AMS AS3636 Datasheet

General Description

AS3636

Xenon Driver IC with LED Driver and

Life Time Counter

The AS3636 is a highly integrated photoflash charger including

IGBT driver, inductive DC-DC boost autofocus/ video LED driver, an indicator LED driver and it includes system level ESD protection and a breakable fuse.

The AS3636 includes flash timeout, over- and undervoltage, overtemperature and LED short circuit protection functions. To reduce production test time a broken transformer or a broken coil is detected.

The AS3636 is controlled by an I²C interface with a dedicated

STROBE input. Additionally the TORCH input controls the torch function. An interrupt output is available to signal an error condition to the controller.

The device includes 11 Bytes EEPROM, and an automatic life time counter to count the number of flashes performed.

The AS3636 is available in a space-saving WL-CSP package and operates over the -30°C to 85°C temperature range.

Warning:

Lethal voltages are present on applications using

AS3636! Do not operate without training to handle high voltages.

Ordering Information

and

Content Guide appear at end of

datasheet.

ams Datasheet

[v2-00] 2016-Feb-29

Page 1

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AS3636 −

General Description

Key Benefits & Features

The benefits and features of AS3636, Xenon Driver IC with LED

Driver and Life Time Counter are listed below:

Figure 1:

Added Value Of Using AS3636

Benefits

•

Highly flexible Xenon flash driver with serial interface

•

High integration reduces total BOM

(Auto Focus LED & Indicator LED support)

•

On-chip safety features

•

Less effort on external ESD protection circuits

•

Small PCB footprint and overall system size

Features

•

Xenon driver

• Adjustable recharge timings

• Adjustable current limits

• In-production trimmable end of charge voltage

•

IGBT Driver

• Trimmable IGBT voltages

• Trimmable IGBT driving waveform

• Internal flash duration timer

• External STROBE input

•

DC-DC Boost Converter

• Autofocus/video LED current source

• Voltage supply for IGBT

•

Integrated one time breakable fuse in supply path

•

Integrated EEPROM to count the number of flashes done

•

Integrated system level ESD protection according to

IEC-61000-4-2 Level 4 (8kV contact, 15kV air discharge)

•

Available in tiny WL-CSP Packages

• 4

×

4 balls 0.5mm pitch,

• 2.0

×

2.15

×

0.6 mm

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ams Datasheet

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AS3636 −

General Description

Figure 2:

AS3636 Typical Operating Circuit

Applications

The AS3636, Xenon Driver IC with LED Driver and Life Time

Counter, is ideal for Xenon Flash with LED Torch for mobile phones.

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[v2-00] 2016-Feb-29

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AS3636 −

Pinout

Pinout

Figure 3:

Pin Assignments (Top View)

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AS3636

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ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Pinout

Figure 4:

Pin Description for AS3636

Pin Number Pin Name Description

A1 VBAT Power supply voltage input

Fuse output and internal power supply input - make a short connection to capacitor C

VBAT

A3

A4

VLED

IGBT_GATE

Autofocus (AF) / Torch LED output

Drive signal output for IGBT Transistor

B1 INT Interrupt open drain, active low

B3

C2

C3

D1

D2

IND (Red) Indicator LED output - connect to GND if not used (set

ILP =0)

VOUTBOOST

DGND

SGND

SDA

SCL

Digital ground supply - connect directly to ground (GND)

Analog signal ground - connect directly to ground (GND)

DC-DC Boost converter switching node - connect to coil L

BOOST

Serial data input for I²C interface

Serial clock input for I²C interface

Xenon DC-DC converter switching node - connect to transformer T

CHARGE

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[v2-00] 2016-Feb-29

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AS3636 −

Absolute Maximum R atings

Absolute Maximum Ratings

Stresses beyond those listed in

Absolute Maximum Ratings may

cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in

Electrical

Characteristics , is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

Figure 5:

Absolute Maximum Ratings

Parameter Min Max Units Comments

VBAT, VBATINT to GND

SDA, SCL, STROBE, INT, TORCH, IGBT_

GATE, SW_B, VOUTBOOST, VLED, IND to

GND

SW_F to GND

VOUTBOOST to SW_B

-0.3

-0.3

-0.3

-0.3

+7.0

VBATIN T

+ 0.3

+55.0

V

V

V

SGND, DGND, PGND to GND 0.0 0.0 V

Diode VOUTBOOST / SW_B

Connect SGND, DGND and PGND to GND directly below the pad

Input Pin Current without causing latchup

Continuous power dissipation

Continuous Power Dissipation (T

AMB

= 70°C)

1 W

P

T

(1)

Continuous power dissipation derating factor

DERATE

(2)

ESD pins VBAT, SDA, SCL, STROBE, INT,

TORCH

ESD HBM

ESD CDM

ESD MM

Electrostatic Discharge

Air Discharge to module;

±15000 V

IEC 61000 -4 -2 test bench

(3)

Contact Test to module;

±8000 V

IEC 61000 -4 -2 test bench

(3)

±2000

±500

±100

V

V

V

JEDEC JESD22-A114F

JEDEC JESD 22-C101E

JEDEC JESD 22-A115-B

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AS3636 −

Absolute Maximum Ratings

Parameter Min Max Units Comments

Junction Temperature

Temperature Ranges and Storage Conditions

150 °C

Internally limited

(overtemperature protection), max 20000s

Storage Temperature Range

Relative Humidity (non-condensing)

-55

5

125

85

°C

%

Body Temperature during Soldering

Moisture Sensitivity Level (MSL) MSL 1

260 °C

According to IPC/JEDEC

J-STD-020

Represents a max. floor life time of unlimited hours

Fuse

Fuse Melting time - I

FUSE_LIMIT

Fuse operating current - I

FUSE typ. 100 ms at 2A

650 mA

Note(s):

1. Depending on actual PCB layout and PCB used

2. P

DERATE

derating factor changes the total continuous power dissipation (P

T

) if the ambient temperature is not 70°C. Therefore for e.g. T

AMB

=85°C calculate P

T

at 85°C = P

T

- P

DERATE

* (85°C - 70°C)

3. Assembled on PCB board (requires capacitor C

VBAT

); system test for completed module (fully capsuled), no permanent interruption of operation; proper layout required; an ESD pulse might trigger a reset of AS3636

ams Datasheet

[v2-00] 2016-Feb-29

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AS3636 −

Electrical Characteristics

Electrical Characteristics

VBAT = +2.7V to +4.4V, T

AMB

= -30°C to 85°C, unless otherwise specified. Typical values are at VBAT = +3.7V, T

AMB

= 25°C, unless otherwise specified.

Figure 6:

Electrical Characteristics

Symbol Parameter Condition Min Typ Max Unit

General Operating Conditions

2.7 3.7 4.4 V

VBAT

I

I

FUNCTI

ONAL

SHUTDOWN

(1)

STANBY

(1)

Supply Voltage

Shutdown Current

Standby Current

AS3636 functionally working, but not all parameters fulfilled (after voltage has been above V

UVLO before)

Shutdown or standby mode,

VBAT<3.7V

0ºC < T

AMB

< 50°C

SCL=SDA=TO

RCH=STROBE

=0V

TORCH=STRO

BE=0V

I

STROBEWAIT

T

AMB

Current when

AS3636 is waiting for strobe

Operating

Temperature

DC-DC operating, IGBT driver enabled

V

UVLO

Under voltage

Lockout

Under voltage lookout is only enabled if the

Xenon Charger or

DC-DC step up converter is running

Falling V

VIN

Rising V

VIN

T

OVTEMP

Overtemperature

Protection

T

OVTEMPHYST

Overtemperature

Hysteresis

Junction temperature

Fuse

R

FUSE

Fuse resistance

Fuse melting times: see Figure 5

EEPROM

t

EE_WRITE

EEPROM writing time n

MAX_WRITE

EEPRIM writing cycles

T

AMB

< 85°C

0.5 1.0

1.0 10.0

μ

A

5 mA

-30 25 85 °C

2.3 2.4 2.5 V

V

UVLO

+0.05

V

UVLO

+0.1

V

UVLO

+0.15

0.2

V

144 °C

5 °C

Ω

10 14.5 24 ms

100k Cycles

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ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Electrical Characteristics

Symbol Parameter Condition Min Typ Max Unit

V t

TRIPRANGE

V

I

TRIP

Δ

V

η

SW

SW

EOC_DET

Programming range of V

TRIP

Xenon Capacitor Charger

6 bit programming measured on pin SW_F Allows in-circuit trimming of the final charged voltage V

FLASH

on capacitor C

FLASH

V

FLASH

=328V, T

J

=15°C to 50°C using nominal valued components

Comparator trip voltage accuracy

Charging

Efficiency

Maximum voltage on pin SW

V

FLASH

=328V using nominal valued components

System Target only; depends on external components used

Switching current limit

Accuracy at typical setting

Adjustable range by register

switch_current_selection

End of charge comparator trigger

time - see AS3636 Internal Circuit

60 %

-13% 750

50 V

+10% mA

375 750 900 mA

128 138 148 ns

R

NMOS_SW_ F

ON resistance of switch

Between SW_F and PGND 0.4 0.7

Ω

V

VOUTBOOST

DC-DC Boost output Voltage

(pin VOUTBOOST) f

CLK

Operating

Frequency

DC-DC Step Up Converter

Voltage feedback mode

(e.g. if used for IGBT driver)

4.5 4.8 5.25 V

Current feedback mode; max.

V

VOUTBOOSTMAX

All internal timings are derived from this oscillator

-30°C - 85°C -7.5%

VLED+0.4 V

+7.5% MHz

T

J

2.0

=0°C - 75°C

-5.0% +5.0%

AF LED Driver

Adjustable by AF_LED_current ,

limited to

Max_LED_current

I

I

VLED

VLED

Δ

VLED current source output

VLED current source accuracy

V

VLED

VLED forward voltage

V

VLED_COMP

Current Source

Compliance

VOUTBOOST-VLED current source voltage compliance

200 350 mV

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[v2-00] 2016-Feb-29

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AS3636 −

Electrical Characteristics

Symbol Parameter Condition Min Typ Max Unit

R

I

I

IGBT_GATE

IGBT_RISE

IGBT_FALL

I

I

I

IND

IND

Δ

IGBT

Δ

Red Privacy Indicator LED (pin IND)

IND current source output

Adjustable by IND_LED_current

IND current source accuracy

VBATINT > 2.7V, indicator LED forward voltage between 1.3V and

2.4V (e.g. use red LED)

Output driver series resistance

IGBT Driver (pin IGBT_GATE)

Measured at

IGBT_fall_ speed2zero

=50mA, V(IGBT_

GATE)=0.8V

All current settings and output voltages

15 20 25

15 20

Ω

Ω

IGBT_GATE rise current

IGBT_GATE fall current

For a IGBT with 10nF gate capacitance results in

0.5V/

μ s(5mA) to 8V/

μ s(80mA); adjustable by

IGBT_rise_and_fall_ speed , IGBT_fall_speed2zero ,

IGBT_fall2zero_slow

Driving to V

VOUTBOOST

(typ. 5.0V,

DC-DC in voltage feedback mode)

IGBT_GATE current tolerance

Parameter I

RISE

IGBT_

and I

IGBT_FALL

>10mA -20 +20

5mA and

10mA setting

Protection and Fault Detection Functions

V

VOUTBOOS

TMAX

DC-DC Boost maximum voltage

In current feedback mode 4.5 5.5 V

I

LIMIT

Current Limit for coil L

BOOST

(Pin

SW_B) measured at 50% PWM duty

cycle

(2)

coil_peak_ current

=

01b 0.3

11b 0.4

V

VLEDSHORT

AF LED short circuit detection voltage

V

V

VLEDOPEN

INDSHORT

AF LED open circuit detection voltage

Indicator LED short circuit detection voltage

Voltage measured on pin VLED

Voltage measured on pin VLED

Voltage measured on pin IND

1.2

4.4

0.7

1.65

1.2

V

V

V

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ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Electrical Characteristics

Symbol Parameter Condition

I

IND_OUT

OPEN

IND current open detection

Detection threshold for open indicator detection on pin IND

V

V

IHSTROBE

ILSTROBE

I

V

V

V

IH

IL

OL

LEAK

R

PULLDOWN

Digital Interface

High Level Input

Voltage

Low Level Input

Voltage

High Level Input

Voltage

Low Level Input

Voltage

Low Level Output

Voltage

Leakage current

Pins SDA, SCL, TORCH

Pin STROBE

Pins INT and SDA; with pullup >1k

Ω to digital supply <2V, VBAT>2.7V

Pulldown resistor to GND

Pins TORCH and

STROBE at 1.8V at 1.2V t

DEBTORCH

TORCH debounce time t

STROBE_MIN

STROBE minimum timing t

TIMEOUT

SCL timeout

I²C Mode Timings - see

Figure 7

In active mode, if SCL is low for this time, the device enters shutdown

mode - see AS3636 Operating

Mode

t f

SCLK

HD:STA t t t

BUF

LOW

HIGH

SCL Clock

Frequency

Bus Free Time

Between a STOP and START

Condition

Hold Time

(Repeated) START

Condition

(3)

LOW Period of SCL

Clock

HIGH Period of

SCL Clock

Min Typ Max Unit

45

% of

I

IND_

OUT

30

1.3

0.6

1.3

0.6

48

37.5

0.3 V

65 k

Ω k

Ω

200 ns

μ s

μ s

μ s

μ s

ams Datasheet

[v2-00] 2016-Feb-29

Page 11

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AS3636 −

Electrical Characteristics

Symbol

t

SU:STA t

HD:DAT t

SU:DAT t

R t

F t

SU:STO

C

B

C

I/O

Parameter Condition

Setup Time for a

Repeated START

Condition

Data Hold Time

(4)

Data Setup Time

(5)

Rise Time of Both

SDA and SCL

Signals

Fall Time of Both

SDA and SCL

Signals

Setup Time for

STOP Condition

Capacitive Load for Each Bus Line

I/O Capacitance

(SDA, SCL)

C

B

— Total capacitance of one bus line in pF

Min

0.6

20 +

0.1C

B

20 +

0.1C

B

0.6

Typ

L

PRIMARY

V

ISOLATION

Transformer Parameters -

(Only use transformers approved by ams, see

Approved Transformers

)

Primary

Inductance

7

Isolation Voltage

For V

FLASH

=330V (final charged voltage on C

FLASH

)

500

10.2

Max Unit

μ s

100 ns

300 ns

300 ns

μ s

400 pF

10 pF

μ

H

V

Note(s):

1. I

SHUTDOWN

or I

STANBY

includes leakage current for SW_B and SW_F.

2. Due to slope compensation of the current limit, I

LIMIT

changes with duty cycle.

3. After this period, the first clock pulse is generated.

4. A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the V

IHMIN

of the SCL signal) to bridge the undefined region of the falling edge of SCL.

5. A fast-mode device can be used in a standard-mode system, but the requirement t

SU:DAT

= to 250ns must then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line t

R

max + t

SU:DAT

= 1000 + 250 = 1250ns before the SCL line is released.

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ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Electrical Characteristics

Figure 7:

I²C Mode Timing Diagram

Timing Diagrams

SDA t

BUF t

LOW t

R t

F t

HD:STA

SCL

STOP START t

HD:STA t

HD:DAT t

HIGH t

SU:DAT t

SU:STA

REPEATED

START t

SU:STO

ams Datasheet

[v2-00] 2016-Feb-29

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Typical Operating

Characteristics

Page 14

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AS3636 −

Typical Operating Characteristics

VBAT = 3.7V, C

FLASH

=25

μ

F, Xenon transformer=TTRN3822H,

switch_current_selection =900mA, T

AMB

= 25°C,

IGBT=RJP4003ANS,

IGBT_rise_and_fall_speed

=

IGBT_fall_ speed2zero =000b, (unless otherwise specified)

Figure 8:

Charging Waveform

g g g

faster due to load of measurement

I

VBAT

200mA/div

V

CFLASH

50V/div

1s/div

Figure 9:

Charging Waveform VBAT=2.7V

I

VBAT

200mA/div

V

CFLASH

50V/div

1s/div faster due to load of measurement

ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Typical Operating Characteristics

Figure 10:

Charging Waveform VBAT=4.4V

I

VBAT

200mA/div

V

CFLASH

50V/div

1s/div

Figure 11:

Xenon Charge Primary Current

faster due to load of measurement

I

SW_F

500mA/div

1μs/div

ams Datasheet

[v2-00] 2016-Feb-29

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AS3636 −

Typical Operating Characteristics

Figure 12:

Xenon EOC vs.

charge_voltage_selection

360

350

340

330

320

310

300

290

28

Tamb=-30C

Tamb=25C

Tamb=85C

29 30 31 32 33

charge_voltage_selection [V]

34 35

Figure 13:

Xenon EOC vs. VBAT

340

335

charge_voltage_selection =31.5V

330

325

320

Tamb=-30C

Tamb=25C

Tamb=85C

315

310

2,7 2,9 3,1 3,3 3,5 3,7 3,9 4,1 4,3 4,5 4,7 4,9

VBAT [V]

ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Typical Operating Characteristics

Figure 14:

SW_F Switching Waveform ams Datasheet

[v2-00] 2016-Feb-29

50ns/Div

Figure 15:

Oscillator Frequency vs. VBAT

2

1,99

1,98

1,97

1,96

1,95

1,94

1,93

1,92

Tamb=85C

Tamb=25C

Tamb=-30C

1,91

1,9

2,5 2,7 2,9 3,1 3,3 3,5 3,7 3,9 4,1 4,3 4,5

VBAT [V]

Page 17

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AS3636 −

Typical Operating Characteristics

Figure 16:

IGBT Drive Waveforms (example 1)

IGBT_rise_and_fall_speed =000b

V

CFLASH

50V/div

V

IGBT_GATE

2V/div

2.5μs/Div

Figure 17:

IGBT Drive Waveforms (example 2)

IGBT_rise_and_fall_speed= 111b

V

CFLASH

50V/div

V

IGBT_GATE

2V/div

2.5μs/Div

ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Typical Operating Characteristics

Figure 18:

IGBT Drive Waveforms SST Pulses (example 1)

xernon_SST_pulse_length= 10

μ s

V

CFLASH

50V/div

V

IGBT_GATE

2V/div

2.5μs/Div

Figure 19:

IGBT Drive Waveforms SST Pulses (example 2)

xernon_SST_pulse_length=

20

μ s

V

CFLASH

50V/div

V

IGBT_GATE

2V/div

5μs/Div

ams Datasheet

[v2-00] 2016-Feb-29

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Page 20

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AS3636 −

Typical Operating Characteristics

Figure 20:

IGBT Drive Waveforms SST Pulses (example 3)

xernon_SST_pulse_length= 100

μ s

V

CFLASH

50V/div

V

IGBT_GATE

2V/div

25μs/Div

Figure 21:

DC-DC Boost Efficiency vs. V

VBAT

100

95

90

85

80

75

70

65

60

55

I

V

LED

LED

=3.4V

=80mA current mode

DCDC Eff iciency

(PVOUTBOOST/PVBAT)

Applicat ion Eff iciency

(PLED/PVBAT)

50

2,7 2,9 3,1 3,3 3,5 3,7 3,9 4,1

VBAT [V]

ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Typical Operating Characteristics

Figure 22:

I

VLED

vs. V

VBAT

at 10mA

10,5

10,25

10

9,75

Tamb=90C

Tamb=30C

Tamb=-27C

9,5

2,7 2,9 3,1 3,3 3,5 3,7 3,9 4,1 4,3

VBAT [V]

Figure 23:

I

VLED

vs. V

VBAT

at 80mA

83

82

81

80

79

78

Tamb=90C

Tamb=30C

Tamb=-27C

77

2,7 2,9 3,1 3,3 3,5 3,7 3,9 4,1 4,3

VBAT [V]

ams Datasheet

[v2-00] 2016-Feb-29

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Detailed Description

AS3636 −

Detailed Description

The AS3636 is a highly integrated photoflash charger with build in IGBT driver, inductive DC-DC boost autofocus/video LED driver, an indicator LED driver and it includes system level ESD protection and a breakable fuse. The integrated fuse will be blown if there is short circuitry in the module

1

. It is not reversible.

Note(s):

The AS3636 uses a WL-CSP (wafer level chip scale package) to optimize the PCB area required and minimize the module size. Therefore the actual DIE is visible (and it is not molded in plastic as for other packages like QFN or DFN) and the AS3636 is sensitive to external light. It has to be protected from direct light from the Xenon tube.

Internal Circuit

Figure 24:

AS3636 Internal Circuit

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1. The purpose is to fulfill the IEC60065 safety requirements.

Page 22

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ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Detailed Description

Figure 25:

AS3636 Operating Mode

Operating Modes

/

266

5

/6

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ams Datasheet

[v2-00] 2016-Feb-29

The internal operating modes are chosen according to the flowchart in

Figure 25

. The xenon charging procedure is

described in Figure 26

.

The AS3636 wakes up from shutdown mode by sensing its bus.

If SCL rises, the AS3636 enters standby modes and the I²C interface is operating. If any activity is sensed (any of the register bits

AF ,

AFSTROBE ,

IND , INDP ,

CAR or CHARGE is set),

the AS3636 enters active mode.

Note(s):

•

If a previous fault has been detected

(Interrupt Status

Register not 00h - see

Protection and Fault Detection

Functions , the fault has to be cleared by reading of

Interrupt Status Register before external Torch Mode or

Active Mode can be used.

•

Watchdog can be triggered (if

WATCHDOG)

=1 and 1min. watchdog timer expired) only in active mode. There is no watchdog for Torch Mode (TORCH=1) - see

Figure 25

.

Page 23

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AS3636 −

Detailed Description

Figure 26:

Xenon Charging Flowchart

$

+

9,&/

6/$6 ##

3

&4%'&&$%-

23-'%

+5

: ,

:

!"

(

-,./

(0#000102))

!"

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#

"

#

$%&'#

(

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!"#

#

$%&'

$%&'#

$%&'#,

.

-6

5(.

-678#.)

*&

+

Upon setting of

CHARGE or CAR

, VOUTBOOST is boosted to 5V

2

, the Xenon capacitor charging is started. Once finished, charging is stopped (

CHARGE is reset), READY

and

READYF

s set and the interrupt line INT is pulled low (if not disabled by

READYFI

). Upon STROBE

3

a flash is started.

Upon release of STROBE and if the register bit

CAR

4

=1 an automatic recharge cycle is started.

2. Using the internal signal V

OUTBOOST_5V_IGBT

- see

DC-DC Boost Converter VOUTBOOST

3. Using the register bit STROBE

or the input signal STROBE

4. Capacitor Automatic Recharge

Page 24

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ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Detailed Description

Figure 27:

Xenon Charging Waveform

'

)

*

(

+

Every second flash cycle, the internal life time counter(

xenon_ life_counter_MSB and

xenon_life_counter_LSB

) inside the

EEPROM (

see EEPROM Writing Cycle ) is updated to count the

number of flash for the attached Xenon tube.

If no flash is triggered for

CAR_interval

time (can be set between

1.0s to 4.5s) and

CAR

= 1, the capacitor is automatically recharged.

Standby mode is entered upon following conditions and

Xenon

Control Register ,

LED Control Register

and

Control Register

are reset to their default:

1.

STDBY is set to 1 - additionally reset Interrupt Status

Register

2.

Any fault condition (

TOF , CTF

,

BCF , OTPF

,

AFF or ILF

)

3.

No flash is triggered within one minute and

WATCHDOG =1

By writing ‘1’ into register

RESET , all registers can be reset to

their default.

In active mode, if SCL = 0 for 35ms and an EEPROM write is not pending, all registers are reset to their default values and shutdown mode is entered reducing current consumption to a minimum.

.

!

,

#$

%

#$&

-

" ' 0

"

ams Datasheet

[v2-00] 2016-Feb-29

Page 25

Document Feedback

Figure 28:

Autofocus LED Operating Modes

AS3636 −

Detailed Description

The register

CHARGE

is set to high and charging begins (1).

During a single cycle, the internal NMOS transistor connects the pin SW_F to PGND (2). Therefore the current I

SW_F

rises (3) until it reaches I

SW

current limit (4) defined by

switch_current_ selection

. Then the energy is transferred to the secondary side of the transformer and the voltage V

CFLASH

on the flash capacitor C

FLASH

rises (5).

The output voltage V

CFLASH

gradually increases and once it hits the end of charge detection threshold defined by

charge_ voltage_selection

(6) (detected on V

SW_F

during the OFF time of the NMOS transistor between SW_F and PGND) 8 times (7)

5

, end_of_charge

6

is set high (8). This automatically sets

READY :=1 and CHARGE

:=0 (9) finishing a full charging cycle (10)

- see

Figure 26

.

Note(s):

For simplicity the number of actual charging cycles

(NMOS SW ON/OFF) are reduced in

Figure 27 .

Autofocus (AF) LED on Pin VLED Operating Modes

The AF LED can be enabled with the TORCH input or the

AF

register bit or gated by the STROBE input if

AFSTROBE

is set. If

AFSTROBE is used, the DC-DC converter is always run at 5V

7

to allow for immediate reaction to the STROBE input signal (within

μ s). The

AFSTROBE

register bit has priority over AF signal or

TORCH input.

If

AF or

AFSTROBE

is used and

WATCHDOG

=1, the AF LED and

DC-DC boost converter is automatically disabled after one minute. Any read or write access to any AS3636 register resets this watchdog timer.

!

"!!#!$!%& ! %#!

5. The 8 cycles required for actual detection of the end of charge conditions are not shown in

Figure 27

.

6. Internal signal - see

Figure 24

7. Using the internal signal V

OUTBOOST_5V_AFSTROBE

- see

DC-DC Boost Converter VOUTBOOST

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ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Detailed Description

Figure 29:

DC-DC Boost Converter Operating Modes

The LED current on pin VLED is defined by:

1.

If in torch mode (

see Figure 25

) and the pin TORCH=H, the LED current is defined by

Max_LED_current

(

AF_LED_PWM is not used). Do not use this operating

mode if the battery voltage VBATINT is below V

UVLO

8

.

2.

If AF

or

AFSTROBE is set, the current is defined by

AF_

LED_current

(limited to

Max_LED_current ). If

PWM

=1, then the

AF_LED_current current is PWM modulated

with a duty cycle defined by

AF_LED_PWM

.

DC-DC Boost Converter VOUTBOOST

VOUTBOOST is used for the IGBT driver and for the autofocus

(AF) LED. Therefore it supports 5V constant voltage output and a constant current mode (where the 5V voltage output has priority) as shown in

Figure 29

:

!"

#$ %

&"

'('((!

Note(s):

If the input/output voltage ratio is too small or the output current is too low to allow continuous operation of the

DC-DC step-up converter (e.g. in constant current mode when the battery voltage is close or slightly below the LED forward voltage), the DC-DC will use pulseskip operation for high efficiency. This can cause increased input current ripple on the battery supply. To avoid this condition, setting

AFSTROBE

=1 forces 5V operation of the DC-DC and increase the input/output voltage ratio, but will reduce efficiency for the AF LED operation.

If the output voltage is set for 5V and there is no external load

(5V generation for the IGBT driver only using V

OUTBOOST_5V_

IGBT

=1 but no AF LED operation - see

Figure 29

), pulseskip operation will be used by the DC-DC converter. In this case the current through the DC-DC converter is very small and therefore the battery supply current ripple is increased only by a minimal amount.

8. If operated below V

UVLO

, the AS3636 will run in an infinite loop following procedure: startup, enable the LED and check for V

UVLO detecting a too low voltage and therefore stop again.

ams Datasheet

[v2-00] 2016-Feb-29

Page 27

Document Feedback

Figure 30:

EEPROM Writing Cycle

&

#0,!

*!!%#

&!

*&+

#

,-&.

AS3636 −

Detailed Description

EEPROM Writing Cycle

The internal EEPROM is updated under the following two conditions:

1.

Life Time Counter: The automatic procedure for update of the internal life time counter is shown in

Figure 30

; the update of the

xenon_life_counter_MSB

and

xenon_ life_counter_LSB

is done every 2nd flash cycle (see

Figure 25 ) increasing the value by one

9

. The counter does not run over 0xFFFFh.

2.

NVM Register update: Any update to a NVM register

10

(

See Register Map

) through the interface has to be started by writing the password number

11

to the

Password_register

. Then the NVM can be written. Do not read or write NVM register during the life time counter is updated. If further bytes should be written, the user shall wait until the

Password_register

is reset by the

AS3636 as shown in

Figure 30

12

.

/ !

"#$

!"#$

)0,!

!)#0%

0,

%!!%#

&!0!2$

!!!%#

&!'()$

3##0, .+4 !$

1!)#

9. Allow minimum 48ms between updates of the xenon life time counter. Updates happen every 2nd flash pulse.

10. The xenon life time counter ( xenon_life_counter_MSB and

xenon_life_counter_LSB ) cannot be changed.

11. Consult

ams

for the exact value to write into the

Password_register

12. Do not initiate an EEPROM writing cycle during flash as this might collide with the xenon life time counter update.

Page 28

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ams Datasheet

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AS3636 −

Detailed Description

If the junction temperature exceeds 85°C, the EEPROM writing is postponed until the internal temperature drops (An I²C read to this register will return the old value during this time). Then the writing cycle is automatically executed.

See

ams

application note ‘AN3636_In-Production_Trimming_ xvx.pdf ’ for a detailed description of the trimming parameters and procedure.

IGBT Driver

The IGBT Driver shown in

Figure 31 has an internal glitch filter

to filter out short spikes with a length of up to t

STROBE_MIN

. After this filter, the strobe pulse can be adjusted in timing (see

IGBT

Pulse Timing Adjustment

). The actual IGBT driver consists of three current source. One is connected to VOUTBOOST to driver the IGBT_GATE high. The two other current sources drive the

IGBT_GATE low, where the falling edge is divided into two sections:

1.

IGBT_rise_and_fall_speed control the edge from

VOUTBOOST to VOUTBOOST/2.

2.

IGBT_fall_speed2zero

control the remaining part from

VOUTBOOST/2 to GND.

Figure 31:

IGBT Driver Internal Circuit

+ !

'(

*

%

* %

! "#$%&

+ !),

AS3636

'(

)

'

( /'

-.

ams Datasheet

[v2-00] 2016-Feb-29

If the STROBE pulse is longer than 2ms, a timeout timer fault is

raised and the strobe pulse is stopped - see Xenon Charger and

Strobe Timeout Fault (TOF)

.

Page 29

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AS3636 −

Detailed Description

Figure 32:

Strobe Pulse Adjustment Internal Circuit

IGBT Pulse Timing Adjustment

The IGBT pulse timing can be extended by a programmable duration to allow the fine adjustment of the light output from the Xenon tube during flash especially for light pulses with very short time typically used for pre-flash pulses (typically about

5

μ s). This adjustment can be performed on a module by module basis thus accurately trimming the light output energy over production for pre-flash pulses.

The internal circuit for this pulse adjustment is shown in

Figure 32 :

% 0

1 %

% "&' "

"

%

)

%

%

*&+ % ",-./

!

!

#

()

AS3636

The circuit operates as shown in

Figure 33 :

Page 30

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ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Detailed Description

Figure 33:

Strobe Pulse Adjustment Operating Waveforms

()*+,

()*+,"-. /

()*+,012

'! #

$$$

! ""#$$$%

! " &

Note(s):

As the internal oscillator is used for pulse adjustment, which is asynchronous to the external signal from STROBE, there is an uncertainty of one clock period in the actual timing extension.

If

extend_pulse =0, the pulse adjust circuit is disabled.

ams Datasheet

[v2-00] 2016-Feb-29

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AS3636 −

Detailed Description

Self Testing

The AS3636 supports internal self testing to allow the verification of the device together with all its external components in a completed system.

Self testing is initiated in active mode

13

by setting the register bit

MST and it executes the flow described in

Figure 34

14

. After the INT signal is low, the test equipment can readout the fault register - for a properly working module, it will read 40h (only register bit

READYF set in this register).

Note(s):

After the self-test is finished, the register bit

READY

is set.

It is recommended to start the self-test with following commands (works under all operating conditions):

1.

Write 40h to register 04h (

Control Register

) - reset the

AS3636

2.

Wait 4ms - the reset command needs up to 4ms for processing

3.

Write 08h to register 11h (

LED Control Register ) - enable

AF LED to force AS3636 into active mode

4.

Write 00h to register 11h (

LED Control Register

) - disable

AF LED

5.

Write 04h to register 04h (

Control Register

) - start the self testing procedure by setting

MST

=1

6.

Wait for INT=0 (or

MST =0)

7.

Readout Interrupt Status Register - it shall return 0x40h

for a properly working module.

Note(s):

During the self test do not readout the

Interrupt Status

Register , only after self test has been finished. If waiting for

INT=0 is not possible, only check

MST

bit by polling register

Control Register . If

MST bit is equal ‘0’ the self test is finished

and then

Interrupt Status Register

can be readout.

13. For entering active mode see Figure 25 (e.g. after charging).

14. A running self test can only be stopped by writing

MST =0 and afterwards

STDBY

=0; the last step in the procedure is still executed.

Page 32

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ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Detailed Description

Figure 34:

Self Testing Procedure

61

*,0

+

'#2%-

; „…„…

; # <= # %

0; # <= # &

;%

3

!

;<=

;%-

*1

!

, :

5

;<=

; <=

5

#<

# <=

5

#2=%

'

#<

#2=%-

!

# #

#$!

% &

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)

2

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, :

5

5

+

5

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,7- 1 18

3 9

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+/-

,

5

*0,&

1#2 3

*

4

1#2

ams Datasheet

[v2-00] 2016-Feb-29

Page 33

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AS3636 −

Detailed Description

Protection and Fault Detection Functions

The protection functions protect the AS3636 and the external devices against physical damage. In case of a failure a register bit is set. The fault bits are cleared

15

by a readout of the

Interrupt Status Register . If enabled by the Interrupt Mask

Register , any fault condition will raise an interrupt by pulling

INT low. The interrupt output INT return to open drain, once the fault condition is cleared.

If a fault is detected, the DC-DC converter and the Xenon charger is disabled, the current sources are switched OFF and the device enters standby mode (see

AS3636 Operating Mode

).

The AS3636 cannot be reenabled before all fault registers are cleared by readout of

Interrupt Status Register (applies for

active mode triggered by I²C and for external torch operation).

Interrupt Output INT

The interrupt output INT is used to indicate a fault or status changes.

If any bit in register

Interrupt Status Register

is set, which is not masked by

Interrupt Mask Register , INT is set to 0. Upon readout

of the register

Interrupt Status Register , this register is

automatically cleared and INT returns to high ohmic - an external pullup resistor (or other device which are connected in parallel to the interrupt line) control the voltage on pin INT.

Note(s):

It is recommended to monitor the status of the INT line and only when INT=0 readout the

Interrupt Status Register .

Therefore a polling of

Interrupt Status Register is not required

and the bus traffic on the I²C bus is automatically reduced.

Indicator LED fault (

ILF

)

If the indicator LED is enabled, an indicator LED fault is triggered under the following conditions:

1.

In case of no or a broken LED and the current through pin IND is below I

IND_OUTOPEN

.

2.

If the LED is shorted and the voltage on IND does not reach V

INDSHORT

.

If one of these conditions is detected the bit

ILF

is set but the current source is not disabled

16

.

Charge transformer fault (

CTF

)

If the Xenon charger is started and the AS3636 detects a too low inductance

17

of the transformer, the Xenon is stopped and the bit

CTF is set.

15. Except overtemperature protection fault

OTPF .

16. To avoid erroneously disabling of the indicator current source due to short voltage drops on the supply.

17. An inductance below 0.5

μ

H will be detected as a fault. Above 3.5

μ

H, a valid transformer is detected.

Page 34

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ams Datasheet

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AS3636 −

Detailed Description

Boost Converter Fault (

BCF

)

The boost converter fault is triggered under the following conditions:

1.

To limit the maximum current from the battery, the

DC-DC converter limits its current through the coil to

I

LIMIT

. If within a single cycle I

LIMIT

is reached and afterwards (still in the same cycle) the current through the coil reaches zero, a shorted coil is assumed.

2.

If the voltage on VOUTBOOST is below 4.0V and a flash strobe command is triggered. The boost converter fault is triggered to protect the IGBT from operating below a minimum voltage.

If any of the above conditions is detected, the DC-DC is stopped, the current source is disabled (if enabled) and the bit

BCF

is set.

Xenon Charger and Strobe Timeout Fault (

TOF

)

During every charging of the Xenon capacitor, the register

charge_time monitor the charge time. If the register reaches

FFh, the Xenon charger is stopped and the bit

TOF is set.

The register

TOF is also set, if the strobe length (from pin

STROBE) exceeds 2ms

18

. In this case, the IGBT_GATE is switched

OFF automatically.

Overtemperature Fault (

OTPF

)

If the AS3636 junction temperature exceeds T

OVTEMP

the register bit

OTPF

is set. The AS3636 can be re-enabled once the temperature drops below T

OVTEMP

-T

OVTEMPHYST

and register bit

OTPF

is cleared by reading of the

Interrupt Status Register .

Autofocus LED Fault (

AFF

)

If the autofocus LED (pin VLED) is enabled, an autofocus LED fault is triggered under the following conditions:

1.

If the LED is shorted and the voltage on VLED does not reach V

VLEDSHORT

19

.

2.

If the voltage on VLED is above V

VLEDOPEN

.

If one of these conditions is detected, the DC-DC converter is stopped, the current source is disabled and the bit

AFF

is set.

Xenon Strobe Self Test Fault (

SSTF

)

The xenon strobe is only used upon self testing - for details see

section Self Testing

. The fault bit is set if the re-charge time for the Xenon charger is above 0.7s or below 0.1s.

18. The exact duration can vary between 930

μ s to 2.15ms.

19. Short LED detection is disabled in

PWM mode set by PWM =1 or INDP =1 and

ILP

=1.

ams Datasheet

[v2-00] 2016-Feb-29

Page 35

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Page 36

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AS3636 −

Detailed Description

Supply Undervoltage Protection

If the voltage on the pin VBATINT (=battery voltage) is or falls below V

UVLO

, the AS3636 is kept in shutdown state and all registers are set to their default state.

I²C Serial Data Bus

The AS3636 supports the I²C bus protocol. A device that sends data onto the bus is defined as a transmitter and a device receiving data as a receiver. The device that controls the message is called a master. The devices that are controlled by the master are referred to as slaves. A master device that generates the serial clock (SCL), controls the bus access, and generates the START and STOP conditions must control the bus.

The AS3636 operates as a slave on the I²C bus. Within the bus specifications a standard mode (100kHz maximum clock rate) and a fast mode (400kHz maximum clock rate) are defined. The

AS3636 works in both modes. Connections to the bus are made through the open-drain I/O lines SDA and SCL.

The following bus protocol has been defined (

Figure 35 ):

•

Data transfer may be initiated only when the bus is not busy.

•

During data transfer, the data line must remain stable whenever the clock line is HIGH. Changes in the data line while the clock line is HIGH are interpreted as control signals.

Accordingly, the following bus conditions have been defined:

Bus Not Busy

Both data and clock lines remain HIGH.

Start Data Transfer

A change in the state of the data line, from HIGH to LOW, while the clock is HIGH, defines a START condition.

Stop Data Transfer

A change in the state of the data line, from LOW to HIGH, while the clock line is HIGH, defines the STOP condition.

Data Valid

The state of the data line represents valid data when, after a

START condition, the data line is stable for the duration of the

HIGH period of the clock signal. The data on the line must be changed during the LOW period of the clock signal. There is one clock pulse per bit of data.

Each data transfer is initiated with a START condition and terminated with a STOP condition. The number of data bytes transferred between START and STOP conditions are not limited, and are determined by the master device. The information is transferred byte-wise and each receiver acknowledges with a ninth bit.

ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Detailed Description

Figure 35:

Data Transfer on I²C Serial Bus

Acknowledge

Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse that is associated with this acknowledge bit.

A device that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable LOW during the HIGH period of the acknowledge-related clock pulse. Of course, setup and hold times must be taken into account. A master must signal an end of data to the slave by not generating an acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave must leave the data line HIGH to enable the master to generate the STOP condition.

SDA

SCL

START

CONDITION

MSB

1

2

SLAVE

ADDRESS

6

R/W

DIRECTION

BIT

ACKNOWLEDGEMENT

SIGNAL FROM

RECEIVER

7

ACKNOWLEDGEMENT

SIGNAL FROM

RECEIVER

8

9

1 2

3-7

8

REPEATED IF

MORE BYTES ARE

TRANSFERRED

9

ACK

STOP CONDITION

OR REPEATED

START CONDITION

ams Datasheet

[v2-00] 2016-Feb-29

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AS3636 −

Detailed Description

Depending upon the state of the R/W bit, two types of data transfer are possible:

1.

Data transfer from a master transmitter to a slave receiver.

The first byte transmitted by the master is the slave address. Next follows a number of data bytes. The slave returns an acknowledge bit after each received byte. Data is transferred with the most significant bit

(MSB) first.

2.

Data transfer from a slave transmitter to a master receiver.

The master transmits the first byte (the slave address). The slave then returns an acknowledge bit, followed by the slave transmitting a number of data bytes. The master returns an acknowledge bit after all received bytes other than the last byte. At the end of the last received byte, a “not acknowledge” is returned. The master device generates all of the serial clock pulses and the START and STOP conditions. A transfer is ended with a STOP condition or with a repeated START condition.

Since a repeated START condition is also the beginning of the next serial transfer, the bus is not released. Data is transferred with the most significant bit (MSB) first.

The AS3636 can operate in the following two modes:

1.

Slave Receiver Mode (Write Mode):

Serial data and clock are received through SDA and SCL. After each byte is received an acknowledge bit is transmitted. START and STOP conditions are recognized as the beginning and end of a serial transfer. Address recognition is performed by hardware after reception of the slave address and direction bit (

see Figure 36

). The slave address byte is the first byte received after the master generates the START condition. The slave address byte contains the 7-bit AS3636 address, which is 0101000, followed by the direction bit (R/W), which, for a write, is

0

20

. After receiving and decoding the slave address byte the device outputs an acknowledge on the SDA line.

After the AS3636 acknowledges the slave address + write bit, the master transmits a register address to the

AS3636. This sets the register pointer on the AS3636.

The master may then transmit zero or more bytes of data, with the AS3636 acknowledging each byte received. The address pointer will increment after each data byte is transferred. The master generates a STOP condition to terminate the data write.

2.

Slave Transmitter Mode (Read Mode):

The first byte is received and handled as in the slave receiver mode.

However, in this mode, the direction bit indicates that the transfer direction is reversed. Serial data is transmitted on SDA by the AS3636 while the serial clock is input on SCL. START and STOP conditions are recognized as the beginning and end of a serial transfer

(

Figure 37

and

Figure 38 ). The slave address byte is the

first byte received after the master generates a START condition. The slave address byte contains the 7-bit

20. The address for read mode from the AS3636 is 51h = 01010001b.

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ams Datasheet

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AS3636 −

Detailed Description

AS3636 address, which is 0101000, followed by the direction bit (R/W), which, for a read, is 1.

21

After receiving and decoding the slave address byte the device outputs an acknowledge on the SDA line. The

AS3636 then begins to transmit data starting with the register address pointed to by the register pointer. If the register pointer is not written to before the initiation of a read mode the first address that is read is the last one stored in the register pointer. The AS3636 must receive a “not acknowledge” to end a read.

Figure 36:

Data Write - Slave Receiver Mode

<Slave Address>

S 0101000

<Word Address (n)>

0 A XXXXXXXX A

<Data(n)>

XXXXXXXX A

<Data(n+1)>

XXXXXXXX A

S - Start

A - Acknowledge (ACK)

P - Stop

Data Transferred

(X + 1 Bytes + Acknowledge)

<Data(n+X)>

XXXXXXXX A P

Figure 37:

Data Read (from Current Pointer Location) - Slave Transmitter Mode

<Slave Address>

S 0101000

<Data(n)>

1 A XXXXXXXX A

<Data(n+1)>

XXXXXXXX A

<Data(n+2)>

XXXXXXXX A

S - Start

A - Acknowledge (ACK)

P - Stop

NA - Not Acknowledge (NACK)

Data Transferred

(X + 1 Bytes + Acknowledge)

<Data(n+X)>

XXXXXXXX

Note: Last data byte is followed by a NACK

NA P

21. The address for writing to the AS3636 is 50h = 01010000b

ams Datasheet

[v2-00] 2016-Feb-29

Page 39

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Figure 38:

Data Read (Write Pointer, Then Read) - Slave Receive and Transmit

AS3636 −

Detailed Description

S 0101000

<Word Address (n)>

0 A XXXXXXXX A Sr

<Slave Address>

0101000

1

A

<Data(n)>

XXXXXXXX A

<Data(n+1)>

XXXXXXXX A

<Data(n+2)>

XXXXXXXX A

S - Start

Sr - Repeated Start

A - Acknowledge (ACK)

P - Stop

NA - Not Acknowledge (NACK)

<Data(n+X)>

XXXXXXXX

Data Transferred

(X + 1 Bytes + Acknowledge)

NA

Note: Last data byte is followed by a NACK

P

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AS3636 −

Detailed Description

Register Description

IC Info Register (Addr: 00h)

This register has a fixed content and can be used to verify the

I²C communication

Figure 39:

IC Info Register

Bit

Addr: 00h

Bit Name Default Access

IC Info Register

Description

7:4 IC_manufacturer_ID 0001b R Fixed Manufacturer ID

IC Version Control Register (Addr: 01h)

Design Round Identification

Figure 40:

IC Version Control Register

Bit

3:0

7:4

Addr: 01h

Bit Name

Design_round

IC Version Control Register

Default Access

NA

0h

R

R

Description

Internal number; do not use in software

Always 0, do not use

ams Datasheet

[v2-00] 2016-Feb-29

Page 41

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AS3636 −

Detailed Description

Module Info Reg.A (Addr: 02h)

Module identification - written by module manufacturer

Figure 41:

Module Info Reg.A

Bit

Addr: 02h

Bit Name

Module Info Reg.A

Default Access Description

Module Sample Type

1:0 Module_Type NVM R Sample

10 Commercial Sample, Mass Production

11 Reserved for future use

4:2 Module_Generation NVM R Module

7:5 Module_Manufacturer_ID NVM R Module

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AS3636 −

Detailed Description

Control Register (Addr: 04h)

Operating mode of AS3636

Figure 42:

Control Register

Addr: 04h

Control Register

Bit Bit Name Default Access Description

Watchdog timer enable

0 No watchdog timer

0 WATCHDOG 1 R/W

1

After one minute after charging is finished the AS3636 automatically enters standby mode; any read or write access to any

AS3636 register resets this one minute watchdog timer

Strobe input usage (level sensitive)

0 STROBE input is used for Xenon flash

1

STROBE input is used for AF LED ON/OFF;

LED current is defined by

LED Current Register

with no PWM

Module Self Testing

0

Read: No module test running

Write: Writing ‘0’ stops a running self test

1

Writing ‘1’ to this register starts the module self test procedure; when the test

is finished MST

is automatically cleared - see

Self Testing

TORCH pin status (used for module testing)

5:4

6

RESET

(1)

00b

0

R

R

W

1 High

Always 0, do not use

Reset of all registers

Always reads back ‘0’

1 All registers are reset to their default

ams Datasheet

[v2-00] 2016-Feb-29

Page 43

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AS3636 −

Detailed Description

Bit

7

Addr: 04h

Bit Name

STDBY

(2)

Control Register

Default Access Description

Standby mode

0 Normal operation (all modes are possible)

0 R/W

1

Writing ‘1’ writes defaults to Xenon

Control Register ,

LED Control Register

and eventually to the

Control Register .

The AS3636 enters standby mode and clears the bit

STDBY

Note(s):

1. The AS3636 needs up to 4ms to process a reset command. Wait at least 4ms before sending the next command.

2. After setting

STDBY

=1 and if a reset shall be done afterwards, wait at least 3ms before setting

RESET =1.

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AS3636 −

Detailed Description

Interrupt Mask Register (Addr: 05h)

Mask Interrupts (interrupt output INT, open drain, active low)

Figure 43:

Interrupt Mask Register

Interrupt Mask Register

Bit

Addr: 05h

Bit Name Default Access Description

Indicator LED fault interrupt

ams Datasheet

[v2-00] 2016-Feb-29

1 Enabled

Xenon Charger Transformer fault interrupt

1 Enabled

DC-DC Boost converter (VOUTBOOST) fault interrupt

1 Enabled

Xenon Charger Timeout fault interrupt

1 Enabled

Over Temperature protection fault interrupt

1 Enabled

Autofocus LED (VLED) fault interrupt

1 Enabled

Xenon charger ready interrupt

1 Enabled

Xenon Strobe Self test fault interrupt

1 Enabled

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AS3636 −

Detailed Description

Interrupt Status Register (Addr: 06h)

Interrupts status (interrupt output INT, open drain, active low); reading this register automatically clears the interrupt; see

Protection and Fault Detection Functions

Figure 44:

Interrupt Status Register

Bit

Addr: 06h

Bit Name

Interrupt Status Register

Default Access Description

Indicator LED fault interrupt

(1)

(1)

Xenon Charger Transformer fault interrupt

(1)

DC-DC Boost converter (VOUTBOOST) fault interrupt

(1)

Xenon Charger or Strobe Timeout fault interrupt

(1)

Over Temperature protection fault interrupt

(1)

Autofocus LED (VLED) fault interrupt

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AS3636 −

Detailed Description

Bit

Addr: 06h

Bit Name

Interrupt Status Register

Default Access Description

Xenon charger ready interrupt flag

(1)

(1)

Xenon Strobe Self test fault interrupt

Note(s):

1. R/SC = Read, self clear: Upon readout, the register bit is automatically cleared.

ams Datasheet

[v2-00] 2016-Feb-29

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AS3636 −

Detailed Description

Xenon Control Register (Addr: 07h)

Control Xenon Charger and Re-charging

Figure 45:

Xenon Control Register

Addr: 07h

Xenon Control Register

Bit Bit Name Default Access Description

Xenon charging

0 CHARGE 0 R/W

Read: No charging;

Write: Writing ‘0’ to CHARGE stops charging

1

Read: Xenon charger running;

Write: Writing ‘1’ to CHARGE starts charging

Xenon Charger Finished charging

1 READY 0 R

Not ready for flash

1

Ready for flash; a flash strobe automatically

resets READY

Strobe test pulse enable

0

Input pin STROBE

(1)

=0

2 STROBE 0

R

1

0

Input pin STROBE

(1)

=1

IGBT strobe flash is controlled by STROBE pin

7:4 0000b

W

R

1

A Xenon flash test pulse of length

Xenon SST

Pulse Length Register

is generated

Xenon Charger automatic recharge

3 CAR 0 0 No

1 automatic recharge enabled - see

Figure 25

Always 0, do not use

Note(s):

1. Reading register bit

STROBE only returns valid results, if VOUTBOOST_5V_IGBT or V

OUTBOOST_5V_AFSTROBE

is set. V

OUTBOOST_5V_IGBT

is set during or after Xenon charging (see

Figure 26 ), VOUTBOOST_5V_AFSTROBE is set if

AFSTROBE

is set (see

Figure 28 ).

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AS3636 −

Detailed Description

Xenon CAR Interval Register (Addr: 08h)

Xenon automatic Re-charging Timer

Figure 46:

Xenon CAR Interval Register

Bit

Addr: 08h

Bit Name

Xenon CAR Interval Register

Default Access Description

Xenon Re-charging Timer - - see Figure 25

000 1.0s

010 2.0s

2:0

CAR_interval

(1)

100 3.0s

101 3.5s

110 4.0s

111 4.5s

Always 0, do not use 7:3 00h R

Note(s):

1. The first recharge interval can be shorter than selected due to an synchronization to an internal timer. The recharge time is always measured from start of recharge to the next start of recharge.

ams Datasheet

[v2-00] 2016-Feb-29

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AS3636 −

Detailed Description

Xenon Charge Time Register (Addr: 09h)

Measure last xenon charging time

Figure 47:

Xenon Charge Time Register

Bit

Addr: 09h

Bit Name

Xenon Charge Time Register

Default Access Description

Xenon charging time; register content is valid if

READY =1

00h Timer has not been started

01h 0-20ms

02h 20-40ms

7:0 charge_time

(1)

04h 60ms-80ms

... ...

FEh 5060-5080ms

FFh

>5080ms

Xenon charger time out fault was triggered - see

TOF

Note(s):

1. Reading register

Interrupt Status Register

resets

charge_time , therefore read charge_time

before reading

Interrupt Status Register .

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AS3636 −

Detailed Description

Xenon SST Pulse Length Register (Addr: 0Ah)

Xenon strobe test pulse length

Figure 48:

Xenon SST Pulse Length Register

Bit

7:0

Addr: 0Ah

Bit Name

xernon_SST_pulse_ length

(1)

Xenon SST Pulse Length Register

Xenon strobe test pulse length

Default Access Description

Define Xenon strobe pulse length for register bit

STROBE =1 and for Xenon module self testing - see

Self Testing

00h Do use

NVM R

μ s

02h 2

μ s

...

FFh 255

μ s

Note(s):

1. The resulting timing can vary by +1

μ s/-0

μ s (excluding the variation of the internal oscillator), therefore use this internal pulse generator only for self testing.

Xenon Life Time Register MSB (Addr: 0Bh)

xenon_life_counter_MSB

Figure 49:

Xenon Life Time Register MSB

Addr: 0Bh

Xenon Life Time Register MSB

Bit Bit Name Default Access

7:0 xenon_life_counter_MSB NVM R

Description

Count the number of flash double-pulses performed and store in NVM -

see AS3636 Operating Mode

counter stops at

FFFFh

ams Datasheet

[v2-00] 2016-Feb-29

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AS3636 −

Detailed Description

Xenon Life Time Register LSB (Addr: 0Ch)

xenon_life_counter_LSB

Figure 50:

Xenon Life Time Register LSB

Addr: 0Ch

Xenon Life Time Register LSB

Bit Bit Name Default Access

7:0 xenon_life_counter_LSB NVM R

Description

Count the number of flash double-pulses performed and store in NVM -

see AS3636 Operating Mode

counter stops at FFFFh

Xenon Config Register A (Addr: 0Dh)

Define the end of charge detection voltage

Figure 51:

Xenon Config Register A

Addr: 0Dh

Xenon Config Register A

Bit

5:0 charge_voltage_selection NVM

7:6

Bit Name Default Access

00b

Description

R

R

Define the Xenon end of charge detection voltage (measured on pin SW_F)

00h 28.5V

01h 28.6V

02h 28.7V

...

3Fh 34.8V

Always 0, do not use

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AS3636 −

Detailed Description

Xenon Config Register B (Addr: 0Eh)

Define the peak current limit for the Xenon charger

Figure 52:

Xenon Config Register B

Addr: 0Eh

Xenon Config Register B

Bit Bit Name Default Access Description

Peak current limit measured on pin SW_F

000 375mA

001 450mA

010 525mA

2:0 switch_current_

selection

(1)

100 675mA

101 750mA

110 825mA

111 900mA

Extend the timing for the IGBT strobe pulse - see

IGBT Pulse Timing Adjustment

0h No pulse extension

1h 100ns

6:3 extend_pulse NVM R

3h 300ns

7 IGBT_fall2zero_slow NVM R/W

0

1

... ...

Eh 1400ns

Fh 1500ns

Define together with

IGBT_fall_speed2zero

IGBT driver fall speed for final switch-OFF

(VOUTBOOST/2 to 0V)

Full current - see IGBT_fall_speed2zero

Half current - see

IGBT_fall_speed2zero

Note(s):

1. Take care to set the peak current limit to fit to the Xenon charger transformer used - if the peak current limit is set too low, efficiency will drop and eventually end of charge will not be reached anymore.

ams Datasheet

[v2-00] 2016-Feb-29

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AS3636 −

Detailed Description

Xenon Config Register C (Addr: 0Fh)

Define IGBT driver parameters and SW_B switch current limits

Figure 53:

Xenon Config Register C

Bit

Addr: 0Fh

Bit Name

2:0

IGBT_fall_speed2

zero

(1)

5:3

IGBT_rise_and_fall_ speed

(1)

Xenon Config Register C

Default Access Description

Define IGBT driver fall speed for final switch-OFF

(VOUTBOOST/2 to 0V)

IGBT_fall2zero_slow

=0 1

000 1V/

μ s (10mA)

001 2V/

μ s (20mA)

NVM R

μ s (30mA)

011 4V/

μ s (40mA)

100 5V/

μ s (50mA)

101 6V/

μ s (60mA)

110 7V/

μ s (70mA)

111 8V/

μ s (80mA)

0.5V/

μ s (5mA)

1V/

μ s (10mA)

1.5V/

μ s (15mA)

2V/

μ s (20mA)

2.5V/

μ s (25mA)

3V/

μ s (30mA)

3.5V/

μ s (35mA)

4V/

μ s (40mA)

Define IGBT switch-ON speed and switch-OFF down to VOUTBOOST/2

000 1V/

μ s (10mA)

001 2V/

μ s (20mA)

010 3V/

μ s (30mA)

NVM R

μ s (40mA)

100 5V/

μ s (50mA)

101 6V/

μ s (60mA)

110 7V/

μ s (70mA)

111 8V/

μ s (80mA)

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AS3636 −

Detailed Description

Addr: 0Fh Xenon Config Register C

Bit Bit Name Default Access

7:6 coil_peak_current NVM

Description

DC-DC Boost Coil Peak current setting (pin SW_B)

00 250mA

R 01 300mA

10 350mA

11 400mA

Note(s):

1. Assuming a 10nF capacitance. The timings scale by the gate capacitance of the IGBT.

ams Datasheet

[v2-00] 2016-Feb-29

Page 55

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AS3636 −

Detailed Description

LED Current Register (Addr: 10h)

AF LED and indicator LED current and PWM settings

Figure 54:

LED Current Register

Bit

Addr: 10h

Bit Name Default Access

LED Current Register

Description

AF LED Current settings

000 10mA

001 15mA

010 20mA

2:0

AF_LED_current

(1)

100 37mA

101 50mA

110 65mA

111 80mA

AF LED PWM setting

000 1/32

001 2/32

010 3/32

5:3

AF_LED_PWM

(2)

100 8/32

101 12/32

110 20/32

111 32/32

Indicator LED current setting

00 2mA

7:6 IND_LED_current 00b R/W 01 4mA

10 8mA

11 16mA

Note(s):

1.

AF_LED_current

setting is automatically limited to

Max_LED_current

2. The internal PWM generator output frequency is 31.25kHz (to avoid audible noise)

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AS3636 −

Detailed Description

LED Control Register (Addr: 11h)

Control AF LED and indicator LED operating mode

Figure 55:

LED Control Register

Bit

Addr: 11h

Bit Name

0

IND

(1)

LED Control Register

Default Access Description

Indicator LED ON/OFF

0 OFF

0 R/W

If

ILP

=0: Use VLED output with AF_LED_ current and AF_LED_PWM duty cycle

1

If

ILP

=1: Use IND output with IND_LED_ current

100ms Indicator LED pulse

1

INDP

(2)

0 R/W

1

If

ILP

=0: 100ms pulse on VLED output with

AF_LED_current and AF_LED_PWM duty

cycle

If

ILP

=1: 100ms pulse on IND output with

IND_

LED_current

AF LED PWM enable if

AF

=1(pin VLED)

1

AF LED PWM with AF_LED_PWM

AF LED ON/OFF (pin VLED)

3

AF

(3)

7:4 0000b R

Note(s):

1. If

IND

=1 and

INDP =1, IND

=1 has priority.

2. After the 100ms pulse, the register INDP is automatically reset.

3. Do not operate

AF =1 and ( IND or INDP

=1) at the same time.

1

Enabled AF LED with

AF_LED_current ;

if PWM

=1 use AF_LED_PWM duty cycle

Always 0, do not use

ams Datasheet

[v2-00] 2016-Feb-29

Page 57

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AS3636 −

Detailed Description

LED Configuration Register (Addr: 12h)

Set maxim AF LED current and configure indicator type

Figure 56:

LED Configuration Register

Addr: 12h

LED Configuration Register

Bit

2:0 Max_LED_current NVM

6:3

Bit Name Default Access

0h

Description

AF LED Maximum current limit

000 10mA

001 15mA

010 20mA

R 011 28mA

100 37mA

101 50mA

110 65mA

111 80mA

R Always 0, do not use

Indicator LED present; applies when indicator is switched ON (

IND =1)

1

Use VLED output with

AF_LED_current

and

AF_LED_PWM

duty cycle

Use IND output with

IND_LED_current ;

ILF

(indicator LED fault) detection is enabled

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AS3636 −

Detailed Description

Password Register (Addr: 13h)

EEPROM writing password lock register

Figure 57:

Password Register

Bit

Addr: 13h

Bit Name Default Access

7:0 Password_register 00h

Password Register

Description

R/W

Un-lock register for EEPROM writing - see EEPROM

Writing Cycle

Password code

(1)

Read: EEPROM writing pending

Write: Unlock EEPROM writing for next

I²C command

Wrong code EEPROM writing locked

Note(s):

1. Consult

ams

for the exact value.

ams Datasheet

[v2-00] 2016-Feb-29

Page 59

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A S 3 6 3 6 −

Register Map

Register Map

Figure 58:

Register Map

Register Definition

Name

IC Info Register

IC Version Control Register

Module Info Reg.A

User NVM 1

Control Register

Interrupt Mask Register

Interrupt Status Register

(1)

Xenon Control Register

Xenon CAR Interval Register

Xenon Charge Time Register

Xenon SST Pulse Length Register

Xenon Life Time Register MSB

Xenon Life Time Register LSB

Xenon Config Register A

Addr Default b7 b6 b5 b4

Content b3 b2 b1 b0

07h

08h

09h

0Ah

0Bh

0Ch

0Dh

00h

01h

02h

03h

04h

12h

0Xh

NVM

NVM

01h

0

0

STDBY

SSTFI

0

0

0

0

Module_Manufacturer_ID

RESET

0

READY FI AFFI

1

0

0

Module_Generation

User defined

0 1

Design_round

0

Module_Type

0

OTPFI

MST

TOFI BCFI

AFSTROBE

CTFI

WATCH

DOG

ILFI

05h FFh

06h 00h

SSTF READYF

AFF OTPF TOF BCF CTF ILF

00h

01h

00h

NVM

NVM

NVM

NVM

0

0

0

0

0

0

0

0

0

0

CAR

0

charge_time

xernon_SST_pulse_length

STROBE READY

CAR_interval

CHARGE

xenon_life_counter_MSB

xenon_life_counter_LSB charge_voltage_selection

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A S 3 6 3 6 −

Register Map

Register Definition

Name

Xenon Config Register B

Xenon Config Register C

LED Current Register

LED Control Register

LED Configuration Register

Password Register

User NVM 2

User NVM 3

User NVM 4

User NVM 5

User NVM Area

Addr Default

0Eh

13h

14h

15h

16h

0Fh

10h

11h

12h

17h

27h-7Fh

NVM

00h

NVM

NVM

NVM

NVM

00h

00h

NVM

NVM

NVM

b7 b6 b5 b4

Content b3 b2 b1 b0

IGBT_fall2 zero_slow extend_pulse switch_current_selection

coil_peak_current IGBT_rise_and_fall_speed

IND_LED_current AF_LED_PWM

IGBT_fall_speed2zero

AF_LED_current

0 0 0 0

AF PWM INDP

ILP Max_LED_current

IND

Password_register

User defined

User defined

User defined

User defined

User defined

Note(s):

1. Reading register

Interrupt Status Register resets

charge_time , therefore read charge_time before reading

Interrupt Status Register .

NVM: Non Volatile Memory using internal EEPROM; for programming see EEPROM Writing Cycle

, do not read or write during life time counter updates

Note(s):

When writing to read-only register (in mixed read only / read/write register like

Xenon Control Register

) write 0 to read-only register bits. For undefined register bits always write ‘0’. Do never write to undefined register addresses (above 15h).

Upon delivery the EEPROM default value are set according to

Figure 59

:

ams Datasheet

[v2-00] 2016-Feb-29

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A S 3 6 3 6 −

Register Map

Figure 59:

EEPROM Default Settings

Register Definition

Name

Module Info Reg.A

User NVM 1

Xenon SST Pulse Length

Register

Xenon Life Time Register

MSB

Xenon Life Time Register LSB

Xenon Config Register A

Xenon Config Register B

Xenon Config Register C

LED Configuration Register

User NVM 2

User NVM 3

Addr

02h

03h

Default

05h

00h

b7 b6

Module_Manufacturer_ID

Module_Project_Number

b5

0Ah 08h

b4

Content b3 b2 b1

Module_Generation

Module_Major_Version

Module_Type

0Bh 00h

0Ch

0Dh

0Eh

0Fh

12h

14h

15h

00h

1Fh

86h

80h

07h

00h

00h

xenon_life_counter_LSB

0 0

IGBT_fall2 zero_slow

charge_voltage_selection

extend_pulse switch_current_selection

coil_peak_current IGBT_rise_and_fall_speed IGBT_fall_speed2zero

ILP Max_LED_current

User defined

User defined

b0

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AS3636 −

Application Information

Application Information

External Components

Transformers T

CHARGE

and T

TRIG

Following transformers are approved for the AS3636 (due to the programming features the output voltage V

FLASH

can be programmed):

Figure 60:

Approved Transformers

Component

T

CHARGE

T

TRIG

Part Number N L Size (mm)

TTRN-3825H 10.2 7

μ

H 3.8

×

3.8

×

2.5

TTRN-3822H 10.2 7

μ

H 3.8

×

3.8

×

2.2

TTRN2518

(1)

10.2 7

μ

H

3.2

×

2.5

×

1.8

(H is max)

TTRN2516

C2-T1.6D

(1)

(2)

10.2 7

10.2 7

μ

μ

H

H

3.2

×

2.5

×

1.6

(H is max)

C3-T2.5R 10.2 H 3.4

×

3.4

×

2.5

C2-T1.8D

(1)

10.2 7

μ

H

3.2

×

2.4

×

1.8

(H is max)

3.2

×

2.4

×

1.6

(H is max)

LDT4520T-01 10.2

μ

H 4.7

×

4.5

×

2.0

ATB322515

(1)

10.2 7

μ

H

3.2

×

2.5

×

1.55

(H is max)

Manufacturer

Tokyo Coil www.tokyocoil.com

Mitsumi www.mitsumi.co.jp

TDK www.tdk.com

BO-02 7.3

×

2.5(3.5)

×

2.2

Tokyo Coil www.tokyocoil.com

Note(s):

1. Use only for

switch_current_selection =825mA or 900mA.

2. Use only for

switch_current_selection =825mA. Contact Mitsumi to use for switch_current_selection

=900mA.

Always check if the voltage on the pin SW_F does never exceed the AS3636 maximum V

SW

(see Figure 6

) specification during charging.

ams Datasheet

[v2-00] 2016-Feb-29

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AS3636 −

Application Information

IGBT

As the AS3636 has an internal DC-DC step up included, 2.5V and

4V IGBT can be used without limit on the supply V

VBAT

. The IGBT is used for two purposes:

1.

Powering of the Xenon tube and generating together with the oscillation circuit consisting of

T

TRIG

, C

TRIG

,

R

TRIG

a sufficiently high trigger pulse to ignite the Xenon tube (about 3.5kV) - this is accomplished by a fast rising edge of the gate of the IGBT.

2.

Switching OFF the current through the Xenon tube at the end of the flash pulse to accurately control the light emitted by the flash. To protect the IGBT the switching

OFF falling edge voltage should be less than 400V/

μ s

(measured on the emitter of the IGBT).

Both requirements are achieved with the internal driving circuit of the AS3636. Trimming allows to adopt to different trigger coils and IGBTs.

Figure 61:

Recommended IGBTs

Component Part Number

Min. Drive

Voltage

Size Manufacturer

Q

IGBT

3

×

4.8mm

RJP4006ANS

(1)

GT8G133 4.0V

6.4mm

TIG058E8

(1)

4.0V

ECH8

2.8

×

2.9mm

Note(s):

1. Requires additional resistor in series with gate. See datasheet of IGBT.

Renesas www.renesas.eu

Toshiba www.semicon.toshiba.co.jp

Sanyo www.sanyo.com

Note(s):

The non-volatile registers

IGBT_fall_speed2zero ,

IGBT_rise_and_fall_speed and

IGBT_fall2zero_slow have to be

set to fit to the used IGBT. Failing to do so might cause permanent damage to the IGBT.

Photoflash Capacitor C

FLASH

The photoflash capacitor stores the energy for the flash. Its capacitance define the maximum available energy. Using higher value capacitors as shown in

Figure 62

is possible, but will increase the charging time.

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AS3636 −

Application Information

It is recommended to use low ESR capacitors to avoid loosing power during flash (it is also possible to connect two capacitors in parallel to reduce ESR):

Figure 62:

Recommended Photoflash Capacitors

Component Part Number Capacitor

Voltage rating

C

FLASH

330FW13A6.3X20

2

×

13.5

μ

F

(1)

Size Manufacturer

330V

Cylinder

2

×

l=24mm, d=7mm

Rubycon www.rubycon.com

Note(s):

1. Different capacitor values are possible to be used together with the AS3636. Lower capacitor value will reduce charging time, lower

ESR capacitor will improve light output energy and reduce losses in the capacitor during the flash pulse.

Photoflash Charger Rectification Diode D

CHARGE

The rectification diode should have very low parasitic capacitance

22

and has to withstand the operating current and reverse voltages.

Figure 63:

Recommended Rectification Diodes

Component Part Number

Parasitic

Capacitor

Voltage rating

D

CHARGE

Size Manufacturer

800V 2.5mm

Origin www.origin.co.jp

/ 2x240V

3.0mm

Vishay www.vishay.com

OnSemi www.onsemi.com

RFU01SM4S 1.5pF 450V

×

0.6mm

Panasonic www.panasonic.com

Rohm www.rohm.com

22. A low parasitic capacitance improves charging efficiency.

ams Datasheet

[v2-00] 2016-Feb-29

Page 65

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AS3636 −

Application Information

Supply Capacitor C

VBAT

and DC-DC Boost Capacitor

C

VOUTBOOST

Low ESR capacitors should be used to minimize VBAT ripple.

Multi-layer ceramic capacitors are recommended since they have extremely low ESR and are available in small footprints.

The capacitor should be located as close to the device as possible.

X5R dielectric material is recommended due to their ability to maintain capacitance over wide voltage and temperature range.

Figure 64:

Recommended C

VBAT

and C

VOUTBOOST

Capacitor

Component

C

VOUTBOOST

Part Number

C

VBAT

,C

VOUTBOOST

GRM188R60J106

C1608X5R 0J106M

C

TC

Code

Rated

Voltage

Size Manufacturer

10

μ

F

>5.5

μ

F@

1.8V

>4

μ

F@5V

10

μ

F X5R 6.3V

TDK www.tdk.com

If a different output capacitor is chosen, ensure low ESR values and voltage ratings.

Inductor L

DC-DC

The fast switching frequency (2MHz) of the AS3636 allows for the use of small SMDs for the external inductor. The inductor should have low DC resistance (DCR) to reduce the I

2

R power losses - high DCR values will reduce efficiency.

Figure 65:

Recommended Inductor

Part Number

LQM21PN2R2NGC 2.2

μ

H 240m

Ω

>1.5

μ

H

BRC1608T2R2M

(1)

L DCR L @ 0.5A

2.2

μ

H 550m

Ω

>1.5

μ

H @

0.4A

GLCR1608T2R2M 2.2

μ

H 400m

Ω

>1.5

μ

H

Size

2

×

1.25

×

0.9mm

(0805)

1.6

×

0.8

×

0.8mm

(0603)

1.6

×

0.8

×

0.9mm

(0603)

Manufacturer

Murata www.murata.com

Taiyo Yuden www.t-yuden.com

TDK www.tdk.com

Note(s):

1. Use only at 250mA

coil_peak_current (see page 51) =00b unless T

AMB can be limited. This coil has a temperature rise maximum current of 280mA. If T

AMB

can be limited

coil_peak_current can be increased to 350mA.

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ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Application Information

ams Datasheet

[v2-00] 2016-Feb-29

If a different inductor is chosen, ensure similar DCR values and at least 1.5

μ

H inductance at 0.5A input current.

Resistor R

TRIG

This resistor has to withstand the high voltage on the photoflash capacitor C

FLASH

. As there is a safety time for the

IGBT driver (see

IGBT Driver ) the high voltage on this resistor is

limited to 2ms. Therefore a smaller resistor size can be used

(0402 sized surge or thick film resistor instead of 0805).

PCB Layout Guideline

Following layout recommendations apply:

1.

Keep the path (and area) of GND (SGND directly connected to DGND below the WL-CSP) - C

VBAT

-

VBATINT - T

CHARGE

(primary) - SW_F - GND as short as possible to minimize the leakage inductance of T

CHARGE and ensure a proper supply connection for the AS3636

2.

Keep the path (and area) of GND - C

VBAT

- L

BOOST

- SW_

B - VOUTBOOST - C

VOUTBOOST

- GND as short as possible.

3.

Place C

VBAT

as close as possible to the AS3636.

4.

Ensure wide and short PCB paths for the path GND -

C

FLASH

- X

FLASH

- Q

IGBT

- GND to allow 150A to flow during the flash pulse. Connect this GND only at a single place to the main GND plane.

5.

The IGBT has two ground connections: One ground for the driving input and one ground for the power path.

6.

Ensure larger spacings for all high voltage paths; check with the PCB manufacturer to ensure proper minimum spacing for 320V paths and 4kV (Xenon tube trigger pin) paths.

7.

Minimize the parasitic capacitance of the PCB on the anode of

D

CHARGE

especially to GND and V

FLASH

8.

See

ams

“WLP-CSP-Handling-Guidelines_1V0.pdf” for proper handling, PCB layout and soldering of the

WL-CSP AS3636 device.

9.

In order to meet system level ESD protection careful routing of the ground lines, supply capacitor C

VBAT

and supply lines is required.

See

ams

demoboard layout (described in application note

‘AN3636’).

Page 67

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AS3636 −

Pack age Drawings & Mark ings

Package Drawings & Markings

Figure 66:

16pin WL-CSP 2

×

2.15mm Marking

AS3636

<Code>

Line 1:

ams

logo

Line 2: AS3636

Line 3: <Code>

Tracecode (4 characters)

Figure 67:

16pin WL-CSP 2

×

2.15mm Package Dimensions

!"#$!

%&'

(&)"

' ' ' ' ' ' ' '

* * * *

+ + +

The coplanarity of the balls is 40μm.

+

Page 68

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*

+

,

*

+

*

+

*

+

RoHS

Green

ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Ordering & Contact Information

Ordering & Contact Information

The devices are available as the standard products shown in

Figure 68 .

Figure 68:

Ordering Information

Ordering

Code

Description

AS3636-ZWLT

Xenon Driver IC with

LED Driver and Life

Time Counter

Package

Delivery

Form

Delivery

Quantity

16-pin WL-CSP (2mm

×

2.15mm) Tape & Reel 12000 pcs/reel

AS3636-ZWLT

Z Temperature Range: -30°C to 85°C

WL Package: Wafer Level Chip Scale Package (WL-CSP)

T Delivery Form: Tape & Reel

Buy our products or get free samples online at: www.ams.com/ICdirect

Technical Support is available at: www.ams.com/Technical-Support

Provide feedback about this document at: www.ams.com/Document-Feedback

For further information and requests, e-mail us at: [email protected]

For sales offices, distributors and representatives, please visit: www.ams.com/contact

Headquarters

ams AG

Tobelbaderstrasse 30

8141 Premstaetten

Austria, Europe

Tel: +43 (0) 3136 500 0

Website: www.ams.com

ams Datasheet

[v2-00] 2016-Feb-29

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AS3636 −

RoHS Compliant & ams Green Statement

RoHS Compliant & ams Green

Statement

RoHS:

The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed

0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes.

ams Green (RoHS compliant and no Sb/Br):

ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants

(Br or Sb do not exceed 0.1% by weight in homogeneous material).

Important Information:

The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

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ams Datasheet

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AS3636 −

Copyrights & Disclaimer

Copyrights & Disclaimer

Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,

Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.

Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of

Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed.

ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services.

ams Datasheet

[v2-00] 2016-Feb-29

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AS3636 −

Document Status

Document Status

Document Status

Product Preview

Preliminary Datasheet

Datasheet

Datasheet (discontinued)

Product Status

Pre-Development

Pre-Production

Production

Discontinued

Definition

Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice

Information in this datasheet is based on products in the design, validation or qualification phase of development.

The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice

Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of

Trade

Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of

Trade, but these products have been superseded and should not be used for new designs

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ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Revision Information

Revision Information

Changes from 1.2.2 to current revision 2-00 (2016-Feb-29)

Content of austriamicrosystems datasheet was converted to latest

ams

design

Updated Figure 1

Note(s):

1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.

2. Correction of typographical errors is not explicitly mentioned.

Page

2

ams Datasheet

[v2-00] 2016-Feb-29

Page 73

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Content Guide

Page 74

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AS3636 −

Content Guide

1 General Description

2 Key Benefits & Features

3 Applications

4 Pinout

6 Absolute Maximum Ratings

8 Electrical Characteristics

13 Timing Diagrams

14 Typical Operating Characteristics

22 Detailed Description

22 Internal Circuit

23 Operating Modes

26 Autofocus (AF) LED on Pin VLED Operating Modes

27 DC-DC Boost Converter VOUTBOOST

28 EEPROM Writing Cycle

29 IGBT Driver

30 IGBT Pulse Timing Adjustment

32 Self Testing

34 Protection and Fault Detection Functions

34 Interrupt Output INT

34 Indicator LED fault (

ILF

)

34 Charge transformer fault (

CTF

)

35 Boost Converter Fault (

BCF

)

35 Xenon charger and strobe timeout fault (

TOF

)

35 Overtemperature fault (

OTPF

)

35 Autofocus LED fault (

AFF

)

35 Xenon strobe self test fault (

SSTF

)

36 Supply Undervoltage Protection

36 I²C Serial Data Bus

41 Register Description

41 IC Info Register (Addr: 00h)

41 IC Version Control Register (Addr: 01h)

42 Module Info Reg.A (Addr: 02h)

43 Control Register (Addr: 04h)

45 Interrupt Mask Register (Addr: 05h)

46 Interrupt Status Register (Addr: 06h)

48 Xenon Control Register (Addr: 07h)

49 Xenon CAR Interval Register (Addr: 08h)

50 Xenon Charge Time Register (Addr: 09h)

51 Xenon SST Pulse Length Register (Addr: 0Ah)

51 Xenon Life Time Register MSB (Addr: 0Bh)

52 Xenon Life Time Register LSB (Addr: 0Ch)

52 Xenon Config Register A (Addr: 0Dh)

53 Xenon Config Register B (Addr: 0Eh)

54 Xenon Config Register C (Addr: 0Fh)

56 LED Current Register (Addr: 10h)

57 LED Control Register (Addr: 11h)

58 LED Configuration Register (Addr: 12h)

59 Password Register (Addr: 13h)

ams Datasheet

[v2-00] 2016-Feb-29

AS3636 −

Content Guide

60 Register Map

63 Application Information

63 External Components

63 Transformers TCHARGE and TTRIG

64 IGBT

64 Photoflash Capacitor CFLASH

65 Photoflash Charger Rectification Diode DCHARGE

65 Supply Capacitor CVBAT and DC-DC Boost Capacitor

CVOUTBOOST

66 Inductor LDC-DC

67 Resistor RTRIG

67 PCB Layout Guideline

68 Package Drawings & Markings

69 Ordering & Contact Information

70 RoHS Compliant & ams Green Statement

71 Copyrights & Disclaimer

72 Document Status

73 Revision Information

ams Datasheet

[v2-00] 2016-Feb-29

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