LG GX500 Service Manual

Date: March, 2010 / Issue 1.0

Service Manual

GX500

Internal Use Only

Table Of Contents

1. INTRODUCTION .................................................5

1.1 Purpose ............................................................................................... 5

1.2 Regulatory Information ............................................................... 5

1. Abbreviations ................................................................................... 7

2. PERFORMANCE ..................................................9

2.1 H/W Features .................................................................................... 9

2.2 Technical Specification ...............................................................10

3. TECHNICAL BRIEF ............................................17

.1 GX500 Functional Block diagram...........................................17

.2 Dual Baseband Processor (BBP) Introduction ...................18

. Power management IC ..............................................................8

.4 Power ON/OFF ...............................................................................46

.5 Dual SIM & u-SD Interface .........................................................48

.6 Memory ............................................................................................50

.7 LCD Display .....................................................................................5

.8 Keypad Switching & Scanning ................................................54

.9 LCD back-light illumination ......................................................55

.10 JTAG & ETM interface connector .........................................56

.11 Audio ...............................................................................................57

.12 Charging circuit ..........................................................................59

.1 WI-FI & BLUETOOTH & FMradio ............................................60

.14 5pin Micro USB Interface connector ..................................6

.15 Triaxial, digital acceleration sensor .....................................64

.16 General Description ..................................................................66

.17 Receiver part ................................................................................68

.18 Transmitter part ..........................................................................69

.19 RF synthesizer ..............................................................................70

.20 DCXO ...............................................................................................70

.21 Front End Module control ......................................................71

.22 Power Amplifier Module .........................................................72

.2 PAM Schematic ...........................................................................7

4. TROUBLE SHOOTING ......................................74

4.1 Trouble shooting test setup .....................................................74

4.2 Power on Trouble ..........................................................................75

4. Charging trouble ..........................................................................78

4.4 LCD display trouble .....................................................................80

4.5 Camera Trouble .............................................................................82

4.6 Receiver & Speaker trouble ......................................................84

4.7 Microphone trouble ....................................................................86

4.8 Vibrator trouble .............................................................................87

4.9 SIM & uSD trouble ........................................................................89

4.10 Touch trouble...............................................................................92

4.11 LCD LED trouble .........................................................................9

4.12 Trouble shooting of Receiver part .......................................94

4.1 Trouble shooting of Transmitter part .............................. 100

4.14 Trouble shooting of WI-FI/BT/FM part ............................ 109

5. DOWNLOAD & S/W UPGRADE......................112

6. BLOCK DIAGRAM ...........................................120

7. CIRCUIT DIAGRAM ........................................121

8. BGA Pin Map ..................................................129

9. PCB LAYOUT ...................................................139

10. RF CALIBRATION .........................................147

10.1 Test Equipment Setup ........................................................... 147

10.2 Calibration Step ....................................................................... 147

11. STAND ALONE TEST ....................................152

11.1 SIM1 TEST ................................................................................... 152

11.2 SIM2 TEST ................................................................................... 159

12. ENGINEERING MODE ..................................161

13. EXPLODED VIEW & REPLACEMENT

PART LIST ....................................................163

1.1 EXPLODED VIEW ...................................................................... 16

1.2 Replacement Parts.................................................................. 165

1. Accessory ................................................................................... 189

Copyright © 2010 LG Electronics. Inc. All right reserved.

Only for training and service purposes

- LGE Internal Use Only

LGE Internal Use Only - 4 Copyright © 2010 LG Electronics. Inc. All right reserved.


1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of the GX500.

1.2 Regulatory Information

1.2.1 Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges you’re your telecommunications services.

System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. LGE will not be responsible for any charges that result from such unauthorized use.

1.2.2 Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

1.2.3 Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the GX500 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

1.2.4 Maintenance Limitations

Maintenance limitations on the GX500 must be performed only at the LGE or its authorized agents. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1.2.5 Notice of Radiated Emissions

The GX500 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

LG Electronics 5/143 LGE Property



- 5 LGE Internal Use Only

1. INTRODUCTION

GX500 Operational Description Revision A

1.2.6 Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

1.2.7 Interference and Attenuation

An GX500 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

1.2.8 Electrostatic Sensitive Devices

ATTENTION

Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign. Following information is

ESD handling: Service personnel should ground themselves by using a wrist strap when exchange system boards.

When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used. When returning system boards or parts such as EEPROM to the factory, use the protective package as described.




1. INTRODUCTION


1.3 ABBREVIATION

For the purposes of this manual, following abbreviations apply:

୛ APC Automatic Power Control

Baseband ୛ BB

୛ BER

୛ CC-CV

୛ CLA

୛ DAC

୛ DCS

୛ dBm

୛ DSP

Bit Error Ratio

Constant Current – Constant Voltage

Cigar Lighter Adapter

Digital to Analog Converter

Digital Communication System dB relative to 1 milli-watt

Digital Signal Processing

୛ EEPROM Electrical Erasable Programmable Read-Only Memory

୛ EGPRS Enhanced General Packet Radio Service

୛ EL Electroluminescence

୛

୛

ESD

FPCB

୛ GMSK

୛ GPIB

୛ GPRS

୛ GSM

Electrostatic Discharge

Flexible Printed Circuit Board

Gaussian Minimum Shift Keying

General Purpose Interface Bus

General Packet Radio Service

Global System for Mobile Communications

International Portable User Identity ୛ IPUI

୛ IF

୛ LCD

୛ LDO

୛ LED

୛ LGE

Intermediate Frequency

Liquid Crystal Display

Low Drop Output

Light Emitting Diode

LG Electronics

Offset Phase Locked Loop ୛ OPLL

୛ PAM

୛ PCB

୛ PGA

୛ PLL

୛ PSTN

୛ RF

୛ RLR

୛ RMS

୛ RTC

୛ SAW

Power Amplifier Module

Printed Circuit Board

Programmable Gain Amplifier

Phase Locked Loop

Public Switched Telephone Network

Radio Frequency

Receiving Loudness Rating

Root Mean Square

Real Time Clock

Surface Acoustic Wave

Subscriber Identity Module

Sending Loudness Rating

୛ SIM

୛ SLR

୛ SRAM

୛ STMR

୛ TA

୛ TDD

୛ TDMA

୛ UART

Static Random Access Memory

Side Tone Masking Rating

Travel Adapter

Time Division Duplex

Time Division Multiple Access

Universal Asynchronous Receiver/Transmitter





1. INTRODUCTION


୛ VCO Voltage Controlled Oscillator

୛ DCXO Digitally Controled Crystal Oscillator

୛ WAP Wireless Application Protocol

ଝ 8PSK 8 Phase Shift Keying




2.1 H/W Feature

Item

Standard Battery

AVG TCVR Current

Standby Current

Talk time

Standby time

Charging time

RX Sensitivity

TX output power

GPRS compatibility

SIM card type

Display

Status Indicator

ANT

EAR Phone Jack

PC Synchronization

Speech coding

Data and Fax

Vibrator

Buzzer

Voice Recoding

C-Mic

Receiver

Travel Adapter

Options

Feature

Lithium-Ion Polymer, 15000mAh

Comment

265mA typ

3.7 mA typ

7 hours (GSM TX Level 7)

Over 390 hours (Paging Period:5, RSSI: -85dBm)

Under 3.5 hours

EGSM/GSM850:-105dBm ˨ ,DCS/PCS:-105dBm ˨

EGSM/GSM850 : 33dBm (@PL 5)

DCS/PCS: 30dBm (@PL 0)

Class 12

@PL5

@PP5

3V Small

Main 240 u 400 pixels, 3” WQVGA, 262K color

Send Key, Shortcut Key, Volume Up/Down Key,

PWR Key, Camera Key, Lock Key

Built in antenna

5pin Micro USB

Yes

HR/EFR/FR/AMR

Yes

Yes

No

Yes

Yes

Yes

Yes

Bluetooth hands-free kit, Data Kit

LG Electronics


9/143 LGE Property

2. PERFORMANCE


1

2

3

2.2 Technical specification

Item Description

4

Frequency Band

Phase Error

Frequency Error

Power Level

Specification

GSM850

TX: 824 + 0.2 x n MHz

RX: 869 + 0.2 x n MHz ( n = 128 ~ 251 )

EGSM

TX: 890 + 0.2 x (n-1024) MHz

RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 /1 ~ 124)

DCS1800

TX: 1710 + ( n-511 ) u 0.2 MHz (n = 512 a 885)

RX: TX + 95 MHz

PCS1900

TX: 1850.2 + ( n-512 ) u 0.2 MHz (n = 512 a 810)

RX: TX + 80MHz

RMS < 5 degrees

Peak < 20 degrees

< 0.1ppm

6

7

8

9

GSM850/EGSM

Level

5

Power Toler.

33 dBm ±2dB

31 dBm

29 dBm

27 dBm

25 dBm

±3dB

±3dB

±3dB

±3dB

10 23 dBm ±3dB

11

12

21 dBm ±3dB

19 dBm ±3dB

DCS1800/PCS1900

4

5

2

3

6

Level

0

1

7

Power Toler.

30 dBm ±2dB

28 dBm ±3dB

26 dBm ±3dB

24 dBm ±3dB

22 dBm ±3dB

20 dBm ±3dB

18 dBm ±3dB

16 dBm ±3dB

Level Power Toler.

13

14

15

16

17

18

19

17 dBm ±3dB

15 dBm ±3dB

13 dBm ±3dB

11 dBm ±5dB

9 dBm ±5dB

7 dBm ±5dB

5 dBm ±5dB

Level Power Toler.

8 14 dBm ±3dB

9

10

11

12

13

14

15

12 dBm ±4dB

10 dBm ±4dB

8 dBm

6 dBm

4 dBm

2 dBm

0 dBm

±4dB

±4dB

±4dB

±5dB

±5dB




2. PERFORMANCE


5

6

Output RF Spectrum

(due to modulation)

Output RF Spectrum

(due to switching transient)

GSM850/EGSM

Offset from Carrier (kHz).

100

200

250

400

600 ~ 1,200

100

200

250

400

1,200 ~ 1,800

1,800 ~ 3,000

3,000 ~ 6,000

6,000

DCS1800/PCS1900

Offset from Carrier (kHz).

600 ~ 1,200

1,200 ~ 1,800

1,800 ~ 3,000

3,000 ~ 6,000

6,000

GSM850/EGSM

Offset from Carrier (kHz)

400

600

1,200

1,800

DCS1800/PCS1900

Offset from Carrier (kHz)

400

600

1,200

1,800

-60

-60

-60

-63

Max. dBc

+0.5

-30

-33

-65

-71

-60

-60

-60

-65

Max. dBc

+0.5

-30

-33

-65

-73

Max. (dBm)

-19

-21

-21

-24

Max. (dBm)

-22

-24

-24

-27





7

8

9

10

2. PERFORMANCE


11

12

13

14

15

16

Spurious Emissions

Bit Error Ratio

Rx Level Report accuracy

SLR

Sending Response

RLR

Receiving Response

STMR

Stability Margin

Distortion

Conduction, Emission Status

Conduction, Emission Status

EGSM/GSM850

BER (Class II) < 2.439% @-102dBm

DCS1800/PCS1900

BER (Class II) < 2.439% @-102dBm r 3 dB

8 r 3 dB

Frequency (Hz) Max.(dB)

100 -12

200

300

1,000

0

0

0

2,000

3,000

3,400

4,000

4

0

4

4

2 r 3 dB

Min.(dB)

/

/

-12

-6

-6

-6

-9

/

Frequency (Hz) Max.(dB) Min.(dB)

100

200

300

500

1,000

3,000

0

2

2

*

-12

0

/

/

-7

-5

-5

-5

3,400

4,000

2

2

-10

* Mean that Adopt a straight line in between

300 Hz and 1,000 Hz to be Max. level in the range.

13 r 5 dB

> 6 dB dB to ARL (dB)

-35

-30

-20

-10

0

7

10

Level Ratio (dB)

17.5

22.5

30.7

33.3

33.7

31.7

25.5




2. PERFORMANCE

23

24


17

18

19

20

21

22

25

26

27

Side tone Distortion

<Change> System frequency (26 MHz) tolerance

<Change>32.768KHz tolerance

Power consumption

Talk Time

Standby Time

Ringer Volume

Charge Current

Antenna Display

Battery Indicator

Low Voltage Warning

Three stage distortion < 10% d 2.5 ppm d 30ppm

Standby

- Normal ஆ d 3.8 mA(@PP5)

EGSM/Lvl 7(Battery Capacity 1500mA):450 min

EGSM/Lvl12(Battery Capacity 1500 mA):630min

Under conditions, at least 390 hours:

1. Brand new and full 1500mAh battery

2. Full charge, no receive/send and keep GSM in idle mode.

3. Broadcast set off.

4. Signal strength display set at 3 level above.

5. Backlight of phone set off.

At least 65 dB under below conditions:

1. Ringer set as ringer.

2. Test distance set as 50 cm

Normal charging : 680 mA

Antenna Bar Number

4

2

1

7

5

0

Off

Battery Bar Number

3

2

1

0

3.53V

Ļ ±0.05V (Call)

3.43V

Ļ ±0.05V (Standby)

Power

>-92 dBm a

-97dBm a –93dBm

-100dBm a –98dBm

-103dBm a –101dBm

-105dBm a –104dBm

< –106 dBm

No Service

Voltage (±0.05V)

3.69V~4.2V

3.53V~3.69V

3.43V~3.53V

3.35V~3.43V





2. PERFORMANCE


30

28

29

Forced shut down Voltage

Battery Type

Travel Charger

3.3 r 0.05 V

Li-Polymer Battery

Standard Voltage = 3.7 V

Battery full charge voltage = 4.2 V

Capacity: 1500mAh

Switching-mode charger

Input: 150 a 240 V, 50/60Hz

Out put: 5.1, 0.7A




2. PERFORMANCE


* EDGE RF Specification (Option: is not serviced for ”EDGE mode”)

2

3

Item Description

1 RMS EVM

4

Peak EVM

95 th Percentile EVM

Origin Offset Suppression

5

6

Power Level

Output RF Spectrum

(due to modulation)

9

10

11

12

5

6

7

8

Specification

≤9%

≤30%

≤15%

≥30dB

GSM850/EGSM

Level Power

27dBm

27dBm

27dBm

27dBm

25dBm

23dBm

21dBm

19dBm

1

2

3

4

5

DCS1800, PCS1900

Level Power

0

Toler.

26/25dBm ±3dB

26/25dBm

22dBm

20dBm

±3dB

26/25dBm ±3dB

24dBm ±3dB

±3dB

±3dB

Toler.

±3dB

±3dB

±3dB

±3dB

±3dB

±3dB

±3dB

±3dB

100

200

250

400

6

7

18dBm

16dBm

GSM850/EGSM

Offset from carrier(kHz)

±3dB

±3dB

600~<1,200

1,200~<1,800

1,800~<3,000

3,000~<6,000

6,000

Max. dBc

+0.5

-30

-33

-54

-60

-60

-63

-65

-71

17

18

19

Level Power

13 17dBm

14

15

16

15dBm

13dBm

11dBm

9dBm

7dBm

5dBm

12

13

14

15

Level Power

8 14dBm

9

10

11

12dBm

10dBm

8dBm

6dBm

4dBm

2dBm

0dBm

Toler.

±3dB

±3dB

±3dB

±5dB

±5dB

±5dB

±5dB

Toler.

±3dB

±4dB

±4dB

±4dB

±4dB

±4dB

±5dB

±5dB





2. PERFORMANCE


6

7

Output RF Spectrum

(due to switching transient)

DCS1800, PCS1900


100

200

250

400

600~<1,200

1,200~<1,800

1,800~<3,000

3,000~<6,000

6,000

GSM850/EGSM


400

600

1,200

1,800

DCS1800, PCS1900


400

600

1,200

1,800

Max. dBm

-23

-26

-27

-30

Max. dBm

-23

-26

-27

-30

Max. dBc

+0.5

-30

-33

-54

-60

-60

-63

-65

-71





3. TECHNICAL BRIEF

III. Technical brief

3.1 GX500 Functional Block diagram

The functional component arrangement is mentioned below diagram. z|izz{lt st[`X\X{s

Figure 3-1. GX500 Functional Block diagram







3.2 Dual Baseband Processor (BBP) Introduction

GX500 is composed of dual Baseband Processor. (S-Gold3 & S-Gold Radio)

3.2.1 S-Gold3 Part

Figure3- 2. Top level block diagram of the S-GOLD3 TM (PMB8877)






3.2.1.1 General Description

S-GOLD3 TM is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital functionality of a cellular radio. Additionally S-GOLD3 TM Provides multimedia extensions such as camera, software MIDI,

MP3 sound. It is designed as a single chip solution, integrating the digital and mixed signal portions of the base band in 0.09um, 1.2V technology.

The chip will fully support the FR, EFR, HR and AMR-NB vocoding.

S-GOLD3 TM support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data application

(up to class 12) and EGPRS (up to class 12) without additional external hardware.

3.2.1.2 Block Description z Processing core

ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and the

Jazelle Java extension for Java acceleration.

- TEAKLite DSP core z ARM-Memory

- 32k Byte Boot ROM on the AHB

- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 16k Byte Cache for Program (internal)

- 8k Byte tightly coupled memory for Program(internal)

- 8k Byte Cache for Data(internal)

- 8k Byte tightly coupled memory for Data(internal) z DSP-Memory

- 104K x 16bit Program ROM

- 8k x 16bit Program RAM

- 60k x 16bit Data ROM

- 37k x 16bit Data RAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit z Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite. z Controller Bus system

The processor cores and their peripherals are connected by powerful buses.

Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal and external memories and with the peripheral buses. z Clock system

The clock system allows widely independent selection of frequencies for the essential parts of the S-GOLD3.

Thus power consumption and performance can be optimized for each application.






GX500 Operational Description Revision A z Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms

(H.263, MPEG-4)

- Programmable PLL with additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

- GMSK Modulator: gauss-filter with B*T=0.3

- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- Advanced static and dynamic power management features including TDMA-Frame

synchronous low power mode and enhanced CPU modes(idle and sleep modes)

- Pulse Number Modulation output for Automatic Frequency Correction(AFC)

- Serial RF Control interface: support of direct conversion RF

- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial data transmission

- 3 USIF with autobaud detection, hardware flow control and integrated

- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards

(up to 4Mbps)

- I2C-bus interface (e.g. connection to S/M power)

- A fast display interface supporting serial and parallel interconnection

- An ITU-R BT.656 compatible Camera interface.

- Programmable clock output for a camera

- An multimedia/Secure Digital Card Interface (MMCI/SD:SDIO capable)

3.2.1.3 External Devices connected to memory interface

Table 3-1. Memory interface

Device

NAND FLASH

SDR

LCD

DPRAM

Name

H8ACS0SJ0MCP-56M

H8ACS0SJ0MCP-56M

Maker

Hynix

Hynix

Remark






3.2.1.4 RF Interface (T_OUT)

S-Gold3 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF ICs

Periodically each TDMA frame.

Table 3-2. RF Interface Spec.

T_OUT

Resource

T_OUT0

T_OUT1

T_OUT2

T_OUT3

T_OUT6

Interconnection

TXON_PA

FE2

PA_BAND

FE1

PA_MODE

Description

PAM Power on

FEM Control

TX RF band select

FEM control

PAM Mode select

3.2.1.5 USIF Interface

GX500 have three USIF Drivers as follow :

- USIF1 : Hardware Flow Control / SW upgrade / Calibration

- USIF2 : Not used Rx, Tx and CTS, RTS use BT Interface

- USIF3 : BT Interface

Table 3-3. USIF Interface Spec.

Name Resource

USIF1

USIF1_TXD

USIF1_RXD

USIF1_CTS

USIF1_RTS

USIF2

USIF2_CTS

USIF2_RTS

USIF3

USIF3_TXD

USIF3_RXD

SIM1_UART_TX

SIM1_UART_RX

USB_SE0_VM

USB_DAT_VP

SIM1_BT_CTS

SIM1_BT_RTS.

SIM1_BT_TX

SIM!_BT_RX

Remark

Transmit Data

Receive Data

USB

USB

BlueTooth

BlueTooth

BT Transmit tx

BT Receive rx

3.2.1.6 ADC channel

BBP ADC block is composed of 10 external ADC channel. This block operates charging process and other related process by reading battery voltage and other analog values.

Table 3-4. S-Gold3 ADC channel usage

ADC channel

Resource

M0

M1

M8

Interconnection

BAT_ID

RF_TEMP

VSUPPLY

Description

Battery temperature measure

RF block temperature measure

Battery supply voltage measure







3.2.1.7 GPIO map

Over a hundred allowable resources, GX500 is using as follows except dedicated to SIM and Memory. GX500

GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table

Table 3-5 S-Gold3 GPIO pin Map

Port function

#Keypad

KP_IN0

KP_IN1

KP_IN4

GPIO_03

CC0CC4IO

CC1CC0IO

CC1CC4IO

KP_OUT0

KP_OUT1

KP_OUT2

KP_OUT3

#USIF1: Universal Serial IF

#USB

USIF1_RXD_MRST

USIF1_TXD_MTSR

USIF1_RTS_N

USIF1_CTS_N

G

GPIO_15

GPIO_16

USIF2_RTS_N

USIF2_CTS_N

G

USIF3_RXD_MRST

USIF3_TXD_MTSR

GPIO_21

G

MMCI2_CMD

MMCI2_DAT[0]

MMCI2_CLK

G

CIF_D0

CIF_D1

CIF_D2

Signal Name

G

KEY_ROW0

KEY_ROW1

KEY_ROW4

HSMIC_BIAS_EN

CHG_DET

MMC_DET

ACCEL_INT

KEY_COL0

KEY_COL1

KEY_COL2

KEY_COL3

G

SIM1_UART_RX

SIM1_UART_RX

USB_DAT_VP

USB_SE0_VM

G

BT_SEL

USB_SEL

SIM1_BT_RTS

SIM1_BT_CTS

G

SIM1_BT_RX

SIM1_BT_TX

SGR_PWR_ON

G

MMC_CMD

MMC_D0

MMC_CLK

G

CIF_D0

CIF_D1

CIF_D2

Reset Value Description

G

T/PU

T/PU

T/PU

T/PU

T/PU

T/PU

T/PU

T/PU

T/PU

T/PU

T/PU

G

G

G

G

G

G

G

G

"Falling Edge" INT on TA

"Falling Edge" INT

For Accel Sensor

G

G

T/PD

T/PD

T/PU

T/PD

G

T/PU

T/PD

T/PD

T/PD

G

T/PD

T/PD

T/PD

G

T/PD

T/PD

T/PD

G

T/PD

T/PD

T/PD

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

"High" Enable





CIF_D3

CIF_D4

CIF_D5

CIF_D6

CIF_D7

CIF_PCLK

CIF_HSYNC

CIF_VSYNC

CLKOUT2

CIF_PD

CIF_RESET

#Display_Interface

DIF_D0

DIF_D1

DIF_D2

DIF_D3

DIF_D4

DIF_D5

DIF_D6

DIF_D7

GPIO_109

DIF_CS1

GPIO_96

DIF_CD

DIF_WR

DIF_RD

EINT7

DIF_VD

GPIO_27

GPIO_101

#I2C1

I2C1_SCL

I2C1_SDA

PM_INT

#I2C2

I2C2_SCL

I2C2_SDA

#Chip Card (USIM1)

CC_IO

CC_CLK

CC_RST

G

GPIO_110

EINT3


T/PD

T/PD

T/PD

T/PU

T/PU

T/PU

T/PU

T/PU

T/PD

T/PD

T/PD

T/PD

G

T

T

#

G

T

T

G

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

G

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

L

SG3_SIM1_CLK L

SG3_SIM1_RST

G

L

G

USB_OEn T/PD

BT_HOST_WAKEUP T/PU

CIF_D3

CIF_D4

CIF_D5

CIF_D6

CIF_D7

CIF_PCLK

CIF_HSYNC

CIF_VSYNC

CIF_MCLK

CIF_PD

CIF_RESET

G

DIF_D0

DIF_D1

DIF_D2

DIF_D3

DIF_D4

DIF_D5

DIF_D6

DIF_D7

MIC_BIAS_EN

DIF_CS

TOUCH_EN

DIF_CD

DIF_WR

DIF_RD

USW_INT

DIF_VSYNC

DIF_RESET

LCD_BL_CTRL

G

SCL

SDA

PM_INT

G

CODEC_SCL

CODEC_SDA

G

SG3_SIM1_IO

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

"High" Enable

G

G

G

G

G







G

SWIF_TXRX

G

MMCI1_CMD

MMCI1_DAT[0]

MMCI1_CLK

G

MMCI1_DAT[1]

MMCI1_DAT[2]

MMCI1_DAT[3]

G

I2S1_CLK0

GPIO_112

I2S1_RX

I2S1_TX

I2S1_WA0

G

EINT4

GPIO_102

CC0CC1IO

GPIO_33

CC0CC3IO

GPIO_103

G

EPN1

EPP1

EPPA1

EPREF

EPPA2

MICN1

MICP1

MICN2

MICP2

AUXN1

AUXP1

AUXN2

AUXP2

AUXGND

VMICP

VMICN

#I/Q-Signale: Analog

Interface, Baseband

PAOUT1

BB_I

G

G

G

G

G

G

G

G

G

G

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

G

G

G

G

G

G

G

G

G

G

G

G

T/PD

T/PD

T/PD

G

T/PD

T/PD

T/PD

T/PD

T/PD

G

T/PU

G

T/PD

T/PD

T/PD

G

G

G

WLAN_CMD

WLAN_SDIO[0]

WLAN_CLK

G

WLAN_SDIO[1]

WLAN_SDIO[2]

WLAN_SDIO[3]

G

SIM1_I2S1_CLK

RPWRON

SIM1_I2S1_RX

SIM1_I2S1_TX

SIM1_I2S1_WA0

G

_EOC

LCD_ID

_PPR

SG3_INT

VIB_PWM

NA

G

EAR_N

EAR_P

BB_SND_L

G

BB_SND_R

SIM1_MIC_N

SIM1_MIC_P

SIM1_HSMIC_N

SIM1_HSMIC_P

GND

GND

GND

GND

G

TP 116

GND

G

PA_LEVEL

I

G

G

G

G

Not Used

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

End Of Charge

G

USB/TA Charger Insert

To SGR

T0 timer (PWM)

Connected to GND

Connected to GND

Connected to GND

Connected to GND

G

Not Used

Connected to GND






MON2

TRACESYNC

TRACECLK

PIPESTAT[2]

PIPESTAT[1]

PIPESTAT[0]

TRACEPKT[0]

TRACEPKT[1]

TRACEPKT[2]

TRACEPKT[3]

TRACEPKT[4]

TRACEPKT[5]

TRACEPKT[6]

TRACEPKT[7]

G

G

G

#JTAG

TDO

TDI

TMS

TCK

TRST_n

RTCK

#Debug

TRIG_IN

M_3

M_4

M_5

M_6

M_7

M_8

BB_IX

BB_Q

BB_QX

#Measurement

M_0

M_1

M_2

M_9

M_10

MON1

IX

Q

QX

G

BAT_ID

S1_RF_TEMP ʳ

TP 101 ʳ ʳ ʳ

TP 105

VSUPPLY ʳ ʳ

G

VREFN

G

G

S1_TDO

S1_TDI

S1_TMS

S1_TCK

S1_TRSTn

S1_RTCK

G

S1_TRIG_IN

2V62_VIO

G

TRACESYNC

TRACECLK

PIPESTAT2

PIPESTAT1

PIPESTAT0

TRACEPKT0

TRACEPKT1

TRACEPKT2

TRACEPKT3

TRACEPKT4

TRACEPKT5

TRACEPKT6

TRACEPKT7

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

T

PU

PU

PD

PD

L

G

PD/Latched

PD/Latched

PD/Latched

L

L

L

L

H

L

L

L

H

H

L

L

L

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

Not Used

Not Used

G

G

Not Used

G

G

G config pins (MON1, MON2, TRIG_IN)

according to memory types =>

NAND 8-bit







G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

#

H

H

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

H

H

H

H

H

L

L

L

L

L

L

L

L

L

L

L

H

G

S1_ADD(31)

_RD_S1

S1_DATA(0)

S1_DATA(1)

S1_DATA(2)

S1_DATA(3)

S1_DATA(4)

S1_DATA(5)

S1_DATA(6)

S1_DATA(7)

S1_DATA(8)

S1_DATA(9)

S1_DATA(10)

S1_DATA(11)

S1_DATA(12)

S1_DATA(13)

S1_DATA(14)

S1_DATA(15)

_NAND_CS_S1

_RAM_CS_S1

_DPRAM_CS_S1

G

_WR_S1

S1_ADD(16)

S1_ADD(17)

S1_ADD(18)

S1_ADD(19)

S1_ADD(20)

S1_ADD(21)

S1_ADD(22)

S1_ADD(23)

S1_ADD(24)

S1_ADD(25)

S1_ADD(26)

S1_ADD(27)

G

G

G

G

G

G

G

G

G

G

G

TP 106

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G






G

G

G

G

G

G

G

FCDP_RBn

G

FWP

G

T_OUT0

GPIO_44

T_OUT2

GPIO_46

GPIO_47

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

S1_ADD(28)

S1_ADD(29)

S1_ADD(30)

G

S1_SDCLKI

S1_SDCLKO

_BC0_S1

_BC1_S1

_BC2_S1

_BC3_S1

S1_ADD(0)

S1_ADD(1)

S1_ADD(2)

S1_ADD(3)

S1_ADD(4)

S1_ADD(5)

S1_ADD(6)

S1_ADD(7)

S1_ADD(8)

S1_ADD(9)

S1_ADD(10)

S1_ADD(11)

S1_ADD(12)

S1_ADD(13)

S1_ADD(14)

S1_ADD(15)

_RAS_S1

_CAS_S1

S1_CKE

G

S1_FCDP

G

_DPRAM_SEM_S1

G

TXON_PA

WLAN_WAKEUP

S1_PA_BAND

WLAN_ENABLE ʳ

H

H

H

L

T

H

H

H

H

H

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

G

G

T/PD G

H

H

L

G

T/PU

G

T/PU G

G G

T/PD/Latched ʳ

T/PD/Latched WIFI

T/PD/Latched ʳ

T/PD WIFI

T/PU NA

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G







CC1CC1IO

T_OUT6

GPIO_50

GPIO_51

GPIO_52

AFC

EINT1

F26M

F32K

OSC32K

RESET_n

GPIO_59

RTC_OUT

G

CLK32K

DSPOUT1

GPIO_63

CC1CC7IO

GPIO_54

GPIO_55

#SPCU

GPIO_117

GPIO_118

SPCU_RC_OUT0

SPCU_RQ_IN2

#RF Control Unit

RF_STR0

GPIO_57

RF_DATA

RF_CLK

#Other Functional Pins:

Clocks and control

SGR_INT

PA_MODE

SGR_Resetn

UART_SEL

LIN_MOTOR_EN

WLAN_HOST_WAKE

UP

SIM_SWITCH

_CHG_EN

G

SIM1_SIM2_SEL

BT_ENABLE

VCXO_EN

RESOURCE_CTRL

G

RF_EN

T/PD from SGR

T/PD ʳ

T/PD/Latched SGR RESET 洢歾穞処穳旇

HIGH 決檺檂穮

T/PD/Latched ʳ

T/PD/Latched MOTOR DRIVER IC CONTROL

T/PU/Latched

WIFI

T/PD ʳ

T/PD

G

T/PD ʳ

Charging IC Enable & control

G

T/PD WIFI

H

T/PD

G

T/PD ʳ ʳ

G

G

_DPRAM_BUSY_S1 T/PD/Latched ͑

RF_DA

RF_CLK

L

L

G

G

G G G

AFC

_DPRAM_INT_S1

26MHZ_MCLK

G

G

_RESET

SIM1_DSR

RTC_OUT

G

CLK32K

WDOG

BT_WAKEUP

T

#

#

#

#

#

T

T/PD

G

T/PD

T/PD

T/PU

G

1.8V Power Domain

G

Connected to 32KHz

Connected to 32KHz

G

G

TP 110

G

WIFI ʳ

WIFI






3.2.2 S-Gold Radio Part

Figure 3-3. S-Gold Radio Circuit Diagram of GX500







3.2.2.1 Block Description

Connectivity

S-GOLDradio

TM offers a variety of connectivity options common in today’s feature phone applications:

• USB 2.0 Full Speed (12 Mbps)

• IrDA Controller

Supports Infrared SIR Mode Transceivers

• RS-232 over a 16C550 compliant UART

• MMC/SD Memory Card Interface

– Low Voltage Capable

– SDIO expandable (using external components)

• Ready to connect to the Infineon’s Bluemoon Family Bluetooth Transceivers

– HCI (H5) optimized USIF (Universal Serial Interface)

– Dedicated PCM-style digital audio interface (I2S)

– Dedicated power supply

• Microcontroller-Like Extension Interface

For multimedia companions (for example, complex display/camera modules or graphic accelerators)

• External Memory Interface

Supporting:

– SDRAM

– Cellular RAM

– Burst Flash

– SRAM

– NAND flashes (error correction capability in HW)

• User Interface (Keypad)

Supporting up to 74 keys with multiple key-press capability

• SIM Card interface (USIM)

ISO 7816 compatible

• Analogue Measurement Unit

For various general purpose measurements such as battery voltage, battery, VCXO and environmental temperature, battery technology, transmission power, offset, on-chip temperature, etc.

Security

S-GOLDradio

TM has the following security features:

• Secure Boot and Flash Update

• SHA1 HW acceleration

• Secure Debug

• 128-bit customer defined efuse key

• Anti-intrusion logic.






Audio

Besides the telephony voice CODECs supplied by the Firmware running on the TEAKLite® DSP core, the

ARM926 core enables running high-quality audio CODECs such as MPEG-1/2 Layer-3 Decode (MP3), AAC+ or

AAC++. Audio streaming is supported according to the 3GPP PSS Release 4 standard.

The output of audio and voice codecs can be mixed and routed to the integrated Hi-Fi Stereo voiceband supporting CD-Quality. Alternatively, the audio can also be sinked to a mono loudspeaker using the integrated hands-free amplifier.

Video and Imaging

S-GOLDradio

TM allows connecting an external camera module over an ITU-R BT656 compliant interface and a display module over a microcontroller-like parallel or serial interface. Furthermore, ARM’s MOVE coprocessor is integrated to accelerate video encoding algorithms (for example, H.263 or MPEG-4). This fulfills basic multimedia requirements and allows connecting commodity cameras and displays without the need of an additional multimedia IC. The computational power for encoding and decoding still pictures (JPEG) and video sequences (H.263 or MPEG-4) is provided by the integrated ARM926 core. Over-the-air interface JPEG pictures and H.263 or MPEG-4 videos can be sent or received as MMS by means of (E)GPRS.

S-GOLDradio

TM also enables video down-streaming because of its DSP and ARM performances.

Supported "still pictures" multimedia scenarios are:

• View Finding for a Picture Snapshot: Captured frames are transferred from the camera IF to the display

IF at up to15 fps (depending on the camera used) in QCIF resolution (depending on the display used).

Downscaling and color conversion is done by the camera and display interface logic. Therefore, view finding for a snapshot is possible without burdening the CPU. However, picture rotation and/or overlay are performed by SW if required.

• Shooting: The captured picture, with up to 1.31 MPixel resolution (SXGA 1280 x 1024), is transferred within 1/15 sec to external memory.

1)

Then, JPEG compression is done by SW, while the viewfinder is frozen so that the user can immediately see the snapshot on the display.

• Photo Flash: Under low light conditions usually a photo flash is required. To activate the flash at the right time, a general purpose timer unit (GTPU) can be used that is triggered by the frame synchronization signal

(VSYNC) from the camera interface.

• Processing: JPEG thumbnail generation, picture overlay, picture rotation and other picture processing tasks are performed by SW.

• Viewing: A JPEG picture is decoded, down-scaled and format converted by SW and then transferred to the display interface. JPEG thumbnails can also be transferred directly to the display interface after decoding by SW without additional downscaling.

• Storage: JPEG pictures can be stored on an MMC/SD card, a Flash or a PC.

• Sending/Receiving: JPEG thumbnails can be sent/received as MMS (E-GPRS). Full resolution JPEG pictures can be sent/received as e-mail or downloaded from the internet.

Supported "video sequence" multimedia scenarios:

• Record Video Sequences: Captured frames in QCIF resolution are transferred to internal memory at 15 fps. H.263 or MPEG-4 encoding is performed on-the-fly by SW with the support of the MOVE coprocessor.







The audio recording is performed on the DSP (GSM AMR CODEC). Multiplexing of audio and video streams is performed by the ARM.

• View Finding during Video Encoding: During video recording the user needs to see what is being recorded. Therefore, the captured frames are not only encoded but also transferred to the display interface.

If only every second frame from the camera is used for encoding, viewfinding is possible without burdening the CPU. However, if each frame from the camera has to be encoded, due to low camera frame rate, the YCbCr4:2:2 to YCbCr4:4:4 color conversion and further downscaling is performed by SW.

Picture rotation and overlay has to be done in SW in any case.

• Storage: Compressed H.263 or MPEG-4 videos can be stored on an MMC/SD, a Flash or a PC.

• Viewing: De-multiplexing of audio and video streams is performed by the ARM. The H.263 or MPEG-4 decoding is also done by SW on the ARM and then the frames are transferred to the display interface.

Audio decoding (GSM-AMR) is done on the DSP.

The audio/video synchronization is done by time stamp feedback from the DSP to the ARM.

• Sending/Receiving: H.263 or MPEG-4 videos can be sent/received as MMS (E-GPRS), as e-mail or downloaded from the internet.

Higher Multimedia Performance

If higher multimedia performance is required, an external multimedia IC can be connected to

S-GOLDradio

TM because it contains a multimedia IC interface module. The camera and display interface pins are used in a multiplex mode to connect an external multimedia IC to the S-GOLDradio

TM multimedia

IC interface module. The display and camera are connected to the multimedia IC, which contains functions

(in HW and/or SW) to process still images and video data. This configuration is intended for higher-end graphics features (for example, high quality video streaming, video conferencing, hardware-assisted 2D/3D graphics functions, etc.).

3.2.2.2 External Devices connected to memory interface

Table 3-6 Memory interface

Device

NAND FLASH

SDRAM

Name

K5D1H12ACC-A075

K5D1H12ACC-A075

Maker

SAMSUNG

SAMSUNG

Remark

1G(64Mx16) NAND

512M(16Mx16) SDRAM






3.2.2.3 RF Interface

S-GOLDradio uses this interface to control RF IC and Peripherals. 6 signals are provided switch on/off RF ICs

Periodically each TDMA frame.

Table 3-7 RF Interface Spec.

T_OUT

Resource

PABS

T_OUT6

FE1

FE2

PAEN

VRAMP

Interconnection

S2_PA_BAND

PA_MODE_2

VC1

VC2

PA_EN

TX_RAMP

Description

TX RF band select

PAM Mode select

FEM control

FEM control

PAM Power on

APC

3.2.2.4 USART Interface

GX500(SGold Radio Part) has a UART Driver as follow :

- USART1 : Hardware Flow Control / SW upgrade / Calibration

Table 3-8 USART Interface Spec.

USART_0(USART1)

Resource Name

USART0_TXD

USART0_RXD

SIM2_UART_TX

SIM2_UART_RX

Remark

Transmit Data

Receive Data

3.2.2.5 ADC channel

SGold Radio ADC block is composed of 7 external ADC channel. This block operates charging process and other related process by reading battery voltage and other analog values.

Table 3-9 S-GOLDradio ADC channel usage

ADC channel

Resource

M0

M1

M8

Interconnection

BAT_ID

RF_TEMP

VSUPPLY

Description

Battery IC check

RF block temperature measure

Battery supply voltage measure



- LGE Internal Use Only




3.2.2.6 GPIO map

Over a hundred allowable resources, GX500 is using as follows except dedicated to SIM and Memory. GX500

GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table.

Table 3-10 S-GOLDradio GPIO pin Map

Port function

#Keypad

KP_IN0

KP_IN1

KP_IN2

KP_IN3

KP_IN4

KP_IN5

KP_IN6

KP_OUT0

KP_OUT1

KP_OUT2

KP_OUT3

#USART0

USART0_RXD

USART0_TXD

USART0_RTS_N

USART0_CTS_N

DSPOUT0

#USB

USB_DPLUS

USB_DMINUS

#CIF:Camera Interface

CIF_D0

CIF_D1

CIF_D2

CIF_D3

CIF_D4

CIF_D5

CIF_D6

CIF_D7

CIF_PCLK

CIF_HSYNC

CIF_VSYNC

CLKOUT2

CIF_PD_GPIO

Signal Name

G

G

G

G

G

G

G

G

G

G

G

G

G

SIM2_UART_RX

SIM2_UART_TX

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

SIM2_USB_DP

SIM2_USB_DM

G

Reset Value Description

G

T/PU

G

T

T

G

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PU

T/PU

T/PU

T/PU

T/PU

T/PU

T/PU

T/PU

T/PU

T/PU

T/PU

G

T/PD

T/PU

T/PU

T/PU

G

Not Used

G

G

G

G

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Deleted

Not Used

Not Used

G

G

G

Not Used

Not Used






CIF_RESET_GPIO

#Display_Interface

DIF_D0

DIF_D1

DIF_D2

DIF_D3

DIF_D4

DIF_D5

DIF_D6

DIF_D7

DIF_CS1

DIF_CS2

DIF_CD

GPIO_41

DIF_RD

GPIO_43

DIF_VD

EINT3

#I2C

I2C_SCL

I2C_SDA

PM_INT

#Chip Card (USIM1)

CC_IO

CC_CLK

CC_RST

#MMCI: Multimedia Card IF

MMCI_CMD

MMCI_DAT0

MMCI_CLK

#USIF: Universal Serial IF

USIF_TXD_MTSR

USIF_RXD_MRST

USIF_SCLK

#I2S1: DAI-PCM

I2S1_CLK0

I2S1_RX

I2S1_TX

I2S1_WA0

#MMCI:

SD-Extension

MMCI_DAT1

MMCI_DAT2

MMCI_DAT3

T

T

#

T/PD

G

G

OD/L

L

T/PD

G

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PD

T/PU

T/PU

T/PU

T/PU

T/PU

T/PD

T/PD

L

G

T/PD

T/PD

T/PD

G

T/PD

T/PD

T/PD

G

T/PD

T/PD

T/PD

T/PD

G

T/PD

T/PD

T/PD

G

G

G

G

G

G

G

G

G

G

G

G

G

SIM2_RPWRON

G

SGR_INT

G

SG3_INT

G

S2_I2C_SCL

S2_I2C_SDA

NONE

G

SGR_SIM2_IO

SGR_SIM2_CLK

SGR_SIM2_RST

G

G

G

G

G

G

G

G

G

SIM2_I2S1_CLK

SIM2_I2S1_RX

SIM2_I2S1_TX

SIM2_I2S1_WA0

G

_DPRAM_INT_S2

_DPRAM_BUSY_S2

_DPRAM_SEM_S2

G

G

G

G

G

G

G

G

Not Used

G

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

Not Used

G

Not Used

G

Not Used

G

G

Not Used

Not Used

Not Used

G

G

G

G

G

Not Used

Not Used

Not Used

G

G

Power Change

G

G







#Voiceband: Analog Interface

EP_N

EP_P

HS_N

EP_CM

HS_P

MIC1_N

MIC1_P

MIC2_N

MIC2_P

VMIC

#Measurement

M0

M1

M2

M7

M8

M9

M10

#Bandgap reference: Analog

Interface

VREF2

IREF2

#JTAG

TDO

TDI

TMS

TCK

TRST_n

RTCK

#Debug

TRIG_IN

MON1

MON2

#External Bus Interface (EBU)

#FCDP:

Flash Controller DMA Port

FCDP_RBN

G

G

S2_FCDP

#GSM TDMA Timer: GSM Control G

1

0

G

GND

GND

G

S2_TDO

S2_TDI

S2_TMS

S2_TCK

S2_TRSTn

S2_RTCK

G

0

G

SKP_N

SPK_P

RCV_N

G

RCV_P

SIM2_MIC_N

SIM2_MIC_P

SIM2_HSMIC_N

SIM2_HSMIC_P

TP 515

G

BAT_ID

S2_RF_TEMP

G

GND

VBAT

G

G

T_OUT1

T_OUT2

T_OUT3

T_OUT4

T_OUT5

NONE

NONE

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

Not Used

G

G

G

G

G

Not Used

G

G

G

G

T

PU

PU

PD

PD

L

G

PD/Latched

PD/Latched

PD/Latched

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

G

T/PU

G

T/PD/Latched

T/PD/Latched

T/PD

T/PU

T/PD






T_OUT6

T_OUT7

T_OUT8

#Other Functional Pins: Clocks and control

CLKOUT0

F26M

F32K

OSC32K

RESET_N

VDD_FUSE_FS

RTC_OUT

PMU_SCMODE_OUT

VCXO_EN

#Extra I/Os & Interrupt Inputs

DSPIN0

DSPIN1

PA_MODE_2

G

G

G

G

NONE

F32K

OSC32K nRESET

GND

NONE

NONE

NONE

G

G

G

T/PD

T/PD

T/PD

G

T/PD

#

#

#

G

G

#

G

H

G

T/PD

T/PU

G

G

G

G

Not Used

G

G

G

G

G

G

G

G

G

Not Used

Not Used







3.3 Power management IC

GX500 is composed of dual Power Management Part. (S-Gold3 & S-Gold Radio)

3.3.1 S-Gold3 Part


SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has been specially designed for usage with S-Gold3. Although optimized for usage with the Infineon S-GOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as well. It also supports the cellular

RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD3 it provides all power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone minimizing external device count.

Block Description

• Highly efficient step-down converter for main digital baseband supply including Core, DSP and memory interface (External Bus Unit).

• Support of S-GOLD standby power-down concept

• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices

• Voltage independent switching of two SIM cards

• LDO regulators for baseband I/O supply

• LDO regulator for analog mixed-signal section of S-GOLD

• Low-noise LDO regulators for RF devices

• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth

• Audio amplifier 8 Ohms for handsfree operation and ringing

• Charge Control for charging Li-Ion/Polymer batteries under software control

• Pre-charge current generator with selectable current level

• RTC regulator with ultra-low quiescent current

• USB interface support for peripheral and mini-host mode

• Backlight LEDs driver with current selection and PWM dimming function

• Two single LED driver outputs for signaling

• Vibrator driver with adjustable voltage

• Fully controlable by software via I2C – Bus

• Temperature and battery voltage sensors

• Interrupt channels for peripherals

• System debug mode

• VQFN 48 package with heat sink and non-protruding leads

• Compatible with the Infineon E-GOLD+ V2 and V3

SM-POWER is a further step on the successful E-Power product line with enhanced and optimized functionality.

SM-POWER features a baseband supply concept with a DC/DC step-down converter cascaded by two linear regulators

–SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone functions (e.g. organizer functions, games, MP3 decoding) possible.

LGE Internal Use Only

LG Electronics

- 8 Copyright © 2010 LG Electronics. Inc. All right reserved.





– SDBB has high efficiency up to 95% and also a power save mode.

– Memory Interface is directly supported by the SDBB

– SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices.

– For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.

SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the linear regulator for the DSP during mobile standby whenever this subsystem is not used. In this phase the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up with power being supplied by the other linear regulator.

SM-POWER includes a fully differential audio amplifier able to drive loads down to a nominal value of 8 Ohm for usage in hands-free phones and for ringing

– 450 mW maximum output power

– adjustable gain

– mute switch SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries

– click and pop -protection SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries

– Precharge current source with two current levels

– Constant current / constant voltage charging with 3 different termination voltages

– Programable charge current limitation for use with different batteries

– Freely programable pulse charging to reduce the thermal power dissipation in the constant voltage charging

phase

– Top-off charge current sensing SM-POWER completes the USB interface of S-GOLD

– Regulated voltage for S-GOLD USB interface including reverse current and overvoltage protection

– Switch to supply USB pull-up resistor

– Mini-host pull down resistor functionality

– Charge pump with internal switching capacitor for USB host VBUS supply voltage SM-POWER fully supports LED

and Vibra Motor functionality

– no external components needed

– driver for backlight LEDs adjustable in steps up to 140mA and with soft turn on and off by PWM dimming

– two driver outputs for single LEDs for precharge indication and signaling with i.e. change of colour

–driver for Vibra Motor with adjustable voltages, soft startup / shutdown and current limitation

SM-POWER offers several control functions

– Power-on Reset Generator with logic state machine

– I2C bus interface

– I2C bus configurable mode control logic with ON (push-button or RTC), VCXOEN and LRF3EN

(wake-up by Bluetooth) inputs

– Programable interrupt channels to handle peripherals like SIM, MMC and USB

– Monitoring of charging functions

– Undervoltage Shut-Down

– Errorflags (volatile or non-volatile) from many power-supply functions and thermal sensor in order to debug

system

– Overtemperature Shut-Down

– Overtemperature Warning

– Support of S-GOLD standby power-down concept

– Support of S-GOLD Power-Down Pad Tristate Function







Table 3-11. LDO Output Table of SM-Power

VRF2

VRF3

VPLL

VRTC

VAFC

VVIB

LDO Net name

SD1

SD2

VAUX

VIO

VSIM

VMME

1V35_Core

1V8_SD

2V85_VFM

2V62_VIO

2V9_SIM

2V8_VMME

VUMTS

VUSB

VLED

1V5_VBT

VUSB

VLED

VAUDIOa 2V5_VAUDA

VAUDIOb 2V5_VAUDB

VRF1 2V85_VRF

1V5_VRF

2V65_VBT

1V35_VPLL

2V11_RTC

VAFC

2V8_VVIB

Output

Voltage

1.35V

1.8V

2.9V

2.62V

2.9V

2.9V

2.85V

3.1V

2.9V

2.5V

2.5V

2.85V

1,53V

2.7V

1.35V

2.11V

2.65V

2.8V

600mA

300mA

100mA

100mA

70mA

150mA

110mA

40mA

10mA

200mA

50mA

150mA

Output Current Usage

100mA

150mA

30mA

4mA

5mA

140mA

Core & for LDO

Memory

LCD

Peripherals

SIM card u-SD

Not used

Not used

Not used

Stereo headset, Mono earpiece

Analog parts of S-Gold

2.85 V supply for SMARTi-PM

RF transceiver


RF transceiver

Bluetooth

S-GOLD3 PLL

Real Time Clock

Not used

Vibrator






PMIC

VUSB

VBAT

VBAT

C237

2.2u

C212

1u

C214

0.1u

1V35_VPLL 2V62_VIO

VBAT VBAT

2V62_VIO

C217

2.2u

VBAT

SG3_RPWRON_EN

RTC_OUT

R216

27K

ON_OFF2

1V8_SD 2V5_VAUDB

2V5_VAUDA 2V85_VFM

USB_OEN

USB_DAT_VP

USB_SE0_VM

VBAT TXON_PA

VBAT

C204 C208 C213

10u 10u 22u

C230

2.2u

C209

2.2u

C245

2.2u

C240

0.1u

C243

1u

SIM1_USB_DP

SIM1_USB_DM

PMRSTN

220

VCXO_EN

SIM1_BT_VCXO_EN

C241

10u

C247

2.2u

C224

0.1u

TP203

B1

C2

D3

C1

D2

RCV

VPIN

VMIN

D+

D-

E3

D1

E2

E1

RESET_N

RESET2_N

SLEEP1_N

SLEEP2_N

F2

F1

VAUDIOA

VDDAUDIOA

G2

G1

VDDAUDIOB

VAUDIOB

H2

H1

VAUX

VDDAUX

J1

J2

H3

J3

SU1_GATE

SU1_GND

SU1_FB

SU1_ISENSE

K1

K2

L2

VDDSD2

SD2_FB

SD2_FBL

C216

2.2u

Figure 3-4. SM-Power Circuit Diagram of GX500

U201

TP202

2V8_VVIB

0.1u

C205

L202

10u

1V35_CORE

VBAT 1V5_VBT

2V7_VRF

2V11_RTC

2V85_VRF

2V9_SIM

1V5_VRF

2V65_VBT

2V9_VMME

1V8_SD

VMME

VDDMME

C11

C10

VDDRF2

VRF2

D10

D11

VRF3

VDDRF13_AFC

E10

E11

VRF1

VVIB

VDDSIMVIB

F10

F11

G11

VSIM

G10

VAFC

H11

VRTC

H10

VDDUMTS

VUMTS

H9

J11

VDDSD1

SD1_FB

SD1_FBL

K11

J10

L10

FB202

C226

10u

C244

1u

C236

1u

C234

1u

C227 C228

1u 2.2u

C242

2.2u

C210

2.2u

C203

2.2u

C229

2.2u

C232

2.2u

C233

2.2u

BATTERY CONNECTOR

R214

1K

C220

100p

BAT_ID

CN201

4

1

2

3

C202

47p

C235

27p

C211

10p

VBAT

C215

2.2u

RPWRON_EN

V_BUS

SINGLE CHARGING IC

VBAT 2V62_VIO 2V62_VIO 2V62_VIO

C338

1uF

C337

1uF

Figure 3-5 SM-Power Circuit Diagram with charging part

‘

820 ohm->(646mA)

2K(10%)->91mA

1

2

3

4

5

IN

ISET

VSS1

LDO

IFULL

PGND

BAT

_PG

CHG

VSS2

EN_SET

9

8

7

6

11

10

C336

1uF

_PPR

_EOC

_CHG_EN




3.3.2 S-Gold Radio Part


S-GOLDradio integrates a Power Management Unit for Lithium-Ion battery driven applications that require different power rails. The S-GOLDradio PMU provides two fully integrated, highly efficient, step-down converters for the main loads such as cores and memories. Both step-down converters support low power modes (PFM) for maximum efficiency at all times, the output voltages are stable under all load conditions.

For supply voltages higher than the battery voltage, the S-GOLDradio PMU provides a step-up converter. This step-up converter provides the supply voltage to, for example, serial connected LED’s used in display backlight. A number of LDOs are available to provide different supply rails for different needs.

In addition, the S-GOLDradio PMU supports charging of the battery and generates the power-on reset. It also provides stand-by voltages and supports different low power modes.

See

Figure 4

.

Figure 3-6 S-GOLDradio

TM

PMU Block Diagram






General Features

• Software controlled charging of Lithium-Ion batteries

• Different low power modes for very low power consumption

• Temperature monitoring with built-in over-temperature warning.

Switched Power Supplies

• Two fully integrated step-down converters with PFM low power modes:

– 400 mA high efficiency step-down converter (SD1) with 1.5 V output voltage

– 300 mA high efficiency step-down converter (SD2) with 1.8 V output voltage

• One step-up converter:

– 5.6 V ... 25 V, 120 mA step-up converter (SU1) for the main LCD backlight, keypad backlight and photo flash.

Linear Low Dropout (LDO) Regulators

• General Purpose LDOs:

– 2.9 V, 150 mA, ultra low drop ( VAUX )

– 2.62 V, 100 mA ( VIO )

– 1.8 V / 2.9 V, 22 mA, ultra low drop ( VSIM )

– 1.8 V / 2.9 V, 150 mA, ultra low drop ( VMME )

– 2.8 V, 140 mA, ultra low drop ( VVIB )

– 3.1 V, 40 mA, ultra low drop ( VUSB )

• Low Noise LDOs:

– 2.5V, 220 mA ( VAUDIOa )

– 2.85 V, 20 mA ( VRF1 )

– 1.5 V, 80 mA ( VRF2 )

– 2.85 V, 150 mA ( VRF3 )

Low Power LDOs

• 1.5 V, 20 mA ( VPLL )

• 2.0 V, 4 mA ( VRTC ).

LED Control

• 3x PWM modulated control signal

• Current Sink Support for photo flash LED driver

• Support for serial connected LEDs

• Support for Trickle and Indicator LED.

Audio Amplifier

• Battery driven 400 mW differential audio amplifier for driving 8 ohm loudspeaker

• Three gain stages including overdrive for ringing tones

• >90 dB PSRR (4 kHz).







Interfaces

• I2C control interface for device configuration

• PMU is configured in software via registers

• Power-on reset generation

• Interrupt (event) line to indicate status change.

Control Unit

• Device ON/OFF switching

• Over-temperature warning

• System start-up state machine

• Under-voltage shut down with defined system behavior

• Independent LDO switch on

• Software and hardware programmable voltages

• System watchdog timer with on-chip oscillator.

C514

10n

C535

10n

VRF3_2V85

VRF1_2V85

C534

0.1u

C529

10n

VRF3_2V85

VAUDIO_2V5

VBT_2V9

VUSB_3V1

C530

1u

C527

2.2u

C528

1u

C503

0.1u

C509

2.2u

VMMC_1V8

C531

2.2u

VIO_2V62

C510

1u

S2_VBAT VRF2_1V5

VPLL_1V5

C539

0.47u

C521

2.2u

C532

1u C518

1u

VRF1_2V85

VRF3_2V85 S2_VBAT VSIM_2V9

C504

2.2u

C517

1u

C515

220n

C513

1u

S2_VBAT

100p

C542

0.1u

C512

VRF3_2V85 VRF3_2V85

VRF3_2V85

C538

0.1u

C508

10n

VRF2_1V5

VSD2_1V8

VSD1_1V5

C505

100n

C533

100n

C511

100n

Figure 3-7 S-GOLDradio PMU circuit diagram

VRTC_2V0

SGR_RPWRON_EN






3.3.3 Charging

SM-POWER provides together with an external p-channel FET Siliconix Si3455 an external AC-adapter a complete charge control function for charging of Li-Ion or Li-Ion-Polymer batteries. Either a 1-cell Li-Ion or

Li-Ion-Polymer battery with 4.1, 4.2 or 4.4 Volts may be used.

4.2V~3.75V 3.75V~3.65V 3.65V~3.58V 3.58V~3.30V

Figure 3-8 Battery Block Indication

1. Charging method : CC-CV

2. Charger detect voltage : 4.0 V

3. Charging time : 3h 15m

4. Charging current : 680 mA

5. CV voltage : 4.2 V

6. Cutoff current : 120 mA

7. Full charge indication current (icon stop current) : 120 mA

8. Recharge voltage : 4.16 V

9. Low battery alarm

a. Idle : 3.58 V ~ 3.3 V

b. Dedicated : 3.58 V ~ 3.3 V

10. Low battery alarm interval

a. Idle : 3 min

b. Dedicated : 1 min

11. Switch-off voltage : 3.3 V

12. Charging temperature adc range

a. ~ -5 ୅ : low charging voltage operation (3.6 V ~ 3.9 V) .

b. -5 ୅ ~ 50 ୅ : standard charging (up to 4.2 V) c. 50 ୅ ~ : low charging voltage operation (3.6V ~ 3.9V)


LG Electronics

- 45 -

45/143


LGE Property



3.4 Power ON/OFF

GX500 Power State : Defined 3cases as follow

ඖ Power-ON : Power key detect (SM-Power’s ON port)

ඖ Power-ON-charging : Charger detect.

Figure 3-9 Power on application.






Input ON is a power-on input for SM-POWER with 2 active high levels (see Figure 6). It might be triggered by a push button or by the RTCOUT output of the S-GOLD device as well. To detect if the push-button is pressed during system operation the logical level at pin ON or its change (if Bit 1 EION in INTCTRL2 is asserted) is recorded in bit LON of the ISF register. If the high level of voltage at pin ON does not reach VIHdet (Vbat-0.8 ~

Vbat-0.3) the above-mentioned bit won’t be set.

To support Remote power on function for factory mass production, applied an analog switch as following figure. As monitoring the RPWRON and Key matrix KP_OUT(2) & KP_IN (0), GX500 system recognize whether remote power on or End-key pushed

Remote Power On

2V11_RTC

RPWRON_EN

KEY_COL2

VA204

PWRON

RPWRON

Q201

KEY_ROW4

END_KEY

R209

10K

Figure 3-10 Remote power on and End-key power on circuit







3.5 Dual SIM & u-SD Interface

3.5.1 Dual SIM Interface

GX500 supports dual SIM mode and each SIM supports 1.8V & 2.9V plug in SIM, SIM interface scheme is shown in (Figure 8).

SIM_IO, SIM_CLK, SIM_RST ports are used to communicate with BBP(S-Gold3) and the SIM power supply enabled by PMIC.

SIM Interface

SIM_CLK : SIM card reference clock

SIM_RST : SIM card Async /sync reset

SIM_IO : SIM card bidirectional reset

DUAL SIM SOCKET

VSIM_2V9

2V9_SIM

SG3_SIM1_CLK

SGR_SIM2_CLK

SG3_SIM1_RST

SGR_SIM2_RST

S102

C4

RESERVED1

C11

C3

C10

C2

C9

C1

CLK2

CLK1

RST2

RST1

VCC2

VCC1

C8

RESERVED2

RESERVED3

C12

I/O_2

I/O_1

VPP2

VPP1

GND2

GND1

C15

C7

C14

C6

C13

C5

RESERVED4

C16

SG3_SIM1_IO

SGR_SIM2_IO

C112

22p

C105

22p

C110

0.1u

C109

1u

C111

22p

C106

22p

Figure 3-11 Dual SIM Interface


LG Electronics





The MicroSD Memory Module has eight exposed contacts on one side. The S-Gold3 is connected to the module using a dedicated eight-pin connector

The MicroSD Memory Module has eight exposed contacts on one side. The S-Gold3 is connected to the module using a dedicated eight-pin connector

Figure 3-12 Micro SD Memory Card Detection Scheme Figure 3-12 Micro SD Memory Card Detection Scheme

Pin No. Name Type

DAT2 I/O

Power Power supply

Ground Power ground

DAT0 I/O

DAT1 I/O







3.6 Memory

GX500 is composed of 3 memories. 2 MCPs(NAND+SDR) are connected each BBP(SG3 / SGR).

And 1 DPRAM is used to communicate between 2 MCPs.(SG3 and SGR).

2G NAND(LB/128Mx16bit) +1G SDR SDRAM(8Mx4x32bit)

EUSY0347505, Hynix

1V8_SD

0.1U

1V8_SD

C107 C104

0.1U

0.1U

0.1U

0.1U

S1_DATA[0]

S1_DATA[1]

S1_DATA[2]

S1_DATA[3]

S1_DATA[4]

S1_DATA[5]

S1_DATA[6]

S1_DATA[7]

S1_DATA[8]

S1_DATA[9]

S1_DATA[10]

S1_DATA[11]

S1_DATA[12]

S1_DATA[13]

S1_DATA[14]

S1_DATA[15]

R113 100K

_NAND_CS_S1

_RD_S1

_WR_S1

S1_ADD[17]

S1_ADD[16]

S1_FCDP

C116 C117 C113 C110 C120

0.1U

0.1U

TP106

TP109

C135

0.1U

C143 C138 C126 C125 C118 C133 C127 C102 C136 C103

0.1U

0.1U

0.1U

0.1U

0.1U

0.1U

0.1U

0.1U

0.1U

0.1U

TP111

J9

K10

L10

M9

N10

C10

D9

E10

F9

G10

J10

K9

L9

M10

N9

C9

D10

E9

F10

G9

B6

B3

B7

B4

C4

C3

C6

B9

C1

H9

J1

P9

M2

_CE

_RE

_WEN

CLE

ALE

_WP

R_B

B5

N5

VCCN0

VCCN1

C5

P6

VSSN0

VSSN1

B8

D1

H1

H10

P8

M1

VDD0

VDD1

VDD2

VDD3

VDD4

VDD5

VSS0

VSS1

VSS2

VSS3

VSS4

VSS5

IO8

IO9

IO10

IO11

IO12

IO13

IO14

IO15

IO0

IO1

IO2

IO3

IO4

IO5

IO6

IO7

N2

N3

M5

P7

M6

N6

M8

P2

P3

N4

P4

P5

N7

M7

N8

VDDQ0

VDDQ1

VDDQ2

VDDQ3

VDDQ4

VDDQ5

VDDQ6

VDDQ7

VDDQ8

VDDQ9

VSSQ0

VSSQ1

VSSQ2

VSSQ3

VSSQ4

VSSQ5

VSSQ6

VSSQ7

VSSQ8

VSSQ9

U102

H8ACS0SJ0BCR-46M

DNU0

DNU1

DNU2

DNU3

DNU4

DNU5

DNU6

K8

L8

K7

K5

K6

G7

J6

J5

H6

L4

L5

L6

L7

H5

J4

G3

G4

F4

E4

F5

H3

H4

E6

F7

F6

D5

E8

D6

D8

D7

C8

C7

DQ20

DQ21

DQ22

DQ23

DQ24

DQ25

DQ26

DQ27

DQ28

DQ11

DQ12

DQ13

DQ14

DQ15

DQ16

DQ17

DQ18

DQ19

DQ29

DQ30

DQ31

DQ0

DQ1

DQ2

DQ3

DQ4

DQ5

DQ6

DQ7

DQ8

DQ9

DQ10

_CS

CK

CKE

_WED

_RAS

_CAS

DQM0

DQM1

DQM2

DQM3

J2

G8

E3

K1

G2

H2

J8

G6

F8

E7

A2

A9

A10

R1

R2

R9

R10

A9

A10

A11

A12

BA0

BA1

A4

A5

A6

A7

A8

A0

A1

A2

A3

K4

L1

L2

L3

C2

D2

E1

D3

E2

D4

K3

F2

F1

J3

K2

TP104

R107 22

TP108

TP107

TP102

TP103

S1_ADD[16]

S1_ADD[17]

S1_ADD[18]

S1_ADD[19]

S1_ADD[20]

S1_ADD[21]

S1_ADD[22]

S1_ADD[23]

S1_ADD[24]

S1_ADD[25]

S1_ADD[26]

S1_ADD[27]

S1_ADD[28]

S1_ADD[29]

S1_ADD[30]

S1_DATA[0]

S1_DATA[1]

S1_DATA[2]

S1_DATA[3]

S1_DATA[4]

S1_DATA[5]

S1_DATA[6]

S1_DATA[7]

S1_DATA[8]

S1_DATA[9]

S1_DATA[10]

S1_DATA[11]

S1_DATA[12]

S1_DATA[13]

S1_DATA[14]

S1_DATA[15]

S1_ADD[0]

S1_ADD[1]

S1_ADD[2]

S1_ADD[3]

S1_ADD[4]

S1_ADD[5]

S1_ADD[6]

S1_ADD[7]

S1_ADD[8]

S1_ADD[9]

S1_ADD[10]

S1_ADD[11]

S1_ADD[12]

S1_ADD[13]

S1_ADD[14]

S1_ADD[15]

S1_CKE

_WR_S1

_RAS_S1

_CAS_S1

_BC0_S1

_BC1_S1

_BC2_S1

_BC3_S1

S1_SDCLKI

S1_SDCLKO

1V8_SD

_RAM_CS_S1

Figure 3-13 SGold3 Part Flash memory & SDR RAM MCP circuit diagram


LG Electronics




1G NAND(LB/64Mx16bit) +512M SDR SDRAM(8Mx4x16bit)

EUSY0389001, SS

M_RESET

S2_FCDP

_RAM_CS_S2

VSD2_1V8

VSD2_1V8

S2_SDCLKI

S2_SDCLKO

S2_CKE

_WR_S2

S2_ADD[13]

S2_ADD[14]

_RAS_S2

_CAS_S2

_BC0_S2

_BC1_S2

S2_DATA[0]

S2_DATA[1]

S2_DATA[2]

S2_DATA[3]

S2_DATA[4]

S2_DATA[5]

S2_DATA[6]

S2_DATA[7]

S2_DATA[8]

S2_DATA[9]

S2_DATA[10]

S2_DATA[11]

S2_DATA[12]

S2_DATA[13]

S2_DATA[14]

S2_DATA[15]

R524

VSD2_1V8

S2_ADD[0]

S2_ADD[1]

S2_ADD[2]

S2_ADD[3]

S2_ADD[4]

S2_ADD[5]

S2_ADD[6]

S2_ADD[7]

S2_ADD[8]

S2_ADD[9]

S2_ADD[10]

S2_ADD[11]

S2_ADD[12]

R526 100

_NAND_CS_S2

S2_ADD[16]

S2_ADD[17]

_RD_S2

_WR_S2

C544

15p

C543

15p

22

A4

A5

A6

A7

A8

A0

A1

A2

A3

A9

A10

A11

A12

L9

K9

J9

H7

H8

D9

H9

G7

C7

C8

C9

B8

M9

E9

H4

G8

F8

D7

D8

E7

F7

G3

H3

_CS

CLK

CKE

_WED

BA0

BA1

_RAS

_CAS

LDQM

UDQM

C6

D5

C5

E5

E6

D6

F5

_CE

ALE

CLE

_RE

R__B

_WE

_WP

DQ0

DQ1

DQ2

DQ3

DQ4

DQ5

DQ6

DQ7

DQ8

DQ9

DQ10

DQ11

DQ12

DQ13

DQ14

DQ15

E3

F4

J4

K3

K4

L3

L4

M3

M4

N3

B3

C4

C3

D4

D3

E4

U502

Figure 3-14 SGold Radio Part Flash memory & SDR RAM MCP circuit diagram

IO0

IO5

IO6

IO7

IO8

IO9

IO1

IO2

IO3

IO4

IO10

IO11

IO12

IO13

IO14

IO15

J8

L8

K5

M5

K6

M6

K7

M7

K8

M8

J5

L5

J6

L6

J7

L7

VDD1

VDD2

VDD3

VDD4

B4

G9

H2

M2

VDDQ1

VDDQ2

VDDQ3

D2

F2

K2

VSS1

VSS2

VSS3

VSS4

C2

F9

G2

N4

VSSQ1

VSSQ2

VSSQ3

E2

J2

L2

VCC1

VCC2

B6

N7

VCCQ

N6

VSS5

VSS6

VSS7

B5

N5

N8

C547

470n

S2_DATA[0]

S2_DATA[1]

S2_DATA[2]

S2_DATA[3]

S2_DATA[4]

S2_DATA[5]

S2_DATA[6]

S2_DATA[7]

S2_DATA[8]

S2_DATA[9]

S2_DATA[10]

S2_DATA[11]

S2_DATA[12]

S2_DATA[13]

S2_DATA[14]

S2_DATA[15]

VSD2_1V8

VSD2_1V8

C545

470n

VSD2_1V8

C546

220n







128K DUAL PORT STATIC RAM

EUSY0285602, CYPRESS

S1_DATA[0]

S1_DATA[1]

S1_DATA[2]

S1_DATA[3]

S1_DATA[4]

S1_DATA[5]

S1_DATA[6]

S1_DATA[7]

S1_DATA[8]

S1_DATA[9]

S1_DATA[10]

S1_DATA[11]

S1_DATA[12]

S1_DATA[13]

S1_DATA[14]

S1_DATA[15]

S1_ADD[0]

S1_ADD[1]

S1_ADD[2]

S1_ADD[3]

S1_ADD[4]

S1_ADD[5]

S1_ADD[6]

S1_ADD[7]

S1_ADD[8]

S1_ADD[9]

S1_ADD[10]

S1_ADD[11]

S1_ADD[12]

_WR_S1

_BC1_S1

_BC0_S1

_DPRAM_CS_S1

_RD_S1

_DPRAM_BUSY_S1

1V8_SD

_DPRAM_SEM_S1

_DPRAM_INT_S1

R704

R709

R711

47K

47K

47K

K10

J9

J10

H10

G7

G8

G10

G9

F9

H1

F4

G2

J1

H2

G3

K1

K7

H6

K8

G6

J7

K9

J8

TP701

J2

K2

H3

J3

K3

G4

K6

K4

H4

H5

G5

F3

K5

E4

G1

F2

D2

E3

D1

A5

A10

C10

E1

E5

E6

E10

F6

J6

VSS4

VSS5

VSS6

VSS7

VSS8

VSS9

0DR1

0DR2

0DR3

0DR4

VSS1

VSS2

VSS3

_UBL

_LBL

_CEL

_OEL

_BUSYL

_SEML

_INTL

0DR0

A6L

A7L

A8L

A9L

A10L

A11L

A12L

R__WL

A2L

A3L

A4L

A5L

IO14L

IO15L

A0L

A1L

IO6L

IO7L

IO8L

IO9L

IO10L

IO11L

IO12L

IO13L

IO0L

IO1L

IO2L

IO3L

IO4L

IO5L

U702

CYDM128B16-55BVXI

C9

D8

B9

A9

C8

A8

D7

C7

A7

C1

C2

C3

B1

B2

A1

C4

F8

E9

D10

F7

E7

D9

B10

B3

A2

B4

D5

A3

D6

B6

A4

C5

B5

B7

D3

A6

D4

J4

C6

H8

H9

F1

E2

F5

J5

H7

F10

B8

E8

A10R

A11R

A12R

R__WR

A6R

A7R

A8R

A9R

IO14R

IO15R

A0R

A1R

A2R

A3R

A4R

A5R

IO6R

IO7R

IO8R

IO9R

IO10R

IO11R

IO12R

IO13R

IO0R

IO1R

IO2R

IO3R

IO4R

IO5R

_UBR

_LBR

_CER

_OER

_BUSYR

_SEMR

_INTR

IRR0

IRR1

NC1

NC2

_SFEN

M__S

VCC1

VCC2

VDDIOL1

VDDIOL2

VDDIOR1

VDDIOR2

TP702

R706

R707

R705

S2_DATA[0]

S2_DATA[1]

S2_DATA[2]

S2_DATA[3]

S2_DATA[4]

S2_DATA[5]

S2_DATA[6]

S2_DATA[7]

S2_DATA[8]

S2_DATA[9]

S2_DATA[10]

S2_DATA[11]

S2_DATA[12]

S2_DATA[13]

S2_DATA[14]

S2_DATA[15]

S2_ADD[0]

S2_ADD[1]

S2_ADD[2]

S2_ADD[3]

S2_ADD[4]

S2_ADD[5]

S2_ADD[6]

S2_ADD[7]

S2_ADD[8]

S2_ADD[9]

S2_ADD[10]

S2_ADD[11]

S2_ADD[12]

_WR_S2

_BC1_S2

_BC0_S2

_DPRAM_CS_S2

_RD_S2

_DPRAM_BUSY_S2

_DPRAM_INT_S2

VSD2_1V8

47K

47K

47K

R708

R703

47K

47K

1V8_SD

VSD2_1V8

Figure 3-15 DPRAM for communication Between SGold3 and SGold Radio





3.7 LCD Display

LCD module include:

- Main LCD: 3.0” 240x400 WQVGA, 262K color TFT

- Backlight : 6 piece of white LED

LCD FPC Interface Spec:

Table 3-13. LCD FPC Interface Spec.







The keypad interface is a peripheral which can be used for scanning keypads up to 3 rows (outputs from Port

Control Logic) and 2columns (inputs to PCL). The number of rows and columns depend on settings of the PCL.

3.8 Keypad Switching & Scanning

The keypad interface is a peripheral which can be used for scanning keypads up to 3 rows (outputs from Port

Control Logic) and 2columns (inputs to PCL). The number of rows and columns depend on settings of the PCL.

VOLUME SIDEKEY

SEND MENU

CN801

1

2

3

SIDEKEY_3P_Contact

VA802 VA801 VA803

KEY_COL0

KEY_ROW0

KEY_COL1

KEY_ROW1

KEY_COL0

KEY_COL1

SEND MENU

KEY_COL0

KEY_COL1

END

VBAT

END

END_KEY

END_KEY

CAMERA KEY LOCK KEY

4

3

2

1

CN803

VA805 VA806 VA807

Figure 3-16 Key pad part key matrix

Figure 3-16 Key pad part key matrix

KEY_ROW1

KEY_COL2

KEY_COL3







3.9 LCD back-light illumination

The SC654 is a high efficiency charge pump LED driver using Analogic-tech’s proprietary charge pump technology. Performance is optimized for use in single-cell Li-ion battery applications.

LCD BACKLIGHT LED DRIVER

MLED

VA203

VBAT

C255

1u

EVLC18S02015

C253

1u

LCD_PWM

VA205

C254 1u

1uC252

1

18

4

17

2

3

6

7

U205

OUTCP1

OUTCP2

AAT3369IDT-1-T1

EP

19

5

C1-

C1+

C2-

C2+

IN

NC

D6

D5

D4

D3

D2

D1

15

14

13

12

11

10

GND EN_SET

16

8

PWM FCAP

9

C256

47n

R224

10K

MLED6

MLED5

MLED4

MLED3

MLED2

MLED1

LCD_BL_CTRL

Figure 3-17 LCD Back light unit and Flash LED charge pump IC

The LED current magnitude is controlled by the EN/SET pin using the S2Cwire interface. The interface records rising edges of the EN/SET pin and decodes them into 32 individual current level settings. Code 1 is full scale

(31mA), and Code 32 is 0.5mA. The modulo 32 interface wraps states back to state 1 after the 32nd clock. The counter can be clocked at speeds up to 1MHz, so intermediate states are not visible. The first rising edge of

EN/SET enables the IC and initially sets the output LED current to full scale, the lowest setting equal to 0.5mA.

Once the final clock cycle is input for the desired brightness level, the EN/SET pin should be held high to maintain the device output current at the programmed level.

Figure 3-18 control method







3.10 JTAG & ETM interface connector

Figure 3-19 JTAG & ETM(Embedded Trace Module) interface connector

In case of GX500 mass production, the JTAG & ETM interface connector will not be mount on board. That is only for developing and software debugging purpose.( It will not be mounted on mass production PCB)


LG Electronics






3.11 Audio

GX500 Audio signal flow diagram as following diagram.

Figure 3-20 Audio signal flow diagram







3.11.1 Audio amplifier

The LM49151 is a fully integrated audio subsystem designed for portable handheld applications such as cellular phones.

The LM49151 combines a 1.25W mono E2S class D amplifier, 125mW Class AB earpiece driver, 42mW/channel stereo ground referenced headphone drivers, volume control, input mixer/multiplexer, and speaker protection into a single device..

AUDIO AMP SUB SYSTEM

VBAT

FB701

RCV_P

RCV_N

AMP_IN_L

AMP_IN_R

I2C1_SDA

I2C1_SCL

2V62_VIO

C701

10u

C712

0.1u

C705

C706

1u

1u

C703

C707

220n

220n

C708

0.1uF

C713

2.2u

E1

INM+

D1

INM-

C1

INL

C2

INR

C3

BYPASS

A1

B2

B3

I2CVDD

SDA

SCL

U701

LM49151TL

LSOUT+

A4

LSOUT-

A3

SET

D2

HPL

E3

HPR

E2

0.1uF

C702

C704

2.2uF

C709

2.2uF

Figure 3-21 Audio amplifier

3.11.2. Microphone circuit

MAIN MIC

1V8_MIC_BIAS

C711

27pF

C710

27pF

SPK_P

SPK_N

HSO_L

HSO_R

MAIN_MIC_N

MAIN_MIC_P

C316

47p

C307

47p

L303

100NH

C311

47P

VA301

C318

2.2u

VA302

MIC301

1

2

3

4

P

G1

G2

O

SPU0410HR5H-PB

Figure 3-22 Microphone circuit






3.12 Charging circuit

The bq25040 has a single power output that charges the battery. A system load can be placed in parallel with the battery. The charge current is programmed using the ISET and EN/SET inputs. The input current limit is programmable to USB100, USB500 or a user programmed current limit up to 1.1A. Additionally, a 4.9V ±3%

50mA LDO is integrated into the IC for supplying low power external circuitry. The single-input interface

(EN/SET) is used to select the charge current and to place the bq25040 into Production Test Mode. In

Production Test Mode, the bq25040 operates as a linear regulator without a battery connected, where the output is regulated at 4.2V and supplies up to 2.3A to calibrate GSM transceivers.

SINGLE CHARGING IC

V_BUS VBAT 2V62_VIO 2V62_VIO 2V62_VIO

RPWRON_EN

C338

1uF

C337

1uF

Figure 3-23 Charging circuit

820 ohm->(646mA)

2K(10%)->91mA

3

4

5

1

2

IN

ISET

VSS1

LDO

IFULL

PGND

BAT

_PG

CHG

VSS2

EN_SET

8

7

6

11

10

9

C336

1uF

_PPR

_EOC

_CHG_EN







8*'*#-6&5005)'.SBEJP

(FOFSBM%FTDSJQUJPO

5IF(9EFWJDFQSPWJEFTUIFIJHIFTUMFWFMPGJOUFHSBUJPOGPSBNPCJMFXJSFMFTTTZTUFNXJUI

JOUFHSBUFE*&&&CH ."$CBTFCBOESBEJP#MVFUPPUIBOE'.SFWFJWFS5IF8:4%/#(9UIBUJT

JODMVEFEPG#$.TPMVUJPOJTTVQQPSUFEUISFFLJOETPGGVODUJPOT*UJTUIFPOFBOUFOOBTUSVDUVSFXIJDIJT

TVQQPSUFEPG8-"/#MVFUPPUIJO()[BOE

'JHVSF8-"/#MVFUPPUI'.3BEJP4ZTUFN"SDIJUFDUVSF


LG Electronics






3.13.1 WLAN

The GX500 supports single-band 2.4GHz IEEE802.11b/g standardization. The WLAN module which is consisted of the BCM4325 single chip device provides for the highest level of integration for a mobile or handheld wireless system, with integrated IEEE802.11TM b/g (MAC/baseband/radio). The BCM4325’s integrated CMOS WLAN 2.4GHz power amplifier provide sufficient output power to meet the need of most WLAN devices. The interface between PMB8877 and WLAN module is the standard interfaces SDIO v1.2 (4-bit and 1-bit).

3.13.2 Bluetooth

The GX500 provides the Bluetooth 2.0 specification. The Bluetooth module is the optimal solution for any voice or data application that requires the Bluetooth SIG standard Host Controller Interface (HCI) using a high-speed UART and PCM. The Bluetooth solution has an integrated radio transceiver that has been optimized for 2.4GHz Bluetooth wireless systems. It has been designed to provided low power,low-cost, robust communications for applications operating in the globally available 2.4GHz unlicensed ISM band. It is fully compliant with the Bluetooth Radio Specification and meets or exceeds the requirements to provide the highest communication link quality of service

3.13.3 FM Radio

This FM is a function of WYSDNBGX6 module, electronically tuned, FM stereo radio with RDS/RBDS demodulator and decoder for low voltage applications, with fully integrated IF selectivity and demodulation. This equipment supports the European Radio Data System (RDS) and the North

American Radio Broadcast Data System (RBDS) modulations. The FM unit supports I2C for communications, stereo analog output, as well as I2S and PCM interfaces.







WLAN+BT+FM

TP699

TP698

TP697

TP696

C608

0

CN601

1

CN602

1

C607

DNI

L602 1.5n

C606

1p close to 3

C688

10uF

C687

0.1u

FB602

R699

0

C699

2.2uF

WLAN_CMD

WLAN_CLK

WLAN_SDIO[3]

WLAN_SDIO[2]

WLAN_SDIO[1]

WLAN_SDIO[0]

WLAN_ENABLE

WLAN_WAKEUP

REG_ON

C698

0.1u

C619

4.7uF

3.3UH

L607

4.7u

L699

1

ANT

2

3

GND5

VDD_WL_PA

6

7

8

9

4

5

SDIO_CMD

SDIO_CLK

SDIO_DATA_3

SDIO_DATA_2

SDIO_DATA_1

SDIO_DATA_0

10

11

12

13

WL_RST_N

WL_WAKE_B

REG_ON

VBAT_IN

14

15

SR_VLX1

SR_VLX1BB

U601

BT_PCM_CLK

BT_PCM_OUT

BT_PCM_SYNC

BT_PCM_IN

45

44

43

42

VDD_BT_PA

41

32KHZ

GND7

FM_ANT

40

39

38

BT_WAKE_B

BT_HOST_WAKE

BT_GPIO_3

BT_GPIO_4

BT_GPIO_7

XTALP

XTALN

32

31

37

36

35

34

33

TP695

TP694

TP601

CLK32K

FM_ANT

BT_WAKEUP

BT_HOST_WAKEUP

BT_PCM_CLK

BT_PCM_RX

BT_PCM_SYNC

BT_PCM_TX FB601

C689

1uF

TP693

CLK_IN close to 17

C697

10uF C696

0.1u

C695

0.1u

C694

4.7uF

C693

2.2uF

C692

0.1u

C691

1uF

TP692

BT_ENABLE

FM_R

FM_L

VBAT

LDO for TCXO

2V7_VTOUCH VDD_TCXO

TOUCH_EN

U604

1

2

3

4

VIN

EN1

P2

P1

VOUT1

VOUT2

GND

EN2

8

7

6

5

BT_CLK_REQ

C643

1u

R607

100K

C646

1u

C647

1u

Figure 3-25. WI-FI / Bluetooth / FM Radio Circuit Diagram

CLK_IN

26MHz TCXO

VDD_TCXO

4

VCC

26MHZ

GND

2

C644

1uF

3

OUT NC

TG-5010LH-87N X601

1






3.14 5pin Micro USB Interface connector

1

2

3

4

5

Table 3-14. Multi media interface pin assign

GX500 MMI

Pin Function

V_BUS

USB_DM

USB_DP

ID

GND

5PIN uUSB

V_BUS

Description

USB V_BUS

USB_DM

USB_DP

Detect ID PIN

GND

USW_DM

USW_DP

USW_ID

C333

22pF

Figure 3-26 5Pin u-USB Connector circuit

3

4

5

1

2

CN301

6

8

10

12

14

7

9

11

13

15

L306

100n

1005 coil

C334

10pF

FM_ANT







3.15 Triaxial, digital acceleration sensor

General description

The BMA020 is a tri-axial, low-g acceleration sensor IC with digital output for consumer market applications. It allows measurements of acceleration in perpendicular axes as well as absolute temperature measurement.

An evaluation circuitry converts the output of a three-channel micromechanical acceleration sensing structure that works according to the differential capacitance principle.

Package and interface have been defined to match a multitude of hardware requirements. Since the sensor IC has small footprint and flat package it is attractive for mobile applications. The sensor IC can be programmed to optimize functionality, performance and power consumption in customer specific applications.

The BMA150 senses tilt, motion and shock vibration in cell phones, handhelds, computer peripherals, man-machine interfaces, virtual reality features and game controllers.

The BMA150 is the LGA package version of the SMB380 triaxial acceleration sensor which is available in a

3mm x 3mm x 0.9mm QFN package.

Axes orientation of the BMA150

Figure 3-27 Axes orientation of the BMA150

ACCEL SENSOR

2V85_VFM

ACCEL_INT

TP205

U203

1

NC1

2

VDD

3

GND

4

INT

5

CSB

C248

22n

Figure 3- 28 Accel sensor circuit

BMA020

NC2

10

VDDIO

9

SDI

8

SDO

7

SCK

6

2V62_VIO

C249

0.1u

I2C2_SDA

I2C2_SCL






III-2. RF circuit

*RF Block Diagram

Mobile Switch

ANT

FEM

Figure 3-29 GX500 RF part Block Diagram

PAM(TQM7M5005H)







3.16 General Description

The RF transceiver (PMB 6272 SMARTi-PM) is an integrated single chip, quad-band transceiver for

GSM850/GSM900/GSM1800/GSM1900 designed for voice and data transfer applications. The transceiver provides an analog I/Q baseband interface and consists of a direct conversion receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA functionality. Further on a completely integrated

SD-synthesizer with HSCSD and GPRS/EDGE capability, a digitally controlled reference oscillator with three outputs, a fully integrated quad-band RF oscillator and a three wire bus interface with all necessary control circuits complete the transceiver.

Figure 3-30 RF transceiver PMB6272 SMARTi-PM functional block diagram





GSM850 GSM900 DCS1800 PCS1900


0.1U

4.7N

C408

2.2P

LBAND_PAM_IN

HBAND_PAM_IN

FE1

FE2

C432

0.22U

R405

10

33

34

35

36

37

38

39

40

FE2

VBIAS

VDDTX1V5

TX1

TX2

VDDTX2V8

VDDMIX2V8

GND3

41

GND4

R401

10

C413

220N

C438

0.1U

C430

0.1U

VDDRX2V8

VDDRX1V5

VCO_RC

VDDVCO2V8

EN

VDDXO2V8

FSYS1

GND1

20

19

18

17

16

15

14

13

R402

820

X401

4

1

3

2

26MHz

DSX321SG-26M

C416

0.1U

C411

0.1U

C442

0.1U

TP401

TP402

I

Q

IX

RF_CLK

RF_DA

QX

Figure 3-31 RF PAM TQM7M5005H schematic







3.17 Receiver part

Figure 3-32 Receiver part block diagram

The constant gain direct conversion receiver contains all active circuits for a complete receiver chain for

GSM/GPRS/EDGE (see Figure 39). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band. Down conversion to baseband domain is performed by low/high band quadrature direct down conversion mixers. The baseband chain contains a LNB (low noise buffer), channel filter, output buffer and DC-offset compensation. The 3rd order low pass filter is fully integrated and provides sufficient suppression of blocking signals as well as adjacent channel interferers and avoids anti-aliasing through the baseband ADC. The receive path is fully differential to suppress on-chip interferences. Several gain steps are implemented to cope with the dynamic range of the input signals. Depending on the baseband ADC dynamic range, single- or multiple gain step switching schemes are applicable. Furthermore an automatic DC-offset compensation can be used (depending on the gain setting) to reduce the DC-offset at baseband-output. A programmable gain correction can be applied to correct for front end- and receiver gain tolerances.






3.18 Transmitter part

The GMSK transmitter supports power class 4 for GSM850 and GSM900 as well as power class 1 for DCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-N Sigma-Delta synthesizer without any external components (see Figure39). The analog I/Q modulation data from the baseband is converted to digital, filtered and transformed to polar coordinates. The phase/frequency signal is further on processed by the Sigma-Delta modulation loop. The output of its associated VCO is divided by four or two, respectively, and connected via an output buffer to the appropriate single ended output pin. This configuration ensures minimum noise level. The 8PSK transmitter supports power class E2 for GSM850 and

GSM900 as well as for DCS1800 and PCS1900. The digital transmitter architecture is based on a polar modulation architecture, where the analog modulation data (rectangular I/Q coordinates) is converted to digital data stream and is subsequently transformed to polar coordinates by means of a CORDIC algorithm.

The resulting amplitude information is fed into a digital multiplier for power ramping and level control. The ready processed amplitude signal is applied to a DAC followed by a low pass filter which reconstructs the analog amplitude information. The phase signal from the CORDIC is applied to the Sigma-Delta fractional-N modulation loop. The divided output of its associated VCO is fed to a highly linear amplitude modulator, recombining amplitude and phase information. The output of the amplitude modulator is connected to a single ended output RF PGA for digitally setting the wanted transmit power. The PA interface of SMARTi-PM supports direct control of standard dual mode power amplifiers (PA’s) which usually have a power control input VAPC and an optional bias

Figure 3-33 Transmitter part block diagram control pin VBIAS for efficiency enhancement. In GMSK mode, the PA is in saturated high efficiency mode and is controlled via its VAPC pin directly by the baseband ramping DAC. In this way both up- / down-ramping and output power level are set. In 8PSK mode, the ramping functionality is assured by an on-chip ramping generator, whereas output power is controlled by the PGA’s as described above.







3.19 RF synthesizer

The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as Sigma-Delta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided by the internal crystal oscillator. This frequency serves as comparison frequency of the phase detector and as clock frequency for all digital circuitry.The divider in the feedback path of the synthesizer is carried out as a multi-modulus divider (MMD). The loop filter is fully integrated and the loop bandwidth is about 100 kHz to allow the transfer of the phase modulation. The loop bandwidth is automatically adjusted prior to each slot

(OLGA2). To overcome the statistical spread of the loop filter element values an automatic loop filter adjustment (ALFA) is performed before each synthesizer startup. The fully integrated quad-band VCO is designed for the four GSM bands (850, 900, 1800, 1900 MHz) and operates at double or four times transmit or receive frequency. To cover the wide frequency range the VCO is automatically aligned by a binary automatic band selection (BABS) before each synthesizer startup.

3.20 DCXO

The SMARTiPM contains a fully integrated 26MHz digitally controlled crystal oscillator (DCXO) with three outputs for the system clock, one output for the GSM baseband and two additional for other subsystems (GPS,

Bluetooth, etc.).The only external part of the oscillator is the crystal itself. The frequency tuning is performed along the selected subrange by programming the frequency control word (XO_TUNE) via the three wire bus

(“3Wbus”)

GND1

14

13

SF OX

X401

4

1

3

2

26MHz

DSX321SG-26M

Figure 3-34 DCXO Schematic






3.21 Front End Module control

Implemented in the S-Gold3 (FL600) are two outputs which are FE1, FE2 for direct control of front end modules with two logic input pins to select RX and TX mode as well as low and high band operation. FEM need 2V85_VRF supply.

Table 3-15 FEM Control Logic

MODE

VDD

VC1

VC2

Tx 1GHz

ON

OFF

ON

Tx 2GHz

ON

ON

ON

Rx 1GHz

ON

OFF

OFF

Rx 2GHz

ON

ON

OFF

FE1

FE2

100P

C439

100P

C424

GND402

ANT401

C405

2.2n

C440

1p

L403 20p

C436

18n

1

SW401

ANT

G3

43

COMMON

G4

2

100NH

L407

C418

100P 17

ANT

C428

0.5p

L404

4.7p

C433

8.2n

Figure 3-35 FEM schematic








3.22 Power Amplifier Module

The TQM7M5005H Power Amplifier Module(PAM) is designed in a compact from fact for quad-band cellular handsets comprising GSM850/900,DCS1800,PCS1900,supporting GMSK and linear EDGE modulation. Class12

General Packet Radio Service(GPRS) multi-slot operation is also supported.

The module consists of a GSM850/900 PA block and a DCS1800/PCS1900 PA block,impedance matching circuitry for 50ohm input and output impedances, and a Multi-function Power Amplifier Control(MFC) block.

A custom CMOS integrated circuit provides the internal MFC function and interface circuitry.

Two separate Heterojunction Bipolar Transistor(HBT) PA blocks are fabricated onto InGaP die; one supports the GSM850/900 bands, the other supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to distribute current. The InGaP die, the silicon die, nad the passive components are mounted on a multi layer laminate substrate. The assembly is encapsulated with plastic overmold.

RF input and output ports are internally matched to 50ohm to reduce the number of external components

Extremely low leakage current(2.5uA) maximizes handset standby time. Band select(BS) circuitry select GSM transmit frequency band(logic0) and DCS/PCS transmit frequency(logic1). MODE circuitry selects GMSK modulation (logic0) or EDGE modulation(logic1). VRAMP controls the output power for GMSK modulation and provides bias optimization for EDGE modulation depending on the state of MODE control.

The integrated multi-function(MFC) provides envelope amplitude control in GMSK mode, reducing sensitivity to input drive, temp, power supply, and process variation. In EDGE mode, the MFC configures the PA for fixed gain, and provides the ability to optimize the PA bias operation at different power levels, This circuitry regulates PA bias conditions, reducing sensitivity to temp., power supply, and process variation. The Enable input signal(pin8) provides a standby state to minimize battery drain..

.

Table 3-16 PAM pin description






3.23 PAM Schematic

L404

4.7p

C428

0.5p

L406

3.9p

C433

8.2n

C410

12n

Figure 3-36 PAM schematic

C417

22n

C425

0.01U

C422

0.01U

12

DCS_PCS_OUT

10

GSM850_900_OUT

13

BY_CAP1

14

11

8

9

BY_CAP2

GND1

GND2

GND3

U402

TQM7M5005H

DCS_PCS_IN

1

MODE_SELECT

2

BS

3

VBATT

4

VRAMP

5

TX_EN

6

15

PGND GSM850_900_IN

7

OK

R403

10K

R407

100P

R404

100P

HBAND_PAM_IN

PA_MODE

S1_PA_BAND

PA_LEVEL

TXON_PA

LBAND_PAM_IN

C414

1u

OK

C437

33u

C434

27P

C441

100P

C415

100P

C420

47P

C429

100P





4.1 Trouble shooting test setup

Equipment setup

Power on all of test equipment

-Connect PIF-UNION JIG or dummy battery to the DUT for power up.

-Connect mobile switch cable between Communication test set and DUT when you need to make a phone call.

-Follow trouble shooting procedure




4. TROUBLE SHOOTING


4.2 Power on Trouble

Check Points

-Battery Voltage( Need to over 3.35V)

-Power-On Key detection (PWRON signal)

-Outputs of LDOs from PMIC

TP1

Remote Power On

RPWRON_EN

KEY_COL2

VA204

RPWRON

KEY_ROW4

2V11_RTC

Q201

TP1

PWRON

END_KEY

R209

10K

Figure 4-1. Remote Power On Circuit

VUSB

VBAT

VBAT

C237

2.2u

C212

1u

C214

0.1u

PMIC

1V35_VPLL

VBAT

2V62_VIO

VBAT

2V62_VIO

C217

2.2u

VBAT

SG3_RPWRON_EN

1V8_SD 2V5_VAUDB

2V5_VAUDA 2V85_VFM

USB_OEN

USB_DAT_VP

USB_SE0_VM

VBAT TXON_PA

VBAT

C204 C208 C213

10u 10u 22u

C230

2.2u

C209

2.2u

C245

2.2u

C240

0.1u

C243

1u

SIM1_USB_DP

SIM1_USB_DM

PMRSTN

220

VCXO_EN

SIM1_BT_VCXO_EN

C241

10u

C247

2.2u

C224

0.1u

TP203

B1

C2

D3

C1

D2

D-

RCV

VPIN

VMIN

D+

E3

D1

E2

E1

RESET_N

RESET2_N

SLEEP1_N

SLEEP2_N

F2

F1

VAUDIOA

VDDAUDIOA

G2

G1

VDDAUDIOB

VAUDIOB

H2

H1

VAUX

VDDAUX

J1

J2

H3

SU1_GATE

SU1_GND

SU1_FB

J3

SU1_ISENSE

K1

K2

L2

VDDSD2

SD2_FB

SD2_FBL

C216

2.2u

Figure 4-2. PMIC Circuit

U201

TP202

RTC_OUT

R216

27K

ON_OFF2

0.1u

C205

L202

10u

VMME

VDDMME

C11

C10

VDDRF2

VRF2

D10

D11

VRF3

VDDRF13_AFC

E10

E11

VRF1

VVIB

VDDSIMVIB

F10

F11

G11

VSIM

G10

VAFC

H11

H10

VRTC

VDDUMTS

VUMTS

H9

J11

VDDSD1

SD1_FB

SD1_FBL

K11

J10

L10

FB202

C226

10u

C244

1u

2V8_VVIB

1V35_CORE

VBAT 1V5_VBT

2V7_VRF

2V11_RTC

2V85_VRF

2V9_SIM

1V5_VRF

2V65_VBT

2V9_VMME

1V8_SD

C236

1u

C234

1u

C227 C228

1u 2.2u

C242

2.2u

C210

2.2u

C203

2.2u

C229

2.2u

C232

2.2u

C233

2.2u







VRF2

VRF3

VPLL

VRTC

VAFC

VVIB

Table 4-1. PMIC GPIO PIN MAP

LDO Net name

Output

Voltage

SD1

SD2

VAUX

VIO

VSIM

VMME

1V35_Core

1V8_SD

2V85_VFM

VUMTS

VUSB

VLED

2V62_VIO

2V9_SIM

2V8_VMME

1V5_VBT

VUSB

VLED

VAUDIOa 2V5_VAUDA

VAUDIOb 2V5_VAUDB

1.35V

1.8V

2.9V

2.62V

2.9V

2.9V

2.85V

3.1V

2.9V

2.5V

2.5V

VRF1 2V85_VRF 2.85V

1V5_VRF

2V65_VBT

1V35_VPLL

2V11_RTC

VAFC

2V8_VVIB

1,53V

2.7V

1.35V

2.11V

2.65V

2.8V

Output

Current

600mA

300mA

100mA

100mA

70mA

150mA

110mA

40mA

10mA

200mA

50mA

150mA

100mA

150mA

30mA

4mA

5mA

140mA

Usage

Core & for LDO

Memory

LCD

Peripherals

SIM card u-SD

Not used

Not used

Not used

Stereo headset, Mono earpiece

Analog parts of S-Gold


RF transceiver


RF transceiver

Bluetooth

S-GOLD3 PLL

Real Time Clock

Not used

Vibrator







Checking Flow

Checking Flow

START

START

Connect power

supply to the DUT

Connect power

supply to the DUT

TP1

TP1

Q201

“PWRON” signal

Check 3 pin of U203

“PWRON” signal

Check 3 pin of U203

Yes

No

No

Check the RPWRON, replace Q201

Check the RPWRON, replace Q201

Q201

Figure 4-3. RPWRON

Figure 4-3. RPWRON

Check the all LDO’s output

Is it correct?

output

No

No

Check solder

U201 or replace it

Check solder

U201 or replace it

U201

U201

Is the 26MHz

clock From X401 signal correct?

clock From X401 signal correct?

Yes

No

No

Check solder X401

or replace it

Check 3 pin of X401

Or Check 11 pin of U401

Check 3 pin of X401

Or Check 11 pin of U401

Replace main PCB

Figure 4-5. X-TAL & Transceiver

U401

X401

U401

14pin of U401

1pin of X401

1pin of X401


LG Electronics





4.3 Charging trouble

Check Points

-Connection of TA (check TA voltage 4.8V)

-Charging Current Path component voltage drop

-Battery voltage

1 Charging method : CC-CV

2 Charger detect voltage : 4.8 V

3 Charging time : 3h 15m

4 Charging current : 680 mA

5 CV voltage : 4.2 V

6 Cutoff current : 120 mA

7 Full charge indication current (icon stop current) : 120 mA

8 Recharge voltage : 4.16 V

4.2V~3.75V 3.75V~3.65V 3.65V~3.58V 3.58V~3.30V

RPWRON_EN

Figure 4-6. Charging circuit

V_BUS

TP1

C338

1uF

C337

1uF

560 ohm->(910mA)

780 ohm->(680mA)

820 ohm->(646mA)

2K(10%)->91mA

1

2

3

4

5

IN

ISET

VSS1

LDO

IFULL

TP2

PGND

BAT

_PG

CHG

VSS2

EN_SET

9

8

7

6

11

10

TP2

VBAT 2V62_VIO 2V62_VIO 2V62_VIO

_PPR

_EOC

_CHG_EN

C336

1uF





18pin IO(CN401)

Is soldered ?

No No

Source pin

of U401 = 4.8V ?

No No

The TA can be broken

Change other TA

then retest

Output pin

of U310 =4.2V?

No No

Check solder

U310 or replace it

Battery voltage is over 3.4V?

No No

Waiting until battery

Voltage goes up to

3.4V

Battery thermistor value

is about 10K?

No No Change the Battery retest

U310

TP1: Source pin

U310

TP2: Output pin

LG Electronics





4.4 LCD display trouble

Check Points

-LCD assembly status ( LCD FPCB, Connector on FPCB)

-EMI filter soldering

-Connector combination

LCD CONNECTOR

DIF_D0

DIF_D1

DIF_D2

DIF_D3

EVRC14S03Q030100R

9

8

7

6

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

FL803

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

3

4

1

2

DIF_D4

DIF_D5

DIF_D6

DIF_D7

2

1

4

3

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

FL805

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

6

7

8

9

EVRC14S03Q030100R

Figure 4-9. LCD Connector circuit

2V85_VFM

C817

1U

36

35

34

33

32

31

30

29

28

40

39

38

37

27

26

25

24

23

22

21

CN804

5

6

7

8

9

10

11

12

13

1

2

3

4

14

15

16

17

18

19

20

R817 DNI

LCD_PWM

LCD_ID

MLED

MLED1

MLED2

MLED3

MLED4

MLED5

MLED6

IF_MODE1

DIF_RESET

DIF_VSYNC

TP801

IF_MODE0

VA804

EVLC14S02050

ENBY0036001

GB042-40S-H10-E3000

Check signal flow via EMI filter

EVRC14S03Q030100R

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

9

8

7

6

FL804

DIF_CD

DIF_CS

DIF_RD

DIF_WR

Check the connection LCD FPCB Connector

Figure 4-10. LCD FPCB Connector

Charge Pump

Figure 4-11. Charge Pump






Checking Flow

START

Check LCD connector

combination then LCD test

with New LCD

No

Is LCD normal?

Yes

Signal is normal on

DIF Signal

FL803, FL804, FL805

Assemble

Yes

Replace LCD

No

Check solder and repair

Damaged filter

FL803, FL804, FL805

Figure 4-11. EMI Filter







4.5 Camera Trouble

Check Points

-Connectors combination

-FPCB status

Figure 4-12. Camera

CIF_D0

CIF_D1

CIF_D2

CIF_D3

CIF_D4

CIF_D5

CIF_D6

CIF_D7

22

23

24

1

2

3

4

5

D0

D1

D2

D3

D4

D5

D6

D7

S101

PCLK

VSYNC

HSYNC

STANDBY

SCK

SDA

RESETB

MCLK

20

19

18

12

9

7

11

10

CIF_PCLK

CIF_VSYNC

CIF_HSYNC

CIF_PD

I2C2_SCL

I2C2_SDA

CIF_RESET

CIF_MCLK

1V8_CAM

2V8_CAM

Figure 4-13. SUB FPCB Assy

Check the Socket combination






Checking Flow

START

Check camera socket,

34pin combination then Camera test with equipped camera module

Yes

Replace New Camera module

Working properly?

No

Replace

SUB PCB

Yes

Replace Camera module

Yes

Assemble








4.6 Receiver & Speaker trouble



-Speaker contact

Check Points

-Speaker contact

-Audio amp soldering

-Audio amp soldering


VBAT

FB701

2V62_VIO

C701

10u

C712

0.1u

RCV_P

RCV_N

C705

C706

1u

1u

AMP_IN_L

AMP_IN_R

I2C1_SDA

I2C1_SCL

Figure 4-14. Audio Amp Circuit



SPK

C703

C707

220n

220n

C708

0.1uF

C713

2.2u

E1

INM+

D1

INM-

C1

INL

C2

INR

C3

BYPASS

A1

B2

B3

I2CVDD

SDA

SCL

U701

LM49151TL

LSOUT+

A4

LSOUT-

A3

SET

D2

HPL

E3

HPR

E2

0.1uF

C702

C704

2.2uF

C709

2.2uF

C711

27pF

C710

27pF

SPK_P

SPK_N

HSO_L

HSO_R

SPK_P

SPK_N

47pF

C716

C717

100pF

C715

47pF

VA701 VA702

L704

L703

47n

47n

L703

L703

L703

2

1

CN701

L704

L704

L704

U701

U701

U701

Figure 4-16. Audio Amp C706 C705

LG Electronics

LG Electronics

Figure 4-16. Audio Amp C706 C705

84/143

84/143

LGE Property

LGE Property




Speaker contact

Figure 4-17. Speaker

Checking Flow

START

Check Speaker ‘s

Contacts are clear.

Yes

Input Signal is

High(C705,C706)

?

Yes

Output Signal is

High(L703,L704)

?

Assemble

Yes

No

Resolder/Replace

Speaker

No

Replace Main Board

No

Replace Audio

AMP(U701)







4.7 Microphone trouble

Check Points

-Microphone hole

-Mic. Bias & signal line

C307 C316 L303

Figure 4-18. Microphone

Checking Flow

START

MIC301

Check microphone sound hole

No Check mic. Bias line Mic bias ON

(2.5V)when

Yes

Check Signal

C307, C316 (2.5V)

No Replace microphone

(MIC301)

Assemble






4.8 Vibrator trouble

Check Points

-Vibrator soldering

-IC is working correct

LINEAR MOTOR DRIVER

2V8_VVIB EUSY0200803

Rev.B

LIN_MOTOR_EN

TP206

R220

10K

U204

1

EN

2

SIN

3

TYPE

4

OCT

V1

8

VSS

7

VCC

6

V2

5

R223

10K

Figure 4-19. LINEAR MOTOR DRIVER Circuit

1%

C251

3.9n

C250

1u

CLOSE TO CONN

VB201

L204 100n

1

L203 100n

2

VA202 VA201

Figure 4-20. Vibrator Driver

Check the driver IC(U204) of

sub boarad







Check the vibrator soldering

Figure 4-21. Vibrator

Checking Flow

START

Check Vibrator sodering

Yes

Pin1 of

U204(VIB EN) is

Yes

Pin3 of U204(VIB) is high?

Yes

Replace Vibrator

Assemble

No

Check FPCB_LCD or replace it

No Replace Main Board

No Replace U204






4.9 SIM & uSD trouble

SIM Check Points

-Power is working

-Socket soldering

-Proper SIM is used

Pin 13 /

2V9_SIM

Pin 12 /

SIM_CLK

Figure 4-23. SIM CLK

Figure 4-22. SUB FPCB Assy

Pin 11 / SIM_IO

Check soldering all pin of

socket







Checking Flow

START

Check All of SIM card voltage

GX500 support

2.9V SIM only

No Resolder pin

16 pins are soldered well?

Yes

Check Proper SIM

Card

Yes Replace SUB Board

Assemble uSD Check Points

-Power is working

-Socket soldering

-Card detect is working

MMC-DETECT PIN

TP1

MMC_DETECT SIGNAL

Figure 4-24. uSD






Card insert

Figure 4-25. MMC_DETECT SIGNAL

Checking Flow

START

Check Micro SD card voltage

(2V9_VMME)

TF socket pins are well soldered

Yes

Check proper uSD?

Assemble

No

Resolder it

(check data line

TP 1 is 2.9V Signal)

Yes Replace Main Board

Card Deject


LG Electronics

- 91 -

91/143


LGE Property



4.10 Touch trouble

Check Points

- Touch driver IC soldering`

- FPCB_Folder Crack

TOUCH IC

2V62_VIO

2V7_VTOUCH

2V62_VIO

TS_XP

TS_IRQ

TS_YP

C820

0.1UF

C819

10U

TP802

C821

DNI

C822

DNI

A1

A2

A3

B1

B2

B3

U802

AUX

VDD_REF

X+

PENIRQ-

A0

Y+

TSC2007IYZGR

SDA

A1

X-

SCL

GND

Y-

C1

C2

C3

D1

D2

D3

C823

DNI

C824

DNI

I2C2_SDA

TS_XM

I2C2_SCL

TS_YM

Figure 4-26. Touch driver IC Circuit

Checking Flow

START

Pin1 of Touch driver IC(U802) is high(2.9v)?

Yes

Pin6 of U802 is high?

Yes

FPCB_Key is

Crack?

Yes

Replace FPCB_Folder and

Assemble

No

No

No

Check Fpcb_Key and replace

Resolder U802

Check and Replace

Fpcb_Key






4.11 LCD LED trouble

Check Points

-Signal path is connected well

TP2


MLED

VA203

VBAT

C255

1u

EVLC18S02015

C253

1u LCD_PWM

VA205

TP2

C254 1u

1uC252

1

18

U205

OUTCP1

OUTCP2

4

17

2

3

6

C1-

C1+

C2-

C2+

IN

AAT3369IDT-1-T1

EP

NC

D6

D5

D4

D3

D2

D1

19

5

15

14

13

12

11

10

TP1

7

GND EN_SET

16

8 9

PWM FCAP

C256

47n

R224

10K

MLED6

MLED5

MLED4

MLED3

MLED2

MLED1

LCD_BL_CTRL

TP1

Figure 4-27. LCD BACKLIGHT LED DRIVER Circuit

Checking Flow

START

Check All of LEDs solder

No Check R224 and

Replace

Check TP1 is hlgh ?

Yes

Check TP2 is high?

Yes

Assemble

No Check and Replace charge pump.

(U205)







4.12 Trouble shooting of Receiver part

Checking Flow Checking Points

Figure 4-28. Main PCB SIM1

START

ྙ

ྚ

ྛ

Setup Test Equipment

Cell Power : –74dBm

EGSM CH30

DCS CH699

ྜ

Check point ྙ

DCXO

Check point ྚ

PLL Control

Figure 4-29. Main PCB SIM2

ྙ

ྚ ྜ

Check point ྛ

Mobile SW & FEM

Check point ྜ

RX I/Q Signal

Re-Download S/W & CAL

ྛ






4.12.1 Checking DCXO Circuit

Checking Points DCXO Circuit Diagram

X401

TP1(C406) : 26MHz

Figure 4-30. DCXO (SIM1)

0.1U

VDDRX2V8

VDDRX1V5

VCO_RC

VDDVCO2V8

EN

VDDXO2V8

FSYS1

GND1

20

19

18

17

16

15

14

13

R402

820

X401

4

1

3

2

26MHz

DSX321SG-26M

Figure 4-32. DCXO Cicuit(SIM1)

RF_EN

26MHZ_MCLK

TP1

X502

*SIM2-> Transceiver is embeded in BB chip.

TP1

Figure 4-31. DCXO (SIM2)

Checking Flow

Is the waveform of TP similar to Fig.7?

Yes

X-TAL Circuit is OK.

See next page to check

PLL Circuit.

N0

Replace

X406/X502

Waveform

TP1 (C406)

Figure 4-33. DCXO Waveform







4.12.2 Checking PLL Control signals

Checking Points

TP1 (RF_EN) TP3 (RF_CLK)

Checking Flow

No Check U401

EN Signal(TP1) is OK ?

TP2 (RF_DATA)

Yes

DA(Data,TP2) is Normal ?

No Check U401

Yes

CLK(Clock,TP3) is Normal ?

No Check U401

Figure 4-34. Transceiver

RF Transceiver Circuit Diagram

Yes

Control Signal is OK.


Mobile SW & FEM.

Waveform

C430

0.1U

C416

0.1U

C411

0.1U

C442

0.1U

37

38

39

40

33

34

35

36

FE2

VBIAS

VDDTX1V5

TX1

TX2

VDDTX2V8

VDDMIX2V8

GND3

41

GND4

VDDRX2V8

VDDRX1V5

VCO_RC

VDDVCO2V8

EN

VDDXO2V8

FSYS1

GND1

16

15

14

13

20

19

18

17

R402

820

TP1

TP1

RF_EN

26MHZ_MCLK

X401

4

1

3

2

26MHz

DSX321SG-26M

TP401

TP402

I

Q

IX

RF_CLK

TP

RF_DA

QX

TP2

TP3

TP2

Figure 4-35. Transceiver Circuit

RF_DATA(TP3)

RF_CLK(TP2)

RF_EN(TP1)

Figure 4-36. PLL Control Waveform





4.12.3 Checking Mobile SW & FEM



SIM1 Circuit

C641

0.75p

1

SW602

ANT

G3

43

COMMON

G4

2

100NH

L601

TP3

TP2

TP1

TP1

17

ANT

TP4

SIM1 Circuit

TP1 TP2 TP2

GSM850 / 900_TX

GSM 1800 / 1900_ TX

GSM850 / 900_RX

GSM 1800 / 1900_ RX

TP3

VC1 (FE1) VC2 (FE2)

H L

L

L

L

H

L

L

C637

47P

C636

47P

VC1

VC2

TP4

TP3

TP TP4

TP4

VC1

VC2

C637

47P

C636

47P

SIM2 Circuit

5pL611

1

SW602

ANT

G3

COMMON

43

G4

2

100NH

L601

C632

Figure 4-37 Mobile SW & FEM Circuit

C641

0.75p

SIM2 Circuit

Figure 4-37 Mobile SW & FEM Circuit

TP4

TP2

TP3

TP3

TP4

TP2

TP4

TP2

TP1

SIM1

Figure 4-38. Mobile SW & FEM

TP5~8

TP1

SIM2

TP1

SIM1

SIM1

TP5~8


TP5~8

17

ANT

SIM2

SIM2

Table 4-2. FEM RX Control Logic

EGSM/GSM850 DCS/PCS

FE1 OFF

FE2 OFF

Table 4-2. FEM RX Control Logic

DCS/PCS

LG Electronics FE1 OFF

FE2 OFF

FE1

FE2


OFF

OFF

ON

OFF

ON






Checking Flow

Check TP1 of (SW401/SW602) with RF Cable and TP2 of (C418/C616)

No

TP1 Signal same as

TP2?

Yes

Replace Mobile SW

(SW401/SW602)

Control Signal is

OK ?

Yes

Yes

TP5~8 Signal is

OK ?

Yes

Mobile SW & FEM is OK.

Check Antenna.

No

No

Replace U101 / U503

Replace

FEM (FL401/FL1)

DCS/PCS RX

FE1

FE2

Figure 4-39 Mobile SW (R403) Figure 4-40 FEM Control Signals




LBAND_PAM_IN

HBAND_PAM_IN

C407

0.1U




C409

4.7P

C412

4.7P

C426

3.3p

3.3p

C435

2.2P

C408

2.2P

2.7p

C427

2.7p

C423

4.7N

FE1

FE2

4.12.4 Checking RX I/Q Signals

C430

0.1U

C416

0.1U

C411

0.1U

C432

0.22U

R405

10

37

38

39

40

33

34

35

36

FE2

VBIAS

VDDTX1V5

TX1

TX2

VDDTX2V8

VDDMIX2V8

GND3

41

GND4

VDDRX2V8

VDDRX1V5

VCO_RC

VDDVCO2V8

EN

VDDXO2V8

FSYS1

GND1

16

15

14

13

20

19

18

17

R402

820

R401

10

C413

220N

C438

0.1U

TP1(IX)

X401

4

1

3

2

26MHz

DSX321SG-26M

TP1(IX)

TP402(I)

TP401(Q)

RF_CLK

RF_DA

QX

TP401

Q

TP402(I)

TP402

IX

I

TP401(Q)

Figure 4-41. RX I/Q Circuit

Checking Points

C442

0.1U

Checking Flow

Check RX I/Q signals TP

Signals are

Normal?

Yes

RX Part is OK.

Check Base Band Circuit or

Re-Download S/W and Cal

No

Replace Transceiver

PMB6272(U401)

I

Q

TP2(QX

U401

G

TP402(I)

TP1(IX)

TP401(Q)

Figure 4-42. RX I/Q RX

Q

I


Figure 4-43. RX I/Q Waveform







4.13 Trouble shooting of Transmitter part

Checking Points

Checking Points

Figure 4-44. Main PCB


Cell Power : –74dBm

EGSM CH30

DCS CH699

Check point ྙ

X-TAL

Check point ྚ

PLL Control

ྙ

ྚ

ྛ

ྜ

ྜྷ

ྞ

Check point ྛ

TX I/Q Signal

Figure 4-45. Main PCB SIM2 ྙ

ྚ

Check point

Transceiver

Check point ྜྷ

PAM Control

ྜྷ

ྞ Check ྞ

FEM & Mobile

SW

Re-Download S/W & RF CAL






4.13.1 Checking VCTCXO Circuit

See RX Part “1. Checking DCXO Circuit”

4.13.2 Checking PLL Control Signal

See RX Part “2. Checking PLL Control Signal”






LBAND_PAM_IN

HBAND_PAM_IN

C407

0.1U

R401

10

C413

220N

GSM850 DCS1800 PCS1900 GSM900


C423

4.7N

C409

4.7P

C412

4.7P

C426

3.3p

C421

3.3p

C435

2.2P

C408

2.2P

C431

2.7p

C427

2.7p

FE1

FE2

4.13.3 Checking TX I/Q Signals

C430

0.1U

C416

0.1U

C411

0.1U

C432

0.22U

R405

10

37

38

39

40

33

34

35

36

FE2

VBIAS

VDDTX1V5

TX1

TX2

VDDTX2V8

VDDMIX2V8

GND3

41

GND4

VDDRX2V8

VDDRX1V5

VCO_RC

VDDVCO2V8

EN

VDDXO2V8

FSYS1

GND1

16

15

14

13

20

19

18

17

R402

820

C442

Checking Flow

0.1U

Check TX I/Q signals TP

C438

0.1U

TP1(IX)

TP1(IX)

TP402(I)

X401

4

1

3

2

TP2(QX)

TP2(QX

26MHz

DSX321SG-26M

TP401(Q)

RF_CLK

RF_DA

QX

TP401

TP402(I)

TP402

I

Q

IX

TP401(Q)

Figure 4-46. TX I/Q Circuit

Signals are

Normal?

Yes

TX Part is OK.

Check Base Band Circuit or

Re-Download S/W and Cal

No

Replace Transceiver

PMB6272(U401)

Checking Points

I

Q

TP2(QX

U401

TP402(I)

TP1(IX)

TP401(Q)

Figure 4-47. TX I/Q

TX

Q

I


Figure 4-48. TX I/Q Waveform






4.13.4 Checking Transceiver Output Signals

TP1(HBNAD_PAM_IN)

12

10

13

9

14

11

8

15

DCS_PCS_OUT

PGND

DCS_PCS_IN

GSM850_900_IN

1

GSM850_900_OUT

BY_CAP1

BY_CAP2

U402

TQM7M5005H

MODE_SELECT

VBATT

2

BS

3

4

VRAMP

5

GND1

GND2

GND3 TX_EN

6

7

OK

R403

10K

R407

100P

R404

100P

HBAND_PAM_IN

PA_MODE

S1_PA_BAND

PA_LEVEL

TXON_PA

LBAND_PAM_IN

15

PGND

8

11

14

GND3

GND2

GND1

9

BY_CAP2

13

BY_CAP1

10

GSM850_900_OUT

12

DCS_PCS_OUT

TQM7M5005H

U602

GSM850_900_IN

7

TX_EN

6

VRAMP

5

VBATT

4

BS

3

MODE_SELECT

2

DCS_PCS_IN

1

C414

1u

OK

C437

33u

C434

27P

C441

100P

C415

100P

C420

47P

C429

100P C613

1u

C640

33u

C622

27P

C620

100P

C631

100P

C623

100P

C639

47P

R601

100P

R605

10K

TP2(LBNAD_PAM_IN)

TP2(LBNAD_PAM_I

TXLB

PA_EN

TX_RAMP

S2_PA_BAND

PA_MODE_2

Figure 4-49. Transceiver Output Circuit

SIM1

Figure 4-50. Transceiver Output

Table 4-3. Transceiver Output Operation

MODE Transceiver Output

GMSK Fixed

8PSK Ramp Burst Control

SIM2







Checking Flow

Check Output Signal

(TP1 TP2)

Signals are

Normal ?

Yes

Transceiver is OK.


PAM Control Circuit.

No

Replace

PMB6272(U401/U50

)

LBAND_PAM_IN (MODE: GMSK) : TP2

EGSM 30CH

LBAND_PAM_IN (MODE: 8PSK) : TP2

EGSM 30CH

Figure 4-51. Transceiver Output (GMSK) Figure 4-52. Transceiver Output (8PSK)


LG Electronics





4.13.5 Checking PAM Control Signals

TP1(PA_LEVEL)

R407

100P

12

10

13

9

14

11

8

15

DCS_PCS_OUT

PGND

DCS_PCS_IN

GSM850_900_IN

1

GSM850_900_OUT

BY_CAP1

BY_CAP2

U402

TQM7M5005H

VBATT

2

MODE_SELECT

BS

3

4

VRAMP

5

GND1

GND2

GND3 TX_EN

6

7

OK

R403

10K

R404

100P

PA_MODE

S1_PA_BAND

PA_LEVEL

TXON_PA

LBAND_PAM_IN

GSM850_900_IN

7

8

11

14

9

13

10

12

GND3

GND2

GND1

TX_EN

6

VRAMP

5

BY_CAP2

BY_CAP1

TQM7M5005H

U602

GSM850_900_OUT

VBATT

MODE_SELECT

4

BS

3

2

DCS_PCS_OUT DCS_PCS_IN

1

C414

1u

OK

C434

27P

C441

100P

C415

100P

C420

47P

C429

100P C613

1u

TP2(TXON_PA)

SIM1 Circult

SIM1 Circuit

TP2(TXON_PA)

TP(PA_MODE)

C622

27P

C620

100P

C631

100P

C623

100P

C639

47P

SIM2 Circult

SIM2 Circuit

R601

100P

R605

10K

Figure 4-53. PAM Control Signals Circuit

TP3(PA_MODE)

TP1(PA_LEVEL)

TXLB

PA_EN

TX_RAMP

S2_PA_BAND

PA_MODE_2

TP2(TXON_PA)

TP3(PA_MODE)

SIM1

Figure 4-54. PAM Output

Table 4-4. PAM Mode Operation

MODE

GMSK

8PSK

MODE

LOW

HIGH

PA_LEVEL

Ramp Burst Control

Control Amp bias

TXON_PA

HIGH

HIGH

SIM2







Checking Flow

Check Control Signals

(TP1, TP2, TP3)

Signals are

Normal ?

Yes

PAM Control Signal is OK.


FEM & Mobile SW Circuit.

No Check

PMB8877/PMB8888

(U101/U502)

Figure 4-55. GSMK Control Signal Figure 4-56. 8PSK Control Signal

TP1(PA_LEVEL)

TP2(TXON_PA)

TP3(PA MODE)

TP2(TXON_PA)

TP1(PA_LEVEL)

TP3(PA MODE)

TP1(PA_LEVEL)

TP2(TXON_PA)

TP3(PA MODE)

TP3(PA MODE) : R441/R623

TP1(PA_LEVEL) : R403/R605

TP2(TXON_PA) : R429/R620






4.13.6 Checking FEM & Mobile SW

4.13.6 Checking FEM & Mobile SW

Mobile SW & FEM Circuit

Mobile SW & FEM Circuit

VC1

VC2

C637

47P

C636

47P

TP1

TP2

1

SW602

ANT

G3

43

COMMON

G4

2

100NH

L601

17

ANT

C641

0.75p

TP2

TP3 TP4 G

TP1

TP5

SIM1 Circuit

SIM1 Circuit

TP3

SIM1 Circuit

VC1 (FE1)

TP3

VC2 (FE2)

TP5

H L

GSM 1800 / 1900_ TX L H

GSM850 / 900_RX L L

GSM 1800 / 1900_ RX L L

TP4 G

G

TP1

TP3

C637

47P

C636

47P

TP TP4

TP4 G

TP1

VC1

VC2

5pL611

C632

18n

SIM2 Circuit

C641

0.75p

Figure 4-57. Mobile SW & FEM Circuit

Figure 4-57. Mobile SW & FEM Circuit

TP3

1

SW602

ANT

G3

43

COMMON

G4

2

100NH

L601

17

ANT

SIM2 Circult

SIM2 Circuit

TP3

TP4

TP2

TP2

TP5

TP1

TP1

SIM1

SIM1

SIM1


SIM2 TP1

SIM2

TP5

Table 4-5. FEM TX Control Logic

FE1 OFF

FE2 ON FE1

FE2

EGSM/GSM850 EGSM/GSM850 DCS/PCS

OFF

ON

ON OFF

ON

FE2 ON ON

ON

ON



- 107 -






Checking Flow

Check TP1 of SW600 with RF Cable and TP2 of

C418/C616

TP1 Signal same as TP2?

Yes

No Replace Mobile SW

(SW401/SW602)

Control Signal is

OK ?

Yes

TP5 Signal is OK ?

Yes

Mobile SW & FEM is OK.

Check Antenna.

No Replace BB CHIP

(U101/U502)

No

Replace FEM (FL401/FL1)

EGSM TX

Figure 4-59 Mobile SW (R403) Figure 4-60 FEM Control Signals






4.14 Trouble shooting of WI-FI/BT/FM part

Checking Flow Checking Points

Figure 4-61. WI-FI/BT/FM Module


START

Check point ྙ

Clock

ྙ

Check point ྚ

POWER

ྚ

Check point ྛ

Module

Compoment Change

END

ྛ





4.14.1 Checking Main Clock part

4.14.1 Checking Main Clock part

TP2(26MHz)C645 Checking Flow

START TP2(26MHz)C645

TP1 (CLK_REQ)R606

(TP1,2) is OK ?

Yes

Check Module Part

No

Figure 4-62. WI-FI/BT/FM Clock part

Check

TCXO

Check

TCXO

TOUCH_EN

VBAT

LDO for TCXO

2V7_VTOUCH VDD_TCXO

C643

1u

R607

100K

U604

1

2

3

4

VIN

EN1

P2

P1

VOUT1

VOUT2

GND

EN2

8

7

6

5

C646

1u

26MHz TCXO

VDD_TCXO

C647

1u

BT_CLK_REQ

CLK_IN

4

VCC

26MHZ

GND

2

C644

1uF

3

OUT NC

TG-5010LH-87N X601

1

TP2 (26MHz)

TP2 (26MHz)

Figure 4-63. WI-FI/BT/FM Clock Circuit






TP3(VDD_WL_PA)

No No Check

POWER block

Check

MODUEL

WLAN+BT+FM

C608

0

CN601

1

CN602

1

C607

DNI

L602 1.5n

C606

1p close to 3

C688

10uF

C687

0.1u

FB602

R699

0

C699

2.2uF

WLAN_CMD

WLAN_CLK

WLAN_SDIO[3]

WLAN_SDIO[2]

WLAN_SDIO[1]

WLAN_SDIO[0]

WLAN_ENABLE

WLAN_WAKEUP

REG_ON

C698

0.1u

C619

4.7uF

3.3UH

L607

4.7u

L699

1

ANT

2

3

GND5

VDD_WL_PA

4

5

6

7

8

9

SDIO_CMD

SDIO_CLK

SDIO_DATA_3

SDIO_DATA_2

SDIO_DATA_1

SDIO_DATA_0

10

11

12

13

WL_RST_N

WL_WAKE_B

REG_ON

VBAT_IN

14

15

SR_VLX1

SR_VLX1BB

TP1(VBAT)

TP699

TP698

TP697

TP696

TP4~7(UART)

U601

BT_PCM_CLK

BT_PCM_OUT

BT_PCM_SYNC

BT_PCM_IN

45

44

43

42

VDD_BT_PA

41

32KHZ

GND7

FM_ANT

40

39

38

BT_WAKE_B

BT_HOST_WAKE

BT_GPIO_3

BT_GPIO_4

BT_GPIO_7

37

36

35

34

33

XTALP

XTALN

32

31

TP695

TP694

TP601

CLK32K

FM_ANT

BT_WAKEUP

BT_HOST_WAKEUP

BT_PCM_CLK

BT_PCM_RX

BT_PCM_SYNC

BT_PCM_TX

FB601

C689

1uF

TP693

CLK_IN

C692

0.1u

C691

1uF

TP692 close to 17

C697

10uF

C696

0.1u

C695

0.1u

TP(VDD_WL_PA)

TP3(VDD_WL_PA)

BT_ENABLE

FM_R

FM_L





5. DOWNLOAD & S/W UPGRADE


1.

2.

3.

Run “Setup.exe” for Installation Infineon usb driver.

Click Install button.

Click Exit button after installation completion.








1.

2.

3.

4.

2.

1.

2.

Connect cable within the device.

Windows will pop-up Found new hardware wizard and detect the new usb device.

Check “Install the software automatically (Recommended)” button,



Windows will pop-up Found new hardware wizard and detect the new usb device.

Check “Install the software automatically (Recommended)” button, install driver for the device. (or set specific location.) 4.

4.

5.

5.

,

,

If you have several usb ports for usb download, you have to repeat

If you have several usb ports for usb download, you have to repeat

Eg. In case of Infineon, “Flash Loader utility” will be installed as shown below.






3.

4.

1.

2.

Connect the usb or nexus cable with the device in order of port number.

If you have the disable port, click “SKIP” button.

After mapping is completed, click “Save & Exit” button.

Connection in 1 st port Connection in 2 nd port Skip 3 rd port



















III. Technical brief

3.1 GX500 Functional Block diagram

6. BLOCK DIAGRAM

The functional component arrangement is mentioned below diagram.

Figure 3-1. GX500 Functional Block diagram




7. CIRCUIT DIAGRAM

12 11 10 9 8 7 6

L

BASE BAND PROCESSOR

1V35_CORE

K

J

H

G

I

F

E

SGR_RESETN

PA_LEVEL

IX

Q

QX

I

R117

TXON_PA

WLAN_WAKEUP

S1_PA_BAND

WLAN_ENABLE

REG_ON

SGR_INT

PA_MODE

100K

UART_SEL

TS_IRQ

WLAN_HOST_WAKEUP

LIN_MOTOR_EN

_CHG_EN

RF_EN

_DPRAM_BUSY_S1

RF_DA

RF_CLK

_DPRAM_INT_S1

26MHZ_MCLK

SG3_SIM1_IO

SG3_SIM1_CLK

SG3_SIM1_RST

WLAN_CMD

WLAN_CLK

WLAN_SDIO[0]

WLAN_SDIO[1]

WLAN_SDIO[2]

WLAN_SDIO[3]

MMC_CMD

MMC_D0

MMC_CLK

_DPRAM_SEM_S1

2V62_VIO

BT_HOST_WAKEUP

2V62_VIO

USB_OEN

2V62_VIO VBAT

BAT_ID

S1_RF_TEMP

D17

D18

E15

B17

RF_STR0

RF_STR1

RF_DATA

RF_CLK

C18

W12

U12

H15

AFC

CLKOUT0

F26M

SWIF_TXRX

H16

K18

K17

CC_IO

CC_CLK

CC_RST

E10

MMCI1_CMD

A12

B11

C9

F10

MMCI1_CLK

MMCI1_DAT0

MMCI1_DAT1

MMCI1_DAT2

A14

D3

D2

F6

MMCI1_DAT3

MMCI2_CMD

MMCI2_DAT0

MMCI2_CLK

W11

FWP

F2

G2

IRDA_TX

IRDA_RX

A18

B18

C15

C16

F13

F16

TDO

TDI

TMS

TCK

TRST_N

RTCK

E14

B16

C10

AA7

U11

Y9

T10

Y8

TRIG_IN

MON1

MON2

TRACESYNC

TRACECLK

PIPESTAT2

PIPESTAT1

PIPESTAT0

E13

B14

F11

A15

E11

F12

B13

C11

E12

C12

B12

B15

C13

K16

M12

N15

M15

M16

K15

W18

V17

M_0

Y19

Y18

W17

AA18

Y17

W16

AA17

Y16

M_1

M_2

M_3

M_4

M_5

M_6

M_7

M_8

M_9

U15

M_10

PAOUT11

PAOUT12

BB_I

BB_IX

BB_Q

BB_QX

T_OUT0

T_OUT1

T_OUT2

T_OUT3

T_OUT4

T_OUT5

T_OUT6

T_OUT7

T_OUT8

T_OUT9

T_OUT10

T_IN0

T_IN1

D

C

KEY_ROW0

KEY_ROW1

KEY_ROW4

FL101

3

4

1

2

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

9

8

7

6

7.5pF

KEY_COL0

KEY_COL1

KEY_COL2

KEY_COL3

FL102

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

6

9

8

7

7.5pF

1V8_SD

1V8_SD 2V62_VIO 2V62_VIO 2V11_RTC 2V5_VAUDB

2V9_SIM 1V35_VPLL 2V5_VAUDA

U101

C139

22N

C145

22N

2V62_VIO

2V62_VIO

B

A

UART

UT101

3G

GND

RX

TX

VCHAR

ON_SW

VBAT

PWR

URXD

UTXD

2.5G

GND

RX

1

2

TX

NC1

ON_SW

VBAT

3

4

5

6

NC2

NC3

NC4

DSR

7

8

9

10

RTS

CTS

11

12

V_BUS VBAT

UART_RX

UART_TX

RPWRON_EN

USB_DM

USB_DP

SIM1_DSR

12 11



10 9 8 7

- 121 -

FCDP_RBN

T11

MEM_WAITN

MEM_ADVN

MEM_RDN

MEM_WRN

K2

M1

L1

R3

MEM_BFCLKO1

W3

MEM_BFCLKO2

MEM_SDCLKO

MEM_BC0_N

MEM_BC1_N

MEM_BC2_N

MEM_BC3_N

U5

Y4

Y3

Y2

AA2

V3

MEM_RAS_N

MEM_CAS_N

MEM_CKE

Y7

W8

U10

F32K

AA16

AA15

OSC32K

RESET_N

RSTOUT_N

RTC_OUT

W14

H18

Y14

R16

VREFP

IREF

R15

SPCU_RQ_IN0

SPCU_RQ_IN1

SPCU_RC_OUT0

SPCU_RQ_IN2

J18

J19

H17

G18

MEM_AD0

MEM_AD1

M2

L3

MEM_AD2

MEM_AD3

MEM_AD4

MEM_AD5

MEM_AD6

MEM_AD7

MEM_AD8

MEM_AD9

MEM_AD10

MEM_AD11

MEM_AD12

MEM_AD13

MEM_AD14

MEM_AD15

M4

P4

K5

L4

R1

M5

P2

N2

J4

K4

J3

L5

M3

N1

MEM_A0

U8

W4

MEM_A1

MEM_A2

MEM_A3

MEM_A4

MEM_A5

MEM_A6

MEM_A7

MEM_A8

MEM_A9

MEM_A10

MEM_A11

MEM_A12

MEM_A13

MEM_A14

MEM_A15

MEM_A16

MEM_A17

MEM_A18

MEM_A19

MEM_A20

MEM_A21

MEM_A22

MEM_A23

MEM_A24

MEM_A25

MEM_A26

T4

R4

T2

P5

T3

U2

W2

R5

T1

U9

W9

V1

N5

W6

T9

W7

Y6

T7

U7

Y5

AA5

T8

U6

W5

AA4

MEM_CS0_N

R2

MEM_CS1_N

MEM_CS2_N

MEM_CS3_N

MEM_CSA0_N

P3

N3

N4

U3

MEM_CSA1_N

MEM_CSA2_N

MEM_CSA3_N

U4

T6

T5

_NAND_CS_S1

_RAM_CS_S1

_DPRAM_CS_S1

S1_ADD[27]

S1_ADD[28]

S1_ADD[29]

S1_ADD[30]

S1_FCDP

_RD_S1

_WR_S1

R104 22

_BC0_S1

_BC1_S1

_BC2_S1

_BC3_S1

_RAS_S1

_CAS_S1

S1_CKE

S1_ADD[0]

S1_ADD[1]

S1_ADD[2]

S1_ADD[3]

S1_ADD[4]

S1_ADD[5]

S1_ADD[6]

S1_ADD[7]

S1_ADD[8]

S1_ADD[9]

S1_ADD[10]

S1_ADD[11]

S1_ADD[12]

S1_ADD[13]

S1_ADD[14]

S1_ADD[15]

S1_ADD[16]

S1_ADD[17]

S1_ADD[18]

S1_ADD[19]

S1_ADD[20]

S1_ADD[21]

S1_ADD[22]

S1_ADD[23]

S1_ADD[24]

S1_ADD[25]

S1_ADD[26]

S1_DATA[0]

S1_DATA[1]

S1_DATA[2]

S1_DATA[3]

S1_DATA[4]

S1_DATA[5]

S1_DATA[6]

S1_DATA[7]

S1_DATA[8]

S1_DATA[9]

S1_DATA[10]

S1_DATA[11]

S1_DATA[12]

S1_DATA[13]

S1_DATA[14]

S1_DATA[15]

S1_SDCLKI

S1_SDCLKO

_RESET

SIM1_DSR

RTC_OUT

32.768KHz

2 1

C144

22P

X101

C140

22P

VREFN

TP112 TP110

6

5

5

4 3 2 1

L

1V8_SD

2G NAND(LB/128Mx16bit) +1G SDR SDRAM(8Mx4x32bit)

EUSY0347505, Hynix

C143

0.1U

1V8_SD

R113 100K

S1_DATA[0]

S1_DATA[1]

S1_DATA[2]

S1_DATA[3]

S1_DATA[4]

S1_DATA[5]

S1_DATA[6]

S1_DATA[7]

S1_DATA[8]

S1_DATA[9]

S1_DATA[10]

S1_DATA[11]

S1_DATA[12]

S1_DATA[13]

S1_DATA[14]

S1_DATA[15]

_NAND_CS_S1

_RD_S1

_WR_S1

S1_ADD[17]

S1_ADD[16]

S1_FCDP

TP106

TP109

TP111

B6

B3

B7

B4

C4

C3

C6

_CE

_RE

_WEN

CLE

ALE

_WP

R_B

B8

D1

H1

H10

P8

M1

B5

N5

VCCN0

VCCN1

C5

P6

VSSN0

VSSN1

VDD0

VDD1

VDD2

VDD3

VDD4

VDD5

C107

0.1U

C104 C116

0.1U

0.1U

C117 C113

0.1U

0.1U

C110 C120

0.1U

0.1U

C135

0.1U

IO8

IO9

IO10

IO11

IO12

IO13

IO14

IO15

IO0

IO1

IO2

IO3

IO4

IO5

IO6

IO7

N2

N3

M5

P7

M6

N6

M8

P2

P3

N4

P4

P5

N7

M7

N8

C138

0.1U

C126

0.1U

C125

0.1U

C118

0.1U

C133

0.1U

C127

0.1U

C102

0.1U

C136

0.1U

C103

0.1U

B9

C1

H9

J1

P9

M2

VSS0

VSS1

VSS2

VSS3

VSS4

VSS5

J9

K10

L10

M9

N10

C10

D9

E10

F9

G10

J10

K9

L9

M10

VDDQ0

VDDQ1

VDDQ2

VDDQ3

N9

C9

D10

E9

F10

G9

VDDQ4

VDDQ5

VDDQ6

VDDQ7

VDDQ8

VDDQ9

VSSQ0

VSSQ1

VSSQ2

VSSQ3

VSSQ4

VSSQ5

VSSQ6

VSSQ7

VSSQ8

VSSQ9

U102

H8ACS0SJ0BCR-46M

A5

A6

A7

A8

A9

A10

A11

A12

BA0

BA1

A0

A1

A2

A3

A4

K4

L1

L2

L3

C2

D2

E1

D3

E2

D4

K3

F2

F1

J3

K2

DQ0

L4

DQ1

DQ2

DQ3

DQ4

L5

L6

L7

K8

L8

DQ5

DQ6

DQ7

DQ8

K7

K5

K6

G7

DQ9

DQ10

DQ11

DQ12

J6

J5

H6

H5

DQ13

DQ14

DQ15

DQ16

DQ17

DQ18

DQ19

DQ20

DQ21

E4

F5

H3

H4

J4

G3

G4

F4

DQ22

DQ23

DQ24

DQ25

E6

F7

F6

D5

DQ26

DQ27

DQ28

DQ29

E8

D6

D8

D7

DQ30

DQ31

C8

C7

_CS

J2

CK

CKE

_WED

_RAS

_CAS

DQM0

DQM1

DQM2

DQM3

E7

H2

J8

G6

F8

G8

E3

K1

G2

DNU0

DNU1

A2

A9

DNU2

DNU3

DNU4

DNU5

A10

R1

R2

R9

DNU6

R10

TP104

R107 22

TP108

TP107

TP102

TP103

S1_ADD[16]

S1_ADD[17]

S1_ADD[18]

S1_ADD[19]

S1_ADD[20]

S1_ADD[21]

S1_ADD[22]

S1_ADD[23]

S1_ADD[24]

S1_ADD[25]

S1_ADD[26]

S1_ADD[27]

S1_ADD[28]

S1_ADD[29]

S1_ADD[30]

S1_DATA[0]

S1_DATA[1]

S1_DATA[2]

S1_DATA[3]

S1_DATA[4]

S1_DATA[5]

S1_DATA[6]

S1_DATA[7]

S1_DATA[8]

S1_DATA[9]

S1_DATA[10]

S1_DATA[11]

S1_DATA[12]

S1_DATA[13]

S1_DATA[14]

S1_DATA[15]

S1_ADD[0]

S1_ADD[1]

S1_ADD[2]

S1_ADD[3]

S1_ADD[4]

S1_ADD[5]

S1_ADD[6]

S1_ADD[7]

S1_ADD[8]

S1_ADD[9]

S1_ADD[10]

S1_ADD[11]

S1_ADD[12]

S1_ADD[13]

S1_ADD[14]

S1_ADD[15]

S1_CKE

_WR_S1

_RAS_S1

_CAS_S1

_BC0_S1

_BC1_S1

_BC2_S1

_BC3_S1

S1_SDCLKI

S1_SDCLKO

1V8_SD

_RAM_CS_S1

I

K

J

H

G

4

ON BOARD ARM9 JTAG & ETM INTERFACE

3 2 1

B

A

D

C

F

E



B

A

G

F

E

D

C

12 11

L

K

I

J

H

USB_OEN

USB_DAT_VP

USB_SE0_VM

1V8_SD 2V5_VAUDB

2V5_VAUDA 2V85_VFM

VBAT TXON_PA

VBAT

C204 C208

10u 10u

C213

22u

C230

2.2u

C209

2.2u

C245

2.2u

C240

0.1u

C243

1u

SIM1_USB_DP

SIM1_USB_DM

PMRSTN

220

VCXO_EN

SIM1_BT_VCXO_EN

C241

10u

C247

2.2u

C224

0.1u

TP203

B1

C2

D3

C1

D2

RCV

VPIN

VMIN

D+

D-

E3

D1

E2

E1

RESET_N

RESET2_N

SLEEP1_N

SLEEP2_N

F2

F1

VAUDIOA

VDDAUDIOA

G2

G1

VDDAUDIOB

VAUDIOB

H2

H1

VAUX

VDDAUX

J1

J2

H3

SU1_GATE

SU1_GND

SU1_FB

J3

SU1_ISENSE

K1

K2

VDDSD2

SD2_FB

L2

SD2_FBL

C216

2.2u

VUSB

VBAT

VBAT

C237

2.2u

C212

1u

C214

0.1u

10

PMIC

1V35_VPLL 2V62_VIO

VBAT VBAT

U201

TP202

9

2V62_VIO

C217

2.2u

VBAT

8

SG3_RPWRON_EN

7

RTC_OUT

R216

27K

ON_OFF2

2V8_VVIB

0.1u

C205

L202

10u

1V35_CORE

VBAT 1V5_VBT

2V7_VRF

2V11_RTC

2V85_VRF

2V9_SIM

1V5_VRF

2V65_VBT

2V9_VMME

1V8_SD

VMME

VDDMME

C11

C10

VDDRF2

VRF2

D10

D11

VRF3

VDDRF13_AFC

E10

E11

VRF1

VVIB

VDDSIMVIB

F10

F11

G11

VSIM

G10

VAFC

H11

VRTC

H10

VDDUMTS

VUMTS

H9

J11

VDDSD1

SD1_FB

SD1_FBL

K11

J10

L10

FB202

C226

10u

C244

1u

C236

1u

C234

1u

C227

1u

C228

2.2u

C242

2.2u

C210

2.2u

C203

2.2u

C229

2.2u

C232

2.2u

C233

2.2u

6

LINEAR MOTOR DRIVER

EUSY0200803

Rev.B

2V8_VVIB

LIN_MOTOR_EN

TP206

R223

10K

R220

10K

U204

1

EN

2

SIN

3

TYPE

4

OCT

V1

8

VSS

7

VCC

6

V2

5

1%

C251

3.9n

C250

1u

CLOSE TO CONN

VB201

L204 100n

1

L203 100n

2

VA202 VA201


MLED

VA203

VBAT

C255

EVLC18S02015

1u

C253

1u

LCD_PWM

VA205

U205 AAT3369IDT-1-T1

C254 1u

1

18

2

3

1uC252 4

17

6

7

OUTCP1

OUTCP2

C1-

C1+

C2-

C2+

IN

GND

EP

NC

19

5

D6

D5

D4

D3

D2

D1

EN_SET

16

15

14

13

12

11

10

8

PWM FCAP

9

C256

47n

R224

10K

MLED6

MLED5

MLED4

MLED3

MLED2

MLED1

LCD_BL_CTRL

1uF

ACCEL SENSOR

2V85_VFM

ACCEL_INT

TP205

C248

22n

U203

1

NC1

2

VDD

3

GND

4

INT

5

CSB

BMA020

NC2

10

VDDIO

SDI

9

8

SDO

SCK

7

6

2V62_VIO

C249

0.1u

I2C2_SDA

I2C2_SCL

5 4

RPWRON_EN

RPWRON

Remote Power On

2V11_RTC

KEY_COL2

VA204

KEY_ROW4

Q201

PWRON

END_KEY

R209

10K

3 2

EXTERNAL RESET

SPOWER_INT

_RESET

R202

0

R201

0

PM_INT

PMRSTN

1

L

K

J

H

I

BATTERY CONNECTOR

CN201

4

1

2

3

R214

1K

C220

100p

BAT_ID

VBAT

C202

47p

C235

27p

C211

10p

C215

2.2u

G

F

E


12 11 10 9 8 7

- 122 -

6 5 4

D

C

VBAT

C225

10u

1

FL201

IN OUT

2

3

G1 G2

4

S2_VBAT

C219

39p

C239

10p

3

B

A

2 1




I

H

L

K

J

G

F

E

D

12 11 10

MIC BIAS

MIC_BIAS_EN

FB301

C317

2.2u

BU18TD2WNVX

4

3

VIN

STBY

U307

VOUT

GND

1

2

C321

2.2U

MAIN MIC

MAIN_MIC_N

MAIN_MIC_P

C316

47p

C307

47p

1V8_MIC_BIAS

L303

100NH

C311

47P

VA301

C318

2.2u

VA302

1

2

3

4

MIC301

P

G1

G2

O

SPU0410HR5H-PB

RCV SWITCH

SIM1_RCV_N

SIM2_RCV_N

SIM1_RCV_P

SIM2_RCV_P

2V62_VIO

10

U303 FSA2268TUMX_F113

1B0 1A

8

1

2

3

4

1B1

2B0

2B1

GND

S1

2A

7

5

S2

6

VCC

9

1U

C315

27P 27P

RCV_N

SIM1_SIM2_SEL

RCV_P

9 8

MIC SWITCH

SIM1_MIC_N

SIM2_MIC_N

SIM1_MIC_P

SIM2_MIC_P

2V62_VIO

3

4

1

2

10


1B0 1A

8

1B1

2B0

2B1

GND

S1

2A

7

5

S2

6

VCC

9

1U

C320

MAIN_MIC_N

SIM1_SIM2_SEL

MAIN_MIC_P

7

USB_SEL

RPWRON_EN

V_BUS

C310

1u

NLAS4157DFT2G U308

6

S B1

1

5

VCC GND

2

4

A B0

3

SGR_RPWRON_EN

SG3_RPWRON_EN

6 5 4 3 2 1

L

SINGLE CHARGING IC

5PIN uUSB

V_BUS

RPWRON_EN

V_BUS VBAT 2V62_VIO 2V62_VIO 2V62_VIO

C338

1uF

C337

1uF

560 ohm->(910mA)

820 ohm->(646mA)

2K(10%)->91mA

1

2

3

4

5

IN

ISET

VSS1

LDO

IFULL

U310

BQ25040

PGND

BAT

_PG

CHG

VSS2

EN_SET

7

6

9

8

11

10

C336

1uF

_PPR

_EOC

_CHG_EN

USW_DM

USW_DP

USW_ID

C333

22pF

MUIC

V_BUS

2V62_VIO

VBAT

HS_MIC_N

HS_MIC_P

C305 0.022uF

27pF

C327

C306 0.022uF

C326

39pF

C329

27pF

UART_TX

UART_RX

R313

2.2k

C325

120pF

ECCH0000198

(2.2uF,6.3V,10%,1005)

USB_DM

USB_DP

HSO_L

HSO_R

RPWRON_EN

USW_INT

I2C1_SDA

I2C1_SCL

C303

27p

C304

27p

R314

R320

FB302

FB304

R318

0

0

1000

1000

100K

C330

0.1uF

C331

0.1u

C4

C3

UART_TX

UART_RX

D4

E4

USB_DM

USB_DP

D1

C1

A4

C2

B3

AUDIO_L

AUDIO_R

MIC

DSS

_INT

A2

B2

D2

SDA

SCL

GND

(EUSY0372001)

VBUS

DM

DP

ID

R2_2K

E1

E2

E3

D3

A3

CLDO

A1

FB303 1000

HB-1M1005-102JT

R315

2.2k

C332

10n

C328

22pF

USW_DM

USW_DP

USW_ID

CN301

1

2

3

14

6

8

10

12

4

5

7

9

11

13

15

L306

100n

1005 coil

C334

10pF

K

FM_ANT

J

I

H

G

USB SWITCH

VUSB VUSB VBAT

SIM2_USB_DP

SIM1_USB_DP

USB_DP

R302

33

C302

1u

1

U301

V+

2

NO1

3

COM1

4

IN1

DG2735DN-T1-E3

NO2

10

COM2

9

IN2

8

NC2

7

5

NC1 GND

6

R301

33

SIM2_USB_DM

USB_DM

SIM1_USB_DM

R305

1K

USB_SEL

F

E

D

C

B

SIM1_HSMIC_N

SIM2_HSMIC_N

SIM1_HSMIC_P

SIM2_HSMIC_P

HS MIC SWITCH

2V62_VIO

10


1B0 1A

8

1

1B1

2

2B0

3

2B1

4

GND

S1

2A

S2

VCC

7

5

6

9

1U

C313

HS_MIC_N

SIM1_SIM2_SEL

HS_MIC_P

A

12 11



10 9

SGR STEREO Port is not used

8 7

- 123 -

6

UART SWITCH

UART_SEL

R308

1K

VBAT

SIM2_UART_TX

UART_TX

R312

10

SIM1_UART_TX

C314

1u

3

4

1

2

U302

V+

NO1

DG2735DN-T1-E3

NO2

10

COM2

9

5

COM1

IN1

NC1

IN2

NC2

8

7

GND

6

R311

10

SIM2_UART_RX

UART_RX

SIM1_UART_RX

5 4 3 2 1

C

B

A



G

F

E

H

I

D

C

B

A

L

K

J

12

12


11

11

10 9 8 7

- 124 -

6 5 4 3

GSM850 / 900_TX

GSM 1800 / 1900_ TX

GSM850 / 900_RX

GSM 1800 / 1900_ RX

VC1 (FE1) VC2 (FE2)

H

L

L

L

L

H

L

L

GND402 ANT401

C405

2.2n

C440

1p

L403 20p

C436

18n

SW401

1

ANT

G3

COMMON

2

G4

43 100NH

L407

C418

100P

C407

0.1U

100P

C439

100P

C424

17

ANT


C423

4.7N

C409

4.7P

C412

4.7P

C426

3.3p

C421

3.3p

C435

2.2P

C408

2.2P

C431

2.7p

C427

2.7p

L404

4.7p

C428

0.5p

L406

3.9p

C433

8.2n

C410

12n

C417

22n

FE1

FE2

C425

0.01U

C422

0.01U

12

DCS_PCS_OUT

10

13

GSM850_900_OUT

BY_CAP1

9

BY_CAP2

14

11

8

GND1

GND2

GND3

15

PGND

U402

TQM7M5005H

DCS_PCS_IN

1

MODE_SELECT

BS

VBATT

VRAMP

TX_EN

GSM850_900_IN

4

5

2

3

6

7

OK

R403

10K

C414

1u

OK

C434

27P

C441

100P

C415

100P

C420

47P

C429

100P

R407

100P

R404

100P

HBAND_PAM_IN

PA_MODE

S1_PA_BAND

PA_LEVEL

TXON_PA

LBAND_PAM_IN

LBAND_PAM_IN

HBAND_PAM_IN

FE1

FE2

C432

0.22U

R405

10

33

34

35

36

37

38

39

40

41

GND4

FE2

VBIAS

VDDTX1V5

TX1

TX2

VDDTX2V8

VDDMIX2V8

GND3

R401

10

C413

220N

C438

0.1U

C430

0.1U

VDDRX2V8

VDDRX1V5

VCO_RC

VDDVCO2V8

EN

VDDXO2V8

FSYS1

GND1

20

19

18

17

16

15

14

13

R402

820

X401

4

1

3

2

C416

0.1U

C411

0.1U

C442

0.1U

TP401

TP402

Q

IX

RF_CLK

RF_DA

QX

RF_EN

26MHZ_MCLK

R406

22K

PT401

10K

S1_RF_TEMP

10 9 8 7 6 5 4 3

2 1

H

I

G

L

K

J

D

C

F

E

B

A

2 1




12 11 10 9 8 7 6 5 4 3 2 1

L

G

F

E

D

C

H

I

K

J

VRF3_2V85 VRF3_2V85

VRF3_2V85

C514

10n

C535

10n

VRF3_2V85

VRF1_2V85

C538

0.1u

C508

10n

C534

0.1u

C529

10n

VRF3_2V85

VAUDIO_2V5

VBT_2V9

VUSB_3V1

C530

1u

C527

2.2u

C528

1u

C503

0.1u

C509

2.2u

VMMC_1V8

C531

2.2u

VIO_2V62

C510

1u

S2_VBAT

VPLL_1V5

C539

0.47u

C521

2.2u

C532

1u

VRF2_1V5

C518

1u

VRF1_2V85

VRF3_2V85 S2_VBAT VSIM_2V9

C504

2.2u

C517

1u

C515

220n

C513

1u

S2_VBAT

VRTC_2V0

100p

C542

0.1u

C512

VRF2_1V5

VSD2_1V8

VSD1_1V5

S2_VBAT

C505

100n

C533

100n

C511

100n

X502

4

1

26MHz

VIO_2V62

VSD1_1V5

C523

22u

DSX321SG-26M

3

2

VIO_2V62

S2_VBAT

BAT_ID

S2_RF_TEMP

TXHB

TXLB

GSM850_RXP

GSM850_RXN

GSM900_RXP

GSM900_RXN

S2_PA_BAND

DCS1800_RXP

DCS1800_RXN

VC1

VC2

PA_EN

PCS1900_RXP

TX_RAMP

PCS1900_RXN

PA_MODE_2

SGR_SIM2_IO

SGR_SIM2_CLK

SGR_SIM2_RST

_DPRAM_INT_S2

_DPRAM_BUSY_S2

VSD2_1V8

C520

10u

C506

10u C540

22u

10uL509

TP501

R509 10K

A18

J10

H11

E13

B19

K9

T_OUT3

T_OUT4

T_OUT5

T_OUT6

T_OUT7

T_OUT8

G19

CLKOUT0

U4

W7

W8

REFR

XOX

XO

V10

U9

V9

CC_IO

CC_CLK

CC_RST

T8

T7

U8

V8

W9

R6

U10

R8

R10

T9

R9

T10

MMCI_CMD

MMCI_DAT0

MMCI_CLK

MMCI_DAT1

MMCI_DAT2

MMCI_DAT3

TDO

TDI

TMS

TCK

TRST_N

RTCK

N5

L5

M5

TRIG_IN

MON1

MON2

R7

U7

FSYS3

FSYS2

A14

A15

A13

C11

A12

A16

VBAT_SD1

VSD1

SD1_FB

SD2_SD1_SUBST

VSS_SD1

SD1_FBL

A11

A10

B9

B10

A9

VBAT_SD2

VSD2

SD2_FB

SD2_FBL

VSS_SD2

C12

B14

B11

B13

B12

C13

SU_GATE

SU_GND

SU_FB

SU_ISENSE

VBAT_SU

VSS_SU

G4

H4

G3

J4

H3

J3

M0

M1

M2

M7

M8

F4

M9

M10

M3

N1

P3

M1

U5

P1

N4

P5

R3

R4

R1

T5

W2

V1

U1

T1

W3

V3

TX2

TX1

RX1

RX1X

RX2

RX2X

PABIAS

PABS

RX3

VDET

PAMODE

RX3X

FE1

FE2

PAEN

RX4

VRAMP

RX4X

U503

SGR_RPWRON_EN

TP504 TP505

C536

15p

L501

100n

L506

100n

C507

15p

L502

100n

L507

100n

VIO_2V62

U14

V17

T14

R13

W16

V16

U12

W15

W14

V15

W13

N18

P19

N19

P15

R14

W18

V18

W17

T15

EBU_AD0

EBU_AD1

EBU_AD2

EBU_AD3

EBU_AD4

EBU_AD5

EBU_AD6

EBU_AD7

EBU_AD8

EBU_AD9

EBU_AD10

EBU_AD11

EBU_AD12

EBU_AD13

EBU_AD14

EBU_AD15

EBU_WR_N

EBU_RD_N

EBU_BC0_N

EBU_BC1_N

S2_DATA[0]

S2_DATA[1]

S2_DATA[2]

S2_DATA[3]

S2_DATA[4]

S2_DATA[5]

S2_DATA[6]

S2_DATA[7]

S2_DATA[8]

S2_DATA[9]

S2_DATA[10]

S2_DATA[11]

S2_DATA[12]

S2_DATA[13]

S2_DATA[14]

S2_DATA[15]

_WR_S2

_RD_S2

_BC0_S2

_BC1_S2

EBU_A0

EBU_A1

EBU_A2

EBU_A3

EBU_A4

EBU_A5

EBU_A6

EBU_A7

EBU_A8

EBU_A9

EBU_A10

EBU_A11

EBU_A12

EBU_A13

EBU_A14

EBU_A15

EBU_A16

EBU_A17

EBU_A18

EBU_A19

EBU_A20

EBU_A21

EBU_A22

EBU_A23

EBU_A24

L16

J19

J16

K17

K18

L17

K15

L18

H19

J17

K16

G18

M16

J18

M18

N15

L15

L19

M15

M19

H18

R16

N17

T19

U17

EBU_CS0_N

EBU_CS1_N

EBU_CS2_N

EBU_CS3_N

EBU_ADV_N

EBU_RAS_N

EBU_CAS_N

EBU_WAIT_N

R17

R19

T17

P18

R18

K19

N16

U18

EBU_SDCLKO

EBU_SDCLKI

EBU_BFCLKO

EBU_BFCLKI

EBU_CKE

U19

U15

P17

U16

T18

R519 22

FCDP_RBN

F18

F32K

OSC32K

RESET_N

E19

D19

F19

TP502

S2_ADD[0]

S2_ADD[1]

S2_ADD[2]

S2_ADD[3]

S2_ADD[4]

S2_ADD[5]

S2_ADD[6]

S2_ADD[7]

S2_ADD[8]

S2_ADD[9]

S2_ADD[10]

S2_ADD[11]

S2_ADD[12]

S2_ADD[13]

S2_ADD[14]

S2_ADD[16]

S2_ADD[17]

_NAND_CS_S2

_RAM_CS_S2

_DPRAM_CS_S2

_RAS_S2

_CAS_S2

S2_SDCLKO

S2_SDCLKI

S2_CKE

S2_FCDP

32.768KHz

FC-135

C541

22p

2 1

C524

22p

IREF1

A_GND

VREF1

B5

B6

A6

VREF2

IREF2

L3

L4

C519

220n

C526

1u

TP506

R504

DNI

NRESET

PO_RESET

M_RESET

PWRON

VRTC_2V0

R508

2K

VRTC_2V0

Q501 3

2

1

R511

10K

SGR_PWR_ON

VIO_2V62

1G NAND(LB/64Mx16bit) +512M SDR SDRAM(8Mx4x16bit)

EUSY0389001, SS

M_RESET

_RAM_CS_S2

VSD2_1V8

VSD2_1V8

S2_DATA[0]

S2_DATA[1]

S2_DATA[2]

S2_DATA[3]

S2_DATA[4]

S2_DATA[5]

S2_DATA[6]

S2_DATA[7]

S2_DATA[8]

S2_DATA[9]

S2_DATA[10]

S2_DATA[11]

S2_DATA[12]

S2_DATA[13]

S2_DATA[14]

S2_DATA[15]

R524

S2_SDCLKI

S2_SDCLKO

S2_CKE

_WR_S2

S2_ADD[13]

S2_ADD[14]

_RAS_S2

_CAS_S2

_BC0_S2

_BC1_S2

VSD2_1V8

S2_ADD[0]

S2_ADD[1]

S2_ADD[2]

S2_ADD[3]

S2_ADD[4]

S2_ADD[5]

S2_ADD[6]

S2_ADD[7]

S2_ADD[8]

S2_ADD[9]

S2_ADD[10]

S2_ADD[11]

S2_ADD[12]

R526 100

_NAND_CS_S2

S2_ADD[16]

S2_ADD[17]

_RD_S2

_WR_S2

S2_FCDP

C544

15p

C543

15p

22

C7

C8

C9

A0

A1

A2

B8

M9

L9

K9

J9

H7

H8

D9

A7

A8

A9

A10

H9

G7

A11

A12

A3

A4

A5

A6

C6

_CE

D5

C5

E5

E6

ALE

CLE

_RE

R__B

D6

F5

_WE

_WP

B3

C4

C3

DQ0

DQ1

DQ2

D4

D3

E4

E3

DQ3

DQ4

DQ5

DQ6

F4

J4

K3

K4

DQ7

DQ8

DQ9

DQ10

M3

M4

L3

L4

DQ11

DQ12

DQ13

DQ14

N3

DQ15

E9

H4

_CS

CLK

G8

F8

D7

D8

CKE

_WED

BA0

BA1

E7

F7

G3

H3

_RAS

_CAS

LDQM

UDQM

U502

VDDQ1

VDDQ2

VDDQ3

D2

F2

K2

VSS1

VSS2

VSS3

VSS4

C2

F9

G2

N4

VSSQ1

VSSQ2

VSSQ3

E2

J2

L2

IO7

IO8

IO9

IO10

IO11

IO12

IO13

IO14

IO15

IO0

IO1

IO2

IO3

IO4

IO5

IO6

J5

L5

J6

L6

J7

L7

J8

L8

K5

M5

K6

M6

K7

M7

K8

M8

VDD1

VDD2

VDD3

VDD4

B4

G9

H2

M2

VCC1

VCC2

B6

N7

VCCQ

N6

VSS5

VSS6

VSS7

B5

N5

N8

C547

470n

S2_DATA[0]

S2_DATA[1]

S2_DATA[2]

S2_DATA[3]

S2_DATA[4]

S2_DATA[5]

S2_DATA[6]

S2_DATA[7]

S2_DATA[8]

S2_DATA[9]

S2_DATA[10]

S2_DATA[11]

S2_DATA[12]

S2_DATA[13]

S2_DATA[14]

S2_DATA[15]

VSD2_1V8

VSD2_1V8

C545

470n

VSD2_1V8

C546

220n

EXT_RESET

VIO_2V62 VRTC_2V0

PO_RESET

NRESET

R516 DNI

6

5

4

7

U501

A1

B1

Y2

GND

VCC

Y1

B2

A2

8

1

2

3

R513 DNI

SGR_RESETN

C502

100n

ON BOARD ARM9 JTAG & ETM INTERFACE

B

A

12 11



10 9 8 7

- 125 -

6 5 4 3 2 1

L

B

A

D

C

F

E

I

H

K

J

G



J

H

G

I

K

L

12 11 10

WLAN+BT+FM

9 8

C608

0

CN601

1

CN602

1

C607

DNI

L602 1.5n

C606

1p close to 3

C688

10uF

C687

0.1u

FB602

R699

0

C699

2.2uF

WLAN_CMD

WLAN_CLK

WLAN_SDIO[3]

WLAN_SDIO[2]

WLAN_SDIO[1]

WLAN_SDIO[0]

WLAN_ENABLE

WLAN_WAKEUP

REG_ON

C698

0.1u

C619

4.7uF

3.3UH

L607

4.7u

L699

1

ANT

14

15

10

11

12

13

2

3

GND5

VDD_WL_PA

4

5

6

7

8

SDIO_CMD

SDIO_CLK

SDIO_DATA_3

SDIO_DATA_2

9

SDIO_DATA_1

SDIO_DATA_0

WL_RST_N

WL_WAKE_B

REG_ON

VBAT_IN

SR_VLX1

SR_VLX1BB

TP699

TP698

TP697

TP696

U601

BT_PCM_CLK

BT_PCM_OUT

BT_PCM_SYNC

BT_PCM_IN

45

44

43

42

VDD_BT_PA

41

32KHZ

GND7

FM_ANT

40

39

38

BT_WAKE_B

BT_HOST_WAKE

BT_GPIO_3

BT_GPIO_4

BT_GPIO_7

35

34

33

37

36

XTALP

XTALN

32

31

TP695

TP694

TP601

CLK32K

FM_ANT

BT_WAKEUP

BT_HOST_WAKEUP

BT_PCM_CLK

BT_PCM_RX

BT_PCM_SYNC

BT_PCM_TX

C689

1uF

FB601

TP693

CLK_IN close to 17

C697

10uF C696

0.1u

C695

0.1u

C694

4.7uF

C693

2.2uF

C692

0.1u

C691

1uF

TP692

BT_ENABLE

FM_R

FM_L

7 6 5

VBAT

LDO for TCXO

2V7_VTOUCH VDD_TCXO

TOUCH_EN

C643

1u

R607

100K

2

3

4

1

U604

VIN

EN1

P2

P1

VOUT1

8

VOUT2

GND

EN2

7

6

5

C646

1u

C647

1u

BT_CLK_REQ

CLK_IN

26MHz TCXO

VDD_TCXO

4

VCC

26MHZ

GND

2

C644

1uF

OUT

TG-5010LH-87N

NC

X601

1

F

E

D

C

B

GND601 ANT601

C626

0

5pL611

C632

18n

C641

0.75p

GSM850 / 900_TX

GSM 1800 / 1900_ TX

GSM850 / 900_RX

GSM 1800 / 1900_ RX

VC1 (FE1) VC2 (FE2)

H

L

L

L

L

H

L

L

C637

47P

C636

47P

VC1

VC2

1

SW602

ANT

G3

COMMON

43

G4

2

100NH

L601

17

ANT

C635

DNI

C612

10n

L609

6.8p

C611

22n

C618

1.2p

C629

0.01U

C614

0.01U

10

12

15

PGND

11

8

14

GND3

GND2

GND1

13

9

BY_CAP2

BY_CAP1

GSM850_900_OUT

DCS_PCS_OUT

GSM850_900_IN

7

TQM7M5005H

U602

TX_EN

VRAMP

6

5

VBATT

BS

4

3

MODE_SELECT

DCS_PCS_IN

2

1

C613

1u

C622

27P

C620

100P

C631

100P

C623

100P

C639

47P

R601

100P

R605

10K

R604

100K

PT601

10K

S2_RF_TEMP

C610

2.7P

C624

2.7P

C628

3.3p

C627

3.3p

C630

4.7p

C617

4.7p

C615

3.9P

C642

3.9P


TXLB

PA_EN

TX_RAMP

S2_PA_BAND

PA_MODE_2

A

12 11 10 9 8 7 6 5

LGE Internal Use Only - 126 -

4 3 2 1

L

F

E

H

I

K

J

G

BT_SEL

R603

10K

SIM2_I2S1_CLK

BT_PCM_CLK

SIM1_I2S1_CLK

SIM2_I2S1_RX

BT_PCM_RX

C633

0.1U

1

2

3

4

NC_A1

SAB

NO_B0

COM_B

U603

NLAST9431MT

COM_D

NO_D0

SCD

NC_C1

12

11

10

9

SIM2_I2S1_WA0

SIM1_I2S1_WA0

BT_PCM_SYNC

SIM1_I2S1_TX

BT_PCM_TX

SIM2_I2S1_TX

SIM1_I2S1_RX

4 3

D

C

B

A

2 1




12 11 10 9 8 7 6

G

F

E

H

I

D

C

L

K

J

S1_DATA[0]

S1_DATA[1]

S1_DATA[2]

S1_DATA[3]

S1_DATA[4]

S1_DATA[5]

S1_DATA[6]

S1_DATA[7]

S1_DATA[8]

S1_DATA[9]

S1_DATA[10]

S1_DATA[11]

S1_DATA[12]

S1_DATA[13]

S1_DATA[14]

S1_DATA[15]

S1_ADD[0]

S1_ADD[1]

S1_ADD[2]

S1_ADD[3]

S1_ADD[4]

S1_ADD[5]

S1_ADD[6]

S1_ADD[7]

S1_ADD[8]

S1_ADD[9]

S1_ADD[10]

S1_ADD[11]

S1_ADD[12]

_WR_S1

_BC1_S1

_BC0_S1

_DPRAM_CS_S1

_RD_S1

_DPRAM_BUSY_S1

_DPRAM_SEM_S1

R704

R709

R711

47K

47K

47K

K7

H6

K8

IO0L

IO1L

G6

J7

K9

J8

IO2L

IO3L

IO4L

IO5L

K10

J9

J10

H10

IO6L

IO7L

IO8L

IO9L

G7

G8

G10

G9

IO10L

IO11L

IO12L

IO13L

F9

H1

F4

G2

IO14L

IO15L

A0L

A1L

J1

H2

G3

K1

A2L

A3L

A4L

A5L

J2

K2

H3

J3

A6L

A7L

A8L

A9L

K3

G4

K6

K4

A10L

A11L

A12L

R__WL

TP701

H4

H5

G5

F3

_UBL

_LBL

_CEL

_OEL

K5

E4

G1

F2

_BUSYL

_SEML

_INTL

0DR0

D2

E3

D1

A5

0DR1

0DR2

0DR3

0DR4

A10

C10

E1

E5

VSS1

VSS2

VSS3

VSS4

E6

E10

F6

J6

VSS5

VSS6

VSS7

VSS8

VSS9

U702

CYDM128B16-55BVXI

IO0R

IO1R

IO2R

IO3R

IO4R

IO5R

F8

E9

D10

IO6R

IO7R

IO8R

IO9R

IO10R

IO11R

IO12R

IO13R

IO14R

IO15R

A0R

A1R

A2R

A3R

A4R

A5R

A10R

A11R

A12R

R__WR

A6R

A7R

A8R

A9R

_UBR

_LBR

_CER

_OER

_BUSYR

_SEMR

_INTR

IRR0

IRR1

NC1

NC2

_SFEN

M__S

VCC1

VCC2

VDDIOL1

VDDIOL2

VDDIOR1

VDDIOR2

F5

J5

H7

F10

B8

E8

A6

D4

J4

C6

H8

H9

F1

E2

A3

D6

B6

A4

C5

B5

B7

D3

B1

B2

A1

C4

B3

A2

B4

D5

C8

A8

D7

C7

A7

C1

C2

C3

C9

D8

B9

A9

F7

E7

D9

B10

TP702

R706

R707

R705

47K

47K

47K

R708

R703

S2_DATA[0]

S2_DATA[1]

S2_DATA[2]

S2_DATA[3]

S2_DATA[4]

S2_DATA[5]

S2_DATA[6]

S2_DATA[7]

S2_DATA[8]

S2_DATA[9]

S2_DATA[10]

S2_DATA[11]

S2_DATA[12]

S2_DATA[13]

S2_DATA[14]

S2_DATA[15]

S2_ADD[0]

S2_ADD[1]

S2_ADD[2]

S2_ADD[3]

S2_ADD[4]

S2_ADD[5]

S2_ADD[6]

S2_ADD[7]

S2_ADD[8]

S2_ADD[9]

S2_ADD[10]

S2_ADD[11]

S2_ADD[12]

_WR_S2

_BC1_S2

_BC0_S2

_DPRAM_CS_S2

_RD_S2

_DPRAM_BUSY_S2

VSD2_1V8

_DPRAM_INT_S2

47K

47K

1V8_SD

VSD2_1V8

SIM1_HS_SPK_L

FM_L

SIM1_HS_SPK_R

FM_R

2V62_VIO

1

2

10


1B0 1A

8

1B1

2B0

S1

2A

7

5

3

4

2B1

GND

S2

VCC

6

9

C714

1U

AMP_IN_L

AMP_IN_R

FM_HS_SEL

B

A

12 11



10 9


VBAT

RCV_P

RCV_N

AMP_IN_L

AMP_IN_R

I2C1_SDA

I2C1_SCL

2V62_VIO

FB701

C701

10u

C712

0.1u

C705

C706

1u

1u

C703 220n

C707 220n

C708

0.1uF

C713

2.2u

E1

D1

INM+

INM-

C1

C2

INL

INR

C3

BYPASS

A1

B2

B3

I2CVDD

SDA

SCL

C704

2.2uF

C709

2.2uF

LSOUT+

LSOUT-

A4

A3

SET

D2

HPL

E3

HPR

E2

0.1uF

C702

C711

27pF

C710

27pF

SPK_P

SPK_N

HSO_L

HSO_R

8 7

- 127 -

6

5 4 3

SPK

SPK_P

SPK_N

47pF

C716

C717

100pF

C715

47pF

VA701 VA702

L704

L703

47n

47n 2

1

CN701

5 4 3

2 1

I

H

G

L

K

J

D

C

F

E

2

OJ701 OJ703 OJ705 OJ702

B

A

1



B

A

G

F

E

D

C

H

I

L

K

J

12 11

VOLUME SIDEKEY

CN801

1

2

3

SIDEKEY_3P_Contact

VA802 VA801 VA803

KEY_COL0

KEY_ROW0

KEY_COL1

CAMERA KEY LOCK KEY

4

3

2

VA805 VA806 VA807

KEY_ROW1

KEY_COL2

KEY_COL3

10

KEY CONN(1.0T SOCKET)

VBAT

KEY_ROW1

KEY_COL0

KEY_COL1

VA811 VA812 VA813

TS_XP

TS_YP

3

4

5

6

10

9

7

8

1

CN805

2

20

19

18

17

16

15

14

13

12

11

24-5804-020-000-829+

END_KEY

TS_XM

TS_YM

VA810

12 11 10


9 8 7

MMC CARD

2V62_VIO

MMC_DET

MMC_D0

MMC_CLK

MMC_CMD

R820 30

C812

820P

C814

DNI

2V9_VMME

C813

1U

G6 G4 G2 COM

8

7

C8

C7

6 C6

5

4

C5

C4

C3 3

2 C2

1

S801

C1

G5 G3 G1 SW

SCHA5B0201

6 5 4 3

TOUCH IC

2V62_VIO

2V7_VTOUCH

2V62_VIO

TS_XP

TS_IRQ

TS_YP

C820

0.1UF

C819

10U

TP802

C821

DNI

C822

DNI

A1

A2

A3

B1

B2

B3

U802

AUX

VDD_REF

X+

PENIRQ-

A0

Y+

TSC2007IYZGR

SDA

A1

X-

SCL

GND

Y-

C1

C2

C3

D1

D2

D3

C823

DNI

C824

DNI

I2C2_SDA

TS_XM

I2C2_SCL

TS_YM

2 1

L

K

J

9

LCD CONNECTOR

DIF_D0

DIF_D1

DIF_D2

DIF_D3

DIF_D4

DIF_D5

DIF_D6

DIF_D7

EVRC14S03Q030100R

9

8

7

6

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

FL803

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

1

2

3

4

4

3

2

1

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

FL805

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

6

7

8

9

EVRC14S03Q030100R

R814

10K

IF_MODE0

2V85_VFM

C817

1U

CN804

8

9

10

11

12

13

14

15

16

17

18

19

20

1

2

3

4

5

6

7

33

32

31

30

29

28

27

26

25

24

23

22

21

40

39

38

37

36

35

34

R817 DNI

IF_MODE0

VA804

EVLC14S02050

LCD_PWM

LCD_ID

MLED

MLED1

MLED2

MLED3

MLED4

MLED5

MLED6

IF_MODE1

DIF_RESET

ENBY0036001

GB042-40S-H10-E3000

IF_MODE1

EVRC14S03Q030100R

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

9

8

7

6

FL804

DIF_CD

DIF_CS

DIF_RD

DIF_WR

R816

10K

8

H

I

G

F

E

MAIN TO SUB CONN(1.5T SOCKET)

VSIM_2V9

SMD,Pb-free_4ch_5p-100ohm-5p,Filter,LCR

FL801

CIF_D7

CIF_D6

CIF_D5

CIF_D4

9

8

7

6

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

1

2

3

4

CIF_D3

CIF_D2

CIF_D1

CIF_D0

CAM_PCLK

CIF_RESET

CIF_PD

9

INOUT_B1

8

7

6

INOUT_B2

INOUT_B3

INOUT_B4

FL802

INOUT_A1

1

INOUT_A2

INOUT_A3

INOUT_A4

2

3

4

5pF

VA808 VA809

SGR_SIM2_CLK

SGR_SIM2_RST

SGR_SIM2_IO

CAM_LDO_EN

CN802

7

8

9

10

11

12

13

14

15

16

17

18

19

20

3

4

5

6

1

2

34

33

32

31

30

29

28

27

26

25

24

23

22

21

38

37

36

35

40

39

I2C2_SCL

I2C2_SDA

CAM_VSYNC

CAM_HSYNC

CAM_MCLK

2V9_SIM

VBAT

2V11_RTC

Clost to CAM CONN

CIF_HSYNC

C811

5p

R805

100

C810

5p

CAM_HSYNC CIF_PCLK

C804

5p

R804

100

C805

5p

CAM_PCLK

CIF_VSYNC

C809

5p

R802

100

C808

5p

CAM_VSYNC CIF_MCLK

C807

5p

R803

100

C806

5p

CAM_MCLK

SG3_SIM1_CLK

SG3_SIM1_RST

SG3_SIM1_IO

7

- 128 -

6 5 4 3

D

C

B

A

2 1



BGA PIN MAP

8. BGA Pin Map

U309(MUIC)

NC

The People Company

8. BGA Pin Map

Challenge 1213




BGA PIN MAP

8. BGA Pin Map

U701(Audio Amp Sub System)

The People Company Challenge 1213



8. BGA Pin Map

BGA PIN MAP


U503(S-Gold Radio)

NC NC NC

NC

NC

NC

NC

NC

NC

NC

NC NC

NC

NC NC

NC

NC

NC NC NC NC NC NC NC

NC NC NC NC NC NC

NC

NC NC

NC NC NC

NC NC

NC

NC

NC

NC

NC NC NC

NC NC

NC NC NC

NC NC

NC

NC

NC NC

NC

NC NC NC

NC

NC

NC

NC NC NC

NC NC

NC NC NC

NC

NC

NC

NC

NC NC

NC

NC

NC NC

NC

NC NC NC NC

NC NC NC NC

NC

NC

NC

NC

NC NC

NC

NC NC NC

NC

NC





BGA PIN MAP

8. BGA Pin Map

U502(1G NAND+512M SDRAM)




BGA PIN MAP

U102(2G NAND+1G SDRAM)

8. BGA Pin Map





8. BGA Pin Map

NC

NC

NC

NC

NC

NC

NC

NC

NC NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC







8. BGA Pin Map

BGA PIN MAP

U702


NC NC

NC

NC

NC

NC

NC NC





8. BGA Pin Map

BGA PIN MAP

U201(PMIC)

NC

NC

NC

NC

NC

NC

NC NC

NC

NC

NC

NC NC

NC

NC



8. BGA Pin Map

BGA PIN MAP

U802(Touch IC)







9. PCB LAYOUT

C N 8 0 1

U307 MIC Bias LDO

- No MIC Sound

U304 MIC Switch

- No MIC Sound

MIC301 MIC

- No MIC Sound



C 5 3 7

L 0 6

C 3 0

U 3 0 4

C 3 0 7 0 4

R 3 0 7

C 3 1 7

C 3 2 1

GX500_MAIN_SPFY0216901_1.0_TOP


9. PCB LAYOUT

U308 Analog Switch

- No Download

U701 Audio subsystem

- No Sound

U309 5 pin u-USB control IC

- No booting, No USB

U303, 305, 703 Analog SW

- No Sound

U310 Single Charger IC

- No Charging

U301 Dual Analog Switch

- No USB Connection

U702 Dual Port Static RAM

- Lock up

U102 Memory for U101

- No booting

U201 PMIC

- No power, No Service

U101 SIM1, Baseband IC- No power on, No Service

U802 Touch IC

- No touch screen

U204 Motor Driver IC

- No vibrator


G N D 6 1 A N T 6 0 1

2 3 6 C

1 1 6 L

1 0 2 B V 1 0 7 N

9 0 2 C

0 4 2 C

8 0 2 C

4 3 3 C

3 3 3 C

1 3 3 C

0 2 3 R

4 1 3 R

9 0 3 U

4 0 2 L

3 0 2 L

V A 2 0 2

V A 2 0 1

2 3 3 C

3 0 3 B F

5 1 3 R

9 1 3 R

8 2 3 C

6 0 3 C

5 0 3 C

7 2 3 C

1 0 7 C

4 1 7 C

3 0 7 U

2 0 8 N

7 3 3 C

4 0 3 R

3 0 3 R

2 0 3 R

1 0 3 R

5 0 3 R

1 0 6 B F

9 8 6 C

1 0 3 U

1 0 6 X

F L 8 0 2 F L 8 0 1

4 0 8 R

1 0 6 P T

4 0 8 C

4 4 6 C

8 0 8 C

0 1 8 C

6 0 8 C

5 0 3 U

3 1 3 C

2 0 8 R

5 0 8 R

3 0 8 R

1 1 2 R

9 0 8 C

1 1 8 C

7 0 8 C

7 0 5 L

2 0 5 L

0 1 3 C

2 0 7 L

1 0 7 L

2 0 7 C

2 0 7 R

0 1 3 R

9 0 7 C

1 0 7 B F

0 1 7 C

1 1 7 C

9 1 3 C

5 1 3 C 8 1 5 C

8 3 5 C

8 0 5 C

5 3 5 C

4 1 5 C

3 0 5 C

4 3 5 C

5 9 6 P T

4 9 6 P T

3 9 6 P T

2 9 6 P T

4 0 6 L

2 1 6 C

8 1 6 C 5 3 6 C 9 0 6 L 1 1 6 C

F L 1

0 1 6 L 2 1 6 L 3 0 6 L 5 0 6 L

9 2 5 C

8 2 5 R

6 2 5 R

4 2 5 C 1 4 5 C

X 5 0 1

1 0 6 T P

4 0 6 R

3 1 6 C

2 2 6 C

0 4 6 C

0 2 6 C

9 3 6 C

7 2 5 C

7 1 5 C

6 0 5 C

2 3 5 C

5 0 5 R

6 2 5 C

6 1 5 C

1 3 5 C

3 0 5 R

0 3 5 C

3 1 5 C

9 3 2 C

9 1 2 C

1 2 5 C

8 2 5 C

9 1 5 C

9 3 5 C

0 2 5 C

F L 2 0 1

C 2 3 8

C 2 1 8

C 2 0 1

D 2 0 1

7 1 2 C

5 0 2 C

2 0 2 D

L 2 0 2

9 9 6 L

9 1 6 C

7 4 2 C

1 4 2 C

8 1 7 C

5 0 7 R

6 0 7 R

7 0 7 R

3 0 7 R

8 0 7 R

4 0 7 R

1 0 2 B F

2 1 1 P T

2 0 7 U

7 4 6 C

6 4 6 C

2 9 6 C

1 0 1 R

3 1 1 R

9 0 1 P T

1 1 1 P T

6 0 1 P T

7 0 1 R

4 0 1 R

6 4 2 C

2 1 2 C

4 1 2 C

7 1 2 R

7 0 2 C

1 2 2 C

7 0 2 R

5 0 2 R

2 1 2 R

7 3 2 C

6 4 1 C

3 2 1 C

8 2 1 C

4 2 1 C

4 1 1 C

2 2 1 C

3 0 1 P T

1 1 1 C

1 3 1 C

0 3 1 C

2 0 1 R

1 1 1 R

2 1 1 R

1 2 1 C

7 3 1 C

0 1 1 R

9 0 1 R

2 4 1 C

2 3 1 C

7 0 1 P T

2 0 1 P T

8 0 1 P T

1 0 1 L

3 0 1 L

5 4 1 C

9 3 1 C

U 1 0 2

9 4 1 C

2 0 1 L

7 1 1 R

5 0 1 C

0 2 1 R

9 1 2 R

8 1 1 R

8 1 2 R

L 5 0 4 L 5 0 9

3 2 5 C

1 1 5 R

2 1 5 R

3 1 5 R

4 0 1 C

3 1 1 C

5 3 1 C

9 1 1 R

5 1 1 R

6 1 1 R

6 0 1 C

1 4 1 C

2 1 1 C

U 5 0 1

2 0 5 C

2 0 5 R

6 0 5 P T

3 3 6 C 5 0 2 A V

2 0 2 R

1 0 2 R

3 0 2 R

4 0 5 R

5 0 2 U

0 4 5 C

4 0 2 A V

V A 8 0 3

V A 8 0 1

V A 8 0 2

7 1 8 C

1 0 8 P T

6 0 2 P T

2 0 8 P T

2 0 8 U

0 2 8 C

3 2 2 R

7 0 8 A V

6 0 8 A V

5 0 8 A V

4 3 4 C

4 1 4 C

7 1 4 C 6 0 4 L 0 1 4 C 3 3 4 C

8 2 4 C

4 0 4 L

5 1 2 C

1 0 4 X

6 0 4 C

2 4 4 C

1 1 4 C

2 0 4 R

9 1 4 C

6 1 4 C

U

2 0 4 L 8 0 4 L 1 0 4 L 5 0 4 L

F

4

L

0

4

1

0 1

3 1 8 A V

2 1 8 A V

1 1 8 A V

2 2 8 C

1 2 8 C

C N 2 0 1

9 0 8 R 5 1 8 R

3 1 8 R

9 4 2 C

8 4 2 C

8 0 8 R

7 0 8 R

1 1 8 R

3 1 8 C

6 3 4 C

0 4 4 C

A N T 4 0 1 G N D 4 0 2

GX500_MAIN_SPFY0216901_1.0_BOT

- 140 -

U503 SIM2, Baseband IC

- No Power On

- No Service

U502 Memory for U503

- No Booting

U302 Dual Analog Switch

- No UART

Q501 TR

- SIM2, No Booting

Q201 Dual TR

- No power on

U205 Charge pump

- No LCD Backlight

U501 Dual AND Gate

- SIM2 No Booting

U203 3axis accelerometer

- No Swivel detect



9. PCB LAYOUT

SIM1 RF

SIM2 RF

BT/WI-FI/FMR

X601 26MHz TCXO

- No BT, WiFi, FM radio

U601 WiFi(b/g)+BT2.1+FM Rx


U604 Dual LDO


X401 SIM1 26MHz X-TAL

- No power on, No service

U402 SIM1 EDGE PAM

- SIM1 no Service

- RF Sensitivity & TX Power



G N D 6 0 A N T 6 0 1

2 3 6 C

1 1 6 L

1 0 2 B V 1 0 7 N

9 0 2 C

0 4 2 C

8 0 2 C

4 3 3 C

3 3 3 C

1 3 3 C

0 2 3 R

4 1 3 R

9 0 3 U

4 0 2 L

3 0 2 L

V A 2 0 2

V A 2 0 1

2 3 3 C

3 0 3 B F

5 1 3 R

9 1 3 R

8 2 3 C

6 0 3 C

5 0 3 C

7 2 3 C

1 0 7 C

4 1 7 C

3 0 7 U

2 0 8 N

7 3 3 C

4 0 3 R

3 0 3 R

2 0 3 R

1 0 3 R

5 0 3 R

1 0 6 B F

9 8 6 C

1 0 3 U

1 0 6 X

F L 8 0 2 F L 8 0 1

4 0 8 R

1 0 6 P T

4 0 8 C

4 4 6 C

8 0 8 C

0 1 8 C

6 0 8 C

5 0 3 U

3 1 3 C

2 0 8 R

5 0 8 R

3 0 8 R

1 1 2 R

9 0 8 C

1 1 8 C

7 0 8 C

7 0 5 L

2 0 5 L

0 1 3 C

2 0 7 L

1 0 7 L

2 0 7 C

2 0 7 R

0 1 3 R

9 0 7 C

1 0 7 B F

0 1 7 C

1 1 7 C

9 1 3 C

5 1 3 C 8 1 5 C

8 3 5 C

8 0 5 C

5 3 5 C

4 1 5 C

3 0 5 C

4 3 5 C

5 9 6 P T

4 9 6 P T

3 9 6 P T

2 9 6 P T

4 0 6 L

2 1 6 C

8 1 6 C 5 3 6 C 9 0 6 L 1 1 6 C

F L 1

0 1 6 L 2 1 6 L 3 0 6 L 5 0 6 L

9 2 5 C

8 2 5 R

6 2 5 R

4 2 5 C 1 4 5 C

X 5 0 1

1 0 6 T P

4 0 6 R

3 1 6 C

2 2 6 C

0 4 6 C

0 2 6 C

9 3 6 C

7 2 5 C

7 1 5 C

6 0 5 C

2 3 5 C

5 0 5 R

6 2 5 C

6 1 5 C

1 3 5 C

3 0 5 R

0 3 5 C

3 1 5 C

9 3 2 C

9 1 2 C

1 2 5 C

8 2 5 C

9 1 5 C

9 3 5 C

0 2 5 C

F L 2 0 1

C 2 3 8

C 2 1 8

C 2 0 1

D 2 0 1

7 1 2 C

5 0 2 C

2 0 2 D

L 2 0 2

9 9 6 L

9 1 6 C

7 4 2 C

1 4 2 C

8 1 7 C

5 0 7 R

6 0 7 R

7 0 7 R

3 0 7 R

8 0 7 R

4 0 7 R

1 0 2 B F

2 1 1 P T

2 0 7 U

7 4 6 C

6 4 6 C

2 9 6 C

1 0 1 R

3 1 1 R

9 0 1 P T

1 1 1 P T

6 0 1 P T

7 0 1 R

4 0 1 R

6 4 2 C

2 1 2 C

4 1 2 C

7 1 2 R

7 0 2 C

1 2 2 C

7 0 2 R

5 0 2 R

2 1 2 R

7 3 2 C

6 4 1 C

3 2 1 C

8 2 1 C

4 2 1 C

4 1 1 C

2 2 1 C

3 0 1 P T

1 1 1 C

1 3 1 C

0 3 1 C

2 0 1 R

1 1 1 R

2 1 1 R

1 2 1 C

7 3 1 C

0 1 1 R

9 0 1 R

2 4 1 C

2 3 1 C

7 0 1 P T

2 0 1 P T

8 0 1 P T

1 0 1 L

3 0 1 L

5 4 1 C

9 3 1 C

U 1 0 2

9 4 1 C

2 0 1 L

7 1 1 R

5 0 1 C

0 2 1 R

9 1 2 R

8 1 1 R

8 1 2 R

L 5 0 4 L 5 0 9

3 2 5 C

1 1 5 R

2 1 5 R

3 1 5 R

4 0 1 C

3 1 1 C

5 3 1 C

9 1 1 R

5 1 1 R

6 1 1 R

6 0 1 C

1 4 1 C

2 1 1 C

U 5 0 1

2 0 5 C

2 0 5 R

6 0 5 P T

3 3 6 C 5 0 2 A V

2 0 2 R

1 0 2 R

3 0 2 R

4 0 5 R

5 0 2 U

0 4 5 C

4 0 2 A V

V A 8 0 3

V A 8 0 1

V A 8 0 2

7 1 8 C

1 0 8 P T

6 0 2 P T

2 0 8 P T

2 0 8 U

0 2 8 C

3 2 2 R

7 0 8 A V

6 0 8 A V

5 0 8 A V

4 3 4 C

4 1 4 C

7 1 4 C 6 0 4 L 0 1 4 C 3 3 4 C

8 2 4 C

4 0 4 L

5 1 2 C

1 0 4 X

6 0 4 C

2 4 4 C

1 1 4 C

2 0 4 R

9 1 4 C

6 1 4 C

U

2 0 4 L 8 0 4 L 1 0 4 L 5 0 4 L

F

4

L

0

4

1

0 1

3 1 8 A V

2 1 8 A V

1 1 8 A V

2 2 8 C

1 2 8 C

C N 2 0 1

9 0 8 R 5 1 8 R

3 1 8 R

9 4 2 C

8 4 2 C

8 0 8 R

7 0 8 R

1 1 8 R

3 1 8 C

6 3 4 C

0 4 4 C

A N T 4 0 1 G N D 4 0 2

GX500_MAIN_SPFY0216901_1.0_BOT

- 141 -

FL1 SIM2 FEM

- SIM2 no Service


U602 SIM2 EDGE PAM

- SIM2 No service

- No power on

X502 SIM2 26MHz X-TAL

- No power on, No service

U603 Quad DPDT Analog Switch

- No BT

U401 SIM1 GPRS, EDGE TRANSCEIVER

- no Service


FL401 SIM1 FEM

- SIM2 no Service



9. PCB LAYOUT

R113


GX500_F_SUB_SPCY0225601_1.0_TOP



9. PCB LAYOUT

40

101 CN

21

20

S101

4

0

3

R11

C10

U10

9 R10

1

FB

FB

101

102

C10

9

0

C10

C11

2 S10



GX500_F_SUB_SPCY0225601_1.0_BOT


9. PCB LAYOUT


SEND

MENU

END

GX500 F_KEY SPCY0212301_1.0_TOP



9. PCB LAYOUT

10

102 CN

6

5



GX500 F_KEY SPCY0212301_1.0_ BOT




VI. RF Calibration

10.1 Test Equipment Setup

4.00 V 0.000 A

10.2 Calibration Step

2.1. Turn on the Phone.

2.2. Execute “HK_34.exe”





10. RF CALIBRATION


2.3. Click “SETTING” Menu

2.4. Setup “Ezlooks” menu such as the following figure






2.5. Setup “Line System” menu such as the following figure

Adjust number of times

Setup Logic operation such as the following figure.

Setup UART port

PWR: Power supply

CELL: Call Test Equipment

Operation Mode

1. By-Pass: not control by GPIB

2. Normal: control by GPIB







2.7. Select “MODEL”.

2.8. Click “START” for RF calibration

2.9. RF Calibration finishes.






2.10. Calibration data will be saved to the following folder.

Saving Format:

Year/month/day_pass or fail

Notices:

1. The state of Phone is “ test mode “ during the CALIBRATION.

2. Calibration program automatically changes either “normal mode” or “ptest mode”.

3. RF Calibration steps as follow:

TX Channel compensation:

SIM1:DCS1800->GSM900->PCS1900->GSM850->EDGE_PCS1900->EDGE_GSM850->

EDGE_GSM900->EDGE_DCS1800

SIM2: DCS1800->GSM900->PCS1900->EDGE_PCS1900->EDGE_GSM900->EDGE_DCS1800

RX Channel compensation:

SIM1 :EGSM->GSM850->DCS->PCS

SIM2 :EGSM->DCS->PCS

< Normal Mode > < Ptest Mode>





11. STAND ALONE TEST



VII. Stand-alone Test

11.1 SIM1 TEST

11.1.1 Test Program Setting

ྙG Set COM Port.

ྚG Check PC Baud rate.

ྛG Confirm EEPROM & Delta file prefix name.

ྙ ԙ

Ԛ




ྜG Click “Update Info” for communicating Phone and Test-Program.

Not Connected

ԛ

Connected







ྜྷ For the purpose of the Standalone Test, Change the Phone to “ptest mode” and then Click the “Reset” bar.

ྞ Select “Non signaling” in the Quick Bar menu. Then Standalone Test setup is finished. ԝ

Ԝ

Change “ptest mood”






11.1.2 Tx Test

ྙ Click “Non signaling mode” bar and then confirm “OK” text in the command line.

Ԙ

G







ྚ Put the number of TX Channel in the ARFCN.

ྛ Select “Tx” in the RF mode menu and “PCL” in the PA Level menu.

ྜ Finally, Click “Write All” bar and try the efficiency test of Phone. ԛ ԙ

G

Ԛ

G






11.1.3 Rx Test

ྙ Put the number of RX Channel in the ARFCN.

ྚ Select “Rx” in the RF mode menu.

ྛ Finally, Click “Write All” bar and try the efficiency test of Phone.

Ԛ

G

Ԙ

G ԙ

G







ྜ The Phone must be changed “normal mode” after finishing Test.

ྜྷ Change the Phone to “normal mode” and then Click the “Reset” bar.\

Ԝ

G ԛ

Change “normal mode “






11.2 SIM2 TEST

11.2.1 Test Program Setting

ྙ AT%uartpath=1(Connected SIM2)

ྚ Same with SIM1.

11.2.2 SIM2 Tx Test

ྙ Click “PowerRamp” bar

ྙ







ྚ Select Frequency Band

ྛ Put the number of TX Channel in the ARFCN.

ྜ Finally, Click “Power Level” bar and try the efficiency test of Phone.

11.2.3 Rx Test

Same with SIM1




- Factory Mode

[1] Device Test

[1-1] Function Test

[1-2] Main LCD

[1-3] LCD Backlight

[1-4] Key Backlight

[1-5] Speaker

[1-6] Vibrator

[1-7] Camera

[1-8] MicRcv

[1-9] Keypad

[1-10] Motion Sensor Test

[2] ELT Mode

[2-1] AutoMatic

[2-2] Manual

[2-2-1] LCD Backlight

[2-2-2] Ringtones

[2-2-3] Vibrator

[2-2-4] Camera

[2-2-5] Auto Loopback

[2-2-6] Ring & Vibrator

[3] SW Sanity Test

[3-1] E Serial NO

[3-2] UA.Strung

[3-2-1] Browser Setting

[3-2-2] Push Dump

[3-2-3] Send Message

[3-2-1] Savepage Dump

[3-3] Unlock SIM

[4] Version

[5] Factoru Reset

Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “1809#*500# “.

Pressing END will switch back to non-engineering mode operation. Drag a screen to select a menu and press ‘OK’ to progress the test. Pressing ‘BACK’ will switch back to the original test menu.

Engineering mode(Test Mode) can be divided by ‘Factory Mode’ and ‘Eng Mode’

- Eng Mode

[1] Usage Info

[1-1] Call Timer

[1-2] User Tendency

[1-3] Usage Tracking

[2] Eng Mode

[2-1] Device Info

[2-1-1] Battery info

[2-1-2] LCD Info

[2-1-3] Firmware Info

[2-2] Audio Tunning

[2-2-1] Handset

[2-2-2] Headset

[2-2-3] Speaker Phone

[2-2-4] Bluetooth Headset

[2-2-5] Tunning Info

[2-2-6] Default

[2-2-7] Save to File

[2-3] Audio Tunning Remote

[2-3-1] Handset

[2-3-2] Headset

[2-3-3] Speaker Phone

[2-3-4] Bluetooth Headset

[2-3-5] Tunning Info

[2-3-6] Default

[2-3-7] Save to File

[2-4] UART Setting

[2-4-1] Auto

[2-4-2] AT CMD

[2-4-3] UART Info

[2-5] BT Testing

[2-5-1] Audio Test

[2-5-2] RF Test

[2-6] WLAN Service

[2-6-1] Net Info

[2-6-2] Rx Tx Test

[2-6-3] Open

[2-6-4] IP Configuration

[2-6-5] Available Net

[2-6-6] OTA Mode ON

[2-6-7] OTA Mode OFF

[2-6-8] Iperf Test

[2-6-9] Close

[2-6-10] Disconnect

[2-7] Defect Report System

[3] Band Select

[4] Band Select Remote

[5] Network Info

[6] Others

[6-1] Bluetooth test Mode

[6-2]Aging Test

[6-3] Touch Screen Test

[6-4] FM Radio Test

[6-5] Debug Test

[6-6] Keytone Aging

[6-7] Touch Calibration

[6-8] Common Test

[6-9] Trace Option

[6-10] FPRI Test

[6-11] Bypass Booting Mode

[6-12] FXUI Debug Setting







13. EXPLODED VIEW & REPLACEMENT PART LIST

13.1 EXPLODED VIEW

MWAC00

SVLM00 MBJZ00 AFBZ00

SUSY00

SAFY00

SJMY00

ACKA00

SACY00

SNGF01 ACGM00 SBPP00 ACGA00

GMEY00

ACGK00 AKAC00 ABFZ00

SACY00 GMZZ00

MBJZ01 SPKY00 SNGF00







3

2

3

4

4

5

5

5

5

5

13.2 Replacement Parts

<Mechanic component>

Level

1

Location

No.

Description

GSM,BAR/FILP

2

3

4

AAAY ADDITION

ACGA00 COVER ASSY,BATTERY

MCJA00 COVER,BATTERY

4 MDAY00 DECO

5

5

5

5

4

5

6

6

6

MLAZ00 LABEL

APEY PHONE

ACGY00 COVER ASSY,EMS

000 ANTENNA,GSM,FIXED

ACGM COVER ASSY,REAR

000 PAD

MCCF00 CAP,MOBILE SWITCH

MCJN00 COVER,REAR

MLEY00 LOCKER

MPBT00 PAD,CAMERA

MPBU00 PAD,CONNECTOR

MPBZ00 PAD

MTAK00 TAPE,CAMERA

MWAE00 WINDOW,CAMERA

ACGV COVER ASSY,BAR

ABFZ00 BRACKET ASSY

MFEZ00 FRAME

MTAZ00 TAPE

MTAZ01 TAPE

Note: This Chapter is used for reference, Part order is ordered

by SBOM standard on GCSC

Part Number

TGSM0077102

AAAY0460209

ACGA0036601

Spec

MCJA0105401 MOLD, PC LUPOY SC-1004A, , , , ,

MDAY0056701 ELECTROFORMING, Cu, , , , ,

MLAZ0050901 PRINTING, (empty), , , , ,

APEY0886706

ACGY0013806

SNGF0057001

3.0 ,-2.0 dBd,, ,internal, GSM900/1800/1900 ,; ,TRIPLE ,-

5.0 ,50 ,3.0

ACGM0151101

WITHOUT

COLOR

BLACK

BLACK

BLACK

MPBZ0266704 COMPLEX, (empty), , , , ,

MCCF0068001 MOLD, PC LUPOY SC-1004A, , , , ,

MCJN0116001

MLEY0004801

MPBT0089201

MOLD, PC LUPOY SC-1004A, , , , ,

MOLD, PC LUPOY SC-1004A, , , , ,

COMPLEX, (empty), , , , ,

MPBU0092801 COMPLEX, (empty), , , , ,

MPBZ0266701

MTAK0035301



MWAE0057001 CUTTING, PMMA MR 200, , , , ,

ACGV0014102

ABFZ0022601

MFEZ0025701

MTAZ0281801

MTAZ0311401

TAPE PROTECTION CHANGE CIS->OPEN

PRESS, STS, , , , ,



WITHOUT

COLOR

BLACK

BLACK

BLACK

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

BLACK

BLACK

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

Color

BLACK

BLACK

BLACK

BLACK

WITHOUT

COLOR

Remark





6

6

6

6

6

Level

5

6

Location

No.

Description

ACGK00 COVER ASSY,FRONT

MCJK00 COVER,FRONT

MDAY00 DECO

MDAY01 DECO

MFBZ00 FILTER

MFBZ01 FILTER

MICE00 INSERT,NUT

Part Number

ACGK0152801

Spec

MCJK0121601 MOLD, PC LUPOY SC-1004A, , , , ,

MDAY0056301 PRESS, STS, , , , ,

MDAY0056201 MOLD, PC LUPOY SC-1004A, , , , ,

MFBZ0010901 COMPLEX, (empty), , , , ,

MFBZ0015001 COMPLEX, (empty), , , , ,

MICE0014101 PRESS, STS, , , , ,

6

6

6 MPBG00 PAD,LCD MPBG0104801 COMPLEX, (empty), , , , ,

MPBJ0075802 COMPLEX, (empty), , , , , 6

6

MPBJ00 PAD,MOTOR

MPBZ00 PAD

6

6

MTAA00 TAPE,DECO

MTAA01 TAPE,DECO


MTAA0214001

MTAA0213901



6

6

6

6

6

6

6

6

6

6

6

5

MTAD00 TAPE,WINDOW

AFBZ00 FRAME ASSY

ACFA

CONTACT ASSY,SIDE

BUTTON

MBJZ00 BUTTON

MBJZ01 BUTTON

MCCG00 CAP,MULTIMEDIA CARD

MCCZ00 CAP

MDAY00 DECO

MDAY01 DECO

MDAY02 DECO

MFEZ00 FRAME

MGDZ00 GUIDE

MTAD0121101 COMPLEX, (empty), , , , ,

AFBZ0017401

ACFA0000302 2Button Type

MBJZ0021901 MOLD, PC LUPOY SC-1004A, , , , ,

MBJZ0021801 MOLD, PC LUPOY SC-1004A, , , , ,

MCCG0024201 MOLD, PC LUPOY SC-1004A, , , , ,

MCCZ0036201 MOLD, PC LUPOY SC-1004A, , , , ,




MFEZ0025601 MOLD, PC LUPOY SC-1004A, , , , ,

MGDZ0000601 PRESS, STS, , , , ,

MTAB00 TAPE,PROTECTION

MTAZ00 TAPE

MTAB0371301 COMPLEX, (empty), , , , ,

MTAZ0281601 COMPLEX, (empty), , , , ,

LGE Internal Use Only - 166 -

BLACK

BLACK

BLACK

BLACK

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

Color

BLACK

BLACK

WITHOUT

COLOR

BLACK

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

BLACK

WITHOUT

COLOR

BLACK

BLACK

BLACK

BLACK

Remark




Level

5

5

5

5

7

5

5

5

4

5

5

5

5

5

5

4

4

4

6

3

Location

No.

MPBZ00 PAD

MTAB00 TAPE,PROTECTION

MTAZ01 TAPE

MTAZ02 TAPE

MWAC00 WINDOW,LCD

ADCA00 DOME ASSY,METAL

MCBA00 CAN,SHIELD

MLAB LABEL,A/S

MLAZ00 LABEL

Description

AKAC00 KEYPAD ASSY,MAIN

GMZZ00 SCREW MACHINE

ACKA00 CAN ASSY,SHIELD

MPBZ00 PAD

MPBZ01 PAD

MTAZ00 TAPE

GMEY SCREW MACHINE,BIND

MLAZ00 LABEL

MTAZ00 TAPE

MLAZ00 LABEL

MLAA00 LABEL,APPROVAL

Part Number

AKAC0007301 SEND, END

Spec

GMZZ0019005

3.5 mm,1.5 mm,MSWR3 ,N ,+ ,- ,NYLOK Coating , , , , , ,

, , ,


Color

BLACK

WITHOUT

COLOR

WITHOUT

COLOR

Remark

MTAB0394602 COMPLEX, (empty), , , , ,

MTAZ0311501

MTAZ0311601



MWAC0135201 CUTTING, PMMA MR 200, , , , ,

ADCA0110501

ACKA0024201

MCBA0066501 PRESS, STS, , , , ,

MLAB0001102

MLAZ0054301

MPBZ0266703

MPBZ0266702

MTAZ0282201

C2000 USASV DIA 4.0

PRINTING, (empty), , , , ,




WITHOUT

COLOR

WITHOUT

COLOR

BLACK

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WHITE

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR

MLAZ0038303

MTAZ0311602

MLAZ0038301

MLAA0062304

PRINTING, (empty), , , , ,


PID Label 4 Array


BLACK

White

WITHOUT

COLOR

WITHOUT

COLOR

WITHOUT

COLOR





5

6

7

7

7

7

7

7

7

7

5

5

5

6

6

7

5

4

8

6

5

13.2 Replacement Parts

<Main component>

Level

4

Location

No.

0000

Description

CAMERA

8

7

111 ANTENNA,GSM,FIXED

SNGF01 ANTENNA,GSM,FIXED

SACY00 PCB ASSY,FLEXIBLE

SACB0062101

SACE00 PCB ASSY,FLEXIBLE,SMT SACE0098801

SACC0073201

CN102

CONNECTOR,BOARD TO

BOARD

CN101

SPCY

CONNECTOR,BOARD TO

BOARD

PCB,FLEXIBLE

SVLM00 LCD MODULE

SACY PCB ASSY,FLEXIBLE



Part Number Spec

SVCY0024701 CMOS ,MEGA ,3M FF SS-LSI(1/5"), 7x7x4.1t,Socket

SNGF0057103

3.0 ,-5.0 dBd,, ,internal, GSM850/GSM901/DCS/PCS ,;

,QUAD ,-5.0 ,50 ,3.0

SNGF0058502 3.0 ,-5.0 dBd,, ,internal, BT/WiFi ,; ,SINGLE ,-5.0 ,50 ,3.0

SACY0109101

ENBY0052001

10 , mm,STRAIGHT , , ,; , ,0.40MM ,[empty] ,FEMALE

,[empty] ,[empty] , ,

SACD0086201

ENBY0053501

20 , mm,STRAIGHT , , ,; , ,0.40MM ,[empty] ,MALE


SPCY0212301 POLYI ,0.4 mm,MULTI-3 , ,; , , , , , , , , ,

SVLM0035201

Main ,3.0 inch ,240*400 ,43.08*75.4*1.8t ,262K ,TFT ,TM

,S6D14E0 , ,

SACY0110701

Color

SACB0062601

Remark

SACE00 PCB ASSY,FLEXIBLE,SMT SACE0100101

BAT101 MODULE,ETC

C101

C102

C103

C105

C109

C110

C112

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

SACC0074201

SMZY0023501 3.8 Backup Capacitor 0.03F ,; ,Module Assembly

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP


ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP


ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP





6

5

6

6

4

6

7

7

7

7

6

5

6

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

CN101

Description

CONNECTOR,BOARD TO

BOARD

FB101 FILTER,BEAD,CHIP


R109

R110

S101

RES,CHIP,MAKER

RES,CHIP

CONN,SOCKET

7 S102 CONN,SOCKET

7 U104 IC


ENBY0035901 40 PIN,0.4 mm,ETC , ,H=1.0, Plug

SFBH0007102 10 ohm,1005 ,Ferrite Bead


ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP

ENSY0022201 24 ,ETC , , mm,7*7, 1.3M (1/5") Socket Type

ENSY0025301

12 ,ETC , ,1.27 mm,28.5x15.5x3.9t, Tray Type Side Dual

SIM socket

EUSY0407401

WDFN8L ,8 ,R/TP ,Programmable Dual LDO ,; ,IC,LDO

Voltage Regulator

C106

C111

R112

R113

SPCY00 PCB,FLEXIBLE

SAFY PCB ASSY,MAIN

SAFB PCB ASSY,MAIN,INSERT

SJMY00 VIBRATOR,MOTOR

SPKY

SUSY00 SPEAKER

SAFF

SAFC

C307

C311

C316

C317

C318

C320

C321

C501

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

RES,CHIP

RES,CHIP

PCB,SIDEKEY

PCB ASSY,MAIN,SMT

PCB ASSY,MAIN,SMT

BOTTOM

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

SACD0087201



ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP

ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP

SPCY0225601 POLYI ,0.4 mm,BUILD-UP 4 , ,; , , , , , , , , ,

SAFY0377501

SAFB0110801

SJMY0008513 2 V, A,10*3.6 ,175hz linear 17mm ,; ,3V , , , , , , ,

SPKY0082101 POLYI ,0.18 mm,DOUBLE , ,; , , , , , , , , ,

SUSY0028901

ASSY ,8 ohm,90 dB,1812 mm,3.0T 10mm ,; , , , , , ,

,[empty]

SAFF0279301

SAFC0140601




ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP





Color Remark





7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

6

Level

7

Location

No.

C536

Description

CAP,CERAMIC,CHIP

7

7

7

7

7

7

C537

L303

L304

L501

L506

CAP,CHIP,MAKER


INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

7

7

7

7

Part Number

ECCH0000112

ECZH0003103

SFBH0007102

ELCH0005009

ELCH0005009

ELCH0001430

ELCH0001430

Spec

15 pF,50V,J,NP0,TC,1005,R/TP

0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP

10 ohm,1005 ,Ferrite Bead

100 nH,J ,1005 ,R/TP ,

100 nH,J ,1005 ,R/TP ,

100 nH,J ,1005 ,R/TP ,PBFREE

100 nH,J ,1005 ,R/TP ,PBFREE

MIC301 MICROPHONE

R307

R326

RES,CHIP,MAKER

PCB ASSY,MAIN,PAD

SHORT

ERHZ0000406

SAFP0000501

100 Kohm,1/16W ,J ,1005 ,R/TP

U304

U307

IC

IC

C109

C110

C111

C112

C105

C106

C107

C108

VA301 VARISTOR

VA302 VARISTOR

SAFD PCB ASSY,MAIN,SMT TOP

C101

C102

C103

C104

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C113

C114

C115

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

EUSY0340301 uMLP ,10 PIN,R/TP ,typ Rdson 0.4ohm, 1.4X1.8 ,;

,IC,Analog Switch

EUSY0407501

SSON004 ,4 ,R/TP ,1.8V 150mA Single LDO ,; ,IC,LDO

Voltage Regulator

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SAFD0138301














ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP


Color Remark




7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

C116

Description

CAP,CHIP,MAKER

7

7

7

7

C117

C118

C119

C120

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C121

C122

C123

C124

C125

C126

C127

C128

C129

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C139

C140

C141

C142

C143

C144

C145

C146

C147

C130

C131

C132

C133

C134

C135

C136

C137

C138

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP























ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP


ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP











- 171 -

Color Remark



7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

7

Location

No.

C148

Description

CAP,CHIP,MAKER

C149 CAP,CERAMIC,CHIP

7 C201 CAP,CERAMIC,CHIP

7

7

C202

C203

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C204

C205

C206

C218

C219

C220

C221

C222

C223

C224

C225

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,TANTAL,CHIP



C209

C210

C211

C212

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C213 CAP,CHIP,MAKER

C214

C215

C216

C217

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP





ECCH0005604

10000000 pF,6.3V ,M ,X5R ,TC ,1608 ,R/TP , , ,[empty]

,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm



ECCH0005604




ECTH0005702

100 uF,6.3V ,M ,L_ESR ,3216 ,R/TP ,; , ,[empty] ,[empty]

, ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]


ECCH0005604





ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP


ECZH0025502

22000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP ,; ,0.85t

,[empty] ,[empty] ,[empty] ,[empty] ,[empty] ,[empty]


ECCH0005603 2.2 uF,10V ,K ,X5R ,TC ,1608 ,R/TP



ECCH0005604




ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP





ECCH0007803

10 uF,10V ,M ,X5R ,HD ,1608 ,R/TP ,; , ,[empty] ,[empty]

,[empty] ,[empty] ,[empty] ,[empty] ,0.8 mm

ECCH0005604



Color Remark




7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

C227

Description

CAP,CERAMIC,CHIP

7

7

7

7

C228

C229

C230

C232

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C233

C234

C235

C236

C237

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP


7

7

C239

C240

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER


C246

C247

C248

C249

C250

C242

C243

C244

C245

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C251 CAP,CHIP,MAKER

C252

C253

C254

C255

C256

C301

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP












ECCH0005604





ECCH0007803












ECZH0001120

3.9 nF,50V ,K ,X7R ,HD ,1005 ,R/TP , , ,[empty] ,[empty]

,[empty] ,[empty] ,[empty] ,[empty]





ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP


Color Remark





7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

C302

Description

CAP,CHIP,MAKER

7

7

7

7

C303

C304

C305

C306

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C310

C312

C313

C314

C315

C319

C324

C325

C326

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C337

C338

C405

C406

C407

C408

C409

C410

C411

C327

C328

C329

C330

C331

C332

C333

C334

C336

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

INDUCTOR,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

INDUCTOR,CHIP

CAP,CHIP,MAKER








ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP













ECZH0003504 100 nF,25V ,K ,X7R ,HD ,1608 ,R/TP





ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP


ELCH0001412 1.8 nH,S ,1005 ,R/TP ,PBFREE



ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECZH0000839 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ELCH0003819 12 nH,J ,1005 ,R/TP ,


- 174 -

Color Remark




7

7

7

7

7

7

C429

C430

C431

C432

C425

C426

C427

C428

C433

C434

C435

C436

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

C412

Description

CAP,CHIP,MAKER

7

7

7

7

C413

C414

C415

C416

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C417

C418

C419

C420

C421

C422

C423

C424

INDUCTOR,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

INDUCTOR,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

INDUCTOR,CHIP

C437 CAP,TANTAL,CHIP

C438

C439

C440

C441

C442

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER







ELCH0003839 22 nH,J ,1005 ,R/TP ,MLCI


ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP




ECCH0000151 4.7 nF,25V,K,X7R,HD,1005,R/TP





ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP




ECCH0000280 0.22 uF,10V ,K ,X7R ,HD ,1608 ,R/TP

ELCH0004705 8.2 nH,J ,1005 ,R/TP ,



ELCH0001052 18 nH,J ,1005 ,R/TP ,PBFREE

ECTH0002002

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty]

,[empty]



ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP



Color Remark





7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

C502

Description

CAP,CHIP,MAKER

C503

C504

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C505 CAP,CHIP,MAKER


C507

C508

C509

C510

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C511 CAP,CHIP,MAKER

C512

C513

C514

C515

C516

C517

C518

C519

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER


C521

C522

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C523 CAP,CHIP,MAKER


C525 CAP,CHIP,MAKER

C526

C527

C528

C529

C530

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP


Part Number

ECZH0004402

Spec

0.1 uF,16V ,Z ,X7R ,TC ,1005 ,R/TP , , ,[empty] ,[empty]




ECZH0004402



ECCH0007803







ECZH0004402











ECCH0007803





ECZH0025502

22000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP ,; ,0.85t



ECZH0004402








Color Remark




7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

7

Location

No.

C531

Description

CAP,CERAMIC,CHIP

C532 CAP,CHIP,MAKER

7 C533 CAP,CHIP,MAKER

C534

C535

C538

C539

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C540 CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

INDUCTOR,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C615

C616

C617

C618

C611

C612

C613

C614

C545

C546

C547

C606

C541

C542

C543

C544

C619

C620

C622

C623

C627

C628

C629




ECZH0004402






ECZH0001503 0.47 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

ECZH0025502

22000000 pF,6.3V ,M ,X5R ,HD ,2012 ,R/TP ,; ,0.85t






ECZH0001217 470 nF,6.3V ,K ,X5R ,TC ,1005 ,R/TP


ECZH0001217 470 nF,6.3V ,K ,X5R ,TC ,1005 ,R/TP



ELCH0004706 10 nH,J ,1005 ,R/TP ,







ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP







Color Remark





7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

7

Location

No.

C630

Description

CAP,CHIP,MAKER

C631 CAP,CHIP,MAKER

C632

C633

C635

C636

C637

C639

INDUCTOR,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

7 C640 CAP,TANTAL,CHIP

C641

C642

C643

C644

C645

C646

C647

C687

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER


C689

C691

C692

C693

C694

C695

C696

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER


C698

C699

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP


C702 CAP,CHIP,MAKER





ELCH0001401 15 nH,J ,1005 ,R/TP ,Pb Free






ECTH0002002

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty]

,[empty]









ECCH0005604







ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP



ECCH0005604





ECCH0007803




Color Remark




C811

C812

C813

C817

C807

C808

C809

C810

C720

C804

C805

C806

C716

C717

C718

C719

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

C703

Description

CAP,CHIP,MAKER

7

7

7

7

C704

C705

C706

C707

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C708

C709

C710

C711

C712

C713

C714

C715

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER


7 C820 CAP,CHIP,MAKER




























ECZH0001126 820 pF,50V ,K ,X7R ,HD ,1005 ,R/TP



ECCH0005604



ECZH0004402



Color Remark





7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

Description

CN201 CONNECTOR,ETC

7

7

7

7

7

7

7

CN301 CONNECTOR,I/O

CN601 CONNECTOR,ETC

CN602 CONNECTOR,ETC

CN802

CONNECTOR,BOARD TO

BOARD

CN804

CONNECTOR,BOARD TO

BOARD

CN805

CONNECTOR,BOARD TO

BOARD

D201 DIODE,SWITCHING

D202

D501

D502

FL301

FL401

FL801

FL802

FL803

FL1

FL101

FL102

FL201

DIODE,SWITCHING

DIODE,SWITCHING

DIODE,SWITCHING









FILTER,SEPERATOR

FILTER,EMI/POWER

FILTER,EMI/POWER

FILTER,EMI/POWER

FILTER,EMI/POWER

FILTER,SEPERATOR

FILTER,EMI/POWER

FILTER,EMI/POWER

FILTER,EMI/POWER

Part Number

ENZY0022101 3 ,2.5 mm,ETC , ,

Spec

ENRY0008801

5 , mm,ANGLE , , ,; , ,0.64MM ,ANGLE ,[empty] ,DIP

,[empty] ,

ENZY0023801 10 , mm,STRAIGHT , ,

ENZY0023801 10 , mm,STRAIGHT , ,

ENBY0036001 40 PIN,0.4 mm,ETC , ,H=1.0, Socket

ENBY0036001 40 PIN,0.4 mm,ETC , ,H=1.0, Socket

ENBY0053601

20 , mm,STRAIGHT , , ,; , ,0.40MM ,[empty] ,FEMALE


EDSY0011901

EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,

IR=30uA(VR=10V)

EDSY0011901


IR=30uA(VR=10V)

EDSY0011901


IR=30uA(VR=10V)

EDSY0011901


IR=30uA(VR=10V)

SFBH0009201 220 ohm,1608 ,

SFBH0009201 220 ohm,1608 ,

SFBH0000912 1000 ohm,1005 ,

SFBH0000912 1000 ohm,1005 ,

SFBH0000912 1000 ohm,1005 ,

SFBH0008101 600 ohm,1005 ,


SFBH0002302 120 ohm,1608 ,CHIP BEAD, 2000mA

SFAY0012001 , , dB, dB, dB, dB,4532 ,IFX EDGE Quad Pin

SFEY0013701 SMD ,18 V,4ch. EMI_ESD Filter (100 Ohm, 7.5pF)

SFEY0013701 SMD ,18 V,4ch. EMI_ESD Filter (100 Ohm, 7.5pF)

SFEY0006501 SMD ,3 TERMINAL EMI FILTER

SFEY0006501 SMD ,3 TERMINAL EMI FILTER

SFAY0012001 , , dB, dB, dB, dB,4532 ,IFX EDGE Quad Pin

SFEY0015501 SMD ,Pb-free_4ch_5p-100ohm-5p ,; ,Filter,LCR

SFEY0015501 SMD ,Pb-free_4ch_5p-100ohm-5p ,; ,Filter,LCR

SFEY0013201 SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 100ohm

Color Remark




Level

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Location

No.

FL804

Description

FILTER,EMI/POWER

FL805

L101

L102

L103

L104

L201 INDUCTOR,SMD,POWER

L407

L408

L502

L504

L403

L404

L405

L406

L305

L306

L401

L402

L202

L203

L204

L301

L507

L509

L601

L602

L603

L604

L605

FILTER,EMI/POWER

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,SMD,POWER

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

INDUCTOR,CHIP

CAP,CERAMIC,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,SMD,POWER

INDUCTOR,CHIP

INDUCTOR,SMD,POWER

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP








ELCP0006811

10 uH,M ,3.8*3.8*1.3 ,R/TP ,power inductor 750mA ,;

,10uH ,20% ,. ,750mA ,0.28 ,; ,; ,SHIELD

,3.8X3.8X1.3MM ,[empty] ,[empty] ,Inductor,Wire

Wound,Chip

ELCP0006703 10 uH,M ,3.2*2.6*1.0 ,R/TP ,

ELCH0001444 100 nH,J ,1005 ,R/TP ,chip coil


ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0005009 100 nH,J ,1005 ,R/TP ,


ELCH0012510 15 nH,G ,1005 ,R/TP ,chip coil

ELCH0009113 4.7 nH,J ,1005 ,R/TP ,chip coil



ELCH0001401 15 nH,J ,1005 ,R/TP ,Pb Free



ELCH0003814 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005


ELCP0006703 10 uH,M ,3.2*2.6*1.0 ,R/TP ,


ELCP0006703 10 uH,M ,3.2*2.6*1.0 ,R/TP ,


ELCH0001404 1.5 nH,S,1005,R/TP

ELCH0009113 4.7 nH,J ,1005 ,R/TP ,chip coil

ELCH0003831 1 nH,S ,1005 ,R/TP ,MLCI

ELCH0009120 4.3 nH,J ,1005 ,R/TP ,COIL

Color Remark





7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

Location

No.

7 L607

Description

INDUCTOR,SMD,POWER

L608

L609

L611

L612

L699

L701

L702

L703

L704

PT401

PT601

CAP,CHIP,MAKER

INDUCTOR,CHIP

CAP,CHIP,MAKER

INDUCTOR,CHIP

INDUCTOR,SMD,POWER

FILTER,BEAD,CHIP

FILTER,BEAD,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

THERMISTOR

THERMISTOR

Q201 TR,BJT,NPN

Q501 TR,BJT,NPN

R112

R113

R114

R115

R108

R109

R110

R111

R101

R102

R103

R104

R105

R106

R107

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

Part Number

ELCP0008007

Spec

3.3 uH,N ,2.5*2.0*1.0 ,R/TP ,MLCI Power ,; ,3.3 ,30% ,; ,;

,; ,; ,; ,SHIELD ,2.5X2X1MM ,[empty] ,[empty]

,Inductor,Wire Wound,Chip


ELCH0004706 10 nH,J ,1005 ,R/TP ,


ELCH0012510 15 nH,G ,1005 ,R/TP ,chip coil

ELCP0008004

4.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD

,2.5X2X1MM ,11MM ,R/TP

SFBH0008105 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP

SFBH0008105 1800 ohm,1005 ,Chip bead ,; ,1800ohm ,; ,[empty] ,R/TP



SETY0006301

NTC ,10000 ohm,SMD ,1005, 3350~3399k, J, R/T,

PBFREE

SETY0006301

NTC ,10000 ohm,SMD ,1005, 3350~3399k, J, R/T,

PBFREE

EQBN0013701 EMT6 ,150 mW,R/TP ,DUAL TRANSISTORS

EQBN0020501

ESM ,0.15 W,R/TP , ,; ,NPN ,5V ,60V ,50V ,150mA

,0.1uA MAX ,10 MIN 700 MAX ,100mW ,ESM ,R/TP ,3P

ERHZ0000465 3300 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000244 22 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000467 330 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000529 1.5 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

ERHY0000166 390 Kohm,1/16W ,F ,1005 ,R/TP

ERHY0000150 75K ohm,1/16W,F,1005,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000529 1.5 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000434 1 ohm,1/16W ,J ,1005 ,R/TP

Color Remark




7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

R116

Description

RES,CHIP,MAKER

7

7

7

7

R117

R118

R119

R120

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R201

R202

R203

R205

R207

R208

R209

R212

R213

PCB ASSY,MAIN,PAD

SHORT

PCB ASSY,MAIN,PAD

SHORT

RES,CHIP,MAKER

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP,MAKER

R214

R216

R217

R218

R219

R220

R221

R223

R224

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R225

R301

R302

R303

R305

R306

R308

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

PCB ASSY,MAIN,PAD

SHORT

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER


ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

SAFP0000501

SAFP0000501

ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP

ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP

ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0000137 27K ohm,1/16W,F,1005,R/TP

ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000301 560 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

SAFP0000501

ERHZ0000463 33 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000463 33 ohm,1/16W ,J ,1005 ,R/TP

ERHY0000254 4.7K ohm,1/16W,J,1005,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP



- 18 -

Color Remark



7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

R309

Description

RES,CHIP,MAKER

7

7

7

7

R310

R311

R312

R313

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R315

R318

R319

R322

R323

R324

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R325 RES,CHIP

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

CAP,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

CAP,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R505

R506

R507

R508

R407

R501

R502

R503

R509

R510

R511

R513

R514

R401

R402

R403

R404

R405

R406


ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0035501

750 ohm,1/16W ,F ,1005 ,R/TP ,; ,750 ,1% ,1/16W ,1005

,R/TP

ERHZ0000206 10 ohm,1/16W ,F ,1005 ,R/TP

ERHY0000185 820 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP


ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000244 22 Kohm,1/16W ,F ,1005 ,R/TP


ERHZ0000286 4700 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0003201 1000 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000206 10 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000244 22 Kohm,1/16W ,F ,1005 ,R/TP

Color Remark




7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

R515

Description

RES,CHIP,MAKER

7

7

7

7

R516

R518

R519

R520

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R521

R522

R523

R524

R525

R526

R527

R528

R601

RES,CHIP

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

CAP,CHIP,MAKER

R705

R706

R707

R708

R709

R711

R799

R802

R803

R602

R603

R604

R605

R606

R607

R702

R703

R704

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP


ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000206 10 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHY0000166 390 Kohm,1/16W ,F ,1005 ,R/TP

ERHY0003201 1000 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP


ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP



- 185 -

Color Remark



7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

R804

Description

RES,CHIP

7

7

7

7

R805

R806

R807

R808

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

7

R809

R811

R812

R814

R816

R817

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

PCB ASSY,MAIN,PAD

OPEN

7

7

R818

R819

PCB ASSY,MAIN,PAD

OPEN

PCB ASSY,MAIN,PAD

SHORT

RES,CHIP,MAKER R820

S801 CONN,SOCKET

SAFY00 PCB,MAIN

7 SW401 CONN,RF SWITCH

SW602

U101

U102

U201

U203

U204

U205

U301

CONN,RF SWITCH

IC

IC

IC

IC

IC

IC

IC

U302 IC

U303 IC


ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0000275 56K ohm,1/16W,J,1005,R/TP

ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP

SAFO0000501 0OHM_1005_DNI

SAFO0000501 0OHM_1005_DNI

SAFP0000501

ERHZ0000457 30 ohm,1/16W ,J ,1005 ,R/TP

ENSY0023301 8 ,ETC , ,0.7 mm,H=1.52,(15*15)

SPFY0216901 FR-4 ,0.8 mm,STAGGERED-8 , ,; , , , , , , , , ,

EUSY0322801

BGA ,10 ,R/TP ,Multimedia Extension EDGE BB, 313 Ball

, ,IC,Digital Baseband Processor

EUSY0347505

FBGA ,137 ,ETC ,FULLY 1.8V 2G(LB/128Mx16)

NAND+1G(8Mx4x32) SDRAM ,; ,IC,MCP

EUSY0323901 BGA PG-WFSGA ,121 PIN,R/TP ,SMPOWER3

EUSY0360301 ,8 ,R/TP ,3axis accelerometer lowcost ,; ,IC Assembly

EUSY0200803 MFL ,8 ,R/TP ,Haptic Driver IC,2X2 ,; ,IC,Motor Driver

EUSY0344405 QFN ,18 ,R/TP ,6CH,PWM,2X3 ,; ,IC,Charge Pump

EUSY0347001

MiniQFN-10L ,10 PIN,R/TP ,1.8X1.4X0.55,0.6 Dual

SPDT Analog Switch ,; ,IC,Analog Switch

EUSY0347001

MiniQFN-10L ,10 PIN,R/TP ,1.8X1.4X0.55,0.6 Dual

SPDT Analog Switch ,; ,IC,Analog Switch


,IC,Analog Switch

Color Remark




7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

U305 IC

Description

U308 IC

U309 IC

U310 IC

U401 IC

U402 PAM

U501 IC

U502 IC

U503

U601

IC

MODULE,ETC

U602 PAM

U603 IC

U604 IC

U701 IC

U702 IC

U703 IC

U802 IC

VA201 VARISTOR

VA202 VARISTOR

VA203 VARISTOR

VA204 VARISTOR

VA205 VARISTOR

VA701 VARISTOR

VA702 VARISTOR

VA801 VARISTOR

VA802 VARISTOR

Part Number

EUSY0340301

Spec uMLP ,10 PIN,R/TP ,typ Rdson 0.4ohm, 1.4X1.8 ,;

,IC,Analog Switch

EUSY0263301

SC-88(2.0x2.1) ,6 PIN,R/TP ,Single SPDT Switch, Pb

Free

EUSY0372001 WCSP ,20 ,R/TP ,MUIC ,; ,IC,Analog Switch

EUSY0388501

DFN ,10 ,R/TP ,Cal Test Mode Single Charger IC for Micro

USB ,; ,IC,Charger

EUSY0274801 VQFN ,40 PIN,R/TP ,GPRS, EDGE TRANSCEIVER

SMPY0021101 dBm, %, A, dBc, dB,5x5 ,SMD ,Linear EDGE PAM.

5005's Halogen Free ver. ,; , , , , , , , ,LGA ,R/TP ,

EUSY0102803 MicroPak ,8 ,R/TP ,Dual AND gate ,; ,IC,TTL

EUSY0389001

FBGA ,107 ,ETC ,FULLY 1.8V 1G(LB/64Mx16)

NAND+512M(8Mx4x16) SDRAM ,; ,IC,MCP

EUSY0347801

BGA ,293 PIN,R/TP ,EDGE RF BB PM Onechip BB ,;

,IC,Digital Baseband Processor

SMZY0026201

WiFi(b/g)+BT2.1+FM Rx, 9.0x7.8x1.1, 54pin

(BCM4325D1) ,; ,WLAN

SMPY0021101 dBm, %, A, dBc, dB,5x5 ,SMD ,Linear EDGE PAM.

5005's Halogen Free ver. ,; , , , , , , , ,LGA ,R/TP ,

EUSY0342401

WQFN16 ,16 PIN,R/TP ,Dual DPDT Analog Switch ,;

,IC,Analog Switch

EUSY0407401

WDFN8L ,8 ,R/TP ,Programmable Dual LDO ,; ,IC,LDO

Voltage Regulator

EUSY0390501 WLCSP ,20 ,R/TP , ,; ,IC,Audio Sub System

EUSY0285602

FBGA ,100 PIN,ETC ,128K DUAL PORT STATIC RAM /

B-VER. MULTI IO / PB FREE


,IC,Analog Switch

EUSY0337101

CSP ,12 PIN,R/TP ,Touchscreen Controller IC , ,IC,A/D

Converter

SEVY0005201 5.5 V, ,SMD ,1005, 50pF

SEVY0005201 5.5 V, ,SMD ,1005, 50pF

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

Color Remark





7

7

7

7

7

7

7

7

7

7

Level

7

Location

No.

Description

VA803 VARISTOR

7

7

7

7

VA804

VA805

VA806

VA807

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VA808

VA809

VA810

VA811

VA812

VA813

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

7 X101 X-TAL

X401

X501

X-TAL

X-TAL

X502 X-TAL

X601 TCXO

Part Number

SEVY0003801 18 V, ,SMD ,

SEVY0001001 14 V, ,SMD ,50pF, 1005

SEVY0003801 18 V, ,SMD ,

Spec

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

SEVY0003801 18 V, ,SMD ,

EXXY0018701

,

32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9

EXXY0027001

26 MHz,7 PPM,8 pF,40 ohm,SMD ,3.2*2.5*0.75 ,26MHz

IFX ULC2 Ref. Clock, Pb-Free ,; ,26MHz ,[empty] ,3.6fF-

Motion ,1.0pF-Shunt , ,SMD ,R/TP

EXXY0018701

,

32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9

EXXY0027001

26 MHz,7 PPM,8 pF,40 ohm,SMD ,3.2*2.5*0.75 ,26MHz

IFX ULC2 Ref. Clock, Pb-Free ,; ,26MHz ,[empty] ,3.6fF-

Motion ,1.0pF-Shunt , ,SMD ,R/TP

EXST0001901

26 MHz,2.5 PPM,10 pF,SMD ,32*15*1.0 ,TI_WL1251 ,; ,

,2.5PPM ,2.8V , , , , ,SMD ,R/TP

Color Remark




13.3 Accessory

3

3

Level

3

Location

No.

Description

MHBY HANDSTRAP

SGDY00 DATA CABLE

3

3 SSAD00 ADAPTOR,AC-DC

3 ADAPTOR,AC-DC

3 ADAPTOR,AC-DC




MHBY0004319 COMPLEX, (empty), , , , ,

SBPP0027401

3.7 V,1500 mAh,1 CELL,PRISMATIC ,454261 WW

LABEL ,; , , , ,PRISMATIC , , ,BLACK , ,

SGDY0014302

; ,[empty] ,[empty] ,1.2M , ,BLACK ,1.2m, 4, Shield case

MicroUSB, ID resistor open ,N

SGEY0003745

; ,RMS 20mW(0.56V,RMS) ,16Ohm+-2.4Ohm 1KHZ

,116dB+-3dB 1KHZ,3mW ,116dB 1KHZ ,96dB 100HZ

,[empty] ,BLACK ,PLUG ,GB190,5P,230Mesh

,Earphone,Stereo

SSAD0034001

100-240V ,5060 Hz,5.1 V,0.7 A,CE ,AC-DC ADAPTOR ,;

,90Vac~264Vac ,5.1 ,700mA ,5060 , ,WALL 3P ,USB ,

Color

WITHOUT

COLOR

Remark

GRAY

SSAD0034002



SSAD0034003






LG GX500 Service Manual

Service Manual

Table Of Contents

1. INTRODUCTION

III. Technical brief

Figure 4

Remote Power On

DUAL SIM SOCKET

128K DUAL PORT STATIC RAM

EUSY0285602, CYPRESS

LCD BACKLIGHT LED DRIVER

MAIN MIC

SINGLE CHARGING IC

(FOFSBM%FTDSJQUJPO

WLAN+BT+FM

5PIN uUSB

ACCEL SENSOR

III-2. RF circuit

*RF Block Diagram

LCD CONNECTOR

LINEAR MOTOR DRIVER

CLOSE TO CONN

Check soldering all pin of

socket

Figure 4-24. uSD

LCD BACKLIGHT LED DRIVER

DCS/PCS RX

See RX Part “1. Checking DCXO Circuit”

LDO for TCXO

26MHz TCXO

5. DOWNLOAD & S/W UPGRADE

III. Technical brief

6. BLOCK DIAGRAM

WLAN+BT+FM

8. BGA Pin Map

VI. RF Calibration

Adjust number of times

11. STAND ALONE TEST

VII. Stand-alone Test

Not Connected

Connected

Change “ptest mood”

Change “normal mode “

Same with SIM1

Key Features

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