STTH1R06
Turbo 2 ultrafast high voltage rectifier
Features
■
■
■
■
Ultrafast switching
Low reverse recovery current
Low thermal resistance
Reduces switching and conduction losses
Description
The STTH1R06, which is using ST Turbo 2 600 V technology, is specially suited as boost diode in power factor correction circuitry.
The device is also intended for use as a free wheeling diode in power supplies and other power switching applications.
A
K
DO-41
STTH1R06
A
A
K
SMA
STTH1R06A
K
SMB
STTH1R06U
Table 1.
Device summary
Symbol
I
F(AV)
V
RRM
I
R
(max)
T j
V
F
(typ) t rr
(max)
Value
1 A
600 V
75 µA
175 °C
1.0 V
25 ns
October 2009 Doc ID 10203 Rev 5 1/9 www.st.com
9
Characteristics
1 Characteristics
STTH1R06
Table 2.
Symbol
V
RRM
Absolute ratings (limiting values)
Repetitive peak reverse voltage
Parameter
I
F(RMS)
Forward rms current
I
F(AV)
I
FSM
Average forward current
Surge non repetitive forward current
DO-41
SMA / SMB
DO-41
SMA
SMB
DO-41
SMA / SMB
T stg
T j
Storage temperature range
Maximum operating junction temperature
Value
600
10
7
T c
= 100 °C δ = 0.5
T c
= 125 °C δ = 0.5
T c
= 135 °C δ = 0.5
1 t p
= 10ms sinusoidal
25
20
-65 to + 175
175
Unit
V
A
A
A
°C
°C
Table 3.
Symbol
Thermal resistance
Parameter
R th(j-l)
Junction to lead
L = 10 mm DO-41
SMA
SMB
L = 10 mm DO-41 R th(j-a)
Junction to ambient
(1)
1.
R th(j-a)
is measured with a copper area S = Scm2 (see Figure 14
).
Table 4.
Symbol
Static electrical characteristics
Parameter Test conditions Min.
Value (max) Unit
45
30
25
70
°C/W
°C/W
Typ.
Max.
I
R
V
F
Reverse leakage current
Forward voltage drop
T j
= 25 °C
T j
= 150 °C
T j
= 25 °C
T j
= 150 °C
V
R
= V
RRM
I
F
= 1A
10
1.0
1
75
1.7
1.25
To evaluate the conduction losses use the following equation: P = 1.03 x I
F(AV)
+ 0.27 I
F
2
(RMS)
Unit
µA
V
2/9 Doc ID 10203 Rev 5
STTH1R06 Characteristics
Table 5.
Symbol t rr t fr
V
FP
Dynamic characteristics
Parameter Test conditions
Reverse recovery time
T j
= 25 °C
Forward recovery time
Forward recovery voltage
T
T j j
= 25 °C
= 25 °C
I
F
= 0.5A I rr
= 0.25A I
R
=1A
I
F
= 1A dI
F
/dt = -50 A/µs V
R
=30V
I
F
= 1A dI
F
/dt = 100 A/µs
V
FR
= 1.1 x V
Fmax
I
F
= 1A dI
F
/dt = 100 A/µs
V
FR
= 1.1 x V
Fmax
Min.
Typ.
30
Max.
25
45
100
10
Unit ns ns
V
1.8
P(W)
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.0
Figure 1.
Conduction losses versus average forward current
Figure 2.
Forward voltage drop vs forward current
0.2
δ = 0.05
0.4
δ = 0.1
0.6
δ = 0.2
I
F(AV)
(A)
0.8
δ = 0.5
δ = 1
δ
=tp/T
1.0
T tp
1.2
7
6
5
4
9
8
3
2
1
0
15
14
13
12
11
10
I
FM
(A)
0
(maximum values)
(typical values)
1 2
V
FM
(V)
3
(maximum values)
4 5
Figure 3.
Relative variation of thermal impedance junction to case vs pulse duration (DO-41)
1.0
Z th(j-c)
/R th(j-c)
0.9
0.8
0.7
0.6
0.5
δ = 0.5
0.4
0.3
0.2
0.1
δ = 0.2
δ = 0.1
0.0
1.E-01
Single pulse
1.E+00 1.E+01
δ =tp/T
1.E+02
T tp
1.E+03
Figure 4.
Relative variation of thermal impedance junction to case vs pulse duration (SMA)
1.0
Z th(j-c)
/R th(j-c)
S = 1cm 2
0.9
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
0.0
1.E-01
Single pulse
1.E+00 1.E+01
δ =tp/T
1.E+02
T tp
1.E+03
Doc ID 10203 Rev 5 3/9
Characteristics STTH1R06
Figure 5.
Relative variation of thermal impedance junction to case vs pulse duration (SMB)
1.0
0.9
Z th(j-c)
/R th(j-c)
S = 1cm 2
0.8
0.7
0.6
0.5
δ = 0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
0.0
1.E-01
Single pulse
1.E+00 1.E+01
δ
=tp/T
1.E+02
T tp
1.E+03
Figure 6.
Peak reverse recovery current vs dI
F
/dt (typical values)
9
I
RM
(A)
8
5
4
3
7
6
2
1
0
0 50
I =0.25 x I
F(AV)
100
I =0.5 x I
F(AV)
150 200
I =I
F(AV)
250 300
I =2 x I
F(AV)
350 400 450 500
Figure 7.
Reverse recovery time versus dI
F
/dt
(typical values)
Figure 8.
Reverse recovery charges versus dI
F
/dt (typical values)
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
0
I =2 x I
F(AV)
I =I F(AV)
I =0.5 x I F(AV)
50 100 150 200 250 300 350 400 450 500
125
100
75
50
25
0
0
250
225
200
175
150
F(AV)
I =I
F(AV)
F(AV)
50 100 150 200 250 300 350 400 450 500
Figure 9.
Reverse recovery softness factor vs dI
F
/dt (typical values)
6
S factor
I =I
F(AV)
5
4
3
2
1
0
0 50 100 150 200 250 300 350 400 450 500
Figure 10.
Relative variations of dynamic parameters vs junction temperature
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
25 50
S factor
I
RM
Q
RR
75 100
I =I
F(AV)
125
4/9 Doc ID 10203 Rev 5
STTH1R06 Characteristics
Figure 11. Transient peak forward voltage vs dI
F
/dt (typical values)
Figure 12.
Forward recovery time vs dI
F
/dt
(typical values)
25
V
FP
(V)
I =I F(AV)
20
15
10
5
0
0 20 40 60 80 100 120 140 160 180 200
200
180
160
140
120
100
80
60
40
20
0
0 20 40 60 80
I =I
F(AV)
V
FR
=1.1 x V max.
100 120 140 160 180 200
Figure 13.
Junction capacitance versus reverse voltage applied
(typical values)
100
C(pF)
V
F=1MHz
OSC
=30mV
10
1
1 10 100 1000
Figure 14.
Thermal resistance junction to ambient versus copper surface under each lead
30
20
10
0
60
50
40
0
110
R th(j-a)
(°C/W)
100
90
80
70
1 2
(epoxy FR4, Cu = 35 µm) (DO-41, SMB)
3
DO-41
Lleads = 10mm
SMB
4
S(cm²)
5 6 7 8 9 10
Figure 15.
Thermal resistance junction to ambient versus copper surface under each lead
(epoxy FR4, Cu = 35 µm) (SMA)
R th(j-a)
(°C/W)
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
0.0
0.5
1.0
1.5
SMA
2.0
S(cm²)
2.5
3.0
3.5
4.0
4.5
5.0
Doc ID 10203 Rev 5 5/9
Package information STTH1R06
●
●
Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Table 6.
SMA dimensions
C
E1
E
L
D
A1
A2 b
Ref.
A1
A2 b c
D
E
E1
L
Dimensions
Millimeters
Min.
1.90
0.05
1.25
0.15
2.25
4.80
3.95
0.75
Max.
2.45
0.20
1.65
0.40
2.90
5.35
4.60
1.50
Inches
Min.
0.075
0.002
0.049
0.006
0.089
0.189
0.156
0.030
Max.
0.094
0.008
0.065
0.016
0.114
0.211
0.181
0.059
Figure 16.
Footprint (dimensions in mm)
1.4
(0.055)
2.63
(0.103)
1.4
(0.055)
1.64
(0.064)
5.43
(0.214)
6/9 Doc ID 10203 Rev 5
STTH1R06 Package information
Table 7.
SMB dimensions
E1
C
E
L
D
A1
A2 b
Figure 17.
Footprint (dimensions in mm)
1.62
2.60
(0.064) (0.102)
1.62
(0.064) c
E
E1
D
L
A1
A2 b
Ref.
Dimensions
Millimeters Inches
Min.
1.90
0.05
1.95
0.15
5.10
4.05
3.30
0.75
Max.
2.45
0.20
2.20
0.40
5.60
4.60
3.95
1.50
Min.
0.075
0.002
0.077
0.006
0.201
0.159
0.130
0.030
Max.
0.096
0.008
0.087
0.016
0.220
0.181
0.156
0.059
2.18
(0.086)
5.84
(0.300)
Table 8.
C
DO-41 (plastic) dimensions
A C
ØD ØB
A
B
C
D
Ref.
Dimensions
Millimeters Inches
Min.
4.07
2.04
25.4
0.71
Max.
5.20
2.71
0.86
Min.
0.160
0.080
1
0.028
Max.
0.205
0.107
0.034
Doc ID 10203 Rev 5 7/9
Ordering information STTH1R06
Table 9.
Ordering information
Order code Marking
STTH1R06
STTH1R06RL
STTH1R06A
STTH1R06U
STTH1R06
STTH1R06
HR6
BR6
Package
DO-41
DO-41
SMA
SMB
Weight
0.34 g
0.34 g
0.068 g
0.11 g
Base qty Delivery mode
2000
5000
5000
2500
Ammopack
Tape and reel
Tape and reel
Tape and reel
Table 10.
Document revision history
Date Revision
Apr-2003
07-Sep-2004
24-Feb-2005
02-Jul-2007
30-Sep-2009
1
2
3
4
5
Changes
First issue.
DO-41 and SMA packages added.
SMA package dimensions update. Reference A1 max.
changed from 2.70 mm (0.106 inc.) to 2.03 mm (0.080).
Reformatted to current standards. Added cathode bars to cover illustrations. Updated dimensions and footprint illustrations for SMA and SMB packages. Corrected part number in Table 9.
Updated table 8 package dimensions.
8/9 Doc ID 10203 Rev 5
STTH1R06
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Doc ID 10203 Rev 5 9/9
