HP ProLiant ML310e Gen8 Server Maintenance and Service Guide


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HP ProLiant ML310e Gen8 Server Maintenance and Service Guide | Manualzz

HP ProLiant ML310e Gen8 Server

Maintenance and Service Guide

Abstract

This document is for an experienced service technician. It is helpful if you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.

Part Number: 682265-002a

April 2014

Edition: 2

© Copyright 2012, 2014 Hewlett-Packard Development Company, L.P.

The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

Microsoft® and Windows® are U.S. registered trademarks of Microsoft Corporation.

Intel®, Xeon®, Pentium®, Celeron®, and Intel® Core™ are trademarks of Intel Corporation in the U.S. and other countries.

Contents

Customer self repair ...................................................................................................................... 6

Parts only warranty service ............................................................................................................................ 6

Illustrated parts catalog ............................................................................................................... 16

Mechanical components ............................................................................................................................. 16

System components .................................................................................................................................... 19

Removal and replacement procedures ........................................................................................... 24

Required tools ............................................................................................................................................ 24

Safety considerations .................................................................................................................................. 24

Preventing electrostatic discharge ...................................................................................................... 24

Symbols on equipment ...................................................................................................................... 24

Server warnings and cautions ............................................................................................................ 25

Preparation procedures ............................................................................................................................... 26

Remove the tower bezel .................................................................................................................... 26

Power down the server ..................................................................................................................... 26

Drive blank or carrier ................................................................................................................................. 27

Storage drive ............................................................................................................................................. 28

Non-hot-plug drive............................................................................................................................ 28

Hot-plug drive .................................................................................................................................. 29

Hot-plug power supply ................................................................................................................................ 30

Access panel ............................................................................................................................................. 31

Air baffle ................................................................................................................................................... 32

Optical drive ............................................................................................................................................. 32

Drive cage ................................................................................................................................................ 33

Drive cage bracket or backplane ................................................................................................................. 34

Front I/O module ....................................................................................................................................... 36

Front system fan ......................................................................................................................................... 37

DIMMs ...................................................................................................................................................... 38

General DIMM slot population guidelines ........................................................................................... 38

Removing a DIMM ........................................................................................................................... 38

Heatsink .................................................................................................................................................... 39

Processor................................................................................................................................................... 41

Expansion board ........................................................................................................................................ 44

Flash-backed write cache procedures ........................................................................................................... 45

FBWC module ................................................................................................................................. 45

Capacitor pack ................................................................................................................................ 46

Recovering data from the flash-backed write cache .............................................................................. 48

System battery ........................................................................................................................................... 49

Rear system fan .......................................................................................................................................... 50

Dedicated iLO management port ................................................................................................................. 50

Enabling the dedicated iLO management port ..................................................................................... 51

Non-hot-plug power supply ......................................................................................................................... 51

RPS backplane module ............................................................................................................................... 52

RPS cage ................................................................................................................................................... 53

System board ............................................................................................................................................ 54

HP Trusted Platform Module......................................................................................................................... 61

Contents 3

Troubleshooting .......................................................................................................................... 62

Troubleshooting resources ........................................................................................................................... 62

Diagnostic tools .......................................................................................................................... 63

HP Insight Diagnostics ................................................................................................................................ 63

HP Insight Diagnostics survey functionality .......................................................................................... 63

HP Insight Remote Support software ............................................................................................................. 63

HP ROM-Based Setup Utility ........................................................................................................................ 64

Integrated Management Log ........................................................................................................................ 64

USB support and functionality ...................................................................................................................... 65

USB support .................................................................................................................................... 65

Internal USB functionality .................................................................................................................. 65

External USB functionality ................................................................................................................. 65

Automatic Server Recovery .......................................................................................................................... 65

Component identification ............................................................................................................. 66

Front panel components .............................................................................................................................. 66

Front panel LEDs and buttons ....................................................................................................................... 67

Rear panel components .............................................................................................................................. 68

Rear panel LEDs and buttons ....................................................................................................................... 69

System board components .......................................................................................................................... 70

DIMM slot locations .......................................................................................................................... 71

PCIe expansion slot definitions .......................................................................................................... 71

System maintenance switch ............................................................................................................... 71

NMI functionality ............................................................................................................................. 72

Drive numbering ........................................................................................................................................ 73

Hot-plug drive LED definitions ...................................................................................................................... 74

FBWC module LED definitions ..................................................................................................................... 75

Fan locations ............................................................................................................................................. 76

T-10/T-15 Torx screwdriver ......................................................................................................................... 76

Cabling ..................................................................................................................................... 77

Cabling overview ....................................................................................................................................... 77

Front panel cabling .................................................................................................................................... 77

System fan cabling ..................................................................................................................................... 78

Storage cabling ......................................................................................................................................... 78

Four-bay LFF drive cabling ................................................................................................................ 78

Eight-bay SFF drive cabling ............................................................................................................... 80

Media drive cabling ................................................................................................................................... 81

Power supply cabling ................................................................................................................................. 82

Nonredundant power supply cabling ................................................................................................. 82

Redundant power supply cabling ....................................................................................................... 83

Capacitor pack cabling .............................................................................................................................. 83

Specifications ............................................................................................................................. 84

Environmental specifications ........................................................................................................................ 84

Server specifications ................................................................................................................................... 84

Power supply specifications ......................................................................................................................... 84

HP 350 W 4U Integrated Power Supply ............................................................................................. 85

HP 460 W CS Gold Hot-plug Power Supply (92% efficiency) ............................................................... 85

Hot-plug power supply calculations .............................................................................................................. 85

Support and other resources ........................................................................................................ 86

Before you contact HP ................................................................................................................................ 86

HP contact information ................................................................................................................................ 86

Contents 4

Acronyms and abbreviations ........................................................................................................ 87

Documentation feedback ............................................................................................................. 90

Index ......................................................................................................................................... 91

Contents 5

Customer self repair

HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts:

Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.

Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty,

HP requires that an authorized service provider replace the part. These parts are identified as "No" in the

Illustrated Parts Catalog.

Based on availability and where geography permits, CSR parts will be shipped for next business day delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits.

If assistance is required, you can call the HP Technical Support Center and a technician will help you over the telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material. Failure to return the defective part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping and part return costs and determine the courier/carrier to be used.

For more information about HP's Customer Self Repair program, contact your local service provider. For the

North American program, refer to the HP website ( http://www.hp.com/go/selfrepair ).

Parts only warranty service

Your HP Limited Warranty may include a parts only warranty service. Under the terms of parts only warranty service, HP will provide replacement parts free of charge.

For parts only warranty service, CSR part replacement is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.

Réparation par le client (CSR)

Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:

Customer self repair 6

Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.

REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.

Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le

Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou le transporteur à utiliser.

Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP

( http://www.hp.com/go/selfrepair ).

Service de garantie "pièces seules"

Votre garantie limitée HP peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de rechange fournies par HP ne sont pas facturées.

Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez à

HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Riparazione da parte del cliente

Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza

HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione. Vi sono due categorie di parti CSR:

Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.

Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.

Customer self repair 7

In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP.

Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.

Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il programma in Nord America fare riferimento al sito Web HP ( http://www.hp.com/go/selfrepair ).

Servizio di garanzia per i soli componenti

La garanzia limitata HP può includere un servizio di garanzia per i soli componenti. Nei termini di garanzia del servizio per i soli componenti, HP fornirà gratuitamente le parti di ricambio.

Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione da parte del cliente. Se il cliente invece richiede la sostituzione ad HP, dovrà sostenere le spese di spedizione e di manodopera per il servizio.

Customer Self Repair

HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere

Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der

Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses

Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:

Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den

Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen

Service berechnet.

Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer

Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche

Kosten anfallen.

HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des

Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.

CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert.

Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen

Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen

Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen

Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das

Customer self repair 8

defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer

Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den

Kurier-/Frachtdienst.

Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter

( http://www.hp.com/go/selfrepair ).

Parts-only Warranty Service (Garantieservice ausschließlich für Teile)

Ihre HP Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice ausschließlich für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt HP Ersatzteile kostenlos zur

Verfügung.

Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet.

Reparaciones del propio cliente

Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self

Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente

CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:

Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a

HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el catálogo ilustrado de componentes.

Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no

Customer self repair 9

enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.

Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente ( http://www.hp.com/go/selfrepair ).

Servicio de garantía exclusivo de componentes

La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes. Según las condiciones de este servicio exclusivo de componentes, HP le facilitará los componentes de repuesto sin cargo adicional alguno.

Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por parte del usuario (CSR). Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

Customer Self Repair

Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee categorieën CSR-onderdelen:

Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.

Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.

OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen.

Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service

Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.

Customer self repair 10

Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website ( http://www.hp.com/go/selfrepair ).

Garantieservice "Parts Only"

Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.

Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.

Reparo feito pelo cliente

Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se, durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente.

Existem duas categorias de peças CSR:

Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado.

Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis.

A peça com defeito deve ser enviada com a documentação correspondente no material de transporte fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a

HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço postal a ser utilizado.

Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP

( http://www.hp.com/go/selfrepair ).

Serviço de garantia apenas para peças

A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa.

Customer self repair 11

No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Customer self repair 12

Customer self repair 13

Customer self repair 14

Customer self repair 15

Illustrated parts catalog

Mechanical components

Item Description

1

2

3

4

5

6

Access panel

RPS cage

Four-bay LFF drive cage

SFF drive blank

LFF drive blank

Air baffle

Spare part number

686751-001

686665-001

686745-001

670033-001

675039-001

686752-001

Customer self repair

(on page 6 )

Mandatory

1

Mandatory

1

Mandatory 1

Mandatory 1

Mandatory 1

Mandatory 1

1

Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.

2 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

3 No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

1

Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Illustrated parts catalog 16

2

Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.

3 No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré.

1 Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.

2

Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

3 No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un “No” nel Catalogo illustrato dei componenti.

1 Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.

2 Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer

Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.

3

No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.

„Nein“ gekennzeichnet.

1 Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

2 Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

3 No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario

1 haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.

Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.

2

Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.

3 No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de

1 garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

2 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

3

No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”

(Não), no catálogo de peças ilustrado.

Illustrated parts catalog 17

Illustrated parts catalog 18

System components

8

9

10

11

12

13

7

Item Description

Optical drives a) SATA DVD-ROM drive b) SATA DVD-RW drive*

Spare part number

Customer self repair

(on page 6 )

624591-001 Mandatory 1

624592-001 Mandatory

1

Front I/O module 691939-001 Mandatory 1

Eight-bay SFF hot-plug drive cage assembly 686753-001 Mandatory 1

Eight-bay SFF hot-plug drive backplane 686759-001 Mandatory

1

Four-bay LFF hot-plug drive backplane

Four-bay LFF non-hot-plug drive bracket

Storage drives

686756-001 Mandatory

1

686746-001 Mandatory 1

— —

LFF drives (8.89 cm, 3.5 in) — —

Non-hot-plug drives, SATA a) 500 GB, 6G hard drive b) 1 TB, 6G hard drive* c) 2 TB, 6G hard drive*

— —

659571-001 Mandatory 1

659569-001 Mandatory

1

659570-001 Mandatory 1

Illustrated parts catalog 19

Item Description d) 3 TB, 6G hard drive*

Non-hot-plug drives, SAS a) 450 GB, 6G hard drive* b) 600 GB, 6G hard drive*

Hot-plug drives, SATA a) 100 GB, 3G MLC solid state drive* b) 200 GB, 3G MLC solid state drive* c) 400 GB, 3G MLC solid state drive* d) 500 GB, 6G hard drive* e) 1 TB, 6G hard drive* f) 2 TB, 6G hard drive* g) 3 TB, 6G hard drive*

Hot-plug drives, SAS a) 450 GB, 6G hard drive* b) 600 GB, 6G hard drive* c) 1 TB, 6G hard drive* d) 2 TB, 6G hard drive* e) 3 TB, 6G hard drive*

SFF drives (6.35 cm, 2.5 in)

Hot-plug drives, SATA a) 100 GB, 3G MLC solid state drive* b) 200 GB, 3G MLC solid state drive* c) 400 GB, 3G MLC solid state drive* d) 500 GB, 6G hard drive* e) 1 TB, 6G hard drive*

Hot-plug drives, SAS a) 146 GB, 6G hard drive* b) 200 GB, 6G SLC solid state drive* c) 300 GB, 6G hard drive* d) 300 GB, 6G hard drive* e) 400 GB, 6G SLC solid state drive* f) 450 GB, 6G hard drive* g) 500 GB, 6G hard drive* h) 600 GB, 6G hard drive* i) 800 GB, 6G MLC solid state drive*

Spare part number

Customer self repair

(on page 6 )

628183-001 Mandatory 1

— —

517353-001 Mandatory 1

517355-001 Mandatory 1

— —

653968-001 Mandatory 1

653969-001 Mandatory 1

653970-001 Mandatory 1

658103-001 Mandatory 1

657739-001 Mandatory 1

658102-001 Mandatory 1

628182-001 Mandatory 1

— —

653951-001 Mandatory

1

653952-001 Mandatory 1

653947-001 Mandatory 1

653948-001 Mandatory 1

653959-001 Mandatory 1

— —

— —

653965-001 Mandatory 1

653966-001 Mandatory 1

653967-001 Mandatory 1

656107-001 Mandatory

1

656108-001 Mandatory 1

— —

653950-001 Mandatory 1

653961-001 Mandatory 1

653955-001 Mandatory 1

653960-001 Mandatory

1

653962-001 Mandatory 1

653956-001 Mandatory 1

653953-001 Mandatory 1

653957-001 Mandatory 1

653964-001 Mandatory 1

Illustrated parts catalog 20

14

15

17

18

19

20

21

Item Description

16

Spare part number

Customer self repair

(on page 6 )

653971-001 Mandatory 1 j) 900 GB, 6G hard drive* k) 1 TB, 6G hard drive* 653954-001 Mandatory 1

Front system fan (80 x 38 mm)

System board assembly (includes alcohol pad and thermal compound)

Processors (includes alcohol pad and thermal compound) a) 2.3-GHz Intel Xeon E3-1220LV2 processor,

2C, 3 MB, 17 W b) 2.5-GHz Intel Celeron G540 processor,

2C, 2 MB, 65 W* c) 2.6-GHz Intel Celeron G1610 processor,

2C 2 MB 55 W* d) 2.7-GHz Intel Celeron G1620 processor,

2C 2 MB 55 W* e) 3.1-GHz Intel Pentium G2020 processor,

2C 3 MB 55 W* f) 3.1-GHz Intel Pentium G2120 processor,

2C, 3 MB, 65 W* g) 3.1-GHz Intel Xeon E3-1220V2 processor,

4C, 8 MB, 69 W* h) 3.2-GHz Intel Pentium G2130 processor,

2C 3 MB 55 W* i) 3.3-GHz Intel Xeon i3-3220 processor, 2C,

3 MB, 55 W* j) 3.3-GHz Intel Xeon E3-1230V2 processor,

4C, 8 MB, 69 W* k) 3.4-GHz Intel Xeon i3-3240 processor, 2C,

3 MB, 55 W* l) 3.4-GHz Intel Xeon E3-1240V2 processor,

4C, 8 MB, 69 W* m) 3.5-GHz Intel Xeon E3-1270V2 processor,

4C, 8 MB, 69 W* n) 3.6-GHz Intel Xeon E3-1280V2 processor,

4C, 8 MB, 69 W*

Heatsink

DIMMs a) 2 GB, single-rank x8 PC3-12800E-11

686749-001 Mandatory 1

686757-001 Optional 2

— —

686687-001 Optional 2

665119-001 Optional 2

715893-001 Optional

2

715894-001 Optional 2

715897-001 Optional 2

703516-001 Optional 2

686686-001 Optional 2

715898-001 Optional

2

701538-001 Optional 2

686685-001 Optional 2

701537-001 Optional

2

686684-001 Optional 2

686683-001 Optional 2

686682-001 Optional

2

686741-001 Optional

664633-001

2

Mandatory 1 b) 2 GB, single-rank x8 PC3L-10600E-9* 664694-001 Mandatory

1 c) 4 GB, dual-rank x8 PC3-12800E-11* d) 4 GB, dual-rank x8 PC3L-10600E-9* e) 8 GB, dual-rank x8 PC3-12800E-11*

664034-001 Mandatory 1

664695-001 Mandatory 1

684035-001 Mandatory

1 f) 8 GB, dual-rank x8 PC3L-10600E-9* 664696-001 Mandatory 1

Rear system fan (92 x 32 mm)

Dedicated iLO management port module

686748-001

686742-001

Mandatory

Mandatory

1

1

HP 350 W 4U Integrated Power Supply Kit 686761-001 Mandatory 1

Illustrated parts catalog 21

Item Description

22

23

Spare part number

Customer self repair

(on page 6 )

511777-001 Mandatory 1 HP 460 W CS Gold Hot Plug Power Supply Kit

(92% efficiency)

RPS backplane module

Cables

686744-001 Mandatory 1

— —

24

25

26

8-pin to 4-pin power adapter cable*

500-mm Mini-SAS cable*

Mini-SAS to SATA cable assembly (for LFF drive cage)*

686755-001 Mandatory 1

647756-001 Mandatory 1

686747-001 Mandatory

1

1

* Not shown

Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.

2 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

3 No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

1 Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

2 Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.

3

No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré.

1

Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.

2 Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

3 No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un “No” nel Catalogo illustrato dei componenti.

1 Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.

2 Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer

Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.

3 No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw.

„Nein“ gekennzeichnet.

1 Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

2

Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su

Illustrated parts catalog 22

sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

3 No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario

1 haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.

Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.

2

Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.

3 No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de

1 garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

2

Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

3 No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No”

(Não), no catálogo de peças ilustrado.

Illustrated parts catalog 23

Removal and replacement procedures

Required tools

You need the following items for some procedures:

T-10/T-15 Torx screwdriver (on page 76 )

Flathead screwdriver

HP Insight Diagnostics (on page 63 )

Safety considerations

Before performing service procedures, review all the safety information.

Preventing electrostatic discharge

To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.

To prevent electrostatic damage:

Avoid hand contact by transporting and storing products in static-safe containers.

Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.

Place parts on a grounded surface before removing them from their containers.

Avoid touching pins, leads, or circuitry.

Always be properly grounded when touching a static-sensitive component or assembly.

Symbols on equipment

The following symbols may be placed on equipment to indicate the presence of potentially hazardous conditions.

This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel.

WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.

This symbol indicates the presence of electric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason.

WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure.

Removal and replacement procedures 24

This symbol on an RJ-45 receptacle indicates a network interface connection.

WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle.

This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists.

WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching.

This symbol indicates that the component exceeds the recommended weight for one individual to handle safely.

WARNING: To reduce the risk of personal injury or damage to the equipment, observe local occupational health and safety requirements and guidelines for manual material handling.

These symbols, on power supplies or systems, indicate that the equipment is supplied by multiple sources of power.

WARNING: To reduce the risk of injury from electric shock, remove all power cords to completely disconnect power from the system.

Server warnings and cautions

WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the equipment:

Observe local occupational health and safety requirements and guidelines for manual material handling.

• Get help to lift and stabilize the product during installation or removal, especially when the product is not fastened to the rails. HP recommends that a minimum of two people are required for all rack server installations. A third person may be required to help align the server if the server is installed higher than chest level.

• Use caution when installing the server in or removing the server from the rack; it is unstable when not fastened to the rails.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.

CAUTION: Protect the server from power fluctuations and temporary interruptions with a regulating uninterruptible power supply. This device protects the hardware from damage caused by power surges and voltage spikes and keeps the system in operation during a power failure.

CAUTION: Do not operate the server for long periods with the access panel open or removed.

Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

Removal and replacement procedures 25

Preparation procedures

To access some components and perform certain service procedures, perform one or more of the following procedures:

Unlock the tower bezel.

Remove the tower bezel (on page 26 ).

Power down the server (on page 26 ).

Before removing the server from a rack or a non-hot-plug component from the server, power down the server.

Remove the access panel (" Access panel " on page 31 ).

Remove the tower bezel

1.

2.

Unlock and open the tower bezel.

Pull the bezel away from the front chassis.

Power down the server

Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs.

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.

IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the system.

Removal and replacement procedures 26

To power down the server, use one of the following methods:

Press and release the Power On/Standby button.

This method initiates a controlled shutdown of applications and the OS before the server enters standby mode.

Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter standby mode.

This method forces the server to enter standby mode without properly exiting applications and the OS.

If an application stops responding, you can use this method to force a shutdown.

Use a virtual power button selection through iLO.

This method initiates a controlled remote shutdown of applications and the OS before the server enters standby mode.

Before proceeding, verify the server is in standby mode by observing that the system power LED is amber.

Drive blank or carrier

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1.

2.

Unlock and open the tower bezel.

Do one of the following: o

In a non-hot-plug drive configuration, remove the drive carrier.

To replace the drive carrier, slide the component into the bay until it clicks.

Removal and replacement procedures 27

o

In a hot-plug drive configuration, remove the drive blank.

To replace the LFF drive blank, slide the component into the bay until it clicks.

To replace the SFF drive blank, while pressing the release latch, slide the component into the bay until it is fully seated.

Storage drive

Non-hot-plug drive

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1.

Back up all server data on the drive.

2.

Power down the server (on page 26 ).

3.

4.

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Unlock and open the tower bezel.

Removal and replacement procedures 28

5.

Remove the drive.

6.

Remove the drive from the carrier.

To replace the component, reverse the removal procedure.

Hot-plug drive

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1.

Back up all server data on the drive.

2.

3.

Determine the status of the drive from the drive LED definitions (" Hot-plug drive LED definitions " on page

74 ).

Unlock and open the tower bezel.

Removal and replacement procedures 29

4.

Remove the drive.

To replace the component, reverse the removal procedure.

Hot-plug power supply

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1.

Power down the server (on page 26 ).

WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply blank to cool before touching it.

2.

Remove the power supply.

Power redundancy requires the presence of two power supply modules in the system.

Removal and replacement procedures 30

CAUTION: The default and redundant power supplies in the server must have the same output power capacity. Verify that all power supplies have the same part number and label color. The system becomes unstable and might shut down when it detects mismatched power supplies.

To replace the component, reverse the removal procedure.

Access panel

To remove the component:

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.

1.

2.

3.

4.

5.

Power down the server (on page 26 ).

Remove all power: a. b.

Disconnect each power cord from the power source.

Disconnect each power cord from the server.

Unlock the tower bezel.

Place the server on its side.

Remove the access panel: a.

Loosen the access panel thumbscrew. b. c.

Slide the access panel back.

Lift the access panel away from the chassis.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 31

Air baffle

To remove the component:

CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.

1.

2.

Power down the server (on page 26 ).

Remove all power:

3.

4.

5. a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Unlock the tower bezel.

Remove the access panel (" Access panel " on page 31 ).

Remove the air baffle.

To replace the component, reverse the removal procedure.

Optical drive

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1.

Power down the server (on page 26 ).

2.

Remove all power:

3.

4. a. b.

Disconnect each power cord from the power source.

Disconnect each power cord from the server.

Unlock and open the tower bezel.

Remove the access panel (" Access panel " on page 31 ).

Removal and replacement procedures 32

5.

6.

Disconnect the SATA and power cables from the optical drive.

Remove the optical drive.

To replace the component, reverse the removal procedure.

Drive cage

To remove the component:

1.

2.

Power down the server (on page 26 ).

Remove all power: a.

Disconnect each power cord from the power source.

3.

4.

5. b.

Disconnect each power cord from the server.

Remove the tower bezel (on page 26 ).

Remove the access panel (" Access panel " on page 31 ).

If the drives are connected to a storage controller card, remove the air baffle.

6.

7.

8.

Remove all installed drives (" Storage drive " on page 28 ).

Disconnect the drive cage cables: a.

Disconnect the Mini-SAS cable from the system board or from the storage controller option. b.

Disconnect the drive power cable from the 10-pin power supply connector.

Remove the drive cage:

Removal and replacement procedures 33

o

Four-bay LFF drive cage o

Eight-bay SFF drive cage

To replace the component, reverse the removal procedure.

To convert the four-bay non-hot-plug drive cage to a hot-plug model, remove the cage bracket, and then

install the hot-plug backplane option before installing the cage back to the server (" Drive cage bracket or backplane " on page 34 ).

Drive cage bracket or backplane

To remove the component:

1.

Power down the server (on page 26 ).

2.

Remove all power: a.

Disconnect each power cord from the power source.

Removal and replacement procedures 34

3.

4.

5.

6.

7. b.

Disconnect each power cord from the server.

Remove the tower bezel (on page 26 ).

Remove the access panel (" Access panel " on page 31 ).

Remove all installed drives (" Storage drive " on page 28 ).

Disconnect the drive cage cables: a.

Disconnect the Mini-SAS cable from the system board or from the storage controller option. b.

Disconnect the drive power cable from the 10-pin power supply connector.

Remove the LFF drive cage assembly.

8.

Do one of the following:

For image clarity, the Mini-SAS and power cables attached to the drive cage are not shown in the following figures. o

For a non-hot-plug drive cage, loosen the bracket thumbscrew, and then remove the bracket assembly from the drive cage.

Removal and replacement procedures 35

o

For a hot-plug drive cage, loosen the backplane thumbscrew, and then remove the backplane assembly from the drive cage.

To replace the component, reverse the removal procedure.

Front I/O module

To remove the component:

1.

Power down the server (on page 26 ).

2.

Remove all power:

3.

4.

5.

6. a. b.

Disconnect each power cord from the power source.

Disconnect each power cord from the server.

Unlock and open the tower bezel.

Remove the access panel (" Access panel " on page 31 ).

Remove the air baffle (" Air baffle " on page 32 ).

Disconnect the front USB and LED cables from the system board (" Front panel cabling " on page 77 ).

Removal and replacement procedures 36

7.

Remove the front I/O module.

To replace the component, reverse the removal procedure.

Front system fan

To remove the component:

1.

Power down the server (on page 26 ).

2.

3.

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Unlock the tower bezel.

4.

5.

6.

Remove the access panel (" Access panel " on page 31 ).

Remove the air baffle (" Air baffle " on page 32 ).

Disconnect the fan cable.

Removal and replacement procedures 37

7.

Press the release latch, and then remove the fan module.

To replace the component, reverse the removal procedure.

DIMMs

General DIMM slot population guidelines

The server has four memory slots.

The server supports two channels with two DIMM slots per channel. o o

Memory channel 1 consists of the two DIMMs that are closest to the processor.

Memory channel 2 consists of the two DIMMs that are farthest from the processor.

White DIMM slot indicates the first slot of a channel (2-A, 4-B).

Memory speed support depends on the type of processor installed. See the technical specification of the installed processor for more information.

The server supports up to 1600 MT/s ECC UDIMMs.

The server supports up to 32 GB (4x8 GB) UDIMMs.

The server does not support: o

RDIMMs o o

Non-ECC UDIMMs

When installing DIMMs: o

Populate the DIMM slots in this sequence: 2-A, 4-B, 1-C, 3-D.

Use HP-qualified UDIMMs.

Removing a DIMM

1.

Power down the server (on page 26 ).

Removal and replacement procedures 38

3.

4.

5.

6.

7.

2.

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Unlock the tower bezel.

Remove the access panel (" Access panel " on page 31 ).

Remove the air baffle (" Air baffle " on page 32 ).

Open the DIMM slot latches.

Remove the DIMM.

To replace the component, reverse the removal procedure.

Heatsink

To remove the component:

1.

Power down the server (on page 26 ).

2.

Remove all power:

3.

4.

5. a. b.

Disconnect each power cord from the power source.

Disconnect each power cord from the server.

Unlock the tower bezel.

Remove the access panel (" Access panel " on page 31 ).

Remove the air baffle (" Air baffle " on page 32 ).

6.

Remove the heatsink: a.

Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. b.

Completely loosen all screws in the same sequence.

Removal and replacement procedures 39

c.

Remove the heatsink from the processor backplate.

To replace the component:

1.

Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing.

2.

Remove the thermal interface protective cover from the heatsink.

3.

CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warranty of the board.

Install the heatsink: a.

Position the heatsink using the guide pin on the processor backplate. b.

Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws.

Removal and replacement procedures 40

c.

Finish the installation by completely tightening the screws in the same sequence.

4.

5.

6.

7.

8.

9.

Install the air baffle (" Air baffle " on page 32 ).

Install the access panel.

Lock the tower bezel.

Connect each power cord to the server.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Processor

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this server.

IMPORTANT: If installing a processor with a faster speed, update the system ROM before installing the processor.

To remove the component:

1.

Power down the server (on page 26 ).

2.

Remove all power: a.

Disconnect each power cord from the power source.

3.

4.

5. b.

Disconnect each power cord from the server.

Unlock the tower bezel.

Remove the access panel (" Access panel " on page 31 ).

Remove the air baffle (" Air baffle " on page 32 ).

Removal and replacement procedures 41

7.

8.

6.

Remove the heatsink (" Heatsink " on page 39 ).

CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area.

CAUTION: The pins on the processor socket are very fragile. Any damage to them may require replacing the system board.

Open the processor locking lever, and then open the processor retaining bracket.

Grasp the processor by the edges, and then lift it out of the socket.

To replace the component:

CAUTION: Failure to completely open the processor locking lever prevents the processor from seating during installation, leading to hardware damage.

CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board:

• Do not touch the processor socket contacts.

Do not tilt or slide the processor when lowering the processor into the socket.

1.

Install the processor. Use the notches on both sides of the processor to properly align it into the socket.

Removal and replacement procedures 42

2.

CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance. Forcing the lever closed can damage the processor and socket, requiring system board replacement.

Close the processor retaining bracket, and then secure the processor locking lever.

3.

4.

Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing.

Apply all the grease to the top of the processor in the following pattern to ensure even distribution.

5.

CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warranty of the board.

Install the heatsink: a. b.

Position the heatsink using the guide pin on the processor backplate.

Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws.

Removal and replacement procedures 43

c.

Finish the installation by completely tightening the screws in the same sequence.

6.

7.

8.

9.

10.

11.

Install the air baffle.

Install the access panel.

Lock the tower bezel.

Connect each power cord to the server.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Expansion board

To remove the component:

1.

2.

Power down the server (on page 26 ).

Remove all power: a. b.

Disconnect each power cord from the power source.

Disconnect each power cord from the server.

3.

4.

5.

6.

7.

8.

Unlock the tower bezel.

Remove the access panel (" Access panel " on page 31 ).

Remove the air baffle (" Air baffle " on page 32 ).

Disconnect all cables connected to the expansion board.

Remove the expansion slot cover retainer.

If removing a full-length expansion board, remove the board retainer securing it.

Removal and replacement procedures 44

9.

Remove the expansion board.

To replace the component, reverse the removal procedure.

Flash-backed write cache procedures

The following types of procedures are provided for the FBWC option:

Removal and replacement of failed components: o o

Removing the cache module (" FBWC module " on page 45 )

Removing the capacitor pack (" Capacitor pack " on page 46 )

Recovery of cached data from a failed server (" Recovering data from the flash-backed write cache " on page 48 )

CAUTION: Do not detach the cable that connects the battery pack or capacitor pack to the cache module. Detaching the cable causes all data in the cache module to be lost.

FBWC module

CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMMs.

Do not use the controller with cache modules designed for other controller models, because the controller can malfunction and you can lose data. Also, do not transfer this cache module to an unsupported controller model, because you can lose data.

CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up.

To remove the component:

1.

Power down the server (on page 26 ).

2.

Remove all power: a.

Disconnect each power cord from the power source.

Removal and replacement procedures 45

3.

4.

5.

6. b.

Disconnect each power cord from the server.

Unlock and open the tower bezel.

Remove the access panel (" Access panel " on page 31 ).

Remove the air baffle (" Air baffle " on page 32 ).

CAUTION: When connecting or disconnecting the capacitor pack cable, the connectors on the cache module and cable are susceptible to damage. Avoid excessive force and use caution to avoid damage to these connectors.

Disconnect the capacitor pack cable from the cache module.

7.

Remove the cache module.

To replace the component, reverse the removal procedure.

Capacitor pack

Removal and replacement procedures 46

CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up.

To remove the component:

1.

Power down the server (on page 26 ).

2.

3.

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Unlock the tower bezel.

4.

5.

6.

7.

Remove the access panel (" Access panel " on page 31 ).

Remove the air baffle (" Air baffle " on page 32 ).

If the existing cache module is connected to a capacitor pack, observe the FBWC module LEDs: o

If a backup is in progress, wait for the backup to complete. o

If the backup is complete, or if the cache has failed, remove the controller from the server, and then continue with the next step.

Disconnect the capacitor pack cable from the cache module.

Removal and replacement procedures 47

8.

Remove the capacitor pack.

To replace the component, reverse the removal procedure.

Recovering data from the flash-backed write cache

If the server fails, use the following procedure to recover data temporarily stored in the FBWC.

CAUTION: Before starting this procedure, read the information about protecting against

electrostatic discharge (" Preventing electrostatic discharge " on page 24 ).

1.

2.

3.

4.

5.

Perform one of the following: o

Set up a recovery server using an identical server model. Do not install any internal drives or FBWC in this server. (HP recommends this option.) o

Find a server that has enough empty drive bays to accommodate all the drives from the failed server and that meets all the other requirements for drive and array migration.

Power down the failed server (" Power down the server " on page 26 ).

Transfer the drives from the failed server to the recovery server.

Perform one of the following: o

If the array controller has failed, remove the cache module and capacitor pack from the failed array controller, and install the cache module and capacitor pack on an identical array controller model in the recovery server. o

If the server has failed, remove the controller, cache module, and capacitor pack from the failed server, and install the controller, cache module, and capacitor pack in the recovery server.

Power up the recovery server. If there was data in the cache at the time of the controller or server failure, a 1792 POST message appears, stating that valid data was flushed from the cache. This data is now stored on the drives in the recovery server. You can now transfer the drives (and controller, if one is used) to another server.

If the drives are migrated to different drive positions or there are volumes present in the recovery server, a 1724 POST message appears, stating that logical drive configuration has been updated automatically.

Removal and replacement procedures 48

System battery

If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.

WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury:

Do not attempt to recharge the battery.

• Do not expose the battery to temperatures higher than 60°C (140°F).

• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.

Replace only with the spare designated for this product.

To remove the component:

1.

Power down the server (on page 26 ).

2.

Remove all power: a.

Disconnect each power cord from the power source.

3.

4.

5.

6. b.

Disconnect each power cord from the server.

Unlock the tower bezel.

Remove the access panel (" Access panel " on page 31 ).

Locate the battery on the system board (" System board components " on page 70 ).

Remove the battery.

IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU.

To replace the component, reverse the removal procedure.

For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.

Removal and replacement procedures 49

Rear system fan

To remove the component:

1.

2.

Power down the server (on page 26 ).

Remove all power: a.

Disconnect each power cord from the power source.

3.

4.

5.

6.

7.

8. b.

Disconnect each power cord from the server.

Unlock the tower bezel.

Remove the access panel (" Access panel " on page 31 ).

Remove the air baffle (" Air baffle " on page 32 ).

Remove any existing expansion board that blocks access to the rear system fan connector.

Disconnect the fan cable.

Press and hold the fan latch, and then remove the fan.

To replace the component, reverse the removal procedure.

Dedicated iLO management port

To remove the component:

1.

Power down the server (on page 26 ).

2.

3.

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Unlock the tower bezel.

4.

5.

6.

Remove the access panel (" Access panel " on page 31 ).

Remove the air baffle (" Air baffle " on page 32 ).

Remove the rear system fan (" Rear system fan " on page 50 ).

Removal and replacement procedures 50

7.

Remove the iLO module from the chassis.

To replace the component, reverse the removal procedure.

Enabling the dedicated iLO management port

The onboard NIC 1/shared iLO connector is set as the default system iLO port.

To enable the installed dedicated iLO module:

1.

During the server startup sequence after module installation, to access iLO RBSU, press the F8 key.

2.

3.

4.

5.

Select the Network menu.

Click the Network Interface Adapter field.

To change the setting to ON, press the spacebar.

To save the new settings, press the F10 key.

6.

7.

Select the File menu, and then to close iLO RBSU, click Exit.

To confirm exiting iLO RBSU, click OK. The server automatically reboots.

IMPORTANT: If the iLO RBSU settings are reset to the default values, access to the machine will be lost. Access the physical machine, and then set the Network Interface Adapter field to ON.

Non-hot-plug power supply

To remove the component:

1.

Power down the server (on page 26 ).

2.

Remove all power: a.

Disconnect each power cord from the power source.

3.

4. b.

Disconnect each power cord from the server.

Unlock the tower bezel.

Remove the access panel (" Access panel " on page 31 ).

Removal and replacement procedures 51

5.

6.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply blank to cool before touching it.

Disconnect the power supply cables from the drive cage and the system board.

Remove the power supply.

To replace the component, reverse the removal procedure.

RPS backplane module

To remove the component:

1.

Power down the server (on page 26 ).

2.

Remove all power: a.

Disconnect each power cord from the power source.

3.

4.

5.

6.

7. b.

Disconnect each power cord from the server.

Unlock and open the tower bezel.

Remove the access panel (" Access panel " on page 31 ).

Remove the EMI shield from the lower media bay.

Remove the optical drive from the upper media bay (" Optical drive " on page 32 ).

Disconnect the power supply cables from the drive cage and the system board.

Removal and replacement procedures 52

8.

Remove the RPS backplane module.

To replace the component, reverse the removal procedure.

RPS cage

To remove the component:

1.

Power down the server (on page 26 ).

2.

3.

Remove all power: a.

Disconnect each power cord from the power source. b.

Disconnect each power cord from the server.

Unlock the tower bezel.

4.

5.

6.

7.

Remove the access panel (" Access panel " on page 31 ).

Remove the air baffle (" Air baffle " on page 32 ).

Disconnect the power supply cables from the system board and the drives.

Remove the EMI shield from the lower media bay.

8.

9.

10.

Remove the optical drive from the upper media bay (" Optical drive " on page 32 ).

Remove the hot-plug power supplies (" Hot-plug power supply " on page 30 ).

Remove the RPS backplane module (" RPS backplane module " on page 52 ).

Removal and replacement procedures 53

11.

Remove the power supply cage.

To replace the component, reverse the removal procedure.

System board

CAUTION: To avoid ESD damage, when removing electrostatic-sensitive components from the failed system board, place the components on a static-dissipating work surface or inside separate antistatic bags.

To remove the system board:

1.

Power down the server (on page 26 ).

2.

Remove all power: a.

Disconnect each power cord from the power source.

3.

4. b.

Disconnect each power cord from the server.

Unlock the tower bezel.

Remove the access panel (" Access panel " on page 31 ).

5.

6.

7.

8.

Remove the air baffle (" Air baffle " on page 32 ).

Remove the rear system fan (" Rear system fan " on page 50 ).

Remove the capacitor pack (" Capacitor pack " on page 46 ).

Remove the heatsink: a. b.

Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws.

Completely loosen all screws in the same sequence.

Removal and replacement procedures 54

c.

Remove the heatsink from the processor backplate.

CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area.

9.

10.

Open the processor locking lever, and then open the processor retaining bracket.

Grasp the processor by the edges, and then lift it out of the socket.

11.

12.

13.

14.

15.

Remove all DIMMs (" Removing a DIMM " on page 38 ).

Remove all expansion boards (" Expansion board " on page 44 ).

If installed, remove the dedicated iLO module (" Dedicated iLO management port " on page 50 ).

Disconnect all cables connected to the system board.

Remove the system board: a.

Remove the system board screws.

Removal and replacement procedures 55

b.

Lift the system board out of the chassis.

To replace the system board:

1.

Install the system board.

2.

3.

4.

5.

Connect all cables disconnected from the failed system board.

Install the DIMMs.

If removed, install the dedicated iLO management port.

Install the expansion boards.

CAUTION: Failure to completely open the processor locking lever prevents the processor from seating during installation, leading to hardware damage.

CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area.

Removal and replacement procedures 56

6.

Open the processor locking lever, and then open the processor retaining bracket.

7.

Remove the processor socket cover.

CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board:

• Do not touch the processor socket contacts.

• Do not tilt or slide the processor when lowering the processor into the socket.

Removal and replacement procedures 57

8.

Install the processor. Use the notches on both sides of the processor to properly align it into the socket.

9.

CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance. Forcing the lever closed can damage the processor and socket, requiring system board replacement.

Close the processor retaining bracket, and then secure the processor locking lever.

10.

Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab.

Allow the alcohol to evaporate before continuing.

Removal and replacement procedures 58

11.

Apply all the grease to the top of the processor in the following pattern to ensure even distribution.

CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warranty of the board.

12.

Install the heatsink: a.

Position the heatsink using the guide pin on the processor backplate. b. c.

Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws.

Finish the installation by completely tightening the screws in the same sequence.

CAUTION: When returning a damaged system board to HP, always install all processor socket covers to prevent damage to the processor sockets and system board.

Removal and replacement procedures 59

13.

Install the processor socket cover on the failed system board.

18.

19.

20.

21.

22.

14.

15.

16.

17.

Connect all cables disconnected from the failed system board.

Install the capacitor pack.

Install the rear system fan.

Install the air baffle.

Install the access panel.

Lock the tower bezel.

Connect each power cord to the server.

Connect each power cord to the power source.

Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

After you replace the system board, you must re-enter the server serial number and the product ID.

1.

During the server startup sequence, press the F9 key to access RBSU.

2.

3.

Select the Advanced Options menu.

Select Service Options.

4.

5.

6.

7.

8.

9.

10.

11.

Select Serial Number. The following warning appears:

Warning: The serial number should ONLY be modified by qualified service personnel. This value should always match the serial number located on the chassis.

Press the Enter key to clear the warning.

Enter the serial number and press the Enter key.

Select Product ID. The following warning appears:

Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis.

Enter the product ID and press the Enter key.

Press the Esc key to close the menu.

Press the Esc key to exit RBSU.

Press the F10 key to confirm exiting RBSU. The server automatically reboots.

Removal and replacement procedures 60

HP Trusted Platform Module

The TPM is not a customer-removable part.

CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.

If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP authorized service provider for a replacement system board and TPM board.

Removal and replacement procedures 61

Troubleshooting

Troubleshooting resources

The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language:

English ( http://www.hp.com/support/ProLiant_TSG_v1_en )

French ( http://www.hp.com/support/ProLiant_TSG_v1_fr )

Spanish ( http://www.hp.com/support/ProLiant_TSG_v1_sp )

German ( http://www.hp.com/support/ProLiant_TSG_v1_gr )

Japanese ( http://www.hp.com/support/ProLiant_TSG_v1_jp )

Simplified Chinese ( http://www.hp.com/support/ProLiant_TSG_v1_sc )

The HP ProLiant Gen8 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades. To view the guide, select a language:

English ( http://www.hp.com/support/ProLiant_EMG_v1_en )

French ( http://www.hp.com/support/ProLiant_EMG_v1_fr )

Spanish ( http://www.hp.com/support/ProLiant_EMG_v1_sp )

German ( http://www.hp.com/support/ProLiant_EMG_v1_gr )

Japanese ( http://www.hp.com/support/ProLiant_EMG_v1_jp )

Simplified Chinese ( http://www.hp.com/support/ProLiant_EMG_v1_sc )

Troubleshooting 62

Diagnostic tools

HP Insight Diagnostics

HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation.

HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, boot the server using Intelligent Provisioning.

HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft Windows and Linux versions, the utility helps to ensure proper system operation.

For more information or to download the utility, see the HP website ( http://www.hp.com/servers/diags ). HP

Insight Diagnostics Online Edition is also available in the SPP. For more information, see the HP website

( http://www.hp.com/go/spp/download ).

HP Insight Diagnostics survey functionality

HP Insight Diagnostics (on page 63 ) provides survey functionality that gathers critical hardware and software

information on ProLiant servers.

This functionality supports operating systems that are supported by the server. For operating systems supported by the server, see the HP website ( http://www.hp.com/go/supportos ).

If a significant change occurs between data-gathering intervals, the survey function marks the previous information and overwrites the survey data files to reflect the latest changes in the configuration.

Survey functionality is installed with every Intelligent Provisioning-assisted HP Insight Diagnostics installation, or it can be installed through the SPP.

HP Insight Remote Support software

HP strongly recommends that you install HP Insight Remote Support software to complete the installation or upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or

HP contractual support agreement. HP Insight Remote Support supplements your monitoring continuously to ensure maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product’s service level. Notifications may be sent to your authorized HP Channel Partner for onsite service, if configured and available in your country.

The HP Insight Remote Support software extends the HP enterprise remote support portfolio for customers with small and medium size IT environments. The software is available in two variants:

HP Insight Remote Support 7.x software is optimized to support up to 500 managed systems and can be installed on a Windows ProLiant hosting device or a Windows ESXi Virtual Machine. It can be integrated easily to work with a supported version of HP Systems Insight Manager. HP Insight Remote

Diagnostic tools 63

Support 7.x provides anytime, anywhere personalized access to your IT environment through HP Insight

Online, and is also the recommended version for HP Proactive Care Service.

HP Insight Remote Support Advanced supports medium-sized to large environments with up to 3,500 devices. It can be installed on a Windows ProLiant hosting device or a Windows ESXi Virtual Machine and requires HP Systems Insight Manager. Optionally, customers using HP Operations Manager or SAP

Solution Manager to manage their environment can integrate these platforms easily to create a single view. This software is also optimized to deliver Mission Critical Services through additional features.

For more information about the Insight Remote Support Advanced software, see the HP website

( http://www.hp.com/go/insightremotesupport ).

The HP Insight Remote Support Release Notes detail the prerequisites, supported hardware, and associated operating systems. The release notes are available on the HP website

( http://www.hp.com/go/insightremotesupport/docs ). HP Insight Remote Support is included as part of HP

Warranty, HP Care Pack Service, or HP contractual support agreement.

HP ROM-Based Setup Utility

RBSU is a configuration utility embedded in HP ProLiant servers that performs a wide range of configuration activities that can include the following:

Configuring system devices and installed options

Enabling and disabling system features

Displaying system information

Selecting the primary boot controller

Configuring memory options

Language selection

For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website ( http://www.hp.com/support/smartstart/documentation ).

Integrated Management Log

The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.

You can view recorded events in the IML in several ways, including the following:

From within HP SIM

From within operating system-specific IML viewers o

For Windows: IML Viewer o

For Linux: IML Viewer Application

From within the iLO user interface

From within HP Insight Diagnostics (on page 63 )

Diagnostic tools 64

USB support and functionality

USB support

HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices through legacy USB support, which is enabled by default in the system ROM.

Legacy USB support provides USB functionality in environments where USB support is not available normally.

Specifically, HP provides legacy USB functionality for the following:

POST

RBSU

Diagnostics

DOS

Operating environments which do not provide native USB support

Internal USB functionality

An internal USB connector is available for use with security key devices and USB drive keys. This solution provides for use of a permanent USB key installed in the internal connector, avoiding issues of clearance on the front of the rack and physical access to secure data.

External USB functionality

HP provides external USB support to enable local connection of USB devices for server administration, configuration, and diagnostic procedures.

For additional security, external USB functionality can be disabled through RBSU.

Automatic Server Recovery

ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND (does not apply to HP ProLiant DL980 Servers), or panic. A system fail-safe timer, the

ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer. However, when the operating system fails, the timer expires and restarts the server.

ASR increases server availability by restarting the server within a specified time after a system hang. At the same time, the HP SIM console notifies you by sending a message to a designated pager number that ASR has restarted the system. You can disable ASR from the System Management Homepage or through RBSU.

Diagnostic tools 65

Component identification

Front panel components

3

4

5

1

2

Item Description

Optical drive (optional)

Media drive bay

USB connectors

Power On/Standby button and system power LED

Drive bays (inside)

Component identification 66

Front panel LEDs and buttons

Item Description

1

UID button/LED

2

Health LED

3

NIC status LED

Status

Solid blue = Activated

Flashing blue (1 Hz/cycle per sec) = Remote management or firmware upgrade in progress

Off = Deactivated

Solid green = Normal

Flashing amber = System degraded

Flashing red (1 Hz/cycle per sec) = System critical

Fast-flashing red (4 Hz/cycles per sec) = Power fault*

Solid green = Link to network

Flashing green (1 Hz/cycle per sec) = Network active

Off = No network activity

4

Power On/Standby button and system power LED

Solid green = System on

Flashing green (1 Hz/cycle per sec) = Performing power on sequence

Solid amber = System in standby

Off = No power present**

*To identify components in a degraded or critical state, see the Systems Insight Display LEDs, check iLO/BIOS logs, and reference the server troubleshooting guide.

**Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has occurred, or the power button cable is disconnected.

Component identification 67

Rear panel components

9

10

11

12

7

8

5

6

3

4

1

2

Item Description

Non-hot-plug power supply

Slot 4 PCIe x16 (8, 4, 1)*

Slot 3 PCIe x8 (8, 4, 1)*

Slot 2 PCIe x8 (4, 1)*

Slot 1 PCIe x4 (1)*

Expansion slot cover retainer

Serial connector

Video connector

Dedicated iLO management port (optional)

NIC 1/shared iLO management connector

NIC connector 2

USB connectors

* For more information on the expansion slot specifications, see "PCIe expansion slot definitions (on page

71 )."

Component identification 68

Rear panel LEDs and buttons

Item Description

1

2

3

4

NIC link LED

NIC status LED

UID LED button

Power supply LED (for hot-plug HP

CS power supplies only)*

Status

Green = Link exists

Off = No link exists

Green = Activity exists

Flashing green = Activity exists

Off = No activity exists

Blue = Identification is activated

Flashing blue = System is being managed remotely

Off = Identification is deactivated

Green = Normal

Off = One or more of the following conditions exists:

Power is unavailable

Power supply failed

Power supply is in standby mode

Power supply error

*Not shown

Component identification 69

System board components

Item

1

20

21

22

23

24

25

26

15

16

17

18

19

6

7

8

9

10

4

5

2

3

11

12

13

14

Description

RPS connector

Processor socket

System battery

24-pin power supply connector

Mini-SAS connector

SATA connectors

Internal USB cable connector

Internal USB connector

SD card slot

Front USB connector 2

Front USB connector 1

Front panel LED connector

Fan connector 2

Reserved

Ambient thermal sensor connector

NMI header

System maintenance switch

Slot 1 PCIe x4 (1)*

Slot 2 PCIe x8 (4, 1)*

Slot 3 PCIe x8 (8, 4, 1)*

Slot 4 PCIe x16 (8, 4, 1)*

Fan connector 1

TPM connector

4-pin power supply connector

Dedicated iLO module connector

DIMM slots

Component identification 70

* For more information on the expansion slot specifications, see "PCIe expansion slot definitions (on page

71 )."

DIMM slot locations

DIMM slots are numbered sequentially (1 through 4) for the processor. The supported AMP modes use the letter assignments for population guidelines.

PCIe expansion slot definitions

The transfer rate of the PCIe expansion slots 3 and 4 depends on the processor model installed. The slots can either run in PCIe2 (5 GT/s) or PCIe3 (8 GT/s) rate.

1

2

3

Intel Xeon Processor E3-xxxx Series, Intel Core i3 Processor Series, Intel Pentium G2120, and Intel

Celeron G540

Slot number Type Length Height Connector link width Negotiable link width

PCIe2 Half

PCIe2 Full

PCIe2 Full

Full

Full

Full x4 x8 x8 x1 x4 x8

4

PCIe2 Full Full x16 x8

1

2

3

Intel Xeon Processor E3-xxxxV2 Series

Slot number Type Length Height Connector link width Negotiable link width

PCIe2 Half

PCIe2 Full

PCIe3 Full

Full

Full

Full x4 x8 x8 x1 x4 x8

4

PCIe3 Full Full x16 x8

System maintenance switch

Position Default Function

S1

Off Off = iLO security is enabled.

On = iLO security is disabled.

Component identification 71

Position

S2

S3

S4

S5

S6

S7

S8

S9

S10

S11

S12

Default

Off

Off

Off

Off

Off

Function

Off = System configuration can be changed.

On = System configuration is locked.

Reserved

Reserved

Off = Power-on password is enabled.

On = Power-on password is disabled.

Off = No function

On = ROM reads system configuration as invalid.

Reserved

Reserved

Reserved

Reserved

Reserved

Reserved

To access the redundant ROM, set S1, S5, and S6 to on.

When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM.

CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly configure the server or data loss could occur.

NMI functionality

An NMI crash dump creates a crash dump log before resetting a system which is not responding.

Crash dump log analysis is an essential part of diagnosing reliability problems, such as failures of operating systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is to restart the system. Resetting the system erases any information which could support problem analysis, but the NMI feature preserves that information by performing a memory dump before a system reset.

To force the system to invoke the NMI handler and generate a crash dump log, do one of the following:

Use the iLO Virtual NMI feature.

Short the NMI header (" System board components " on page 70 ).

For more information, see the HP website

( http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00797875/c00797875.pdf

).

Component identification 72

Drive numbering

Four-bay LFF drive model

Eight-bay SFF drive model

Component identification 73

Hot-plug drive LED definitions

2

3

4

1

Item LED

Locate

Status Definition

Solid blue The drive is being identified by a host application.

Flashing blue The drive carrier firmware is being updated or requires an update.

Activity ring Rotating green Drive activity

Off No drive activity

Do not remove Solid white

Off

Do not remove the drive. Removing the drive causes one or more of the logical drives to fail.

Removing the drive does not cause a logical drive to fail.

Drive status Solid green The drive is a member of one or more logical drives.

Flashing green The drive is rebuilding or performing a RAID migration, strip size migration, capacity expansion, or logical drive extension, or is erasing.

Flashing amber/green

The drive is a member of one or more logical drives and predicts the drive will fail.

Flashing amber The drive is not configured and predicts the drive will fail.

Solid amber The drive has failed.

Off The drive is not configured by a RAID controller.

Component identification 74

FBWC module LED definitions

The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the reverse side of the cache module to facilitate status viewing.

Off

Off

Off

Off

1 - Amber

Off

Off

Off

Off

Flashing 1 Hz

Flashing 1 Hz

Flashing 1 Hz

Flashing 2 Hz

Flashing 2 Hz

On

On

2 - Green 3 - Green Interpretation

Off Off The cache module is not powered.

Flashing 0.5 Hz Flashing 0.5 Hz The cache microcontroller is executing from within its boot loader and receiving new flash code from the host controller.

Flashing 1 Hz Flashing 1 Hz The cache module is powering up, and the capacitor pack is charging.

Off

Off

Flashing 1 Hz

On

The cache module is idle, and the capacitor pack is charging.

The cache module is idle, and the capacitor pack is charged.

On On

Flashing 1 Hz

On

Off

Off

Flashing 1 Hz Off

Flashing 1 Hz On

The cache module is idle, the capacitor pack is charged, and the cache contains data that has not yet been written to the drives.

A backup is in progress.

The current backup is complete with no errors.

The current backup failed, and data has been lost.

A power error occurred during the previous or current boot. Data may be corrupt.

An overtemperature condition exists. On Off

Flashing 2 Hz Off

Flashing 2 Hz On

On

On

Off

On

The capacitor pack is not attached.

The capacitor has been charging for 10 minutes, but has not reached sufficient charge to perform a full backup.

The current backup is complete, but power fluctuations occurred during the backup.

The cache module microcontroller has failed.

Component identification 75

Fan locations

Description

Rear system fan (fan 1, for processor cooling)

Front system fan (fan 2, for expansion board cooling)

Item

1

2

T-10/T-15 Torx screwdriver

The server includes a T-10/T-15 Torx screwdriver located on the side of the media drive cage. Use the screwdriver to loosen screws during hardware configuration procedures.

Component identification 76

Cabling

Cabling overview

This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance.

For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website ( http://www.hp.com/products/servers/platforms ).

CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.

Front panel cabling

1

2

3

Item Description

Front USB 2 cable

Front USB 1 cable

Front panel LED cable

Cabling 77

System fan cabling

1

2

Item Description

Rear system fan cable

Front system fan cable

Storage cabling

Four-bay LFF drive cabling

Non-hot-plug, SATA drive support only

Cabling 78

1

2

Item Description

Power cable

Data cable

Non-hot-plug, SATA and SAS drive support

1

2

Item Description

Power cable

Data cable

Hot-plug, SATA drive support

Item Description

1

Power cable

Cabling 79

Item Description

2

Mini-SAS cable

Hot-plug, SATA and SAS drive support

1

2

Item Description

Power cable

Mini-SAS cable

Eight-bay SFF drive cabling

This drive configuration supports hot-plug SATA and SAS drives.

Item Description

1

Power cable

Cabling 80

2

3

Item Description

Mini-SAS cable

Mini-SAS cable

Media drive cabling

Media drives in a nonredundant power configuration

Item

3

4

1

2

Description

Upper media drive power cable

Lower media drive SATA cable

Upper media drive SATA cable

Lower media drive power cable

Cabling 81

Media drive in a redundant power configuration

Item

1

2

Description

Upper media drive SATA cable

Upper media drive power cable

Power supply cabling

Nonredundant power supply cabling

1

2

Item Description

24-pin power supply cable

4-pin power supply cable

Cabling 82

Redundant power supply cabling

Item

1

2

3

Description

24-pin power supply cable

26-pin RPS cable

4-pin power supply cable (with the 8-pin to 4-pin adapter cable connected)

Capacitor pack cabling

Cabling 83

Specifications

Environmental specifications

Specification Value

Temperature range*

Operating

10°C to 35°C (50°F to 95°F)

Non-operating

-30°C to 60°C (-22°F to 140°F)

Relative humidity

(non-condensing)

Operating, maximum wet bulb temperature of 28°C (82.4°F)

10% to 90%

Non-operating, maximum wet bulb temperature of 38.7°C

(101.7°F)

5% to 95%

* All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.

Server specifications

Specification

Height

Depth

Width

Weight, minimum for SFF drive cage

Weight, maximum for SFF drive cage

Weight, minimum for LFF drive cage

Weight, maximum for LFF drive cage

Tower model

36.82 cm (14.50 in)

47.52 cm (18.71 in)

17.50 cm (6.89 in)

11.00 kg (24.22 lb)

17.00 kg (37.44 lb)

11.90 kg (26.21 lb)

19.00 kg (41.85 lb)

Rack model

17.50 cm (6.89 in)

47.52 cm (18.71 in)

36.82 cm (14.50 in)

11.00 kg (24.22 lb)

17.00 kg (37.44 lb)

11.90 kg (26.21 lb)

19.00 kg (41.85 lb)

Power supply specifications

Depending on installed options, the server is configured with one of the following power supplies:

HP 350 W 4U Integrated Power Supply

HP 460 W CS Gold Hot-plug Power Supply (92% efficiency)

CAUTION: Check the system and power supply input ratings before powering up the server.

Specifications 84

HP 350 W 4U Integrated Power Supply

Specification

Input requirements

Rated input voltage

Rated input frequency

Rated input current

Rated input power

Efficiency

Power supply output

Rated steady-state power

Maximum peak power

Rated output power

Value

100 V AC to 240 V AC

47 Hz to 63 Hz

6 A

440 W at 100 V AC input

440 W at 200 V AC input

No less than 82% at 100% load

No less than 85% at 50% load

No less than 82% at 20% load

350 W at 100 V AC input

350 W at 200 V AC input

400 W at 100 V AC input

400 W at 200 V AC input

350 W

HP 460 W CS Gold Hot-plug Power Supply (92% efficiency)

Specification Value

Input requirements

Rated input voltage

Rated input frequency

Rated input current

Rated input power

Power supply output

Efficiency

Rated steady-state power

Maximum peak power

100 V AC to 240 V AC

50 Hz to 60 Hz

6 A to 3 A

526 W at 115 V AC input

523 W at 230 V AC input

Not less than 87.5% at 100% load

Not less than 89.5% at 50% load

Not less than 87.5% at 20% load

460 W at 100 V to 120 V AC input

460 W at 200 V to 240 V AC input

460 W at 100 V to 120 V AC input

460 W at 200 V to 240 V AC input

Hot-plug power supply calculations

For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, see the HP Power Advisor website ( http://www.hp.com/go/hppoweradvisor ).

Specifications 85

Support and other resources

Before you contact HP

Be sure to have the following information available before you call HP:

Active Health System log (HP ProLiant Gen8 or later products)

Download and have available an Active Health System log for 3 days before the failure was detected.

For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP website ( http://www.hp.com/go/ilo/docs ).

Onboard Administrator SHOW ALL report (for HP BladeSystem products only)

For more information on obtaining the Onboard Administrator SHOW ALL report, see the HP website

( http://www.hp.com/go/OAlog ).

Technical support registration number (if applicable)

Product serial number

Product model name and number

Product identification number

Applicable error messages

Add-on boards or hardware

Third-party hardware or software

Operating system type and revision level

HP contact information

For United States and worldwide contact information, see the Contact HP website

( http://www.hp.com/go/assistance ).

In the United States:

To contact HP by phone, call 1-800-334-5144. For continuous quality improvement, calls may be recorded or monitored.

If you have purchased a Care Pack (service upgrade), see the Support & Drivers website

( http://www8.hp.com/us/en/support-drivers.html

). If the problem cannot be resolved at the website, call 1-800-633-3600. For more information about Care Packs, see the HP website

( http://pro-aq-sama.houston.hp.com/services/cache/10950-0-0-225-121.html

).

Support and other resources 86

Acronyms and abbreviations

ABEND abnormal end

AMP

Advanced Memory Protection

ASR

Automatic Server Recovery

CSR

Customer Self Repair

DDR double data rate

FBWC flash-backed write cache

HP CS

HP Common Slot (power supply)

HP SIM

HP Systems Insight Manager iLO

Integrated Lights-Out

IML

Integrated Management Log

LFF large form factor

MLC multilevel cell

Acronyms and abbreviations 87

NMI nonmaskable interrupt

NVRAM nonvolatile memory

PCIe

Peripheral Component Interconnect Express

POST

Power-On Self Test

RBSU

ROM-Based Setup Utility

RDIMM registered dual in-line memory module

RPS redundant power supply

SAS serial attached SCSI

SATA serial ATA

SD

Secure Digital

SFF small form factor

SLC single-level cell

SPP

HP Service Pack for ProLiant

TPM

Trusted Platform Module

Acronyms and abbreviations 88

UDIMM unregistered dual in-line memory module

UID unit identification

USB universal serial bus

Acronyms and abbreviations 89

Documentation feedback

HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback ( mailto:[email protected]

).

Include the document title and part number, version number, or the URL when submitting your feedback.

Documentation feedback 90

Index

A

access panel 31

air baffle 32

ASR (Automatic Server Recovery) 65

authorized reseller 86

Automatic Server Recovery (ASR) 65

B

bezel, tower 26

blanks 27

board components 70

C

cables 77

cabling 77, 78, 79, 80, 81, 82, 83

cache module 45, 75

cache module, removing 45

capacitor pack 45, 46, 83

Care Pack 63

components 16, 66 components, identification 16, 66

components, system board 70

connectors 66

contacting HP 86

crash dump analysis 72

CSR (customer self repair) 6

customer self repair (CSR) 6, 86

D

diagnostic tools 63, 64, 65

diagnostics utility 63

DIMMs 38

drive blank 27

drive cabling 77, 78, 80

drive cage, removing 33, 34

drive LEDs 74 drives 27, 28, 29, 32, 73, 74

E

electrostatic discharge 24

environmental requirements 84 environmental specifications 84

error messages 62

F

fan module location 76

fans 37, 50

FBWC cabling 78, 83

FBWC module LEDs 75

features 66

flash-backed write cache procedures 45, 48

front I/O module 36

front panel cabling 77

front panel components 66

G

guidelines, troubleshooting 62

H

hard drive LEDs 74 hard drives, determining status of 74

health driver 65

heatsink 39

help resources 86

HP Insight Diagnostics 63

HP Insight Remote Support software 63

HP technical support 6, 86

I

illustrated parts catalog 16

iLO (Integrated Lights-Out) 50, 51, 64

IML (Integrated Management Log) 64

Insight Diagnostics 63

Integrated Lights-Out (iLO) 64

Integrated Management Log (IML) 64

L

LEDs 74

LEDs, front panel 74

LEDs, hard drive 74

LEDs, rear panel 69

Index 91

LEDs, SAS hard drive 74

LEDs, troubleshooting 62

M

maintenance 24

management tools 63

mechanical components 16

media drive bay cabling 81

memory dump 72

N

NMI functionality 72

O

operating system crash 65, 72

optical drive 32, 66

P

part numbers 16

PCI expansion slots 71

phone numbers 86

POST error messages 62

power down procedure 26

power supply 30, 51, 53

power supply cabling 82

power supply specifications 84, 85

powering down 26

problem diagnosis 62

processors 41

R

RBSU (ROM-Based Setup Utility) 64

rear components 68

rear panel buttons 69

rear panel components 68

rear panel LEDs 69

removal and replacement procedures 24 required tools 24

resources 86

RPS cabling 52, 53

S

safety considerations 24

SAS and SATA device numbers 73

SAS cabling 79, 80

SATA cabling 78, 79

server, real panel LEDs 69

server, rear panel components 68

spare part numbers 16

specifications 84, 85

specifications, environmental 84 specifications, mechanical 84 specifications, power 84 specifications, server 84

static electricity 24

support 86

symbols on equipment 24

system battery 49

system board components 70 system board replacement 54, 70

system components 19, 66

system fan 50

system fan cabling 78

system maintenance switch 71

T

technical support 6, 86 telephone numbers 86

temperature requirements 84

tools 24

Torx screwdriver 76

tower bezel, removing 26

troubleshooting 62

Trusted Platform Module (TPM) 61

U

USB support 65

utilities 63

utilities, deployment 64

V

video connector 70

W

warnings 25

website, HP 86

weight 84

Index 92

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