LEICA TCS SP8
Technical Documentation
2
SPECIFICATIONS
MICROSCOPES
Microscope stand
Upright
VIBRATION ISOLATION
MICROSCOPE STAGE
Inverted
Isolation options
Anti-vibration table
Stage options
Autofocus
Motorfocus
Z galvanometer
CONTINUOUS WAVE LASERS
Laser type
VIS
PULSED LASERS
VIS
UV
Laser type
IR
CARS laser picoEmerald
UV
Options
Leica DM6 CS
Leica DM6 CFS
Leica DM6 CFS w/o TL axis
Leica DMi8 CS
Leica DMi8 CEL Compact
Leica DMi8 CEL Advanced
Specifications
Yes (active/passive)
Specifications
Optional reflection-based Adaptive Focus Control (AFC) for Leica DMi8 CS with
15 Hz sampling rate
Image Based Autofocus for transmission light and fluorescence images.
Can be combined with AFC
Travel range depending on mechanics of microscope/ minimum step size 50 nm, adjustable in increments of < 4 nm
Selectable z modes (Galvo Flow/discrete steps) available,
1500 μm range/minimum step size 20 nm, adjustable in increments of < 1.5 nm
Unique xzy scan mode for real-time xz slices, for setup of correction collar and for quick assessment of axial resolution
Specifications
Solid state laser 40 mW: 448 nm
Solid state laser 20 mW: 488 nm
Solid state laser 20 mW: 514 nm
Solid state laser 20 mW: 552 nm
Solid state laser 30 mW: 638 nm
Diode 40 mW: 442 nm
Ar 65 mW: 458, 476, 488, 496, 514 nm
HeNe, 2 mW: 594 nm
HeNe, 10 mW: 633 nm
DPSS, 20 mW: 561 nm
UV OPSL 80 mW: 355 nm
Diode, 50 mW: 405 nm
Specifications
Power and tuning range depending on selected model.
Full integration of Coherent Chameleon and Newport MaiTai lasers with and without precompensation, OPO MPX and InSight DS+ for gap-free tuning up to 1300 nm
Stokes wavelength/power: >700 mW @ 1031 nm, pump wavelength tuning range/power:
>500 mW (750 – 960 nm) @ 720 – 960 nm, pulse width: 2 ps, spectral bandwidth: <1 nm/10 cm -1 repetition rate: 80 MHz
,
WLL2, avg. power 1.5 mW: 470 – 670 nm, 78 MHz; with integrated pulse picker: 78, 39, 19.5, 9.75 MHz
WLL E, avg. power 1.0 mW: 470 – 670 nm, 78 MHz; with integrated pulse picker: 78, 39, 19.5, 9.75 MHz
Diode, 10 mW: 640 nm; 40, 20, 10, 5, 2.5, 1.25, 0.62, 0.31 MHz
Diode, 4 mW: 470 nm; 40, 20, 10, 5, 2.5, 1.25, 0.62, 0.31 MHz
Diode, 4 mW: 440 nm; 40, 20, 10, 5, 2.5, 1.25, 0.62, 0.31 MHz
Diode, 3 mW: 405 nm; 40, 20, 10, 5, 2.5, 1.25, 0.62, 0.31 MHz
SUPER-RESOLUTION
EXCITATION MODULATION
OPTICS
SCANNERS
STED 3X CW
STED ONE/STED 3X gated
STED 3X pulsed
Modulation type
AOTF VIS
AOTF UV
EOM IR
AOTF CARS
Pulsed laser driver
Direct modulation
Number of laser ports
Number of VIS lasers
Excitation – emission splitting
Simultaneous visible laser lines (AOBS)
Detection range
UV and IR imaging
Field upgradable
UV correction
Pinhole
Pinhole-diameter control
Notch filters
Scanner design
Scanning concept
Switch FOV-scanner-resonant scanner
Field-of-view scanner
Maximal line frequency
Minimal line frequency
Line frequency
Maximal frame rate 512 x 512
Maximal frame rate 512 x 16
Beam park
Maximal frame resolution
Scan zoom
Panning
Field rotation
Field diameter
592 STED: Vortex donut (FWHM): xy < 80 nm; z = confocal
592 STED: Z donut (FWHM): xy < 150 nm; z < 175 nm
660 STED: Vortex donut (FWHM): xy < 80 nm; z = confocal
660 STED: Z donut (FWHM): xy < 150 nm; z < 175 nm
592 STED: Vortex donut (FWHM): xy < 50 nm; z = confocal
592 STED: Z donut (FWHM): xy < 130 nm; z < 130 nm
660 STED: Vortex donut (FWHM): xy < 50 nm; z = confocal
660 STED: Z donut (FWHM): xy < 130 nm; z < 130 nm
775 STED: Vortex donut (FWHM): xy < 50 nm; z = confocal
775 STED: Z donut (FWHM): xy < 130 nm; z < 130 nm
Specifications
Up to 8 channels
Up to 3 channels
Yes
Up to 2 channels
Optional
For 405 nm
Up to 4 (UV-VIS-IR-STED)
Up to 8 channels
Acousto-Optical Beam Splitter (AOBS) or Low Incident Angle dichroic beam splitters
(LIAchroics) max. 8 (both in fluorescence and reflection mode)
400 – 800 nm
Sequential (line/frame) or simultaneous
Yes (most options, e.g. STED, multiphoton)
Unified concept with CS2 optics
Stable single pinhole (maintenance-free)
Motorized by software, wavelength-dependent automatic mode available
Fluorifier disk with numerous options
Specifications
X2Y-scanner with optically correct scanning at low inertia
FOV and resonant scanner in one system (opt)
Specifications
3600 Hz (bidirectional)
1 Hz
Freely selectable in steps of 1 Hz (unidirectional), 2 Hz (bidirectional)
7 Hz
112 Hz
Yes
8192 x 8192 (FLIM: up to 4096 x 4096)
0.75 – 48x
Yes
200° optical
22 mm
3
4
SPECIFICATIONS
SCANNERS
SCAN MODES
ADVANCED SCAN MODES
INTERNAL CONFOCAL DETECTION
Resonant scanner 8kHz
Maximal line frequency
Minimal line frequency
Maximal frame rate 512 x 512
Maximal frame rate 512 x 16
Maximal frame resolution
Scan zoom
Panning
Field rotation
Field diameter
Resonant scanner 12kHz
Maximal line frequency
Minimal line frequency
Specifications
16 kHz (bidirectional)
8 kHz
28 fps
290 fps
1248 x 1248 pixel
1.3 – 48x
Yes
200° optical
13 mm
Specifications
24 kHz (bidirectional)
12 kHz
Maximal frame rate 512 x 512
Maximal frame rate 512 x 16
Maximal frame resolution
Scan zoom
Panning
Field rotation
40 fps
428 fps
832 x 832 pixel
2 – 48x
Yes
200° optical
Field diameter
Scan options
8 mm
Available xyz, xt, xyt, xyzt, xy λ , xy λ t, xyz λ , xyz λ t Real-time z sectioning with SuperZ Galvanometer at all scan speeds xzy, xzt, xzyt, xz λ , xz λ t Yes xy
L
, xz
L
, xyz
L
, xy
L t, xy
λL
, xz
λL
Hybrid detection for imaging
WLL and CARS
Specifications
Emission separation
Time gated detection
Maximum number of detectors
Highly sensitive prism spectral detector (HyD SP) or filter cube (HyD RLD)
Yes
4 (+ 1 PMT)
Tunability of emission bands
Spectral detection range
Typical quantum efficiency
Simultaneously tunable spectral detection channels
Yes
400 – 750 nm
45% (@500 nm) max. 5
Spectral tuning resolution
Minimal detection range
Photon counting
Sensors
Digitization
Read out frequency
(dig oversampling)
1 nm across full spectrum of 400 – 750 nm
5 nm
Linear signal response in Photon Counting mode max. 60 Mcounts/s, in Standard Mode max. 300 Mcounts/s
GaAsP hybrid detectors
12 or 16 bit per channel
> 600 MHz
Max gray value resolution
Gated detection
16 bit
Yes (in combination with white light laser)
Hybrid detection for imaging and SMD Specifications
Emission separation
Time gated detection
Highly sensitive prism spectral detector (HyD SP) or filter cube (HyD RLD)
Yes
INTERNAL CONFOCAL DETECTION
HyVolution 2
Tunability of emission bands
Spectral detection range
Typical quantum efficiency
Spectral tuning resolution
Minimal detection range
Photon Counting
Sensors
Digitization
Read out frequency (dig oversampling)
Max gray resolution
Gated detection
FCS capability
FLIM capability
FLCS
Active cooling
Dark noise
PMT detection for Imaging
Emission separation
Maximum number of detectors
Tunability of emission bands
Yes
400 – 750 nm
45% (@500 nm)
1 nm across full spectrum of 400 – 750 nm
5 nm
Up to 60 Mcounts/s in Photon Counting mode, Up to 300 Mcounts/s in Standard Mode with linear signal response
GaAsP hybrid detectors
12 or 16 bit per channel
> 600 MHz (for imaging)
16 bit
Yes (in combination with white light laser)
Yes
Yes
Yes
Yes
< 400 counts per second at 18° C
Specifications
Highly sensitive prism spectral detector
Up to 5
Yes
Spectral detection range
Quantum efficiency
Spectral tuning resolution
Minimal detection range
Sensors
Digitization
Read out frequency
400 – 800 nm
30% (@ 500 nm)
1 nm across full spectrum of 400 – 800 nm
5 nm
High sensitive low noise, selected PMT
12 or 18 bit per channel
40 MHz oversampling
Maximum gray resolution 16 bit
PMT detection for FLIM and Imaging Specifications
Emission separation
Maximum number of detectors
Highly sensitive prism spectral detector
Up to 2 (+ up to 3 additional internal detectors)
Spectral resolution
Spectral detection range
Spectral resolution
Minimal detection range
Photon counting
FLIM capabilities
Sensors
Digitization
Read out frequency
Max gray resolution
Number of spectral channels
Lateral resolution
Lateral resoltuion increase
Axial resolution increase
1 nm across full spectrum of 400 – 800 nm
400 – 800 nm
1 nm across full spectrum of 400 – 800 nm
5 nm
Yes yes
PMT with fast time response
12 or 18 bit per channel
40 MHz oversampling
16 bit
5 spectral detectors w/o sequential scanning
140 nm
1.5 x
2 x
5
6
SPECIFICATIONS
EXTERNAL CONFOCAL DETECTION
NON-CONFOCAL DETECTION
ELECTRONICS
EXTENSIONS
Detector types
PE APDs
MPD APDs
Detection types
Applications
2, for FCS and imaging
2, for FCS, FLCS, FLIM and imaging
For Imaging
Transmitted light detector
Non-descanned transmitted light channels
Optional, allowing BF, Ph, Dodt contrast (MP), etc.
Up to 4 (multiphoton)
Non-descanned reflected light channels Up to 4 (multiphoton)
Non-descanned reflected light HyD detection
Up to 4 (multiphoton), for imaging and FLIM
Maximum number of detectors
Devices
8 NDDs, 1 BF-TLD
For Imaging
Scanner control
Trigger in/out
Auxiliary data input channels
Computer
Monitor
Software control
Devices
Auxiliary emission port
Environmental control
Digital (FPGA, field programmable gate arrays)
Yes
Up to 2
Premium HP workstation for real 64 bit processing
30“ high brilliance monitor
Programmable control panel with LCD function and value display
For Imaging
Optional
Various options and accessories
SOFTWARE
Ergonomy
Image acquisition
Mosaicking/Stitching
Online dye separation
Photon statistics
LightGate
2D/3D deconvolution
Data exchange LAS X/Huygens
Dye assistant
Lambda scan
Lambda-lambda scan
Z intensity compensation
Leica HCS A
LAS X 3D Visualization
LAS X 2D/3D Analysis
LAS X Measurements
LAS X Environmental Control
Intuitive software wizards
LAS X MicroLab
LAS X Live Data Mode
LSA X Electrophysiology
LAS X SMD FLIM
LAS X SMD FCS
LAS X SmartSTED
GUI optimized for dark rooms and image processing
Scalable user interface for maximum flexibility
Fully modular and flexible arrangement of functions
Multidimensional acquisition, full control of motorized hardware
Algorithm based stitching functionalities
Fast online dye separation for VIS and MP imaging
Read out of photon counts (HyD)
Detection in user defined time window (HyD)
Integrated deconvolution algorithms
Exchange of Confocal, STED and MP images between LAS X and Huygens deconvolution software
Software-aided hardware configuration based on fluorophores used
Acquisition of emission spectrum using spectral detectors
Acquisition of full excitation-emission spectrum (WLL and CARS)
Laser power and/or detector gain adustments within z stacks
High content screening and automated microscopy
Fast, GPU-based processing of large 3D stacks, unique clipping tool
2D/3D multi channel analysis and classification
2D measurements
Setting up, logging and monitoring of climate conditions
FRAP, FLIP, photoconversion, FRET (acceptor photobleaching, sensitized emission)
Recording of manual and automated workflows, trigger functions, complex timelapse series
Live Data Mode combined with the recording of electrical data
Setup and processing of FLIM measurement series using integrated SMD components
Setup and processing of FCS measurement series using integrated SMD components
Workflow for STED 3X operation
7
8
SPECIFICATIONS
DLS (DIGITAL LIGHTSHEET MODULE)
Microscope stand
Synergies
Illumination
Detection
Mirror
Cameras
Wide field imaging
Lasers (for light sheet generation)
IR lasers
Filter
Software
DMi8 CS Bino DLS (new system)
DMi8 CS Bino (upgradable)
DMi8 CS Trino (upgradable)
DMi8 CEL Advanced (upgradable)
DMI6000 CS Bino (upgradable)
DMI6000 CS Trino (upgradable)
DMI6000 CS AFC Bino (upgradable)
DMI6000 CS AFC Trino (upgradable)
Confocal TCS SP8 (included)
STED (optional)
MP/CARS (optional)
SMD (optional)
HCS A (optional)
HC PL FLUOTAR 2.5x/0.07
HCX PL FLUOTAR 5x/0.15
L 1.6x/0.05 DLS
HC FLUOTAR L25x/0.95 W DLS working distance = 2.5 mm, water immersion
HC APO L10x/0.30 W DLS working distance = 3.6 mm, water immersion
5x/0.15 IMM DLS working distance = 4.95 mm, water to glycerol immersion
TwinFlect 5 mm (specimen size: max. 2.0 mm, short axis)
TwinFlect 2.5 mm (specimen size: max. 1.0 mm, short axis)
TwinFlect 7.8 mm (specimen size: max. 3.5 mm, short axis)
Leica DFC9000 GTC
PCO Edge 5.5 sCMOS camera
Hamamatsu Orca Flash 4.0 V2 Kamera
Transmitted and incident illumination for sample positioning
All VIS lasers (WLL included), see page 2
UV: 405 nm, see page 2
Not for light sheet generation, suitable for combined laser manipulations
Filter DLS 455-495 (BP = bandpass filter)
Filter DLS 504-545 (BP)
Filter DLS 575-615 (BP)
Filter DLS 575-635 (BP)
Filter DLS 405/488/561/633 (NF = notch filter)
Filter DLS 405/488/552/638 (NF)
Filter DLS 405/488/561 (NF)
Filter DLS 405/488/552 (NF)
Filter DLS 458/514 (NF)
Filter DLS 488/561 (NF)
Filter DLS 405/488 (NF)
LightSheet Wizard fully integrated in LAS X
3D Visualisation and Prcocessing Pipeline
Environmental Control
Workstation
Recommended requirements for offline workstation
Incubation
Physical Dimensions
Spectral range of detection
Multi-channel acquisition
Field of view
Specimen size
Two-sided illumination
Sample mounting
Light sheet thickness
Camera properties
Pixel size
Maximum pixel format
Bit depth
Max frame rate DFC9000 GTC
Max frame rate PCO
Max frame rate ORCA Flash 4
Max write speed SSD RAID
Max write speed HDD RAID
WS Expert HPZ840
CPU: 2x Xeon E5-2637v3 Quad Core 3.5 GHz
Memory: 128 GB
Storage: 1.862 TB SSD RAID, 10.914 TB HDD RAID
NIC: Intel X520 10GbE Dual Port Adapter C3N52AA
NVIDIA Quadro K4200 4 GB
CPU: 2x Xeon E5-2637v3 Quad Core 3,5 GHz or higher
Memory: min. 128 GB or higher
Storage: 2 TB or larger SSD RAID 0 and/or 10 TB or larger HDD RAID 5
NIC: Intel X520 10GbE Dual Port Adapter C3N52AA
NVIDIA Quadro K4200 4GB
Environmental chamber, transparent (incubation)
Environmental chamber, black (incubation and laser safety)
Heating Device
Identical to TCS SP8 specifications
420 – 800 nm
Fast sequential scan via AOTF
Field of view Max. image diagonal up to 2075 µm with the 5x detection objective
Diameter of sample (short axis) ≤ 3.5 mm, diameter long axis determined by the mounting dish
With one illumimation objective via TwinFlect mirrors
Sample mounting in standard glass bottom dishes (recommended cover slip thickness 170 μm +/ – 20 μm), mounting in aqueous solutions, or solutions with
RI up to 1.47 depending on optics used, specimen elevated ~500 μm from cover slip, multiposition experiments supported
1.7 – 15 μm
6.5 μm
2048 x 2048
16 bit
Up to 64 fps at 2048 x 2048 in xyt format
Up to 94 fps at 1000 x 1000 in xyt format
Up to 41 fps at 2048 x 2048 in xyz format
Up to 50 fps at 1000 x 1000 in xyz format
Up to 66 fps at 2048 x 2048 in xyt format
Up to 93 fps at 1000 x 1000 in xyt format
Up to 41 fps at 2048 x 2048 in xyz format
Up to 50 fps at 1000 x 1000 in xyz format
Up to 60 fps at 2048 x 2048 in xyt format
Up to 93 fps at 1000 x 1000 in xyt format
Up to 41 fps at 2048 x 2048 in xyz format
Up to 50 fps at 1000 x 1000 in xyz format
Up to 880 Mbyte/sec
Up to 820 Mbyte/sec
9
SPECIFICATIONS
WEIGHT OF BASIC SYSTEM
HEAT LOAD MAX.
ELECTRICAL SPECIFICATIONS
Min. number of phases
Supply voltage
Power consumption
Fuse
Protection class
Type of protection
Overvoltage category
Frequency
Permitted relative humidity
Max. location elevation
Pollution degree
Max. tolerable vibrations
OPERATION TEMPERATURE
LASER SAFETY MEASURES
Temperature for operation
Opt. optical behavior at
Laser class
Maximum 330 kg (728 lbs)
VIS: 1.7 kW (CSU); 3.2 kW (FSU)
UV: 0.5 kW
IR: 2.0 kW
2 (CSU systems); 3 (FSU systems); some options may require additional electrical connections
100 V~ to 240 V~ ± 10%, grounded
FSU: 2x 1600 VA (incl. peripheral devices connected to flexible supply unit’s multiple socket outlet)
CSU: 700 VA
FSU: automated process
I
CSU: 2x T8AH, 250 V AC
Covered design
II
50/60 Hz
20% to 60% (non-condensing)
2000 m above sea level
2 (protect system from dust)
Frequency range [5 Hz – 30 Hz]: less than 30 μm/s root mean square
Frequency range [> 30 Hz]: less than 60 μm/s root mean square
Internet access for advanced remote diagnostics
Room must comply with country specific regulations for laser class 3b and 4
Room darkening recommended
18 to 25 °C (64 to 77 °F)
22 °C ± 1 °C (72 FC ± 1.8 °F)
3B/ IIIb, 4/IV
10
SYSTEM DIMENSIONS
Compact supply unit and upright stand
approx.
1750 mm
Distance from wall 525 mm
Depth approx.
1100 mm
Width approx. 2300 mm
Compact supply unit and inverted stand
approx.
1400 mm approx.
1300 mm
Distance from wall 525 mm
Depth approx.
1100 mm
Width approx. 2530 mm visible and ultraviolet radiation: infrared radiation:
Figures are for illustrative purposes only. The system you purchase may deviate from the illustrations shown here, and
Leica Microsystems CMS GmbH reserve the right to change the specification without prior notice.
11
SPECIFICATIONS
Leica Microsystems CMS GmbH
www.leica-microsystems.de
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