color Remark
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 155 LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C528
Description
CAP,CERAMIC,CHIP
6
6
6
C529
C530
C531
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C532
C533
C600
C601
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
C602
C603
C604
C605
C606
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C607
C608
C609
C610
C611
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C612
C613
C614
C615
C616
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
6 C617 CAP,CERAMIC,CHIP
C618 CAP,CERAMIC,CHIP
C619 CAP,CHIP,MAKER
C620
C621
C622
C623
C624
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
Part Number Spec
ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP
ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0003002
10000000 pF,10V ,Z ,Y5V ,HD ,2012 ,R/TP , , ,[empty]
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,1.25 mm
ECCH0003002
10000000 pF,10V ,Z ,Y5V ,HD ,2012 ,R/TP , , ,[empty]
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,1.25 mm
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
Color Remark
LGE Internal Use Only - 156 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C625
Description
CAP,CERAMIC,CHIP
6
6
6
C626
C627
C628
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
6
6
C629
C630
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
6 C631 CAP,CERAMIC,CHIP
6
6
C632
C633
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C634 CAP,TANTAL,CHIP
C635 CAP,TANTAL,CHIP
C636
C637
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C638
C639
C640
C641
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C642
C643
C644
C645
C646
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C647
C648
C649
C650
C651
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
C652
C653
C654
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
Part Number Spec
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
ECCH0005604
10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty]
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
ECCH0005604
10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty]
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
ECCH0005604
10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty]
,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm
ECTH0005202
100 uF,4V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,
,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]
ECTH0005202
100 uF,4V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,
,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP
ECZH0001217 470 nF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001217 470 nF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
Color Remark
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 157 LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
C655
Description
CAP,CERAMIC,CHIP
6
6
6
C656
C657
C658
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
C659
C660
C661
C662
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CAP,CERAMIC,CHIP
6
C664
C665
C666
CN200
CN201
CAP,CERAMIC,CHIP
CAP,CERAMIC,CHIP
CAP,CHIP,MAKER
CONNECTOR,I/O
CONNECTOR,ETC
CN300
CONNECTOR,BOARD TO
BOARD
D101 DIODE,SWITCHING
FB400
FL300
FL301
FL302
FL303
FILTER,BEAD,CHIP
FILTER,EMI/POWER
FILTER,EMI/POWER
FILTER,EMI/POWER
FILTER,EMI/POWER
6
6
6
6
6
6
Part Number
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
ECCH0000117
ECCH0000117
ECZH0003103
ECCH0000198
ECCH0000117
ECCH0000117
ECZH0003103
ENRY0006401
ENZY0022201
ENBY0036801
EDSY0017301
Spec
27 pF,50V,J,NP0,TC,1005,R/TP
27 pF,50V,J,NP0,TC,1005,R/TP
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
27 pF,50V,J,NP0,TC,1005,R/TP
27 pF,50V,J,NP0,TC,1005,R/TP
0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type
3 ,2.5 mm,ETC , ,
60 PIN,0.4 mm,ETC , ,H=1.0, Socket
VSM ,15 V,100 mA,R/TP ,PB-FREE
SFBH0008101 600 ohm,1005 ,
SFEY0015501 SMD ,Pb-free_4ch_5p-100ohm-5p ,; ,Filter,LCR
SFEY0015501 SMD ,Pb-free_4ch_5p-100ohm-5p ,; ,Filter,LCR
SFEY0015501 SMD ,Pb-free_4ch_5p-100ohm-5p ,; ,Filter,LCR
SFEY0015501 SMD ,Pb-free_4ch_5p-100ohm-5p ,; ,Filter,LCR
FL304 FILTER,EMI/POWER SFEY0015501 SMD ,Pb-free_4ch_5p-100ohm-5p ,; ,Filter,LCR
FL400
FL500
FL501
J200
J300
FILTER,DIELECTRIC
FILTER,SAW,DUAL
FILTER,SAW,DUAL
SFDY0002601
2450 MHz,2.0*1.25*1.0 ,SMD ,2400M~2500M, IL 3.8,
8pin, U-B, 34.2_j95, BT (CSR BC41B143A) ,; ,BPF ,2450
,100 ,SMD ,R/TP
SFSB0001902
1842.5 MHz,75 MHz,2.5 dB,10 dB,1960 MHz,60 MHz,2.6
dB,11 dB,1.8*1.4*0.5 ,SMD
,1805M~1880M,1930M~1990M,10p,B,150_15,150_22,D
CS+PCS Rx, HL ,; , ,1.8*1.4*0.5 ,SMD ,R/TP
SFSB0001802
881.5 MHz,25 MHz,2 dB,35 dB,942.5 MHz,35 MHz,2.4
dB,20 dB,1.8*1.4*0.5 ,SMD
,869M~894M,925M~960M,10p,B,150_82,150_82,GSM85
0+EGSM Rx, HL ,; , ,1.8*1.4*0.5 ,SMD ,R/TP
CONN,JACK/PLUG,EARPH
ONE
CONN,SOCKET
ENJE0006701 4 ,5 PIN, ,; ,4P ,4P ,ANGLE ,[empty] , ,BLACK ,
ENSY0018701 6 PIN,ETC , ,2.54 mm,H=1.8
L100 INDUCTOR,CHIP ELCH0001032 18 nH,J ,1005 ,R/TP ,PBFREE
Color Remark
LGE Internal Use Only - 158 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
L101
Description
INDUCTOR,SMD,POWER
6
6
6
L200
L201
L202
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
L203
L204
L205
L206
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
6
L207
L208
L209
L400
L402
L403
L404
L500
L501
L502
L503
L504
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
PCB ASSY,MAIN,PAD
SHORT
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
L505
L506
L507
L508
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
INDUCTOR,CHIP
L509
L510
INDUCTOR,CHIP
INDUCTOR,CHIP
6
6
6
L600 INDUCTOR,SMD,POWER
L601 INDUCTOR,SMD,POWER
M400 MODULE,ETC
Part Number Spec
ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
ELCH0005009 100 nH,J ,1005 ,R/TP ,
ELCH0005009 100 nH,J ,1005 ,R/TP ,
ELCH0005009 100 nH,J ,1005 ,R/TP ,
ELCH0005009 100 nH,J ,1005 ,R/TP ,
ELCH0005009 100 nH,J ,1005 ,R/TP ,
ELCH0005009 100 nH,J ,1005 ,R/TP ,
ELCH0005009 100 nH,J ,1005 ,R/TP ,
ELCH0005009 100 nH,J ,1005 ,R/TP ,
ELCH0005009 100 nH,J ,1005 ,R/TP ,
ELCH0005009 100 nH,J ,1005 ,R/TP ,
SAFP0000501
ELCH0004716 39 nH,J ,1005 ,R/TP ,
ELCH0003823 470 nH,K ,1608 ,R/TP ,chip coil,PBFREE
ELCH0001413 22 nH,J ,1005 ,R/TP ,PBFREE
ELCH0001430 100 nH,J ,1005 ,R/TP ,PBFREE
ELCH0001408 6.8 nH,J ,1005 ,R/TP ,Pb Free
ELCH0001408 6.8 nH,J ,1005 ,R/TP ,Pb Free
ELCH0001052 18 nH,J ,1005 ,R/TP ,PBFREE
ELCH0001052 18 nH,J ,1005 ,R/TP ,PBFREE
ELCH0001039 2.7 nH,S ,1005 ,R/TP ,PBFREE
ELCH0001411 1.2 nH,S ,1005 ,R/TP ,PBFREE
ELCH0001033 1.5 nH,S ,1005 ,R/TP ,PBFREE
ELCH0001034 3.3 nH,S ,1005 ,R/TP ,PBFREE
ELCH0001034 3.3 nH,S ,1005 ,R/TP ,PBFREE
ELCH0001052 18 nH,J ,1005 ,R/TP ,PBFREE
ELCP0008006
2.2 uH,M ,- ,R/TP ,Chip power inductor ,- ,650mA(30%)
,20% ,- ,- ,1.5 ,- ,- ,SHIELD ,2X1.5X1.3MM ,[empty]
,[empty] ,Inductor,Wire Wound,Chip
ELCP0008006
2.2 uH,M ,- ,R/TP ,Chip power inductor ,- ,650mA(30%)
,20% ,- ,- ,1.5 ,- ,- ,SHIELD ,2X1.5X1.3MM ,[empty]
,[empty] ,Inductor,Wire Wound,Chip
SMZY0015801 84 Ball 0.5pitch, BGA , Bluetooth+FM (6.0*6.0*1.0)
Color Remark
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 159 LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
Description
MIC200 MICROPHONE
6
6
Q300
Q500
TR,BJT,ARRAY
TR,BJT,ARRAY
Q600 TR,FET,P-CHANNEL
R100
R101
RES,CHIP,MAKER
RES,CHIP,MAKER
R102
R103
R104
R105
R106
R107
R114
R115
R116
R117
R200
R109
R110
R111
R112
R108
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP
RES,CHIP
RES,CHIP,MAKER
RES,CHIP,MAKER
PCB ASSY,MAIN,PAD
OPEN
RES,CHIP
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
R201
R202
PCB ASSY,MAIN,PAD
OPEN
RES,CHIP,MAKER
R203
R206
R209
R210
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
R211 RES,CHIP,MAKER
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Part Number Spec
SUMY0010609
UNIT ,-42 dB,3.76*2.95*1.1 ,mems smd mic ,; , , ,OMNI
,[empty] , ,[empty]
EQBA0004902
TES6 ,200 mW,R/TP ,NPN/PNP dual, Vo1=50V,
Io1=100mA, Vo2=-50V,Io2=-100mA
EQBA0004902
TES6 ,200 mW,R/TP ,NPN/PNP dual, Vo1=50V,
Io1=100mA, Vo2=-50V,Io2=-100mA
EQFP0004501
SOT-323 ,.29 W,1.8 V,.86 A,R/TP ,P-Chanel MOSFET,
Pb free
ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP
ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP
ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
SAFO0000501 0OHM_1005_DNI
ERHY0000512 10M ohm,1/16W,J,1608,R/TP
ERHZ0000312 68 Kohm,1/16W ,F ,1005 ,R/TP
ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000213 120 Kohm,1/16W ,F ,1005 ,R/TP
ERHZ0000414 120 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000445 220 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000435 20 ohm,1/16W ,J ,1005 ,R/TP
SAFO0000501 0OHM_1005_DNI
ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000529 1.5 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000435 20 ohm,1/16W ,J ,1005 ,R/TP
Color Remark
LGE Internal Use Only - 160 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
R212
Description
RES,CHIP,MAKER
6
6
6
R213
R215
R216
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
R217
R218
R219
R220
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP
RES,CHIP
R221
R222
R223
R224
R225
RES,CHIP,MAKER
RES,CHIP
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
R226
R300
R301
R305
R306
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
R308
R400
R401
R402
R404
R405
R406
R502
R503
R508
R509
R510
R511
R603
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
Part Number Spec
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP
ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHY0005902 5.62 Kohm,1/16W ,F ,1005 ,R/TP
ERHY0000129 18K ohm,1/16W,F,1005,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHY0000129 18K ohm,1/16W,F,1005,R/TP
ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0003001 30 Kohm,1/16W ,F ,1005 ,R/TP
ERHZ0003001 30 Kohm,1/16W ,F ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000456 2.2 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000522 24 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000496 560 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000456 2.2 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000287 47 Kohm,1/16W ,F ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000428 18 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000242 220 ohm,1/16W ,F ,1005 ,R/TP
ERHZ0000242 220 ohm,1/16W ,F ,1005 ,R/TP
ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 161 -
Color Remark
LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
R604
Description
RES,CHIP,MAKER
6 R605
6 R606
RES,CHIP,MAKER
PCB ASSY,MAIN,PAD
OPEN
R607
R608
R609
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
6 R610
R611
R612
R613
R614
R615
R616
R617
R618
RES,CHIP,MAKER
PCB ASSY,MAIN,PAD
OPEN
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
R619
R620
R621
R622
R623
R624
R625
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
PCB ASSY,MAIN,PAD
SHORT
PCB ASSY,MAIN,PAD
SHORT
PCB ASSY,MAIN,PAD
SHORT
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
6
6
6
6
R626
R627
S300
S600
PCB ASSY,MAIN,PAD
OPEN
PCB ASSY,MAIN,PAD
SHORT
CONN,SOCKET
CONN,SOCKET
6 SW500 CONN,RF SWITCH
6 U100 IC
Part Number Spec
ERHZ0000212 12 Kohm,1/16W ,F ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
SAFO0000501 0OHM_1005_DNI
ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP
SAFO0000501 0OHM_1005_DNI
ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
SAFP0000501
SAFP0000501
SAFP0000501
ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000457 30 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000445 220 Kohm,1/16W ,J ,1005 ,R/TP
ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
SAFO0000501 0OHM_1005_DNI
SAFP0000501
ENSY0022201 24 ,ETC , , mm,7*7, 1.3M (1/5") Socket Type
ENSY0021001 8 PIN,ANGLE ,Reverse , mm,
ENWY0006101
,SMD ,0.4 dB, ,; ,0.40MM ,STRAIGHT ,SOCKET ,SMD
,R/TP ,BR , ,
EUSY0286002
BGA ,105 PIN,R/TP ,512M 65nm Nor+128MSDRAM,
1.8V I/O,Pb Free , ,IC,MCP
Color Remark
LGE Internal Use Only - 162 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
Level
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Location
No.
U102
U200
U201
U202
U300
U500 IC
U501 RF MODULE,HANDSET
U600 IC
U601 IC
U602
U603
U604
U605
IC
IC
IC
IC
IC
IC
IC
IC
IC
Description
VA200 VARISTOR
VA201 VARISTOR
VA202 VARISTOR
VA203 VARISTOR
VA204 VARISTOR
VA205 VARISTOR
VA206 VARISTOR
VA207 VARISTOR
VA209 VARISTOR
VA210 VARISTOR
VA211 VARISTOR
VA300 VARISTOR
Part Number Spec
EUSY0369001
CSP-BGA ,388 ,R/TP
,ATLAS3HLite,EDGE/GPRS,ARM926EJ-S-
208MHz,QVGA,CAM2M,no HW ISP ,; ,IC,Digital
Baseband Processor
EUSY0362701 uQFN10 ,10 ,R/TP ,DPDT USB 2.0 High Speed Analog
Switch, OVT Option ,; ,IC,Analog Switch
EUSY0347001
MiniQFN-10L ,10 PIN,R/TP ,1.8X1.4X0.55,0.6 Dual SPDT
Analog Switch ,; ,IC,Analog Switch
EUSY0351601
DFN ,12 PIN,R/TP ,Dual Charger IC (Bypass) ,;
,IC,Charger
EUSY0319001
WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual
LDO
EUSY0280102
LFCSP40 ,40 PIN,R/TP ,EDGE QUAD BAND
TRANSCEIVER, Othello E.
SMRH0005101 MHz, MHz, ,ADI EDGE Tx Module
EUSY0270602
MICRO SMD ,24 PIN,R/TP ,2BUCK 2LDO,2.5x2.5 ,;
,IC,Sub PMIC
EUSY0347001
MiniQFN-10L ,10 PIN,R/TP ,1.8X1.4X0.55,0.6 Dual SPDT
Analog Switch ,; ,IC,Analog Switch
EUSY0378901
STFBGA ,144 ,R/TP ,3M,MP3,WQVGA,USB2.0 ,;
,IC,Digital Signal Processors
EUSY0365301
Micro SMD ,20 ,R/TP ,Class D, Bypass ,; ,IC,Audio Sub
System
EUSY0347001
MiniQFN-10L ,10 PIN,R/TP ,1.8X1.4X0.55,0.6 Dual SPDT
Analog Switch ,; ,IC,Analog Switch
EUSY0077701
SC70-5 ,5 PIN,R/TP ,1.8V Low Voltage Comparator with
Rail-to-Rail Input, Pb Free
SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free
SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free
SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free
SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free
SEVY0005201 5.5 V, ,SMD ,1005, 50pF
SEVY0005402 5.6 V, ,SMD ,1005 Siez , 50pF
SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free
SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free
SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free
SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free
SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free
SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free
Color Remark
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 163 LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
5
6
Level
Location
No.
6
6
6
6
6
6
Description Part Number Spec
X100
X500
X501
X600
ZD200
X-TAL
TCXO
X-TAL
X-TAL
DIODE,TVS
EXXY0018701
32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9
,
EXST0001901
26 MHz,2.5 PPM,10 pF,SMD ,32*15*1.0 ,TI_WL1251 ,; ,
,2.5PPM ,2.8V , , , , ,SMD ,R/TP
EXXY0025201
26 MHz,10 PPM,11 pF,60 ohm,SMD ,3.2*2.5*0.75
,exclusive use at ADI RFIC ,; , ,10PPM , , , ,SMD ,P/TP
EXXY0017801
12 MHz,50 PPM,8 pF,80 ohm,SMD ,3.2*2.5*0.75 ,20ppm at 25'C, 30ppm at -30'C ~ +85'C
EDTY0009601
SLP1006P2 ,5 V,100 W,R/TP ,1.0x0.6x0.5t ,; , , , , ,
,[empty] ,[empty] ,[empty] ,[empty]
ZD201 DIODE,TVS EDTY0009601
SLP1006P2 ,5 V,100 W,R/TP ,1.0x0.6x0.5t ,; , , , , ,
,[empty] ,[empty] ,[empty] ,[empty]
SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0120901
C144
C145
C215
CAP,CHIP,MAKER
CAP,CHIP,MAKER
CAP,CHIP,MAKER
ECZH0001215
ECZH0001215
ECZH0000901
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
24 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
6
D300
D301
D302
D303
D304
DIODE,TVS
DIODE,TVS
DIODE,TVS
DIODE,TVS
DIODE,TVS
D305
D306
D307
FB200
L210
LD300
LD301
R214
DIODE,TVS
DIODE,TVS
DIODE,TVS
FILTER,BEAD,CHIP
INDUCTOR,CHIP
DIODE,LED,CHIP
DIODE,LED,CHIP
RES,CHIP,MAKER
EDTY0008606
EDTY0008606
EDTY0008606
EDTY0008606
EDTY0008606
DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
SFBH0000912 1000 ohm,1005 ,
ELCH0005009 100 nH,J ,1005 ,R/TP ,
EDLH0013401
WHITE ,ETC ,R/TP ,SIDEVIEW LED ,; ,[empty] , , , , ,
,[empty] ,[empty] ,2P
EDLH0013401
WHITE ,ETC ,R/TP ,SIDEVIEW LED ,; ,[empty] , , , , ,
,[empty] ,[empty] ,2P
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
R227
R302
R303
R304
R307
RES,CHIP,MAKER
RES,CHIP
RES,CHIP
RES,CHIP,MAKER
RES,CHIP,MAKER
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
Color Remark
LGE Internal Use Only - 164 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
13. EXPLODED VIEW & REPLACEMENT PART LIST
6
6
6
6
6
6
6
6
6
6
6
6
Level
6
Location
No.
R309
Description
RES,CHIP
6
6
6
R310
R311
R312
RES,CHIP
RES,CHIP,MAKER
RES,CHIP,MAKER
R313
R314
R315
R316
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
RES,CHIP,MAKER
R317
R628
SPFY00
U101
VA208
RES,CHIP,MAKER
RES,CHIP,MAKER
PCB,MAIN
IC
VARISTOR
VA301 VARISTOR
VA302 VARISTOR
VA303 VARISTOR
Part Number Spec
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000505 680 ohm,1/16W ,J ,1005 ,R/TP
ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP
SPFY0188401 FR-4 ,0.8 mm,STAGGERED-8 , ,; , , , , , , , , ,
EUSY0250001 Leaded ,4 PIN,R/TP ,Hall IC
SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free
SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free
SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free
SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free
Color Remark
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 165 LGE Internal Use Only
13. EXPLODED VIEW & REPLACEMENT PART LIST
13.3 Accessory Note : This Chapter is used for reference, Part order is ordered
by SBOM standard on GCSC
Level
Location
No.
4
Description
SNGF00 ANTENNA,GSM,FIXED
4 SNGF01 ANTENNA,GSM,FIXED
Part Number Spec
SNGF0043401
3.0 ,-5.0 dBd,, ,internal, GSM850/900/1800/1900 ,;
,QUAD ,-5.0 ,50 ,3.0
SNGF0043502
3.0 ,-5.0 dBd,, ,internal, Bluetooth ,; ,SINGLE ,-5.0 ,50
,3.0
Color Remark
47
LGE Internal Use Only - 166 Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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