Ver. A01
Technical Document
GlobalTop Technology Inc.
BLE Module
Application Notes
(CSR1010 series)
Revision: A01
Reference layout, design tips, guides, and cautions for GlobalTop BLE modules.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without prior
permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
th
No.16 Nan-ke 9 Rd, Science-Based Industrial Park, Tainan, 741, Taiwan, R.O.C.
Tel: +886-6-5051268 / Fax: +886-6-5053381 / Email: [email protected] / Web: www.gtop-tech.com
GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
Version History
Title:
Subtitle:
Doc Type:
GlobalTop BLE Module Application Notes (CSR1010 series)
BLE Module
Technical Document
Revision
A00
Date
2014-04-01
Editor
Yingjie
A01
2014-04-30
Dylan
Description
First Release
Modify Technical Support.
Modify Appendix VI: Cautions on Reflow
Soldering Process.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
3
Table of Contents
Attention ................................................................................................................................... 4
Technical Support ...................................................................................................................... 5
1. Introduction .......................................................................................................................... 6
2. General Rules for Design-in .................................................................................................... 7
2.1 Circuit Design ....................................................................................................... 7
2.1.1 Power supply VCC .................................................................................................................. 7
2.1.2 UART (RX/TX) –Serial Interface .............................................................................................. 8
2.1.3 Download Firmware (SPI-Serial Interface) ............................................................................. 9
2.1.4 GND-Ground ........................................................................................................................ 10
2.2 Layout Guideline ................................................................................................ 11
2.2.1 Trace..................................................................................................................................... 11
2.2.2 Ground Segmentation .......................................................................................................... 12
2.2.3 Ground Plane ....................................................................................................................... 12
2.2.4 Ground Clarence .................................................................................................................. 13
3. Thermal Profile for SMD Modules .........................................................................................14
4. Manual Soldering..................................................................................................................15
5. Contact Information..............................................................................................................16
Appendix I: UART to RS232 Interface.........................................................................................17
Appendix II: UART to USB Interface ...........................................................................................18
Appendix VI: Cautions on Reflow Soldering Process ..................................................................19
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
Attention
Please read carefully before you start:
This application note provides the necessary guideline to successfully design a system
using BLE modules. For detailed module specification, please refer to the
corresponding datasheet of BLE module.
BLE Module is an electrostatic sensitive device, please don’t touch BLE module directly,
please follow ESD safety rule when handling.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
Technical Support
If you have any technical problems or cannot find the required information in our
documents, please feel free to contact us for technical support. Below is a list of information
which you can provide to us to help us to determining the source of the problem and the
necessary solution:
1. Your company name and website
2. Description about application and system
3. BLE module type
4. BLE firmware version
5. Description of the question or problems encountered, together with figures, pictures
or videos files
―
Test setup
―
The problem or issue shown in figures
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
1. Introduction
GlobalTop has various BLE modules designed for many different applications.
The application note is compliant with the models listed below using CSR1010 chip:
Module built-in PCB Antenna: Bcs-u1623
Bcs-u1623
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
2. General Rules for Design-in
In order to obtain good BLE performances, there are some rules which require attentions for using
BLE module.
2.1 Circuit Design
Compatible Model: Bcs-u1623
2.1.1 Power supply VCC
It is necessary to provide a clean and stable power supply for our BLE module in order to obtain
good performance. Unstable power source will have a significant negative impact on the BLE
performance. To achieve this, the Vcc ripple must be controlled under 50mV pp . In addition, there are
also some important suggestions for main power circuit design:
(1). Add ferrite bead, power choke or low pass filter for power noise reduction.
(2). Linear regulator is better than switch DC/DC power supply in ripple.
(3). Use enough decoupling capacitors beside VCC for stable voltage.
Power design for BLE module
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
2.1.2 UART (RX/TX) –Serial Interface
Compatible Model: Bcs-u1623
(1). UART is the default interface (TTL level) that has the baud rate ranging from 1200 bps to 2Mbps.
(2). Placing damping resistor on the RX and TX of the BLE module could limit the interference from
host MCU or high speed digital logics. Fine tuning the damping resistor is required to suppress
interference efficiently. The damping resistor would be a chock coil as well.
(3). Please leave RX open if it is not used as there is an internal pull-up to VCC.
(4). Please don’t connect diode(s) to RX/TX as it will decrease signal driving capability which might
adversely affect RX/TX signal level (ex. no data output).
(5). If RS232 logic-level is needed for any particular application, and then the level shifter is
necessary. Please refer to “Appendix I: UART to RS232 Interface” for more information.
(6). If USB logic-level is needed for any particular application. Please refer to “Appendix II: UART to
USB Interface” for more information.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
2.1.3 Download Firmware (SPI-Serial Interface)
Below shows a typical download firmware circuit.
Bellow shows the method for firmware download.
(1). Used CSR Bluetooth download firmware tool (USB to SPI transform):
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prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
(2). Via Parallel port to download Firmware connect circuit as below:
Parallel Port (25pin)
2.1.4 GND-Ground
Compatible Model: Bcs-u1623
Make sure all GND pins of the module are connected to a good ground plane.
Please refer to “2.2.2 Ground Segmentation”.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
2.2 Layout Guideline
Please follow the layout criteria to design a system using BLE module.
2.2.1 Trace
Compatible Model: Bcs-u1623
(1). The USB differential signals should be traced closely and of equal-length for minimum radiation
and better noise immunity.
(2). Any right angle turn in trace routing should be accomplished with two 135 degree turn or an arc
turn
It is better to have independent trace of power source for any device
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
2.2.2 Ground Segmentation
The separation of ground between BLE module and the rest of the system is recommended to avoid
interference. If this is not possible, it is best to follow these typical rules: segmentation of ground
between digital and analogue system, high current and low current system, and different radiation
systems in general.
One way to segment the ground is to place digital and noise component at one corner of the board,
while placing analog and quiet components at the opposite corner of the board. Make sure there is
no crossing of microstrip or current between the two component sets and grounds of each sets are
contacted in one point only.
Another way to do this is the place the two different sets at different layers of the board, while the
ground of each layer is contacted in one point only (preferable at border of the board).
2.2.3 Ground Plane
Compatible Model: Bcs-u1623
It must place the ground plane on the top layer of the PCB, directly underneath the BLE module as
the figure below shows:
A GND plane on the both side of the module will affect the antenna efficiency. It is better to have
the GND plane as small as possible.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
2.2.4 Ground Clarence
Compatible Model: Bcs-u1623
The PCB trace Antenna of BLE module is a sensitive component to the environment.
The circled area as shown in the figure is a ground clearance area on the top, bottom and in all
layers.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
3. Thermal Profile for SMD Modules
The following information is Pb-Free compliant.
(The details are for reference only)
SMT Reflow Soldering Temperature Profile
Average ramp-up rate (25 ~ 150°C): 3°C/sec. max.
Average ramp-up rate (270°C to peak): 3°C/sec. max.
Preheat: 175 ± 25°C, 60 ~ 120 seconds
Temperature maintained above 217°C: 60~150 seconds
Peak temperature: 250 +0/-5°C, 20~40 seconds
Ramp-down rate: 6°C/sec. max.
Time 25°C to peak temperature: 8 minutes max.
SMT Solder Mask
Please use the dimension of PCB pad as reference and shrink the size by 0.1 to 0.2 mm and use that
as layout for paste mask. (For PCB pad layout, please refer to “Recommended PCB pad layout” on
individual BLE module data sheet)
Manual Soldering
Soldering iron: Bit Temperature: Under 380°C |
Time: Under 3 second.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
4. Manual Soldering
Soldering iron:
Heat Temperature: Under 380°C
| Time: Under 3 sec.
Notes:
1. Please do not directly touch the soldering pads on the surface of the PCB boardto prevent
further oxidation
2. The solder paste must be defrosted to room temperature before use so it can return to its
optimal working temperature. The time required for this procedure is unique and dependent
on the properties of the solder paste used.
3. The steel plate must be properly assessed before and after use, so its measurement stays
strictly within the specification set by SOP.
4. Please watch out for the spacing between soldering joint, as excess solder may cause
electrical shortage
5. Please exercise with caution and do not use extensive amount of flux due to possible siphon
effects on neighboring components, which may lead to electrical shortage.
6. Please do not use the heat gun for long periods of time when removing the shielding or
inner components of the BLE module, as it is very likely to cause a shift to the inner
components and will leads to electrical shortage.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
5. Contact Information
GlobalTop Technology Inc.
Address: No.16 Nan-ke 9th Road Science-based Industrial Park, Tainan 741, Taiwan
Tel: +886-6-5051268
Fax: +886-6-5053381
Website: www.gtop-tech.com
Email: [email protected]
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
Appendix I: UART to RS232 Interface
Typically RS232 or USB interface is required to connect the PC to the GlobalTop BLE module
for communication. Majority of GlobalTop modules uses a set of communication port in TTLlogic. Some newer ones supports for direct USB connection. A bridge IC is needed for RS232
signal conversion.
Please refer to the reference circuit below for RS232 signal conversion. SP3320 IC is used
here as an example.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
Appendix II: UART to USB Interface
If the GlobalTop module you have chosen does not contain USB interface or if you do not
wish to use the integrated USB interface (perhaps due to driver or other concerns), it is
possible to connect it to an external USB IC. To further enhance the transferring speed, use
one that is capable of USB 2.0 interface. Once the driver for the chosen USB Bridge IC is
successfully installed onto Windows or other operating system, the USB Bridge IC will be
automatically recognized as a COM port within the operating system.
Note:
Proper driver must be installed or else the operating system will not be able to recognize
the device!
Please refer to the reference circuits below for the conversion: CP2102 IC is used here as an
example
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
19
Appendix VI: Cautions on Reflow Soldering Process
Details
Before proceeding with the reflowsoldering process, the BLE module must be
pre-baked.
Suggestions
Pre-bake Time:
6 Hours @ 60°±5°C or
Notes
The maximum tolerated
temperature for the tray
is 100°C.
4 Hours @ 70°±5°C
After the pre-baking
process, please make
sure the temperature is
sufficiently cooled down
to 35°C or below in order
to prevent any tray
deformation.
Because PCBA (along with the PCB antenna)
is highly endothermic during the reflowsoldering process, extra care must be paid
to the BLE module's solder joint to see if
there are any signs of cold weld(ing) or false
welding.
The parameters of the
reflow temperature must
be set accordingly to
module’s reflow-soldering
temperature profile.
Double check to see if the
surrounding components
around the BLE module
are displaying symptoms
of cold weld(ing) or false
welding.
3
Special attentions are needed for PCBA
board during reflow-soldering to see if
there are any symptoms of bending or
deformation to the PCBA board, possibility
due to the weight of the module. If so, this
will cause concerns at the latter half of the
production process.
A loading carrier fixture
must be used with PCBA if
the reflow soldering
process is using rail
conveyors for the
production.
If there is any bending or
deformation to the PCBA
board, this might causes
the PCBA to collide into
one another during the
unloading process.
4
Before the PCBA is going through the
reflow-soldering process, the production
operators must check by eyesight to see if
there are positional offset to the module,
because it will be difficult to readjust after
the module has gone through reflowsoldering process.
The operators must check
by eyesight and readjust
the position before reflowsoldering process.
If the operator is planning
to readjust the module
position, please do not
touch the PCB antenna
Before handling the PCBA, they must be
cooled to 35°C or below after they have
gone through the reflow-soldering process,
in order to prevent positional shift that
might occur when the module is still hot.
1. Can use electric fans
behind the Reflow machine
to cool them down.
2. Cooling the PCBA can
prevent the module from
shifting due to fluid effect.
1
2
5
--
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GlobalTop Technology
BLE Module Application Notes (CSR1010 series)
Ver. A01
Other Cautionary Notes on Reflow-Soldering Process:
1. Module must be pre-baked before going through SMT solder reflow process.
2. The usage of solder paste should follow “First-in-First-Out” principle. Opened solder paste
needs to be monitored and recorded in a timely manner ( refer to IPQC standards for
related documentation and examples).
3. Temperature and humidity must be controlled within SMT production line and storage area.
Temperature of 23°C, 60±5% RH humidity is recommended. (please refer to IPQC standards
for related documentation and examples)
4. When performing solder paste printing, please notice if the amount of solder paste is in
excess or insufficient, as both conditions may lead to defects such as electrical shortage,
empty solder and etc.
5. Make sure the vacuum mouthpiece is able to bear the weight of the BLE module to prevent
positional shift during the loading process.
6. Before the PCBA is going through the reflow-soldering process, the operators should check
by eyesight to see if there are positional offset to the module.
7. The reflow temperature and its profile data must be measured before the SMT process and
match the levels and guidelines set by IPQC.
8. If SMT protection line is running a double-sided process for PCBA, please process BLE
module during the second pass only to avoid repeated reflow exposures of the BLE modules.
Please contact GlobalTop beforehand if you must process BLE modules during the 1st pass of
double-side process.
Place BLE modules right-side up when running reflow-solder process, do not invert.
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2014 GlobalTop Technology Inc. All Rights Reserved.
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