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IFX1763

Wide Input Range Low Noise 500mA LDO

Data Sheet

Rev. 1.1, 2014-10-30

Standard Power

Wide Input Range Low Noise 500mA LDO IFX1763

1 Overview

Features

• Low Noise down to 24 µ

V

RMS

(BW = 10 Hz to 100 kHz)

• 500 mA Current Capability

• Low Quiescent Current: 30 µA

• Wide Input Voltage Range: 1.8 V to 20 V

• 2.5% Output Voltage Accuracy (over full temperature and load range)

• Low Dropout Voltage: 320 mV

• Very low Shutdown Current: < 1 µA

• No Protection Diodes Needed

• Fixed Output Voltage: 3.3 V

• Adjustable Version with Output from 1.22 V to 20 V

• Stable with ≥ 3.3 µF Output Capacitor

• Stable with Aluminium, Tantalum or Ceramic Capacitors

• Reverse Battery Protection

• No Reverse Current

• Overcurrent and Overtemperature Protected

• DSO-8 Exposed Pad and TSON-10 Exposed Pad packages

• Green Product (RoHS compliant)

Applications

• Microcontroller Supply

• Battery-Powered Systems

• Noise Sensitive Instruments

• Radar Applications

• Image Sensors

PG-DSO-8 Exposed Pad

PG-TSON-10

The IFX1763 is not qualified and manufactured according to the requirements of Infineon Technologies with regards to automotive and/or transportation applications. For automotive applications please refer to the Infineon

TLx (TLE, TLS, TLF.....) voltage regulator products.

Type

IFX1763XEJ V

IFX1763XEJ V33

IFX1763LD V

IFX1763LD V33

Data Sheet

Package

PG-DSO-8 Exposed Pad

PG-DSO-8 Exposed Pad

PG-TSON-10

PG-TSON-10

2

Marking

1763EV

1763EV33

176LV

176LV33

Rev. 1.1, 2014-10-30

IFX1763

Overview

The IFX1763 is a micropower, low noise, low dropout voltage regulator. The device is capable of supplying an output current of 500 mA with a dropout voltage of 320 mV. Designed for use in battery-powered systems, the low quiescent current of 30 µA makes it an ideal choice.

A key feature of the IFX1763 is its low output noise. By adding an external 0.01 µF bypass capacitor output noise values down to 24 µ

V

RMS

over a 10 Hz to 100 kHz bandwidth can be reached. The IFX1763 voltage regulator is stable with output capacitors as small as 3.3 µF. Small ceramic capacitors can be used without the series resistance required by many other regulators. Its internal protection circuitry includes reverse battery protection, current limiting and reverse current protection. The IFX1763 comes as fixed output voltage 3.3 V as well as adjustable device with a 1.22 V reference voltage. It is available in a DSO-8 Exposed Pad and as well as in a

TSON-10 Exposed Pad package.

Data Sheet 3 Rev. 1.1, 2014-10-30

2 Block Diagram

Note: Pin numbers in the block diagrams refer to the DSO-8 EP package type.

IN

8

EN

5

BYP

4

IFX1763

Bias

Voltage reference

Error

Amplifier

Over Current

Protection

Saturation

Control

Temperature

Protection

1

OUT

2

SENSE

Figure 1 Block Diagram IFX1763 fixed voltage version

GND

6

IFX1763

Block Diagram

IN

8

IFX1763 ADJ

EN

5

BYP

4

Bias

Voltage reference

Error

Amplifier

Over Current

Protection

Saturation

Control

Temperature

Protection

1

OUT

2

ADJ

Figure 2 Block Diagram IFX1763 adjustable version

Data Sheet 4

6

GND

Rev. 1.1, 2014-10-30

IFX1763

Pin Configuration

3

3.1

Pin Configuration

Pin Assignment

OUT

SENSE

1

2

8

7

IN

NC

OUT

ADJ

1

2

8

7

IN

NC

Figure 3

3 6 3 6

NC GND NC GND

9

9

4 5 4 5

BYP EN BYP EN

IFX1763XEJ V33

IFX1763XEJ V

version

Pin Configuration of IFX1763 in PG-DSO-8 Exposed Pad for fixed voltage and adjustable

OUT

OUT

NC

SENSE

BYP

3

4

5

1

2

11

10

9

8

7

6

IFX1763LD V33

IN

IN

NC

EN

GND

OUT

OUT

NC

ADJ

BYP

1

2

3

4

5

11

10

9

8

7

6

IFX1763LD V

IN

IN

NC

EN

GND

Figure 4 Pin Configuration of IFX1763 in PG-TSON-10 for fixed voltage and adjustable version

Data Sheet 5 Rev. 1.1, 2014-10-30

IFX1763

Pin Configuration

3.2

Pin Definitions and Functions

Pin

1 (DSO-8 EP)

1,2 (TSON-10)

2 (DSO-8 EP)

4 (TSON-10)

2 (DSO-8 EP)

4 (TSON-10)

3, 7 (DSO-8 EP)

3, 8 (TSON-10)

4 (DSO-8)

5 (TSON-10)

5 (DSO-8 EP)

7 (TSON-10)

6 (DSO-8 EP)

6,(TSON-10)

8 (DSO-8 EP)

9, 10 (TSON-10)

9 (DSO-8 EP)

11 (TSON-10)

EN

GND

IN

Symbol

OUT

SENSE

(fix voltage version)

Function

Output. Supplies power to the load. For this pin a minimum output capacitor of

3.3 µF is required to prevent oscillations. Larger output capacitors may be required for applications with large transient loads in order to limit peak voltage transients or when the regulator is applied in conjunction with a bypass capacitor.

For more details please refer to the section

“Application Information” on

Page 24

.

Output Sense. For the fixed voltage version the SENSE pin is the input to the error amplifier. This allows to achieve an optimized regulation performance in case of small voltage drops

R

p

that occur between regulator and load. In applications where such drops are relevant they can be eliminated by connecting the SENSE pin directly at the load. In standard configurations the SENSE pin can be connected directly to the OUT pin. For further details please refer to the section

“Kelvin Sense Connection” on Page 25

.

ADJ

(adjustable version)

NC

Adjust. For the adjustable version the ADJ pin is the input to the error amplifier.

The ADJ pin voltage is 1.22V referenced to ground and allows an output voltage range from 1.22V to 20V -

V

DR

. The ADJ pin is internally clamped to ±7 V. Please note that the bias current of the ADJ pin is flowing into the pin.

1)

No Connect. The NC Pins have no connection to any internal circuitry. Connect either to GND or leave open.

BYP

Tab

Bypass. The BYP pin is used to bypass the reference of the IFX1763 to achieve low noise performance. The BYP-pin is clamped internally to ±0.6 V (i.e. one

V

BE

).

A small capacitor from the output to the BYP pin will bypass the reference to lower the output voltage noise

2)

. If not used this pin must be left unconnected.

Enable. With the EN pin the IFX1763 can be put into a low power shutdown state.

The output will be off when the EN is pulled low. The EN pin can be driven by 5V logic or open-collector logic with pull-up resistor. The pull-up resistor is required to supply the pull-up current of the open-collector gate

3)

and the EN pin current

4)

.

Please note that if the EN pin is not used it must be connected to

V

IN

. It must not be left floating.

Ground. For the ADJ version connect the bottom of the output voltage setting resistor divider directly to the GND pin for optimum load regulation performance.

Input. Via the input pin IN the power is supplied to the device. A capacitor at the input pin is required if the device is more than 6 inches away from the main input filter capacitor or if bigger inductance is present at the IN pin

5)

. The IFX1763 is designed to withstand reverse voltages on the Input pin with respect to GND and

Output. In the case of reverse input (e.g. due to a wrongly attached battery) the device will act as if there is a diode in series with its input. In this way there will be no reverse current flowing into the regulator and no reverse voltage will appear at the load. Hence, the device will protect both - the device itself and the load.

Exposed Pad. To ensure proper thermal performance,solder Pin 11 (exposed pad) of TSON-10 to the PCB ground and tie directly to Pin 6. In the case of DSO-

8 EP as well solder exposed pad (Pin 9) to the PCB ground and tie directly to

Pin 6.

Data Sheet 6 Rev. 1.1, 2014-10-30

IFX1763

Pin Configuration

1) The typical value of the ADJ pin bias current is 60 nA with a very good temperature stability.See also the corresponding

Typical Performance Graph

“Adjust Pin Bias current I

ADJ

versus Junction Temperature T

J

” on Page 20

.

2) A maximum value of 10 nF can be used for reducing output voltage noise over the bandwidth from 10 Hz to 100 kHz.

3) Normally several microamperes.

4) Typical value is 1 µA.

5) In general the output impedance of a battery rises with frequency, so it is advisable to include a bypass capacitor in batterypowered circuits. Depending on actual conditions an input capacitor in the range of 1 to 10 µF is sufficient.

Data Sheet 7 Rev. 1.1, 2014-10-30

IFX1763

General Product Characteristics

4 General Product Characteristics

4.1

Absolute Maximum Ratings

Table 1 Absolute Maximum Ratings

1)

T

j

= -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified)

Number Parameter Symbol Values Unit Note /

Test Condition

Min.

Typ.

Max.

Input Voltage

Voltage

V

IN

-20 – 20 V

Output Voltage

Voltage

Input to Output Differential

Voltage

Sense Pin

Voltage

ADJ Pin

V

OUT

V

IN

- V

OUT

V

SENSE

-20

-20

-20

20

20

20

7

V

V

V

Voltage

V

ADJ

-7 – V

BYP Pin

Voltage

V

BYP

-0.6

– 0.6

V

Enable Pin

Voltage

V

EN

-20 – 20 V

Temperatures

Junction Temperature

Storage Temperature

T

j

T

stg

-40

-55

150

150

°C

°C

ESD Susceptibility

All Pins

All Pins

V

ESD

V

ESD

-2

-1

1) Not subject to production test, specified by design.

2

1

2) ESD susceptibility, HBM according to ANSI/ESDA/JEDEC JS001 (1.5k

, 100 pF)

3) ESD susceptibility, Charged Device Model “CDM” according JEDEC JESD22-C101 kV kV

HBM

2)

CDM

3)

P_4.1.1

P_4.1.2

P_4.1.3

P_4.1.4

P_4.1.5

P_4.1.6

P_4.1.7

P_4.1.8

P_4.1.9

P_4.1.10

P_4.1.11

Notes

1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation.

Data Sheet 8 Rev. 1.1, 2014-10-30

IFX1763

General Product Characteristics

4.2

Functional Range

Table 2 Functional Range

Parameter Symbol

Min.

Values

Typ.

Max.

Unit Note /

Test Condition

Number

Input Voltage Range

(3.3 V fix voltage version)

V

IN

3.8 V – 20 V –

P_4.2.1

Input Voltage Range

(adjustable voltage version)

V

IN

2.3 – 20 V –

1)

P_4.2.2

Operating Junction Temperature

T

j

-40 – 125 °C –

P_4.2.3

1) For the

IFX1763

adjustable version the minimum limit of the functional range

V

IN is tested and specified with the ADJ- pin connected to the OUT pin.

Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the Electrical Characteristics table.

4.3

Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go to

www.jedec.org

.

Table 3

Parameter

Thermal Resistance

1)

Symbol Unit Note /

Test Condition

Number

Min.

Values

Typ.

Max.

IFX1763X EJ (PG-DSO-8 Exposed Pad)

Junction to Case

Junction to Ambient

Junction to Ambient

Junction to Ambient

R

thJC

R

thJA

R

thJA

R

thJA

Junction to Ambient

R

thJA

7.0

39

155

66

52

K/W –

K/W –

2)

K/W Footprint only

3)

K/W 300 mm

2

heatsink area on PCB

3)

K/W 600 mm

2

heatsink area on PCB

3)

P_4.3.1

P_4.3.2

P_4.3.3

P_4.3.4

P_4.3.5

IFX1763 LD (PG-TSON-10)

Junction to Case

Junction to Ambient

Junction to Ambient

Junction to Ambient

R

thJC

R

thJA

R

thJA

R

thJA

Junction to Ambient

R

thJA

1) Not subject to production test, specified by design.

6.4

53

183

69

57

K/W –

K/W

2)

K/W Footprint only

3)

K/W 300 mm

2

heatsink area on PCB

3)

K/W 600 mm

2

heatsink area on PCB

3)

P_4.3.6

P_4.3.7

P_4.3.8

P_4.3.9

P_4.3.10

Data Sheet 9 Rev. 1.1, 2014-10-30

IFX1763

General Product Characteristics

2) Specified

R

thJA

value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).

Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.

3) Specified

R

thJA

value is according to JEDEC JESD 51-3 at natural convection on FR4 1s0p board; The Product

(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm

3

board with 1 copper layer (1 x 70µm Cu).

Data Sheet 10 Rev. 1.1, 2014-10-30

IFX1763

Electrical Characteristics

5

5.1

Electrical Characteristics

Electrical Characteristics Table

Table 4 Electrical Characteristics

-40 °C <

T

j

< 125 °C; all voltages with respect to ground; positive current defined flowing out of pin; unless otherwise specified.

Parameter Symbol Unit Note / Test Condition Number

V

IN,min

Min.

Values

Typ.

Max.

1.8

2.3

V

I

OUT

= 500 mA

1)2)3)

P_5.1.1

Minimum Operating Voltage

Output Voltage

4)

IFX1763XEJ V33

IFX1763LD V33

IFX1763XEJ V

IFX1763LD V

Line Regulation

IFX1763XEJ V33

IFX1763LD V33

IFX1763XEJ V

IFX1763LD V

Load Regulation

IFX1763XEJ V33

IFX1763LD V33

IFX1763XEJ V33

IFX1763LD V33

IFX1763XEJ V

IFX1763LD V

IFX1763XEJ V

IFX1763LD V

Dropout Voltage

2)5)6)

Dropout Voltage

Dropout Voltage

Dropout Voltage

Dropout Voltage

Dropout Voltage

Dropout Voltage

Dropout Voltage

V

V

V

V

V

V

V

V

V

OUT

OUT

V

V

V

V

V

V

OUT

OUT

OUT

OUT

OUT

OUT

DR

DR

DR

DR

DR

DR

DR

3.220

3.30

3.380

V

1.190 1.22

1.250 V

1

1

9

4

100

150

190

320

20

8

20

22

38

14

130

190

190

250

220

300

350 mV mV mV mV mV mV mV mV mV mV mV mV mV

1m A <

4.3 V <

1m A <

2.3 V <

V

IN

I

OUT

V

IN

I

OUT

T

J

V

T

J

I

V

I

I

IN

I

IN

OUT

OUT

OUT

I

V

OUT

IN

< 500 mA,

< 20 V

I

V

OUT

IN

< 500 mA;

< 20 V

3)

= 3.8 V to 20 V;

= 1 mA

= 2.0 V to 20 V;

= 1 mA

3)

= 25°C;

V

= 1 to 500 mA

= 4.3 V;

IN

= 4.3 V;

= 1 to 500 mA

= 25°C;

OUT

V

IN

= 2.3 V;

= 1 to 500 mA

3)

= 2.3 V;

= 1 to 500 mA

3)

I

OUT

V

IN

=

= 10 mA;

V

OUT,nom

;

T

J

I

V

OUT

IN

=

= 10 mA;

V

OUT,nom

I

V

OUT

IN

=

= 50 mA;

V

OUT,nom

;

T

J

I

OUT

V

IN

=

= 50 mA;

V

OUT,nom

I

OUT

V

IN

=

= 100 mA;

V

OUT,nom

;

T

J

I

V

OUT

IN

=

= 100 mA;

V

OUT,nom

I

V

OUT

IN

=

= 500 mA;

V

OUT,nom

;

T

J

= 25°C

= 25°C

= 25°C

= 25°C

P_5.1.2

P_5.1.3

P_5.1.4

P_5.1.5

P_5.1.6

P_5.1.7

P_5.1.8

P_5.1.9

P_5.1.10

P_5.1.11

P_5.1.12

P_5.1.13

P_5.1.14

P_5.1.15

P_5.1.16

Data Sheet 11 Rev. 1.1, 2014-10-30

IFX1763

Electrical Characteristics

Table 4

Electrical Characteristics (cont’d)

-40 °C <

T

j

< 125 °C; all voltages with respect to ground; positive current defined flowing out of pin; unless otherwise specified.

Parameter Symbol Unit Note / Test Condition Number

Dropout Voltage

V

DR

Min.

Values

Typ.

Max.

– 450 mV

I

V

OUT

IN

=

= 500 mA;

V

OUT,nom

P_5.1.17

GND Pin Current

5)7)

GND Pin Current

I

GND

– 30 60 µA

P_5.1.18

GND Pin Current

GND Pin Current

GND Pin Current

GND Pin Current

GND Pin Current

GND Pin Current

Quiescent Current in Off-Mode

(EN-pin low)

Enable

Enable Threshold High

Enable Threshold Low

EN Pin Current

8)

EN Pin Current

8)

Adjust Pin Bias Current

9)11)

ADJ Pin Bias Current

Output Voltage Noise

11)

Output Voltage Noise

IFX1763XEJ V

10)

IFX1763LD V

10)

Output Voltage Noise

IFX1763XEJ V

10)

IFX1763LD V

10)

Output Voltage Noise

IFX1763XEJ V

10)

IFX1763LD V

10)

I

I

I

I

I

I

I

I

I

I

V

V e e e

GND

GND

GND

GND

GND

GND q th,EN tl,EN

EN

EN bias,ADJ no no no

0.25

50

300

0.7

3

11

11

0.1

60

41

28

29

100

850

2.2

8

0.8

2.0

0.65

0.01

1 –

22

1

31

µA

µA mA mA mA mA

µA

V

V

µA

µA nA

µV

µV

µV

RMS

RMS

RMS

I

V

IN

OUT

=

V

OUT,nom;

= 0 mA

I

V

IN

OUT

=

V

OUT,nom;

= 1 mA

V

IN

I

OUT

=

V

OUT,nom;

= 50 mA

V

IN

I

OUT

=

V

OUT,nom;

= 100 mA

I

V

IN

OUT

=

V

OUT,nom;

= 250 mA

I

V

IN

OUT

=

V

OUT,nom;

= 500 mA;

T

J

≥ 25°C

V

IN

I

OUT

=

V

OUT,nom;

= 500 mA;

T

J

V

IN

T

J

= 6 V;

= 25°C

V

EN

< 25°C

= 0 V;

V

OUT

V

OUT

V

EN

V

EN

T

J

= Off to On

= On to Off

= 0 V;

T

J

= 20 V;

T

J

= 25°C

= 25°C

= 25°C

C

OUT

C

BYP

= 10 µF ceramic;

= 10 nF;

I

OUT

= 500 mA;

(BW = 10 Hz to 100 kHz)

C

OUT

= 10 µF ceramic

+250mΩ resistor in series;

I

C

BYP

OUT

= 10 nF;

= 500 mA;

(BW = 10 Hz to 100 kHz)

C

OUT

C

BYP

= 22 µF ceramic;

= 10 nF;

I

OUT

= 500 mA;

(BW = 10 Hz to 100 kHz)

P_5.1.19

P_5.1.20

P_5.1.21

P_5.1.22

P_5.1.23

P_5.1.24

P_5.1.25

P_5.1.26

P_5.1.27

P_5.1.28

P_5.1.29

P_5.1.30

P_5.1.31

P_5.1.32

P_5.1.33

Data Sheet 12 Rev. 1.1, 2014-10-30

IFX1763

Electrical Characteristics

Table 4

Electrical Characteristics (cont’d)

-40 °C <

T

j

< 125 °C; all voltages with respect to ground; positive current defined flowing out of pin; unless otherwise specified.

Parameter Symbol Unit Note / Test Condition Number

Output Voltage Noise

IFX1763XEJ V

10)

IFX1763LD V

10)

Output Voltage Noise

IFX1763XEJ V33

IFX1763LD V33

Output Voltage Noise

IFX1763XEJ V33

IFX1763LD V33

Output Voltage Noise

IFX1763XEJ V33

IFX1763LD V33

Output Voltage Noise

IFX1763XEJ V33

IFX1763LD V33

e e e e e

no no no no no

Min.

Values

Typ.

Max.

24 –

45

35

33

30

µV

µV

µV

RMS

RMS

RMS

µV

RMS

µV

RMS

C

OUT

= 22 µF ceramic

+250mΩ resistor in series;

I

C

BYP

OUT

= 10 nF;

= 500 mA;

(BW = 10 Hz to 100 kHz)

I

C

OUT

= 10 µF ceramic;

C

BYP

OUT

= 10 nF;

= 500 mA;

(BW = 10 Hz to 100 kHz)

C

OUT

= 10 µF ceramic

+250mΩ resistor in series;

I

C

BYP

OUT

= 10 nF;

= 500 mA;

(BW = 10 Hz to 100 kHz)

I

C

OUT

= 22 µF ceramic;

C

BYP

OUT

= 10 nF;

= 500 mA;

(BW = 10 Hz to 100 kHz)

C

OUT

= 22 µF ceramic

+250mΩ resistor in series;

I

C

BYP

OUT

= 10 nF;

= 500 mA;

(BW = 10 Hz to 100 kHz)

P_5.1.34

P_5.1.35

P_5.1.36

P_5.1.37

P_5.1.38

Power Supply Ripple Rejection

11)

Power Supply Ripple Rejection

PSRR

50 65 – dB

V

IN

f

r

-

V

OUT

= 1.5V (avg);

V

RIPPLE

= 0.5Vpp;

= 120Hz;

I

OUT

= 500mA

P_5.1.39

Output Current Limitation

Output Current Limit

Output Current Limit

I

OUT,limit

I

OUT,limit

520

520

– mA mA

V

IN

= 7 V;

V

OUT

= 0 V

V

IN

=

2.3 V

V

OUT,nom

12)

;

V

OUT

= -0.1 V

+ 1 V or

P_5.1.40

P_5.1.41

Input Reverse Leakage Current

Input Reverse Leakage

Reverse Output Current

13)

I

leak,rev

Fixed Voltage Versions

I

Reverse

Adjustable Voltage Version

I

Reverse

10

5

1

20

10 mA

µA

µA

V

IN

= -20 V;

V

OUT

= 0 V

V

OUT

V

IN

T

J

=

V

OUT,nom

;

<

V

OUT,nom

= 25°C

;

V

OUT

V

IN

= 1.22 V;

< 1.22 V;

T

J

= 25°C

3)

P_5.1.42

P_5.1.43

P_5.1.44

Data Sheet 13 Rev. 1.1, 2014-10-30

IFX1763

Electrical Characteristics

Table 4

Electrical Characteristics (cont’d)

-40 °C <

T

j

< 125 °C; all voltages with respect to ground; positive current defined flowing out of pin; unless otherwise specified.

Parameter Symbol Values Unit Note / Test Condition Number

Min.

Typ.

Max.

Output Capacitor

11)

Output Capacitance

ESR

C

OUT

ESR

3.3

14)

3

µF

C

BYP

= 0 nF P_5.1.45

P_5.1.46

1) This parameter defines the minimum input voltage for which the device is powered up and provides the maximum output current of 500 mA. Due to the nominal output voltage of 3.3 V of the fixed voltage version or depending on the chosen setting of the external voltage divider as well as on the applied conditions the device may either regulate its nominal output voltage or it may be in tracking mode. For further details please also refer to the

V

OUT

specification in

Table 4

.

2) For the IFX1763XEJ V and IFX1763LD V adjustable versions the dropout voltage for certain output voltage / load conditions will be restricted by the minimum input voltage specification.

3) The adjustable versions of the IFX1763 are tested and specified for these conditions with the ADJ pin connected to the OUT pin.

4) The operation conditions are limited by the maximum junction temperature. The regulated output voltage specification will only apply for conditions where the limit of the maximum junction temperature is fulfilled. It will therefore not apply for all possible combinations of input voltage and output current at a given output voltage. When operating at maximum input voltage, the output current must be limited for thermal reasons. The same holds true when operating at maximum output current where the input voltage range must be limited for thermal reasons.

5) To satisfy requirements for minimum input voltage, the adjustable version of the IFX1763 is tested and specified for these conditions with an external resistor divider (two 250 k

resistors) for an output voltage of 2.44 V. The external resistors will add a 5 µA DC load on the output.

6) The dropout voltage is the minimum input to output voltage differential needed to maintain regulation at a specified output current. In dropout, the output voltage will be equal to

V

IN

-

V

DR

.

7) GND-pin current is tested with

V

IN

=

V

OUT,nom

or VIN = 2.3 V, whichever is greater, and a current source load. This means that this parameter is tested while being in dropout condition and thus reflects a worst case condition. The GND-pin current will in most cases decrease slightly at higher input voltages - please also refer to the corresponding typical performance graphs.

8) The EN pin current flows into EN pin.

9) The ADJ pin current flows into ADJ pin.

10) ADJ pin connected to OUT pin.

11) Not subject to production test, specified by design.

12) whichever of the two values of

V

IN

is greater in order to also satisfy the requirements for

V

IN,min

.

13) Reverse output current is tested with the IN pin grounded and the OUT pin forced to the rated output voltage. This current flows into the OUT pin and out of the GND pin.

14)

C

BYP

= 0 nF,

C

OUT

≥ 3.3 µF; please note that for cases where a bypass capacitor at BYP is used - depending on the actual applied capacitance of

C

OUT

and

C

BYP

- a minimum requirement for ESR may apply. For further details please also refer to the corresponding typical performance graph.

Note: The listed characteristics are ensured over the operating range of the integrated circuit. Typical characteristics specified mean values expected over the production spread. If not otherwise specified, typical characteristics apply at

T

A

= 25 °C and the given supply voltage.

Data Sheet 14 Rev. 1.1, 2014-10-30

IFX1763

6 Typical Performance Characteristics

Dropout Voltage

V

DR

versus

Output Current

I

OUT

Typical Performance Characteristics

Guaranteed Dropout Voltage

V

DR

versus

Output Current

I

OUT

500

450

400

350

300

250

200

150

100

50

0

0 100 200

I

OUT

[A]

300

Dropout Voltage

V

DR

versus

Junction Temperature

T

J

T j

= −40

°

C

T j

= 25

°

C

T j

= 125

°

C

400 500

300

250

200

150

100

50

0

−50

500

450

400

350

Data Sheet

I

OUT

= 10 mA

I

OUT

= 50 mA

I

OUT

= 100 mA

I

OUT

= 500 mA

0

T j

[

°

C]

50 100

15

10

5

0

−50

30

25

20

15

50

45

40

35

500

Δ

= Guaranteed Limits

450

400

350

300

250

200

150

100

50

0

0 100 200

I

OUT

[A]

300

Quiescent Current versus

Junction Temperature

T

J

T j

25

°

C

T j

125

°

C

400 500

0

T j

[

°

C]

50

V

IN

= 6 V

I

OUT

= 0 mA .

V

EN

= V

IN

100

Rev. 1.1, 2014-10-30

Output Voltage

V

OUT versus

Junction Temperature

T

J

(IFX1763XEJ V33)

3.36

3.34

3.32

3.3

3.28

3.26

3.24

−50

I

OUT

= 1 mA

0

T j

[

°

C]

50

Quiescent Current

Input Voltage

V

I

q versus

IN

(IFX1763XEJ V33)

100

500

400

300

200

100

0

0

800

700

600

2 4

V

IN

[V]

6

V

OUT,nom

I

OUT,nom

V

EN

T j

= V

IN

= 25

°

C

= 3.3 V

= 0 mA

8 10

IFX1763

Typical Performance Characteristics

25

20

15

10

5

0

0

40

35

30

Output / ADJ Pin Voltage

V

OUT

versus

Junction Temperature

T

J

(IFX1763XEJ V)

1.24

1.235

1.23

1.225

1.22

1.215

1.21

1.205

1.2

−50

I

OUT

= 1 mA

0

T j

[

°

C]

50

Quiescent Current

Input Voltage

V

IN

I

q

versus

(IFX1763XEJ V)

100

5 10

V

IN

[V]

V

OUT,nom

R

Load

V

EN

T j

= V

IN

= 25

°

C

= 1.22 V

= 250 k

Ω

15 20

Data Sheet 16 Rev. 1.1, 2014-10-30

1200

1000

800

600

400

200

GND Current

Input Voltage

I

GND

versus

V

IN

(IFX1763XEJ V33)

R

Load

= 3.3 k

Ω

/ I

OUT

= 1 mA*

R

Load

= 330

Ω

/ I

OUT

= 10 mA*

R

Load

= 66

Ω

/ I

OUT

= 50 mA*

[* for V

OUT

T j

= 25

°

C

= 3.3 V]

0

0 2 4

V

IN

[V]

6

GND Current

Input Voltage

I

GND

versus

V

IN

(IFX1763XEJ V33)

8 10

16000

14000

12000

10000

8000

6000

4000

2000

0

0 2

R

Load

= 33.0

Ω

/ I

OUT

= 100 mA*

R

Load

= 11.0

Ω

/ I

OUT

= 300 mA*

R

Load

= 6.60

Ω

/ I

OUT

= 500 mA *.

[* for V

OUT

T j

= 25

°

C

= 3.3 V]

4

V

IN

[V]

6 8 10

IFX1763

Typical Performance Characteristics

GND Current

I

Input Voltage

GND

versus

V

IN

(IFX1763XEJ V)

400

350

300

R

Load

= 1.22 k

Ω

/ I

OUT

= 1 mA*

R

Load

= 122

Ω

/ I

OUT

= 10 mA*

R

Load

= 24.4

Ω

/ I

OUT

= 50 mA*

[* for V

OUT

T j

= 25

°

C

= 1.22 V]

250

200

150

100

50

0

0 2 4

V

IN

[V]

6

GND Current

I

Input Voltage

GND

versus

V

IN

(IFX1763XEJ V)

8 10

16000

14000

12000

10000

8000

6000

4000

2000

0

0 2

R

Load

= 12.2

Ω

/ I

OUT

= 100 mA*

R

Load

= 4.07

Ω

/ I

OUT

= 300 mA*

R

Load

= 2.44

Ω

/ I

OUT

= 500 mA *.

[* for V

OUT

T j

= 25

°

C

= 1.22 V]

4

V

IN

[V]

6 8 10

Data Sheet 17 Rev. 1.1, 2014-10-30

GND Current

I

GND versus

Output Current

I

OUT

12

10

V

IN

T j

= V

OUT,nom

= 25

°

C

+ 1 V

8

6

4

2

0

0 100 200 300

I

OUT

[mA]

EN Pin Threshold (Off-to-On) versus

Junction Temperature

T

J

400 500

1.2

1 mA

500 mA

1

0.8

0.6

0.4

0.2

0

−50 0

T j

[

°

C]

50 100

IFX1763

Typical Performance Characteristics

EN Pin Threshold (On-to-Off) versus

Junction Temperature

T

J

1.2

1 mA

500 mA

1

0.8

0.6

1.4

1.2

1

0.8

0.6

0.4

0.2

0

0

0.4

0.2

0

−50 0

T j

[

°

C]

50

EN Pin Input Current versus

EN Pin Voltage

V

EN

5 10

V

EN

[V]

15

100

T j

= 25

°

C

V

IN

= 20 V

20

Data Sheet 18 Rev. 1.1, 2014-10-30

EN Pin Input Current versus

Junction Temperature

T

J

1

0.8

0.6

0.4

0.2

1.6

1.4

1.2

0

−50 0

Current Limit versus

Junction Temperature

T

J

T j

[

°

C]

50

V

EN

= 20 V

100

1.2

V

IN

= 7 V

V

OUT

= 0 V

1

0.8

0.6

0.4

0.2

0

−50 0

T j

[

°

C]

50 100

IFX1763

Typical Performance Characteristics

Current Limit versus

Input Voltage

V

IN

0.6

0.5

0.4

0.3

1

0.9

V

OUT

T j

= 0 V

= 25

°

C

0.8

0.7

0.2

0.1

0

0

1 2 3

V

IN

[V]

4

Reverse Output Current versus

Output Voltage

V

OUT

5 6 7

30

20

10

0

0

90

80

V

OUT.nom

= 1.22 V (ADJ)

V

OUT.nom

= 3.3 V (V33)

70

60

V

IN

T j

= 0 V

= 25

°

C

50

40

2 4

V

OUT

[V]

6 8 10

Data Sheet 19 Rev. 1.1, 2014-10-30

IFX1763

Typical Performance Characteristics

Reverse Output Current versus

Junction Temperature

T

J

8

6

4

2

20

18

V

OUT.nom

= 1.22 V (ADJ)

V

OUT.nom

= 3.3 V (V33)

16

14

V

IN

= 0 V

12

10

0

−50 0

Load Regulation versus

Junction Temperature

T

J

T j

[

°

C]

50 100

Minimum Input Voltage

1)

versus

Junction Temperature

T

J

2.5

2

1.5

1

0.5

0

−50 0

T j

[

°

C]

50

I

OUT

= 100 mA

I

OUT

= 500 mA

100

Adjust Pin Bias current

I

ADJ

Junction Temperature

T

J

versus

5 140

V33: V

IN

= 4.3 V V

OUT.nom

= 3.3 V

ADJ: V

IN

= 2.3 V V

OUT.nom

= 1.22 V

120

0

100

−5

80

−10

60

−15

40

−20

20

−25

−50

Δ

I

Load

= 1 mA to 500 mA

0

T j

[

°

C]

50 100

0

−50 0

T j

[

°

C]

50 100

1)

V

IN

,min is referred here as the minimum input voltage for which the requested current is provided and

V

OUT

reaches 1 V.

Data Sheet 20 Rev. 1.1, 2014-10-30

IFX1763

Typical Performance Characteristics

ESR Stability versus

Output Current

I

OUT

(for

C

OUT

= 3.3 µF)

10

1

ESR(

C

OUT

) with

C

BYP

= 10 nF versus

Output Capacitance

C

OUT

3

C

Byp

= 10 nF

measurement limit

2.5

2

1.5

stable region above blue line

10

0

ESR max

C

Byp

= 0 nF

ESR min

C

Byp

= 0 nF

ESR max

C

Byp

= 10 nF

ESR min

C

Byp

= 10 nF

C

OUT

= 3.3 µF

(0.06

Ω

is measurement limit)

10

−1

0 100 200 300

I

OUT

[mA]

400

Input Ripple Rejection PSRR versus

Frequency f

500

60

50

40

30

20

10

0

10

100

90

80

70

V

IN

V

C

= V

OUTnom ripple

OUT

= 0.5 V

= 10 µF

+ 1.5 V pp

I

OUT

=500mA C

BYP

=0 nF

I

OUT

=500mA C

BYP

=10nF

I

OUT

=50mA C

BYP

=0 nF

I

OUT

=50mA C

BYP

=10nF

100 1k f [Hz]

10k 100k

1

0.5

0

2 3 4

C

OUT

[µF]

5

Input Ripple Rejection PSRR versus

Junction Temperature

T

J

6

68

66

64

62

60

58

56

V

IN

= V

OUTnom

+ 1.5 V

V ripple

= 0.5 V pp f ripple

= 120 Hz

C

OUT

= 10 µF

54

52

−50

I

OUT

=500mA C

BYP

=0 nF

I

OUT

=500mA C

BYP

=10nF

0

T j

[

°

C]

50 100

7

Data Sheet 21 Rev. 1.1, 2014-10-30

Output Noise Spectral Density (ADJ) versus

Frequency (

C

OUT

= 10 µF,

I

OUT

= 50 mA

1)

)

10

1

C

OUT

I

OUT

= 10 µF

= 50 mA

10

0

IFX1763

Typical Performance Characteristics

Output Noise Spectral Density (ADJ) versus

Frequency (

C

OUT

= 22 µF,

I

OUT

= 50 mA

1)

)

10

1

C

OUT

I

OUT

= 22 µF

= 50 mA

10

0

10

−1

10

−2

10

1

C

Byp

= 0 nF; ESR(C

OUT

)=0

C

Byp

= 10 nF; ESR(C

OUT

)=0

C

Byp

= 10 nF; ESR(C

OUT

)=250m

Ω

10

2

10

3 f [Hz]

10

4

Output Noise Spectral Density (3.3 V) versus

Frequency (

C

OUT

= 10 µF,

I

OUT

= 50 mA

1)

)

10

5

10

1

C

OUT

I

OUT

= 10 µF

= 50 mA

10

−1

C

Byp

= 0 nF; ESR(C

OUT

)=0

C

Byp

= 10 nF; ESR(C

OUT

)=0

C

Byp

= 10 nF; ESR(C

OUT

)=250m Ω

10

−2

10

1

10

2

10

3 f [Hz]

10

4

10

5

Output Noise Spectral Density (3.3 V) versus

Frequency (

C

OUT

= 22µF,

I

OUT

= 50mA

1)

)

10

1

C

OUT

I

OUT

= 22 µF

= 50 mA

10

0

10

0

10

−1

10

−1

10

−2

10

1

C

Byp

= 0 nF; ESR(C

OUT

)=0

C

Byp

= 10 nF; ESR(C

OUT

)=0

C

Byp

= 10 nF; ESR(C

OUT

)=250m Ω

10

2

10

3 f [Hz]

10

4

10

5

10

−2

10

1

C

Byp

= 0 nF; ESR(C

OUT

)=0

C

Byp

= 10 nF; ESR(C

OUT

)=0

C

Byp

= 10 nF; ESR(C

OUT

)=250m Ω

10

2

10

3 f [Hz]

10

4

1) Load condition 50mA is representing a worst case condition with regard to output voltage noise performance.

10

5

Data Sheet 22 Rev. 1.1, 2014-10-30

IFX1763

Typical Performance Characteristics

Transient Response

C

BYP

= 0nF (IFX1763XEJ V33) Transient Response

C

BYP

= 10nF (IFX1763XEJ V33)

-0,1

-0,2

-0,3

0

0,1

0

0,3

0,2

C

OUT

C

BYP

V

IN

= 10 µF

= 0 nF

= 6 V

100 200 300 400 500

Time (μs)

600 700 800 900 1000

200

100

0

0

400

300

600

I

OUT

: 100 to 500mA

500

100 200 300 400 500

Time (μs)

600 700 800 900 1000

-0,05

-0,1

-0,15

0

0,15

0,1

C

OUT

C

BYP

V

IN

= 10 µF

= 10 nF

= 6V

0,05

0

10 20

600

I

OUT

: 100 to 500mA

500

400

300

200

100

0

0 10 20 30

30 40 50

Time / [μs]

60 70

40 50

Time / [μs]

60 70 80

80 90 100

90 100

Data Sheet 23 Rev. 1.1, 2014-10-30

IFX1763

7 Application Information

Application Information

Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device.

V

IN

C

IN

1µF

IN

IFX1763

OUT

SENSE

C

BYP

10nF

C

OUT

10µF

V

OUT

R

Load

EN

GND

BYP

Figure 5

GND

Typical Application Circuit IFX1763 (fixed voltage version)

IFX1763 ADJ

V

IN

IN OUT

R

2

C

IN

ADJ

R

1 1µF

C

BYP

C

OUT

V

OUT

10nF

EN

GND

BYP

10µF

R

Load

GND

Calculation of V

OUT

: V

OUT

= 1.22V x (1 + R

2

/ R

1

) + (I

ADJ x R

2

)

Figure 6 Typical Application Circuit IFX1763 (adjustable version)

Note: This is a very simplified example of an application circuit. The function must be verified in the real application

1)2)

.

1) Please note that in case a non-negligible inductance at IN pin is present, e.g. due to long cables, traces, parasitics, etc, a bigger input capacitor

C

IN

may be required to filter its influence. As a rule of thumb if the IN pin is more than six inches away from the main input filter capacitor an input capacitor value of

C

IN

= 10 µF is recommended.

2) For specific needs a small optional resistor may be placed in series to very low ESR output capacitors

C

OUT

for enhanced noise performance (for details please see

“Bypass Capacitance and Low Noise Performance” on Page 25

).

Data Sheet 24 Rev. 1.1, 2014-10-30

IFX1763

Application Information

The IFX1763 is a 500 mA low dropout regulator with very low quiescent current and Enable-functionality. The device is capable of supplying 500 mA at a dropout voltage of 320 mV. Output voltage noise numbers down to

24

µV

RMS

can be achieved over a 10 Hz to 100 kHz bandwidth with the addition of a 10 nF reference bypass capacitor. The usage of a reference bypass capacitor will additionally improve transient response of the regulator, lowering the settling time for transient load conditions. The device has a low operating quiescent current of typical

30 µA that drops to less than 1 µA in shutdown (EN-pin pulled to low level). The device also incorporates several protection features which makes it ideal for battery-powered systems. It is protected against both reverse input and reverse output voltages. In battery backup applications where the output can be held up by a backup battery when the input is pulled to ground the device behaves like it has a diode in series with its output and prevents reverse current flow.

7.1

Adjustable Operation

The adjustable version of the IFX1763 has an output voltage range of 1.22 V to 20 V -

set by the ratio of two external resistors, as it can be seen in

Figure 6

V

DR

. The output voltage is

(for the calculation of

V

OUT

the formula given in the figure can be used). The device controls the output to maintain the ADJ pin at 1.22 V referenced to ground.

The current in

R

1

is then equal 1.22 V /

R

1

and the current in

R

2

equals the current in current. The ADJ pin bias current, which is ~ 60 nA @ 25°C, flows through

R

R

1

plus the ADJ pin bias

2

into the ADJ pin. The value of

R

1 should be not greater than 250 kΩ in order to minimize errors in the output voltage caused by the ADJ pin bias current. Note that when the device is shutdown (i.e. low level applied to EN pin) the output is turned off and consequently the divider current will be zero. For details of the ADJ pin bias current see also the corresponding

typical performance graph

Figure “Adjust Pin Bias current I

ADJ

versus Junction Temperature T

J

” on

Page 20

.

7.2

Kelvin Sense Connection

For the fixed voltage version of the IFX1763 the SENSE pin is the input to the error amplifier. An optimum regulation will be obtained at the point where the SENSE pin is connected to the OUT pin of the regulator. In critical applications however small voltage drops can be caused by the resistance Rp of the PC-traces and thus may lower the resulting voltage at the load. This effect may be eliminated by connecting the SENSE pin to the output as close

as possible at the load (see

Figure 7

). Please note that the voltage drop across the external PC trace will add up

to the dropout voltage of the regulator.

V

IN

C

IN

IN

IFX1763

OUT

SENSE

EN

GND

BYP

R

P

C

OUT

R

Load

R

P

Figure 7 Kelvin Sense Connection

7.3

Bypass Capacitance and Low Noise Performance

The IFX1763 regulator may be used in combination with a bypass capacitor connecting the OUT pin to the BYP pin in order to minimize output voltage noise

1)

.This capacitor will bypass the reference of the regulator, providing

1) a good quality low leakage capacitor is recommended.

Data Sheet 25 Rev. 1.1, 2014-10-30

IFX1763

Application Information

a low frequency noise pole. The noise pole provided by such a bypass capacitor will lower the output voltage noise in the considered bandwidth. For a given output voltage actual numbers of the output voltage noise will - next to the bypass capacitor itself - be dependent on the capacitance of the applied output capacitor and its ESR: In case of the IFX1763XEJ V applied with unity gain (i.e.

V

OUT

= 1.22 V) the usage of a bypass capacitor of 10 nF in combination with a (low ESR) ceramic

41

µV

C

OUT

of 10 µF will result in output voltage noise numbers of typical

RMS

. This Output Noise level can be reduced to typical 28

µV

RMS

under the same conditions by adding a small resistor of ~250 mΩ in series to the 10 µF ceramic output capacitor acting as additional ESR. A reduction of the output voltage noise can also be achieved by increasing capacitance of the output capacitor. For

C

OUT

= 22 µF

(ceramic low ESR) the output voltage noise will be typically around 29

24

µV

RMS

by adding a small resistance of ~250 mΩ in series to

C

µV

RMS

and can again be further lowered to

OUT

. In case of the fix voltage version IFX1763XEJ

V33 the output voltage noise for the described cases vary from 45

please also see

“Output Voltage Noise

µV

RMS

down to 30

µV

RMS

. For further details

11)

” on Page 12

,, of the Electrical Characteristics. Please note that next

to reducing the output voltage noise level the usage of a bypass capacitor has the additional benefit of improving transient response which will be also explained in the next chapter. However one needs to take into consideration that on the other hand the regulator start-up time is proportional to the size of the bypass capacitor and slows down to values around 15 ms when using a 10 nF bypass capacitor in combination with a 10 µF

C

OUT

output capacitor.

7.4

Output Capacitance Requirements and Transient Response

The IFX1763 is designed to be stable with a wide range of output capacitors. The ESR of the output capacitor is an essential parameter with regard to stability, most notably with small capacitors. A minimum output capacitor of

3.3 µF with an ESR of 3 Ω or less is recommended to prevent oscillations. Like in general for LDO’s the output transient response of the IFX1763 will be a function of the output capacitance. Larger values of output capacitance decrease peak deviations and thus improve transient response for larger load current changes. Bypass capacitors, used to decouple individual components powered by the IFX1763 will increase the effective output capacitor value. Please note that with the usage of bypass capacitors for low noise operation either larger values of output capacitors are needed or a minimum ESR requirement of

Figure “ESR(C

OUT

) with C

BYP

C

OUT

may have to be considered (see also

= 10 nF versus Output Capacitance C

OUT

” on Page 21

as example). In conjunction with the usage of a 10 nF bypass capacitor an output capacitor

C

OUT

≥ 6.8 µF is recommended. The benefit of a bypass capacitor to the transient response performance is impressive and illustrated as one example

in

Figure 8

where the transient response of the IFX1763XEJ V33 to one and the same load step from 100 mA to

500 mA is shown with and without a 10 nF bypass capacitor: for the given configuration of

C

OUT

= 10 µF with no bypass capacitor the load step will settle in the range of less than 100 µs while for

C

OUT

= 10 µF in conjunction with a 10 nF bypass capacitor the same load step will settle in the range of 10 µs. Due to the shorter reaction time of the regulator by adding the bypass capacitor not only the settling time improves but also output voltage deviations due to load steps are sharply reduced.

Figure 8

0,3

0,2

C

OUT

C

BYP

V

IN

= 10 µF

= 0 vs 10nF

= 6 V

0,1

0

C_BYP = 0nF

C_BYP = 10nF

-0,1

-0,2

-0,3

0 100 200 300 400 500

Time (μs)

600 700 800 900 1000

Influence of without

C

C

BYP

: example of transient response to one and the same load step with and

BYP

of 10 nF (

I

OUT

100 mA to 500 mA, IFX1763XEJ V33)

Data Sheet 26 Rev. 1.1, 2014-10-30

IFX1763

Application Information

7.5

Protection Features

The IFX1763 regulators incorporate several protection features which make them ideal for usage in batterypowered circuits. In addition to normal protection features associated with monolithic regulators like current limiting and thermal limiting the device is protected against reverse input voltage, reverse output voltage and reverse voltages from output to input.

Current limit protection and thermal overload protection are intended to protect the device against current overload conditions at the output of the device. For normal operation the junction temperature must not exceed 125°C.

The input of the device will withstand reverse voltages of 20 V. Current flowing into the device will be limited to less than 1 mA (typically less than 100 µA) and no negative voltage will appear at the output. The device will protect both itself and the load. This provides protection against batteries being plugged backwards.

The output of the IFX1763 can be pulled below ground without damaging the device. If the input is left open-circuit or grounded, the output can be pulled below ground by 20 V. Under such conditions the output of the device by itself behaves like an open circuit with practically no current flowing out of the pin

1)

. In more application relevant cases however where the output is either connected to the SENSE pin (fix voltage variant) or tied either via an external voltage divider or directly to the ADJ pin (adjustable variant) a small current will be present from this origin.

In the case of the fixed voltage version this current will typically be below 100 µA while for the adjustable version it depends on the magnitude of the top resistor of the external voltage divider

2)

. If the input is powered by a voltage source the output will source the short circuit current of the device and will protect itself by thermal limiting. In this case grounding the EN pin will turn off the device and stop the output from sourcing the short-circuit current.

The ADJ pin of the adjustable device can be pulled above or below ground by as much as 7 V without damaging the device. If the input is grounded or left open-circuit, the ADJ pin will act inside this voltage range like a large resistor (typically 100 kΩ) when being pulled above ground and like a resistor (typically 5 kΩ) in series with a diode when being pulled below ground. In situations where the ADJ pin is at risk of being pulled outside its absolute maximum ratings ±7 V the ADJ pin current must be limited to 1 mA (e.g. in cases where the ADJ pin is connected to a resistor divider that would pull the ADJ pin above its 7 V clamp voltage). Let’s consider for example the case where a resistor divider is used to provide a 1.5 V output from the 1.22 V reference and the output is forced to

20 V. The top resistor of the resistor divider must then be chosen to limit the current into the ADJ pin to 1 mA or less when the ADJ pin is at 7 V. The 13 V difference between output and ADJ pin divided by the 1 mA maximum current into the ADJ pin requires a minimum resistor value of 13 kΩ.

In circuits where a backup battery is required, several different input/output conditions can occur. The output voltage may be held up while the input is either pulled to ground, pulled to some intermediate voltage or is left open-circuit. Current flow back into the output will follow the curve as shown in

Figure 9

below.

When the IN pin of the fixed voltage version is forced below the OUT pin, or the OUT pin is pulled above the IN pin, the input current will drop to very small values – typically down to less than 2 µA, once

V

OUT

exceeds

V

IN

by some 300 mV or more. This can happen if the input of the device is connected to a discharged battery and the output is held up by either a backup battery or a second regulator circuit. The state of the EN pin will have no effect on the reverse output current when the output is pulled above the input.

1) typically < 1 µA for the mentioned conditions,

V

OUT

being pulled below ground with other pins either grounded or open.

2) In case there is no external voltage divider applied i.e. the ADJ pin is directly connected to the output and the output is pulled below ground by 20 V the current flowing out of the ADJ pin will be typically ~ 4 mA. Please ensure in such cases that the absolute maximum ratings of the ADJ pin are respected.

Data Sheet 27 Rev. 1.1, 2014-10-30

Figure 9 Reverse Output Current

30

20

10

90

80

V

OUT.nom

= 1.22 V (ADJ)

V

OUT.nom

= 3.3 V (V33)

70

60

V

IN

T j

= 0 V

= 25

°

C

50

40

0

0 2 4

V

OUT

[V]

6 8 10

IFX1763

Application Information

Data Sheet 28 Rev. 1.1, 2014-10-30

8 Package Outlines

+0 -0.1

0.41

±0.0

9

2)

1.27

C 0.08

C

Seating Plane

0.2

M

C A-B D 8x

3.

9 ±0.1

1)

0.35 x 45˚

0.1

C D 2x

+0.06

9

0.1

D

6

±0.2

0.64

±0.25

0.2

M

D 8x

8 5

A

Bottom View

3

±0.2

1 4

1 4

8

B

Index Marking

4.

9

±0.1

1)

0.1

C A-B 2x

1) Does not include plastic or metal protrusion of 0.15 max. per side

2) Dambar protrusion shall be maximum 0.1 mm total in excess of lead width

3) JEDEC reference MS-012 variation BA

Figure 10

PG-DSO-8 Exposed Pad package outlines

5

PG-DSO-8-27-PO V01

IFX1763

Package Outlines

3 .

3

±0.1

0.05

0.1

±0.1

Z

0.

3 6

±0.1

2.5

8

±0.1

0.5

3

±0.1

Pin 1 M a rking

Z (4:1)

0.5

±0.1

Pin 1 M a rking

0.25

±0.1

PG-T S ON-10-2-PO V02

0.07 MIN.

Figure 11

PG-TSON-10 Package Outlines

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e

Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).

For further information on alternative packages, please visit our website:

http://www.infineon.com/packages

.

Data Sheet 29

Dimensions in mm

Rev. 1.1, 2014-10-30

IFX1763

9

Revision

1.1

1.0

Revision History

Revision History

Date Changes

2014-10-30 Updated Data Sheet including additional package type PG-TSON-10:

• PG-TSON-10 package variants added: Product Overview, Pin Configuration

Thermal Resistance, Wording, etc added / updated accordingly.

• Typical Performance Graphs: some legends entries updated and corrected

(

Figure “Minimum Input Voltage versus Junction Temperature T

J

” on

Page 20

and

Figure “Input Ripple Rejection PSRR versus Junction

Temperature T

J

” on Page 21

).

• Application Information updated: Clarification and correction of wording.

Typical values updated and footnotes added.

• Editorial changes throughout the document.

2014-02-13 Data Sheet - Initial Release

Data Sheet 30 Rev. 1.1, 2014-10-30

Edition 2014-10-30

Published by

Infineon Technologies AG

81726 Munich, Germany

©

2014 Infineon Technologies AG

All Rights Reserved.

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.

Information

For further information on technology, delivery terms and conditions and prices, please contact the nearest

Infineon Technologies Office (

www.infineon.com

).

Warnings

Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office.

The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of

Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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