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DISCRETE SEMICONDUCTORS
DATA SHEET
dbook, halfpage
MBD128
BGA2748
MMIC wideband amplifier
Product specification
Supersedes data of 2002 Jul 03
2010 Sep 13
NXP Semiconductors
MMIC wideband amplifier
Product specification
BGA2748
FEATURES
•
Internally matched
•
Wide frequency range
•
Optimized for 900 MHz
•
Excellent isolation
•
Low noise
•
Unconditionally stable.
APPLICATIONS
•
Cable systems
•
LNB IF amplifiers
•
General purpose
•
ISM.
DESCRIPTION
Silicon Monolitic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin
SOT363 SMD plastic package.
PINNING
PIN
1
2, 5
3
4
6
V
S
GND2
RF out
GND1
RF in
DESCRIPTION
6 5 4
1
6 3
1
Top view
2 3
MAM455
4 2, 5
Marking code: G3* * = - : made in Hong Kong
* = p : made in Hong Kong
* = t : made in Malaysia
Fig.1 Simplified outline (SOT363) and symbol.
QUICK REFERENCE DATA
SYMBOL
V
S
I
S
|s
21
| 2
NF
P
L(sat)
PARAMETER
DC supply voltage
DC supply current insertion power gain noise figure saturated load power f = 1 GHz f = 1 GHz f = 1 GHz
CONDITIONS TYP.
3
5.7
21.8
1.9
−
2.3
−
−
4
−
−
MAX.
UNIT
V mA dB dB dBm
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling.
2010 Sep 13 2
NXP Semiconductors
MMIC wideband amplifier
Product specification
BGA2748
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134)
SYMBOL
V
S
I
S
P tot
T stg
T j
P
D
PARAMETER
DC supply voltage supply current total power dissipation storage temperature operating junction temperature maximum drive power
CONDITIONS
RF input AC coupled
T s
≤
80
°
C
THERMAL RESISTANCE
SYMBOL
R th j-s
PARAMETER thermal resistance from junction to solder point
CONDITIONS
P tot
= 200 mW; T s
≤
80
°
C
−
−
MIN.
−
−
−
−
65
300
MAX.
4
15
200
+150
150
10
VALUE
UNIT
V mA mW
°
C
°
C dBm
UNIT
K/W
CHARACTERISTICS
V
S
= 3 V; I
S
= 5.7 mA; f = 1 GHz; T j
= 25
°
C; unless otherwise specified.
SYMBOL
I
S
|s
21
| 2
R
R
NF
BW
P
P
L
L
IN
OUT
L(sat)
L 1 dB
IP3
IP3
(in)
(out)
PARAMETER supply current insertion power gain return losses input return losses output noise figure bandwidth saturated load power load power input intercept point output intercept point
CONDITIONS MIN.
f = 1 GHz f = 2 GHz f = 1 GHz f = 2 GHz f = 1 GHz f = 2 GHz f = 1 GHz f = 2 GHz
− at
| s
21
| 2 −
3 dB below flat gain at 1 GHz
− f = 1 GHz
− f = 2 GHz at 1 dB gain compression; f = 1 GHz at 1 dB gain compression; f = 2 GHz f = 1 GHz f = 2 GHz
−
−
−
−
− f = 1 GHz f = 2 GHz
−
−
−
−
−
−
−
−
4.5
−
TYP.
MAX.
UNIT
5.7
21.8
18.5
18
14
7
8
1.9
2.4
1.9
−
2.3
−
3.3
−
9.2
−
−
10.9
−
−
−
−
−
−
23.7
−
−
19.9
−
−
1.9
−
1.4
−
−
−
−
−
−
−
−
8
− dB
GHz dBm dBm dBm dBm dBm dBm dB dB dB dB mA dB dB dB dBm dBm
2010 Sep 13 3
NXP Semiconductors
MMIC wideband amplifier
Product specification
BGA2748
APPLICATION INFORMATION
Figure 2 shows a typical application circuit for the
BGA2748 MMIC. The device is internally matched to 50
Ω
, and therefore does not need any external matching. The value of the input and output DC blocking capacitors C2,
C3 should be not more than 100 pF for applications above
100 MHz. However, when the device is operated below
100 MHz, the capacitor value should be increased.
The 22 nF supply decoupling capacitor, C1 should be located as closely as possible to the MMIC.
Separate paths must be used for the ground planes of the ground pins GND1, GND2, and these paths must be as short as possible. When using vias, use multiple vias per pin in order to limit ground path inductance.
input
100 pF handbook, halfpage from RF circuit mixer
DC-block
100 pF
DC-block
100 pF output
MGU437
Fig.3 Easy cascading application circuit.
to IF circuit or demodulator wideband amplifier
MGU438 oscillator C1
RF input
C2
RF in
GND1
Vs
RF out
GND2
C3
RF output
MGU435
Fig.4 Application as IF amplifier.
Fig.2 Typical application circuit.
Figure 3 shows two cascaded MMICs. This configuration
doubles overall gain while preserving broadband characteristics. Supply decoupling and grounding conditions for each MMIC are the same as those for the
The excellent wideband characteristics of the MMIC make it and ideal building block in IF amplifier applications such
As a buffer amplifier between an LNA and a mixer in a receiver circuit, the MMIC offers an easy matching, low
In Fig.6 the MMIC is used as a driver to the power amplifier
in part of a transmitter circuit. Good linear performance and matched input and output offer quick design solutions in such applications.
handbook, halfpage antenna
LNA wideband amplifier oscillator mixer or IF circuit oscillator mixer to IF circuit or demodulator
MGU439
Fig.5 Application as RF amplifier.
wideband amplifier to power amplifier
MGU440
Fig.6 Application as driver amplifier.
2010 Sep 13 4
NXP Semiconductors
MMIC wideband amplifier handbook, full pagewidth
180 ° 0
135
°
+ 0.5
+
−
0.2
0.2
0.2
0.5
90 °
+ 1
1
100 MHz
2
3 GHz
+ 2
45 °
5
+
5
1.0
0.8
0.6
0.4
0 °
0.2
0
− 5
−
135
°
− 0.5
− 1
− 90 °
− 2
−
45
°
MGU465
I
S
= 5.66 mA; V
S
= 3 V; P
D
=
−
30 dBm; Z
O
= 50
Ω.
Fig.7 Input reflection coefficient (s
11
); typical values.
1.0
handbook, full pagewidth
180 ° 0
135
°
+ 0.5
+ 0.2
0.2
90 °
+ 1
0.5
1
3 GHz
100 MHz
+ 2
45 °
5
+
5
1.0
0.8
0.6
0.4
0 °
0.2
0
−
0.2
− 5
−
135
°
− 0.5
− 1
− 90 °
−
2
−
45
°
MGU466
I
S
= 5.66 mA; V
S
= 3 V; P
D
=
−
30 dBm; Z
O
= 50
Ω.
Fig.8 Output reflection coefficient (s
22
); typical values.
1.0
2010 Sep 13 5
Product specification
BGA2748
NXP Semiconductors
MMIC wideband amplifier
Product specification
BGA2748
MGU467
0 handbook, halfpage s12
2
(dBm)
−
20
−
40
− 60
− 80
0 1000 2000 f (MHz)
3000
I
S
= 5.66 mA; V
S
= 3 V; P
D
=
−
30 dBm; Z
O
= 50
Ω.
Fig.9
Isolation (|s
12
| 2 ) as a function of frequency; typical values.
30 handbook, halfpage s21
2
(dB)
20
10
0
0 1000
MGU468
2000 f (MHz)
3000
I
S
= 5.66 mA; V
S
= 3 V; P
D
=
−
30 dBm; Z
O
= 50
Ω.
Fig.10 Insertion gain (|s
21
| 2 ) as a function of frequency; typical values.
MGU469
0 handbook, halfpage
PL
(dBm)
− 10
− 20
MGU470
0 handbook, halfpage
PL
(dBm)
− 10
− 20
− 30
−
50
−
40
−
30
−
20
−
10
PD (dBm)
0
− 30
−
50
−
40
−
30
−
20
−
10
PD (dBm)
0
V
S
= 3 V; f = 1 GHz; Z
O
= 50
Ω.
Fig.11 Load power as a function of drive power at
1 GHz; typical values.
2010 Sep 13 6
V
S
= 3 V; f = 2 GHz; Z
O
= 50
Ω.
Fig.12 Load power as a function of drive power at
2 GHz; typical values.
NXP Semiconductors
MMIC wideband amplifier
Product specification
BGA2748
5 handbook, halfpage
NF
(dB)
4
3
2
1
0
0 1000
MGU471
15
K
10
5
MGU472
2000 f (MHz)
3000
0
0 1000 2000 f (MHz)
3000
I
S
= 5.66 mA; V
S
= 3 V; Z
O
= 50
Ω.
Fig.13 Noise figure as a function of frequency; typical values.
I
S
= 5.66 mA; V
S
= 3 V; Z
O
= 50
Ω.
Fig.14 Stability factor as a function of frequency; typical values.
Table 1 Scattering parameters: I
S
= 5.66 mA; V
S
= 3 V; P
D
=
−
30 dBm; Z
O
= 50
Ω
; T amb
= 25
°
C f
(MHz)
100
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
2600
2800
3000 s
11
MAGNITUDE
(ratio)
0.08233
0.08934
0.10677
0.12257
0.12902
0.12635
0.11634
0.11643
0.12552
0.15177
0.18258
0.20634
0.22422
0.22777
0.21931
0.22247
ANGLE
(deg)
−
6.058
1.505
1.621
−
2.565
−
8.769
−
11.24
−
9.574
1.8040
14.913
23.659
27.689
29.316
28.365
26.661
28.691
37.201
(ratio)
5.4700
6.8702
9.7365
11.586
12.372
12.519
12.232
11.550
10.664
9.6775
8.5565
7.5480
6.5362
5.6120
4.8007
3.9567
s
21
MAGNITUDE ANGLE
(deg)
14.75
17.10
−
111.1
−
124.5
−
136.9
−
148.4
−
158.5
−
167.7
−
175.6
5.277
−
12.73
−
31.11
−
48.70
−
65.32
−
81.52
−
96.69
s
12
MAGNITUDE
(ratio)
0.00049
0.00078
0.00164
0.00168
0.00233
0.00363
0.00551
0.00659
0.00779
0.00871
0.01025
0.01124
0.01078
0.00884
0.00548
0.00384
ANGLE
(deg)
−
92.64
−
91.63
−
108.6
−
119.4
−
113.0
−
129.6
−
140.5
−
151.4
−
163.4
−
176.5
172.8
160.7
146.8
131.1
123.8
160.7
s
22
MAGNITUDE
(ratio)
0.32715
0.32763
0.33688
0.36332
0.39884
0.44177
0.47449
0.48300
0.46932
0.43106
0.37882
0.31996
0.26441
0.22542
0.18502
0.12693
ANGLE
(deg)
−
3.589
−
2.304
−
1.542
−
1.800
−
3.931
−
8.067
−
14.54
−
21.47
−
28.10
−
34.03
−
38.74
−
41.11
−
40.43
−
37.88
−
38.37
−
37.56
2010 Sep 13 7
NXP Semiconductors
MMIC wideband amplifier
PACKAGE OUTLINE
Plastic surface-mounted package; 6 leads
D B
Product specification
BGA2748
E A X
SOT363 y HE v M A
6 5 4
Q pin 1 index
1 e1 e
2 bp
3 w M B
A
A1 c detail X
Lp
0 1 scale
2 mm
DIMENSIONS (mm are the original dimensions)
UNIT A
A1 max bp c D mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
E
1.35
1.15
e
1.3
e
1
0.65
HE
2.2
2.0
Lp
0.45
0.15
Q
0.25
0.15
v
0.2
w
0.2
y
0.1
OUTLINE
VERSION
SOT363
IEC
REFERENCES
JEDEC JEITA
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
2010 Sep 13 8
NXP Semiconductors
MMIC wideband amplifier
Product specification
BGA2748
DATA SHEET STATUS
DOCUMENT
Objective data sheet
PRODUCT
STATUS
DEFINITION
Development This document contains data from the objective specification for product development.
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary data sheet
Product data sheet
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
Limited warranty and liability
⎯
Information in this document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes
⎯
NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use
⎯
NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications
⎯
Applications that are described herein for any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Customers are responsible for the design and operation of their applications and products using NXP
Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.
2010 Sep 13 9
NXP Semiconductors
MMIC wideband amplifier
Product specification
BGA2748
Limiting values
⎯
Stress above one or more limiting values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.
Terms and conditions of commercial sale
⎯
NXP
Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.
No offer to sell or license
⎯
Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Export control
⎯
This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
Quick reference data
⎯
The Quick reference data is an extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products
⎯
Unless this data sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
2010 Sep 13 10
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for the marking codes and the package outline drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [email protected]
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands R77/04/pp11 Date of release: 2010 Sep 13
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