HP (Hewlett-Packard) | 686713-S01 | User manual | HP ProLiant ML350p Gen8 Server User Guide


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HP (Hewlett-Packard) | 686713-S01 | User manual | HP ProLiant ML350p Gen8 Server User Guide | Manualzz

HP ProLiant ML350p Gen8 Server

User Guide

Abstract

This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.

Part Number: 661082-001

March 2012

Edition: 1

© Copyright 2012 Hewlett-Packard Development Company, L.P.

The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation.

Bluetooth is a trademark owned by its proprietor and used by Hewlett-Packard Company under license.

Contents

Component identification ............................................................................................................... 7

Front panel components ................................................................................................................................ 7

Front panel LEDs and buttons ......................................................................................................................... 8

Rear panel components ................................................................................................................................ 9

Rear panel LEDs ......................................................................................................................................... 10

System board components .......................................................................................................................... 11

System maintenance switch ............................................................................................................... 12

NMI functionality ............................................................................................................................. 12

DIMM slots ................................................................................................................................................ 13

Systems Insight Display LEDs ....................................................................................................................... 13

Systems Insight Display LED combinations ..................................................................................................... 14

SAS and SATA device numbers ................................................................................................................... 15

Drive LED definitions ................................................................................................................................... 16

Fans ......................................................................................................................................................... 17

FBWC module LEDs (P222, P420, P420i, P421) ........................................................................................... 18

RPS riser board connectors .......................................................................................................................... 19

Operations................................................................................................................................. 20

Power down the server ............................................................................................................................... 20

Power up the server .................................................................................................................................... 20

Remove the tower bezel .............................................................................................................................. 20

Remove the security bezel ........................................................................................................................... 22

Install the security bezel .............................................................................................................................. 22

Remove the rack bezel ................................................................................................................................ 22

Install the rack bezel ................................................................................................................................... 23

Remove the access panel ............................................................................................................................ 24

Install the access panel ............................................................................................................................... 24

Extend the server from the rack .................................................................................................................... 25

Remove the air baffle .................................................................................................................................. 25

Remove the fan .......................................................................................................................................... 26

Remove the fan cage .................................................................................................................................. 27

Remove the FBWC capacitor pack ............................................................................................................... 28

Remove the DVD drive ................................................................................................................................ 29

Remove the component drive cage blank ...................................................................................................... 30

Setup ......................................................................................................................................... 31

Optional installation services ....................................................................................................................... 31

Rack planning resources ............................................................................................................................. 31

Optimum environment................................................................................................................................. 31

Space and airflow requirements ........................................................................................................ 32

Temperature requirements ................................................................................................................. 32

Power requirements .......................................................................................................................... 33

Electrical grounding requirements ...................................................................................................... 33

Rack warnings ........................................................................................................................................... 34

Server warnings and cautions ...................................................................................................................... 34

Identifying tower server shipping carton contents ........................................................................................... 35

Installing hardware options ......................................................................................................................... 35

Contents 3

Setting up a tower server ............................................................................................................................ 35

Installing the server into the rack .................................................................................................................. 36

Powering up and configuring the server ........................................................................................................ 37

Installing the operating system ..................................................................................................................... 37

Registering the server.................................................................................................................................. 38

Hardware options installation ....................................................................................................... 39

Introduction ............................................................................................................................................... 39

Second processor option ............................................................................................................................. 39

Memory options ......................................................................................................................................... 45

HP SmartMemory ............................................................................................................................. 46

Memory subsystem architecture ......................................................................................................... 46

Single-, dual-, and quad-rank DIMMs ................................................................................................. 47

DIMM identification .......................................................................................................................... 47

Memory configurations ..................................................................................................................... 48

General DIMM slot population guidelines ........................................................................................... 49

Installing a DIMM ............................................................................................................................. 50

Optical drive cage option ........................................................................................................................... 51

DVD option ............................................................................................................................................... 54

Redundant AC power supply option ............................................................................................................. 56

Hot-plug SAS drive options .......................................................................................................................... 57

Removing the drive blank .................................................................................................................. 57

Installing a hot-plug drive .................................................................................................................. 58

Expansion board option .............................................................................................................................. 59

Graphic card option ................................................................................................................................... 62

Installing a graphic card adapter option ............................................................................................. 62

Controller option ........................................................................................................................................ 66

Installing FBWC capacitor pack ......................................................................................................... 67

Installing the cache module ............................................................................................................... 68

Redundant fans option ................................................................................................................................ 69

Redundant fan guidelines .................................................................................................................. 69

Installing a hot-plug redundant fan ..................................................................................................... 70

Eight-bay SFF drive cage option................................................................................................................... 73

Installing the optional SFF hot-plug drive cage ..................................................................................... 73

Six-bay LFF drive cage ................................................................................................................................ 76

Installing the optional LFF hot-plug drive cage...................................................................................... 76

HP Trusted Platform Module option .............................................................................................................. 79

Installing the Trusted Platform Module board ....................................................................................... 80

Retaining the recovery key/password ................................................................................................. 82

Enabling the Trusted Platform Module ................................................................................................. 82

Cabling ..................................................................................................................................... 83

Server data cabling .................................................................................................................................... 83

Media device data cabling ......................................................................................................................... 84

Optical drive cabling .................................................................................................................................. 85

Software and configuration utilities ............................................................................................... 86

Server mode .............................................................................................................................................. 86

Server QuickSpecs ..................................................................................................................................... 86

HP iLO Management Engine ....................................................................................................................... 86

HP iLO ............................................................................................................................................ 86

Intelligent Provisioning ...................................................................................................................... 88

Scripting Toolkit ............................................................................................................................... 90

HP Service Pack for ProLiant ........................................................................................................................ 90

Contents 4

HP Smart Update Manager ............................................................................................................... 90

HP ROM-Based Setup Utility ........................................................................................................................ 91

Using RBSU ..................................................................................................................................... 91

Auto-configuration process ................................................................................................................ 91

Boot options .................................................................................................................................... 92

Configuring AMP modes ................................................................................................................... 92

Re-entering the server serial number and product ID ............................................................................. 92

Utilities and features ................................................................................................................................... 93

Array Configuration Utility ................................................................................................................ 93

Option ROM Configuration for Arrays................................................................................................ 94

ROMPaq utility ................................................................................................................................. 94

Automatic Server Recovery ................................................................................................................ 95

USB support .................................................................................................................................... 95

Redundant ROM support ................................................................................................................... 95

Keeping the system current .......................................................................................................................... 96

Drivers ............................................................................................................................................ 96

Software and firmware ..................................................................................................................... 96

Version control ................................................................................................................................. 96

HP Operating Systems and Virtualization Software Support for ProLiant Servers ..................................... 97

HP Technology Service Portfolio ......................................................................................................... 97

Change control and proactive notification .......................................................................................... 97

Troubleshooting .......................................................................................................................... 98

Troubleshooting resources ........................................................................................................................... 98

Battery replacement .................................................................................................................... 99

Regulatory compliance notices ................................................................................................... 101

Regulatory compliance identification numbers ............................................................................................. 101

Federal Communications Commission notice ............................................................................................... 101

FCC rating label ............................................................................................................................ 101

FCC Notice, Class A Equipment ...................................................................................................... 101

FCC Notice, Class B Equipment ....................................................................................................... 101

Declaration of conformity for products marked with the FCC logo, United States only ...................................... 102

Modifications ........................................................................................................................................... 102

Cables .................................................................................................................................................... 102

Canadian notice (Avis Canadien) .............................................................................................................. 102

European Union regulatory notice .............................................................................................................. 103

Disposal of waste equipment by users in private households in the European Union ........................................ 103

Japanese notice ....................................................................................................................................... 104

BSMI notice ............................................................................................................................................. 104

Korean notice .......................................................................................................................................... 104

Chinese notice ......................................................................................................................................... 105

Vietnam compliance marking notice ........................................................................................................... 105

Ukraine notice ......................................................................................................................................... 105

Laser compliance ..................................................................................................................................... 105

Battery replacement notice ........................................................................................................................ 106

Taiwan battery recycling notice ................................................................................................................. 106

Power cord statement for Japan ................................................................................................................. 106

Acoustics statement for Germany (Geräuschemission) .................................................................................. 107

Electrostatic discharge ............................................................................................................... 108

Preventing electrostatic discharge .............................................................................................................. 108

Grounding methods to prevent electrostatic discharge .................................................................................. 108

Contents 5

Specifications ........................................................................................................................... 109

Environmental specifications ...................................................................................................................... 109

Server specifications ................................................................................................................................. 109

Power supply specifications ....................................................................................................................... 110

HP 460 W Power Supply (92%) specifications .................................................................................. 110

HP 460 W CS Power Supply (94%) specifications ............................................................................. 110

HP 750 W Power Supply (92%) specifications .................................................................................. 111

HP 750 W CS Power Supply (94%) specifications ............................................................................. 111

HP 1200 W CS Power Supply (94%) specifications ........................................................................... 112

Technical support ...................................................................................................................... 113

Before you contact HP .............................................................................................................................. 113

HP contact information .............................................................................................................................. 113

Customer Self Repair ................................................................................................................................ 113

Acronyms and abbreviations ...................................................................................................... 121

Documentation feedback ........................................................................................................... 124

Index ....................................................................................................................................... 125

Contents 6

Component identification

Front panel components

SFF

2

3

4

Item Description

1

Media/Drive cage bay

SAS/SATA drives (8)

Optical drive

USB connectors (4)

Component identification 7

LFF

Item

3

4

1

2

Description

Media/Drive cage bay

SAS/SATA drive (6)

Optical drive

USB connectors (4)

Front panel LEDs and buttons

Item Description

1

Power On/Standby button and system power LED

Status

Green = Normal (system on)

Flashing green = waiting for power

Amber = System in standby, but power still applied

Off = Power cord not attached or power supply failure

Component identification 8

Item Description

2

NIC statusLED

3

4

Health LED

UID LED

Status

Green = Network link

Flashing green = Network link and activity

Off = No link to network

Green = Normal (system on)

Flashing amber = System health is degraded

Flashing red = System health is critical

Off = Normal (system off)

Blue = Activated

Flashing blue = System is being managed remotely

Off = Deactivated

Rear panel components

Item

10

11

12

13

8

9

6

7

14

15

3

4

1

2

5

Description

Power supply 4

Power supply 3

Power supply 2

Power supply 1

PCIe slot 1 (Processor 1)

PCIe slot 2 (Processor 1)

PCIe slot 3 (Processor 1)

PCIe slot 4 (Processor 1)

UID button/LED

Serial connector iLO connector

NIC connector 3

NIC connector 4

NIC connector 2

NIC connector 1

Component identification 9

Item

16

17

18

19

20

21

22

Description

USB connectors (4)

Video connector

PCIe slot 5 (Processor 2)

PCIe slot 6 (Processor 2)

PCIe slot 7 (Processor 2)

PCIe slot 8 (Processor 2)

PCIe slot 9 (Processor 2)

Rear panel LEDs

5

6

2

3

Item Description

1

NIC activity LED

NIC link LED

Power supply LED

4

UID LED iLO 4 link LED iLO 4 activity LED

Status

Green = Linked to network

Off = No network connection

Green or flashing green = Network activity

Off = No network activity

Green = System has AC power and is powered up

Off = System has no AC power, the system is off, or the power supply has failed

Blue = Activated

Flashing blue = System is being managed remotely

Off = Deactivated

Green or flashing green = Network activity

Off = No network activity

Green = Linked to network

Off = No network connection

Component identification 10

System board components

Item

15

16

17

18

19

11

12

13

14

7

8

5

6

9

10

3

4

1

2

20

21

22

23

24

25

26

Description

Slot 1 PCIe3 x16 (8, 4, 1)

Slot 2 PCIe3 x8 (4, 1)

Slot 3 PCIe3 x16 (16, 8, 4, 1)

Slot 4 PCIe3 x8 (4, 1)

Processor 1 DIMM slots

Smart Array P420i memory cache module

Mini-SAS connectors (2)

Processor 2 DIMM slots

Processor socket 2

SD card slot

Front panel connectors (2)

Fan cage connector

Internal USB tape connector

Discovery service cable connector

System battery

SATA connectors

Internal USB connector

Processor 2 DIMM slots

TPM connector

Slot 9 PCIe3 x8 (4, 1)

Slot 8 PCIe3 x16 ( 16, 8, 4, 1)

Slot 7 PCIe3 x8 (4, 1)

Slot 6 PCIe3 x16 (16, 8, 4, 1)

Slot 5 PCIe2 x8 (4, 1)

Processor 1 DIMM slots

Processor socket 1 (populated)

Component identification 11

System maintenance switch

The system maintenance switch (SW1) is a ten-position switch that is used for system configuration.

Position

S1

Description iLO security

Function

S2

S3

S4

S5

S6

S7, S8, S9,

S10, S11,

S12

Configuration lock

Reserved

Reserved

Password protection override

Invalidate configuration

Reserved

Off = iLO security enabled.

On = iLO security disabled.

Off = Able to change system configuration.

On = System configuration locked.

Off = Tower

On = Rack

Reserved

Off = No function

On = Clears power-on password and administrator password

Off = Normal

On = ROM treats the system configuration as invalid.

Reserved

When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM.

CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly configure the server or data loss could occur.

NMI functionality

An NMI crash dump enables administrators to create crash dump files when a system is hung and not responding to traditional debug mechanisms.

Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in operating systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is to cycle the system power. Resetting the system erases any information that could support problem analysis, but the NMI feature preserves that information by performing a memory dump before a hard reset.

To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can do either of the following:

Short the NMI jumper pins

Use the iLO Virtual NMI feature

For more information, see the whitepaper on the HP website

( http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00797875/c00797875.pdf

).

Component identification 12

DIMM slots

DIMM slots are numbered sequentially (1 through 12) for each processor. The supported AMP modes use the letter assignments for population guidelines.

NOTE: For proper orientation, the arrow indicates the front of the server.

Systems Insight Display LEDs

The HP Systems Insight Display LEDs represent the system board layout.

Component identification 13

Item

1

2

3

Description

Power cap

AMP Status

DIMM LEDs

All other LEDs

Status

To determine Power cap status, see

"Systems Insight Display LED combinations

(on page 14 )."

Green = AMP mode enabled

Amber = Failover

Off = AMP mode disabled

Amber = DIMM error

Off = Normal

Amber = Failure

Off = Normal

IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.

Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing each DIMM in a bank with a known working DIMM.

Systems Insight Display LED combinations

When the health LED on the front panel illuminates either amber or red, the server is experiencing a health event. Combinations of illuminated Systems Insight Display LEDs, the system power LED, and the health LED indicate system status.

Systems Insight Display

LED and color

Health LED

System power

LED

Status

Processor (amber)

Red Amber

Processor (amber)

Amber Green

One or more of the following conditions might exist:

Processor in socket X has failed.

Processor X is not installed in the socket.

Processor X is unsupported.

ROM detects a failed processor during

POST

Processor in socket X is in a pre-failure condition.

DIMM (amber)

DIMM (amber)

Red

Amber

Overtemperature (amber) Amber

Overtemperature (amber) Red

Fan (amber)

Fan (amber)

Amber

Red

Green

Green

Green

Amber

Green

Green

One or more DIMMs have failed.

DIMM in slot X is in a pre-failure condition.

The Health Driver has detected a cautionary temperature level.

The server has detected a hardware critical temperature level.

Fan has failed or is missing, but still meets the minimum fan requirements.

Fan has failed or is missing and no longer meets the minimum fan requirements.

Power supply (amber)

Red Amber

• Only one power supply installed and in standby mode.

Power supply fault

System board fault

Component identification 14

Systems Insight Display

LED and color

Health LED

System power

LED

Amber Green

Status

Power supply (amber)

Power cap (off)

Power cap (green)

Power cap (flashing amber)

Power cap (green)

Amber

Flashing green

Amber

Green

Redundant power supply is installed and only one power supply is functional.

AC power cord is not plugged into redundant power supply.

Redundant power supply fault

Power supply mismatch at POST or through hot-plug addition.

Standby

Waiting for power

Power cap has been exceeded

Power is available

IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.

Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing each DIMM in a bank with a known working DIMM.

SAS and SATA device numbers

With optional drive cages installed, the server supports up to 24 SFF drives or up to 18 LFF drives. The server does not support mixing SFF and LFF drives.

HP recommends that you populate drive bays starting with the lowest SAS or SATA device number. Drives are numbered from left to right in each component box. Component boxes are numbered 1 through 3, from bottom to top.

SFF drives

Component identification 15

LFF drives

Drive LED definitions

2

1

Item LED

Locate

3

4

Status Definition

Solid blue The drive is being identified by a host application.

Flashing blue The drive carrier firmware is being updated or requires an update.

Activity ring Rotating green Drive activity

Off No drive activity

Do not remove Solid white

Off

Do not remove the drive. Removing the drive causes one or more of the logical drives to fail.

Removing the drive does not cause a logical drive to fail.

Drive status Solid green The drive is a member of one or more logical drives.

Flashing green The drive is rebuilding or performing a RAID migration, stripe size migration, capacity expansion, or logical drive extension, or is erasing.

Flashing amber/green

The drive is a member of one or more logical drives and predicts the drive will fail.

Flashing amber The drive is not configured and predicts the drive will fail.

Solid amber The drive has failed.

Component identification 16

Item LED Status

Off

Definition

The drive is not configured by a RAID controller.

Fans

The server supports redundant fans to provide proper airflow to the system when a primary fan fails. For more

information, see "Redundant fan guidelines (on page 69 )."

IMPORTANT: Fan louvers must be present for the redundant configuration. Without the louvers, all four fans are nonredundant.

Item

3

4

1

2

Description

Fan 1

Fan 2

Fan 3

Fan 4

Configuration

Redundant

Primary

Primary

Primary

Component identification 17

FBWC module LEDs (P222, P420, P420i, P421)

The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the reverse side of the cache module to facilitate status viewing.

Off

Off

Off

Off

1 - Amber

Off

Off

Off

Off

Flashing 1 Hz

Flashing 1 Hz

Flashing 1 Hz

Flashing 2 Hz

Flashing 2 Hz

On

On

2 - Green 3 - Green Interpretation

Off Off The cache module is not powered.

Flashing 0.5 Hz Flashing 0.5 Hz The cache microcontroller is executing from within its boot loader and receiving new flash code from the host controller.

Flashing 1 Hz Flashing 1 Hz The cache module is powering up, and the capacitor pack is charging.

Off

Off

Flashing 1 Hz The cache module is idle, and the capacitor pack is charging.

On The cache module is idle, and the capacitor pack is charged.

On On

Flashing 1 Hz

On

Off

Off

Flashing 1 Hz Off

Flashing 1 Hz On

The cache module is idle, the capacitor pack is charged, and the cache contains data that has not yet been written to the drives.

A backup is in progress.

The current backup is complete with no errors.

The current backup failed, and data has been lost.

A power error occurred during the previous or current boot. Data may be corrupt.

On Off

Flashing 2 Hz Off

Flashing 2 Hz On

On

On

Off

On

An overtemperature condition exists.

The capacitor pack is not attached.

The capacitor has been charging for 10 minutes, but has not reached sufficient charge to perform a full backup.

The current backup is complete, but power fluctuations occurred during the backup.

The cache module microcontroller has failed.

Component identification 18

RPS riser board connectors

2

3

4

5

Item

1

Connector

J7

J9

J5

J6

J8

Description

Graphic card power connector

Drive backplane bay 1/optical drive power connector

Drive backplane bay 2 power connector

Drive backplane bay 3 power connector

Graphic card power connector

Component identification 19

Operations

Power down the server

Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs.

IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the system.

To power down the server, use one of the following methods:

Press and release the Power On/Standby button.

This method initiates a controlled shutdown of applications and the OS before the server enters standby mode.

Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter standby mode.

This method forces the server to enter standby mode without properly exiting applications and the OS.

If an application stops responding, you can use this method to force a shutdown.

Use a virtual power button selection through iLO 4.

This method initiates a controlled remote shutdown of applications and the OS before the server enters standby mode.

Before proceeding, verify the server is in standby mode by observing that the system power LED is amber.

Power up the server

To power up the server:

1.

Connect each power cord to the server.

2.

3.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Remove the tower bezel

This server has a removable bezel that must be unlocked and opened before accessing the hard drives. The bezel must be kept closed during normal server operations.

Operations 20

1.

Using the key provided with the server, unlock the bezel with a clockwise turn.

2.

Remove the tower bezel.

Operations 21

Remove the security bezel

Unlock the security bezel, press the latch on the security bezel, and then remove the security bezel.

Install the security bezel

Install the security bezel into the chassis, and then lock the security bezel with the key.

Remove the rack bezel

1.

2.

If installed, remove the security bezel (on page 22 ).

Press the Power On/Standby button.

The server powers down and enters standby mode. The system power LED changes from green to amber. Power is still applied to the server.

Operations 22

4.

5.

6.

7.

3.

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

Loosen the thumbscrews.

Remove the rack bezel.

Install the rack bezel

1.

2.

Install the rack bezel.

Tighten the thumbscrews.

3.

Install the access panel (on page 24 ).

Operations 23

4.

Slide the server back into the rack.

Remove the access panel

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: Do not operate the server for long periods with the access panel open or removed.

Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

To remove the component:

1.

Do one of the following: o o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

For rack models, if installed, remove the security bezel (on page 22 ).

2.

3.

Power down the server (on page 20 ).

Remove all power: a.

Disconnect each power cord from the power source.

4.

5. b.

Disconnect each power cord from the server.

Do one of the following: o o

For tower models, place the server on a flat, level surface with the access panel facing up.

For rack models, extend the server from the rack (on page 25 ).

Open the locking latch, slide the access panel to the rear of the chassis, and then remove the access panel.

If the locking latch is locked, use a T-15 Torx screwdriver to unlock it.

Install the access panel

1.

2.

3.

4.

5.

6.

7.

8.

9.

10.

For rack models, install the rack bezel (on page 23 ).

Place the access panel on top of the server with the hood latch open. Allow the panel to extend past the rear of the server approximately 1.25 cm (0.5 in).

Push down on the hood latch. The access panel slides to a closed position.

Use the T-15 Torx screwdriver provided with the server to tighten the security screw on the hood latch.

For tower models, return the server to an upright position.

For rack models, slide the server back into the rack.

Connect each power cord to the server.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Do one of the following: o

For tower models, install the bezel.

Operations 24

o

For rack models, if removed, install the security bezel (on page 22 ).

Extend the server from the rack

IMPORTANT: If the server is installed in a telco rack, remove the server from the rack to access internal components.

1.

2.

Pull down the quick release levers on each side of the server.

Extend the server from the rack.

WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is adequately stabilized before extending a component from the rack.

WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release latches and sliding the server into the rack. The sliding rails could pinch your fingers.

3.

After performing the installation or maintenance procedure, slide the server back into the rack, and then press the server firmly into the rack to secure it in place.

WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release latches and sliding the server into the rack. The sliding rails could pinch your fingers.

Remove the air baffle

1.

2.

3.

Do one of the following: o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

o

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power: a. b.

Disconnect each power cord from the power source.

Disconnect each power cord from the server.

Operations 25

4.

5.

6.

Do one of the following: o

For tower models, place the server on a flat, level surface with the access panel facing up. o

For rack models, extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

Remove the air baffle (on page 25 ).

Remove the fan

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1.

Do one of the following:

2.

3. o o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

For rack models, if installed, remove the security bezel (on page

Power down the server (on page 20 ).

22 ).

Remove all power:

4.

5. a. b.

Disconnect each power cord from the power source.

Disconnect each power cord from the server.

Do one of the following: o o

For tower models, place the server on a flat, level surface with the access panel facing up.

For rack models, extend the server from the rack (on page 25 ).

o

Remove the access panel (on page 24 ).

Locate the fan to be removed (" Fans " on page 17 ).

Operations 26

6.

Remove the fan.

Remove the fan cage

IMPORTANT: When installing or replacing server components, one or more fans might need to be removed. To prevent an orderly or immediate server shutdown, HP highly recommends powering down the server during these procedures. To determine if powering down is required, see the specific procedure.

To remove the component:

1.

Do one of the following: o o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

For rack models, if installed, remove the security bezel (on page 22 ).

2.

3.

Power down the server (on page 20 ).

Remove all power: a.

Disconnect each power cord from the power source.

4.

5.

6. b.

Disconnect each power cord from the server.

Do one of the following: o o

For tower models, place the server on a flat, level surface with the access panel facing up.

For rack models, extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

Remove the air baffle (on page 25 ).

Operations 27

7.

Remove the fan cage (on page 27 ).

Remove the FBWC capacitor pack

CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the capacitor pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress.

CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module. The cache module is backing up data, and data is lost if the cable is detached.

To remove the component:

1.

Do one of the following: o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

2.

3.

4. o

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Do one of the following:

5.

6.

7.

8. o o

For tower models, place the server on a flat, level surface with the access panel facing up.

For rack models, extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

Remove the air baffle (on page 25 ).

Remove the fan cage (on page 27 ).

Disconnect the cable from the cache module only if the capacitor pack is not being used to recover data from the server or transfer data to another server.

Operations 28

9.

Remove the capacitor pack.

Remove the DVD drive

The server supports both DVD-ROM and DVD-RW drives.

1.

Do one of the following: o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

2.

3. o

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power: a.

Disconnect each power cord from the power source.

4.

5.

6.

7. b.

Disconnect each power cord from the server.

For tower models, do the following: a. b.

Place the server on a flat, level surface with the access panel facing up.

Remove the access panel (on page

For rack models, do the following:

24 ).

a.

Extend the server from the rack (on page 25 ).

b. c.

Remove the access panel (on page 24 ).

Release thumbscrews and remove the rack bezel ("

Remove the fan cage (on page 27 ).

Remove the rack bezel " on page 22 ).

Disconnect and remove the DVD-ROM drive power and data cables.

Operations 29

8.

Remove the DVD-ROM drive.

Remove the component drive cage blank

1.

2.

Do one of the following: o o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

For rack models, do the following: a. b.

If installed, remove the security bezel (on page 22 ).

Remove the access panel. (" Remove the access panel " on page 24 )

c.

Release thumbscrews and remove the rack bezel. (" Remove the rack bezel " on page 22 )

Remove the component drive cage blank.

WARNING: To reduce the risk of personal injury from an electrical hazard, do not remove more than one drive cage at a time.

Operations 30

Setup

Optional installation services

Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate both hardware and software support into a single package. A number of service level options are available to meet your needs.

HP Care Pack Services offer upgraded service levels to expand your standard product warranty with easy-to-buy, easy-to-use support packages that help you make the most of your server investments. Some of the Care Pack services are:

Hardware support o

6-Hour Call-to-Repair o o

4-Hour 24x7 Same Day

4-Hour Same Business Day

Software support o

Microsoft® o o o

Linux

HP ProLiant Essentials (HP SIM and RDP)

VMWare

Integrated hardware and software support o

Critical Service o o o

Proactive 24

Support Plus

Support Plus 24

Startup and implementation services for both hardware and software

For more information on HP Care Pack Services, see the HP website

( http://www.hp.com/services/carepack ).

Rack planning resources

The rack resource kit ships with all HP branded or Compaq branded 9000, 10000, and H9 series racks. For more information on the content of each resource, see the rack resource kit documentation.

Optimum environment

When installing the server, select a location that meets the environmental standards described in this section.

Setup 31

Space and airflow requirements

Tower server

In a tower configuration, leave at least a 7.6-cm (3-in) clearance space at the front and back of the server for proper ventilation.

Rack server

To allow for servicing and adequate airflow, observe the following space and airflow requirements when deciding where to install a rack:

Leave a minimum clearance of 63.5 cm (25 in) in front of the rack.

Leave a minimum clearance of 76.2 cm (30 in) behind the rack.

Leave a minimum clearance of 121.9 cm (48 in) from the back of the rack to the back of another rack or row of racks.

HP servers draw in cool air through the front door and expel warm air through the rear door. Therefore, the front and rear rack doors must be adequately ventilated to allow ambient room air to enter the cabinet, and the rear door must be adequately ventilated to allow the warm air to escape from the cabinet.

CAUTION: To prevent improper cooling and damage to the equipment, do not block the ventilation openings.

When vertical space in the rack is not filled by a server or rack component, the gaps between the components cause changes in airflow through the rack and across the servers. Cover all gaps with blanking panels to maintain proper airflow.

CAUTION: Always use blanking panels to fill empty vertical spaces in the rack. This arrangement ensures proper airflow. Using a rack without blanking panels results in improper cooling that can lead to thermal damage.

The 9000 and 10000 Series Racks provide proper server cooling from flow-through perforations in the front and rear doors that provide 64 percent open area for ventilation.

CAUTION: When using a Compaq branded 7000 series rack, install the high airflow rack door insert (PN 327281-B21 for 42U rack, PN 157847-B21 for 22U rack) to provide proper front-to-back airflow and cooling.

CAUTION: If a third-party rack is used, observe the following additional requirements to ensure adequate airflow and to prevent damage to the equipment:

Front and rear doors—If the 42U rack includes closing front and rear doors, you must allow

5,350 sq cm (830 sq in) of holes evenly distributed from top to bottom to permit adequate airflow (equivalent to the required 64 percent open area for ventilation).

Side—The clearance between the installed rack component and the side panels of the rack must be a minimum of 7 cm (2.75 in).

Temperature requirements

To ensure continued safe and reliable equipment operation, install or position the system in a well-ventilated, climate-controlled environment.

The maximum recommended ambient operating temperature (TMRA) for most server products is 35°C

(95°F). The temperature in the room where the rack is located must not exceed 35°C (95°F).

Setup 32

CAUTION: To reduce the risk of damage to the equipment when installing third-party options:

Do not permit optional equipment to impede airflow around the server or to increase the internal rack temperature beyond the maximum allowable limits.

• Do not exceed the manufacturer’s TMRA.

Power requirements

Installation of this equipment must comply with local and regional electrical regulations governing the installation of information technology equipment by licensed electricians. This equipment is designed to operate in installations covered by NFPA 70, 1999 Edition (National Electric Code) and NFPA-75, 1992

(code for Protection of Electronic Computer/Data Processing Equipment). For electrical power ratings on options, refer to the product rating label or the user documentation supplied with that option.

WARNING: To reduce the risk of personal injury, fire, or damage to the equipment, do not overload the AC supply branch circuit that provides power to the rack. Consult the electrical authority having jurisdiction over wiring and installation requirements of your facility.

CAUTION: Protect the server from power fluctuations and temporary interruptions with a regulating uninterruptible power supply (UPS). This device protects the hardware from damage caused by power surges and voltage spikes and keeps the system in operation during a power failure.

When installing more than one server, you may need to use additional power distribution devices to safely provide power to all devices. Observe the following guidelines:

Balance the server power load between available AC supply branch circuits.

Do not allow the overall system AC current load to exceed 80 percent of the branch circuit AC current rating.

Do not use common power outlet strips for this equipment.

Provide a separate electrical circuit for the server.

Electrical grounding requirements

The server must be grounded properly for proper operation and safety. In the United States, you must install the equipment in accordance with NFPA 70, 1999 Edition (National Electric Code), Article 250, as well as any local and regional building codes. In Canada, you must install the equipment in accordance with

Canadian Standards Association, CSA C22.1, Canadian Electrical Code. In all other countries, you must install the equipment in accordance with any regional or national electrical wiring codes, such as the

International Electrotechnical Commission (IEC) Code 364, parts 1 through 7. Furthermore, you must be sure that all power distribution devices used in the installation, such as branch wiring and receptacles, are listed or certified grounding-type devices.

Because of the high ground-leakage currents associated with multiple servers connected to the same power source, HP recommends the use of a PDU that is either permanently wired to the building’s branch circuit or includes a nondetachable cord that is wired to an industrial-style plug. NEMA locking-style plugs or those complying with IEC 60309 are considered suitable for this purpose. Using common power outlet strips for the server is not recommended.

Setup 33

Rack warnings

WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:

The leveling jacks are extended to the floor.

• The full weight of the rack rests on the leveling jacks.

• The stabilizing feet are attached to the rack if it is a single-rack installation.

The racks are coupled together in multiple-rack installations.

Only one component is extended at a time. A rack may become unstable if more than one component is extended for any reason.

WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack:

At least two people are needed to safely unload the rack from the pallet. An empty 42U rack can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might become unstable when being moved on its casters.

• Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle the rack from both sides.

WARNING: When installing a server in a telco rack, be sure that the rack frame is adequately secured to the top and bottom of the building structure.

Server warnings and cautions

WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the equipment:

• Observe local occupational health and safety requirements and guidelines for manual material handling.

Get help to lift and stabilize the product during installation or removal, especially when the product is not fastened to the rails. When the server weighs more than 22.5 kg (50 lb), at least two people must lift the server into the rack together. A third person may be required to help align the server if the server is installed higher than chest level.

Use caution when installing the server in or removing the server from the rack; it is unstable when not fastened to the rails.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.

CAUTION: Protect the server from power fluctuations and temporary interruptions with a regulating uninterruptible power supply (UPS). This device protects the hardware from damage caused by power surges and voltage spikes and keeps the system in operation during a power failure.

Setup 34

CAUTION: Do not operate the server for long periods with the access panel open or removed.

Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

Identifying tower server shipping carton contents

Unpack the server shipping carton and locate the materials and documentation necessary for installing the server.

The contents of the server shipping carton include:

Server

Power cord

Keyboard

Mouse

Tower feet

Hardware documentation, Documentation CD, and software products

In addition to the supplied items, you may need:

Hardware options

Operating system or application software

PDU

Installing hardware options

Install any hardware options before initializing the server. For options installation information, refer to the

option documentation. For server-specific information, refer to "Hardware options installation (on page 39 )."

Setting up a tower server

Follow the steps in this section to set up a tower model server. If you are going to install the server into a rack,

see the rack installation section (" Installing the server into the rack " on page 36 ).

Setup 35

1.

Lay the server on the side, and then install the feet.

2.

3.

4.

5.

Return the server to an upright position.

Connect peripheral devices to the server (" Rear panel components " on page 9 ).

WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into RJ-45 connectors.

Connect the power cord to the rear of the server.

Connect the power cord to the AC power source.

WARNING: To reduce the risk of electric shock or damage to the equipment:

Do not disable the power cord grounding plug. The grounding plug is an important safety feature.

• Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times.

Unplug the power cord from the power supply to disconnect power to the equipment.

• Do not route the power cord where it can be walked on or pinched by items placed against it.

Pay particular attention to the plug, electrical outlet, and the point where the cord extends from the server.

Installing the server into the rack

To install the server into a rack with square, round, or threaded holes, refer to the instructions that ship with the rack hardware kit.

If you are installing the server into a telco rack, order the appropriate option kit at the RackSolutions.com website ( http://www.racksolutions.com/hp ). Follow the server-specific instructions on the website to install the rack brackets.

CAUTION: Always plan the rack installation so that the heaviest item is on the bottom of the rack.

Install the heaviest item first, and continue to populate the rack from the bottom to the top.

Setup 36

1.

2.

WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the equipment:

Observe local occupational health and safety requirements and guidelines for manual material handling.

Get help to lift and stabilize the product during installation or removal, especially when the product is not fastened to the rails. When the server weighs more than 22.5 kg (50 lb), at least two people must lift the server into the rack together. A third person may be required to help align the server if the server is installed higher than chest level.

Use caution when installing the server in or removing the server from the rack; it is unstable when not fastened to the rails.

Install the server and cable management arm into the rack. For more information, refer to the installation instructions that ship with the 3-7U Quick Deploy Rail System (rack installation only).

Connect peripheral devices to the server (" Rear panel components " on page 9 ).

Powering up and configuring the server

To power up the server:

1.

Connect each power cord to the server.

2.

3.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

While the server boots, ORCA utility and the RBSU are automatically configured to prepare the server for operating system installation.

To configure these utilities manually:

To configure the array controller using ORCA, press the F8 key when prompted during the array controller initialization.

To change the server settings using RBSU, press the F9 key when prompted during the boot process. The system is set up by default for the English language.

For more information on the automatic configuration, see the HP ROM-Based Setup Utility User Guide located on the Documentation CD.

Installing the operating system

This ProLiant server does not ship with provisioning media. All components needed to manage and install the system software and firmware is preloaded on the server.

To operate properly, the server must have a supported operating system. For the latest information on operating system support, see the HP website ( http://www.hp.com/go/supportos ).

To install an operating system on the server, use one of the following methods:

Intelligent Provisioning—The iLO Management Engine is a new feature on ProLiant servers that contains

Intelligent Provisioning for embedded deployment, updating, and provisioning capabilities. Intelligent

Provisioning can configure the server and install an operating system, eliminating the need for

SmartStart CDs and Smart Update Firmware DVDs.

Setup 37

To install an operating system on the server with Intelligent Provisioning (local or remote): a.

Connect the Ethernet cable, and then power on the server. b. c. d.

During server POST, press the F10 key.

Complete the initial Preferences and Registration portion of Intelligent Provisioning (on page 88 ).

At the 1 Start screen, click the Configure and Install button. e.

To finish the installation, follow the on-screen prompts. An Internet connection is required to update the firmware and systems software.

Remote deployment installation—To remotely deploy an operating system, use Insight Control server deployment for an automated solution.

For additional system software and firmware updates, download the HP Service Pack for ProLiant from the HP website ( http://www.hp.com/go/spp/download ). Software and firmware must be updated before using the server for the first time, unless any installed software or components require an older version. For more

information, see Keeping the system current (on page 96 ).

The Smart Update Firmware DVD ISO is also available at the download tab on the HP website

( http://www.hp.com/go/foundation ).

For more information on using these installation methods, see the HP website ( http://www.hp.com/go/ilo ).

Registering the server

To register the server, refer to the HP Registration website ( http://register.hp.com

).

Setup 38

Hardware options installation

Introduction

If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure. Improper grounding can cause electrostatic discharge.

Second processor option

The server supports single-processor and dual-processor operation.

When processor 2 is installed, install fan 1 and the PCI air baffles.

CAUTION: To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this server.

CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number.

IMPORTANT: If installing a processor with a faster speed, update the system ROM before installing the processor.

To install a processor:

1.

Do one of the following:

2.

3. o o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power:

4.

5.

6. a. b.

Disconnect each power cord from the power source.

Disconnect each power cord from the server.

Do one of the following: o

For tower models, place the server on a flat, level surface with the access panel facing up. o

For rack models, extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

Remove the air baffle (on page 25 ).

Hardware options installation 39

7.

Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.

8.

Remove the clear processor socket cover. Retain the processor socket cover for future use.

Hardware options installation 40

9.

Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE

SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.

CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts.

10.

Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket.

CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket.

11.

Press and hold the processor retaining bracket in place, and then close each processor locking lever.

Press only in the area indicated on the processor retaining bracket.

CAUTION: Close and hold down the processor cover socket while closing the processor locking levers. The levers should close without resistance. Forcing the levers closed can damage the processor and socket, requiring system board replacement.

Hardware options installation 41

12.

Open the heatsink retaining levers.

CAUTION: The pins on the processor socket are very fragile. Any damage to them may require replacing the system board.

CAUTION: Failure to completely open the processor locking lever prevents the processor from seating during installation, leading to hardware damage.

13.

Remove the heatsink cover.

CAUTION: After the cover is removed, do not touch the thermal interface media.

Hardware options installation 42

14.

Install the heatsink, and then close the heatsink retaining levers.

15.

16.

Install the air baffle.

Remove the fan blank.

Hardware options installation 43

17.

Install the fan, making sure that the fan clicks into place.

18.

Install the PCIe air baffles.

19.

20.

21.

22.

23.

24.

Install the access panel (on page 24 ).

Do one of the following: o

For tower models, return the server to an upright position. o

For rack models, slide the server back into the rack.

Connect each power cord to the server.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Do one of the following: o

For tower models, install the bezel.

Hardware options installation 44

o

For rack models, if removed, install the security bezel (on page 22 ).

Memory options

IMPORTANT: This server does not support mixing LRDIMMs, RDIMMs, or UDIMMs. Attempting to mix any combination of these DIMMs can cause the server to halt during BIOS initialization.

The memory subsystem in this server can support LRDIMMs, RDIMMs, or UDIMMs:

UDIMMs represent the most basic type of memory module and offer lower latency in one DIMM per channel configurations and (relatively) low power consumption, but are limited in capacity.

RDIMMs offer larger capacities than UDIMMs and include address parity protection.

LRDIMMs support higher densities than single- and dual-rank RDIMMs, and higher speeds than quad-rank RDIMMs. This support enables you to install more high capacity DIMMs, resulting in higher system capacities and higher bandwidth.

All types are referred to as DIMMs when the information applies to all types. When specified as LRDIMM,

RDIMM, or UDIMM, the information applies to that type only. All memory installed in the server must be the same type.

The server supports the following DIMM speeds:

Single- and dual-rank PC3-10600 (DDR-1333) RDIMMs operating at up to 1333 MT/s

Single- and dual-rank PC3-12800 (DDR-1600) RDIMMs operating at up to 1600 MT/s

Single- and dual-rank PC3-10600 (DDR-1333) UDIMMs operating at up to 1333 MT/s

Quad-rank PC3L-10600 (DDR3-1333) LRDIMMs, operating as dual-rank DIMMs, at up to 1333 MT/s

Speed, voltage, and capacity

DIMM type DIMM rank

RDIMM

RDIMM

RDIMM

LRDIMM

UDIMM

Dual-rank

Single-rank

Dual-rank

Quad-rank

Dual-rank

DIMM capacity

8GB

8GB

16GB

32GB

8GB

Native speed (MT/s) Voltage

1333

1600

1333

1333

1333

LV

STD

LV

LV

LV

Depending on the processor model, the number of DIMMs installed, and whether LRDIMMs, UDIMMs, or

RDIMMs are installed, the memory clock speed can be reduced to 1333 or 1066 MT/s. Clock speed can also be reduced when using low voltage DIMMs.

Populated DIMM speed (MT/s)

DIMM type DIMM rank 1 DIMM per channel

RDIMM

RDIMM

RDIMM

LRDIMM

— 1.35V

Dual-rank (8GB) 1333

Single-rank (8GB) 1333

Dual-rank (16GB) 1333

Quad-rank

(32GB)

1333**

1.5V

1600

1600

1600

1333

2 DIMMs per channel

1.35V

1333

1333

1333

1333**

1.5V

1600

1600

1600

1333

3 DIMMs per channel

1.35V

1066*

1066

1066*

1066

1.5V

1066

1066

1066

1066

Hardware options installation 45

DIMM type DIMM rank

1 DIMM per channel

2 DIMMs per channel

3 DIMMs per channel

UDIMM

Dual-rank (8GB) 1333 1600 1333† 1600 — —

* RDIMM supports 1.35V 3DPC at 1066. Third-party memory supports 1.5V 3DPC at 1066.

** LRDIMM enables 3 DIMMs per channel. HP SmartMemory supports up to 3DPC at 1066 at 1.35V. Third-party memory supports 1.5V only.

† UDIMM is supported at 2DPC at 1333 using HP SmartMemory only. Third-party memory supports up to 2DPC at 1066.

HP SmartMemory

HP SmartMemory, introduced for Gen8 servers, authenticates and unlocks certain features available only on

HP Qualified memory and verifies whether installed memory has passed HP qualification and test processes.

Qualified memory is performance-tuned for HP ProLiant and BladeSystem servers and provides future enhanced support through HP Active Health and manageability software.

Certain performance features are unique with HP SmartMemory. HP SmartMemory 1.35V DDR3-1333

Registered memory is engineered to achieve the same performance level as 1.5V memory. For example, while the industry supports DDR3-1333 RDIMM at 1.5V, this Gen8 server supports DDR3-1333 RDIMM up to 3 DIMMs per channel at 1066 MT/s running at 1.35V. This equates to up to 20% less power at the DIMM level with no performance penalty. In addition, the industry supports UDIMM at 2 DIMMs per channel at

1066 MT/s. HP SmartMemory supports 2 DIMMs per channel at 1333 MT/s, or 25% greater bandwidth.

Memory subsystem architecture

The memory subsystem in this server is divided into channels. Each processor supports four channels, and each channel supports three DIMM slots.

Memory subsystem channel

Population order Slot number (Processor

2)

Slot number (Processor

1)

1

2

B

F

J

A

E

I

9

8

7

12

11

10

4

5

6

1

2

3

3

4

D

H

L

C

G

K

4

5

6

1

2

3

For the location of the slot numbers, see "DIMM slots (on page 13 )."

9

8

7

12

11

10

This multi-channel architecture provides enhanced performance in Advanced ECC mode. This architecture also enables Lockstep and Online Spare Memory modes.

DIMM slots in this server are identified by number and by letter. Letters identify the population order. Slot numbers indicate the DIMM slot ID for spare replacement.

Hardware options installation 46

Single-, dual-, and quad-rank DIMMs

To understand and configure memory protection modes properly, an understanding of single-, dual-, and quad-rank DIMMs is helpful. Some DIMM configuration requirements are based on these classifications.

A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from the memory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module, with only one rank accessible at a time. A quad-rank DIMM is, effectively, two dual-rank DIMMs on the same module. Only one rank is accessible at a time. The server memory control subsystem selects the proper rank within the

DIMM when writing to or reading from the DIMM.

Dual- and quad-rank DIMMs provide the greatest capacity with the existing memory technology. For example, if current DRAM technology supports 8-GB single-rank DIMMs, a dual-rank DIMM would be 16

GB, and a quad-rank DIMM would be 32 GB.

LRDIMMs are labeled as quad-rank DIMMs; however, they function more like dual-rank DIMMs. There are four ranks of DRAM on the DIMM, but the LRDIMM buffer creates an abstraction that allows the DIMM to appear as a dual-rank DIMM to the system. The LRDIMM buffer also isolates the electrical loading of the

DRAM from the system to allow for faster operation. These two changes allow the system to support up to three LRDIMMs per memory channel, providing for up to 50% greater memory capacity and higher memory operating speed compared to quad-rank RDIMMs.

DIMM identification

To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and table.

1

2

Item Aspect

Size

Rank

3

Data width

Definition

1R = Single rank

2R = Dual rank

4R = Quad rank x4 = 4 bit x8 = 8 bit

Hardware options installation 47

Item Aspect

4

5

6

Voltage rating

Memory speed

DIMM type

Definition

L = Low voltage (1.35 V)

U = Ultra low voltage (1.25 V)

Blank or omitted = Standard

12800 = 1600 MT/s

10600 = 1333 MT/s

8500 = 1066 MT/s

R = RDIMM (registered)

E = UDIMM (unbuffered with ECC)

L = LRDIMM (load reduced)

For the latest supported memory information, see the QuickSpecs on the HP website ( http://www.hp.com

).

Memory configurations

To optimize server availability, the server supports the following AMP modes:

Advanced ECC—provides up to 4-bit error correction and enhanced performance over Lockstep mode.

This mode is the default option for this server.

Online spare memory—provides protection against failing or degraded DIMMs. Certain memory is reserved as spare, and automatic failover to spare memory occurs when the system detects a DIMM that is degrading. This allows DIMMs that have a higher probability of receiving an uncorrectable memory error (which would result in system downtime) to be removed from operation.

Advanced Memory Protection options are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM configuration, the server boots in Advanced ECC mode. For more information, see

"HP ROM-Based Setup Utility (on page 91 )."

The server also can operate in independent channel mode or combined channel mode (lockstep). When running in lockstep mode, you gain reliability in one of two ways:

If running with UDIMMs (built with x8 DRAM devices), the system can survive a complete DRAM failure

(SDDC). In independent channel mode, this failure would be an uncorrectable error.

If running with RDIMM (built with x4 DRAM devices), the system can survive the complete failure of two

DRAM devices (DDDC). Running in independent mode, the server can only survive the complete failure of a single DRAM device (SDDC).

Maximum capacity

DIMM type

RDIMM

RDIMM

LRDIMM

UDIMM

UDIMM

DIMM rank

Single-rank

Dual-rank

Quad-rank

Single-rank

Dual-rank

One processor

96 GB

192 GB

384 GB

16 GB

64 GB

Two processors

192 GB

384 GB

768 GB

32 GB

128 GB

For the latest memory configuration information, see the QuickSpecs on the HP website

( http://www.hp.com

).

Hardware options installation 48

Advanced ECC

Advanced ECC memory is the default memory protection mode for the server. Standard ECC can correct single-bit memory errors and detect multibit memory errors. When multibit errors are detected using Standard

ECC, the error is signaled to the server and causes the server to halt.

Advanced ECC protects the server against some multibit memory errors. Advanced ECC can correct both single-bit memory errors and 4-bit memory errors if all failed bits are on the same DRAM device on the DIMM.

Advanced ECC provides additional protection over Standard ECC because it is possible to correct certain memory errors that would otherwise be uncorrected and result in a server failure. Using HP Advanced

Memory Error Detection technology, the server provides notification when a DIMM is degrading and has a higher probability of uncorrectable memory error.

Online Spare memory configuration

Online spare memory provides protection against degraded DIMMs by reducing the likelihood of uncorrected memory errors. This protection is available without any operating system support.

Online spare memory protection dedicates one rank of each memory channel for use as spare memory. The remaining ranks are available for OS and application use. If correctable memory errors occur at a rate higher than a specific threshold on any of the non-spare ranks, the server automatically copies the memory contents of the degraded rank to the online spare rank. The server then deactivates the failing rank and automatically switches over to the online spare rank.

Lockstep memory configuration

Lockstep mode provides protection against multi-bit memory errors that occur on the same DRAM device.

Lockstep mode can correct any single DRAM device failure on x4 and x8 DIMM types. The DIMMs in each channel must have identical HP part numbers.

General DIMM slot population guidelines

Observe the following guidelines for all AMP modes:

Install DIMMs only if the corresponding processor is installed.

When two processors are installed, balance the DIMMs across the two processors.

White DIMM slots denote the first slot of a channel (Ch 1-A, Ch 2-B, Ch 3-C, Ch 4-D).

Do not mix LRDIMMs, UDIMMs, or RDIMMs.

Do not install more than two UDIMMs per channel. UDIMMs should not be installed in slots Ch 1-I, Ch

2-J, Ch 3-K, or Ch 4-L.

When two processors are installed, install the DIMMs in sequential alphabetical order balanced between the two processors: P1-A, P2-A, P1-B, P2-B, P1-C, P2-C, and so on.

For detailed memory configuration rules and guidelines, use the Online DDR3 Memory Configuration Tool on the HP website ( http://www.hp.com/go/ddr3memory-configurator ).

DIMM speeds are supported as indicated in the following table.

Populated slots

(per channel)

Rank Speeds supported (MT/s)

1

Single- or dual-rank 1333, 1600

Hardware options installation 49

Populated slots

(per channel)

1

2

3

Rank

Quad-rank

Single- or dual-rank

Single- or dual-rank

Speeds supported (MT/s)

1333

1333

1066

Advanced ECC population guidelines

For Advanced ECC mode configurations, observe the following guidelines:

Observe the general DIMM slot population guidelines (on page 49 ).

DIMMs may be installed individually.

Online spare population

For online spare memory mode configurations, observe the following guidelines:

Observe the general DIMM slot population guidelines (on page 49 ).

Each channel must have a valid online spare configuration.

Each channel can have a different valid online spare configuration.

Each populated channel must have a spare rank: o

A single dual-rank DIMM is not a valid configuration. o

LRDIMMs are treated as dual-rank DIMMs.

Lockstep Memory population guidelines

For Lockstep memory mode configurations, observe the following guidelines:

Observe the general DIMM slot population guidelines (on page 49 ).

DIMM configuration on all channels of a processor must be identical.

In multi-processor configurations, each processor must have a valid Lockstep Memory configuration.

In multi-processor configurations, each processor might have a different valid Lockstep Memory configuration.

Population order

For memory configurations with a single processor or multiple processors, populate the DIMM slots in the following order:

LRDIMM: Sequentially in alphabetical order (A through L)

RDIMM: Sequentially in alphabetical order (A through L)

UDIMM: A through H, sequentially in alphabetical order. Do not populate DIMM slots I through L.

After installing the DIMMs, use RBSU to configure Advanced ECC, online spare, or lockstep memory support.

Installing a DIMM

Hardware options installation 50

1.

2.

3.

4.

5.

6.

7.

8.

CAUTION: To avoid damage to the hard drives, memory, and other system components, the air baffle, drive blanks, and access panel must be installed when the server is powered up.

Do one of the following: o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

o

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power: a. b.

Disconnect each power cord from the power source.

Disconnect each power cord from the server.

Do one of the following: o

For tower models, place the server on a flat, level surface with the access panel facing up. o

For rack models, extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

Remove the air baffle (on page 25 ).

Open the DIMM slot latches.

Install the DIMM.

If you are installing DIMMs in lock-step configuration, configure this mode in RBSU (" HP ROM-Based Setup

Utility " on page 91 ).

For more information about LEDs and troubleshooting failed DIMMs, see Systems Insight Display LED

combinations (on page 14 ).

Optical drive cage option

1.

2.

Do one of the following: o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

o

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Hardware options installation 51

3.

4.

5.

6.

Remove all power: a.

Disconnect each power cord from the power source. b. b.

Disconnect each power cord from the server.

For tower models, do the following: a.

Place the server on a flat, level surface with the access panel facing up.

Remove the access panel (on page 24 ).

For rack models, do the following: a.

Extend the server from the rack (on page 25 ).

b. c.

Remove the access panel (on page 24 ).

Release thumbscrews and remove the rack bezel (" Remove the rack bezel " on page 22 ).

Remove the blank from box 3.

7.

Install the optical drive cage.

Hardware options installation 52

8.

Using the T-15 screws, secure the optical drive cage.

9.

The Torx screws required to install optical drives are located on the chassis.

10.

11.

12.

13.

14.

For tower models, do the following: a. b.

Install the access panel (on page 24 ).

Return the server to an upright position.

For rack models, do the following: a. b.

Install the rack bezel (on page 23 ).

Install the access panel (on page 24 ).

c.

Slide the server back into the rack.

Connect each power cord to the server.

Connect each power cord to the power source.

Press the Power On/Standby button.

Hardware options installation 53

15.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Do one of the following: o o

For tower models, install the bezel.

For rack models, if removed, install the security bezel (on page 22 ).

DVD option

The server supports both DVD-ROM and DVD-RW drives.

1.

Do one of the following:

2.

3. o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

o

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power: a.

Disconnect each power cord from the power source.

4.

5.

6. b.

Disconnect each power cord from the server.

For tower models, do the following: a.

Place the server on a flat, level surface with the access panel facing up. b.

Remove the access panel (on page 24 ).

For rack models, do the following: a. b.

Extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

c.

Release thumbscrews and remove the rack bezel (" Remove the rack bezel " on page 22 ).

Remove the blank from the drive cage.

Hardware options installation 54

7.

Install a DVD-ROM or DVD-RW drive into the drive cage.

8.

9.

10.

11.

Remove the air baffle (on page 25 ).

Remove the fan cage (on page 27 ).

Connect the power cable from the drive to the system board.

Connect the SATA cable from the drive to the system board.

12.

13.

14.

15.

Install the fan cage.

Install the air baffle.

For tower models, do the following: a. b.

Install the access panel (on page 24 ).

Return the server to an upright position.

For rack models, do the following: a.

Install the rack bezel (on page 23 ).

b.

Install the access panel (on page 24 ).

Hardware options installation 55

16.

17.

18.

19. c.

Slide the server back into the rack.

Connect each power cord to the server.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Do one of the following: o

For tower models, install the bezel. o

For rack models, if removed, install the security bezel (on page 22 ).

Redundant AC power supply option

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To install the component:

1.

Access the product rear panel.

2.

Remove the blank.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply blank to cool before touching it.

Hardware options installation 56

3.

Insert the power supply into the power supply bay until it clicks into place.

4.

5.

6.

7.

Connect the power cord to the power supply.

Route the power cord. Use best practices when routing power cords and other cables.

For rack models, a cable management arm is available to help with routing. To obtain a cable management arm, contact an HP authorized reseller.

Connect the power cord to the AC power source.

Be sure that the power supply LED is green.

Hot-plug SAS drive options

When adding drives to the server, observe the following general guidelines:

The system automatically sets all device numbers.

If only one drive is used, install it in the bay with the lowest device number (" SAS and SATA device numbers " on page 15 ).

Drives should be the same capacity to provide the greatest storage space efficiency when drives are grouped together into the same drive array.

Removing the drive blank

1.

Do one of the following: o o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

For rack models, if installed, remove the security bezel (on page 22 ).

Hardware options installation 57

2.

Remove the drive blank.

Installing a hot-plug drive

The server can support six drives in a LFF configuration, or eight drives in a SFF configuration.

To install the component:

1.

Do one of the following:

2. o o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

For rack models, if installed, remove the security bezel (on page

Remove the drive blank.

22 ).

3.

Prepare the drive.

Hardware options installation 58

4.

Install the drive.

5.

6.

Determine the status of the drive from the drive LED definitions (on page 16 ).

Do one of the following: o

For tower models, install the bezel. o

For rack models, if removed, install the security bezel (on page 22 ).

Expansion board option

1.

2.

3.

4.

5.

6.

Do one of the following: o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

o

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Do one of the following: o o

For tower models, place the server on a flat, level surface with the access panel facing up.

For rack models, extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

Remove the air baffle (on page 25 ).

Hardware options installation 59

7.

Open the PCIe retainer latch.

8.

Do one of the following: a.

If you are installing a single-width expansion card, remove one PCIe blank. b.

If you are installing a double-width expansion card, remove two PCIe blanks.

Hardware options installation 60

9.

Install the expansion board.

10.

Close the PCIe retainer latch.

11.

12.

13.

14.

15.

16.

17.

Install the air baffle.

Install the access panel (on page 24 ).

Do one of the following: o

For tower models, return the server to an upright position. o

For rack models, slide the server back into the rack.

Connect each power cord to the server.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Do one of the following:

Hardware options installation 61

o o

For tower models, install the bezel.

For rack models, if removed, install the security bezel (on page 22 ).

Graphic card option

The server supports up to three graphic card options. The server supports up to two double-wide graphic cards.

For optimal performance, HP recommends that you install graphic card options in PCI slots 3, 6, or 8.

HP recommends the following:

If the graphic card is populated in PCI slot 3, do not use PCI slot 2.

If a single-wide graphic card is populated in PCI slot 8, do not use PCI slot 9.

In a single-processor configuration, HP recommends installing the graphic card in PCI slot 3.

In a two-processor configuration, HP recommends installing the graphic card in PCI slot 6.

If a third graphic card is installed, HP recommends installing the third graphic card in PCI slot 8.

Installing a graphic card adapter option

1.

Do one of the following:

2.

3.

4.

5.

6.

7.

8. o o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Do one of the following: o o

For tower models, place the server on a flat, level surface with the access panel facing up.

For rack models, extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

Remove the air baffle (on page 25 ).

Remove the fan cage (on page 27 ).

Select the appropriate PCIe slot to install the graphic card adapter.

Hardware options installation 62

9.

Open the PCIe retainer latch.

10.

Do one of the following: o

If you are installing a single-width graphic card adapter, remove one PCIe blank. o

If you are installing a double-width graphic card adapter, remove two PCIe blanks.

Hardware options installation 63

11.

Install the graphic adapter in a x16 PCIe expansion slot.

12.

Connect the graphic card adapter cable to the appropriate graphic card connector.

NOTE: For more information about installing a graphic card, see the documentation that ships with the graphic card option kit.

Hardware options installation 64

13.

Close the PCIe retainer latch.

NOTE: Install the graphic card bracket only if you have installed a double-width graphic card.

14.

Install the graphic card bracket, and then tighten the screws.

15.

16.

17.

18.

19.

20.

Install the fan cage.

Install the air baffle.

Install the access panel (on page 24 ).

Do one of the following: o

For tower models, return the server to an upright position. o

For rack models, slide the server back into the rack.

Connect each power cord to the server.

Connect each power cord to the power source.

Hardware options installation 65

21.

22.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Do one of the following: o

For tower models, install the bezel. o

For rack models, if removed, install the security bezel (on page 22 ).

Controller option

The server ships with an embedded Smart Array P420i Controller. For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant Servers User Guide on the HP website

( http://bizsupport2.austin.hp.com/bc/docs/support/SupportManual/c01608507/c01608507.pdf

). To configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP website

( http://bizsupport1.austin.hp.com/bc/docs/support/SupportManual/c00729544/c00729544.pdf

).

Upgrade options exist for the integrated array controller. For a list of supported options, see the QuickSpecs on the HP website ( http://www.hp.com/support ).

The server supports FBWC option:

FBWC consists of a cache module and a capacitor pack. The DDR cache module buffers and stores data being written by the controller. When the system is powered on, the capacitor pack charges fully in about 5 minutes. In the event of a system power failure, a fully charged capacitor pack provides power for up to 80 seconds. During that interval, the controller transfers the cached data from DDR memory to flash memory, where the data remains indefinitely or until a controller retrieves the data.

CAUTION: The cache module connector does not use the industry standard DDR3 mini DIMM pinout. Do not use this controller with cache modules designed for other controller models, because the controller can malfunction and you can lose data. Also, do not transfer this cache module to an unsupported controller model, because you can lose data.

CAUTION: To prevent a server malfunction or damage to the equipment, do not add or remove the capacitor pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress.

CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module. The cache module is backing up data, and data is lost if the cable is detached.

IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST error message is displayed when the server is powered up, indicating that the battery pack is temporarily disabled. No action is necessary on your part. The internal circuitry automatically recharges the batteries and enables the battery pack. This process might take up to four hours.

During this time, the cache module functions properly, but without the performance advantage of the battery pack.

NOTE: The data protection and the time limit also apply if a power outage occurs. When power is restored to the system, an initialization process writes the preserved data to the hard drives.

Hardware options installation 66

Installing FBWC capacitor pack

CAUTION: The cache module connector does not use the industry standard DDR3 mini DIMM pinout. Do not use this controller with cache modules designed for other controller models, because the controller can malfunction and you can lose data. Also, do not transfer this cache module to an unsupported controller model, because you can lose data.

To install the component:

1.

Do one of the following: o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

2.

3.

4. o

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Do one of the following:

5.

6.

7.

8.

9.

10. o o

For tower models, place the server on a flat, level surface with the access panel facing up.

For rack models, extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

Remove the air baffle (on page 25 ).

Remove the fan cage. (" Remove the fan cage " on page 27 )

Install the cache module (" Redundant fans option " on page 69 , "

Installing the cache module " on page

68 ).

If the storage controller is not already installed, then install the storage controller.

Install the capacitor pack.

11.

12.

13.

Install the fan cage.

Install the air baffle.

Install the access panel (on page 24 ).

Hardware options installation 67

14.

15.

16.

17.

18.

Do one of the following: o

For tower models, return the server to an upright position. o

For rack models, slide the server back into the rack.

Connect each power cord to the server.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Do one of the following: o

For tower models, install the bezel. o

For rack models, if removed, install the security bezel (on page 22 ).

Installing the cache module

CAUTION: The cache module connector does not use the industry standard DDR3 mini DIMM pinout. Do not use this controller with cache modules designed for other controller models, because the controller can malfunction and you can lose data. Also, do not transfer this cache module to an unsupported controller model, because you can lose data.

To install the component:

1.

Do one of the following: o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

2.

3.

4. o

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Do one of the following:

5.

6. o o

For tower models, place the server on a flat, level surface with the access panel facing up.

For rack models, extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

Remove the air baffle (on page 25 ).

Hardware options installation 68

7.

Install the cache module.

8.

9.

10.

11.

12.

13.

14.

Install the air baffle.

Install the access panel (on page 24 ).

Do one of the following: o o

For tower models, return the server to an upright position.

For rack models, slide the server back into the rack.

Connect each power cord to the server.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. o

Do one of the following: o

For tower models, install the bezel.

For rack models, if removed, install the security bezel (on page 22 ).

Redundant fans option

Redundant fan guidelines

The server supports redundant fans to provide proper airflow to the system when a primary fan fails.

In the standard, nonredundant configuration, fans 2, 3, and 4 cool the server.

For the redundant configuration, fan 1 and four fan louvers are added to back up the primary fans. This configuration enables the server to continue operation in redundant mode, when a fan failure occurs. In a redundant fan configuration:

If one fan fails, then the other three fans provide airflow.

If two fans fail, then the server shuts down.

Hardware options installation 69

IMPORTANT: Fan louvers must be present for the redundant configuration. Without the louvers, all four fans are nonredundant.

NOTE: If your system is already installed with four fans, store the fan that is included in this kit as a spare.

Installing a hot-plug redundant fan

1.

2.

3.

4.

5.

6.

Do one of the following: o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

o

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Do one of the following: o

For tower models, place the server on a flat, level surface with the access panel facing up. o

For rack models, extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

Remove all the fans and fan blanks.

Hardware options installation 70

7.

Install the fan louvers, making sure that the louver click into place.

8.

Remove the tab from each fan.

Hardware options installation 71

9.

Install the fans, making sure that the fans click into place.

10.

Install the PCIe air baffles.

11.

12.

13.

14.

15.

16.

Install the access panel (on page 24 ).

Do one of the following: o

For tower models, return the server to an upright position. o

For rack models, slide the server back into the rack.

Connect each power cord to the server.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Do one of the following: o

For tower models, install the bezel.

Hardware options installation 72

o

For rack models, if removed, install the security bezel (on page 22 ).

Eight-bay SFF drive cage option

Install the optional eight-bay SFF drive cage in drive cage bay 2 or drive cage bay 3.

To install an additional eight-bay SFF drive cage, an optional SAS controller is required. To obtain the option, contact an HP authorized reseller.

Installing the optional SFF hot-plug drive cage

1.

Do one of the following:

2.

3.

4.

5.

6. o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

o

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

For tower models, do the following: a.

Place the server on a flat, level surface with the access panel facing up. b.

Remove the access panel (on page 24 ).

For rack models, do the following: a. b.

Extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

c.

Release thumbscrews and remove the rack bezel (" Remove the rack bezel " on page 22 ).

Remove the blank from box 2 or box 3.

Hardware options installation 73

7.

Install the optional SFF drive cage.

8.

Using the T-15 screws, secure the optional SFF drive cage to the server.

9.

10.

Remove the air baffle.

Remove the fan cage.

Hardware options installation 74

11.

Connect the mini-SAS cables to the drive cage backplane option.

12.

Connect the mini-SAS cables to the SAS controller option.

NOTE: For more information about connecting the cables to SAS controller option, see the documentation that ships with SAS controller option kit.

13.

Connect the power cable to the system board connector appropriate for your configuration.

14.

15.

16.

17.

Install the fan cage.

Install the air baffle.

For tower models, do the following: a.

Install the access panel (on page 24 ).

b.

Return the server to an upright position.

For rack models, do the following: a.

Install the rack bezel (on page 23 ).

Hardware options installation 75

18.

19.

20.

21. b. c.

Install the access panel (on page 24 ).

Slide the server back into the rack.

Connect each power cord to the server.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Do one of the following: o o

For tower models, install the bezel.

For rack models, if removed, install the security bezel (on page 22 ).

Six-bay LFF drive cage

To install a six-bay, LFF hot-plug drive cage in a server, a SAS controller option is required.

To obtain the SAS controller option, contact an authorized HP reseller.

To install the SAS controller option, see the documentation that ships with SAS controller option kit.

Installing the optional LFF hot-plug drive cage

1.

2.

3.

4.

5.

Do one of the following: o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

o

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

For tower models, do the following: a. b.

Place the server on a flat, level surface with the access panel facing up.

Remove the access panel (on page

For rack models, do the following:

24 ).

a. b. c.

Extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

Release thumbscrews and remove the rack bezel (" Remove the rack bezel " on page 22 ).

Hardware options installation 76

6.

Remove the blank from box 2 or box 3

7.

Install the optional LFF hot-plug drive cage.

Hardware options installation 77

8.

Using the T-15 screws, secure the optional LFF drive cage to the server.

9.

10.

11.

Remove the air baffle

Remove the fan cage.

Connect the mini-SAS cables to the drive backplane option.

12.

Connect the mini-SAS cables to the SAS controller option.

NOTE: For more information about connecting the cables to SAS controller option, see the documentation that ships with SAS controller option kit.

Hardware options installation 78

13.

Connect the power cable to the appropriate connector on the system board for your configuration.

14.

15.

16.

17.

18.

19.

20.

21.

Install the fan cage.

Install the air baffle.

For tower models, do the following: a.

Install the access panel (on page 24 ).

b.

Return the server to an upright position.

For rack models, do the following: a.

Install the rack bezel (on page 23 ).

b. c.

Install the access panel (on page 24 ).

Slide the server back into the rack.

Connect each power cord to the server.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Do one of the following: o o

For tower models, install the bezel.

For rack models, if removed, install the security bezel (on page 22 ).

HP Trusted Platform Module option

Use these instructions to install and enable a TPM on a supported server. This procedure includes three sections:

1.

Installing the Trusted Platform Module board.

2.

3.

Retaining the recovery key/password (on page 82 ).

Enabling the Trusted Platform Module (on page 82 ).

Hardware options installation 79

Enabling the TPM requires accessing RBSU (" HP ROM-Based Setup Utility " on page 91 ). For more

information about RBSU, see the HP website ( http://www.hp.com/go/ilomgmtengine/docs ).

TPM installation requires the use of drive encryption technology, such as the Microsoft Windows BitLocker

Drive Encryption feature. For more information on BitLocker, see the Microsoft website

( http://www.microsoft.com

).

CAUTION: Always observe the guidelines in this document. Failure to follow these guidelines can cause hardware damage or halt data access.

When installing or replacing a TPM, observe the following guidelines:

Do not remove an installed TPM. Once installed, the TPM becomes a permanent part of the system board.

When installing or replacing hardware, HP service providers cannot enable the TPM or the encryption technology. For security reasons, only the customer can enable these features.

When returning a system board for service replacement, do not remove the TPM from the system board.

When requested, HP Service provides a TPM with the spare system board.

Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.

When using BitLocker, always retain the recovery key/password. The recovery key/password is required to enter Recovery Mode after BitLocker detects a possible compromise of system integrity.

HP is not liable for blocked data access caused by improper TPM use. For operating instructions, see the encryption technology feature documentation provided by the operating system.

Installing the Trusted Platform Module board

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

1.

2.

3.

4.

5.

Do one of the following: o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

o

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Do one of the following: o o

For tower models, place the server on a flat, level surface with the access panel facing up.

For rack models, extend the server from the rack (on page 25 ).

Remove the access panel (on page 24 ).

Hardware options installation 80

6.

7.

8.

Remove the air baffle (on page 25 ).

If installed, remove the PCI card from slot 9.

CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.

Install the TPM board. Press down on the connector to seat the board.

9.

Install the TPM security rivet by pressing the rivet firmly into the system board.

10.

11.

12.

13.

14.

If removed, install the PCI card in slot 9.

Install the air baffle.

Install the access panel (on page 24 ).

Do one of the following: o o

For tower models, return the server to an upright position.

For rack models, slide the server back into the rack.

Connect each power cord to the server.

Hardware options installation 81

15.

16.

17.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Do one of the following: o o

For tower models, install the bezel.

For rack models, if removed, install the security bezel (on page 22 ).

Retaining the recovery key/password

The recovery key/password is generated during BitLocker™ setup, and can be saved and printed after

BitLocker™ is enabled. When using BitLocker™, always retain the recovery key/password. The recovery key/password is required to enter Recovery Mode after BitLocker™ detects a possible compromise of system integrity.

To help ensure maximum security, observe the following guidelines when retaining the recovery key/password:

Always store the recovery key/password in multiple locations.

Always store copies of the recovery key/password away from the server.

Do not save the recovery key/password on the encrypted hard drive.

Enabling the Trusted Platform Module

1.

When prompted during the start-up sequence, access RBSU by pressing the F9 key.

2.

3.

4.

5.

6.

7.

8.

From the Main Menu, select Server Security.

From the Server Security Menu, select Trusted Platform Module.

From the Trusted Platform Module Menu, select TPM Functionality.

Select Enable, and then press the Enter key to modify the TPM Functionality setting.

Press the Esc key to exit the current menu, or press the F10 key to exit RBSU.

Reboot the server.

Enable the TPM in the OS. For OS-specific instructions, see the OS documentation.

CAUTION: When a TPM is installed and enabled on the server, data access is locked if you fail to follow the proper procedures for updating the system or option firmware, replacing the system board, replacing a hard drive, or modifying OS application TPM settings.

For more information on firmware updates and hardware procedures, see the HP Trusted Platform Module

Best Practices White Paper on the HP website ( http://www.hp.com/support ).

For more information on adjusting TPM usage in BitLocker™, see the Microsoft website

( http://technet.microsoft.com/en-us/library/cc732774.aspx

).

Hardware options installation 82

Cabling

Server data cabling

Item

1

4

5

2

3

6

Description

Optical drive connector

Drive cage 1, SAS connector 2

Drive cage 1, SAS connector 1

SATA connector

SAS connector

SAS connector

Cabling 83

Media device data cabling

Item

3

4

1

2

5

6

Description

Optical drive connector

Optical drive connector

Optical drive connector

SATA connector

SATA connector

SATA connector

Cabling 84

Optical drive cabling

Cabling 85

Software and configuration utilities

Server mode

The software and configuration utilities presented in this section operate in online mode, offline mode, or in both modes.

Software or configuration utility Server mode

HP iLO (on page 86 )

Online and Offline

Active Health System (on page 87 )

Integrated Management Log (on page 88 )

Intelligent Provisioning (on page 88 )

HP Insight Diagnostics (on page 89 )

Erase Utility (on page 89 )

Scripting Toolkit (on page 90 )

HP Service Pack for ProLiant (on page 90 )

HP Smart Update Manager (on page 90 )

HP ROM-Based Setup Utility (on page 91 )

Array Configuration Utility (on page 93 )

Option ROM Configuration for Arrays (on page 94 )

ROMPaq utility (on page 94 )

Online and Offline

Online and Offline

Offline

Online and Offline

Offline

Online

Online and Offline

Online and Offline

Offline

Online and Offline

Offline

Offline

Server QuickSpecs

For more information about product features, specifications, options, configurations, and compatibility, see the QuickSpecs on the HP website

( http://h18000.www1.hp.com/products/quickspecs/ProductBulletin.html

). At the website, choose the geographic region, and then locate the product by name or product category.

HP iLO Management Engine

The HP iLO Management Engine is a set of embedded management features supporting the complete lifecycle of the server, from initial deployment through ongoing management.

HP iLO

The iLO 4 subsystem is a standard component of selected HP ProLiant servers that simplifies initial server setup, server health monitoring, power and thermal optimization, and remote server administration. The iLO

4 subsystem includes an intelligent microprocessor, secure memory, and a dedicated network interface. This design makes iLO 4 independent of the host server and its operating system.

Software and configuration utilities 86

iLO 4 enables and manages the Active Health System (on page 87 ) and also features Agentless

Management. All key internal subsystems are monitored by iLO 4. SNMP alerts are sent directly by iLO 4 regardless of the host operating system or even if no host operating system is installed.

Using iLO 4, you can do the following:

Access a high-performance and secure Remote Console to the server from anywhere in the world.

Use the shared iLO 4 Remote Console to collaborate with up to six server administrators.

Remotely mount high-performance Virtual Media devices to the server.

Securely and remotely control the power state of the managed server.

Have true Agentless Management with SNMP alerts from iLO 4 regardless of the state of the host server.

Access Active Health System troubleshooting features through the iLO 4 interface.

For more information about iLO 4 features (which may require an iLO Advanced Pack or iLO Advanced for

BladeSystem license), see the iLO 4 documentation on the Documentation CD or on the HP website

( http://www.hp.com/go/ilo/docs ).

Active Health System

HP Active Health System provides the following features:

Combined diagnostics tools/scanners

Always on, continuous monitoring for increased stability and shorter downtimes

Rich configuration history

Health and service alerts

Easy export and upload to Service and Support

The HP Active Health System monitors and records changes in the server hardware and system configuration.

The Active Health System assists in diagnosing problems and delivering rapid resolution when server failures occur.

The Active Health System collects the following types of data:

Server model

Serial number

Processor model and speed

Storage capacity and speed

Memory capacity and speed

Firmware/BIOS

HP Active Health System does not collect information about Active Health System users' operations, finances, customers, employees, partners, or data center, such as IP addresses, host names, user names, and passwords. HP Active Health System does not parse or change operating system data from third-party error event log activities, such as content created or passed through by the operating system.

The data that is collected is managed according to the HP Data Privacy policy. For more information see the

HP website ( http://www.hp.com/go/privacy ).

Software and configuration utilities 87

The Active Health System log, in conjunction with the system monitoring provided by Agentless Management or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status, and service alerts for various server components.

The Agentless Management Service is available in the SPP, which is a disk image (.iso) that you can download from the HP website ( http://www.hp.com/go/spp/download ). The Active Health System log can be downloaded manually from iLO 4 or HP Intelligent Provisioning and sent to HP. For more information, see the HP iLO User Guide or HP Intelligent Provisioning User Guide on the HP website

( http://www.hp.com/go/ilo/docs ).

Integrated Management Log

The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.

You can view recorded events in the IML in several ways, including the following:

From within HP SIM

From within operating system-specific IML viewers o

For Windows: IML Viewer o

For Linux: IML Viewer Application

From within the iLO 4 user interface

From within HP Insight Diagnostics (on page 89 )

Intelligent Provisioning

Several packaging changes have taken place with HP ProLiant Gen8 servers: SmartStart CDs and the Smart

Update Firmware DVD will no longer ship with these new servers. Instead, the deployment capability is embedded in the server as part of HP iLO Management Engine’s Intelligent Provisioning.

Intelligent Provisioning is an essential single-server deployment tool embedded in HP ProLiant Gen8 servers that simplifies HP ProLiant server setup, providing a reliable and consistent way to deploy HP ProLiant server configurations.

Intelligent Provisioning assists with the OS installation process by preparing the system for installing

"off-the-shelf" versions of leading operating system software and automatically integrating optimized

HP ProLiant server support software from SPP. SPP is the installation package for operating system-specific bundles of HP ProLiant optimized drivers, utilities, management agents, and system firmware.

Intelligent Provisioning provides maintenance-related tasks through Perform Maintenance features.

Intelligent Provisioning provides installation help for Microsoft Windows, Red Hat and SUSE Linux, and

VMware. For specific OS support, see the HP Intelligent Provisioning Release Notes.

For more information on Intelligent Provisioning software, see the HP website ( http://www.hp.com/go/ilo ).

For more information about Intelligent Provisioning drivers, firmware, and SPP, see the HP website

( http://www.hp.com/go/spp/download ).

Software and configuration utilities 88

HP Insight Diagnostics

HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation.

HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS

is not running. To run this utility, boot the server using Intelligent Provisioning (on page 88 ).

HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft Windows and Linux versions, the utility helps to ensure proper system operation.

For more information or to download the utility, see the HP website ( http://www.hp.com/servers/diags ). HP

Insight Diagnostics Online Edition is also available in the SPP. For more information, see the HP website

( http://www.hp.com/go/spp/download ).

HP Insight Diagnostics survey functionality

HP Insight Diagnostics (on page 89 ) provides survey functionality that gathers critical hardware and software

information on ProLiant servers.

This functionality supports operating systems that are supported by the server. For operating systems supported by the server, see the HP website ( http://www.hp.com/go/supportos ).

If a significant change occurs between data-gathering intervals, the survey function marks the previous information and overwrites the survey data files to reflect the latest changes in the configuration.

Survey functionality is installed with every Intelligent Provisioning-assisted HP Insight Diagnostics installation,

or it can be installed through the SPP (" HP Service Pack for ProLiant " on page 90 ).

Erase Utility

CAUTION: Perform a backup before running the System Erase Utility. The utility sets the system to its original factory state, deletes the current hardware configuration information, including array setup and disk partitioning, and erases all connected hard drives completely. Refer to the instructions for using this utility.

The Erase utility enables you to erase system CMOS, NVRAM, and hard drives. Run the Erase Utility if you must erase the system for the following reasons:

You want to install a new operating system on a server with an existing operating system.

You encounter an error when completing the steps of a factory-installed operating system installation.

To access the Erase Utility, click the Perform Maintenance icon from the Intelligent Provisioning home screen and then select Erase.

Run the Erase utility to:

Reset all settings — erases all drives, NVRAM, and RBSU

Reset all disks — erases all drives

Reset RBSU — erases current RBSU settings

After selecting the appropriate option, click Erase System. Click Exit to reboot the server after the erase task is completed. Click Cancel Erase to exit the utility without erasing.

Software and configuration utilities 89

Scripting Toolkit

The Scripting Toolkit is a server deployment product that enables you to build an unattended automated installation for high-volume server deployments. The Scripting Toolkit is designed to support ProLiant BL, ML,

DL, and SL servers. The toolkit includes a modular set of utilities and important documentation that describes how to apply these tools to build an automated server deployment process.

The Scripting Toolkit provides a flexible way to create standard server configuration scripts. These scripts are used to automate many of the manual steps in the server configuration process. This automated server configuration process cuts time from each deployment, making it possible to scale rapid, high-volume server deployments.

For more information, and to download the Scripting Toolkit, see the HP website

( http://www.hp.com/go/ProLiantSTK ).

HP Service Pack for ProLiant

SPP is a release set that contains a comprehensive collection of firmware and system software components, all tested together as a single solution stack for HP ProLiant servers, their options, BladeSystem enclosures, and limited HP external storage.

SPP has several key features for updating HP ProLiant servers. Using HP SUM as the deployment tool, SPP can be used in an online mode on a Windows or Linux hosted operating system, or in an offline mode where the server is booted to the ISO so that the server can be updated automatically with no user interaction or updated in interactive mode.

For more information or to download SPP, see the HP website ( http://www.hp.com/go/spp ).

HP Smart Update Manager

The HP SUM provides intelligent and flexible firmware and software deployment. This technology assists in reducing the complexity of provisioning and updating HP ProLiant Servers, options, and Blades within the data center. HP SUM is used to deploy firmware and software in SPP.

HP SUM enables system administrators to upgrade ROM images efficiently across a wide range of servers and options. This tool has the following features:

Enables GUI and a command-line, scriptable interface

Provides scriptable, command-line deployment

Requires no agent for remote installations

Enables dependency checking, which ensures appropriate install order and dependency checking between components

Deploys software and firmware on Windows and Linux operating systems

Performs local or remote (one-to-many) online deployment

Deploys firmware and software together

Supports offline and online deployment

Deploys necessary component updates only

Downloads the latest components from Web

Software and configuration utilities 90

Enables direct update of BMC firmware (HP iLO)

For more information about HP SUM and to access the HP Smart Update Manager User Guide, see the HP website ( http://www.hp.com/go/hpsum/documentation ).

HP ROM-Based Setup Utility

RBSU is a configuration utility embedded in ProLiant servers that performs a wide range of configuration activities that can include the following:

Configuring system devices and installed options

Enabling and disabling system features

Displaying system information

Selecting the primary boot controller

Configuring memory options

Language selection

For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website ( http://www.hp.com/support/rbsu ).

Using RBSU

To use RBSU, use the following keys:

To access RBSU, press the F9 key during power-up when prompted.

To navigate the menu system, use the arrow keys.

To make selections, press the Enter key.

To access Help for a highlighted configuration option, press the F1 key.

IMPORTANT: RBSU automatically saves settings when you press the Enter key. The utility does not prompt you for confirmation of settings before you exit the utility. To change a selected setting, you must select a different setting and press the Enter key.

Default configuration settings are applied to the server at one of the following times:

Upon the first system power-up

After defaults have been restored

Default configuration settings are sufficient for proper typical server operation, but configuration settings can be modified using RBSU. The system will prompt you for access to RBSU with each power-up.

Auto-configuration process

The auto-configuration process automatically runs when you boot the server for the first time. During the power-up sequence, the system ROM automatically configures the entire system without needing any intervention. During this process, the ORCA utility, in most cases, automatically configures the array to a default setting based on the number of drives connected to the server.

NOTE: If the boot drive is not empty or has been written to in the past, ORCA does not automatically configure the array. You must run ORCA to configure the array settings.

Software and configuration utilities 91

NOTE: The server may not support all the following examples.

Drives installed

1

2

3, 4, 5, or 6

More than 6

Drives used

1

2

3, 4, 5, or 6

0

RAID level

RAID 0

RAID 1

RAID 5

None

To change any ORCA default settings and override the auto-configuration process, press the F8 key when prompted.

For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website ( http://www.hp.com/support/rbsu ).

Boot options

Near the end of the boot process, the boot options screen is displayed. This screen is visible for several seconds before the system attempts to boot from a supported boot device. During this time, you can do the following:

Access RBSU by pressing the F9 key.

Access Intelligent Provisioning Maintenance Menu by pressing the F10 key.

Access the boot menu by pressing the F11 key.

Force a PXE Network boot by pressing the F12 key.

Configuring AMP modes

Not all ProLiant servers support all AMP modes. RBSU provides menu options only for the modes supported by the server. Advanced memory protection within RBSU enables the following advanced memory modes:

Advanced ECC Mode—Provides memory protection beyond Standard ECC. All single-bit failures and some multi-bit failures can be corrected without resulting in system downtime.

Online Spare Mode—Provides protection against failing or degraded DIMMs. Certain memory is set aside as spare, and automatic failover to spare memory occurs when the system detects a degraded

DIMM. DIMMs that are likely to receive a fatal or uncorrectable memory error are removed from operation automatically, resulting in less system downtime.

For DIMM population requirements, see the server-specific user guide.

Re-entering the server serial number and product ID

After you replace the system board, you must re-enter the server serial number and the product ID.

1.

2.

During the server startup sequence, press the F9 key to access RBSU.

Select the Advanced Options menu.

3.

4.

Select Service Options.

Select Serial Number. The following warnings appear:

Software and configuration utilities 92

5.

6.

7.

8.

9.

10.

11.

WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. This option should only be used by qualified service personnel. This value should always match the serial number sticker located on the chassis.

Warning: The serial number should ONLY be modified by qualified service personnel. This value should always match the serial number located on the chassis.

Press the Enter key to clear the warning.

Enter the serial number and press the Enter key.

Select Product ID. The following warning appears:

Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID on the chassis.

Enter the product ID and press the Enter key.

Press the Esc key to close the menu.

Press the Esc key to exit RBSU.

Press the F10 key to confirm exiting RBSU. The server automatically reboots.

Utilities and features

Array Configuration Utility

ACU is a browser-based utility with the following features:

Runs as a local application or remote service accessed through the HP System Management Homepage

Supports online array capacity expansion, logical drive extension, assignment of online spares, and

RAID or stripe size migration

Suggests the optimum configuration for an unconfigured system

For supported controllers, provides access to licensed features, including: o

Moving and deleting individual logical volumes o o o o o

Advanced Capacity Expansion (SATA to SAS and SAS to SATA)

Offline Split Mirror

RAID 6 and RAID 60

RAID 1 (ADM) and RAID 10 (ADM)

HP Drive Erase o

Video-On-Demand Advanced Controller Settings

Provides different operating modes, enabling faster configuration or greater control over the configuration options

Remains available any time that the server is on

Displays on-screen tips for individual steps of a configuration procedure

Provides context-sensitive searchable help content

Provides diagnostic and SmartSSD Wear Gauge functionality on the Diagnostics tab

Software and configuration utilities 93

ACU is now available as an embedded utility, starting with HP ProLiant Gen8 servers. To access ACU, use one of the following methods:

If an optional controller is not installed, press F10 during boot.

If an optional controller is installed, when the system recognizes the controller during POST, press F5.

For optimum performance, the minimum display settings are 1024 × 768 resolution and 16-bit color. Servers running Microsoft® operating systems require one of the following supported browsers:

Internet Explorer 6.0 or later

Mozilla Firefox 2.0 or later

For Linux servers, see the README.TXT file for additional browser and support information.

For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant

Servers User Guide on the HP website

( http://bizsupport2.austin.hp.com/bc/docs/support/SupportManual/c01608507/c01608507.pdf

). To configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP website

( http://bizsupport1.austin.hp.com/bc/docs/support/SupportManual/c00729544/c00729544.pdf

).

Option ROM Configuration for Arrays

Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign

RAID levels, and establish online spare configurations.

The utility also provides support for the following functions:

Reconfiguring one or more logical drives

Viewing the current logical drive configuration

Deleting a logical drive configuration

Setting the controller to be the boot controller

Selecting the boot volume

If you do not use the utility, ORCA will default to the standard configuration.

For more information regarding the default configurations that ORCA uses, see the HP ROM-Based Setup

Utility User Guide on the Documentation CD or the HP website ( http://www.hp.com/support/rbsu ).

For more information about the controller and its features, see the HP Smart Array Controllers for HP ProLiant

Servers User Guide on the HP website

( http://bizsupport2.austin.hp.com/bc/docs/support/SupportManual/c01608507/c01608507.pdf

). To configure arrays, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the HP website

( http://bizsupport1.austin.hp.com/bc/docs/support/SupportManual/c00729544/c00729544.pdf

).

ROMPaq utility

The ROMPaq utility enables you to upgrade the system firmware (BIOS). To upgrade the firmware, insert a

ROMPaq USB Key into an available USB port and boot the system. In addition to ROMPaq, Online Flash

Components for Windows and Linux operating systems are available for updating the system firmware.

The ROMPaq utility checks the system and provides a choice (if more than one exists) of available firmware revisions.

Software and configuration utilities 94

For more information, see the Download drivers and software page for the server. To access the server-specific page, enter the following web address into the browser: http://www.hp.com/support/<servername>

For example: http://www.hp.com/support/dl360g6

Automatic Server Recovery

ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND (does not apply to HP ProLiant DL980 Servers), or panic. A system fail-safe timer, the

ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer. However, when the operating system fails, the timer expires and restarts the server.

ASR increases server availability by restarting the server within a specified time after a system hang. At the same time, the HP SIM console notifies you by sending a message to a designated pager number that ASR has restarted the system. You can disable ASR from the System Management Homepage or through RBSU.

USB support

HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices through legacy USB support, which is enabled by default in the system ROM.

Legacy USB support provides USB functionality in environments where USB support is not available normally.

Specifically, HP provides legacy USB functionality for the following:

POST

RBSU

Diagnostics

DOS

Operating environments which do not provide native USB support

Redundant ROM support

The server enables you to upgrade or configure the ROM safely with redundant ROM support. The server has a single ROM that acts as two separate ROM images. In the standard implementation, one side of the ROM contains the current ROM program version, while the other side of the ROM contains a backup version.

NOTE: The server ships with the same version programmed on each side of the ROM.

Safety and security benefits

When you flash the system ROM, ROMPaq writes over the backup ROM and saves the current ROM as a backup, enabling you to switch easily to the alternate ROM version if the new ROM becomes corrupted for any reason. This feature protects the existing ROM version, even if you experience a power failure while flashing the ROM.

Software and configuration utilities 95

Keeping the system current

Drivers

IMPORTANT: Always perform a backup before installing or updating device drivers.

The server includes new hardware that may not have driver support on all OS installation media.

If you are installing an Intelligent Provisioning-supported OS, use Intelligent Provisioning (on page 88 ) and its

Configure and Install feature to install the OS and latest supported drivers.

If you do not use Intelligent Provisioning to install an OS, drivers for some of the new hardware are required.

These drivers, as well as other option drivers, ROM images, and value-add software can be downloaded as part of an SPP.

If you are installing drivers from SPP, be sure that you are using the latest SPP version that your server supports. To verify that your server is using the latest supported version and for more information about SPP, see the HP website ( http://www.hp.com/go/spp/download ).

To directly locate the OS drivers for a particular server, enter the following web address into the browser: http://www.hp.com/support/<servername>

In place of <servername>, enter the server name.

For example: http://www.hp.com/support/dl360g6

Software and firmware

Software and firmware should be updated before using the server for the first time, unless any installed software or components require an older version. For system software and firmware updates, download the

SPP (" HP Service Pack for ProLiant " on page 90 ) from the HP website (

http://www.hp.com/go/spp ).

Version control

The VCRM and VCA are web-enabled Insight Management Agents tools that HP SIM uses to schedule software update tasks to the entire enterprise.

VCRM manages the repository for SPP. Administrators can view the SPP contents or configure VCRM to automatically update the repository with internet downloads of the latest software and firmware from

HP.

VCA compares installed software versions on the node with updates available in the VCRM managed repository. Administrators configure VCA to point to a repository managed by VCRM.

For more information about version control tools, see the HP Systems Insight Manager User Guide, the HP

Version Control Agent User Guide, and the HP Version Control Repository User Guide on the HP website

( http://www.hp.com/go/hpsim ).

Software and configuration utilities 96

HP Operating Systems and Virtualization Software Support for

ProLiant Servers

For information about specific versions of a supported operating system, see the HP website

( http://www.hp.com/go/ossupport ).

HP Technology Service Portfolio

HP Technology Services offers a targeted set of consultancy, deployment, and service solutions designed to meet the support needs of the most business and IT environments.

Foundation Care services deliver scalable hardware and software support packages for HP ProLiant server and industry-standard software. You can choose the type and level of service that is most suitable for your business needs.

HP Collaborative Support —With a single call, HP addresses initial hardware and software support needs and helps to quickly identify if a problem is related to hardware or software. If the problem is identified as hardware, HP will resolve as per service level commitments. If the reported incident is related to HP or supported 3rd party software product and cannot be resolved by applying known fixes, HP will contact the third-party vendor and create a problem incident on the your behalf.

HP Proactive Care — For customers running business critical environments where down time is not an option, then HP Proactive Care helps to deliver high levels of application availability. Key to these service options is the delivery of proactive service management offers to help you avoid the causes of down time. If a problems arises than HP offers advanced technical response from critical system support specialist for fast problem identification and resolution.

HP Support Center — All service options include HP Support Center delivering information, tools, and experts required to support HP business products.

HP Insight Remote Support — Provides 24x7 secure remote monitoring, diagnosis and problem resolution.

For more information, see the HP website ( http://www.hp.com/services/proliant ) or the HP website for the

HP BladeSystem ( http://www.hp.com/services/bladesystem ).

Change control and proactive notification

HP offers Change Control and Proactive Notification to notify customers 30 to 60 days in advance of upcoming hardware and software changes on HP commercial products.

For more information, refer to the HP website ( http://www.hp.com/go/pcn ).

Software and configuration utilities 97

Troubleshooting

Troubleshooting resources

The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language:

English ( http://www.hp.com/support/ProLiant_TSG_v1_en )

French ( http://www.hp.com/support/ProLiant_TSG_v1_fr )

Spanish ( http://www.hp.com/support/ProLiant_TSG_v1_sp )

German ( http://www.hp.com/support/ProLiant_TSG_v1_gr )

Japanese ( http://www.hp.com/support/ProLiant_TSG_v1_jp )

Simplified Chinese ( http://www.hp.com/support/ProLiant_TSG_v1_sc )

The HP ProLiant Gen8 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades. To view the guide, select a language:

English ( http://www.hp.com/support/ProLiant_EMG_v1_en )

French ( http://www.hp.com/support/ProLiant_EMG_v1_fr )

Spanish ( http://www.hp.com/support/ProLiant_EMG_v1_sp )

German ( http://www.hp.com/support/ProLiant_EMG_v1_gr )

Japanese ( http://www.hp.com/support/ProLiant_EMG_v1_jp )

Simplified Chinese ( http://www.hp.com/support/ProLiant_EMG_v1_sc )

Troubleshooting 98

Battery replacement

If the server no longer automatically displays the correct date and time, you might have to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.

WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury:

Do not attempt to recharge the battery.

• Do not expose the battery to temperatures higher than 60°C (140°F).

Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.

Replace only with the spare designated for this product.

To remove the component:

1.

Do one of the following: o

For tower models, open and remove the bezel (" Remove the tower bezel " on page 20 ).

2.

3. o

For rack models, if installed, remove the security bezel (on page 22 ).

Power down the server (on page 20 ).

Remove all power: a.

Disconnect each power cord from the power source.

4.

5.

6. b.

Disconnect each power cord from the server.

Do one of the following: o o

For tower models, place the server on a flat, level surface with the access panel facing up.

For rack models, extend the server from the rack (on page

Remove the access panel (on page 24 ).

25 ).

Remove the air baffle (on page 25 ).

Battery replacement 99

7.

Remove the battery.

IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU.

For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.

Battery replacement 100

Regulatory compliance notices

Regulatory compliance identification numbers

For the purpose of regulatory compliance certifications and identification, this product has been assigned a unique regulatory model number. The regulatory model number can be found on the product nameplate label, along with all required approval markings and information. When requesting compliance information for this product, always refer to this regulatory model number. The regulatory model number is not the marketing name or model number of the product.

Federal Communications Commission notice

Part 15 of the Federal Communications Commission (FCC) Rules and Regulations has established Radio

Frequency (RF) emission limits to provide an interference-free radio frequency spectrum. Many electronic devices, including computers, generate RF energy incidental to their intended function and are, therefore, covered by these rules. These rules place computers and related peripheral devices into two classes, A and

B, depending upon their intended installation. Class A devices are those that may reasonably be expected to be installed in a business or commercial environment. Class B devices are those that may reasonably be expected to be installed in a residential environment (for example, personal computers). The FCC requires devices in both classes to bear a label indicating the interference potential of the device as well as additional operating instructions for the user.

FCC rating label

The FCC rating label on the device shows the classification (A or B) of the equipment. Class B devices have an FCC logo or ID on the label. Class A devices do not have an FCC logo or ID on the label. After you determine the class of the device, refer to the corresponding statement.

FCC Notice, Class A Equipment

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to

Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at personal expense.

FCC Notice, Class B Equipment

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to

Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to

Regulatory compliance notices 101

radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit that is different from that to which the receiver is connected.

Consult the dealer or an experienced radio or television technician for help.

Declaration of conformity for products marked with the FCC logo, United States only

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions regarding this product, contact us by mail or telephone:

Hewlett-Packard Company

P. O. Box 692000, Mail Stop 530113

Houston, Texas 77269-2000

1-800-HP-INVENT (1-800-474-6836). (For continuous quality improvement, calls may be recorded or monitored.)

For questions regarding this FCC declaration, contact us by mail or telephone:

Hewlett-Packard Company

P. O. Box 692000, Mail Stop 510101

Houston, Texas 77269-2000

1­281-514-3333

To identify this product, refer to the part, series, or model number found on the product.

Modifications

The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Hewlett-Packard Company may void the user’s authority to operate the equipment.

Cables

Connections to this device must be made with shielded cables with metallic RFI/EMI connector hoods in order to maintain compliance with FCC Rules and Regulations.

Canadian notice (Avis Canadien)

Class A equipment

Regulatory compliance notices 102

This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment

Regulations.

Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada.

Class B equipment

This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment

Regulations.

Cet appareil numérique de la classe B respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada.

European Union regulatory notice

Products bearing the CE marking comply with the following EU Directives:

Low Voltage Directive 2006/95/EC

EMC Directive 2004/108/EC

Ecodesign Directive 2009/125/EC, where applicable

CE compliance of this product is valid if powered with the correct CE-marked AC adapter provided by HP.

Compliance with these directives implies conformity to applicable harmonized European standards

(European Norms) that are listed in the EU Declaration of Conformity issued by HP for this product or product family and available (in English only) either within the product documentation or at the following HP website

( http://www.hp.eu/certificates ) (type the product number in the search field).

The compliance is indicated by one of the following conformity markings placed on the product:

For non-telecommunications products and for EU harmonized telecommunications products, such as

Bluetooth® within power class below 10mW.

For EU non-harmonized telecommunications products (If applicable, a 4-digit notified body number is inserted between CE and !).

Please refer to the regulatory label provided on the product.

The point of contact for regulatory matters is Hewlett-Packard GmbH, Dept./MS: HQ-TRE, Herrenberger

Strasse 140, 71034 Boeblingen, GERMANY.

Disposal of waste equipment by users in private households in the European Union

Regulatory compliance notices 103

This symbol on the product or on its packaging indicates that this product must not be disposed of with your other household waste. Instead, it is your responsibility to dispose of your waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate collection and recycling of your waste equipment at the time of disposal will help to conserve natural resources and ensure that it is recycled in a manner that protects human health and the environment. For more information about where you can drop off your waste equipment for recycling, please contact your local city office, your household waste disposal service or the shop where you purchased the product.

Japanese notice

BSMI notice

Korean notice

Class A equipment

Regulatory compliance notices 104

Class B equipment

Chinese notice

Class A equipment

Vietnam compliance marking notice

This marking is for applicable products only.

Ukraine notice

Laser compliance

This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in accordance with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser radiation.

Each laser product complies with 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser

Notice No. 50, dated June 24, 2007; and with IEC 60825-1:2007.

Regulatory compliance notices 105

WARNING: Use of controls or adjustments or performance of procedures other than those specified herein or in the laser product's installation guide may result in hazardous radiation exposure. To reduce the risk of exposure to hazardous radiation:

• Do not try to open the module enclosure. There are no user-serviceable components inside.

Do not operate controls, make adjustments, or perform procedures to the laser device other than those specified herein.

• Allow only HP Authorized Service technicians to repair the unit.

The Center for Devices and Radiological Health (CDRH) of the U.S. Food and Drug Administration implemented regulations for laser products on August 2, 1976. These regulations apply to laser products manufactured from August 1, 1976. Compliance is mandatory for products marketed in the United States.

Battery replacement notice

WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury:

Do not attempt to recharge the battery.

• Do not expose the battery to temperatures higher than 60°C (140°F).

• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.

Batteries, battery packs, and accumulators should not be disposed of together with the general household waste. To forward them to recycling or proper disposal, use the public collection system or return them to HP, an authorized HP Partner, or their agents.

For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.

Taiwan battery recycling notice

The Taiwan EPA requires dry battery manufacturing or importing firms in accordance with Article 15 of the

Waste Disposal Act to indicate the recovery marks on the batteries used in sales, giveaway or promotion.

Contact a qualified Taiwanese recycler for proper battery disposal.

Power cord statement for Japan

Regulatory compliance notices 106

Acoustics statement for Germany (Geräuschemission)

Schalldruckpegel L pA

< 70 dB(A)

Zuschauerpositionen (bystander positions), Normaler Betrieb (normal operation)

Nach ISO 7779:1999 (Typprüfung)

Regulatory compliance notices 107

Electrostatic discharge

Preventing electrostatic discharge

To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.

To prevent electrostatic damage:

Avoid hand contact by transporting and storing products in static-safe containers.

Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.

Place parts on a grounded surface before removing them from their containers.

Avoid touching pins, leads, or circuitry.

Always be properly grounded when touching a static-sensitive component or assembly.

Grounding methods to prevent electrostatic discharge

Several methods are used for grounding. Use one or more of the following methods when handling or installing electrostatic-sensitive parts:

Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist straps are flexible straps with a minimum of 1 megohm ±10 percent resistance in the ground cords. To provide proper ground, wear the strap snug against the skin.

Use heel straps, toe straps, or boot straps at standing workstations. Wear the straps on both feet when standing on conductive floors or dissipating floor mats.

Use conductive field service tools.

Use a portable field service kit with a folding static-dissipating work mat.

If you do not have any of the suggested equipment for proper grounding, have an authorized reseller install the part.

For more information on static electricity or assistance with product installation, contact an authorized reseller.

Electrostatic discharge 108

Specifications

Environmental specifications

Specification Value

Temperature range*

Operating

10°C to 35°C (50°F to 95°F)

Shipping

-40°C to 70°C (-40°F to 158°F)

Maximum wet bulb temperature 28°C (82.4°F)

Relative humidity

(noncondensing)**

Operating

10% to 90%

Non-operating

5% to 95%

* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.

** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for storage corresponds to a pressure minimum of 70 kPa.

Server specifications

Specification Value

Dimensions

Rack model

Height

Depth

Width

Tower model

Height

Depth

Width

Weight

Rack model

Maximum

21.8 cm (8.58 in)

73.22 cm (28.83 in)

48.26 cm (19.00 in)

46.2 cm (18.19 in)

74.00 cm (29.13 in)

21.8 cm (8.58 in)

50.06 kg (110.36 lbs)

Minimum

Tower model

Maximum

Minimum

27.63 kg (60.91 lbs)

52.09 kg (144.84 lbs)

31.09 kg (70.33 lbs)

Specifications 109

Power supply specifications

Depending on installed options, the server is configured with one of the following power supplies:

HP 460 W Power Supply (92%) specifications (on page 110 )

HP 460 W CS Power Supply (94%) specifications (on page 110 )

HP 750 W Power Supply (92%) specifications (on page 111 )

HP 750 W CS Power Supply (94%) specifications (on page 111 )

HP 1200 W CS Power Supply (94%) specifications (on page 112 )

HP 460 W Power Supply (92%) specifications

Specification Value

Input requirements

Rated input voltage

Rated input frequency

Rated input current

Rated input power

BTUs per hour

100 to 120 VAC, 200 to

240 VAC

50 Hz to 60 Hz

5.5 A at 100 VAC

2.6 A at 200 VAC

526 W at 100V AC input

505 W at 200V AC input

1794 at 100V AC input

1725 at 200V AC input

Power supply output

Rated steady-state power

Maximum peak power

460 W at 100V to 120V AC input

460 W at 200V to 240V AC input

460 W at 100V to 120V AC input

460 W at 200V to 240V AC input

HP 460 W CS Power Supply (94%) specifications

Specification Value

Input requirements

Rated input voltage

Rated input frequency

Rated input current

Rated input power

BTUs per hour

100 to 120 VAC, 200 to

240 VAC

50 Hz to 60 Hz

5.2 A at 100 VAC

2.5 A at 200 VAC

509 W at 115V AC input

495 W at 230V AC input

1764 at 100V AC input

1736 at 115V AC input

1694 at 200V AC input

1687 at 230V AC input

Power supply output

Specifications 110

Rated steady-state power

Maximum peak power

460 W at 100V to 120V AC input

460 W at 200V to 240V AC input

460 W at 100V to 120V AC input

460 W at 200V to 240V AC input

HP 750 W Power Supply (92%) specifications

Specification Value

Input requirements

Rated input voltage

Rated input frequency

Rated input current

Rated input power

BTUs per hour

100 to 120 VAC, 200 to

240 VAC

50 Hz to 60 Hz

8.9 A at 100 VAC

4.3 A at 200 VAC

857 W at 100V AC input

824 W at 200V AC input

2925 at 100V AC input

2812 at 200V AC input

Power supply output

Rated steady-state power

Maximum peak power

750 W at 100V to 120V AC input

750 W at 200V to 240V AC input

750 W at 100V to 120V AC input

750 W at 200V to 240V AC input

HP 750 W CS Power Supply (94%) specifications

Specification Value

Input requirements

Rated input voltage

Rated input frequency

Rated input current

Rated input power

BTUs per hour

100 to 120 VAC, 200 to

240 VAC

50 Hz to 60 Hz

8.5 A at 100 VAC

4.1 A at 200 VAC

831 W at 115V AC input

808 W at 230V AC input

2878 at 100V AC input

2834 at 115V AC input

2769 at 200V AC input

2758 at 230V AC input

Power supply output

Rated steady-state power

Maximum peak power

750 W at 100V to 120V AC input

750 W at 200V to 240V AC input

750 W at 100V to 120V AC input

750 W at 200V to 240V AC input

Specifications 111

HP 1200 W CS Power Supply (94%) specifications

Specification Value

Input requirements

Rated input voltage

Rated input frequency

Rated input current

Rated input power

BTUs per hour

100 to 120 VAC, 200 to

240 VAC

50 Hz to 60 Hz

10 A at 100 VAC

6.7 A at 200 VAC

990 W at 115V AC input

1315 W at 230V AC input

3060 at 100V AC input

3380 at 115V AC input

4503 at 200V AC input

4485 at 230V AC input

Power supply output

Rated steady-state power

Maximum peak power

800 W at 100V AC input

900 W at 120V AC input

1200 W at 200V to 240V AC input

800 W at 100V AC input

900 W at 120V AC input

1200 W at 200V to 240V AC input

Specifications 112

Technical support

Before you contact HP

Be sure to have the following information available before you call HP:

Active Health System log

Download and have available an Active Health System log for 3 days before the failure was detected.

For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP website ( http://www.hp.com/go/ilo/docs ).

Onboard Administrator SHOW ALL report (for HP BladeSystem products only)

For more information on obtaining the Onboard Administrator SHOW ALL report, see the HP website

( http://h20000.www2.hp.com/bizsupport/TechSupport/Document.jsp?lang=en&cc=us&objectID=c

02843807 ).

Technical support registration number (if applicable)

Product serial number

Product model name and number

Product identification number

Applicable error messages

Add-on boards or hardware

Third-party hardware or software

Operating system type and revision level

HP contact information

For United States and worldwide contact information, see the Contact HP website

( http://www.hp.com/go/assistance ).

In the United States:

To contact HP by phone, call 1-800-334-5144. For continuous quality improvement, calls may be recorded or monitored.

If you have purchased a Care Pack (service upgrade), see the Support & Drivers website

( http://www8.hp.com/us/en/support-drivers.html

). If the problem cannot be resolved at the website, call 1-800-633-3600. For more information about Care Packs, see the HP website

( http://pro-aq-sama.houston.hp.com/services/cache/10950-0-0-225-121.html

).

Customer Self Repair

HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service

Technical support 113

providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts:

Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.

Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,

HP requires that an authorized service provider replace the part. These parts are identified as "No" in the

Illustrated Parts Catalog.

Based on availability and where geography permits, CSR parts will be shipped for next business day delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits.

If assistance is required, you can call the HP Technical Support Center and a technician will help you over the telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material. Failure to return the defective part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping and part return costs and determine the courier/carrier to be used.

For more information about HP's Customer Self Repair program, contact your local service provider. For the

North American program, refer to the HP website ( http://www.hp.com/go/selfrepair ).

Réparation par le client (CSR)

Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:

Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.

REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.

Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le

Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou le transporteur à utiliser.

Technical support 114

Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP

( http://www.hp.com/go/selfrepair ).

Riparazione da parte del cliente

Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza

HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione. Vi sono due categorie di parti CSR:

Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.

Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.

In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP.

Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.

Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il programma in Nord America fare riferimento al sito Web HP ( http://www.hp.com/go/selfrepair ).

Customer Self Repair

HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere

Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der

Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses

Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:

Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den

Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen

Service berechnet.

Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer

Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche

Kosten anfallen.

Technical support 115

HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des

Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.

CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.

Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen

Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen

Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen

Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer

Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den

Kurier-/Frachtdienst.

Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter

( http://www.hp.com/go/selfrepair ).

Reparaciones del propio cliente

Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self

Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente

CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:

Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a

HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el catálogo ilustrado de componentes.

Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas

Technical support 116

sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.

Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente ( http://www.hp.com/go/selfrepair ).

Customer Self Repair

Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee categorieën CSR-onderdelen:

Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.

Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.

OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.

Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service

Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.

Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website ( http://www.hp.com/go/selfrepair ).

Reparo feito pelo cliente

Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se, durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente.

Existem duas categorias de peças CSR:

Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Technical support 117

Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado.

Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis.

A peça com defeito deve ser enviada com a documentação correspondente no material de transporte fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a

HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço postal a ser utilizado.

Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP

( http://www.hp.com/go/selfrepair ).

Technical support 118

Technical support 119

Technical support 120

Acronyms and abbreviations

ABEND abnormal end

ACU

Array Configuration Utility

AMP

Advanced Memory Protection

ASR

Automatic Server Recovery

CSA

Canadian Standards Association

CSR

Customer Self Repair

DDR double data rate

ECC error checking and correcting

FBWC flash-backed write cache

IEC

International Electrotechnical Commission iLO

Integrated Lights-Out

IML

Integrated Management Log

Acronyms and abbreviations 121

NMI non-maskable interrupt

NVRAM non-volatile memory

ORCA

Option ROM Configuration for Arrays

PCIe peripheral component interconnect express

POST

Power-On Self Test

PPM processor power module

PSP

ProLiant Support Pack

RBSU

ROM-Based Setup Utility

RDIMM

Registered Dual In-line Memory Module

RDP

Rapid Deployment Pack

RPS

Redundant power supply

SAS serial attached SCSI

SFF small form-factor

SIM

Systems Insight Manager

Acronyms and abbreviations 122

TMRA recommended ambient operating temperature

UDIMM

Unregistered Dual In-Line Memory Module

UID unit identification

UPS uninterruptible power system

USB universal serial bus

VCA

Version Control Agent

Acronyms and abbreviations 123

Documentation feedback

HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback ( mailto:[email protected]

).

Include the document title and part number, version number, or the URL when submitting your feedback.

Documentation feedback 124

Index

A

access panel 24

acoustics statement for Germany 107

Active Health System 86, 87

ACU (Array Configuration Utility) 86, 93

Advanced ECC memory 50, 92

air baffle 25

airflow requirements 32

AMP (Advanced Memory Protection) 92

AMP modes 92

Array Configuration Utility (ACU) 93

ASR (Automatic Server Recovery) 95

authorized reseller 113

auto-configuration process 91

Automatic Server Recovery (ASR) 95

B

Basic Input/Output System (BIOS) 86, 94

battery 99, 106

bezel 22, 23

BIOS (Basic Input/Output System) 86, 94

BIOS upgrade 86, 94

blue screen event 12

boot options 92

BSMI notice 104

buttons 7

C

cables 83, 102

cabling 83, 85

cache module 68

cache module capacitor pack 67

cache module installation 68

Canadian notice 102

Care Pack 31, 97

Change Control 97 change control and proactive notification 97

Chinese notice 105

compatibility 86

components 7

configuration of system 37, 86

configuring AMP modes 92

connectors 7

contacting HP 113

controller options 66

crash dump analysis 12

D

Declaration of Conformity 102

diagnosing problems 98

diagnostic tools 86, 89, 94, 95

diagnostics utility 89

DIMM installation guidelines 49

DIMM population guidelines 49

DIMM slots 11, 13, 49

DIMMs 47

DIMMs, installation 50

disposal, waste 103

downloading files 113

drive cage, installing 73, 76

drive LEDs 16

drivers 96

DVD-ROM drive 54

DVD-ROM drive, removing 29

DVD-RW drive 54

E

Eight-bay SFF drive cage 73

electrical grounding requirements 33

electrostatic discharge 108

environmental requirements 31, 109

Erase Utility 86, 89

error messages 98

European Union notice 103

expansion boards 59

extending server from rack 25

F

fan cage 27

fans 17, 39, 69

fans, installing 70

fans, removing 26

FBWC capacitor pack 28, 67

FCC (Federal Communications Commission)

notice 101, 102

FCC rating label 101

features 7, 93

Index 125

Federal Communications Commission (FCC)

notice 101, 102

firmware update 90, 96

firmware upgrade utility, troubleshooting 98

firmware, updating 96 firmware, upgrading 96

Foundation Care Services 97

front panel components 7

front panel LEDs 8

G

graphics card option 62

grounding methods 108

grounding requirements 33

H

hard drive blanks 57

hard drive LEDs 16 hard drives, determining status of 16

hard drives, installing 39, 58

hardware options 39 hardware options installation 35, 39

health driver 95

health LEDs 12

help resources 113

HP Care Pack Services 97

HP contact information 113

HP iLO 86

HP iLO Management Engine 86

HP Insight Diagnostics 89

HP Insight Diagnostics survey functionality 89

HP Insight Remote Support software 97

HP Proactive Care 97

HP Smart Update Manager overview 86, 90

HP Support Pack for ProLiant 86, 90

HP technical support 97, 113

HP website 113

I

identification number 101

identifying components 7

iLO (Integrated Lights-Out) 86

IML (Integrated Management Log) 86, 88

Insight Diagnostics 89, 96

installation services 31

Integrated Lights-Out (iLO) 86

Integrated Management Log (IML) 88

Intelligent Provisioning 86, 88

internal cables 83

J

Japanese notice 104

K

Korean notices 104

L

laser devices 105

LEDs, hard drive 16

M

maintenance guidelines 96

media bay blank 30

media device data cabling 84

memory 45, 47, 49 memory configurations 48, 49

memory dump 12

memory subsystem architecture 46

memory, Advanced ECC 92

memory, configuring 49

memory, mirrored 93

memory, online spare 49, 92

mirrored memory 93

N

NMI switch 12

O

online spare memory 49, 92

operating system crash 12

operating system version support 97 operating systems 97 operating systems supported 97

optical drive cage 51

optimum environment 31

Option ROM Configuration for Arrays (ORCA) 86,

94

options 86

options installation 35, 39

ORCA (Option ROM Configuration for Arrays) 86,

94

P

passwords 82

PCI expansion slots 20

phone numbers 113

power cord 106

Index 126

power distribution unit (PDU) 33 power requirements 33

power supplies 56 power supply, installing 56

powering down 20

powering up 20, 37, 91

preparation procedures 20

pro-active notification 97

problem diagnosis 98

processors 39

product features 86

Product ID 92

Q

QuickSpecs 86

R

rack installation 31, 34, 36

rack resources 31

RBSU (ROM-Based Setup Utility) 91, 92

RBSU configuration 91

rear panel components 9

rear panel LEDs 10

recovery key 82

redundant power supply cable connector 19

redundant ROM 95

registering the server 38

regulatory compliance notices 101, 103

required information 113

resetting the system 12

ROM redundancy 95

ROM-Based Setup Utility (RBSU) 82, 86, 91

ROMPaq utility 86, 94, 95

S

safety information 95

SAS drive numbers 15

SAS/SATA backplane 12

scripted installation 90 scripting toolkit 86, 90

serial number 92

server features and options 39

Server mode 86

server specifications 109

server warnings and cautions 34

shipping carton contents 35

site requirements 32

six-bay LFF backplane 76

Smart Update Manager 86, 90

software 96 software upgrades 96

space requirements 32

specifications, server 109

static electricity 108

supported operating systems 97

switches 12

system board battery 99, 106

system board components 11

system components 7

System Erase Utility 89

system maintenance switch 12

system, keeping current 96

Systems Insight Display LED combinations 14

Systems Insight Display LEDs 13

T

Taiwan battery recycling notice 106

technical support 97, 113

technology services 97

telephone numbers 113

temperature requirements 32

tower bezel, removing 20

tower server, setting up 35

TPM (Trusted Platform Module) 79, 80, 82

troubleshooting 98 troubleshooting resources 98 troubleshooting, firmware upgrade utility 98

Trusted Platform Module (TPM) 79, 82

U

UID LED 12

updating the system ROM 95

UPS (uninterruptible power supply) 33

USB support 95

utilities 86, 93

utilities, deployment 86, 90, 91

V

ventilation 31

Version Control 96

Version Control Agent (VCA) 96

Version Control Repository Manager (VCRM) 96

Vietnam compliance marking notice 105

W

website, HP 113

Index 127

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