Tesla_C1060_boardSpec_v03

Thermal

Specifications

Thermal Qualification Summary

The information contained in this summary report is intended to provide users of the Tesla C1060 computing processor with thermal information necessary to assist in thermal management efforts. This information is not intended to provide a specific thermal management solution. However, it does show an approach that result in the reliable operation of the Tesla C1060.

The product and cooling solutions used are:

‰

Device product: Tesla C1060 board

‰

Cooling solution: Fan sink solution, Cooler Master TM72 NV P/N: 580-10607-

2000-000. The cooling solution assembly includes a heat sink, fan, backplate, thermal grease interface material, and screws.

‰

Result: Under the operating conditions described in the following tables, the

Tesla C1060 passed thermal qualification.

September 22, 2008 | BD-04111-001_v03

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Tesla C1060 Computing Processor Board

Table 6. Test Setup and Configuration

System Part

PC

Configuration

Motherboard attached to a chassis frame – entire unit placed in an acrylic box

Power Supply

CPU

ThermalTake 1000 W

Intel Core 2 Extreme QX9650 Yorkfield 3.0 GHz

12 MB L2 Cach LGA 775 130 W Quad-Core processor

DDR3 1333; 2 – 1 GB OCZ memory cards SDRAM

PC Operating System Windows XP 32-bit

GPU Computing ProcessingBoard Tesla C1060

BIOS 62.00.1E.00.00

Display Driver 177.83

Clock Speed 1.296 GHz (core) 800 MHz (mclk)

Table 7. Sample Thermal Results and Specification

Test

Application

Test 1:

3DMark06/GT2

Firefly

GPU junction maximum temperature specification under any operating conditions.

Tjunction(°C)*

102

TA(°C)**

87 45.4

At any ambient

Temperature

Cooling

Solution

Fan sink solution,

NV P/N 580-

10607-2000-000

* Junction temperature is reported by NVIDIA thermal sensor

** Ambient air temperature – average of 3 sensors positioned at the inlet to the GPU fan

September 22, 2008 | BD-04111-001_v03

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