TCS3200
Programmable
Color Light-to-Frequency Converter
General Description
The TCS3200 programmable color light-to-frequency converter combines configurable silicon photodiodes and a current-to-frequency converter on a single monolithic CMOS integrated circuit. The output is a square wave (50% duty cycle) with frequency directly proportional to light intensity
(irradiance).
The full-scale output frequency can be scaled by one of three preset values via two control input pins. Digital inputs and digital output allow direct interface to a microcontroller or other logic circuitry. Output enable (OE) places the output in the high-impedance state for multiple-unit sharing of a microcontroller input line.
In the TCS3200, the light-to-frequency converter reads an 8 × 8 array of photodiodes. Sixteen photodiodes have blue filters, 16 photodiodes have green filters, 16 photodiodes have red filters, and 16 photodiodes are clear with no filters.
The four types (colors) of photodiodes are interdigitated to minimize the effect of non-uniformity of incident irradiance. All photodiodes of the same color are connected in parallel. Pins
S2 and S3 are used to select which group of photodiodes (red, green, blue, clear) are active. Photodiodes are 110μm × 110μm in size and are on 134μm centers.
Ordering Information
and
Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of TCS3200 Programmable Color
Light-to-Frequency Converter are listed below:
Figure 1:
Added Value of Using TCS3200
Benefits
•
Enables High-Resolution Conversion of Light
Intensity to Frequency
•
Disables the Output into a Hi-Impedance State when OE Input Pin is Low
•
Enables Output Range to be Optimized for a
Variety of Low-Cost Measurement Techniques
•
Reduces Board Space Requirements while
Simplifying Designs
Features
•
Programmable Color Light-to-Frequency Converter
•
Output Enable (OE) Pin
•
Output Frequency Scaling
•
Available in 5mm x 6.2mm SOIC (D) Package
ams Datasheet
[v1-01] 2018-Mar-14
Page 1
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TCS3200 −
General Description
•
Programmable Color and Full-Scale Output Frequency
•
Communicates Directly with a Microcontroller
•
Single-Supply Operation (2.7V to 5.5V)
•
Power Down Feature
•
Nonlinearity Error Typically 0.2% at 50kHz
•
Stable 200ppm/°C Temperature Coefficient
•
Low-Profile Lead (Pb) Free and RoHS Compliant
Surface-Mount Package
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
TCS3200 Block Diagram
Light
Photodiode
Array
S2 S3
Current-to-Frequency
Converter
Output
S0 S1
OE
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ams Datasheet
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TCS3200 −
Pin Assignments
Pin Assignments
The TCS3200 pin assignments are described below:
Figure 3:
Pin Diagram of TCS3200
S0 1
S1 2
OE 3
GND 4
PACKAGE D
8-LEAD SOIC
(TOP VIEW)
8 S3
7 S2
6 OUT
5 V
DD
TCS3200 ams Datasheet
[v1-01] 2018-Mar-14
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TCS3200 −
Pin Assignments
Figure 4:
Terminal Functions
Terminal
Name
S0, S1
OE
GND
V
DD
OUT
S2, S3
No.
5
6
7, 8
1, 2
3
4
Figure 5:
Selectable Options
S0
H
H
L
L
S1
L
H
L
H
I/O Description
I
I
O
I
Output frequency scaling selection inputs
Enable for f o
(active low)
Power supply ground. All voltages are referenced to GND.
Supply voltage
Output frequency (f o
)
Photodiode type selection inputs
Output Frequency
Scaling (f
o
)
Power down
2%
20%
100%
S2
H
H
L
L
S3
L
H
L
H
Photodiode Type
Red
Blue
Clear (no filter)
Green
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TCS3200 −
Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under
Recommended
Operating Conditions is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Figure 6:
Absolute Maximum Ratings Over Operating Free-Air Temperature Range (unless otherwise noted)
Symbol
V
DD
V
I
T
A
T
STRG
Parameter
Supply voltage
(1)
Input voltage range, all inputs
Operating free-air temperature range
(2)
Storage temperature range
(2)
Solder conditions in accordance with JEDEC J−STD−020A, maximum temperature
(3)
-0.3
-40
-40
Min Max
6
V
DD
+ 0.3
85
85
Unit
°C
V
V
V
260 °C
Note(s):
1. All voltages are with respect to GND.
2. Long-term storage or operation above 70°C could cause package yellowing that will lower the sensitivity to wavelengths < 500nm.
3. The device may be hand soldered provided that heat is applied only to the solder pad and no contact is made between the tip of the solder iron and the device lead. The maximum time heat should be applied to the device is 5 seconds.
ams Datasheet
[v1-01] 2018-Mar-14
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Electrical Characteristics
TCS3200 −
Electrical Characteristics
All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or
SQC (Statistical Quality Control) methods.
Figure 7:
Recommended Operating Conditions
Symbol
V
DD
V
IH
V
IL
T
A
Parameter
Supply voltage
High-level input voltage
Low-level input voltage
V
DD
= 2.7V to 5.5V
V
DD
= 2.7V to 5.5V
Operating free-air temperature range
Min
2.7
2
0
-40
Figure 8:
Electrical Characteristics at T
A
= 25°C, V
DD
= 5V (unless otherwise noted)
Nom
5
Max
5.5
V
DD
0.8
70
Unit
V
V
V
°C
Symbol
V
OH
V
OL
I
IH
I
IL
I
DD k
SVS
Parameter
High-level output voltage
Low-level output voltage
High-level input current
Test Conditions
I
OH
= -2mA
I
OL
= 2mA
Min
4
Low-level input current
Supply current
Full-scale frequency
(1)
Power-on mode
Power-down mode
S0 = H, S1 = H
S0 = H, S1 = L
S0 = L, S1 = H
Temperature coefficient of responsivity
Supply voltage sensitivity
λ ≤ 700nm, -25°C ≤ T
A
≤ 70°C
V
DD
= 5V ±10%
500
100
10
Typ
4.5
Max
0.25
0.40
5
1.4
600
120
12
±200
±0.5
5
2
0.1
Unit
V
V
μA
μA mA
μA kHz kHz kHz ppm/°C
%/V
Note(s):
1. Full-scale frequency is the maximum operating frequency of the device without saturation.
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ams Datasheet
[v1-01] 2018-Mar-14
TC S 3 2 0 0 −
Electrical Characteristics
Figure 9:
Operating Characteristics at V
DD
= 5V, T
A
= 25°C, S0 = H, S1 = H (unless otherwise noted)
(1)
,
(2)
,
(3)
,
(4)
Symbol
f
O
R e f
D
Parameter
Test
Conditions
Output
frequency
Irradiance
responsivity
(6)
Saturation
irradiance
(5)
(7)
E e
= 47.2μW/cm
2
λ p
= 470nm
E e
= 40.4μW/cm
2
λ p
= 524nm
E e
= 34.6μW/cm
2
λ p
= 640nm
λ p
= 470nm
λ p
= 524nm
λ p
= 640nm
λ p
= 470nm
λ p
= 524nm
λ p
= 640nm
Dark frequency
E e
= 0
12.5
12.5
13.1
Clear
Photodiode
S2 = H, S3 = L
Blue
Photodiode
S2 = L, S3 = H
Green
Photodiode
S2 = H, S3 = H
Red
Photodiode
S2 = L, S3 = L
Min Typ Max Min Typ Max Min Typ Max Min Typ Max
15.6
15.6
16.4
331
386
474
1813
1554
1266
2
18.7
18.7
19.7
10
61%
8%
5%
61%
8%
5%
--
--
--
2
84%
28%
21%
84%
28%
21%
10
22%
57%
0%
22%
57%
0%
--
--
--
2
43%
80%
12%
43%
80%
12%
10
0%
9%
84%
0%
9%
84%
--
--
--
2
6%
27%
105%
6%
27%
105%
10
Unit
kHz
Hz/
(μW/ cm
2
)
μW/ cm
2
Hz
ams Datasheet
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T C S 3 2 0 0 −
Electrical Characteristics
Symbol Parameter
Test
Conditions
f
O
= 0 to 5kHz
Nonlinearity
(8)
f
O
= 0 to 50kHz f
O
= 0 to 500kHz
Recovery from power down
Response time to output enable (OE)
Clear
Photodiode
S2 = H, S3 = L
Blue
Photodiode
S2 = L, S3 = H
Green
Photodiode
S2 = H, S3 = H
Red
Photodiode
S2 = L, S3 = L
Min Typ Max Min Typ Max Min Typ Max Min Typ Max
±0.1
±0.2
±0.5
±0.1
±0.2
±0.5
±0.1
±0.2
±0.5
±0.1
±0.2
±0.5
Unit
%F.S.
100 100 100 100 μs
100 100 100 100 ns
Note(s):
1. Optical measurements are made using small-angle incident radiation from a light-emitting diode (LED) optical source.
2. The 470nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics: peak wavelength λ p
= 470nm, spectral halfwidth Δλ½ = 35nm, and luminous efficacy = 75lm/W.
3. The 524nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics: peak wavelength λ p
= 524nm, spectral halfwidth Δλ½ = 47nm, and luminous efficacy = 520lm/W.
4. The 640nm input irradiance is supplied by a AlInGaP light-emitting diode with the following characteristics: peak wavelength λ p
= 640nm, spectral halfwidth Δλ½ = 17nm, and luminous efficacy = 155lm/W.
5. Output frequency Blue, Green, Red percentage represents the ratio of the respective color to the Clear channel absolute value.
6. Irradiance responsivity R e
is characterized over the range from zero to 5kHz.
7. Saturation irradiance = (full-scale frequency)/(irradiance responsivity) for the Clear reference channel.
8. Nonlinearity is defined as the deviation of f
O
from a straight line between zero and full scale, expressed as a percent of full scale.
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ams Datasheet
[v1-01] 2018-Mar-14
TCS3200 −
Typical Operating Characteristics
Typical Operating
Characteristics
Figure 10:
Photodiode Spectral Responsivity
1
0.9
0.8
0.7
Clear
Blue
Normalized to
@ 715 nm
Red
0.6
0.5
0.4
0.3
0.2
0.1
0
300
Green
Blue
Green
500 700
λ
− Wavelength − nm
900
Clear
T
A
= 25
°
C
1100
Figure 11:
Normalized Output Frequency vs. Angular Displacement
1
0.8
0.6
0.4
0.2
0
−90
Angular Displacement is
Equal for Both Aspects
−60 −30 0 30
− Angular Displacement −
°
60
90 ams Datasheet
[v1-01] 2018-Mar-14
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TCS3200 −
Typical Operating Characteristics
Figure 12:
I
DD
vs. V
DD
vs. Temperature
1.25
1.2
1.15
1.1
1.05
1
0
1.55
1.5
1.45
1.4
1.35
1.3
Saturated
V
DD
= 5 V
Saturated
V
DD
= 3 V
Dark
V
DD
= 5 V
Dark
V
DD
= 3 V
25 50 75
T
A
− Free-Air Temperature −
°
C
100
Figure 13:
Normalized Output vs. V
DD
100.6
100.4
100.2
100
99.8
99.6
99.4
2.5
3 3.5
4
V
DD
−
V
4.5
5 5.5
ams Datasheet
[v1-01] 2018-Mar-14
TCS3200 −
Typical Operating Characteristics
Figure 14:
Photodiode Responsivity Temperature Coefficient vs.
Wavelength Of Incident Light
9k
8k
7k
6k
5k
4k
3k
2k
1k
0
600 650 700 750 800 850 900 950 1000
λ
− Wavelength of Incident Light − nm ams Datasheet
[v1-01] 2018-Mar-14
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Application Information
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TCS3200 −
Application Information
Power Supply Considerations
Power supply lines must be decoupled by a 0.01μF to 0.1μF capacitor with short leads mounted close to the device package.
Input Interface
A low-impedance electrical connection between the device
OE pin and the device GND pin is required for improved noise immunity. All input pins must be either driven by a logic signal or connected to VDD or GND - they should not be left unconnected (floating).
Output Interface
The output of the device is designed to drive a standard TTL or
CMOS logic input over short distances. If lines greater than
12 inches are used on the output, a buffer or line driver is recommended.
A high state on Output Enable (OE) places the output in a high-impedance state for multiple-unit sharing of a microcontroller input line.
Power Down
Powering down the sensor using S0/S1 (L/L) will cause the output to be held in a high-impedance state. This is similar to the behavior of the output enable pin, however powering down the sensor saves significantly more power than disabling the sensor with the output enable pin.
Photodiode Type (Color) Selection
The type of photodiode (blue, green, red, or clear) used by the
device is controlled by two logic inputs, S2 and S3 (see Figure 5
).
Output Frequency Scaling
Output-frequency scaling is controlled by two logic inputs,
S0 and S1. The internal light-to-frequency converter generates a fixed-pulsewidth pulse train. Scaling is accomplished by internally connecting the pulse-train output of the converter to a series of frequency dividers. Divided outputs are 50%-duty cycle square waves with relative frequency values of 100%, 20%, and 2%. Because division of the output frequency is accomplished by counting pulses of the principal internal frequency, the final-output period represents an average of the multiple periods of the principle frequency.
The output-scaling counter registers are cleared upon the next pulse of the principal frequency after any transition of the
S0, S1, S2, S3, and OE lines.
ams Datasheet
[v1-01] 2018-Mar-14
TCS3200 −
Application Information
The output goes high upon the next subsequent pulse of the principal frequency, beginning a new valid period. This minimizes the time delay between a change on the input lines and the resulting new output period. The response time to an input programming change or to an irradiance step change is one period of new frequency plus 1μs. The scaled output changes both the full-scale frequency and the dark frequency by the selected scale factor.
The frequency-scaling function allows the output range to be optimized for a variety of measurement techniques. The scaled-down outputs may be used where only a slower frequency counter is available, such as low-cost microcontroller, or where period measurement techniques are used.
Measuring the Frequency
The choice of interface and measurement technique depends on the desired resolution and data acquisition rate. For maximum data-acquisition rate, period-measurement techniques are used.
Output data can be collected at a rate of twice the output frequency or one data point every microsecond for full-scale output. Period measurement requires the use of a fast reference clock with available resolution directly related to reference clock rate. Output scaling can be used to increase the resolution for a given clock rate or to maximize resolution as the light input changes. Period measurement is used to measure rapidly varying light levels or to make a very fast measurement of a constant light source.
Maximum resolution and accuracy may be obtained using frequency-measurement, pulse-accumulation, or integration techniques. Frequency measurements provide the added benefit of averaging out random- or high-frequency variations
(jitter) resulting from noise in the light signal. Resolution is limited mainly by available counter registers and allowable measurement time. Frequency measurement is well suited for slowly varying or constant light levels and for reading average light levels over short periods of time. Integration (the accumulation of pulses over a very long period of time) can be used to measure exposure, the amount of light present in an area over a given time period.
ams Datasheet
[v1-01] 2018-Mar-14
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TCS3200 −
Application Information
PCB Pad Layout
Suggested PCB pad layout guidelines for the D package are shown in
Figure 15 .
Figure 15:
Suggested D Package PCB Layout
4.65
1.27
6.90
0.50
2.25
Note(s):
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
ams Datasheet
[v1-01] 2018-Mar-14
TCS3200 −
Packaging Mechanical Data
Packaging Mechanical Data
This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically nonconductive clear plastic compound. The TCS3200 has an
8 × 8 array of photodiodes with a total size of 1mm by 1mm.
The photodiodes are 110μm × 110μm in size and are positioned on 134μm centers.
Figure 16:
Package D - TCS3200 Plastic Small Outline IC Packaging Configuration
PACKAGE D
NOTE B
2.12
0.250
3.00 0.250
TOP VIEW
PIN 1
PLASTIC SMALL-OUTLINE
BOTTOM VIEW
1.75
1.35
0.50
0.25
6 1.27
2.8 TYP
CLEAR WINDOW
END VIEW
45
0.88 TYP TOP OF
SENSOR DIE
A
4.00
3.80
6.20
5.80
RoHS
8
0.510
0.330
PIN 1
1.27
0.41
SIDE VIEW
5.00
4.80
5.3
MAX
DETAIL A
0.25
0.19
0.25
0.10
Note(s):
1. All linear dimensions are in millimeters.
2. The center of the 1mm by 1mm photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
3. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. This drawing is subject to change without notice.
ams Datasheet
[v1-01] 2018-Mar-14
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TCS3200 −
Packaging Mechanical Data
Figure 17:
Package D Carrier Tape
SIDE VIEW
K o
2.11 0.10 [0.083 0.004]
0.292 0.013
[0.0115 0.0005]
TOP VIEW
1.50
8 0.1
[0.315
0.004]
A
DETAIL A
A
A o
6.45 0.10
[0.254 0.004]
B
4 0.1
[0.157
0.004]
2 0.05
[0.079
0.002]
B
1.75 0.10
[0.069 0.004]
END VIEW
5.50 0.05
[0.217 0.002]
12 + 0.3 − 0.1
[0.472 + 0.12 − 0.004]
DETAIL B
B o
5.13 0.10
[0.202 0.004]
Note(s):
1. All linear dimensions are in millimeters [inches].
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing A o
, B o
, and K o
are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 1000 parts.
5.
ams
packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. This drawing is subject to change without notice.
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ams Datasheet
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TCS3200 −
Manufacturing Information
Manufacturing Information
Figure 18:
TCS3200 Solder Reflow Profile
Parameter
Average temperature gradient in preheating
Soak time
Time above 217°C
Time above 230°C
Time above T peak
- 10°C
Peak temperature in reflow
Temperature gradient in cooling
Figure 19:
TCS3200 Solder Reflow Profile Graph
The Plastic Small Outline IC package (D) has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The component should be limited to a maximum of three passes through this solder reflow profile.
Reference
t soak t
1 t
2 t
3
T peak
TCS32x0
2.5°C/s
2 to 3 minutes
Max 60 s
Max 50 s
Max 10 s
260°C (-0°C/5°C)
Max -5°C/s
Not to scale — for reference only
T peak
T
3
T
2
T
1 ams Datasheet
[v1-01] 2018-Mar-14
Time (s) t soak t
3 t
2 t
1
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TCS3200 −
Manufacturing Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on the bag when stored under the following conditions:
•
Shelf Life: 12 months
•
Ambient Temperature: < 40°C
•
Relative Humidity: < 90%
Rebaking of the devices will be required if the devices exceed the 12-month shelf life or the Humidity Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture region.
Floor Life
The D package has been assigned a moisture sensitivity level of MSL 5a. As a result, the floor life of devices removed from the moisture barrier bag is 24 hours from the time the bag was opened, provided that the devices are stored under the following conditions:
•
Floor Life: 24 hours
•
Ambient Temperature: < 30°C
•
Relative Humidity: < 60%
If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded, rebake at 60°C for 24 hours.
ams Datasheet
[v1-01] 2018-Mar-14
TCS3200 −
Ordering & Contact Information
Ordering & Contact Information
Figure 20:
Ordering Information
Ordering Code
TCS3200D-TR
Device
T
A
TCS3200 -40°C to 85°C
Package - Leads Package Designator
SOIC - 8 D
Buy our products or get free samples online at: www.ams.com/ICdirect
Technical Support is available at: www.ams.com/Technical-Support
Provide feedback about this document at: www.ams.com/Document-Feedback
For further information and requests, e-mail us at: [email protected]
For sales offices, distributors and representatives, please visit: www.ams.com/contact
Headquarters
ams AG
Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
ams Datasheet
[v1-01] 2018-Mar-14
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TCS3200 −
RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS:
The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br):
ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous material).
Important Information:
The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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ams Datasheet
[v1-01] 2018-Mar-14
TCS3200 −
Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.
Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services.
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TCS3200 −
Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
Product Status
Pre-Development
Pre-Production
Production
Discontinued
Definition
Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice
Information in this datasheet is based on products in the design, validation or qualification phase of development.
The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice
Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of
Trade
Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and should not be used for new designs
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[v1-01] 2018-Mar-14
TCS3200 −
Revision Information
Revision Information
Changes from 1-00 (2016-Jul-13) to current revision 1-01 (2018-Mar-14)
Removed all instances of TCS3210
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
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ams Datasheet
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Content Guide
TCS3200 −
Content Guide
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