AMS AS1745 Datasheet

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AS1744 , AS1745
Data Sheet
H i g h - Sp e e d , L o w - Vo l ta g e , D u a l , S i n g l e - S u p p l y,
4 Ω, S P D T A n a l o g S w i t c h e s
2 Key Features
Fast switching speeds, low ON-resistance, and low
power-consumption make these devices ideal for singlecell battery powered applications.
These highly-reliable devices operate from a +1.8 to
+5.5V supply, are differentiated by inverted logic, and
support break-before-make switching.
!
ON-Resistance:
- 4Ω (+5V supply)
- 5.5Ω (+3V supply)
!
RON Matching: 0.2Ω (+5V supply)
!
RON Flatness: 1Ω (+5V supply)
!
Supply Voltage Range: +1.8 to +5.5V
!
1.8V Operation:
- 9.5Ω ON-Resistance over Temperature
- 38ns Turn On Time
- 12ns Turn Off Time
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With low ON-resistance (RON), RON matching, and RON
flatness, the devices can accurately switch signals for
sample and hold circuits, digital filters, and op-amp gain
switching networks.
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The AS1744/AS1745 are high-speed, low-voltage, dual
single-pole/double-throw (SPDT) analog switches.
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1 General Description
The devices are available in a 10-pin MSOP package
and a 10-pin TDFN package.
!
Current-Handling: 100mA Continuous
!
Break-Before-Make Switching
!
Rail-to-Rail Signal Handling
!
Crosstalk: -90dB at 1MHz
!
Off-Isolation: -85dB at 1MHz
!
Total Harmonic Distortion: 0.1%
!
Operating Temperature Range: -40 to +85ºC
!
Package Types:
- 10-pin MSOP
- 10-pin TDFN
3 Applications
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The devices are ideal for use in power routing systems,
cordless and mobile phones, MP3 players, CD and DVD
players, PDAs, handheld computers, digital cameras,
and any other application where high-speed signal
switching is required.
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1
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Figure 1. Block Diagrams
IN1
2
Te
NO1
3
GND
AS1744
4
NO2
5
IN2
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1
10
COM1
Truth Table
9
NC1
INx
8
Low
V+
7
NC2
High
NOx to NCx to
COMx COMx
Off
On
10
IN1
2
3
Off
GND
4
NC2
5
6
IN2
COM2
Revision 1.53
9
NC1
On
Switches shown for low input.
COM1
NO1
AS1745
8
V+
7
NO2
6
COM2
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AS1744/AS1745
Data Sheet - P i n o u t
4 Pinout
Pin Assignments
Figure 2. Pin Assignments (Top View)
NO1 2
AS1744
GND 3
NO2 4
Pin Descriptions
10 COM1
9 NC1
NC1 2
9 NO1
8 V+
GND 3
7 NC2
NC2 4
6 COM2
8 V+
AS1745
7 NO2
IN2 5
6 COM2
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IN2 5
IN1 1
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10 COM1
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IN1 1
Table 1. Pin Descriptions
Pin Number
Pin Name
Description
AS1744
AS1745
10
10
COM1
Analog Switch 1 Common
6
6
COM2
Analog Switch 2 Common
3
3
1
1
5
5
9
2
7
4
2
9
4
7
GND
Analog Switch 1 Logic Control Input
IN2
Analog Switch 2 Logic Control Input
NC1
Analog Switch 1 Normally Closed Terminal
NC2
Analog Switch 2 Normally Closed Terminal
NO1
Analog Switch 1 Normally Open Terminal
NO2
Analog Switch 2 Normally Open Terminal
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IN1
8
V+
Input Supply Voltage. +1.8 to +5.5V
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8
Ground
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Revision 1.53
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AS1744/AS1745
Data Sheet - A b s o l u t e
Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Min
Max
Units
V+, IN1, IN2 to GND
-0.3
+7
V
-0.3
V+
+ 0.3
V
COMx, NOx, NCx Continuous Current
-100
+100
mA
COMx, NOx, NCx Peak Current
-150
+150
mA
Pulsed at 1ms, 10% duty cycle
Continuous Power Dissipation (TAMB = +70ºC)
330
mW
Derate at 4.7mW/ºC above +70ºC
Electro-Static Discharge
1000
V
HBM Mil-Std883E 3015.7 methods
Latch Up Immunity
Operating Temperature Range
-40
Junction Temperature
Storage Temperature Range
Package Body Temperature
-65
100
mA
+85
ºC
150
ºC
+150
ºC
+260
ºC
Norm: JEDEC 17
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”
Signals on pins COM1, COM2, NO1, NO2, NC1, or NC2 that exceed V+ or GND are clamped by internal diodes.
Limit forward-diode current to the maximum current rating.
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COMx, NOx, NCx to GND
Comments
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Parameter
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Revision 1.53
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AS1744/AS1745
Data Sheet - E l e c t r i c a l
Characteristics
6 Electrical Characteristics
V+ = +4.5 to 5.5V, VIH = +2.4V, VIL = +0.8V, TAMB = TMIN to TMAX (unless otherwise specified). Typ Values @TAMB = +25ºC.
Table 3. +5V Supply Electrical Characteristics
ON-Resistance
Min
0
V+ = 4.5V, ICOMx = 10mA,
VNOx or VNCx = 0 to V+
ON-Resistance
V+ = 4.5V, ICOMx = 10mA,
Match Between
VNOx or VNCx = 0 to V+
1
Channels
ON-Resistance
V+ = 4.5V, ICOMx = 10mA,
RFLAT(ON)
2
VNOx or VNCx = 0 to V+
Flatness
INOx(OFF), NOx or NCx OffV+ = 5.5V, VCOMx = 1 or 4.5V,
INCx(OFF) Leakage Current 3
VNOx or VNCx = 4.5 or 1V
COMx OffV+ = 5.5V, VCOMx = 1 or 4.5V,
ICOMx(OFF)
3
VNOx or VNCx = 4.5 or 1V
Leakage Current
COMx OnV+ = 5.5V, VCOMx = 4.5 or 1V,
ICOMx(ON)
3
VNOx or VNCx = 4.5 or 1V
Leakage Current
Logic Input: INx
VIH
Input Logic High
VIL
Input Logic Low
Input Leakage
IIH, IIL
VINx = 0 or +5.5V
Current
Switch Dynamic Characteristics
TAMB = TMIN to TMAX
TAMB = +25ºC
TAMB = TMIN to TMAX
TAMB = +25ºC
TAMB = TMIN to TMAX
TAMB = +25ºC
TAMB = TMIN to TMAX
TAMB = +25ºC
TAMB = TMIN to TMAX
tON
Turn On Time
tOFF
Turn Off Time
3
3
Break-Before3
Make
Q
Charge Injection
CNOx(OFF), NOx, NCx OffCNCx(OFF)
Capacitance
COMx OnCCOMx(ON)
Capacitance
TAMB = +25ºC
VNOx or VNCx = 3V, RLOAD = 300Ω,
CLOAD = 35pF, Figure 12
TAMB = TMIN to TMAX
TAMB = +25ºC
VNOx or VNCx = 3V, RLOAD = 300Ω,
CLOAD = 35pF, Figure 12
TAMB = TMIN to TMAX
TAMB = +25ºC
VNOx or VNCx = 3V, RLOAD = 300Ω,
CLOAD = 35pF, Figure 13
TAMB = TMIN to TMAX
VGEN = 2V, RGEN = 0, CLOAD = 1.0nF, Figure 14
Unit
V+
V
2.5
0.1
4
4.5
0.2
0.4
Te
VCT
Crosstalk
5
Total Harmonic
Distortion
Power Supply
Positive Supply
I+
Current
THD
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Ω
0.5
-0.1
-0.3
-0.1
-3
-0.4
-4
±0.01
1
1.2
0.1
0.3
0.1
3
0.4
4
±0.01
±0.1
2.4
-100
Ω
nA
nA
nA
0.8
V
V
5
100
nA
14
17
18
6
8
4
10
1
ns
ns
ns
pC
VNOx or VNCx = GND, f = 1MHz, Figure 15
20
pF
VCOMx = GND, f = 1MHz, Figure 15
56
pF
f = 10MHz, RLOAD = 50Ω, CLOAD = 5pF,
Figure 16
f = 1MHz, RLOAD = 50Ω, CLOAD = 5pF,
Figure 16
f = 10MHz, RLOAD = 50Ω, CLOAD = 5pF,
Figure 16
f = 1MHz, RLOAD = 50Ω, CLOAD = 5pF,
Figure 16
-52
f = 20Hz to 20kHz, VNOx = 5Vp-p, RLOAD = 600Ω
0.1
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Off-Isolation
4
Ω
7
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tBBM
VISO
Max
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ΔRON
TAMB = +25ºC
TAMB = TMIN to TMAX
TAMB = +25ºC
Typ
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RON
Conditions
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Symbol
Parameter
Analog Switch
VCOMx,
Analog Signal
VNOx,
Range
VNCx
V+ = 5.5V, VINx = 0 or V+
Revision 1.53
dB
-85
-52
dB
-90
0.01
%
1.0
µA
4 - 16
AS1744/AS1745
Data Sheet - E l e c t r i c a l
Characteristics
V+ = +2.7 to 3.6V, VIH = +2.0V, VIL = +0.4V, TAMB = TMIN to TMAX (unless otherwise specified). Typ values @ TAMB = +25ºC.
Table 4. +3V Supply Electrical Characteristics
Symbol
Parameter
Analog Switch
VCOMx,
VNOx,
Analog Signal Range
VNCx
Conditions
Min
Typ
Max Unit
0
ΔRON
ON-Resistance
Match Between
1
Channels
V+ = 2.7V, ICOMx = 10mA,
VNOx or VNCx = 0 to V+
RFLAT(ON)
ON-Resistance
2
Flatness
V+ = 2.7V, ICOMx = 10mA,
VNOx or VNCx = 0 to V+
INOx(OFF),
INCx(OFF)
NOx or NCx Off3
Leakage Current
V+ = 3.3V, VCOMx = 1 or 3V,
VNOx or VNCx = 3 or 1V
ICOMx(OFF)
COMx Off-Leakage
3
Current
V+ = 3.3V, VCOMx = 1 or 3V,
VNOx or VNCx = 3 or 1V
COMx On-Leakage
3
Current
Logic Input: (INx)
VIH
Input Logic High
V+ = 3.3V, VCOMx = 1 or 3V,
VNOx or VNCx = 1 or 3V
TAMB = +25ºC
5
TAMB = TMIN to TMAX
8
TAMB = +25ºC
0.1
TAMB = TMIN to TMAX
TAMB = +25ºC
TAMB = TMIN to TMAX
TAMB = +25ºC
TAMB = TMIN to TMAX
5.5
ICOMx(ON)
VIL
0.2
0.4
1.5
2
2.5
-0.1
±0.01
0.1
-0.3
0.3
TAMB = +25ºC
-0.1
TAMB = TMIN to TMAX
-3
TAMB = +25ºC
-0.4
TAMB = TMIN to TMAX
-4
±0.01
±0.1
3
tOFF
Turn Off Time
tBBM
Break-Before-Make
3
3
Ω
Ω
3
0.4
4
nA
nA
nA
V
0.4
V
5
100
nA
TAMB = +25ºC
VNOx or VNCx = 2V, RLOAD =
300Ω, CLOAD = 35pF, Figure 12 TAMB = TMIN to TMAX
17
23
TAMB = +25ºC
VNOx or VNCx = 2V, RLOAD =
300Ω, CLOAD = 35pF, Figure 12 TAMB = TMIN to TMAX
6
TAMB = +25ºC
VNOx or VNCx = 2V, RLOAD =
300Ω, CLOAD = 35pF, Figure 13 TAMB = TMIN to TMAX
11
Input Leakage
IIH,IIL
Current
Switch Dynamic Characteristics
Turn On Time
0.1
2.0
Input Logic Low
tON
Ω
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V+ = 2.7V, ICOMx = 10mA,
VNOx or VNCx = 0 to V+
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ON-Resistance
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RON
V+
VINx = 0 or +5.5V
-100
28
8
10
ns
ns
ns
1
Charge Injection
VGEN = 1.5V, RGEN = 0, CLOAD = 1.0nF, Figure 14
0
pC
CNOx(OFF),
CNCx(OFF)
NOx, NCx OffCapacitance
VNOx or VNCx = GND, f = 1MHz, Figure 15
20
pF
CCOMx(ON)
COMx OnCapacitance
VCOMx = GND, f = 1MHz, Figure 15
56
pF
f = 10MHz, RLOAD = 50Ω, CLOAD = 5pF, Figure 16
-52
f = 1MHz, RLOAD = 50Ω, CLOAD = 5pF, Figure 16
-85
f = 10MHz, RLOAD = 50Ω, CLOAD = 5pF, Figure 16
-52
f = 1MHz, RLOAD = 50Ω, CLOAD = 5pF, Figure 16
-90
V+ = 3.6V, VIN = 0 or +3.6V
0.01
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Off-Isolation
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VISO
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Q
VCT
Crosstalk
4
5
dB
dB
Te
Power Supply
I+
Positive Supply
Current
1.0
µA
1. ΔRON = RON(MAX) - RON(MIN).
2. Flatness is defined as the difference between the maximum and the minimum value of ON-resistance as measured
over the specified analog signal ranges.
3. Guaranteed by design.
4. Off-Isolation = 20log10(VCOMx/VNOx), VCOMx = output, VNOx = input to off switch.
5. Between any two switches.
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Revision 1.53
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AS1744/AS1745
Data Sheet - Ty p i c a l
Operating Characteristics
7 Typical Operating Characteristics
Figure 3. Frequency Response
Figure 4. THD vs. Frequency
10
0.12
Bandwidth
0
0.1
-10
Isolation
-40
Crosstalk
-50
-60
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0.08
-30
THD (%)
0.06
0.04
-70
-80
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Loss (dB)
-20
0.02
-90
0.1
10
0
1000
1000
10000
100000
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-100
0.001
Frequency (MHz)
Frequency (Hz)
Figure 5. RON vs. VCOM and Temperature (VDD = 5V)
Figure 6. RON vs. VCOM and Temperature (VDD = 3V)
3.5
4.5
4.0
2.5
2.0
Temp = +85ºC
3.5
Temp = +25ºC
3.0
RON(Ω)
RON (Ω)
3.0
Temp = -40ºC
1.5
Temp = +85ºC
Temp = +25ºC
2.5
Temp = -40ºC
2.0
1.5
1.0
0
1
2
3
4
1.0
5
0.0
VCOM (V)
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25
20
tON/tOFF (ns)
VDD = 1.8V
8
VDD = 2.5V
6
Te
RON (Ω)
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10
VDD = 3V
4
3.0
Figure 8. tON/tOFF vs. Temperature (V+ = 5V)
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12
2.0
VCOM (V)
Figure 7. RON vs. VCOM
14
1.0
tON
15
10
VDD = 4.5V
tOFF
5
2
VDD = 5V
0
0
0
1
2
3
4
5
-40
VCOM (V)
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25
85
Temperature (°C)
Revision 1.53
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AS1744/AS1745
Data Sheet - D e t a i l e d
Description
Figure 9. tON/tOFF vs. Supply Voltage
Figure 10. Charge Injection
35
40
30
25
20
20
tON
15
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Q(pC)
10
5
10
tOFF
0
VDD = 3V
VDD = 5V
-5
0
1.5
2.5
3.5
4.5
0
5.5
1
2
3
VCOM (V)
4
5
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Supply Voltage (V)
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tON/tOFF (ns)
30
8 Detailed Description
The AS1744/AS1745 are low ON-resistance, low-voltage, dual analog SPDT switches that operate from a single +1.8
to +5.5V supply.
CMOS process technology allows switching of analog signals that are within the supply voltage range (GND to V+).
ON-Resistance
When powered from a +5V supply, the low RON (4Ω max) allows high continuous currents to be switched in a wide
range of applications. All devices have low RON flatness (1Ω, max) so they can meet or exceed the low-distortion audio
requirements of modern portable audio devices.
Bi-Directional Switching
Pins NOx, NCx, and COMx are bi-directional, thus they can be used as inputs or outputs.
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Analog Signal Levels
Analog signals ranging over the entire supply voltage (V+ to GND) can be passed with very little change in ON-resistance (see Typical Operating Characteristics on page 6).
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Logic Inputs
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The AS1744/AS1745 logic inputs (INx) can be driven up to +5.5V regardless of the supply voltage value. For example,
with a +3.3V supply, IN+ may be driven low to GND and high to +5.5V. This allows the devices to interface with +5V
systems using a supply of less than 5V.
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Revision 1.53
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AS1744/AS1745
Data Sheet - A p p l i c a t i o n
Information
9 Application Information
Power-Supply Sequencing
Proper power-supply sequencing is critical for proper operation. The recommended sequence is as follows:
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1. V+
2. NOx, NCx, COMx
Always apply V+ before applying analog signals, especially if the analog signal is not current-limited. If the above
sequence is not possible, and if the analog inputs are not current-limited to less than 30mA, add a small-signal diode
as shown in Figure 11 (D1). If the analog signal can dip below GND, add diode D2. Adding these diodes will reduce the
analog range to a diode-drop (about 0.7V) below V+ (for D1), and a diode-drop above ground (for D2).
Note: Operation beyond the absolute maximum ratings (see page 3) may permanently damage the devices.
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Overvoltage Protection
ON-resistance increases slightly at lower supply voltages.
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Figure 11. Overvoltage Protection Using 2 External Blocking Diodes
AS1744/AS1745
V+
D1
V+
NOx
COMx
VGEN
GND
D2
Adding diode D2 to the circuit shown in Figure 11 causes the logic threshold to be shifted relative to GND. Diodes D1
and D2 also protect against overvoltage conditions.
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For example, in the circuit shown in Figure 11, if the supply voltage goes below the absolute maximum rating, and if a
fault voltage up to the absolute maximum rating is applied to an analog signal pin, no damage will result.
Note: The supply voltage (V+) must not exceed the absolute maximum rating of +7V.
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Power Supply Bypass
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Power supply connections to the devices must maintain a low impedance to ground. This can be done using a bypass
capacitor, which will also improve noise margin and prevent switching noise propagation from the V+ supply to other
components.
Layout Considerations
High-speed switches require proper layout and design procedures for optimum performance.
Reduce stray inductance and capacitance by keeping traces short and wide.
!
Ensure that bypass capacitors are as close to the device as possible.
!
Use large ground planes where possible.
Te
!
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Revision 1.53
8 - 16
AS1744/AS1745
Data Sheet - A p p l i c a t i o n
Information
Timing Diagrams and Test Setups
Figure 12. Switching Time
NOx or NCx
COMx
VOUT
NCx or NOx
RLOAD
CLOAD
†
INx
50%
50%
tOFF
VOUT
Switch
Output 0
0.9 x VOUT
tON
Logic
Input
GND
Logic input waveforms inverted for switches
that have the opposite logic sense.
Includes stray capacitance and fixture capacitance.
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0.9 x VOUT
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V+
VIN
tR < 5ns
tF < 5ns
VIH + 0.5V
Logic
Input
0
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V+
AS1744/
AS1745
Figure 13. Break-Before-Make Interval
V+
V+
VIN
NOx or NCx
NCx or NOx
INx
tR < 5ns
tF < 5ns
AS1744/
AS1745
VIH + 0.5V
COMx
RLOAD
VOUT
CLOAD
†
Logic
Input
50%
0
0.9 x VOUT
VOUT
Logic
Input
GND
Includes stray capacitance and fixture capacitance.
tD
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†
Figure 14. Charge Injection
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AS1744/
AS1745
V+
V+
ΔVOUT
ch
INx
VINL to
VINH
COMx
NCx
or NOx
VOUT
INx
Off
VOUT
On
Off
Te
RGEN
VGEN
GND
CLOAD
Off
On
Off
INx
INx depends on switch configuration; input polarity is determined by the sense of the switches.
Q = ΔVOUT x CLOAD
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Revision 1.53
9 - 16
AS1744/AS1745
Data Sheet - A p p l i c a t i o n
Information
Figure 15. NOx, NCx, and COMx Capacitance
AS1744/
AS1745
V+
V+
COMx
10nF
INx
GND
NCx or
NOx
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VINH or
VINL
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1MHz
Capacitance
Analyzer
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Figure 16. Off-Isolation, On-Loss, and Crosstalk
Network Analyzer
COMx
V+
VIN
50Ω
VOUT
Measure
50Ω
V+
10nF
AS1744/
AS1745
NCx
V+
NOx
Reference
INx
GND
50Ω
50Ω
Notes:
50Ω
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1. Measurements are standardized against short-circuit at all terminals.
2. Off-isolation is measured between COMx and the off NCx/NOx terminal of each switch. Off-isolation =
20log(VOUT/VIN).
3. Crosstalk is measured from one channel to all other channels.
4. Signal direction through the switch is reversed; worst values are recorded.
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Revision 1.53
10 - 16
AS1744/AS1745
Data Sheet - A p p l i c a t i o n
Information
Package Drawings and Markings
The devices are available in a 10-pin MSOP package and a 10-pin TDFN package.
Typ
1.10
0.10
0.86
3.00
2.95
4.90
3.00
2.95
0.51
0.51
0.15
0.15
0.31
0.41
±Tol
Max
±0.05
±0.08
±0.10
±0.10
±0.15
±0.10
±0.10
±0.13
±0.13
+0.15/-0.08
+0.15/-0.08
±0.08
±0.08
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Symbol
A
A1
A2
D
D2
E
E1
E2
E3
E4
R
R1
t1
t2
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Figure 17. 10-pin MSOP Package
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Symbol
b
b1
c
c1
θ1
θ2
θ3
L
L1
aaa
bbb
ccc
e
S
Revision 1.53
Typ
0.23
0.20
0.18
0.15
3.0º
12.0º
12.0º
0.55
0.95BSC
0.10
0.08
0.25
0.50 BSC
0.50 BSC
±Tol
+0.07/-0.08
±0.05
±0.08
+0.03/-0.02
±3.0º
±3.0º
±3.0º
±0.15
-
11 - 16
AS1744/AS1745
Data Sheet - A p p l i c a t i o n
Information
All dimensions are in millimeters, angles in degrees, unless otherwise specified.
Datums B and C to be determined at datum plane H.
Dimensions D and E1 are to be determined at datum plane H.
Dimensions D2 and E2 are for top package; dimensions D and E1 are for bottom package.
Cross section A-A to be determined at 0.13 to 0.25mm from lead tip.
Dimensions D and D2 do not include mold flash, protrusion, or gate burrs.
Dimensions E1 and E2 do not include interlead flash or protrusion.
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2.
3.
4.
5.
6.
7.
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Notes:
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Revision 1.53
12 - 16
AS1744/AS1745
Data Sheet - A p p l i c a t i o n
Information
Figure 18. 10-pin TDFN Package (3.0x3.0mm)
D2
SEE
DETAIL B
-A-
D
D/2
D2/2
PIN 1 MARKER
aaa C 2x
E
E2
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E2/2
E/2
NXL
-B-
INDEX AREA
(D/2 xE/2)
4
NXb
e
aaa C 2x
INDEX AREA
(D/2 xE/2)
4
6
TOP VIEW
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NXK
N N-1
10
(ND-1) X e
5
bbb
ddd
C
C A B
8
ccc C
10
A
7
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BOTTOM VIEW
NX
0.08 C
SEATING
PLANE
-C-
A3
A1
SIDE VIEW
Datum A or B
E
L2
L1
D
e
Terminal Tip
DETAIL B
TYPE A
Max
0.80
0.05
ca
Typ
0.75
0.02
0.20 REF
0.15
0.13
14º
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Min
0.70
0.00
0º
0.20
0.17
0.18
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Symbol
A
A1
A3
L1
L2
θ
K
K2
b
e
aaa
bbb
ccc
ddd
eee
ggg
0.25
0.5
0.15
0.10
0.10
0.05
0.08
0.10
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0.30
Notes
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2, 5
Symbol
D BSC
E BSC
D2
E2
L
N
ND
5
ODD TERMINAL SIDE
Min
2.20
1.40
0.30
Variations
Typ
3.00
3.00
0.40
10
5
Max
2.70
1.75
0.50
Notes
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2, 5
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
Revision 1.53
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AS1744/AS1745
Data Sheet - A p p l i c a t i o n
Information
Notes:
Dimensioning and tolerancing are compliant with ASME Y14.5M-1994.
Dimensions are in millimeters, angles in degrees (º).
N is the total number of terminals.
The terminal 1 identifier and terminal numbering convention shall conform to JESD 95-1 SPP-012. Details of
terminal 1 identifier are optional, but must be located within the zone indicated. The terminal 1 identifier may
be either a mold, embedded metal or mark feature.
5. Dimension b applies to metallized terminal and is measured between 0.15 and 0.30mm from terminal tip.
6. ND refers to the maximum number of terminals on D side.
7. Variation shown in Figure 18 is for illustration purposes only.
8. For variation identifier dimension details, refer to the Dimensions table.
9. For a complete set of dimensions for each variation, refer to the Variations table.
10. Unilateral coplanarity zone applies to the exposed heat sink slug and the terminals.
11. For a rectangular package, the terminal side of the package is determined by:
- Type 1: Terminals are on the short side of the package.
- Type 2: Terminals are on the long side of the package.
12. Variations specified as NJR (non JEDEC registered), with an additional dash number (e.g., -1, -2) are packages currently not registered with JEDEC.
13. When more than one variations exist for the same profile height, body size (DxE), and pitch, then those variations will be denoted by an additional dash number (i.e., -1,-2) for identification. The new variations shall be
created based on any or all of the following factors: terminal count, terminal length, and exposed pad sizes.
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Revision 1.53
14 - 16
AS1744/AS1745
Data Sheet - O r d e r i n g
Information
10 Ordering Information
The devices are available as the standard products shown in Table 5.
Table 5. Ordering Information
Description
Delivery Form
Package
AS1744G
Dual SPDT Switch
Tube
10-pin MSOP
Dual SPDT Switch
Tape and Reel
10-pin MSOP
Dual SPDT Switch
Tape and Reel
10-pin TDFN
Dual SPDT Switch
Tube
10-pin MSOP
Dual SPDT Switch
Tape and Reel
10-pin MSOP
Dual SPDT Switch
Tape and Reel
10-pin TDFN
AS1744V-T
†
AS1745G
AS1745G-T
AS1745V-T
Available upon request. Contact austriamicrosystems, AG for details.
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Type
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Revision 1.53
15 - 16
AS1744/AS1745
Data Sheet
Copyrights
Copyright © 1997-2007, austriamicrosystems AG, Schloss Premstaetten, 8141 Unterpremstaetten, Austria-Europe.
Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.
All products and companies mentioned are trademarks or registered trademarks of their respective companies.
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Disclaimer
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Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing
in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding
the information set forth herein or regarding the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior
to designing this product into a system, it is necessary to check with austriamicrosystems AG for current information.
This product is intended for use in normal commercial applications. Applications requiring extended temperature
range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or lifesustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for
each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard
production flow, such as test flow or test location.
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The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However,
austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to
personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or
consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of
austriamicrosystems AG rendering of technical or other services.
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Contact Information
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Headquarters
austriamicrosystems AG
A-8141 Schloss Premstaetten, Austria
Tel: +43 (0) 3136 500 0
Fax: +43 (0) 3136 525 01
For Sales Offices, Distributors and Representatives, please visit:
http://www.austriamicrosystems.com/contact
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Revision 1.53
16 - 16
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