NXP TDA18273_18275 Hybrid silicon tuner Data Sheet

TDA18273HN

Hybrid (analog and digital) Silicon Tuner for terrestrial and cable TV reception

Rev. 3 — 10 May 2011 Product short data sheet

The TDA18273HN is a high performance Silicon Tuner designed for terrestrial and cable TV reception for both analog and digital signals.

The TDA18273HN supports all analog and digital TV standards and delivers a LOW IF (LIF) signal to a demodulator for analog TV and/or a channel demodulator for digital TV.

2. Features and benefits

Fully integrated IF selectivity; eliminating the need for external SAW filters Worldwide multistandard terrestrial and cable Fully integrated oscillators Alignment free Single 3.3 V supply voltage Power level detector Integrated wideband gain control Crystal oscillator output buffer (16 MHz) for single crystal applications I 2 C-bus interface compatible with 3.3 V microcontrollers Self AGC synchronization mode (VSYNC) Very fast tuning time LIF channel center frequency output ranging from 3 MHz to 5 MHz 1.7 MHz, 6 MHz, 7 MHz, 8 MHz and 10 MHz channel bandwidths Ready for DVB-T2 and DVB-C2 RoHS compliant Strong immunity to spurious and field interferences

3. Quick reference data

Table 1.

Quick reference data

f

Symbol Parameter

RF NF tun ϕ jit RF frequency tuner noise figure phase jitter

Conditions

full range of RF input 75 Ω source; maximum gain UHF; integrated from 250 Hz to 4 MHz -

Min

42 -

Typ

4.0

0.4

Max Unit

870 MHz 4.6

0.6

dB degree

NXP Semiconductors

TDA18273HN Hybrid (analog and digital) Silicon Tuner for terrestrial and cable TV reception Table 1.

Quick reference data

…continued


α image CSO image rejection composite second-order distortion

Conditions

worst case for image rejection, at 4 MHz IF frequency and for image levels above 60 dB μ V worst interferer over RF frequency with respect to wanted carrier CTB composite triple beat worst interferer over RF frequency with respect to wanted carrier for frequency ≤ 550 MHz worst interferer over RF frequency with respect to wanted carrier for frequency > 550 MHz ICP 1dB 1 dB input compression point at tuner input and minimum gain [1] Channel loading assumptions: 129 channels at 75 dB μ V each.

[1]

-

Min

57.5

Typ

63 -

Max Unit

dB 122 − − 60 65 − − − 55 60 55 dBc dBc dBc dB μ V

Table 2.

Ordering information Type number Package Name Description

TDA18273HN/C1 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 × 6 × 0.85 mm

Version

SOT618-1 TDA18273HN_SDS

Product short data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 3 — 10 May 2011

© NXP B.V. 2011. All rights reserved.

2 of 10

xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x RF input 42-870 MHz SURGE CB TRAP RFIN LNA band-split filter AGC1 TEMPERATURE SENSOR RF FILTER RFAGC AGC2 AGC3 CLOCKS Xtal FRAC-N DIVIDER H3H5/ wireless filter IR mixer AGCK IF filters IF AGC IFP IFN VIFAGC AGC4 AGC5 LO DIVIDERS PLD AGC CONTROL VSYNC DETECTOR LC VCO PULSE SHAPER VSYNC I 2 C-BUS CONTROL AND INTERFACES AS_XTSEL SDA SCL IRQ loop filter

001aam151

Fig 1.

Block diagram



Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).


V V I CC supply voltage input voltage

Conditions

V CC < 3.3 V V CC > 3.3 V T stg T j T amb V ESD storage temperature junction temperature ambient temperature electrostatic discharge voltage EIA/JESD22-A114 (HBM)

EIA/JESD22-C101-C (FCDM) class III [2]

Min

− 0.3

− 0.3

− 0.3

− 40 − 20 − 2 750

Max

+3.6

Unit

V V CC + 0.3 V +3.6

+150 125

[1]

V ° C ° C ° C +2 kV V [1] [2] The maximum allowed ambient temperature T amb(max) depends on the assembly conditions of the package and especially on the design of the Printed-Circuit Board (PCB) and die connection. The application mounting must be done in such a way that the maximum junction temperature is never exceeded. The junction temperature can be obtained by reading the temperature sensor bit via I 2 C-bus. The junction temperature: T j = T amb + Δ T j-c . where Δ T j-c = power × R th .

Class III: 500 V to 1000 V.

7. Abbreviations

Table 4.

Acronym

AGC AGCK CB DVB DVB-T/T2/C/C2/H FCDM FRAC-N HBM IF IR LC-VCO LNA LO PCB PLD RF RoHS SAW UHF

Abbreviations Description

Automatic Gain Control Automatic Gain Control step Killer Citizen Band Digital Video Broadcasting DVB-Terrestrial/Terrestrial second generation/Cable/Handheld Field-induced Charged-Device Model Fractional-N Human Body Model Intermediate Frequency Image Rejection Inductors and Capacitors - Voltage Controlled Oscillator Low-Noise Amplifier Local Oscillator Printed-Circuit Board Power Level Detector Radio Frequency Restriction of Hazardous Substances Surface Acoustic Wave Ultra High Frequency TDA18273HN_SDS



Rev. 3 — 10 May 2011


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Acronym

VHF VSYNC Xtal

Abbreviations

…continued

Description

Very High Frequency Vertical SYNChronization Crystal TDA18273HN_SDS



Rev. 3 — 10 May 2011


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Revision history Document ID

TDA18273HN_SDS v.3

TDA18273HN_SDS v.2

[1]

Release date

20110510 20101215 [1] Revision 1 is not available.

Data sheet status

Product short data sheet Preliminary short data sheet -

Change notice

-

Supersedes

TDA18273HN_SDS v.2

TDA18273HN_SDS



Rev. 3 — 10 May 2011


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TDA18273HN Hybrid (analog and digital) Silicon Tuner for terrestrial and cable TV reception Document status [1][2]

Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet

Product status

Development Qualification Production

[3] Definition

This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. [1] [2] [3] Please consult the most recently issued document before initiating or completing a design. The term ‘short data sheet’ is explained in section “Definitions”. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com

.

9.2 Definitions

Draft —

The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet —

A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification —

The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

9.3 Disclaimers

Limited warranty and liability —

Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the

Terms and conditions of commercial sale

of NXP Semiconductors.

Right to make changes —

NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use —

NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or TDA18273HN_SDS


malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.

Applications —

Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Limiting values —

Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale —

NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license —

Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control —

This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.


Rev. 3 — 10 May 2011


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TDA18273HN Hybrid (analog and digital) Silicon Tuner for terrestrial and cable TV reception Quick reference data —

The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products —

Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

9.4 Licenses

ICs with DVB-T or DVB-T2 functionality

Use of this product in any manner that complies with the DVB-T or the DVB-T2 standard may require licenses under applicable patents of the DVB-T respectively the DVB-T2 patent portfolio, which license is available from Sisvel S.p.A., Via Sestriere 100, 10060 None (TO), Italy, and under applicable patents of other parties.

9.5 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

I 2 C-bus —

logo is a trademark of NXP B.V.

Silicon Tuner —

is a trademark of NXP B.V.

10. Contact information

For more information, please visit:

http://www.nxp.com

For sales office addresses, please send an email to:

[email protected]

TDA18273HN_SDS



Rev. 3 — 10 May 2011


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TDA18273HN Hybrid (analog and digital) Silicon Tuner for terrestrial and cable TV reception

11. Tables

Table 1. Quick reference data . . . . . . . . . . . . . . . . . . . . .1

Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .2

Table 3. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .4

12. Figures

Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

Table 4. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Table 5. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6

TDA18273HN_SDS



Rev. 3 — 10 May 2011


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TDA18273HN Hybrid (analog and digital) Silicon Tuner for terrestrial and cable TV reception

13. Contents

1 2 3

4

5

6 7

8

9

9.1 9.2 9.3

9.4 9.5

10

11 12

13

General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6

Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Contact information. . . . . . . . . . . . . . . . . . . . . . 8

Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

© NXP B.V. 2011.

All rights reserved.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]

Date of release: 10 May 2011 Document identifier: TDA18273HN_SDS

NXP TDA18273_18275 Hybrid silicon tuner Data Sheet

Hybrid (analog and digital) Silicon Tuner for terrestrial and cable TV reception

Rev. 3 — 10 May 2011 Product short data sheet

2. Features and benefits

3. Quick reference data

NXP Semiconductors

NXP Semiconductors

7. Abbreviations

NXP Semiconductors

NXP Semiconductors

NXP Semiconductors

9.2 Definitions

9.3 Disclaimers

NXP Semiconductors

9.4 Licenses

9.5 Trademarks

10. Contact information

NXP Semiconductors

11. Tables

12. Figures

NXP Semiconductors

13. Contents

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