LG Electronics LG-C300 Cell Phone User manual

Date: August, 2010 / Issue 1.0

Service Manual

LG-C300

Internal Use Only

Table Of Contents

1. INTRODUCTION ..................................................................5

1.1 Purpose ............................................................................................... 5

1.2 Regulatory Information ............................................................... 5

1. Abbreviations ................................................................................... 7

2. PERFORMANCE ...................................................................9

2.1 H/W Features .................................................................................... 9

2.2 Technical Specification ...............................................................11

3. TECHNICAL BRIEF .............................................................16

.1 Baseband Processor Introduction .........................................16

.2 Power Management ....................................................................21

. FEM with integrated Power Amplifier Module

(RF7161, U01) ...............................................................................

.4 Crystal(26 MHz, X102) .................................................................6

.5 RF Subsystem of PMB8810 (U102).........................................7

.6 MEMORY(PF8F6066M0YDE, U102) ..................................42

.7 BT module (U02) .........................................................................44

.8 SIM Card Interface ........................................................................46

.9 LCD Interface ..................................................................................47

.10 Battery Charger Interface .......................................................50

.11 Keypad Interface ........................................................................51

.12 Audio Front-End .........................................................................5

.1 Camera Interface(2M Fixed Focus Camera) .....................59

.14 KEY BACLKLIGHT LED Interface ............................................61

.15 Vibrator Interface .......................................................................62

4. TROUBLE SHOOTING .......................................................63

4.1 RF Component...............................................................................6

4.2 RX Trouble .......................................................................................64

4. TX Trouble ........................................................................................68

4.4 Power On Trouble .........................................................................72

4.5 Charging Trouble ..........................................................................75

4.6 Vibrator Trouble .............................................................................77

4.7 LCD Trouble .....................................................................................80

4.8 Camera Trouble .............................................................................84

4.9 Speaker Trouble ............................................................................88

4.10 Earphone Trouble ......................................................................90

4.11 Receiver Trouble .........................................................................92

4.12 Microphone Trouble .................................................................94

4.1 SIM Card Interface Trouble .....................................................96

4.14 KEY backlight Trouble ..............................................................98

4.15 Micro SD (uSD) Trouble ......................................................... 100

4.16 Bluetooth Trouble ................................................................... 102

4.17 FM Radio Trouble .................................................................... 104

5. DOWNLOAD ................................................................... 106

6. BLOCK DIAGRAM ........................................................... 119

7. CIRCUIT DIAGRAM ........................................................ 121

8. BGA PIN MAP ................................................................. 125

9. PCB LAYOUT ................................................................... 127

10.ENGINEERING MODE ................................................... 129

11. STAND ALONE TEST .................................................... 130

11.1 Introduction .............................................................................. 10

11.2 Setting Method ........................................................................ 10

11. Tx Test ........................................................................................... 1

11.4 Rx Test .......................................................................................... 15

12.AUTO CALIBRATION ..................................................... 137

12.1 Overview .................................................................................... 17

12.2 Configuration of HotKimchi ............................................... 17

12. Description of Basic File ....................................................... 18

12.4 Procedure ................................................................................... 19

12.5 AGC ............................................................................................... 142

12.6 APC ............................................................................................... 142

12.7 ADC ............................................................................................... 142

12.8 Target Power ............................................................................. 142

13 EXPLODED VIEW & REPLACEMENT

PART LIST ...................................................................... 143

1.1 EXPLODED VIEW ...................................................................... 14

1.2 Replacement Parts.................................................................. 145

1. Accessory ................................................................................... 16

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes

- LGE Internal Use Only

LGE Internal Use Only - 4 Copyright © 2010 LG Electronics. Inc. All right reserved.


1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it.

The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

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- 5 LGE Internal Use Only

1. INTRODUCTION

2. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described. ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

LGE Internal Use Only

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- 6 Copyright © 2010 LG Electronics. Inc. All right reserved.


LCD

LDO

LED

OPLL

APC

BB

BER

ESD

FPCB

GMSK

GPIB

GSM

CC-CV

DAC

DCS dBm

DSP

EEPROM

IPUI

IF

1.3 Abbreviations

For the purposes of this manual, following abbreviations apply:

Automatic Power Control

Baseband

Bit Error Ratio

Constant Current – Constant Voltage

Digital to Analog Converter

Digital Communication System dB relative to 1 milli watt

Digital Signal Processing

Electrical Erasable Programmable Read-Only Memory

Electrostatic Discharge

Flexible Printed Circuit Board

Gaussian Minimum Shift Keying

General Purpose Interface Bus

Global System for Mobile Communications

International Portable User Identity

Intermediate Frequency

Liquid Crystal Display

Low Drop Output

Light Emitting Diode

Offset Phase Locked Loop ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



]VXZZ

- 7 -

1. INTRODUCTION

1. INTRODUCTION


1. INTRODUCTION

PAM

PCB

PGA

PLL

PSTN

RF

RLR

RMS

RTC

SAW

SIM

SLR

SRAM

PSRAM

STMR

TA

TDD

TDMA

UART

VCO

VCTCXO

WAP

Power Amplifier Module

Printed Circuit Board

Programmable Gain Amplifier

Phase Locked Loop

Public Switched Telephone Network

Radio Frequency

Receiving Loudness Rating

Root Mean Square

Real Time Clock

Surface Acoustic Wave

Subscriber Identity Module

Sending Loudness Rating

Static Random Access Memory

Pseudo SRAM

Side Tone Masking Rating

Travel Adapter

Time Division Duplex

Time Division Multiple Access

Universal Asynchronous Receiver/Transmitter

Voltage Controlled Oscillator

Voltage Control Temperature Compensated Crystal Oscillator

Wireless Application Protocol

1. INTRODUCTION ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


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2. PERFORMANCE

2. SYSTEM SPECIFICATION

2.1 H/W Features

Item

Standard Battery Li-ion, 3.7V 900mAh

Feature

Talk time

Stand by time

Charging time

RX Sensitivity

TX output power

GPRS compatibility

SIM card type

Display

Status Indicator

ANT

EAR Phone Jack

PC Synchronization

Speech coding

Data and Fax

Vibrator

Loud Speaker

Voice Recoding

Microphone

Up to 8 hrs : GSM850 & EGSM,TX Level : 10

Up to 500 hrs : Paging Period 9

Under 3 hrs

GSM, EGSM: -109dBm, DCS: -109dBm

GSM, EGSM: 33 dBm(Level 5),

DCS , PCS: 30 dBm(Level 0)

Class 12

3.0V / 1.8V

MAIN : 2.4” TFT 240 Ý 320 QVGA

Yes

Yes

Yes

Yes

Hard icons. Key Pad (Qwerty)

A ~ Z,0 ~ 9, #, *, Up/Down Left/Right OK Key

Send Key, PWR Key , Soft Key(Left/Right),

Side key(Volume Up/Volume Down)

Internal type (QUAD band)

Yes (Stereo)

Yes

EFR/FR/HR/NB-AMR

Yes

Comment c ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



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2. PERFORMANCE

Item Feature

Speaker/Receiver

Travel Adapter

18x12

Yes

Ȱ

Speaker/

Receiver

MIDI SW decoded max. 32 poly

Camera

Bluetooth / FM Radio BT 2.1 + EDR / 87.5 ~ 108MHz supported


Comment ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


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2. PERFORMANCE


2.2 Technical Specification

Item Description

1

2

3

4

Frequency Band

Phase Error

Frequency Error

Power Level

Specification

GSM850 EGSM

TX: 824 ~ 849 MHz TX: 880 ~ 915MHz

RX: 869 ~ 894 MHz RX: 925 ~ 960 MHz

DCS

TX: 1710 ~ 1785 MHz

RX: 1805 ~ 1880 MHz

PCS

TX: 1850 ~ 1910 MHz

RX: 1930 ~ 1990 MHz

RMS < 5 degrees

Peak < 20 degrees

< 0.1 ppm

GSM850/EGSM

Level Power Toler. Level Power Toler.

5 33dBm · 2dB 13 17dBm · 3dB

6 31dBm · 3dB 14 15dBm · 3dB

7 29dBm · 3dB 15 13dBm · 3dB

8 27dBm · 3dB 16 11dBm · 5dB

9 25dBm · 3dB 17 9dBm · 5dB

10 23dBm · 3dB 18 7dBm · 5dB

11 21dBm · 3dB 19 6dBm · 5dB

12 19dBm · 3dB

DCS/PCS

Level Power Toler. Level Power Toler.

0 30dBm · 2dB 8 14dBm · 3dB

1 28dBm · 3dB 9 12dBm · 4dB

2 26dBm · 3dB 10 10dBm · 4dB

3 24dBm · 3dB 11 8dBm · 4dB

4 22dBm · 3dB 12 6dBm · 4dB

5 20dBm · 3dB 13 4dBm · 4dB

6 18dBm · 3dB 14 2dBm · 5dB

7 16dBm · 3dB 15 0dBm · 5dB ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



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2. PERFORMANCE


5

Output RF Spectrum

(due to modulation)

6

Output RF Spectrum

(due to switching transient)


Specification

GSM850/ EGSM

Offset from Carrier (kHz).

100

200

250

400

600~ <1,200

1,200~ <1,800

1,800~ <3,000

3,000~ <6,000

6,000

DCS/PCS


100

200

250

400

600~ <1,200

1,200~ <1,800

1,800~ <3,000

3,000~ <6,000

6,000

GSM850/ EGSM


400

600

1,200

1,800

Max. dBc

+0.5

-30

-33

-60

-60

-60

-65

-65

-73

Max. dBc

+0.5

-30

-33

-60

-60

-60

-63

-65

-71

Max. dBm

-19

-21

-21

-24 ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


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2. PERFORMANCE


Item

6

7

8

9

10

11

12

Output RF Spectrum

(due to switching transient)

RLR

Description

Spurious Emissions

Bit Error Ratio

RX Level Report Accuracy

SLR

Sending Response

Specification

DCS/PCS


400

600

1,200

1,800

Conduction, Emission Status

Max. dBm

-22

-24

-24

-27

GSM850, EGSM

BER (Class II) < 2.439% @-102 dBm

DCS,PCS

BER (Class II) < 2.439% @-102 dBm

· 3 dB

15 · 3 dB

Frequency (Hz) Max.(dB) Min.(dB)

100

200

300

1,000

-12

0

0

0

-12

-6

-

-

2,000

3,000

3,400

4,000

4

4

4

0

-6

-6

-9

-

4 · 3 dB ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



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2. PERFORMANCE


13 Receiving Response

14

15

STMR

Stability Margin

16 Distortion

17

18

19

Side Tone Distortion

System frequency

(13 MHz) tolerance

32.768KHz tolerance

20 Ringer Volume


Specification

Frequency (Hz) Max.(dB) Min.(dB)

100 -12 -

200 0 -

300

500

2

*

-7

-5

1,000 0 -5

3,000

3,400

4,000

2

2

2

-5

-10

* Mean that Adopt a straight line in between 300 Hz and 1,000 Hz to be Max. level in the range.

17 ρ 5 dB

> 6 dB dB to ARL (dB) Level Ratio (dB)

-35 17.5

-30

-20

22.5

30.7

-10 33.3

0 33.7

7

10

31.7

25.5

Three stage distortion < 10%

˺ 2.5 ppm

˺ 30 ppm

At least 55 dBspl under below conditions:

1. Ringer set as ringer.

2. Test distance set as 1 m ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


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2. PERFORMANCE

24

25

26

27

Item

21

22

23

28

Description

Charge Current

Antenna Display

Battery Indicator

Low Voltage Warning

( Blinking Bar)

Forced shut down

Voltage

Sustain RTC without battery

Battery Type

Travel Charger


Specification

Constant Charge Current : <. 400 mA

Total Charging Time : < 3 hours ( Battery 900mA )

Bar Number Power

7

7 -> 5

-92 Max.

-93 · 3

-98 · 3 5 -> 4

4 -> 2

2 -> 1

-101 · 3

-104 · 3

1 -> 0

0 -> OFF

-106 · 3

-106 Min.

Battery Bar Number Voltage

3 ˻ 3.73

· 0.05 V

3 -> 2

2 -> 1

1 -> 0

3.61 · 0.05 V

3.46 · 0.05 V

3.35 · 0.05 V

˺ 3.46 · 0.05V (Call), 1 time per 1 minute (Receiver)

˺ 3.46 · 0.05V (Standby), 1 time per 3 minutes(Speaker)

3.35 · 0.05V

Over 50 hours

Lithium-Ion Battery, Inner pack

Standard Voltage = 3.7 V

Battery full charge voltage = 4.2 V

Capacity: 900mAh

Switching-mode charger

Input: 100 ~ 240V, 50/60 Hz

Output: 4.8V, 700mA ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



X[VXZZ


3. TECHNICAL BRIEF

'LJLWDO0DLQ3URFHVVRU

3.1 Digital Main Processor


Figure. 3.1.1 X-Gold tm 213 Hardware Block Diagram

)LJXUH;*ROGWP+DUGZDUH%ORFN'LDJUDP



3.1.1 General

• Technology:

– SoC, Monolithic, 65 nm CMOS

• Package:

– eWLB, 8x8x0.8 mm

– 0.5 mm pitch

– 217 balls / 6-layer PCB

3.1.2 RF Transceiver

• Dual-band direct conversion receiver

• Tri/Quad-band possible with external circuitry

• Fully integrated digital controlled X0

• Additional buffer for 2 external system clocks

• Fully digital RF-Synthesizer incl. ȭȟ -Transmitter

3.1.3 Baseband

• DSP:

– 156 MHz TeakLite™

• MCU:

– ARM1176® @ 208 MHz

• MCU RAM:

– 3.00Mbit

• Memory I/F:

– 512 Mbit

• Modem:

– GPRS class 12, (RX/TX CS1-CS4)

– EGPRS class 12, (RX MCS1-MCS9, TX MCS1-MCS4)

• Cipher Units:

– A51/2/3

– GEA-1/2/3

• Security:

– OMTP TR0

– Secure Boot

– RSA(ROM)/SHA-1(HW accel.)

– OCDS disabling

– Certificate Management ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



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- 17 -






• Speech Codec:

– FR / HR / EFR / NB-AMR

• Audio Codec (running on ARM1176):

– SP-MIDI

– SB-ADPCM

– MP3

– WB-AMR

– AAC/AAC+/eAAC+

• Others:

– DARP (SAIC)

– TTY

• Customization:

– E-Fuses

3.1.4 External Memory

• External Bus Unit

– 25-bit address bus (512 Mbit)

– 16-bit data bus

– 1.8V & 2.8V support

• Flash / RAM

– NOR Type

– Serial Flash SPI and SPI-4

– Parallel Flash (Page & Burst Mode)

- 16-bit Demultiplexed

- 16-bit AD-multiplexed

- 16-bit AAD-multiplexed

– iNAND Type e.g. oneNAND

• Memory card

– SD/MMC card interface with 1 or 4 data lines

3.1.5 Connectivity

• 3xUSIF (configurable either as SPI or UART), I2C, I2S; Interfaces @ 1.8V

• Direct (U)SIM 1.8/3V

• USB2.0 up to 480 Mbit/s (High Speed) w/ external USB Phy over ULPI interface

• Stereo Headset (Amplifier integrated)

• 3 external analog measurement PIN’s

• Bluetooth ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


X^VXZZ





3.1.6 Mixed Signal

• Improved audio performance

• Loudspeaker Audio Class D Amplifier, 700 mW@8 ȳ mono for hands-free and ringing

• Stereo Headset 2x30 mW@16 ȳ w/o coupling C

• Mono Earpiece 100 mW@16 ȳ

• Digital microphone supported

• Differential microphone inputs

3.1.7 FM Radio

• Integrated FM radio

– FM Stereo RDS Receiver

– Sensitivity 2 Ɇ V EMF

– Support for US & EU bands

– Stereo recording

3.1.8 Power Management

• Direct-to-Battery Connection

– LDOs (incl. capless)

– DC/DC step-down converter

– DC/DC step-up for white LED supply

• Battery Type

– Li-Polymer

• Charging control

– Battery temperature

– Watchdog protection

– Start-up on flat battery

• External Charger

– Switch mode

• USB battery charging

– USB charging spec 1.0 compliant

• Backlight

– Up to 5 serial white LEDs (integrated LDO) ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



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3.1.10 Main LCD Display

• Type

– 240*320, QVGA, 262k color (parallel)

• Interface

– Parallel 8bit MIPI-DBI Type B

– Serial MIPI-DBI Type C

– Interf. voltage at 1.8V or 2.8V

• gRacr - Display Controller (Hardware)

– 30 fps Display update without DMA (up to 60 fps) (full or partial)

– Video post processing Scaling, Rotation (90 ¶ steps), Mirroring

– Overlay with alpha blending

– Color conversion YUV -> RGB

– 2D vector graphics (Lines, filled rectangles, Bit block transfer (e.g. sprites, scrolling, antialiased bitmap fonts)

3.1.11 Camera

• 2.0 Mpxls, FF

• Frame Rate : 15@UXGA, 30@SVGA

• 39 MHz Pixel Rate

• 15 [email protected] Mpx full resolution

3.1.12 Video Capabilities

• Video Decoding MPEG-4/H.263

– QCIF@30 fps

– QVGA@15fps

• Video Encoding MPEG-4/H.263

– QCIF@15 fps

3.1.13 Audio Capabilities

• Polyphonic ring tones

– 64 voices MIDI, SP-MIDI

– FM synthesizer

• AMR-WB

• True ring tones (MP3)

• MP3, eAAC+

• G.722 SB-ADPCM encoding/decoding ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


X`VXZZ





3.2 Power Management

A mobile platform requires power supplies for different functions. These power supplies are generated in the integrated power management Unit (PMU). The PMU is designed to deliver the power for a typical standard phone.

Figure. 3-2-1 Block Figure of the PMU Modules X-Gold tm 213 ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



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̲ DC/DC Step Down Converter for 1.8V (SD1)

The DC/DC converter generates a 1.8V supply rail. This voltage rail is used to supply main parts of the system, like the digital core of the chip (via LDO LCORE), some parts of the mixed signal macro, parts of the RF macro and the external memory if a 1.8V memory is used. The efficiency of the DC/DC converter is optimized for an average load current of 100mA. That is the load current estimated for the GSM talk mode.

̲ Linear voltage Regulators (low dropout) LDOs

The LDOs are used to generate the supply for the different supply domains not directly supplied out of the DC/DC converter.

The VSIM output current is high enough to drive USB SIM cards.

̲ LCORE

The LCORE LDO provides the VCORE supply used for most of the digital parts of the chip

̲ LPMU

The LPMU provides VPMU sued for the PMU supply, e.g. for the startup state machine and analog parts like ADC, sense amplifier etc.

̲ LUSB

The LUSB LDO generates the supply for the USB transceiver (output driver and input). If no USB interface is required, LUSB can be used as general purpose LDO.

̲ LAUX

The LAUX generates VAUX. It is a general purpose LDO and can be used for different functions depending on the phone application, e.g. for the display or Camera.

̲ LMMC

The LMMC generates VMMC. It is a general purpose LDO and can be used e,g. for memory cards

̲ LSIM

The LSIM LDO generates the VSIM supply for the SIM card and interface. It is designed to supply

Standard SIM cards.

̲ Other LDOs

The RF module has implemented several LDO’s for different RF Power domain.

The mixed signal module has some LDO’s for the audio driver and microphone supply.

ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


YXVXZZ



Table. 3-2-1 Power supply Domains (without RF) ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ 22/133






3.2.1 Power on and startup

̲ Analog startup Circuit

Because the POR circuit and the LPBG are directly connected to the battery, it is not possible to switch them off. If the battery voltage exceed the power on reset threshold (2.5V), the power on reset is released, the LPMU regulator and the LRTC voltage regulator are switched on. The LPMU regulator starts in its ultra-low power mode.

The LPMU regulator generates a control signal (lpmu_OK) that enables the 50KHZ PMU oscillator. The output clock of the oscillator is checked with a fully coded counter. A counter overflow releases the reset

(vpmu_rst_n) signal for the small PMU state-machine.

̲ Small first digital State-Machine

The small PMU state-machine is always connected to VPMU After starting from reset the small startup state machine enters the SYSTEM OFF state and only continuous the startup procedure if a switch on event like first connect, on-key, wake up or charge detect occurs.

̲ PMU-main State-Machine

The main PMU state-machine is always connected to VPMU also. The power up sequence driven by the

PMU state-machine can be seen in Figure18. After enabling the reference (HPGB) and waiting for the settling time, the battery voltage is measured and compared with the power on threshold. If the battery voltage is high enough, the SD1 DC/DC converter and the LCORE LDO are started. A timer ensures that the supply voltage will be stable before the DCXO is enabled. The DCXO settling time is ensured using a fixed timer. After an overflow of this timer, the reset is released for the rest of the system. The PMU state machine remains in this System-ON state until the system is switched into the OFF state. For example the system sleep mode is completely configured by software( for example switching off the LDO’s, switching of the DCXO etc.) and controlled by the VCXO_enable signal. The reason for the startup is stored in the

ResetSourceRead register.

̲ Battery Measurement

The ADC and the oscillator for the ADC needs the VDD_ADC supply voltage from the LADC LDO. LADC uses either the charger voltage VDD_CHARGE or VDDRTC as input voltage. The input voltage is selected automatically by a bulk switch circuit. LADC, the ADC and the oscillator are enabled on request for every battery measurement if the charger unit is not running. This is handled by an ADC control block in one of the state-machines. If the charger unit is running the ADC is controlled by the charger state-machine ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


YZVXZZ





Figure.3.2.1 First Part of the State Machine,

Running in Different Power Domains than the Second Part ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



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Figure 3.2.2 Second (Main) Part of the Startup State Machine in the VPMU Domain ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

Y\VXZZ





3.2.2 Switching on due to first connect

If the battery voltage is connected the first time, that means the system enters the first time the SYSOFF state, this is stored in a first connect flag. If the first connect flag is set, the system will start immediately and not wait for any other system on event in the SYSOFF state.

3.2.3 Switching on due to on-Key event

The on key is connected to the ONKEY pad. The ESD protection and the input structure of this pad are connected to VRTC. If the ONKEY pad is forced to VRTC by an external key or similar circuit, the system starts. The ONKEY is sampled with the PMU clock. It has to be sampled four times high before a valid on event is generated. The status of the ON key can be read in the PMU registers, so it can be used as a functional key during phone operation also.

3.2.4 Switching on due to RTC alarm

The real time clock can generate a wakeup signal called RTC alarm. This signal is sampled from the statemachine and after successfully detecting a high, the system is switched on.

3.2.5 Switching on due to charging

When a battery with a voltage below the SSONLEV level is inserted, the state machine will not start the system. As long as the battery voltage stays lover than SYSONLEV the system will stay off. The only possibility to start up the system is due to an external charger.

If an external charger is connected and detected and the battery is charged above the SYSONPRE voltage level the system will start up.

The PMU main state machine waits in the Check battery state until the battery voltage condition is fulfilled. The charger state machine provides the necessary pre-charge indication signal. This pre-charge signal is denounced in a small counter to have a stable signal. This is important, especially in half/fullwave charging where the charger detection is switching between charger detected/not detected according the AC supply frequency. Reasons for details on pre-charging see the charger chapter. The

3. TECHNICAL BRIEF pre-charge, the PMU-state machine now changes to state HPBG on state and the system starts. This state change is indicated to the charger state-machine to enable the charger watchdog for safety

3.2.6 Power Supply Start-up sequence

In order to avoid an excessive drop on the battery voltage caused by in-rush current during system power-on, possibly leading to system instability and “hick-ups” a staggered turn-on approach for the regulators is implemented. The regulators are turned on in a well defined sequence, thus spreading the in-rush current transients over time.

The IO’s of X-GOLD TM 213 are isolated in OFF mode (core supply is off). The isolation signal is controlled by the PMU state machine. This ensures that the PADs are in a well defined state during core supply settling. This allows to power up the LCORE core regulator and wait for the core to reach reset state before powering up the I/O supply regulators.




- 27 LGE Internal Use Only ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

Y^VXZZ





Figure 3.2.3 Start Up Sequence (triggered by First Connect Event)

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3.2.7 External Reset Handling

The chip reset can be controlled by an external RESET_N ball. If this ball is pulled low, the chip will be reset. All PMU registers are reset during the external reset including LSIM control bits. The PMU statemachines are also not reset from the external reset. An SW or watchdog reset will not reset the PMU registers. A SW and Watchdog reset is seen on the reset_n pad to allow the reset of external devices.

Basically there are three reset sources, first the reset signal controlled by the PMU (reset_pmu_n_o), second the reset signal controlled by the SCU (resetout_o) and third the external reset (RESET_N). The

SCU reset is triggered by SW (for example due to a SW reset or watchdog reset). The PMU reset is controlled by the PMU state machine. The output of the reset handling block is the reset_postscu_n_o signal. This signal controls for example the Ɇ C subsystem and releases reset for the controller. During normal start up, the PMU releases the reset_pmu_n_o signal after entering the SYSTEM ON state. At this time the resetout_o signal is high, the RESET_N pad is not pulled low and therefore the reset_postscu_n_o signal follows the reset_pmu_n_o signal. That means the Ɇ C reset will be released and the Ɇ C starts operation. If the SW triggers an external reset via the SCU, signal resetout_o will be forced to low for a certain time and RESET_N will be forced to low by the open drain driver. At the same time the feedback to the SCU will be masked to not reset the baseband. The RESET_N pad is in the

VDDRTC domain but the internal pull up is connected to the VDD_VDIG1 (1.8V) domain. That allows the pad to be used as reset for external devices running in the VDD1V8 domain. The RESET_N pad can also be used to monitor the chip internal reset condition during startup.

The open drain driver is a weak driver, that means it can be forced to high during debug from external pushing some current into the pad. In testmode signal reset_pmu_n_o is high, that means the chip reset is fully controlled from external . ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

Y`VXZZ






Figure 3.2.4 PMU, CGU and External Reset

3.2.8 Sysclock Switching

The PMU controls the rf_sysclk_en signal of the DCXO in the RF macro. During startup the PMU enables the DCXO. After the system is running the DCXO is controlled by the SCU of the baseband by using the vcxo_enable signal. This is handled by a dedicated logic in the PMU, see Figure 21. As long as rf_sysclk_en_pmu, the output of the PMU state-machine is high, vcxo_enable controls the rf_sysclk_en signal to the RF. If rf_sysclk_en_pmu is low, the DXCO is switched off, independent from vcxo_enable. ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


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Figure 3.4.2 How sysclock Enable is Routed in the PMU

3.2.9 Undervoltage Shutdown

In active mode the PMU periodically measures the battery voltage using the ADC from the charger unit. If the battery is measured to be below the programmable shut-down level (called SYSOFF), the system changes to OFF mode. This is done via the SHUTDOWN state of the PMU state machine. (see chapter switch OFF)

3.2.10 Software Reset

A software reset does not affect any PMU register. The PMU register are reset with the reset_pmufsm_n_o signal. That means all PMU register are reset in OFF state. For details about the SW reset see chapter External Reset Handling .







3.2.11 PMU Clock

During the first startup (for example plugging in a battery) a PMU internal oscillator is used for generation of the PMU clock (pmu_clock). The frequency is slightly above 32 kHz (typ. 50 kHz) to be out of the audio band also for worst case devices. After first startup the software shall enable the 32 kHz crystal oscillator. It is not possible to use the 32 kHz oscillator during first startup, because the settling time of the oscillator can be quite long. After the 32 kHz oscillator is running and settled the software shall switch the PMU clock to the 32 kHz clock and disable the internal PMU oscillator for power saving reasons. The 32 kHz oscillator shall never be disabled after the PMU clock has been switched. The ADC in the charger unit has it’s own oscillator generating a frequency of about 10 MHz. This oscillator is running during charging and during battery measurements triggered by the PMU. It is off otherwise.

3.2.12 System Sleep Mode

The sleep mode is controlled by using the VCXO_enable signal. This signal is used to switch the LDO’s and the DC/DC converter SD1 in a programmable way into its low power mode (PFM). In addition DC/DC converter SD1 can be configured to change the output voltage to a lower value for additional power saving. VCXO_enable is also used to deactivate the HPBG and setting LDO LPMU in the ultra-low-power mode. In addition the DCXO is switched off by the VCXO_enable signal. The VCXO_enable signal is also used to switch some LDO’s (software configured) to sleep and/or off mode or to change the output voltages of said LDO’s. The state of the main PMU state machine is not changed due to VCXO_enable.

3.2.13 DC/DC Pre-Load Register Handling

The DC/DC converter works in different modes. If the mode is switched from PFM to PWM the pulse-width of the DC/DC converter depends on the current battery voltage (and on the output voltage). The PMU state-machine knows the battery voltage because of the battery supervision function. Depending on this value it selects a startup pulse-width for the DC/DC converter out of a register table. (4-values)

3.2.14 Power Down Sequence

Setting bit OFF in the GeneralControl register switches the system into OFF mode. After the turn off event, the state-machine switches to the SHUTDOWN state. The reset_pmu_n_o signal changes to low, the I/O pads are isolated using the padisolation_n signal, the LCORE LDO and the SD1 DC/DC converter are switched off, the LPMU LDO is switched to ultra-low power mode, the DCXO is turned off and the bandgap buffer is disabled. Before switching OFF the software shall have enabled the 32 kHz oscillator and has switched the PMU clock to the 32 kHz clock to archive the target OFF current .



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3.3 FEM with integrated Power Amplifier Module (RF7161, U301)

3.3.1 Internal Block Diagram

Figure. 3-3-1 RF7161 FUNCTIONAL BLOCK DIAGRAM

3.3.2 General Description

The RF7161 is a quad-band (GSM850/EGSM900/DCS1800/PCS1900) GSM/GPRS, Class 12 compliant transmit module with four interchangeable receive ports. This transmit module builds upon RFMD’s leading power amplifier with PowerStar® integrated power control technology, pHEMT switch technology, and integrated transmit filtering for best-in-class harmonic performance. The results are high performance, reduced solution size, and ease of implementation. The device is designed for use as the final portion of the transmitter section in a GSM850/EGSM900/DCS1800/PCS1900 handset and eliminates the need for a PA-toantenna switch module matching network. The device provides 50 ȳ matched input and output ports requiring no external matching components.

The RF7161 features RFMD’s latest integrated power-flattening circuit which significantly reduces current and power variation into load mismatch. Additionally, a VBATT tracking feature is incorporated to maintain switching performance as supply voltage decreases. The RF7161 also integrates an ESD filter to provide excellent ESD protection at the antenna port. The RF7161 is designed to provide maximum efficiency at rated POUT.




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- LGE Internal Use Only


3.3 FEM with integrated Power Amplifier Module (RF7161, U301)

3.3.1 Internal Block Diagram


Figure. 3-3-1 RF7161 FUNCTIONAL BLOCK DIAGRAM

3.3.2 General Description

The RF7161 is a quad-band (GSM850/EGSM900/DCS1800/PCS1900) GSM/GPRS, Class 12 compliant transmit module with four interchangeable receive ports. This transmit module builds upon RFMD’s leading power amplifier with PowerStar® integrated power control technology, pHEMT switch technology, and integrated transmit filtering for best-in-class harmonic performance. The results are high performance, reduced solution size, and ease of implementation. The device is designed for use as the final portion of the transmitter section in a GSM850/EGSM900/DCS1800/PCS1900 handset and eliminates the need for a PA-toantenna switch module matching network. The device provides 50 ȳ matched input and output ports requiring no external matching components.

The RF7161 features RFMD’s latest integrated power-flattening circuit which significantly reduces current and power variation into load mismatch. Additionally, a VBATT tracking feature is incorporated to maintain switching performance as supply voltage decreases. The RF7161 also integrates an ESD filter to provide excellent ESD protection at the antenna port. The RF7161 is designed to provide maximum efficiency at rated POUT.






1. RX1, RX2, RX3, and RX4 are broadband receive ports and each supports the EGSM, GSM850, PCS, and DCS bands.

Figure 3.3.2 Band SW Logic Table

DCS_PCS_OUT

GSM_OUT

L301 3.3n

1n

L308

L302 3.3n

C392

DNI

C306 56p

C343 22p

C305

1p

7

10

11

8

9

GND5

GND6

GND7

RX1

RX2

C359

DNI

L303 3.3n

L306 3.3n

C322

33p

C302

33p

C314

1.5p

GND_SLUG

VRAMP

TX_ENABLE

GPCTRL0

GPCTRL1

VBATT

23

22

21

20

19

18

Figure 3.3.3 FEM CIRCUIT DIAGRAM

VBAT

C327

4.7u

C317

4.7u

R327

10

C315

39p

C319

1n

C318

1n

C326

1n

TX_RAMP

TX_EN

BS1

BS2

VLOGIC ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



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The X-GOLDTM213 RF-Subsystem contains a fully integrated 26 MHz digitally controlled crystal oscillator, designed for 8 pF crystals.

The only external part of the oscillator is the crystal itself. Overall pulling range of the

DCXO is approximately · 55 ppm, controllable by a 13-bit tuning word.

Figure. 3.4.1 Crystal Oscillator External Connection

This frequency serves as comparison frequency within the RF-PLL and as clock frequency for the digital circuitry.

The 26 MHz reference clock can also be applied to external components like

Bluetooth or GPS, via the two buffered output signals FSYS1 and FSYS2.

Figure. 3.4.2 Digital PREDISTORTION with LUXO

The DCXO tuning characteristic should be a first order linear function of the programming word AFC. The variable capacitance array is a first order linear function of the digital word DIG, which leads to a nonlinear curve ppm vs. DIG (and also a nonlinear ppm vs. AFC for DIG=AFC). In order to linearize the ppm vs. AFC curve the implementation of a predistortion is necessary.

To get the wanted linear ppm vs. AFC tuning curve some digital predistortion of the AFC word is required.

This predistortion is performed by the linearization unit for crystal oscillator (LUXO). The LUXO calculates the corresponding DIG value according to the given AFC value.



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3.5 RF Subsystem of PMB8810 (U101)

3.5 RF Subsystem of PMB8810 (U102)




3.5.1 GENERAL DESCRIPTION

3.5.1 GENERAL DESCRIPTION

class 12). The system can be configured to support one low band, GSM850 or EGSM900, and one

The PMB8810 RF subsystem is designed for dual-band GSM voice and data applications (GPRS class 12).

The system can be configured to support one low band, GSM850 or EGSM900, and one high band, DCS1800 or PCS1900. A block diagram of the RF subsystem is given in Figure 3-5-1.

ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



Z`VX\_ ʹΠΡΪΣΚΘΙΥ͑ι ͣͨ͑͡͡ͽ͸͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟

΀ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ

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3.5.2 FUNCTIONAL DESCRIPTION

3.5.2.1 Receiver

The X-GOLD™213 dual-band receiver is based on a Direct Conversion Receiver (DCR) architecture. Input impedance of the LNAs is optimized to achieve a matching without (external) high quality inductors. By use of frequency dividers (by 2/4) the LO frequency is derived from the RF frequency synthesizer.

The receive path is fully differential to suppress the on-chip interferences and reduce DC-offsets. The analog chain of the receiver contains two LNAs (low/high band), a quadrature mixer followed by an analog baseband filter and 14-bit continuous-time delta-sigma analog-to-digital converter. The filtered and digitized signal is fed into the digital signal processing chain, which provides decimation, DC offset removal and programmable gain control.

Figure. 3.5.2 RECEIVER CHAIN BLOCK DIAGRAM ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


37/133





3.5.2.2 Transmitter

The GMSK transmitter supports power class 4 for GSM850 or GSM900 as well as power class 1 for

DCS1800 or PCS1900. The digital transmitter architecture is based on a fractional-N sigma-delta synthesizer for constant envelope GMSK modulation. This configuration allows a very low power design without any external components.

Up- and down-ramping is performed via the ramping DAC connected to VRAMP.

Figure. 3.5.3 TRANSMITTER CHAIN BLOCK DIAGRAM

RF synthesizer

The RF subsystem contains a fractional-N sigma-delta synthesizer for the frequency synthesis. Respective to the chosen band of operation the phase locked loop (PLL) operates at twice or forth of the target signal frequency. In receive operation mode the divided output signal of the digital controlled oscillator output

(DCO) serves as local oscillator signal for the balanced mixer. For transmit operation the fractional-N sigma-delta synthesizer is used as modulation loop to process the phase/frequency signal. The 26 MHz reference signal of the phase detector incorporated in the PLL is provided by the reference oscillator.







3.5.2.3 Front-end/PA Control Interface

Two outputs (FE1, FE2) for direct control of antenna switch modules enable to select RX- and TX-mode as well as low- and high-band operation.

An extra band select signal PABS for the power amplifier is used, to support discrete PA and switching modules. Time accurate power dissipation of the PA is achieved by the control signal PAEN.

A minor set of power amplifiers require a bias voltage to enhance power efficiency. Support of this power amplifiers is achieved by the implemented bias DAC.

Figure. 3.5.4 PA AND FEM CONTROL BLOCK DIAGRAM ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


Z`VXZZ





3.5.2.4 Power Supply

To increase power efficiency most parts of the RF subsystem are supplied by the DCDC converter situated in the PMU subsystem. Conversion of the 1.8 V output voltage of the DCDC to the 1.3 V/1,4 V circuit supply voltages is achieved by several Low-DropOut regulators (LDO).

One embedded direct-to-battery LDO provides the 2.5 V supply voltage for the remaining circuits.

Figure. 3.5.5 POWER SUPPLY BLOCK DIAGRAM ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

[WVXZZ






Figure. 3.6.1 MEMORY BLOCK DIAGRAM

The Numonyx™ StrataFlash® Cellular Memory (M18) device provides high read and write performance at low voltage on a 16-bit data bus.

The flash memory device has a multi-partition architecture with read-while-program and read-whileerase capability.

The device supports synchronous burst reads up to 108 MHz using ADV# and CLK address-latching

(legacy-latching) on some litho/density combinations and up to 133 MHz using CLK address-latching

.

only on some litho/density combinations. It is listed below in the following table.



[XVXZZ





Table 3_6_1 M18 Frequency combinations

In continuous-burst mode, a data Read can traverse partition boundaries.

Upon initial power-up or return from reset, the device defaults to asynchronous arrayread mode.

Synchronous burst-mode reads are enabled by programming the Read Configuration Register. In synchronous burst mode, output data is synchronized with a user-supplied clock signal. A WAIT signal provides easy CPU-to-flash memory synchronization.

Designed for low-voltage applications, the device supports read operations with VCC at 1.8 V, and erase and program operations with VPP at 1.8 V or 9.0 V. VCC and VPP can be tied together for a simple, ultra-low power design. In addition to voltage flexibility, a dedicated VPP connection provides complete data protection when VPP is less than VPPLK.

A Status Register provides status and error conditions of erase and program operations.

One-Time-Programmable (OTP) registers allow unique flash device identification that can be used to increase flash content security. Also, the individual block-lock feature provides zero-latency block locking and unlocking to protect against unwanted program or erase of the array.

The flash memory device offers three power savings features:

• Automatic Power Savings (APS) mode: The device automatically enters APS following a read-cycle completion.

• Standby mode: Standby is initiated when the system deselects the device by deasserting CE#.

• Deep Power-Down (DPD) mode: DPD provides the lowest power consumption and is enabled by programming in the Enhanced Configuration Register. DPD is initiatied by asserting the DPD pin.




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Figure 3_7_1. BT BLOCK DIAGRAM

This module has an integrated radio transceiver that has been optimized for use in 2.4GHz

Bluetooth Wireless systems. It has been designed to provide low-power, robust communications for applications Operating in the globally available 2.4GHz unlicensed ISM band. It is fully compliant with the Bluetooth Radio Specification and enhanced data rate specification and meets or exceed the requirement to provide the highest communication link quality of service. ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


[ZVXZZ





3.7.1 Transmitter path

This module features a fully integrated zero IF transmitter. The baseband transmitted data Is digitally modulated in the modem block and up-converted the 2.4GHz ISM band in the Transmitter path. The transmitter path consists of signal filtering, I/Q up-conversion, high -output power amplifier(PA), and

RF filtering. It also incorporates modulation schemes P/4-DQPSK for 2 Mbps and 8-DPSK for 3 Mbps to support enhanced data rate.

• Digital modulator

The digital modulator performs the data modulation and filtering required for the GFSK, b/4DQPSK, and 8-DPSK signal. The fully digital modulator minimizes any frequency drift or anomalies in the modulation characteristics of the transmitted signal and is much more Stable than direct VCO modulation schemes.

• Power Amplifier

The integrated PA for the BCM2070 is configurable for Class 2 operation, transmitting up to +4 dBm as well as Class 1 operation and transmit power up to +12 dBm at the chip, gFSK, >2.5V supply. Due to the linear nature of the PA, combined with some integrated filtering, no External filters are requires for meeting Bluetooth and regulatory harmonic and spurious requirements. For integrated mobile handset applications, where Bluetooth is integrated next to the celluar radio, minimal external filtering can be applied to achieve near thermal noise levels for spurious and radiated noise emissions.

Using a highly linearized, temperature compensated design the PA can transmit +12 dBm for Basic rate and +10 dBm for enhanced data rates(2 to 3 Mbps). A flexible supply voltage range Allows the PA to operate from 1.2V to 3.0V. The minimum supply voltage at VDDTF is 1.8V to achieve +10dBm of transmit power.

3.7.2 Receiver path

The receiver path uses a low IF scheme to down-convert the received signal for demodulation in the digital demodulator and bit synchronizer. The receiver path provides a high degree of Linearity, an extended dynamic range, and high order on-chip channel filtering to ensure reliable operation in the noisy 2.4GHz ISM bnad. The front-end topology, with built-in out -of-bnad attenuation, enables the device to be used in most applications with no off-chip Filtering. For integrated handset operation where the Bluetooth function is integrated close to the celluar transmitter, minimal external filtering is required to eliminate the desensitization of The receiver by the cellular transmit signal. ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



[[VXZZ




SIM_CONNECTOR 1(Default)

2V85_VSIM

2V85_VSIM

SIM_DATA

R417

4.7K

R418

DNI

4

5

6

8

GND

VPP

I_O

GND2

ZD403

C416

22p

J401

VCC

RST

CLK

GND1

1

2

3

7

C413

0.1u

ZD401

C414

DNI

ZD402

C415

22p

SIM_RST

SIM_CLK

ZD200ZD201 is DNI defaultly

These are added for CMCC ESD test

Figure 3-8-1. SIM CARD Interface

The Main Base Band Processor(XMM2130) provides SIM Interface Module.

The XMM2130 checks status Periodically During established call mode whether SIM card is inserted or not, but it doesn't check during deep sleep mode. In order to communicate with SIM card, 3 signals

SIM_DATA, SIM_CLK, SIM_RST.

And This model supports 1.8/3V SIM Card.

Signal

SIM_RST

SIM_CLK

SIM_DATA

This signal makes SIM card to HW default status.

This signal is transferred to SIM card.

This signal is interface datum.

Description ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


[\VXZZ





3.9 LCD Interface

VMMC

LCD CONNECTOR

LCD_ID

MAKER ID : LOW

LCD_DATA04

LCD_DATA05

LCD_DATA06

LCD_DATA07

FL404

3

4

1

2

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

9

8

7

6

LCD_VSYNC

R445

100ohms

VA416 C430

0.001uF

C428

1uF

C427

27pF

CN403

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

1V8_VDD VBAT

C425

1uF

C426

2.2u

VA415

R446

100ohms

C429

0.001uF

FL405

3

4

1

2

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

7

6

9

8

_LCD_RESET

TP402

LCD_DATA00

LCD_DATA01

LCD_DATA02

LCD_DATA03

FL403

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

9

8

7

6

TP403

TP404

TP405

NLCD_WR

NLCD_MAIN_CS

LCD_RS

MLED1

MLED2

MLED3

MLED4

MLED5

Figure 3-9-1. LCD Interface of LCD FPCB ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



[]VXZZ




CAM_IO_1V8

CAM_D_1V5

CAM_A_2V8

1V8_HPVDD

VBAT

9

10

11

12

6

7

8

AGND

VIN

LDOIN

LDO4

LDO3

LDO2

LDO1

U402

VOUT

LED1

LED2

LED3

LED4

LED5

LED6

20

19

18

24

23

22

21

C420

1u

C401

1u

C402

1u

C433

1u

C421

2.2u

C422

2.2u

31 41 51 61 71

MLED1

MLED2

MLED3

MLED4

MLED5

C419

2.2u

I2C_SCL

I2C_SDA

LCD_BL_CTRL

1V8_VDD

C418

0.1u

R427

100K

Figure 3-9-2. RT9396 CIRCUIT DIAGRAM

The RT9396 is an integrated solution for backlighting and phone camera input supply. The part contains a charge pump white LED driver and dual low dropout linear regulators. This IC can be shutdown by pulling ENA low.

In the section of charge pump, The RT9396 can power up 5 white LEDs with regulated constant current for uniform intensity. Each channel (LED1-LED5) can support up to

25mA. The part maintains highest efficiency by utilizing a x1/x1.5/x2 fractional charge pump and low dropout current regulators. An internal 5-bit DAC is used for brightness control. Users can easily configure up to 32-step of LED current by I2C interface.

In the section of linear regulator, The RT9396 comprises a dual channel, low noise, and low dropout regulator sourcing up to 300mA at each channel. The range of output voltage can be configured from

1.1V to 3.3V by I2C interface. The outputs of LDO offer 3% accuracy and low dropout voltage of 250mV

@300mA. The LDO also provides current limiting and output short circuit thermal folded back protection.



47/133





Figure 3-9-3. RT9396C FUNCTION BLOCK DIAGRAM ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



[_VXZZ




3.10 Battery Charger Interface

CHARGING IC

VBUS_USB

From External Source

(Travel Adaptor or USB)

VBAT

LDO_OUT

C222

0.1u

C223

1u

(25V)

R233

820

R234

3.9K

1

2

3

4

5

PGND

VIN BATT

ISET

GND1

LDO

U203

RT9524

EUSY0410801

PGB

GND2

IEOC EN_SET

9

8

7

6

11

10

C221

1u

(10V)

C257

0.1u

1V8_VDD

R217

100K

_EOC

CHG_EN

Figure 3-10-1 BATTERY CHARGER BLOCK

The RT9524 is a fully integrated single-cell Li-Ion battery charger IC ideal for portable applications. The RT

9524 optimizes the charging task by using a control algorithm including pre-charge mode, fast charge mode and constant voltage mode. The input voltage range of the VIN pin can be as high as 30V. When the input voltage exceeds the OVP threshold, it will turn off the charging MOSFET to avoid overheating of the chip.

In RT9524, the maximum charging current can be programmed with an external resister. For the USB application, user can set the current to 100mA/500mA through EN/SET pin. For the factory mode, the

RT9524 can allow 4.2V/2.3V power pass through to support system operation. It also provides a 50mA

LDO to support the power of peripheral circuit. The internal thermal feedback circuit regulates the die temperature to optimize the charge rate for all ambient temperatures. The RT9524 provides protection functions such as under voltage protection, over voltage protection for VIN supply and thermal protection for battery temperature.

The RT9524 is available in a WDFN-10L 2x3 package to achieve optimized solution for PCB space and thermal considerations.



[`VXZZ





3.11 Keypad Interface

KEY_COL0

CN401

1

2

3

4

KB437

Q

KB422

O

VA417 VA419 VA418

KB436

W

KB423

P

R416

R428

R429

100ohms

100ohms

100ohms

KB435

E

KB424

A

KEY_ROW6

KEY_ROW7

KEY_COL5

KB430

R

KB425

S

KB434

T

KB426

D

POWER ON

VRTC

KB101

C146

2.2u

END_KEY

D101

R118

100

R117

100K

PWRON

KB433

Y

KB427

F

KB432

U

KB428

G

KB431

I

KB429

H

KEY_COL1

KEY_COL2

KEY_COL3

KEY_COL4

KEY_COL5

KB440

J

KB412

V

KB411

@

KB439

K

KB413

B

KB410

SPACE

KB445

OK

KB443

L

KB414

N

KB409

,(COMMA)

KB407

LEFT

KB444

BACK

KB415

M

KB438

.(PRIOD)

KB406

RIGHT

KB421

SHIFT

KB416

?(QUES)

KB408

SYM

KB405

UP

KB441

Z

KB442

X

KB417

ENTER

KB403

LEFT SOFT

KB404

DOWN

KB418

LOCK

KB402

RIGHT SOFT

KB420

C

KB419

MESSAGE

KB401

SEND

KEY_ROW0

KEY_ROW1

KEY_ROW2

KEY_ROW3

KEY_ROW4

KEY_ROW5

KEY_ROW6

KEY_ROW7

Figure 3-11-1 MAIN KEY STRUCTURE

Figure 3-11-1 MAIN KEY STRUCTURE ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



\WVXZZ




The Keypad Interface is a peripheral controller, which can be used for scanning external keypad matrices with up to 8 rows and 8 columns (that is 64 standard keys). By adding an additional row of keys connected to ground the number of keys can be extended by up to 8 keys. This results in a maximum number of 72 keys to by identified by the Keypad Interface Controller.

The Keypad Scan Module reduces the number of interrupts and polling through the processor and therefore reduces the power consumption. The module is able to debounce and scan the external keypad matrix automatically without any software intervention. After debouncing it generates an interrupt. The interface controller contains information about the key (or key combination) that was pressed and how long it was pressed.

Figure 3-11-3 Block Diagram and System Integration of the KPD ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


51/133





3.12 Audio Front-End

3.12.1 Functional Overview

The audio front-end of X-GOLD™213 offers the digital and analog circuit blocks for both receive and transmit audio operation, from a mobile phone perspective (called audio-in and audio-out subsequently). It features a high-quality, stereo digital-to-analog path with amplifier stages for connecting acoustic transducers to X-GOLD™213. In audio-in path the supply voltage generation for electret microphones, a low-noise amplifier and analog to digital conversion are integrated in X-GOLD™213. A more detailed functional description will be given in the following sections.

The audio front-end itself can be considered to be organized in three sub-blocks:

• Interface to processor cores (TEAKLite® and - indirectly - ARM)

• Digital filters

• Analog part

The following figure shows an architecture overview of the Audio section.

Figure 3.12.1 Audio Section Overview ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



\YVXZZ




Figure 3.12.2 Overview of Clocking and Interfaces of Audio Front End

The audio front-end of X-GOLD™213 has the following major operation modes:

• Power-down: All analog parts are in power down and all clocks of the digital part are switched off.

• Audio mode: Digital decimation/interpolation filters are connected to the interface buffers and the analog part is enabled.

These major modes can be modified by certain control register settings.

• Due to the new gain settings in the TX path, the maximum input voltage is limited to 0.8 Vpp.

• In both voiceband paths, the value range for voice samples is confined to 97.5%, i.e. to [-31948, 31947] or

[8334H, 7CCBH] in X-GOLD™213.

• On the TX path, 83% "1"s on the VTPDM line correspond to a 16-bit value of 7CCBH and 17% "1"s correspond to a 16-bit value of 8334H at the digital filter output. Thus the usable range is 66%. This range can be scaled to 100% by Firmware.

• The high-pass functions of the voiceband filters have to be implemented in firmware on TEAKLite®.



\ZVXZZ





3.12.2 Digital Part

The digital part of the X-GOLD™213 audio front-end comprises an interface to the TEAKLite® bus, interfaces to the interrupt units of TEAKLite®, digital interpolation filters for oversampling digital-toanalog conversion, digital decimation filters for analog-to-digital conversion and an interface to the analog part of the audio front-end. For the digital microphone all the filtering is done in a dedicated hardware. The output sample stream is then fed in a duplicated ring buffer structure like the data from the analog microphone path (after A/D conversion and subsequent digital filtering).

̲ Interpolation Filter

The interpolation path of the X-GOLD™213 audio front-end increases the sampling rate of the audio samples to the rate of the digital-to-analog converter. Because the input sampling rates can vary between

8 kHz and 47.619 kHz the filter characteristic and oversampling ratio can be adjusted to the respective sampling rate. The requirements for the interpolation filters depend on the sampling rate, because a sufficient out-of-band discrimination in the audio frequency band (20 Hz,...,20 kHz) has to be ensured.

̲ Decimation Filter

The digital decimation filter on X-GOLD™213 has two operating modes: 8 kHz output sampling rate and 16 kHz output sampling rate (or 16 kHz output sample rate and 16kHz bandwidth in case of doubled ASMD clock).

3.12.3 Analog Part

The analog part of the X-GOLD™213 audio front-end in audio-out direction consists of a stereo digital to analog converter (multi-bit oversampling converter) which transforms the output of the digital interpolation filter into analog signals. It is followed by the gain control/amplifier section. The DAC outputs can be switched to several output buffers. In audio-in section there is an input multiplexer which selects either one of two differential microphone inputs to be connected to the low-noise amplifier and analog pre-filter. The signals from the analog pre-filter are input to a second-order sigma-delta analog-to-digital converter. In addition there is a connection for FM-radio playing.

̲ Audio-out Part

The analog audio-out part consists of two multi-bit digital-to-analogue converters (DAC) and an output stage. The signal sources are switched to the output drivers in the output stage. The output drivers consist of: a) one mono, differential class-D Loudspeaker driver, b) one mono, differential Earpiece driver and c) one stereo, single-ended (with uni- or bipolar signals), Headset driver.




\[VXZZ




̲ Digital-to-analog converters

The multi-bit oversampling DACs of the X-GOLD™213 audio front-end convert the 16-bit data words coming from the digital interpolation filters to analogue signals.

̲ Output Amplifier

The different output buffers in X-GOLD™213 are driven by the outputs of the selection block. The differential earpiece driver can be used to drive a 16 ȳ earpiece and works in differential. The two single ended headset drivers can be used to drive a 16 ȳ headset. They can work unipolar mode, where an AC coupling of the headset might be needed, or can work also in bipolor mode. The differential loudspeaker driver can be used to drive a 8 ȳ loudspeaker. As it is a class-D amplifier the needed suppression of the higher harmonics of the switching signals has to be achieved by the external circuitry. The buffers are designed to be short circuit protected.

Figure 3.12.3 Switching for R/L DACs onto Buffers ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


\\VXZZ





Figure 3.12.4 Different Application Scenarios

In order to achieve the single-speaker concept by parallel connection of Earpiece and Headset amplifier the

Earpiece amplifier have to sustain the up to 5 V voltage of the class-D amplifier.

̲ Audio-in Path

The audio-in path of X-GOLD™213 provides two differential microphone input sources, MIC1and MIC2.

• The inputs for microphone MIC1 are MICP1 and MICN1.

• The inputs for microphone MIC2 are MICP2 and MICN2.

The audio-in path consists of an input selector, a low noise amplifier and following pre-filter with gain control, a second order ȭȟ -converter and a digital decimation filter. It supports both standard GSM

(bandwidth 3.5 kHz) and wideband (bandwidth 7 kHz) speech bands.

The differential input signal from the microphone first passes a low noise amplifier and following pre-filter and an anti-aliasing pre-filtering stage achieving and overall variable gain ranging from 0 dB to +39 dB .

The signal is then modulated by a second order ȭȟ -converter which is clocked with the same clock rate as the digital to analog converters. The ȭȟ -converter delivers a 1-bit pulse density modulated data stream at a rate of 2 MHz to the digital decimation filter which reduces the rate to 8 kHz or 16 kHz, depending on the current mode.

To improve SNR the sample frequency can be doubled in dedicated modes and the modulated data stream is 4MHz instead of 2 MHz.




\]VXZZ




̲ Microphone Supply

X-GOLD™213 has a single ended power-supply concept for electret microphones:

For both modes a minimal load capacitance of t.b.d. nF is necessary to guarantee stable operation of the buffer.

The maximal load capacitance must not exceed t.b.d. nF.

2 microphone supplies VMIC and VUMIC are available. The supply VUMIC has a ultra-low-power mode, where the current consumption is minimum, whilst at the same time the noise performance is reduced.

For this purpose the VUMIC is directly supplied out of the VMIC regulator, the Mic-Buffer can be switched off and only the quiescent current of the VMIC regulator is present. This mode can be used to supply a headset and allow accessory detection with highly reduced current consumption For normal operation the supply can be switched to normal operation mode with improved noise performance. In case of an digital microphone VMIC can be used for supplying this microphone.

Figure 3.12.5 Typical Microphone Supply Generation (alternative) ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


\^VXZZ





3.13 Camera Interface(2M Fixed Focus Camera)

3.13.1 PMB8810 Camera Interface

The Camera Interface (CIF) represents a complete video and still picture input interface (see Figure 3.13.1).

The CIF contains image processing, scaling, and compression functions. The integrated image processing unit supports image sensors with integrated YC b

C r processing.

Scaling is used for downsizing the sensor data for either displaying them on the LCD, or for generating data streams for MPEG-4 compression. In general, YC b

C r

4:2:2 JPEG compressed images should use the full sensor resolution, but they can also be downscaled to a lower resolution for smaller JPEG files. Scaling also can be used for digital zoom effects, because the scalers are capable of up-scaling as well.

CIF all data is transmitted via the memory interface to an AHB bus system using a bus master interface.

Programming is done by register read/write transactions using an AHB slave interface.

Figure 3.13.1 Block Diagram of Camera Interface ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



\_VXZZ




Functional Overview of CIF

The following list gives an overview over the CIF’s functionality:

• 78 MHz system clock

• 78 MHz sensor clock

• 78 MHz JPEG encoder clock

• 32-bit AHB slave programming interface

• ITU-R BT 601 compliant video interface supporting YC b

C r

• ITU-R BT 656 compliant video interface supporting YC b

C r

• 8-bit camera interface

• 12-bit resolution per color component internally

• YC b data

C r

4:2:2 processing

• Hardware JPEG encoder incl. JFIF1.02 stream generator and programmable quantization and

Huffman tables

• Windowing and frame synchronization

• Continuous resize support

• Frame skip support for video (e.g. MPEG-4) encoding

• Macro block line, frame end, capture error, data loss interrupts and sync. (h_start, v_start) interrupts

• Programmable polarity for synchronization signals

• Luminance/chrominance and chrominance blue/red swapping for YUV input signals

• Maximum input resolution of 3 Mpixels (2048x1536 pixels)

• Main scaler with pixel-accurate up- and down-scaling to any resolution between 3 MP (2048x1536) and 32x16

• pixel in processing mode

• Buffer in system memory organized as ring-buffer

• Buffer overflow protection for raw data and JPEG files

• Asynchronous reset input, software reset for the entire IP and separate software resets for all submodules

• Interconnect test support

• Semi planar storage format

• Color processing (contrast, saturation, brightness, hue)

• Power management by software controlled clock disabling of currently not needed sub-modules ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


\`VXZZ





3.14 KEY BACLKLIGHT LED Interface

Key Backlight LED is controlled by switch (Q401). If KEY_BL_EN is high, Current is flowing from VBAT to

LED. Then Light emitted from The LED.

KEY_BL_EN is operating PWM. It is reducing current consumption.

VBAT

Q401

3

1

2

LD408 LD402 LD406 LD403 LD407 LD404 LD405 LD409 LD410 LD411 LD414 LD413 LD412 LD401 C431

0.1u

R447

1.2K

KEY_BL_EN

D401

Figure 3-14-1 Key Backlight Block

Figure 3-14-1 Key Backlight Block ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



]WVXZZ




3.15 Vibrator Interface

Support PWM signal which generated by hardware itself via register control direct connect to the VIB and

VSSVIB pin from XMM2130 without any external component required it is capable to driver the vibrator motor up to 150mA.



VIB_P

Figure 3-15-1 Vibrator Driver Block Diagram

MOTOR

C253

33p

C254

1uF

L208 0.1uH

VIB_P

VB201

1

2

VIB_N

L209

0.1uH

SJMY0007110

Figure 3-15-2 Vibrator Driver Block

]XVXZZ



4.

4. TROUBLE SHOOTING

4.1 RF Component

U102 U101



X102

U102

U101(PMB8810)

U301

X102

U301

SW301

Figure 4.1

Memory(512NOR/128pSDRAM)

PF38F5060M0Y3DF

Main Chip (A-GOLDRADIO)

FEM(Tx Module)

Crystal, 26MHz Clock ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

]YVXZZ





4.2 RX Trouble

CHECKING FLOW

START

HP8960 : Test mode

62 CH, 7 level setting (TCH)

62CH, -60dBm setting (BCCH)

Spectrum analyzer setting

Oscilloscope setting

(1) Check

Crystal Circuit

(2) Check

Mobile SW &TX module

(3) Check PLL Control

Re-download SW or

Do calibration again

4. TROUBLE SHOOTING ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


]ZVXZZ





(1) Checking Crystal Circuit

TEST POINT CHECKING FLOW

No

26 MHz O.K?

Yes

Crystal is OK.

See next page to check PLL Circuit

Replace X102

Figure 4.2.1

X102

1 pin : 26MHz

CIRCUIT WAVEFORM

Connect GND plane directly

Close to the 26MHz XTAL

X102 DSX321G-26M

4 3

1 2

2V85_VSIM

26MHz

C126

0.1u

TP1

1 pin

NUB

UART_TX

UART_RX

BT_RXD

BT_TXD

USB_DP

USB_DM

NLB_AD25

A3

B2

K11

K12

B11

A11

H7

J8

A2

B3

USIF2_RTS_N

USIF2_CTS_N

USIF1_TXD_MTSR

USIF1_RXD_MRST

USIF1_RTS_N

USIF1_CTS_N

DPLUS

DMINUS

XOX

XO

SIM_DATA

SIM_CLK

SIM_RST

M8

G3

G2

G4

VSIM

SIM_IO

SIM_CLK

SIM_RST

EINT2

CC1CC6IO

Figure 4.2.2

Figure 4.2.3




]]VXZZ




(2) Checking Mobile SW &FEM

TEST POINT

BS2

BS1

TX_EN

TP3

TP2

Figure 4.2.4

CIRCUIT

DCS_PCS_OUT

GSM_OUT

L301 3.3n

1n

L308

L302 3.3n

C392

DNI

C306 56p

C343 22p

C305

1p

7

8

9

10

11

GND5

GND6

GND7

RX1

RX2

C359

DNI

L303 3.3n

L306 3.3n

C314

1.5p

1

FL302

IN_1842_5

2

3

5

4

IN_1960

GND1

GND3

GND5

SFSB0001903

OUT_1842_5

8

OUT_1960

9

GND2

GND4

GND6

7

6

10

1805M1880M,1930M1990M

1

FL301

IN_881_5

2

3

5

4

IN_942_5

GND1

GND3

GND5

SFSB0001803

OUT_881_5

8

OUT_942_5

9

GND2

GND4

GND6

7

6

10

869M894M,925M960MHz

GND_SLUG

VRAMP

TX_ENABLE

GPCTRL0

GPCTRL1

VBATT

23

22

21

20

19

18

VBAT

C398

22p

L310

DNI

C396

22p

Test point

L319

1.8n

L312

27n

L320

1.8n

L309

2.2n

C327

4.7u

C317

4.7u

L305

9.1n

C318

1n

RX34X

RX34

RX12X

RX12

R327

10

TX_RAMP

TX_EN

BS1

BS2

VLOGIC

CONTROL LOGIC

EGSM Rx

VLOGIC

Tx_EN

BS1

BS2

TXRAMP

TP4

VLOGIC

TP1 ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


]\VXZZ



CHECKING FLOW

Check TP1 of SW301

TP1 Signal is OK?

Yes

Check TP4 of U301 ?

Yes

Control Signal is

(VLogic, BS1,

BS2)OK ?

Yes

TP2(High Band),

TP3(Low Band)

Signal is OK ?

Yes

Mobile SW & TX Module is OK.

No

No

No

Replace Mobile SW (SW301)

EGSM Rx

Check PMB8810

Replace FEM (U301) ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

]]VXZZ





4.3 TX Trouble

CHECKING FLOW

START

HP8960 : Test mode

62 CH, 7 level setting (TCH)

62CH, -60dBm setting (BCCH)

Spectrum analyzer setting

Oscilloscope setting

(1)Check

Crystal Circuit

(2) Check

Mobile SW &FEM

(3) Check PLL Control

Redownload SW or

Do calibration again

4. TROUBLE SHOOTING ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


]^VXZZ





(1) Checking Crystal Circuit

TEST POINT CHECKING FLOW

No

26 MHzO.K?

Yes

Crystal is OK.

See next page to check PLL Circuit

Replace X102

Figure 4.3.1

X101

1 pin : 26MHz

CIRCUIT WAVEFORM



X102 DSX321G-26M

4 3

1 2

2V85_VSIM

26MHz

C126

0.1u

TP1

1 pin

NUB

UART_TX

UART_RX

BT_RXD

BT_TXD

USB_DP

USB_DM

NLB_AD25

K11

K12

B11

A11

H7

J8

A2

B3

A3

B2

USIF2_RTS_N

USIF2_CTS_N

USIF1_TXD_MTSR

USIF1_RXD_MRST

USIF1_RTS_N

USIF1_CTS_N

DPLUS

DMINUS

XOX

XO

SIM_DATA

SIM_CLK

SIM_RST

M8

G3

G2

G4

VSIM

SIM_IO

SIM_CLK

SIM_RST

EINT2

CC1CC6IO

Figure 4.3.2

Figure 4.3.3




]_VXZZ




(2) Checking Mobile SW & TX Module

TEST POINT

BS2

BS1

TX_EN

TP3

TP2

SW301

Figure 4.2.4

CIRCUIT

DCS_PCS_OUT

GSM_OUT

L301 3.3n

TP2

L302 3.3n

TP

C306

C343

56p

22p

1n

L308

C392

DNI

C305

1p

7

8

9

10

11

GND5

GND6

GND7

RX1

RX2

C359

DNI

L303 3.3n

L306 3.3n

C314

1.5p

1

FL302

IN_1842_5

4

IN_1960

2

3

5

GND1

GND3

GND5

SFSB0001903

OUT_1842_5

8

OUT_1960

9

GND2

GND4

GND6

7

6

10

1805M1880M,1930M1990M

1

4

FL301

IN_881_5

IN_942_5

SFSB0001803

8

OUT_881_5

OUT_942_5

9

2

3

5

GND1

GND3

GND5

869M894M,925M960MHz

GND2

GND4

GND6

7

6

10

GND_SLUG

VRAMP

TX_ENABLE

GPCTRL0

GPCTRL1

VBATT

23

22

21

20

19

18

VBAT

L319

1.8n

L312

27n

L320

1.8n

L309

2.2n

C398

22p

L310

DNI

C396

22p

C327

4.7u

C317

4.7u

R327

10

C323

1n

C315

39p

C319

1n

C318

1n

C326

1n

L305

9.1n

RX34X

RX34

RX12X

RX12

TX_RAMP

TX_EN

BS1

BS2

VLOGIC

CONTROL LOGIC

EGSM Tx

VLOGIC

Tx_EN

BS1

BS2

TXRAMP

TP4

VLOGIC



]`VXZZ





CHECKING FLOW

Check TP2& TP3

TP2(High Band),

TP3(Low Band)

Signal is OK ?

Yes

Control Signal is

(VLogic,TX EN,

BS1, BS2)OK ?

Yes

Check TP4 of U301 ?

Yes

TP1 Signal is OK?

Yes

TP5 signal same as TP1?

Yes

Mobile SW & FEM is OK.

No

No

No

No

Replace PMB8810 (U101)

EGSM Tx

Check PMB8810

Replace FEM (U301)

Replace SW301 ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



^WVXZZ




4.4 Power On Trouble

TEST POINT

VAUX

VMMC

VPMU VDDMS VDDXO

VRTC

VUSB VCORE VDDRF2

Figure 4.1

VDDTDC ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


^XVXZZ





CIRCUIT

VDDTRX

RF SUPPLIES (CLEAN GND)

VDDRF2 VBAT_RF2

VBAT

PIN_B14 PIN_G13 PIN_G14

FB101

75

C125

1u

C132

18p

C131

220n

C147

5p

C118

470n

(10V)

RF SUPPLIES (DIRTY GND)

VDDXO VDDTDC VDDMS

PIN_E11 PIN_B12 PIN_H13

VRF1

PIN_H10

Seperate and shield

1V8_VDD

R103

0

C123

4.7n

C122

47n

C120

47n

C114

1u

VDD_IO1

DBB SUPPLIES

VDD_IO2 VDD_EBU

1V8_VDD 1V8_VDD 1V8_VDD

PIN G9 PIN K7 PIN R5

C128

0.1u

C106

0.1u

C124

0.1u

VBAT_PMU

VBAT

PIN N8

C101

2.2u

(10V)

1V8_VDD

3.3u

22u

C107

C134 10u

VBAT VBAT

1V8_VDD

1V8_VDD 1V8_VDD VPMU

PMU SUPPLIES

VPMU VAUX VMMC

PIN P10 PIN P8 PIN L7

VUSB

PIN M9

VCORE

PIN K8

C113

0.1u

C121

470n

C117

470n

C111

0.1u

C130

220n

ABB SUPPLIES

VDD1V8CP

VBATSP

Speaker Supply

1V8_VDD

VBAT

PIN P14

C129

0.1u

PIN P16

C115

2.2u

(10V)

VCORE 1V8_VDD

TX_RAMP

1V8_VDD VDDMS VDDXO VDDTDC VBAT_RF2 VAUX VMMC VUSB VDDRF2 VRF1 VRTC

Q101

VBAT

3

1

R106

470

2

R109

3.9K

R111

LCD_ID

BAT_TEMP

C119 4.7n

FM_ANT

C133 DNI

0

GSM_OUT

BS2

N12

T11

R11

N11

M10

M11

T15

R15

M0

M1

M2

VDD_FMR

FMRIN

FMRINX

CP1

CP2

A15

A14

TX1

FE2

ABB

RF

RF SUPPLY DOMAIN PMU PADS

A_D5

A_D6

A_D7

A_D8

A_D9

A_D0

A_D1

A_D2

A_D3

A_D4

K3

K2

L1

M1

N3

M2

N1

P2

K1

L4

R107

100K (1%)

R110

5.6K

LDO_OUT

AD00

AD01

AD02

AD03

AD04

AD05

AD06

AD07

AD08

AD09

Figure 4.2 Power block of LG-C300 ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

Figure 4.2 power block of LG-C300

^YVXZZ






CHECKING FLOW

START

Check Battery Voltage

> 3.35V

YES

Push power-on key

And check the level change into high of POWERKEY

YES

Check the voltage of

The LDO outputs at U102

Charge or Change Battery

NO

Replace U101

VCORE=1.2V, VPMU=1.2V. VRTC=2.3V, VUSB=3.1V

VAUX=2.85V,VMMC=2.85V, VDD_RF2=2.5V,

VDDMS=1.3V, VDDXO=1.3V, VDDTDC=1.3V

YES

NO

NO Check the contact of power key

Or dome-switch

Is the phone power on?

NO Replace U101 and

Re-download software

YES

The phone will

Properly operating.

Does it work properly?

NO

Replace the main board ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


^ZVXZZ





4.5 Charging Trouble

TEST POINT

U203

C223

CN201

Figure 4.5

CIRCUIT

CHARGING IC

VBUS_USB

LDO_OUT

TP1

TP1

C222

0.1u

C223

1u

(25V)

R233

820

R234

3.9K

3

4

5

1

2

PGND

VIN BATT

ISET

GND1

LDO

U203

RT9524

EUSY0410801

PGB

GND2

IEOC EN_SET

11

10

9

8

7

6

VBAT

C221

1u

(10V)

C257

0.1u

1V8_VDD

R217

100K

_EOC

CHG_EN ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



^[VXZZ




CHECKING FLOW

START

Change the battery

Battery is charged?

NO

Is I/O Connector(CN201) well-soldered ?

YES

Check the voltage at

Pin 1 U203 = 5.1V ?

(C223)

YES

Battery is charged?

YES

Charging is properly operating

YES

NO

NO

NO

Charging is properly operating

Resolder the CN201

(Pin 1 : VBUS_USB)

The TA is out of order

Change the TA

Replace the main board ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


^\VXZZ





4.6 Vibrator Trouble

TEST POINT

Vibrator PAD

C254_TP1

L209_TP2

Rear Cover

Figure 4.6




^]VXZZ



CIRCUIT

Main

IC

(U101)

Main IC (U101)

PWRON

VIB_P

MOTOR

TP1

C253

33p

C254

1uF

L208 0.1uH

VIB_P

VB201

1

TP2

VIB_N

L209

0.1uH

2

SJMY0007110

TP1



^^VXZZ





CHECKING FLOW

SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu

START

NO

Clean the Pad.

Check the contact pin of vibrator ?

YES

Is the voltage at

Pin (+) high?

YES

Is the voltage at

Vibrator PAD

(+) high?

YES

Replace vibrator

YES

Vibrator

Working well !

NO

Replace the U102

NO

Replace the U102 ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

^_VXZZ





4.7 LCD Trouble

TEST POINT

U402

CN403

[UG{yv|islGzovv{pun

FL403

FL404

FL405

C415_TP2

R417_TP1 ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


Figure 4.7

^`VXZZ





CIRCUIT

VMMC

LCD CONNECTOR

LCD_ID

MAKER ID : LOW

LCD_DATA04

LCD_DATA05

LCD_DATA06

LCD_DATA07

FL404

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

7

6

9

8

LCD_VSYNC

R445

100ohms

VA416 C430

0.001uF

C428

1uF

C427

27pF

CN403

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

1V8_VDD VBAT

C425

1uF

C426

2.2u

VA415

R446

100ohms

C429

0.001uF

FL405

3

4

1

2

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

7

6

9

8

_LCD_RESET

TP402

LCD_DATA00

LCD_DATA01

LCD_DATA02

LCD_DATA03

FL403

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

9

8

7

6

TP403

TP404

TP405

NLCD_WR

Test point

NLCD_MAIN_CS

LCD_RS

MLED1

MLED2

MLED3

MLED4

MLED5

CAM_IO_1V8

CAM_D_1V5

CAM_A_2V8

1V8_HPVDD

VBAT

C420

1u

C401

1u

C402

1u

C433

1u

C421

2.2u

C422

2.2u

8

9

6

7

10

11

12

AGND

VIN

LDOIN

LDO4

LDO3

LDO2

LDO1

U402

31 41 51 61 71

VOUT

LED1

LED2

LED3

LED4

LED5

LED6

24

23

22

21

20

19

18

TP

C419

2.2u

I2C_SCL

I2C_SDA

LCD_BL_CTRL

TP

C418

0.1u

R427

100K

TP1

MLED1

TP2

MLED4

MLED5

1V8_VDD ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



- 81 -

_WVXZZ



Waveform


LCD_BL_CTRL

LCD_RS

LCD_CS

LCD_WR

Graph 4.7.1. LCD Backlight Control Signal Waveform ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


Graph 4.7.2. LCD Data Waveform

_XVXZZ





CHECKING FLOW

START

Is the connection of

CN403 with LCD connector ok ?

YES

Check the

Voltage Level of C422 is about Battery voltage ?

(LCD_BL_CTRL signal is high Level)

YES

Check the Waveform of

EMI filter ?

YES

Does LCD work properly ?

YES

LCD working well !

NO

NO

Resoldering or Replace U402

NO

NO

Reassemble LCD connector

Resoldering EMI filter.

(FL403,FL404,FL405)

Replace LCD module ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



_YVXZZ




4.8 Camera Trouble

TEST POINT

C420 C401 C402

TP1

CN402

TP2

TP3

TP4

Figure 4.8

U402 ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


_ZVXZZ




[UG{yv|islGzovv{pun

CIRCUIT

CAM_DATA0

CAM_DATA1

CAM_DATA2

CAM_DATA3

CAM_DATA4

CAM_DATA5

CAM_DATA6

CAM_DATA7

FL402

3

4

1

2

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

5pF

7

6

9

8

GND

FL401

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

9

8

7

6

CAMERA INTERFACE

1

2

3

4

5

22

23

24

D4

D5

D6

D7

D0

D1

D2

D3

C404

DNI

CN402

PCLK

VSYNC

HSYNC

STANDBY

SCK

SDA

RESETB

MCLK

9

7

12

11

10

20

19

18

TP1

TP4

R409

100K

C411

15p

1V8_VDD

C412

15p

CAM_PCLK

CAM_VSYNC

CAM_HSYNC

CAM_STANDBY

R407

2.2K

R408

2.2K

C403

DNI

CAM_RESET

CAM_MCLK

CAM_A_2V8

I2C_SCL

TP

TP3

I2C_SDA

CAM_D_1V5

5pF

C406

0.1u

C410

56p

C407

0.1u

C409

56p

C405

0.1u

C408

56p

CAM_IO_1V8

CAM_D_1V5

CAM_A_2V8

1V8_HPVDD

VBAT

9

10

11

12

6

7

8

AGND

VIN

LDOIN

LDO4

LDO3

LDO2

LDO1

U402

VOUT

LED1

LED2

LED3

LED4

LED5

LED6

21

20

19

18

24

23

22

C420

1u

C401

1u

C402

1u

C433

1u

C421

2.2u

C422

2.2u

31 41 51 61 71

MLED1

MLED2

MLED3

MLED4

MLED5

C419

2.2u

I2C_SCL

I2C_SDA

LCD_BL_CTRL

1V8_VDD

C418

0.1u

R427

100K ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



_[VXZZ




Waveform

CAM_MCLK

CAM_RESET

I2C_DATA

CAM_MCLK

26MHz

Graph 4.8.1. I2C Data Waveform Graph 4.8.2. MCLK Waveform

CAM_HSYNC

CAM_VSYNC

CAM_HSYNC

CAM_PCLK

26MHz

Graph 4.8.3.CAM_VSYNC vs.

CAM_HSYNC Waveform

Graph 4.8.4.CAM_HSYNC vs.

CAM_PCLK Waveform ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


_\VXZZ





CHECKING FLOW

START

Is the connection of

CN402 with Camera ok ?

YES

Check the each voltage Level of

C402( 2.8V), C420( 1.8V) is right ?

(SWIF signal is high Level)

YES


I2C_CLK, I2C_DATA,

CAM_MCLK(26MHz) ?

YES


Data pins on CN402?

YES

Does Camera work properly ?

YES

Camera working well !

NO Reassemble camera connector with camera.

NO

Resoldering or Replace U402

NO

NO

Replace U101 or

Change the board

Replace Camera Module.

NO

Replace U101 or Change the board ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



_]VXZZ




4.9 Speaker Trouble

TEST POINT

C210_TP2 C209_TP1

U202

C255

C256

L210_TP3

L211_TP4

Figure 4.11.1

CIRCUIT

AUDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR

VBAT

SPK

SPK_P

EAR_SPK_N

EAR_SPK_P

I2C_SCL

I2C_SDA

C255

C256

1u

1u

C2

C1

IN1-

IN1+

D2

D1

IN2-

IN2+

D3

C3

IN3-

IN3+

C202

10u

C203

0.1u

DNI

R263

OUT+

OUT-

C5

D5

U202

WM9093ECS-R

HPL

HPR

EUSY0403901

A2

A1

CPVDD

CPVSS

CP

CN

B5

A3

A4

A5

C218 2.2u

C214 2.2u

C213 2.2u

C205

2.2u

2.2u

C206

R212

0

EAR_GND

TP2 TP1

R201

20

C211

0.1u

C212

0.1u

R208

20

HP_LOUT

HP_ROUT

R238 1800

1V8_VDD

FB207

DNI

C204

0.1u

DNI

R250

1V8_HPVDD

EAR_GND

EAR_GND

TP2

C210

47p

TP1

C209

47p

SPK_P

SPK_N

SPK_N

TP3

TP4

47pF

C217

0

TP

C201

100pF

L210

0

TP4

L211

C216

47pF

VA201 VA202

CN202

1

2

SUSY0024805 ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


_^VXZZ





CHECKING FLOW

START

< Cal l >

START

< Mp3>

Check the state of contact of speaker

Yes

No

Check the Audio signal

C255, C256

Yes

No

Replace/Change speaker

No

Change the U101

Check the state of contact of speaker

Yes

No Check the Audio signal

C255,C256

Yes

Check the Audio signal

C210,C209

Yes

Speaker

Working well!!

No Replace/Change the U202 No Check the Audio signal

L210. L211

Yes

Speaker

Working well!!




__VXZZ



C256_TP2

C256_TP2

Figure 4.11.1

Figure 4.11.1

CIRCUIT

CIRCUIT


VBAT

C202

10u

C203

0.1u

EAR_SPK_N

EAR_SPK_P

I2C_SCL

I2C_SDA

C255

C256

1u

1u

C2

C1

IN1-

IN1+

D2

D1

IN2-

IN2+

D3

C3

IN3-

IN3+ ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

DNI

R263

EAR_GND

OUT+

OUT-

C5

D5

U202 HPL

A2

A1

EUSY0403901

CPVDD

CPVSS

CP

CN

B5

A3

A4

A5

C218 2.2u

C214 2.2u

C213 2.2u

TP2

TP2

R201

20

0.1u

TP1

0.1u

R208

20

HP_LOUT

TP1

C210

47p

C209

47p

JACK_DETECT

C205

2.2u

2.2u

C206

R212

0

R238 1800

1V8_VDD

FB207

DNI

C204

0.1u

DNI

R250

1V8_HPVDD

EAR_GND

EAR_GND

SPK_P

SPK_N

HP_LOUT

HP_ROUT

C252

270pF

1V8_VDD

R230

DNI

TP

L207

0.1uH

TP4

L204

0.1uH

C240

270pF

TP3

1V8_VDD

TP3

VAUX

TP4

Q201

R266

DNI

D R261

100K

R262

1M

G

FB205

1800

FB206

1800

C262

DNI

R239

DNI

EAR_GND

_`VXZZ

C261

DNI

R265

DNI

R264

DNI

VA206 VA209 VA210 ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

_`VXZZ

LGE Internal Use Only - 90 -

VA205

L202

0.1uH

C244 47p L203

0.1uH

VA211

0

R251

0

FM_ANT

EAR_GND

2

3

4

M6

M1

M4F

5

6

M3

M4

1

M5

J201





CHECKING FLOW

START

Check the

Display on ear-jack detect icon

YES

Set the audio part of the test equipment to PRBS or Continuous wave mode

NO

Resolder J201

Can you hear the sound from the earphone?

YES

Set the audio part of the test Equipment to echo mode

NO

Change the earphone and try again

Can you hear the sound from the earphone?

NO

Resolder

FB205,FB206

C210,C209

(Call, MP3)

YES

Can you hear

Your voice from the earphone?

NO

Change the earphone and try again

Can you hear

Your voice from the earphone?

NO

Resolder

C255,C256 or Change the

U202 & U101

YES

Earphone will work properly ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



`WVXZZ



4.11 Receiver Trouble

TEST POINT


C245_TP3 C246_TP4

C142_TP1 C143_TP2

CIRCUIT

Figure 4.11

Receiver pad

VDDP_DIG1

A_D21

A_D22

A_D23

A_D24

CS0_N

CS1_N

ADV_N

WAIT_N

ANAMON

BFCLK0

J3

T3

N4

K4

M3

R3

J6

P9

T2

FSYS_EN

K15

EPN

EPP

HSL

HSR

LSN

LSP

M15

M16

R14

T14

N16

N15

MICN1

MICP1

MICN2

MICP2

VMIC

VUMIC

R12

T12

R13

T13

P12

P13

ACD

AGND

VREF

R10

P11

T10

NC1

NC2

NC3

NC4

A16

T16

A1

T1

C105

220n

AD21

AD22

AD23

AD24

NROM_CS

NRAM_CS

NADV

NWAIT

MEM_CLK

FSYS_EN

VMIC VHSMIC

C144

DNI

C136

DNI

TP2

TP2

TP1

C143

47p

C142

47p

TP1

RCV_N

RCV_P

EAR_SPK_N

EAR_SPK_P

MIC_N

MIC_P

HS_MIC_N

HS_MIC_P

C102

1n

C127

1n

C112

47p

C110

47p

C108

47p

C109

47p

PLACE THESE CAPS NEAR BB IC

MAIN RECEIVER

RCV_P

RCV_N

TP3

TP4

L205

L206

TP4 C246

47pF

C245

47pF

0.1uH

0.1uH

CN204

1

2

VA208

SURY0013401

VA207 ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


`XVXZZ





CHECKING FLOW

SETTING : After initialize Agilent 8960, Test EGSM900, DCS mode ( or GSM850, PCS mode )

Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max.

START

Does waveform at

C142 and C143

Fluctuate?

YES

Does waveform at

C245 and C246

Fluctuate?

Yes

NO

No

Change the U101

Replace/Change the receiver

Is receiver connected

Properly?

YES

Receiver will work properly.

NO

Resolder/Change the receiver ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

`YVXZZ





4.12 Microphone Trouble

TEST POINT


C231_TP1 C233_TP2 C236_TP3

Figure 4.12

CIRCUIT

VMIC

MICROPHONE

MIC_N

MIC_P

TP2

C232

39p

TP

TP2

C230

39p

C231

10u

L201

100n

TP1 TP1

TP3

C238

39p

C237

39p

VA203 VA204

D201

R235

0

MIC201

1

2

3

4

P

G1

G2

O

SUMY0010609

MIC201 ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


`ZVXZZ





CHECKING FLOW

SETTING : After initialize Agilent 8960, Test EGSM900, DCS mode ( or GSM850, PCS mode )

START

Check microphone sound hole

Make a phone call, then check C231 mic bias signal comes from U101?

NO

YES

Check the signal

Level at each side of MIC201.

Is it a few tens mV AC?

NO

YES

NO

Check the soldering of

C233, C236

YES

Microphone will work properly.

1. Check mic Bias signal line

2. Change the U101

Change the microphone

Resolder component ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



`[VXZZ




4.13 SIM Card Interface Trouble

TEST POINT

PIN 1

PIN 3

PIN 4

PIN 6

J401

Figure 4.13

CIRCUIT


2V85_VSIM

2V85_VSIM

SIM_DATA

PIN6

R417

Pin6

R418

DNI

4

5

6

8

GND

VPP

I_O

GND2

ZD403

C416

22p

J401

VCC

RST

CLK

GND1

1

2

3

7

PIN1

Pin1

Pin3

PIN

Pin4

PIN4

C413

0.1u

ZD401

C414

DNI

ZD402

C415

22p

SIM_RST

SIM_CLK


These are added for CMCC ESD test ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

`\VXZZ





CHECKING FLOW

START

Does the SIM card support 3V or 1.8V ?

YES

NO Change the SIM Card.

This phone supports 3V or 1.8V SIM card.

YES

Is Voltage at the pin1 of J201

2.85V or 1.8V?

NO Voltage output of VSIM LDO

Is 2.85V?

YES

Resolder J401

NO

Change the U101

Change the

SIM Card and try again.

Does it work

Properly?

NO

YES

SIM card is properly working redownload SW.

Does it work

Properly?

YES

SIM card is properly working.

NO

Change the main board ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

`]VXZZ





4.14 KEY backlight Trouble

TEST POINT

LD401 ~ LD414


Q201

Figure 4.14



`^VXZZ





VBAT

CIRCUIT

LD408 LD402 LD406 LD403 LD407 LD404 LD405 LD409 LD410 LD411 LD414 LD413 LD412 LD401

D401

Q401

3

1

2

TP1

C431

TP1

0.1u

R447

1.2K

KEY_BL_EN

CHECKING FLOW

START

Is Pin3 of Q401 low at KEY_BL_EN

= high ?

YES

NO

NO

Are all LEDs

Working?

YES

Backlight will work properly.

Check Q401

Check the soldering each R and LED

NO

Replace or resolder component ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ



`_VXZZ



4.15 Micro SD (uSD) Trouble

TEST POINT


R211_TP1

Figure 4.15

CIRCUIT

USD_D1

USD_D0

USD_CLK

USD_CMD

USD_D3

USD_D2

USD_DET ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


TP1

TP1

MICRO SD Connector

VMMC

FB202

S201

SWA

ENSY0020901

SWB

8

7

6

5

4

3

2

1

GND

R204

47ohms

1V8_VDD

R205

100Kohms

C215

0.001uF

VA212 VA213

DNI

DNI

C220

2.2uF

``VXZZ





CHECKING FLOW

START

Micro SD Detect

OK?

YES

NO Check the

R250=2.8V?

YES

NO

Change U101

Check out

MC_CLK & Data

Timing OK?

YES

Replace Micro SD Card

YES

Micro SD Card will work properly

NO Re-download SW ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

XWWVXZZ






4.16 Bluetooth Trouble

TEST POINT

U302

ANT

C385_TP2

C386_TP3

C389_TP1

C374_TP4

BT_CLK

Figure 4.16.1

CIRCUIT

Bluetooth

VAUX

R326

0

C386

2.2u

1V8_VDD

TP2

TP2

C385

2.2u

C383 10n

C384 2.2u

FB304 600

R329

0

C382

C381

C380

10p

10n

10n

DNI

R330

C378

10p

C379

1u

TP1

3

GND2

L307

1.2n

FEED

GND1

1

2

ANT304

SNMF0059501

L318 2.2n

C391

DNI

C371 10p

TP1

C370

DNI

C372

DNI

FL303

C389 100p

TP4 OUT

BT_CLK

2450MHz

C374

BT_DBB_INT

FSYS_EN

CLK32K

1n

3

4

TP319

TP320

TP321

C393

DNI

C373

TP2

R308

1n

15K

E6

E3

B7

G4

RES

D1

RFP

F7

E7

SCL

SDA

A8

C7

SPIM_CLK

SPIM_CS_N

A4

LPO_IN

G2

G3

XIN

XOUT

B5

GPIO_0

B3

GPIO_1

TCXO_OR_OUT_GPIO_5

TCXO_OR_IN_GPIO_6

GPIO_7

BCM2070CB0KUFBXG

U302

C377

1n

1V8_VDD

RST_N

REG_EN

TM0

TM2

B4

B2

C4

F3

BT_RESET

F6

PCM_IN

PCM_OUT

UART_RTS_N

G6

PCM_CLK

PCM_SYNC

UART_TXD

UART_RXD

F4

Test point

D8

TP322

TP323

D7

E8

TP324

TP325

TP326

TP327

UART_CTS_N

PCM_TX

PCM_RX

PCM_CLK

PCM_SYNC

BT_RXD

BT_TXD

BT_CTS

BT_RTS ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


XWXVXZZ





CHECKING FLOW

Check condition of matching components

(C389)

A condition is good?

YES

Check Bias Voltage

VAUX at C386

1V8_VDD at C385

YES

Check the C374

BT_CLK

YES

Check BT Test point pin

YES

BT will work properly

NO

NO

NO

NO

Give the additory solder in

C389

Replace

U101

Replace

U101

Replace

U302 ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

XWYVXZZ





4.17 FM Radio Trouble

TEST POINT


Q301

L304_TP1

ANT301

Figure 4.17

CIRCUIT

R111

LCD_ID

BAT_TEMP

C119

FM_ANT

4.7n

C133 DNI

0

GSM_OUT

BS2

RX12

RX12X

RX34

RX34X

N12

T11

R11

N11

M10

M11

T15

R15

M0

M1

M2

VDD_FMR

FMRIN

FMRINX

CP1

CP2

A15

A14

D16

C16

F16

E16

C14

B13

TX1

FE2

RX12

RX12X

RX34

RX34X

VDET

L202

0.1uH

C244 47p

L203

0.1uH

VA211

0

R251

0

FM_ANT

EAR_GND

FM_LNA_EN

L304

22n

FM_ANT_1

ANT301

1

2

C310

1u

R306

5.1ohms

R305

4.7K

1

3

Q301

2

C312

470n

L313

270n

C341

27p

L314

56n

C313

470n

C394

27p

FM_ANT

FM_ANT_1

M6

M1

M4F

M3

M4

M5

2

3

4

5

6

1 ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

J201

XWZVXZZ





CHECKING FLOW

START

Check of ear_jack condition


YES

Check condition of matching components

(C389, C371, L318)

NO

Replace J201


YES

Check FM LNA EN

(L304)

YES

NO

NO Give the additory solder in

C389, C371, L318

Replace

U101

FM_radio will work properly ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ

XW[VXZZ




5. DOWNLOAD

5. DOWNLOAD

kGGaG

㜼 Onzt|s{pGGZUWP

XUj GG GGaG 㜼 iyhpsGO{tnP

YUGzV~G⮹㾡 aG 㜼 OGw}⮹㾡⓸ ㇵḴ㛺㢀UGP

LG-C00

LG-C00



kss ⮹㾡 a 㜼 On|Y_W kssP

LG-C00

LG-C00

LG-C00

5. DOWNLOAD




5. DOWNLOAD

LG-C00

LG-C00

LG-C00



zG||ziwGtGGGaGG 㜼 OW[P

LG-C00

5. DOWNLOAD




5. DOWNLOAD

|ziGkG⮹㾡 aG 㜼 Osn |zi t k G[U`U[P



5. DOWNLOAD




5. DOWNLOAD

|ziGtG㉔䈑 aG

O P

‘LG-C00’



5. DOWNLOAD




5. DOWNLOAD

㐘䚽䑀㢰 ⶸ㤸 aG 㜼Otnzt}ZWP P



5. DOWNLOAD

LG-C00

LG-C00

LG-C00

‘LG-C00’

LG-C00

LG-C00 LG-C00

‘LG-C00’

LG-C00




5. DOWNLOAD

LG-C00 LG-C00

LG-C00 LG-C00

LG-C00 LG-C00



5. DOWNLOAD

LG-C00 LG-C00




5. DOWNLOAD

LG-C00 LG-C00



6. BLOCK DIAGRAM

Audio A

Call / Headset / M

SAW Fi

6. BLOCK DIAGRAM






7. CIRCUIT DIAGRAM

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

L

VDDTRX

RF SUPPLIES (CLEAN GND)

VDDRF2 VBAT_RF2

VBAT

PIN_B14 PIN_G13 PIN_G14

FB101

75

C125

1u

C132

18p

C131

220n

C147

5p

C118

470n

(10V)

RF SUPPLIES (DIRTY GND)

VDDXO VDDTDC VDDMS

PIN_E11 PIN_B12 PIN_H13

VRF1

PIN_H10

Seperate and shield

1V8_VDD

R103

0

C123

4.7n

C122

47n

C120

47n

C114

1u

VDD_IO1

DBB SUPPLIES

VDD_IO2 VDD_EBU

1V8_VDD 1V8_VDD 1V8_VDD

PIN G9 PIN K7 PIN R5

C128

0.1u

C106

0.1u

C124

0.1u

K

J

VBAT_PMU

VBAT

PIN N8

C101

2.2u

(10V)

PMU SUPPLIES

VPMU VAUX VMMC

PIN P10 PIN P8 PIN L7

VUSB

PIN M9

VCORE

PIN K8

C113

0.1u

C121

470n

C117

470n

C111

0.1u

C130

220n

ABB SUPPLIES

VDD1V8CP

VBATSP

Speaker Supply

1V8_VDD

VBAT

PIN P14

C129

0.1u

PIN P16

C115

2.2u

(10V)

1V8_VDD

I 3.3u

22u

C107

VBAT VBAT

1V8_VDD

1V8_VDD 1V8_VDD VPMU

C134 10u 1V8_VDD

H

G

F

E

D

PT101

10K

(5%)

R120

DNI

R104

DNI

(1%)

R111

LCD_ID

BAT_TEMP

C119

FM_ANT

C133

4.7n

DNI need to replace to 1%

PT101 is DNI defaultly

2V85_VSIM

BT_RESET

SPI_MOSI

SPI_MISO

LCD_BL_CTRL



1

4

X102 DSX321G-26M

3

26MHz

2

0

GSM_OUT

BS2

RX12

RX12X

RX34

RX34X

BS1

R127

VLOGIC

DCS_PCS_OUT

TX_EN

10

VDDTRX

R126 10

NUB

UART_TX

UART_RX

BT_RXD

BT_TXD

USB_DP

USB_DM

NLB_AD25

H8

J7

H7

J8

A2

B3

A3

B2

K11

K12

B11

A11

A15

A14

D16

C16

F16

E16

C14

B13

C13

B16

B15

C12

B14

N12

T11

R11

N11

M10

M11

T15

R15

C126

0.1u

SIM_DATA

SIM_CLK

SIM_RST

M0

M1

M2

VDD_FMR

FMRIN

FMRINX

CP1

CP2

TX1

FE2

RX12

RX12X

RX34

RX34X

VDET

PABS

PABIAS

FE1

TX2

PAEN

VDDTRX

USIF2_TXD_MTSR

USIF2_RXD_MRST

USIF2_RTS_N

USIF2_CTS_N

USIF1_TXD_MTSR

USIF1_RXD_MRST

USIF1_RTS_N

USIF1_CTS_N

DPLUS

DMINUS

XOX

XO

M8

G3

G2

G4

VSIM

SIM_IO

SIM_CLK

SIM_RST

1V8_VDD

USD_CMD

USD_D0

USD_CLK

USD_D1

USD_D2

USD_D3

H1

H3

H2

H6

G5

K5

MMCI_CMD

MMCI_DAT_0

MMCI_CLK

MMCI_DAT_1

MMCI_DAT_2

MMCI_DAT_3

R102

10K

R105

100K

IO_EXPANDER0

TDO

TDI

TMS

TCK

NTRST

R108

100K

_LCD_RESET

BT_CLK

SPI_CLK

PCM_CLK

PCM_SYNC

H12

J15

J16

G16

H16

H15

K16

J13

J12

C4

G11

F11

J11

H11

G10

SWIF_TXRX

TDO

TDI

TMS

TCK

TRST_N

TRIG_IN

MON1

MON2

MON3

FSYS1

FSYS2

DIGUP_CLK

DIGUP1

DIGUP2

RF

C

ABB

RF

EINT3

VDDP_DIG1

EINT2

CC1CC6IO

VDDP_ULPI

RF

VDDP_SIM

VDDP_DIG2

CC0CC1IO

CC0CC7IO

EINT4/EINT1

VDDP_MMC

VDDP_DIG1

VCORE 1V8_VDD

TX_RAMP

1V8_VDD VDDMS VDDXO VDDTDC

PIN COLOR DESCRIPTION

ORANGE ABB PADS

YELLOW

LIGHT BLUE

LIGHT GREEN

MAGENTA

RF PADS

PMU PADS

DBB SUPPLIES

DBB SIGNAL PADS

PIN NAME

T2IN

DIGUP2

DIF_RESET

USIF1_CTS_N

USIF1_RTS_N

VDDP_DIG1

U101

INT PORT

EINT0

EINT4

EINT7

CC1CC6IO

CC0CC1IO

VDDP_DIG1

VBAT_RF2 VAUX VMMC VUSB VDDRF2 VRF1 VRTC

Q101

VBAT

3

1

R106

470

2

RF SUPPLY DOMAIN

SIGNAL NAME

SLIDE

BT_DBB_INT uSD_DET

_CHG_EOC

MUIC_INT

R109

3.9K

VDDP_EBU

VDDP_DIG1

ABB

PMU PADS

VDDP_DIG1

FSYS_EN

K15

EPN

EPP

HSL

HSR

LSN

LSP

M15

M16

R14

T14

N16

N15

MICN1

MICP1

MICN2

MICP2

VMIC

VUMIC

R12

T12

R13

T13

P12

P13

ACD

AGND

VREF

R10

P11

T10

NC1

NC2

NC3

NC4

A16

T16

A1

T1

VDDFS

F9

A_D9

A_D10

A_D11

A_D12

A_D13

A_D14

A_D15

A_D0

A_D1

A_D2

A_D3

A_D4

A_D5

A_D6

A_D7

A_D8

K3

K2

L1

M1

N3

M2

N1

P2

K1

L4

L2

L3

N2

P5

P1

P3

WR_N

RD_N

R4

J1

CS0_N

CS1_N

ADV_N

WAIT_N

ANAMON

BFCLK0

A_D16

A_D17

A_D18

A_D19

A_D20

A_D21

A_D22

A_D23

A_D24

R1

J4

J2

H4

P4

R2

J3

T3

N4

K4

M3

R3

J6

P9

T2

R107

100K (1%)

R110

5.6K

C105

220n

LDO_OUT

AD00

AD01

AD02

AD03

AD04

AD05

AD06

AD07

AD08

AD09

AD10

AD11

AD12

AD13

AD14

AD15

NWR

NRD

AD16

AD17

AD18

AD19

AD20

AD21

AD22

AD23

AD24

NROM_CS

NRAM_CS

NADV

NWAIT

MEM_CLK

FSYS_EN

TP101

VMIC VHSMIC

C144

DNI

C136

DNI

C143

47p

C142

47p

RCV_N

RCV_P

EAR_SPK_N

EAR_SPK_P

MIC_N

MIC_P

HS_MIC_N

HS_MIC_P

C102

1n

C127

1n

C112

47p

C110

47p

C108

47p

C109

47p

PLACE THESE CAPS NEAR BB IC

1V8_VDD

B

ON_SW

PWRON

IO_EXPANDER0

I2C_SDA

I2C_SCL

POWER ON

VRTC

KB101

C146

2.2u

END_KEY

D101

R118

100

R117

100K

PWRON

R135

0.1u

C145

1u

Not Assembly BT Model

U103

1

IN

4

EN_SET

5

GND

OUT1

3

OUT2

2

OUT3

8

OUT4

7

OUT5

6

R132

100K

R134

100K

R133

100K

R131

100K

R130

100K

TP110

WLAN_REG_ON

BT_RESET

WLAN_RESET

LCD_BL_CTRL

AD16

AD17

AD18

AD19

AD20

AD21

AD22

AD23

AD24

NLB_AD25

AD00

AD01

AD02

AD03

AD04

AD05

AD06

AD07

AD08

AD09

AD10

AD11

AD12

AD13

AD14

AD15

TP108

UART_RX

UART_TX

PWRON

BACKUP BATTERY

(SUPER CAP)

VRTC

U102

A1

A14

C3

C12

H3

H12

K1

K14

NC1

NC2

NC3

NC4

NC5

NC6

NC7

NC8

ADQ0

ADQ1

ADQ2

ADQ3

ADQ4

ADQ5

ADQ6

ADQ7

ADQ8

ADQ9

ADQ10

ADQ11

ADQ12

ADQ13

ADQ14

ADQ15

G12

G11

F9

F8

G7

G6

F5

F4

F11

F10

G9

G8

F7

F6

G4

G3

E4

D11

E10

D10

E5

D4

D12

E7

C11

C4

A16

A17

A18

A19

A20

A21

A22

A23

A24

A25

P_CRE

H8

WAIT_

D3

P_LB_

P_UB_

P_CE1_

C7

C8

H7

CLK

D6

WE_

OE_

D8

F12

AVD_

E6

F1_CE_

E11

F_RST_

F_WP_P_CE2

F_DPD

E8

E9

H11

VCC1

VCC2

D7

H4

VCCQ1

VCCQ2

E3

G10

VSS1

VSS2

VSS3

VSS4

D5

E12

F3

G5

F_VPP

D9

R121 100K

TP106

R114

R113

NWR

NRD

R124

DNI

NADV

TP107

R119 43K

100K

100K

C139

1u

NWAIT

R122

10

NLB_AD25

NUB

NRAM_CS

MEM_CLK

NROM_CS

C141

1V8_VDD

470n

NRESET

1V8_VDD

1V8_VDD

C138

0.1u

1V8_VDD

C140

1u

C137

0.1u

C104

1u

(NOT MOUNTED)

(FOR SW DEBUGGING / NOT MOUNTED)

ON BOARD ARM9 JTAG & ETM INTERFACE

ON BOARD UART/USB INTERFACE

CN101 : SW DEBUG

UART PORT

GND

RX

TX

VCHAR

ON_SW

VBAT

PWR

URXD

UTXD

3G

UA101

2.5G

GND

RX

TX

NC1

ON_SW

VBAT

NC2

NC3

NC4

DSR

RTS

CTS

5

6

7

8

9

10

11

12

1

2

3

4

1V8_VDD

C148

DNI

4

5

6

7

8

9

CN101

1

2

3

VBUS_USB VBAT

UART_RX

UART_TX

ON_SW

C103

22p

X101

1

FC-135

2

32.768KHz

C116

22p

OJ101 OJ102

F_MODE

F_MODE

R137

1K

ON_SW

ON_SW

TP105

TP102

TP104

NRESET

NTRST

TDI

TMS

TCK

TDO

A

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

L

K

J

I

H

G

F

E

D

C

B

A





16 15 14 13 12

L

K

J

I


VBAT

C202

10u

C203

0.1u

EAR_GND

DNI

R263

EAR_SPK_N

EAR_SPK_P

I2C_SCL

I2C_SDA

C255

C256

1u

1u

C2

C1

IN1-

IN1+

D2

D1

IN2-

IN2+

D3

C3

IN3-

IN3+

OUT+

OUT-

C5

D5

U202

WM9093ECS-R

HPL

HPR

EUSY0403901

A2

A1

CPVDD

CPVSS

CP

CN

B5

A3

A4

A5

C218 2.2u

C214 2.2u

C213 2.2u

C205

2.2u

2.2u

C206

R212

0

R201

20

C211

0.1u

C212

0.1u

R208

20

HP_LOUT

HP_ROUT

R238 1800

1V8_VDD

FB207

DNI

1V8_HPVDD

C204

0.1u

DNI

R250

EAR_GND

EAR_GND

C210

47p

C209

47p

SPK_P

SPK_N

H

G

F

E

D

C

B

A

USD_D1

USD_D0

USD_CLK

USD_CMD

USD_D3

USD_D2

USD_DET

16 15

MICRO SD Connector

VMMC

FB202

R204

47ohms

1V8_VDD

R205

100Kohms

C215

0.001uF

VA212 VA213

DNI

DNI

C220

2.2uF

14 13 12

S201

SWA

ENSY0020901

SWB

8

7

6

5

4

3

2

1

GND

11 10

1V8_VDD VAUX

9 8

3.5phi HEADSET

1V8_VDD

Q201

S

R262

1M

G

JACK_DETECT

EAR_GND

HP_LOUT

HP_ROUT

C252

270pF

R230

DNI

C240

270pF

L207

0.1uH

L204

0.1uH

R266

DNI

D R261

100K

FB205

1800

FB206

1800

C262

DNI

R239

DNI

VAUX VBAT

1V8_VDD

C261

DNI

R265

DNI

R264

DNI

VA206 VA209 VA210

7 6

VA205

L202

0.1uH

C244 47p L203

0.1uH

VA211

0

R251

0

FM_ANT

EAR_GND

5

6

1

2

3

4

M3

M4

M5

M6

M1

M4F

J201

HOOK_DETECT

R228

47ohms

C241

120pF

HS_MIC_N

HS_MIC_P

4

OUT IN-

3

GND

2

5

VCC IN+

U204 LMV331

EUSY0407701

1

R237

C258

DNI

100

VHSMIC

C249

560pF

C247

10pF

C243

C251

0.022uF

0.022uF

C248

560pF

R232

2.2Kohms

C250

2.2uF

5 4

MICROPHONE

MIC_N

MIC_P

3

C230

39p

C231

10u

VMIC

L201

100n

C232

39p

C238

39p

C237

39p

VA203 VA204

D201

R235

0

MIC201

1

2

3

4

P

G1

G2

O

SUMY0010609

SPK

SPK_P

SPK_N

47pF

C217

0

C201

100pF

L210

0

L211

C216

47pF

VA201 VA202

CN202

1

2

SUSY0024805

MAIN RECEIVER

RCV_P

RCV_N

L205

0.1uH

L206

C246

47pF

C245

47pF

0.1uH

CN204

1

2

VA208

SURY0013401

VA207

2 1

L

K

J

I

H

G

F

MUIC

1V8_VDD

UART_TX

UART_RX

USB_DM

USB_DP

MUIC_INT

I2C_SDA

I2C_SCL

R218

2.2K

R220

DNI

1

R206

R207

R222 27

R223 27

1

C4

C3

UART_TX

UART_RX

D4

E4

USB_DM

USB_DP

D1

C1

A4

C2

B3

AUDIO_L

AUDIO_R

MIC

DSS

_INT

A2

B2

D2

SDA

SCL

GND

C239

0.1u

(10V)

U201

TP201

VBAT

VBUS

DM

DP

ID

E1

E2

E3

D3

VBUS_USB

0.1u

C226

(25V)

R2_2K

A3 R215 2.2K

MUIC_DM

MUIC_DP

FB203 1000

CLDO

A1 C228

C227

2.2u

2.2u

C229

1.5n

MUIC_ID

BATTERY CONNECTOR

VBAT 1V8_VDD

R213

51K (1%) CN201

4

1

2

3

ENZY0020402

HSBC-3PT25-17N

R219 10 (1%)

C235

100u

C224

0.1u

C225

39p

(5%) need to replace to 1%

R216

100K

(1%)

C259

270pF

BAT_TEMP

E

D

CHARGING IC

VBUS_USB

LDO_OUT

C222

0.1u

C223

1u

(25V)

R233

820

R234

3.9K

1

2

3

4

5

VIN

PGND

BATT

ISET

GND1

LDO

U203

RT9524

EUSY0410801

PGB

CHGSB

GND2

IEOC EN_SET

9

8

11

10

7

6

VBAT

C221

1u

(10V)

C257

0.1u

1V8_VDD

R217

100K

_EOC

CHG_EN

11 10 9 8

VBUS_USB

MUIC_DM

MUIC_DP

MUIC_ID

MUIC_DM

GND2

OUT

GND1

IN

FL201

1

2

3

4

5

CN203

6

8

10

12

14

7

9

11

13

15

04-5151-005-100-883

ENRY0010801

MUST BE PLACED NEAR IO CONNECTOR

7 6 5 4 3

VIB_P

MOTOR

C253

33p

C254

1uF

L208 0.1uH

VIB_P

VB201

1

2

VIB_N

L209

0.1uH

SJMY0007110

2 1

C

B

A




16 15 14 13 12 11 10

L

K

J

I

GND301

H

G

F

RF PART

DCS_PCS_OUT

GSM_OUT

L301 3.3n

1n

L308

L302 3.3n

C392

DNI

C306 56p

C343 22p

C305

1p

9

10

11

7

8

GND5

GND6

GND7

RX1

RX2

ANT302

3L 2.7n

L322

8.2n

C308

6.8p

C320

1p

1

SW301

ANT

3

G3

COMMON

4

G4

2

C359

DNI

L303 3.3n

L306 3.3n

C314

1.5p

1

FL302

IN_1842_5

4

IN_1960

SFSB0001903

8

OUT_1842_5

OUT_1960

9

2

3

5

GND1

GND3

GND5

GND2

GND4

GND6

7

6

10

1805M1880M,1930M1990M

1

FL301

IN_881_5

4

IN_942_5

2

3

5

GND1

GND3

GND5

SFSB0001803

8

OUT_881_5

OUT_942_5

9

GND2

GND4

GND6

7

6

10

869M894M,925M960MHz

GND_SLUG

VRAMP

TX_ENABLE

GPCTRL0

GPCTRL1

VBATT

23

22

21

20

19

18

VBAT

L319

1.8n

L312

27n

L320

1.8n

L309

2.2n

C398

22p

L310

DNI

C396

22p

C327

4.7u

C317

4.7u

L305

9.1n

C318

1n

RX34X

RX34

RX12X

RX12

R327

10

MODE

STANDBY

EGSM_RX

GSM850_RX

PCS_RX

DCS_RX

LB_TX

HB_TX

VLOGIC

LOW

HIGH

LOW

LOW

LOW

LOW

LOW

TX_EN

LOW

LOW

LOW

LOW

LOW

HIGH

HIGH

BS1

LOW

LOW

LOW

HIGH

HIGH

LOW

HIGH

BS2

LOW

LOW

HIGH

HIGH

LOW

HIGH

HIGH

E

9 8 7

TX_RAMP

TX_EN

BS1

BS2

VLOGIC

3

GND2

L307

1.2n

FEED

GND1

1

2

ANT304

SNMF0059501

L318 2.2n

C391

DNI

C371 10p

6 5

Bluetooth

4

VAUX 1V8_VDD

R326

0

C386

2.2u

C385

2.2u

3

C383 10n

C384 2.2u

FB304 600

2

R329

0

C382

C381

C380

10p

10n

10n

DNI

R330

C378

10p

C379

1u

1

L

K

C389 100p

BT_CLK

1

2

FL303

IN OUT

GND1 GND2

3

4

2450MHz

C374

CLK32K

1n

DBB_BT_INT

BT_DBB_INT

FSYS_EN

TP319

TP320

TP321

C393

DNI

R308

C373 1n

15K

G4

RES

D1

RFP

F7

E7

SCL

SDA

A8

C7

SPIM_CLK

SPIM_CS_N

A4

LPO_IN

G2

G3

XIN

XOUT

B5

GPIO_0

B3

GPIO_1

E6

E3

B7

TCXO_OR_OUT_GPIO_5

TCXO_OR_IN_GPIO_6

GPIO_7

BCM2070CB0KUFBXG

U302

RST_N

REG_EN

TM0

TM2

B4

B2

C4

F3

PCM_IN

PCM_OUT

PCM_CLK

PCM_SYNC

F6

G6

F4

F5

UART_TXD

UART_RXD

UART_RTS_N

UART_CTS_N

C8

D8

D7

E8

C377

1n

BT_RESET

1V8_VDD

TP322

TP323

TP324

TP325

TP326

TP327

PCM_TX

PCM_RX

PCM_CLK

PCM_SYNC

BT_RXD

BT_TXD

BT_CTS

BT_RTS

J

I

H

G

F

E

D

C

B

FM_LNA_EN

L304

22n

C310

1u

R306

5.1ohms

FM_ANT_1

ANT301

1

2

R305

4.7K

1

3

Q301

2

C312

470n

L313

270n

C313

470n

FM_ANT

C341

27p

L314

56n

C394

27p

FM_ANT_1

A

16 15 14 13 12



11 10 9

- 123 -

8 7 6 5 4 3 2 1

D

C

B

A



L

K

J

I

H

G

F

E

D

C

B

A

16

KEY_COL0

KEY_COL1

KEY_COL2

KEY_COL3

KEY_COL4

KEY_COL5

15 14 13 12

CN401

1

2

3

4

KB437

Q

KB422

O

VA417 VA419

VA418

KB436

W

KB423

P

R416

R428

R429

100ohms

100ohms

100ohms

KB435

E

KB424

A

KEY_ROW6

KEY_ROW7

KEY_COL5

KB430

R

KB425

S

KB434

T

KB426

D

KB433

Y

KB427

F

11

KB432

U

KB428

G

KB431

I

KB429

H

10

KB440

J

KB412

V

KB411

@

KB439

K

KB413

B

KB410

SPACE

KB445

OK

KB443

L

KB414

N

KB409

,(COMMA)

KB407

LEFT

KB444

BACK

KB415

M

KB438

.(PRIOD)

KB406

RIGHT

KB421

SHIFT

KB416

?(QUES)

KB408

SYM

KB405

UP

KB441

Z

KB442

X

KB417

ENTER

KB403

LEFT SOFT

KB404

DOWN

KB418

LOCK

KB402

RIGHT SOFT

KB420

C

KB419

MESSAGE

KB401

SEND

VBAT

9 8 7

LD408 LD402 LD406 LD403 LD407 LD404 LD405 LD409 LD410 LD411 LD414 LD413 LD412 LD401

D401

6

Q401

3

1

2

5 4 3 2


2V85_VSIM

2V85_VSIM

C431

0.1u

R447

1.2K

KEY_BL_EN

SIM_DATA

R417

4.7K

R418

DNI

4

5

6

8

GND

VPP

I_O

GND2

J401

VCC

RST

CLK

GND1

1

2

3

7

ZD403

C416

22p

C413

0.1u

ZD401

C414

DNI

ZD402

C415

22p

SIM_RST

SIM_CLK


These are added for CMCC ESD test

1

L

K

J

CAM_IO_1V8

CAM_D_1V5

CAM_A_2V8

1V8_HPVDD

VBAT

10

9

11

12

6

7

8

AGND

VIN

LDOIN

LDO4

LDO3

LDO2

LDO1

U402

VOUT

LED1

LED2

LED3

LED4

LED5

LED6

21

20

19

18

24

23

22

C420

1u

C401

1u

C402

1u

C433

1u

C421

2.2u

C422

2.2u

31 41 51 61 71

MLED1

MLED2

MLED3

MLED4

MLED5

C419

2.2u

1V8_VDD

I2C_SCL

I2C_SDA

LCD_BL_CTRL

C418

0.1u

R427

100K

VMMC

LCD CONNECTOR

LCD_ID

MAKER ID : LOW

LCD_DATA04

LCD_DATA05

LCD_DATA06

LCD_DATA07

FL404

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

9

8

7

6

LCD_VSYNC

R445

100ohms

VA416 C430

0.001uF

C428

1uF

C427

27pF

CN403

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

1V8_VDD

VBAT

C425

1uF

C426

2.2u

I

VA415

R446

100ohms

C429

0.001uF

FL405

3

4

1

2

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

9

8

7

6

_LCD_RESET

TP402

LCD_DATA00

LCD_DATA01

LCD_DATA02

LCD_DATA03

FL403

1

INOUT_A1

2

3

INOUT_A2

4

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

9

8

7

6

TP403

TP404

TP405

NLCD_WR

NLCD_MAIN_CS

LCD_RS

H

G

MLED1

MLED2

MLED3

MLED4

MLED5

F

KEY_ROW0

KEY_ROW1

KEY_ROW2

KEY_ROW3

KEY_ROW4

KEY_ROW5

KEY_ROW6

KEY_ROW7

1V8_VDD

R420

120K

C432

1UF

C417

1UF

R419

3.3K

R403

3.3K

KEY_SDA

KEY_INT

KEY_SCL

R450 10

R451 10

R452 10

C434

100pF

C435

100pF

C436

100pF

1

2

3

4

5

6

7

TEST

SEL_28P

P57

P56

P55

P17

P15

U401

P40

P41

P42

P43

P44

P45

P46

21

20

19

18

17

16

15

R402

R423

R424

R404

R426

R412

R413

R414

100ohms

100ohms

100ohms

100ohms

100ohms

100ohms

100ohms

100ohms

KEY_ROW0

KEY_ROW1

KEY_ROW2

KEY_ROW3

KEY_ROW4

KEY_ROW5

KEY_ROW6

KEY_ROW7

CAM_DATA0

CAM_DATA1

CAM_DATA2

CAM_DATA3

CAM_DATA4

CAM_DATA5

CAM_DATA6

CAM_DATA7

FL402

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

5pF

9

8

7

6

GND

FL401

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

9

8

7

6

CAMERA INTERFACE

22

23

24

1

2

3

4

5

D4

D5

D6

D7

D0

D1

D2

D3

1V8_VDD

C404

DNI

CN402

PCLK

VSYNC

HSYNC

STANDBY

SCK

SDA

RESETB

MCLK

20

19

18

12

9

7

11

10

R410 22

R409

100K

R411 51

C411

15p

C412

15p

CAM_PCLK

CAM_VSYNC

CAM_HSYNC

CAM_STANDBY

R407

2.2K

R408

2.2K

I2C_SCL

I2C_SDA

C403

DNI

CAM_RESET

CAM_MCLK

CAM_A_2V8

CAM_IO_1V8

CAM_D_1V5

5pF

C406

0.1u

C410

56p

C407

0.1u

C409

56p

C405

0.1u

C408

56p

E

D

C

R421

R422

R405

R406

R425

R415

100ohms

100ohms

100ohms

100ohms

100ohms

100ohms

VA403

KEY_COL0

KEY_COL1

KEY_COL2

KEY_COL3

KEY_COL4

KEY_COL5

B

A

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1



BGA IC pin check (U102)

BGA IC pin check (U101)

ؼ Ball Diagram (Top View), PMB8810(A-GOLDRADIO+)

8. BGA PIN MAP

: not in use ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ 118/133




8. BGA PIN MAP

ؼ Ball Diagram (Top View), PF38F6066M0Y3DE

: not in use ͽ͸Ͷ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑΀ΟΝΪ


XX`VXZZ



9. PCB LAYOUT



L

LD405

LD409

L

D

4

0 8

K B 4 0 5

K B 4 4 5

K B 4 0 4

L

R

4

3

1

L D 4 1 0

11

LD4

14

LD4

L D

4 0

1

LD412

L D 4 0 4

K B 4 1 0

03

LD4

LG-C300_MAIN_SPFY0229001-1.0_TOP

- 127 -

MIC201 (Main Mic)

- No Mic Operation


9. PCB LAYOUT

CN402 (Camera Module socket)

- No Camera

U302 (BT Module)

- No BT Operation

U202 (Audio AMP)

- No Sound

CN201(Battery Connector)

- No Power On

CN401 (Side-key pad)

- No side key Operation

U102 (Memory)

- No Power On

- No Download

U101 (BB IC)

- No Power On

- No Download

- No Display

S201 (µ-SD Connector)

- No µ-SD Operation

J401 (SIM Connector)

- No SIM Operation

U401(Tr. for Key Backlight)

- No Key Backlight


1 9 3 C

0 7 3 C

2 7 3 C 9 8 3 C 3 0 3 L F

6

R31

C

N

2 0

4

ANT

304

5 4 2 C

5 0 2 L

C N 2 0 2

7 0 2 A

8 0 2 A

V

V

7 1 2 C

6 1 2 C

1 0 2 A

0 1 2 L

V

1 1 2 L

2 0 2 A V

7 7 3 C

9 1 3 P T

3 7 3 C

6 8 3 C

0 2 3 P T

4 8 3 C

0 8 3 C

6 2 3 P T 1 2 3 P T

4 2 3 P T 5 2 3 P T 7 2 3 P T

5 8 3 C

5 7 3 C

6 7 3 C

1 8 3 C

2 8 3 C

2 2 3 P T

3 2 3 P T

8 0 3 R

3 9 3 C

4 7 3 C

4 0 3 B F

8 4 3 C

1 0 3 X

3 0 3 U

4 1 3 R

8 3 3 R

5 4 3 C

6 4 3 C

1 0 2 N C

1 1 2 C

2 1 2 C

5 0 2 C

6 5 2 C

5 5 2 C

D

4 1 2 C

2 0 2 U

3 1 2 C

8 1 2 C

2 0 2 C

0 5 2 R

3 6 2 R

1 0 1 Q

6 0 1 R 5 2 2 C

5 3 2 C 9 3 1 C

9 1 2 R

3 1 2 R

9 5 2 C

7 1 4 A

6 1 4 R

9 1 4 A

8 2 4 R

8 1 4 A

9 2 4 R

V

V

V

1 0 1 D

7 3 1 C

0 4 1 C

4 0 2 R

0 1 2 R

0 2 2 C

3 1 2 A V

7 0 1 P T

9 0 2 R

1 1 2 R

2 0 2 R

3 0 2 R

2 1 2 A

2 0 2 B F

V

2 0 1 U

B

A

D

C

F

E

H

G

K

J

1 4

0 3 2 C

7 3 2 C

4 0 2 A V

6 3 2 C

2 3 2 C

8 3 2 C

3 0 2 A

1 0 2 L

V

1

4 1 4 C

1 0 4 D Z

6 1 4 C

3 0 4 D Z

8 1 4 R

7 1 4 R

8 2 1 C

9 2 1 C

6 0 1 C

0 2 1 R

4 0 1 R

1 0 1 T P

2 0 4 D Z

8 0 1 C

9 0 1 C

2 0 1 C

1 1 1 R

3 3 1 C

1 0 1 C

5 0 1 C

9 1 1 C

2 1 1 R

5 3 1 C 0 3 1 C

5 1 1 C

2 4 1 C

1 1 2 A

2 4 2 C

2 0 2 L

V

J2

01 5 0 2 A

4 0 2 B F

V

2 3 2 R

0 5 2 C

4 2 2 R

0 1 4 C 6 0 4 C 9 0 4 C 7 0 4 C 5 0 4 C 8 0 4 C

7 0 4 R

8 0 4 R

1 1 4 C

3 0 4 C

0 1 2 A V

9 3 2 R

7 0 2 B F

2 0 4 U

5 4 4 R

9 1 4 C

4 4 4 R

5 2 4 C

6 2 4 C

6 3 2 R

1 5 2 C

3 4 2 C

6 2 2 R

7 2 2 R

8 4 2 C

9 4 2 C

1 0 1 T A B

4 0 1 C

5 2 1 R

0 6 2 R

3 0 4 P T

4 0 4 P T

5 0 4 P T

2 0 4 P T

3 5 2 C

4 5 2 C

9 0 2 L

4 9 3 C

4 1 3 L

5 0 3 R

1 4 3 C

3 1 3 L

2 1 3 C

4 0 3 R

0 1 3 C

7 0 2 R 7 1 2 R

7 5 2 C

3 0 2 U

4 3 2 R

2 2 2 C

3 3 2 R

1 0 3 T N A

8 2 2 C

7 2 2 C

2 0 1 X

0 2 1 C

2 3 1 C

3 2 1 C

2 2 1 C

5 2 1 C

1 0 2 C S

4 0 1 P T 2 0 1 P T 5 0 1 P T

6 1 1 C

9 0 3 L 5 0 3 L

7 4 1 C

2 1 3 L

2 0 3 L F

0 1 3 L

1 0 3 L F

3 0 1 C

4 1 3 C 7 2 3 C

6 1 3 C

5 2 3 C

7 1 3 C

1 0 3 U

1 0 3 L

5 0 3 C

1 0 4 Q

2 0 2 D

3 0 2 D

1 0 4 D

3 0 4 A V

9 1 4 R

2 5 4 R

4 3 4 C

5 1 4 R

6 3 4 C

1 5 4 R

9 4 4 R

7 4 4 R

1 3 4 C

8 4 4 R

7 1 4 C 0 2 4 R 3 0 4 R 5 3 4 C

2 0 4 R

3 2 4 R

4 2 4 R

4 0 4 R

6 2 4 R

2 1 4 R

3 1 4 R

0 5 4 R

V

V

V

V

V

V

V

1 0 4 A

3 1 4 A

2 1 4 A

1 1 4 A

0 1 4 A

9 0 4 A

8 0 4 A

2 3 4 C

7 3 4 R

8 3 4 R

1 4 4 R

2 4 4 R

0 4 4 R

9 3 4 R

6 3 4 R

5 3 4 R

3 3 4 R

1 0 4 R

8 4 1 C

8 4 1 R

7 3 1 R

2 0 1 D

0 2 3 C

LG-C300_MAIN_SPFY0229001-1.0_BOT

- 128 -

BAT101 (Backup Battery)

-RTC Rest

U402 (Charge Pump)

- No LCD Backlight

CN403(LCD Connector)

- No LCD Display

VB201 (vibrator pad)

- No vibrator

U203 (Charging IC)

- No Charging

U201 (MUIC)

- No Booting- No USB/Serial

Connection

X102 (X-tal 26M)

- No Power On

- No Service

U301 (PAM)

- No Call

ANT302 (Main RF contact pad)



10.ENGINEERING MODE

9. ENGINEERING MODE

Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “1809#*300#

“Select. Pressing END will switch back to non-engineering mode operation. Use Up and Down key to select a menu and press ‘select’ key to progress the test. Pressing ‘back key will switch back to the original test menu.

1. Factory Mode

[1] DEVICE TEST

[1-1] Auto All Test

[1-2] Main LCD

[1-3] Sub LCD

[1-4] LCD Backlight

[1-5] Key Backlight

[1-6] Speaker

[1-7] Vibrator

[1-8] Camera

[1-9] Sub Camera

[1-10] Mic Loopback

[1-11] Key Press Test

[1-12] Speaker Vib Test

[2] ELT Mode

[3] SW Sanity Test

[3-1] FPRI Test

[3-2] DB Check

[3-3] E Serial NO

[3-4] UA.String

[3-5] Unlock SIM

[4] Version

[5] Factory Reset

2. Eng Mode

[1] Usage Info

[2] Eng Mode

[2-1] Band Selection

[2-2] Battery Info

[2-3] Audio Tunning

[2-4] UART Setting

[2-5] BT Testing

[2-6] Defect Report System

[3] Band Select

[3-1] Auto

[3-2] GSM 850

[3-3] GSM900

[3-4] DCS 1800

[3-5] PCS 1900

[4] Network Info

[3-1] Cell Env. (Idle)

[3-2] Cell Env. (Ded)

[3-3] PS Log Save

[3-4] TCPIP Debug

[3-5] PCS 1900

[5] Other

[5-1] Bluetooth Test Menu

[5-2] PS Attach Mode

[5-3] MMS Test

[5-4] SIM Info

[6] Debug Setting

[5-1] Variable Watch

[5-2] Heap Freesize

[5-3] Heap Leakage

[5-4] Heap Assert

[6-5] QM Heap Freesize

[6-6] Developer Debug

XYWVXZZ




11. STAND ALONE TEST


11.1 Introduction

This manual explains how to examine the status of RX and TX of the model.

A. Tx Test

TX test - this is to see if the transmitter of the phones is activating normally.

B. Rx Test

RX test - this is to see if the receiver of the phones is activating normally.

11.2 Setting Method

ྙ ԙ

Ԛ

1. Set COM Port

2. Check PC Bau Rate

3. Confirm EEPROM & Delta file prefix name


XYXVXZZ





Not Connected

ԛ

Connected

4. Click “Update Info” for communicating Phone and Test-Program



XYYVXZZ


11. STAND ALONE TEST ԝ

Ԝ

Change “ptest mood”

5. For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the

“Reset” bar.

6. Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished.


XYZVX[_



11.3 Tx Test

Ԙ



1. “Non signaling mode” bar and then confirm “OK” text in the command line.



XY[VXZZ


11. STAND ALONE TEST ԙ

Ԛ ԛ

2. Put the number of TX Channel in the ARFCN

3. Select “Tx” in the RF mode menu and “PCL” in the PA Level menu.

4. Finally, Click “Write All” bar and try the efficiency test of Phone.


XY\VX[_



11.4 Rx Test

Ԙ ԙ

Ԛ

1. Put the number of RX Channel in the ARFCN.

2. Select “Rx” in the RF mode menu.

3. Finally, Click “Write All” bar and try the efficiency test of Phone.





XY]VXZZ




Ԝ ԛ

Change “normal mode “

4. The Phone must be changed “normal mode” after finishing Test.

5. Change the Phone to “normal mode” and then Click the “Reset” bar.


XY^VXZZ



12.AUTO CALIBRATION

11. AUTO CALIBRATION



Auto-cal (Auto Calibration) is the PC side Calibration tool that perform Tx, Rx and Battery

Calibration with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable

Power supply).

Auto-cal generates calibration data by communicating with phone and measuring equipment then write it into calibration data block of flash memory in GSM phone.

12.2 Configuration of HotKimchi

CM_GSM_MULTI

Common

PwrSupply_Cmd

At_Serial_Cmd

LG_CL_039.dll

Dll_SerialATD.dll

DLL_PwrControlD.dll

DLL_E5515CD.DLL

Debug

Debug

Auto

Cal

CalAuto

Result dll,ocx

(Windows 98)MFCD DLL COPY

(Windows 2000)MFCD DLL COPY

(Windows XP)MFCD DLL COPY vsflex7l_ocx_regist

Hot_Kimchi

ComLMPLib_1_11.dll

ComLMPLib_2_11.dll

Dll_EzLooksMQ_016.dll

GuiTk115d.dll

ShieldBox_DllD.dll

HK_40

Model

Setup_Cal_Parameter_001 script_001

PwrSupply_Cmd

Ezlooks xmm2130_eep008.cfg

LG_RfTest_E5515C_122.dll

LG_RfCal_InfiKE000Ag_177.dll

dwdio.dll

UI

Multi_HK

LG_UI_Ad6500_004.dll

XY_VXZZ






12.3 Description of Basic File

12.1 Common

-. LG_CL_039.dll : Common logic dll, Module In Charge of Reading PID & S/W Version, Booting.

-. Dll_SerialATD.dll : Serial Communication Module From Phone by AT Command.

-. DLL_PwrControlD.dll : Communication Module From Power supply.

-. DLL_E5515CD.DLL : Communication Module From Agilent 8960(Test Set).

-. At_Serial_Cmd.xml : Definition File of AT Command.

-. PwrSupply_Cmd.xml : Definition File of Power supply command.

12.2 Debug

-. Debug - Cal : Result File of Calibration.

Auto : Result File of Auto Test.

CalAuto : Result File of Cal & Auto Test.

12.3 dll, ocx

-.

vsflex7l_ocx_regist

:

Registration File for System use

-. Windows XXX)MFCD DLL : Registration File for System use

12.4 HotKimchi

-. HK_40.exe : Execute File, HK_XX Æ XX is File Version.

-. ComLMPLib_1_11.dll : Communication Module With PLC or Shield Box In Automation Rack.

Support to J&S Shield Box and Tescom TC-5981A.

-. ComLMPLib_2_11.dll : Communication Module With PLC or Shield Box In Automation Rack.

Support to J&S Shield Box and Tescom TC-5981A.

-. Dll_EzLooksMQ_005.dll : Communication Module with ezTray Installed In Local PC.

-. GuiTk115d.dll : control library

-. ShieldBox_DllD.dll : Communication with Shield Box. Support to Tescom TC-5952B.

12.5 Model

-.

LG_RfCal_InfiKE000Ag_177.dll : Main Module of Calibration

-. LG_RfTest_E5515C_122.dll : Main Module of Auto Test

-. Xmm2130_eep008.cfg : Cal Data Save binary Module.

LG-C300

-. Ezlooks.xml : Calibration ezLooks Item & Cal Spec Definition Module.

LG-C300

-. Script_001.xml : RF TEST Setup & calibration Setup Module.

LG-C300

-. Setup_Cal_Parameter_001.xml : Calibration Definition Module.


XY`VXZZ





12.6 UI

-. LG_UI_Ad6500_002.dll : ADI Model UI Dll.

12.7 Multi_HK

-. Registration File For System Setting.

1. Connect as Fig 6-2(RS232 serial cable is connected between COM port of PC and MON port of TEST

JIG, in general)

2. Set the Power Supply 4.0V

3. Set the 3 rd , 4 th of DIP SW ON state always

4. Press the Phone power key, if the Remote ON is used, 1 st ON state

12.4 Procedure

1. Copy the file to C:\Cm_Gsm_Multi

2. Copy the files of((Windows XXX)MFCD DLL, vsflex7l_ocx_regist to C:\Cm_Gsm_Multi\dll,ocx

3. Select MFCD DLL of your computer OS

4. Click on “vsflex7l_ocx_regist”

5. Click on “Multi_HK reg”

6. Connect as Fig 11-2 (RS232 serial cable is connected between COM port of PC, in general.)

7. . Run HK_40exe to start calibration.

8. Click “ Logic Operation” of “SETTING” menu bar



XZWVXZZ




9. Set PORT (using RS232 cable) that PC can communicate with the phone

10. Select “ LOGIC MODE” that you want

Logic mode: 1-> Calibration only

2-> Auto test only

3-> Cal & Auto


XZXVXZZ



LG-C00

Model name Start button



12. Click “start” button

LG-C00



XZYVXZZ




12.5 AGC

This procedure is for Rx calibration.

In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the result window will show correction values per every power level and gain code and the same measure is performed per every frequency.

12.6 APC

This procedure is for Tx calibration.

In this procedure you can get proper scale factor value and measured power level.

12.7 ADC

This procedure is for battery calibration.

You can get main Battery Config Table and temperature Config Table will be reset.

12.8 Target Power

BAND

GSM 850

EGSM 900

DCS1800

PCS 1900

Description

Channel

Frequency

Max power

Channel

Frequency

Max power

Channel

Frequency

Max power

Channel

Frequency

Max power

Low

128

824.2 MHz

32.3dBm

975

880.2 MHz

32.3dBm

512

1710.2 MHz

29.5dBm

512

1850.2 MHz

29dBm

Middle

191

836.8 MHz

32.3dBm

37

897.4 MHz

32.3dBm

699

1747.6 MHz

29.5dBm

661

1880 MHz

29dBm

High

251

848.8 MHz

32.3dBm

124

914.8 MHz

32.3dBm

885

1784.8 MHz

29.5dBm

810

1909.8 MHz

29dBm


XZZVXZZ



13. EXPLODED VIEW & REPLACEMENT PART LIST

13.1 EXPLODED VIEW

ACGK00

MWAC00 MTAD00

MBJZ00

AKAD00

AKAC00

SVLM00

SAFY00

SURY00

SVCY00

SPKY00

ACGM00

SNGF01

SUSY00

SJMY00

ACKA00

ADCA00

MIC201 SNGF00



- 143 -

SBPL00

GMEY00

ACGA00

SURY00

SVLM00

SAFY00

AKAC00

AKAD00

MBJZ00

MTAD00

MWAC00

ACGK00

Location No.

ACGA00

SBPL00

GMEY00

SNGF00

SJMY00

SUSY00

SNGF01

ACGM00

ACKA00

SVCY00

MIC201

ADCA00

SPKY00

Part Name

COVER, BATTERY, ASSY

BATTERY

SCREW

INTENNA, MAIN

MOTOR

SPEAKER

INTENNA, FM

COVER, REAR, ASSY

CAN, SHIELD, ASSY

CAMERA

MICROPHONE

DOME, METAL ,ASSY

PCB, SIDE KEY

RECEIVER

LCD

PCB, ASSY

KEYPAD, MAIN

KEYPAD, SUB

BUTTON, VOLUME

TAPE, WINDOW, LCD

WINDOW, LCD

COVER, FRONT, ASSY





13.2 Replacement Parts

<Mechanic component>

Note: This Chapter is used for reference, Part order is ordered

by SBOM standard on GCSC

Level

Location

No.

1

2

3

2

3

4

4

4

4

3

3

3

4

5

3

3

3

3

2

Description

GSM,BAR/FILP

AAAY00 ADDITION

ACGA00 COVER ASSY,BATTERY

MCJA00 COVER,BATTERY

APAY00 PACKAGE

APLY00 PALLET ASSY

MBEC00 BOX,CARTON

MCCL00 CAP,BOX

MPCY00 PALLET

MBAD00 BAG,VINYL(PE)

MBEE00 BOX,MASTER

MBEF00 BOX,UNIT

MLAC00 LABEL,BARCODE

MLAJ00 LABEL,MASTER BOX

MLAZ01 LABEL

APEY

ACGY

PHONE

COVER ASSY,EMS

ACGK00 COVER ASSY,FRONT

AKAC00 KEYPAD ASSY,MAIN

Part Number

TGSM0088401

AAAY0486204

ACGA0041303

Spec Color

WHITE

ORANGE

WHITE

ORANGE

Remark

PINK

MCJA0127001 MOLD, PC LUPOY SC-1004A, , , , , WHITE

APAY0151001

APLY0003901

APEY0915204

ACGY0007804

LG-C300 STD(EU1)

EU1 TYPE_Body(SW)+Cap(EU)+AL_1200EA

MBEC0003601 BOX, TW, , , , ,

MCCL0002501 BOX, TW, , , , ,

MPCY0012403 COMPLEX, (empty), , , , ,

MBAD0005204 COMPLEX, (empty), , , , ,

MBEE0061001

MBEF0148902

MLAC0004541

MLAJ0004402 LABEL,MASTER BOX(for CGR TDR 2VER. mbox_label)

MLAZ0050901

BOX, TW, , 307, 170, 251, 1 COLOR

BOX, TW, , , , ,

PRINTING, (empty), , , , ,

PRINTING, (empty), , , , ,

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

Without

Color

Without

Color

WITHOUT

COLOR

WHITE

ORANGE

WHITE

ORANGE

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

DARK BLUE

ACGK0162601

AKAC0014501

WHITE

WITHOUT

COLOR





5

5

Level

5

Location

No.

Description

AKAD00 KEYPAD ASSY,SUB

MBJZ00 BUTTON

MCJK00 COVER,FRONT

5

5

MDAY00 DECO

MDAY01 DECO

5 MPBG00 PAD,LCD

5

5

MPBZ00 PAD

MPBZ01 PAD

5

5

5

MTAB00 TAPE,PROTECTION

MTAD00 TAPE,WINDOW

MTAZ00 TAPE

5

5

5

5

5

5

5

4

MWAC00 WINDOW,LCD

ACGM00 COVER ASSY,REAR

MCCE00 CAP,RECEPTACLE

MCJN00 COVER,REAR

MDAY00 DECO

MFBC

MLAB

FILTER,SPEAKER

LABEL,A/S

MPBN00 PAD,SPEAKER

5

5

5

MPBT00 PAD,CAMERA

MPBZ00 PAD

MSAZ00 SHEET

5 MTAA00 TAPE,DECO

Part Number

AKAD0004301

Spec

MBJZ0034001 MOLD, PC LUPOY SC-1004A, , , , ,

MCJK0130101 MOLD, PC LUPOY SC-1004A, , , , ,

MDAY0073101 MOLD, PC LUPOY SC-1004A, , , , ,

MDAY0073001 COMPLEX, (empty), , , , ,

MPBG0110201 COMPLEX, (empty), , , , ,

MPBZ0297701 COMPLEX, (empty), , , , ,


MTAB0402101 COMPLEX, (empty), , , , ,

MTAD0128001 COMPLEX, (empty), , , , ,

MTAZ0317501 COMPLEX, (empty), , , , ,

MWAC0145101 MOLD, Tempered Glass, , , , ,

ACGM0162301

MCCE0059601 MOLD, PC LUPOY SC-1004A, , , , ,

MCJN0122801 MOLD, PC LUPOY SC-1004A, , , , ,

MDAY0073201 MOLD, PC LUPOY SC-1004A, , , , ,

MFBC0051901 COMPLEX, (empty), , , , ,

MLAB0001102 C2000 USASV DIA 4.0

MPBN0095501 COMPLEX, (empty), , , , ,

MPBT0095601 COMPLEX, (empty), , , , ,


MSAZ0074201 COMPLEX, (empty), , , , ,

MTAA0223901 COMPLEX, (empty), , , , ,


Color

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

ORANGE

WITHOUT

COLOR

ORANGE

WITHOUT

COLOR

BLACK

WITHOUT

COLOR

WITHOUT

COLOR

COLOR

UNFIXED

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WHITE

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

Remark




6

7

7

7

7

6

6

6

Level

5

Location

No.

Description

MWAE00 WINDOW,CAMERA

4

6

GMEY00 SCREW MACHINE,BIND

ACKA00 CAN ASSY,SHIELD

Part Number Spec

MWAE0062101 CUTTING, PMMA MR 200, , , , ,

GMEY0014301 2.7 mm,3.5 mm,MSWR3 ,Ni,+ ,NYLOK(0.6)

ACKA0037201

MCBA00 CAN,SHIELD

ADCA00 DOME ASSY,METAL

MIDZ00

MIDZ01

INSULATOR

INSULATOR

MAAA0007501 COMPLEX, (empty), , , , ,

MCBA0077401 PRESS, STS, , , , ,

ADCA0114601

MIDZ0255401 COMPLEX, (empty), , , , ,

MIDZ0255501 COMPLEX, (empty), , , , ,

6

6

6

MIDZ02 INSULATOR

MPBZ00 PAD

MSAZ00 SHEET

6

6

MTAC00 TAPE,SHIELD

MTAZ00 TAPE

3

MLAZ00 LABEL

ANT301 CONTACT

SC201 CAN,SHIELD

MLAA00 LABEL,APPROVAL

MIDZ0280901

MPBZ0355701

MSAZ0073801

COMPLEX, (empty), , , , ,



MTAC0094601 COMPLEX, (empty), , , , ,

MTAZ0317701 COMPLEX, (empty), , , , ,

MLAZ0038301 PID Label 4 Array

MCIZ0004401 PRESS, STS, 0.12, , , ,

MCBA0059201 PRESS, STS, , , , ,

MLAA0062303 COMPLEX, (empty), , , , ,

Color

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

TRANSPAR

ENT

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

Silver

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

Remark





13.2 Replacement Parts

<Main component>



7

7

7

7

7

7

7

7

7

7

7

Level

5

5

5

5

4

5

6

6

6

6

6

5

6

Location

No.

SJMY00 VIBRATOR,MOTOR

SNGF ANTENNA,GSM,FIXED

SNGF00 ANTENNA,GSM,FIXED

SUSY00 SPEAKER

SAFY

SAFB00 PCB ASSY,MAIN,INSERT

BRAH00 RESIN,PC

SPKY00 PCB,SIDEKEY

SURY00 RECEIVER

SVCY00 CAMERA

SVLM00 LCD MODULE

SAFF

ANT304 ANTENNA,MOBILE,FIXED

BAT101 MODULE,ETC

C101 CAP,CERAMIC,CHIP


C103

C104

C105

C106

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C107

C108

C109

Description

PCB ASSY,MAIN

PCB ASSY,MAIN,SMT

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP


SJMY0007905

SNGF0061901

3 V,0.08 A,5.8*5.1*9 ,cylinder motor ,; ,3V , , ,11000 , , ,

,29

3.0 ,-5.0 dBd, ,LG-C300 FM Internal_FPCB, Pb-Free ,;

,SINGLE ,-5.0 ,50ohm ,3.0

SNGF0061801

3.0 ,-2.0 dBd, ,LG-C300 Main Internal

GSM850+900+1800+1900, Pb-Free ,; ,QUAD ,-2.0

,50ohm ,3.0

SUSY0024805

PIN ,8 ohm,91 dB,16 mm,3.4T spring 0.9W ,; , , , , , ,

,CONTACT

SAFY0376404

SAFB0121301

BRAH0001301 ; , , , ,[empty]

SPKY0090601 POLYI ,0.18 mm,MULTI-2 , ,; , , , , , , , , ,

SURY0010120 ASSY , dB, ohm,1207*2.5T ,10mm ,; , , , , , ,WIRE ,

SVCY0026901 CMOS ,MEGA ,2M FF, Hynix 1/5", 7x7x4.1t, Socket

SVLM0034001

Main ,2.4" ,320*240 ,54.3*46.8*1.7t ,262K ,TFT ,TM

,NT35399 ,Landscape LCD ,

SAFF0278104

SAFC0148701

SNMF0059501

3.0 ,-2.0 dB,Amotech-3015 Size BT Chip Antenna, Pb-

Free ,; ,SINGLE ,-2.0 ,50ohm ,3.0

SMZY0023501 3.8 Backup Capacitor 0.03F ,; ,Module Assembly

ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP

ECZH0025502

22000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP ,; ,0.85t

,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]



Color Remark

Black




7

7

7

7

7

7

7

C125

C126

C127

C128

C129

C130

C131

C132

C118

C119

C120

C121

C122

C123

C124

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

C110

Description

CAP,CERAMIC,CHIP

7

7

7

7

7

7

7

C111

C112

C113

C114

C115

C116

C117

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

7 C134 CAP,CERAMIC,CHIP

C137

C138

C139

C140

C141

C142

C143

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP









ECZH0001217 470 nF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001210 470 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP

ECCH0000151 4.7 nF,25V,K,X7R,HD,1005,R/TP

ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP


ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP











ECCH0007803

10 uF,10V ,M ,X5R ,HD ,1608 ,R/TP ,; , ,[empty] ,[empty]

,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm








Color Remark





7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

C146

Description

CAP,CERAMIC,CHIP

7

7

C147

C201

CAP,CHIP,MAKER

CAP,CHIP,MAKER

7 C202 CAP,CERAMIC,CHIP

C203

C204

C205

C206

C209

C210

C211

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP


C218

C220

C221

C222

C223

C224

C225

C226

C213

C214

C215

C216

C217

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C227 NOT ASSEMBLE

C228

C229

C230

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP


ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP

ECZH0000806 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0007803

10 uF,10V ,M ,X5R ,HD ,1608 ,R/TP ,; , ,[empty] ,[empty]

,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP






ECCH0002001

0.1 uF,6.3V ,K ,B ,HD ,1005 ,R/TP , , ,[empty] ,[empty]

,[empty] ,[empty] ,[empty] ,[empty] ,.5 mm

ECCH0002001

0.1 uF,6.3V ,K ,B ,HD ,1005 ,R/TP , , ,[empty] ,[empty]

,[empty] ,[empty] ,[empty] ,[empty] ,.5 mm








ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP


ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP



ECZH0003504 100 nF,25V ,K ,X7R ,HD ,1608 ,R/TP

99999999999 NOT ASSEMBLE




Color

Color

Unfixed

Remark




7

7

7

C232

C233

C235

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,TANTAL,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C259

C260

C302

C303

C304

C305

C250

C251

C253

C254

C255

C256

C257

C244

C245

C246

C247

C248

C249

C236

C237

C238

C239

C241

C242

C243

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

C231

Description

CAP,CERAMIC,CHIP


ECCH0005604

10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty]

,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm



ECTH0002703

100 uF,10V ,M ,STD ,3216 ,R/TP ,; ,0.0001 ,20% ,10V ,

,-55TO+125C , ,3.2X1.6X1MM ,NONE ,SMD ,R/TP







ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP




ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECZH0003118 560 pF,50V ,K ,X7R ,HD ,1005 ,R/TP



ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP












Color Remark





7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

C306

Description

CAP,CHIP,MAKER


CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C374

C377

C378

C379

C380

C381

C382

C325

C326

C327

C341

C343

C371

C373

C383

C384

C385

C317

C318

C319

C320

C322

C323

C310

C312

C313

C314

C315

C316



ECCH0001001

6.8 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP ,; , ,0.5PF ,50V

,NP0 ,[empty] ,1005 ,R/TP , mm




ECZH0000822 1.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP



ECCH0007802 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP








ECCH0007802 4.7 uF,10V ,M ,X5R ,TC ,1608 ,R/TP















Color Remark




7

7

7

7

7

7

7

7

7

7

C420

C421

C422

C423

C424

C425

C426

C427

C428

C429

C413

C415

C416

C417

C418

C419

C406

C407

C408

C409

C410

C411

C412

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

C386

Description

CAP,CERAMIC,CHIP

7

7

7

7

7

7

7

C389

C394

C396

C398

C401

C402

C405

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP



































- 15 -

Color Remark



7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

C430

Description

CAP,CERAMIC,CHIP

C431

C432

C433

C434

C435

C436

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CN201 CONNECTOR,ETC

7

7

7

CN203

CN402

CN403

CONNECTOR,I/O

CONN,SOCKET

CONNECTOR,FFC/FPC

D101

D102

DIODE,TVS

DIODE,TVS

D202 DIODE,TVS

D203 DIODE,TVS

D401 VARISTOR

FB101 FILTER,BEAD,CHIP








FL201 FILTER,EMI/POWER

7 FL301 FILTER,SAW,DUAL









ENZY0020402 3 ,2.5 mm,BOTTOM , ,

ENRY0010801

5 ,0.65 mm,STRAIGHT ,- ,M USB Normal ,; ,5 ,0.64MM

,STRAIGHT ,RECEPTACLE ,DIP ,[empty] ,

ENSY0023701 24 ,ETC , ,0.7 mm,7x7x3.95t, (1.3M Socket)

ENQY0014201

27 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FFC/FPC

,STRAIGHT ,BOTH ,SMD ,R ,LOCKING ,

EDTY0010101

SOD-923 ,5 V,300 mW,R/TP ,15pF ,; , ,5.8V(MIN)

,12.5V(1A) ,40A ,300mW ,[empty] ,[empty] ,2P ,2

EDTY0009801

SOT-963 ,5 V,25 W,R/TP , ,; , , , , , ,[empty] ,[empty] ,2P

,1

EDTY0009801


,1

EDTY0009801


,1

SEVY0004301 18 V, ,SMD ,10pF, 1005

SFBH0007103 75 ohm,1005 ,CHIP BEAD, 300mA

SFBH0000903 600 ohm,1005 ,

SFBH0000912 1000 ohm,1005 ,

SFBH0008105 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP




SFBH0000903 600 ohm,1005 ,

SFEY0007101 SMD ,1CH,1608Feedthru ESD/EMI filter for power Pb-free

SFSB0001803

881.5 MHz,25 MHz,2.5 dB,23 dB,942.5 MHz,35 MHz,2.9

dB,18 dB,1.8*1.4*0.5 ,SMD

,869M~894M,925M~960M,10p,B,150,LH,GSM850+EGS

M Rx,DIP_OUT ,; ,881.5+942.5 ,1.8*1.4*0.5 ,SMD ,R/TP

Color Remark




Level

Location

No.

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

FL302

FL303

FL401

FL402

FL403

FL404

FL405

J201

J401

L101

L201

L202

L203

L204

L205

L206

L207

L208

L209

L210

L211

L301

L302

L303

L304

L305

L306

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

PCB ASSY,MAIN,PAD

SHORT

PCB ASSY,MAIN,PAD

SHORT

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

Description

FILTER,SAW,DUAL

FILTER,DIELECTRIC

FILTER,EMI/POWER

FILTER,EMI/POWER

FILTER,EMI/POWER

FILTER,EMI/POWER

FILTER,EMI/POWER

CONN,JACK/PLUG,EARPH

ONE

CONN,SOCKET

INDUCTOR,SMD,POWER


SFSB0001903

SFDY0003001

1842.5 MHz,75 MHz,3.1 dB,12 dB,1960 MHz,60 MHz,3.2

dB,8 dB,1.8*1.4*0.5 ,SMD

,1805M~1880M,1930M~1990M,10p,B,170,DCS+PCS

Rx,LH,DIP_OUT ,; ,1842.5+1960 ,1.8*1.4*0.5 ,SMD

,R/TP

2450 MHz,2.0*1.25*1.05 ,SMD ,2400M~2500M, IL 1.6,

4pin, U-U, 50-50, BT BPF ,; ,BPF ,2450 ,100 ,SMD ,R/TP

SFEY0015501 SMD ,Pb-free_4ch_5p-100ohm-5p ,; ,Filter,LCR

SFEY0015501 SMD ,Pb-free_4ch_5p-100ohm-5p ,; ,Filter,LCR

SFEY0012501 SMD ,SMD ,18 V,4ch. EMI_ESD Filter (200 Ohm,25pF)



ENJE0008001

,6 , ,; ,[empty] ,4P ,[empty] ,R/TP , ,BLACK

,12.55x6.3x4.0t

ENSY0022101 6 ,ETC , ,2.54 mm,H=1.5

ELCP0009410

3.3 uH,N ,2x2.5x1.0 ,R/TP ,chip power ,; ,3.3uH ,30% ,;

,400mA ,; ,; ,; ,SHIELD ,2.5X2MM ,[empty] ,R/TP

,Inductor,Wire Wound,Chip

ELCH0003842 100 nH,J ,1005 ,R/TP ,MLCI

ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0003842 100 nH,J ,1005 ,R/TP ,MLCI

ELCH0003842 100 nH,J ,1005 ,R/TP ,MLCI

ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0005009 100 nH,J ,1005 ,R/TP ,

SAFP0000501

SAFP0000501

ELCH0003826 3.3 nH,S ,1005 ,R/TP ,chip

ELCH0003826 3.3 nH,S ,1005 ,R/TP ,chip

ELCH0003826 3.3 nH,S ,1005 ,R/TP ,chip

ELCH0005004 22 nH,J ,1005 ,R/TP ,

ELCH0003818 9.1 nH,J ,1005 ,R/TP ,

ELCH0003826 3.3 nH,S ,1005 ,R/TP ,chip

Color Remark





7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

L307

Description

INDUCTOR,CHIP

L308

L309

L312

L313

L314

L318

L319

L320

L321

L322

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

7 PT101 THERMISTOR

7 Q101 TR,BJT,NPN

Q201 TR,FET,P-CHANNEL

Q301 TR,BJT,NPN

Q401 TR,BJT,NPN

R102

R103

R105

R106

R107

R108

R109

R110

R111

R112

R113

R114

RES,CHIP,MAKER

PCB ASSY,MAIN,PAD

SHORT

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

PCB ASSY,MAIN,PAD

SHORT

PCB ASSY,MAIN,PAD

SHORT

RES,CHIP,MAKER

RES,CHIP,MAKER


ELCH0001411 1.2 nH,S ,1005 ,R/TP ,PBFREE

ELCH0001403 1 nH,S ,1005 ,R/TP ,PBFREE

ELCH0005001 2.2 nH,S ,1005 ,R/TP ,

ELCH0005005 27 nH,J ,1005 ,R/TP ,

ELCH0010402 270 nH,M ,1005 ,R/TP ,CHIP

ELCH0003825 56 nH,J ,1005 ,R/TP ,chip inductor,PBFREE

ELCH0003832 2.2 nH,S ,1005 ,R/TP ,MLCI

ELCH0003847 1.8 nH,S ,1005 ,R/TP ,chip coil

ELCH0003847 1.8 nH,S ,1005 ,R/TP ,chip coil

ELCH0003815 2.7 nH,S ,1005 ,R/TP ,

ELCH0003838 8.2 nH,J ,1005 ,R/TP ,MLCI

SETY0006301

NTC ,10000 ohm,SMD ,1005, 3350~3399k, J, R/T,

PBFREE

EQBN0020501

ESM ,0.15 W,R/TP , ,; ,NPN ,5V ,60V ,50V ,150mA

,0.1uA MAX ,10 MIN 700 MAX ,100mW ,ESM ,R/TP ,3P

EQFP0007601

ESM (EMT3) ,0.1 W,-30 V,-0.05 A,R/TP ,High Speed Pch MOSFET, Pb-free

EQBN0019201

VSM ,0.1 W,R/TP ,1.2*1.2*0.5 Vcbo=20, Vceo=12,

Vebo=2V, Ic=100mA

EQBN0020501

ESM ,0.15 W,R/TP , ,; ,NPN ,5V ,60V ,50V ,150mA

,0.1uA MAX ,10 MIN 700 MAX ,100mW ,ESM ,R/TP ,3P

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

SAFP0000501

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000484 470 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000475 3900 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP

SAFP0000501

SAFP0000501

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

Color Remark




7

7

7

7

7

7

7

7

7

R206

R207

R208

R209

R210

R211

R137

R148

R201

R202

R203

R204

R205

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

R117

Description

RES,CHIP,MAKER

7

7

7

7

7

7

7

R118

R119

R121

R122

R125

R126

R127

RES,CHIP

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R212

R213

R214

R215

R216

R217

R218

R219

R222

PCB ASSY,MAIN,PAD

SHORT

RES,CHIP,MAKER

PCB ASSY,MAIN,PAD

SHORT

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER


ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0000272 43K ohm,1/16W,J,1005,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP

ERHZ0000206 10 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000206 10 ohm,1/16W ,F ,1005 ,R/TP

ERHY0000241 1K ohm,1/16W,J,1005,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000240 20 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000240 20 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

SAFP0000501

ERHZ0000295 51 Kohm,1/16W ,F ,1005 ,R/TP

SAFP0000501

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000206 10 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000451 27 ohm,1/16W ,J ,1005 ,R/TP



- 157 -

Color Remark



7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

R223

Description

RES,CHIP,MAKER

7

7

R224

R226

R227

R228

R232

R233

R234

R236

R237

R238

R251

R252

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP

RES,CHIP

FILTER,BEAD,CHIP

PCB ASSY,MAIN,PAD

SHORT

PCB ASSY,MAIN,PAD

SHORT

RES,CHIP,MAKER R260

R261

R262

7

7

7

7

7

7

R267

R303

R304

R305

R306

R308

R315

R316

R327

R329

R330

R401

RES,CHIP,MAKER

RES,CHIP,MAKER

PCB ASSY,MAIN,PAD

SHORT

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

PCB ASSY,MAIN,PAD

SHORT

PCB ASSY,MAIN,PAD

SHORT

RES,CHIP,MAKER

PCB ASSY,MAIN,PAD

SHORT

PCB ASSY,MAIN,PAD

OPEN

RES,CHIP,MAKER


ERHZ0000451 27 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000529 1.5 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000445 220 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHY0000185 820 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000278 3900 ohm,1/16W ,F ,1005 ,R/TP

ERHY0000140 36K ohm,1/16W,F,1005,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP


SAFP0000501

SAFP0000501

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP

SAFP0000501

ERHZ0000449 24 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000531 270 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP

SAFP0000501

Color Remark

SAFP0000501

ERHZ0000206 10 ohm,1/16W ,F ,1005 ,R/TP

SAFP0000501

SAFO0000501 0OHM_1005_DNI

ERHZ0000355 270 ohm,1/16W ,F ,1005 ,R/TP




7

7

7

7

7

7

7

7

7

7

R424

R425

R426

R427

R428

R429

R433

R435

R436

R437

R417

R419

R420

R421

R422

R423

R410

R411

R412

R413

R414

R415

R416

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

R402

Description

RES,CHIP

7

7

7

7

7

7

7

R403

R404

R405

R406

R407

R408

R409

RES,CHIP,MAKER

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP,MAKER

RES,CHIP

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER


ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP

ERHY0000105 51 ohm,1/16W,F,1005,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000213 120 Kohm,1/16W ,F ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000355 270 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000355 270 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000355 270 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000355 270 ohm,1/16W ,F ,1005 ,R/TP



- 159 -

Color Remark



7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

R438

Description

RES,CHIP,MAKER

R439

R440

R441

R442

R443

R444

R445

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

R446

R447

R448

R450

R451

R452

S201

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

CONN,SOCKET

7 SW301 CONN,RF SWITCH

7 U101 IC


ERHZ0000355 270 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000355 270 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000355 270 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000355 270 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000355 270 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000412 1200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ENSY0020901 8 PIN,STRAIGHT , , mm,

7

7

7

7

7

7

7

7

7

7

7

U102 IC

U201 IC

U202 IC

U203 IC

U204 IC

U301 RF MODULE,HANDSET

U302 IC

U401

U402

IC

IC

VA201 VARISTOR

VA202 VARISTOR

EUSY0421201

BGA ,210 ,R/TP ,EDGE Rx,ARM11

208MHz,FMR,2.0Mp,QVGA Display ,; ,IC,Digital

Baseband Processor

EUSY0417801

FBGA ,56 ,ETC ,Fully 1.8V ADmux 1G(mono die) NOR +

256M(128*2) psRAM ,; ,IC,MCP

EUSY0372001 WCSP ,20 ,R/TP ,MUIC ,; ,IC,Analog Switch

EUSY0403901

WLCSP ,20 ,R/TP ,Mono Audio Subsystem ,; ,IC,Audio

Sub System

EUSY0410801

DFN ,10 ,R/TP ,DFN Cal Test Mode Single Charger IC for

Micro USB ,; ,IC,Charger

EUSY0407701 SC-70 ,5 ,R/TP ,Comparator ,; ,IC,TTL

EUSY0382201

FPBGA ,50 ,R/TP ,4.5x4.0x0.6, BT2.1, 0.5pitch ,;

,IC,Bluetooth

EUSY0300008 QFN ,28 ,R/TP ,64key ,; ,IC,Bus Controller

EUSY0344403 QFN ,24 ,R/TP ,4CH+2LDO ,; ,IC,Sub PMIC

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

Color Remark




7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

VA203

Description

DIODE,TVS

VA204 DIODE,TVS

VA205

VA206

VA207

VA208

VA209

VA210

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VA211 DIODE,TVS

VA401

VA402

VARISTOR

VARISTOR

VA403 DIODE,TVS

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VA409

VA410

VA411

VA412

VA413

VA414

VA404

VA405

VA406

VA407

VA408

VA415

VA416

VA417

VA418

VA419

X101 X-TAL


EDTY0010101



EDTY0010101



SEVY0005202 5.5 V,+-30 ,SMD ,1005, 100 pF, Pb free


SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005



EDTY0010501

1.0 x 0.6 x 0.5mm ,15 V,120 W,R/TP , ,; , ,16.7V (min)

,28V (max) ,4A , ,[empty] ,R/TP ,2P ,1

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

EDTY0010101



SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

SEVY0004301 18 V, ,SMD ,10pF, 1005

EXXY0018701

,

32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9

Color Remark





7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

6

7

7

7

7

7

7

7

7

Level

7

Location

No.

X102 X-TAL

Description

ZD401 DIODE,TVS

ZD402 DIODE,TVS

ZD403 DIODE,TVS

SAFD00 PCB ASSY,MAIN,SMT TOP

D201 DIODE,TVS

LD401 DIODE,LED,CHIP















EXXY0027001

26 MHz,7 PPM,8 pF,40 ohm,SMD ,3.2*2.5*0.75 ,26MHz

IFX ULC2 Ref. Clock, Pb-Free ,; ,26MHz ,[empty] ,3.6fF-

Motion ,1.0pF-Shunt , ,SMD ,R/TP

EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE



SAFD0146901


EDLH0011901 WHITE ,1608 ,R/TP ,PB-FREE(ZENER)














7 MIC201 MICROPHONE

R235

R430

R431

PCB ASSY,MAIN,PAD

SHORT

RES,CHIP,MAKER

RES,CHIP,MAKER

R432

R434

RES,CHIP,MAKER

RES,CHIP,MAKER

SPFY00 PCB,MAIN

SAFP0000501

ERHZ0000355 270 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000355 270 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000355 270 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000355 270 ohm,1/16W ,F ,1005 ,R/TP

SPFY0229001 FR-4 ,1.0 mm,STAGGERED-6 ,GW200 ,; , , , , , , , , ,

Color Remark




13.3 Accessory



Level

Location

No.

3

Description

SBPL00 BATTERY PACK,LI-ION

3

3

3

3

3

BATTERY PACK,LI-ION

SSAD00 ADAPTOR,AC-DC

ADAPTOR,AC-DC

ADAPTOR,AC-DC

ADAPTOR,AC-DC


SBPL0098201

SBPL0098901

SSAD0034501

SSAD0034502

SSAD0034503

SSAD0034504

3.7 V,900 mAh,1 CELL,PRISMATIC

,463450,INNERPACK,WW ,; ,3.7 ,900 ,180 ,PRISMATIC

,4.6X34X50 ,5.1X34X50 ,BLACK ,INNERPACK ,

3.7 V,900 mAh,1 CELL,PRISMATIC ,463450,innerpack,

WW ,; ,3.7 ,900 ,180 ,PRISMATIC ,4.6x34x50 ,4.6x34x53

,BLACK ,innerpack ,

,

100-240V ,5060 Hz,4.8 V,0.4 A,CE ,AC-DC ADAPTOR ,;

,90Vac~264Vac ,4.8Vdc ,400mA ,5060 , ,WALL 2P ,USB

,

100-240V ,5060 Hz,4.8 V,.4 A,CE ,AC-DC ADAPTOR ,;


,



,



Color

BLACK

Remark




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