PAF500-600-700F48-SERIES Mounting Method
PA F500 - 600 - 700F48 SERIES
NS U ю X
Mounting Method
Contents
PCB Mounting Methods
Heatsink Installation Methods
Vibration
Recommended Soldering Method
Recommended Cleaning Condition
| DWG No.:C160-04-12B |
A DENSEI-LAMBDA '
PAF500-600 - 700F48-SERIES Mounting Method EEE
1. PCB Mounting Method
By the following instruction shown in Fig.1-1, mount
power module onto printed circuit board. |
9 y— M3 Screw
2<—Spring Washer
Y. TE.
4 | Plain Washer
Heatsink
Silicon grease
M3 Mounting Tap
| - — A— Power Module
y
| [ |
+ ¿
5 $ inted Circuit Board
| Г © — ee —Plain Washer
à 3 | Spring Washer
3 1 M3 Screw
M3 Mounting Tap
Heatsink
Silicon grease
ounting Hole ¢ 3.3
(non-thread)
Power Module
|
|
/ 4 $ inted Circuit Board
| © Г © <— Plain Washer
4 | 4 ©—Spring Washer
| Do
Figl-1. Installation of Printed Circuit Board
and Heatsink
(1) Method of Fix
To fix a power module onto printed circuit board, use
M3 screws and mount it to the tapped holes(4 places) of
the module. Recommended torque is 0.54N-m.
(2) M3 Mounting Tapped Holes
(7 Toptionis $3.3 non-thred)
M3 mounting tapped holes of power module are
connected to baseplate. Connect baseplate terminal to
FG (Frame Ground) by using this M3 mounting tapped
holes.
(3) Mounting Holes on Printed Circuit Board
Refer to the following sizes when determining diameter
of hole and land diameter of printed circuit board.
Input/Output terminal ( $ 2.0 mm)
Hole diameter :¢ 2.5 mm
Land diameter : 45.0 mm
Signal terminal pin ( à 1.0 mm )
Hole diameter : $ 1.5 mm
Land diameter : ¢ 3.0 mm
M3 Mounting Tap ( FG)
Hole diameter: ¢ 3.5 mm
Land diameter : ¢ 7.0 mm
For position of the holes, see outline drawing of the
power module. |
(4) Recommended Material of PCB
Recommended materials of the printed circuit board is
- double sided glass epoxy with through holes.
( thickness t:1.6mm , copper 35 u m).
(5) Output terminal pin
Connect +Vin, -Vin, +V, -V terminals pin such that
contact resistance is minimal. Note that if contact
resistance 1s big, efficiency will drop and power module
will be damaged by abnormal heat, etc.
(6) Output Pattern Width
When several to tens amperes of current flows to output
pattern, voltage would drop and heat generation would
be higher for narrow patter. Relationship between
current and pattern width changes depending on
materials of printed circuit board, thickness of
conduction, temperature raise allowance. 35 um copper
glass epoxy printed circuit board is shown in Figurel-2
as an example. |
For example, when 5A of current follows and
temperature rise below 10°C are expected, pattern width
shall be more than 4.2mm with 35 д т copper
plate( generally 1mm/A is standard).
PAF500 - 600 -700F48-SERIES Mounting Method
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8 77 20°C
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p=
2 —
0 1 2 3 4 5
Pattern Width (mm)
Fig.1-2 Characteristic of current allowance
Confirmation is definitely necessary for designing
because characteristics shown in figure 1-2 depends on
manufactures of printed circuit board.
2. Heatsink Installation Method
(1) Method to Fix
To fix the power module onto heatsink, use M3 screws
and mount it to the tapped holes (4 places) at the
baseplate side. Recommended torque is 0.54 N-m.
Use with termal grease or thermal sheet in between
heatsink and baseplate to minimize the contact thermal
resistance and to enhance the heat conductivity. Also use
the no-warped heatsink and make sure good contact
between baseplate and heatsink.
(2) Mounting Hole of Heatsink
The recommended mounting hole diameter of the
heatsink 1s ¢ 3.5 mm
3. Vibration
The vibration specification of the module is determined
assuming that only the power module is mounted on
printed circuit board. To prevent excessive force to the
module and the printed circuit board, fix the heatsink to
the chassis as well as to the module when a large size of
heastsink is used.
4. Recommended Soldering Method
Recommended soldering temperature is as follows.
(1) Soldering dip
260°C within 10 seconds
Pre-heat condition
110°C during 30~40 seconds
(2) Soldering iron
1 ¢ Pin: Soldering iron temperature 350°C (60W)
within 3 seconds
2 ¢ Pin: Soldering iron temperature 350°C (150W)
within 20 seconds
XSoldering time changes according to soldering iron
Heating capacity, PCB pattern, etc. Please confirm
actual performance.
5.Recommended Cleaning Condition
Recommended cleaning condition after soldering is as
follows. For other cleaning methods, contact us.
(1) Cleaning solvent
IPA ( isopropyl alchol )
(2) Cleaning Procedure
Use brush and dry the solvent completely.
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