STMicroelectronics STEVAL-BFA001V2B User Manual
โฆษณา
โฆษณา
UM2663
User manual
Multi-sensor predictive maintenance kit with IO-Link device stack
Introduction
The STEVAL-BFA001V2B is an industrial reference design kit for condition monitoring (CM) and predictive maintenance (PdM).
The hardware consists of a highly compact (50 x 9 x 9 mm) industrial sensor board specifically designed for real industrial applications, and the necessary debugging tools, cables, plugs and adapters for an industrial communications scenario. The connection is managed using a standard multipolar cable with one wire used for IO-Link data.
The layout is designed to meet IEC61000-4-2/4 and EN60947 requirements for industrial applications.
The STSW-BFA001V2 firmware package (freely available on www.st.com
) includes dedicated algorithms for advanced time and frequency domain signal processing and analysis of the high bandwidth 3D digital accelerometer for vibration monitoring.
The package includes pressure, relative humidity and temperature sensor monitoring samples as well as audio algorithms for acoustic emission (AE).
The firmware runs on the high performance STM32F469AI , ARM ® Cortex ® -M4, 32-bit microcontroller. The sensor data analysis results can be displayed on a user PC terminal emulator via wired connectivity or the related IO-Link master board interface.
IO-Link device stack v1.1. (for evaluation purposes, with some limitations) is included in object library format with IO-Link Device
Descriptor (IODD) for all measurements and with dedicated examples to demonstrate device interoperability with any master tool. It supports BLOB transfer for vibration and acoustic FFT data, event generator and parameter configuration.
The package includes a GUI to demonstrate the IO-Link device features when connected to the STEVAL-IDP004V2 multi-port master evaluation board or to the P-NUCLEO-IOM01M1 STM32 Nucleo pack.
Figure 1. STEVAL-BFA001V2B predictive maintenance reference kit
UM2663 - Rev 3 - February 2021
For further information contact your local STMicroelectronics sales office.
www.st.com
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1.1
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Features
Features
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Kit content:
– Sensor node (marked STEVAL-IDP005V2; not available for separate sale)
– Communication adapter board (marked STEVAL-UKI001V2; not available for separate sale)
– STLINK-V3MINI programming and debugging interface
– Cables and connector
Main supply voltage: 18 - 32 V
Main components of the sensor node:
– 32-bit ARM ® Cortex ® -M4 core for signal processing and analysis ( STM32F469AI )
– Ultra-wide bandwidth (up to 6kHz), low-noise, 3-axis digital vibration sensor ( IIS3DWB )
– Absolute digital pressure sensor ( LPS22HB )
– Relative humidity and temperature sensors ( HTS221 )
– Digital microphone sensors ( IMP34DT05 )
– IO-Link PHY device ( L6362A )
– EEPROM ( M95M01-DF ) for data storage
– Step-down switching regulator and LDO regulator ( L6984 and LDK220 )
– ESD protection ( ESDALC6V1-1U2 , SMBJ33CA )
Complete set of firmware demo examples based on 3D accelerometer library with advanced frequency and time domain signal processing for predictive maintenance, including:
– Programmable FFT size (256, 512, 1024, 2048), overlapping and averaging
– Programmable windowing (Flat Top, Hanning, Hamming, Rectangular)
– Speed RMS moving average, acceleration max. peak
– Programmable threshold for warning and alarm conditions in spectral band
Microphone algorithms for:
– PDM to PCM
– Sound pressure level (SPL)
– Audio FFT
IO-Link device stack v1.1 protocol and IO-Link Device Descriptor (IODD) for all measurements included
(provided by TEConcept GmbH)
M12 standard industrial connector
SWD connector for debugging and programming capability
Reset button
Expansion connector with GPIO, ADC, I²C bus, timer
Designed to meet IEC industrial standard requirements
RELATED LINKS
Visit the STEVAL-BFA001V2B web page for the most up to date resources and reference material
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Package components
One STEVAL-IDP005V2
sensor node reference design (10 x 50 mm).
One adapter for ST-LINK programming and debugging tool - STEVAL-UKI001V2.
STLINK-V3MINI debugger/programmer for STM32 and STDC14 flat cable.
One 0.050” 10-pin flat cable.
One 4-pole cable with M12 female connector.
One 4-pole mount M12 connector plug, with male contacts.
1. This board is not available for separate sale
UM2663 - Rev 3 page 2/82
Figure 2. STEVAL-BFA001V2B package contents
UM2663
System requirements
M12 Industrial
Connector
GND
Figure 3. Industrial sensor node - top view
LDK220
RST SWD HTS221
Expansion
Connector
VDD L6984 IIS3DWB
Z
Y
X
Figure 4. Industrial sensor node - bottom view
STM32F469AI M95M01-DF LSE CLK
GND
LPS22HB
1.2
USBLC6-4SC6 IMP34DT05-A HSE
CLK
L6362A
System requirements
The industrial sensor node in the STEVAL-BFA001V2B package is supplied with the
Predictive_Maintenance_SRV firmware. To run the demo, you need the following items:
UM2663 - Rev 3 page 3/82
1.3
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How to run the demo supplied with the firmware
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A Windows (1) PC with a serial line terminal application like TeraTerm.
A USB micro-B connector.
A generic power supply (range 18 to 32 V).
An IO-Link master hardware tool for IO-Link projects only.
1. version 7 or higher
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To develop your own project, you will also need the following items:
A Windows (1) PC with IAR, KEIL or System Workbench for STM32 firmware development environment.
Microsoft.NET Framework 4.5 or higher (for the GUI only).
IO-Link master interface tool like TEConcept control tool (for IO-Link project only).
ST-LINK utility for binary firmware download.
1. version 7 or higher
RELATED LINKS
Find the latest embedded software version of the ST-LINK utility on the ST website
How to run the demo supplied with the firmware
Unpack the STEVAL-BFA001V2B kit and follow the steps below to run the
STSW-BFA001V2\Projects\Demonstrations\Predictive_Maintenance_SRV predictive maintenance demonstration firmware loaded on the industrial sensor node.
Step 1.
Connect the STEVAL-UKI001V2 adapter to the STEVAL-IDP005V2 sensor node through the 10 pin flat cable.
Step 2.
Connect the STEVAL-UKI001V2 adapter to the STLINK-V3MINI programmer/debugger board through the STDC14 flat cable.
Step 3.
Supply power.
Step 4.
Connect the STLINK-V3MINI to the PC through the USB micro-B cable.
Step 5.
Open and configure your terminal emulator.
For TeraTerm settings, see the teraterm_tpl.INI
file included in the corresponding Misc example folder.
Step 5a.
Set the following parameters:
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Name: COM Port name
Baud Rate: 230400
Data:8
Parity: None
Stop Bit: One
Flow Control: None
Step 6.
Press the Reset button on the STEVAL-UKI001V2 (or STEVAL-IDP005V2).
Step 7.
Insert the new parameters and/or press [ ENTER ], then press [ Y ] and [ Enter ] to start monitoring.
RELATED LINKS
4 How to supply power to the sensor node on page 14
5.1 Connection through an STLINK-V3MINI on page 16
7.1 Outputs for the acoustic analysis project on page 27
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Industrial sensor node hardware architecture
Industrial sensor node hardware architecture
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Figure 5. STEVAL-IDP005V2 top side components
JP1 - IO-Link 4-position M12 A-coded connector
J1 - SWD connector
J2 - Auxiliary connector
SW1 - Reset button
L1 - Shielded power inductor
U1 - L6984 step-down switching regulator
U2 - LDK220 LDO
U4 - IIS3DWB ultra-wide bandwidth 3D digital vibration sensor
U6 - HTS221 humidity and temperature sensor
U8 - LPS22HB pressure sensor
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Figure 6. STEVAL-IDP005V2 bottom side components
U3 - L6362A IO-Link communication transceiver
U7 - IMP34DT05 digital microphone
U9 - M95M01-DF 1-Mbit serial SPI bus EEPROM
U10 - STM32F469AI ARM ® Cortex ® -M4 32-bit MCU
Y1 - 32.768 kHz crystal
Y2 - 24 MHz crystal
UM2663 - Rev 3
The whole system consists of the following functional subsystems:
1.
Power management
2.
Microcontroller
3.
MEMS sensors
4.
EEPROM
5.
Wired connectivity
6.
External connectors
The sensors are connected to the microcontroller through separate bus SPI and I²C peripherals.
The connectivity options are: page 5/82
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UART and I²C on the expansion connectors.
IO-Link on the M12 male socket.
Figure 7. STEVAL-IDP005V2 functional block diagram
L6984 step-down switching regulator
LDK220
LDO
M12 4-pin A-
Coded Male
Socket
L6362A
IO-Link Transceiver
USART2 SPI1 IIS3DWB
3D Accelerometer
Enhanced
SWD
Connector
Auxiliary
Connector
UART5
I2C2
ADC3
GPIO
STM32F469AI
Microcontroller
I2C1
HTS221
Humidity and
Temperature Sensor
LPS22HB
Pressure Sensor
I2S2
IMP34DT05
Digital Microphone
32 kHz
Crystal
24 MHz
Crystal
SPI4 M95M01-DF
1-Mbit SPI bus
EEPROM
ESDALC6V1-1U2
Single Line ESD protection
SMBJ33CA
Transil
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Power management
2.1
Power management
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The power management stage of the STEVAL-IDP005V2 can accept an 18 to 32 V
DC
input through the M12
A-coded 4-pin male connector (JP1) and provide 3.3 V
DC
/ 200 mA voltage output to its digital components.
U1 -
U2 -
L6984 step-down switching regulator
LDK220 LDO
Figure 8. Power management system
UM2663 - Rev 3 page 6/82
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Microcontroller
2.1.1
L6984
2.1.2
The L6984 is a step-down monolithic switching regulator able to deliver up to 400 mA DC. The output voltage adjustability ranges from 0.9 V. The fixed 3.3 V V
OUT
requires no external resistor divider. The
“Low Consumption Mode” (LCM) maximizes the efficiency at light load with controlled output voltage ripple.
The “Low Noise Mode” (LNM) makes the switching frequency almost constant over the load current range.
The PGOOD open collector output can implement output voltage sequencing during the power-up phase. The synchronous rectification, designed for high efficiency at medium - heavy load, and the high switching frequency capability make the size of the application compact. Pulse-by-pulse current sensing on low-side power element implements an effective constant current protection.
LDK220
2.2
The LDK220 is a low drop voltage regulator, which provides a maximum output current of 200 mA from an input voltage in the range of 2.5 V to 13.2 V, with a typical dropout voltage of 100 mV. A ceramic capacitor stabilizes it on the output. The very low drop voltage, low quiescent current and low noise make it suitable for industrial applications. The enable logic control function puts the LDK220 in shutdown mode allowing a total current consumption lower than 1 μA. The device also includes a short-circuit constant current limiting and thermal protection.
Microcontroller
The STEVAL-IDP005V2 embeds an STM32F469AI (U10) ARM ® Cortex ® -M4 32-bit MCU.
The board has a Serial Wire Debug (SWD) connector (J1) for MCU programming and debugging. This connector routes UART pins as well.
The board also has a reset button (SW1) to restart the microcontroller.
Figure 9. Microcontroller subsystem
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Sensors
2.2.1
STM32F469AI
2.2.2
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The STM32F469AI microcontroller is based on the high-performance ARM® Cortex®-M4 32-bit
RISC core operating at a frequency of up to 180 MHz. The Cortex®-M4 core features a Floating point unit
(FPU) single precision which supports all ARM® single-precision data processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The device incorporates high-speed embedded memories (Flash memory up to 2 Mbytes, up to 384 Kbytes of
SRAM), up to 4 Kbytes of backup SRAM, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.
The device offers three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers, and a true random number generator
(RNG).
The microcontroller features the following standard and advanced communication interfaces:
• Up to three I2Cs.
• Six SPIs, two I2Ss full duplex. To achieve audio class accuracy, the I2S peripherals can be clocked via a dedicated internal audio PLL or via an external clock to allow synchronization.
Four USARTs plus four UARTs.
One SAI serial audio interface.
The STM32F469AI device operates in the -40 to +105 °C temperature range from a 1.7 to 3.6 V power supply.
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Enhanced SWD connector
The STEVAL-IDP005V2 has a 1.27 mm pitch, 10-contact, 2-row board-to-board connector. The connector can be used for the following purposes:
• To program the microcontroller via a dedicated adapter (STEVAL-UKI001V2) connected to the programming tool (STLINK-V3MINI).
As an expansion connector that routes the UART pins, to connect the sensor node with a PC COM port. A further IO for USER_LED is also routed.
Figure 10. Enhanced SWD connector schematic
2.3
Sensors
The STEVAL-IDP005V2 embeds several sensors to detect vibration, environmental parameters and sound parameters. The sensor data is analyzed with algorithms running on the STM32F469AI microcontroller with FPU.
UM2663 - Rev 3 page 8/82
Figure 11. Sensor array subsystem
U4 - IIS3DWB ultra-wide bandwidth 3D digital vibration sensor
U6 - HTS221 humidity and temperature sensor
U8 - LPS22HB pressure sensor
U7 - IMP34DT05 digital microphone
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Sensors
2.3.1
IIS3DWB
The IIS3DWB system-in-package features a 3-axis digital accelerometer with low noise over an ultra-wide and flat frequency range. The wide bandwidth, low noise, highly stable and consistent sensitivity, together with its extended operating temperature range (up to +105 °C), make the device particularly suitable for vibration monitoring in industrial applications.
2.3.2
The high performance delivered at low power consumption, together with the digital output and the embedded digital features like the FIFO and the interrupts are enabling features for battery-operated industrial wireless sensor nodes. The IIS3DWB has a selectable full-scale acceleration range of ±2/±4/±8/±16 g and is capable of measuring accelerations with a bandwidth up to 5 kHz with an output data rate of 26.7 kHz. A 3 kB first-in, first-out (FIFO) buffer is integrated in the device to avoid any data loss and to limit intervention of the host processor.
The IIS3DWB includes a self-test capability for verifying sensor operation in the final application.
The IIS3DWB is available in a 14-lead plastic land grid array (LGA) package and is guaranteed to operate over an extended temperature range from -40 °C to +105 °C.
HTS221
The HTS221 is an ultra-compact sensor for relative humidity and temperature. It includes a sensing element and a mixed signal ASIC to provide the measurement information through digital serial interfaces.
The sensing element consists of a polymer dielectric planar capacitor structure capable of detecting relative humidity variations and is manufactured using a dedicated ST process.
The HTS221 is available in a small top-holed cap land grid array (HLGA) package guaranteed to operate over a temperature range from -40 °C to +120 °C.
UM2663 - Rev 3 page 9/82
2.3.3
2.3.4
2.4
UM2663
Memory
LPS22HB
The LPS22HB is an ultra-compact piezoresistive absolute pressure sensor which functions as a digital output barometer. The device comprises a sensing element and an IC interface which communicates through I2C or SPI from the sensing element to the application.
The sensing element, which detects absolute pressure, consists of a suspended membrane manufactured using a dedicated process developed by ST.
The LPS22HB is available in a full-mold, holed LGA package (HLGA). It is guaranteed to operate over a temperature range extending from -40 °C to +85 °C. The package is holed to allow external pressure to reach the sensing element.
IMP34DT05
The IMP34DT05 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to producing audio sensors.
The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.
The IMP34DT05 is a low-distortion digital microphone with a 64 dB signal-to-noise ratio and -26 dBFS ±3 dB sensitivity.
The IMP34DT05 is available in a top-port, SMD-compliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
Memory
The STEVAL-IDP005V2 has non-volatile memory which can store up to 1-Mbits of data.
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Figure 12. EEPROM subsystem
U9 - M95M01-DF 1-Mbit serial SPI bus EEPROM
2.4.1
M95M01-DF
The M95M01 electrically erasable programmable memory (EEPROM) id organized as 131072 x 8 bits, accessed through the SPI bus.
The M95M01-DF can operate with a supply range from 1.7 V up to 5.5 V. This device is guaranteed for the -40
°C/+85 °C temperature range.
The M95M01-DF offers an additional Identification Page (256 bytes), which can be used to store sensitive application parameters that can subsequently be permanently locked in Read-only mode.
UM2663 - Rev 3 page 10/82
2.5
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IO-Link communication
IO-Link communication
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The STEVAL-IDP005V2 board has IO-Link connectivity available on the M12 A-coded connector with the IO-Link device stack v1.1 runs on the microcontroller embedded.
IO-Link is an industrial standard for hardware connectivity. The standard specifies: the number of wires needed for the bus installation the colors to distinguish supply voltage from the IO-Link bus line connector pinouts.
The standard also establishes two different data communication methods:
1.
Pure serial data communication (SDCI) with a detailed protocol structure to manage sensor parameters and sensor data.
2.
A simple level transition high to low and vice versa to signal the sensor status only.
The use of an IO-Link system offers several advantages, like:
• Automatic detection and parameterization of the IO-Link device: the operating parameters of devices are stored in the master during setup. Once connected, the master recognizes the device and enables automatic startup. If a device like a sensor fails, it can be replaced and parameterization data stored in the master is automatically downloaded to the replacement device.
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Device monitoring and diagnostics: IO-Link allows equipment components and systems to be monitored and proactively managed. Diagnostics provided by IO-Link devices lets the control system track data and trends, facilitating preventive and predictive maintenance and improving machine uptime.
Changes on the fly: parameters can be quickly adjusted for installed devices while the machine is running, reducing time consumption.
Reduced component costs: by exploiting the configuration capabilities of IO-Link, a device can be configured to have different output functions.
Figure 13. IO-Link subsystem
U9 - L6362A IO-Link communication transceiver device IC
2.5.1
L6362A
The L6362A is an IO-Link transceiver device compliant with PHY2 (3-wire connection) supporting
COM1 (4.8 kbaud), COM2 (38.4 kbaud) and COM3 (230.4 kbaud) modes. The output stage can be configured as high-side, low-side or push-pull by hardware connection, and it can drive resistive, capacitive and inductive loads.
The IC can interface a sensor node to a master unit using both the Serial Data Communication Interface (SDCI) based on IO-Link protocol and the Standard I/O mode (SIO). Communication is managed using the 24 V industrial bus voltage. The L6362A is protected against reverse polarity across VCC, GND, OUTH, OUTL and I/Q pins. The
IC is also protected against output short-circuits, overvoltage and fast transient conditions (±1 kV, 500 Ω and 18
μF coupling).
UM2663 - Rev 3 page 11/82
2.5.2
IO-Link connector
The IO-Link connector is M12 A-coded 4-pin.
Figure 14. IO-Link connector and signals
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Auxiliary connections
2.6
Auxiliary connections
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The STEVAL-IDP005V2 comes with a 10-pin auxiliary connector for:
• V
DD
and GND
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SMBus (I²C)
One ADC channel
Two timers
The above pins can still be used as GPIOs.
The mounted J2 auxiliary female connector mates with the male-male connector in the kit.
UM2663 - Rev 3 page 12/82
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STEVAL-UKI001V2 adapter board
STEVAL-UKI001V2 adapter board
This is an adapter for STLINK-V3MINI programmer/debugger tool and STEVAL-IDP005V2.
You can use STLINK-V3MINI through the STEVAL-UKI001V2 adapter to program and debug the target application. You can also use the STLINK-V3MINI Virtual COM Port Driver as a UART interface. This allows you to keep using the USB cable that connects the kit to your PC.
The STEVAL-UKI001V2 includes a reset button to reset the STEVAL-IDP005V2 and the user LED1, the additional push button e LED are not driven by STEVAL-IDP005V2, but reserved for future use. Refer to the schematic below.
T_VCC
U_LED_1
U_BTN
U_LED_2
GNDDetec
Figure 15. STEVAL-UKI001V2 schematic
5
7
9
1
3
J1
2
4
6
8
10
SWD-10_ENH
T_SWDIO
T_SWCLK
T_VCP_RX
T_VCP_TX
T_NRST
T_VCC
GND
GND
GNDDetec
T_VCP_RX
11
13
7
9
1
3
5
J2
SWD-14
2
4
6
8
10
12
14
T_SWDIO
T_SWCLK
T_NRST
T_VCP_TX
R1
590
Yellow LED SML-M13YTT86
LD1
U_LED_1
U_LED_2
T_VCP_RX
T_VCP_TX
3
4
1
2
J3
R2
590
Strip_1X4_SMD
U_BTN
LD2
Green LED SML-M13MTT86
GND GNDDetec
C1
100nF
NM
3
2 1
SW1 mini switch-KMR211GLFS
4
T_NRST
C2
100nF
NM
3
2 1
SW2 mini switch-KMR211GLFS
4
Figure 16. STEVAL-UKI001V2 top view
UM2663 - Rev 3 page 13/82
4
UM2663
How to supply power to the sensor node
How to supply power to the sensor node
The kit includes the necessary cable and connectors to power the sensor node.
Figure 17. 4-wire cable with free ends and an M12 A-coded 4-pin female connector
Figure 18. 4-pole cable mount connector plug with male contacts
4.1
RELATED LINKS
1.3 How to run the demo supplied with the firmware on page 4
Supply power directly from a DC power supply
You can power the board directly from a DC power supply using only the cable provided in the kit.
Step 1.
Connect the cable to an 18 – 32 V
DC
power supply:
– Pin 1 (brown wire) to positive
– Pin 3 (blue wire) to negative
Figure 19. Power supply connection (without IO-Link master board)
4.2
Supply power through an IO-Link master board
You can supply power via an IO-Link master board using the cable and connectors provided in the kit.
Step 1.
Attach the 4-pole cable mount connector plug with male contacts to the cable.
Step 2.
Connect the female end to the STEVAL-IDP005V2 board and the male end to the master tool (e.g.,
STEVAL-IDP004V2 master board).
UM2663 - Rev 3 page 14/82
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Supply power through an IO-Link master board
Step 3.
Power the STEVAL-IDP004V2 IO-Link master board with an 18 to 32 V
DC
supply through screw connector CON1.
Figure 20. STEVAL-IDP005V2 power supply connection (through IO-Link master board)
UM2663 - Rev 3 page 15/82
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Sensor node board connections
5
Sensor node board connections
The STEVAL-IDP005V2 needs to be linked with a PC to manage the data coming from the board. The connection can either be through a serial communication adapter (STLINK-V3MINI) or an IO-Link master multi-port board
( STEVAL-IDP004V2 ).
5.1
Connection through an STLINK-V3MINI
The STLINK-V3MINI debugger/programmer tool connected to the STEVAL-IDP005V2 lets you update the firmware on latter. It also allows UART communication with a PC using the STLINK-V3MINI Virtual COM Port.
To enable UART communication:
Step 1.
Install the STM32 Virtual COM Port Driver ( STSW-STM32102 ) on your PC.
Step 2.
Run a terminal emulator like TeraTerm, etc.
To set up a connection for firmware update.
Step 3.
Respecting the polarity connect the 10-pin flat IDC cable to STEVAL-UKI001V2.
Step 4.
Connect the STEVAL-UKI001V2 to STLINK-V3MINI using the STDC14 pin flat cable.
Figure 21. connection between STLINK-V3MINI and STEVAL-UKI001V2
Step 5.
Connect the STLINK-V3MINI to the PC through the USB micro-B cable.
Step 6.
Use the 4-wire cable with free ends and an M12 A-coded 4-pin female connector (e.g. Telemecanique
Sensors XZCP1141L2).
Step 7.
Connect the M12 A-coded 4-pin female connector of the cable to JP1 (IO-Link connector) of the
STEVAL-IDP005V2.
Step 8.
Connect wire 1 (VIN) and wire 3 (GND) of the cable to a power supply able to provide 18 to 32 V
DC
.
Step 9.
Respecting the polarity, connect the free end of the 10-pin flat IDC wire cable to J1 (SWD connector) of the STEVAL-IDP005V2.
The STEVAL-IDP005V2 is ready to be programmed with new firmware.
Figure 22. IO-Link and SWD connection
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Connection through an IO-LINK master tool
Step 10.
To display data, open a terminal emulator, configured with baud rate 230400, 8N1 parameters, and run it to monitor and log application data on the PC.
Figure 23. STEVAL-BFA001V2B complete setup kit connection in stand-alone mode
5.2
RELATED LINKS
1.3 How to run the demo supplied with the firmware on page 4
6.2.4.3 Demonstrations folders on page 23
7.1 Outputs for the acoustic analysis project on page 27
8 Projects with IO-Link on page 43
8.1 How to run projects via IO-Link on page 43
Connection through an IO-LINK master tool
The STEVAL-IDP005V2 can be connected to any master tool through IO-Link protocol via the M12 connector. The following procedure provides an example physical IO-Link connection between the STEVAL-IDP005V2 sensor node and a PC using the STEVAL-IDP004V2 master multi-port board or a P-NUCLEO-IOM01M1 STM32 Nucleo pack with an L6360 master IC for each IO-Link port.
Step 1.
Ensure that none of the boards are connected to a power supply.
Step 2.
Assemble the Telemecanique Sensors XZCP1141L2 (4-wire cable) with the Telemecanique Sensors
XZCC12MDM40B (4-pole connector).
Step 3.
You can also use a preassembled 4-wire cable (not provided in the package) with M12 A-coded 4-pin connectors, male on one end and female on the other.
Step 4.
Plug the female M12 connector of the cable to the STEVAL-IDP005V2.
Step 5.
Plug the male M12 connector of the cable to a free port of the four ones that are in the STEVAL-
IDP004V2 .
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Connection through an IO-LINK master tool
Step 6.
Connect the RS485 dongle (not present in the package) and install the related driver to create the physical connection between PC and master board.
For correct communication, use the reference pinout on the DB9 connector shown below.
PIN Number
1 , 4
2 , 8
6 , 7 , 9
3 , 5
Table 1. RS485 Connector pinout
PIN Description
Inverting receiver input and inverting driver output
Non inverting receiver input and non-inverting driver output
Not connected
Ground
Step 7.
Connect an 18 to 32 V (typ. 24 V) supply voltage through screw connector CON1 on the board to run the system.
Step 8.
Open the master software interface and enable the power on by suitable command.
Figure 24. STEVAL-IDP004V2 and STEVAL-IDP005V2 connections
UM2663 - Rev 3
RELATED LINKS
6.2.4.3 Demonstrations folders on page 23
8 Projects with IO-Link on page 43
9 Graphical user interface overview on page 45
8.1 How to run projects via IO-Link on page 43
page 18/82
6
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Firmware overview
Firmware overview
The STSW-BFA001V2 software is an expansion of the STM32Cube environment with functions to help you develop applications using inertial, environmental and microphone sensors. The firmware includes sample condition monitoring and predictive maintenance applications based on ultra wide bandwidth 3D digital accelerometer, environmental and acoustic MEMS sensors.
The software uses the following lower layers:
• Low level STM32Cube HAL layer to provide all the MCU communication peripherals APIs compatible with
STM32Cube framework.
•
•
Low level drivers to facilitate sensor configuration and data reception with dedicated APIs that are compatible with STM32Cube framework.
Medium level board support package (BSP) layer to provide on-board sensor control and data reception at the application level.
The middleware libraries built on top of the lower layers provide the following features:
• Middleware, including algorithms for advanced time and frequency domain signal processing for vibration analysis:
– For the frequency domain:
◦ Programmable FFT size (256, 512, 1024, 2048)
◦
◦
Programmable FFT input data overlapping
Programmable FFT input data windowing (Flat Top, Hanning, Hamming, Rectangular)
◦
◦
◦
◦
◦
◦
Programmable FFT output averaging
Programmable FFT subrange analysis
HP filtering to reduce accelerometer offset
Accelerometer max peak evaluation
Accelerometer integration to evaluate Speed
Moving RMS speed evaluation
•
•
•
•
Middleware with microphone algorithms:
– PDM to PCM
– Sound pressure
– Audio FFT
Third party Middleware (provided by TEConcept) including IO-Link device stack v1.1 in library format:
– IO-Link Device Descriptor (IODD) to provide all measurements (Baud rate: COM3 speed).
– Process data cyclically sent to the master to update several data measurements.
– Binary Large OBject (BLOB) acyclically sent by request from the master.
– Parameters and Thresholds configurable directly from the Master interface (i.e. by TEConcept control tool).
– BLOB transfer support for vibration and acoustic FFT data transfer.
– Events device generation for Time and Frequency Domain.
Sample application:
– Monitor environmental, acoustic and vibration data.
– Read algorithm outputs through a terminal emulator.
– Programmable warning and alarm thresholds in the time domain and across spectral bands.
Demonstration example firmware:
– To demonstrate device interoperability with any master tool.
– Supports BLOB transfer for vibration and acoustic FFT data.
– Event generator for alarm and warning from configurable time and frequency domain thresholds.
– Parameter configuration for MotionSP settings and thresholds (with parameter custom ISDU).
The firmware package includes a dedicated PC GUI to plot the data coming from STEVAL-IDP005V2 when it is connected to the IO-Link master multi-port evaluation board (STEVAL-IDP004V2).
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6.1
6.2
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Firmware architecture
Firmware architecture
The firmware is based on the STM32Cube framework for applications running on the STM32 microcontroller.
The package provides a board support package (BSP) for the MEMS and Microphone sensors and other devices used for IO-Link communication. The package also contains middleware for signal and audio processing, plus a third party library to use a device IO-link stack.
Figure 25. STSW-BFA001V2 firmware architecture
Demonstrations
Predictive
Maintenance
(IO-Link and SVR UART comm)
Acoustic&Env
Analysis
(IO-Link)
Acoustic
Analysis
(SRV UART)
Applications
Environmental
Monitoring
(SRV UART)
Vibration
Analysis
(SRV UART)
Middleware
Hardware
Abstraction
MotionSP
STM32Cube Hardware
Abstraction Layer
Audio Lib
TEConcept
IO-Link Device Stack
Lib
Board Support
Package
Hardware
IIS3DWB, HTS221, LPS22HB, IMP34DT05, M95M01-DF
STEVAL-IDP005V2
The following firmware layers access and use the hardware components:
• STM32Cube HAL layer: generic Application Programming Interfaces (APIs) which interact with higher level applications, libraries and stacks. The APIs are based on the common STM32Cube framework so other layers like middleware can function without requiring specific hardware information for a given microcontroller unit (MCU).
• Board support package (BSP) layer: provides firmware support for the STM32 (excluding MCU) peripherals.
These APIs provide a programming interface for certain board-specific components like LEDs, user buttons, etc. The APIs can also fetch board serial and version information, as well as support initializing, configuring and reading data from sensors. The BSP provides the drivers for the STEVAL-IDP005V2 board peripherals to connect to the microcontroller peripherals.
This firmware package expands the functionality of the STM32Cube platform with the following features for specific industrial applications:
• Low and middle level drivers to connect all the on-board MEMS sensors:
– Pressure and temperature sensor ( LPS22HB )
– Humidity and temperature sensor ( HTS221 )
•
•
– Accelerometer sensors ( IIS3DWB )
– Digital Microphone audio sensor ( IMP34DT05 )
Complete BSP functions to allow applications to access sensors. The data acquisition from different sensors is provided via SPI and I²C.
Several sample firmware projects divided into two main groups:
– Applications: examples that use motion, environmental and acoustic measurements, including middleware algorithms focused on vibration and acoustic analysis and environmental monitoring.
– Demonstrations: projects designed to demonstrate predictive maintenance with the STEVAL-
IDP005V2, using the IO-Link connectivity and the standard UART; plus a dedicated project for acoustic analysis using IO-Link connectivity with the master board ( STEVAL-IDP004V2 ).
Firmware folder structure
The STSW-BFA001V2 package is developed using the standard STM32Cube framework structure shown below.
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Figure 26. STSW-BFA001V2 firmware folder structure
UM2663
Firmware folder structure
6.2.1
Note:
6.2.2
6.2.3
6.2.4
Documentation
The documentation folder contains a compiled HTML file generated from doxygen comments in the source code.
The folder also has documentation regarding the firmware framework, drivers for the on-board components and
APIs to manage the different functions.
For more information, open the STEVAL-BFA001V2.chm help file in the documentation folder.
•
Drivers
All firmware packages compliant with the STM32Cube framework contain the following main groups:
• BSP: board-specific drivers for the HW components.
• CMSIS: vendor-independent hardware abstraction layer for the ARM Cortex-M series, including DSP libraries used for the projects.
STM32F4xx_HAL_Drivers: microcontroller HAL libraries.
The board support package files are grouped into two main folders with the low level hardware device drivers and the board-specific medium level drivers:
• Components: includes a set of platform-independent device drivers for
M95M01-DF , as well as common files.
LPS22HB , HTS221 , IIS3DWB ,
• STEVAL-IDP005V2: includes a set of medium level drivers for each hardware subsystem. You can use the drivers in your application to control and configure the functionality of different measurement datatypes.
These APIs abstract the on-board hardware and connectivity devices contained in the STEVAL-IDP005V2 module for use by applications.
Middleware
•
•
The Middleware folder contains four libraries that give higher level applications access to APIs for:
• Acoustic (STM32_Audio, STM32_AcousticDB_Library),
Motion signal processing analysis (STM32_MotionSP_Library),
IO-Link device stack protocol (coming from a third party and released in library format).
Projects
The Projects directory contains several user projects under Applications and Demonstrations subfolders.
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Figure 27. Projects folders
UM2663
Firmware folder structure
6.2.4.1
6.2.4.2
•
•
All the projects are available for the following integrated development environments (IDE):
• IAR Embedded Workbench ® for ARM ® (EWARM) by IAR systems ®
Microcontroller Development Kit for ARM ® (MDK-ARM) by Keil ®
System Workbench for STM32 (SW4STM32) by AC6 (free IDE)
Standard files for all projects
•
•
•
The standard STM32Cube application files have the same configuration as any standard example using the
STM32 HAL libraries, plus the peripherals used for demonstration purposes in the following files:
• main.c: APIs for system clock configuration and all the standard include files for the other APIs defined in
HAL libraries, BSP and Middleware.
stm32f4xx_hal_msp.c: APIs for application-level peripheral initialization.
stm32f4xx_hal_it.c: APIs for all interrupt handlers.
TargetPlatform.c: APIs available for any project to configure all the required peripherals and features.
Applications folder
The Applications folder includes separate projects and reference firmware to monitor (through serial communication via the STEVAL-UKI001V2) the following types of data from the STEVAL-IDP005V2:
1.
Vibration data: with vibration analysis based on accelerometer data for diagnostic purposes.
2.
Audio data: retrieves sound data such as sound pressure level and sound power spectrum.
3.
Environmental data: retrieves environmental data such as humidity, temperature and pressure.
UM2663 - Rev 3 page 22/82
Figure 28. Application folders for Acoustic Analysis
UM2663
Firmware folder structure
6.2.4.3
Demonstrations folders
The Demonstrations folder includes projects for the STEVAL-IDP005V2:
•
•
Predictive Maintenance:
– with serial communication via UART through the STEVAL-UKI001V2
– with IO-Link protocol communication through a master tool
Acoustic Analysis:
– with IO-Link protocol communication through a master tool
UM2663 - Rev 3 page 23/82
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Firmware folder structure
Figure 29. Demonstrations folder example (Predictive Maintenance SRV)
The Predictive Maintenance project is used to analyze vibration data against threshold parameters for the same measurement datatype evaluated. The project includes an algorithm to determine status information with respect to time and frequency domain parameters.
Two different approaches for Predictive Maintenance are available to retrieve and analyze sensor data for equipment status evaluation:
1.
The Predictive_Maintenance_SRV project uses standard communication with a PC via the STEVAL-
UKI001V2 connected to STLINK-V3MINI
2.
The Predictive_Maintenance_IOL project uses the IO-Link communication PHY, interfacing the STEVAL-
IDP005V2 with the STEVAL-IDP004V2 master board that sending the received data via a USB (or RS485-
USB adapter) to a PC.
RELATED LINKS
5.1 Connection through an STLINK-V3MINI on page 16
5.2 Connection through an IO-LINK master tool on page 17
9 Graphical user interface overview on page 45
6.2.4.3.1
Application-specific files for standard communication
The application-specific APIs for the Predictive_Maintenance_SRV project are found in the following files:
• main.c
– APIs for sending the application information to the terminal screen (via Service UART)
– APIs for sensor initialization (accelerometer, humidity, pressure and temperature)
– APIs for sensor measurement (accelerometer, humidity, pressure and temperature)
– APIs for external memory Init (EEPROM)
– APIs for accelerometer parameters that can be configured by the user, and accelerometer INT management
– APIs for time domain and frequency domain analyses
UM2663 - Rev 3 page 24/82
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Firmware folder structure
•
• data_communication_srv.c: APIs to run the CLI configuration command and to monitor requested processing outputs.
MotionSP_Manager.c: to interface with middleware functionality.
Figure 30. User files for Predictive_Maintenance_SRV project
User
Demonstration
Files
Standard
STM32CUBE
User files
6.2.4.3.2
Application-specific files for IO-Link communication
The application-specific APIs for the Predictive Maintenance_IOL project are found in the following files:
• main.c
•
•
– APIs for the standard application running (Clock configuration, GPIO callback and IO-Link stack register callback) data_communication_srv.c and console.c:
– APIs designed to send some information about the application status using the SRV UART when all the debugging toolchain is connected.
MotionSP_Manager.c and MotionSP_Thresholds.h:
•
•
•
•
– APIs to use all the middleware functionalities, also for IO-Link stack purpose.
– Default initialization for the thresholds using some structure with constant value.
application.c and audio_application.c
– APIs to interface and adapt all the features in the IO_link device stack library for execution in main.
These APIs develop customized structures to send sensor and processing datatypes via the process data.
– APIs for IO-Link device stack initialization
– APIs for sensor measurement insertion inside the IO-Link buffer to send
– APIs for insertion of time and frequency domain results in the IO-Link buffer to be sent app_blob_transfer.c:
– APIs to use the BLOB transmission method.
iold_app_callbacks.c
– APIs to control via callbacks, all the write and read operation done using the IO-Link device stack.
eventhandler.c
– APIs to configure all the events to send to the master.
UM2663 - Rev 3 page 25/82
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Firmware folder structure
• eepromhandler.c, nvmhandler.c
– APIs for memory management.
The SRC/hsal folder contains specific files released by the stack provider to allow appropriate interfacing of all the device stack features included in the medium level middleware APIs.
UM2663 - Rev 3 page 26/82
7
7.1
UM2663
How to run projects via Service UART
How to run projects via Service UART
Perform the following steps for any of the projects available for Service UART:
Step 1.
Connect the STEVAL-IDP005V2 to the STLINK-V3MINI
Step 2.
Power on the STEVAL-IDP005V2
Step 3.
Connect the STLINK-V3MINI to a USB PC and download the dedicated firmware.
Step 4.
Run a terminal emulator like TeraTerm on your PC.
Be sure to use the correct COM port and UART parameters: 921600/8-N-1 for acoustic project and
230400/8-N-1 for the other example projects. You can find the TeraTerm configuration file in the MISC project folder.
Step 5.
Press the reset button to restart the application.
Outputs for the acoustic analysis project
Figure 31. Terminal emulator screenshot for acoustic analysis firmware
UM2663 - Rev 3
The log file from the terminal emulator stores the following information:
• the measured sound pressure and its acquisition time
• the measured average power spectrum with its peak and its acquisition time.
page 27/82
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Outputs for the acoustic analysis project
Figure 32. Acoustic analysis terminal emulator log file
UM2663 - Rev 3
RELATED LINKS
1.3 How to run the demo supplied with the firmware on page 4
5.1 Connection through an STLINK-V3MINI on page 16
page 28/82
7.2
UM2663
Outputs for the environmental monitoring project
Outputs for the environmental monitoring project
Figure 33. Terminal emulator screenshot while running environmental monitoring firmware
UM2663 - Rev 3
The log file from the terminal emulator stores the following information:
• the measured sound pressure and its acquisition time page 29/82
UM2663
Outputs for the environmental monitoring project
Figure 34. Environmental monitoring terminal emulator log file
UM2663 - Rev 3 page 30/82
7.3
UM2663
Outputs for the vibration analysis project
Outputs for the vibration analysis project
Figure 35. Terminal emulator screenshot while running vibration analysis firmware
FS
The bottom part of the screen lists the stored parameters for the analysis and prompts you to change some of these parameters. Press [ y ] to change parameters you want and [ Enter ] to scroll the parameters.
The configurable parameters are:
The configurable values are: 2, 4 (default), 8, 16. See IIS3DWB datasheet for further details.
UM2663 - Rev 3 page 31/82
UM2663
Outputs for the vibration analysis project hpf
Cutoff frequency for internal hardware High Pass Filter (HPF) as per the following table:
HPF configuration
4
10
20
45
100
200
400
800
Table 2. HPF configuration
Cutoff frequency selected
ODR/4
ODR/10
ODR/20
ODR/45
ODR/100
ODR/200
ODR/400
ODR/800
FFT in size
FFT input array accelerometer size: 256, 512, 1024, or 2048 (default)
FFT OVL
Overlapping between the following FFT input array in percentage; use a value between 5% and 95% (75% default)
FFT window
Filter windowing type; choose from:
•
•
•
•
0 - Rectangular
1 - Hanning (default)
2 - Hamming
3 - Flat Top
Acq. time
Total acquisition time (in ms) to evaluate all the parameters for the time domain and frequency domain analysis in the same time.
RMS tau
Time parameter to include for the moving root mean square (RMS) evaluation (for speed and/or acceleration); choose a value from: 25, 50, 100, 150, 250, 500 (default), 1000, 1500 and 2000.
subrng
This parameter is available only in predictive maintenance project. Subrange FFT numbers to evaluate the frequency domain analysis results in each subrange frequency sector; choose a value from 8, 16 (default), 32, or
64 (this parameter is used by the condition monitoring project.
tdtype
Time domain datatype format:
•
•
•
0 - Speed RMS only (default)
1 - Acceleration RMS only
2 - Speed RMS and Acceleration RMS
Once you have inserted the new parameters, the command line interface prompts you to type [ y ] and press
[ Enter ] to confirm the new values.
Pay attention to every parameter inserted via user terminal: ensure it overwrites the previous line in the window, so the next figure is simply a summary obtained through the "log" functionality.
UM2663 - Rev 3 page 32/82
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Outputs for the vibration analysis project
Figure 36. Default parameter list and starting point
UM2663 - Rev 3
After the parameter setting phase, all the configurations are initiated and checked, and some information is also returned about the MotionSP algorithm that is about to be launched.
page 33/82
UM2663 - Rev 3
Figure 37. MotionSP Initialization
UM2663
Outputs for the vibration analysis project
The terminal emulator shows the following information:
• Time domain analysis X-Y-Z arrays according to the tdtype and tacq (timing window) parameters, transmitting the data every 5 ms. The figure below lists the following information:
– the real ODR evaluated by the algorithm in order to have a more accurate value for the FFT arrays;
– the time domain datalog with the timestamp in the first column, and the X-Y-Z value chosen, in order to plot the RMS speed trend in mm/s.
Figure 38. Time domain data page 34/82
UM2663
Outputs for the vibration analysis project
• Frequency Domain X-Y-Z arrays according to the parameter settings for the configured timing window (tacq) as well as the bin frequency information. The output shows the acceleration power spectrum in m/s².
Figure 39. Frequency domain data
UM2663 - Rev 3
• Frequency Domain final results, including the average number of FFTs used during processing.
Figure 40. FFT results
• The maximum X-Y-Z acceleration peak.
Figure 41. Maximum X-Y-Z acceleration peak page 35/82
UM2663
Predictive Maintenance via Service UART
• The final step lets you change some parameters again and run a new analysis.
Figure 42. Summary window
7.4
Predictive Maintenance via Service UART
The Predictive Maintenance demonstration project is based on continuous comparison of vibration data with configurable threshold values, which may be provided by the machinery manufacturer. The aim is to monitor potentially damaging conditions that cannot be identified in conventional scheduled maintenance.
The sensor node firmware lets you modify time domain and frequency domain threshold parameters:
• Time domain thresholds with three different warning thresholds and three different alarm thresholds (one for each axes) to continuously compare against the following processed data:
•
– Speed RMS
– Acceleration Peak
Frequency domain thresholds with warning and alarm thresholds for all the subranges. The thresholds can be changed using the MotionSP_thresholds.h configuration file.
Running this demonstration project, after a board reset, the terminal emulator shows the following information:
UM2663 - Rev 3 page 36/82
UM2663
Predictive Maintenance via Service UART
Figure 43. Predictive Maintenance header log
Typing [ y ] or [ n ] for the prompt on the terminal to change parameters allows you to to confirm or change each configuration parameter, as explained in the following figure.
Figure 44. Sensor node parameter setting and configuration
UM2663 - Rev 3
The new parameters written by the user terminal are now fixed and ready to use by the library, which configures everything before starting the application, measuring time domain (1st array) and frequency domain (2nd array).
page 37/82
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Predictive Maintenance via Service UART
Figure 45. STEVAL-BFA001V2 parameter overview and analysis with time domain array
1. MotionSP parameter overview
2. Analysis start with time domain array
1
2
UM2663 - Rev 3 page 38/82
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Predictive Maintenance via Service UART
Figure 46. STEVAL-BFA001V2 2nd analysis with frequency domain array
UM2663 - Rev 3
The analysis results shown for this application are:
• Time domain values plus its threshold status about speed RMS and acceleration peak
•
•
Frequency domain values about the FFT average numbers and the absolute maximum values detected in the whole power spectrum
Frequency domain threshold status for each subrange analyzed
• General status for time and frequency domain page 39/82
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Predictive Maintenance via Service UART
Figure 47. STEVAL-BFA001V2 time domain predictive maintenance results
1. FFT arrays
2. Time domain results and threshold status
3. FFT average numbers and results: max. amplitude per frequency
UM2663 - Rev 3 page 40/82
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Predictive Maintenance via Service UART
Figure 48. STEVAL-BFA001V2 frequency domain subrange status and all status results
1. FFT subrange analysis, max. amplitude per frequency status
2. Time domain and frequency domain: all threshold status
UM2663 - Rev 3
The figure below shows the environmental measurements and parameters already configured with the opportunity of changing them before starting next analysis.
page 41/82
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Predictive Maintenance via Service UART
Figure 49. STEVAL-BFA001V2 environmental measurement and parameter list
1. Environmental measurements
2. Parameter overview for next analysis
UM2663 - Rev 3 page 42/82
8
UM2663
Projects with IO-Link
Projects with IO-Link
The STEVAL-IDP005V2 is able to communicate through its embedded IO-Link PHY device several data, using receive and transmit data and commands to and from any master tool.
The example provided here describes the interoperability between STEVAL-IDP005V2 and the STEVAL-
IDP004V2 master board based on the IO-Link PHY master.
In the firmware package, there are two demonstration projects for gathering Predictive Maintenance and acoustic analyses data via IO-Link communication. Both projects require dedicated software installed on the PC to manage the master main functions and its communication with all the devices already connected via IO-Link wiring, as shown in the picture below.
Figure 50. IO-Link System setup with PC communication
Note:
8.1
The project example in the STSW-
BFA001V2\Projects\Demonstrations\Predictive_Maintenance_IOL folder lets you run a dedicated demo which transmits and receives data via IO-Link, configuration parameters and specific events according to the analysis performed in the device.
The embedded IO-LINK device stack is a time limited version for evaluation purposes, so after a fixed time you need to reset the hardware to restart the application.
RELATED LINKS
5.1 Connection through an STLINK-V3MINI on page 16
5.2 Connection through an IO-LINK master tool on page 17
9 Graphical user interface overview on page 45
How to run projects via IO-Link
Follow the steps described below, to run the application with IO-Link:
UM2663 - Rev 3 page 43/82
UM2663 - Rev 3
UM2663
How to run projects via IO-Link
Step 1.
Connect the STEVAL-IDP005V2 to the STEVAL-IDP004V2 (or other Master board with IO-Link stack embedded) using a standard 4- wire cable with M12 A-coded 4-pin connectors, male on one end and female on the other.
Step 2.
Connect the STEVAL-IDP004V2 to the PC using a micro USB cable or a RS485-USB adapter.
Step 3.
Connect the master board to the power supply
VIN = 20 to 32 V
Step 4.
Install the SW tool that support the Master connection (STEVAL-IDP005Vx GUI, IO-Link Control Tool).
Step 5.
After the installation, run the GUI and connect the Master board selecting the right COM port.
Step 6.
Select the right device port with STEVAL-IDP005V2 wire connected, and switch on the device by pressing the power on button.
Step 7.
Connect the STEVAL-IDP005V2 to the STLINK-V3MINI with STEVAL-UKI001V2 and update the firmware.
Use the binary file in STSW-BFA001V2\Projects\Demonstrations\
Predictive_Maintenance_IOL\Binary
Step 8.
Disconnect the assembly tool used for the firmware update, but leave the boards with IO-Link cable connected.
Step 9.
Leave the Master board connected via USB cable (or RS-485/USB adapter) to your PC.
Step 10.
Use the GUI to run an IO-Link application gather data and familiarize yourself with the the IO-Link features implemented in the projects.
RELATED LINKS
5.1 Connection through an STLINK-V3MINI on page 16
5.2 Connection through an IO-LINK master tool on page 17
9 Graphical user interface overview on page 45
page 44/82
9
9.1
UM2663
Graphical user interface overview
Graphical user interface overview
•
•
The Predictive Maintenance project over IO-Link can be displayed using any IO-LINK master PC software tool, including the following GUI software packages:
STEVAL-IDP005Vx GUI v2.0.0 released by ST: located in STSW-BFA001V2/Utilities.
IO-Link Control Tool (CT) v3.9 released by TEConcept: located in STSW-BFA001V2/Utilities.
•
•
•
The tool is designed to help you set up an IO-Link project and facilitate command and data exchange between
PC, STEVAL-IDP004V2 master board, and STEVAL-IDP005V2 sensor node. The tool provides the following features:
• Continuous data streaming from device to master, including environmental sensors measurements and post processing by MotionSP middleware related to time and frequency domain analysis
MotionSP parameters values updating from master to device
Time and frequency domain threshold values updating from master to device
Post processing comparison data for time and frequency domain analysis, visible as event generated from device to the master.
Each control command sent by a GUI is managed by the master and sent to the device as an IO-Link message with information like data, parameters, or a larger data fragment (BLOB transmission frames).
When the sensor node receives a message from the master, it sends a response back to the master according to the IO-Link stack protocol, which is then sent re-directed to the GUI.
RELATED LINKS
5.2 Connection through an IO-LINK master tool on page 17
6.2.4.3 Demonstrations folders on page 23
8 Projects with IO-Link on page 43
8.1 How to run projects via IO-Link on page 43
How to run the STEVAL-IDP005Vx GUI
Before using the software, connect your PC the STEVAL-IDP004V2 or the P-NUCLEO-IOM01M1 via USB or
RS485/USB adapter cable, and power supply the STEVAL-IDP004V2 such as already described.
This SW GUI is able to demonstrate the features of the IO-Link stack in reading and logging mode from the master/device system, without performing any control or action in writing mode.
When the application is running, you can monitor the data sent cyclically by the IO-Link stack in the [ Vibration
Analysis ] and [ ENV Measurements ] pages, plus the stack event and status messages in the [ Flow Comm ] page, but you cannot change specific firmware parameters or threshold configurations.
The software can support both the projects available for predictive maintenance and acoustic analysis data communication over an IO-Link fieldbus.
UM2663 - Rev 3 page 45/82
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How to run the STEVAL-IDP005Vx GUI
Step 1.
Run the GUI to open the main screen.
Figure 51. Start GUI and insert Communication settings
UM2663 - Rev 3
Step 2.
Set PC-Master Board communication parameters:
– Name: COM Port name
– Baud Rate: 230400 Baud
– Data: 8
– Parity: None
– Stop Bit: One
– Flow Control: None page 46/82
UM2663
How to run the STEVAL-IDP005Vx GUI
Step 3.
Click the [ Connect ] button, and then select one of the [ Sensor [1-4] ] buttons for one or more sensor nodes connected to corresponding master board channels.
During this connection phase, the SW performs the following actions on the master and for each selected sensor node: a.
Programs the master ICs on the corresponding port to connect using the default configuration.
b.
Powers on the device connected to the same port; its status is confirmed by a dedicated LED on the STEVAL-IDP004V2.
c.
Starts the IO-Link connection, providing feedback on its status using another dedicated LED that blinks until the connection is established by the stack, after which then remains on. On successful connection, the corresponding button on the GUI changes color.
d.
Starts the application and immediately sends data to the application pages, while the information regarding master - device stack communication is available in the [ Flow Comm ] page.
Figure 52. STEVAL-IDP004V2 and STEVAL-IDP005V2 connected and application start
9.1.1
How to view sensor and communication data in the GUI
The large volumes of data transmission required for vibration and acoustic plots are supported by a dedicated
IO-Link transmission datatype named BLOB data, which allows up to 16384-byte data packages in the supported predictive and acoustic applications.
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How to run the STEVAL-IDP005Vx GUI
Step 1.
Select the [ Vibration Analysis ] tab.
Figure 53. Vibration analysis tab
Note:
Step 2.
In the sensors panel, check the field boxes to activate the different types of analyses you wish to perform on each sensor:
– ENV MSR (for environmental data shown in the [ ENV Measurements ] tab); always enabled for both the projects.
– RMS/PEAK (for time domain analysis values in 3D dedicated sector); always enabled but only used by the predictive maintenance project
– ACC FFT (for frequency domain analysis, available up to 3D); when enabled, it displays the 3D accelerometer FFT power spectrum for the predictive maintenance project, and a single FFT
Acoustic spectrum (located in the Y-plot) for the acoustic analysis project.
You can select one of the colored check boxes along the right to enable all the available plots and measurements for a particular sensor.
UM2663 - Rev 3 page 48/82
UM2663
How to run the STEVAL-IDP005Vx GUI
Step 3.
Select one of the following options to start displaying the data:
– [ MEASURE START ] for a single plot
– [ LOOP MEASURE START ] for continuous plotting in loop mode
Figure 54. Frequency domain and time domain results
UM2663 - Rev 3 page 49/82
UM2663
How to run the STEVAL-IDP005Vx GUI
Step 4.
Select the [ ENV Measurements ] tab to view the environmental data for the selected sensors.
Figure 55. Environmental Measurements
UM2663 - Rev 3 page 50/82
UM2663
How to run the STEVAL-IDP005Vx GUI
Step 5.
Select the [ Flow Comm ] tab to view the messages from the IO-Link master and the sensor nodes.
The information shown includes EVENT messages generated by the sensor nodes. A spreadsheet file with message code descriptions is provided in STSW-BFA001V2\Projects\Utilities .
Figure 56. Messages from the master and device stack
9.1.2
How to save the log files
The [ Log Files ] page lets you configure the log for each connected sensor node. Follow the procedure below to store the communication history in a log file.
Step 1.
Select the [ Log Files ] tab.
Step 2.
Check the [ Enable Saving To File Sensor X Measurements ] box.
UM2663 - Rev 3 page 51/82
UM2663
How to use the TEC Control Tool (by TEConcept)
Step 3.
Click the corresponding square blue button and enter the folder path and file name for the log file.
Figure 57. Log file storage
9.2
How to use the TEC Control Tool (by TEConcept)
Before you begin, connect your PC to the STEVAL-IDP004V2 IO-Link master via USB or RS485/USB adapter cable and supply appropriate power.
This graphical user interface by TEConcept demonstrates IO-Link functionality in terms of reading data, configuring parameters and thresholds for the MotionSP library, extracting events, and controlling BLOB transmission. The software implements several IO-Link Device Descriptor (IODD) files that configure the IO-
Link master to work with different sensor nodes in a functional communication environment. The IODD for the STEVAL-BFA001V2 sensor node is located in the STSW-BFA001V2/Utilities/STMicroelectronics-
STEVAL-BFA001V2-IODD1.1
folder.
Follow the steps below to exchange data with the sensor node:
Step 1.
Select the appropriate COM for the STEVAL-IDP004V2 IO-Link master connected via USB or RS485
USB adapter
UM2663 - Rev 3 page 52/82
UM2663
How to use the TEC Control Tool (by TEConcept)
Step 2.
Select the green icon in the menu bar to enable the connection between the master and the PC.
Figure 58. Start GUI, select the COM, and start the master application
UM2663 - Rev 3
Step 3.
In the [ Device Control ] panel, select the [ Port x ] that corresponds with the connected device page 53/82
UM2663 - Rev 3
UM2663
How to use the TEC Control Tool (by TEConcept)
Step 4.
Click the [ Select device ] button to list the associated IODD files.
Figure 59. Port and associated IODD selection
Step 5.
Select the appropriate IODD file from the list, or import a new file using the [ Import ] button.
Either double-click on the file name or click the [ Select Device ] button.
Figure 60. Loading IODD file page 54/82
UM2663
How to use the TEC Control Tool (by TEConcept)
Step 6.
Select the [ Power On ] button to supply the sensor node.
The powered status of the sensor node is indicated by a LED on the IO-Link master board.
Step 7.
If you have not already done so, download the binary file in STSW-
BFA001V2\Projects\Demonstrations\Predictive_Maintenance_IOL/Binary to the
STEVAL-IDP005V2 sensor node MCU.
Step 8.
Click the [ IO-Link ] button to initiate data communication.
A different LED on the IO-Link master board blinks until connection is established by the stack, after which the LED remains on.
Figure 61. Power On and IO-Link communication start
UM2663 - Rev 3
The application starts immediately updating the process data measured according to the Cycle Time configured in the IODD file (this value can be increased through the [ Advanced configuration ] menu.
Step 9.
Observe the [ Parameters ] section.
This section contains the following collapsible menus:
– [ Identification Menu ]: all the stack features and specs
– [ Parameter Menu ]: all the configurable settings for the MotionSP middleware page 55/82
UM2663
How to use the TEC Control Tool (by TEConcept)
Step 10.
Observe the [ Process Data ] section
This section shows the data sent by the device to the master every cycle time interval (10 ms in this example).
Figure 62. IO-Link control tool Parameters and Process Data sections
9.2.1
Process Data plots
The IO-Link stack is able to transmit up to 32-byte process data messages via the fieldbus every cycle time interval. The Predictive Maintenance application can therefore use up to 16 different 2-byte values.
You can verify trends in every measurement through data plotting. By clicking the [ Plot ] button, it is possible to monitor all the values together or individually.
1.
Environmental measurements:
– Acoustic Sound Pressure Level - SPL (in dB)
– Atmospheric Pressure (in mbar)
– Relative Humidity (in %)
– Temperature (in °C)
UM2663 - Rev 3 page 56/82
UM2663
How to use the TEC Control Tool (by TEConcept)
Figure 63. Data plot of environmental measurements
UM2663 - Rev 3
1.
Time Domain Results:
– X – Y – Z axes Vibrational Speed Root Mean Square (in mm/s)
– X – Y – Z axes max acceleration Peak (in m/s2) page 57/82
UM2663
How to use the TEC Control Tool (by TEConcept)
Figure 64. Data plot of Time Domain analysis
1.
Frequency Domain results:
– X – Y – Z axes acceleration FFT maximum amplitude (in m/s2)
– X – Y – Z axes frequency of FFT maximum amplitude (in Hz)
Figure 65. Frequency Domain analysis results data plot
9.2.2
How to request BLOB data transmission
This procedure describes how to initiate a BLOB data request while the application is running:
UM2663 - Rev 3 page 58/82
UM2663
How to use the TEC Control Tool (by TEConcept)
Step 1.
In the parameter panel, open [ Menu ]>[ BLOB Transfer ].
A new panel opens to execute an a-cyclical BLOB request from the master to the device. The data is plotted in the same panel.
The data from the sensor nodes are shown in the [ BLOB Transfer ] panel as large array byte sequences with up to 16,384 elements, which can be grouped into the following blocks: a.
1 st Block → 4096 Bytes → Bin Frequencies (1024 values in float) b.
2 nd Block → 4096 Bytes → FFT X-Amplitude ( “ “ “ “ ) c.
3 rd Block → 4096 Bytes → FFT Y-Amplitude ( “ “ “ “ ) d.
4 th Block → 4096 Bytes → FFT Z-Amplitude ( “ “ “ “ )
UM2663 - Rev 3 page 59/82
UM2663
How to use the TEC Control Tool (by TEConcept)
Step 2.
Click the [ Save ] button.
Figure 66. Start BLOB transfer request and read data
9.2.3
How to configure the MotionSP parameters
The TEC Control Tool used with the specific STEVAL-BFA001V2 IODD file lets you configure certain values associated with the communication between the IO-Link master board and the sensor node device. Follow the procedure below to update certain MotionSP middleware parameters associated with time and frequency domain analyses:
UM2663 - Rev 3 page 60/82
Note:
UM2663
How to use the TEC Control Tool (by TEConcept)
Step 1.
Open the Parameter menu.
Step 2.
Click the [ Read all ] button to read the parameters values used in the firmware.
The parameters have default values configured by firmware unless they are changed by the user.
Step 3.
Select any parameter and click the [ Read Selected ] button.
This allows you to read the value of any specific parameter.
Step 4.
Select one of the following parameters and enter a corresponding permissible value in the Value column.
– DataInputSize: 256, 512, 1024, 2048 FFT sample number.
– Accelerometer ODR: Not configurable for the device used (IIS3DWB use just one: 26667 Hz).
– Accelero_Full_Scale: ±2g, ±4g, ±8g, ±16g.
– FFT_Overlapping: from 5% to 95%.
– Acquisition_time: from 500 to 60000 ms.
– Subranges: 8, 16, 32, 64 (different sectors to analyze the FFT output).
Any values outside these sets or ranges will be ignored by the firmware.
Step 5.
Click the [ Write Selected ] button.
The value will change from blue to green to confirm the transmission has been performed by the stack.
Figure 67. Parameter configuration
9.2.4
How to configure the time and frequency domain thresholds
The Predictive Maintenance application can compare incoming time and frequency domain data with threshold settings in the firmware (default values inside the MotionSP_Thresholds.h
file). The device IO-Link stack supports Indexed Service Data Unit (ISDU) transmissions that you can use to modify the threshold values during
Predictive Maintenance runtime execution, and therefore control when events are triggered due to excessive values.
UM2663 - Rev 3 page 61/82
UM2663
How to use the TEC Control Tool (by TEConcept)
The following example shows how to update the time domain thresholds while the application is running.
Step 1.
Open the spreadsheet file for configuring thresholds, included in the software package.
STSW-BFA001V2/Utilities/Thresholds configurator and Event reader.xls
It provides a simple tool to convert the custom ISDU messages into a format the TEC Control tool can read.
Step 2.
Open the Thresholds Configurator sheet within the spreadsheet file.
Step 3.
Use the section for time domain threshold format conversion
The ISDU index is 0x0100
Step 4.
Write the values to update in each cell and then copy the corresponding converted values.
Step 5.
Ensure the master/device boards are connected, the IO-Link stack is initialized, and the application is running.
Step 6.
In the TEC Control Tool, open [ Menu ]>[ Custom ISDU ] in the parameters section.
This panel allows you to write or read any customized ISDU indexed by the firmware stack.
Step 7.
Perform the following tasks in the [ Custom ISDU ] section:
– write 0x0100 in the index panel
– leave 0 in the subindex panel
– Paste the converted values from the spreadsheet file into the Data panel
– check that everything is confirmed in the panel on the right
Figure 68. Threshold insertion
9.2.5
The same procedure can be executed to update all the frequency domain thresholds with appropriate values for the subgroup: 8 set for each custom ISDU.
How to read the events associated with time and frequency domain
The TEC Control tool provides a panel for each sensor on the main page listing the events generated by the device and master. This event log is generated according to IO-Link stack specifications, with an ID code for the cause of each event. The messages are only displayed after the analysis acquisition time has expired.
The following figure shows the information generated in the Events panel for an appropriately configured IODD.
UM2663 - Rev 3 page 62/82
UM2663 - Rev 3
UM2663
How to use the TEC Control Tool (by TEConcept)
Figure 69. TEC Control event message panel
•
•
•
•
The more important fields in the list are:
• Time: Event timestamp (sent after the diagnosis is completed)
•
•
Code: Event ID code (for Predictive Maintenance by IO-Link application; there are 396 possible events)
Mode: Event status sent by the Device to the Master
– “Event appears” if the condition occurred during the analysis
– “Event disappears” if the condition is no longer present when the analysis has finished
Type: Event type related to the event source condition (Error or Warning)
Source: Event ownership (Master or Device application)
Instance: Only the word “Application” appears in the released project
Name: Event cause description, for two different analyses:
– Time Domain: The messages return the event cause in terms of TYPE, AXIS and analyzed measurements (Acceleration peak or Speed RMS)
– Frequency Domain: The messages show information regarding the corresponding TYPE, AXIS, and
SUBRANGE
1. The Event Dispatcher controls the "Event appears" and "Event disappears" flow. Once the Event Dispatcher has sent an
Event appears for a given EventCode, it shall not send it again for the same EventCode before it has sent an Event disappears for the same EventCode.
Use the procedure below to determine the frequency of a certain anomaly:
Step 1.
Open the file STSW-BFA001V2/Utilities/ Thresholds configurator and Event reader.xls
Step 2.
Open the [ Event Reader ] sheet
Step 3.
Open the filter window in the cell [ SUBRANGE Monitored ]
Step 4.
Type the subrange number in the search box to find the frequency involved page 63/82
10
Schematic diagrams
T_VCC
U_LED_1
U_BTN
U_LED_2
GNDDetec
R1
590
Yellow LED SML-M13YTT86
LD1
5
7
9
1
3
J1
Figure 70. STEVAL-UKI001V2 (adapter board) circuit schematic
2
4
6
8
10
SWD-10_ENH
T_SWDIO
T_SWCLK
T_VCP_RX
T_VCP_TX
T_NRST
T_VCC
GND
GND
GNDDetec
T_VCP_RX
7
9
1
3
5
11
13
J2
SWD-14
2
4
6
8
10
12
14
T_SWDIO
T_SWCLK
T_NRST
T_VCP_TX
U_LED_1
U_LED_2
T_VCP_RX
T_VCP_TX
3
4
1
2
J3
R2
590
Strip_1X4_SMD
U_BTN
LD2
Green LED SML-M13MTT86
GND GNDDetec
C1
100nF
NM
3
2 1
SW1 mini switch-KMR211GLFS
4
T_NRST
C2
100nF
NM
3
2 1
SW2 mini switch-KMR211GLFS
4
VIN: 18 V - 32 V from IO-Link connector
Power Management
VIN VDD: 3.3 V
IO-Link
VIN
EEPROM
IN2
OUT/IQ
DIAG
OL
Figure 71. STEVAL-IDP005V2 (main board) circuit schematic
Microcontroller
IO-Link_COM_TX
IO-Link_COM_RX
IO-Link_DIAG
IO-Link_OL
ACC_CK
ACC_SI
ACC_SO
ACC_CS
ACC_INT1
ACC_INT2
SMBCLK
SMBDATA
SMBALERT
SMB_IO
ENV_CK
ENV_SD
HUM-TEMP_DRDY
PRESS_DRDY
MIC_CK
MIC_SD
PB1
PB0 EEPROM_SCK
EEPROM_SDI
EEPROM_SDO
EEPROM_CS
EEPROM_HOLD
EPPROM_W
MEM_CK
MEM_SI
MEM_SO
MEM_CS
MEM_HOLD
MEM_W
Sensors
ACC_SPC
ACC_SDI
ACC_SDO
ACC_CS
ACC_INT1
ACC_INT2
AUX_CLK
AUX_DATA
AUX_ALERT
AUX_IO
HUM-TEMP_SCL
HUM-TEMP_SDA
HUM-TEMP_DRDY
PRES_SCL
PRES_SDA
PRES_INT_DRDY
MIC_CLK
MIC_DOUT
PB1
PB0
Step-down switching regulator
Figure 72. STEVAL-IDP005V2 (main board) circuit schematic - power management
TP1
VIN
18 V - 32 V
TP3
D4
SMBJ33CA
C1
100nF
R3
C2
3.3µF
909k
Vdc-dc
R2
100k
7
U1
VIN
4
3
9
EN
TON
VBIAS
L6984
LX
FB
PGOOD
6
2
1
VCC
8
R1
1M
C3
1µF
R4
205k
R5
68k
L1
68µH
C4
22µF
Vdc-dc
3.6 V
200 mA
LDO
Vdc-dc
SB2
0R
TP2
C5
1µF
6
U2
IN
4
EN
3
ADJ/NC
LDK220
OUT
NC
GND
1
2
5
Vldo
3.3 V
C6
1µF
VDD
TP5 VDD
Vldo
DIAG
IN2
OUT/IQ
OL
VDD
Figure 73. STEVAL-IDP005V2 (main board) circuit schematic - IO-Link
TP6
VIN
C9
10pF
R6
100k
Not Mounted
C10
10pF
R9
100R R10
R11 100R
100R R13
100R
C11
10pF
R7
4k7
C12
10pF
R8
4k7
SB5
0R
SB6
0R
Not Mounted
C7
47nF
1
U3
Vdd
2
IN1
3
IN2
4
EN/DIAG
5
OUT/IQ
6
OL
L6362A
Vcc
OUTH
I/Q
OUTL
SEL
GND
12
8
7
11
10
9
C8
1uF
C13
Not Mounted
D1
NSR05T40P2
D2
NSR05T40P2
R12
22k
4
JP1
2
3D accelerometer
ACC_SDO
ACC_INT1
MEMS pressure sensor
VDD
ACC_CS
ACC_SPC
ACC_SDI
U4
1
2
3
4
SDO/SA0
RES1
RES2
INT1
IIS3DWB
VDD
C14
100nF
R24
10k
NC2
NC1
INT2
VDD
11
10
9
8
Figure 74. STEVAL-IDP005V2 (main board) circuit schematic - sensors
VDD
MEMS microphone Humidity and temperature sensor
VDD
VDD
ACC_INT2
C18
100nF
C19
1uF
5
1
U7
VDD
CLK
DOUT
LR
GND
IMP34DT05
3
4
2
R16
10k
MIC_CLK
MIC_DOUT
C17
100nF
5
1
U6
VDD
SCL/SPC
SDA/SDI/SDO
CS
DRDY
GND
HTS221
2
4
6
3
VDD
I²S
C15
100nF
Auxiliary SMBus
SPI
AUX_CLK
AUX_DATA
VDD
1
3
5
7
9
J2
2
4
6
8
10
M50-3200545
VDD
AUX_IO
PB1
PB0AUX_ALERT
C20
100nF
C21
4.7uF
1
10
U8
3
8
9
Vdd_IO
VDD
SCL/SPC
SDA/SDI/SDO
SDO/SA0
CS
INT_DRDY
RES
GND1
GND2
LPS22HB
2
4
5
6
7
PRES_SCL
PRES_SDA
PRES_INT_DRDY
1
2
3
U5
I/O1 I/O4
6
GND VBUS
5
I/O2 I/O3
USBLC6-4SC6
4
SMBus
I²C
HUM-TEMP_SCL
HUM-TEMP_SDA
HUM-TEMP_DRDY
I²C
EEPROM_CS
EEPROM_SDO
EPPROM_W
Figure 75. STEVAL-IDP005V2 (main board) circuit schematic - EEPROM
VDD
R22
100k
A5
B4
C3
C5
U9
S
Q
W
VSS
M95M01-DF
VCC
HOLD
C
D
A1
A3
B2
C1
R23
100k
EEPROM_HOLD
EEPROM_SCK
EEPROM_SDI
SPI
MIC_CK
MIC_SD
MEM_CS
MEM_HOLD
MEM_W
USER_LED
VDD
1
3
5
7
9
J1
SWD Connector
2
4
6
8
10
E5
C3
A1
B2
D10
C10
B11
A12
G9
F10
F11
PI0
PI1
PI2
PI3
PI4
PI5
PI6
PI7
PI9
PI10
PI11
U10A
STM32F469AI
SWDIO
SWCLK
COM_RX
COM_TX nRESET
Figure 76. STEVAL-IDP005V2 (main board) circuit schematic - microcontroller (1 of 2)
U10B
NRST
BOOT0
PDR_ON
DSIHOST_CKN
DSIHOST_CKP
DSIHOST_D0N
DSIHOST_D1N
DSIHOST_D0P
DSIHOST_D1P
H9
F8
D9
J2
J1
J3
H2
K3
H3 nRESET
BOOT0
VDD
PB0
PB1
ACC_CK
ACC_SO
ACC_SI
ENV_SD
ENV_CK
IO-Link_COM_TX
IO-Link_COM_RX
SWDIO
SWCLK
BOOT1
I2C1_SDA
I2C1_SCL
PA0-WKUP
PA1
PA2
PA3
PA4
PA5
PA6
PA7
PA8
PA9
PA10
PA11
PA12
PA13
PA14
PA15
PB0
PB1
PB2-BOOT1
PB3
PB4
PB5
PB6
PB7
PB8
PB9
PB10
PB11
PB12
PB13
PB14
PB15
P10
N9
P9
A8
C8
B8
G8
A9
B9
E9
N5
K5
H5
K4
P1
N2
L10
K9
L9
N10
M9
L8
P11
J8
E1
E2
E3
F7
F6
D1
D4
A2
PC0
PC1
PC6
PC7
PC8
PC9
PC10
PC11
PC12
PC13
PC14-OSC32_IN
PC15-OSC32_OUT
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PD8
PD9
PD10
PD11
PD12
PD13
PD14
PD15
STM32F469AI
C6
E7
A5
L4
N1
M3
J4
M2
H4
L3
L2
E6
A3
C5
D6
B4
J9
L12
F3
G7
F4
F5
D5
B3
C4
D12
E11
E12
VDD
VDD
OSC32_IN
Y1
32.768 kHz
C24
10pF
OSC32_OUT
C25
10pF
I2C1_SDA
I2C1_SCL
R18
2k
C23
10pF
R19
2k
C26
10pF
SW1
Reset
R17
10k
C22
100nF nRESET
D3
ESDALC6V1-1U2
SB7
0R
Not Mounted
BOOT0
SB9
10k
VDD
COM_TX
OSC32_IN
OSC32_OUT
COM_RX
USER_LED
SB8
0R
Not Mounted
BOOT1
SB10
10k
VDD
VDD
VDD
C29
2.2µF
C30
2.2µF
A4
B7
C1
F2
H7
M1
N8
P4
B10
F12
J11
N11
L11
H1
C12
N4
D2
VSS
VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSSA
VSSDSI
VBAT
VCAP1
VCAP2
U10C
Figure 77. STEVAL-IDP005V2 (main board) circuit schematic - microcontroller (2 of 2)
VDD
U10D
STM32F469AI
VDD
VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDDA
VDDDSI
VDDUSB
VDD12DSI
VCAPDSI
VDD
M12
L1
F1
K2
K1
A7
B5
C2
P3
P8
A11
G11
J12
P12
C27
2.2µF
VDD
IO-Link_DIAG
C28
100nF
SMBDATA
SMBCLK
SMBALERT
SMB_IO
MEM_CK
MEM_SO
MEM_SI
IO-Link_OL
R25100R
I2C2_SDA
I2C2_SCL
I2C2_SMBA
PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
PE8
PE9
PE10
PE11
PE12
PE13
PE14
PE15
PF0
PF1
PF2
PF3
PF4
PF5
PF10
PF11
PF12
PF13
PF14
PF15
A10
C9
F9
E10
C11
B12
D11
N7
M7
K6
P6
N6
M6
L6
J5
P5
G10
H10
G12
H11
J10
H12
K10
K7
M8
J7
L7
H8
PH0-OSC_IN
PH1-OSC_OUT
PH2
PH3
PH4
PH5
PH8
PH9
PH10
PH11
PH12
PH13
PH14
PH15
PG0
PG1
PG2
PG3
PG4
PG5
PG6
PG7
PG8
PG9
PG10
PG11
PG12
PG13
PG15
G1
G3
H6
G6
D7
J6
P7
G5
G4
G2
C7
B6
A6
E8
D8
P2
B1
D3
E4
M5
L5
M4
N3
K11
K12
M11
N12
M10
K8
STM32F469AI
C31
1µF
C32
100nF
HUM-TEMP_DRDY
PRESS_DRDY
OSC_IN
OSC_OUT
ACC_CS
ACC_INT1
ACC_INT2
C33
4.7µF
C34
100nF
C35
100nF
C36
100nF
C37
100nF
C38
100nF
C39
100nF
C40
100nF
C41
100nF
C46
100nF
C47
100nF
VDD
R20
2k
R21
2k
R26
2k
OSC_IN
4
Y2
3
1
24 MHz
C42
16pF
2
OSC_OUT
C43
16pF
I2C2_SDA
I2C2_SCL
I2C2_SMBA
C44
10pF
C45
10pF
C48
10pF
UM2663
Bill of materials
11
Bill of materials
1
2
Item
1
1
Q.ty
Ref.
3 1 STLINK-V3MINI
4 1
5 1 M12
6 1 M12
Table 3. STEVAL-BFA001V2B bill of materials
Part/Value Description Manufacturer
Sensor node ST
Communication adapter board
Programming and debugging interface
Programming cable
ST
ST
4-pin female connector
Male cable mount connector
Telemecanique
Sensors
Katlax
Telemecanique
Sensors
Katlax
Order code
Not available for separate sale
Not available for separate sale
STLINK-V3MINI
XZCP1141L2
CBF12-S44N0-02BPUR
XZCC12MDM40B
CNM12-S4SP0-BP7
1
2
3
4
5
6
7
8
9
10
11
Item
1
1
5
1
1
1
9
1
17
1
2
Q.ty
C1
C2
Ref.
C3, C5, C6,
C19, C31
C4
C7
C8
Table 4. STEVAL-IDP005V2 bill of materials
Part/Value Description
100 nF SMD 0402 50 V
±10%
3.3 µF SMD 1206 50 V ±
10%
1 µF SMD 0402 10 V ±10%
22 µF SMD 1210 16 V ±20%
X7S-Ceramic
Capacitor
X7R-Ceramic
Capacitor
47 nF SMD 0402 10 V ±
10%
1 µF SMD 0603 50 V ±10%
X7R-Ceramic
Capacitor
X8L-Ceramic
Capacitor
X7R-Ceramic
Capacitor
X5R-Ceramic
Capacitor
Manufacturer
TDK
TDK
Murata
TDK
Murata
Murata
C9, C10, C11,
C12, C23, C26,
C44, C45, C48
10 pF SMD 0402 10 V ±1%
C0G-Ceramic
Capacitor
Kemet
C13 SMD 0402 10 V
Capacitor (not mounted)
/
C14, C17, C18,
C20, C22, C28,
C32, C34, C35,
C36, C37, C38,
C39, C40, C41,
C46, C47
100 nF SMD 0402 10 V
±10%
X7R-Ceramic
Capacitor
/
Order code
C1005X7R1H104K050BB
CGA5L1X8L1H335K160AC
GCM155C71A105KE38D
CGA6P1X7R1C226M250AC
GRM155R71A473KA01D
GRT188R61H105KE13D
C0402C100J5GACTU
Wurth Elektronik 885012205018
C15
C21, C33
100 nF SMD 0402 10 V
±10%
4.7 µF SMD 0603 10 V
±10%
X7R-Ceramic
Capacitor
X7S-Ceramic
Capacitor
Wurth Elektronik 885012205018
TDK C1608X7S1A475K080AC
UM2663 - Rev 3 page 72/82
UM2663
Bill of materials
12
Item
2
Q.ty
13
14
15
16
17
18
21
22
23
24
29
30
31
27
28
25
26
19
20
32
33
34
35
36
3
2
2
1
1
1
1
1
1
1
3
1
1
1
1
2
5
1
5
5
2
3
1
1
Ref.
Part/Value Description
C24, C25
C27, C29, C30
C42, C43
D1, D2
D3
D4
JP1
J1
J2
10 pF SMD 0402 50 V ±5%
2.2 µF SMD 0402 10 V
±10%
16 pF SMD 0402 50 V ±5%
NSR05T40P2 SOD-923
ESDALC6V1-1U2 SMD
0201
SMBJ33CA SMB DO-214AA
33V
IO-Link CONN
C0G-Ceramic
Capacitor
Schottky Barrier
Diode
Single-line low capacitance
Transil™ for ESD protection
600 W TVS in
SMB
IO-Link 4-position
M12 A-coded connector
SMT Pitch 1.27 mm, 5x2
TH Pitch 1.27 mm, 5x2
C0G-Ceramic
Capacitor
X7R-Ceramic
Capacitor
SWD Connector
Auxiliary
Connector
L1
R1
R2, R22, R23
R3
R4
R5
R6
68 µH SMD (4.8x4.8x2.8
mm) Isat = 0.4 A/Rdc = 0.34
ohm ± 30%
Shielded Power
Inductor
1 M SMD 0402 0.1 W ± 1% Resistor
100 k SMD 0402 0.1 W ±
1%
Resistor
909 k SMD 0402 0.1 W ±
1%
205 k SMD 0402 0.1 W ±
1%
Resistor
Resistor
68 k SMD 0402 0.1 W ± 1% Resistor
100 k SMD 0402 0.1 W ±
1%
Resistor (not mounted)
4 k7 SMD 0402 0.1 W ± 1% Resistor
100 R SMD 0402 0.1 W ±
1%
Resistor
22 k SMD 0603 0.1 W ± 1% Resistor
R7, R8
R9, R10, R11,
R13, R25
R12
SB9, SB10,
R16, R17, R24
10 k SMD 0402 0.1 W ± 1% Resistor
R18, R19, R20,
R21, R26
SB2, SB5
2 k SMD 0402 0.1 W ± 1% Resistor
SB6, SB7, SB8
0 R SMD 0402 0.1 W ± 1% Resistor
0 R SMD 0402 0.1 W ± 1%
Resistors (not mounted)
SW1 smd (L 4.6 x W 2.2 x H 1.9
mm)
Reset
U1
L6984 VDFPN10 (3x3x1.0
mm)
36 V 400 mA synchronous stepdown switching regulator
/
/
ST
ST
ST
Manufacturer
Kemet
TDK
Murata
OnSemiconductor s
Binder
Harwin
Harwin
Order code
C0402C100J5GACTU
C1005X7S1A225K050BC
GRM1555C1H160JA01D
NSR05T40P2T5G
ESDALC6V1-1U2
SMBJ33CA
9043121204
M50-3600542
M50-3200545
Wurth Elektronik 744043680
Panasonic
Panasonic
Panasonic
Panasonic
Panasonic
Panasonic
Panasonic
Bourns
Panasonic
Panasonic
Panasonic
C & K
/
/
ERJ-2RKF1004X
ERJ-2RKF1003X
ERJ-2RKF9093X
ERJ-2RKF2053X
ERJ-2RKF6802X
ERJ-2GEJ472X
ERJ-2RKF1000X
CR0603-FX-2202ELF
ERJ-2RKF1002X
ERJ-2RKF2001X
ERJ-2GE0R00X
KMR211GLFS
L6984ATR
UM2663 - Rev 3 page 73/82
UM2663
Bill of materials
37
38
39
40
41
42
43
44
45
46
47
48
49
50
Item
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Q.ty
Ref.
Part/Value Description Manufacturer
U2
U3
U4
U5
U6
U7
U8
LDK220 DFN6 (1.2x1.3x0.5
mm)
L6362A VFDFPN 12L
(3x3x0.90 mm)
IIS3DWB LGA-14L
(2.5x3x0.83 mm)
USBLC6-4SC6 SOT-23-6
HTS221 HLGA-6L (2x2x0.9
mm)
IMP34DT05 HCLGA-4LD
(3x4x1 mm)
LPS22HB HLGA-10L
(2x2x0.76 mm)
200 mA low quiescent current and low noise
LDO
IO-Link communication transceiver device
IC
ST
ST
Ultra-wide bandwidth, lownoise 3-axis digital accelerometer for industrial applications
Very low capacitance ESD protection
ST
ST
Capacitive digital sensor for relative humidity and temperature
MEMS audio sensor omnidirectional digital microphone for industrial applications
Ultra-compact piezoresistive absolute pressure sensor
ST
ST
ST
U9
U10
M95M01-DF WLCSP8
(2.578x1.716 mm)
STM32F469AI WLCSP 168L
DIE 434 12X14 P 0.4mm
1-Mbit SPI bus
EEPROM with high-speed clock
High-performance advanced line,
ARM Cortex-M4 core with DSP and
FPU
ST
ST
Y1
Y2
32.768 kHz smd
(2.05x1.2x0.55mm) ±20ppm
24 MHz smd (2x1.6x0.45
mm) ±20ppm
PCB 50x8.5x1.2mm
NA-supply only Pitch 1.27 mm, 5x2
NA-supply only Pitch 1.27 mm, 5x2
Crystal
Crystal
PCB
SWD Cable
Header Board to
Board Connector
NDK
NDK
Ermes
Harwin
GCT
Order code
LDK220PU33R
L6362ATR
IIS3DWBTR
USBLC6-4SC6
HTS221TR
IMP34DT05TR
LPS22HBTR
M95M01-DFCS6TP/K
STM32F469AIY6TR
NX2012SA 32.768kHz
EXS00A-MU00389
NX2016SA 24.000MHz
EXS00A-CS05544
-
M50-9100542
GTC BD030-10-A-
A-0350-0300-L-G
UM2663 - Rev 3 page 74/82
UM2663
Bill of materials
8
9
5
6
7
2
3
4
1
Item
2
Q.ty
C1, C2
Ref.
1
1
1
J1
J2
J3
1
1
2
LD1
LD2
R1, R2
2
1
SW1, SW2
PCB
Table 5. STEVAL-UKI001V2 bill of materials
Part/Value
100 nF, 16 V ±20% 0805
(2012 Metric) SMD
SWD-10_ENH SMD 10 pos.
1.27 mm
SWD-14 14 pos. 1.27 mm
Strip_1X4_SMD 10.16X5.08
mm SMD 4 pos. 2.54 mm
SML-M13YTT86 20 mA
0805 (2012 Metric) SMD
SML-M13MTT86 20 mA
0805 (2012 Metric) SMD
590 0.125 W, 1/8 W ±1%
0805 (2012 Metric) SMD
SPST-NO 0.05 A 32 V-
KMR211GLFS 4.60 mm x
2.80 mm
FR4-32x25.3x1.6 mm
32x25.3x1.6 mm
Description
Ceramic capacitors
Yellow LED
Greem LED
Chip resistor
Tactile switch
PCB
Manufacturer
Any
Connector header Samtec Inc.
Connector header Samtec Inc.
Connector header Samtec Inc.
Rohm
Semiconductor
Rohm
Semiconductor
Any
C&K
Any
Any
Order code
FTSH-105-01-L-DV-K-TR
FTSH-107-01-L-DV-K
TSM-104-01-F-SV-P-TR
SML-M13YTT86
SML-M13MTT86
Any
KMR211GLFS
Any
UM2663 - Rev 3 page 75/82
UM2663
Revision history
Table 6. Document revision history
Date
14-Jan-2020
07-May-2020
08-Feb-2021
Version Changes
1
2
3
Initial release.
Updated Section 10 Schematic diagrams, Figure 24. STSW-BFA001V2 firmware architecture and
Section 3 STEVAL-UKI001V2 adapter board.
, Section 1.1 Package components ,
Section 5.1 Connection through an STLINK-V3MINI
,
Figure 31. Terminal emulator screenshot for acoustic analysis firmware
, Figure 33. Terminal emulator screenshot while running environmental monitoring firmware
,
Section 7.3 Outputs for the vibration analysis project and
Section 7.4 Predictive Maintenance via
.
Added P-NUCLEO-IOM01M1 compatibility information.
Minor text changes.
UM2663 - Rev 3 page 76/82
UM2663
Contents
Contents
UM2663 - Rev 3 page 77/82
UM2663
Contents
How to read the events associated with time and frequency domain. . . . . . . . . . . . . . . . . 62
UM2663 - Rev 3 page 78/82
UM2663
List of figures
List of figures
UM2663 - Rev 3 page 79/82
UM2663
List of figures
UM2663 - Rev 3 page 80/82
UM2663
List of tables
List of tables
UM2663 - Rev 3 page 81/82
UM2663
IMPORTANT NOTICE – PLEASE READ CAREFULLY
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Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks . All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2021 STMicroelectronics – All rights reserved
UM2663 - Rev 3 page 82/82
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