INTEGRATED CIRCUITS

DATA SHEET

TDA7052A/AT

1 W BTL mono audio amplifier with

DC volume control

Product specification

Supersedes data of August 1991

July 1994

NXP Semiconductors

1 W BTL mono audio amplifier with DC volume control

Product specification

TDA7052A/AT

FEATURES

• DC volume control

• Few external components

• Mute mode

• Thermal protection

• Short-circuit proof

• No switch-on and off clicks

• Good overall stability

• Low power consumption

• Low HF radiation

• ESD protected on all pins

QUICK REFERENCE DATA

I

SYMBOL

V

P

P

O

G

φ

P v

THD

PARAMETERS positive supply voltage range output power

TDA7052A

TDA7052AT maximum total voltage gain gain control range total quiescent current total harmonic distortion

TDA7052A

TDA7052AT

R

R

L

L

GENERAL DESCRIPTION

The TDA7052A/AT are mono BTL output amplifiers with

DC volume control. They are designed for use in TV and monitors, but also suitable for battery-fed portable recorders and radios.

Missing Current Limiter (MCL)

A MCL protection circuit is built-in. The MCL circuit is activated when the difference in current between the output terminal of each amplifier exceeds 100 mA (typical

300 mA). This level of 100 mA allows for headphone applications (single-ended).

CONDITIONS

= 8

Ω; V

P

= 16

Ω; V

= 6 V

P

= 6 V

V

P

= 6 V; R

L

=

∞

P

O

= 0.5 W

P

O

= 0.25 W

ORDERING INFORMATION

EXTENDED TYPE

NUMBER

TDA7052A

TDA7052AT

Notes

1. SOT97-1.

2. SOT96-1.

8

8

PINS PIN POSITION

DIL mini-pack

PACKAGE

MATERIAL plastic plastic

MIN.

4.5

−

TYP.

MAX.

UNIT

18 V

−

−

1.0

0.5

34.5

75

−

1.1

0.55

35.5

80

7

0.3

0.3

−

−

36.5

−

12

W

W dB dB mA

1

1

%

%

SOT97 (1)

CODE

SOT96A

(2)

July 1994 2

NXP Semiconductors

1 W BTL mono audio amplifier with DC volume control

Product specification

TDA7052A/AT handbook, full pagewidth n.c.

7

TDA7052A

TDA7052AT positive input

DC volume control

2

4

VP

1

I + i 5 positive output

I – i 8 negative output

V ref

STABILIZER TEMPERATURE

PROTECTION

3 6

Fig.1 Block diagram.

signal ground power ground

MCD385 - 1

PINNING

SYMBOL

V

P

IN+

GND1

VC

OUT+

GND2 n.c

OUT

−

6

7

4

5

8

1

2

3

PIN DESCRIPTION positive supply voltage positive input signal ground

DC volume control positive output power ground not connected negative output handbook, halfpage

VP 1

IN + 2

TDA7052A

TDA7052AT

GND1 3

VC 4

8 OUT –

7 n.c.

6

5

GND2

OUT +

MCD384

Fig.2 Pin configuration.

July 1994 3

NXP Semiconductors

1 W BTL mono audio amplifier with DC volume control

Product specification

TDA7052A/AT

FUNCTIONAL DESCRIPTION

The TDA7052A/AT are mono BTL output amplifiers with

DC volume control, designed for use in TV and monitors but also suitable for battery fed portable recorders and radios.

In conventional DC volume circuits the control or input stage is AC coupled to the output stage via external capacitors to keep the offset voltage low.

In the TDA7052A/AT the DC volume control stage is integrated into the input stage so that no coupling capacitors are required and yet a low offset voltage is maintained. At the same time the minimum supply remains low.

The BTL principle offers the following advantages:

• Lower peak value of the supply current

• The frequency of the ripple on the supply voltage is twice the signal frequency.

Thus a reduced power supply with smaller capacitors can be used which results in cost savings.

For portable applications there is a trend to decrease the supply voltage, resulting in a reduction of output power at conventional output stages. Using the BTL principle increases the output power.

The maximum gain of the amplifier is fixed at 35.5 dB. The

DC volume control stage has a logarithmic control characteristic.

The total gain can be controlled from 35.5 dB to

−44 dB. If the DC volume control voltage is below 0.3 V, the device switches to the mute mode.

The amplifier is short-circuit proof to ground, V

P

and across the load. Also a thermal protection circuit is implemented. If the crystal temperature rises above

+150

°C the gain will be reduced, so the output power is reduced.

Special attention is given to switch on and off clicks, low

HF radiation and a good overall stability.

T amb

T stg

T vj

T sc

V

2

V

4

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134)

SYMBOL

V

P

I

ORM

I

OSM

P tot

PARAMETER supply voltage range repetitive peak output current non-repetitive peak output current total power dissipation

TDA7052A

TDA7052AT operating ambient temperature range storage temperature range virtual junction temperature short-circuit time input voltage pin 2 input voltage pin 4

CONDITIONS

T amb

≤ 25%

−

−

−

−

−

−40

−55

−

−

−

−

MIN.

1

8

8

MAX.

18

1.25

1.5

1.25

0.8

+85

+150

+150

V

A

A

W

W

°C

°C

°C hr

V

V

UNIT

July 1994 4

NXP Semiconductors

1 W BTL mono audio amplifier with DC volume control

Product specification

TDA7052A/AT

THERMAL RESISTANCE

R th j-a

SYMBOL PARAMETER from junction to ambient in free air

TDA7052A

TDA7052AT

THERMAL RESISTANCE

Notes to the thermal resistance

TDA7052A: V

P

Therefore T

= 6 V; R amb(max)

L

= 8

Ω. The maximum sine-wave dissipation is 0.9 W.

= 150

− 100 × 0.9 = 60 °C.

TDA7052AT: V

P

= 6 V; R

Therefore T amb(max)

L

= 16

Ω. The maximum sine-wave dissipation is 0.46 W.

= 150

− 155 × 0.46 = 78 °C.

100 K/W

155 K/W

July 1994 5

NXP Semiconductors

1 W BTL mono audio amplifier with DC volume control

Product specification

TDA7052A/AT

CHARACTERISTICS

V

P

= 6 V; T amb

= 25

°C; f = 1 kHz; TDA7052A: R

L

= 8

Ω; TDA7052AT: R

L

= 16

Ω; unless otherwise specified (see Fig.6).

CONDITIONS TYP.

SYMBOL

V

P

I

P

PARAMETER positive supply voltage range total quiescent current V

P

= 6 V; R note 1

L

=

∞

MIN.

4.5

−

−

7

MAX.

UNIT

18

12

V mA

Maximum gain; V

4

= 1.4 V

P

O

THD

G

V

V

B

I v no(rms) output power

TDA7052A

TDA7052AT total harmonic distortion

TDA7052A

TDA7052AT voltage gain input signal handling noise output voltage (RMS value) bandwidth

THD = 10%

P

P

V

O

O

= 0.5 W

= 0.25 W

4

= 0.8 V; THD

< 1% f = 500 kHz; note 2

−1 dB note 3

1.0

0.5

−

−

38

−

15

1.1

0.55

0.3

0.3

34.5

35.5

0.5

−

−

0.65

210

20 Hz to

300 kHz

46

0

20

−

−

1

1

−

−

36.5

dB

−

V

μV

−

W

W

%

% dB

150 mV

25 k

Ω

SVRR

|V off

|

Z

I supply voltage ripple rejection

DC output offset voltage input impedance (pin 2)

Minimum gain; V

4

= 0.5 V

G v

V no(rms) voltage gain noise output voltage (RMS value)

Mute position

V

O output voltage in mute position

DC volume control

φ gain control range

I

4 control current note 4

V

V

4

≤ 0.3 V; V

4

= 0.4 V

I

= 600 mV

−

−

−

75

60

−44

20

−

80

70

−

30

30

−

80 dB

μV

μV dB

μA

Notes to the characteristics

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage dividend by R

L

.

2. The noise output voltage (RMS value) at f = 500 kHz is measured with R

S

= 0

Ω and bandwidth = 5 kHz.

3. The ripple rejection is measured with R

S

= 0

Ω and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV, (RMS value) is applied to the positive supply rail.

4. The noise output voltage (RMS value) is measured with R

S

= 5 k

Ω unweighted.

July 1994 6

NXP Semiconductors

1 W BTL mono audio amplifier with DC volume control

Product specification

TDA7052A/AT

MCD388 gain

(dB)

20

0

– 20

– 40

– 60

– 80

0 0.4

0.8

1.2

1.6

V

4

(V)

2.0

Fig.3 Gain control as a function of DC volume control.

MCD389 - 1

1000 handbook, halfpage

V noise

( μ V)

800

600

400

200

0

0 0.4

0.8

1.2

1.6

2.0

Fig.4

Noise output voltage as a function of DC volume control.

MCD390 - 1

100 handbook, halfpage

I4

(

μ

A)

60

20

– 20

– 60

– 100

0 0.4

0.8

1.2

1.6

2.0

Fig.5

Control current as a function of DC volume control.

July 1994 7

NXP Semiconductors

1 W BTL mono audio amplifier with DC volume control

APPLICATION INFORMATION handbook, full pagewidth

Product specification

TDA7052A/AT

(1)

100 nF 220

μ

F positive input

0.47

μ

F n.c.

7

2

4

TDA7052A

TDA7052AT

1

I + i

R

S

5 k

Ω

DC volume control

V ref

STABILIZER TEMPERATURE

PROTECTION

I – i

This capacitor can be omitted if the 220

μF electrolytic capacitor is connected close to pin 1.

Fig.6 Test and application diagram.

3 6

5

8

R = 8 Ω

(TDA7052A)

R = 16 Ω

(TDA7052A/AT) ground

MCD386 - 1 handbook, halfpage volume control

4

1 μ F 1 M Ω

MCD387

Fig.7

Application with potentiometer as volume control; maximum gain = 30 dB.

July 1994 8

NXP Semiconductors

1 W BTL mono audio amplifier with DC volume control

PACKAGE OUTLINES

DIP8: plastic dual in-line package; 8 leads (300 mil)

Product specification

TDA7052A/AT

SOT97-1

D

L

Z

8 b e

A

2 A

A

1 b

1 w M

5 b

2 pin 1 index

E c

M

M

E

H

1 4

0 5 scale

10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

A max.

A min.

A max.

b b

1 b

2 c D

(1)

E

(1) mm inches

4.2

0.17

0.51

0.02

3.2

0.13

1.73

1.14

0.068

0.045

0.53

0.38

0.021

0.015

1.07

0.89

0.042

0.035

0.36

0.23

0.014

0.009

9.8

9.2

0.39

0.36

6.48

6.20

0.26

0.24

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. e

2.54

0.1

OUTLINE

VERSION

SOT97-1

IEC

050G01

REFERENCES

JEDEC JEITA

MO-001 SC-504-8 e

1

7.62

0.3

L

3.60

3.05

0.14

0.12

M

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

M

H

10.0

8.3

0.39

0.33

w

0.254

Z

(1) max.

1.15

0.01

0.045

ISSUE DATE

99-12-27

03-02-13

July 1994 9

NXP Semiconductors

1 W BTL mono audio amplifier with DC volume control

SO8: plastic small outline package; 8 leads; body width 3.9 mm

Product specification

TDA7052A/AT

SOT96-1

8

Z y pin 1 index

1 e

D E A

X c

H

E

5 b p

4 w

M

A

2

A

1

L

L p detail X

Q

θ

A v M A

0 2.5

scale

5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

A max.

A

1

A

2

A

3 b p c D

(1)

E

(2) e H

E mm inches

1.75

0.069

0.25

0.10

0.010

0.004

1.45

1.25

0.057

0.049

0.25

0.01

0.49

0.36

0.019

0.014

0.25

0.19

0.0100

0.0075

5.0

4.8

0.20

0.19

4.0

3.8

0.16

0.15

1.27

0.05

6.2

5.8

0.244

0.228

L L p

Q

1.05

0.041

1.0

0.4

0.039

0.016

0.7

0.6

0.028

0.024

v

0.25

0.01

w y Z

(1)

0.25

0.01

0.1

0.004

0.7

0.3

0.028

0.012

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE

VERSION

SOT96-1

IEC

076E03

REFERENCES

JEDEC JEITA

MS-012

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27

03-02-18

θ

8 o

0 o

July 1994 10

NXP Semiconductors

1 W BTL mono audio amplifier with DC volume control

Product specification

TDA7052A/AT

SOLDERING

Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011).

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from

215 to 250

°C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at

45

°C.

DIP

S OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is

260

°C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg max

). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

W AVE SOLDERING

Wave soldering techniques can be used for all SO packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must be parallel to the solder flow.

• The package footprint must incorporate solder thieves at the downstream end.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260

°C, and maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150

°C within

6 seconds. Typical dwell time is 4 seconds at 250

°C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

R EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300

°C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400

°C, contact may be up to 5 seconds.

SO

R EFLOW SOLDERING

Reflow soldering techniques are suitable for all SO packages.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

R EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300

°C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between

270 and 320

°C.

July 1994 11

NXP Semiconductors

1 W BTL mono audio amplifier with DC volume control

Product specification

TDA7052A/AT

DATA SHEET STATUS

DOCUMENT

STATUS (1)

Objective data sheet

PRODUCT

STATUS

(2)

DEFINITION

Development This document contains data from the objective specification for product development.

Qualification

Production

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary data sheet

Product data sheet

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DISCLAIMERS

Limited warranty and liability

⎯ Information in this document is believed to be accurate and reliable.

However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort

(including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial

sale of NXP Semiconductors.

Right to make changes

⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use

⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications

⎯ Applications that are described herein for any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP

Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

July 1994 12

NXP Semiconductors

1 W BTL mono audio amplifier with DC volume control

Product specification

TDA7052A/AT

Limiting values

⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and

(proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale

⎯ NXP

Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP

Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license

⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control

⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

Quick reference data

⎯ The Quick reference data is an extract of the product data given in the Limiting values and

Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products

⎯ Unless this data sheet expressly states that this specific NXP

Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP

Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies

NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP

Semiconductors’ standard warranty and NXP

Semiconductors’ product specifications.

July 1994 13

NXP Semiconductors

provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management,

Interface, Security and Digital Processing expertise

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version.

Contact information

For additional information please visit: http://www.nxp.com

For sales offices addresses send e-mail to: [email protected]

© NXP B.V. 2010

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Printed in The Netherlands RM5/02/pp14 Date of release: July 1994