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TDA8943SF
7 W mono Bridge Tied Load (BTL) audio amplifier
14 April 1999 Preliminary specification
1.
General description
The TDA8943SF is a single-channel audio power amplifier with an output power of
7 W at an 8
Ω
load and a 12 V supply. The circuit contains a Bridge Tied Load (BTL) amplifier with an all-NPN output stage and standby/mute logic. The TDA8943SF comes in a 9-lead single in-line (SIL) medium power package. The TDA8943SF is printed-circuit board (PCB) compatible with all other types in the TDA894x family.
One PCB footprint accommodates both the mono and the stereo products.
2.
Features
■ Few external components
■ Fixed gain
■ Standby and mute mode
■ No on/off switching plops
■ Low standby current
■ High supply voltage ripple rejection
■ Outputs short-circuit protected to ground, supply and across the load
■ Thermally protected
■ Printed-circuit board compatible, see
Table 3 “Product family overview” .
3.
Applications
■ Mains fed applications (e.g. TV sound)
■ PC audio
■ Portable audio.
4.
Quick reference data
Table 1: Quick reference data
I
I
Symbol Parameter
V q
CC stb
Conditions supply voltage quiescent supply current V
CC
= 12 V; R
L
=
∞ standby supply current -
-
Min Typ Max Unit
6 12 18 V
-
15 22
10 mA
µ
A
Philips Semiconductors
TDA8943SF
7 W mono BTL audio amplifier
Table 1: Quick reference data …continued
Symbol Parameter
P o
THD output power
Conditions
THD = 10%; R
L
= 8
Ω
;
V
CC
= 12 V total harmonic distortion P o
= 1 W
G v voltage gain
SVRR supply voltage ripple rejection
Min Typ Max Unit
6 7 W
-
31
50 -
0.03
32
-
0.1
33
% dB dB
5.
Ordering information
Table 2: Ordering information
Type number Package
Name Description
TDA8943SF SIL9MPF plastic single in-line medium power package with fin; 9 leads
Version
SOT110-1
5.1 Ordering options
Table 3: Product family overview
Type number Package Description
TDA8941P
TDA8942P
DIP8
DIP16
1.5 W mono Bridge Tied Load (BTL) audio amplifier
2 x 1.5 W stereo Bridge Tied Load (BTL) audio amplifier
TDA8943SF SIL9MPF
TDA8944J DBS17P
TDA8945S
TDA8946J
SIL9P
DBS17P
7 W mono Bridge Tied Load (BTL) audio amplifier
2 x 7 W stereo Bridge Tied Load (BTL) audio amplifier
15 W mono Bridge Tied Load (BTL) audio amplifier
2 x 15 W stereo Bridge Tied Load (BTL) audio amplifier
9397 750 04877
Preliminary specification 14 April 1999
© Philips Electronics N.V. 1999. All rights reserved.
2 of 12
Philips Semiconductors
TDA8943SF
7 W mono BTL audio amplifier
6.
Block diagram
idth
IN −
IN
+
MODE
SVR
VCC
2
TDA8943SF
1
5
4
3
VCC
7 STANDBY/
MUTE LOGIC
6
20 k
Ω k
20
Ω
SHORT CIRCUIT
AND
TEMPERATURE
PROTECTION
8
MBK942
GND
OUT
−
OUT +
Fig 1.
Block diagram.
7.
Pinning information
7.1 Pinning
handbook, halfpage
OUT
−
1
VCC
OUT
+
2
3
IN
+
4
IN
−
5 TDA8943SF
SVR 6
MODE 7
GND 8 n.c.
9
MBK941
Fig 2.
Pin configuration.
9397 750 04877
Preliminary specification 14 April 1999
© Philips Electronics N.V. 1999. All rights reserved.
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Philips Semiconductors
TDA8943SF
7 W mono BTL audio amplifier
7.2 Pin description
Table 4: Pin description
Symbol
OUT
−
V
CC
OUT+
Pin
1
2
3
IN+
IN
−
SVR
MODE
GND n.c.
6
7
4
5
8
9
Description negative loudspeaker terminal supply voltage positive loudspeaker terminal positive input negative input half supply voltage decoupling (ripple rejection) mode selection input (standby, mute, operating) ground not connected
8.
Functional description
The TDA8943SF is a mono BTL audio power amplifier capable of delivering 7 W output power to an 8
Ω
load at THD = 10%, using a 12 V power supply and an external heatsink. The voltage gain is fixed at 32 dB.
With the three-level MODE input the device can be switched from ‘standby’ to ‘mute’ and to ‘operating’ mode.
The TDA8943SF outputs are protected by an internal thermal shutdown protection mechanism and a short-circuit protection.
8.1 Power amplifier
The power amplifier is a Bridge Tied Load (BTL) amplifier with an all-NPN output stage, capable of delivering a peak output current of 1.5 A.
The BTL principle offers the following advantages:
• Lower peak value of the supply current
• The ripple frequency on the supply voltage is twice the signal frequency
• No expensive DC-blocking capacitor
• Good low frequency performance.
9397 750 04877
Preliminary specification
8.2 Mode selection
The TDA8943SF has three functional modes, which can be selected by applying the proper DC voltage to pin MODE.
Standby — In this mode the current consumption is very low and the outputs are floating. The device is in standby mode when V
MODE
> (V
CC
−
0.5 V), or when the
MODE pin is left floating.
Mute — In this mode the amplifier is DC-biased but not operational (no audio output).
This allows the input coupling capacitors to be charged to avoid pop-noise. The device is in mute mode when 2.5 V < V
MODE
< (V
CC
−
1.5 V).
14 April 1999
© Philips Electronics N.V. 1999. All rights reserved.
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Philips Semiconductors
TDA8943SF
7 W mono BTL audio amplifier
Operating — In this mode the amplifier is operating normally. The operating mode is activated at V
MODE
< 0.5 V.
9.
Limiting values
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions
I
V
V
T
T
I
CC
ORM stg amb supply voltage input voltage repetitive peak output current storage temperature operating ambient temperature operating no signal non-operating
Min
−
0.3
−
0.3
−
0.3
-
−
55
−
40
P tot
V
CC(sc) total power dissipation supply voltage to guarantee short-circuit protection
-
-
[1] Applies to all functional modes.
Max
+18
+25
Unit
V
V
V
CC
+ 0.3 V
2
+150
+85
A
°
C
°
C
<tbf>
<tbf>
W
V
10. Thermal characteristics
Table 6: Thermal characteristics
Symbol
R th(j-a)
R th(j-c)
Parameter thermal resistance from junction to ambient thermal resistance from junction to case
Conditions in free air in free air
Value Unit
65 K/W
10 K/W
11. Static characteristics
Table 7: Static characteristics
V
CC
= 12 V; T amb
= 25
°
C; R
L
= 8
Ω
; V
MODE
= 0 V; V i
= 0 V; measured in test circuit
Figure 3 ; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
I
V
CC
I q
I stb
V
O
∆
V
OUT
V
MODE
MODE supply voltage quiescent supply current standby supply current
DC output voltage differential output voltage offset mode selection input voltage mode selection input current operating
R
L
=
∞
V
MODE
= V
CC operating mode mute mode standby mode
0 < V
MODE
< V
CC
-
-
-
-
-
6
0
2.5
V
CC
−
0.5
-
-
-
-
-
-
12
15
6 -
18
22
10
200
V mA
µ
V
A mV
0.5
V
V
CC
−
1.5
V
V
CC
20
V
µ
A
[1] With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the differential output voltage offset
(∆
V
OUT
) divided by the load resistance (R
L
).
[2] The DC output voltage with respect to ground is approximately 0.5V
CC
.
[3]
∆
V
OUT
=
|
V
OUT+
−
V
OUT
−
|
.
9397 750 04877
Preliminary specification 14 April 1999
© Philips Electronics N.V. 1999. All rights reserved.
5 of 12
Philips Semiconductors
TDA8943SF
7 W mono BTL audio amplifier
12. Dynamic characteristics
Table 8: Dynamic characteristics
V
CC
= 12 V; T amb
= 25 ° C; R
L
= 8 Ω ; f = 1 kHz; V
MODE
= 0 V; measured in test circuit
Figure 3 ; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
P o output power THD = 10%
THD = 0.5%
6
4
7
5
-
-
W
W
THD
G v
Z i(dif)
V n(o)
SVRR
V o(mute) total harmonic distortion voltage gain differential input impedance noise output voltage supply voltage ripple rejection output voltage f
P o
= 1 W ripple f ripple
= 1 kHz
= 100 Hz to 20 kHz mute mode
-
-
-
31
70
50
-
-
0.03
32
90
90
<tbf>
-
-
0.1
33
110
120
50
% dB k
Ω
µ
V dB dB
µ
V
[1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance
R source
= 0
Ω
at the input.
[2] Supply voltage ripple rejection is measured at the output, with a source impedance R source
= 0
Ω at the input. The ripple voltage is a sine wave with a frequency f ripple
and an amplitude of 100 mV (RMS), which is applied to the positive supply rail.
[3] Output voltage in mute mode is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including noise.
13. Application information
handbook, full pagewidth
100 nF
VCC
2
Rsource
220 nF
IN
−
5
TDA8943SF
1 OUT
−
Vi
MICROCONTROLLER
220 nF
IN
+
4 3 OUT
+
MODE 7
SVR 6
10
µ
F
VCC
STANDBY/
MUTE LOGIC 20 k
Ω
20 k
Ω
SHORT CIRCUIT
AND
TEMPERATURE
PROTECTION
8
GND MBK943
VCC
1000
µ
F
RL
8
Ω
Fig 3.
Application diagram.
9397 750 04877
Preliminary specification
© Philips Electronics N.V. 1999. All rights reserved.
6 of 12 14 April 1999
Philips Semiconductors
TDA8943SF
7 W mono BTL audio amplifier
14. Test information
14.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611-part E is applicable and reference can be found in the Quality Reference Handbook, chapter
Quality standards for customers. The handbook can be ordered using the code
9397 750 00192.
9397 750 04877
Preliminary specification 14 April 1999
© Philips Electronics N.V. 1999. All rights reserved.
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Philips Semiconductors
15. Package outline
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
D
TDA8943SF
7 W mono BTL audio amplifier
SOT110-1
P
D
1 q
P
1
A
2 q
1 q
2
A
3
A
A
4
E pin 1 index
Z
1 b
2 e
9 b b
1 w M
L
Q c
0 5 scale
10 mm
DIMENSIONS (mm are the original dimensions)
UNIT A
A
2 max.
A
3
A
4 b b
1 b
2 mm
18.5
17.8
3.7
8.7
8.0
15.8
15.4
1.40
1.14
0.67
0.50
1.40
1.14
c
0.48
0.38
D
(1)
21.8
21.4
D
1
21.4
20.7
E
(1) e
6.48
6.20
2.54
L P
3.9
3.4
2.75
2.50
P
1
3.4
3.2
Q q q
1
1.75
1.55
15.1
14.9
4.4
4.2
q
2
5.9
5.7
w
0.25
Z
(1) max.
1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT110-1
IEC
REFERENCES
JEDEC EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-25
Fig 4.
SIL9MPF package outline.
9397 750 04877
Preliminary specification 14 April 1999
© Philips Electronics N.V. 1999. All rights reserved.
8 of 12
Philips Semiconductors
TDA8943SF
7 W mono BTL audio amplifier
16. Soldering
16.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260
°
C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg(max)
).
If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300
°
C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400
°
C, contact may be up to 5 seconds.
16.4 Package related soldering information
Table 9: Suitability of through-hole mount IC packages for dipping and wave soldering methods
Package
DBS, DIP, HDIP, SDIP, SIL
Soldering method
Dipping suitable
Wave suitable [1]
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
17. Revision history
Rev Date
01 990414 -
CPCN Description
Preliminary specification; initial version.
9397 750 04877
Preliminary specification 14 April 1999
© Philips Electronics N.V. 1999. All rights reserved.
9 of 12
Philips Semiconductors
TDA8943SF
7 W mono BTL audio amplifier
18. Data sheet status
Datasheet status
Objective specification
Preliminary specification Qualification
Product specification
Product status
Development This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice.
Production
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued data sheet before initiating or completing a design.
19. Definitions 20. Disclaimers
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance.
Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
9397 750 04877
Preliminary specification 14 April 1999
© Philips Electronics N.V. 1999 All rights reserved.
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Philips Semiconductors
TDA8943SF
7 W mono BTL audio amplifier
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For all other countries apply to: Philips Semiconductors,
Marketing & Sales Communications,
Building BE, P.O. Box 218, 5600 MD EINDHOVEN,
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Internet: http://www.semiconductors.philips.com
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Preliminary specification 14 April 1999
© Philips Electronics N.V. 1999. All rights reserved.
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16.2
16.3
16.4
17
18
19
20
Contents
5
5.1
6
7
7.1
7.2
8
8.1
8.2
3
4
1
2
9
10
11
12
13
14
14.1
15
16
16.1
General description. . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications. . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . 2
Ordering options. . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . 4
Power amplifier. . . . . . . . . . . . . . . . . . . . . 4
Mode selection . . . . . . . . . . . . . . . . . . . . . 4
Limiting values . . . . . . . . . . . . . . . . . . . . . 5
Thermal characteristics . . . . . . . . . . . . . . 5
Static characteristics . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . 6
Application information . . . . . . . . . . . . . . 6
Test information . . . . . . . . . . . . . . . . . . . . 7
Quality information . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . 8
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . 9
Soldering by dipping or by solder wave . . 9
Manual soldering . . . . . . . . . . . . . . . . . . . 9
Package related soldering information . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . 9
Data sheet status. . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . 10
TDA8943SF
7 W mono BTL audio amplifier
© Philips Electronics N.V. 1999.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Date of release: 14 April 1999 Document order number: 9397 750 04877
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