Texas Instruments DS125BR401EVK User guide
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DS125BR401EVM User’s Guide
User's Guide
Literature Number: SNLU121
November 2012
User's Guide
SNLU121 – November 2012
DS125BR401EVM Evaluation Kit
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The DS125BR401EVM – SMA evaluation kit provides a complete high band-width platform to evaluate the signal integrity and signal conditioning features of the Texas Instruments signal conditioning products – with Equalization and De-emphasis. SMA edge launch connectors are used as the input and the output connections for this evaluation board. Commercially available adaptor boards can be purchased to facilitate connection to cables or backplane interconnects.
Topic
...........................................................................................................................
Page
Features
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4-Level IO Control
...............................................................................................
Switch Connection Overview
................................................................................
Quick Start Guide
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SMBus Slave Mode of the EQ, VOD, and De-Emphasis level:
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Bill of Materials for DS125BR401EVM:
Schematic for DS125BR401EVM:
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EVM Layout
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DS125BR401EVM Evaluation Kit
Copyright © 2012, Texas Instruments Incorporated
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1 Features
• 4 Lane Repeater up to 12.5 Gbps
• Low 65 mW/channel power consumption, with option to power down unused channels
• Transparent management of link training protocol for PCIe, SAS, and 10G-KR
• Receive Equalization up to 30 dB at 12.5 Gbps
• Settable transmit de-emphasis driver to -12 dB
• Transmit output voltage control: 700 – 1300 mV
• Programmable via pin selection, EEPROM, or SMBus interface
• Single supply operation: VIN = 3.3V±10% or VDD = 2.5V ±5%
• -40°C to +85°C Operation
• 5 kV HBM ESD rating
• High speed signal flow–thru pin-out package: 54-pin QFN (10 mm x 5.5 mm, 0.5 mm pitch)
Applications
FR-4 Backplane Traces and High Speed Cable
Ordering Information
EVM ID
DS125BR401EVM
DEVICE ID
DS125BR401SQE/NOPB
Features
DEVICE PACKAGE
QFN-54
Figure 1. DS125BREVK REV. 1
DS125BR401/DS125BR800 Top Assembly
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Features
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Figure 2. DS125BREVK REV. 1
DS125BR401/DS125BR800 Bottom Assembly
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2 4-Level IO Control
4-Level IO Control
Many of the control pins on the DS125BR401 have more than two valid levels.
below shows how to access each of these levels with the switch banks on the back side of the EVM.
Table 1. Switches to set the 4-Level input control pins
4-Level Input Settings
0 - Tie 1k Ω to GND
R - Tie 20k Ω to GND
F - FLOAT (open)
1 - Tie 1k Ω to VIH
Setting for 3 pin switches (3-2-1)
ON - OFF - OFF
OFF - ON - OFF
OFF - OFF - OFF
OFF - OFF - ON
The following switches are used to set the input condition for the 4-level inputs:
•
SW1, SW2, SW3, SW5, SW6, SW8, SW9
There are 3 switches connected to an input signal pin. Each switch when set to the ON position sets the pin to one of the 4-level setting. The 6 pin switches are assigned similar to the 3 pin switches. The only difference is 2 signal pins are connected and thus 6-5-4 is for the one signal pin and 3-2-1 is for another signal pin.
NOTE:
Only 1 switch at the ON position is allowed. Activating more than one switch concurrently results in an indeterminate voltage level.
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Switch Connection Overview
3 Switch Connection Overview
Component
J1 to J8
J9 to J16
SW3
SW4
SW5
SW6
SW7
SW8
J19
J20
J17
J18
SW1
SW2
SW9
SW10 www.ti.com
Table 2. Connection and Control Description
Name
IN_B2+, IN_B2-,
IN_B3+, IN_B3-,
IN_A0+, IN_A0-,
IN_A1+, IN_A1-,
OUT_B2+, OUT_B2-,
OUT_B3+, OUT_B3-,
OUT_A0+, OUT_A0-,
OUT_A1+, OUT_A1-,
VIN or VDD
VIN or VDD
Function
High-speed differential inputs
High-speed differential outputs
SDA, SCL
EEPROM
EQB[1:0] or
AD[3:2]
ENSMB
DC Power - VIN or VDD to DS125BR401SQ
Jumper – VIN or VDD to VIH power
Optional SMBUS access pins.
See the datasheet for additional information on SMBUS.
Optional socket for EEPROM
PIN MODE – EQ control for channel B inputs
SMBUS MODE – AD[3:2] device address bits
ENSMB = LOW – PIN MODE
ENSMB = HIGH – SMBUS (slave mode)
ENSMB = FLOAT – SMBUS (master mode – load configuration from
EEPROM)
PIN MODE – DE control for channel A outputs
“ON” position connects SDA and SCL lines to the device pin.
PIN MODE – DE control for channel B outputs
SMBUS MODE – AD[1:0] device address bits
DEMA[1:0]
SDA/SCL
DEMB[1:0] or
AD[1:0]
SD_TH and LPBK - RES
SD_TH – Signal detect threshold level (FLOAT = Default level)
LPBK function for BR401 only (FLOAT = Normal operation)
VDD_SEL and
RESET
EQA[1:0]
VDD_SEL – Enable or disable the internal 3.3V to 2.5V regulator.
RESET – Enable or disable the device (LOW – enable)
PIN MODE – EQ control for channel A inputs
INPUT_EN and
MODE
READ_EN
INPUT_EN – Enable or disable the internal 50 ohm to VDD terminations
MODE – Tie 1k
Ω to GND = GEN 1,2 and SAS 1,2
Float = Auto Mode Select (for PCIe and SAS-3)
Tie 20k
Ω to GND = SAS-3 and GEN-3 without De-emphasis
Tie 1k Ω to VDD = SAS-3 and GEN-3 with De-emphasis
ENSMB = FLOAT – SMBUS (master mode – load configuration from
EEPROM)
SW6: SD_TH becomes the READ_EN pin.
To start the loading at power up, set SW6 pin 3 to “ON” position (pull to
GND).
To manually control the start, set SW6 pin 1 to “ON” position (pull to VDD) and push the SW10 button for the high to low transition to start the loading.
When the loading is complete the LED – D1 light should turn OFF.
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4 Quick Start Guide
Quick Start Guide
1. Connect J19: VIN = 3.3V or VDD = 2.5V and GND.
•
For VIN = 3.3V:
Set SW7 pin1 (VDD_SEL) to the ON position (enable internal LDO regulator) and float VDD at J19.
•
For VIN = 2.5V:
Set SW7 pin1 (VDD_SEL) to the OFF positions (disable internal LDO regulator) and float VIN at
J19.
2. Set jumper – J20 for VIH connection to VIN or VDD.
3. Connect 50 Ohm SMA cables to the board.
• The input signals J5 to J12 can be connected from a pattern generator.Set SW7 pin1 (VDD_SEL) to the ON position (enable internal LDO regulator) and float VDD at J19.
• The output signals J1 to J4 and J13 to J16 can be connected to a scope.
A/B Channels
B-Channels
A-Channels
Table 3. SMA Channel Connections
Input Channel
J1 – OUT_B2+, J2 – OUT_B2-
J3 – OUT_B3+, J4 – OUT_B3-
J5 – IN_A0+, J6 – IN_A0-
J7 – IN_A1+, J8 – IN_A1-
Output Channel
J9 – IN_B2+, J10 – IN_B2-
J11 – IN_B3+, J12 – IN_B3-
J13 – OUT_A0+, J14 – OUT_A0-
J15 – OUT_A1+, J16 – OUT_A1-
4. Set the control pins for normal operation
• SW7 – RESET = 0 (enables the device): set switch pin2 to the ON position.
• SW9 – INPUT_EN = 1 (50 ohm input termination): set switches (3-2-1) = (OFF-OFF-ON).
• SW9 – MODE = VDD (enables SAS-3 / PCIe GEN3 mode): set switches (6-5-4) = (OFF-OFF-ON).
• SW6 – SD_TH = F (default signal detect threshold level): set switches (3-2-1) = (OFF-OFF-OFF).
• SW6 – LPBK - RES = F (normal operation): set switches (6-5-4) = (OFF-OFF-OFF).
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Quick Start Guide
5.
Set the input equalization level.
•
For external pin mode control of the equalization level:
• Set ENSMB = 0 (1k Ω to GND) by using the SW2 (3-2-1) = (ON-OFF-OFF).
• SW4 pin1,2 must be set to the OFF positions, so the SMBUS signals are disconnected.
• Refer to
for information on the 3 switch settings for the 4 level input.
Example:
• Set EQB[1:0] with SW1 for the B bank of inputs (top 4 inputs of DS125BR401).
• SW1 (6-5-4), (3-2-1) = (OFF-ON-OFF), (OFF-ON-OFF) = EQB[1:0] = R,R (Level 6).
• Set EQA[1:0] with SW8 for the A bank of inputs (bottom 4 inputs of DS125BR401).
• SW8 (6-5-4), (3-2-1) = (OFF-ON-OFF), (OFF-ON-OFF) = EQA[1:0] = R,R (Level 6).
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Level
6
7
8
9
10
1
2
3
4
5
14
15
16
11
12
13
EQA/B[1:0]
R, R
R, F
R, 1
F, 0
F, R
0, 0
0, R
0, F
0, 1
R, 0
F, F
F, 1
1, 0
1, R
1, F
1, 1
ON
OFF
OFF
OFF
OFF
OFF
OFF
6
ON
ON
ON
OFF
OFF
OFF
OFF
OFF
OFF
Table 4. EQ Settings available with PIN MODE
OFF
OFF
OFF
OFF
OFF
OFF
ON
ON
ON
OFF
OFF
5
SW1 - EQB[1:0] or SW8 - EQA[1:0]
4 3 2
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
ON
OFF
OFF
OFF
ON
OFF
OFF
ON
ON
ON
ON
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
1
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
EQ (dB) @ 6 GHz
16.2
15.9
17.0
20.7
21.8
3.1
6.7
8.4
9.1
13.7
23.6
24.7
28.0
29.2
30.9
31.9
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Quick Start Guide
6.
Set the output VOD and De-emphasis level.
•
For external pin mode control for the VOD and De-emphasis level:
• Set ENSMB = 0 (1k Ω to GND) by using the SW2 (3-2-1) = (ON-OFF-OFF).
• SW4 pin1,2 must be set to the OFF positions, so the SMBUS signals are disconnected.
• Refer to
for information on the 3 switch settings for the 4 level input.
Example:
• Set DEMB[1:0] with SW5 for the B bank of outputs (top 4 outputs of DS125BR401).
• SW5 (6-5-4), (3-2-1) = (ON-OFF-OFF), (OFF-OFF-ON) = DEMB[1:0] = 0,1 (VOD=1.0V, DE=0 dB).
• Set DEMA[1:0] with SW3 for the A bank of outputs (bottom 4 outputs of DS125BR401).
• SW3 (6-5-4), (3-2-1) = (ON-OFF-OFF), (OFF-OFF-ON) = DEMA1:0] = 0,1 (VOD=1.0V, DE=0 dB).
Level
R, F
R, 1
F, 0
F, R
F, F
F, 1
1, 0
0, 0
0, R
0, F
0, 1
R, 0
R, R
1, R
1, F
1, 1
EQA/B[1:0]
Table 5. DE and VOD Settings available in PIN MODE
SW1 - EQB[1:0] or SW8 - EQA[1:0]
6
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
ON
ON
ON
OFF
OFF
OFF
OFF
OFF
5
OFF
ON
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
ON
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
ON
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
OFF
OFF
OFF
OFF
ON
ON
ON
ON
ON
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
ON
ON
OFF
OFF
OFF
4 3 2 1
GEN1 and GEN2
Inner Amplitude
(V
PP
)
0.8
0.9
0.6
1.0
DE (dB)
0
0
-3.5
0
0.7
0.5
1.1
0.7
-3.5
-6
0
-3.5
0.6
1.2
0.8
0.6
1.3
0.9
0.7
0.5
-6
0
-3.5
-6
0
-3.5
-6
-9
NOTE:
The De-Emphasis levels are also available in SAS-3 / GEN-3 mode when MODE = 1
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SMBus Slave Mode of the EQ, VOD, and De-Emphasis level:
5 SMBus Slave Mode of the EQ, VOD, and De-Emphasis level:
www.ti.com
• Set ENSMB = 1 (1k Ω to VIH) by using the SW2 (3-2-1) = (OFF-OFF-ON).
• Set SW4 pin1,2 to the ON position so the SMBUS signals are connected.
• Set SW3 pin1 thru pin6 switches to the OFF position so they do not connect to the SDA and SCL line.
• Set the SW1 and SW5 for the AD[3:0] pins. AD[3:0]=0000 sets device slave address = B0’hex.
• Connect SDA, SCL and GND to J17. Please refer to datasheet for register map for EQ, VOD and
DEM.
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6 Bill of Materials for DS125BR401EVM:
13
14
15
16
17
18
Item
1
2
3
4
5
6
7
8
9
10
11
12
Bill of Materials for DS125BR401EVM:
1
2
1
2
6
1
2
1
1
Qty
1
1
5
16
1
16
31
1
13
R1, R2, R3, R4,
R8, R11, R13,
R14, R16, R17,
R19, R20, R22,
R23, R25, R26,
R28, R29, R31,
R32, R34, R35,
R37, R38, R40,
R41, R43, R44,
R46, R47, R49
R7
R12, R15, R18,
R21, R24, R27,
R30, R33, R36,
R39, R42, R45,
R48
R5, R6
SW1, SW3, SW5,
SW6, SW8, SW9
SW2
SW4, SW7
SW10
U1
Reference
C1
C2
C3, C4, C5, C6,
C7
C11, C12, C13,
C14, C15, C16,
C17, C18, C19,
C20, C21, C22,
C23, C24, C25,
C26
D1
J1, J2, J3, J4, J5,
J6, J7, J8, J9,
J10, J11, J12,
J13, J14, J15,
J16
J17
J19, J20
J18
Table 6. DS125BR401EVM BOM
Digikey PN
445-3448-1-ND
445-1322-1-ND
445-4711-1-ND
587-2483-1-ND
511-1592-1-ND
J801-ND
WM6504-ND
WM6503-ND
3M5473-ND
P1.00KLCT-ND
P220LCT-ND
P20.0KLCT-ND
Manufacture PN
C1608Y5V0J106Z
C1608X5R0J105K
C0603X5R0J104M
LMK063BJ224MP-F
SML-P12PTT86
142-0761-881
22-28-4043
22-28-4033
4808-3004-CP
ERJ-2RKF1001X
ERJ-2RKF2200X
ERJ-2RKF2002X
Descriptions
CAP CER 10UF 6.3V Y5V 0603
CAP CER 1.0UF 6.3V X5R 0603
CAP CER .10UF 6.3V X5R 0201
CAP CER .22UF 10V X5R 0201
LED GRN 0.2MM 13MCD 0402 SMD
CONN JACK SMA 50 OHMS PC MOUNT
CONN HEADER 4POS .100 VERT GOLD
CONN HEADER 3POS .100 VERT GOLD
SOCKET IC 8-POS .3"
RES 1.00K 1/10W 1% 0402
RES 220 1/10W 1% 0402
RES 20.0K 1/10W 1% 0402
P4.70KLCT-ND
CT2196MST-ND
CT2193MST-ND
CT2192MST-ND
P12225SCT-ND
NA
ERJ-2RKF4701X
219-6MST
RES 4.70K OHM 1/10W 1% 0402 SMD
SWITCH TAPE SEAL 6 POS SMD
219-3MST
219-2MST
SWITCH TAPE SEAL 3 POS SMD
SWITCH TAPE SEAL 2 POS SMD
EVQ-21505R SWITCH LT 6MM 160GF 5MM HEIGHT
DS125BR401SQ/NOPB BUFFER - REPEATER
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Schematic for DS125BR401EVM:
7 Schematic for DS125BR401EVM:
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Figure 3. DS125BR401EVM Schematic
Note: The DS125BR401 and DS125BR800 share a common EVM PCB Assembly.
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8 EVM Layout
EVM Layout
The following Figures show the DS125BR401EVM board layout. The EVM controls signal integrity functions via a combination of switches and jumpers.
The DS125BR401 is very compact and low power. The QFN package offers an exposed thermal pad to enhance electrical and thermal performance. This must be soldered to the copper landing on the PWB.
Figure 4. Top Assembly Layer
Figure 5. Bottom Assembly Layer
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