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TL331
SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
TL331 Single Differential Comparator
1 Features
1
• Single Supply or Dual Supplies
• Wide Range of Supply Voltage, 2 V to 36 V
• Low Supply-Current Drain Independent of Supply
Voltage, 0.4 mA Typ
• Low Input Bias Current, 25 nA Typ
• Low Input Offset Voltage, 2 mV Typ
• Common-Mode Input Voltage Range Includes
Ground
• Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage, ±36 V
• Low Output Saturation Voltage
• Output Compatible With TTL, MOS, and CMOS
3 Description
This device consists of a single voltage comparator that is designed to operate from a single power supply over a wide range of voltages. Operation from dual supplies also is possible if the difference between the two supplies is 2 V to 36 V and V
CC is at least 1.5 V more positive than the input commonmode voltage. Current drain is independent of the supply voltage. The output can be connected to other open-collector outputs to achieve wired-AND relationships.
PART NUMBER
PACKAGE (PIN) BODY SIZE (NOM)
TL331 SOT (5) 2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at the end of the datasheet.
2 Applications
• Hysteresis Comparators
• Oscillators
• Window Comparators
• Industrial Equipment
• Test and Measurement
4 Simplified Schematic
IN+
IN−
OUT
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
TL331
SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
www.ti.com
1
Features ..................................................................
2
Applications ...........................................................
3
Description .............................................................
4
Simplified Schematic.............................................
5
Revision History.....................................................
6
Pin Configuration and Functions .........................
7
Specifications.........................................................
7.1
Absolute Maximum Ratings ......................................
7.2
ESD Ratings..............................................................
7.3
Recommended Operating Conditions .......................
7.4
Thermal Information ..................................................
7.5
Electrical Characteristics...........................................
7.6
Switching Characteristics ..........................................
7.7
Typical Characteristics ..............................................
8
Detailed Description ..............................................
8.1
Overview ...................................................................
Table of Contents
8.2
Functional Block Diagram .........................................
8.3
Feature Description...................................................
8.4
Device Functional Modes..........................................
9
Application and Implementation ..........................
9.1
Application Information..............................................
9.2
Typical Application ...................................................
10
Power Supply Recommendations .....................
11
Layout...................................................................
11.1
Layout Guidelines .................................................
11.2
Layout Example ....................................................
12
Device and Documentation Support .................
12.1
Trademarks ...........................................................
12.2
Electrostatic Discharge Caution ............................
12.3
Glossary ................................................................
13 Mechanical, Packaging, and Orderable
Information ...........................................................
5 Revision History
Changes from Revision F (July 2008) to Revision G Page
• Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. .................................................................................................
• Deleted Ordering Information table. .......................................................................................................................................
• Deleted 25°C Specifications in Electrical Characteristics table..............................................................................................
• Changed test condition V
ID for parameter I
OL from 1 V to –1 V in Electrical Characteristics table. .......................................
2
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6 Pin Configuration and Functions
DBV PACKAGE
(TOP VIEW)
IN−
V
CC−
/GND
IN+
1
2
3
5
4
V
CC
OUT
TL331
SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
NAME
IN+
IN–
OUT
V
CC
GND
PIN
NO.
3
1
4
5
2
TYPE
O
I
I
I
I
Pin Functions
Positive Input
Negative Input
Open Collector/Drain Output
Power Supply Input
Ground
DESCRIPTION
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TL331
SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
7 Specifications
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7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
V
CC
V
ID
V
I
V
O
I
O
Supply voltage
(2)
Differential input voltage
(3)
Input voltage range (either input)
Output voltage
Output current
Duration of output short-circuit to ground
(4)
Operating virtual junction temperature
Storage temperature range
MIN
0
–36
–0.3
0
0
–40
–65
Unlimited
MAX UNIT
36 V
36
36
36
20
V
V
V mA
150
150
°C
°C
T
J
T stg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to the network ground.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to V
CC can cause excessive heating and eventual destruction.
7.2 ESD Ratings
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
VALUE
±1000
±750
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V
CC
T
J
Supply voltage
Junction Temperature
MIN
2
-40
MAX
36
125
UNIT
V
°C
7.4 Thermal Information
R
θJA
R
θJC(top)
R
θJB
ψ
JT
ψ
JB
THERMAL METRIC
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
(1)
Junction-to-board characterization parameter
TL331
DBV
5 PINS
218.3
87.3
44.9
4.3
44.1
UNIT
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953 .
4
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TL331
SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
7.5 Electrical Characteristics
at specified free-air temperature, V
CC
= 5 V (unless otherwise noted)
I
I
V
IO
IO
IB
PARAMETER
Input offset voltage
Input offset current
Input bias current
TEST CONDITIONS
(1)
V
CC
V
IC
= 5 V to 30 V, V
= V
IC(min)
O
= 1.4 V,
V
V
O
O
= 1.4 V
= 1.4 V
T
A
(2)
25°C
Full range
25°C
Full range
25°C
Full range
MIN TYP MAX UNIT
2 5 mV
9
5 50
250 nA
–25 –250
–400 nA
V
CC
0 to
– 1.5
V
I
V
A
V
ICR
VD
OH
OL
I
OL
I
CC
Common-mode input voltage range
(3)
Large-signal differential voltage amplification
High-level output current
Low-level output voltage
Low-level output current
Supply current
I
V
CC
R
L
= 15 V, V
O
= 1.4 V to 11.4 V,
≥ 15 kΩ to V
CC
V
OH
= 5 V, V
ID
= 1 V
V
V
OH
OL
OL
R
L
= 30 V, V
ID
= 4 mA, V
ID
= 1.5 V, V
= ∞, V
CC
ID
= 1 V
= –1 V
= –1 V
= 5 V
Full range
25°C
25°C
Full range
25°C
Full range
25°C
25°C
50
6
200
0.1
150
0.4
V/mV
50 nA
1
μA
400 mV
700
0.7
mA mA
(1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified.
(2) Full range T
A is –40°C to 85°C for I-suffix devices and –40°C to 105°C for K-suffix devices.
(3) The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the commonmode voltage range is V
CC+
– 1.5 V, but either or both inputs can go to 30 V without damage.
7.6 Switching Characteristics
V
CC
= 5 V, T
A
= 25°C
PARAMETER TEST CONDITIONS
100-mV input step with 5-mV overdrive
Response time R
L connected to 5 V through 5.1 k Ω, C
L
= 15 pF
(1) (2)
TTL-level input step
(1) C
L includes probe and jig capacitance.
(2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
TYP UNIT
1.3
μs
0.3
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TL331
SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
7.7 Typical Characteristics
1.0
-40C
85C
0C
125C
0.8
0.6
25C
0.4
0.2
0.0
0 10 20
Vcc (V)
30
Figure 1. Supply Current vs Supply Voltage
10.000
40
C001
1.000
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70
60
50
40
30
20
-40C
85C
0C
125C
25C
10
0
0 8 16 24 32
Vcc (V)
Figure 2. Input Bias Current vs Supply Voltage
40
C002
0.100
0.010
-40C
25C
125C
0C
85C
0.001
0.01 0.1 1
Output Sink Current, Io(mA)
10 100
C005
Figure 3. Output Low Voltage vs Output Current (I
OL
)
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8 Detailed Description
TL331
SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
8.1 Overview
The TL331 is a single comparator with the ability to operate up to 36 V on the supply pin. This standard device has proven ubiquity and versatility across a wide range of applications. This is due to it's very wide supply voltages range (2 V to 36 V), low Iq and fast response.
The open-drain output allows the user to configure the output's logic low voltage (V
OL
) and can be utilized to enable the comparator to be used in AND functionality.
8.2 Functional Block Diagram
V
CC
Current Regulator
10 mA 60 mA 10 mA
80 mA
IN+
OUT
COMPONENT COUNT
Epi-FET
Diodes
Resistors
Transistors
1
2
1
20
IN−
GND
Current values shown are nominal.
8.3 Feature Description
TL331 consists of a PNP darlington pair input, allowing the device to operate with very high gain and fast response with minimal input bias current. The input Darlington pair creates a limit on the input common mode voltage capability, allowing TL331 to accurately function from ground to V
CC enables much head room for modern day supplies of 3.3 V and 5.0 V.
– 1.5 V differential input. This is
The output consists of an open drain NPN (pull-down or low side) transistor. The output NPN will sink current when the positive input voltage is higher than the negative input voltage and the offset voltage. The VOL is resistive and will scale with the output current. Please see
for V
OL current.
values with respect to the output
8.4 Device Functional Modes
8.4.1 Voltage Comparison
The TL331 operates solely as a voltage comparator, comparing the differential voltage between the positive and negative pins and outputting a logic low or high impedance (logic high with pull-up) based on the input differential polarity.
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TL331
SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.
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9.1 Application Information
TL331 will typically be used to compare a single signal to a reference or two signals against each other. Many users take advantage of the open drain output to drive the comparison logic output to a logic voltage level to an
MCU or logic device. The wide supply range and high voltage capability makes TL331 optimal for level shifting to a higher or lower voltage.
9.2 Typical Application
5 V
Vref
5 V
+
TL331
Input 0 V to 30 V
Figure 4. Typical Application Schematic
9.2.1 Design Requirements
For this design example, use the parameters listed in
as the input parameters.
Table 1. Design Parameters
DESIGN PARAMETER
Input Voltage Range
Supply Voltage
Logic Supply Voltage (R
PULLUP
Voltage)
Output Current (V
LOGIC
/R
PULLUP
)
Input Overdrive Voltage
Reference Voltage
Load Capacitance (C
L
)
EXAMPLE VALUE
0 V to V
CC
– 1.5 V
2 V to 36 V
2 V to 36 V
1 µA to 20 mA
100 mV
2.5 V
15 pF
9.2.2 Detailed Design Procedure
When using TL331 in a general comparator application, determine the following:
• Input voltage range
• Minimum overdrive voltage
• Output and drive current
• Response time
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TL331
SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
9.2.2.1 Input Voltage Range
When choosing the input voltage range, the input common mode voltage range (V account. If temperature operation is above or below 25°C the V
ICR
ICR
) must be taken in to can range from 0 V to V
CC
– 1.5 V. This limits the input voltage range to as high as V
CC incorrect comparisons.
– 1.5 V and as low as 0 V. Operation outside of this range can yield
Below is a list of input voltage situation and their outcomes:
1. When both IN- and IN+ are both within the common mode range:
(a) If IN- is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current
(b) If IN- is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is not conducting
2. When IN- is higher than common mode and IN+ is within common mode, the output is low and the output transistor is sinking current
3. When IN+ is higher than common mode and IN- is within common mode, the output is high impedance and the output transistor is not conducting
4. When IN- and IN+ are both higher than common mode, the output is low and the output transistor is sinking current
9.2.2.2 Minimum Overdrive Voltage
Overdrive Voltage is the differential voltage produced between the positive and negative inputs of the comparator over the offset voltage (V
IO
). In order to make an accurate comparison the Overdrive Voltage (V
OD higher than the input offset voltage (V
IO
) should be
). Overdrive voltage can also determine the response time of the comparator, with the response time decreasing with increasing overdrive.
and
show positive and negative response times with respect to overdrive voltage.
9.2.2.3 Output and Drive Current
Output current is determined by the load/pull-up resistance and logic/pull-up voltage. The output current will produce a output low voltage (V
to determine V
OL
OL
) from the comparator. In which V based on the output current.
OL is proportional to the output current. Use
The output current can also effect the transient response. More will be explained in the next section.
9.2.2.4 Response Time
The transient response can be determined by the load capacitance (C
L equivalent collector-emitter resistance (R
CE
).
), load/pull-up resistance (R
PULLUP
) and
• The positive response time (
τ p
) is approximately
τ
P
• The negative response time ( τ
N
) is approximately τ
N
~ R
PULLUP
~ R
CE
× C
× C
L
L
– R
CE can be determine by taking the slope of dividing the V
OL by I out
in it's linear region at the desired temperature, or by
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SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
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9.2.3 Application Curves
The following curves were generated with 5 V on V
CC and V
Logic
, R
PULLUP
= 5.1 k
Ω, and 50 pF scope probe.
4
3
2
6
5
5mV OD
1
20mV OD
0
100mV OD
±
1
-0.25 0.25 0.75 1.25
Time (usec)
1.75 2.25
Figure 5. Response Time for Various Overdrives
(Positive Transition)
C004
6
5
4
3
2
5mV OD
1
20mV OD
0
100mV OD
±
1
± 0.25 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Time (usec)
C006
Figure 6. Response Time for Various Overdrives
(Negative Transition)
10 Power Supply Recommendations
For fast response and comparison applications with noisy or AC inputs, it is recommended to use a bypass capacitor on the supply pin to reject any variation on the supply voltage. This variation can eat into the comparator's input common mode range and create an inaccurate comparison.
11 Layout
11.1 Layout Guidelines
For accurate comparator applications without hysteresis it is important maintain a stable power supply with minimized noise and glitches, which can affect the high level input common mode voltage range. In order to achieve this, it is best to add a bypass capacitor between the supply voltage and ground. This should be implemented on the positive power supply and negative supply (if available). If a negative supply is not being used, do not put a capacitor between the IC's GND pin and system ground.
11.2 Layout Example
Ground
Negative Supply or Ground
IN –
GND
IN+
1
2
3
Bypass
Capacitor
5
V
CC
Positive Supply
Only needed for dual power supplies
4
OUT
Ground
Figure 7. TL331 Layout Example
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TL331
SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
12 Device and Documentation Support
12.1 Trademarks
All trademarks are the property of their respective owners.
12.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
12.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
25-Oct-2016
PACKAGING INFORMATION
Orderable Device
TL331IDBVR
TL331IDBVRE4
TL331IDBVRG4
TL331IDBVT
TL331IDBVTG4
TL331KDBVR
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Type Package
Drawing
SOT-23
SOT-23
DBV
DBV
Pins Package
5
5
Qty
Eco Plan
(2)
3000 Green (RoHS
& no Sb/Br)
3000 Green (RoHS
& no Sb/Br)
SOT-23 DBV 5
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
3000 Green (RoHS
& no Sb/Br)
250 Green (RoHS
& no Sb/Br)
250 Green (RoHS
& no Sb/Br)
3000 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp
(3)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 105
Device Marking
(4/5)
(T1IG ~ T1IL ~
T1IS)
T1IG
T1IG
(T1IG ~ T1IL ~
T1IU)
T1IG
(T1KG ~ T1KL)
TL331KDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL)
TL331KDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
CU NIPDAU | CU SN Level-1-260C-UNLIM
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
-40 to 105 (T1KG ~ T1KL)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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25-Oct-2016
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TL331 :
•
Automotive: TL331-Q1
•
Enhanced Product: TL331-EP
NOTE: Qualified Version Definitions:
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
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TAPE AND REEL INFORMATION
PACKAGE MATERIALS INFORMATION
3-Aug-2017
*All dimensions are nominal
Device
TL331IDBVR
TL331IDBVR
TL331IDBVRG4
TL331IDBVT
TL331IDBVTG4
TL331KDBVR
Package
Type
Package
Drawing
SOT-23
SOT-23
DBV
SOT-23 DBV
SOT-23 DBV
SOT-23 DBV
SOT-23 DBV
DBV
Pins
5
5
5
5
5
5
SPQ
3000
3000
3000
250
250
3000
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
178.0
9.0
180.0
178.0
8.4
9.0
A0
(mm)
3.23
B0
(mm)
3.17
K0
(mm)
1.37
3.23
3.17
1.37
3.23
3.17
1.37
178.0
178.0
178.0
9.0
9.0
9.0
3.3
3.3
3.2
3.2
1.4
1.4
3.23
3.17
1.37
P1
(mm)
4.0
4.0
4.0
4.0
4.0
4.0
W
(mm)
Pin1
Quadrant
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Pack Materials-Page 1
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PACKAGE MATERIALS INFORMATION
3-Aug-2017
*All dimensions are nominal
Device
TL331IDBVR
TL331IDBVR
TL331IDBVRG4
TL331IDBVT
TL331IDBVTG4
TL331KDBVR
Package Type Package Drawing Pins
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
SPQ
3000
3000
3000
250
250
3000
Length (mm) Width (mm) Height (mm)
180.0
202.0
180.0
180.0
180.0
180.0
180.0
201.0
180.0
180.0
180.0
180.0
18.0
28.0
18.0
18.0
18.0
18.0
Pack Materials-Page 2
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