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BM63SPKA1MGA
BM63SPKA1MGA
Bluetooth 3.0 Digital Audio Output Module
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park, Hsinchu city 30077, Taiwan, R.O.C
Phone: 886-3-577-8385
Version:1.2
10/15/2014
Fax: 886-3-577-850 1
BM63SPKA1MGA
Product Description
The ISSC BM63SPKA1MGA is a highly integrated Bluetooth 3.0 digital audio output module, designed for high data rate, short-range wireless communication in the 2.4 GHz ISM band. With the built-in ISSC Bluetooth stack, profiles and digital audio interface, the ISSC BM63SPKA1MGA can combine the external DSP and codec to provide high performance Bluetooth audio.
Features
Main Chip: ISSC IS2063GM(Flash version)
Bluetooth 3.0 compliant
Max. +4dBm Class 2 output power
Receiver Sensitivity: GFSK typical -89 dBm, π/4 PSK typical -90dBm,
8DPSK typical -83dBm
Piconet and Scatter net support
CVSD, A-law,
-law, mSBC CODEC algorithms for voice applications
Support SONY new feature
SBC/AAC decode for Bluetooth audio streaming
Microphone input and audio line-in support
Built-in four language voice prompt (Chinese/English/Spanish/French)
Support PCM and I2S digital audio interface
Built-in 350mAH Li-ion battery charger
HSP 1.2, HFP 1.6, A2DP 1.2, AVRCP 1.5,SPP 1.0 profiles supported
Support USB 1.1 DFU and BC1.2/Apple charger detection
USB BC1.2 charger detection for DCP/CDP/SDP
Apple Charger: 2.5W, 5W, 10W, 12.5W
3.3V operating voltage
Built-in program ROM and 64Kb EEPROM
51 pins for SMT module Size: 15mmx32mm
Built-in PCB Antenna
RoHS compliant
ISSC Confidential
(Version: 1.2) - 2 - 10/15/2014
BM63SPKA1MGA
Module Pin Out Diagram
BM63SPKA1MGA
49
50
51
ANT1
ANT2
ANT3
10
11
12
8
9
6
7
1
2
3
4
5
13
14
15
16
17
18
19
DR0
RFS0
SCLK0
DT0
AOHPR
AOHPM
AOHPL
MICN1
MICP1
MICBIAS
AIR
AIL
P12
P13
RST_N
P01
P24
P04
P15
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
GND
P05
P30
P27
P20
P02
P31
P33
P36
DP
DM
EAN
P03
P00
P35
P37
GND
LED1
LED2
ISSC Confidential
(Version: 1.2) - 3 - 10/15/2014
4
5
6
7
1
2
3
8
9
10
11
12
BM63SPKA1MGA
Pin Definition for Flash module
Pin No. Pin type Name Description
13
14
15
16
17
18
19
20
21
22
23
I
O
O
DR0 I2S interface: Digital Left/Right Data from ADC
RFS0 I2S interface: DAC Left/Right Clock
SCLK0 I2S interface: Bit Clock
DT0 I2S interface: Digital Left/Right Data to DAC O
O
O
O
I
I
AOHPR R-channel analog headphone output
AOHPM Headphone common mode output/sense input.
AOHPL L-channel analog headphone output
MICN1
MICP1
MIC 1 mono differential analog negative input
MIC 1 mono differential analog positive input
P
I
I
I/O
I/O
I
I/O
I/O
MICBIAS Electric microphone biasing voltage
AIR R-channel single-ended analog input
AIL
P12
P13
RST_N
P01
P24
P04
L-channel single-ended analog input
GPIO, default pull-high input
1. KEY PIN for FT Test
2. EEPROM clock SCL
GPIO, default pull-high input
1. KEY PIN for FT Test
2. EEPROM data SDA
KEY PIN for FT Test
System Reset Pin (Low active)
GPIO, default pull-high input
BAT_CHK_EN
GPIO, default pull-high input
1. KEY PIN for FT Test
2. System Configuration:
H: Boot Mode
L: Boot Mode with P2_0 low combination
GPIO, default pull-high input. I/O
I/O
I
O
P15
HCI_RXD
HCI_TXD
GPIO, default pull-high input
KEY PIN for FT Test
1-bit serial data received from MCU through UART
KEY PIN for FT Test
1-bit serial data transmitted to MCU through UART
P CODEC_VO 3.1V LDO output for CODEC power
P VDD_IO I/O power supply input
ISSC Confidential
(Version: 1.2) - 4 - 10/15/2014
Pin No. Pin type Name
24 P ADAP_IN Power adaptor input
BM63SPKA1MGA
Description
31
32
33
25
26
27
28
29
30
34
35
36
37
38
39
40
41
42
43
44
45
46
I
P
I/O
P
P
P
I
I
I
I/O
I/O
I/O
I
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
BAT_IN Battery input
AMB_DET ADC analog input 1
SYS_PWR System Power Output
PWR(MFB) Multi-Function Push Button key
LED3 LED Driver 3
LED2 LED Driver 2
LED1 LED Driver 1
GND Ground Pin
P37
P35
P00
P03
EAN
DM
DP
P36
P33
P31
P02
P20
P27
P30
GPIO, default pull-high input
GPIO, default pull-high input (LF/ES samples)
Default pull-low input (CS/MP samples)
Charger Enable
GPIO, default pull-high input
UART TX_IND signal to wake up MCU
GPIO, default pull-high input
UART RX_IND signal to wake up BT
(Note: HCI_RXD can also be used to wake up BT)
Embedded ROM/External Flash enable
H: Embedded; L: External Flash
USB Differential data bus
Data -
USB Differential data bus
Data +
GPIO, default pull-high input
GPIO, default pull-high input
ICHG1
GPIO, default pull-high input
ICHG0
GPIO, default pull-high input
GPIO, default pull-high input
1. KEY PIN for FT Test
2. System Configuration,
H: Application
L: Baseband(IBDK Mode)
GPIO, default pull-high input
GPIO, default pull-high input
ISSC Confidential
(Version: 1.2) - 5 - 10/15/2014
BM63SPKA1MGA
Description Pin No. Pin type Name
47
48
I/O
P
P05
Line-in Detector
GPIO, default pull-high input
Charger Status
GND Ground Pin
49 P ANT1 Antenna modification point
50
51
P
P
ANT2 Antenna modification point
ANT3 Antenna modification point
Block Diagram
BT 3.0
Transceiver
Synthesizer
RF Transmitter
RF Receiver
XTAL + POR
I2S/PCM
Module
Audio Codec
Audio Digital Core
Stereo DAC
Stereo ADC
Anti-Pop
BUS
BT 3.0 Digital Core
Interrupts
Modem + MAC
ROM
MCU Core
DSP Core
DSP ROM/RAM
Common RAM
DMA Controller
Memory Controller
RAM
Flash
PMU
Power Switch
Battery Charger
BUCK
LDO
LED Driver * 2
SAR_ADC
Misc. PMU logic
HCI/UART
SPI
ULPC 32KHz
GPIOs (Buttons)
I2C (GPIOs or H/W)
External
MCU
Buttons
EEPROM
ISSC Confidential
(Version: 1.2) - 6 - 10/15/2014
BM63SPKA1MGA
Digital Audio Interface
Support I2S and PCM interface
Sampling Rate : 8K, 16K, 44.1K, 48K, 88.2K, 96K
Word Length: 16 bits, 24 bits
4 application modes
ISSC Confidential
(Version: 1.2) - 7 - 10/15/2014
BM63SPKA1MGA
Mode 1: I2S Master
External CODEC/DSP
DAC
ADC
BCLK
ADCLRC
DACLRC
ADCDAT
DACDAT
Slave
BM63
SCLK0
RFS0
TFS0
DR0
DT0
A2DP/SCO
LineIn
Master
SCO
ADC
1/fs
SCLK0
RFS0
Left Channel Right Channel
DR0/DT0
B n-1
B n-2
B
1
B
0
B n-1
B n-2
Word Length or
Solutions with mic and line-in analog input with I2S audio output
Mic for Bluetooth SCO link
Line-in for external audio playback(for high SNR requirement)
B
1
B
0
External CODEC/DSP
DAC
BCLK
ADCLRC
DACLRC
ADCDAT
DACDAT
LineIn
Slave
BM63
SCLK0
RFS0
TFS0
DR0
DT0
Master
A2DP/SCO
SCO
ISSC Confidential
(Version: 1.2) - 8 - 10/15/2014
BM63SPKA1MGA
Mode 2: I2S Slave
External CODEC/DSP
DAC
ADC
BCLK
ADCLRC
DACLRC
ADCDAT
DACDAT
Master
BM63
SCLK0
RFS0
TFS0
DR0
DT0
LineIn
Slave
A2DP/SCO
SCO
ADC
1/fs
SCLK0
RFS0
Left Channel Right Channel
DR0/DT0
B n-1
B n-2
B
1
B
0
B n-1
B n-2
Word Length or
Solutions with mic and line-in analog input with I2S audio output
Mic for Bluetooth SCO link
Line-in for external audio playback(for high SNR requirement)
External CODEC/DSP BM63
B
1
B
0
DAC
BCLK
ADCLRC
DACLRC
ADCDAT
DACDAT
SCLK0
RFS0
TFS0
DR0
DT0
A2DP/SCO
SCO
LineIn
Master Slave
ISSC Confidential
(Version: 1.2) - 9 - 10/15/2014
BM63SPKA1MGA
Mode 3: PCM master
External CODEC/DSP
DAC
ADC
BCLK
ADCLRC
DACLRC
ADCDAT
DACDAT
Slave
BM63
SCLK0
RFS0
TFS0
DR0
DT0
A2DP/SCO
LineIn
Master
SCO
ADC
1/fs
SCLK0
RFS0
DR0/DT0
B n-1
B n-2
Left Channel
B
1
B
0
B n-1
B
Right Channel n-2
B
1
B
0
Word Length
ISSC Confidential
(Version: 1.2) - 10 - 10/15/2014
BM63SPKA1MGA
Mode 4: PCM slave
External CODEC/DSP
DAC
ADC
BCLK
ADCLRC
DACLRC
ADCDAT
DACDAT
Master
BM63
SCLK0
RFS0
TFS0
DR0
DT0
LineIn
Slave
A2DP/SCO
SCO
ADC
1/fs
SCLK0
RFS0
DR0/DT0
B n-1
B n-2
Left Channel
B
1
B
0
B n-1
B
Right Channel n-2
B
1
B
0
Word Length
ISSC Confidential
(Version: 1.2) - 11 - 10/15/2014
BM63SPKA1MGA
Outline Dimension (Module Foot print)
ISSC Confidential
(Version: 1.2) - 12 - 10/15/2014
BM63SPKA1MGA
ISSC Confidential
(Version: 1.2) - 13 - 10/15/2014
BM63SPKA1MGA
Electrical Characteristics
Table 1: Absolute Maximum Voltages
Storage Temperature
ESD: Human Body Mode
ESD: Machine Mode
ESD: Charge Device Mode
Core supply voltage
RF supply voltage
Min Max
-40ºC +85ºC
± 2KV
± 200V
± 200V
VDD_CORE, AVDD_PLL 1.14V 1.26V
VCC_RF 1.22V 1.34V
SAR supply voltage AVDD_SAR
Codec supply voltage VDD_AUDIO
I/O voltage VDD_IO
1.62V 1.98V
2.7V 3.0V
3.6V
BK_VDD 4.5V
3V1_VIN 4.5V
Supply voltage
BAT_IN
ADAP_IN
LED
Power switch
Table 2: Recommended Operating Conditions
Storage Temperature
Core supply voltage
RF supply voltage
3.0
4.5
4.5V
7.0V
5.1V
7.0V
Min Typ Max
-10ºC +25ºC +60ºC
VDD_CORE, AVDD_PLL 1.14V 1.2V 1.26V
VCC_RF 1.22V 1.28V 1.34V
SAR supply voltage AVDD_SAR 1.62V 1.8V 1.98V
Codec supply voltage VDD_AUDIO
I/O voltage VDD_IO
BK_VDD
3V1_VIN
Supply voltage
BAT_IN
ADAP_IN
LED
Power switch
2.7V
2.7V
3V
3V
3V
4.5V
1.8V
3.0V
3.0V
3.3V
4.3V
4.3V
4.3V
6.0V
4.3V 5.0V
6.0V
ISSC Confidential
(Version: 1.2) - 14 - 10/15/2014
BM63SPKA1MGA
Table 3: BUCK switching regulator
Normal Operation
Operation Temperature
Input Voltage (V
IN
)
Output Voltage (V
OUT
)
(I
LOAD
=70mA, V
IN
=4V)
Output Voltage Accuracy
Output Voltage Adjustable Step
Output Adjustment Range
Output Ripple
Average Load Current (I
LOAD
)
Settling Time
EN or V
IN
to V
OUT
(start-up time)
Conversion efficiency
@BAT=3.8V
I
LOAD
= 50mA
I
LOAD
≥ 10mA (PWM)
I
LOAD
≥ 10mA (PFM)
I
LOAD
≥ 250 μ A (PFM)
Switching Frequency
Min
-40
3.0
1.7
-0.1
120
Typ
3.8
1.80
± 5
50
10
1.2
Max
85
4.5
2.05
+0.25
15
% mV/Step
V mV
RMS mA
2
88
70
80
65 70
800
Unit
℃
V
V ms
%
KHz
PWM/PFM Switching Point by F/W mA
Start-up Current Limit
Start-up Inrush
Current
I
LOAD
= 10mA
PWM
Quiescent Current
Output Current (Peak)
PFM
0
200
50
30
210
400
1000
40 mA mA
μ A mA
Load Regulation (I
LOAD
= 10 ~ 100mA) 1 mV/mA
Line Regulation (3.2V < V
IN
< 4.2V)
Logic Low Voltage (V
IL
)
EN threshold
EN current
Shutdown Current
Logic High Voltage (V
IH
) 1.62
0.03
(30)
0.4
10
<1
%/V
(mV/V)
V
V nA
μ A
ISSC Confidential
(Version: 1.2) - 15 - 10/15/2014
BM63SPKA1MGA
Table 4: Low Drop Regulation
Operation Temperature
Input Voltage (V
IN
)
V
OUT
= 2.9V
Output Voltage (V
OUT
)
(2.4~3.4V)
(1) V
OUT_CODEC
V
OUT
= 1.8V
(2) V
OUT_IO
(1.3~2.3V)
Accuracy (V
IN
=3.7V, I
LOAD
=100mA, 27 ’C)
Output Voltage Adjustable Step
Output Adjustment Range
Start-up Inrush Current I
LOAD
=10mA
Settling Time (start-up time) EN or V
IN
to V
OUT
Min Typ Max
-40 85
3.0 4.5
67
2.9
1.8
± 5
100
± 0.5
200
250
400
500
Unit
℃
V
V
% mV/Step
V mA
μ s
100 mA Output Current (Average) V
OUT
Output Current (Peak)
EN current
Shutdown Current (*1)
V
OUT
Drop-Out Voltage
(I
LOAD
= maximum output current)
Quiescent Current
(excluding load, I
LOAD
< 1mA)
Quiescent Current
(excluding load, I
LOAD
< 100 μ A)
Load Regulation (I load
= 0mA to 100mA), Δ V
OUT
Note: 0.4(mV/mA) * (100mA-0mA)=40mV
Line Regulation (V
OUT
+0.3V<V
IN
<4.5V
Logic Low Voltage (V
IL
)
EN threshold
Logic High Voltage (V
IH
) 1.62
45
7
150
300
N/A
40
(0.4)
10
0.4
10
<1 mA mV
μ A
μ A mV
(mV/mA) mV/V
V
V nA
μ A
ISSC Confidential
(Version: 1.2) - 16 - 10/15/2014
BM63SPKA1MGA
Table 5: Battery Charger
Charging Mode (BAT_IN rising to 4.2V)
Operation Temperature
Min
-40
Typ Max
85
Unit
℃
Input Voltage (V
IN
)
Note: It needs more time to get battery fully charged when 4.5 5.0 7.0 V
V
IN
=4.5V
3 4.5 mA Supply current to charger only
Battery trickle charge current
(BAT_IN < trickle charge voltage threshold)
Maximum Battery
Fast Charge Current
(ADAP_IN=5V)
Headroom = 0.3V
Note: ENX2=0
Headroom > 0.7V
(ADAP_IN=4.5V)
Maximum Battery
Fast Charge Current
(ADAP_IN=5V)
Headroom = 0.3V
Note: ENX2=1
Headroom > 0.7V
(ADAP_IN=4.5V)
170
160
330
180
0.1C
200
180
370
220
240
240
420
270 mA mA mA mA mA
Minimum Step 1 mA
Trickle Charge Voltage Threshold 3 V
Float Voltage
Battery Charge Termination Current,
% of Fast Charge Current
Standby Mode (BAT_IN falling from 4.2V)
Supply current to charger only
4.158 4.2
10
2
4.242
4
V
% mA
Battery Current
Battery Recharge Current
Note: C
Battery Capacity (*1)
-1
0.25C
μ A mA
ISSC Confidential
(Version: 1.2) - 17 - 10/15/2014
BM63SPKA1MGA
Table 6: Audio codec ADC
Temperature
Resolution
Conditions
Input sample rate, F sample
8KHz for MIC
44.1/48KHz for Line-in f in
=1KHz
B/W=20~20KHz
8KHz
Signal to Noise Ratio
(SNR @MIC or Line-in mode)
(A-weighted)
THD+N < 1%
44.1/
48KHz
2.26Vpp input
Digital Gain
Digital Gain Resolution
MIC Boost Gain
PGA Analog Gain
Analog Gain step
Input full-scale at maximum gain (differential)
Input full-scale at minimum gain (differential)
3dB bandwidth
Note:
Input V
PP
=0.8*AVDD
Input impedance Microphone mode input impedance
THD+N (microphone input)
@30mV
RMS
input
Input capacitance
THD+N (line input)
Min
-40
8
90
90
Typ
25
Max
85
16
48
92
92
Unit
℃
Bits
KHz dB
-54
-6
2~6
20
1
4
(AVDD=2.8V)
800
(AVDD=2.8V)
20
6
4.85 dB dB
26 dB dB
10
20 mV mV
RMS
RMS
KHz
K Ω pF
0.02
0.04
%
%
ADC channels
Analog supply voltage
Digital supply voltage
Crosstalk @line-in mode
2.6
1.08
42
2
2.8
1.2
45
3.0 V
1.32 V
48 dB
ISSC Confidential
(Version: 1.2) - 18 - 10/15/2014
BM63SPKA1MGA
MIC Boost Gain and PGA Gain are controlled by DSP F/W
AIL
MICP1
MICN1 -
+
MIC AMP
+
LINE AMP
-
1-bit
SD ADC
Digital
Codec
DSP
Core
MIC Boost Gain
0dB or 20dB
PGA Analog Gain
-6 ~ 26dB in 1dB step
ADC Digital Gain
-54 ~ 4.85dB
Fixed in 0dB now
DSP Digital Gain
-96 ~ 0dB in 6dB step
Fixed in 0dB now
System Gain = MIC Boost Gain + PGA Analog Gain + ADC Digital Gain + DSP Digital Gain
(1) MIC mode:
(a) There are 16 gain levels: 46/43/40/37/34/31/28/25/22/19/16/13/10/7/4/0 dB
(b) 46/43/40/37 dB gain levels are normally used for MIC mode
(2) Line-in mode:
(a) MIC boost gain = 0 dB
(b) PGA analog gain = 0 dB
(c) ADC digital gain = 0 dB
(d) DSP digital gain = 0 dB
(e) Gain control for line-in mode is recommended to be done by DAC side
Note: For I 2 S digital audio output, no gain control in BM63 so far and it is controlled by external DAC
AIL
MICP1
MICN1
Line-in mode
+
-
MIC AMP
MIC Boost Gain
0dB or 20dB
SCO up link
+
LINE AMP
-
PGA Analog Gain
-6 ~ 26dB in 1dB step
1-bit
SD ADC
Digital
Codec
BT
RF/MAC
UART
DSP
Core I 2 S
External
MCU
I 2 C
External
DSP/DAC
(YDA174)
A2DP down link
&
SCO down link
ADC Digital Gain
-54 ~ 4.85dB
Fixed in 0dB now
DSP Digital Gain
-96 ~ 0dB in 6dB step
Fixed in 0dB now
Digital/Analog
Gain Control
ISSC Confidential
(Version: 1.2) - 19 - 10/15/2014
BM63SPKA1MGA
Table 7: Transmitter section for BDR (25 ℃ )
Min Typ Max
2.0* 5.0
Bluetooth specification
-6 to 4 Maximum RF transmit power
RF power variation over temperature range with compensation disabled
RF power control range
RF power range control resolution
20dB bandwidth for modulated carrier
ACP
Note:
F = F
0
± 2MHz
F = F
0
± 3MHz
F
0
=2441MHz F = F
0
± >3MHz
∆f
1avg
maximum modulation
∆f
2max
maximum modulation
∆f
2avg
/∆f
1avg
ICFT
±
±
2.0
18
0.5
925
≥16
≤1000
-42
-49
-40
-48
≤-20
≤-40
≤-40 -57 -53
145
120 135
175 140<∆f
1avg
<175
140
≥115
0.9 0.95 ≥0.80
4.5 8 10.5 ± 75
Drift rate
Drift (single slot packet)
2 nd
harmonic content
3 rd
harmonic content
3.3
* The transmit power is calibrated in MP.
5
12
-42
-45
7.0
≤20
≤40
≤-30
≤-30
Unit dBm dB dB dB
KHz dBm dBm dBm
KHz
KHz
KHz
KHz/50 us
KHz dBm dBm
ISSC Confidential
(Version: 1.2) - 20 - 10/15/2014
BM63SPKA1MGA
Table 8 Transmitter section for EDR (25 ℃ )
Min Typ Max
Bluetooth specification
Unit
Relative transmit power
π /4 DQPSK max carrier frequency stability
|ω o
| freq. error
|ω
|ω i o
| initial freq. error
+ω i
|
8DPSK max carrier frequency stability block freq. error
|ω o
| freq. error
|ω i
| initial freq. error
|ω o
+ω i
| block freq. error
π /4 DQPSK modulation accuracy
RMS DEVM
99% DEVM
Peak DEVM
RMS DEVM 8DQPSK modulation accuracy
99% DEVM
Peak DEVM
In-band spurious emissions
Note:
F
0
=2441MHz
F > F
0
+3MHz
F < F
0
-3MHz
F = F
F = F
F = F
0
-3MHz
0
-2MHz
0
-1MHz
F = F
0
+1MHz
F = F
0
+2MHz
F = F
0
+3MHz
EDR differential phase encoding
-1.2
2.5
2.5
5
2.5
2.5
5
-4 to 1 dB
5
≤10 for all blocks KHz
5 ≤75 for all blocks KHz
10 ≤75 for all blocks KHz
5 ≤10 for all blocks KHz
5
≤75 for all blocks KHz
10
≤75 for all blocks KHz
7 12.2
PASS
7
25
PASS
20
<-52
<-53
-46
-34
-34
-37
-34
-46
100
≤-40
≤-40
≤-20
≤-26
≤-26
≤-20
≤-40
≥99
≤20
≤30
≤35
≤13
≤20
≤25
≤-40 dBm dBm dBm dBm dBm dBm
%
%
%
%
%
%
% dBm dBm
ISSC Confidential
(Version: 1.2) - 21 - 10/15/2014
Table 9 Receiver section for BDR (25 ℃ )
BM63SPKA1MGA
Bluetooth specification
Unit
Sensitivity at 0.1%
BER for all basic rate packet types
Frequency
(GHz)
2.402
2.441
Min
2.480
Maximum received signal at 0.1% BER
Continuous power 0.030
–2.000 required to block
Bluetooth reception
2.000-2.400
2.500-3.000
(for input power of
-67dBm with 0.1%
BER) measured at the unbalanced port of the balun
3.000-12.75
Typ
-89
-89
-89
0
-7
-10
-11
-7
Max
C/I co-channel
Adjacent channel selectivity C/I
Note: F
0
=2441MHz
F = F
0
+1MHz
F = F
0
-1MHz
F = F
F = F
0
0
+2MHz
-2MHz
F = F
0
-3MHz
F = F
0
+5MHz
F = F image
Maximum level of inter-modulation interferers
Spurious output level
6
-6
-6.5
-36
-28
-31
-48
-28
-37
N/A
≤-70
≥-20
-10
-27
-27
-10
≤11
≤0
≤0
≤-30
≤-9
≤-20
≤-40
≤-9
≥-39 dBm dBm dBm dB dB dB dB dB dB dB dB dBm dBm/Hz
ISSC Confidential
(Version: 1.2) - 22 - 10/15/2014
BM63SPKA1MGA
Table 10: Receiver section for EDR (25 ℃ )
Bluetooth specification
Unit
Sensitivity at
0.01% BER
Frequency
(GHz)
2.402
2.441
2.480
2.402
2.441
Modulation
π /4 DQPSK
π /4 DQPSK
π /4 DQPSK
8DPSK
8DPSK
Maximum received signal at
0.1% BER
Adjacent channel selectivity C/I
Note:
F
0
=2441MHz
2.480
π
π
/4 DQPSK
8DPSK
π /4 DQPSK
C/I co-channel at 0.1% BER
F= F
0
+1MHz
8DPSK
π /4 DQPSK
8DPSK
π /4 DQPSK
F= F
0
-1MHz
F= F
0
+2MHz
F= F
F= F
0
0
-2MHz
-3MHz
8DPSK
8DPSK
π /4 DQPSK
8DPSK
/4 DQPSK
8DPSK
π /4 DQPSK
8DPSK
π /4 DQPSK
F= F
0
+5MHz
8DPSK
π /4 DQPSK
F= F image
8DPSK
Min Typ
-90
-90
-90
-83
-83
-82
-10
-10
10
16
-11
-5
-8
-4
-38.5
-33.5
-29
-25
-32.5
-27
-49.5
-43.5
-29
-25
Max
≤-70
≤-70 dBm dBm dBm
≥-20
≥-20
≤13
≤21
≤0
≤5
≤0
≤5
≤-30
≤-25
≤-7
≤0
≤-20
≤-13
≤-40
≤-33
≤-7
≤0 dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB
ISSC Confidential
(Version: 1.2) - 23 - 10/15/2014
Reflow profile
BM63SPKA1MGA
ISSC Confidential
(Version: 1.2) - 24 - 10/15/2014
QR code label information
Label Size:15
±
1.5 *6
±
1.5 mm
Device Name: BM63SPKA1MGA
MAC ID: xxxxxxxxxx
Customer ID Name: Cxxxxx
Date Code: 13xx
Module Weight
(Test condition: module with QR label)
TBD
BM63SPKA1MGA
ISSC Confidential
(Version: 1.2) - 25 - 10/15/2014
BM63SPKA1MGA
Storage standard
1. Calculated shelf life in sealed bag: 12 months at < 40 ℃ and <90% relative humidity (RH)
2. After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be Mounted within 168 hours of factory conditions <30 ℃ /60% RH
ISSC Confidential
(Version: 1.2) - 26 - 10/15/2014
BM63SPKA1MGA
Ordering Information
Device
Size
BM63SPKA1MGA
Bluetooth 3.0 digital audio Module
Note:
32*15 mm
2
Minimum Order Quantity is 630pcs Tray.
Module
Shipment
Method
Tray
Order Number
ISSC Confidential
(Version: 1.2) - 27 - 10/15/2014
BM63SPKA1MGA
Packing Information
Tray Dimensions
Packing Method
ISSC Confidential
(Version: 1.2) - 28 - 10/15/2014
BM63SPKA1MGA
Inner box: Q ’ty (630 Pcs)
Dimensions: 36*16*9.5 cm
Bar Code Label
P/N: Device name
C/N: Customer name
Lot No: Lot ID
Q ’ty: Box or Carton Module’s Q’ty
Carton: Q’ty (3780 Pcs)
Dimensions: 38*35*30 cm
ISSC Confidential
(Version: 1.2) - 29 - 10/15/2014
1.
BM63 module contain PCB antenna
2.
The gain of PCB antenna is 2.4dBi
1.
Every module has 48 pin
2.
Fix BT module on main board by its 8 pin
3.
Every pin is fixed on the main board by tin
Main board
SRS ‐ X55
+
+
1.Main
board plug in the plastic enclose inside.
=
FCC statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2)this device must accept any interference received, including interference that may cause undesired operation.
IC statement
This device complies with Industry
Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device
Le pr é sent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autoris é e aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radio é lectrique subi, m ê me si le brouillage est susceptible d'en compromettre le fonctionnement.
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