Memory Module Specifications KVR1066D3Q8R7SK3/24GI

Memory Module Specifications KVR1066D3Q8R7SK3/24GI
Memory Module Specifications
24GB (8GB 1Gb x 72-Bit x 3 pcs.) PC3-8500
CL7 Registered w/Parity 240-Pin DIMM Kit
ValueRAM’s KVR1066D3Q8R7SK3/24GI is a kit of three
1Gb x 72-bit (8GB) DDR3-1066 CL7 SDRAM (Synchronous
DRAM) registered w/parity, quad-rank memory modules, Intel®
Compatibility Tested, based on thirty-six 256M x 8-bit DDR31066 FBGA components per module. Total kit capacity is
24GB. The SPDs are programmed to JEDEC standard latency
1066Mhz timing of 7-7-7 at 1.5V. Each 240-pin DIMM uses
gold contact fingers and requires +1.5V. The electrical and
mechanical specifications are as follows:
CL(IDD) 7 cycles
Row Cycle Time (tRCmin) 50.63ns (min.)
Refresh to Active/Refresh Command Time (tRFCmin)
160ns (min.)
Row Active Time (tRASmin) 37.5ns (min.)
Power 3.705 W (operating per module)
UL Rating 94 V - 0
Operating Temperature 0° C to 85° C
Storage Temperature -55° C to +100° C
• JEDEC standard 1.5V ± 0.075V Power Supply
• VDDQ = 1.5V ± 0.075V
• 533MHz fCK for 1066Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 6,7,8,9
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 6(DDR3-1066)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does
not allow seamless read or write [either on the fly using A12
or MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• On-DIMM thermal sensor (Grade B)
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE ≤ 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), double sided component
Continued >>
Document No. VALUERAM0940-001.A00
12/06/10 Page 1
(Units = millimeters)
Document No. VALUERAM0940-001.A00
12/06/10 Page 2
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