DFI GH960 COM Express Basic User's Manual

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GH960

COM Express Basic Module

User’s Manual

A-580-M-2009

Copyright

This publication contains information that is protected by copyright. No part of it may be reproduced in any form or by any means or used to make any transformation/adaptation without the prior written permission from the copyright holders.

This publication is provided for informational purposes only. The manufacturer makes no representations or warranties with respect to the contents or use of this manual and specifically disclaims any express or implied warranties of merchantability or fitness for any particular purpose. The user will assume the entire risk of the use or the results of the use of this document. Further, the manufacturer reserves the right to revise this publication and make changes to its contents at any time, without obligation to notify any person or entity of such revisions or changes.

Changes after the publication’s first release will be based on the product’s revision. The website will always provide the most updated information.

© 2020. All Rights Reserved.

Trademarks

Product names or trademarks appearing in this manual are for identification purpose only and are the properties of the respective owners.

FCC and DOC Statement on Class B

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio TV technician for help.

Notice:

1. The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

2. Shielded interface cables must be used in order to comply with the emission limits.

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2

Table of Contents

Copyright ........................................................................................................................................2

Trademarks ....................................................................................................................................2

FCC and DOC Statement on Class B ...........................................................................................2

Notice: ............................................................................................................................................2

About this Manual .........................................................................................................................4

Warranty ........................................................................................................................................4

Static Electricity Precautions .......................................................................................................4

Safety Measures ...........................................................................................................................4

About the Package........................................................................................................................5

Optional Items ...............................................................................................................................5

Before Using the System Board ...................................................................................................5

Chapter 1 - Introduction................................................................................................................6

Specifications .........................................................................................................................6

Features ..................................................................................................................................7

Concept ...................................................................................................................................8

Chapter 2 - Hardware Installation ................................................................................................9

Board Layout...........................................................................................................................9

Standby Power LED ................................................................................................................9

System Memory ...................................................................................................................10

Installing the SO-DIMM Module ...................................................................................10

Assembly ..............................................................................................................................11

I/O Connectors .....................................................................................................................13

CPU Fan ..........................................................................................................................13

Board-to-board Connector ............................................................................................14

Signal Descriptions ..............................................................................................................17

Pin Types ........................................................................................................................17

AC97/HDA Signals Descriptions ..................................................................................17

Gigabit Ethernet Signals Descriptions .........................................................................17

SATA Signals Descriptions ...........................................................................................18

PCI Express Lanes Signals Descriptions .....................................................................18

PEG Signals Descriptions .............................................................................................19

ExpressCard Signals Descriptions ...............................................................................21

USB Signals Descriptions .............................................................................................21

LVDS Signals Descriptions ............................................................................................23

LPC Signals Descriptions ..............................................................................................24

SPI Signals Descriptions ...............................................................................................24

VGA Signals Descriptions .............................................................................................25

DDI Signals Descriptions .............................................................................................25

Serial Interface Signals Descriptions ...........................................................................27

I2C Signal Descriptions .................................................................................................27

Miscellaneous Signal Descriptions ..............................................................................28

Power and System Management Signals Descriptions .............................................28

Thermal Protection Signals Descriptions ....................................................................29

SMBUS Signals Descriptions ........................................................................................29

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GPIO Signals Descriptions ............................................................................................29

Power and GND Signal Descriptions ...........................................................................30

Module type Signal Descriptions ..................................................................................30

Chapter 3 - BIOS Settings ...........................................................................................................31

Overview ...............................................................................................................................31

Main .......................................................................................................................................32

Advanced .............................................................................................................................32

AMD CHIPSET Setting ...................................................................................................33

AMD Platform Setting ...................................................................................................34

Trusted Computing ........................................................................................................35

PTN3460 Config ............................................................................................................35

IT8528 Super IO Configuration .....................................................................................36

CPU Configuration .........................................................................................................37

USB Configuration .........................................................................................................37

CSM Configuration ........................................................................................................38

PC Health Status ...........................................................................................................38

WatchDog Configuration ...............................................................................................39

ACPI Configuration ........................................................................................................39

Serial Port Console Redirection ...................................................................................40

Network Stack Configuration........................................................................................41

Security .................................................................................................................................42

Secure Boot ....................................................................................................................42

Boot .......................................................................................................................................44

Save & Exit ............................................................................................................................44

Updating the BIOS ................................................................................................................45

Notice: BIOS SPI ROM..........................................................................................................45

Chapter 4 - Supported Software ................................................................................................46

Auto-run Menu ......................................................................................................................46

AMD Chipset and VGA Drivers ............................................................................................46

Intel LAN Driver ...................................................................................................................47

Audio Drivers ........................................................................................................................48

Adobe Acrobat Reader 9.3 ..................................................................................................48

3

About this Manual

This manual can be downloaded from the website, or acquired as an electronic file included in the optional CD/DVD. The manual is subject to change and update without notice, and may be based on editions that do not resemble your actual products. Please visit our website or contact our sales representatives for the latest editions.

Warranty

1. Warranty does not cover damages or failures that arised from misuse of the product, inability to use the product, unauthorized replacement or alteration of components and product specifications.

2. The warranty is void if the product has been subjected to physical abuse, improper installation, modification, accidents or unauthorized repair of the product.

3. Unless otherwise instructed in this user’s manual, the user may not, under any circumstances, attempt to perform service, adjustments or repairs on the product, whether in or out of warranty. It must be returned to the purchase point, factory or authorized service agency for all such work.

4. We will not be liable for any indirect, special, incidental or consequencial damages to the product that has been modified or altered.

Static Electricity Precautions

It is quite easy to inadvertently damage your PC, system board, components or devices even before installing them in your system unit. Static electrical discharge can damage computer components without causing any signs of physical damage. You must take extra care in handling them to ensure against electrostatic build-up.

1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are ready to install it.

2. Wear an antistatic wrist strap.

3. Do all preparation work on a static-free surface.

4. Hold the device only by its edges. Be careful not to touch any of the components, contacts or connections.

5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or connectors by their ends.

Important:

Electrostatic discharge (ESD) can damage your processor, disk drive and other components. Perform the upgrade instruction procedures described at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.

Safety Measures

• To avoid damage to the system, use the correct AC input voltage range.

• To reduce the risk of electric shock, unplug the power cord before removing the system chassis cover for installation or servicing. After installation or servicing, cover the system chassis before plugging the power cord.

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4

About the Package

The package contains the following items. If any of these items are missing or damaged, please contact your dealer or sales representative for assistance.

• One GH960 board

• CPU Cooler

Optional Items

• COM332-B carrier board kit

• Heat Spreader

The board and accessories in the package may not come similar to the information listed above. This may differ in accordance with the sales region or models in which it was sold. For more information about the standard package in your region, please contact your dealer or sales representative.

Before Using the System Board

When installing the system board in a new system, you will need at least the following internal components.

• Storage device such as hard disk drive, CD-ROM, etc.

• Power adaptor

External system peripherals may also be required for navigation and display, including at least a keyboard, a mouse and a video display monitor.

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Chapter 1

INTRODUCTION

Chapter 1 - Introduction

X

Specifications

SYSTEM

GRAPHICS

EXPANSION

AUDIO

ETHERNET

I/O

Processor

Memory

BIOS

Controller

Feature

AMD

®

Ryzen™ Embedded Series:

- V1807, Quad Core, 2MB Cache, 11 CU, 3.35GHz (3.8GHz), 35-54W

- V1756, Quad Core, 2MB Cache, 8 CU, 3.25GHz (3.6GHz), 35-54W

- V1605, Quad Core, 2MB Cache, 8 CU, 2.0GHz (3.6GHz), 12-25W

- V1202, Dual Core, 1MB Cache, 3 CU, 2.3GHz (3.2GHz), 12-25W

- R1606G, Dual Core, 1MB Cache, 3 CU, 2.6GHz (3.5GHz), 12-25W

- R1505G, Dual Core, 1MB Cache, 3 CU, 2.4GHz (3.3GHz), 12-25W

Two 260-pin SODIMM up to 32GB

Dual Channel DDR4 up to 2400/3200MHz

Insyde SPI 64Mbit

AMD

®

Radeon™ Vega Graphics

OpenGL 4.5, DirectX 12, OpenCL 2.1

HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265,

VP8, VP9

HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9

Display 1 x VGA/DDI (DDI available upon request)

1 x LVDS/eDP (eDP available upon request)

2 x DDI (HDMI/DVI/DP++)

VGA: resolution up to 1920x1200 @ 60Hz

LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz eDP: resolution up to 3840x2160 @ 60 Hz

HDMI: resolution up to 2560x1600 @ 60Hz or 4096x2160 @ 24Hz

DVI: resolution up to 1920x1200 @ 60Hz

DP++: resolution up to 4096x2304 @ 60Hz

Quad Displays VGA + LVDS + 2 DDI or eDP + 3 DDI (available upon request)

Interface

Interface

Controller

1 x PCIe x8 (Gen 3)

6 x PCIe x1 or 2 x PCIe x2 or 1 x PCIe x4

1 x LPC

1 x I

2

C

1 x SPI

1 x SMBus

2 x UART (TX/RX)

HD Audio

USB

SATA

DIO

1 x Intel

®

1 x Intel

®

I210AT PCIe (10/100/1000Mbps) (normal temp.) or

I210IT PCIe (10/100/1000Mbps) (wide temp.)

4 x USB 3.1

8 x USB 2.0

2 x SATA 3.0 (up to 6Gb/s)

RAID 0/1

1 x 8-bit DIO (Default 4 inputs and 4 outputs)

WATCHDOG

TIMER

SECURITY

POWER

Output &

Interval

TPM

Type

System Reset, Programmable via Software from 1 to 255 Seconds

TPM1.2/2.0 (Available Upon Request)

12V, 5VSB, VCC_RTC (ATX mode)

12V, VCC_RTC (AT mode)

OS SUPPORT

Windows: Windows 10 IoT Enterprise 64-bit

Linux

ENVIRONMENT

Temperature Operating: 0 to 60°C, -40 to 85°C

Storage: -40 to 85°C

Humidity Operating: 5 to 90% RH

Storage: 5 to 90% RH

MECHANICAL

Dimensions COM Express

®

Basic: 95mm (3.74") x 125mm (4.9")

Compliance PICMG COM Express

®

R3.0, Type 6

The specifications listed here may be based on editions that do not resemble your actual products. Please visit the download page at go.dfi.

com/GH960 or via the QR code to the right for the latest datasheet.

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6

X

Features

Watchdog Timer

The Watchdog Timer function allows your application to regularly “clear” the system at the set time interval. If the system hangs or fails to function, it will reset at the set time interval so that your system will continue to operate.

DDR4

DDR4 delivers increased system bandwidth and improves performance. The advantages of

DDR4 provide an extended battery life and improve the performance at a lower power than

DDR3/DDR2. Instead of using memory connectors, the system features memory down with the support of ECC memory.

Graphics

The integrated Intel® HD graphics engine delivers an excellent blend of graphics performance and features to meet business needs. It provides excellent video and 3D graphics with outstanding graphics responsiveness. These enhancements deliver the performance and compatibility needed for today’s and tomorrow’s business applications. Supports VGA, LVDS, eDP and

DDI display outputs.

Serial ATA

The system supports multiple SATA 3.0 (up to 6Gb/s) ports and allows for different configurations of RAID levels to meet various requirements for data redundancy and performance.

Gigabit LAN

The Intel® I210IT Gigabit LAN controller features up to 1Gbps data transmission with support for Intel® Active Management Technology. It provides remote maintenance and manageability for networked computing assets in an enterprise environment.

Wake-On-LAN

This feature allows the network to remotely wake up a Soft Power Down (Soft-Off) PC. It is supported via the onboard LAN port or via a PCI LAN card that uses the PCI PME (Power Management Event) signal. However, if your system is in the Suspend mode, you can power-on the system only through an IRQ or DMA interrupt.

USB

The system board supports the new USB 3.0. It is capable of running at a maximum transmission speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60 MB/s) and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission, reduces power consumption, and is backward compatible with USB 2.0. It is a marked improvement in device transfer speeds between your computer and a wide range of simultaneously accessible external Plug and Play peripherals.

Chapter 1

INTRODUCTION

ACPI STR

The system board is designed to meet the ACPI (Advanced Configuration and Power Interface) specification. ACPI has energy saving features that enables PCs to implement Power Management and Plug-and-Play with operating systems that support OS Direct Power Management.

ACPI when enabled in the Power Management Setup will allow you to use the Suspend to RAM function.

With the Suspend to RAM function enabled, you can power-off the system at once by pressing the power button or selecting “Standby” when you shut down Windows® without having to go through the sometimes tiresome process of closing files, applications and operating system.

This is because the system is capable of storing all programs and data files during the entire operating session into RAM (Random Access Memory) when it powers-off. The operating session will resume exactly where you left off the next time you power-on the system.

Power Failure Recovery

When power returns after an AC power failure, you may choose to either power-on the system manually or let the system power-on automatically.

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X

Concept

COM Express

Computer-on-module (COM) Express is a PC form factor designed with the core computing integrated on a fairly compact module. All the I/O signals and power supply are concentrated and mapped to the board-to-board connectors on the bottom side to interface with a carrier board that is typically customized to fit the application. When an upgrade or change of application is needed, the physical separation of the core computing and the I/O of COM Express cuts back the cost greatly, whereas canonical IPC designs would typically require an entire makeover. The

COM Express module can be replaced when there is only need to upgrade for higher computing performance, while the carrier board can be redesigned when there is solely change in application. COM Express also comes in different form factors and signal Types cut out for different scales and aspects of the system's application. Detailed specifications of COM Express are available on the website of PCI Industrial Computer Manufacturers Group (PICMG).

Common for all Form Factors

Extended only

Basic only

Compact only

Compact and Basic only

Mini only

106.00

Compact

Extended

Basic

91.00

70.00

51.00

Mini

18.00

6.00

0.00

4.00

Chapter 1

INTRODUCTION

Carrier Board

The design of a carrier board for COM Express greatly depends on the form factor and signal

Type of the COM Express module. The carrier board typically handles — but not limited to — one COM Express module, and is populated with stand-offs that conform to the form factor of the module's mounting holes.

GH960 is a Type 6 COM Express (R3.0) module compatible with DFI's proprietary carrier board

— COM332-B — as an optional item. If the carrier board is to be customized, the design guide for the carrier board can be attained via the Partner Zone page on our website.

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Chapter 2 - Hardware Installation

X

Board Layout

Top View

CPU Fan

AMD

Ryzen

V1000/

R1000

TM

SPI Flash BIOS

Standby Power LED

Bottom View

SC9214

REV.A

U48

1 5

3 4

7

1

5

U39

SC8901

6

4

1

Q1

3

LC8901

5

A

A

A

A

5

C

C

LC8700

2

U8901 1

8 5

8

U30

2

C

A

1

1

97

96

6

Q25

4

1 3

65

64

SC9000

U5

C

5

U3

1

4

A

3

4

1

8

7

5 4

C

1

15 16

8

5 4

VR1

5

U28

1

128

A110

32

33

1

C

C A

U8201

6

A

Q8200

6

4

1

4

4

3

6

U8200

D110

1

3

A

A

5

1

6

Q8900

1

C110

4

7

8

U8900

D14

3

3

C

D110

C110

B110

7

1

A C

A110

A 1 3

Q8600

C C

3 1

Q8202

Q8203

Q8201

A

Q17

3

Q21

U34

1

COM Express B2B

5

4

3

3

1

4 6

Q19

4

C A C A

5

1

4

6

1

3

3

6

1

Q9

Q8601

S

D

G

A

1

VR8401

C

D1

C1

B1

A1

D1

C1

B1

CN2

A1

Q8001

4

Q8000

3 1

A

6

C

1 6

1

4

6

Q8100

3

4

2

1

U18

3

1

U16 1

3

1

3

U17

5

4

4

5

5

4

4

3

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GH960

Chapter 2

HARDWARE INSTALLATION

Important:

Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in boards, and other components. Perform installation procedures at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.

X

Standby Power LED

Standby Power LED

Important:

When the Standby Power LED lights red, it indicates that there is power on the system board. Power-off the PC then unplug the power cord prior to installing any devices. Failure to do so will cause severe damage to the motherboard and components.

9

X

System Memory

DDR4_1

DDR4_2

Chapter 2

HARDWARE INSTALLATION

Installing the SO-DIMM Module

Before installing the memory module, please make sure that the following safety cautions are well-attended.

1. Make sure the PC and all other peripheral devices connected to it has been powered down.

2. Disconnect all power cords and cables.

3. Locate the SO-DIMM socket on the system board

4. Make sure the notch on memory card is aligned to the key on the socket.

The system board supports the following memory interface.

Single Channel (SC)

Data will be accessed in chunks of 64 bits from the memory channels.

Dual Channel (DC)

Data will be accessed in chunks of 128 bits from the memory channels. Dual channel provides better system performance because it doubles the data transfer rate.

Single Channel

Dual Channel

DIMMs are on the same channel. DIMMs in a channel can be identical or completely different. However, we highly recommend using identical DIMMs. Not all slots need to be populated.

DIMMs of the same memory configuration are on different channels.

Features

• DDR4 2400/3200 MHz memory

• ECC or Non-ECC

• Dual channel memory interface

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GH960

45°

Step 1

Retention Notch

Notch

Retention Clip

Key

DDR4 SO-DIMM

Socket Top View

10

Step 2

Step 3

Retention Notch

Notch

DDR3 SO-DIMM

X

System Memory

Retention Clip

Key

X

Installing the SO-DIMM Module

Socket Top View

Please follow the steps below to install the memory card into the socket.

45°

Step 1

Step 2

Step 3

Step 1:

Insert the memory card into the slot while making sure 1) the notch and the key are aligned, and 2) the non-connector end rises approximately 45 degrees horizontally. Press the card firmly into the socket while applying and maintaining even pressure on both ends.

Step 2:

Press the end of the card far from the socket down while making sure the retention notch and the clip align as indicated by the dotted line in the illustration. If the retention notch and the clip do not align, please remove the card and re-insert it. Press the card all the way down.

Step 3:

The clips snap automatically and abruptly to the retention notches of the card sounding a distinctive click, and lock the card in place.

Inspect that the clip sits in the notch. If not, please pull the clips outward, release and remove the card, and mount it again.

Chapter 2

HARDWARE INSTALLATION

X

Assembly

A CPU cooler is included in the standard package. The CPU cooler contains six spring screws and shall be installed after the COM Express module is securely mounted onto the carrier board. Please make sure the cooler, the module, and the carrier board are oriented correctly by inspecting whether the screws, screw holes, and stand-offs all align.

CPU Cooler

COM Express module

Carrier Board

User's Manual |

GH960

Note:

The carrier board is not included in the standard package and is typically customized.

11

6

5

1

3

2

4

X

Assembly

1. Locate the COM Express board-to-board connectors on the bottom side of the module and the carrier board. Locate the mounting holes on the module and the corresponding stand-offs on the carrier board.

A B C

Chapter 2

HARDWARE INSTALLATION

2. Place the module on the carrier board while making sure the mounting holes and connectors all align. At the long edge of the module closer to the connector, apply firm pressure onto the module and press it onto the the carrier board until the three standoffs and the edge of the module close up. The other edge of the module away from the connector may still remain slightly aloft from the stand-offs at this moment.

F E

C B A

D

Board-to-board connector on

COM Express module

D E F

Board-to-board connector on carrier board

3. At the long edge away from the connector, apply firm pressure with another hand onto the module and press it onto the carrier board until the module is against the remaining three stand-offs. Please also maintain the pressure described in the previous step the whole time.

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6

6

1

3

5 1

3

2

2

5

4

4

12

Chapter 2

HARDWARE INSTALLATION

X

Assembly

4. Inspect whether the gaps between the module and the stand-offs all close up. It is highly recommended that the module be removed and installed again following the previous steps when there is discernable gap.

X

I/O Connectors

CPU Fan

„

CPU Fan

1

5. Place the CPU cooler, i.e. heatsink and fan, onto the module while making sure the screws on the cooler align with the screw holes on the module. The thermal interface

3

below. By following the order, the risk of damaging the component is significantly reduced.

1

6

4

2

5

1

3

6

4

2

5

The fan connector is used to connect to cooling fans. Cooling fans provide adequate air circulation throughout the chassis and dissipate heat to prevent overheating of the system board and components.

BIOS Setting

Fan speed can be read in the Advanced menu (“SIO IT8528E” submenu) of the BIOS. Refer to chapter 3 for more information.

„

3-pin Fan Pin Assignment

Pin Assignment

1 Ground

2 Power

3 Sense

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X

I/O Connectors

Board-to-board Connector

1 5

7

1

3

5

4

C

A

6 4

1 3

2

5

A

A

A

A

5

C

C

8

1

1

97

96

6

1

3

4

5

4

1

128

5 4

7

1

A

1

2

8 5

C

1

8

15 16

5

1

65

64

5

6

14

33

C

32

A

C

A

6

1

A

4

6 4

1

3

4

6

3

C

D110

1

3

1

C110

4

7

8

2

3

1

B110

8

7

1

3

C

5

1

4

A

3

A

C

1

6

A110 A C

C

A

5

1

4

3

4

3

1

5

4

3

4

3

1

6

4

1

6

1

5

3

4

3

1

6

D1

1

A

S

D

G

C

3 1

A

6

4

C

1 6

1

4 6

4

3

3 2

4 1

C1

B1

3

1

3

1

3

1

5

4

4

5

5

4

A1

C A C A

Board-to-board connector

The two board-to-board connectors are located at the bottom side of the COM Express module.

Four rows (row A to row D) of pins and their signal are specified as listed below.

A8

A9

A10

A11

A12

A13

A14

A15

A4

A5

A6

A7

Pin

A1

A2

A3

A16

A17

A18

A19

A20

A21

Row A

GND (FIXED)

GBE0_MDI3-

GBE0_MDI3+

GBE0_LINK100#

GBE0_LINK1000#

GBE0_MDI2-

GBE0_MDI2+

GBE0_LINK#

GBE0_MDI1-

GBE0_MDI1+

GND (FIXED)

GBE0_MDI0-

GBE0_MDI0+

GBE0_CTREF

SUS_S3#

SATA0_TX+

SATA0_TX-

SUS_S4#

SATA0_RX+

SATA0_RX-

GND (FIXED)

B8

B9

B10

B11

B12

B13

B14

B15

B4

B5

B6

B7

Pin

B1

B2

B3

B16

B17

B18

B19

B20

B21

Row B

GND (FIXED)

GBE0_ACT#

LPC_FRAME# / ESPI_CS0#

LPC_AD0 / ESPI_IO_0

LPC_AD1 /ESPI_IO_1

LPC_AD2 / ESPI_IO_2

LPC_AD3 / ESPI_IO_3

LPC_DRQ0# / ESPI_ALERT0#

LPC_DRQ1# / ESPI_ALERT1#

LPC_CLK /ESPI_CK

GND (FIXED)

PWRBTN#

SMB_CK

SMB_DAT

SMB_ALERT#

SATA1_TX+

SATA1_TX-

SUS_STAT# /ESPI_RESET#

SATA1_RX+

SATA1_RX-

GND (FIXED)

User's Manual |

GH960

PCIE_TX4+

PCIE_TX4-

GND

PCIE_TX3+

PCIE_TX3-

GND (FIXED)

PCIE_TX2+

PCIE_TX2-

GPI1

PCIE_TX1+

PCIE_TX1-

GND

GPI2

PCIE_TX0+

PCIE_TX0-

Row A

SATA2_TX+

SATA2_TX-

SUS_S5#

SATA2_RX+

SATA2_RX-

BATLOW#

(S)ATA_ACT#

HDA_SYNC

HDA_RST#

GND (FIXED)

HDA_BITCLK

HDA_SDOUT

BIOS_DIS0# /ESPI_SAFS

THRMTRIP#

USB6-

USB6+

USB_6_7_OC#

USB4-

USB4+

GND (FIXED)

USB2-

USB2+

USB_2_3_OC#

USB0-

USB0+

VCC_RTC

RSVD

GBE0_SDP

LPC_SERIRQ /ESPI_CS1#

GND (FIXED)

PCIE_TX5+

PCIE_TX5-

GPI0

A47

A48

A49

A50

A51

A52

A53

A54

A39

A40

A41

A42

A43

A44

A45

A46

A31

A32

A33

A34

A35

A36

A37

A38

Pin

A22

A23

A24

A25

A26

A27

A28

A29

A30

A63

A64

A65

A66

A67

A68

A69

A55

A56

A57

A58

A59

A60

A61

A62

Chapter 2

HARDWARE INSTALLATION

B47

B48

B49

B50

B51

B52

B53

B54

B39

B40

B41

B42

B43

B44

B45

B46

B31

B32

B33

B34

B35

B36

B37

B38

Pin

B22

B23

B24

B25

B26

B27

B28

B29

B30

B63

B64

B65

B66

B67

B68

B69

B55

B56

B57

B58

B59

B60

B61

B62

PCIE_RX4+

PCIE_RX4-

GPO2

PCIE_RX3+

PCIE_RX3-

GND (FIXED)

PCIE_RX2+

PCIE_RX2-

GPO3

PCIE_RX1+

PCIE_RX1-

WAKE0#

WAKE1#

PCIE_RX0+

PCIE_RX0-

Row B

SATA3_TX+

SATA3_TX-

PWR_OK

SATA3_RX+

SATA3_RX-

WDT

HDA_SDIN2

HDA_SDIN1

HDA_SDIN0

GND (FIXED)

SPKR

I2C_CK

I2C_DAT

THRM#

USB7-

USB7+

USB_4_5_OC#

USB5-

USB5+

GND (FIXED)

USB3-

USB3+

USB_0_1_OC#

USB1-

USB1+

ESPI_EN#

USB0_HOST_PRSNT

SYS_RESET#

CB_RESET#

GND (FIXED)

PCIE_RX5+

PCIE_RX5-

GPO1

14

Row A Row B

A77 LVDS_VDD_EN/eDP_VDD_EN (opt.) B77 LVDS_B3+

A78 LVDS_A3+

A79 LVDS_A3-

A80 GND (FIXED)

A81 LVDS_A_CK+/eDP_TX3+ (opt.)

A82 LVDS_A_CK-/eDP_TX3- (opt.)

A83 LVDS_I2C_CK/eDP_AUX+ (opt.)

A84 LVDS_I2C_DAT/eDP_AUX- (opt.)

A85 GPI3

A86 RSVD

A87 RSVD/eDP_HPD

A88 PCIE0_CLK_REF+

A89 PCIE0_CLK_REF-

A90 GND (FIXED)

A91 SPI_POWER

A92 SPI_MISO

A93 GPO0

A94 SPI_CLK

A95 SPI_MOSI

A96 TPM_PP

A97 NC

A98 SER0_TX

A99 SER0_RX

A100 GND (FIXED)

A101 SER1_TX

A102 SER1_RX

A103 LID#

A104

A105

A106

A107

A108

A109

A110

VCC_12V

VCC_12V

VCC_12V

VCC_12V

VCC_12V

VCC_12V

GND (FIXED)

B78 LVDS_B3-

B79 LVDS_BKLT_EN/eDP_BKLT_EN (opt.)

B80 GND (FIXED)

B81 LVDS_B_CK+

B82 LVDS_B_CK-

B83 LVDS_BKLT_CTRL/eDP_BKLT_CTRL (opt.)

B84 VCC_5V_SBY

B85 VCC_5V_SBY

B86 VCC_5V_SBY

B87 VCC_5V_SBY

B88 BIOS_DIS1#

B89 VGA_RED

B90 GND (FIXED)

B91 VGA_GRN

B92 VGA_BLU

B93 VGA_HSYNC

B94 VGA_VSYNC

B95 VGA_I2C_CK

B96 VGA_I2C_DAT

B97 SPI_CS#

B98 RSVD

B99 RSVD

B100 GND (FIXED)

B101 FAN_PWMOUT

B102 FAN_TACHIN

B103 SLEEP#

B104 VCC_12V

B105 VCC_12V

B106 VCC_12V

B107 VCC_12V

B108 VCC_12V

B109 VCC_12V

B110 GND (FIXED)

X

I/O Connectors

X

Board-to-board Connector

Row A

GND (FIXED)

LVDS_A0+/ eDP_TX2+

LVDS_A0-/ eDP_TX2-

LVDS_A1+/ eDP_TX1+

LVDS_A1-/ eDP_TX1-

LVDS_A2+/ eDP_TX0+

LVDS_A2-/ eDP_TX0-

LVDS_VDD_EN/ eDP_VDD_EN

LVDS_A3+

LVDS_A3-

GND (FIXED)

LVDS_A_CK+/ eDP_TX3+

LVDS_A_CK-/ eDP_TX3-

LVDS_I2C_CK/ eDP_AUX+

LVDS_I2C_DAT/ eDP_AUX-

GPI3

RSVD eDP_HPD

PCIE0_CLK_REF+

PCIE0_CLK_REF-

GND (FIXED)

SPI_POWER

SPI_MISO

GPO0

SPI_CLK

SPI_MOSI

TPM_PP

TYPE10#

SER0_TX

SER0_RX

GND (FIXED)

SER1_TX

SER1_RX

LID#

VCC_12V

VCC_12V

VCC_12V

VCC_12V

VCC_12V

VCC_12V

GND (FIXED)

A93

A94

A95

A96

A97

A98

A99

A100

A85

A86

A87

A88

A89

A90

A91

A92

A101

A102

A103

A104

A105

A106

A107

A108

A109

A110

A77

A78

A79

A80

A81

A82

A83

A84

Pin

A70

A71

A72

A73

A74

A75

A76

B93

B94

B95

B96

B97

B98

B99

B100

B85

B86

B87

B88

B89

B90

B91

B92

B101

B102

B103

B104

B105

B106

B107

B108

B109

B110

B77

B78

B79

B80

B81

B82

B83

B84

Pin

B70

B71

B72

B73

B74

B75

B76

VCC_5V_SBY

VCC_5V_SBY

VCC_5V_SBY

BIOS_DIS1#

VGA_RED

GND (FIXED)

VGA_GRN

VGA_BLU

VGA_HSYNC

VGA_VSYNC

VGA_I2C_CK

VGA_I2C_DAT

SPI_CS#

RSVD

RSVD

GND (FIXED)

Row B

GND (FIXED)

LVDS_B0+

LVDS_B0-

LVDS_B1+

LVDS_B1-

LVDS_B2+

LVDS_B2-

LVDS_B3+

LVDS_B3-

LVDS_BKLT_EN/ eDP_BKLT_EN

GND (FIXED)

LVDS_B_CK+

LVDS_B_CK-

LVDS_BKLT_CTRL/ eDP_BKLT_CTRL

VCC_5V_SBY

FAN_PWNOUT

FAN_TACHIN

SLEEP#

VCC_12V

VCC_12V

VCC_12V

VCC_12V

VCC_12V

VCC_12V

GND (FIXED)

User's Manual |

GH960

Row C

GND (FIXED)

GND

USB_SSRX0-

USB_SSRX0+

GND

USB_SSRX1-

USB_SSRX1+

GND

USB_SSRX2-

USB_SSRX2+

GND (FIXED)

USB_SSRX3-

USB_SSRX3+

GND

DDI1_PAIR6+

DDI1_PAIR6-

RSVD

RSVD

PCIE_RX6+

PCIE_RX6-

GND (FIXED)

PCIE_RX7+

PCIE_RX7-

DDI1_HPD

DDI1_PAIR4+

DDI1_PAIR4-

RSVD

RSVD

DDI1_PAIR5+

DDI1_PAIR5-

GND (FIXED)

DDI2_CTRLCLK_AUX+

DDI2_CTRLDATA_AUX-

DDI2_DDC_AUX_SEL

RSVD

DDI3_CTRLCLK_AUX+

DDI3_CTRLDATA_AUX-

DDI3_DDC_AUX_SEL

DDI3_PAIR0+

DDI3_PAIR0-

GND (FIXED)

DDI3_PAIR1+

DDI3_PAIR1-

DDI3_HPD

RSVD

DDI3_PAIR2+

DDI3_PAIR2-

RSVD

C36

C37

C38

C39

C40

C41

C42

C43

C44

C45

C46

C47

C48

C28

C29

C30

C31

C32

C33

C34

C35

C15

C16

C17

C18

C19

C20

C21

C22

C23

C24

C25

C26

C27

C7

C8

C9

C10

C11

C12

C13

C14

Pin

C1

C2

C3

C4

C5

C6

Chapter 2

HARDWARE INSTALLATION

D36

D37

D38

D39

D40

D41

D42

D43

D44

D45

D46

D47

D48

D28

D29

D30

D31

D32

D33

D34

D35

D15

D16

D17

D18

D19

D20

D21

D22

D23

D24

D25

D26

D27

D7

D8

D9

D10

D11

D12

D13

D14

Pin

D1

D2

D3

D4

D5

D6

Row D

GND (FIXED)

GND

USB_SSTX0-

USB_SSTX0+

GND

USB_SSTX1-

USB_SSTX1+

GND

USB_SSTX2-

USB_SSTX2+

GND (FIXED)

USB_SSTX3-

USB_SSTX3+

GND

DDI1_CTRLCLK_AUX+

DDI1_CTRLDATA_AUX-

RSVD

RSVD

PCIE_TX6+

PCIE_TX6-

GND (FIXED)

PCIE_TX7+

PCIE_TX7-

RSVD

RSVD

DDI1_PAIR0+

DDI1_PAIR0-

RSVD

DDI1_PAIR1+

DDI1_PAIR1-

GND (FIXED)

DDI1_PAIR2+

DDI1_PAIR2-

DDI1_DDC_AUX_SEL

RSVD

DDI1_PAIR3+

DDI1_PAIR3-

RSVD

DDI2_PAIR0+

DDI2_PAIR0-

GND (FIXED)

DDI2_PAIR1+

DDI2_PAIR1-

DDI2_HPD

RSVD

DDI2_PAIR2+

DDI2_PAIR2-

RSVD

15

X

I/O Connectors

C69

C70

C71

C72

C73

C74

C75

C76

C61

C62

C63

C64

C65

C66

C67

C68

C53

C54

C55

C56

C57

C58

C59

C60

Pin

C49

C50

C51

C52

C85

C86

C87

C88

C89

C90

C91

C92

C93

C94

C77

C78

C79

C80

C81

C82

C83

C84

X

RSVD

PEG_RX8+

PEG_RX8-

GND (FIXED)

PEG_RX9+

PEG_RX9-

RSVD

GND

PEG_RX10+

PEG_RX10-

GND

PEG_RX11+

PEG_RX11-

GND (FIXED)

PEG_RX12+

PEG_RX12-

GND

PEG_RX13+

Row C

DDI3_PAIR3+

DDI3_PAIR3-

GND (FIXED)

PEG_RX0+

PEG_RX0-

TYPE0#

PEG_RX1+

PEG_RX1-

TYPE1#

PEG_RX2+

PEG_RX2-

GND (FIXED)

PEG_RX3+

PEG_RX3-

RSVD

RSVD

PEG_RX4+

PEG_RX4-

RAPID_SHUTDOWN

PEG_RX5+

PEG_RX5-

GND (FIXED)

PEG_RX6+

PEG_RX6-

GND

PEG_RX7+

PEG_RX7-

GND

Board-to-board Connector

D69

D70

D71

D72

D73

D74

D75

D76

D61

D62

D63

D64

D65

D66

D67

D68

D53

D54

D55

D56

D57

D58

D59

D60

Pin

D49

D50

D51

D52

D85

D86

D87

D88

D89

D90

D91

D92

D93

D94

D77

D78

D79

D80

D81

D82

D83

D84

Row D

DDI2_PAIR3+

DDI2_PAIR3-

GND (FIXED)

PEG_TX0+

PEG_TX0-

PEG_LANE_RV#

PEG_TX1+

PEG_TX1-

TYPE2#

PEG_TX2+

PEG_TX2-

GND (FIXED)

PEG_TX3+

PEG_TX3-

RSVD

RSVD

PEG_TX4+

PEG_TX4-

GND

PEG_TX5+

PEG_TX5-

GND (FIXED)

PEG_TX6+

PEG_TX6-

GND

PEG_TX7+

PEG_TX7-

GND

RSVD

PEG_TX8+

PEG_TX8-

GND (FIXED)

PEG_TX9+

PEG_TX9-

RSVD

GND

PEG_TX10+

PEG_TX10-

GND

PEG_TX11+

PEG_TX11-

GND (FIXED)

PEG_TX12+

PEG_TX12-

GND

PEG_TX13+

User's Manual |

GH960

C104

C105

C106

C107

C108

C109

C110

Pin

C95

C96

C97

C98

C99

C100

C101

C102

C103

Row C

PEG_RX13-

GND

RSVD

PEG_RX14+

PEG_RX14-

GND (FIXED)

PEG_RX15+

PEG_RX15-

GND

VCC_12V

VCC_12V

VCC_12V

VCC_12V

VCC_12V

VCC_12V

GND (FIXED)

Chapter 2

HARDWARE INSTALLATION

Pin

D95

D96

D97

D98

D99

Row D

PEG_TX13-

GND

RSVD

PEG_TX14+

PEG_TX14-

D100 GND (FIXED)

D101 PEG_TX15+

D102 PEG_TX15-

D103 GND

D104 VCC_12V

D105 VCC_12V

D106 VCC_12V

D107 VCC_12V

D108 VCC_12V

D109 VCC_12V

D110 GND (FIXED)

16

X

Signal Descriptions

Pin Types

I

O

I/O

OD

Input to the Module

Output from the Module

Bi-directional input / output signal

Open drain output

RSVD pins are reserved for future use and should be no connect. Do not tie the RSVD pins together.

AC97/HDA Signals Descriptions

Signal Pin# Pin Type

AC/HDA_RST#

AC/HDA_SYNC

A30

A29

AC/HDA_BITCLK A32

AC/HDA_SDOUT A33

AC/HDA_SDIN0 B30

AC/HDA_SDIN1 B29

AC/HDA_SDIN2 B28

O CMOS

O CMOS

I/O CMOS

O CMOS

I/O CMOS

I/O CMOS

I/O CMOS

Pwr Rail /Tolerance

3.3V Suspend/3.3V

3.3V/3.3V

3.3V/3.3V

3.3V/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

Gigabit Ethernet Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance

GBE0_MDI0+

GBE0_MDI0-

GBE0_MDI1+

GBE0_MDI1-

GBE0_MDI2+

GBE0_MDI2-

GBE0_MDI3+

GBE0_MDI3-

GBE0_ACT#

GBE0_LINK#

B2

A8

GBE0_LINK100# A4

GBE0_LINK1000# A5

GBE0_CTREF A14

A7

A6

A3

A2

A13

A12

A10

A9

I/O Analog

I/O Analog

I/O Analog

I/O Analog

I/O Analog

I/O Analog

I/O Analog

I/O Analog

OD CMOS

OD CMOS

OD CMOS

OD CMOS

REF

3.3V max Suspend

3.3V max Suspend

3.3V max Suspend

3.3V max Suspend

3.3V max Suspend

3.3V max Suspend

3.3V max Suspend

3.3V max Suspend

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

GND min 3.3V max

GH960 PU/PD series 33Ω resistor series 33Ω resistor series 22Ω resistor series 33Ω resistor

GH960 PU/PD

NC

Module Base Specification R3.0 Description

Reset output to CODEC, active low.

Sample-synchronization signal to the CODEC(s).

Serial data clock generated by the external CODEC(s).

Serial TDM data output to the CODEC.

Serial TDM data inputs from up to 3 CODECs.

Module Base Specification R3.0 Description

Gigabit Ethernet Controller 0: Media Dependent Interface Differential

Pairs 0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbit / sec modes. Some pairs are unused in some modes, per the following:

1000BASE-T 100BASE-TX 10BASE-T

MDI[0]+/- B1_DA+/- TX+/- TX+/-

MDI[1]+/- B1_DB+/- RX+/- RX+/-

MDI[2]+/- B1_DC+/-

MDI[3]+/- B1_DD+/-

Gigabit Ethernet Controller 0 activity indicator, active low.

Gigabit Ethernet Controller 0 link indicator, active low.

Gigabit Ethernet Controller 0 100 Mbit / sec link indicator, active low.

Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low.

Reference voltage for Carrier Board Ethernet channel 0 magnetics center tap. The reference voltage is determined by the requirements of the

Module PHY and may be as low as 0V and as high as 3.3V.

The reference voltage output shall be current limited on the Module. In the case in which the reference is shorted to ground, the current shall be limited to 250 mA or less.

User's Manual |

GH960

Chapter 2

HARDWARE INSTALLATION

COM Express Carrier Design Guide R2.0 Description

CODEC Reset.

Serial Sample Rate Synchronization.

24 MHz Serial Bit Clock for HDA CODEC.

Audio Serial Data Output Stream.

Audio Serial Data Input Stream from CODEC[0:2].

COM Express Carrier Design Guide R2.0 Description

Media Dependent Interface (MDI) differential pair 0.

Media Dependent Interface (MDI) differential pair 1.

Media Dependent Interface (MDI) differential pair 2. Only used for 1000Mbit/sec Gigabit Ethernet mode.

Media Dependent Interface (MDI) differential pair 3.

Only used for 1000Mbit/sec Gigabit Ethernet mode.

Ethernet controller 0 activity indicator, active low.

Ethernet controller 0 link indicator, active low.

Ethernet controller 0 100Mbit/sec link indicator, active low.

Ethernet controller 0 1000Mbit/sec link indicator, active low.

Reference voltage for Carrier Board Ethernet channel 0 magnetics center tap.

17

SATA Signals Descriptions

Signal Pin# Pin Type

SATA0_TX+

SATA0_TX-

SATA0_RX+

SATA0_RX-

SATA1_TX+

SATA1_TX-

SATA1_RX+

SATA1_RX-

SATA2_TX+

SATA2_TX-

SATA2_RX+

SATA2_RX-

SATA3_TX+

SATA3_TX-

SATA3_RX+

SATA3_RX-

(S)ATA_ACT#

B22

B23

B25

B26

A28

A22

A23

A25

A26

B16

B17

B19

B20

A16

A17

A19

A20

O SATA

O SATA

I SATA

I SATA

O SATA

O SATA

I SATA

I SATA

O SATA

O SATA

I SATA

I SATA

O SATA

O SATA

I SATA

I SATA

I/O CMOS

Pwr Rail /Tolerance

AC coupled on Module

AC coupled on Module

AC coupled on Module

AC coupled on Module

AC coupled on Module

AC coupled on Module

AC coupled on Module

AC coupled on Module

AC coupled on Module

AC coupled on Module

AC coupled on Module

AC coupled on Module

AC coupled on Module

AC coupled on Module

AC coupled on Module

AC coupled on Module

3.3V / 3.3V

GH960 PU/PD Module Base Specification R3.0 Description

AC Coupling capacitor Serial ATA or SAS Channel 0 transmit differential pair.

AC Coupling capacitor

AC Coupling capacitor Serial ATA or SAS Channel 0 receive differential pair.

AC Coupling capacitor

AC Coupling capacitor Serial ATA or SAS Channel 1 transmit differential pair.

AC Coupling capacitor

AC Coupling capacitor Serial ATA or SAS Channel 1 receive differential pair.

NA

NA

NA

NA

AC Coupling capacitor

NA

NA

NA

NA

PU 10KW to 3.3V

Serial ATA or SAS Channel 2 transmit differential pair.

Serial ATA or SAS Channel 2 receive differential pair.

Serial ATA or SAS Channel 3 transmit differential pair.

Serial ATA or SAS Channel 3 receive differential pair.

ATA (parallel and serial) or SAS activity indicator, active low.

PCI Express Lanes Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance

O PCIE AC coupled on Module PCIE_TX0+

PCIE_TX0-

PCIE_RX0+

PCIE_RX0-

PCIE_TX1+

PCIE_TX1-

PCIE_RX1+

PCIE_RX1-

PCIE_TX2+

A64

A65

B64

B65

A61

A68

A69

B68

B69

I PCIE

O PCIE

I PCIE

O PCIE

AC coupled off Module

AC coupled on Module

AC coupled off Module

PCIE_TX2-

PCIE_RX2+

PCIE_RX2-

PCIE_TX3+

PCIE_TX3-

A62

B61

B62

A58

A59

I PCIE

O PCIE

GH960 PU/PD Module Base Specification R3.0 Description

AC Coupling capacitor PCI Express Differential Transmit Pairs 0

AC Coupling capacitor

PCI Express Differential Receive Pairs 0

AC Coupling capacitor PCI Express Differential Transmit Pairs 1

AC Coupling capacitor

PCI Express Differential Receive Pairs 1

AC coupled on Module AC Coupling capacitor

(R1000 NA)

AC Coupling capacitor

(R1000 NA)

PCI Express Differential Transmit Pairs 2

AC coupled off Module (R1000 NA)

(R1000 NA)

AC coupled on Module

PCI Express Differential Receive Pairs 2

AC Coupling capacitor PCI Express Differential Transmit Pairs 3

AC Coupling capacitor

User's Manual |

GH960

Chapter 2

HARDWARE INSTALLATION

COM Express Carrier Design Guide R2.0 Description

Serial ATA channel 0

Transmit output differential pair.

Serial ATA channel 0

Receive input differential pair.

Serial ATA channel 1

Transmit output differential pair.

Serial ATA channel 1

Receive input differential pair.

Serial ATA channel 2

Transmit output differential pair.

Serial ATA channel 2

Receive input differential pair.

Serial ATA channel 3

Transmit output differential pair.

Serial ATA channel 3

Receive input differential pair.

Serial ATA activity LED. Open collector output pin driven during SATA command activity.

COM Express Carrier Design Guide R2.0 Description

PCIe channel 0. Transmit Output differential pair.

PCIe channel 0. Receive Input differential pair.

PCIe channel 1. Transmit Output differential pair.

PCIe channel 1. Receive Input differential pair.

PCIe channel 2. Transmit Output differential pair.

PCIe channel 2. Receive Input differential pair.

PCIe channel 3. Transmit Output differential pair.

18

PCIE_RX3+

PCIE_RX3-

PCIE_TX4+

PCIE_TX4-

PCIE_RX4+

PCIE_RX4-

PCIE_TX5+

PCIE_TX5-

PCIE_RX5+

PCIE_RX5-

PCIE_TX6+

PCIE_TX6-

PCIE_RX6+

PCIE_RX6-

PCIE_TX7+

PCIE_TX7-

PCIE_RX7+

PCIE_RX7-

C22

C23

PCIE_CLK_REF+ A88

PCIE_CLK_REFA89

C19

C20

D22

D23

B55

B56

A52

A53

B58

B59

A55

A56

B52

B53

D19

D20

I PCIE

O PCIE

I PCIE

O PCIE

I PCIE

O PCIE

I PCIE

O PCIE

I PCIE

O PCIE

PEG Signals Descriptions

Signal Pin# Pin Type

O PCIE PEG_TX0+

PEG_TX0-

PEG_RX0+

PEG_RX0-

PEG_TX1+

PEG_TX1-

PEG_RX1+

PEG_RX1-

PEG_TX2+

PEG_TX2-

PEG_RX2+

PEG_RX2-

PEG_TX3+

PEG_TX3-

D58

D59

C58

C59

D61

D62

D55

D56

C55

C56

D52

D53

C52

C53

I PCIE

O PCIE

I PCIE

O PCIE

I PCIE

O PCIE

AC coupled off Module PCI Express Differential Receive Pairs 3

AC coupled on Module

AC coupled off Module

AC Coupling capacitor PCI Express Differential Transmit Pairs 4

AC Coupling capacitor

PCI Express Differential Receive Pairs 4

AC coupled on Module

AC coupled off Module

AC Coupling capacitor PCI Express Differential Transmit Pairs 5

AC Coupling capacitor

PCI Express Differential Receive Pairs 5

AC coupled on Module AC Coupling capacitor

(Option)

AC Coupling capacitor

(Option)

AC coupled off Module (Option)

(Option)

AC coupled on Module NA

NA

AC coupled off Module NA

NA

PCIE

PCI Express Differential Transmit Pairs 6

PCI Express Differential Receive Pairs 6

PCI Express Differential Transmit Pairs 7

PCI Express Differential Receive Pairs 7

Reference clock output for all PCI Express and PCI Express Graphics lanes.

Pwr Rail /Tolerance

AC coupled on Module

AC coupled off Module

GH960 PU/PD Module Base Specification R3.0 Description

AC Coupling capacitor PCI Express Graphics transmit differential pairs 0

AC Coupling capacitor

PCI Express Graphics receive differential pairs 0

AC coupled on Module

AC coupled off Module

AC Coupling capacitor PCI Express Graphics transmit differential pairs 1

AC Coupling capacitor

PCI Express Graphics receive differential pairs 1

AC coupled on Module

AC coupled off Module

AC Coupling capacitor PCI Express Graphics transmit differential pairs 2

AC Coupling capacitor

PCI Express Graphics receive differential pairs 2

AC coupled on Module AC Coupling capacitor PCI Express Graphics transmit differential pairs 3

AC Coupling capacitor

Chapter 2

HARDWARE INSTALLATION

PCIe channel 3. Receive Input differential pair.

PCIe channel 4. Transmit Output differential pair.

PCIe channel 4. Receive Input differential pair.

PCIe channel 5. Transmit Output differential pair.

PCIe channel 5. Receive Input differential pair.

PCIe channel 6. Transmit Output differential pair.

PCIe channel 6. Receive Input differential pair.

PCIe channel 7. Transmit Output differential pair.

PCIe channel 7. Receive Input differential pair.

PCIe Reference Clock for all COM Express PCIe lanes, and for PEG lanes.

COM Express Carrier Design Guide R2.0 Description

PEG channel 0, Transmit Output differential pair.

PEG channel 0, Receive Input differential pair.

PEG channel 1, Transmit Output differential pair.

PEG channel 1, Receive Input differential pair.

PEG channel 2, Transmit Output differential pair.

PEG channel 2, Receive Input differential pair.

PEG channel 3, Transmit Output differential pair.

User's Manual |

GH960

19

PEG_RX5+

PEG_RX5-

PEG_TX6+

PEG_TX6-

PEG_RX6+

PEG_RX6-

PEG_TX7+

PEG_TX7-

PEG_RX3+

PEG_RX3-

PEG_TX4+

PEG_TX4-

PEG_RX4+

PEG_RX4-

PEG_TX5+

PEG_TX5-

I PCIE

O PCIE

I PCIE

O PCIE

I PCIE

O PCIE

I PCIE

O PCIE

PEG_RX7+

PEG_RX7-

PEG_TX8+

PEG_TX8-

PEG_RX8+

PEG_RX8-

PEG_TX9+

PEG_TX9-

PEG_RX9+

PEG_RX9-

PEG_TX10+

PEG_TX10-

PEG_RX10+

PEG_RX10-

PEG_TX11+

PEG_TX11-

PEG_RX11+

PEG_RX11-

User's Manual |

GH960

C85

C86

D88

D89

C81

C82

D85

D86

C88

C89

C78

C79

D81

D82

C74

C75

D78

D79

I PCIE

O PCIE

I PCIE

O PCIE

I PCIE

O PCIE

I PCIE

O PCIE

I PCIE

C71

C72

D74

D75

C68

C69

D71

D72

C65

C66

D68

D69

C61

C62

D65

D66

AC coupled off Module PCI Express Graphics receive differential pairs 3

AC coupled on Module AC Coupling capacitor

(R1000 NA)

AC Coupling capacitor

(R1000 NA)

AC coupled off Module (R1000 NA)

(R1000 NA)

AC coupled on Module AC Coupling capacitor

(R1000 NA)

AC Coupling capacitor

(R1000 NA)

AC coupled off Module (R1000 NA)

(R1000 NA)

AC coupled on Module AC Coupling capacitor

(R1000 NA)

AC Coupling capacitor

(R1000 NA)

AC coupled off Module (R1000 NA)

(R1000 NA)

AC coupled on Module AC Coupling capacitor

(R1000 NA)

AC Coupling capacitor

(R1000 NA)

AC coupled off Module (R1000 NA)

(R1000 NA)

AC coupled on Module NA

NA

AC coupled off Module NA

NA

AC coupled on Module NA

NA

AC coupled off Module NA

NA

AC coupled on Module NA

NA

AC coupled off Module NA

NA

AC coupled on Module NA

NA

AC coupled off Module NA

NA

PCI Express Graphics transmit differential pairs 4

PCI Express Graphics receive differential pairs 4

PCI Express Graphics transmit differential pairs 5

PCI Express Graphics receive differential pairs 5

PCI Express Graphics transmit differential pairs 6

PCI Express Graphics receive differential pairs 6

PCI Express Graphics transmit differential pairs 7

PCI Express Graphics receive differential pairs 7

PCI Express Graphics transmit differential pairs 8

PCI Express Graphics receive differential pairs 8

PCI Express Graphics transmit differential pairs 9

PCI Express Graphics receive differential pairs 9

PCI Express Graphics transmit differential pairs 10

PCI Express Graphics receive differential pairs 10

PCI Express Graphics transmit differential pairs 11

PCI Express Graphics receive differential pairs 11

Chapter 2

HARDWARE INSTALLATION

PEG channel 3, Receive Input differential pair.

PEG channel 4, Transmit Output differential pair.

PEG channel 4, Receive Input differential pair.

PEG channel 5, Transmit Output differential pair.

PEG channel 5, Receive Input differential pair.

PEG channel 6, Transmit Output differential pair.

PEG channel 6, Receive Input differential pair.

PEG channel 7, Transmit Output differential pair.

PEG channel 7, Receive Input differential pair.

PEG channel 8, Transmit Output differential pair.

PEG channel 8, Receive Input differential pair.

PEG channel 9, Transmit Output differential pair.

PEG channel 9, Receive Input differential pair.

PEG channel 10, Transmit Output differential pair.

PEG channel 10, Receive Input differential pair.

PEG channel 11, Transmit Output differential pair.

PEG channel 11, Receive Input differential pair.

20

PEG_TX12+

PEG_TX12-

PEG_RX12+

PEG_RX12-

PEG_TX13+

PEG_TX13-

PEG_RX13+

PEG_RX13-

PEG_TX14+

PEG_TX14-

PEG_RX14+

PEG_RX14-

D98

D99

C98

C99

PEG_TX15+

PEG_TX15-

PEG_RX15+

PEG_RX15-

D101

D102

C101

C102

PEG_LANE_RV# D54

D94

D95

C94

C95

D91

D92

C91

C92

O PCIE

I PCIE

O PCIE

I PCIE

I CMOS

O PCIE

I PCIE

O PCIE

I PCIE

AC coupled on Module NA

NA

AC coupled off Module NA

NA

AC coupled on Module NA

NA

AC coupled off Module NA

NA

AC coupled on Module NA

NA

AC coupled off Module NA

NA

AC coupled on Module NA

NA

AC coupled off Module NA

NA

3.3V / 3.3V

PU 10KΩ to 3V3

ExpressCard Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance

GBE0_SDP A49 I/O 3.3V Suspend/3.3V

RSVD

USB0_HOST_

PRSNT

ESPI_EN#

A48

B48

B47

I CMOS

I CMOS

3.3V Suspend/

3.3V

NA

GH960 PU/PD

NC

NC

NC

USB Signals Descriptions

Signal Pin# Pin Type

I/O USB USB0+

USB0-

USB1+

USB1-

USB2+

USB2-

USB3+

USB3-

A43

A42

B43

B42

A46

A45

B46

B45

I/O USB

I/O USB

I/O USB

Pwr Rail /Tolerance

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

GH960 PU/PD

PCI Express Graphics transmit differential pairs 12

PCI Express Graphics receive differential pairs 12

PCI Express Graphics transmit differential pairs 13

PCI Express Graphics receive differential pairs 13

PCI Express Graphics transmit differential pairs 14

PCI Express Graphics receive differential pairs 14

PCI Express Graphics transmit differential pairs 15

PCI Express Graphics receive differential pairs 15

PCI Express Graphics lane reversal input strap.

Pull low on the Carrier board to reverse lane order.

Chapter 2

HARDWARE INSTALLATION

PEG channel 12, Transmit Output differential pair.

PEG channel 12, Receive Input differential pair.

PEG channel 13 Transmit Output differential pair.

PEG channel 13, Receive Input differential pair.

PEG channel 14, Transmit Output differential pair.

PEG channel 14, Receive Input differential pair.

PEG channel 15, Transmit Output differential pair.

PEG channel 15, Receive Input differential pair.

PCI Express Graphics lane reversal input strap.

Pull low on the carrier board to reverse lane order.

Module Base Specification R3.0 Description

Gigabit Ethernet Controller 0 Software-Definable Pin.

Reserve pin

Module USB client may detect the presence of a USB host on USB0

This signal is used by the Carrier to indicate the operating mode of the LPC/eSPI bus.

COM Express Carrier Design Guide R2.0 Description

PCI ExpressCard0: PCI Express capable card request, active low, one per card

PCI ExpressCard0: reset, active low, one per card

PCI ExpressCard1: PCI Express capable card request, active low, one per card

PCI ExpressCard1: reset, active low, one per card

Module Base Specification R3.0 Description

USB differential pairs, channel 0

USB differential pairs, channel 1

USB differential pairs, channel 2

USB differential pairs, channel 3

COM Express Carrier Design Guide R2.0 Description

USB Port 0, data + or D+

USB Port 0, data - or D-

USB Port 1, data + or D+

USB Port 1, data - or D-

USB Port 2, data + or D+

USB Port 2, data - or D-

USB Port 3, data + or D+

USB Port 3, data - or D-

User's Manual |

GH960

21

USB4+

USB4-

USB5+

USB5-

USB6+

USB6-

USB7+

USB7-

USB_0_1_OC#

A37

A36

B37

B36

A40

A39

B40

B39

B44

USB_2_3_OC# A44

USB_4_5_OC# B38

USB_6_7_OC# A38

USB_SSTX0+

USB_SSTX0-

USB_SSRX0+

USB_SSRX0-

USB_SSTX1+

USB_SSTX1-

USB_SSRX1+

USB_SSRX1-

USB_SSTX2+

USB_SSTX2-

USB_SSRX2+

USB_SSRX2-

USB_SSTX3+

USB_SSTX3-

USB_SSRX3+

USB_SSRX3-

D9

C10

C9

D13

D12

C13

C12

D7

D6

C7

C6

D10

D4

D3

C4

C3

User's Manual |

GH960

I CMOS

I CMOS

I CMOS

O PCIE

I PCIE

O PCIE

I PCIE

O PCIE

I/O USB

I/O USB

I/O USB

I/O USB

I CMOS

I PCIE

O PCIE

I PCIE

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

AC coupled on Module

AC coupled off Module

AC coupled on Module

AC coupled off Module

USB differential pairs, channel 4

USB differential pairs, channel 5

USB differential pairs, channel 6

PU 10KW to 3.3V

Suspend

PU 10KW to 3.3V

Suspend

PU 10KW to 3.3V

Suspend

USB differential pairs, channel 7.

USB7 may be configured as a USB client or as a host, or both, at the Module designer’s discretion. (CH960 default set as a host)

USB over-current sense, USB channels 0 and 1. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not pull this line high on the Carrier Board.

USB over-current sense, USB channels 2 and 3. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not pull this line high on the Carrier Board.

USB over-current sense, USB channels 4 and 5. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not pull this line high on the Carrier Board.

PU 10KW to 3.3V

Suspend

USB over-current sense, USB channels 6 and 7. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not pull this line high on the Carrier Board.

AC Coupling capacitor Additional transmit signal differential pairs for the SuperSpeed USB data path.

AC Coupling capacitor

Additional receive signal differential pairs for the SuperSpeed USB data path.

AC Coupling capacitor Additional transmit signal differential pairs for the SuperSpeed USB data path.

AC Coupling capacitor

Additional receive signal differential pairs for the SuperSpeed USB data path.

Chapter 2

HARDWARE INSTALLATION

USB Port 4, data + or D+

USB Port 4, data - or D-

USB Port 5, data + or D+

USB Port 5, data - or D-

USB Port 6, data + or D+

USB Port 6, data - or D-

USB Port 7, data + or D+

USB Port 7, data - or D-

USB over-current sense, USB ports 0 and 1.

USB over-current sense, USB ports 2 and 3.

USB over-current sense, USB ports 4 and 5.

USB over-current sense, USB ports 6 and 7.

USB Port 0, SuperSpeed TX +

USB Port 0, SuperSpeed TX -

USB Port 0, SuperSpeed RX +

USB Port 0, SuperSpeed RX -

USB Port 1, SuperSpeed TX +

USB Port 1, SuperSpeed TX -

USB Port 1, SuperSpeed RX +

USB Port 1, SuperSpeed RX -

USB Port 2, SuperSpeed TX + AC coupled on Module AC Coupling capacitor

(USB3.1 Gen1)

AC Coupling capacitor

(USB3.1 Gen1)

AC coupled off Module (USB3.1 Gen1)

(USB3.1 Gen1)

AC coupled on Module NA

NA

AC coupled off Module NA

NA

Additional transmit signal differential pairs for the SuperSpeed USB data path.

Additional receive signal differential pairs for the SuperSpeed USB data path.

Additional transmit signal differential pairs for the SuperSpeed USB data path.

Additional receive signal differential pairs for the SuperSpeed USB data path.

USB Port 2, SuperSpeed TX -

USB Port 2, SuperSpeed RX +

USB Port 2, SuperSpeed RX -

USB Port 3, SuperSpeed TX +

USB Port 3, SuperSpeed TX -

USB Port 3, SuperSpeed RX +

USB Port 3, SuperSpeed RX -

22

Chapter 2

HARDWARE INSTALLATION

LVDS Signals Descriptions

Signal Pin# Pin Type

A71 O LVDS LVDS_A0+/eDP_

TX2+

LVDS_A0-/eDP_

TX2-

LVDS_A1+/eDP_

TX1+

LVDS_A1-/eDP_

TX1-

LVDS_A2+/eDP_

TX0+

LVDS_A2-/eDP_

TX0-

LVDS_A3+

LVDS_A3-

A72

A73

A74

A75

A76

A78

A79

O LVDS

O LVDS

O LVDS

LVDS_A_CK+/ eDP_TX3+

A81

LVDS_A_CK-/eDP_

TX3-

A82

LVDS_B0+

LVDS_B0-

LVDS_B1+

LVDS_B1-

B71

B72

B73

B74

LVDS_B2+

LVDS_B2-

LVDS_B3+

LVDS_B3-

LVDS_B_CK+

LVDS_B_CK-

LVDS_VDD_EN/ eDP_VDD_EN

LVDS_BKLT_EN/ eDP_BKLT_EN

LVDS_BKLT_

CTRL/eDP_BKLT_

CTRL

LVDS_I2C_CK/ eDP_AUX+

B75

B76

B77

B78

B81

B82

A77

B79

B83

A83

O LVDS

O LVDS

O LVDS

O LVDS

O LVDS

O LVDS

O CMOS

O CMOS

O CMOS

Pwr Rail /Tolerance

LVDS

EDP: AC coupled off

Module

LVDS

EDP: AC coupled off

Module

LVDS

EDP: AC coupled off

Module

LVDS

EDP: AC coupled off

Module

LVDS

LVDS

LVDS

LVDS

LVDS

LVDS

3.3V / 3.3V

3.3V / 3.3V

3.3V / 3.3V

I/O OD CMOS 3.3V / 3.3V

LVDS_I2C_DAT/ eDP_AUX-

A84 I/O OD CMOS 3.3V / 3.3V

GH960 PU/PD Module Base Specification R3.0 Description

LVDS Channel A differential pairs

Ther LVDS flat panel differential pairs (LVDS_A[0:3]+/-, LVDS_B[0:3]+/-. LVDS_

A_CK+/-, LVDS_B_CK+/-) shall have 100Ω terminations across the pairs at the destination. These terminations may be on the Carrier Board if the Carrier Board implements a LVDS deserializer on-board. eDP: eDP differential pairs

COM Express Carrier Design Guide R2.0 Description

LVDS channel A differential signal pair 0 eDP lane 2, TX± differential signal pair

LVDS channel A differential signal pair 1 eDP lane 1, TX± differential signal pair

LVDS Channel A differential clock

LVDS channel A differential signal pair 2 eDP lane 0, TX ± differential signal pair

LVDS channel A differential signal pair 3

LVDS channel A differential clock pair eDP lane 3, TX± differential pair

PD 100K

PD 100K

PD 100K

RSV PD 100K

RSV PU 100K to 3V3

LVDS Channel B differential pairs

Ther LVDS flat panel differential pairs (LVDS_A[0:3]+/-, LVDS_B[0:3]+/-. LVDS_

A_CK+/-, LVDS_B_CK+/-) shall have 100Ω terminations across the pairs at the destination. These terminations may be on the Carrier Board if the Carrier Board implements a LVDS deserializer on-board.

LVDS channel B differential signal pair 0

LVDS channel B differential signal pair 1

LVDS channel B differential signal pair 2

LVDS Channel B differential clock

LVDS panel power enable

LVDS panel backlight enable

LVDS panel backlight brightness control

I2C clock output for LVDS display use

I2C data line for LVDS display use

LVDS channel B differential signal pair 3

LVDS channel B differential clock pair

LVDS flat panel power enable. eDP power enable

LVDS flat panel backlight enable high active signal eDP backlight enable

LVDS flat panel backlight brightness control

EDP backlight brightness control

DDC I2C clock signal used for flat panel detection and control. eDP auxiliary lane +

DDC I2C data signal used for flat panel detection and control. eDP auxiliary lane -

User's Manual |

GH960

23

RSVD/eDP_HPD A87 I CMOS 3.3V / 3.3V

RSV series resistor to

PCH EDP HPD eDP_HPD:Detection of Hot Plug / Unplug and notification of the link layer

Chapter 2

HARDWARE INSTALLATION

eDP_HPD: Detection of Hot Plug / Unplug and notification of the link layer

LPC Signals Descriptions

Signal Pin# Pin Type

B4 I/O CMOS LPC_AD0 / ESPI_

IO_0

LPC_AD1 /ESPI_

IO_1

LPC_AD2 / ESPI_

IO_2

LPC_AD3 / ESPI_

IO_3

LPC_FRAME# /

ESPI_CS0#

B5

B6

B7

B3 O CMOS

Pwr Rail /Tolerance

3.3V / 3.3V

1.8V Suspend / 1.8V

3.3V / 3.3V

1.8V Suspend / 1.8V

LPC_DRQ0# /

ESPI_ALERT0#

LPC_DRQ1#

LPC_SERIRQ /

ESPI_CS1#

B8

B9

A50

LPC_CLK /ESPI_

CK

B10

GH960 PU/PD Module Base Specification R3.0 Description COM Express Carrier Design Guide R2.0 Description

Using as LPC function LPC multiplexed address, command and data bus.

ESPI Mode: eSPI Master Data Input / Outputs These are bi-directional input/output pins used to transfer data between master and slaves.

Multiplexed with LPC_AD[0:3]

LPC multiplexed command, address and data.

I CMOS

I CMOS

I/O CMOS

O CMOS

O CMOS

3.3V / 3.3V

1.8V Suspend / 1.8V

3.3V / 3.3V

1.8V Suspend / 1.8V

3.3V / 3.3V

1.8V Suspend / 1.8V

3.3V / 3.3V

1.8V Suspend / 1.8V

Using as LPC function LPC frame indicates the start of an LPC cycle

ESPI Mode: eSPI Master Chip Select Outputs Driving Chip Select0#. A low selects a particular eSPI slave for the transaction. Each of the eSPI slaves is connected to a dedicated Chip Selectn# pin.

LPC frame indicates start of a new cycle or termination of a broken cycle.

PU 10K to 3.3V

LPC serial DMA request

ESPI Mode: eSPI pins used by eSPI slave to request service from the eSPI master.

LPC encoded DMA/Bus master request.

PU 10K to 3.3V, not support.

PU 10K to 3.3V

series 22Ω resistor

LPC serial interrupt

ESPI Mode: eSPI Master Chip Select Outputs Driving Chip Select# A low selects a particular eSPI slave for the transaction. Each of the eSPI slaves is connected to a dedicated Chip Selectn# pin.

LPC serialized IRQ.

LPC clock output - 33MHz nominal

ESPI Mode: eSPI Master Clock Output This pin provides the reference timing for all the serial input and output operations.

LPC clock output 33MHz.

SPI Signals Descriptions

Signal Pin# Pin Type

SPI_CS# B97 O CMOS

SPI_MISO

SPI_MOSI

SPI_CLK

SPI_POWER

A92

A95

A94

A91

I CMOS

O CMOS

O CMOS

O

Pwr Rail /Tolerance

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

GH960 PU/PD Module Base Specification R3.0 Description

Chip select for Carrier Board SPI - may be sourced from chipset SPI0 or SPI1

Data in to Module from Carrier SPI

Data out from Module to Carrier SPI

Clock from Module to Carrier SPI

Power supply for Carrier Board SPI – sourced from Module – nominally

3.3V. The Module shall provide a minimum of 100mA on SPI_POWER.

Carriers shall use less than 100mA of SPI_POWER. SPI_POWER shall only be used to power SPI devices on the Carrier Board.

COM Express Carrier Design Guide R2.0 Description

Chip select for Carrier Board SPI – may be sourced from chipset SPI0 or SPI1

Data in to Module from Carrier SPI

Data out from Module to Carrier SPI

Clock from Module to Carrier SPI

Power supply for Carrier Board SPI – sourced from Module

– nominally 3.3V. The Module shall provide a minimum of

100mA on SPI_POWER. Carriers shall use less than 100mA of SPI_POWER. SPI_POWER shall only be used to power SPI devices on the Carrier.

User's Manual |

GH960

24

BIOS_DIS0# /

ESPI_SAFS

BIOS_DIS1#

A34

B88

I CMOS NA PU 10KΩ to 3V3

Suspend.

PU 10KΩ to 3V3

Suspend.

VGA Signals Descriptions

Signal

VGA_RED

VGA_GRN

VGA_BLU

VGA_HSYNC

VGA_VSYNC

VGA_I2C_CK

VGA_I2C_DAT

Pin#

B89

B91

B92

B93

B94

B95

B96

Pin Type

O Analog

O Analog

Pwr Rail /Tolerance

Analog

Analog

O Analog Analog

O CMOS

O CMOS

3.3V / 3.3V

3.3V / 3.3V

I/O OD CMOS 3.3V / 3.3V

I/O OD CMOS 3.3V / 3.3V

DDI Signals Descriptions

Signal Pin# Pin Type

DDI1_PAIR0+

DDI1_PAIR0-

D26

D27

O PCIE

O PCIE DDI1_PAIR1+

DDI1_PAIR1-

DDI1_PAIR2+

DDI1_PAIR2-

DDI1_PAIR3+

DDI1_PAIR3-

DDI1_PAIR4+

DDI1_PAIR4-

DDI1_PAIR5+

DDI1_PAIR5-

DDI1_PAIR6+

DDI1_PAIR6-

D36

D37

C25

C26

C29

C30

C15

C16

D29

D30

D32

D33

O PCIE

O PCIE

I PCIE

I PCIE

I PCIE

GH960 PU/PD

PD 150W to GND

PD 150W to GND

PD 150W to GND

PU 2.2KW to 3.3V

PU 2.2KW to 3.3V

Pwr Rail /Tolerance

AC coupled off Module

GH960 PU/PD

AC coupled off Module

AC coupled off Module

AC coupled off Module

AC coupled off Module NA,no spport

NA,no spport

AC coupled off Module NA,no spport

NA,no spport

AC coupled off Module NA,no spport

NA,no spport

Selection straps to determine the BIOS boot device.

The Carrier should only float these or pull them low, please refer to

COM Express Module Base Specification Revision 2.1 for strapping options of

BIOS disable signals.

Chapter 2

HARDWARE INSTALLATION

Selection strap to determine the BIOS boot device.

The Carrier should only float these or pull them low, please refer to for strapping options of BIOS disable signals.

Selection strap to determine the BIOS boot device.

The Carrier should only float these or pull them low.

Module Base Specification R3.0 Description

Red for monitor. Analog DAC output, designed to drive a 37.5Ω equivalent load.

Horizontal sync output to VGA monitor

Vertical sync output to VGA monitor

DDC clock line (I2C port dedicated to identify VGA monitor capabilities)

COM Express Carrier Design Guide R2.0 Description

Red component of analog DAC monitor output, designed to drive a 37.5Ω equivalent load.

Green for monitor. Analog DAC output, designed to drive a 37.5Ω equivalent load.

Green component of analog DAC monitor output, designed to drive a 37.5Ω equivalent load.

Blue for monitor. Analog DAC output, designed to drive a 37.5Ω equivalent load.

Blue component of analog DAC monitor output, designed to drive a 37.5Ω equivalent load.

Horizontal sync output to VGA monitor.

Vertical sync output to VGA monitor.

DDC data line.

DDC clock line (I2C port dedicated to identify VGA monitor capabilities).

DDC data line.

Module Base Specification R3.0 Description

DDI for Display Port: DP1_LANE 0 differential pairs

DDI for SDVO: SDVO1_RED± differential pair (Serial Digital Video red output)

DDI for HDMI/DVI: TMDS1_DATA lanes 2 differential pairs

DDI for Display Port: DP1_LANE 1 differential pairs

DDI for SDVO: SDVO1_GRN± differential pair (Serial Digital Video green output)

DDI for HDMI/DVI: TMDS1_DATA lanes 1 differential pairs

DDI for Display Port: DP1_LANE 2 differential pairs

DDI for SDVO: SDVO1_BLU± differential pair (Serial Digital Video blue output)

DDI for HDMI/DVI: TMDS1_DATA lanes 0 differential pairs

DDI for Display Port: DP1_LANE 3 differential pairs

DDI for SDVO: SDVO1_CK± differential pair (Serial Digital Video clock output)

DDI for HDMI/DVI: TMDS1_CLK differential pairs

DDI for SDVO: SDVO1_INT± differential pair

(Serial Digital Video B interrupt input differential pair)

DDI for SDVO: SDVO1_TVCLKIN± differential pair

(Serial Digital Video TVOUT synchronization clock input differential pair.)

DDI for SDVO: SDVO1_FLDSTALL± differential pair

(Serial Digital Video Field Stall input differential pair.)

COM Express Carrier Design Guide R2.0 Description

DP1_LANE0+ for DP / TMDS1_DATA2+ for HDMI or DVI

DP1_LANE0- for DP / TMDS1_DATA2- for HDMI or DVI

DP1_LANE1+ for DP / TMDS1_DATA1+ for HDMI or DVI

DP1_LANE1- for DP / TMDS1_DATA1- for HDMI or DVI

DP1_LANE2+ for DP / TMDS1_DATA0+ for HDMI or DVI

DP1_LANE2- for DP / TMDS1_DATA0- for HDMI or DVI

DP1_LANE3+ for DP / TMDS1_CLK+

DP1_LANE3- for DP / TMDS1_CLK-

NA

NA

NA

NA

NA

NA

User's Manual |

GH960

25

DDI1_CTRLCLK_

AUX+

D15

DDI1_CTRLCLK_

AUX-

D16

DDI1_HPD C24

DDI1_DDC_AUX_

SEL

D34

DDI2_PAIR0+

DDI2_PAIR0-

DDI2_PAIR1+

DDI2_PAIR1-

DDI2_PAIR2+

DDI2_PAIR2-

DDI2_PAIR3+

DDI2_PAIR3-

DDI2_CTRLCLK_

AUX+

D46

D47

D49

D50

C32

D39

D40

D42

D43

DDI2_CTRLCLK_

AUX-

C33

DDI2_HPD D44

User's Manual |

GH960

I/O PCIE AC coupled on Module PD 100K to GND

I/O OD CMOS 3.3V / 3.3V

I/O PCIE AC coupled on Module PU 100K to 3.3V

I/O OD CMOS 3.3V / 3.3V

I CMOS

I CMOS

3.3V / 3.3V

3.3V / 3.3V

O PCIE

O PCIE

O PCIE

O PCIE

I/O PCIE

AC coupled off Module

AC coupled off Module

AC coupled off Module

AC coupled off Module

AC coupled on Module PD 100K to GND

I/O OD CMOS 3.3V / 3.3V

I CMOS 3.3V / 3.3V

NA

NA

PD 100K to GND

PD 1M to GND

I/O OD CMOS 3.3V / 3.3V

I/O PCIE AC coupled on Module

NA

PU 100K to 3.3V

NA

PD 100K to GND

Chapter 2

HARDWARE INSTALLATION

DDI for Display Port: DP1_AUX+ Differetial pairs

(DP AUX+ function if DDI1_DDC_AUX_SEL is no connect)

Half-duplex bi-directional AUX channel for services such as link configuration or maintenance and EDID access

DDI for SDVO: SDVO1_CTRLCLK (SDVO I2C clock line - to set up SDVO peripherals.)

DDI for HDMI/DVI: HDMI1_CTRLCLK

(HDMI/DVI I2C CTRLCLK if DDI1_DDC_AUX_SEL is pulled high)

DDI for Display Port: DP1_AUX- Differetial pairs

(DP AUX- function if DDI1_DDC_AUX_SEL is no connect)

Half-duplex bi-directional AUX channel for services such as link configuration or maintenance and EDID access

DDI for SDVO: SDVO1_CTRLDATA (SDVO I2C data line - to set up SDVO peripherals.)

DDI for HDMI/DVI: HDMI1_CTRLDATA

(HDMI/DVI I2C CTRLDATA if DDI1_DDC_AUX_SEL is pulled high)

DDI for Display Port: DP1_HPD (DP Hot-Plug Detect)

DDI for HDMI/DVI: HDMI1_HPD (HDMI Hot-Plug Detect)

Selects the function of DDI1_CTRLCLK_AUX+ and

DDI1_CTRLDATA_AUX-. This pin shall have a 1M pull-down to logic ground on the Module. If this input is floating the AUX pair is used for the DP AUX+/- signals. If pulled-high the AUX pair contains the CRTLCLK and CTRLDATA signals.

DP1_AUX+ for DP

HDMI1_CTRLCLK for HDMI or DVI

DP1_AUX- for DP

HDMI1_CTRLDATA for HDMI or DVI

DP1_HPD for DP / HDMI1_HPD for HDMI or DVI

DDI for Display Port: DP2_LANE 0 differential pairs

DDI for HDMI/DVI: TMDS2_DATA lanes 2 differential pairs

DDI for Display Port: DP2_LANE 1 differential pairs

DDI for HDMI/DVI: TMDS2_DATA lanes 1 differential pairs

DDI for Display Port: DP2_LANE 2 differential pairs

DDI for HDMI/DVI: TMDS2_DATA lanes 0 differential pairs

DDI for Display Port: DP2_LANE 3 differential pairs

DDI for HDMI/DVI: TMDS2_CLK differential pairs

Selects the function of DP1 AUX±(Low) or HDMI1 DDC CLK/

DATA(High)

The DDC_AUX_SEL pin should be routed to pin 13 of the

DisplayPort connector, to enable Dual-Mode.

When HDMI/DVI is directly done on the Carrier Board, this pin shall be pulled to 3.3V with a 100k Ohm resistor to configure the AUX pairs as DDC channels.

DP2_LANE0+ for DP / TMDS2_DATA2+ for HDMI or DVI

DP2_LANE0- for DP / TMDS2_DATA2- for HDMI or DVI

DP2_LANE1+ for DP / TMDS2_DATA1+ for HDMI or DVI

DP2_LANE1- for DP / TMDS2_DATA1- for HDMI or DVI

DP2_LANE2+ for DP / TMDS2_DATA0+ for HDMI or DVI

DP2_LANE2- for DP / TMDS2_DATA0- for HDMI or DVI

DP2_LANE3+ for DP / TMDS2_CLK+

DP2_LANE3- for DP / TMDS2_CLK-

DP2_AUX+ for DP DDI for Display Port: DP2_AUX+ Differetial pairs

(DP AUX+ function if DDI2_DDC_AUX_SEL is no connect)

Half-duplex bi-directional AUX channel for services such as link configuration or maintenance and EDID access

DDI for HDMI/DVI: HDMI2_CTRLCLK

(HDMI/DVI I2C CTRLCLK if DDI2_DDC_AUX_SEL is pulled high)

DDI for Display Port: DP2_AUX- Differetial pairs

(DP AUX- function if DDI2_DDC_AUX_SEL is no connect)

Half-duplex bi-directional AUX channel for services such as link configuration or maintenance and EDID access

DDI for HDMI/DVI: HDMI2_CTRLDATA

(HDMI/DVI I2C CTRLDATA if DDI2_DDC_AUX_SEL is pulled high)

DDI for Display Port: DP2_HPD (DP Hot-Plug Detect)

DDI for HDMI/DVI: HDMI2_HPD (HDMI Hot-Plug Detect)

HDMI2_CTRLCLK for HDMI or DVI

DP2_AUX- for DP

HDMI2_CTRLDATA for HDMI or DVI

DP2_HPD for DP / HDMI1_HPD for HDMI or DVI

26

DDI2_DDC_AUX_

SEL

C34

DDI3_PAIR0+

DDI3_PAIR0-

DDI3_PAIR1+

DDI3_PAIR1-

DDI3_PAIR2+

DDI3_PAIR2-

DDI3_PAIR3+

DDI3_PAIR3-

DDI3_CTRLCLK_

AUX+

C46

C47

C49

C50

C36

C39

C40

C42

C43

DDI3_CTRLCLK_

AUX-

C37

DDI3_HPD C44

DDI3_DDC_AUX_

SEL

C38

I CMOS 3.3V / 3.3V

PD 1M to GND

O PCIE

O PCIE

O PCIE

O PCIE

I/O PCIE

AC coupled off Module (Optional)

(Optional)

AC coupled off Module (Optional)

(Optional)

AC coupled off Module (Optional)

(Optional)

AC coupled off Module (Optional)

(Optional)

AC coupled on Module PD 100K to GND

(Optional)

I/O OD CMOS 3.3V / 3.3V

I CMOS

I CMOS

3.3V / 3.3V

3.3V / 3.3V

NA

I/O PCIE AC coupled on Module

I/O OD CMOS 3.3V / 3.3V

PU 100K to 3.3V

(Optional)

NA

PD 100K to GND

(Optional)

PD 1MΩ to GND

(Optional)

Chapter 2

HARDWARE INSTALLATION

Selects the function of DDI2_CTRLCLK_AUX+ and

DDI2_CTRLDATA_AUX-. This pin shall have a 1M pull-down to logic ground on the Module. If this input is floating the AUX pair is used for the DP AUX+/- signals. If pulled-high the AUX pair contains the CRTLCLK and CTRLDATA signals.

DDI for Display Port: DP3_LANE 0 differential pairs

DDI for HDMI/DVI: TMDS3_DATA lanes 2 differential pairs

DDI for Display Port: DP3_LANE 1 differential pairs

DDI for HDMI/DVI: TMDS3_DATA lanes 1 differential pairs

DDI for Display Port: DP3_LANE 2 differential pairs

DDI for HDMI/DVI: TMDS3_DATA lanes 0 differential pairs

DDI for Display Port: DP3_LANE 3 differential pairs

DDI for HDMI/DVI: TMDS3_CLK differential pairs

Selects the function of DP2 AUX±(Low) or HDMI2 DDC CLK/

DATA(High)

The DDC_AUX_SEL pin should be routed to pin 13 of the

DisplayPort connector, to enable Dual-Mode.

When HDMI/DVI is directly done on the Carrier Board, this pin shall be pulled to 3.3V with a 100k Ohm resistor to configure the AUX pairs as DDC channels.

DP3_LANE0+ for DP / TMDS3_DATA2+ for HDMI or DVI

DP3_LANE0- for DP / TMDS3_DATA2- for HDMI or DVI

DP3_LANE1+ for DP / TMDS3_DATA1+ for HDMI or DVI

DP3_LANE1- for DP / TMDS3_DATA1- for HDMI or DVI

DP3_LANE2+ for DP / TMDS3_DATA0+ for HDMI or DVI

DP3_LANE2- for DP / TMDS3_DATA0- for HDMI or DVI

DP3_LANE3+ for DP / TMDS3_CLK+

DP3_LANE3- for DP / TMDS3_CLK-

DP3_AUX+ for DP DDI for Display Port: DP3_AUX+ Differetial pairs

(DP AUX+ function if DDI3_DDC_AUX_SEL is no connect)

Half-duplex bi-directional AUX channel for services such as link configuration or maintenance and EDID access

DDI for HDMI/DVI: HDMI3_CTRLCLK

(HDMI/DVI I2C CTRLCLK if DDI3_DDC_AUX_SEL is pulled high)

DDI for Display Port: DP3_AUX- Differetial pairs

(DP AUX- function if DDI3_DDC_AUX_SEL is no connect)

DDI for HDMI/DVI: HDMI3_CTRLDATA

(HDMI/DVI I2C CTRLDATA if DDI3_DDC_AUX_SEL is pulled high)

DDI for Display Port: DP3_HPD (DP Hot-Plug Detect)

DDI for HDMI/DVI: HDMI3_HPD (HDMI Hot-Plug Detect)

Selects the function of DDI3_CTRLCLK_AUX+ and

DDI3_CTRLDATA_AUX-. This pin shall have a 1M pull-down to logic ground on the Module. If this input is floating the AUX pair is used for the DP AUX+/- signals. If pulled-high the AUX pair contains the CRTLCLK and CTRLDATA signals.

HDMI3_CTRLCLK for HDMI or DVI

DP3_AUX- for DP

HDMI3_CTRLDATA for HDMI or DVI

DP3_HPD for DP / HDMI1_HPD for HDMI or DVI

Selects the function of DP3 AUX±(Low) or HDMI3 DDC CLK/

DATA(High)

The DDC_AUX_SEL pin should be routed to pin 13 of the

DisplayPort connector, to enable Dual-Mode.

When HDMI/DVI is directly done on the Carrier Board, this pin shall be pulled to 3.3V with a 100k Ohm resistor to configure the AUX pairs as DDC channels.

Serial Interface Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance

SER0_TX

SER0_RX

SER1_TX

SER1_RX

A98

A99

A101

A102

O CMOS

I CMOS

O CMOS

I CMOS

5V/12V

5V/12V

5V/12V

5V/12V

I2C Signal Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance

User's Manual |

GH960

GH960 PU/PD

PU 10KΩ to 3.3V

PU 10KΩ to 3.3V

GH960 PU/PD

Module Base Specification R3.0 Description

General purpose serial port 0 transmitter

General purpose serial port 0 receiver

General purpose serial port 1 transmitter

General purpose serial port 1 receiver

Module Base Specification R3.0 Description

COM Express Carrier Design Guide R2.0 Description

Transmit Line for Serial Port 0 ; PD 4.7KΩ

Receive Line for Serial Port 0

Transmit Line for Serial Port 1 ; PD 4.7KΩ

Receive Line for Serial Port 1

COM Express Carrier Design Guide R2.0 Description

27

I2C_CK

I2C_DAT

B33

B34

I/O OD CMOS 3.3V Suspend/3.3V

I/O OD CMOS 3.3V Suspend/3.3V

PU 2.2K to 3.3V

Suspend

PU 2.2K to 3.3V

Suspend

General purpose I2C port clock output

General purpose I2C port data I/O line

Chapter 2

HARDWARE INSTALLATION

General Purpose I2C Clock output

General Purpose I2C data I/O line.

Miscellaneous Signal Descriptions

Signal Pin# Pin Type

SPKR B32

WDT

FAN_PWMOUT

FAN_TACHIN

TPM_PP

B27

B101

B102

A96

O CMOS

Pwr Rail /Tolerance

3.3V / 3.3V

O CMOS

O CMOS

I OD CMOS

I CMOS

3.3V / 3.3V

3.3V / 12V

3.3V / 12V

3.3V / 3.3V

GH960 PU/PD Module Base Specification R3.0 Description

Output for audio enunciator - the “speaker” in PC-AT systems.

This port provides the PC beep signal and is mostly intended for debugging purposes.

Output indicating that a watchdog time-out event has occurred.

COM Express Carrier Design Guide R2.0 Description

Output used to control an external FET or a logic gate to drive an external PC speaker.

PD 10KΩ to GND.

Fan speed control. Uses the Pulse Width Modulation (PWM) technique to control the fan’s RPM.

Fan tachometer input for a fan with a two pulse output.

RSV PD 4.7KΩ to GND.

Trusted Platform Module (TPM) Physical Presence pin. Active high.

TPM chip has an internal pull down. This signal is used to indicate Physical

Presence to the TPM.

Output indicating that a watchdog time-out event has occurred.

Fan speed control. Uses the Pulse Width Modulation (PWM) technique to control the fan’s RPM.

Fan tachometer input for a fan with a two pulse output.

Trusted Platform Module (TPM) Physical Presence pin.

Active high. TPM chip has an internal pull down. Thissignal is used to indicate Physical Presence to the TPM.

Power and System Management Signals Descriptions

Signal

PWRBTN#

SYS_RESET#

CB_RESET#

PWR_OK

SUS_STAT#

SUS_S3#

SUS_S4#

Pin#

B12

B49

B50

B24

B18

A15

A18

Pin Type

I CMOS

I CMOS

O CMOS

I CMOS

O CMOS

O CMOS

O CMOS

Pwr Rail /Tolerance

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V / 3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

GH960 PU/PD

PU 10KΩ to 3.3V

Suspend

PU 10KΩ to 3.3V

Suspend

PD 100KΩ to GND

Module Base Specification R3.0 Description

A falling edge creates a power button event. Power button events can be used to bring a system out of S5 soft off and other suspend states, as well as powering the system down.

Reset button input. Active low request for Module to reset and reboot.

May be falling edge sensitive. For situations when SYS_RESET# is not able to reestablish control of the system, PWR_OK or a power cycle may be used.

Reset output from Module to Carrier Board. Active low. Issued by

Module chipset and may result from a low SYS_RESET# input, a low

PWR_OK input, a VCC_12V power input that falls below the minimum specification, a watchdog timeout, or may be initiated by the Module software.

COM Express Carrier Design Guide R2.0 Description

Power button low active signal used to wake up the system from S5 state (soft off). This signal is triggered on the falling edge.

Reset button input. Active low request for Module to reset and reboot. May be falling edge sensitive. For situations when SYS_RESET# is not able to reestablish control of the system, PWR_OK or a power cycle may be used.

Reset output signal from Module to Carrier Board. This signal may be driven low by the Module to reset external components located on the Carrier Board.

PU 10KΩ to 3.3V and PD

20K to GND

Power OK from main power supply. A high value indicates that the power is good. This signal can be used to hold off Module startup to allow Carrier based FPGAs or other configurable devices time to be programmed.

PU 10KΩ to 3V3 Indicates imminent suspend operation; used to notify LPC devices.

PD 10KΩ to GND

PD 10KΩ to GND

Power OK status signal generated by the ATX power supply to notify the Module that the DC operating voltages are within the ranges required for proper operation.

Suspend status signal to indicate that the system will be entering a low power state soon. It can be used by other peripherals on the Carrier Board as an indication that they should go into power-down mode.

Indicates system is in Suspend to RAM state. Active low output. An inverted copy of SUS_S3# on the Carrier Board may be used to enable the non-standby power on a typical ATX supply.

S3 Sleep control signal indicating that the system resides in

S3 state (Suspend to RAM).

Indicates system is in Suspend to Disk state. Active low output.

S4 Sleep control signal indicating that the system resides in

S4 state (Suspend to Disk).

User's Manual |

GH960

28

SUS_S5#

WAKE0#

WAKE1#

BATLOW#

LID#

SLEEP#

RAPID_

SHUTDOWN

A24

B66

B67

A27

Thermal Protection Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance

THRM# B35 I CMOS 3.3V / 3.3V

THRMTRIP#

A103

B103

C67

A35

O CMOS

I CMOS

I CMOS

I CMOS

I OD CMOS 3.3V Suspend/12V

I CMOS

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/3.3V

3.3V Suspend/ 3.3V

I OD CMOS 3.3V Suspend/12V

5.0V Suspend/ 5.0V

Chapter 2

HARDWARE INSTALLATION

PD 10KΩ to GND Indicates system is in Soft Off state.

PU 10K to 3.3V Suspend PCI Express wake up signal.

PU 10K to 3.3V Suspend General purpose wake up signal. May be used to implement wake-up on PS2 keyboard or mouse activity.

PU 10KΩ to 3.3V

Suspend

PU 47KΩ to 3.3V

Suspend

PU 47KΩ to 3.3V

Suspend

Indicates that external battery is low.

This port provides a battery-low signal to the Module for orderly transitioning to power saving or power cut-off ACPI modes.

S5 Sleep Control signal indicating that the system resides in

S5 State (Soft Off).

PCI Express wake-up event signal.

General purpose wake-up signal.

Battery low input. This signal may be driven low by external circuitry to signal that the system battery is low. It also can be used to signal some other external power management event.

LID switch. Low active signal used by the ACPI operating system for a LID switch. LID switch.

Low active signal used by the ACPI operating system for a

LID switch.

Sleep button. Low active signal used by the ACPI operating system to bring the system to sleep state or to wake it up again.

Sleep button.

Low active signal used by the ACPI operating system to bring the system to sleep state or to wake it up again.

PD 100KΩ to GND Trigger for Rapid Shutdown. Must be driven to 5V though a <=50 ohm source impedance for ≥ 20 μs.

NA

O CMOS 3.3V / 3.3V

GH960 PU/PD

PU 10KΩ to 3.3V

PU 1KΩ to 3.3V

Module Base Specification R3.0 Description

Input from off-Module temp sensor indicating an over-temp situation.

Active low output indicating that the CPU has entered thermal shutdown.

COM Express Carrier Design Guide R2.0 Description

Thermal Alarm active low signal generated by the external hardware to indicate an over temperature situation. This signal can be used to initiate thermal throttling.

Thermal Trip indicates an overheating condition of the processor. If ‘THRMTRIP#’ goes active the system immediately transitions to the S5 State (Soft Off).

SMBUS Signals Descriptions

Signal

SMB_CK

Pin#

B13

Pin Type Pwr Rail /Tolerance

I/O OD CMOS 3.3V Suspend/3.3V

SMB_DAT

SMB_ALERT#

B14

B15

I/O OD CMOS 3.3V Suspend/3.3V

I CMOS 3.3V Suspend/3.3V

GH960 PU/PD

PU 2.2KΩ to 3.3V

Suspend

PU 2.2KΩ to 3.3V

Suspend

PU 2.2KΩ to 3.3V

Suspend

Module Base Specification R3.0 Description

System Management Bus bidirectional clock line.

System Management Bus bidirectional data line.

System Management Bus Alert – active low input can be used to generate an

SMI# (System Management Interrupt) or to wake the system.

COM Express Carrier Design Guide R2.0 Description

System Management Bus bidirectional clock line

System Management bidirectional data line.

System Management Bus Alert

GPIO Signals Descriptions

Signal Pin# Pin Type

O CMOS GPO0

GPO1

GPO2

GPO3

A93

B54

B57

B63

Pwr Rail /Tolerance

3.3V / 3.3V

GH960 PU/PD

RSV PU 47K to 3V3/

3.3V Suspend

Module Base Specification R3.0 Description COM Express Carrier Design Guide R2.0 Description

General purpose output pins. Upon a hardware reset, these outputs should be low. General Purpose Outputs for system specific usage.

User's Manual |

GH960

29

GPI0

GPI1

GPI2

GPI3

A54

A63

A67

A85

I CMOS 3.3V / 3.3V

PU 100KΩ to 3.3V

General purpose input pins. Pulled high internally on the Module.

Power and GND Signal Descriptions

Signal

VCC_12V

VCC_5V_SBY

VCC_RTC

GND

Pin#

A104~A109

B104~B109

C104~C109

D104~D109

B84~B87

Pin Type

Power

Pwr Rail /Tolerance GH960 PU/PD Module Base Specification R3.0 Description

Primary power input: +12V nominal. All available VCC_12V pins on the connector(s) shall be used.

Power Standby power input: +5.0V nominal. If VCC5_SBY is used, all available VCC_5V_SBY pins on the connector(s) shall be used. Only used for standby and suspend functions. May be left unconnected if these functions are not used in the system design.

Real-time clock circuit-power input. Nominally +3.0V.

A47 Power

Pin Type = Power. Pin#: A1, A11, A21, A31, A41, A51, A57, A60, A66, A70, A80,

A90, A100, A110, B1, B11, B21 ,B31, B41, B51, B60, B70, B80, B90, B100, B110, C1,

C2, C5, C8, C11, C14, C21, C31, C41, C51, C60, C70, C73, C76, C80, C84, C87, C90,

C93, C96, C100, C103, C110, D1, D2, D5, D8, D11, D14, D21, D31, D41,D51, D60,

D67, D70, D73, D76, D80, D84, D87, D90, D93, D96, D100, D103, D110

Ground - DC power and signal and AC signal return path.

All available GND connector pins shall be used and tied to Carrier Board GND plane.

Chapter 2

HARDWARE INSTALLATION

General Purpose Input for system specific usage. The signals are pulled up by the Module.

COM Express Carrier Design Guide R2.0 Description

Module type Signal Descriptions

Signal Pin# Pin Type

TYPE0#

TYPE1#

TYPE2#

C54

C57

D57

PDS

PDS

PDS

Pwr Rail /Tolerance GH960 PU/PD

N.C.

N.C.

PD 0Ω to GND

TYPE10# A97 PDS N.C.

Module Base Specification R3.0 Description

TYPE2# TYPE1# TYPE0#

X X X pin out Type 1

NC NC NC pin out Type 2

NC NC GND pin out Type 3 (no IDE)

NC GND NC pin out Type 4 (no PCI)

NC GND GND pin out Type 5 (no IDE, no PCI)

GND NC NC pin out Type 6 (no IDE, no PCI)

COM Express Carrier Design Guide R2.0 Description

The Type pins indicate the COM Express pin-out type of the

Module. To indicate the Module’s pin-out type, the pins are either not connected or strapped to ground on the Module.

The Carrier Board has to implement additional logic, which prevents the system to switch power on, if a Module with an incompatible pin-out type is detected.

Dual use pin. Indicates to the Carrier Board that a Type 10 Module is installed.

Indicates to the Carrier that a Rev 1.0/2.0 Module is installed

TYPE10#

NC Pin-out R2.0

PD Pin-out Type 10 pull down to ground with 47K resistor

12V Pin-out R1.0

This pin is reclaimed from the VCC_12V pool. In R1.0 Modules this pin will connect to other VCC_12V pins. In R2.0 this pin is defined as a no connect for types 1-6. A

Carrier can detect a R1.0 Module by the presence of 12V on this pin. R2.0 Module types 1-6 will no connect this pin. Type 10 Modules shall pull this pin to ground through a 47K resistor.

Indicates to the Carrier Board that a Type 10 Module is installed. Indicates to the Carrier Board, that a Rev 1.0/2.0

Module is installed.

TYPE10#

NC Pin-out R2.0

PD Pin-out Type 10 pull down to ground with 47k

12V Pin-out R1.0

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Chapter 3

BIOS SETTING

Chapter 3 - BIOS Settings

X

Overview

The BIOS is a program that takes care of the basic level of communication between the CPU and peripherals. It contains codes for various advanced features found in this system board.

The BIOS allows you to configure the system and save the configuration in a battery-backed

CMOS so that the data retains even when the power is off. In general, the information stored in the CMOS RAM of the EEPROM will stay unchanged unless a configuration change has been made such as a hard drive replaced or a device added.

It is possible that the CMOS battery will fail causing CMOS data loss. If this happens, you need to install a new CMOS battery and reconfigure the BIOS settings.

Note:

The BIOS is constantly updated to improve the performance of the system board; therefore the BIOS screens in this chapter may not appear the same as the actual one. These screens are for reference purpose only.

Default Configuration

Most of the configuration settings are either predefined according to the Load Optimal Defaults settings which are stored in the BIOS or are automatically detected and configured without requiring any actions. There are a few settings that you may need to change depending on your system configuration.

Entering the BIOS Setup Utility

The BIOS Setup Utility can only be operated from the keyboard and all commands are keyboard commands. The commands are available at the right side of each setup screen.

The BIOS Setup Utility does not require an operating system to run. After you power up the system, the BIOS message appears on the screen and the memory count begins. After the memory test, the message “Press DEL to run setup” will appear on the screen. If the message disappears before you respond, restart the system or press the “Reset” button. You may also restart the system by pressing the <Ctrl> <Alt> and <Del> keys simultaneously.

Legends

Keys

Right / Left arrow

Up / Down arrow

<Enter>

+ (plus key)/F6

- (minus key)/F5

<F1>

<F2>

<F9>

<F10>

<Esc>

Function

Move the highlight left or right to select a menu

Move the highlight up or down between submenus or fields

Enter the highlighted submenu

Scroll forward through the values or options of the highlighted field

Scroll backward through the values or options of the highlighted field

Display general help

Display previous values

Optimized defaults

Save and Exit

Return to previous menu

Scroll Bar

When a scroll bar appears to the right of the setup screen, it indicates that there are more available fields not shown on the screen. Use the up and down arrow keys to scroll through all the available fields.

Submenu

When “

X

” appears on the left of a particular field, it indicates that a submenu which contains additional options are available for that field. To display the submenu, move the highlight to that field and press <Enter>.

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X

Main

The Main menu is the first screen that you will see when you enter the BIOS Setup Utility.

Basic hardware information is displayed.

Main Advanced

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Chipset Security Boot Save & Exit

[Mon 01 /07/2020]

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

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Advanced

The Advanced menu allows you to configure your system for basic operation. Some entries are defaults required by the system board, while others, if enabled, will improve the performance of your system or let you set some features according to your preference.

Important:

Setting incorrect field values may cause the system to malfunction.

Main Advanced

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Chipset Security Boot Save & Exit

X

X

AMD CHIPSET Setting

X

X

Trusted Computing

X

X

IT8528 Super IO Configuration

X

X

USB Configuration

X

X

PC Health Status

X

X

ACPI Configuration

X

Network Stack Configuration

AMD CBS Setup Page

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

System Date

The date format is <month>, <date>, <year>. Press "Tab" to switch to the next field and press "-" or "+" to modify the value.

System Time

The time format is <hour>, <minute>, <second>. The time is based on the 24-hour military-time clock. For example, 1 p.m. is 13:00:00. Hour displays hours from 00 to 23. Minute displays minutes from 00 to 59. Second displays seconds from 00 to 59.

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X

Advanced

AMD CHIPSET Setting

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

Chapter 3

BIOS SETTING

► GFX Configuration

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

GFX Configuration

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

Ac Loss Control

Select among Always On, Always Off, and Last State. This field is used to specify what state the system is set to return to when power is re-applied after AC power failure or loss (G3 state).

Always On

The system automatically powers on after power failure.

Always Off

The system enters soft-off state after power failure. Power-on signal input is required to power up the system.

Last State

The system returns to the last state right before power failure.

DRAM ECC Enable

Enable or disable (Error-correcting code) ECC function of the memory.

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

Integrated Graphics Controller

Enable or disable the integrated graphics controller, or select Auto for auto-detection.

NB Azalia

Enable or disable the integrated HD Audio controller, or select Auto for auto-detection.

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X

Advanced

X

AMD CHIPSET Setting

► SATA Configuration Options

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

SATA Configuration Options

SATA Controller

SATA Port 0

`

[Auto]

Chapter 3

BIOS SETTING

X

Advanced

AMD Platform Setting

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

Primary Video Adaptor [Int Graphics (IGD)]

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

SATA Controller

Enable or disable the SATA controller, or select Auto for auto-detection.

The information of the SATA devices installed on the system is shown.

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

Primary Video Adaptor

Select which graphics controller will be the primary video adaptor — Int Graphics (IGD) or Ext

Graphics (PEG).

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X

Advanced

Trusted Computing

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

Chapter 3

BIOS SETTING

X

Advanced

PTN3460 Config

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

Security Device Support

This field is used to enable or disable BIOS support for the security device such as an TPM 2.0 to achieve hardware-level security via cryptographic keys.

Pending operation

To clear the existing TPM encryption, select "TPM Clear" and restart the system. This field is not available when "Security Device Support" is disabled.

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

PTN3460 Function

Enable or Disable PTN3460 LCD Features. When this field is disabled, the following fields will remain hidden.

LCD Panel Type

Select the resolution of the LCD Panel — 800X480, 800X600, 1024X768, 1366X768, 1280X1024,

1920X1080, or 1920X1200.

LCD Panel Color Depth

Select the color depth of the LCD Panel — 18 Bit, 24 Bit, 36 Bit, 48 Bit.

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Note:

The configuration must match the specifications of your LCD Panel in order for the

LCD Panel to display properly.

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X

Advanced

IT8528 Super IO Configuration

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

IT8528 Super IO Configuration

IT8528

Chapter 3

BIOS SETTING

► Serial Port 1/2 Configuration

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

Serial Port 1 Configuration

Change Settings Auto

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

The Super IO Chip information is displayed. Select a submenu for more settings.

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

Serial Port

Enable or disable the current serial COM port.

Change Settings

Select an I/O Address and IRQ for the current serial Port, or select Auto to assign automatically.

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X

Advanced

CPU Configuration

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

Enable/disable the genera and _PCT objets.

Chapter 3

BIOS SETTING

X

Advanced

USB Configuration

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

USB Configuration

Enables Legacy USB sup -

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

PSS Support

Enable or disable the power, performance, and speed related ACPI functions of the CPU.

NX Mode

Enable or disable the protection function that keeps no-execute codes from being executed by the CPU.

SVM Mode

Enable or disable Secure Virtual Machine (SVM) for CPU virtualization.

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

Legacy USB Support

Enabled

Enable Legacy USB support.

Disabled

Auto

Keep USB devices available only for EFI applications.

Disable Legacy support if no USB devices are connected.

XHCI Hand-off

Enable or disable XHCI Hand-off.

USB Mass Storage Driver Support

Enable or disable USB Mass Storage Driver Support.

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X

Advanced

CSM Configuration

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

Enable/Disable CSM Sup -

CSM Configuration

CSM Support

CSM16 Module Version

Boot option filter

Option ROM execution

[Enabled]

C8.BB

[UEFI only]

Chapter 3

BIOS SETTING

X

Advanced

PC Health Status

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

Enable/Disable CPU Smart -

Temperature

F) : +55 C / +131F

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

CSM Support

This section is used to enable or disable CSM Support. The following fields are only available when "CSM Support" is enabled.

Boot option filter

This field controls Legacy/UEFI ROMs priority — UEFI and Legacy, Legacy only, UEFI only.

Network

This field controls the execution of UEFI and Legacy Network OpROM.

Storage

This field controls the execution of UEFI and Legacy Storage OpROM.

Video

This field controls the execution of UEFI and Legacy Video OpROM.

Other PCI devices

This field determines OpROM execution policy for devices other than Network, Storage or

Video.

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

This section displays the system’s health information, i.e. voltage readings, CPU and system temperatures, and fan speed readings.

CPU SmartFan

Enable or disable CPU Smart Fan. Once enabled, the fan speed will be moderated according to the current CPU temperature.

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X

Advanced

WatchDog Configuration

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

Chapter 3

BIOS SETTING

X

Advanced

ACPI Configuration

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

Wake On PCIE

Wake up hour

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

WatchDog1 function

Enable or disable WatchDog function. Once it is enabled, please configure the following field.

SuperIO WatchDog Timer

Set the WatchDog Timer timeout value, ranging from 1 to 255 (second).

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

Wake On PCIE

Enable or disable Wake-on-LAN function for the integrated LAN to wake up the system.

Wake on RTC from S5

When Enabled, the system will automatically power up at a designated time every day

. Once it’s switched to [Enabled], please set up the time of day — hour, minute, and second — for the system to wake up.

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X

Advanced

Serial Port Console Redirection

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

Console Redirection En -

[Enabled]

[Enabled]

Chapter 3

BIOS SETTING

► Console Redirection Settings

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

Emulation: ANSI: Extend -

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

Console Redirection

By enabling Console Redirection of a COM port, the sub-menu of console redirection settings will become available for configuration as detailed in the following.

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

Configure the serial settings of the current COM port.

Terminal Type

Select terminal type: VT100, VT100+, VT-UTF8 or ANSI.

Bits per second

Select serial port transmission speed: 9600, 19200, 38400, 57600 or 115200.

Data Bits

Select data bits: 7 bits or 8 bits.

Parity

Select parity bits: None, Even, Odd, Mark or Space.

Stop Bits

Select stop bits: 1 bit or 2 bits.

Flow Control

Select flow control type: None or Hardware RTS/CTS.

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X

Advanced

Network Stack Configuration

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Advanced

Enable/Disable UEFI Net -

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

Network Stack

Enable or disable UEFI network stack. The following fields will appear when this field is enabled.

Ipv4 PXE Support

Enable or disable IPv4 PXE boot support. If disabled, IPv4 PXE boot support will not be available.

Ipv6 PXE Support

Enable or disable IPv6 PXE boot support. If disabled, IPv6 PXE boot support will not be available.

PXE boot wait time

Set the wait time in seconds to press ESC key to abort the PXE boot. Use either +/- or numeric keys to set the value.

Media detect count

Set the number of times the presence of media will be checked. Use either +/- or numeric keys to set the value.

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X

Security

Main Advanced

Password Description

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Chipset Security Boot Save & Exit

Set Administrator Pass -

Chapter 3

BIOS SETTING

X

Security

Secure Boot

System Mode

Secure Boot

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Security

Setup

[Custom]

► Key Management

Administrator Password

► Secure Boot

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

Administrator Password

Set the administrator password. To clear the password, input nothing and press enter when a new password is asked. Administrator Password will be required when entering the BIOS.

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

Secure Boot

The Secure Boot store a database of certificates in the firmware and only allows the OSes with authorized signatures to boot on the system. To activate Secure Boot, please make sure that

“Secure Boot” is “[Enabled]”, Platform Key (PK) is enrolled, “System Mode” is “User”, and CSM is disabled. After enabling/disabling Secure Boot, please save the configuration and restart the system. When configured and activated correctly, the Secure Boot status will be “Active”.

Secure Boot Mode

Select the secure boot mode — Standard or Custom. When set to Custom, the following fields will be configurable for the user to manually modify the key database.

Restore Factory Keys

Force system to User Mode. Load OEM-defined factory defaults of keys and databases onto the Secure Boot. Press Enter and a prompt will show up for you to confirm.

Reset To Setup Mode

Clear the database from the NVRAM, including all the keys and signatures installed in the Key

Management menu. Press Enter and a prompt will show up for you to confirm.

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Chapter 3

BIOS SETTING

X

Security

X

Secure Boot

X

Key Management

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Security

Vendor Keys

► Export Secure Boot variables

► Authorized Signatures | 0| 0| No

► Authorized TimeStamps| 0| 0| No

Valid

[Disabled]

Install factory default Se -

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

Factory Key Provision

Enable or disable the provision factory default keys on next re-start. This will only take place when the “System Mode” in the previous menu is in “Setup”, which can be achieved by moveing the cursor to the “Reset To Setup Mode” and press Enter.

Restore Factory Keys

Force system to User Mode. Configure NVRAM to contain OEM-defined factory default Secure

Boot keys.

Reset To Setup Mode

Clear the database from the NVRAM, including all the keys and signatures installed in the Key

Management menu. Press Enter and a prompt will show up for you to confirm.

Export Secure Boot variables

Export the Secure Boot settings (i.e. all keys and signatures) as files to the root directory of a file system device. Press Enter and select a storage device listed in the pop-up menu. The saved files will be named automatically according to the type of key/signature as listed below.

• “PK” for Platform Keys

• “KEK” for Key Exchange Keys

• “db” for Authorized Signatures

• “dbx” for Forbidden Signatures

Enroll Efi Image

Allow the image to run in Secure Boot mode. Enroll SHA256 Hash certificate of a PE image into

Authorized Signature Database (db). Press Enter and select a storage device listed in the popup menu, select a directory, and then select the EFI Image document.

Remove ‘UEFI CA’ from DB

Remove Microsoft UEFI CA from the Authorized Signature database. For systems that support

Device Guard, Microsoft UEFI CA must NOT be included in the Authorized Signature database.

Restore DB defaults

Press Enter to restore the database variable to factory defaults.

Manually configure the following keys and signatures. Move the cursor to the field and press

Enter, and then a pop-up menu will show up.

Platform Key(PK), Key Exchange Keys, Authorized Signatures, Forbidden Signatures, Authorized TimeStamps, OsRecovery Signatures

Details

Export

Update

Append

Delete

List the information of enrolled keys and signatures

Save the key or signature as a file to the root directory of a file system. The saved files will be named automatically according to the type of key/signature as previously listed in the “Export Secure Boot Variables”.

Load factory default database

Enroll keys and signatures from a file system

Delet keys and signatures

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X

Boot

Main Advanced

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Chipset Security Boot Save & Exit

Boot Option Priorities

BGRT Logo [Disabled]

Chapter 3

BIOS SETTING

X

Save & Exit

Main Advanced

Aptio Setup Utility - Copyright (C) 2020 American Megatrends, Inc.

Chipset Security Boot Save & Exit

Version 2.20.1273. Copyright (C) 2020 American Megatrends, Inc.

Setup Prompt Timeout

Set the number of seconds to wait for the setup activation key. 65535 (0xFFFF) denotes indefinite waiting.

Bootup NumLock State

Select the keyboard NumLock state: On or Off.

Quiet Boot

This section is used to enable or disable quiet boot option.

Boot Option Priorities

Rearrange the system boot order of available boot devices. Please enable the devices that you wish to set as boot devices in the "Advanced > CSM Configuration" submenu.

BGRT Logo

It is used to enable or disable the support of display logo with ACPI BGRT table.

Note:

If “Boot option filter” of “CSM Configuration” is set to “UEFI and Legacy” or “UEFI only”, and “Quiet Boot” is set to enabled, “BGRT Logo” will show up for configuration. Refer to the Advanced > CSM Configuration submenu for more information.

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Save Changes and Reset

To save the changes, select this field and then press <Enter>. A dialog box will appear. Select

Yes to reset the system after saving all changes made.

Discard Changes and Reset

To discard the changes, select this field and then press <Enter>. A dialog box will appear. Select Yes to reset the system setup without saving any changes.

Restore Defaults

To restore and load the optimized default values, select this field and then press <Enter>. A dialog box will appear. Select Yes to restore the default values of all the setup options.

44

X

Updating the BIOS

To update the BIOS, you will need the new BIOS file and a flash utility. Please contact technical support or your sales representative for the files and specific instructions about how to update

BIOS with the flash utility. For updating AMI BIOS in UEFI mode, you may refer to the how-to video at https://www.dfi.com/Knowledge/Video/5 .

X

Notice: BIOS SPI ROM

1. The Intel ® Management Engine has already been integrated into this system board. Due to the safety concerns, the BIOS (SPI ROM) chip cannot be removed from this system board and used on another system board of the same model.

2. The BIOS (SPI ROM) on this system board must be the original equipment from the factory and cannot be used to replace one which has been utilized on other system boards.

3. If you do not follow the methods above, the Intel

® dated and will cease to be effective.

Management Engine will not be up-

Note:

a. You can take advantage of flash tools to update the default configuration of the

BIOS (SPI ROM) to the latest version anytime.

b. When the BIOS IC needs to be replaced, you have to populate it properly onto the system board after the EEPROM programmer has been burned and follow the technical person's instructions to confirm that the MAC address should be burned or not.

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Chapter 4 - Supported Software

Install drivers, utilities and software applications that are required to facilitate and enhance the performance of the system board. You may acquire the software from your sales representatives, from a DVD included in the shipment, or from the website download page at https://www.

dfi.com/DownloadCenter .

X

Auto-run Menu

After inserting your DVD-ROM into your optical drive or executing your DVD image, the System Utility auto-run menu may pop up. Click on the utility or driver that is to be installed on the system. Please refer to the following sections that correspond to your selection for more information.

X

AMD Chipset and VGA Drivers

1. Read the license agreement then click “Accept and Install”.

2. The step displays the installing status in the progress.

Chapter 4

SUPPORTED SOFTWARE

Note:

This step can be ignored if the applications are standalone files.

3. After completing installation, click “Restart Now” to exit setup.

Restarting the system will allow the new software installation to take effect.

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X

Intel LAN Driver

1. Setup is ready to install the driver. Click “Next”.

2. Click “I accept the terms in the license agreement” then click

“Next”.

3. Select the program features you want installed then click

“Next”.

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4. Click “Install” to begin the installation.

Chapter 4

SUPPORTED SOFTWARE

5. The step displays the installing status in the progress.

6. After completing installation, click “Finish”.

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X

Audio Drivers

1. Setup is ready to install the driver. Click “Next”.

2. Click “Yes, I want to restart my computer now” then click “Finish”.

Restarting the system will allow the new software installation to take effect.

X

Adobe Acrobat Reader 9.3

1. Click “Next” to install or click

“Change Destination Folder” to select another folder.

Chapter 4

SUPPORTED SOFTWARE

2. Click “Install” to begin installation.

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3. Setup is now installing the driver.

4. Click “Finish” to exit installation.

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SUPPORTED SOFTWARE

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