HP ProBook 645 G3 Notebook PC, HP ProBook 655 G3 Notebook PC

QuickSpecs

Overview

HP ProBook 645 G3 Notebook PC



1. WLAN antennas (2)

2. WWAN antennas (2) (select models)

3. Internal microphones (2)

4. Webcam LED (select models)

5. Webcam (select models)

6. Wireless on/off button

7. Speaker mute button

8. Power connector

9. SIM card slot

10. Docking connector

11. Ethernet port

12. USB 3.0 ports (2)

Front/Right

13. SD card slot

14. DisplayPort™

15. USB-C™ port

16. Microphone/ headphones combo jack

17. Fingerprint reader (select models)

18. Touchpad

19. Touchpad buttons

20. Indicator LEDs: Wireless Light, Power Light, AC

Adapter/Battery Light, Storage Usage Light

21. NFC (select models)

22. Pointstick (select models)

23. Power button

Not all configuration components are available in all regions/countries. c05240727 – DA 15673– World Wide – Version 6 – April 11, 2017

Page 1

QuickSpecs

Overview



1. Security lock slot

2. Optical drive (select models)

Left side

3. Smart Card Reader


Page 2

QuickSpecs

Overview



1. VGA port

Back


Page 3

QuickSpecs

Overview




1. WLAN antennas (2)

2. WWAN antennas (2) (select models)

3. Internal microphones (2)

4. Webcam LED (select models)

5. Webcam (select models)

6. Wireless on/off button

7. Speaker mute button

8. Power connector

9. SIM card slot

10. Docking connector

11. Ethernet port

12. USB 3.0 ports (2)


Front/Right

13. SD card slot

14. DisplayPort™

15. USB-C™ port

16. Microphone/ headphones combo jack

17. Fingerprint reader (select models)

18. Touchpad

19. Touchpad buttons

20. Indicator LEDs: Wireless Light, Power Light, AC

Adapter/Battery Light, Storage Usage Light

21. NFC (select models)

22. Pointstick (select models)

23. Power button

Page 4

QuickSpecs

Overview



1. Security lock slot

2. Optical drive (select models)

Left side

3. Smart Card Reader


Page 5

QuickSpecs

Overview



1. VGA port

Back

2. Serial port (select models)


Page 6

QuickSpecs

Overview

A

T A

G

LANCE



 Windows 10 versions, Windows 7 through downgrade rights or FreeDOS 2.0

 Protect existing IT investment with optional optical drive and optional serial port (HP ProBook 655 G3 only)

 Choice of up to 7 th generation AMD A6, A8 and A10 Accelerated Processing Unit and graphics

 The HP Premium keyboard is spill-resistant and offered with optional backlit design

 Large Touchpad with gestures support, on/off button with LED indicator

 Enhanced security features including TPM 2.0, SmartCard Reader and optional Fingerprint reader

 LED-backlit display

HP ProBook 645: 35.56 cm (14") diagonal HD and FHD or Touch FHD with camera and with WWAN

HP ProBook 655: 39.6 cm (15.6") diagonal HD and FHD or Touch FHD with camera and with WWAN

 Optional HD webcam with dual-microphone array for video conferencing

 DisplayPort™ 1.2 with integrated graphics

 Three USB ports for fast data transfer from devices: one standard, one charging, and one USB-C™ charging port

 Wireless and speaker mute button to conveniently manage the connectivity and speaker.

 Flexible wireless connectivity options: o - Broadband Wireless (WWAN) o - Wireless LAN (WLAN) o - Personal area network (WPAN Bluetooth®) o - Near Field Communication (NFC)

 Choice of hard drives up to 1 TB or solid state drives up to 512 GB

 Pending MIL STD testing

1

1. MIL STD 810G testing is not intended to demonstrate fitness for U.S. Department of Defense contract requirements or for military use. Test results are not a guarantee of future performance under these test conditions. Damage under the

MIL STD test conditions or any accidental damage requires an optional HP Accidental Damage Protection Care Pack.

NOTE: See important legal disclosures for all listed specs in their respective features sections.


Page 7

QuickSpecs



Technical Specifications

PRODUCT NAMES

HP ProBook 645 G3 Notebook PC

HP ProBook 655 G3 Notebook PC

OPERATING SYSTEM

Preinstalled

Windows 10 Pro 64 1

Windows 10 Home 64 1

Windows 10 Home Single Language 64 1

Windows 10 Pro 64 (National Academic only)

2

Windows 7 Professional 64 (Available through downgrade rights from Windows 10 Pro 64) 3

NeoKylin Linux 64

FreeDOS 2.0

Web-only Support

Windows 10 Enterprise 1

Windows 7 Enterprise 64 1,3

Windows 7 Professional 64 1

1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for updates. See http://www.windows.com

.

2. Some devices for academic use will automatically be updated to Windows 10 Pro Education with the Windows 10

Anniversary Update. Features vary; see https://aka.ms/ProEducation for Windows 10 Pro Education feature information.

3. This system is preinstalled with Windows 7 Professional software and also comes with a license and media for Windows

10 Pro software. You may only use one version of the Windows software at a time. Switching between versions will require you to uninstall one version and install the other version. You must back up all data (files, photos, etc.) before uninstalling and installing operating systems to avoid loss of your data.

PROCESSORS

AMD A10-8730B APU with Radeon™ R5 Graphics (2.4 GHz, up to 3.3 GHz, 2 MB cache, 4 cores) 1



Processors Family

7th Generation AMD A8 APU processor (9600B model)



NOTE: In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on products configured with Intel® and AMD 7 th generation and forward processors or provide any Windows 8 or Windows 7 drivers on http://www.support.hp.com


Page 8

QuickSpecs




1. Multicore is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software configurations. AMD’s numbering is not a measurement of clock speed.

CHIPSET

Integrated with processor

GRAPHICS

Radeon™ R5 Graphics

NOTE: Integrated with processors.

DISPLAY

HP ProBook 645

Internal

Non-Touch

35.56 cm (14") diagonal LED-backlit HD

1

SVA eDP Anti-glare Slim 45% CG 220 nits (1366x768)

35.56 cm (14") diagonal LED-backlit HD 1 SVA eDP Anti-glare Slim 45% CG 220 nits (1366x768) with camera

35.56 cm (14") diagonal LED-backlit HD 1 SVA eDP Anti-glare Slim 45% CG 220 nits (1366x768) with WWAN

35.56 cm (14") diagonal LED-backlit HD

1

SVA eDP Anti-glare Slim 45% CG 220 nits (1366x768) with camera and with WWAN

35.56 cm (14") diagonal LED-backlit FHD SVA eDP Anti-glare Slim 60% CG 300 nits (1920x1080)

35.56 cm (14") diagonal LED-backlit FHD SVA eDP Anti-glare Slim 60% CG 300 nits (1920x1080) with camera

35.56 cm (14") diagonal LED-backlit FHD SVA eDP Anti-glare Slim 60% CG 300 nits (1920x1080) with WWAN

35.56 cm (14") diagonal LED-backlit FHD SVA eDP Anti-glare Slim 60% CG 300 nits (1920x1080) with camera & WWAN

Touch

35.56 cm (14") diagonal LED-backlit FHD SVA eDP 60% CG 300 nits (1920x1080) with camera and with WWAN

External

Up to 32-bit per pixel color depth

VGA

Port supports resolutions up to 1920 x 1200 external resolution @60 Hz

DisplayPort 1.2

Supports resolutions up to 2560 x 1600, 30-bit color depth at 60 Hz, and full HD (1920 x 1080) monitors, 24-bit color depth at

120 Hz

Number of Displays Supported

Supports 3 independent displays if used with optional HP Ultraslim Docking Station

2

HP ProBook 655


Page 9

QuickSpecs




Internal

Non-Touch

39.6 cm (15.6") diagonal LED-backlit HD 1 SVA eDP Anti-glare Slim 45% CG 220 nits (1366 x 768)

39.6 cm (15.6") diagonal LED-backlit HD

1

SVA eDP Anti-glare Slim 45% CG 220 nits (1366 x 768) with camera

39.6 cm (15.6") diagonal LED-backlit HD 1 SVA eDP Anti-glare Slim 45% CG 220 nits (1366 x 768) with WWAN

39.6 cm (15.6") diagonal LED-backlit HD 1 SVA eDP Anti-glare Slim 45% CG 220 nits (1366 x 768) with camera and with WWAN

39.6 cm (15.6") diagonal LED-backlit FHD SVA eDP Anti-glare Slim 60% CG 300 nits (1920 x 1080)

39.6 cm (15.6") diagonal LED-backlit FHD SVA eDP Anti-glare Slim 60% CG 300 nits (1920 x 1080) with camera

39.6 cm (15.6") diagonal LED-backlit FHD SVA eDP Anti-glare Slim 60% CG 300 nits (1920 x 1080) with WWAN

39.6 cm (15.6") diagonal LED-backlit FHD SVA eDP Anti-glare Slim 60% CG 300 nits (1920 x 1080) with camera & WWAN

Touch

39.6 cm (15.6") diagonal LED-backlit FHD SVA eDP 60% CG 300 nits (1920 x 1080) with camera with WWAN

External

Up to 32-bit per pixel color depth

VGA

Port supports resolutions up to 1920 x 1200 external resolution @60 Hz

DisplayPort™ 1.2

Supports resolutions up to 2560 x 1600, 30-bit color depth at 60 Hz, and full HD (1920 x 1080) monitors, 24-bit color depth at

120 Hz

Number of Displays Supported

Supports 3 independent displays if used with optional HP Ultraslim Docking Station

2

NOTE: Resolutions are dependent upon monitor capability, and resolution and color depth settings.

1. HD content required to view HD images.

2. Sold separately or as an optional feature.

STORAGE AND DRIVES

Primary Storage Bay

SATA, 2.5" Hard Drives 1

500 GB 7200 rpm

500 GB 7200 rpm Self-Encrypting Drive (Opal 2)

500 GB 7200 rpm Self Encrypting Drive (FIPS-140-2)

1 TB 5400 rpm

M.2 (NGFF) Solid State Drive 1

128 GB SATA-3 SS Value

256 GB-PCIe NVMe SSD TLC

256 GB-SATA TLC (Opal 2)

512 GB-PCIe NVMe TLC

360 GB PCIe Gen3x4 NVMe SS TLC

256 GB PCIe Gen3x4 NVMe SS Value

512 GB PCIe Gen3x4 NVMe SS Value

1. For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB of system disk is reserved for system recovery software.


Page 10

QuickSpecs




OPTICAL DRIVES

Fixed 9.5 mm SATA

DVD-ROM Drive

DVD+/-RW SuperMulti DL

1

BD Writer

1. Intended for your original content and other lawful uses. Don’t copy copyright-protected materials.

2. Not available on with Touch panel.

MEMORY

DDR4-2133 SDRAM (Transfer rates up to 1866 MT/s)

Two SODIMM slots supporting dual-channel memory

Configurations

4096 MB Total System Memory (4096 MB x 1)



12288 MB Total System Memory (8192 MB + 4096 MB)


Maximum

Up to 16384 MB

Dual-channel

Maximized dual-channel performance requires SODIMMs of the same size and speed in both memory slots.

NOTE: Due to the non-industry standard nature of some third-party memory modules, we recommend

HP branded memory to ensure compatibility. If you mix memory speeds, the system will perform at the lower memory speed.

NETWORKING/COMMUNICATIONS

Broadband Wireless (WWAN)

2,3

HP lt4120 Qualcomm® Snapdragon™ X5 LTE Mobile Broadband Module

HP lt4132 LTE/HSPA+ 4G Mobile Broadband Module

HP hs3210 HSPA+ Mobile Broadband Module

Wireless LAN (WLAN) 1,2

Options via Minicard

Intel® Dual Band Wireless-AC 3168 802.11 a/b/g/n/ac (1x1) Wi-Fi® and Bluetooth® 4.2 Combo (non-vPro)

Realtek 802.11b/g/n (1x1) and Bluetooth® 4.0 Combo (non-vPro)

Intel® Dual Band Wireless-AC 7265 802.11a/b/g/n/ac (2x2) WiFi and Bluetooth® 4.2 Combo (non-vPro)

Personal area network (WPAN Bluetooth) 1,2


Page 11

QuickSpecs




Bluetooth® 4.0 supported via Broadcom Realtek

Bluetooth® 4.2 supported via all supported Intel® WLAN modules

Near Field Communication (NFC) Optional 2

HP Module with NXP NFC Controller NPC100

1. Wireless access point and Internet service is required and is not included. Availability of public wireless access points limited.


3. WWAN module is optional and requires separately purchased service contract. Check with service provider for coverage and availability in your area. Connection speeds will vary due to location, environment, network conditions, and other factors. 4G LTE not available on all products, in all regions.

Support for Miracast (Windows 10)

Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming media players that also support Miracast. You can use Miracast to share what you’re doing on your PC and present a slide show. For more information: http://windows.microsoft.com/en-us/windows-8/project-wireless-screen-miracast.

Communications

Realtek RTL8111HSH Gigabit Ethernet NIC with DASH Support

AUDIO/MULTIMEDIA

Audio

(2) Integrated stereo speakers

Dual Array Microphone

Webcam

Optional 720p HD webcam 1,2


2. HD content required to view HD images.

KEYBOARDS/POINTING DEVICES/BUTTONS & FUNCTION KEYS

HP Premium Keyboard

The HP spill-resistant keyboard is designed using a thin layer of Mylar film under the keyboard. The 101/102-key compatible keyboard features a full-pitch key layout with desktop keyboard features, such as editing keys, both left and right control and alt keys, and function keys. DuraKeys only available with Backlit option.

Three Keyboard Options

Touchpad, Spill-resistant with drain

Touchpad, Spill-resistant with drain, DuraKeys & Backlit

Dual Point, Spill-resistant with drain, DuraKeys & Backlit

Touchpad

On/Off button

Enabled by default


Page 12

QuickSpecs


2F Scrolling – On

2F Zoom ( Pinch ) – On

OSD ( enable / disable ) – On

Buttons and Function Keys

F1 – Sleep

F2 – Blank

F3 – Backlit

F4 - Display Switch

F5 - Brightness down

F6 - Brightness up

F7 – Blank

F8 - Volume down

F9 - Volume up

F10 - Mic Mute

F11 – Bank

F12 - Num lock



SOFTWARE AND SECURITY

Preinstalled Software with Windows Operating System

BIOS

HP BIOSphere

1

HP DriveLock | HP Automatic DriveLock

BIOS Update via Network

Master Boot Record Security

Power On Authentication

Secure Erase

2

Absolute Persistence Module

3

Pre-boot Authentication

Multi Media

CyberLink Power Media Player - CMIT

CyberLink Power2Go

Communication / Connectivity

HP Mobile Connect Pro (Windows 10 only) 5

Native Miracast Support 6

HP LAN-WLAN Protection

HP MAC Address Manager

HP SureConnect

HP Value Add Software

HP 3D DriveGuard 6


Page 13

QuickSpecs




HP ePrint Driver + JetAdvantage 7

HP Hotkey Support - CMIT

HP Recovery Manager

HP Recovery Disc Creator (Windows 7 only)

HP Jumpstart

HP Support Assistant

HP Noise Cancellation Software

3 rd Party

Foxit PhantomPDF Express for HP (Windows 7 only)

Microsoft Products

Buy Office

Bing Search

Skype 8

Manageability

HP Driver Packs 9

HP SoftPaq Download Manager (SDM)

9

HP System Software Manager (SSM) 9 HP BIOS Config Utility (BCU) 9 HP Client Catalog 9 HP MIK for Microsoft SCCM 9

LANDESK Management 10

For more information on HP Client Management Solutions refer to: http://www.hp.com/go/clientmanagement .

Client Security Software

HP Client Security Suite Gen3

 HP Security Manager (including Credential Manager and Password Manager)

 HP Drive Lock

 HP Fingerprint Sensor

 HP Password Manager

 Absolute Persistence Module

 Power On Authentication

Microsoft Security Essentials 11 (Windows 7 only)

Microsoft Defender (Windows 10 only)

Security

Trusted Platform Module (TPM) 1.2 (Infineon SLB9670). Common Criteria EAL4+ Certified.

Upgradable to TPM 2.0. Convertible to FIPS 140-2 Certified mode. (TPM 2.0 is not available for Win 7 32-bit.)

HP Fingerprint reader (On select models)

Security lock slot (Cable not included)

Integrated Smart Card Reader

1 Available only on business PCs with HP BIOS.


Page 14

QuickSpecs




2. For the methods outlined in the National Institute of Standards and Technology Special Publication 800-

88.

3. Absolute agent is shipped turned off, and will be activated when customers activate a purchased subscription. Subscriptions can be purchased for terms ranging multiple years. Service is limited, check with

Absolute for availability outside the U.S. The Absolute Recovery Guarantee is a limited warranty. Certain conditions apply. For full details visit: http://www.absolute.com/company/legal/agreements/ computraceagreement. Data Delete is an optional service provided by Absolute Software. If utilized, the Recovery

Guarantee is null and void. In order to use the Data Delete service, customers must first sign a Pre-

Authorization Agreement and either obtain a PIN or purchase one or more RSA SecurID tokens from

Absolute Software.

4. This product ships with TPM 1.2 with option to upgrade to TPM 2.0. Upgrade utility is expected to be available by the end of 2016 via HP Customer Support

5. HP Mobile Connect Pro is only available on preconfigured devices with WWAN. For geographic availability refer to http://www.hp.com/go/mobileconnect

6. Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming media players that also support Miracast. You can use Miracast to share what you’re doing on your PC and present a slide show. For more information: http://windows.microsoft.com/en-us/windows-8/projectwireless-screen-miracast

7. Requires an Internet connection to HP web-enabled printer and HP ePrint account registration (for a list of eligible printers, supported documents and image types and other HP ePrint details, see http://www.hp.com/go/eprintcenter ). 8. Skype is not offered in China.

9. Not preinstalled, however available for download at http://www.hp.com/go/clientmanagement

10. Subscription required.

11. Opt in and internet connection required for updates.

POWER

Power Supply 1

HP 45W Smart AC Adapter

HP 45W Smart AC Adapter (2 prong)


HP 65W Smart EM Adapter

1. Availability may vary by country.

Power cord

Power cord included is 1.8 m (+/- 0.1 m) or 1.0 m (+/- 0.1 m).

Primary Battery

HP 3-cell Long Life Prismatic (48 WHr)

NOTE: Battery is internal and not replaceable by customer.

Battery Life

1

Platform Other HW Details Battery UMA Graphics

HP ProBook 645 G3

HP ProBook 645 G3

HDD

SSD

3-cell (48WHr)

3-cell (48WHr)

Up to 8 hrs

Up to 9 hrs 15 mins


Page 15

QuickSpecs




HP ProBook 655 G3

HP ProBook 655 G3

HDD

SSD

3-cell (48WHr)

3-cell (48WHr)

Up to 7 hrs 45 mins

Up to 9 hrs 30 mins

System Standby Time

2

TBD

1. Windows 10 MM14 battery life will vary depending on various factors including product model, configuration, loaded applications, features, use, wireless functionality, and power management settings. The maximum capacity of the battery will naturally decrease with time and usage. See www.bapco.com for additional details.

2. Standby life will vary depending on various factors including battery, Memory, CPU, EC and LAN chip. The maximum capacity of the battery will naturally decrease with time and usage.

WEIGHTS & DIMENSIONS

HP ProBook 645 Notebook PC

Weight

Starting at 4.30 lbs (1.95 kg) 1

(3-cell battery, ODD weight saver, UMA, no FPR, 1 SODIMM, WLAN only, SSD, touchpad only, no camera, no WWAN)

Dimensions (w x d x h)

13.39 x 9.33 x 1.06 in (Front and rear)

2

34.0 x 23.7 x 2.70 cm (Front and rear) 2

HP ProBook 655 Notebook PC

Weight

Starting at 5.10 lbs ( 2.31 kg)

1

(3-cell battery, ODD weight saver, UMA, no FPR, 1 SODIMM, WLAN only, SSD, touchpad only, no camera, no WWAN)

Dimensions (w x d x h)

14.88 x 10.11 x 1.08 in (Front and rear)

2

37.8 x 25.70 x 2.74 cm (Front and rear) 2

1. Weight varies by configuration and components.

2. Height varies depending upon where on the notebook the measurement is made.

PORTS/SLOTS

Ports

1 USB Type-C™

1 USB 3.0 port

1 USB 3.0 port charging


Page 16

QuickSpecs




1 RJ-45 / Ethernet

1 Docking connector

1 Headphone / Microphone (Combo jack )

1 AC port ( 4.5mm )

1 DisplayPort™ 1.2

1 VGA port

1 Optional Serial port (Only available on HP ProBook 655)

1


SD Media Reader Slot

Supports SD, SDHC, SDXC

SERVICE AND SUPPORT

HP Services offers 3-year and 1-year limited warranties and 90 day software support options depending on country. Batteries have a default one year limited warranty except for Long Life batteries which will have same 1-year or 3-year limited warranty as the platform. On-site service

1,2 and extended coverage is also available. HP Care Pack Services are optional extended service contracts that go beyond the standard limited warranties. To choose the right level of service for your HP product, use the HP Care Pack Services Lookup Tool at: http://www.hp.com/go/cpc .


2. Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. HP services are governed by the applicable HP terms and conditions of service provided or indicated to Customer at the time of purchase. Customer may have additional statutory rights according to applicable local laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty provided with your HP Product. To choose the right level of service for your HP product, use the HP Care Pack Services Lookup Tool at: http://www.hp.com/go/cpc

DISPLAYS

Note: All specifications represent the typical specifications provided by HP's component manufacturers; actual performance may vary either higher or lower.

14.0” diagonal FHD AG WLED SVA 60%cg 300nits eDP Slim Touch

Active Area (W x H)

Dimensions (W x H)

Diagonal Size

Thickness

Weight

309.40 x 173.95 (mm)

320.9 x 205.6 (mm) max

14 (inch)

3.0 (mm) max

430 g max


Page 17

QuickSpecs




Interface

Surface Treatment

Contrast Ratio

Refresh Rate

Brightness

Pixel Resolution - Format

PPI

Pixel Resolution - Configuration

Backlight

Color Gamut Coverage

Color Depth

Viewing Angle

Touch Enabled

Touch Point Supported

Other Features

Pen Enabled

14.0” FHD AG WLED SVA 60%cg 300nits eDP Slim



Diagonal Size

Thickness

Weight

Interface


Contrast Ratio

Refresh Rate

Brightness


PPI


Backlight


Color Depth

Viewing Angle

Touch Enabled


Other Features

Pen Enabled eDP 1.2

BV

300:1 (typical)

60 Hz

300 nits

1920 x 1080 (FHD)

157

RGB

LED

60%

6 bits + Hi FRC

SVA 45/45/25/35

Optional

10-point multi-touch

AS

No

309.40 x 173.95 (mm)

320.9 x 205.6 (mm) max

14 (inch)

3.0 (mm) max

270 g max eDP 1.2

Anti-Glare (AG)

300:1 (typical)

60 Hz

300 nits

112

1920 x 1080 (FHD)

RGB

LED

60%

AS

No

6 bits + Hi FRC

SVA 45/45/25/35

Optional



Page 18

QuickSpecs




14.0” diagonal HD AG WLED SVA 45%cg 220nits eDP Slim



Diagonal Size

Thickness

Weight

Interface


Contrast Ratio

Refresh Rate

Brightness


PPI


Backlight


Color Depth

Viewing Angle

Touch Enabled


Other Features

Pen Enabled

15.6” diagonal FHD AG WLED SVA 60%cg 300nits eDP Slim

3.2mm Touch



Diagonal Size

Thickness

Weight

Interface


Contrast Ratio

Refresh Rate

Brightness


PPI


Backlight


Color Depth

344.2 x 193.5 (mm)

360 x 224.3 (mm) max

15.6 (inch)

3.2 (mm) max

550 g max eDP 1.2

BV

400:1 (typical)

60 Hz

300 nits

142

1920 x 1080 (FHD)

RGB

LED

60%

6 bits


309.40 x 173.95 (mm)

320.9 x 205.6 (mm) max

14 (inch)

3.0 (mm) max

290 g max eDP 1.2

Anti-Glare (AG)

300:1 (typical)

60 Hz

220 nits

112

1366 x 768 (HD)

RGB

LED

45%

6 bits + Hi FRC

SVA 45/45/25/35

Optional


AS

No

Page 19

QuickSpecs




Viewing Angle


Other Features

Pen Enabled

15.6” FHD AG WLED SVA 60%cg 300nits eDP Slim 3.2mm



Diagonal Size

Thickness

Weight

Interface


Contrast Ratio

Refresh Rate

Brightness


PPI


Backlight


Color Depth

Viewing Angle


Other Features

Pen Enabled

15.6” diagonal HD AG WLED SVA 45%cg 220nits eDP Slim



Diagonal Size

Thickness

Weight

Interface


Contrast Ratio

Refresh Rate

Brightness


PPI


344.2 x 193.5 (mm)

360 x 224.3 (mm) max

15.6 (inch)

3.2 (mm) max

360 g max eDP 1.2

Anti-Glare (AG)

400:1 (typical)

60 Hz

300 nits

101

1920 x 1080 (FHD)

RGB

LED

60%

6 bits

SVA 45/45/25/35


AS

No

344.2 x 193.5 (mm)

360 x 224.3 (mm) max

15.6 (inch)

3.2 (mm) max

370 g max eDP 1.2

Anti-Glare (AG)

300:1 (typical)

60 Hz

220 nits

101

1366 x 768 (HD)

RGB


SVA 45/45/25/35

Optional


AS

Page 20

QuickSpecs


Backlight


Color Depth

Viewing Angle



LED

45%

6 bits + Hi FRC

SVA 45/45/25/35

STORAGE

HDD 500 GB 7200RPM 7mm SATA

Capacity

Drive Weight

Rotation Speed

Cache Buffer

NAND Type/Size

Height

Width

Interface

Interface Transfer Rate

Seek Time

Logical Blocks

Operating Temperature

Security Features

Other Features

HDD 500GB 7200RPM 7mm FIPS SATA Opal2

Capacity

Drive Weight

Rotation Speed

Cache Buffer

500GB

0.20-0.21 lbs (92-95 g)

7200 rpm

7mm

69.85mm

ATA-8, SATA 3.0

600 MB/s

Single Track

1.5-2 ms

Average

Maximum

Up to 32MB

N/A

11-13 ms

18-22 ms

976,773,168

32° to 140° F (0° to 60° C) [top cover temp]

ATA Security

S.M.A.R.T., NCQ, Ultra DMA

500 GB

0.21 lbs (95 g)

7200 rpm

32 MB


Page 21

QuickSpecs




NAND Type/Size

Height

Width

Interface


Seek Time

Logical Blocks



Other Features

N/A

0.28 in (7 mm)

2.75 in (69.85 mm)

ATA-8, SATA 3.0

600 MB/s

Single Track

1.5 ms

Average

Maximum

12 ms

21 ms

976,773,168


ATA Security; TCG Opal 2.x, FIPS


HDD 500GB 7200RPM 7mm SED SATA Opal2

Capacity

Drive Weight

Rotation Speed

Cache Buffer

NAND Type/Size

Height

Width

Interface


Seek Time

500 GB

0.21 lbs (95 g)

7200 rpm

32 MB

N/A

0.28 in (7 mm)

2.75 in (69.85 mm)

ATA-8, SATA 3.0

600 MB/s

Single Track

1.5 ms

Average

12 ms

Logical Blocks



Other Features

Maximum

21 ms

976,773,168


ATA Security; TCG Opal 2.x


SSD 128GB 2280 M2 SATA-3 Value

Form-Factor (I/O)

Capacity

NAND Type

M.2 2280

128 GB

MLC/TLC


Page 22

QuickSpecs




Weight

Height

Width

Interface

Sequential Read

Sequential Write

Logical Blocks



Other Features

SSD 256GB 2280 M2 PCIe-3x4 SS NVMe TLC


Capacity

NAND Type

Weight

Height

Width

Interface

Sequential Read


Logical Blocks



Other Features

SSD 512GB 2280 M2 PCIe-3x4 SS NVMe TLC


Capacity

NAND Type

Weight

Height

Width

Interface

Sequential Read


Logical Blocks



M.2 2280

256 GB

TLC

0.02 lb (10 g)

0.09 in (2.3 mm)

0.87 in (22 mm)

PCIe NVMe Gen3X4

1,800 ~2,600 MB/s

600 900 MB/s

500,118,192

32° to 158°F (0° to 70°C) [ambient temp]

ATA Security (Option)

TRIM; L1.2

M.2 2280

512 GB

TLC

0.02 lb (10 g)

0.09 in (2.3 mm)

0.87 in (22 mm)

PCIe NVMe Gen3X4

1,580 ~ 2,600 MB/s

300 ~ 1,400 MB/s

1,000,215,216




0.01-0.02 lb (6-10 g)

0.09 in (2.3 mm)

0.87 in (22 mm)

ATA-8, SATA 3.0

520 ~ 535 MB/s

185 ~ 515 MB/s

250,069,680



DIPM; TRIM; DEVSLP

Page 23

QuickSpecs




Other Features

TRIM; L1.2

SSD 256GB 2280 M2 SATA-3 Self Encrypted OPAL2 Three Layer Cell


M.2 2280

Capacity

NAND Type

256 GB

TLC

Weight

Height

Width

0.02 lb (10 g)

0.09 in (2.3 mm)

0.87 in (22 mm)

Interface

Sequential Read


Logical Blocks



Other Features

ATA-8, SATA 3.0

515 ~ 530 MB/s

490 ~ 515 MB/s

500,118,192


ATA Security; TCG Opal 2.0

DIPM; TRIM; DEVSLP

SSD 360GB 2280 PCIe-3x4 SS NVMe TLC


Capacity

NAND Type

Weight

Height

Width

Interface

Sequential Read


Logical Blocks



Other Features

256 GB PCIe Gen3x4 NVMe SS Value Solid State

Drive


Capacity

NAND Type

Weight

Height

M.2 2280

360 GB

TLC

0.02 lb (10 g)

0.09 in (2.3 mm)

0.87 in (22 mm)

PCIe NVMe Gen3X4

1,700 MB/s (Compressible Performance)

600 MB/s (Compressible Performance)

703,282,608



TRIM; L1.2

M.2 2280

256 GB

TLC

0.02 lb (10 g)

0.09 in (2.3 mm)


Page 24

QuickSpecs


Width

Interface

Sequential Read


Logical Blocks



Other Features

512 GB PCIe Gen3x4 NVMe Value Solid State

Drive


Capacity

NAND Type

Weight

Height

Width

Interface

Sequential Read


Logical Blocks



Other Features

OPTICAL DRIVES

DVDROM Drive



0.87 in (22 mm)

PCIe NVMe Gen3X4



500,118,192



TRIM; L1.2

M.2 2280

512 GB

TLC

0.02 lb (10 g)

0.09 in (2.3 mm)

0.87 in (22 mm)

PCIe NVMe Gen3X4



1,000,215,216



TRIM; L1.2

Access Times

Weight

Max Data Transfer Rate

Interface

Supported Media (read)

Random

<140ms CD (typical)

< 160ms DVD (typical)

150g max.

24X CD-ROM

8X DVD-ROM

5X DVD-RAM

UDMA Mode 5

Gen 1 SATA

CD-DA, CD-TEXT, CD-ROM, CD-ROM XA, MIXED MODE

CD, CD-I, CD-I Bridge (Photo-CD, Video CD),

Multisession CD (Photo-CD, CD-EXTRA, Portfolio, CD-

R, CD-RW), CD-R, CD-RW, DVD-ROM (DVD-5, DVD-9,

DVD-10, DVD-18), DVD-R, DVD-RW, DVD+R,


Page 25

QuickSpecs




DVD+RW, DVD-RAM

DVD+/-RW SuperMulti DL Drive

Max Media Capacity

(read)

Transport

Access Times

Weight


Transfer Mode

Interface


8.5 GB

Tray Loading

Random

<140ms CD (typical)

< 160ms DVD (typical)

150g max.

24X CD-ROM

8X DVD-ROM

24X CD-R

10X CD-RW

8X DVD+R

8X DVD+RW

8X DVD-R

6X DVD-RW

6X - DVD+R Dual Layer

6X - DVD-R Dual Layer

5X DVD-RAM

UDMA Mode 5

Gen 1 SATA






DVD+RW, DVD-RAM

BD Drive


(read)


(write)

Transport

8.5 GB

8.5 GB

Access Times

Weight


Tray Loading

<200ms CD (typical)

Random

<200ms DVD (typical)

<250ms BD (typical)

150g max.

24X CD-ROM

8X DVD-ROM


Page 26

QuickSpecs




Transfer Mode

Interface


6X BD-ROM

24X CD-R

10X CD-RW

8X DVD+R

8X DVD+RW

8X DVD-R

6X DVD-RW

6X - DVD+R Dual Layer

6X - DVD-R Dual Layer

5X DVD-RAM

4X BD-R

2X BD-RE

UDMA Mode 5

Gen 1 SATA






DVD+RW, DVD-RAM, BD-ROM, BD-R, BD-RE


(read)


(write)

Transport

128 GB

128 GB

Tray Loading

NETWORKING

HP lt4120 Qualcomm® Snapdragon™ X5 LTE Mobile Broadband Module*

Technology/Operating bands LTE: 2100 (Band 1), 1900 (Band 2), 1800 (Band 3),

1700/2100 (Band 4), 850 (Band 5), 2600 (Band 7), 900 (Band 8),

700 (Band 12 lower), 700 (Band 13 upper), 700 (Band 17 lower),

800 (Band 20), 700 (Band 28).


Page 27

QuickSpecs




HSPA+: 2100 (Band 1), 1900 (Band 2), 1700/2100 (Band 4),

850 (Band 5), 900 (Band 8) MHz

EV-DO: 850 (BC0), 1900 (BC1) MHz (Only work with Verizon network)

E-GPRS: 1900 (Band 2), 1800 (Band 3), 850 (Band 5), 900 (Band 8)

MHz

Wireless protocol standards

3GPP Release 10 LTE Specification CAT.4, 20MHz BW

WCDMA R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification

1xEVDO Release 0, A and B.

E-GPRS: Class B, Multi-slot class 12, coding schemes CS1 - CS4 and MSC1 - MSC9

GPS

GPS bands

Standalone, A-GPS (MS-A, MS-B and XTRA)

1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz

Maximum data rates

LTE: 150 Mbps (Download), 50 Mbps (Upload)

DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)

HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)

CDMA 1xRTT: 153.6 kbps (Download), 153.6 kbps (Upload)

EVDO Rel.A: 3.1 Mbps (Download), 1.8 Mbps (Upload)

EVDO Rel.B: 14.7 Mbps (Download), 5.4Mbps (Upload)

EDGE: 236.8 kbps (Download), 236.8 kbps (Upload)

GPRS: 85.6 kbps(Download), 85.6 kbps (Upload)

Maximum output power

LTE: 23 dBm

HSPA+: 23.5 dBm

1xRTT/EVDO: 24dBm

E-GPRS 1900/1800: 26 dBm

E-GPRS 900/850: 27 dBm

GPRS 1900/1800: 29.5 dBm


Page 28

QuickSpecs


GPRS 900/850: 32.5 dBm

Maximum power consumption LTE: 1,200 mA (peak); 900 mA (average)

HSPA+: 1,100 mA (peak); 800 mA (average)

1xRTT/EVDO: 1,000 mA (peak); 700 mA (average)

E-GPRS: 2,800 mA (peak); 500 mA (average)

Form Factor

Weight

M.2, 3042-S3 Key B

Dimensions

(Length x Width x Thickness)

6.2 g

42 x 30 x 2.3 mm



* Mobile Broadband is an optional feature. Connection requires wireless data service contract, network support, and is not available in all areas. Contact service provider to determine the coverage area and availability. Connection speeds will vary due to location, environment, network conditions, and other factors. 4G LTE not available on all products or in all countries.

HP lt4132 LTE/HSPA+ 4G Mobile Broadband Module

Technology/Operating bands LTE: 2100 (Band 1), 1900 (Band 2), 1800 (Band 3) MHz,

850 (Band 5), 2600 (Band 7), 900 (Band 8) MHz,

800 (Band 20), 700 (Band 28) MHz.

HSPA+: 2100 (Band 1), 1900 (Band 2), 850 (Band 5), 900 (Band 8) MHz

E-GPRS: 1900 (Band 2), 1800 (Band 3), 850 (Band 5), 900 (Band 8) MHz


3GPP Release 10 LTE Specification CAT.4, 20MHz BW

WCDMA R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification


GPS

GPS bands

Standalone, A-GPS (MS-B and LTO)

1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz


LTE: 150 Mbps (Download), 50 Mbps (Upload)


Page 29

QuickSpecs


DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)

HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)

EDGE: 236.8 kbps (Download), 236.8 kbps (Upload)

GPRS: 85.6 kbps(Download), 85.6 kbps (Upload)




LTE: 23 dBm

HSPA+: 23.5 dBm

E-GPRS 1900/1800: 26 dBm

E-GPRS 900/850: 27 dBm

GPRS 1900/1800: 29.5 dBm

GPRS 900/850: 32.5 dBm

Maximum power consumption LTE: 1,200 mA (peak); 900 mA (average)



Form Factor

M.2, 3042-S3 Key B

6 g

Weight

Dimensions


42 x 30 x 2.3 mm

* Mobile Broadband is an optional feature. Connection requires wireless data service contract, network support, and is not available in all areas. Contact service provider to determine the coverage area and availability. Connection speeds will vary due to location, environment, network conditions, and other factors. 4G LTE not available on all products or in all countries.

HP hs3210 HSPA+ Mobile Broadband Module*

Technology/Operating bands


HSPA+: 2100 (Band1), 1900 (Band 2), 850 (Band 5), 900 (Band 8) MHz

E-GPRS: 1900 (Band 2), 1800 (Band 3), 850 MHz (Band 5), 900 (Band 8) MHz

WCDMA R99, 3GPP Release 5, 6 and 7 UMTS Specification


Page 30

QuickSpecs







HSPA+: 21.6 Mbps (Download), 5.76 Mbps (Upload)

E-GPRS: 296 kbps (Download), 236.8 kbps (Upload)

GPRS: 107 kbps (Download), 85.6 kbps (Upload)

HSPA+: 24 dBm

E-GPRS 1800/1900: 26 dBm

E-GPRS 850/900: 27 dBm

GPRS 1800/1900: 30 dBm

GPRS 850/900: 33 dBm

Maximum power consumption



M.2, 2242-S3 Key B

Form Factor

Weight

Dimensions


6 g

1.65 x 8.66 x 0.09 in (42 x 22 x 2.38 mm)

* Mobile Broadband is an optional feature. Connection requires wireless data service contract, network support, and is not available in all areas. Contact service provider to determine the coverage area and availability. Connection speeds will vary due to location, environment, network conditions, and other factors.

Intel® Dual Band Wireless-AC 3168 802.11 a/b/g/n/ac (1x1) Wi-Fi® and Bluetooth® 4.2 Combo

Wireless LAN Standards IEEE 802.11a

IEEE 802.11b

IEEE 802.11g

IEEE 802.11n

IEEE 802.11ac

Interoperability

Frequency Band

Wi-Fi certified

802.11b/g/n

 2.402 – 2.482 GHz


Page 31

QuickSpecs




Data Rates

Modulation

Security 1

Network Architecture

Models

Roaming

Output Power

2

Note:

The FCC has declared as of January 1, 2015 products that utilize passive scanning on channel 12/13 and are capable of transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.

802.11a/n

 4.9 – 4.95 GHz (Japan)

 5.15 – 5.25 GHz

 5.25 – 5.35 GHz

 5.47 – 5.725 GHz

 5.825 – 5.850 GHz

Note:

Indonesia only supports 5.725 - 5.825 GHz (CH149 - CH161)

 802.11b: 1, 2, 5.5, 11 Mbps

 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps

 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps

 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)

 802.11ac : MCS0 ~ MCS

9 , (1SS) (20MHz, 40MHz, and

80MHz)

Direct Sequence Spread Spectrum

BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM

 IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only

 AES-CCMP: 128 bit in hardware

 802.1x authentication

 WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.

 WPA2 certification

 IEEE 802.11i

 Cisco Certified Extensions, all versions through CCX4 and CCX

Lite

 WAPI

Ad-hoc (Peer to Peer)

Infrastructure (Access Point Required)

IEEE 802.11 compliant roaming between access points

 802.11b : +16dBm minimum

 802.11g : +14dBm minimum


Page 32

QuickSpecs


Power Consumption

Power Management

Receiver Sensitivity

Antenna type

3

 802.11a : +14dBm minimum

 802.11n HT20(2.4GHz) : +14dBm minimum


 802.11n HT20(5GHz) : +14dBm minimum


 802.11ac 80MHz(5GHz) : +11dBm minimum

Transmit: 2.0 W (max)

Receive: 1.6 W (max)

Idle mode (PSP): 180 mW (WLAN Associated)

Idle mode: 50 mW (WLAN unassociated)

Connect Standby: 10 mW (WLAN+BT)

Radio disabled: 5 mW

ACPI and PCI Express compliant power management

802.11 compliant power saving mode

802.11b, 1Mbps : -94dBm maximum


802.11g, 6Mbps : -88dBm maximum


802.11a, 6Mbps : -88dBm maximum


802.11n, MCS07 : -69dBm maximum


802.11ac, 1SS, MCS-0 : -86dBm maximum




High efficiency antenna with spatial diversity, mounted in the display


Page 33



QuickSpecs




Form Factor

Dimensions enclosure

Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications

PCI-Express M.2 MiniCard

Type 2230 : 2.3 x 22.0 x 30.0 mm

Or

Type 1630 : 2.3 x 16.0 x 30.0 mm

Weight

Operating Voltage

Temperature

Humidity

Type 2230 : 2.8g

Or

Type 1630 : 2g

3.3v +/- 9%

Operating

Non-operating

Operating

Non-operating

14° to 158° F (–10° to 70° C)

–40° to 176° F (–40° to 80° C)

10% to 90% (non-condensing)


Altitude Operating

Non-operating

0 to 10,000 ft (3,048 m)

0 to 50,000 ft (15,240 m)

LED Activity LED Amber – Radio OFF; LED White – Radio ON

1. Check latest software/driver release for updates on supported security features.

2. Maximum output power may vary by country according to local regulations.

3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM modulation).

HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology

Bluetooth Specification

Frequency Band

Number of Available Channels

4.0/4.1/4.2 Compliant

2402 to 2480 MHz

Legacy : 0~79 (1 MHz/CH)

BLE : 0~39 (2 MHz/CH)

Data Rates and Throughput

Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps

BLE : 1 Mbps data rate; throughput up to 0.2 Mbps


Page 34

QuickSpecs




Transmit Power

Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice channels

Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)

The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of + 4 dBm for BR and EDR.


Legacy


Range

Electrical Interface

Bluetooth Software Supported

Link Topology



Security


Certifications

Security

Certifications

Modulation

GFSK

π/4-DQPSK

8DPSK

Peak (Tx) 330 mW

Peak (Rx) 230 mW

Selective Suspend 17 mW

Legacy Up to 33 ft (10 m)

BLE Up to 99 ft (30 m)

USB 2.0 compliant

0.01% BER

-80 dBm

-80 dBm

-80 dBm

Microsoft Windows Bluetooth Software

0.001% BER

-70 dBm

-70 dBm

-70 dBm

Point to Point, Multipoint Pico Nets up to 7 slaves

Full support of Bluetooth Security Provisions

Microsoft Windows ACPI, and USB Bus Support

Self-configurable to optimize power conservation in all operating modes, including Standby, Hold, Park, and Sniff

All necessary regulatory approvals for supported countries, including:

FCC (47 CFR) Part 15C, Section 15.247 & 15.249


Page 35

QuickSpecs


Bluetooth Profiles Supported




Certifications

Certifications


ETS 300 328, ETS 300 826

Low Voltage Directive IEC950

UL, CSA, and CE Mark

Serial Port Profile (SPP)

1.2

Service Discovery Application Profile (SDAP)

Dial-Up Networking (DUN)

1.1

Generic Object Exchange Profile (GOEP)

1,2

Object Push Profile (OPP)

1,2

Hard Copy Cable Replacement (HCRP)

1,2

Personal Area Networking Profile (PAN)

1.0

Human Interface Device Profile (HID)

1.0

Hands Free Profile (HFP)

1.5/1.6

Advanced Audio Distribution Profile (A2DP) 1.3

Audio Video Remote Control Profile (AVRCP)

1.3/1.4

Bluetooth V4.1/V4.2 support feature

V4.1: ESR5/6/7 compliant

V4.2: ESR8 compliant, LE Secure Connection – Basic.

Realtek 802.11b/g/n (1x1) and Bluetooth® 4.0 Combo


IEEE 802.11b

IEEE 802.11g

IEEE 802.11n

IEEE 802.11ac


Frequency Band

Wi-Fi certified

802.11b/g/n

 2.402 – 2.482 GHz


Page 36

QuickSpecs




Data Rates

Modulation

Security 1


Models

Roaming

Output Power

2

Note:


802.11a/n

 4.9 – 4.95 GHz (Japan)

 5.15 – 5.25 GHz

 5.25 – 5.35 GHz

 5.47 – 5.725 GHz

 5.825 – 5.850 GHz

Note:

Indonesia only supports 5.725 - 5.825 GHz (CH149 - CH161)

 802.11b: 1, 2, 5.5, 11 Mbps

 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps

 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps


 802.11ac : MCS0 ~ MCS

9 , (1SS) (20MHz, 40MHz, and

80MHz)








 IEEE 802.11i


Lite

 WAPI







Page 37

QuickSpecs





Antenna type

3






 802.11ac 80MHz(5GHz) : +11dBm minimum





















High efficiency antenna with spatial diversity, mounted in the display


Page 38



QuickSpecs




Form Factor

Dimensions enclosure



Type 2230 : 2.3 x 22.0 x 30.0 mm

Or

Type 1630 : 2.3 x 16.0 x 30.0 mm

Weight


Temperature

Humidity

Type 2230 : 2.8g

Or

Type 1630 : 2g

3.3v +/- 9%

Operating

Non-operating

Operating

Non-operating

14° to 158° F (–10° to 70° C)

–40° to 176° F (–40° to 80° C)




Non-operating

0 to 10,000 ft (3,048 m)

0 to 50,000 ft (15,240 m)







Frequency Band



2402 to 2480 MHz


BLE : 0~39 (2 MHz/CH)





Page 39

QuickSpecs




Transmit Power

Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice channels




Legacy


Range



Link Topology



Security


Certifications

Security

Certifications

Modulation

GFSK

π/4-DQPSK

8DPSK

Peak (Tx) 330 mW

Peak (Rx) 230 mW




USB 2.0 compliant

0.01% BER

-80 dBm

-80 dBm

-80 dBm


0.001% BER

-70 dBm

-70 dBm

-70 dBm








Page 40

QuickSpecs






Certifications

Certifications


ETS 300 328, ETS 300 826



Serial Port Profile (SPP)

1.2


Dial-Up Networking (DUN)

1.1

Generic Object Exchange Profile (GOEP)

1,2

Object Push Profile (OPP)

1,2

Hard Copy Cable Replacement (HCRP)

1,2

Personal Area Networking Profile (PAN)

1.0

Human Interface Device Profile (HID)

1.0

Hands Free Profile (HFP)

1.5/1.6


Audio Video Remote Control Profile (AVRCP)

1.3/1.4




Intel® Dual Band Wireless-AC 7265 802.11a/b/g/n/ac (2x2) WiFi and Bluetooth® 4.2 Combo


IEEE 802.11b

IEEE 802.11g

IEEE 802.11n

IEEE 802.11ac


Frequency Band

Wi-Fi certified

802.11b/g/n


Page 41

QuickSpecs




Data Rates

Modulation

Security 1


Models

Roaming

Output Power

2

 2.402 – 2.482 GHz

Note:


802.11a/n

 4.9 – 4.95 GHz (Japan)

 5.15 – 5.25 GHz

 5.25 – 5.35 GHz

 5.47 – 5.725 GHz

 5.825 – 5.850 GHz

Note: Indonesia no support this band)

 802.11b: 1, 2, 5.5, 11 Mbps

 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps

 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps


 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)








 IEEE 802.11i


Lite

 WAPI







Page 42

QuickSpecs





Antenna type

3


























High efficiency antenna with spatial diversity, mounted in the display enclosure


Page 43



QuickSpecs




Form Factor

Dimensions

Weight


Temperature

Humidity



Type 2230 : 2.3 x 22.0 x 30.0 mm

Or

Type 1630 : 2.3 x 16.0 x 30.0 mm

Type 2230 : 2.8g

Or

Type 1630 : 2g

3.3v +/- 9%

Operating

Non-operating

Operating

Non-operating

14° to 158° F (–10° to 70° C)

–40° to 176° F (–40° to 80° C)




Non-operating

0 to 10,000 ft (3,048 m)

0 to 50,000 ft (15,240 m)







Frequency Band




2402 to 2480 MHz


BLE : 0~39 (2 MHz/CH)



Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice


Page 44

QuickSpecs




Transmit Power


Legacy


Range

channels



Modulation

GFSK

π/4-DQPSK

8DPSK

0.01% BER

-80 dBm

-80 dBm

-80 dBm

0.001% BER

-70 dBm

-70 dBm

-70 dBm

Peak (Tx) 330 mW

Peak (Rx) 230 mW




USB 2.0 compliant




Link Topology



Security


Certifications

Security

Certifications









Page 45

QuickSpecs



Certifications

Certifications




ETS 300 328, ETS 300 826



Serial Port Profile (SPP) 1.2


Dial-Up Networking (DUN) 1,1

Generic Object Exchange Profile (GOEP) 1,2

Object Push Profile (OPP) 1,2

Hard Copy Cable Replacement (HCRP) 1,2

Personal Area Networking Profile (PAN) 1.0

Human Interface Device Profile (HID) 1.0

Hands Free Profile (HFP) 1.5/1.6


Audio Video Remote Control Profile (AVRCP) 1.3/1.4


POWER

45 W AC Adaptor

Dimensions

Weight

Input

Output

DC Plug



Input Efficiency

Input Frequency Range

Input AC current

Output Power

DC Output

Hold-up Time

Output Over Current Protection

95.0x40.0x26.5mm unit: 200g +/- 10g

87.74 % at 115 Vac and 88.4 % at 230Vac

47 ~ 63 Hz

Max. 1.4 A at 90 Vac

45W

19.5V

5ms at 115 Vac input

<8.0A

4.5mm Barrel Type


Page 46

QuickSpecs





Environmental Design

32 o

F to 95 o

F (0 o to 35 o

C)

Non-operating (storage) Temperature -4 o F to 185 o F (-20 o to 85 o C)

Altitude

Humidity

Storage Humidity

0 to 16,400 ft (0 to 5000m)

20% to 95%

10% to 95%

EMI and Safety Certifications

*CE Mark - full compliance with LVD and EMC directives

* Worldwide safety standards - IEC60950, EN60950,

UL60950, Class1, SELV; Agency approvals - C-UL-US,

NORDICS, DENAN, EN55022 Class B, FCC Class B, CISPR22

Class B, CCC, NOM-1 NYCE.

* MTBF - over 200,000 hours at 25°C ambient condition.

45 W 2 Prong AC Adaptor

Dimensions

Weight

Input

Output

DC Plug





Output Power

DC Output

Hold-up Time



95.0x40.0x26.5mm unit: 200g +/- 10g

87.74 % at 115 Vac and 88.4 % at 230Vac

47 ~ 63 Hz


45W

19.5V


<8.0A

4.5mm Barrel Type

32 o F to 95 o F (0 o to 35 o C)

Non-operating (storage) Temperature -4 o

F to 185 o

F (-20 o to 85 o

C)

Altitude

Humidity


0 to 16,400 ft (0 to 5000m)

20% to 95%

10% to 95%




UL60950, Class2, SELV; Agency approvals - C-UL-US, PSE



Page 47

QuickSpecs




65 W AC Adaptor

Dimensions

Weight

Input

Output

DC Plug





Output Power

DC Output

Hold-up Time



107.0x47.0x30.0mm unit: 250g +/- 10g

88.0 % at 115 Vac and 89.0 % at 230Vac

47 ~ 63 Hz


65W

19.5V


<11.0A

4.5mm Barrel Type

32 o F to 95 o F (0 o to 35 o C)

Non-operating (storage) Temperature -4 o

F to 185 o

F (-20 o to 85 o

C)

Altitude

Humidity


0 to 16,400 ft (0 to 5000m)

20% to 95%

10% to 95%








65 W EM AC Adaptor

Dimensions

Weight

Input

Output

DC Plug





Output Power

DC Output

Hold-up Time



102.0x55.0x30.0mm unit: 350g +/- 10g

87.0 % at 115 Vac and 230Vac

47 ~ 63 Hz


65W

19.5V


<11.0A

4.5mm Barrel Type

32 o

F to 95 o

F (0 o to 35 o

C)

Non-operating (storage) Temperature -4 o F to 185 o F (-20 o to 85 o C)


Page 48

QuickSpecs


Altitude

Humidity





0 to 16,400 ft (0 to 5000m)

20% to 95%

10% to 95%







90 W AC Adaptor

Dimensions

Weight

Input

Output

DC Plug





Output Power

DC Output

Hold-up Time



127.0x51.0x30.0mm unit: 350g +/- 10g

88% min at 115V and 89% min at 230V

47 ~ 63 Hz

1.5 A at 90 VAC and maximum load

90W

19.5V


<11.0A

4.5mm Barrel Type

32 o

Fto 95 o

F (0 o to 35 o

C)

Non-operating (storage) Temperature

Altitude

Humidity


-4 o

Fto 185 o

F (-20 o to 85 o

C)

0 to 16,400 ft (0 to 5000m)

5% to 95%

5% to 95%









Page 49

QuickSpecs




HP 3-cell, Long Life 48 WHr

Li-ion

Dimensions (H x W x L)

Weight

Cells/Type

Energy

Temperature

Battery Re-Charge Time

Fuel Gauge LED

Warranty

Optional Travel Battery

Available

15.05. x177.55x94.55 mm

Voltage

Amp-hour capacity

Watt-hour capacity

Operating (Charging)

Operating (Discharging)

Non-operating

System in OFF or Standby

Mode

0.25 kg (0.55lb)

3cell Lithium-Ion

11.4V/ 10.95V

4.212Ah /4.385Ah

48Wh

32˚ to 113˚ F (0˚ to 45˚ C)

14˚ to 122˚ F(-10˚ to 60˚

C)

-4˚ to 122˚ F (-20˚ to 60˚

C)

<3 hours

No

Batteries have a default one year limited warranty except for Long Life batteries which will have same 1-year or 3-year limited warranty as the platform.

No

S

ECURITY

HP Fingerprint Reader

(optional)

Mobile Voltage Operation


Current consumption

ESD Resistance

Detection Matrix

3.0V-3.6V

14° – 167°F (-10° – 75°C)

Imaging: 36 mA (typical)

Low latency wakeup: 950 μA (typical)

USB Suspend: 220 μA (max)

IEC 61000-4-2 Level 4B (±15KV)

508 DPI resolution, 256 levels of grayscale

200 pixel wide fingerprint image (10mm)


Page 50

QuickSpecs


Smart Card Reader



16.5mm x 3 mm (sensor area)

Smart card standard

PC/SC 2.0 for Windows smart card standard

Dimensions (L x W x H) 0.41x 0.08 x 0.32 in (10.5 x 2 x 8.2 mm)

Smart Card support

Operating systems

ISO 7816 Class A, B, and C (5V/3V/1.8V) card

Smart Card Interface

Smart Card Interface with T = 0 and T = 1 support

Support I2C memory card, SLE4418, SLE4428, SLE4432, SLE4442, SLE4436,

SLE5536, SLE6636, AT88SC1608, AT45D041 card and AT45DB041 card via external EEPROM

No driver is required for this device. Native support is provided by the operating system.

Power Normal Mode

With card present, before being suspended: 40.9 mA

Without card present, before being suspended: 33.16 mA

After being suspended with smart card present: 380 μA

After being suspended without smart card present: 380 μA

Power Saving

Mode

With card present, before being suspended: 40.6 mA

Without card present: 380 μA

After being suspended with smart card present: 380 μA

Features

 Support single slot

 Support T0, T1 protocol

 Support I2C memory card, SLE4418, SLE4428, SLE4432, SLE4442,

SLE4436,

 SLE5536, SLE6636, AT88SC1608, AT45D041 card and AT45DB041 card via external EEPROM

 Support ISO7816 Class A, B and C (5V/3V/1.8V) card

 Implemented as an USB full speed device with bulk transfer endpoint,

Mass

 Storage endpoint

 Built-in PLL for USB and Smart Card clocks requirement

 Support EEPROM for USB descriptors customization (PID/VID/ iManufacturer/iProduct/Serial Number), Direct Web Page Link, and accessing memory card module.

 EEPROM programmable via USB interface

 Support software update for memory card module

 Support Direct Web Page Link via configuration in external EEPROM

 Support short APDU and extended APDU

 Compatible with Microsoft USB-CCID driver

 Support remote wake up through inserting card/removing card

 Support USB selective suspend

 Support Power Saving Mode (Using one pin to select between

Normal/PWR Saving Mode)


Page 51

QuickSpecs




 Support card power over current protection mechanism

 Built in resonator.

 Support USB LPM (Link Power Management) features.

 Embedded clock source.

ENVIRONMENTAL


Eco-Label Certifications

& declarations

This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:

System Configuration

 IT ECO declaration

 US ENERGY STAR®

 EPEAT <Gold> registered in the United States. See http://www.epeat.net for registration status in your country.

The configuration used for the Energy Consumption and Declared Noise Emissions data for the

Notebook model is based on a “Typically Configured Notebook”.

Energy Consumption

(in accordance with US

ENERGY STAR® test

method)

115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz

8.24 W 8.70 W 8.77 W Normal Operation (Short idle)

Normal Operation (Long idle)

6.84 W 7.60 W 6.70 W

Sleep

Off

0.48 W

0.29 W

0.59 W

0.38 W

0.48 W

0.29 W

Note:

Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S.


Page 52

QuickSpecs




Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a

Microsoft Windows® operating system.

Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz

Normal Operation (Short idle)


Sleep

28 BTU/hr

23 BTU/hr

30 BTU/hr

26 BTU/hr 23 BTU/hr

30 BTU/hr

2 BTU/hr 2 BTU/hr 2 BTU/hr

Off

Declared

Emissions

Noise

(in accordance with

ISO 7779 and ISO 9296)


*NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.

Sound Power

(L

WAd

, bels)

Sound Pressure

(L pAm

, decibels)

Typically Configured –

Idle

2.8 20

Fixed Disk – Random writes

Batteries

3.2

This battery(s) in this product comply with EU Directive 2006/66/EC

Batteries used in the product do not contain:

Mercury greater the1ppm by weight

Cadmium greater than 20ppm by weight

Battery size: CR2032 (coin cell)

Battery type: Lithium

20


Page 53

QuickSpecs




Additional Information

 This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive - 2011/65/EC.

 This HP product is designed to comply with the Waste Electrical and Electronic Equipment

(WEEE) Directive – 2002/96/EC.

 This product is in compliance with California Proposition 65 (State of California; Safe

Drinking Water and Toxic Enforcement Act of 1986).

 This product is in compliance with the IEEE 1680 (EPEAT) standard at the <Gold> level, see www.epeat.net

 Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and

ISO1043.

 This product contains 0% post-consumer recycled plastic (by wt.)

 This product is 94.4% recycle-able when properly disposed of at end of life.

Packaging Materials External:

PAPER/Corrugated 326 g

Material Usage

Internal:

PLASTIC/Polyethylene Expanded - EPE 42 g

PLASTIC/Polyethylene low density - LDPE

PLASTIC/Polypropylene - PP

15 g

4 g

The plastic packaging material contains at least 50% recycled content.

The corrugated paper packaging materials contains at least 70% recycled content.

This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf

): the Environment at

 Asbestos

 Certain Azo Colorants

 Certain Brominated Flame Retardants – may not be used as flame retardants in plastics

 Cadmium

 Chlorinated Hydrocarbons

 Chlorinated Paraffins

 Formaldehyde

 Halogenated Diphenyl Methanes

 Lead carbonates and sulfates

 Lead and Lead compounds

 Mercuric Oxide Batteries

 Nickel – finishes must not be used on the external surface designed to be frequently handled or carried by the user.

 Ozone Depleting Substances

 Polybrominated Biphenyls (PBBs)

 Polybrominated Biphenyl Ethers (PBBEs)

 Polybrominated Biphenyl Oxides (PBBOs)

 Polychlorinated Biphenyl (PCB)

 Polychlorinated Terphenyls (PCT)

 Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been voluntarily removed from most applications.

 Radioactive Substances

 Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)


Page 54

QuickSpecs




Packaging Usage

HP follows these guidelines to decrease the environmental impact of product packaging:

 Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials.

 Eliminate the use of ozone-depleting substances (ODS) in packaging materials.

 Design packaging materials for ease of disassembly.

 Maximize the use of post-consumer recycled content materials in packaging materials.

 Use readily recyclable packaging materials such as paper and corrugated materials.

 Reduce size and weight of packages to improve transportation fuel efficiency.

 Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

End-of-life Management and Recycling

Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.

HP, Inc. Corporate

Environmental

Information

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers . These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment.

For more information about HP’s commitment to the environment:

Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html

Eco-label certifications http://www8.hp.com/us/en/hp-information/environment/ecolabels.html

ISO 14001 certificates: http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842 and http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf



Page 55

QuickSpecs




Eco-Label Certifications

This product has received or is in the process of being certified to the following approvals and may

& declarations

be labeled with one or more of these marks:

System Configuration

 IT ECO declaration

 US ENERGY STAR®

 EPEAT Gold registered in the United States. See http://www.epeat.net for registration status in your country.

The configuration used for the Energy Consumption and Declared Noise Emissions data for the

Notebook model is based on a “Typically Configured Notebook”.

Energy Consumption

(in accordance with US

ENERGY STAR® test

method)




Sleep


Sleep

8.93 W

5.18 W

0.50 W 0.62 W 0.50 W

Off

Heat Dissipation*


0.34 W 0.44 W 0.34 W

Note:

Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S.

Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a

Microsoft Windows® operating system.




2 BTU/hr

9.59 W

5.65 W

2 BTU/hr

8.32 W

5.22 W

2 BTU/hr


Page 56

QuickSpecs




Off 1 BTU/hr 2 BTU/hr 1 BTU/hr

*NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.

Declared

Emissions

Noise

(in accordance with

ISO 7779 and ISO 9296)

Sound Power

(L

WAd

, bels)

Sound Pressure

(L pAm

, decibels)

Typically Configured –

Idle

3.3 25

Fixed Disk – Random writes

3.7 30

Batteries

Additional Information

Packaging Materials

Material Usage

This battery(s) in this product comply with EU Directive 2006/66/EC

Batteries used in the product do not contain:

Mercury greater the1ppm by weight

Cadmium greater than 20ppm by weight

Battery size: CR2032 (coin cell)

Battery type: Lithium

 This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive - 2011/65/EC.

 This HP product is designed to comply with the Waste Electrical and Electronic Equipment

(WEEE) Directive – 2002/96/EC.

 This product is in compliance with California Proposition 65 (State of California; Safe

Drinking Water and Toxic Enforcement Act of 1986).

 This product is in compliance with the IEEE 1680 (EPEAT) standard at the gold level, see www.epeat.net

 Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and

ISO1043.

 This product contains 0% post-consumer recycled plastic (by wt.)

 This product is 94.9% recycle-able when properly disposed of at end of life.

External:

PAPER/Corrugated 329 g

Internal:

PLASTIC/Expanded Polyethylene - EPE

PLASTIC/Polyethylene low density - LDPE

PLASTIC/Polypropylene - PP

47 g

13 g

5 g

The plastic packaging material contains at least 50% recycled content.

The corrugated paper packaging materials contains at least 70% recycled content.

This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at


Page 57

QuickSpecs



Technical Specifications http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf

):

 Asbestos

 Certain Azo Colorants

 Certain Brominated Flame Retardants – may not be used as flame retardants in plastics

 Cadmium

 Chlorinated Hydrocarbons

 Chlorinated Paraffins

 Formaldehyde

 Halogenated Diphenyl Methanes

 Lead carbonates and sulfates

 Lead and Lead compounds

 Mercuric Oxide Batteries

 Nickel – finishes must not be used on the external surface designed to be frequently handled or carried by the user.

 Ozone Depleting Substances

 Polybrominated Biphenyls (PBBs)

 Polybrominated Biphenyl Ethers (PBBEs)

 Polybrominated Biphenyl Oxides (PBBOs)

 Polychlorinated Biphenyl (PCB)

 Polychlorinated Terphenyls (PCT)

 Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been voluntarily removed from most applications.

 Radioactive Substances

 Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging Usage

HP follows these guidelines to decrease the environmental impact of product packaging:

 Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials.

 Eliminate the use of ozone-depleting substances (ODS) in packaging materials.

 Design packaging materials for ease of disassembly.

 Maximize the use of post-consumer recycled content materials in packaging materials.

 Use readily recyclable packaging materials such as paper and corrugated materials.

 Reduce size and weight of packages to improve transportation fuel efficiency.

 Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

End-of-life Management and Recycling

Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers . These


Page 58

QuickSpecs



Technical Specifications instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment.

HP, Inc. Corporate

Environmental

Information

For more information about HP’s commitment to the environment:

Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html

Eco-label certifications http://www8.hp.com/us/en/hp-information/environment/ecolabels.html

ISO 14001 certificates: http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842 and http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

Country of Origin

TBD


Page 59

QuickSpecs



Options and Accessories (Sold separately and availability may vary by country.)

Category

Cases

Description

HP Business Backpack

Part Number

H5M90AA

Security

Monitors

Adapters

Power

Docking

Input Device

HP Business 4 Wheel Roller Case

HP 3001pr USB 3.0 Port Replicator

HP USB-C Travel Dock

HP USB Travel Dock

HP Ultraslim Docking Station

HP Comfort Grip Wireless Mouse

HP 3-Button USB Laser Mouse

HP Ultra Mobile Wireless Mouse

HP Slim Bluetooth Mouse

HP Ultrathin Wireless Mouse

HP Stereo USB Headset

DisplayPort to HDMI Adapter

DisplayPort to DVI Adapter

HP 45W Smart AC Adapter (4.5mm)

45W 2 Prong Power Adapter, 4.5mm


HP Notebook Power Bank

HP USB External DVDRW Drive

HP Keyed Cable Lock 10mm

HP Docking Station Cable Lock

HP ProDisplay P240va 23.8-inch Monitor

HP ProDisplay P232 23-inch Monitor

H5M93AA

F3S42AA

T0K29AA#ABA

T0K30AA#ABA

D9Y32AA#xxx

H2L63AA

H4B81AA

H6F25AA#xxx

F3J92AA#xxx

L9V78AA

T1A67AA

F3W43AA

F7W96AA

H6Y88AA#xxx

L6F60AA#ABJ

H6Y89AA#xxx

N9F71AA

F2B56AA

T1A62AA

AU656AA#XXX

N3H14AA

K7X31AA


Page 60

QuickSpecs



Sumary of changes

Date of change

December 5, 2016

January 3, 2017

January 13, 2017

January 30, 2017

March 16, 2017

April 4, 2017

Version History

V1 to V2 Launch

V2 to V3 Update

V3 to V4

V4

V4 to V5

V5 to V6

Update

Update

Update

Update

Description of change

Quickspecs launched

Environmental info updated

Operating System and Processors Section updated (Win 7 disclaimer)

Battery Life Section updated

Memory and Display section updated

Battery Warranty updated and Processor Family added

Copyright © 2017 HP Development Company, L.P. The only warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. AMD and Radeon are registered trademarks or trademarks of AMD Corporation in the U.S. and/or other countries. Bluetooth is a trademark owned by its proprietor and used by

HP Inc. under license. Microsoft and Windows are either trademarks or registered trademarks of Microsoft Corporation in the U.S. and other countries. ENERGY STAR is a registered mark owned by the U.S. Environmental Protection Agency. USB Type-C™ and

USB-C™ are trademarks of USB Implementers Forum. DisplayPort™ and the DisplayPort™ logo are trademarks owned by the

Video Electronics Standards Association (VESA®) in the United States and other countries.


Page 61

HP ProBook 645 G3 Notebook PC, HP ProBook 655 G3 Notebook PC

HP ProBook 645 G3 Notebook PC

HP ProBook 655 G3 Notebook PC

T A

LANCE

POWER

ECURITY

Related manuals

DeLOCK

42295