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HP ProLiant DL560 Gen8 Server
User Guide
Abstract
This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
Part Number: 696744-003
February 2014
Edition: 3
© Copyright 2012, 2014 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
Microsoft® and Windows® are U.S. registered trademarks of Microsoft Corporation.
Contents
Contents 3
Contents 4
Contents 5
Component identification
Front panel components
Item
1
4
5
2
3
6
Description
Video connector
Serial pull tab
USB connector
Fan module
Hot-plug hard drive
Systems Insight Display
Front panel LEDs and buttons
Component identification 6
Item Description
1
NIC status LED
2 Health LED
Status
Solid green = Link to network
Flashing green (1 Hz/cycle per sec) = Network active
Off = No network activity
Solid green = Normal
Flashing amber = System degraded
Flashing red (1 Hz/cycle per sec) = System critical
Fast-flashing red (4 Hz/cycles per sec) = Power fault*
3 Power On/Standby button and system power LED
Solid green = System on
Flashing green (1 Hz/cycle per sec) = Performing power on sequence
Solid amber = System in standby
Off = No power present**
4 UID button/LED Solid blue = Activated
Flashing blue (1 Hz/cycle per sec) = Remote management or firmware upgrade in progress
Off = Deactivated
* To identify components in a degraded or critical state, see the Systems Insight Display LEDs, check iLO/BIOS logs, and reference the server troubleshooting guide.
** Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has occurred, or the power button cable is disconnected.
Systems Insight Display LEDs
The HP Systems Insight Display LEDs represent the system board layout. The display enables diagnosis with the access panel installed.
Item
1
Description
Over temp
Status
Off = Normal
Solid amber = High system temperature detected
Component identification 7
Item
2
3
Description
NIC link/activity
AMP status
Status
Off = No link to network. If the power is off, view the rear panel RJ-45 LEDs for status
(" Rear panel LEDs and buttons " on page
Flashing green = Network link and activity
Solid green = Network link
Off = AMP modes disabled
Solid green = AMP mode enabled
Solid amber = Failover
Flashing amber = Invalid configuration
4
—
Power cap
All other LEDs
Off = System is in standby, or no cap is set.
Solid green = Power cap applied
Off = Normal
Amber = Failure
For more information on the activation of these LEDs, see "Systems Insight Display
LED combinations (on page 8 )."
Systems Insight Display LED combinations
When the health LED on the front panel illuminates either amber or red, the server is experiencing a health event. Combinations of illuminated Systems Insight Display LEDs, the system power LED, and the health LED indicate system status.
Systems Insight Display
LED and color
Health LED System power
LED
Status
Processor (amber) Red Amber
Processor (amber) Amber Green
One or more of the following conditions may exist:
• Processor in socket X has failed.
• Processor X is not installed in the socket.
• Processor X is unsupported.
• ROM detects a failed processor during
POST.
Processor in socket X is in a pre-failure condition.
DIMM (amber)
DIMM (amber)
Over temp (amber)
Red
Amber
Amber
Green
Green
Green
Over temp (amber)
Fan (amber)
Fan (amber)
Power supply (amber)
Red
Amber
Red
Red
Amber
Green
Green
Amber
One or more DIMMs have failed.
DIMM in slot X is in a pre-failure condition.
The Health Driver has detected a cautionary temperature level.
The server has detected a hardware critical temperature level.
One fan has failed or has been removed.
Two or more fans have failed or been removed.
One or more of the following conditions may exist:
• Only one power supply is installed and
Component identification 8
Systems Insight Display
LED and color
Health LED System power
LED
Status
Power supply (amber)
Power cap (off)
Power cap (green)
Power cap (green)
Amber
—
—
—
Green
Amber
Flashing green
Green that power supply is in standby.
• Power supply fault
• System board fault
One or more of the following conditions may exist:
• Redundant power supply is installed and only one power supply is functional.
• AC power cord is not plugged into redundant power supply.
• Redundant power supply fault
• Power supply mismatch at POST or power supply mismatch through hot-plug addition
Standby
Waiting for power
Power is available.
IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.
Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing each DIMM in a bank with a known working DIMM.
Rear panel components
3
4
1
2
5
6
7
8
Item Description
PCIe slots 1–3 (top to bottom)
PCIe slots 4–6 (top to bottom)
Power supply 1 (PS1)
Power supply 1 power connector
Power supply 2 power connector
Power supply 2 (PS2)
USB connectors (4)
Video connector
Component identification 9
9
10
11 iLO connector
Serial connector
FlexibleLOM ports (Shown: 4x1Gb/Optional: 2x10Gb); port 1 on right side
Rear panel LEDs and buttons
Item Description
1
2
3
4
5
Status
Power supply 1
LED
Power supply 2
LED
UID LED/button
Off = System is off or power supply has failed.
Solid green = Normal
Off = System is off or power supply has failed.
Solid green = Normal
Off = Deactivated
Solid blue = Activated
Flashing blue = System being managed remotely
NIC activity LED Off = No network activity
Solid green = Link to network
Flashing green = Network activity
NIC link LED Off = No network link
Green = Network link
Non-hot-plug PCIe riser board slot definitions
• Primary riser cage connector, connected to processor 1 or the southbridge
Slot PCIe 3-slot riser cage* PCIe 2-slot x16 riser cage
1 - FL/FH PCIe2 or PCIe3** x16 (16,8,4,2,1) —
2 - HL/FH
3 - HL/FH
PCIe2 or PCIe3** x8 (8,4,2,1)
PCIe2 x8 (4,2,1)†
—
—
• Secondary riser cage connector, connected to processor 2 (Processor 2 must be installed)
Slot PCIe 3-slot riser cage* PCIe 2-slot x16 riser cage
4 - FL/FH
5 - HL/FH
PCIe2 or PCIe3** x16 (16,8,4,2,1)
PCIe2 or PCIe3** x8 (8,4,2,1)
PCIe2 or PCIe3** x16 (16,8,4,2,1)
PCIe2 or PCIe3** x16 (16,8,4,2,1)
Component identification 10
Slot PCIe 3-slot riser cage* PCIe 2-slot x16 riser cage
6 - HL/FH PCIe2 or PCIe3** x8 (8,4,2,1) —
*Depending on the server model, the server might ship with one or two riser cages installed.
**These slots can run 8 GT/s signaling rate in either PCIe2 or PCIe3 mode, depending on the capability of the installed processor.
†PCIe slot 3 is connected to the southbridge and runs at the Gen2 signaling rate.
Notes:
"Primary" denotes the riser cage is installed in the primary riser connector.
"Secondary" denotes the riser cage is installed in the secondary riser connector.
Installing the riser cages listed in the table above in either the primary or secondary riser connectors determines the form factor of the PCIe cards supported by those riser cages.
FL/FH denotes full-length, full-height. HL/FH denotes half-length, full-height. LP denotes low profile.
The PCIe 2-slot x16 riser cage supports a maximum power of 150 W with an HP power cable. This cable must be used for PCIe card wattages greater than 75 W.
System board components
2
3
Item
1
Description
Processor 3 DIMM slots (7-12)
Front power switch
Processor 3 socket
Component identification 11
Item
10
11
12
13
6
7
4
5
8
9
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
Description
Drive cage power connector 2
Processor 3 DIMM slots (1-6)
Systems Insight Display connector
Sideband signal connector
Processor 4 DIMM slots (7-12)
Processor 4 socket
Discovery services connector
Drive cage power connector 1
Front video connector
Processor 4 DIMM slots (1-6)
Processor 2 DIMM slots (1-6)
Power supply backplane connector
USB connector 1
System battery
MicroSD card slot
Internal USB connector
Secondary (processor 2) PCIe riser connector
TPM connector
Processor 2 socket
Processor 2 DIMM slots (7-12)
Processor 1 DIMM slots (1-6)
System maintenance switch
Primary (processor 1) PCIe riser connector
FlexibleLOM slot
SAS connector 1
USB connector 2
SAS connector 2
Cache module connector
Processor 1 DIMM slots (7-12)
Processor 1 socket
System maintenance switch
Position Default Function
S1 Off
S2
S3
S4
S5
Off
Off
Off
Off
Off = iLO security is enabled.
On = iLO security is disabled.
Off = System configuration can be changed.
On = System configuration is locked.
Reserved
Reserved
Off = Power-on password is enabled.
On = Power-on password is disabled.
Component identification 12
Position
S6
S7
S8
S9
S10
S11
S12
Default
Off
—
—
—
—
—
—
Function
Off = No function
On = ROM reads system configuration as invalid.
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
To access the redundant ROM, set S1, S5, and S6 to on.
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM.
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly configure the server or data loss could occur.
NMI functionality
An NMI crash dump enables administrators to create crash dump files when a system is hung and not responding to traditional debug mechanisms.
Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in operating systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is to cycle the system power. Resetting the system erases any information that could support problem analysis, but the NMI feature preserves that information by performing a memory dump before a hard reset.
To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can use the iLO
Virtual NMI feature.
For more information, see the HP website ( http://www.hp.com/support/NMI ).
Component identification 13
DIMM slot locations
DIMM slots are numbered sequentially (1 through 12) for each processor. The supported AMP modes use the letter assignments for population guidelines.
Hot-plug drive bay numbering
Hot-plug drive LED definitions
Component identification 14
2
3
4
1
Item LED
Locate
Status Definition
Solid blue The drive is being identified by a host application.
Flashing blue The drive carrier firmware is being updated or requires an update.
Activity ring Rotating green Drive activity
Off No drive activity
Do not remove Solid white
Off
Do not remove the drive. Removing the drive causes one or more of the logical drives to fail.
Removing the drive does not cause a logical drive to fail.
Drive status Solid green The drive is a member of one or more logical drives.
Flashing green The drive is rebuilding or performing a RAID migration, strip size migration, capacity expansion, or logical drive extension, or is erasing.
Flashing amber/green
The drive is a member of one or more logical drives and predicts the drive will fail.
Flashing amber The drive is not configured and predicts the drive will fail.
Solid amber The drive has failed.
Off The drive is not configured by a RAID controller.
PCIe riser cage LED
CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser cage.
Status
On = AC power is connected.
Off = AC power is disconnected.
Component identification 15
FBWC module LEDs (P222, P420, P421)
The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the reverse side of the cache module to facilitate status viewing.
1 - Amber
Off
Off
Off
Off
Off
Off
Off
Off
Flashing 1 Hz
Flashing 1 Hz
Flashing 1 Hz
Flashing 2 Hz
Flashing 2 Hz
On
On
Hot-plug fans
2 - Green 3 - Green Interpretation
Off Off The cache module is not powered.
Flashing 0.5 Hz Flashing 0.5 Hz The cache microcontroller is executing from within its boot loader and receiving new flash code from the host controller.
Flashing 1 Hz Flashing 1 Hz The cache module is powering up, and the capacitor pack is charging.
Off
Off
Flashing 1 Hz
On
The cache module is idle, and the capacitor pack is charging.
The cache module is idle, and the capacitor pack is charged.
On On
Flashing 1 Hz
On
Off
Off
Flashing 1 Hz Off
Flashing 1 Hz On
The cache module is idle, the capacitor pack is charged, and the cache contains data that has not yet been written to the drives.
A backup is in progress.
The current backup is complete with no errors.
The current backup failed, and data has been lost.
A power error occurred during the previous or current boot. Data may be corrupt.
An overtemperature condition exists. On Off
Flashing 2 Hz Off
Flashing 2 Hz On
On
On
Off
On
The capacitor pack is not attached.
The capacitor has been charging for 10 minutes, but has not reached sufficient charge to perform a full backup.
The current backup is complete, but power fluctuations occurred during the backup.
The cache module microcontroller has failed.
Component identification 16
CAUTION: To avoid damage to server components, all fan modules must be installed in fan bays for any processor configuration.
For all processor configurations, the HP ProLiant DL560 Gen8 Server requires six fan modules for redundancy. A fan failure causes a loss of cooling redundancy. A second fan failure or a missing fan module causes an orderly shutdown of the server.
The server supports variable fan speeds. The fans operate at minimum speed until a temperature change requires a fan speed increase to cool the server.
The server shuts down in the following temperature-related scenarios:
• At POST and in the OS, iLO performs an orderly shutdown if a cautionary temperature level is detected.
If the server hardware detects a critical temperature level before an orderly shutdown occurs, the server performs an immediate shutdown.
• When the Thermal Shutdown feature is disabled in RBSU, iLO does not perform an orderly shutdown when a cautionary temperature level is detected. Disabling this feature does not disable the server hardware from performing an immediate shutdown when a critical temperature level is detected.
CAUTION: A thermal event can damage server components when the Thermal Shutdown feature is disabled in RBSU.
IMPORTANT: An immediate shutdown is a hardware-controlled function and it overrides any firmware or software actions.
Component identification 17
Operations
Power up the server
To power up the server, press the Power On/Standby button.
Power down the server
Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs.
IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the system.
To power down the server, use one of the following methods:
• Press and release the Power On/Standby button.
This method initiates a controlled shutdown of applications and the OS before the server enters standby mode.
• Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter standby mode.
This method forces the server to enter standby mode without properly exiting applications and the OS.
If an application stops responding, you can use this method to force a shutdown.
• Use a virtual power button selection through iLO.
This method initiates a controlled remote shutdown of applications and the OS before the server enters standby mode.
Before proceeding, verify the server is in standby mode by observing that the system power LED is amber.
Extend the server from the rack
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is adequately stabilized before extending a component from the rack.
1. Pull down the quick release levers on each side of the server.
Operations 18
2. Extend the server from the rack.
3. After performing the installation or maintenance procedure, slide the server back into the rack, and then press the server firmly into the rack to secure it in place.
WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release latches and sliding the server into the rack. The sliding rails could pinch your fingers.
Access the Systems Insight Display
To access the HP Systems Insight Display:
1. Press and release the panel.
Operations 19
2. After the display fully ejects, rotate the display sideways to view the LEDs.
Remove the access panel
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.
To remove the component:
1.
Power down the server (on page 18 ).
2.
3.
Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.
Extend the server from the rack (on page 18 ).
4.
5.
Use a T-15 Torx screwdriver to loosen the security screw on the hood latch.
Lift up on the hood latch handle, and then remove the access panel.
Install the access panel
1.
2.
Place the access panel on top of the server with the hood latch open. Allow the panel to extend past the rear of the server approximately 1.25 cm (0.5 in).
Push down on the hood latch. The access panel slides to a closed position.
Operations 20
3. Use a T-15 Torx screwdriver to tighten the security screw on the hood latch.
Access the product rear panel
Opening the cable management arm
To access the server rear panel:
1. Release the cable management arm.
2. Open the cable management arm. Note that the cable management arm can be right-mounted or left-mounted.
Remove the primary PCIe riser cage
Operations 21
1.
2.
3.
4.
5.
6.
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser cage.
Power down the server (on page 18 ).
Remove all power: a. b.
Disconnect each power cord from the power source.
Disconnect each power cord from the server.
Extend the server from the rack (on page 18 ).
Remove the access panel (on page 20 ).
If any full-length expansion boards are installed, release the full-length expansion board retainer.
Remove the PCIe riser cage.
Install the primary PCIe riser cage
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
1.
2.
3.
4.
Power down the server (on page 18 ).
Remove all power: a. b.
Disconnect each power cord from the power source.
Disconnect each power cord from the server.
Extend the server from the rack (on page 18 ).
Remove the access panel (on page 20 ).
Operations 22
5. Install the PCIe riser cage.
6.
7.
8.
9.
10.
Install the access panel (on page 20 ).
Install the server into the rack (" Installing the server into the rack " on page 30 ).
Connect each power cord to the server.
Connect each power cord to the power source.
Power up the server (on page 18 ).
Remove the air baffle
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.
To remove the component:
1.
Power down the server (on page 18 ).
2.
3.
Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.
Extend the server from the rack (on page 18 ).
4.
5.
Remove the access panel (on page 20 ).
If any full-length expansion boards are installed, release the full-length expansion board retainer, and
then remove the PCIe riser cage (" Remove the primary PCIe riser cage " on page 21 ).
Operations 23
6.
CAUTION: Do not detach the cable that connects the battery pack to the cache module.
Detaching the cable causes any unsaved data in the cache module to be lost.
IMPORTANT: It is necessary to remove the PCI riser cage only if there is a full-length expansion board installed.
Remove the air baffle.
Install the air baffle
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.
To install the component:
1.
Power down the server (on page 18 ).
2. Remove all power:
3.
4. a. b.
Disconnect each power cord from the power source.
Disconnect each power cord from the server.
Extend the server from the rack (on page 18 ).
Remove the access panel (on page 20 ).
CAUTION: Do not detach the cable that connects the battery pack to the cache module.
Detaching the cable causes any unsaved data in the cache module to be lost.
Operations 24
5. Install the air baffle.
6.
7.
8.
9.
10.
Install the access panel (on page 20 ).
Install the server into the rack (" Installing the server into the rack " on page 30 ).
Connect each power cord to the server.
Connect each power cord to the power source.
Power up the server (on page 18 ).
Operations 25
Setup
Optional installation services
Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate both hardware and software support into a single package. A number of service level options are available to meet your needs.
HP Care Pack Services offer upgraded service levels to expand your standard product warranty with easy-to-buy, easy-to-use support packages that help you make the most of your server investments. Some of the Care Pack services are:
• Hardware support o 6-Hour Call-to-Repair o o
4-Hour 24x7 Same Day
4-Hour Same Business Day
• Software support o Microsoft® o o o
Linux
HP ProLiant Essentials (HP SIM and RDP)
VMware
• Integrated hardware and software support o Critical Service o o o
Proactive 24
Support Plus
Support Plus 24
• Startup and implementation services for both hardware and software
For more information on HP Care Pack Services, see the HP website
( http://www.hp.com/services/carepack ).
Optimum environment
When installing the server in a rack, select a location that meets the environmental standards described in this section.
Space and airflow requirements
To allow for servicing and adequate airflow, observe the following space and airflow requirements when deciding where to install a rack:
Setup 26
• Leave a minimum clearance of 63.5 cm (25 in) in front of the rack.
• Leave a minimum clearance of 76.2 cm (30 in) behind the rack.
• Leave a minimum clearance of 121.9 cm (48 in) from the back of the rack to the back of another rack or row of racks.
HP servers draw in cool air through the front door and expel warm air through the rear door. Therefore, the front and rear rack doors must be adequately ventilated to allow ambient room air to enter the cabinet, and the rear door must be adequately ventilated to allow the warm air to escape from the cabinet.
CAUTION: To prevent improper cooling and damage to the equipment, do not block the ventilation openings.
When vertical space in the rack is not filled by a server or rack component, the gaps between the components cause changes in airflow through the rack and across the servers. Cover all gaps with blanking panels to maintain proper airflow.
CAUTION: Always use blanking panels to fill empty vertical spaces in the rack. This arrangement ensures proper airflow. Using a rack without blanking panels results in improper cooling that can lead to thermal damage.
The 9000 and 10000 Series Racks provide proper server cooling from flow-through perforations in the front and rear doors that provide 64 percent open area for ventilation.
CAUTION: When using a Compaq branded 7000 series rack, install the high airflow rack door insert (PN 327281-B21 for 42U rack, PN 157847-B21 for 22U rack) to provide proper front-to-back airflow and cooling.
CAUTION: If a third-party rack is used, observe the following additional requirements to ensure adequate airflow and to prevent damage to the equipment:
• Front and rear doors—If the 42U rack includes closing front and rear doors, you must allow
5,350 sq cm (830 sq in) of holes evenly distributed from top to bottom to permit adequate airflow (equivalent to the required 64 percent open area for ventilation).
• Side—The clearance between the installed rack component and the side panels of the rack must be a minimum of 7 cm (2.75 in).
IMPORTANT: The HP ProLiant DL560 Gen8 Server cable management arm is not supported on
Compaq branded 7000 series racks.
Temperature requirements
To ensure continued safe and reliable equipment operation, install or position the system in a well-ventilated, climate-controlled environment.
The maximum recommended ambient operating temperature (TMRA) for most server products is 35°C
(95°F). The temperature in the room where the rack is located must not exceed 35°C (95°F).
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:
• Do not permit optional equipment to impede airflow around the server or to increase the internal rack temperature beyond the maximum allowable limits.
• Do not exceed the manufacturer’s TMRA.
Setup 27
Power requirements
Installation of this equipment must comply with local and regional electrical regulations governing the installation of information technology equipment by licensed electricians. This equipment is designed to operate in installations covered by NFPA 70, 1999 Edition (National Electric Code) and NFPA-75, 1992
(code for Protection of Electronic Computer/Data Processing Equipment). For electrical power ratings on options, refer to the product rating label or the user documentation supplied with that option.
WARNING: To reduce the risk of personal injury, fire, or damage to the equipment, do not overload the AC supply branch circuit that provides power to the rack. Consult the electrical authority having jurisdiction over wiring and installation requirements of your facility.
CAUTION: Protect the server from power fluctuations and temporary interruptions with a regulating uninterruptible power supply. This device protects the hardware from damage caused by power surges and voltage spikes and keeps the system in operation during a power failure.
When installing more than one server, you may need to use additional power distribution devices to safely provide power to all devices. Observe the following guidelines:
• Balance the server power load between available AC supply branch circuits.
• Do not allow the overall system AC current load to exceed 80% of the branch circuit AC current rating.
• Do not use common power outlet strips for this equipment.
• Provide a separate electrical circuit for the server.
Electrical grounding requirements
The server must be grounded properly for proper operation and safety. In the United States, you must install the equipment in accordance with NFPA 70, 1999 Edition (National Electric Code), Article 250, as well as any local and regional building codes. In Canada, you must install the equipment in accordance with
Canadian Standards Association, CSA C22.1, Canadian Electrical Code. In all other countries, you must install the equipment in accordance with any regional or national electrical wiring codes, such as the
International Electrotechnical Commission (IEC) Code 364, parts 1 through 7. Furthermore, you must be sure that all power distribution devices used in the installation, such as branch wiring and receptacles, are listed or certified grounding-type devices.
Because of the high ground-leakage currents associated with multiple servers connected to the same power source, HP recommends the use of a PDU that is either permanently wired to the building’s branch circuit or includes a nondetachable cord that is wired to an industrial-style plug. NEMA locking-style plugs or those complying with IEC 60309 are considered suitable for this purpose. Using common power outlet strips for the server is not recommended.
Connecting a DC power cable to a DC power source
WARNING: To reduce the risk of electric shock or energy hazards:
• This equipment must be installed by trained service personnel, as defined by the NEC and IEC
60950-1, Second Edition, the standard for Safety of Information Technology Equipment.
• Connect the equipment to a reliably grounded SELV source. An SELV source is a secondary circuit that is designed so normal and single fault conditions do not cause the voltages to exceed a safe level (60 V direct current).
• The branch circuit overcurrent protection must be rated 20A.
Setup 28
WARNING: When installing a DC power supply, the ground wire must be connected before the positive or negative leads.
WARNING: Remove power from the power supply before performing any installation steps or maintenance on the power supply.
CAUTION: The server equipment connects the earthed conductor of the DC supply circuit to the earthing conductor at the equipment. For more information, see the HP 750W Common Slot -48V
DC Input Hot-Plug Power Supply Kit Installation Instructions.
CAUTION: If the DC connection exists between the earthed conductor of the DC supply circuit and the earthing conductor at the server equipment, the following conditions must be met:
• This equipment must be connected directly to the DC supply system earthing electrode conductor or to a bonding jumper from an earthing terminal bar or bus to which the DC supply system earthing electrode conductor is connected.
• This equipment should be located in the same immediate area (such as adjacent cabinets) as any other equipment that has a connection between the earthed conductor of the same DC supply circuit and the earthing conductor, and also the point of earthing of the DC system. The
DC system should be earthed elsewhere.
• The DC supply source is to be located within the same premises as the equipment.
• Switching or disconnecting devices should not be in the earthed circuit conductor between the
DC source and the point of connection of the earthing electrode conductor.
To connect a DC power cable to a DC power source:
1. Cut the DC power cord ends no shorter than 150 cm (59.06 in).
2. If the power source requires ring tongues, use a crimping tool to install the ring tongues on the power cord wires.
IMPORTANT: The ring tongues must be UL approved and accommodate 12 gauge wires.
IMPORTANT: The minimum nominal thread diameter of a pillar or stud type terminal must be 3.5 mm (0.138 in); the diameter of a screw type terminal must be 4.0 mm (0.157 in).
3. Stack each same-colored pair of wires and then attach them to the same power source. The power cord consists of three wires (black, red, and green).
For more information, see the HP 750W Common Slot -48V DC Input Hot-Plug Power Supply Installation
Instructions.
Rack warnings
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:
• The leveling jacks are extended to the floor.
• The full weight of the rack rests on the leveling jacks.
• The stabilizing feet are attached to the rack if it is a single-rack installation.
• The racks are coupled together in multiple-rack installations.
• Only one component is extended at a time. A rack may become unstable if more than one component is extended for any reason.
Setup 29
WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack:
• At least two people are needed to safely unload the rack from the pallet. An empty 42U rack can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might become unstable when being moved on its casters.
• Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle the rack from both sides.
Identifying the contents of the server shipping carton
Unpack the server shipping carton and locate the materials and documentation necessary for installing the server. All the rack mounting hardware necessary for installing the server into the rack is included with the rack or the server.
The contents of the server shipping carton include:
• Server
• Power cord
• Hardware documentation, Documentation CD, and software products
• Rack-mounting hardware
In addition to the supplied items, you might need:
• Operating system or application software
• Hardware options
Installing hardware options
Install any hardware options before initializing the server. For options installation information, refer to the
Installing the server into the rack
CAUTION: Always plan the rack installation so that the heaviest item is on the bottom of the rack.
Install the heaviest item first, and continue to populate the rack from the bottom to the top.
1.
2.
Install the server and cable management arm into the rack. For more information, see the installation instructions that ship with the 2U Quick Deploy Rail System.
Connect peripheral devices to the server. For information on identifying connectors, see "Rear panel
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into RJ-45 connectors.
3. Connect the power cord to the rear of the server.
Setup 30
4. Install the power cord anchors.
5. Secure the cables to the cable management arm.
IMPORTANT: When using cable management arm components, be sure to leave enough slack in each of the cables to prevent damage to the cables when the server is extended from the rack.
6. Connect the power cord to the AC power source.
WARNING: To reduce the risk of electric shock or damage to the equipment:
• Do not disable the power cord grounding plug. The grounding plug is an important safety feature.
• Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times.
• Unplug the power cord from the power supply to disconnect power to the equipment.
• Do not route the power cord where it can be walked on or pinched by items placed against it.
Pay particular attention to the plug, electrical outlet, and the point where the cord extends from the server.
Setup 31
Installing the operating system
This ProLiant server ships with Intelligent Provisioning installed. Everything needed to manage and install the system software and firmware is preloaded on the server.
To operate properly, the server must have a supported operating system. For the latest information on operating system support, see the HP website ( http://www.hp.com/go/supportos ).
To install an operating system on the server, use one of the following methods:
• Intelligent Provisioning—The iLO Management Engine is a new feature on ProLiant servers that contains
Intelligent Provisioning for embedded deployment, updating, and provisioning capabilities. Intelligent
Provisioning can configure the server and install an operating system, eliminating the need for
SmartStart CDs and Smart Update Firmware DVDs.
To install an operating system on the server with Intelligent Provisioning (local or remote): a. Connect the Ethernet cable, and then power on the server. b. c. d. e.
During server POST, press the F10 key.
Complete the initial Preferences and Registration portion of Intelligent Provisioning (on page 70 ).
At the 1 Start screen, click the Configure and Install button.
To finish the installation, follow the onscreen prompts. An Internet connection is required to update the firmware and systems software.
• Remote deployment installation—To remotely deploy an operating system, use Insight Control server deployment for an automated solution.
For additional system software and firmware updates, download the HP Service Pack for ProLiant from the HP website ( http://www.hp.com/go/spp/download ). Software and firmware must be updated before using the server for the first time, unless any installed software or components require an older version. For more
information, see "Keeping the system current (on page 78 )."
For more information on using these installation methods, see the HP website ( http://www.hp.com/go/ilo ).
Powering on and selecting boot options
1.
2.
3.
Connect the Ethernet cable.
Press the Power On/Standby button.
During the initial boot: o o
To modify the server configuration ROM default settings, press F9 when prompted from the start up sequence to enter the RBSU. By default, RBSU runs in the English language.
If you do not need to modify the server configuration and are ready to install the system software, press F10 to access Intelligent Provisioning.
NOTE: If an HP Smart Array controller has been added or is embedded in the system, the controller defaults to a RAID configuration based on the size and number of drives installed. For more information on modifying the controller default settings, see the documentation on the
Documentation CD.
For more information on automatic configuration, see the HP ROM-Based Setup Utility User Guide on the
Documentation CD or the iLO Management Engine Information Library ( http://www.hp.com/support/rbsu ).
Setup 32
Registering the server
To experience quicker service and more efficient support, register the product at the HP Product Registration website ( http://register.hp.com
).
Setup 33
Hardware options installation
Introduction
If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure. Improper grounding can cause electrostatic discharge.
Processor option
This server does not support a three processor configuration.
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
CAUTION: To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this server.
CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number.
IMPORTANT: If installing a processor with a faster speed, update the system ROM before installing the processor.
To install a processor:
1.
Power down the server (on page 18 ).
2. Remove all power:
3.
4.
5.
6. a. b.
Disconnect each power cord from the power source.
Disconnect each power cord from the server.
Extend the server from the rack (on page 18 ).
Remove the access panel (on page 20 ).
If any full-length expansion boards are installed, release the full-length expansion board retainer, and
then remove the PCIe riser cage (" Remove the primary PCIe riser cage " on page 21 ).
Remove the air baffle (on page 23 ).
Hardware options installation 34
7. Open the heatsink retaining bracket, and then remove the blank, if present.
8.
CAUTION: The pins on the processor socket are very fragile. Any damage to them may require replacing the system board.
Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
Hardware options installation 35
9. Remove the clear processor socket cover. Retain the processor socket cover for future use.
10. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE
SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts.
11. Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket.
Hardware options installation 36
CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket.
12. Press and hold the processor retaining bracket in place, and then close each processor locking lever.
Press only in the area indicated on the processor retaining bracket.
13. Remove the thermal interface protective cover from the heatsink.
Hardware options installation 37
14. Install the heatsink.
15.
16.
17.
18.
19.
20.
Install the air baffle (on page 24 ).
Install any full-length expansion boards, if previously removed.
Install the access panel (on page 20 ).
Install the server into the rack (" Installing the server into the rack " on page 30 ).
Connect each power cord to the server.
Connect each power cord to the power source.
Memory options
IMPORTANT: This server does not support mixing LRDIMMs, RDIMMs, or UDIMMs. Attempting to mix any combination of these DIMMs can cause the server to halt during BIOS initialization.
The memory subsystem in this server supports LRDIMMs and RDIMMs:
• UDIMMs are not supported in this server.
• RDIMMs offer larger capacities than UDIMMs and include address parity protection.
• LRDIMMs support higher densities than single- and dual-rank RDIMMs, and higher speeds than quad-rank RDIMMs. This support enables you to install more high capacity DIMMs, resulting in higher system capacities and higher bandwidth.
All types are referred to as DIMMs when the information applies to all types. When specified as LRDIMM or
RDIMM, the information applies to that type only. All memory installed in the server must be the same type.
The server supports the following DIMM speeds:
Hardware options installation 38
• Single- and dual-rank PC3-10600 (DDR-1333) RDIMMs operating at up to 1333 MT/s at 1.35V
• Single- and dual-rank PC3-12800 (DDR-1600) RDIMMs operating at up to 1600 MT/s at 1.5V
• Single- and dual-rank PC3-12800 (DDR-1600) RDIMMs operating at up to 1600 MT/s at 1.35V
• Single- and dual-rank PC3-14900 (DDR3-1866) RDIMMs, operating at up to 1866 MT/s at 1.5V
• Quad-rank PC3L-10600 (DDR3-1333) LRDIMMs, operating at up to 1333 MT/s at 1.35V
• Quad-rank PC3-14900 (DDR3-1866) LRDIMMs, operating at up to 1866 MT/s at 1.5V
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
LRDIMM
LRDIMM
* IVB memory
Speed, voltage, and capacity
DIMM type DIMM rank
Single-rank
Single-rank
Single-rank
Single-rank
Dual-rank
Single-rank
Dual-rank
Single-rank
Dual-rank
Single-rank
Dual-rank
Dual-rank
Dual-rank
Dual-rank
Quad-rank
Quad-rank
DIMM capacity
4 GB
4 GB
4 GB
4 GB
8 GB
8 GB
8 GB
8 GB
8 GB
8 GB
8 GB
16 GB
16 GB
16 GB
32 GB
32 GB
Native speed (MT/s) Voltage
1333
1600
1600
1866
1333
1600
1600
1600
1600
1866
1866
1333
1600
1866
1333
1866
LV
STD
LV*
STD*
LV
STD
STD
LV*
LV*
STD*
STD*
LV
LV*
STD*
LV
STD*
Depending on the processor model, the number of DIMMs installed, and whether LRDIMMs or RDIMMs are installed, the memory clock speed can be reduced to 1333 or 1066 MT/s.
Populated DIMM speed (MT/s)
DIMM type DIMM rank 1 DIMM per channel 2 DIMMs per channel 3 DIMMs per channel
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
RDIMM
Single-rank (4 GB) 1333
Single-rank (4 GB) 1600
Single-rank (4 GB) 1600
Single-rank (4 GB) 1866
Dual-rank (8 GB) 1333
Single-rank (8 GB) 1600
Dual-rank (8 GB) 1600
Dual-rank (8 GB) 1600
Dual-rank (8 GB) 1866
Dual-rank (16 GB) 1333
Dual-rank (16 GB) 1600
Dual-rank (16 GB) 1600
1333
1600
1600
1866
1333
1600
1600
1600
1866
1333
1600
1600
1066
1333 1
800 2
1066 2
1066 3
1333 1
800 2
1333 1
1066 2
1066 3
1333 1
800 2
Hardware options installation 39
DIMM type DIMM rank 1 DIMM per channel 2 DIMMs per channel 3 DIMMs per channel
LRDIMM Quad-rank (32
GB)
1333 4 1333 4 1066
LRDIMM Quad-rank (32
GB)
1866
1
2
Supported with the BIOS RBSU setting
1066 1333 2
3
4
IVB memory
RDIMM supports 1.35V 3DPC at 1066. Third-party memory supports 1.5V 3DPC at 1066 MT/s.
LRDIMM enables 3 DIMMs per channel. HP SmartMemory supports up to 3DPC at 1066 MT/s at 1.35V. Third-party memory supports 1.5V only.
HP SmartMemory
HP SmartMemory, introduced for Gen8 servers, authenticates and unlocks certain features available only on
HP Qualified memory and verifies whether installed memory has passed HP qualification and test processes.
Qualified memory is performance-tuned for HP ProLiant and BladeSystem servers and provides future enhanced support through HP Active Health and manageability software.
Certain performance features are unique to HP SmartMemory. HP SmartMemory 1.35V DDR3-1333
Registered memory is engineered to achieve the same performance level as 1.5V memory. For example, while the industry supports DDR3-1333 RDIMM at 1.5V, this Gen8 server supports up to 3 DDR3-1333
RDIMMs per channel at 1066 MT/s running at 1.35V. This equates to up to 20% less power at the DIMM level with no performance penalty. In addition, the industry supports DDR3-1600 RDIMMs at 3 DIMMs per channel at 1066 MT/s. HP SmartMemory supports 3 RDIMMs per channel at 1333 MT/s, or 25% greater bandwidth with an RBSU setting.
Memory subsystem architecture
The memory subsystem in this server is divided into channels. Each processor supports four channels, and each channel supports three DIMM slots, as shown in the following table.
Channel Population order Slot number
1
2 B
F
J
A
E
I
9
8
7
12
11
10
3
4 D
H
L
C
G
K
4
5
6
1
2
3
For the location of the slot numbers, see "DIMM slot locations (on page 14 )."
This multi-channel architecture provides enhanced performance in Advanced ECC mode. This architecture also enables Lockstep and Online Spare Memory modes.
DIMM slots in this server are identified by number and by letter. Letters identify the population order. Slot numbers indicate the DIMM slot ID for spare replacement.
Hardware options installation 40
Single-, dual-, and quad-rank DIMMs
To understand and configure memory protection modes properly, an understanding of single-, dual-, and quad-rank DIMMs is helpful. Some DIMM configuration requirements are based on these classifications.
A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from the memory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module. A quad-rank
DIMM is, effectively, two dual-rank DIMMs on the same module. The server memory control subsystem selects the proper rank within the DIMM when writing to or reading from the DIMM.
Dual- and quad-rank DIMMs provide the greatest capacity with the existing memory technology. For example, if current DRAM technology supports 8-GB single-rank DIMMs, a dual-rank DIMM would be 16
GB, and a quad-rank DIMM would be 32 GB.
LRDIMMs are labeled as quad-rank DIMMs. There are four ranks of DRAM on the DIMM, but the LRDIMM buffer creates an abstraction that allows the DIMM to appear as a logical dual-rank DIMM to the system. This is called Rank-Multiplication. The LRDIMM buffer also isolates the electrical loading of the DRAM from the system to allow for faster operation. These two changes allow the system to support up to three LRDIMMs per memory channel, providing for up to 50% greater memory capacity and higher memory operating speed compared to quad-rank RDIMMs.
DIMM identification
To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and table.
1
2
Item Description
Size
Rank
3 Data width
Definition
—
1R = Single-rank
2R = Dual-rank
3R = Three-rank
4R = Quad-rank x4 = 4-bit x8 = 8-bit
Hardware options installation 41
Item Description
4
5
6
Voltage rating
Memory speed
DIMM type
Definition
L = Low voltage (1.35V)
U = Ultra low voltage (1.25V)
Blank or omitted = Standard
12800 = 1600-MT/s
10600 = 1333-MT/s
8500 = 1066-MT/s
R = RDIMM (registered)
E = UDIMM (unbuffered with ECC)
L = LRDIMM (load reduced)
For the latest supported memory information, see the QuickSpecs on the HP website
( http://www.hp.com/go/productbulletin ). At the website, choose the geographic region, and then locate the product by name or product category.
Memory configurations
To optimize server availability, the server supports the following AMP modes:
• Advanced ECC—provides up to 4-bit error correction and enhanced performance over Lockstep mode.
This mode is the default option for this server.
• Online spare memory—provides protection against failing or degraded DIMMs. Certain memory is reserved as spare, and automatic failover to spare memory occurs when the system detects a DIMM that is degrading. This allows DIMMs that have a higher probability of receiving an uncorrectable memory error (which would result in system downtime) to be removed from operation.
Advanced Memory Protection options are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM configuration, the server boots in Advanced ECC mode. For more information, see
"HP ROM-Based Setup Utility (on page 74 )."
The server also can operate in independent channel mode or combined channel mode (lockstep). Lockstep mode improves the system reliability and availability. If running with RDIMM (built with x4 DRAM devices), the system can survive the complete failure of two DRAM devices (DDDC). Running in independent mode, the server can only survive the complete failure of a single DRAM device (SDDC).
Maximum capacity
DIMM type DIMM rank
RDIMM
RDIMM
LRDIMM
Single-rank
Dual-rank
Quad-rank
One processor
96 GB
192 GB
384 GB
Two processors
192 GB
384 GB
768 GB
Four processors
384 GB
768 GB
1.5 TB
For the latest memory configuration information, see the QuickSpecs on the HP website
( http://www.hp.com/go/productbulletin ).
Advanced ECC memory configuration
Advanced ECC memory is the default memory protection mode for this server. Standard ECC can detect and correct single-bit memory errors and only detect multi-bit memory errors. When multi-bit errors are detected using Standard ECC, the error is signaled to the server to halt the server.
Advanced ECC protects the server against some multi-bit memory errors. Advanced ECC can detect and correct up to 4-bit memory errors if all failed bits are on the same DRAM device on the DIMM.
Hardware options installation 42
Advanced ECC provides additional protection over Standard ECC because it is possible to correct certain memory errors that would otherwise be uncorrected and result in a server failure. Using HP Advanced
Memory Error Detection technology, the server provides notification when a DIMM is degrading and has a higher probability of uncorrectable memory error.
Online Spare memory configuration
Online spare memory provides protection against degraded DIMMs by reducing the likelihood of uncorrected memory errors. This protection is available without any operating system support.
Online spare memory protection dedicates one rank of each memory channel for use as spare memory. The remaining ranks are available for OS and application use. If correctable memory errors occur at a rate higher than a specific threshold on any of the non-spare ranks, the server automatically copies the memory contents of the degraded rank to the online spare rank. The server then deactivates the failing rank and automatically switches over to the online spare rank.
Lockstep memory configuration
Lockstep mode provides protection against multi-bit memory errors that occur on the same DRAM device.
Lockstep mode can correct any single DRAM device failure on x4 and x8 DIMM types. The DIMMs in each channel must have identical HP part numbers.
General DIMM slot population guidelines
Observe the following guidelines for all AMP modes:
• Install DIMMs only if the corresponding processor is installed.
• When multiple processors are installed, HP recommends balancing the DIMMs across the all processors.
• White DIMM slots denote the first slot of a channel (Ch 1-A, Ch 2-B, Ch 3-C, Ch 4-D...).
• Do not mix LRDIMMs and RDIMMs.
• UDIMMs are not supported on this server.
• When multiple processors are installed, HP recommends installing the DIMMs in sequential alphabetical order: P1-A, P2-A... P4-A, P1-B, P2-B... P4-B, P1-C, P2-C... P4-C, and so on.
For detailed memory configuration rules and guidelines, use the Online DDR3 Memory Configuration Tool on the HP website ( http://www.hp.com/go/ddr3memory-configurator ).
2
2
1
1
3
3
DIMM speeds are supported as indicated in the following table.
Populated slots
(per channel)
Rank Speeds supported (MT/s)
Single- or dual-rank
Quad-rank
Single- or dual-rank
Quad-rank
Single- or dual-rank
Quad-rank
1333, 1600, 1866
1333, 1866
1333, 1600, 1866
1600
800, 1066, 1600
1066, 1333
Hardware options installation 43
Online spare population
For Online Spare memory mode configurations, observe the following guidelines:
•
Observe the general DIMM slot population guidelines (on page 43 ).
• Each channel must have a valid online spare configuration.
• Each channel can have a different valid online spare configuration.
• Each populated channel must have a spare rank: o A single dual-rank DIMM is not a valid configuration. o LRDIMMs are treated as dual-rank DIMMs.
Lockstep Memory population guidelines
For Lockstep memory mode configurations, observe the following guidelines:
•
Observe the general DIMM slot population guidelines (on page 43 ).
• DIMM configuration on all channels of a processor must be identical.
• In multi-processor configurations, each processor must have a valid Lockstep Memory configuration.
• In multi-processor configurations, each processor may have a different valid Lockstep Memory configuration.
Population order
For memory configurations with a single processor or multiple processors, populate the DIMM slots in the following order:
• LRDIMM: Sequentially in alphabetical order (A through L)
• RDIMM: Sequentially in alphabetical order (A through L)
After installing the DIMMs, use RBSU to configure Advanced ECC, online spare, or lockstep memory support.
Advanced ECC population guidelines
For Advanced ECC mode configurations, observe the following guidelines:
•
Observe the general DIMM slot population guidelines (on page 43 ).
• DIMMs may be installed individually.
Installing a DIMM
The server supports up to 48 DIMMs.
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
To install a DIMM:
1.
2.
Power down the server (on page 18 ).
Remove all power:
Hardware options installation 44
3.
4.
5.
6.
7. a. b.
Disconnect each power cord from the power source.
Disconnect each power cord from the server.
Extend the server from the rack (on page 18 ).
Remove the access panel (on page 20 ).
Remove the air baffle (on page 23 ).
Open the DIMM slot latches..
Install the DIMM.
8.
9.
10.
11.
12.
13.
Install the air baffle (on page 24 ).
Install the access panel (on page 20 ).
Install the server into the rack (" Installing the server into the rack " on page 30 ).
Connect each power cord to the server.
Connect each power cord to the power source.
Power up the server (on page 18 ).
Use RBSU (" HP ROM-Based Setup Utility " on page 74 ) to configure the memory mode.
For more information about LEDs and troubleshooting failed DIMMs, see "Systems Insight Display LED
Hot-plug hard drive options
When adding hard drives to the server, observe the following general guidelines:
• The system automatically sets all device numbers.
• If only one hard drive is used, install it in the bay with the lowest device number.
• Drives should be the same capacity to provide the greatest storage space efficiency when drives are grouped together into the same drive array.
Removing a hot-plug SAS or SATA hard drive
Hardware options installation 45
1.
2.
3.
CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.
Back up all server data on the drive.
Remove the drive.
Installing a hot-plug SAS or SATA hard drive
The server can support five SAS or SATA hard drives in an SFF configuration.
To install the component:
1. Remove the drive blank.
Hardware options installation 46
2. Prepare the drive.
3. Install the drive.
4.
Controller options
The server ships with an embedded Smart Array P420i controller. For more information about the storage controller and its features, select the relevant controller user documentation on the HP website
( http://www.hp.com/go/smartstorage/docs ).
To configure arrays, see the HP Smart Storage Administrator User Guide on the HP website
( http://www.hp.com/go/smartstorage/docs ).
Upgrade options exist for the integrated array controller. For a list of supported options, see the QuickSpecs on the HP website ( http://www.hp.com/go/productbulletin ).
The server supports FBWC. FBWC consists of a cache module and a capacitor pack. The DDR cache module buffers and stores data being written by the controller. When the system is powered on, the capacitor pack charges fully in about 5 minutes. In the event of a system power failure, a fully charged capacitor pack provides power for up to 80 seconds. During that interval, the controller transfers the cached data from DDR memory to flash memory, where the data remains indefinitely or until a controller retrieves the data.
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMMs.
Do not use the controller with cache modules designed for other controller models, because the controller can malfunction and you can lose data. Also, do not transfer this cache module to an unsupported controller model, because you can lose data.
Hardware options installation 47
CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress.
CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module. The cache module is backing up data, and data is lost if the cable is detached.
IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST error message is displayed when the server is powered up, indicating that the battery pack is temporarily disabled. No action is necessary on your part. The internal circuitry automatically recharges the batteries and enables the battery pack. This process might take up to four hours.
During this time, the cache module functions properly, but without the performance advantage of the battery pack.
NOTE: The data protection and the time limit also apply if a power outage occurs. When power is restored to the system, an initialization process writes the preserved data to the hard drives.
Installing the flash-backed write cache module
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMMs.
Do not use the controller with cache modules designed for other controller models, because the controller can malfunction and you can lose data. Also, do not transfer this cache module to an unsupported controller model, because you can lose data.
To install the component:
1. Back up all data.
2. Close all applications.
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up.
3.
4.
Power down the server (on page 18 ).
Remove all power: a. Disconnect each power cord from the power source.
5.
6. b. Disconnect each power cord from the server.
Extend the server from the rack (on page 18 ).
Remove the access panel (on page 20 ).
Hardware options installation 48
7. Install the cache module.
8. Connect the capacitor pack cable to the connector on the top of the cache module.
9.
10.
11.
12.
13.
Install the access panel (on page 20 ).
Install the server into the rack (" Installing the server into the rack " on page 30 ).
Connect each power cord to the server.
Connect each power cord to the power source.
Power up the server (on page 18 ).
Installing the flash-backed write cache capacitor pack
CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMMs.
Do not use the controller with cache modules designed for other controller models, because the controller can malfunction and you can lose data. Also, do not transfer this cache module to an unsupported controller model, because you can lose data.
Hardware options installation 49
To install the component:
1. Back up all data.
2. Close all applications.
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up.
3.
4.
5.
6.
7.
8.
Power down the server (on page 18 ).
Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.
Extend the server from the rack (on page 18 ).
Remove the access panel (on page 20 ).
already installed.
Connect the capacitor pack cable to the connector on the top of the cache module.
9. Install the FBWC capacitor pack into the FBWC capacitor pack holder.
Hardware options installation 50
o Single capacitor pack holder o Double capacitor pack holder
10. Install the FBWC capacitor pack holder into the server.
Hardware options installation 51
o Single capacitor pack holder o Double capacitor pack holder
11.
12.
13.
14.
15.
Install the access panel (on page 20 ).
Install the server into the rack (" Installing the server into the rack " on page 30 ).
Connect each power cord to the server.
Connect each power cord to the power source.
Power up the server (on page 18 ).
Redundant hot-plug power supply option
CAUTION: All power supplies installed in the server must have the same output power capacity.
Verify that all power supplies have the same part number and label color. The system becomes unstable and may shut down when it detects mismatched power supplies.
Hardware options installation 52
Label color
Green
Output
1,200W
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
To install the component:
1.
Access the product rear panel (on page 21 ).
2. Remove the blank.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply blank to cool before touching it.
3. Insert the power supply into the power supply bay until it clicks into place.
4.
5.
6.
7.
Connect the power cord to the power supply.
Route the power cord. Use best practices when routing power cords and other cables. A cable management arm is available to help with routing. To obtain a cable management arm, contact an HP authorized reseller.
Connect the power cord to the AC power source.
Be sure that the power supply LED is green (" Rear panel LEDs and buttons " on page 10 ).
Hardware options installation 53
FlexibleLOM option
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
To remove the existing FlexibleLOM:
1.
Power down the server (on page 18 ).
2. Remove all power:
3.
4.
5.
6.
7.
8. a. b.
Disconnect each power cord from the power source.
Disconnect each power cord from the server.
Remove any attached network cables.
Extend the server from the rack (on page 18 ).
Remove the access panel (on page 20 ).
Remove the primary PCIe riser cage (on page 21 ).
Loosen the thumbscrew.
Remove the existing FlexibleLOM.
Pull the FlexibleLOM toward the front of the server while removing it, to avoid catching it on the rear chassis.
Hardware options installation 54
To install the optional FlexibleLOM:
1. Firmly seat the FlexibleLOM in the slot, and then tighten the thumbscrew.
6.
7.
8.
2.
3.
4.
5.
Install the PCIe riser cage (" Install the primary PCIe riser cage " on page 22 ).
Install the access panel (on page 20 ).
Slide the server into the rack.
Connect the LAN segment cables.
Connect each power cord to the server.
Connect each power cord to the power source.
Power up the server (on page 18 ).
Expansion board options
The server supports PCI Express expansion boards. The server ships with PCIe riser boards and expansion slots. PCIe expansion boards are supported with optional riser boards.
Removing the expansion slot blanks
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.
To remove the component:
1.
Power down the server (on page 18 ).
2. Remove all power:
Hardware options installation 55
3.
4.
5.
6.
7.
8. a. b.
Disconnect each power cord from the power source.
Disconnect each power cord from the server.
Extend the server from the rack (on page 18 ).
Remove the access panel (on page 20 ).
Disconnect any external cables that are connected to the expansion board.
Disconnect any internal cables that are connected to the expansion board.
Remove the PCIe riser cage (" Remove the primary PCIe riser cage " on page 21 ).
Remove the expansion slot blank.
To replace the component, reverse the removal procedure.
Installing a half-length expansion board
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
1.
Power down the server (on page 18 ).
2.
3.
4.
5.
6.
Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.
Extend the server from the rack (on page 18 ).
Remove the access panel (on page 20 ).
Remove the PCIe riser cage (" Remove the primary PCIe riser cage " on page 21 ).
Remove the expansion slot blank (" Removing the expansion slot blanks " on page 55 ).
Hardware options installation 56
7. Install the expansion board.
8.
9.
10.
11.
12.
13.
14.
Connect any required internal or external cables to the expansion board. See the documentation that ships with the expansion board.
Install the PCIe riser cage (" Install the primary PCIe riser cage " on page 22 ).
Install the access panel (on page 20 ).
Install the server into the rack (" Installing the server into the rack " on page 30 ).
Connect each power cord to the server.
Connect each power cord to the power source.
Power up the server (on page 18 ).
Installing a full-length expansion board
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
1.
2.
3.
4.
Power down the server (on page 18 ).
Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.
Extend the server from the rack (on page 18 ).
Remove the access panel (on page 20 ).
Hardware options installation 57
5. Remove the PCIe riser cage.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
Remove the expansion slot cover.
Install the expansion board.
Connect any required internal or external cables to the expansion board. See the documentation that ships with the expansion board.
Install the PCIe riser cage (" Install the primary PCIe riser cage " on page 22 ).
Secure the full-length expansion board retainer to the full-length expansion board.
Install the access panel (on page 20 ).
Install the server into the rack (" Installing the server into the rack " on page 30 ).
Connect each power cord to the server.
Connect each power cord to the power source.
Power up the server (on page 18 ).
Secondary PCIe riser cage option
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an expansion board installed.
IMPORTANT: The secondary PCI riser cage option requires both processors.
To install the component:
1.
Power down the server (on page 18 ).
2. Remove all power:
Hardware options installation 58
3.
4.
5. a. b.
Disconnect each power cord from the power source.
Disconnect each power cord from the server.
Extend the server from the rack (on page 18 ).
Remove the access panel (on page 20 ).
Remove the PCI riser blank.
6. Remove the blank from the optional secondary PCI riser cage.
Hardware options installation 59
7. Install an expansion board into the PCI riser cage.
8. Install the optional secondary PCI riser cage.
9.
10.
11.
12.
13.
14.
If not already installed, install the secondary processor (" Processor option " on page 34 ).
Install the access panel (on page 20 ).
Install the server into the rack (" Installing the server into the rack " on page 30 ).
Connect each power cord to the server.
Connect each power cord to the power source.
Power up the server (on page 18 ).
2U rack bezel option
The 2U rack bezel helps prevent any unauthorized physical access to the server in the rack configuration. To access the hard drive cage, you must unlock and open the 2U rack bezel.
To unlock the 2U rack bezel, use the key provided with the kit.
Hardware options installation 60
Install the 2U rack bezel into the chassis, and then lock the 2U rack bezel with the key.
HP Trusted Platform Module option
For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the HP Product Bulletin website ( http://www.hp.com/go/productbulletin ).
Use these instructions to install and enable a TPM on a supported server. This procedure includes three sections:
1. Installing the Trusted Platform Module board.
2.
3.
Retaining the recovery key/password (on page 63 ).
Enabling the Trusted Platform Module (on page 63 ).
Enabling the TPM requires accessing RBSU. For more information about RBSU, see the HP website
( http://www.hp.com/support/rbsu ).
TPM installation requires the use of drive encryption technology, such as the Microsoft Windows BitLocker
Drive Encryption feature. For more information on BitLocker, see the Microsoft website
( http://www.microsoft.com
).
CAUTION: Always observe the guidelines in this document. Failure to follow these guidelines can cause hardware damage or halt data access.
When installing or replacing a TPM, observe the following guidelines:
• Do not remove an installed TPM. Once installed, the TPM becomes a permanent part of the system board.
• When installing or replacing hardware, HP service providers cannot enable the TPM or the encryption technology. For security reasons, only the customer can enable these features.
• When returning a system board for service replacement, do not remove the TPM from the system board.
When requested, HP Service provides a TPM with the spare system board.
• Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.
Hardware options installation 61
• When using BitLocker, always retain the recovery key/password. The recovery key/password is required to enter Recovery Mode after BitLocker detects a possible compromise of system integrity.
• HP is not liable for blocked data access caused by improper TPM use. For operating instructions, see the encryption technology feature documentation provided by the operating system.
Installing the Trusted Platform Module board
WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
1.
2.
3.
4.
5.
6.
7.
Power down the server (on page 18 ).
Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.
Remove the server from the rack, if necessary.
Place the server on a flat, level work surface.
Remove the access panel (on page 20 ).
Remove the PCI riser cage (" Remove the primary PCIe riser cage " on page 21 ).
Remove the air baffle (on page 23 ).
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.
8.
Hardware options installation 62
9. Install the TPM security rivet by pressing the rivet firmly into the system board.
10.
11.
12.
13.
14.
15.
16.
Install the air baffle (on page 24 ).
Install the PCI riser cage (" Install the primary PCIe riser cage " on page 22 ).
Install the access panel (on page 20 ).
Install the server into the rack (" Installing the server into the rack " on page 30 ).
Connect each power cord to the server.
Connect each power cord to the power source.
Power up the server (on page 18 ).
Retaining the recovery key/password
The recovery key/password is generated during BitLocker™ setup, and can be saved and printed after
BitLocker™ is enabled. When using BitLocker™, always retain the recovery key/password. The recovery key/password is required to enter Recovery Mode after BitLocker™ detects a possible compromise of system integrity.
To help ensure maximum security, observe the following guidelines when retaining the recovery key/password:
• Always store the recovery key/password in multiple locations.
• Always store copies of the recovery key/password away from the server.
• Do not save the recovery key/password on the encrypted hard drive.
Enabling the Trusted Platform Module
1.
2.
3.
4.
5.
When prompted during the start-up sequence, access RBSU by pressing the F9 key.
From the Main Menu, select Server Security.
From the Server Security Menu, select Trusted Platform Module.
From the Trusted Platform Module Menu, select TPM Functionality.
Select Enable, and then press the Enter key to modify the TPM Functionality setting.
Hardware options installation 63
6.
7.
8.
Press the Esc key to exit the current menu, or press the F10 key to exit RBSU.
Reboot the server.
Enable the TPM in the OS. For OS-specific instructions, see the OS documentation.
CAUTION: When a TPM is installed and enabled on the server, data access is locked if you fail to follow the proper procedures for updating the system or option firmware, replacing the system board, replacing a hard drive, or modifying OS application TPM settings.
For more information on firmware updates and hardware procedures, see the HP Trusted Platform Module
Best Practices White Paper on the HP website ( http://www.hp.com/support ).
For more information on adjusting TPM usage in BitLocker™, see the Microsoft website
( http://technet.microsoft.com/en-us/library/cc732774.aspx
).
Hardware options installation 64
Cabling
SAS drive cabling
Cabling 65
FBWC cabling
• SFF FBWC cabling
• PCIe option
Depending on the server configuration, you may need to remove the primary PCIe riser cage (on page
21 ) before cabling to a PCIe expansion board.
150W PCIe power cable option
Cabling 66
CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI expansion cage.
Connect the cable as indicated.
Cabling 67
Software and configuration utilities
Server mode
The software and configuration utilities presented in this section operate in online mode, offline mode, or in both modes.
Software or configuration utility Server mode
Online and Offline
Active Health System (on page 69 )
Integrated Management Log (on page 70 )
Intelligent Provisioning (on page 70 )
HP Insight Diagnostics (on page 71 )
HP Insight Remote Support software (on page 72 )
HP Insight Online (on page 72 )
Scripting Toolkit (" Scripting Toolkit for Windows and Linux " on page 73 )
HP Service Pack for ProLiant (on page 73 )
HP Smart Update Manager (on page 73 )
HP ROM-Based Setup Utility (on page 74 )
Array Configuration Utility
Option ROM Configuration for Arrays (on page 76 )
Online and Offline
Online and Offline
Offline
Online and Offline
Online
Online
Offline
Online
Online and Offline
Online and Offline
Offline
Online and Offline
Offline
Offline
HP product QuickSpecs
For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the HP Product Bulletin website ( http://www.hp.com/go/productbulletin ).
HP iLO Management
HP iLO Management is a set of embedded management features supporting the complete lifecycle of the server, from initial deployment through ongoing management.
HP iLO
The iLO subsystem is a standard component of HP ProLiant servers that simplifies initial server setup, server health monitoring, power and thermal optimization, and remote server administration. The iLO subsystem includes an intelligent microprocessor, secure memory, and a dedicated network interface. This design makes iLO independent of the host server and its operating system.
Software and configuration utilities 68
All key internal subsystems are monitored by iLO. SNMP alerts are sent directly by iLO regardless of the host operating system or even if no host operating system is installed.
software, drivers, or agents.
Using iLO, you can do the following:
• Access a high-performance and secure Integrated Remote Console to the server from anywhere in the world if you have a network connection to the server.
• Use the shared iLO Remote Console to collaborate with up to four server administrators.
• Remotely mount high-performance Virtual Media devices to the server.
• Securely and remotely control the power state of the managed server.
• Implement true Agentless Management with SNMP alerts from HP iLO, regardless of the state of the host server.
• Access Active Health System troubleshooting features through the iLO interface.
• Register for HP Insight Remote Support software without installing any drivers or agents.
For more information about iLO features, see the iLO documentation on the HP website
( http://www.hp.com/go/ilo/docs ).
Active Health System
HP Active Health System provides the following features:
• Combined diagnostics tools/scanners
• Always on, continuous monitoring for increased stability and shorter downtimes
• Rich configuration history
• Health and service alerts
• Easy export and upload to Service and Support
The HP Active Health System monitors and records changes in the server hardware and system configuration.
The Active Health System assists in diagnosing problems and delivering rapid resolution when server failures occur.
The Active Health System collects the following types of data:
• Server model
• Serial number
• Processor model and speed
• Storage capacity and speed
• Memory capacity and speed
• Firmware/BIOS
HP Active Health System does not collect information about Active Health System users' operations, finances, customers, employees, partners, or data center, such as IP addresses, host names, user names, and passwords. HP Active Health System does not parse or change operating system data from third-party error event log activities, such as content created or passed through by the operating system.
Software and configuration utilities 69
The data that is collected is managed according to the HP Data Privacy policy. For more information see the
HP website ( http://www.hp.com/go/privacy ).
The Active Health System log, in conjunction with the system monitoring provided by Agentless Management or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status, and service alerts for various server components.
The Agentless Management Service is available in the SPP, which is a disk image (.iso) that you can download from the HP website ( http://www.hp.com/go/spp/download ). The Active Health System log can be downloaded manually from iLO or HP Intelligent Provisioning and sent to HP.
For more information, see the following documents:
• HP iLO User Guide on the HP website ( http://www.hp.com/go/ilo/docs )
• HP Intelligent Provisioning User Guide on the HP website
( http://www.hp.com/go/intelligentprovisioning/docs )
Integrated Management Log
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.
You can view recorded events in the IML in several ways, including the following:
• From within HP SIM
• From within operating system-specific IML viewers o For Windows: IML Viewer o For Linux: IML Viewer Application
• From within the iLO user interface
•
From within HP Insight Diagnostics (on page 71 )
Intelligent Provisioning
Several packaging changes have taken place with HP ProLiant Gen8 servers: SmartStart CDs and the Smart
Update Firmware DVD no longer ship with these new servers. Instead, the deployment capability is embedded in the server as part of Intelligent Provisioning.
Intelligent Provisioning is a single-server deployment tool embedded in HP ProLiant Gen8 servers that simplifies HP ProLiant server setup, providing a reliable and consistent way to deploy HP ProLiant server configurations:
• Intelligent Provisioning assists with the OS installation process by preparing the system for installing
"off-the-shelf" and HP branded versions of leading operating system software and integrating optimized
HP ProLiant server support software.
• Intelligent Provisioning provides maintenance-related tasks through Perform Maintenance Options features.
• Intelligent Provisioning provides installation help for Microsoft Windows, Red Hat and SUSE Linux, and
VMware operating systems. For specific OS support, see the HP Intelligent Provisioning Release Notes on the HP website ( http://www.hp.com/go/intelligentprovisioning/docs ).
For more information about Intelligent Provisioning software, see the HP website
( http://www.hp.com/go/intelligentprovisioning ). For Intelligent Provisioning recovery media downloads,
Software and configuration utilities 70
see the Resources tab on the HP website ( http://www.hp.com/go/ilo ). For consolidated drive and firmware update packages, see the HP Systems and Server Software Management page on the HP website
( http://www.hp.com/go/SmartUpdate ).
HP Insight Diagnostics
HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation.
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS
is not running. To run this utility, boot the server using Intelligent Provisioning (on page 70 ).
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft Windows and Linux versions, the utility helps to ensure proper system operation.
For more information or to download the utility, see the HP website ( http://www.hp.com/servers/diags ). HP
HP Insight Diagnostics survey functionality
information on ProLiant servers.
This functionality supports operating systems that are supported by the server. For operating systems supported by the server, see the HP website ( http://www.hp.com/go/supportos ).
If a significant change occurs between data-gathering intervals, the survey function marks the previous information and overwrites the survey data files to reflect the latest changes in the configuration.
Survey functionality is installed with every Intelligent Provisioning-assisted HP Insight Diagnostics installation,
or it can be installed through the SPP (" HP Service Pack for ProLiant " on page 73 ).
Erase Utility
CAUTION: Perform a backup before running the Erase Utility. The utility sets the system to its original factory state, deletes the current hardware configuration information, including array setup and disk partitioning, and erases all connected hard drives completely. Before using this utility, see the instructions in the HP Intelligent Provisioning User Guide.
Use the Erase Utility to erase drives and Active Health System logs, and to reset RBSU settings. Run the Erase
Utility if you must erase the system for the following reasons:
• You want to install a new operating system on a server with an existing operating system.
• You encounter an error when completing the steps of a factory-installed operating system installation.
To access the Erase Utility, click the Perform Maintenance icon from the Intelligent Provisioning home screen, and then select Erase.
For more information about the Erase Utility, see the HP Intelligent Provisioning User Guide on the HP website
( http://www.hp.com/go/intelligentprovisioning/docs ).
Software and configuration utilities 71
HP Insight Remote Support software
HP strongly recommends that you register your device for remote support to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or HP contractual support agreement. HP Insight Remote Support supplements your monitoring continuously to ensure maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product’s service level. Notifications may be sent to your authorized HP Channel Partner for onsite service, if configured and available in your country.
For more information, see HP Insight Remote Support and Insight Online Setup Guide for ProLiant Gen8
Servers and BladeSystem c-Class Enclosures on the HP website ( http://www.hp.com/go/enterprise/docs ).
HP Insight Remote Support is available as part of HP Warranty, HP Care Pack Service, or HP contractual support agreement.
HP Insight Remote Support Central Connect
When you use the embedded Remote Support functionality with a ProLiant Gen8 server or BladeSystem c-Class enclosure, you can register a server or enclosure to communicate to HP through an HP Insight Remote
Support centralized Hosting Device in your local environment. All configuration and service event information is routed through the Hosting Device. This information can be viewed by using the local HP
Insight Remote Support user interface or the web-based view in HP Insight Online.
The Central Connect Remote Support configuration is available in iLO 4 1.10 and later, Intelligent
Provisioning 1.20 and later, and Onboard Administrator 3.60 and later.
For more information about the prerequisites, supported hardware, and associated operating systems for central connect, see HP Insight Remote Support Release Notes on the HP website
( http://www.hp.com/go/insightremotesupport/docs ).
HP Insight Remote Support Direct Connect
When you use the embedded Remote Support functionality with a ProLiant Gen8 server or BladeSystem c-Class enclosure, you can register a server or enclosure to communicate directly to HP Insight Online without the need to set up an HP Insight Remote Support centralized Hosting Device in your local environment. HP
Insight Online will be your primary interface for remote support information. The Direct Connect Remote
Support configuration is available in iLO 4 1.40 and later, Intelligent Provisioning 1.60 and later, and
Onboard Administrator 4.10 and later.
For more information, see the product documentation on the HP website
( http://www.hp.com/go/insightremotesupport/docs ).
HP Insight Online
HP Insight Online is a capability of the HP Support Center portal. Combined with HP Insight Remote Support
7.x, it automatically aggregates device health, asset, and support information from iLO Management with contract and warranty information, and then secures it in a single, personalized dashboard that is viewable from anywhere at any time. The dashboard organizes your IT and service data to help you understand and respond to that information more quickly. With specific authorization from you, an authorized HP Channel
Partner can also view your IT environment remotely at HP Insight Online.
For more information, see the following documents:
• For more information about using HP Insight Online, see the HP Insight Online User’s Guide.
Software and configuration utilities 72
• For more information about installing HP Insight Remote Support and enabling HP Insight Online, see the HP Insight Remote Support and Insight Online Setup Guide for ProLiant Gen8 Servers and
BladeSystem c-Class Enclosures.
These documents are available on the HP website ( http://www.hp.com/go/insightremotesupport/docs ).
Scripting Toolkit for Windows and Linux
The Scripting Toolkit for Windows and Linux is a server deployment product that delivers an unattended automated installation for high-volume server deployments. The Scripting Toolkit is designed to support
ProLiant BL, ML, DL, and SL servers. The toolkit includes a modular set of utilities and important documentation that describes how to apply these tools to build an automated server deployment process.
The Scripting Toolkit provides a flexible way to create standard server configuration scripts. These scripts are used to automate many of the manual steps in the server configuration process. This automated server configuration process cuts time from each deployment, making it possible to scale rapid, high-volume server deployments.
For more information, and to download the Scripting Toolkit, see the HP website
( http://www.hp.com/go/ProLiant/STK ).
HP Service Pack for ProLiant
SPP is a comprehensive systems software (drivers and firmware) solution delivered as a single ISO file with major server releases. This solution uses HP SUM as the deployment tool and is tested on all supported HP
ProLiant servers including HP ProLiant Gen8 servers.
SPP can be used in an online mode on a Windows or Linux hosted operating system, or in an offline mode where the server is booted to an operating system included on the ISO file so that the server can be updated automatically with no user interaction or updated in interactive mode.
For more information or to download SPP, see one of the following pages on the HP website:
• HP Service Pack for ProLiant download page ( http://www.hp.com/go/spp )
• HP Systems and Server Software Management page ( http://www.hp.com/go/SmartUpdate )
HP Smart Update Manager
HP SUM is a product used to install and update firmware, drivers, and systems software on HP ProLiant servers. HP SUM provides a GUI and a command-line scriptable interface for deployment of systems software for single or one-to-many HP ProLiant servers and network-based targets, such as iLOs, OAs, and VC Ethernet and Fibre Channel modules.
For more information about HP SUM, see the product page on the HP website
( http://www.hp.com/go/hpsum ).
To download HP SUM, see the HP website ( http://www.hp.com/go/hpsum/download ).
To access the HP Smart Update Manager User Guide, see the HP SUM Information Library
( http://www.hp.com/go/hpsum/documentation ).
Software and configuration utilities 73
HP ROM-Based Setup Utility
RBSU is a configuration utility embedded in HP ProLiant servers that performs a wide range of configuration activities that can include the following:
• Configuring system devices and installed options
• Enabling and disabling system features
• Displaying system information
• Selecting the primary boot controller
• Configuring memory options
• Language selection
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the HP RBSU Information
Library ( http://www.hp.com/go/rbsu/docs ).
Using RBSU
To use RBSU, use the following keys:
• To access RBSU, press the F9 key during power-up when prompted.
• To navigate the menu system, use the arrow keys.
• To make selections, press the Enter key.
• To access Help for a highlighted configuration option, press the F1 key.
IMPORTANT: RBSU automatically saves settings when you press the Enter key. The utility does not prompt you for confirmation of settings before you exit the utility. To change a selected setting, you must select a different setting and press the Enter key.
Default configuration settings are applied to the server at one of the following times:
• Upon the first system power-up
• After defaults have been restored
Default configuration settings are sufficient for proper typical server operation, but configuration settings can be modified using RBSU. The system will prompt you for access to RBSU with each power-up.
Auto-configuration process
The auto-configuration process automatically runs when you boot the server for the first time. During the power-up sequence, the system ROM automatically configures the entire system without needing any intervention. During this process, the ORCA utility, in most cases, automatically configures the array to a default setting based on the number of drives connected to the server.
NOTE: If the boot drive is not empty or has been written to in the past, ORCA does not automatically configure the array. You must run ORCA to configure the array settings.
NOTE: The server may not support all the following examples.
Software and configuration utilities 74
Drives installed
1
2
3, 4, 5, or 6
More than 6
Drives used
1
2
3, 4, 5, or 6
0
RAID level
RAID 0
RAID 1
RAID 5
None
To change any ORCA default settings and override the auto-configuration process, press the F8 key when prompted.
For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the HP RBSU Information
Library ( http://www.hp.com/go/rbsu/docs ).
Boot options
Near the end of the boot process, the boot options screen is displayed. This screen is visible for several seconds before the system attempts to boot from a supported boot device. During this time, you can do the following:
• Access RBSU by pressing the F9 key.
• Access Intelligent Provisioning Maintenance Menu by pressing the F10 key.
• Access the boot menu by pressing the F11 key.
• Force a PXE Network boot by pressing the F12 key.
Configuring AMP modes
Not all HP ProLiant servers support all AMP modes. RBSU provides menu options only for the modes supported by the server. Advanced memory protection within RBSU enables the following advanced memory modes:
• Advanced ECC Mode—Provides memory protection beyond Standard ECC. All single-bit failures and some multi-bit failures can be corrected without resulting in system downtime.
• Online Spare Mode—Provides protection against failing or degraded DIMMs. Certain memory is set aside as spare, and automatic failover to spare memory occurs when the system detects a degraded
DIMM. DIMMs that are likely to receive a fatal or uncorrectable memory error are removed from operation automatically, resulting in less system downtime.
For DIMM population requirements, see the server-specific user guide.
Re-entering the server serial number and product ID
After you replace the system board, you must re-enter the server serial number and the product ID.
1. During the server startup sequence, press the F9 key to access RBSU.
2.
3.
4.
Select the Advanced Options menu.
Select Service Options.
Select Serial Number. The following warning appears:
Warning: The serial number should ONLY be modified by qualified service personnel. This value should always match the serial number located on the chassis.
Software and configuration utilities 75
5.
6.
7.
8.
9.
10.
11.
Press the Enter key to clear the warning.
Enter the serial number and press the Enter key.
Select Product ID. The following warning appears:
Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis.
Enter the product ID and press the Enter key.
Press the Esc key to close the menu.
Press the Esc key to exit RBSU.
Press the F10 key to confirm exiting RBSU. The server automatically reboots.
Utilities and features
HP Smart Storage Administrator
HP SSA is a configuration and management tool for HP Smart Array controllers. Starting with HP ProLiant
Gen8 servers, HP SSA replaces ACU with an enhanced GUI and additional configuration features.
HP SSA exists in three interface formats: the HP SSA GUI, the HP SSA CLI, and HP SSA Scripting. Although all formats provide support for configuration tasks, some of the advanced tasks are available in only one format.
Some HP SSA features include the following:
• Supports online array capacity expansion, logical drive extension, assignment of online spares, and
RAID or stripe size migration
• Suggests the optimal configuration for an unconfigured system
• Provides diagnostic and SmartSSD Wear Gauge functionality on the Diagnostics tab
• For supported controllers, provides access to additional features.
For more information about HP SSA, see the HP website ( http://www.hp.com/go/hpssa ).
Option ROM Configuration for Arrays
Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign
RAID levels, and establish online spare configurations.
The utility also provides support for the following functions:
• Reconfiguring one or more logical drives
• Viewing the current logical drive configuration
• Deleting a logical drive configuration
• Setting the controller to be the boot controller
• Selecting the boot volume
If you do not use the utility, ORCA will default to the standard configuration.
Software and configuration utilities 76
For more information regarding the default configurations that ORCA uses, see the HP ROM-Based Setup
Utility User Guide on the Documentation CD or the HP RBSU Information Library
( http://www.hp.com/go/rbsu/docs ).
For more information about the storage controller and its features, select the relevant controller user documentation on the HP website ( http://www.hp.com/go/smartstorage/docs ).
To configure arrays, see the HP Smart Storage Administrator User Guide on the HP website
( http://www.hp.com/go/smartstorage/docs ).
ROMPaq utility
The ROMPaq utility enables you to upgrade the system firmware (BIOS). To upgrade the firmware, insert a
ROMPaq USB Key into an available USB port and boot the system. In addition to ROMPaq, Online Flash
Components for Windows and Linux operating systems are available for updating the system firmware.
The ROMPaq utility checks the system and provides a choice (if more than one exists) of available firmware revisions.
For more information, go to the HP website ( http://www.hp.com/go/hpsc ) and click on Drivers, Software
& Firmware. Then, enter your product name in the Find an HP product field and click Go.
Automatic Server Recovery
ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND (does not apply to HP ProLiant DL980 Servers), or panic. A system fail-safe timer, the
ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer. However, when the operating system fails, the timer expires and restarts the server.
ASR increases server availability by restarting the server within a specified time after a system hang. At the same time, the HP SIM console notifies you by sending a message to a designated pager number that ASR has restarted the system. You can disable ASR from the System Management Homepage or through RBSU.
USB support
HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices through legacy USB support, which is enabled by default in the system ROM.
Legacy USB support provides USB functionality in environments where USB support is not available normally.
Specifically, HP provides legacy USB functionality for the following:
• POST
• RBSU
• Diagnostics
• DOS
• Operating environments which do not provide native USB support
Software and configuration utilities 77
Redundant ROM support
The server enables you to upgrade or configure the ROM safely with redundant ROM support. The server has a single ROM that acts as two separate ROM images. In the standard implementation, one side of the ROM contains the current ROM program version, while the other side of the ROM contains a backup version.
NOTE: The server ships with the same version programmed on each side of the ROM.
Safety and security benefits
When you flash the system ROM, ROMPaq writes over the backup ROM and saves the current ROM as a backup, enabling you to switch easily to the alternate ROM version if the new ROM becomes corrupted for any reason. This feature protects the existing ROM version, even if you experience a power failure while flashing the ROM.
Keeping the system current
Drivers
IMPORTANT: Always perform a backup before installing or updating device drivers.
The server includes new hardware that may not have driver support on all OS installation media.
Configure and Install feature to install the OS and latest supported drivers.
If you do not use Intelligent Provisioning to install an OS, drivers for some of the new hardware are required.
These drivers, as well as other option drivers, ROM images, and value-add software can be downloaded as part of an SPP.
If you are installing drivers from SPP, be sure that you are using the latest SPP version that your server supports. To verify that your server is using the latest supported version and for more information about SPP, see the HP website ( http://www.hp.com/go/spp/download ).
To locate the drivers for a particular server, go to the HP website ( http://www.hp.com/go/hpsc ) and click on Drivers, Software & Firmware. Then, enter your product name in the Find an HP product field and click
Go.
Software and firmware
Software and firmware should be updated before using the server for the first time, unless any installed software or components require an older version.
For system software and firmware updates, use one of the following sources:
•
download page ( http://www.hp.com/go/spp ).
• Download individual drivers, firmware, or other systems software components from the server product page in the HP Support Center ( http://www.hp.com/go/hpsc ).
Software and configuration utilities 78
Version control
The VCRM and VCA are web-enabled Insight Management Agents tools that HP SIM uses to schedule software update tasks to the entire enterprise.
• VCRM manages the repository for SPP. Administrators can view the SPP contents or configure VCRM to automatically update the repository with internet downloads of the latest software and firmware from
HP.
• VCA compares installed software versions on the node with updates available in the VCRM managed repository. Administrators configure VCA to point to a repository managed by VCRM.
For more information about version control tools, see the HP Systems Insight Manager User Guide, the HP
Version Control Agent User Guide, and the HP Version Control Repository User Guide on the HP website
( http://www.hp.com/go/hpsim ).
HP operating systems and virtualization software support for
ProLiant servers
For information about specific versions of a supported operating system, see the HP website
( http://www.hp.com/go/ossupport ).
HP Technology Service Portfolio
HP Technology Services offers a targeted set of consultancy, deployment, and service solutions to meet the support needs of most business and IT environments.
Foundation Care services—Delivers scalable hardware and software support packages for HP ProLiant server and industry-standard software. You can choose the type and level of service that is most suitable for your business needs.
HP Collaborative Support—With a single call, HP addresses initial hardware and software support needs and helps to quickly identify if a problem is related to hardware or software. If the problem is related to hardware, HP resolves the problem according to service level commitments. If the reported incident is related to an HP software product or a supported third-party software product and cannot be resolved by applying known fixes, HP contacts the third-party vendor and creates a problem incident on your behalf.
HP Proactive Care—For customers running business critical environments where downtime is not an option,
HP Proactive Care helps to deliver high levels of availability. Key to these service options is the delivery of proactive service management tools to help you avoid the causes of downtime. If a problem arises, then HP offers advanced technical response from critical system support specialists for problem identification and resolution.
HP Support Center—For all service options, the HP Support Center delivers the information, tools, and experts required to support HP business products.
HP Insight Remote Support—Provides 24x7 secure remote monitoring, diagnosis, and problem resolution.
For more information, see one of the following websites:
• HP ProLiant Server Services website ( http://www.hp.com/services/proliant )
• HP BladeSystem Services website ( http://www.hp.com/services/bladesystem )
Software and configuration utilities 79
Change control and proactive notification
HP offers Change Control and Proactive Notification to notify customers 30 to 60 days in advance of upcoming hardware and software changes on HP commercial products.
For more information, refer to the HP website ( http://www.hp.com/go/pcn ).
Software and configuration utilities 80
Troubleshooting
Troubleshooting resources
The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language:
• English ( http://www.hp.com/support/ProLiant_TSG_v1_en )
• French ( http://www.hp.com/support/ProLiant_TSG_v1_fr )
• Spanish ( http://www.hp.com/support/ProLiant_TSG_v1_sp )
• German ( http://www.hp.com/support/ProLiant_TSG_v1_gr )
• Japanese ( http://www.hp.com/support/ProLiant_TSG_v1_jp )
• Simplified Chinese ( http://www.hp.com/support/ProLiant_TSG_v1_sc )
The HP ProLiant Gen8 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades. To view the guide, select a language:
• English ( http://www.hp.com/support/ProLiant_EMG_v1_en )
• French ( http://www.hp.com/support/ProLiant_EMG_v1_fr )
• Spanish ( http://www.hp.com/support/ProLiant_EMG_v1_sp )
• German ( http://www.hp.com/support/ProLiant_EMG_v1_gr )
• Japanese ( http://www.hp.com/support/ProLiant_EMG_v1_jp )
• Simplified Chinese ( http://www.hp.com/support/ProLiant_EMG_v1_sc )
Troubleshooting 81
Battery replacement
If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury:
• Do not attempt to recharge the battery.
• Do not expose the battery to temperatures higher than 60°C (140°F).
• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.
• Replace only with the spare designated for this product.
To remove the component:
1.
2.
Power down the server (on page 18 ).
Remove all power: a. b.
Disconnect each power cord from the power source.
Disconnect each power cord from the server.
3.
4.
5.
Extend the server from the rack (on page 18 ).
Remove the access panel (on page 20 ).
Remove the PCI riser cage (" Remove the primary PCIe riser cage " on page 21 ).
CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the expansion boards.
6. Remove the battery.
Battery replacement 82
IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU.
To replace the component, reverse the removal procedure.
For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.
Battery replacement 83
Regulatory information
Safety and regulatory compliance
For safety, environmental, and regulatory information, see Safety and Compliance Information for Server,
Storage, Power, Networking, and Rack Products, available at the HP website
( http://www.hp.com/support/Safety-Compliance-EnterpriseProducts ).
Turkey RoHS material content declaration
Ukraine RoHS material content declaration
Warranty information
HP ProLiant and X86 Servers and Options ( http://www.hp.com/support/ProLiantServers-Warranties )
HP Enterprise Servers ( http://www.hp.com/support/EnterpriseServers-Warranties )
HP Storage Products ( http://www.hp.com/support/Storage-Warranties )
HP Networking Products ( http://www.hp.com/support/Networking-Warranties )
Regulatory information 84
Electrostatic discharge
Preventing electrostatic discharge
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
To prevent electrostatic damage:
• Avoid hand contact by transporting and storing products in static-safe containers.
• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
• Place parts on a grounded surface before removing them from their containers.
• Avoid touching pins, leads, or circuitry.
• Always be properly grounded when touching a static-sensitive component or assembly.
Grounding methods to prevent electrostatic discharge
Several methods are used for grounding. Use one or more of the following methods when handling or installing electrostatic-sensitive parts:
• Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist straps are flexible straps with a minimum of 1 megohm ±10 percent resistance in the ground cords. To provide proper ground, wear the strap snug against the skin.
• Use heel straps, toe straps, or boot straps at standing workstations. Wear the straps on both feet when standing on conductive floors or dissipating floor mats.
• Use conductive field service tools.
• Use a portable field service kit with a folding static-dissipating work mat.
If you do not have any of the suggested equipment for proper grounding, have an authorized reseller install the part.
For more information on static electricity or assistance with product installation, contact an authorized reseller.
Electrostatic discharge 85
Specifications
Environmental specifications
Specification Value
Temperature range*
Operating 10°C to 35°C (50°F to 95°F)
Shipping -30°C to 50°C (-22°F to 122°F)
Storage -30°C to 60°C (-22°F to 140°F)
Maximum wet bulb temperature
28°C (82.4°F)
Relative humidity
(noncondensing)**
Operating 10% to 90%
Non-operating 5% to 95%
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for storage corresponds to a pressure minimum of 70 KPa.
Mechanical specifications
Specification Value
Height
Depth
Width
Weight (maximum)
Weight (minimum)
8.73 cm (3.44 in)
74.93 cm (29.50 in)
44.54 cm (17.54 in)
27.66 kg (61.00 lb)
18.59 kg (41.00 lb)
Power supply specifications
The server is configured with the HP 1200 W CS HE Power Supply (94%) (" HP 1200 W CS HE Power Supply
(94%) specifications " on page 86 ).
HP 1200 W CS HE Power Supply (94%) specifications
Specification Value
Input requirements
Rated input voltage
Rated input frequency
100 to 120 VAC, 200 to
240 VAC
50 Hz to 60 Hz
Specifications 86
Rated input current
Maximum rated input power
Btus per hour
Power supply output
Rated steady-state power
Maximum peak power
9.1 A at 100 VAC
6.7 A at 200 VAC
897 W at 100V AC input
1321 W at 200V AC input
3408 at 120V AC input
4433 at 200V to 240V AC input
800 W at 100V AC input
900 W at 120V AC input
1200 W at 200V to 240V AC input
800 W at 100V AC input
900 W at 120V AC input
1200 W at 200V to 240V AC input
Specifications 87
Support and other resources
Before you contact HP
Be sure to have the following information available before you call HP:
• Active Health System log (HP ProLiant Gen8 or later products)
Download and have available an Active Health System log for 3 days before the failure was detected.
For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP website ( http://www.hp.com/go/ilo/docs ).
• Onboard Administrator SHOW ALL report (for HP BladeSystem products only)
For more information on obtaining the Onboard Administrator SHOW ALL report, see the HP website
( http://www.hp.com/go/OAlog ).
• Technical support registration number (if applicable)
• Product serial number
• Product model name and number
• Product identification number
• Applicable error messages
• Add-on boards or hardware
• Third-party hardware or software
• Operating system type and revision level
HP contact information
For United States and worldwide contact information, see the Contact HP website
( http://www.hp.com/go/assistance ).
In the United States:
• To contact HP by phone, call 1-800-334-5144. For continuous quality improvement, calls may be recorded or monitored.
• If you have purchased a Care Pack (service upgrade), see the Support & Drivers website
( http://www8.hp.com/us/en/support-drivers.html
). If the problem cannot be resolved at the website, call 1-800-633-3600. For more information about Care Packs, see the HP website
( http://pro-aq-sama.houston.hp.com/services/cache/10950-0-0-225-121.html
).
Customer Self Repair
HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service
Support and other resources 88
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts:
• Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.
• Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,
HP requires that an authorized service provider replace the part. These parts are identified as "No" in the
Illustrated Parts Catalog.
Based on availability and where geography permits, CSR parts will be shipped for next business day delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits.
If assistance is required, you can call the HP Technical Support Center and a technician will help you over the telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material. Failure to return the defective part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping and part return costs and determine the courier/carrier to be used.
For more information about HP's Customer Self Repair program, contact your local service provider. For the
North American program, refer to the HP website ( http://www.hp.com/go/selfrepair ).
Réparation par le client (CSR)
Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:
Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.
Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.
REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le
Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou le transporteur à utiliser.
Support and other resources 89
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP
( http://www.hp.com/go/selfrepair ).
Riparazione da parte del cliente
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza
HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione. Vi sono due categorie di parti CSR:
Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.
Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.
NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP.
Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.
Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il programma in Nord America fare riferimento al sito Web HP ( http://www.hp.com/go/selfrepair ).
Customer Self Repair
HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere
Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der
Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses
Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:
Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den
Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen
Service berechnet.
Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer
Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche
Kosten anfallen.
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HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des
Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.
Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen
Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen
Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen
Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer
Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den
Kurier-/Frachtdienst.
Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter
( http://www.hp.com/go/selfrepair ).
Reparaciones del propio cliente
Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self
Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente
CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:
• Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a
HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.
• Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.
NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el catálogo ilustrado de componentes.
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas
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sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente ( http://www.hp.com/go/selfrepair ).
Customer Self Repair
Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee categorieën CSR-onderdelen:
Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.
Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.
OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.
Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service
Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website ( http://www.hp.com/go/selfrepair ).
Reparo feito pelo cliente
Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se, durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente.
Existem duas categorias de peças CSR:
Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.
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Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado.
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis.
A peça com defeito deve ser enviada com a documentação correspondente no material de transporte fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a
HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço postal a ser utilizado.
Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP
( http://www.hp.com/go/selfrepair ).
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Acronyms and abbreviations
ABEND abnormal end
ACU
Array Configuration Utility
AMP
Advanced Memory Protection
ASR
Automatic Server Recovery
CSA
Canadian Standards Association
CSR
Customer Self Repair
DDDC
Double Device Data Correction
DDR double data rate
FBWC flash-backed write cache
IEC
International Electrotechnical Commission iLO
Integrated Lights-Out
IML
Integrated Management Log
Acronyms and abbreviations 96
LFF large form factor
NMI nonmaskable interrupt
NVRAM nonvolatile memory
ORCA
Option ROM Configuration for Arrays
PCIe
Peripheral Component Interconnect Express
POST
Power-On Self Test
RBSU
ROM-Based Setup Utility
RDIMM registered dual in-line memory module
RDP
Rapid Deployment Pack
SAS serial attached SCSI
SATA serial ATA
SDDC
Single Device Data Correction
SELV separated extra low voltage
SFF small form factor
Acronyms and abbreviations 97
SIM
Systems Insight Manager
TMRA recommended ambient operating temperature
TPM
Trusted Platform Module
UDIMM unregistered dual in-line memory module
UID unit identification
USB universal serial bus
VCA
Version Control Agent
Acronyms and abbreviations 98
Documentation feedback
HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback ( mailto:[email protected]
).
Include the document title and part number, version number, or the URL when submitting your feedback.
Documentation feedback 99
Index
A
Advanced ECC memory 42, 44, 75
Array Configuration Utility (ACU) 76
ASR (Automatic Server Recovery) 77
Automatic Server Recovery (ASR) 77
B
C
components 6 components, identification 6
CSR (customer self repair) 88 customer self repair (CSR) 88
D
DIMM installation guidelines 43
DIMMs, single- and dual-rank 41
E
electrical grounding requirements 28
enabling the Trusted Platform Module 63
environmental specifications 86
expansion board options 55 expansion boards 55
F
Federal Communications Commission (FCC)
G
Index 100
H
hard drive bays 6, 14 hard drive LEDs 14 hard drives, determining status of 14
hardware options installation 30, 34
hot-plug SAS hard drive options 45
HP Insight Remote Support software 72, 79
HP Service Pack for ProLiant 68, 71, 73
HP Smart Update Manager overview 40, 68, 73
I
iLO (Integrated Lights-Out) 68, 69, 70
IML (Integrated Management Log) 68, 70
installation, server options 30, 34
installing a hot-plug SAS hard drive 46
installing the full-length expansion board retainer 22
installing the server into the rack 30
installing the Trusted Platform Module board 62
Integrated Lights-Out (iLO) 68, 70
Integrated Management Log (IML) 70
Intelligent Provisioning 68, 70, 71
J
L
M
memory 38, 41, 43 memory configurations 42, 43
memory subsystem architecture 40
memory, configuration requirements 42, 44
N
O
online spare memory 43, 44, 75
Option ROM Configuration for Arrays (ORCA) 68,
ORCA (Option ROM Configuration for Arrays) 68,
P
power distribution unit (PDU) 28
power supply specifications 86
powering down 18 powering up 18 preparation procedures 18
R
RBSU (ROM-Based Setup Utility) 68, 74, 75
Index 101
regulatory compliance notices 84
removing a hot-plug SAS hard drive 45
retaining the recovery key/password 63
S
safety considerations 29, 78, 84, 85
server features and options 34
space and airflow requirements 26
supported operating systems 79
Systems Insight Display 7, 8, 19
Systems Insight Display LEDs 7, 8
T
Taiwan battery recycling notice 84
technical support 79, 88 telephone numbers 88
TPM (Trusted Platform Module) 61, 63
U
V
W
Index 102
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