AMS TSL25911 Light Sensor Datasheet

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TSL2591

Light-to-Digital Converter

General Description

The TSL2591 is a very-high sensitivity light-to-digital converter that transforms light intensity into a digital signal output capable of direct I²C interface. The device combines one broadband photodiode (visible plus infrared) and one infrared-responding photodiode on a single CMOS integrated circuit. Two integrating ADCs convert the photodiode currents into a digital output that represents the irradiance measured on each channel. This digital output can be input to a microprocessor where illuminance (ambient light level) in lux is derived using an empirical formula to approximate the human eye response. The TSL2591 supports a traditional level style interrupt that remains asserted until the firmware clears it.

Ordering Information

and

Content Guide appear at end of

datasheet.

Figure 1:

Added Value of Using TSL2591

Benefits

•

Approximates Human Eye Response

•

Flexible Operation

•

Suited for Operation Behind Dark Glass

•

Low Operating Overhead

•

Low Power 3.0

A Sleep State

•

I²C Fast Mode Compatible Interface

Features

•

Dual Diode

•

Programmable Analog Gain and Integration Time

•

600M:1 Dynamic Range

•

Two Internal Interrupt Sources

•

Programmable Upper and Lower Thresholds

•

One Interrupt Includes Programmable Persistence Filter

•

User Selectable Sleep Mode

•

Data Rates up to 400 kbit/s

•

Input Voltage Levels Compatible with 3.0V Bus

ams Datasheet

[v2-04] 2018-Jun-05

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Figure 2:

Block Diagram

TSL2591 −

General Description

Block Diagram

The functional blocks of this device are shown below:

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TSL2591 −

Detailed Description

The TSL2591 contains two integrating analog-to-digital converters (ADC) that integrate currents from two photodiodes.

Integration of both channels occurs simultaneously. Upon completion of the conversion cycle, the conversion result is transferred to the Channel 0 and Channel 1 data registers, respectively. The transfers are double-buffered to ensure that the integrity of the data is maintained. After the transfer, the device automatically begins the next integration cycle.

Communication with the device is accomplished through a standard, two-wire I²C serial bus. Consequently, the TSL2591 can be easily connected to a microcontroller or embedded controller. No external circuitry is required for signal conditioning. Because the output of the device is digital, the output is effectively immune to noise when compared to an analog signal.

The TSL2591 also supports an interrupt feature that simplifies and improves system efficiency by eliminating the need to poll a sensor for a light intensity value. The primary purpose of the interrupt function is to detect a meaningful change in light intensity. The concept of a meaningful change can be defined by the user both in terms of light intensity and time, or persistence, of that change in intensity. The device has the ability to define two sets of thresholds, both above and below the current light level. An interrupt is generated when the value of a conversion exceeds either of these limits. One set of thresholds can be configured to trigger an interrupt only when the ambient light exceeds them for a configurable amount of time (persistence) while the other set can be configured to trigger an immediate interrupt.

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Pin Assignment

Package FN Dual Flat No-Lead (Top

View):

Package drawing is not to scale.

TSL2591 −

Pin Assignment

T he TSL2591 pin assignments are described below.

Figure 3:

Pin Diagram

SCL 1

INT 2

GND 3

6 SDA

5 V

4 NC

Figure 4:

Pin Description

Pin Number

Pin Name

SCL

INT

GND

SDA

Description

I²C serial clock input terminal

Interrupt — open drain output (active low).

Power supply ground. All voltages are referenced to GND.

No connect — do not connect.

Supply voltage

I²C serial data I/O terminal

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TSL2591 −

Absolute Maximum Ratings

Stresses beyond those listed under

Absolute Maximum Ratings

may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under

maximum rating conditions for extended periods may affect device reliability.

Figure 5:

Absolute Maximum Ratings

Parameter

Supply voltage, V

Input terminal voltage

Output terminal voltage

Output terminal current

Storage temperature range, T stg

ESD tolerance, human body model

ESD tolerance, charge device model

(CDM)

Min Max Units Comments

All voltages are with respect to GND 3.8

-0.5

-1

3.8

-40

±2000

V mA

ºC

V JESD22-A114-B

±500 V JESD22-C101

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TSL2591 −

Electrical Characteristics

All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical

Quality Control) methods. Device parameters are guaranteed at T

= 25°C unless otherwise noted.

Figure 6:

Recommended Operating Conditions

Symbol

Parameter

Supply voltage

Operating free-air temperature

Min

2.7

-30

Typ

Max

3.6

Units

ºC

Figure 7:

Operating Characteristics, V

=3V, T

=25 ºC (unless otherwise noted)

Symbol

LEAK

Parameter

Supply current

INT, SDA output low voltage

Leakage current, SDA,

SCL, INT pins

Conditions

Active

Sleep state - no I²C activity

3mA sink current

6mA sink current

SCL, SDA input high voltage

SCL, SDA input low voltage

TSL25911 (V bus

= V

)

TSL25913 (V bus

= 1.8)

TSL25911 (V bus

= V

)

TSL25913 (V bus

= 1.8)

Min

-5

0.7 V

1.26

Typ Max Units

275

2.3

325

0.4

0.6

0.3 V

0.54

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TSL2591 −

Electrical Characteristics

Figure 8:

ALS Characteristics, V

=3V, T

=25 ºC, AGAIN = High, AEN=1, (unless otherwise noted)

(1) (2) (3)

Parameter

Dark ADC count value

Conditions

E e

= 0,

AGAIN = Max,

ATIME=000b (100ms)

ADC integration time step size

ADC number of integration steps

(4)

Max ADC count

ATIME = 000b (100ms)

Max ADC count

ADC count value

ADC count value ratio: CH1/CH0

R e

Irradiance responsivity

Noise

(4)

ATIME = 000b (100ms)

ATIME = 001b (200ms), 010b

(300ms), 011b (400ms),

100b (500ms), 101b (600ms)

White light

(2)

E e

= 4.98 μW/cm

ATIME = 000b (100 ms)

λ p

= 850 nm

(3)

E e

= 5.62 μW/cm

ATIME = 000b (100 ms)

White light

λ p

White light

ATIME = 000b (100 ms)

λ p

= 850 nm

(3)

ATIME = 000b (100 ms)

White light

(2)

E e

= 4.98 μW/cm

ATIME = 000b (100 ms)

Channel Min

CH0

CH1

CH0

CH1

CH0

CH1

CH0

CH1

CH0

CH1

CH0

1120

1230

0.092

0.558

Typ

100

1315

174

1447

866

0.132

0.598

264.1

34.9

257.5

154.1

Max

105

36863

65535

1510

1665

0.172

0.638

Units

counts ms steps counts counts counts counts counts/

(μW/cm

)

1 standard deviation

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TSL2591 −

Electrical Characteristics

Parameter Conditions

AGAIN = Med

Gain scaling, relative to 1× gain setting

(AGAIN = Low)

AGAIN = High

AGAIN = Max

Channel Min

CH0

CH1

CH0

CH1

CH0

CH1

360

8500

9100

Typ

24.5

400

9200

9900

Max

440

9900

10700

Units

Note(s):

1. Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Visible white LEDs and infrared 850 nm LEDs are used for final product testing for compatibility with high-volume production

2. The white LED irradiance is supplied by a white light-emitting diode with a nominal color temperature of 4000 K.

3. The 850 nm irradiance is supplied by a GaAs light-emitting diode with the following typical characteristics: peak wavelength λ p

850 nm and spectral halfwidth Δλ½ = 42 nm.

4. Parameter ensured by design and is not 100% tested.

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TSL2591 −

Timing Characteristics

The timing characteristics of TSL2591 are given below.

Figure 9:

AC Electrical Characteristics, V

= 3 V, T

= 25ºC (unless otherwise noted)

Parameter

(1)

Description

(SCL)

Clock frequency (I²C only) t t

(BUF)

(HDSTA)

Bus free time between start and stop condition

Hold time after (repeated) start condition. After this period, the first clock is generated.

(SUSTA) t

(SUSTO) t

(HDDAT) t

(SUDAT)

Repeated start condition setup time

Stop condition setup time

Data hold time

Data setup time t

(LOW) t

(HIGH)

SCL clock low period

SCL clock high period t

F t

Clock/data fall time

Clock/data rise time

C i

Input pin capacitance

Note(s):

1. Specified by design and characterization; not production tested.

Min

1.3

0.6

100

1.3

0.6

Typ Max

400

300

Units

kHz

μs

μs ns ns pF

μs ns

μs

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Timing Diagrams

Figure 10:

Parameter Measurement Information

TSL2591 −

Timing Diagrams

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TSL2591 −

Typical Operating Characteristics

Typical Operating

Characteristics

Figure 11:

Spectral Responsivity

Spectral Responsivity:

Two channel response allows for tunable illuminance

(lux) calculation regardless of transmissivity of glass.

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

CH0

CH1

300 400 500 600 700 800 900 1000 1100

λ

- Wavelength - nm

White LED Angular Response:

Near cosine angular response for broadband white light sources.

Figure 12:

White Normalized Responsivity vs. Angular Displacement

100%

90%

80%

70%

60%

50%

CH0

40%

30%

20%

10%

CH1

-90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90

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vs. V

and Temp:

Effect of supply voltage and temperature on active current.

TSL2591 −

Typical Operating Characteristics

Figure 13:

Normalized I

vs. V

and Temperature

1.2

1.15

1.1

1.05

0.95

75°C

50°C

25°C

5°C

0.9

2.7

2.8

2.9

3 3.1

3.2

3.3

3.4

3.5

3.6

- Source Voltage - V

White LED Response vs. Temp:

Effect of temperature on the device response for a broadband white light source.

Figure 14:

Response to White LED vs. Temperature

110%

105%

Ch 0

100%

Ch 1

95%

90%

0 10 20 30 40 50 60 70

Temperature - ºC

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TSL2591 −

Register Description

The device is controlled and monitored by registers accessed through the I²C serial interface. These registers provide for a variety of control functions and can be read to determine results of the ADC conversions. The register set is summarized in

Figure 15 .

Figure 15:

Register Description

Address Register Name

0x05

0x06

0x07

0x08

0x00

0x01

0x04

0x09

0x0A

0x0B

0x14

0x15

0x16

0x17

0x0C

0x11

0x12

0x13

COMMAND

ENABLE

CONFIG

AILTL

AIHTH

NPAILTL

NPAILTH

NPAIHTL

PERSIST

C0DATAL

C0DATAH

C1DATAL

C1DATAH

R/W

R/W

Register Function

Specifies Register Address

Enables states and interrupts

ALS gain and integration time configuration

ALS interrupt low threshold low byte

ALS interrupt high threshold high byte

No Persist ALS interrupt low threshold low byte

No Persist ALS interrupt low threshold high byte

No Persist ALS interrupt high threshold low byte

Reset

Value

0x00

Interrupt persistence filter

CH0 ADC low data byte

CH0 ADC high data byte

CH1 ADC low data byte

CH1 ADC high data byte

0x00

Note(s):

1. Devices with a primary I

C address of 0x29 also have a secondary I

C address of 0x28 that can be used for read only registers to quickly read in a single block I

C transaction.

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Command Register

CMD

Fields

CMD

6 5

TRANSACTION

Bits

TRANSACTION

ADDR/SF

6:5

4:0

TSL2591 −

The COMMAND register specifies the address of the target register for future read and write operations, as well as issues special function commands.

4 3 1 0 2

ADDR/SF

Description

Select Command Register. Must write as 1 when addressing

COMMAND register.

Select type of transaction to follow in subsequent data transfers

FIELD VALUE DESCRIPTION

Reserved - Do not use

Normal Operation

Reserved – Do not use

Special Function – See description below

Address field/special function field. Depending on the transaction type, see above, this field either specifies a special function command or selects the specific control-status-data register for subsequent read and write transactions. The field values listed below apply only to special function commands.

FIELD VALUE

00100

00110

00111

DESCRIPTION

Interrupt set – forces an interrupt

Clears ALS interrupt

Clears ALS and no persist ALS interrupt

01010 other

Clears no persist ALS interrupt

Reserved – Do not write

The interrupt set special function command sets the interrupt bits in the status register (0x13). For the interrupt to be visible on the

INT pin, one of the interrupt enable bits in the enable register

(0x00) must be asserted.

The interrupt set special function must be cleared with an interrupt clear special function. The ALS interrupt clear special functions clear any pending interrupt(s) and are self-clearing.

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TSL2591 −

Enable Register (0x00)

NPIEN

SAI

Reserved

The ENABLE register is

used to power the device on/off, enable functions and interrupts.

AIEN

Reserved

2 1

AEN

PON

Fields

NPIEN

SAI

Reserved

AIEN

Reserved

AEN

PON

Bits

3:2

Description

No Persist Interrupt Enable. When asserted NP Threshold conditions will generate an interrupt, bypassing the persist filter.

Sleep after interrupt. When asserted, the device will power down at the end of an ALS cycle if an interrupt has been generated.

Reserved. Write as 0.

ALS Interrupt Enable. When asserted permits ALS interrupts to be generated, subject to the persist filter.

Reserved. Write as 0.

ALS Enable. This field activates ALS function. Writing a one activates the ALS. Writing a zero disables the ALS.

Power ON. This field activates the internal oscillator to permit the timers and ADC channels to operate. Writing a one activates the oscillator. Writing a zero disables the oscillator.

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Control Register (0x01)

SRESET

Reserved

AGAIN

TSL2591 −

The CONTROL register is

used to configure the ALS gain and integration time. In addition, a system reset is provided. Upon power up, the CONTROL register resets to 0x00.

4 2 0 3

Reserved

ATIME

Fields

SRESET

Reserved

AGAIN

Reserved

ATIME

Bits

5:4

2:0

Description

System reset. When asserted, the device will reset equivalent to a power-on reset. SRESET is self-clearing.

Reserved. Write as 0.

ALS gain sets the gain of the internal integration amplifiers for both photodiode channels.

FIELD VALUE

DESCRIPTION

Low gain mode

Medium gain mode 01

Reserved. Write as 0.

High gain mode

Maximum gain mode

ALS time sets the internal ADC integration time for both photodiode channels.

FIELD VALUE

000

001

010

011

100

101

INTEGRATION TIME

100 ms

200 ms

300 ms

400 ms

500 ms

600 ms

MAX COUNT

36863

65535

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TSL2591 −

ALS Interrupt Threshold Register

(0x04 − 0x0B)

The ALS interrupt threshold registers provide the values to be used as the high and low trigger points for the comparison function for interrupt generation. If C0DATA crosses below the low threshold specified, or above the higher threshold, an interrupt is asserted on the interrupt pin.

If the C0DATA exceeds the persist thresholds (registers: 0x04 –

0x07) for the number of persist cycles configured in the PERSIST register an interrupt will be triggered. If the C0DATA exceeds the no-persist thresholds (registers: 0x08 – 0x0B) an interrupt will be triggered immediately following the end of the current integration.

Note that while the interrupt is observable in the STATUS register (0x13), it is visible only on the INT pin when AIEN or

NPIEN are enabled in the ENABLE register (0x00).

Upon power up, the interrupt threshold registers default to

0x00.

Register

AILTL

AILTH

AIHTL

AIHTH

NPAILTL

NPAILTH

NPAIHTL

NPAIHTH

Address

0x08

0x09

0x0A

0x0B

0x04

0x05

0x06

0x07

Bits

7:0

Description

ALS low threshold lower byte

ALS low threshold upper byte

ALS high threshold lower byte

ALS high threshold upper byte

No Persist ALS low threshold lower byte

No Persist ALS low threshold upper byte

No Persist ALS high threshold lower byte

No Persist ALS high threshold upper byte

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PERSIST Register (0x0C)

Field

Reserved

APERS

Reserved

TSL2591 −

The Interrupt persistence filter sets the number of consecutive out-of-range ALS cycles necessary to generate an interrupt.

Out-of-range is determined by comparing C0DATA (0x14 and

0x15) to the interrupt threshold registers (0x04 - 0x07). Note that the no-persist ALS interrupt is not affected by the interrupt persistence filter. Upon power up, the interrupt persistence filter register resets to 0x00.

4 3 2 1 0

APERS

Bits

7:4

3:0

Description

Reserved. Write as 0.

ALS interrupt persistence filter

FIELD VALUE

0000

PERSISTENCE

Every ALS cycle generates an interrupt

0001

0010

0011

0100

Any value outside of threshold range

2 consecutive values out of range

3 consecutive values out of range

5 consecutive values out of range

1001

1010

1011

1100

0101

0110

0111

1000

1101

1110

1111

10 consecutive values out of range

15 consecutive values out of range

20 consecutive values out of range

25 consecutive values out of range

30 consecutive values out of range

35 consecutive values out of range

40 consecutive values out of range

45 consecutive values out of range

50 consecutive values out of range

55 consecutive values out of range

60 consecutive values out of range

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TSL2591 −

PID Register (0x11)

Reserved

The PID register provides an identification of the devices package. This register is a read-only register whose value never changes.

3 0 5

PACKAGEID

4 2

Reserved

Field

Reserved

PID

Reserved

Bits

7:6

5:4

3:0

Description

Reserved.

Package Identification = 00

Reserved.

ID Register (0x12)

7 6

Field

Bits

7:0

The ID register provides the device identification. This register is a read-only register whose value never changes.

4 3 2 1 0

Description

Device Identification = 0x50

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Status Register (0x13)

Reserved

Field

Reserved

NPINTR

AINT

Reserved

AVALID

Bits

7:6

3:1

NPINTR

TSL2591 −

The Status Register provides the internal status of the device.

This register is read only.

3 1 4

AINT

Reserved

AVALID

Description

Reserved. Write at zero.

No-persist Interrupt. Indicates that the device has encountered a no-persist interrupt condition.

ALS Interrupt. Indicates that the device is asserting an ALS interrupt.

Reserved.

ALS Valid. Indicates that the ADC channels have completed an integration cycle since the AEN bit was asserted.

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TSL2591 −

ALS Data Register (0x14 - 0x17)

Register

C0DATAL

C0DATAH

C1DATAL

C1DATAH

Address

0x14

0x15

0x16

0x17

ALS data is stored as two 16-bit values; one for each channel.

When the lower byte of either channel is read, the upper byte of the same channel is latched into a shadow register. The shadow register ensures that both bytes are the result of the same ALS integration cycle, even if additional integration cycles occur between the lower byte and upper byte register readings.

Each channel independently operates the upper byte shadow register. So to minimize the potential for skew between CH0 and CH1 data, it is recommended to read all four ADC bytes in sequence.

Bits

7:0

Description

ALS CH0 data low byte

ALS CH0 data high byte

ALS CH1 data low byte

ALS CH1 data high byte

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Application Information

Figure 16:

Typical Application Hardware Circuit

TSL2591 −

Application Information

Figure 16 shows a typical hardware application circuit. A 1-μF

low-ESR decoupling capacitor should be placed as close as possible to the V

pin. V

BUS

in this figure refers to the I²C bus voltage, which is equal to V

TSL2591

The I²C signals and the Interrupt are open-drain outputs and require pull-up resistors. The pull-up resistor (RP) value is a function of the I²C bus speed, the I²C bus voltage, and the capacitive load. The

ams

EVM running at 400 kbps, uses 1.5-kΩ resistors. A 10-kΩ pull-up resistor (RPI) can be used for the interrupt line.

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TSL2591 −

PCB Pad Layout

Suggested land pattern based on the IPC−7351B Generic

Requirements for Surface Mount Design and Land Pattern

Standard (2010) for the small outline no-lead (SON) package is shown in

Figure 17 .

Figure 17:

Suggested FN Package PCB Layout (Top View)

Note(s):

1. All linear dimensions are in millimeters.

2. This drawing is subject to change without notice.

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Package Drawings & Markings

Figure 18:

FN Package – Dual Flat No-Lead Packaging Configuration

TSL2591 −

Pack age Drawings & Mark ings

Note(s):

1. All linear dimensions are in micrometers.

2. The die is centered within the package within a tolerence of ±75

μ m.

3. Package top surface is molded with an electrically non-conductive clear plastic compound having an index of refraction of 1.55.

4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.

5. This package contains no lead (Pb).

6. This drawing is subject to change without notice.

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TSL2591 −

Mechanical Data

Figure 19:

FN Package Carrier Tape and Reel Information

Note(s):

1. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.

2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.

3. Symbols on drawing A

, B

and K

O are defined in ANSI EIA Standard 481-B 2001.

4. Each reel is 178 millimeters in diameter and contains 3500 parts.

ams

packaging tape and reel conform to the requirements of EIA Standard 481 - B.

6. In accordance with EIA Standard, device pin 1 is located next to the sprocket holes in the tape.

7. This drawing is subject to change without notice.

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TSL2591 −

Soldering Information

Figure 20:

Solder Reflow Profile

Parameter

Average temperature gradient in preheating

Soak time

Time above 217 ºC (T

)

Time above 230 ºC (T

)

Time above T peak

- 10 ºC (T

)

Peak temperature in reflow

Temperature gradient in cooling

The package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.

The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile.

Reference

t soak t

1 t

2 t

T peak

Device

2.5 ºC/s

2 to 3 minutes

Max 60 s

Max 50 s

Max 10 s

260 ºC

Max -5 ºC/s

Figure 21:

Solder Reflow Profile Graph

Not to scale — for reference only

T peak

Time (s) t soak

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3 t

2 t

1 ams Datasheet

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TSL2591 −

Storage Information

ams Datasheet

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Moisture Sensitivity

Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package.

To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping.

Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use.

Shelf Life

The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on the bag when stored under the following conditions:

•

Shelf Life: 12 months

•

Ambient Temperature: < 40

•

Relative Humidity: < 90%

Rebaking of the devices will be required if the devices exceed the 12 month shelf life or the Humidity Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture region.

Floor Life

The FN package has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions:

•

Floor Life: 168 hours

•

Ambient Temperature:

•

Relative Humidity:

60%

If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing.

Rebaking Instructions

When the shelf life or floor life limits have been exceeded, rebake at 50

C for 12 hours.

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TSL2591 −

Ordering & Contac t Information

Ordering & Contact Information

Figure 22:

Ordering Information

Ordering Code

TSL25911FN

Address

0x29

Interface

I²C V bus

= V

Interface bus

= 1.8V

Delivery Form

ODFN-6

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RoHS Compliant & ams Green Statement

RoHS Compliant & ams Green

Statement

RoHS:

The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed

0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes.

ams Green (RoHS compliant and no Sb/Br):

ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants

(Br or Sb do not exceed 0.1% by weight in homogeneous material).

Important Information:

The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

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Copyrights & Disclaimer

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Copyrights & Disclaimer

Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.

Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of

Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed.

ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services.

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Document Status

Document Status

Product Preview

Preliminary Datasheet

Datasheet

Datasheet (discontinued)

Product Status

Pre-Development

Pre-Production

Production

Discontinued

Definition

Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice

Information in this datasheet is based on products in the design, validation or qualification phase of development.

The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice

Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of

Trade

Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of

Trade, but these products have been superseded and should not be used for new designs

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Revision Information

Changes from 2-03 (2018-Apr-30) to current revision 2-04 (2018-Jun-05)

Updated Figure 5

Updated text under Electrical Characteristics

Note(s):

1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.