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Rigado LLC
2601 25 th ST SE Suite 200
Salem, Oregon 97302
866-6-RIGADO
[email protected] www.rigado.com/modules
BMD-100 Module for Bluetooth 4.1 LE
The BLU MOD BMD-100 is a Bluetooth Smart master/slave network processor module targeted for low-power sensors and accessories using the ultralow power STMicroelectronics BlueNRG-MS chipset.
It integrates features required for a Bluetooth Smart application, including Bluetooth radio, software stack, and GATT/ATT-based access. The external host application processor, where the application resides, connects using SPI20. This allows the best microcontroller for the application to be chosen and C based
Bluetooth Low Energy profiles are available for compiling into your application.
The module can be powered directly from a standard 3V coin cell battery or a pair of AAA batteries with a maximum input current of only 15 mA at the highest output power. On-module flash memory allows in the field Bluetooth low energy stack upgrades.
1.
Features
Bluetooth v4.1 compliant master, slave and multiple roles simultaneously
Embedded Bluetooth low energy protocol stack: GAP, GATT, SM, L2CAP, LL, RF-PHY
C based Bluetooth low energy profiles
High performance, ultra-low power Cortex-M0
32-bit architecture core
SPI application controller interface (ACI)
Operating supply voltage: 1.7 to 3.6 V
8.2 mA maximum TX current (@0 dBm, 3.0 V)
Down to 1.7 μA current consumption with active BLE stack
Integrated linear regulator and DC-DC stepdown converter
Up to +8 dBm available output power
Excellent RF link budget (up to 96 dB)
Accurate RSSI to allow power control
Full link controller and host security
On-chip non-volatile Flash memory
AES security co-processor
Low power modes
32 MHz crystal oscillator
32 kHz ring oscillator
Optional 32 kHz crystal oscillator
Battery voltage monitor and temperature sensor
Operating temperature range: -40 °C to 85 °C
Bluetooth, FCC, IC, and CE certifications (Jan
2015)
BMD-100-DS-V0.5 PRELIMINARY Page 1 of 17
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
2.
Ordering Information
Email [email protected]
for quotes and ordering or visit www.rigado.com/bmd-100
Part Number
BMD-100-A-R
BMD-100-A-CT
BMD-100-NUCL
BMD-100-EVAL
Description
BMD-100 module, Rev A, Tape & Reel
BMD-100 module, Rev A, Cut Tape
BMD-100 Nucleo Shield
BMD-100 Evaluation Kit (Nucleo Shield + Nucleo Platform)
Table 1 - Ordering Part Numbers
3.
Hardware Block Diagram
Figure 1 – Hardware Block Diagram
4.
Software Block Diagram
BMD-100-DS-V0.5
Figure 2 – Software Block Diagram
PRELIMINARY Page 2 of 17
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
Table of Contents
BMD-100-DS-V0.5 PRELIMINARY Page 3 of 17
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
5.
Quick Specifications
Bluetooth
Version
Security
LE connections
4.1 ( Bluetooth Smart) Peripheral & Central
AES-128 up to 8
Radio
Frequency
Modulation
Transmit power
Receiver sensitivity
Antenna
Current Consumption
TX only @ +8 dBm, 4 dBm, 2 dBm
RX only
CPU, Flash and RAM on/off
Sleep, 32kHz XO/RO
Standby, (RAM2 Off)
Reset
Dimensions
Length
Width
Height
13.6 mm
8.4 mm
1.8 mm
2.402GHz to 2.480GHz
GFSK at 1 Mbps
+8 dBm
-88 dBm (BLE mode)
Integrated ceramic chip
15.1 mA, 10.9 mA, 8.2 mA
7.7 mA
3.3 mA, 2.0 mA
2.4 µA, 3.5 µA
1.3 µA
5 nA
Hardware
Interface
Power supply
ACI over SPI with IRQ and Reset (8 MHz Max)
1.7V to 3.6V
Planned Certifications (Jan 2015)
FCC FCC part 15 modular qualification – FCC ID: 2AA9B03
IC
CE
Bluetooth
Industry Canada RSS-210 modular qualification – IC: 12208A-01
EN 60950-1: 2011-01 3.1 (a) : Health and Safety of the User
EN 301 489-17 V2.2.1 3.1 (b) : Electromagnetic Compatibility
EN 300 328 V1.8.1 3.2 : Effective use of spectrum allocated
Component (Tested) – DID: TBD
Table 2- Quick Specifications
BMD-100-DS-V0.5 PRELIMINARY Page 4 of 17
6.
Pin Descriptions
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
Figure 3- Pin out (Top View)
Name
SPI_CS
SPI_CLK
SPI_MOSI
SPI_MISO
SPI_IRQ
Pin description
Direction
In
In
In
Out
Out nRESET
SXTAL0
SXTAL1
VCC
GND
RESERVED
RESERVED
In
In
In
Pwr
Pwr
N/A
N/A
Description
SPI slave select = SPI enable.
SPI clock (max 8 MHz).
Master output, slave input.
Master input, slave output.
Slave has data for master.
Reset and deep sleep control
32 kHz Crystal (optional)
32 kHz Crystal (optional)
+1.7 to +3.6VDC input 1
Electrical Ground
Connect to Ground
Leave Unconnected
Pin
14
17
16
15
18
13
10
12
19
A,B,C,D,E,F,7,9,20
1,2,3,11
4,5,6,8
Table 3 – Pin Descriptions
Note 1: An external capacitor for V
CC
is not strictly required, however a 1µF -
4.7µF ceramic capacitor is recommended.
BMD-100-DS-V0.5 PRELIMINARY Page 5 of 17
7.
Electrical Specifications
7.1.
Absolute Maximum Ratings
Symbol Parameter
V
CC_MAX
Voltage on supply pin
V
IO_MAX
Voltage on SXTAL pins
T
S
Storage Temperature Range
V
ESD-HBM
Electrostatic discharge voltage
Min.
-0.3
-0.3
-40
-2.0
Table 4 – Absolute Maximum Ratings
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
Max.
3.9
1.4
125
2.0
Unit
V
V
°C kV
7.2.
Operating Conditions
Symbol Parameter
V
CC
Operating supply voltage
T
A
Operating Ambient Temperature Range
Table 5 – Operating Conditions
Min. Max. Unit
1.7 3.6 V
-40 85 °C
7.3.
SPI Interface
The application controller interface (ACI) uses a standard SPI slave interface as the transport
Layer on five physical wires:
2 control wires (clock and slave select)
2 data wires with serial shift-out (MOSI and MISO) in full duplex
1 wire to indicate data availability from the slave
All the SPI pins have an internal pull-down except for the SPI_CS that has a pull-up. All the SPI pins, except the SPI_CS, are in high impedance state during the low-power states. The SPI_IRQ pin requires an external pull-down resistor.
Symbol Parameter Min. Typ. Max. Unit
F
MAX
SPI Clock Max Frequency
T
RISE
Rise Time
T
FALL
Fall Time
V
IH
Input High Voltage
V
IL
Input Low Voltage
V
OH
Output High Voltage (Vcc = 3.3V)
V
OL
Output Low Voltage (Vcc = 3.3V)
R
PU
Pull-up Resistance
R
PD
Pull-down Resistance
5
6
-
-
8
19
22
MHz ns ns
0.65 x V
CC
-
V
SS
-
V
CC
0.35 x V
CC
V
V
2.4
-
-
-
-
0.4
V
V
11
11
13
13
16
16 kΩ kΩ
Table 6 – SPI Interface
7.4.
Clocks
The BMD-100 integrates two low-speed frequency oscillators (LSOSC) and two high-speed
(32 MHz) frequency oscillators (HSOSC).
BMD-100-DS-V0.5 PRELIMINARY Page 6 of 17
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
The primary high frequency clock is a 32 MHz crystal oscillator. There is also a fast starting 12 MHz ring oscillator that provides the clock while the crystal oscillator is starting up. Frequency tolerance of the highspeed crystal is ±30 ppm.
The low frequency clock is used in Low Power mode and can be supplied either by a 32.7kHz oscillator that uses an external crystal and guarantees up to ±50 ppm frequency tolerance, or by a ring oscillator with maximum ±500 ppm frequency tolerance, which does not require any external components.
32.768 kHz Crystal Specification Requirements
Symbol f nom
Crystal frequency
Parameter Typ. Max. Unit
32.768 - kHz
F tol,BLE
Frequency tolerance
P
D
Load Capacitance
-
-
±50 ppm
0.1 μW
Table 7 - 32.768 kHz Crystal
32.768 kHz Oscillator Comparison
Symbol f nom
Crystal frequency
F tol,BLE
Frequency tolerance
Parameter
Table 8 - 32.768 kHz Oscillator
Typ. Max. Unit
37.4 - kHz
- ±500 ppm
7.5.
Note
Additional electrical characteristics and current consumption data can be found on the BlueNRG-MS datasheet provided by STMicroelectronics at www.st.com
.
8.
Application controller interface
The application controller interface is based on a standard SPI module with transfer rates up to 8
Mbits/s. The application controller Interface defines a software protocol providing functions to access all the services offered by the layers of the embedded Bluetooth stack. The ACI commands are described in the BlueNRG-MS ACI command interface document provided by
STMicroelectronics at www.st.com
.
BMD-100-DS-V0.5 PRELIMINARY Page 7 of 17
9.
Mechanical Data
9.1.
Module Dimensions
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
Figure 4- Module Dimensions
(All dimensions are in mm)
9.2.
Recommended PCB Land Pad
BMD-100-DS-V0.5
Figure 5- Module Dimensions
PRELIMINARY Page 8 of 17
10.
Module Marking
(All dimensions are in mm)
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
Figure 6 – Module Marking – Rev A
11.
RF Design Notes
11.1.
Recommended RF Layout & Ground Plane
The integrated ceramic chip antenna requires a suitable ground plane to radiate effectively. Reducing the ground plane from that shown in figure 7 will reduce the effective radiated power.
The BMD-100 module should be placed at the edge of the ground plane with the antenna side towards the edge. Place a copper keep-out under the antenna (area shown in red). The area under the keep-out and extending out from the edge of the ground plane should be kept clear of copper and other metal. The BMD-
100 uses a Johanson Technology 2450AT07A0100 chip antenna. Additional information on the antenna can be acquired from www.johansontechnology.com
.
BMD-100-DS-V0.5 PRELIMINARY Page 9 of 17
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
Figure 7- Recommended RF Layout
11.2.
Mechanical Enclosure
Care should be taken when designing and placing the module into an enclosure. Metal should be kept clear from the antenna area, both above and below. Any metal around the module can negatively impact RF performance.
The module is designed and tuned for the antenna and RF components to be in free air. Any potting, epoxy fill, plastic overmolding, or conformal coating can negatively impact RF performance and must be evaluated by the customer.
11.3.
Antenna Pattern
TBD.
11.3.1.
S33 Smith Chart
TBD.
11.3.2.
3D Radiation Pattern
TBD.
11.3.3.
XY-plane
TBD.
11.3.4.
XZ-plane
TBD.
11.3.5.
YZ-plane
TBD.
12.
Evaluation Boards
Rigado has developed a Nucleo-compatible shield for the BMD-100 that provides a complete development solution for Bluetooth 4.1 LE.
BMD-100-DS-V0.5 PRELIMINARY Page 10 of 17
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
13.
Custom Development
Project specific firmware and hardware for the BMD-100 can be created or modified for customers. Custom embedded development is available upon request. Please contact Rigado at [email protected]
or 1-866-6-
RIGADO for custom engineering options and fees.
14.
Bluetooth Certification
TBD.
BMD-100-DS-V0.5 PRELIMINARY Page 11 of 17
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
15.
Regulatory Statements
15.1.
FCC Statement:
This device has been tested and found to comply with part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Operation is subjected to the following two conditions: (1) This device may no cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: Modification to this product will void the user’s authority to operate this equipment.
Note: Modification to this product will void the users’ authority to operate this equipment.
15.2.
FCC Important Notes:
(1) FCC Radiation Exposure Statement
This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
This equipment complies with Part 15 of the FCC Rules. Operation is subject the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired operation.
The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in the user documentation that comes with the product.
Caution!
The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications to this equipment. Such modification could void the user authority to operate the equipment.
(2) Co-location Warning:
This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter.
(3) OEM integration instructions ：
This device is intended only for OEM integrators under the following conditions:
The transmitter module may not be co-located with any other transmit or antenna. The module shall be only used with the integral antenna(s) that has been originally tested and certified with this module.
BMD-100-DS-V0.5 PRELIMINARY Page 12 of 17
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
As long as the two (2) conditions above are met, further transmitter testing will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance requirements with this module installed (for example, digital device emission, PC peripheral requirements, etc.)
(4) OEM integration instructions ：
In the event that these conditions cannot be met (for example certain laptop configuration or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these and circumstance, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
(5) End product labeling ：
The final end product must be labeled in a visible area with the following: “Contains FCC ID: 2AA9B02 ”.
Any similar wording that expresses the same meaning may be used.
The FCC Statement below should also be included on the label. When not possible, the FCC Statement should be included in the User Manual of the host device.
“This device complies with part 15 of the FCC rules.
Operation is subject to the following two conditions. (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. “
(6) Information that must be placed in the end user manual ：
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
15.3.
IC Statement:
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
RF exposure warning: The equipment complies with RF exposure limits set forth for an uncontrolled environment. The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Avertissement d'exposition RF: L'équipement est conforme aux limites d'exposition aux RF établies pour un incontrôlés environnement. L'antenne (s) utilisée pour ce transmetteur ne doit pas être co-localisés ou onctionner en conjonction avec toute autre antenne ou transmetteur .
15.4.
IC Important Notes:
1. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user manual of the end product.
BMD-100-DS-V0.5 PRELIMINARY Page 13 of 17
BMD-100 Module Datasheet
Bluetooth 4.1 LE
The user manual provided by OEM integrators for end users must include the following information in a
1/5/2014 prominent location.
2. To comply with IC RF exposure compliance requirements, the antenna used for this transmitter must not be co‐located or operating in conjunction with any other antenna or transmitter, except in accordance with IC multi‐transmitter product procedures.
3. The final system integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to install or remove the transmitter module except such device has implemented two‐ways authentication between module and the host system.
4. The host device shall be properly labeled to identify the module within the host device. The final end product must be labeled in a visible area with the following: “Contains IC: 12208A-02 ”.
Any similar wording that expresses the same meaning may be used.
The IC Statement below should also be included on the label. When not possible, the IC Statement should be included in the User Manual of the host device.
“This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le onctionnement.”
15.5.
CE Regulatory:
This device has been tested and has been found to be complaint against the following standards. OEM integrators should consult with qualified test house to verify all regulatory requirements have been met for their complete device.
From Directive 2006/95/EC:
EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011
From R&TTE Directive 1999/5/EC:
ETSI EN 300 440-1 V 1.6.1
ETSI EN 300 440-2 V 1.4.1
EN 62479:2010
From Directive 2004/108/EC:
ETSI EN 301 489-3 V1.6.1
ETSI EN 301 489-1 V1.9.2
Declarations of Conformity and supporting test reports are available upon request.
BMD-100-DS-V0.5 PRELIMINARY Page 14 of 17
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
16.
Solder Reflow Temperature-Time Profile
Figure 8 - Reflow Profile for Lead Free Solder
17.
Packaging and Labeling
17.1.
Carrier Tape Dimensions
TBD.
17.2.
Reel Packaging
TBD.
17.3.
Packaging Label
BMD-100-DS-V0.5
Figure 9 – Packaging Label
PRELIMINARY Page 15 of 17
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
18.
Cautions
1) The guidelines of this document should be followed in order to assure proper performance of the module.
2) This product is for use in office, business, and residential applications, but not medical devices.
3) This module may short-circuit. If a short circuit can result in serious damage or injury then failsafe precautions should be used. This could be accomplished by redundant systems and protection circuits.
4) Supply voltage to the module should not be higher than the specified inputs or reversed. Additionally it should not contain noise, spikes, or AC ripple voltage.
5) Avoid use with other high frequency circuits.
6) Use methods to eliminate static electricity when working with the module as it can damage the components.
7) Contact with wires, the enclosure, or any other objects should be avoided.
8) Refer to the recommended pattern when designing for this module.
9) If hand soldering is used, be sure to use the precautions outlined in this document.
10) This module should be kept away from heat, both during storage and after installation.
11) Do not drop or physically shock the module.
12) Do not damage the interface surfaces of the module.
13) The module should not be mechanically stressed at any time (storage, handling, installation).
14) Do not store or expose this module to:
Humid or salty air conditions
High concentrations of corrosive gasses.
Long durations of direct sunlight.
Temperatures lower than -40°C or higher than 125°C.
19.
Life Support Policy
This product is not designed to be used in a life support device or system, or in applications where there is potential for a failure or malfunction to, directly or indirectly, cause significant injury. By using this product in an application that poses these risks, such as described above, the customer is agreeing to indemnify Rigado for any damages that result.
20.
Document History
Revision Date Changes / Notes
0.5 1/5/14 Initial Release - Preliminary
BMD-100-DS-V0.5 PRELIMINARY Page 16 of 17
21.
Related Documents
STMicroelectronics Documents:
DM00141263: BlueNRG-MS Datasheet
BMD-100 Module Datasheet
Bluetooth 4.1 LE
1/5/2014
BMD-100-DS-V0.5 PRELIMINARY Page 17 of 17
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