A1
A2
K
A2
A1
D2PAK
STPS40L45CG
K
A1K
A2
TO-220AB
STPS40L45CT
A1
K
A2
TO-247
STPS40L45CW
Features
Low forward voltage drop meaning very small conduction losses
Low switching losses allowing high frequency operation
Avalanche capability specified
STPS40L45C
Low drop power Schottky rectifier
Datasheet
-
production data
Description
Dual center tap Schottky barrier rectifier designed for high frequency switched mode power supplies and DC to DC converters.
Packaged in TO-220AB, TO-247 and D
2
PAK these devices are intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications.
Table 1. Device summary
I
F(AV)
V
RRM
T j
(max)
V
F
(max)
2 x 20 A
45 V
150° C
0.49 V
October 2013
This is information on a product in full production.
DocID6857 Rev 5 1/11 www.st.com
Characteristics
1 Characteristics
STPS40L45C
Symbol
Table 2. Absolute Ratings (limiting values, per diode)
Parameter
V
RRM
I
F(RMS)
Repetitive peak reverse voltage
Forward rms current
I
F(AV)
Average forward current
T c
=130° C
= 0.5
Per diode
Per device
I
FSM
I
RRM
I
RSM
P
ARM
Surge non repetitive forward current t p
= 10 ms Sinusoidal
Repetitive peak reverse current t p
= 2 µs square F = 1 kHz
Non repetitive peak reverse current t p
= 100 µs square
Repetitive peak avalanche power t p
= 1 µs T j
= 25° C
T stg
T j
Storage temperature range
Maximum operating junction temperature dV/dt Critical rate of rise of reverse voltage
(1)
1.
dTj
– a
condition to avoid thermal runaway for a diode on its own heatsink
Value Unit
45
30
20
40
V
A
A
220
2
3
8100 W
-65 to + 150 °C
150
10000
°C
V/µs
A
A
A
Symbol
R th (j-c)
Junction to case
R th(c)
Coupling
Table 3. Thermal resistances
Parameter
Per diode
Total
Value
1.5
0.8
0.1
Unit
°C/W
°C/W
When the diodes 1 and 2 are used simultaneously:
T j
(diode 1) = P(diode1) x R th(j-c)
(Per diode) + P(diode2) x R th(c)
.
Table 4. Static electrical characteristics (per diode)
Parameter Test Conditions Min.
Typ.
Max.
Unit Symbol
I
R
(1)
Reverse leakage current
T j
= 25° C
T j
= 125° C
T j
= 25° C
V
R
= V
RRM
I
F
= 20 A
V
F
(
1.
)
Forward voltage drop
T j
= 125° C
T j
= 25° C
I
F
= 20 A
I
F
= 40 A
T j
= 125° C I
F
= 40 A
1.
Pulse test: t p
= 380 µs,
< 2%
To evaluate the conduction losses use the following equation:
P = 0.28 x I
F(AV)
+ 0.0105 I
F
2
(RMS)
140
0.6
mA
280 mA
0.53
0.42
0.49
0.69
0.6
0.7
V
2/11 DocID6857 Rev 5
STPS40L45C Characteristics
Figure 1. Average forward power dissipation versus average forward current (per diode)
PF(av)(W)
16
14
12
10
8
δ
= 0.05
δ
= 0.1
δ
= 0.2
δ
= 0.5
δ
= 1
6
4
T
2
IF(av) (A)
δ =tp/T tp
0
0 2 4 6 8 10 12 14 16 18 20 22 24
Figure 2. Average forward current versus ambient temperature (
= 0.5, per diode)
22
20
18
16
14
12
10
8
6
4
2
0
0
IF(av)(A)
δ
=tp/T
T
25 tp
Rth(j-a)=Rth(j-c)
Rth(j-a)=15°C/W
50
Tamb(°C)
75 100 125 150
Figure 3. Normalized avalanche power derating versus pulse duration
Figure 4. Normalized avalanche power derating versus junction temperature
1
P
P
ARM (tp)
ARM
(1 µs)
1.2
P
ARM (Tj)
P
ARM
(25 °C)
0.1
0.01
0.001
0.01
0.1
1 10 100 1000
1
0.8
0.6
0.4
0.2
0
25 50 75 100 125 150
Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values, per diode)
IM(A)
250
225
200
175
150
125
100
75
50
25
0
1E-3
I M t
δ
=0.5
1E-2 t(s)
1E-1
Tc=25°C
Tc=75°C
Tc=125°C
1E+0
Figure 6. Relative variation of thermal impedance junction to case versus pulse
1.0
Zth(j-c)/Rth(j-c)
0.8
0.6
δ
= 0.5
0.4
δ = 0.2
δ
= 0.1
0.2
Single pulse
0.0
1E-4
1E-3 duration tp(s)
1E-2
δ
=tp/T
1E-1
T tp
1E+0
DocID6857 Rev 5 3/11
11
Characteristics STPS40L45C
Figure 7. Reverse leakage current versus reverse voltage applied (typical values, per diode)
1E+3
IR(mA)
Tj=150°C
1E+2
Tj=125°C
1E+1
Tj=75°C
1E+0
Figure 8. Junction capacitance versus reverse voltage applied (typical values, per diode)
10.0
C(nF)
1.0
F=1MHz
Tj=25°C
1E-1 Tj=25°C
VR(V)
5 10 15 20 25 30 35 40 45
0.1
1
VR(V)
10 100
1E-2
0
Figure 9. Forward voltage drop versus forward current (maximum values, per diode)
Figure 10. Thermal resistance junction to ambient versus copper surface under tab
1000
100
IFM(A)
Typical values
Tj=150°C
Tj=125°C
10
Tj=75°C
Tj=25°C
VFM(V)
1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
80
70
60
50
40
30
20
10
0
0
Rth(j-a) (°C/W)
5 10
Epoxy printed circuit board FR4, copper thickness: 35 µm
15
S(Cu) (cm²)
20 25 30 35 40
4/11 DocID6857 Rev 5
STPS40L45C Package Information
Epoxy meets UL94,V0
Cooling method: by conduction (C)
Recommended torque value: 0.4 to 0.6 N·m (TO-220AB)
Recommended torque value: 0.55, 1.0 N·m maximum (TO-247)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
® specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 11. TO-220AB dimension definitions
E
∅ P F
A
Resin gate
0.5 mm max.
protrusion(1)
Q
L20
D D1
L30 b1 L1
J1
L b e
Resin gate
0.5 mm max.
protrusion(1) e1
(1) Resin gate position accepted in each of the two position shown as well as the symmetrical opposites c
H1
DocID6857 Rev 5 5/11
11
Package Information
Ref.
J1
L
L1
L20
L30
P
Q c
D
D1
E e e1
F
H1
A b b1
STPS40L45C
10
2.40
4.95
1.23
6.20
2.40
13
3.50
Min.
4.40
0.61
1.14
0.48
15.25
Table 5. TO-220AB dimension values
Dimensions
Millimeters
Max.
4.60
0.88
1.70
0.70
15.75
Min.
0.17
0.024
0.045
0.019
0.60
1.27 typ.
10.40
2.70
5.15
1.32
6.60
2.72
14
3.93
0.39
0.094
0.19
0.048
0.24
0.094
0.51
0.137
16.40 typ.
28.90 typ.
3.75
2.65
3.85
2.95
0.147
0.104
Inches
0.05 typ.
0.64 typ.
1.13 typ.
0.41
0.106
0.20
0.052
0.26
0.107
0.55
0.154
Max.
0.18
0.035
0.067
0.027
0.62
0.151
0.116
6/11 DocID6857 Rev 5
STPS40L45C
Ref.
G
L
D
E
B2
C
C2
L2
L3
M
R
V2
A
A1
A2
B
Figure 12. D
2
PAK dimension definitions
Package Information
A
E
C2
L2
D
L
L3
A1
B2
B
C R
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
Min.
4.40
2.49
0.03
0.70
1.14
0.45
1.23
8.95
10.00
4.88
15.00
1.27
1.30
2.29
Table 6. D
2
PAK dimension values
Dimensions
Millimeters
Max.
4.60
2.69
0.23
0.93
1.70
0.60
1.36
9.35
10.40
5.28
15.85
1.40
1.75
2.79
Min.
0.173
0.098
0.001
0.027
0.045
0.017
0.048
0.352
0.393
0.192
0.590
0.050
0.051
0.090
0.40 typ.
0° 8° 0°
Inches
0.016 typ.
Max.
0.181
0.106
0.009
0.037
0.067
0.024
0.054
0.368
0.409
0.208
0.624
0.055
0.069
0.110
8°
DocID6857 Rev 5 7/11
11
Package Information
Figure 13. D
2
PAK footprint (dimensions in mm)
16.90
STPS40L45C
12.2
2.54
1.60
5.08
3.50
9.75
Figure 14. TO-247 dimension definitions
E
D
S ∅ R
L
L1
1 2 b1
3 b2 b e
L2
A1
A
Heat-sink plane
∅ P c
3 2 1
BACK VIEW
8/11 DocID6857 Rev 5
STPS40L45C Package Information
Table 7. TO-247 dimension values
Dimensions
Millimeters Ref.
Min.
Typ.
Max.
Min.
A
A1 b b1 b2 c
D
(1)
E
4.85
2.20
1.00
2.00
3.00
0.40
19.85
15.45
5.15
2.60
1.40
2.40
3.40
0.80
20.15
15.75
e
L
L1
5.30
14.20
3.70
5.45
5.60
14.80
4.30
0.209
0.559
0.145
L2
P
(2)
R
S
3.55
4.50
18.50 typ.
3.65
5.50
5.30
5.50
5.70
1.
Dimension D plus gate protrusion does not exceed 20.5 mm
2.
Resin thickness around the mounting hole is not less than 0.9 mm
0.139
0.177
0.209
0.191
0.086
0.039
0.078
0.118
0.015
0.781
0.608
Inches
Typ
0.215
0.728 typ.
0.216
0.143
0.217
0.224
Max.
0.203
0.102
0.055
0.094
0.133
0.031
0.793
0.620
0.220
0.582
0.169
DocID6857 Rev 5 9/11
11
Ordering Information STPS40L45C
Order code
STPS40L45CG
STPS40L45CT
STPS40L45CW
Table 8. Ordering information
Marking
STPS40L45CG
Package
D
2
PAK
Weight Base qty Delivery mode
1.8g
500 Tape and reel
STPS40L45CT
STPS40L45CW
TO-220AB
TO-247
2g
4.4g
50
30
Tube
Tube
Date
Jul-2003
30-Oct-2013
Table 9. Document revision history
Revision Description of Changes
4A
5
Previous version
Updated Package information section
10/11 DocID6857 Rev 5
STPS40L45C
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