ST SPSGRF Datasheet
Reklama
Reklama
SPSGRF
Sub-GHz (868 or 915 MHz) low power programmable RF transceiver modules
Datasheet
-
production data
Certification:
– CE (SPSGRF-868)
– FCC (SPSGRF-915)
– IC (SPSGRF-915)
Features
Programmable radio features
– Based on Sub-1GHz SPIRIT1 transceiver and integrated Balun (BALF-SPI-01D3)
– Modulation schemes: 2-FSK, GFSK, MSK,
GMSK, OOk, ASK
– Air data rate from 1 to 500 kbps
– On-board antenna
– Operating temperature range from -40 °C to 85 °C
RF features
– Receiver sensitivity: -118 dBm
– Programmable RF output power up to
+11.6 dBm
Host interface
– SPI
General I/O
– Up to 32 programmable I/O functions on 4
GPIO programmable module pins
Two typical carrier frequency versions:
– SPSGRF-868 with 868 MHz tuned antenna
– SPSGRF-915 with 915 MHz tuned antenna
Applications
AMR (automatic meter reading)
Home and building automation
WSN (wireless sensor network)
Industrial monitoring and control
Wireless fire and security alarm systems
Point-to-point wireless link
Description
The SPSGRF-868 and SPSGRF-915 are easy-touse, low power sub-GHz modules based on the
SPIRIT1 RF transceiver, operating respectively in the 868 MHz SRD and 915 MHz ISM bands.
The modules provide a complete RF platform in a tiny form factor.
The SPSGRF series enables wireless connectivity in electronic devices, requiring no RF experience or expertise for integration into the final product. As an FCC, IC, and CE certified solution, the SPSGRF series optimizes the timeto-market of end applications. The SPSGRF-915 is an FCC certified module (FCC ID:
S9NSPSGRF) and IC certified (IC 8976C-
SPSGRF), while the SPSGRF-868 is certified CE.
The modules are designed for maximum performance in minimal space and include 4 programmable I/O pins and SPI serial interfaces.
October 2017
This is information on a product in full production.
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Contents
Contents
6
SPSGRF
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
SPSGRF module functional behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Hardware specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.3
Module current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.4
Module RF compliance limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.5
SPSGRF module RF typical performance . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.6
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.1
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.1
FCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.1.1
6.1.2
Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2
IC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2.1
6.2.2
Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.3
CE certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Module traceability and marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
ECOPACK ® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
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SPSGRF
Figure 1. SPSGRF block diagram
Block diagram
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SPSGRF module functional behavior
2 SPSGRF module functional behavior
SPSGRF
The SPIRIT1 device in the SPSGRF module is equipped with a built-in main controller which controls the switching between the two main operating modes: transmit (TX) and receive
(RX).
In shutdown condition, the SPSGRF module can be switched on/off with the external SDN pin; all other functions/registers/commands are available through the SPI interface and
GPIOs. No internal supply is generated (in order to minimize battery leakage), and therefore all stored data and configurations are lost.
The GPIO and SPI ports of the module during shutdown are in HiZ. From the SHUTDOWN state, the SPSGRF module can be switched on from the SDN pin and goes into a READY state, which is the default, where the reference signal from XO is available.
From the READY state, the SPSGRF module can be moved to a LOCK state to generate the high precision LO signal and/or TX or RX modes. Switching from RX to TX and viceversa can occur only by passing through the LOCK state. This operation is normally managed by radio control with a single user command (TX or RX).
At the end of the events above, the SPSGRF module can return to its default state (READY) and can then be put into a sleep condition (SLEEP state), characterized by very low power consumption.
If no timeout is required, the SPSGRF module can be moved from READY to STANDBY state, which has the lowest possible current consumption while retaining FIFO, status and configuration registers. To manage the transitions towards and between these operating modes, the controller works as a state machine, the state switching of which is driven by SPI commands.
Figure 2. Module functional state transitions diagram
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SPSGRF Hardware specifications
3.1
3.2
3.3
Absolute maximum ratings
General conditions (V
IN
= 3.3 V and 25 °C)
Rating
Storage temperature range
Supply voltage, V
IN
I/O pin voltage
RF saturation input power
Table 1. Absolute maximum ratings
Min.
Typ.
Max.
-40
-0.3
-0.3
+10
+85
3.9
3.9
Recommended operating conditions
Rating
Table 2. Recommended operating conditions
Min.
Typ.
Max.
Operating temperature range
Supply voltage, V
IN
Signals & I/O pin voltage (according supply voltage)
RF frequency bandwidth
(SPSGRF-868)
RF frequency bandwidth
(SPSGRF-915)
-40
1.8
1.8
863
902
3.3
+85
3.6
3.6
870
928
Module current consumption
Symbol
I
DD
Parameter
Table 3. SPSGRF-868 module
Test conditions
Supply current
Operating mode
Tx, +11.6 dBm, 2-FSK, 868 MHz
Operating mode
Tx, - 7 dBm, 2-FSK, 868 MHz
Operating mode Rx, 868MHz
Command mode
Shutdown high level -V
DD
(with other I/O in High impedance)
Typ.
22
9
10
0.6
0.1
Unit
°C
V
V dBm
Unit
°C
V
V
MHz
MHz
Unit mA mA mA mA
μ A
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Hardware specifications
3.4
SPSGRF
Symbol
I
DD
Parameter
Table 4. SPSGRF-915 module
Test conditions
Supply current
Operating mode
Tx, +11.6 dBm, 2-FSK, 915 MHz
Operating mode
Tx, - 7 dBm, 2-FSK, 915 MHz
Operating mode Rx, 915 MHz
Command mode
Shutdown high level -V
DD
(with other I/O in high impedance)
Typ.
22
9
10
0.6
0.1
Module RF compliance limits
The RF compliance limits are those tested for FCC, IC and CE certification using the dedicated dongle (PC92A.V01). These limits are enforced by the dongle firmware. Care must be taken with custom application firmware to ensure these limits are not exceeded, voiding the FCC, IC and CE certification.
Modulation
Table 5. RF compliance limits table
Standards Parameter Max.
Unit
2-FSK
GFSK
MSK
FCC Part 15.207
(1)
FCC Part 15.247 (1)
IC RSS-210
EN 300 220-2 V2.4.1
(2)
EN 301 489-01 V1.9.2 (2)
EN 301 489-03 V1.4.1
(2)
Data rate
Output power
500
+11.6
kbps dBm
OOK
ASK
FCC Part 15.207
(1)
FCC Part 15.247
(1)
IC RSS-210
EN 300 220-2 V2.4.1
(2)
EN 301 489-01 V1.9.2 (2)
EN 301 489-03 V1.4.1
(2)
Data rate
Output power
1. FCC and IC standards are applicable only to the SPSGRF-915 module.
2. EN standards are applicable only to the SPSGRF-868 module.
250
+6 kbps dBm
Unit mA mA mA mA
μ A
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SPSGRF
3.5
Hardware specifications
SPSGRF module RF typical performance
The RF performance of the SPSGRF-868 and SPSGRF-915 modules are dependent on many factors, related to the customer hardware application board where the module is connected and also to the customer application firmware. In order to provide some basic information to the customer integrating the module, it may be useful to provide the RF measurements taken in an anechoic chamber using a dongle containing a connected
SPSGRF-868 or SPSGRF-915 module.
Symbol
Table 6. SPSGRF-868 or 915 modules radiated typical performance
Parameter Test conditions Typ.
Unit
Tx RF power
RF radiated power
Operating mode
Tx, +11.6 dBm, 2-FSK, 868,0-868,6 MHz
Operating mode
Tx, +11.6 dBm, 2-FSK, 902-928 MHz
+5.3
+2.2
dBm dBm
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Hardware specifications SPSGRF
Table 7. SPSGRF-868 or 915 module conducted typical performance before the RF antenna circuits (positive RF power signal values measured)
Parameter Test conditions (1)
Conducted programmable value
Measured conducted value Typ.
Unit
Tx RF conducted power
(before the antenna circuits)
Tx, +11.6 dBm, 2-FSK, 868 MHz
Tx, +11.6 dBm, 2-FSK, 915 MHz
Tx, +11 dBm, 2-FSK, 868 MHz
Tx, +11 dBm, 2-FSK, 915 MHz
Tx, +10 dBm, 2-FSK, 868 MHz
Tx, +10 dBm, 2-FSK, 915 MHz
Tx, +9 dBm, 2-FSK, 868 MHz
Tx, +9 dBm, 2-FSK, 915 MHz
Tx, +8 dBm, 2-FSK, 868 MHz
Tx, +8 dBm, 2-FSK, 915 MHz
Tx, +7 dBm, 2-FSK, 868 MHz
Tx, +7 dBm, 2-FSK, 915 MHz
Tx, +6 dBm, 2-FSK, 868 MHz
Tx, +6 dBm, 2-FSK, 915 MHz
Tx, +5 dBm, 2-FSK, 868 MHz
Tx, +5 dBm, 2-FSK, 915 MHz
Tx, +4 dBm, 2-FSK, 868 MHz
Tx, +4 dBm, 2-FSK, 915 MHz
Tx, +3 dBm, 2-FSK, 868 MHz
Tx, +3 dBm, 2-FSK, 915 MHz
Tx, +2 dBm, 2-FSK, 868 MHz
Tx, +2 dBm, 2-FSK, 915 MHz
Tx, +1 dBm, 2-FSK, 868 MHz
Tx, +1 dBm, 2-FSK, 915 MHz
Tx, +0 dBm, 2-FSK, 868 MHz
Tx, +0 dBm, 2-FSK, 915 MHz
+11.6
+11.0
+10.0
+9.0
+8.0
+7.0
+6.0
+5.0
+4.0
+3.0
+2.0
+1.0
+0.0
+11.2
+10.8
+9.7
+8.5
+7.6
+7.2
+6.2
+5.4
+4.0
+3.1
+2.1
+1.2
+0.6
dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm
1. Operating mode
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SPSGRF Hardware specifications
Table 8. SPSGRF-868 or 915 module conducted typical performance before the RF antenna circuits (negative RF power signal values measured)
Parameter Test conditions (1)
Conducted programmable value
Measured conducted value Typ.
Unit
Tx RF conducted power
(before the antennas circuits)
Tx, -1 dBm, 2-FSK, 868 MHz
Tx, -1 dBm, 2-FSK, 915 MHz
Tx, -2 dBm, 2-FSK, 868 MHz
Tx, -2 dBm, 2-FSK, 915 MHz
Tx, -3 dBm, 2-FSK, 868 MHz
Tx, -3 dBm, 2-FSK, 915 MHz
Tx, -4 dBm, 2-FSK, 868 MHz
Tx, -4 dBm, 2-FSK, 915 MHz
Tx, -5 dBm, 2-FSK, 868 MHz
Tx, -5 dBm, 2-FSK, 915 MHz
Tx, -6 dBm, 2-FSK, 868 MHz
Tx, -6 dBm, 2-FSK, 915 MHz
Tx, -7 dBm, 2-FSK, 868 MHz
Tx, -7 dBm, 2-FSK, 915 MHz
Tx, -8 dBm, 2-FSK, 868 MHz
Tx, -8 dBm, 2-FSK, 915 MHz
Tx, -9 dBm, 2-FSK, 868 MHz
Tx, -9 dBm, 2-FSK, 915 MHz
Tx, -10 dBm, 2-FSK, 868 MHz
Tx, -10 dBm, 2-FSK, 915 MHz
Tx, -15 dBm, 2-FSK, 868 MHz
Tx, -15 dBm, 2-FSK, 915 MHz
Tx, -20 dBm, 2-FSK, 868 MHz
Tx, -20 dBm, 2-FSK, 915 MHz
Tx, -25 dBm, 2-FSK, 868 MHz
Tx, -25 dBm, 2-FSK, 915 MHz
Tx, -30 dBm, 2-FSK, 868 MHz
Tx, -30 dBm, 2-FSK, 915 MHz
Tx, -35 dBm, 2-FSK, 868 MHz
Tx, -35 dBm, 2-FSK, 915 MHz
-1.0
-2.0
-3.0
-4.0
-5.0
-6.0
-7.0
-8.0
-9.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-1.1
-2.3
-3.4
-4.9
-5.8
-6.9
-6.5
-7.3
-8.2
-9.7
-14.6
-19.2
-23.3
-26.2
-27.8
dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm
1. Operating mode
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24
Hardware specifications
Figure 3. Pin connection diagram
SPSGRF
Name
V in
GND
SDN
GPIO [0]
Type Pin#
SPI_CLK I
SPI_MISO O
SPI_MOSI I
SPI_CS I
I
I/O
5
6
7
8
9
10
11
4
Table 9. Pin assignment
Description
Alt function
V max. tolerance
SPI interface
SPI CLOCK (Max. 8 MHz)
SPI MISO (MASTER in / SLAVE out)
SPI MOSI (MASTER out SLAVE in)
SPI “Chip Select” (SPI slave select)
Power and ground
V in
GND
V
V
V
V in in in in
(1.8V - 3.6V max.)
Module shutdown
Shutdown input (active high) (1.8V - 3.6V max.)
GPIO - general purpose input/output
Programmable input / output & analog temperature output
(1.8V - V in
max.)
GPIO [1]
GPIO [2]
GPIO [3]
I/O
I/O
I/O
3
2
1
Programmable input / output
Programmable input / output
Programmable input / output
(1.8V - V in
max.)
(1.8V - V in
max.)
(1.8V - V in
max.)
Initial state
Digital output.
Low power
Digital output.
Low power
Digital output.
Low power
Digital output.
Low power
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SPSGRF
Figure 4. Mechanical dimensions
Mechanical dimensions
Figure 5. Recommended land pattern
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Hardware design SPSGRF
Note:
The SPSGRF module supports SPI hardware interfaces.
- All unused pins should be left floating; do not ground.
- All GND pins must be well grounded.
- The area around the module should be free of any ground planes, power planes, trace routings, or metal for 6 mm from the module antenna position, in all directions.
- Traces should not be routed underneath the module
The SPSGRF is a surface mount sub-1 GHz transceiver module supplied on an 11 pin, 4layer PCB. The final assembly recommended reflow profiles are indicated below.
The soldering phase must be executed with care. In order to avoid an undesired melting phenomenon, particular attention should be given to the setup of the peak temperature.
Table 10 provides suggestions for the temperature profile based on IPC/JEDEC J-STD-
020C, July 2004 recommendations.
Table 10. Soldering recommendations
Profile feature PB-free assembly
Average ramp up rate (T
SMAX
to T p
)
Preheat
3°C/ sec max
Temperature min (T
S
min)
Temperature max (T
S
max)
Time (t
S
min to t
S
max) (t
S
)
Time maintained above:
150 °C
200 °C
60-100 sec
Temperature T
L
Time t
L
Peak temperature (T
P
)
217 °C
60-70 sec
240 + 0 °C
Time within 5 °C of actual peak temperature (t
P
) 10-20 sec
Ramp down rate 6 °C/sec
Time from 25 °C to peak temperature 8 minutes max
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SPSGRF
Figure 6. Soldering profile
Hardware design
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Regulatory compliance SPSGRF
14/24
The SPSGRF-915 module has been tested and found compliant with the FCC part 15 rules.
These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Modifications or changes to this equipment not expressly approved by STMicroelectronics may render void the user's authority to operate this equipment.
Modular approval
FCC ID: S9NSPSGRF
In accordance with FCC part 15, the SPSGRF-915 is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple transmitters must comply with collocation and RF exposure requirements in accordance with FCC multi-transmitter product procedures. Collocated transmitters operating in portable
RF exposure conditions (e.g. <20 cm from persons including but not limited to body worn and hand-held devices) may require separate approval.
When integrating the SPSGRF-915 into the final product, the OEM must ensure that the
FCC labeling requirements are satisfied. A statement must be included on the exterior of the final product which indicates that the product includes a certified module. The label should state the following (or similar wording that conveys the same meaning):
OR
Contains FCC ID: S9NSPSGRF
This product contains FCC ID: S9NSPSGRF
The OEM must include the following statements on the exterior of the final product unless the product is too small (e.g. less than 4 x 4 inches):
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
1. this device may not cause harmful interference
2. this device must accept any interference received, including any interference that may cause undesired operation.
DocID027664 Rev 6
SPSGRF
6.1.2
Regulatory compliance
Product manual instructions
This section applies to OEM final products containing the SPSGRF-915 module, subject to
FCC compliance. The final product manual must contain the following statement (or a similar statement that conveys the same meaning):
“Warning: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. (Part. 15.21)”
In the case where an OEM seeks Class B (residential) limits for the final product, the following statement must be included in the final product manual:
“Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
– Reorient or relocate the receiving antenna.
– Increase the separation between the equipment and receiver.
– Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
– Consult the dealer or an experienced radio/TV technician for help.”
In the case where an OEM seeks the lesser category of a Class A digital device for the final product, the following statement must be included in the final product manual:
“Note: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his expense.”
The SPSGRF-915 module has been tested and found compliant with the IC RSS-210 rules.
These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with RSS-210 of the IC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
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Regulatory compliance SPSGRF
Modifications or changes to this equipment not expressly approved by STMicroelectronics may render void the user's authority to operate this equipment.
Modular approval
IC: 8976C-SPSGRF
In accordance with IC RSS-210, the SPSGRF-915 is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple transmitters must comply with collocation and RF exposure requirements in accordance with IC multi-transmitter product procedures. Collocated transmitters operating in portable
RF exposure conditions (e.g. <20 cm from persons including but not limited to body worn and hand-held devices) may require separate approval.
6.2.2
When integrating the SPSGRF-915 into the final product, the OEM must ensure that the IC labeling requirements are satisfied. A statement must be included on the exterior of the final product which indicates that the product includes a certified module. The label should state the following (or similar wording that conveys the same meaning):
OR
Contains IC ID: 8976C-SPSGRF
This product contains IC ID: 8976C-SPSGRF
The OEM must include the following statements on the exterior of the final product unless the product is too small (e.g. less than 4 x 4 inches):
“This device complies with RSS-210 of the IC Rules. Operation is subject to the following two conditions:
1.
this device may not cause harmful interference
2. this device must accept any interference received, including any interference that may cause undesired operation.”
Product manual instructions
This section applies to OEM final products containing the SPSGRF-915 module, subject to
IC compliance. The final product manual must contain the following statement (or a similar statement that conveys the same meaning):
“Warning: Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. (RSS-210)”
In the case where an OEM seeks Class B (residential) limits for the final product, the following statement must be included in the final product manual:
“Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or
16/24 DocID027664 Rev 6
SPSGRF Regulatory compliance television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
– Reorient or relocate the receiving antenna.
– Increase the separation between the equipment and receiver.
– Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
– Consult the dealer or an experienced radio/TV technician for help.”
In the case where an OEM seeks the lesser category of a Class A digital device for the final product, the following statement must be included in the final product manual:
“Note: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his expense.”
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Regulatory compliance
The module has been certified according to the following certification rules:
EN 300 328 V 2.1.1 (2016-11)
(a)
ETSI EN 301 489-17 V3.1.1 (2017-02)
(b)
ETSI EN 301 489-1 V2.1.1 (2017-02)
(c)
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013
(d)
EN 62479:2010
The module is provided by CE marking:
SPSGRF
The SPSGRF-868 module has obtained the RED certificate: No. 0051-RED-0024 REV. 0
The certified module test platform is based on STSW-SP1ML868AT production firmware release: 1.X
For additional information please refer to:
STMicroelectronics Via C. Olivetti 2, Agrate Brianza 20864 (ITALY)
18/24 a. EN 300 328 V 2.1.1 (2016 11): “electromagnetic compatibility and radio spectrum Matters (ERM); Wideband transmission systems; data transmission equipment operating in the 2.4 GHZ ISM band and using wideband modulation techniques; harmonized EN covering essential requirements under article 3.2 of the R&TTE directive”.
b. EN 301 489-17 V 3.1.1 (2017 02): “electromagnetic compatibility and radio spectrum Matters (ERM); electromagnetic compatibility (EMC) standard for radio equipment and services; part 17: specific condition for
2.4 GHz wideband transmission systems and 5 GHz high performance RLAN equipment”.
c. ETSI EN 301 489-1 V2.1.1 (2017 02): “electromagnetic compatibility and radio spectrum Matters (ERM); electromagnetic compatibility (EMC) standard for radio equipment and services; part 1: Common technical requirements”.
d. EN60950-1:2006 +A11:2009+A1:2010+A12:2011+A2:2013: “Information technology equipment - safety”.
DocID027664 Rev 6
SPSGRF
7 Module traceability and marking
Module traceability and marking
The SPSGRF bottom-side label contains the following information:
Model: “MODEL: SPSGRF-915” indicating the SPSGRF RF module family
FCC USA Certification Identification number: “FCCID:S9NSPSGRF”. This code is valid only for 915 MHz frequency band
IC Canada certification number: “IC: 8976C-SPSGRF”. This code is used only for the
Canadian market
2D laser data matrix
Figure 7. SPSGRF bottom side
Each module is univocally identified by serial number stored in a 2D laser data matrix marked on the bottom of the module.
The figure below shows the standard bottom-side QR-code laser marking.
Figure 8. SPSGRF QR-code laser marking
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Module traceability and marking
The serial number has the following format: WW YY K PP NNN where:
WW - Week
YY - Year
K - Product ID (refer to Table 11 below)
PP - internal ST use only
NNN - internal ST use only
K
W
X
Table 11. Module Product ID
Product family identification
SPSGRF-868
SPSGRF-915
SPSGRF
Each module bulk package is identified by a bulk ID.
The Bulk ID and module 2D data matrix are linked by a reciprocal traceability link.
The module 2D data matrix traces the lot number of any raw material used.
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SPSGRF Ordering information
Order code
Table 12. Ordering information
Description Packing
SPSGRF-868 868 MHz SPIRIT1 transceiver module (Region 1, Europe) JEDEC tray
SPSGRF-915 915 MHz SPIRIT1 transceiver module (Region 2, The Americas) JEDEC tray
MOQ
2448 pcs
2448 pcs
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ECOPACK
®
9 ECOPACK
®
SPSGRF
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
®
22/24 DocID027664 Rev 6
SPSGRF Revision history
Date
31-Mar-2015
14-Apr-2015
22-May-2015
29-Jun-2016
17-Oct-2016
04-Oct-2017
Table 13. Document revision history
Revision Changes
1
2
3
4
5
6
Initial release.
Updated Features and Description in cover page.
Updated Description in cover page.
– Added marking and module identification details in
Section 7: Module traceability and marking .
– Updated Figure 5: Recommended land pattern
Corrected typographical error in part number SPSGRF-
915 in the Features and Description sections of the coverpage.
Updated Section 6.3: CE certification
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SPSGRF
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2017 STMicroelectronics – All rights reserved
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:
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